Automatic side-pushing multifunctional integrated welding tool and method

Abstract

The invention discloses an automatic side-pushing multifunctional integrated welding tool and method, the tool comprises a bottom plate tray and an automatic side-pushing elastic gland, the bottom plate tray is used for bearing and positioning a printed circuit board, a heat conduction structural member and a flip device, and the structure of the bottom plate tray is compatible with printing, surface mounting and reflow soldering procedures; the automatic side-pushing elastic gland is matched with the bottom plate tray and is used for vertically pressing the power amplifier device, the printed circuit board, the heat-conducting structural member and the flip-chip device into a whole before reflow soldering; the automatic side-pushing elastic gland is provided with a temperature-control hovering automatic side-pushing device, so that the side-pushing component can hover to avoid and accumulate pushing force before welding, the pushing force is automatically released and converted into transverse pushing force after welding temperature rise, and a power amplifier device is stably close to the side wall of the output end. The problems of low multi-tool conversion efficiency, non-uniform welding temperature, poor lateral thrust consistency and the like can be fundamentally solved, and high-efficiency, high-quality and low-cost integrated manufacturing of the high-power radio frequency power amplifier assembly is realized.

Description

Technical Field

[0001] This invention relates to the field of PCB welding technology for high-power radio frequency amplifiers in communication equipment, and in particular to an automatic side-push multifunctional integrated welding fixture and method. Background Technology

[0002] In the manufacturing process of high-power radio frequency (RF) amplifiers, a core component of communication equipment, due to stringent heat dissipation requirements and specific RF performance parameters, high-power amplifiers are typically packaged as multi-planar soldered devices. Structurally, the amplifier's pins are soldered to traces on the PCB (Printed Circuit Board), while its heat dissipation flange is embedded in or passes through the PCB and soldered to a heat-conducting structure, which in turn is soldered to the bottom surface of the PCB. This type of multi-dimensional planar soldering is currently generally completed using a one-time reflow soldering process. It is particularly noteworthy that the soldering quality at the RF amplifier's output end is extremely sensitive to its performance and efficiency. With the development of 5G communication technology, 5G communication equipment places higher reliability and precision requirements on the soldering between high-power RF amplifiers and the PCB.

[0003] Currently, the industry commonly uses specialized welding fixtures that combine elastic pressing with gravity-assisted side pushing to achieve multi-dimensional planar one-time reflow soldering of power amplifiers and precision soldering of the output terminals. However, in the mass production of high-power amplifier products, this type of fixture has gradually revealed the following technical bottlenecks, making it difficult to meet the demands of large-volume, high-efficiency production: 1. Limited functionality and poor process integration: The existing tooling is designed solely for reflow soldering. To accommodate the reflow oven track height and avoid interference, the PCB must be lowered below the reflow oven track plane, resulting in a misalignment of the production reference plane between the soldering process and other preceding and following manufacturing processes. Other processes still require the use of various different toolings, necessitating frequent handling and loading / unloading of solder paste between different toolings during manufacturing. This not only leads to low operational efficiency but also significantly increases the risk of quality defects due to repeated handling, while simultaneously driving up the overall tooling cost.

[0004] 2. Uneven thermal management leads to significant potential welding quality issues: The fixture itself has a localized structure that absorbs a lot of heat, which can easily create localized "cold spots" during reflow soldering. The temperature difference between the area supported by the fixture and the cutout area on the PCB is large, which can easily cause cold solder joints or poor solder joints in the supported area, while the components in the cutout area may be damaged due to overheating.

[0005] 3. The side-push mechanism is cumbersome to operate and suffers from poor stability and consistency: The existing gravity side-push mechanism has a large range of motion, which imposes significant limitations on the overall structure of the tooling and the PCB layout space. Its gravity counterweight hangs naturally, with the center of gravity falling above the power amplifier tube. Installation and pressing require considerable manual intervention, making operation inconvenient and inefficient. Furthermore, this design is highly prone to problems such as wiping the board, impacting components, and even damaging expensive power amplifier tubes during operation. The application of the side-push force is generally ineffective, and batch-to-batch consistency is difficult to guarantee.

[0006] 4. Inconvenient assembly and disassembly, affecting overall production efficiency: Although the existing tooling is relatively convenient to install and fix, the disassembly operation after welding is cumbersome, time-consuming and labor-intensive, which further reduces the overall production cycle and operating efficiency.

[0007] Therefore, there is an urgent need for a new welding fixture that can integrate the functions of tooling in each process, improve operational efficiency and welding consistency, reduce overall costs, and eliminate quality defects caused by uneven local heating. Summary of the Invention

[0008] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an automatic side-push multifunctional integrated welding fixture that integrates printing, surface mount, and welding functions. The welding fixture has intelligent temperature-controlled side-push, uniform heating, and rapid loading and unloading characteristics, enabling efficient, high-quality, and low-cost integrated manufacturing of high-power RF amplifier components.

[0009] An automatic side-push multi-functional integrated welding fixture according to an embodiment of the present invention includes: The base plate tray is used to support and position printed circuit boards, thermally conductive structural components and flip-chip devices. Its structure is compatible with printing, surface mount and reflow soldering processes. An automatic side-push elastic cover, in conjunction with the base plate tray, is used to vertically press the power amplifier components, printed circuit boards, thermal conductive structural components, and flip-chip components into one unit before reflow soldering. The automatic side-push elastic cover is equipped with a hovering automatic side-push device, which includes a temperature-controlled hovering limit component. This allows the side-push component to hover in a standby position outside the power amplifier device after the cover is pressed together and before the reflow soldering temperature rises. When the reflow soldering temperature reaches the set value, the hovering limit component automatically releases the limit, allowing the side-push component to apply a lateral thrust to the input end of the power amplifier device, pushing the power amplifier device to press tightly against the output end sidewall of the mounting slot on the printed circuit board.

[0010] In some embodiments of the present invention, the bottom tray is a plate-like structure, and its top is provided with: PCB limiting support groove, the shape of which matches the shape of the printed circuit board, is used to precisely limit and support the four sides of the printed circuit board; PCB support pillars, there are multiple PCB support pillars, and they are spaced apart; all the PCB support pillars are used together to support the bottom surface of the printed circuit board and form a return hot air convection channel. The first limiting support groove has a shape that matches the heat-conducting structural component. A first limiting column is provided on the base plate tray near the first limiting support groove. The first limiting column and the first limiting support groove are used together to limit and support the heat-conducting structural component. The second limiting support groove has a shape that matches the inverted device. The second limiting support groove is provided with a second limiting column. The second limiting column and the second limiting support groove are used together to limit and support the inverted device. There are two quick-release limit slots, which are symmetrically opened on a set of opposite sides of the bottom plate tray. They are used to cooperate with the locking components on the automatic side-push elastic pressure cover to achieve quick locking and unlocking. There are multiple first and second limiting support slots, and the height of the first and second limiting columns is 0.5-1.0mm lower than the support surface of the printed circuit board.

