Substrate holding mechanism, conveyance device, holding member, substrate molding system, substrate holding method, and substrate molding method

Abstract

The base material holding mechanism (440) includes: a main body portion (441) having a three-dimensional shape including at least a concave portion or a convex portion; and an adsorption part (449) for holding the base material by adsorbing the base material to the main body part (441) along the three-dimensional shape of the concave part or the convex part provided in the main body part (441). Furthermore, the base material is sucked and held along the three-dimensional shape of the main body part (441), so that the use amount of the base material in the base material forming system (100) can be reduced compared with a case in which the base material is held in a flat shape.

Description

Technical Field

[0001] This invention relates to a substrate holding mechanism and a substrate forming system for holding a substrate in a substrate forming system for forming a substrate, and a substrate holding method of such a substrate holding mechanism. Furthermore, this invention also relates to a substrate forming system for producing a molded article by forming a substrate generated by a substrate forming apparatus, a transport device for transporting the substrate and the molded article produced by forming the substrate, a holding member provided in such a transport device, and a substrate forming method of such a substrate forming system. Background Technology

[0002] Currently, in substrate molding systems that produce molded articles using a substrate (e.g., a film) formed by an injection molding machine, the following steps are performed sequentially. More specifically, the steps are performed sequentially as follows: a step of feeding the film from the preform; a step of cutting the fed film into sheets; a step of heating the cut film sheets to soften them; a step of vacuum forming the heated film using a mold; a step of injecting resin; and a step of removing the molded article.

[0003] Furthermore, in Patent No. 5866398 (JP5866398B2), a substrate holding mechanism for a substrate to be formed in a substrate holding forming system is disclosed, which clamps only the upper edge of the sheet-like substrate. More specifically, the sheet-like substrate, with only its upper edge clamped, becomes a flat shape extending straight downwards due to gravity. Additionally, by placing the sheet-like substrate held in this state between molds, the substrate can be formed using the molds. Furthermore, Patent No. 5866398 discloses a structure in which a heating mechanism is provided outside the injection molding machine to preheat another film during the vacuum forming of one film, thereby shortening the production time of the molded article.

[0004] In addition, Patent No. 5926352 (JP5926352B2) discloses an injection molding system in which a multi-joint robot arm is installed inside the injection molding machine to remove the molded product from the mold. Summary of the Invention

[0005] The substrate forming system disclosed in Patent No. 5866398 uses a holding hand, as described above, to form a flat substrate that extends straight downwards using a mold. Therefore, it is difficult to reduce the amount of substrate used in the substrate forming system. More specifically, for example, when forming the substrate into a convex shape using a mold, transferring a substrate held in a convex shape pre-formed along the shape of the mold can reduce the amount of substrate used compared to transferring a substrate held in an unbent, flat state to the mold. However, the problem is that a substrate holding mechanism capable of holding the substrate in such a bent state currently does not exist.

[0006] In addition, in existing injection molding systems, each process for making the molded product is performed sequentially. Therefore, when making sheet-like films and injection molding, which take time, the delay in each process directly affects the production time of the molded product.

[0007] Furthermore, in the injection molding system disclosed in Patent No. 5866398, a heating unit is provided outside the injection molding machine. Therefore, after the film is heated by the heating unit, it must be transported from the heating unit to the injection molding machine. This requires the introduction of multiple robots, such as a robot for supplying the film to the injection molding machine and a robot for transporting the molded product, resulting in a complex overall system structure. On the other hand, in the injection molding system disclosed in Patent No. 5926352, heating is performed while holding only one side of the sheet-like film. Therefore, if the sheet-like film is thin, wrinkles or warping may occur during heating. In addition, the sheet-like film with wrinkles or warping cannot adhere sufficiently to the mold during vacuum forming, thus failing to achieve tight adhesion between the sheet-like film and the mold, resulting in reduced design flexibility of the molded product. In addition, the injection molding system disclosed in Patent No. 5926352 has a robot arm installed inside the injection molding device. Therefore, the robot arm has a narrow range of motion and may interfere with the various components of the injection molding machine depending on the situation.

[0008] The present invention was developed with these aspects in mind, and its object is to provide a substrate holding mechanism, substrate forming system and substrate holding method that can reduce the amount of substrate used in a substrate forming system by adsorbing and holding the substrate in a manner that follows the three-dimensional shape of a main body having at least a concave or convex portion.

[0009] Another object of the present invention is to provide a substrate forming system, a transport device, a holding member, and a substrate forming method that, during the production of a molded article by forming a substrate using a forming apparatus, can heat the substrate to be formed while transporting it to the forming apparatus, thereby shortening the overall processing time when producing a molded article by sequentially forming multiple substrates.

[0010] The substrate holding mechanism of the present invention is used to hold a substrate in a substrate forming system for forming a substrate. The substrate holding mechanism is characterized by comprising: a main body having a three-dimensional shape including at least a concave portion or a convex portion; and an adsorption portion that holds the substrate by adsorbing it onto the main body along the three-dimensional shape of the concave portion or the convex portion provided on the main body.

[0011] In the substrate holding mechanism of the present invention, the main body may have a structure in which a base component and an elastic component having an elastic material are stacked, and when the adsorption part adsorbs the substrate along the three-dimensional shape of the main body, the elastic component contacts the substrate.

[0012] In this case, the elastic material can also be silicone resin.

[0013] Alternatively, the main body may also include a frame-shaped component with an opening.

[0014] The substrate holding mechanism of the present invention may also include a holding auxiliary component disposed inside the opening of the frame-shaped component to assist the frame-shaped component in holding the substrate.

[0015] Alternatively, in the substrate holding mechanism of the present invention, the adsorption part may hold the substrate by vacuum adsorption of the substrate.

[0016] Alternatively, in the substrate holding mechanism of the present invention, the main body may include a porous material having a plurality of adsorption pores, and the adsorption part may adsorb the substrate along the three-dimensional shape of the recess or the protrusion provided on the main body by drawing gas through each of the adsorption pores.

[0017] Alternatively, in the substrate holding mechanism of the present invention, a plurality of through holes may be provided in the main body, and the adsorption part may adsorb gas through each of the through holes, thereby adsorbing the substrate along the three-dimensional shape of the concave or convex portion provided in the main body.

[0018] In this case, each of the through holes can also be a gap.

[0019] In addition, each of the through holes can also be circular, elliptical, or polygonal in shape.

[0020] The conveying device of the present invention is used to convey a substrate generated by a substrate generating apparatus and a molded article made by forming the substrate. The conveying device is characterized by comprising: a holding member for holding the substrate and the molded article; and a moving mechanism for moving the holding member, the holding member having: a substrate holding portion for holding and heating the substrate; and a molded article holding portion for holding the molded article.

