Floating device for chip handover of bonding equipment

Abstract

The invention discloses a floating device for chip handover of bonding equipment, which relates to the technical field of floating devices and comprises a main body mechanism, a positioning mechanism and a grabbing mechanism. According to the invention, the clamping blocks and the connecting pieces are preliminarily guided and contacted, the floating platform starts to adaptively finely adjust the spatial pose of the floating platform and absorb and compensate the relative displacement and deflection between the two platforms, the common problems of clamping stagnation, dislocation and stress concentration in the traditional rigid butt joint are effectively avoided, and then the two electromagnets are electrified, so that the floating platform is driven to rotate; the floating platform and the target platform which are in a floating state previously are tensioned and fixedly connected into a whole, stable and reliable rigid connection is formed, through a mechanism combining floating compensation and rigid locking, adaptability and stability needed by high-precision butt joint are considered, and it is ensured that chips are not in contact with the target platform at the moment of connection. And a platform system for bearing the device is stable and accurately aligned, so that a solid foundation is laid for accurate placement and grabbing of subsequent chips.

Description

Technical Field

[0001] This invention relates to the field of floating device technology, specifically a floating device for chip transfer in bonding equipment. Background Technology

[0002] A floating device is a mechanical device that enables flexible floating and precise positioning of components through a specific structure or principle. Its core lies in allowing the clamped or positioned workpiece / tool ​​to float flexibly with multiple degrees of freedom within a small range. Through intelligent sensing or mechanical compensation mechanisms, it automatically finds and precisely aligns with the theoretical center position or ideal angle, thereby eliminating assembly errors, compensating for mechanical deviations, or adapting to changes in the workpiece surface, ultimately improving assembly accuracy, load distribution effect, or operational reliability.

[0003] In the semiconductor manufacturing and packaging field, chips often need to be transferred from a chip loading platform to a chip bonding platform. The chip loading platform is fixed on a stable base to ensure positioning accuracy, while the chip bonding platform is isolated from external vibrations by a shock absorption system, but dynamic shaking is inevitable. Due to the lack of an effective floating coordination device between the two platforms, during the direct chip handover process, the shaking of the bonding platform and the fixation of the loading platform will generate relative motion, resulting in chip positioning errors, unstable gripping, falling or damage. Existing technologies such as rigid docking are prone to jamming and misalignment under relative shaking due to lack of buffering capacity, vacuum adsorption methods have insufficient adsorption force during shaking, causing chip displacement, magnetic positioning cannot compensate for multi-degree-of-freedom displacement and has limited control accuracy, while the reset mechanism relies on complex mechanical structures and has high maintenance costs. Summary of the Invention

[0004] The purpose of this invention is to provide a floating device for chip handover in bonding equipment, so as to solve the problem mentioned in the background art where chip movement is difficult due to platform shaking.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a floating device for chip handover in bonding equipment, comprising: The main structure is designed to facilitate the movement of the floating device; A positioning mechanism is used to precisely attach and connect the floating device to other platforms. A gripping mechanism for quickly gripping mobile chips; The main structure includes two connectors and two permanent magnets. The outer walls of the two connectors are provided with guide grooves, and the two permanent magnets are installed on the inner side of the guide grooves to guide the precise fit between the platforms. The positioning mechanism includes two columns and eight locking blocks. Four fixing rods are fixedly installed between the inner walls of the two columns. The eight locking blocks are all sleeved on the surface of the fixing rods. Connecting plates are movably inserted into the inner walls of the two columns. Four first connecting seats are fixedly installed on one side of the outer wall of the two connecting plates. Every four locking blocks are movably sleeved on the outer wall of the first connecting seats. A rubber pad is provided on one side of the outer wall of each of the eight locking blocks. When the four retracted locking blocks on one side contact the inner wall of the connecting parts, they begin to extend under force, thereby guiding the floating device to align with other platforms.