[0011] In some embodiments of the present invention, the base plate tray is further provided with: A conveyor track is provided on the outer side of the base plate pallet along its length, and its thickness and width are adapted to the conveyor tracks of the production equipment for each process. The positioning post is detachably fixed to the base plate tray and is used to accurately position the heat-conducting structural component when not in maintenance mode, and is detachable when in maintenance mode. Support feet, which are detachably mounted at the four corners of the base plate tray, are used in non-maintenance functions and can be removed in maintenance functions.

[0012] In some embodiments of the present invention, the automatic side-push elastic cover is a grid-like structure, with the following on its top: The elastic pressure column assembly includes multiple PCB elastic pressure columns and power amplifier elastic pressure columns, which respectively vertically press the printed circuit board, heat-conducting structural components and power amplifier devices placed on the base plate tray; A guide positioning pin is used to cooperate with a guide positioning hole on the base plate tray to achieve pre-alignment and prevent mistaken alignment when the cover is pressed together. The rotary quick-release lock includes a handle and a locking tooth. The handle is connected to the locking tooth via a locking linkage. Rotating the handle drives the locking tooth to be screwed into or unscrewed into the quick-release limiting groove of the base plate tray to lock or unscrew.

[0013] In some embodiments of the present invention, the locking link is connected to the handle and the locking teeth by a mortise and tenon structure and is fixed by a second fixing screw.

[0014] In some embodiments of the present invention, the hovering automatic side-push device further includes: A fixed bracket is used to mount the hovering automatic side-push device onto the automatic side-push elastic cover; The guide shaft allows the side-pushing component to be rotatably mounted on the fixed bracket. A side thrust spring is disposed between the side thrust component and the fixed bracket; The hovering limiting component is mounted on the fixed bracket on the side near the side push component. The hovering limiting component has a first state and a second state. In the first state, the hovering limiting component extends to restrict the movement of the side push component. In the second state, the hovering limiting component retracts to release the restriction.

[0015] In some embodiments of the present invention, the hovering automatic side-push device further includes an unloaded limiting component, which is installed on the side-push component to limit the range of motion of the side-push component when the tooling is unloaded, and to prevent the side-push spring from dislodging.

[0016] In some embodiments of the present invention, an active maintenance heat-conducting patch is also included. When the tooling is used for maintenance functions, the active maintenance heat-conducting patch is detachably embedded in the position on the base plate tray for installing heat-conducting structural components, so as to open a local heat conduction path to heat and repair specific channels.

[0017] The present invention also discloses an automatic side-push welding method using the above-mentioned welding fixture, comprising the following steps: S1. In the printing and mounting process, only the base plate tray is used as a carrier. The thermally conductive structural components and flip-chip devices are installed in the corresponding positions on the base plate tray, and then the printed circuit board is installed into the PCB limiting support groove for production. S2. Before reflow soldering, align and press the automatic side push elastic cover with the base plate tray, and lock it into one piece by rotating the quick lock. At this time, the side push component of the hovering automatic side push device is in the hovering standby position. S3. The assembly is sent into the reflow oven for welding. As the temperature rises, the hovering limit component of the automatic side push device is automatically released from the limit. The side push spring drives the side push component to push the power amplifier device to the output end and stick it tightly. S4. After welding is completed, loosen the rotating quick lock, remove the automatic side-push spring cover, and take out the welded component.

[0018] In some embodiments of the present invention, the following steps are performed during the maintenance process: Remove the support feet and positioning posts of the base plate tray; Embed the active maintenance heat-conducting patch into the base plate tray position corresponding to the channel that needs maintenance; Place the printed circuit board to be repaired into the base tray and secure it. When performing localized heating repairs, the normal channels that are not equipped with the active heat-conducting patch are protected from heating because the heat conduction path is closed.

[0019] Compared with the prior art, the automatic side-push multifunctional integrated welding fixture provided by the present invention has the following beneficial effects: First, this invention integrates printing, surface mount technology (SMT), reflow soldering, and even repair functions into a single fixture. Throughout the entire manufacturing process of a high-power RF amplifier PCB, only this fixture is needed to complete all core processes, completely eliminating the frequent handling and unloading of solder paste boards caused by the need for dedicated fixtures for different processes in existing technologies. This not only significantly reduces quality risks such as component collisions, board smoothing, and alignment deviations caused by multiple transfers, but also simplifies the operation process and improves production cycle time and operational efficiency. Simultaneously, one fixture replaces multiple sets of dedicated fixtures, directly saving on the purchase and management costs of fixtures, and significantly improving production efficiency and economic benefits.

[0020] Secondly, the base tray of this invention adopts a distributed PCB support structure, replacing the traditional integral support strip with discrete support points. While ensuring good support for the PCB, this significantly increases the convection channel between the reflow oven hot air and the bottom surface of the PCB. Combined with the lightweight design of the overall fixture, this effectively reduces the heat capacity and heat absorption of the fixture itself. This design ensures uniform heating of the PCB surface during reflow soldering, successfully eliminating "cold spots" caused by localized heat absorption in the fixture and localized overheating problems caused by airflow blockage. This avoids the risk of cold soldering of components in the support area and overheating damage to components in the cutout area, significantly improving the consistency and reliability of soldering quality.

[0021] Third, the hovering automatic side-pushing device of this invention utilizes the temperature control characteristics of shape memory metal to achieve "hovering standby" for the side-pushing claw during the pressing and installation stage and "automatic triggering" during the reflow soldering stage. This design completely avoids direct interference and pressure from the side-pushing claw on the power amplifier components during installation, effectively preventing potential collisions and damage caused by human operation. During soldering, a spring provides a stable and consistent side-pushing force, which, after being amplified by levers, precisely pushes the power amplifier towards the output end sidewall, ensuring the accuracy of the power amplifier soldering at the output end and high batch-to-batch consistency. This device has a compact structure, imposes minimal space constraints on tooling and PCB layout, and has a wider range of applications.

[0022] Fourth, this invention achieves rapid fixing and releasing of the pressure cap and base plate tray through a rotary quick-lock design, allowing for "alignment and insertion, and a single turn to lock". This lock structure is robust and provides a stable and reliable locking state, overcoming the inconvenience of disassembling existing tooling. This makes the assembly and disassembly of the entire tooling extremely simple and quick, further improving overall production efficiency and reducing the labor intensity of operators.