[0021] In the transport device of the present invention, the moving mechanism may also include a multi-joint robot.

[0022] The holding member of the present invention has a frame portion for holding a generated substrate generated by a substrate generating apparatus and a molded article made by forming the generated substrate. The holding member is characterized in that it includes: a substrate holding portion that holds the generated substrate and heats the generated substrate by means of a heating member disposed on the side of the structural member on which the frame portion is mounted; and a molded article holding portion that holds the molded article made by forming the generated substrate.

[0023] In the holding component of the present invention, the substrate holding part may also hold the substrate generated by vacuum adsorption.

[0024] In the holding component of the present invention, the molded article holding part may hold the molded article by vacuum adsorption.

[0025] In the retaining component of the present invention, the frame portion may be generally rectangular in shape, with the substrate retaining portion provided on the front side of the frame portion and the molded article retaining portion provided on the back side of the frame portion.

[0026] In the holding member of the present invention, the structure for holding the generated substrate generated by the substrate generating apparatus using the substrate holding part may be different from the structure for holding the molded article using the molded article holding part.

[0027] The substrate forming system of the present invention is used to produce molded articles by forming a substrate. The substrate forming system is characterized by comprising: a substrate generating apparatus for generating a substrate; a forming apparatus for forming the substrate generated by the substrate generating apparatus; and a transport apparatus for transporting the substrate generated by the substrate generating apparatus from the substrate generating apparatus to the forming apparatus. The transport apparatus has: a substrate holding mechanism for holding the substrate; and a moving mechanism for moving the substrate holding mechanism. The substrate holding mechanism has: a main body having a three-dimensional shape including at least a recess or a protrusion; and an adsorption part for holding the substrate by adsorbing it onto the main body along the three-dimensional shape of the recess or the protrusion provided on the main body.

[0028] In the substrate forming system of the present invention, the forming device may have a concave mold having a three-dimensional shape including at least a concave portion, and the main body of the substrate holding mechanism may include a protrusion that is embedded in at least a portion of the concave portion of the mold of the forming device.

[0029] Alternatively, in the substrate forming system of the present invention, the forming device may perform vacuum forming of the substrate generated by the substrate generating device and injection molding of the resin (injection molding).

[0030] Alternatively, in the substrate forming system of the present invention, the moving mechanism of the conveying device may include a multi-joint robot.

[0031] The substrate forming system of the present invention is used to produce molded articles by forming a substrate. The substrate forming system is characterized by comprising: a substrate generating apparatus for generating a substrate; a forming apparatus for forming the substrate generated by the substrate generating apparatus; and a transport apparatus for transporting the substrate generated by the substrate generating apparatus from the substrate generating apparatus to the forming apparatus, the transport apparatus having: a holding member for holding the substrate generated by the substrate generating apparatus and the molded article formed from the substrate by the forming apparatus; and a moving mechanism for moving the holding member, the holding member having: a substrate holding portion for holding and heating the substrate generated by the substrate generating apparatus; and a molded article holding portion for holding the molded article formed from the substrate by the forming apparatus.

[0032] In the substrate forming system of the present invention, the forming device may also perform vacuum forming of the substrate generated by the substrate generating device and injection forming of resin.

[0033] In this case, the molding apparatus performs vacuum forming on one side of the substrate transported to the molding apparatus and resin injection forming on the other side.

[0034] In the substrate forming system of the present invention, the moving mechanism of the conveying device may also include a multi-joint robot.

[0035] In the substrate forming system of the present invention, the substrate holding part of the holding member of the conveying device may also hold the substrate generated by vacuum adsorption.

[0036] In the substrate forming system of the present invention, the molded article holding part of the holding member of the conveying device may also hold the molded article by vacuum adsorption.

[0037] In the substrate forming system of the present invention, the holding member of the conveying device may have a frame portion with a generally rectangular shape, the substrate holding portion being provided on the front side of the frame portion of the conveying device, and the molded article holding portion being provided on the back side of the frame portion.

[0038] In the substrate forming system of the present invention, the structure for holding the generated substrate using the substrate holding part in the holding member of the conveying device may be different from the structure for holding the molded article using the molded article holding part.

[0039] The substrate holding method of the present invention is used to hold a substrate in a substrate forming system for forming a substrate. The substrate holding method is characterized by comprising: a step of preparing a substrate; and a step of holding the substrate by adsorbing the substrate along the three-dimensional shape of a main body portion having at least a concave or convex portion.

[0040] The substrate forming method of the present invention is characterized by comprising: a step of generating a substrate; a step of transporting the generated substrate to a forming apparatus by means of the transport apparatus after holding the generated substrate with a holding member of the transport apparatus, wherein the generated substrate held by the holding member is heated at this time; and a step of producing a molded article by forming the generated substrate with the forming apparatus, wherein during the production of the molded article by forming the generated substrate with the forming apparatus, the generated substrate to be subsequently formed by the forming apparatus is transported to the forming apparatus by means of the transport apparatus and heated thereon.

[0041] In the substrate forming method of the present invention, the formed article produced by the forming device may be taken out of the forming device by the conveying device while the substrate to be formed by the forming device is held in the forming device by the conveying device.

[0042] In this case, when the molded article produced by the molding apparatus is removed from the molding apparatus by the conveying device, the molded article is held in a part of the holding member that is different from the part where the generated substrate was held when it was transported to the molding apparatus by the conveying device. Attached Figure Description

[0043] Figure 1 This is a top view that schematically illustrates the structure of a substrate forming system according to an embodiment of the present invention.

[0044] Figure 2 yes Figure 1 A three-dimensional view of the substrate forming system shown.

[0045] Figure 3 It means Figure 1A top view of the structure of the holding component in the transport device of the substrate forming system shown.

[0046] Figure 4 It means Figure 3 A front view showing details of the structure of the substrate holding mechanism for the holding component.

[0047] Figure 5 It means Figure 4 A perspective view of the schematic structure of the main body of the substrate holding mechanism shown.

[0048] Figure 6 It means Figure 4 A side view of the general structure of the main body of the substrate holding mechanism shown.

[0049] Figure 7 This indicates that it will be by Figure 4 A side view of the schematic structure of the substrate held by the substrate holding mechanism as it is transferred to the forming device.

[0050] Figure 8 It means Figure 3 A front view showing details of the structure of the molded part holding component of the shown retaining member.

[0051] Figure 9 It means Figure 1 The diagram shows the functional block diagram of the control system structure of the conveying device of the substrate forming system.

[0052] Figure 10 It means Figure 1 A top view of the intermediate state of a molded article being produced by molding a substrate in the substrate molding system shown.