[0006] Preferably, a fixing seat is fixedly installed on one side of the outer wall of each of the eight card blocks, a rotating plate is movably sleeved on the outer wall of each of the eight fixing seats, a set of bending springs is fixedly installed between each of the eight rotating plates and the outer wall of the card blocks, a set of mounting cylinders is fixedly installed on one side of the outer wall of each of the eight rotating plates, and ball bearings are movably inserted inside the multiple sets of mounting cylinders.

[0007] Preferably, the positioning mechanism includes a floating platform, inside which are inserted two sets of first electromagnets, a set of lugs and two racks, a guide post is fixedly inserted on the inner surface wall of each set of lugs, and a moving platform is movably sleeved between the outer surface walls of each set of guide posts, and a dual-axis motor is fixedly inserted inside the moving platform.

[0008] Preferably, the output end of the dual-axis motor is fixedly installed with two motor shafts, and gears are fixedly sleeved on the outer walls of the two motor shafts. The outer walls of the two gears are meshed with the outer walls of the rack. The outer walls of the floating platform are fixedly installed with two columns, and four guide rails are fixedly installed on the outer walls of the two columns. The eight guide rails are movably embedded with sliders inside.

[0009] Preferably, a second spring is fixedly installed on one side of the outer wall of each of the eight sliders and one side of the inner wall of the guide rail; an elastic element and a contact point one are fixedly installed on one side of the inner wall of each of the two columns; a contact point two is contacted on the outer wall of each of the two contact points one; a connecting plate is fixedly installed between the outer walls of the two second springs and the two contact points two; and a second electromagnet is fixedly installed on one side of the outer wall of each of the two connecting plates.

[0010] Preferably, a second connecting seat is fixedly installed on one side of the outer wall of each of the eight sliders, a push plate is movably sleeved on the outer wall of each of the eight second connecting seats, a third connecting seat is movably inserted into the inner wall of each of the eight push plates, and the eight third connecting seats are fixedly installed on one side of the outer wall of the block.

[0011] Preferably, the main body includes a support base, on the top of which a chip loading platform, a chip bonding platform and a water tank are fixedly installed. Connectors are fixedly inserted inside the chip loading platform and the chip bonding platform. A set of iron cores is fixedly inserted inside the two connectors. A set of first ball joints and a first spring are fixedly installed on the top of the support base.

[0012] Preferably, a receiving cylinder is fixedly installed on the top of each of the first ball joints, a piston is movably inserted into the inner wall of each of the receiving cylinders, a second ball joint is fixedly installed on the top of each of the pistons, and a floating platform is fixedly installed between the top of the second ball joints and the top of the first spring.

[0013] Preferably, the input ends of each of the group of receiving cylinders are fixedly connected to water pipes, the input ends of each of the group of water pipes are fixedly connected to electric valves, and the input ends of each of the group of electric valves are fixedly connected to a water tank.

[0014] Preferably, the gripping mechanism includes a rotating base, which is fixed to one side of the outer wall of the floating platform. An electric telescopic rod is fixedly installed on the top of the rotating base. A linear module is fixedly installed at the telescopic end of the electric telescopic rod. A crossbeam is fixedly installed on the top of each linear module. A disc is fixedly installed at the bottom of the crossbeam. A set of flexible sleeves is provided inside the disc. A suction cup is adhered inside each set of flexible sleeves. A set of third springs is fixedly installed between the suction cups and the disc.

[0015] Compared with the prior art, the beneficial effects of the present invention are: In this invention, the floating platform begins to adaptively fine-tune its spatial posture through initial guidance and contact via the locking block and connector, absorbing and compensating for the relative displacement and sway between the two platforms. This effectively avoids the jamming, misalignment, and stress concentration problems commonly found in traditional rigid docking. Subsequently, the two electromagnets are energized and tightly attracted to their corresponding iron cores, pulling the previously floating platform and the target platform together and fixing them into a single unit, forming a stable and reliable rigid connection. Through a combination of floating compensation and rigid locking mechanisms, the adaptability and stability required for high-precision docking are taken into account, ensuring that the platform system supporting the chip is stable and precisely aligned at the moment of handover, thus laying a solid foundation for the subsequent precise placement and gripping of the chip.