[0023] Fifth, this invention creates a selectable localized heating repair mode by introducing a detachable, movable heat-conducting patch. During repair, the heat-conducting patch is simply embedded in the tooling position corresponding to the faulty channel, opening a direct and efficient heat conduction path for localized heating of that channel; while normal channels, lacking a patch, have their heat conduction path "closed," thus avoiding the impact of repair heating. This modular design makes repair operations highly targeted, significantly improving the success rate and consistency of repairs, effectively preventing performance variations in normal channels during repair, and eliminating the need to manufacture expensive dedicated repair tooling for specific products or channels, further reducing overall costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the automatic side-push multi-functional integrated welding fixture mentioned in the embodiments of the present invention; Figure 2 yes Figure 1 Exploded view; Figure 3 This is a schematic diagram of the structure of the base plate tray of the present invention; Figure 4 This is an exploded view of the base plate tray of the present invention; Figure 5 yes Figure 4 Enlarged view of point A in the middle; Figure 6 This is a schematic diagram of the automatic side-push elastic pressure cap of the present invention; Figure 7 This is an exploded view of the automatic side-push elastic pressure cap of the present invention; Figure 8 This is a schematic diagram of the automatic hovering side-push device of the present invention; Figure 9 This is an exploded view of the hovering automatic side-push device of the present invention; Figure 10 This is a schematic diagram from another perspective of the hovering automatic side-push device of the present invention; Figure 11 yes Figure 10 The left view; Figure 12 This is a cross-sectional schematic diagram of the working principle of the automatic hovering side thrust device of the present invention; wherein, a is a schematic diagram of the position of the automatic hovering side thrust device at low temperature; b is a schematic diagram of the position of the automatic hovering side thrust device at high temperature; Figure 13 This is a schematic diagram of the rotating quick-release latch of the present invention; Figure 14 This is an exploded view of the rotary quick-release lock of the present invention; Figure 15 This is a schematic diagram of the rotary quick-release latch of the present invention when it is opened; wherein, a is a partially enlarged schematic diagram from top to bottom; b is an enlarged schematic diagram from bottom to top; Figure 16 This is a schematic diagram of the rotating quick-lock mechanism of the present invention when locked; wherein, a is a partially enlarged schematic diagram from top to bottom; b is an enlarged schematic diagram from bottom to top; Figure 17 This is a schematic diagram illustrating the application of the automatic side-pushing integrated welding function of the present invention; Figure 18 This is a schematic diagram illustrating the printing and patching functions of the present invention; Figure 19 yes Figure 18 Exploded view; Figure 20 This is a schematic diagram illustrating the maintenance function of the present invention; Figure 21 yes Figure 20 The exploded diagram.

[0025] In the picture: 100. Automatic side-push multi-functional integrated welding fixture; 10. Base plate tray; 11. Outer frame; 12. Connecting rod; 101. PCB limiting support groove; 102. PCB support pillars; 103. First limiting support groove; 104. First limiting column; 105. Second limiting support groove; 106. Second limiting column; 107. Quick loading and unloading limiting groove; 108. Conveyor rail; 109. Positioning post; 110. Support leg; 111. First fixing screw; 112. Hand-grabbing position; 113. Positioning block; 20. Automatic side-push spring-loaded cap; 201. Elastic pressure post mounting hole; 202. Locking buckle mounting hole; 21. Automatic hovering side-push device; 211. Fixed bracket; 212. Side-push component; 213. Hovering limiting component; 214. Guide shaft; 215. Side-push spring; 216. No-load limiting component; 22. Rotary quick-release latch; 221. Handle; 222. Locking linkage; 223. Locking teeth; 224. Second fixing screw; 23. Spring-loaded pressure column assembly; 231. PCB spring-loaded pressure column; 232. Power amplifier spring-loaded pressure column; 24. Guide positioning pin; 30. Mobile repair heat-conducting patch; 40. Printed circuit board; 41. Locking screw; 50. Thermally conductive structural components; 60. Power amplifier components; 70. Flip-chip devices. Detailed Implementation

[0026] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0027] PCB: Printed Circuit Board, is the mechanical support and electrical interconnection carrier for all electronic components.

[0028] The following is for reference. Figures 1-21 The automatic side-push multi-functional integrated welding fixture 100 according to an embodiment of the present invention includes a base plate tray 10 and an automatic side-push elastic cover 20. The base plate tray 10 is used to support and position the printed circuit board 40, the thermally conductive structural component 50, and the flip-chip device 70. The structure of the base plate tray 10 is compatible with printing, surface mount, and reflow soldering processes. The automatic side-push elastic cover 20 cooperates with the base plate tray 10 to vertically press the power amplifier device 60, the printed circuit board 40, the thermally conductive structural component 50, and the flip-chip device 70 into one unit before reflow soldering. The automatic side-push elastic cover 20 is equipped with a hovering automatic side-push device 21, which includes a side-push component 212 and a temperature-controlled hovering limit component 213. After the cover is pressed together and before the reflow soldering temperature rises, the side-push component 212 hovers in a standby position outside the power amplifier device 60. When the reflow soldering temperature reaches the set value, the hovering limit component 213 is released, so that the side-push component 212 applies a lateral thrust to the input end side of the power amplifier device 60, pushing the power amplifier device 60 to press tightly against the output end sidewall of the mounting slot on the printed circuit board 40.

[0029] Specifically, the base plate tray 10 serves as a carrier, with mounting positions on it for supporting and positioning the printed circuit board 40, the thermally conductive structural component 50, and the flip-chip device 70. The automatic side-push elastic cover 20 serves as a cover plate; after the printed circuit board 40, the thermally conductive structural component 50, and the flip-chip device 70 are placed on the base plate tray 10, it can be positioned above the printed circuit board 40 and connected and fixed to the base plate tray 10, thereby vertically pressing the printed circuit board 40, the thermally conductive structural component 50, and the flip-chip device 70 into a single unit. The side-push component 212 in the hovering automatic side-push device 21 is positioned directly opposite the power amplifier device 60 on the printed circuit board 40. Through temperature control, its horizontal position can be adjusted so that the lateral thrust generated is applied to the power amplifier device 60, ensuring that the power amplifier device 60 is tightly attached to the output sidewall of the mounting slot on the printed circuit board 40.