[0053] Figure 11 It indicates a continuation Figure 10 The state shown Figure 1 A top view of the intermediate state of a molded article being produced by molding a substrate in the substrate molding system shown.

[0054] Figure 12 It indicates a continuation Figure 11 The state shown Figure 1 A top view of the intermediate state of a molded article being produced by molding a substrate in the substrate molding system shown.

[0055] Figure 13 It indicates a continuation Figure 12 The state shown Figure 1 A top view of the intermediate state of a molded article being produced by molding a substrate in the substrate molding system shown.

[0056] Figure 14(a) is a flowchart illustrating a substrate forming method of a substrate forming system according to an embodiment of the present invention, and (b) is a flowchart illustrating a substrate forming method of a prior art substrate forming system.

[0057] Figure 15 It is a general representation Figure 1 A side view of another structure of the substrate holding mechanism and forming device of the substrate forming system shown.

[0058] Figure 16 It is a general representation Figure 1 A side view of another structure of the substrate holding mechanism and forming device of the substrate forming system shown.

[0059] Figure 17 It is a general representation Figure 1 A side view of another structure of the substrate holding mechanism and forming device of the substrate forming system shown.

[0060] Figure 18 It means to utilize Figure 17 The diagram shows the structure of the forming device when forming the substrate.

[0061] Figure 19 This is a general indication of adding settings. Figure 3 A front view of the structure of the base material holding part of the holding member shown in the figure.

[0062] Figure 20 It means Figure 1 A structural diagram of another example of the forming apparatus of the substrate forming system shown.

[0063] Figure 21 It means Figure 3 A structural diagram of another example of the substrate holding part of the holding component shown. Detailed Implementation

[0064] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figures 1 to 21 This is a diagram illustrating the substrate forming system of this embodiment and the substrate forming method of such substrate forming system. Furthermore, Figure 1 In this drawing, the operator performing the work using the substrate forming system of this embodiment is indicated by the reference numeral M. Additionally, Figure 2 In the drawing, the positioning marks set on the billet are indicated by the reference numeral X. Additionally, Figures 2-4 , Figures 6-8 , Figures 10-13 as well as Figures 15-21 In this drawing, the substrate to be formed by the forming apparatus before molding is indicated by reference numeral W1, and the molded article made by forming the substrate by the forming apparatus is indicated by reference numeral W2. Additionally, Figure 7 , Figure 15 and Figure 16 In the figure, the substrate to be generated, which is held by an existing substrate holding mechanism, is indicated by the reference numeral W.

[0065] First, use Figure 1 and Figure 2 The substrate forming system 100 of this embodiment will be described. For example... Figure 1 and Figure 2 As shown, the substrate forming system 100 of this embodiment includes: a substrate forming apparatus 200 for forming a sheet-like film or the like; a forming apparatus 300 for forming the substrate formed by the substrate forming apparatus 200; and a transport apparatus 400 for transporting the substrate formed by the substrate forming apparatus 200 from the substrate forming apparatus 200 to the forming apparatus 300. In this substrate forming system 100, firstly, a sheet-like film or the like is formed using the substrate forming apparatus 200; then, the substrate formed by the substrate forming apparatus 200 is transported from the substrate forming apparatus 200 to the forming apparatus 300 using the transport apparatus 400; and then, the substrate is formed using the forming apparatus 300, thereby producing a molded article. Furthermore, according to the substrate forming method of this embodiment, during the production of a molded article by forming the substrate using the forming apparatus 300, the substrate to be formed by the forming apparatus 300 is heated while being transported from the substrate forming apparatus 200 to the forming apparatus 300 using the transport apparatus 400. The following is a detailed description of each component of this substrate forming system 100.

[0066] like Figure 2 As shown, the substrate forming apparatus 200 includes: a conveying section 240 such as a conveying roller that intermittently conveys a strip of film or other substrate material fed from a blank 220; and a cutting section 260 such as a cutting machine that cuts off the leading edge portion of the strip of substrate material conveyed by the conveying section 240. By cutting off the leading edge portion of the strip of substrate material with the cutting section 260, a sheet-like (in other words, a single sheet) substrate material is formed. Additionally, as... Figure 2As shown, near the end of the blank 220 in the width direction, a plurality of positioning marks (indicated by reference numeral X) are formed at predetermined intervals along the feeding direction of the blank 220. Furthermore, the strip-shaped substrate is cut by the cutting section 260 of the substrate forming apparatus 200 such that a positioning mark is included at a predetermined location on the cut sheet-shaped substrate. As described later, when the sheet-shaped substrate is removed from the substrate forming apparatus 200 by the transport device 400, the positioning marks are used to position the transport device 400 relative to the sheet-shaped substrate. Here, the substrate fed from the blank 220 in the substrate forming apparatus 200 is, for example, a single-layer or multi-layer film of acrylic, PET, ABS resin, polyethylene, polycarbonate, and polypropylene. Furthermore, when using a multi-layer film or similar material as the substrate, the total thickness only needs to be within the range of 50 to 1000 μm. More specifically, the thickness of each layer depends on the number of layers and is limited to the range of 50 to 1000 μm as the total thickness.

[0067] The molding apparatus 300 performs vacuum forming of the substrate generated by the substrate generating apparatus 200 and resin injection molding (injection molding). More specifically, the molding apparatus 300 performs vacuum forming with respect to one side of the substrate transported to the molding apparatus 300, and performs resin injection molding with respect to the other side. Specifically, as described below... Figure 1 and Figure 2 As shown, the forming apparatus 300 includes: a movable mold 320, a fixed mold 340, a movable mold holding portion 360 for holding the movable mold 320, and a fixed mold holding portion 380 for holding the fixed mold 340. When the movable mold 320 and the fixed mold 340 are in contact with each other, a concave cavity (cavity portion) is formed between the movable mold 320 and the fixed mold 340. More specifically, a recess 321 is formed in the movable mold 320, and a protrusion 341 is provided in the fixed mold 340 that enters the recess 321. When the movable mold 320 and the fixed mold 340 are in contact with each other and the protrusion 341 enters the recess 321, a concave cavity is formed between the protrusion 341 and the recess 321.

[0068] The substrate material, transported to the forming apparatus 300 by the conveying device 400, is vacuum-formed using the movable mold 320 of the forming apparatus 300. More specifically, as... Figure 1As shown, a gas flow path 330 is connected to the recess 321 of the movable mold 320, and a suction pump 310 is connected to this flow path 330. Furthermore, the suction pump 310 draws gas from the flow path 330, thereby vacuum-adhering the substrate material transported by the transport device 400 to the forming device 300 to the movable mold 320. At this time, the substrate material enters the recess 321 of the movable mold 320, thereby vacuum-forming the substrate material in a manner that conforms to the shape of the recess 321. Additionally, as... Figure 1 As shown, a positioning mark 322 is formed on the movable mold 320. As described later, when the substrate is transferred by the transport device 400, the positioning mark 322 is used to position the moving mechanism 410 (i.e., the substrate) relative to the movable mold 320.