[0016] In this invention, the suction cups of the gripping mechanism are connected to the disk of the upper beam by a third spring and a flexible sleeve. When the gripping device moves down to pick up the chip, even if there are slight alignment deviations or flatness errors, this flexible structure allows each suction cup to move independently up and down and sideways, adaptively adhering to the chip surface, ensuring uniform distribution of vacuum adsorption force, and effectively avoiding chip displacement, warping or even breakage caused by single-point stress or weak adsorption. Attached Figure Description

[0017] Figure 1 This is a perspective view of the main structure of a floating device for chip handover in a bonding device according to the present invention. Figure 2 This is a perspective view of the main mechanism in a floating device for chip transfer in a bonding device according to the present invention; Figure 3 This is a partial perspective view of the main mechanism in a floating device for chip transfer in a bonding equipment according to the present invention. Figure 4 This is a cross-sectional view of the positioning mechanism in a floating device for chip handover in a bonding device according to the present invention. Figure 5 This is a partial three-dimensional schematic diagram of the positioning mechanism in a floating device for chip handover in a bonding equipment according to the present invention. Figure 6 This is a cross-sectional view of the internal structure of the positioning mechanism in a floating device for chip handover in a bonding device according to the present invention. Figure 7 This is a partial three-dimensional view of the positioning mechanism in a floating device for chip handover in a bonding device according to the present invention. Figure 8 This is a three-dimensional schematic diagram of the gripping mechanism in a floating device for chip transfer in a bonding device according to the present invention. Figure 9 This is a perspective view of the disk in a floating device for chip transfer in a bonding device according to the present invention.

[0018] In the picture: 1. Main structure; 11. Support base; 12. Chip loading platform; 13. Chip bonding platform; 14. Connector; 15. Iron core; 16. Guide groove; 17. Permanent magnet; 18. First ball joint; 19. Receiving cylinder; 110. Piston; 111. Second ball joint; 112. First spring; 113. Water pipe; 114. Electric valve; 115. Water tank; 2. Positioning mechanism; 21. Floating platform; 22. First electromagnet; 23. Ear block; 24. Guide column; 25. Rack; 26. Moving stage; 27. Dual-axis motor; 28. Motor shaft; 29. ​​Gear; 210. Column; 211. Guide rail; 212. Slider; 213. Second spring; 214. Fixed rod; 215. Elastic element; 216. Contact point one; 217. Contact point two; 218. Connecting plate; 219. First connecting seat; 220. Second electromagnet; 221. Second connecting seat; 222. Push plate; 223. Third connecting seat; 224. Locking block; 225. Rubber pad; 226. Fixed seat; 227. Rotating plate; 228. Bending spring; 229. Mounting cylinder; 230. Ball bearing; 3. Gripping mechanism; 31. Rotating base; 32. Electric telescopic rod; 33. Linear module; 34. Crossbeam; 35. Disc; 36. Flexible sleeve; 37. Suction cup; 38. Third spring. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figure 1 and Figure 2 As shown, this embodiment discloses a floating device for chip transfer in a bonding equipment, including: a main body mechanism 1 for facilitating the movement of the floating device; a positioning mechanism 2 for precisely attaching and connecting the floating device to other platforms; and a gripping mechanism 3 for quickly gripping the moving chip. In existing chip transfers on bonding equipment, the bonding platform is prone to shaking and is difficult to precisely connect with the loading platform, resulting in difficulty in chip movement.