[0030] Understandably, during the printing and surface mount processes, only the base plate tray 10 is used as a carrier. The thermally conductive structural component 50 and the flip-chip device 70 are mounted in their corresponding positions on the base plate tray 10, and then the printed circuit board 40 is mounted onto the base plate tray 10 for production. Before reflow soldering, the automatic side-push spring cap 20 is aligned, pressed, and fixed with the base plate tray 10. At this time, the side-push component 212 of the hovering automatic side-push device 21 is in the hovering standby position. Then, the entire assembly can be sent into the reflow oven for soldering. As the temperature rises, the hovering limit component 213 of the hovering automatic side-push device 21 is released, allowing the side-push component 212 to push the power amplifier device 60 tightly against the side wall of the mounting slot output end on the printed circuit board 40. After soldering is completed, the entire assembly can be removed from the reflow oven, and the automatic side-push spring cap 20 can be removed from the base plate tray 10 to remove the soldered component.

[0031] The present invention relates to an automatic side-push multi-functional integrated soldering fixture, which integrates printing, surface mount, and reflow soldering functions into a single fixture. Throughout the entire manufacturing process of a high-power RF amplifier PCB, only this fixture is needed to complete all core processes, completely eliminating the frequent handling and unloading of solder paste boards caused by the need for dedicated fixtures for different processes in existing technologies. This not only significantly reduces quality risks such as component collisions, board smoothing, and alignment deviations caused by multiple transfers, but also simplifies the operation process and improves production cycle time and operational efficiency. Furthermore, one fixture replaces multiple sets of dedicated fixtures, directly saving on the purchase and management costs of fixtures, and significantly improving production efficiency and economic benefits.

[0032] In some embodiments of the present invention, reference is made to... Figures 1 to 5As shown, the base tray 10 has a plate-like structure, with a PCB limiting support groove 101, PCB support pillars 102, a first limiting support groove 103, a second limiting support groove 105, and a quick-release limiting groove 107 on its upper part. The shape of the PCB limiting support groove 101 matches the shape of the printed circuit board 40, and is used to precisely limit and support the four sides of the printed circuit board 40. There are multiple PCB support pillars 102, which are spaced apart. All PCB support pillars 102 are used to support the bottom surface of the printed circuit board 40 and form a return hot air convection channel. The shape of the first limiting support groove 103 matches the heat-conducting structural component 50, and a first limiting groove is provided on the base tray 10 near the first limiting support groove 103. The first limiting post 104 and the first limiting support groove 103 are used together to limit and support the heat-conducting structural component 50; the shape of the second limiting support groove 105 matches the inverted device 70, and the second limiting support groove 105 is provided with a second limiting post 106. The second limiting post 106 and the second limiting support groove 105 are used together to limit and support the inverted device 70; there are two quick-release limiting grooves 107, which are symmetrically opened on a set of opposite sides of the base plate tray 10, and are used to cooperate with the locking components on the automatic side-push elastic pressure cover 20 to achieve quick locking and unlocking; the height of the first limiting post 104 and the second limiting post 106 is 0.5-1.0mm lower than the support surface of the printed circuit board.

[0033] For example, the base tray 10 may include an outer frame 11 and multiple connecting rods 12 arranged vertically and intersectingly inside the outer frame 11. A PCB limiting support groove 101 may be formed on the top of the outer frame 11. It can be milled according to the actual external dimensions of the printed circuit board 40 + 0.1-0.15mm / side, with a recess depth equal to the thickness of the printed circuit board 40 and a side width of 2-3mm. This allows for precise installation and support of the four sides of the printed circuit board 40. PCB support pillars 102 may be 5-8mm cubes or cylinders. Multiple PCB support pillars 102 are spaced apart on the connecting rods 12 located on the left side of the entire base tray 10. These multiple PCB support pillars 102 effectively support the printed circuit board 40 and prevent the backflow of hot air convection from being blocked by the overall support of the printed circuit board 40. In other words, compared to overall support, distributed support has a smaller area, smoother backflow hot air convection channels, eliminates localized cold spots, and results in more uniform heating during product reflow soldering.

[0034] The number and position of the first limiting support grooves 103 can be set according to the actual installation requirements of the heat-conducting structural component 50. Each first limiting support groove 103 can be machined by milling a pin according to the actual outer dimensions of the heat-conducting structural component 50 + 0.1-0.15mm / side. The recess depth = PCB board thickness (T PCB + Thickness of thermally conductive structural components (T) 导The support is segmented with a width of 2-3mm and a diameter of -0.1mm. The first limiting post 104 prevents the heat-conducting structural component 50 from being installed in the wrong direction. The first limiting support groove 103 and the first limiting post 104 are segmented to reduce local heat absorption. The height of the first limiting post 104 is 0.5-1.0mm lower than the PCB support surface, which facilitates the soldering of the heat-conducting structural component 50 to the printed circuit board 40 and ensures a smooth flux discharge path, reducing flux residue. The side has a notch 10-15mm wide and 1.0-2.0mm deep. When the tooling is not for maintenance, it serves as an installation window for the heat-conducting structural component 50. When the tooling is for maintenance, it can serve as an installation limit and support for the movable maintenance heat-conducting patch 30.

[0035] The number and position of the second limiting support groove 105 can be set according to the actual installation needs of the components. When input / output connectors and other components need to be installed on the bottom surface of the printed circuit board 40, the components can be inverted and embedded into the base plate tray 10 at the installation position. The components, power amplifier components 60, heat-conducting structural components 50 and printed circuit board 40 are pressed together and reflow soldered in one go. The groove depth of the second limiting support groove 105 is equal to the height of the component board surface - 0.1mm, ensuring that the inverted component 70 is completely attached to the printed circuit board 40 for soldering. The height of the second limiting column 106 is also 0.5-1.0mm lower than the PCB support surface, which facilitates the unobstructed flux discharge path for component soldering and reduces flux residue.

[0036] The quick-release mounting and disassembly limiting groove 107 can be set on a set of opposite sides of the outer frame 11 at the center of the power amplifier device 60. The upper part of the quick-release mounting and disassembly limiting groove 107 is a combination hole of an elongated hole and a semi-circular through hole. The elongated hole is 21mm long and 11mm wide. A semi-circular through hole with a diameter of 9mm is provided in the middle of one long side of the elongated hole to facilitate quick installation and disassembly of the pressure cap latch. The bottom surface has a concentric semi-circular groove with a diameter of 21mm and a thickness of 2-2.5mm. The latch can be screwed in to quickly lock and fix, and screwed out to release.