[0069] In addition, such as Figure 1 As shown, a resin supply path 350 is provided in the fixed mold holding part 380. This resin supply path 350 supplies a resin such as thermoplastic resin to the cavity formed between the movable mold 320 and the fixed mold 340 when they are in contact. A resin supply part 390 that supplies resin to the resin supply path 350 is connected to the resin supply path 350. When the movable mold 320 and the fixed mold 340 are in contact, resin is supplied from the resin supply part 390 to the concave cavity formed between the movable mold 320 and the fixed mold 340 via the resin supply path 350. As a result, resin injection molding is performed on the surface of the substrate formed by vacuum forming using the movable mold 320 (specifically, the surface opposite to the surface opposite to the concave portion 321). Here, the resin supplied from the resin supply section 390 to the cavity between the movable mold 320 and the fixed mold 340 via the resin supply path 350 is, for example, any one of acrylic acid, ABS resin, AES resin, AS resin, polycarbonate, and polypropylene, or a mixture thereof. Additionally, the resin supplied to the cavity may also contain a tilted material obtained by melting the interfaces of the aforementioned materials.

[0070] In addition, such as Figure 1 and Figure 2 As shown, the molding apparatus 300 has a guide portion 370 for guiding a movable mold holding portion 360. The movable mold holding portion 360 moves along the guide portion 370 toward a fixed mold holding portion 380 and away from the fixed mold holding portion 380, respectively. Furthermore, Figure 1 This indicates the state when the movable mold holding part 360 separates from the fixed mold holding part 380. Figure 10 This indicates the state when the movable mold 320 approaches the fixed mold 380 via the movable mold holding part 360 and the movable mold 320 and the fixed mold 340 come into contact with each other.

[0071] In this embodiment, the forming temperature of the substrate produced by the forming apparatus 300 is preferably 80 to 160°C. Furthermore, when vacuum forming of the substrate using the forming apparatus 300, the vacuum level is preferably in the range of approximately 100,000 Pa (maximum atmospheric pressure) to a minimum of 0.1 Pa. Additionally, the stamping pressure relative to the substrate exerted by the movable mold 320 and the fixed mold 340 is preferably in the range of 0 kN to 40,000 kN.

[0072] The conveying device 400 transports the substrate generated by the substrate generating device 200 from the substrate generating device 200 to the forming device 300, or removes the molded article formed from the substrate by the forming device 300 from the forming device 300. Specifically, such as Figure 1 and Figure 2 As shown, the transport device 400 includes: a holding member 420 for holding the substrate generated by the substrate generating apparatus 200 and the molded article formed from the substrate by the forming apparatus 300; and a moving mechanism 410 for moving the holding member 420. Furthermore, in this embodiment, a multi-joint robot is used as the moving mechanism 410. Using this multi-joint robot, the orientation of the substrate, substrate, and molded article held by the holding member 420 can be changed. In addition, since the moving mechanism 410 of the transport device 400 uses a multi-joint robot, and the moving mechanism 410 is provided outside the forming apparatus 300, even in confined spaces when the movable mold 320 and the fixed mold 340 are separated, contact between the moving mechanism 410 and the constituent components of the substrate forming system 100 can be prevented.

[0073] Furthermore, the moving mechanism 410 is not limited to a multi-joint robot. Any device other than a multi-joint robot can be used as the moving mechanism 410, as long as it can transport the substrate generated by the substrate generating apparatus 200 from the substrate generating apparatus 200 to the molding apparatus 300 and remove the molded article formed from the substrate by the molding apparatus 300 from the molding apparatus 300.

[0074] In addition, such as Figure 3 As shown, the retaining member 420 has a frame portion 423 with an opening. Additionally, a feature for retaining the substrate generated by the substrate generating apparatus 200 is provided on one side (e.g., the front side) of the retaining member 420. Figure 3 The substrate holding mechanism 440 (denoted by reference numeral W1 in the accompanying drawings) has a feature on the other side (e.g., the back side) of the holding member 420 for holding the molded article formed from the substrate by the forming device 300. Figure 3The molded article holding portion 460 (represented by reference numeral W2 in the accompanying drawings). As described above, the holding member 420 moves using the moving mechanism 410, therefore, the substrate holding mechanism 440 and the molded article holding portion 460 also move using the moving mechanism 410.

[0075] In addition, such as Figure 1 and Figure 9 As shown, the transport device 400 includes an imaging unit 401 such as a camera, and a control unit 490 that controls the movement mechanism 410 based on images captured by the imaging unit 401. More specifically, the imaging unit 401 captures images of positioning marks ( ) set on the substrate being formed by the substrate forming apparatus 200. Figure 2 The positioning mark 322 is provided on the movable mold 320 (denoted by reference numeral X in the attached drawing). Furthermore, the control unit 490 controls the moving mechanism 410 based on the positioning mark 322 and the like in the image captured by the imaging unit 401. More specifically, the control unit 490 controls the imaging unit 401 to capture an image of the substrate generated by the substrate generating apparatus 200 before holding it with the substrate holding mechanism 440. Additionally, the control unit 490 controls the moving mechanism 410 of the transport device 400 based on the position of the positioning mark in the image of the substrate generated by the imaging unit 401, thereby positioning the moving mechanism 410 (more specifically, the substrate holding mechanism 440) relative to the substrate generated. Therefore, after positioning the substrate holding mechanism 440 relative to the substrate generated, the substrate generated can be held by the substrate holding mechanism 440.

[0076] Furthermore, the control unit 490 controls the imaging unit 401 to capture images of the positioning marks 322 formed on the movable mold 320 before transferring the substrate held by the substrate holding mechanism 440 to the forming apparatus 300. Additionally, the control unit 490 controls the moving mechanism 410 (more specifically, the substrate held by the substrate holding mechanism 440) relative to the movable mold 320 by controlling the position of the positioning marks 322 in the image of the movable mold 320 captured by the imaging unit 401. Therefore, the substrate can be transferred to the movable mold 320 after positioning of the substrate relative to the movable mold 320. In other words, in this embodiment, the processing position (gripping position) of the transport device 400 on the substrate is corrected based on the positioning marks formed on the substrate and the positioning marks 322 provided on the movable mold 320. Thus, positioning is performed in both cases: when the substrate generated by the substrate generating apparatus 200 is held by the substrate holding mechanism 440 and when the substrate is transferred to the movable mold 320. Therefore, high-quality molded articles can be produced with good reproducibility using the forming apparatus 300.