[0021] In this invention, a floating device is used as a medium to precisely connect to two platforms before transferring the chip, ensuring the chip's stability during placement and retrieval. Figure 5 and Figure 7 As shown, the positioning mechanism 2 includes two columns 210 and eight locking blocks 224. Four fixing rods 214 are fixedly installed between the inner walls of each of the two columns 210. The eight locking blocks 224 are all sleeved on the surface of the fixing rods 214. When the locking blocks 224 are compressed and subjected to force, they will rotate around the fixing rods 214 as the center. Figure 6 Figure 7As shown, connecting plates 218 are movably inserted into the inner walls of both columns 210. Four first connecting seats 219 are fixedly installed on one side of the outer wall of each of the two connecting plates 218. Eight locking blocks 224 are movably fitted onto the outer wall of each of the four first connecting seats 219. Rubber pads 225 are provided on one side of the outer wall of each of the eight locking blocks 224. The four retracted locking blocks 224 on one side contact the connecting piece 14 (e.g., Figure 2 When the inner wall is reached, it begins to stretch under force, thereby guiding the floating device to align with other platforms. Each of the eight locking blocks 224 has a fixed base 226 fixedly installed on one side of its outer wall. Each of the eight fixed bases 226 has a rotating plate 227 movably fitted onto its outer wall. A set of bending springs 228 is fixedly installed between each of the eight rotating plates 227 and the outer wall of the locking blocks 224. Each of the eight rotating plates 227 has a set of mounting cylinders 229 fixedly installed on one side of its outer wall. Multiple mounting cylinders 229 have ball bearings 230 movably inserted inside. Figure 2 As shown, the main body 1 includes two connectors 14 and two permanent magnets 17. The outer walls of both connectors 14 are provided with guide grooves 16, and the two permanent magnets 17 are installed on one side of the inner side of the guide grooves 16 to guide the precise fit between the platforms. As the floating platform 21 (e.g., ...) moves... Figure 4 ) and chip loading platform 12 or chip bonding platform 13 (such as Figure 2When the connection approaches, the column 210 first pushes the four locking blocks 224 on one side, which in turn causes multiple balls 230 to contact the inner wall of the connector 14. Since the balls 230 are located inside the mounting cylinder 229, and the mounting cylinder 229 contains multiple small balls, three of which form a universal ball, as the four locking blocks 224 gradually approach, the four locking blocks 224 begin to rotate around the fixed rod 214 as the center, extending outward on the side closer to the balls 230. The locking blocks 224 in the four directions gradually change from an inclined state to a vertical state. Pushing the rubber pad 225 on one side and moving it in all four directions against the inner wall of the connector 14, the moving block 224 not only pulls the first connecting seat 219 to slide inside the column 210, but also presses against the rotating plate 227 against the inner wall of the connector 14 during the process. The rotating plate 227 rotates around the fixed seat 226 as the center, and compresses the bending spring 228, causing the ball 230 to continuously follow the block 224 in a circular motion, always ensuring that the ball 230 rolls inside the connector 14, and preventing the rubber pad 225 from rolling inside the connector 14. Direct friction between the walls can cause jamming. When the floating platform 21 moves, it also drives the column 210 to insert into the guide groove 16 in the center of the connector 14. The front end of the guide groove 16 is conical to further guide the position of the floating platform 21, and the rear end is square, which coincides with the column 210, to fix the aligned column 210 and prevent the floating platform 21 and the connected platform from shifting due to accidental movement. When the floating platform 21 is in contact with the corresponding connector 14, the four locking blocks 224 are in a vertical state, which drives the four rubber pads 225 to be tightly in contact with the four sides of the inner wall of the connector 14. This allows the floating platform 21 to be precisely aligned with the chip loading platform 12 or the chip bonding platform 13 when in contact, ensuring that the position information of the chip from the floating platform 21 to other platforms is transmitted without loss, offsetting the dynamic offset between the two platforms, and locking the positions of the two platforms to prevent jamming or misalignment of the two docked platforms due to shaking. This facilitates the stability of chip placement and gripping.

[0022] like Figure 4As shown, the positioning mechanism 2 includes a floating platform 21. Inside the floating platform 21 are two sets of first electromagnets 22, a set of lugs 23, and two racks 25. Guide posts 24 are fixedly inserted into the inner walls of each set of lugs 23. A movable stage 26 is movably fitted between the outer walls of each set of guide posts 24. A dual-axis motor 27 is fixedly inserted inside the movable stage 26. Two motor shafts 28 are fixedly mounted on the output end of the dual-axis motor 27. Gears 29 are fixedly fitted onto the outer walls of each of the two motor shafts 28. The outer walls of the two gears 29 mesh with the outer walls of the racks 25. To rigidly connect the floating platform 21 to the platforms on both sides, when transferring the chip, the dual-axis motor 27 is first started. The dual-axis motor 27 adjusts its rotation direction as needed, driving the motor shafts 28 on both sides to rotate, causing the gears 29 on the outer walls to move on the surface of the racks 25. Guided by the guide posts 24, the movable stage 26 moves towards the platform to be connected. Figure 2 As shown, a set of iron cores 15 are fixedly inserted inside each of the two connectors 14. After the moving platform 26 finishes moving, the first electromagnet 22 on the corresponding side is energized to generate magnetic force, attracting the nearby iron cores 15. Under the action of magnetic force, the first electromagnet 22 drives the floating platform 21 to gradually approach and even fit into the platform to be connected.