[0037] Understandably, during the printing and surface mount processes, the thermally conductive structural component 50 and the flip-chip device 70 can be first installed in the first limiting support groove 103 and the second limiting support groove 105 on the base plate tray 10, and then the printed circuit board 40 can be installed in the PCB limiting support groove 101 for production. The PCB support column 102 is used to support the printed circuit board 40. The height of the first limiting column 104 and the second limiting column 106 is 0.5-1.0mm lower than the support surface of the printed circuit board, which facilitates the soldering of the thermally conductive structural component 50 and the flip-chip device 70 to the printed circuit board 40, and ensures a smooth flux discharge path, reducing flux residue.

[0038] The base tray of this invention adopts a distributed PCB support structure, replacing the traditional integral support strip with discrete support points. While ensuring good support for the PCB, this significantly increases the convection channel between the reflow oven hot air and the bottom surface of the PCB. Combined with the lightweight design of the overall fixture, this effectively reduces the heat capacity and heat absorption of the fixture itself. This design ensures uniform heating of the PCB surface during reflow soldering, successfully eliminating "cold spots" caused by localized heat absorption in the fixture and localized overheating problems caused by airflow blockage. This avoids the risk of cold soldering of components in the support area and overheating damage to components in the cutout area, significantly improving the consistency and reliability of soldering quality.

[0039] In some embodiments of the present invention, reference is made to... Figures 1 to 5 As shown, the base tray 10 is also equipped with a conveyor track 108, positioning posts 109, and support feet 110. The conveyor track 108 is located on the outer side of the base tray 10 along its length, and its thickness and width are adapted to the conveyor tracks of the production equipment in each process. The positioning posts 109 are detachably mounted on the base tray 10 and are used for precise positioning of the heat-conducting structural component 50 when not in maintenance mode; they can be removed during maintenance. The support feet 110 are detachably mounted at the four corners of the base tray 10 and are used when not in maintenance mode; they can be removed during maintenance.

[0040] Specifically, the conveyor track 108 can be symmetrically arranged on the outer side of the outer frame 11 along its length, with a thickness of 2-3mm and a width of 7-10mm. It is milled from the bottom surface of the base plate tray 10 upwards, adapting to the conveying and handling of equipment in various processes during manufacturing. The positioning post 109 can be screwed onto the base plate tray 10 for precise positioning of the heat-conducting structural component 50 during installation and welding in non-maintenance functions, and can be disassembled during maintenance functions. Correspondingly, the printed circuit board 40 can be fixed with locking screws 41 to prevent the heat-conducting structural component 50 from separating from the printed circuit board 40 and creating gaps during maintenance. There are four support feet 110, which can be detachably installed at the four corners of the base plate tray 10 by first fixing screws 111. When the tooling is used for non-maintenance functions, it is easy to install and remove the cover and stack / handle the tooling. When the tooling is used for maintenance functions, it can be removed.

[0041] In view of this, a handle position 112 may also be provided on the non-transfer side of the base plate tray 10. For example, the handle position 112 is a groove with a width of 15-25mm and a depth of 5-6mm set on the left and right sides of the outer frame 11. The handle position 112 facilitates the insertion / removal of the printed circuit board 40. The inner side wall of the outer frame 11 may also be provided with a lower positioning block 113 for guiding and positioning the automatic side-push elastic cover 20. The lower positioning block 113 has a lower positioning hole. Correspondingly, an upper positioning block is provided at a corresponding position on the automatic side-push elastic cover 20. The upper positioning block has an upper positioning hole. The cooperation of the upper positioning block and the lower positioning block 113, with the help of positioning pins and other components, can realize the guiding and positioning function of the automatic side-push elastic cover 20 installation, and at the same time, it also serves as a support function for the printed circuit board 40.

[0042] In some embodiments of the present invention, reference is made to... Figures 1 to 12 As shown, the automatic side-push elastic pressure cover 20 has a grid-like structure. It is equipped with a rotary quick-lock 22, an elastic pressure post assembly 23, and a guide positioning pin 24. The rotary quick-lock 22 includes a handle 221 and locking teeth 223. The handle 221 is connected to the locking teeth 223 via a locking linkage 222. Rotating the handle 221 drives the locking teeth 223 to screw into or out of the quick-release limiting groove 106 on the base plate tray 10 to lock or release. The elastic pressure post assembly 23 includes multiple PCB elastic pressure posts 231 and power amplifier elastic pressure posts 232, which respectively vertically press the printed circuit board 40, the heat-conducting structural component 50, and the power amplifier device 60 placed on the base plate tray 10. The guide positioning pin 24 is used to cooperate with the guide positioning holes on the base plate tray 10 to achieve pre-alignment and prevent mistaken insertion when the pressure cover is pressed.

[0043] For example, the automatic side-push elastic pressure cap 20 is provided with a locking mounting hole 202 for installing a rotary quick-release lock 22. There are two locking mounting holes 202, symmetrically arranged on opposite sides of the automatic side-push elastic pressure cap 20. Their specific positions can be matched with the quick-release limiting groove 106 on the base plate tray 10. The hole diameter is 8.0mm, and the 180° rotation range of the handle is limited by the front of the pressure cap being recessed by 1 / 2 the thickness to limit the operating range of the lock, thus avoiding increasing the tooling height. Figures 8 to 12 As shown, the locking link 222 is inserted into the locking mounting hole 202, and the handle 221 is arranged above the automatic side-push elastic pressure cover 20 and is connected and fixed to the top of the locking link 222. At the same time, the lower part of the locking link 222 is inserted into the quick-release limiting groove 106, and the locking teeth 223 are arranged below the base plate tray 10 and are connected and fixed to the bottom of the locking link 222.

[0044] Multiple PCB spring-loaded pressure pillars 231 are set at the mounting positions of the thermally conductive structural component 50 and the flip-chip component 70 according to the actual component layout of the product. The multiple PCB spring-loaded pressure pillars work together to vertically press the printed circuit board 40 in multiple dimensions and complete the reflow soldering in one go. This can avoid thermal deformation of the printed circuit board 40, the welding gap between the thermally conductive structural component 50 and the printed circuit board 40, and the floating height of the flip-chip component 70.

[0045] Multiple power amplifier spring-loaded posts 232 are also set according to the actual layout of the power amplifier components 60 in the product. The power amplifier spring-loaded posts 232 press vertically against the power amplifier components 60, and the reflow soldering is completed in one go. Correspondingly, the automatic side-push spring-loaded cover 20 has spring-loaded post mounting holes 201. Each spring-loaded post mounting hole 201 is set according to the actual spring-loaded posts in the product. Their positions are distributed in the connecting strip and frame of the cover panel structure. The opening diameter = post diameter + 0.1mm, and the front is recessed by 1-1.5mm. The recessed diameter = post limit spring outer diameter + 0.5mm, ensuring that each spring-loaded post does not protrude from the automatic side-push spring-loaded cover 20 when not in operation after installation, and preventing the limit spring from being impacted by external forces.