[0077] use Figures 3-7Details of the structure of the substrate holding mechanism 440 are explained here. Figure 4 It means Figure 3 A detailed front view of the structure of the substrate holding mechanism 440 of the holding member 420 shown. In other words, Figure 4 It means to Figure 3 The main body 441 of the substrate holding mechanism 440 of the holding member 420 shown is from... Figure 3 A structural diagram of the structure when viewed from left to right. Additionally, Figure 5 and Figure 6 It means Figure 4 A perspective view and a side view of the schematic structure of the main body 441 of the substrate holding mechanism 440 shown. Figure 7 This indicates that it will be by Figure 4 A side view of the schematic structure of the substrate held by the substrate holding mechanism 440 as it is transferred to the movable mold 320 of the forming device 300.

[0078] like Figures 3-7 As shown, the substrate holding mechanism 440 includes a main body 441 having a three-dimensional shape including at least a recess or a protrusion. In this embodiment, the main body 441 is composed of a generally rectangular frame member 443 having a protrusion 442 and an opening 444, the protrusion 442 being formed in a convex shape that bends toward a recess 321 formed in the movable mold 320. More specifically, the main body 441 is formed such that the shape of the substrate held by the main body 441 is substantially the same as the three-dimensional shape of the recess 321 of the movable mold 320 (see reference). Figure 7 Furthermore, the main body 441 has multiple (specifically four) elongated slits 447, which are used to vacuum-adsorb the sheet-like substrate near its four sides. In this way, the substrate is adsorbed and held along the three-dimensional shape of the main body 441. More specifically, as... Figure 3 As shown, gas flow paths 448 are connected to each slit 447, and suction pumps such as rotary pumps 430 are connected to these flow paths 448. Furthermore, by using the suction pumps 430 to draw gas from each flow path 448, the areas near the four sides of the sheet-like substrate are vacuum-adsorbed into each slit 447. That is, in the substrate holding mechanism 440 of this embodiment, suction portions 449 are formed to adsorb the substrate in a three-dimensional shape that conforms to the main body 441 using the suction pumps 430, slits 447, and flow paths 448.

[0079] Furthermore, the main body 441 has a structure in which a base component 445 and an elastic component 446 made of an elastic material are stacked. When the substrate is adsorbed along the three-dimensional shape of the main body 441 by the adsorption part 449, the elastic component 446 comes into contact with the substrate. Here, it is preferable that the base component 445 is formed of a lightweight and highly rigid material (e.g., aluminum or carbon fiber). Furthermore, to improve the adhesion between the elastic component 446 and the substrate, it is preferable that the elastic component 446 is formed of a soft material such as resin. As described later, the substrate is heated by the heater 450 (heating member) while held in the main body 441; therefore, it is more preferable that the elastic component 446 is made of a heat-resistant silicone resin or the like. Alternatively, the elastic component 446 may also be formed of a heat-resistant rubber or the like.

[0080] Furthermore, a heater 450 is installed in the substrate holding mechanism 440. The sheet-like substrate material, which is vacuum-adsorbed onto the slits 447 provided in the main body 441, is heated to, for example, 50 to 200°C by the heater 450. This softens the sheet-like substrate material formed by the forming apparatus 300. In other words, the substrate holding part 470 in this embodiment, which holds and heats the substrate material, includes the substrate holding mechanism 440 and the heater 450.

[0081] Furthermore, in this embodiment, the heater 450 is disposed inside the opening 444 of the frame member 443, but the configuration of the heater 450 is not limited to the above-described case. For example, it is also possible that the heater 450 is not disposed inside the opening 444 of the frame member 443, but is disposed inside the opening of the frame portion 423 of the retaining member 420. Alternatively, the heater 450 may be disposed on the side of the structural member on which the frame portion 423 is mounted (e.g., the structural member of the transport device 400).

[0082] Furthermore, in this embodiment, the substrate held by the substrate holding mechanism 440 is in Figure 7 The substrate is transferred to the movable mold 320 in the state shown. That is, with the recess 321 of the movable mold 320 and the protrusion 442 of the main body 441 of the substrate holding mechanism 440 facing each other, the substrate being formed in the substrate holding mechanism 440 is transferred to the movable mold 320. This reduces the amount of substrate used in the substrate forming system 100 of this embodiment. More specifically, in conventional substrate holding mechanisms, the sheet-like substrate is held in a flat shape that extends straight downwards. Furthermore, the substrate held in this state is transferred to the mold ( Figure 7(W is used to indicate the shape in the accompanying drawings). Therefore, considering the stretching and deformation of the substrate during transfer to the mold or during forming by the forming apparatus, it is necessary to transfer a sheet-like substrate, generated in a manner larger than the shape of the recess or protrusion provided in the mold, to the mold. In contrast, in this embodiment, the substrate holding mechanism 440 holds the generated substrate along the three-dimensional shape of the main body portion 441 having the protrusion 442, and transfers the generated substrate in this state to the movable mold 320. Therefore, as... Figure 7 As shown, a substrate material that is generated in a manner that is approximately the same size as the shape of the recess 321 provided in the movable mold 320 can be used. Thus, in the substrate forming system 100 of this embodiment, a substrate material with a smaller size than that of existing structures where the substrate material is held in a flat shape can be used, thereby reducing the amount of substrate material used in the substrate forming system 100. Furthermore, since the main body 441 holds the substrate material along the shape of the recess 321 of the movable mold 320 and transfers the substrate material in this state to the movable mold 320, vacuum forming of the substrate material can be easily performed using the movable mold 320 along the shape of the recess 321.

[0083] Alternatively, instead of providing multiple slits 447 in the main body 441, multiple through holes of circular, elliptical, or polygonal shapes can be provided in the main body 441. Furthermore, gas can be drawn through these through holes, causing the sheet-like substrate to adhere to the main body 441 in a manner that follows the three-dimensional shape of the main body 441. Alternatively, instead of providing multiple slits 447 in the main body 441, the main body 441 can be formed using a porous material such as a sponge with multiple adsorption pores, and gas can be drawn through these adsorption pores, thereby causing the sheet-like substrate to adhere to the main body 441 in a manner that follows the three-dimensional shape of the main body 441.