[0023] like Figure 6 As shown, elastic elements 215 and contact point 216 are fixedly installed on one side of the inner wall of each of the two columns 210. Contact point 217 is in contact with the outer wall of each of the two contact points 216. A connecting plate 218 is fixedly installed between the two second springs 213 and the outer wall of contact point 217. A second electromagnet 220 is fixedly installed on one side of the outer wall of each of the two connecting plates 218. When the connecting plate 218 is pulled by the moving block 224, the elastic element 215 is stretched, and the contact point 217 is moved to separate from contact point 216. At this time, the circuit is connected, so that the second electromagnet 220 on the other side is energized to generate magnetic force. The second electromagnet 220 is used to attract the permanent magnet 17 that is constantly approaching it, in order to further strengthen the connection between the two platforms and prevent the first electromagnet 22 from failing and causing the platforms to separate.

[0024] like Figure 5 As shown, two columns 210 are fixedly installed on the outer wall of the floating platform 21. Four guide rails 211 are fixedly installed on the outer wall of each column 210. Slider blocks 212 are movably embedded inside each of the eight guide rails 211. A second spring 213 is fixedly installed on one side of the outer wall of each of the eight sliders 212 and one side of the inner wall of the guide rail 211. Figure 8As shown, a second connecting seat 221 is fixedly installed on one side of the outer wall of each of the eight sliders 212. A push plate 222 is movably sleeved on the outer wall of each of the eight second connecting seats 221. A third connecting seat 223 is movably inserted into the inner wall of each of the eight push plates 222. The eight third connecting seats 223 are fixedly installed on one side of the outer wall of the block 224. When the block 224 makes a circular motion, the third connecting seat 223 installed on the outer wall moves inward and pulls the push plate 222 to move synchronously. At this time, the push plate 222, driven by the second connecting seat 221, drives the slider 212 to slide and squeeze the second spring 213.

[0025] like Figure 2 and Figure 3 As shown, the main structure 1 includes a support base 11. A chip loading platform 12, a chip bonding platform 13, and a water tank 115 are fixedly mounted on the top of the support base 11. Connectors 14 are fixedly inserted into the interior of both the chip loading platform 12 and the chip bonding platform 13. A set of first ball joints 18 and first springs 112 are fixedly mounted on the top of the support base 11. Receiving cylinders 19 are fixedly mounted on the top of each set of first ball joints 18. Pistons 110 are movably inserted into the inner wall of each set of receiving cylinders 19. Second ball joints 111 are fixedly mounted on the top of each set of pistons 110. A floating platform 21 is fixedly mounted between the top of the second ball joints 111 and the top of the first springs 112. Water pipes 113 are fixedly connected to the input ends of each set of receiving cylinders 19. Electric valves 114 are fixedly connected to the input ends of each set of electric valves 114. The water tank 115 is fixedly connected between the input ends of each set of electric valves 114. When the floating platform 21 is pulled, it will cause the bottom set of... The first spring 112 deforms, and under the action of a set of first ball joints 18 and a set of second ball joints 111, it drives the corresponding receiving cylinder 19 and piston 110 to move in the direction of the floating platform 21. As the floating platform 21 moves, the piston 110 begins to move up and down inside the receiving cylinder 19. At this time, the electric valve 114 begins to open. Under the action of air pressure, the receiving cylinder 19 begins to draw tap water from the water tank 115 or send tap water into the water tank 115 through the water pipe 113. After the adjustment is completed, the electric valve 114 closes to fix the platform position in conjunction with other structures. When the two platforms separate, the first spring 112, without external force, begins to drive the top floating platform 21 to reset. At this time, the electric valve 114 opens again to facilitate the flow of tap water between the receiving cylinder 19 and the water tank 115. This device achieves a damping effect through water flow, ensuring that the device can move arbitrarily in space, while reducing the shaking of the device during movement and even reset, thus improving the stability of operation.