[0046] The guide positioning pin 24 is installed diagonally in one set of PCB mounting holes within the product cover range. It is used for pre-alignment and pressing guidance of the automatic side-push elastic cover 20. The positioning pins are asymmetrical and also have the function of preventing the automatic side-push elastic cover 20 from being installed in reverse.

[0047] It is understandable that, such as Figures 1 to 21 As shown, before the automatic side-push elastic cover 20 is pressed and fixed, the handle 221 is turned to the open position, and the locking rod 222 and the locking tooth 223 are turned out to the standby position. Then, the automatic side-push elastic cover 20 is vertically pressed against the base plate tray 10 by aligning it with the guide positioning pin. The locking rod 222 and the locking tooth 223 are simultaneously and vertically inserted into the quick-release limit groove 106. After the automatic side-push elastic cover 20 is pressed into place, the handle 221 is turned to the locked position, and the locking rod 222 and the locking tooth 223 are turned in to the limit lock (as shown). Figure 16 As shown in the figure, the automatic side-push elastic pressure cover 20, power amplifier device 60, printed circuit board 40, heat-conducting structural component 50, flip-chip device 70 and other components are combined into one unit and multi-dimensional planar integrated welding is completed in one reflow.

[0048] This invention utilizes a rotary quick-lock design to achieve rapid fixing and releasing of the pressure cap and base plate tray through "alignment and insertion, one-twist locking". The lock structure is robust and provides a stable and reliable locking state, overcoming the inconvenience of disassembly in existing tooling. This makes the assembly and disassembly of the entire tooling extremely simple and quick, further improving overall production efficiency and reducing the labor intensity of operators.

[0049] In some embodiments of the present invention, reference is made to... Figures 1 to 21 As shown, the locking link 222 is connected to the handle 221 and the locking tooth 223 by a mortise and tenon structure and is fixed by the second fixing screw 224. The locking link 222 is machined with a stepped rod diameter to fit the handle 221 and is nested in the pressure cap mounting hole. It can rotate horizontally along the central axis of the link to switch the lock open and locked. The two ends of the locking link 222 are connected to the handle 221 and the locking tooth 223 by a mortise and tenon structure, and are reinforced and fixed by the second fixing screw 224. The lock structure is stronger and the lock works more stably.

[0050] In some embodiments of the present invention, reference is made to... Figures 1 to 21 As shown, the hovering automatic side-push device 21 also includes a fixed bracket 211, a guide shaft 214, and a side-push spring 215. The fixed bracket 211 is used to mount the hovering automatic side-push device 21 onto the automatic side-push elastic cover 20. The side-push component 212 is rotatably mounted on the fixed bracket 211 via the guide shaft 214. The side-push spring 215 is arranged between the side-push component 212 and the fixed bracket 211. A hovering limiting component 213 is mounted on the fixed bracket near the side-push component. The hovering limiting component has a first state and a second state. In the first state, the hovering limiting component 213 extends to restrict the movement of the side-push component 212; in the second state, the hovering limiting component 213 retracts to release the limiting.

[0051] For example, the fixed bracket 211 is a structure formed by vertically bending a U-shaped bracket, which can include two parallel and inverted L-shaped brackets and a connecting rod connecting the ends of the two L-shaped brackets. The L-shaped brackets and the connecting rod are integrally formed. The connecting rod has a hole for installing the power amplifier spring pressure column 232. The connecting rod fits against the top of the automatic side-push spring pressure cover 20, and the L-shaped bracket extends into the automatic side-push spring pressure cover 20. The side-push component 212 is placed between the two L-shaped brackets. The lower part of the side-push component 212 has symmetrical first connecting holes on both sides. The end of the L-shaped bracket away from the connecting rod has a second connecting hole that mates with the first connecting hole. The guide shaft 214 passes through the second connecting hole and the first connecting hole in sequence to realize the rotatable connection between the fixed bracket 211 and the side-push component 212. The entire side-push component 212 can rotate around the guide shaft 214. The side-push spring 215 is set between the upper part of the side-push component 212 and the connecting rod, and its two ends are connected to the upper part of the side-push component 212 and the connecting rod, respectively. The L-shaped bracket has a first mounting hole near the connecting rod. The upper sides of the side-push component 212 have symmetrically arranged first limiting holes that mate with the first mounting hole. Two hovering limiting components 213 are symmetrically installed in the two first mounting holes, with their inner ends extending into the first limiting holes. The hovering limiting components 213 are made of shape memory metal and have the characteristic of contracting from low to high temperatures. At low temperatures, the hovering limiting components 213 are in a first state, i.e., the inner end of the hovering limiting components 213 extends into the first limiting hole, and the side-push spring 215 is in a compressed state, which restricts the movement of the side-push component 212. When the temperature increases, the hovering limiting components 213 switch from the first state to the second state, and the hovering limiting components 213 contract into the first mounting hole, with their inner ends disengaging from the first limiting hole. The side-push spring 215 releases an outward elastic force applied to the upper end of the side-push component 212. The side-push component 212, acting counterclockwise along the guide shaft 214, amplifies the side-push force and converts it into a lateral horizontal push force applied to the input side of the power amplifier device 60, pushing the power amplifier device 60 towards the output side and firmly attaching it to the side wall of the PCB power amplifier slot on the printed circuit board 40 for soldering (e.g., ...). Figure 12 (See Figure b) Complete the welding of the automatic side-push power amplifier close to the output end to improve side-push consistency.

[0052] Understandably, before the automatic side-push spring cover 20 is pressed and fixed, the side-push component 212 is retracted and the side-push spring 215 is compressed. The hovering limit component 213 automatically pushes out to the limit, causing the side-push component 212 to hover outside the power amplifier, setting it to the standby position. The automatic side-push spring cover 20, when pressed and fixed, keeps the side-push component 212 hovering outside the power amplifier (e.g., ...). Figure 12(See Figure a) to prevent damage to the power amplifier device 60 caused by the side push component 212 pressing vertically downwards. After the automatic side push spring cover 20 presses the power amplifier device 60, printed circuit board 40, heat-conducting structural component 50, etc., the side push component 212 hovers in the standby position and begins reflow soldering. As the reflow soldering temperature rises, the memory metal of the hover limit component 213 retracts to release the hover limit of the side push component 212, and the side push spring 215 releases outward elastic force applied to the upper end of the side push component 212. The side push component 212 amplifies the side push force by levering counterclockwise along the guide shaft 214, converting it into a horizontal push force applied to the input side of the power amplifier, pushing the power amplifier towards the output side and pressing it tightly against the side wall of the PCB power amplifier slot for soldering (e.g., Figure 12 (See Figure b) The automatic side-push amplifier was soldered close to the output end, thereby improving the consistency of side-push.