[0084] Next, use Figure 3 and Figure 8 Details of the structure of the molded part holding section 460 of the holding component 420 are explained. Figure 8 It means to Figure 3 The molded part 460 of the holding member 420 shown is held from... Figure 3 The structural diagram shown when viewed from the right to the left. For example... Figure 3 and Figure 8 As shown, a plurality of adsorption pads 462 are provided in the molded article holding portion 460, and each adsorption pad 462 is provided with an adsorption hole 464. Multiple portions of the molded article are vacuum-adsorbed using the adsorption holes 464 of these plurality of adsorption pads 462. More specifically, each adsorption pad 462 is made of a flexible material such as rubber, and when the molded article is adsorbed onto each adsorption pad 462, the adsorption pad 462 prevents damage to the molded article. Furthermore, as... Figure 3 As shown, a gas flow path 466 is connected to each adsorption hole 464, and a suction pump 430 is connected to the flow path 466. Moreover, by using the suction pump 430 to draw gas from each flow path 466, multiple parts of the molded article are vacuum adsorbed by each adsorption hole 464.

[0085] Furthermore, the positions of each adsorption pad 462 can be changed in the molded article holding section 460 of the holding member 420. Additionally, the adsorption direction of each adsorption pad 462 on the molded article can also be changed. Here, the adsorption direction refers to the direction in which air is drawn from the adsorption holes 464 of each adsorption pad 462, for example... Figure 8 The suction direction of the molded article in the molded article holding part 460 shown is... Figure 3 To the left. Furthermore, by changing the adsorption direction of each adsorption pad 462, it is possible to use each adsorption pad 462 to hold, for example, a molded article... Figure 3 The adsorption can be applied in the upward or downward direction. In this way, the position and adsorption direction of each adsorption pad 462 can be changed, so the molded article holding part 460 can stably hold molded articles of various shapes.

[0086] Furthermore, the suction pump 430 draws gas from either or both of the flow path 448 associated with the substrate holding mechanism 440 and the flow path 466 associated with the molded article holding portion 460. Specifically, the connection target of the suction pump 430 is switched to either or both of the flow path 448 and the flow path 466 using a switching valve (not shown).

[0087] Thus, in this embodiment, the structure of the holding member 420 for holding the generated substrate using the substrate holding mechanism 440 (substrate holding part 470) is different from the structure for holding the molded article using the molded article holding part 460.

[0088] Next, use Figures 10-13 This describes a substrate forming method for a substrate forming system 100 having this structure.

[0089] When forming a substrate and producing a molded article using the substrate forming system 100 of this embodiment, if the operator turns on the power supply of the transport device 400, heating of the heater 450 of the transport device 400 begins. When it is determined that the heater 450 has reached a predetermined temperature, a cycle of forming the substrate and producing the molded article as shown below begins.

[0090] In the cycle of producing a molded article by sequentially forming substrates, a sheet-shaped substrate is first produced using a substrate forming apparatus 200. Specifically, in the substrate forming apparatus 200, a strip-shaped substrate fed from a blank 220 is transported by a transport unit 240 such as rollers, so that the leading edge of the strip-shaped substrate reaches a predetermined position. Furthermore, a moving mechanism 410 moves the substrate holding mechanism 440 so that it is aligned with the leading edge of the substrate at the predetermined position in the substrate forming apparatus 200. As described above, before holding the formed substrate with the substrate holding mechanism 440, an image of the formed substrate is captured by an imaging unit 401. Additionally, a control unit 490 of the transport apparatus 400 controls the moving mechanism 410 based on positioning marks in the image of the formed substrate captured by the imaging unit 401, thereby positioning the substrate holding mechanism 440 relative to the formed substrate.

[0091] When it is determined that the substrate holding mechanism 440 of the holding member 420 of the conveying device 400 is opposite to the front end portion of the substrate that has reached a predetermined position in the substrate forming apparatus 200, gas is drawn from the flow path 448 in the conveying device 400 using a suction pump 430. As a result, the front end portion of the strip-shaped substrate fed from the blank 220 in the substrate forming apparatus 200 is vacuum-adsorbed along the three-dimensional shape of the main body 441 of the substrate holding mechanism 440. When it is determined that the front end portion of the strip-shaped substrate has been vacuum-adsorbed along the three-dimensional shape of the main body 441 of the substrate holding mechanism 440, the front end portion of the strip-shaped substrate is cut in the substrate forming apparatus 200 using a cutting part 260 to generate a sheet-shaped substrate. Furthermore, the sheet-shaped substrate thus generated is vacuum-adsorbed along the three-dimensional shape of the main body 441 of the substrate holding mechanism 440.

[0092] When it is determined that a sheet-like substrate has been formed by cutting the leading end portion of the strip-shaped substrate using the cutting section 260 in the substrate forming apparatus 200, the formed substrate is transported from the substrate forming apparatus 200 to the forming apparatus 300 by the conveying device 400. At this time, the formed substrate, which is vacuum-adsorbed onto the main body 441 of the substrate holding mechanism 440, is heated by the heater 450 to soften the formed substrate. Then, when the formed substrate transported by the conveying device 400 reaches the vicinity of the forming apparatus 300, as... Figure 10 As shown, the substrate is held in place by the substrate holding mechanism 440 of the holding member 420 and waits near the forming apparatus 300. Furthermore, as described later, while the substrate is being transported from the substrate forming apparatus 200 to the forming apparatus 300 by the transport device 400 and heated, the forming apparatus 300 performs the action of forming the previously formed substrate to create a molded article. When a molded article is produced in the forming apparatus 300, as... Figure 11As shown, the movable mold holding part 360 moves away from the fixed mold holding part 380 in the direction (i.e., Figure 11 The movable mold 320 moves to the left and is separated from the fixed mold 340 by a distance (the state in which the movable mold 320 leaves the fixed mold 340 is called "mold opening").

[0093] like Figure 11 As shown, when it is determined that the movable mold 320 has left the fixed mold 340, as... Figure 12 As shown, the holding member 420, which holds the substrate being produced, is brought closer to the movable mold 320 by the moving mechanism 410. As described above, before transferring the substrate being produced, held by the substrate holding mechanism 440, to the forming apparatus 300, the movable mold 320 (specifically, the positioning mark 322) is also photographed by the imaging unit 401. Furthermore, the control unit 490 of the transport device 400 controls the moving mechanism 410 based on the positioning mark 322 in the image of the movable mold 320 captured by the imaging unit 401, thereby positioning the substrate holding mechanism 440 (i.e., the substrate being produced) relative to the movable mold 320.