[0026] like Figure 8 and Figure 9As shown, the gripping mechanism 3 includes a rotating base 31, which is fixed to one side of the outer wall of the floating platform 21. An electric telescopic rod 32 is fixedly installed on the top of the rotating base 31. A linear module 33 is fixedly installed at the telescopic end of the electric telescopic rod 32. A crossbeam 34 is fixedly installed on the top of each linear module 33. A disc 35 is fixedly installed at the bottom of the crossbeam 34. A set of flexible sleeves 36 is provided inside the disc 35. A suction cup 37 is adhered inside each set of flexible sleeves 36. A set of first-order suction cups 37 is fixedly installed between the set of suction cups 37 and the disc 35. When the chip needs to be moved, the three springs 38 first cause the disk 35 to rotate the suction cup 37 to be collinear with the center of the chip. Then, the linear module 33 pushes the suction cup 37 forward to above the chip. Finally, the electric telescopic rod 32 drives the suction cup 37 to fit against the chip. At this time, the flexible sleeve 36 allows the suction cup 37 to move left and right. The third spring 38 facilitates the up and down movement of the suction cup 37. The multiple suction cups 37 move up, down, left and right to ensure perfect contact with the chip surface, avoiding failure to adsorb and transfer the chip due to poor contact, or chip damage.

[0027] The wiring diagrams of the electric valve 114, the first electromagnet 22, the dual-axis motor 27, the second electromagnet 220, the electric telescopic rod 32, and the linear module 33 in this invention are common knowledge in the field, and their working principles are known technologies. The appropriate model is selected according to actual use. Therefore, the control methods and wiring arrangements of the electric valve 114, the first electromagnet 22, the dual-axis motor 27, the second electromagnet 220, the electric telescopic rod 32, and the linear module 33 will not be explained in detail.

[0028] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A floating device for chip handover in bonding equipment, characterized in that, Including: The main structure (1) is used to facilitate the movement of the floating device; Positioning mechanism (2) is used to precisely attach and connect the floating device to other platforms; The gripping mechanism (3) is used to quickly grip the mobile chip; The main body (1) includes two connectors (14) and two permanent magnets (17). The outer walls of the two connectors (14) are provided with guide grooves (16). The two permanent magnets (17) are installed on one side inside the guide grooves (16) to guide the precise fit between the platforms. The positioning mechanism (2) includes two columns (210) and eight locking blocks (224). Four fixing rods (214) are fixedly installed between the inner walls of the two columns (210). The eight locking blocks (224) are all sleeved on the surface of the fixing rods (214). Connecting plates (218) are movably inserted into the inner walls of the two columns (210). Four first connecting seats (219) are fixedly installed on one side of the outer wall of the two connecting plates (218). Four locking blocks (224) are movably sleeved on the outer wall of the first connecting seat (219) for every four. Rubber pads (225) are provided on one side of the outer wall of the eight locking blocks (224). When the four retracted locking blocks (224) on one side come into contact with the inner wall of the connector (14), they begin to stretch under force, thereby guiding the floating device to align with other platforms.

2. The floating device for chip handover in bonding equipment according to claim 1, characterized in that, Each of the eight card blocks (224) has a fixed seat (226) fixedly installed on one side of its outer wall. Each of the eight fixed seats (226) has a rotating plate (227) movably fitted on its outer wall. Each of the eight rotating plates (227) and the outer wall of the card blocks (224) has a set of bending springs (228) fixedly installed between them. Each of the eight rotating plates (227) has a set of mounting cylinders (229) fixedly installed on one side of its outer wall. Each of the mounting cylinders (229) has a ball bearing (230) movably inserted inside it.