[0053] The hovering automatic side-pushing device of this invention utilizes the temperature control characteristics of shape memory metal to achieve "hovering standby" for the side-pushing claw during the press-fit installation stage and "automatic triggering" during the reflow soldering stage. This design completely avoids direct interference and pressure from the side-pushing claw on the power amplifier components during installation, effectively preventing potential collisions and damage caused by human operation. During soldering, a spring provides a stable and consistent side-pushing force, which, after being amplified by levers, precisely pushes the power amplifier towards the output end sidewall, ensuring the accuracy of the power amplifier soldering at the output end and high batch-to-batch consistency. This device has a compact structure, imposes minimal space constraints on tooling and PCB layout, and has a wider range of applications.

[0054] In some embodiments of the present invention, reference is made to... Figures 1 to 21 As shown, the hovering automatic side-push device 21 also includes an unloaded limiting component 216, which is installed on the side-push component 212 to further limit the range of motion of the side-push component 212 when the tooling is unloaded, and to prevent the side-push spring 215 from coming out.

[0055] It is understandable that the no-load limit component 216 is mainly used to limit the no-load position range of the side push component 212 when the tooling is no-load or idle, so as to prevent the side push spring 215 from coming out / falling off due to the excessive no-load position range. It is possible to adjust the no-load position range of the side push component 212 by screwing the no-load limit component 216 in / out.

[0056] In some embodiments of the present invention, reference is made to... Figures 1 to 21 As shown, it may also include a movable maintenance heat-conducting patch 30. When the tooling is used for maintenance functions, the movable maintenance heat-conducting patch 30 is detachably embedded in the position on the base plate tray 10 for installing the heat-conducting structure 50, so as to open a local heat conduction path to heat and repair specific channels.

[0057] Understandably, the amplifier repair operation only uses the base plate tray 10 and the movable repair heat dissipation block 30. Specifically, before the repair operation, the support feet 110, the first fixing screw 111, and the detachable positioning post 109 of the base plate tray 10 are removed. Then, the movable repair heat dissipation block 30 is embedded into the corresponding position of the base plate tray 10 according to the channel to be repaired. The movable repair heat dissipation block 30 enables selective local heating of the product to be repaired. Then, the printed circuit board 40 of the product to be repaired is installed and locked in place by the locking screw 41. During the repair, the channel to be repaired must have the movable repair heat dissipation block 30 installed, and the direct heat conduction path is activated for local heating repair. The abnormal channel does not have the movable repair heat dissipation block 30 installed, and the heat conduction path is closed to prevent heating of the normal channel, ensuring that the normal channel is not affected by the repair operation.

[0058] This invention introduces a detachable, movable heat-conducting patch for maintenance, creating a selectable localized heating maintenance mode. During maintenance, the heat-conducting patch is simply embedded in the tooling position corresponding to the faulty channel, opening a direct and efficient heat conduction path for localized heating of that channel; while normal channels, lacking a patch, have their heat conduction path "closed," thus avoiding the impact of maintenance heating. This modular design makes maintenance operations highly targeted, significantly improving the success rate and consistency of maintenance, effectively preventing performance variations in normal channels during maintenance, and eliminating the need to manufacture expensive dedicated maintenance tooling for specific products or channels, further reducing overall costs.

[0059] The present invention also discloses an automatic side-push welding method using the above-mentioned welding fixture, comprising the following steps: S1. In the printing and mounting process, only the base plate tray 10 is used as a carrier to install the heat-conducting structural components and flip-chip devices in the corresponding positions of the base plate tray, and then the printed circuit board is installed into the PCB limiting support groove 101 for production. S2. Before reflow soldering, align and press the automatic side push elastic cover 20 with the base plate tray 10, and lock them together by rotating the quick lock 22. At this time, the side push component 212 of the hovering automatic side push device 21 is in the hovering standby position. S3. The assembly is sent into the reflow oven for welding. As the temperature rises, the hovering limit component 213 of the hovering automatic side push device 21 is released from the limit, and the side push spring 215 drives the side push component 212 to push the power amplifier device toward the output end and stick it tightly. S4. After welding is completed, loosen the rotating quick lock 22, remove the automatic side-push elastic cover 20, and take out the welded component.

[0060] In some embodiments of the present invention, reference is made to... Figures 1 to 21 As shown, the following steps are performed during the repair process: Remove the support feet 110 and positioning posts 109 of the base plate tray 10; Embed the active maintenance heat-conducting patch 30 into the base plate tray position corresponding to the channel that needs maintenance; Place the printed circuit board to be repaired into the base plate tray and secure it with locking screws; When performing localized heating repairs, the normal channels of the non-embedded active repair heat-conducting patch 30 are not affected by heating because the heat conduction path is closed.

[0061] like Figure 17 As shown, during the automatic side-push integrated welding function, the automatic side-push elastic cover 20, the power amplifier device 60, the printed circuit board 40, the heat-conducting structural component 50, and the flip-chip device 70 are vertically pressed and combined into a single reflow soldering unit before reflow by the base plate tray 10. The printed circuit board 40 and the automatic side-push elastic cover 20 are spaced 13.5-14.0mm apart to ensure uniform convection heating of the reflow hot air. As the reflow temperature rises, the hovering automatic side-push device 21 automatically converts the horizontal thrust to push the power amplifier device 60 to the output end side and sticks it to the side wall of the PCB power amplifier slot to complete the welding.

[0062] like Figure 18 , 19 As shown, in the printing and placement process, only the base plate tray 10 is used as the carrier of the printed circuit board 40. The heat-conducting structural component 50 and the flip-chip device 70 are pre-installed in the base plate tray 10 corresponding to the first limiting support groove 103 and the second limiting support groove 105. Then, the printed circuit board 40 with solder paste printed on the BOT side is placed into the PCB limiting support groove 101 to start printing and placement production. The distributed PCB support columns 102 support the bottom surface of the printed circuit board 40 to ensure that its board surface is flat and avoid deformation that affects the printing and placement quality.