[0094] In the forming apparatus 300, a suction pump 310 draws gas from the flow path 330, and the suction pump 430 of the transport device 400 stops drawing gas from the flow path 448. As a result, a substrate is transferred from the holding member 420 of the transport device 400 to the movable mold 320 of the forming apparatus 300, and the transferred substrate is vacuum-adhered to the movable mold 320. When it is determined that the substrate is vacuum-adhered to the movable mold 320, the force of the suction pump 310 drawing gas from the flow path 330 increases. As a result, the substrate enters the recess 321 of the movable mold 320, and is vacuum-formed along the shape of the recess 321. Then, the holding member 420 is moved by the moving mechanism 410 so that the molded part 460 of the holding member 420 approaches the fixed mold 340. Then, when the molded article held by the protrusion 341 of the fixed mold 340 approaches the molded article holding portion 460 of the holding member 420, gas is drawn from the flow path 466 in the transport device 400 using a suction pump 430. As a result, the molded article is vacuum-adsorbed onto each adsorption pad 462 of the molded article holding portion 460. Then, as... Figure 13As shown, the holding member 420 is moved by the moving mechanism 410 in a manner that keeps the holding member 420 away from the fixed mold 340. The holding member 420 is moved by the moving mechanism 410 toward a molded article storage box or the like (not shown). Then, when it is determined that the holding member 420 has moved to the molded article storage box or the like, the suction pump 430 of the conveying device 400 stops the gas suction from the flow path 466. As a result, the molded article held by the holding member 420 is stored in the storage box or the like. Furthermore, this action of storing the molded article held by the holding member 420 in the storage box or the like is referred to as "molded article discharge".

[0095] Thus, in this embodiment, when the substrate to be formed by the forming apparatus 300 is held in the movable mold 320 of the forming apparatus 300 by the transport device 400, the molded article produced by the forming apparatus 300 is taken out of the forming apparatus 300 by the transport device 400. In addition, when the molded article produced by the forming apparatus 300 is taken out of the forming apparatus 300 by the transport device 400, the molded article is held in a part of the holding member 420 that is different from the part that holds the substrate when it is transported to the forming apparatus 300 by the transport device 400 (i.e., the substrate holding mechanism 440) (i.e., the molded article holding part 460).

[0096] Furthermore, the above description describes the process of transferring the substrate held by the holding member 420 of the transport device 400 to the movable mold 320 after the movable mold 320 leaves the fixed mold 340, and then removing the molded article from the fixed mold 340 using the holding member 420. However, this embodiment is not limited to this method. Alternatively, after the movable mold 320 leaves the fixed mold 340, the molded article held by the protrusion 341 of the fixed mold 340 may be held by the molded article holding part 460 of the holding member 420, and then the substrate held by the substrate holding mechanism 440 of the holding member 420 may be transferred to the movable mold 320. Finally, the holding member 420 may be removed from the molding device 300, thereby storing the molded article held by the molded article holding part 460 of the holding member 420 in a storage box or the like.

[0097] When it is determined that the substrate material transferred from the holding member 420 of the conveying device 400 to the movable mold 320 of the forming device 300 has been vacuum-formed, and the molded article is removed from the fixed mold 340 of the forming device 300 by the holding member 420, and the holding member 420 retracts from the space between the movable mold 320 and the fixed mold 340, the movable mold holding part 360 moves towards the fixed mold holding part 380 (i.e., Figures 10-13 Move to the right (in the middle), such as Figure 10As shown, the movable mold 320 and the fixed mold 340 are in contact with each other. Then, when it is determined that the movable mold 320 and the fixed mold 340 are in contact, resin is supplied from the resin supply section 390 to the chamber formed between the movable mold 320 and the fixed mold 340 via the resin supply path 350. As a result, resin injection molding is performed on the surface of the substrate material that has been vacuum-formed using the movable mold 320 (specifically, the surface opposite to the surface opposite to the recess 321). The molded article is thus produced, and the produced molded article is held by the protrusion 341 of the fixed mold 340. Furthermore, during the production of the molded article by resin injection molding of the substrate material in the molding apparatus 300, the next substrate material is transported from the transport device 400 to the molding apparatus 300, and at this time, the substrate material is heated by the heater 450 of the transport device 400.

[0098] Furthermore, according to the substrate forming system 100 of this embodiment, during the production of a molded article by forming a substrate using a forming apparatus 300 (specifically, injection molding of resin relative to the substrate), the substrate to be formed by the forming apparatus 300 is heated while being transported to the forming apparatus 300 by a transport device 400. Thus, during the production of a molded article by forming a substrate using the forming apparatus 300, the substrate to be formed is heated while being transported to the forming apparatus 300, thereby shortening the overall processing time when producing a molded article by sequentially forming multiple substrates. Regarding this technical aspect, using... Figure 14 Please provide an explanation. Furthermore... Figure 14 (a) is a flowchart illustrating the substrate forming method of the substrate forming system 100 according to this embodiment. Figure 14 (b) is a flowchart illustrating a substrate forming method of a prior art substrate forming system.

[0099] In the transport device 400 of the substrate forming system 100 of this embodiment, the substrate formed by the substrate forming apparatus 200 can be held and heated by the substrate holding portion 470 of the holding member 420 (i.e., the substrate holding mechanism 440 and the heater 450). Furthermore, the molded article formed from the substrate by the forming apparatus 300 can be held by the molded article holding portion 460 of the holding member 420. Therefore, during the injection molding of resin onto the substrate in the forming apparatus 300, the transport device 400 can be used to transport and heat the next substrate. Specifically, as... Figure 14As shown in (a), during the resin injection molding of the first substrate in the molding apparatus 300, the second substrate can be transported and heated using the transport device 400. Furthermore, the moving mechanism 410 of the transport device 400 is a multi-joint robot, and since the moving mechanism 410 is located outside the molding apparatus 300, even in narrow spaces where the movable mold 320 and the fixed mold 340 are separated, contact between the moving mechanism 410 and the components of the substrate molding system 100 can be prevented. In contrast, in existing substrate molding systems, the transport device that transports the substrate generated by the substrate generating apparatus to the molding apparatus does not include a heater. Therefore, after the substrate generated by the substrate generating apparatus is removed from the substrate generating apparatus, it must be transported to a heating device located separately from the molding apparatus and heated using that heating device. Then, the heated substrate is transported to the molding apparatus using the transport device. In addition, in existing substrate forming systems, the holding component of the conveying device does not have both a holding surface for holding the sheet-like substrate and a holding surface for holding the molded article. Therefore, there is a problem that it takes time to transfer the sheet-like substrate to the movable mold of the forming device and then receive and discharge the molded article from the fixed mold.

[0100] In addition, in existing substrate forming systems, such as Figure 14 As shown in (b), the following steps are performed sequentially: a step of feeding the substrate into the substrate forming apparatus; a step of holding and cutting the fed substrate using a transport device; a step of heating the sheet-like substrate to soften it; a step of injection molding the substrate with resin using a mold; and a step of discharging the molded article. Therefore, when producing molded articles by forming multiple substrates, there is a problem of increased overall processing time. Specifically, in the substrate forming method of the prior art substrate forming system, time b is spent to produce three molded articles. In contrast, in the substrate forming method of the substrate forming system 100 of this embodiment, during the resin injection molding of the substrate in the forming apparatus 300, the next substrate is transported and heated using the transport device 400. Thus, the time required to produce three molded articles becomes a, and the overall processing time is shortened by time c.