3. A floating device for chip handover in a bonding device according to claim 1, characterized in that, The positioning mechanism (2) includes a floating platform (21). Inside the floating platform (21) are two sets of first electromagnets (22), a set of lugs (23) and two racks (25). The inner surface of each set of lugs (23) is fixedly fitted with guide posts (24). A moving stage (26) is movably fitted between the outer surface of each set of guide posts (24). Inside the moving stage (26) is a dual-axis motor (27).

4. A floating device for chip handover in a bonding device according to claim 3, characterized in that, The output end of the dual-axis motor (27) is fixedly equipped with two motor shafts (28). Gears (29) are fixedly sleeved on the outer walls of the two motor shafts (28). The outer walls of the two gears (29) are meshed with the outer walls of the rack (25). The outer walls of the floating platform (21) are fixedly equipped with two columns (210). The outer walls of the two columns (210) are fixedly equipped with four guide rails (211). The eight guide rails (211) are all movably embedded with sliders (212).

5. A floating device for chip handover in a bonding device according to claim 4, characterized in that, Each of the eight sliders (212) has a second spring (213) fixedly installed on one side of its outer wall and the inner wall of its guide rail (211). Each of the two columns (210) has an elastic element (215) and a contact point (216) fixedly installed on one side of its inner wall. Each of the two contact points (216) has a contact point (217) in contact with its outer wall. Each of the two second springs (213) and the two contact points (217) has a connecting plate (218) fixedly installed between its outer walls. Each of the two connecting plates (218) has a second electromagnet (220) fixedly installed on one side of its outer wall.

6. A floating device for chip handover in a bonding device according to claim 4, characterized in that, Each of the eight sliders (212) has a second connecting seat (221) fixedly installed on one side of its outer wall. Each of the eight second connecting seats (221) has a push plate (222) movably fitted on its outer wall. Each of the eight push plates (222) has a third connecting seat (223) movably inserted into its inner wall. Each of the eight third connecting seats (223) is fixedly installed on one side of the outer wall of the block (224).

7. A floating device for chip handover in a bonding device according to claim 1, characterized in that, The main body (1) includes a support base (11). A chip loading platform (12), a chip bonding platform (13) and a water tank (115) are fixedly installed on the top of the support base (11). Connectors (14) are fixedly inserted inside the chip loading platform (12) and the chip bonding platform (13). A set of iron cores (15) are fixedly inserted inside the two connectors (14). A set of first ball joints (18) and a first spring (112) are fixedly installed on the top of the support base (11).

8. A floating device for chip handover in a bonding device according to claim 7, characterized in that, A receiving cylinder (19) is fixedly installed on the top of each of the first ball joints (18), and a piston (110) is movably inserted into the inner wall of each of the receiving cylinders (19). A second ball joint (111) is fixedly installed on the top of each of the pistons (110), and a floating platform (21) is fixedly installed between the top of the second ball joint (111) and the top of the first spring (112).

9. A floating device for chip handover in a bonding device according to claim 8, characterized in that, Each of the input ends of a set of the receiving cylinders (19) is fixedly connected to a water pipe (113), each of the input ends of a set of the water pipes (113) is fixedly connected to an electric valve (114), and a water tank (115) is fixedly connected between the input ends of a set of the electric valves (114).

10. A floating device for chip handover in a bonding device according to claim 1, characterized in that, The gripping mechanism (3) includes a rotating base (31), which is fixed to one side of the outer wall of the floating platform (21). An electric telescopic rod (32) is fixedly installed on the top of the rotating base (31). A linear module (33) is fixedly installed at the telescopic end of the electric telescopic rod (32). A crossbeam (34) is fixedly installed on the top of the linear module (33). A disc (35) is fixedly installed at the bottom of the crossbeam (34). A set of flexible sleeves (36) is provided inside the disc (35). A suction cup (37) is adhered inside the set of flexible sleeves (36). A set of third springs (38) is fixedly installed between the set of suction cups (37) and the disc (35).

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