[0063] like Figure 20 , 21 As shown, in the power amplifier device repair operation, only the base plate tray 10 and the movable repair heat-conducting patch 30 are used. Specifically, before the repair operation, the support feet 110, the first fixing screw 111, and the detachable positioning post 109 of the base plate tray 10 are removed. Then, the movable repair heat-conducting patch 30 is embedded into the corresponding position of the base plate tray 10 according to the channel to be repaired. The movable repair heat-conducting patch 30 enables selective local heating of the product to be repaired. Then, the printed circuit board 40 of the product to be repaired is installed and locked in place by the locking screw 41. During repair, the channel to be repaired is equipped with the movable repair heat-conducting patch 30, and the direct heat conduction path is activated for local heating repair. The abnormal channel is not equipped with the movable repair heat-conducting patch 30, and the heat conduction path is closed to prevent heating of the normal channel, ensuring that the normal channel is not affected by the repair operation.

[0064] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0066] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0067] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0069] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An automatic side-push multi-functional integrated welding fixture, characterized in that, include: The base plate tray is used to support and position printed circuit boards, thermally conductive structural components and flip-chip devices. Its structure is compatible with printing, surface mount and reflow soldering processes. An automatic side-push elastic cover, in conjunction with the base plate tray, is used to vertically press the power amplifier components, printed circuit boards, thermal conductive structural components, and flip-chip components into one unit before reflow soldering. The automatic side-push elastic cover is equipped with a hovering automatic side-push device, which includes a temperature-controlled hovering limit component. This allows the side-push component to hover in a standby position outside the power amplifier device after the cover is pressed together and before the reflow soldering temperature rises. When the reflow soldering temperature reaches the set value, the hovering limit component automatically releases the limit, allowing the side-push component to apply a lateral thrust to the input end of the power amplifier device, pushing the power amplifier device to press tightly against the output end sidewall of the mounting slot on the printed circuit board.

2. The welding fixture according to claim 1, characterized in that, The base tray has a plate-like structure, and its top is provided with: PCB limiting support groove, the shape of which matches the shape of the printed circuit board, is used to precisely limit and support the four sides of the printed circuit board; PCB support pillars, wherein there are multiple PCB support pillars and they are spaced apart; All of the PCB support pillars work together to support the bottom of the printed circuit board and form a recirculation hot air convection channel. The first limiting support groove has a shape that matches the heat-conducting structural component. A first limiting column is provided on the base plate tray near the first limiting support groove. The first limiting column and the first limiting support groove are used together to limit and support the heat-conducting structural component. The second limiting support groove has a shape that matches the inverted device. The second limiting support groove is provided with a second limiting column. The second limiting column and the second limiting support groove are used together to limit and support the inverted device. There are two quick-release limit slots, which are symmetrically opened on a set of opposite sides of the bottom plate tray. They are used to cooperate with the locking components on the automatic side-push elastic pressure cover to achieve quick locking and unlocking. There are multiple first and second limiting support slots, and the height of the first and second limiting columns is 0.5-1.0mm lower than the support surface of the printed circuit board.

3. The welding fixture according to claim 2, characterized in that, The base plate tray is also equipped with: A conveyor track is provided on the outer side of the base plate pallet along its length, and its thickness and width are adapted to the conveyor tracks of the production equipment for each process. The positioning post is detachably fixed to the base plate tray and is used to accurately position the heat-conducting structural component when not in maintenance mode, and is detachable when in maintenance mode. Support feet, which are detachably mounted at the four corners of the base plate tray, are used in non-maintenance functions and can be removed in maintenance functions.

4. The welding fixture according to claim 2, characterized in that, The automatic side-push elastic pressure cover has a grid-like structure, and its upper part is provided with: The elastic pressure column assembly includes multiple PCB elastic pressure columns and power amplifier elastic pressure columns, which respectively vertically press the printed circuit board, heat-conducting structural components and power amplifier devices placed on the base plate tray; A guide positioning pin is used to cooperate with a guide positioning hole on the base plate tray to achieve pre-alignment and prevent mistaken alignment when the cover is pressed together. The rotary quick-release lock includes a handle and a locking tooth. The handle is connected to the locking tooth via a locking linkage. Rotating the handle drives the locking tooth to be screwed into or unscrewed into the quick-release limiting groove of the base plate tray to lock or unscrew.

5. The welding fixture according to claim 4, characterized in that, The locking link is connected to the handle and locking teeth by a mortise and tenon structure and is fixed by a second fixing screw.

6. The welding fixture according to claim 1, characterized in that, The hovering automatic side-push device also includes: A fixed bracket is used to mount the hovering automatic side-push device onto the automatic side-push elastic cover; The guide shaft allows the side-pushing component to be rotatably mounted on the fixed bracket. A side thrust spring is disposed between the side thrust component and the fixed bracket; The hovering limiting component is mounted on the fixed bracket on the side near the side push component. The hovering limiting component has a first state and a second state. In the first state, the hovering limiting component extends to restrict the movement of the side push component. In the second state, the hovering limiting component retracts to release the restriction.

7. The welding fixture according to claim 6, characterized in that, The hovering automatic side-push device also includes an unloaded limiting component, which is installed on the side-push component to limit the range of motion of the side-push component when the tooling is unloaded, and to prevent the side-push spring from coming out.

8. The welding fixture according to claim 1, characterized in that, It also includes a movable maintenance heat-conducting patch, which can be detachably embedded in the position on the base plate tray for installing heat-conducting structural components when the tooling is used for maintenance, so as to open a local heat conduction path to heat and repair specific channels.

9. An automatic side-push welding method using the welding fixture as described in any one of claims 1-8, characterized in that, Includes the following steps: S1. In the printing and mounting process, only the base plate tray is used as a carrier. The thermally conductive structural components and flip-chip devices are installed in the corresponding positions on the base plate tray, and then the printed circuit board is installed into the PCB limiting support groove for production. S2. Before reflow soldering, align and press the automatic side push elastic cover with the base plate tray, and lock it into one piece by rotating the quick lock. At this time, the side push component of the hovering automatic side push device is in the hovering standby position. S3. The assembly is sent into the reflow oven for welding. As the temperature rises, the hovering limit component of the automatic side push device is automatically released from the limit. The side push spring drives the side push component to push the power amplifier device to the output end and stick it tightly. S4. After welding is completed, loosen the rotating quick lock, remove the automatic side-push spring cover, and take out the welded component.

10. The automatic side-push welding method according to claim 9, characterized in that, The following steps are performed during the repair process: Remove the support feet and positioning posts of the base plate tray; Embed the active maintenance heat-conducting patch into the base plate tray position corresponding to the channel that needs maintenance; Place the printed circuit board to be repaired into the base tray and secure it. When performing localized heating repairs, the normal channels that are not equipped with the active heat-conducting patch are protected from heating because the heat conduction path is closed.

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