[0101] Alternatively, the main body 441 of the substrate holding mechanism 440 and the movable mold 320 of the forming device 300 can be replaced by using... Figure 15 and Figure 16The main body portions 441a, 441b and movable molds 320a, 320b are shown. That is, the main body portion 441a and movable mold 320a can be used to hold the substrate in a concave shape facing the movable mold 320a, and the main body portion 441b and movable mold 320b can be used, consisting of multiple parts arranged at a predetermined angle. Furthermore, each main body portion 441a, 441b is formed such that the shape of the substrate held by the main body portion 441a, 441b is substantially the same as the three-dimensional shape of the movable molds 320a, 320b. In addition, Figure 15 and Figure 16 In this text, the description of the fixed molds arranged opposite to each movable mold 320a, 320b is omitted. Furthermore, each main body portion 441a, 441b has the same structure as the main body portion 441 described above, except for the different shapes of the main body portions 441a, 441b. When using these main body portions 441a, 441b, the amount of substrate used in the substrate forming system 100 can be reduced compared to the case where the substrate is held in a flat shape (indicated by reference numeral W). In addition, since each main body portion 441a, 441b holds the generated substrate along the shape of each recess 321a, 321b of the movable molds 320a, 320b, the generated substrate can be easily vacuum-formed along the shape of each recess 321a, 321b.

[0102] Furthermore, the three-dimensional shapes of the aforementioned main body portions 441, 441a, and 441b are formed in a manner substantially similar to the three-dimensional shapes of the recesses 321, 321a, and 321b provided in the movable molds 320, 320a, and 320b from which the substrate is to be transferred and generated by the main body portions 441, 441a, and 441b are formed, but are not limited to this manner. For example, as Figure 17 and Figure 18 As shown, when the three-dimensional shape of the molded article to be formed by the substrate forming system 100 (i.e., the three-dimensional shape of the movable mold 320c and the fixed mold 340c) is complex, the shape of the main body of the substrate holding mechanism 440 can be formed to be approximately along the shape of the movable mold 320c to which the generated substrate held by the substrate holding mechanism 440 is transferred. More specifically, as a... Figure 17 The main body of the substrate holding mechanism 440, which transfers the substrate from the complex-shaped movable mold 320c shown, can also be a main body 441c formed approximately along the shape of the movable mold 320c, but not along the shape of a predetermined recess (e.g., recess 321c). When using this main body 441c, compared to the case where the substrate is held in a flat shape (indicated by reference numeral W), it is also possible to easily vacuum-form the substrate along the shape of the recess 321c (see figure). Figure 18Furthermore, it can reduce the amount of substrate used in the substrate forming system 100. In addition, the main body 441c has the same structure as the main body 441, except for its shape.

[0103] in addition, Figure 19 The substrate holding portion 470a shown (i.e., the substrate holding mechanism 440a and the heater 450) can also be used in the substrate forming system 100. More specifically, compared to the substrate holding mechanism 440 described above, the substrate holding mechanism 440a adds a holding auxiliary member 443a, which is provided inside the opening 444 of the frame-shaped member 443 to assist in holding the substrate. With this holding auxiliary member 443a, even when the shape of the main body 441 is complex, the substrate can be held more reliably in a manner that follows the three-dimensional shape of the main body 441.

[0104] The substrate holding mechanism 440 in the substrate forming system 100 having the above structure includes: main body portions 441, 441a to 441c having a three-dimensional shape including at least a concave portion or a convex portion (such as a convex portion 442 in the above embodiment); and adsorption portions 449 for holding the substrate by adsorbing the substrate (i.e., the generated substrate) onto each main body portion 441, 441a to 441c along the three-dimensional shape of the convex portion 442 provided on each main body portion 441, 441a to 441c. Therefore, by adsorbing and holding the substrate at least along the three-dimensional shape of the convex portion 442, the amount of substrate used in the substrate forming system 100 can be reduced compared to holding the substrate in a flat shape.

[0105] Furthermore, the transport device 400, having the above structure, for transporting the substrate generated by the substrate generating apparatus 200 and the molded article produced by molding the substrate, includes: a holding member 420 for holding the substrate and the molded article; and a moving mechanism 410 for moving the holding member 420. The holding member 420 has a substrate holding portion 470 (i.e., a substrate holding mechanism 440 and a heater 450) for holding and heating the substrate, and a molded article holding portion 460 for holding the molded article. Therefore, during the injection molding of resin onto the substrate in the molding apparatus 300, the transport device 400 can be used to transport and heat the next substrate. Specifically, as Figure 14 As shown in (a), during the injection molding of resin onto the first substrate in the molding apparatus 300, the second substrate can be transported and heated using the transport device 400.

[0106] In addition, the holding member 420 having the above structure and having a frame portion 423 for holding the substrate generated by the substrate generating apparatus 200 and the molded article made by forming the substrate includes: a substrate holding portion 470 that holds the substrate and heats the substrate using a heating member (specifically, a heater 450) provided on the side of the structural member on which the frame portion 423 is mounted; and a molded article holding portion 460 that holds the molded article made by forming the substrate. Therefore, the substrate held by the frame portion 423 can be heated using the heating member.

[0107] Furthermore, the substrate forming system 100 having the above structure for producing molded articles from a substrate includes: a substrate forming apparatus 200 for generating a substrate (i.e., generating a substrate); a forming apparatus 300 for forming the generated substrate generated by the substrate forming apparatus 200; and a transport apparatus 400 for transporting the generated substrate generated by the substrate forming apparatus 200 from the substrate forming apparatus 200 to the forming apparatus 300. Additionally, the transport apparatus 400 has a substrate holding mechanism 440 for holding a substrate and a moving mechanism 410 for moving the substrate holding mechanism 440. The substrate holding mechanism 440 includes: main body portions 441, 441a to 441c having a three-dimensional shape including at least a recess or a protrusion (in the above embodiment, a protrusion 442, etc.); and an adsorption portion 449 for holding the substrate by adsorbing the substrate onto each main body portion 441, 441a to 441c along the three-dimensional shape of the protrusion 442 provided on each main body portion 441, 441a to 441c. Therefore, by adsorbing and holding the substrate in a three-dimensional shape along the protrusion 442, the amount of substrate used when forming the substrate using the substrate forming system 100 can be reduced compared to holding the substrate in a flat shape.

[0108] In addition, in the substrate forming system 100 of this embodiment, as described above, the forming device 300 is provided with a mold (i.e., movable molds 320, 320a to 320c) having a three-dimensional shape including at least a concave portion, and each main body portion 441, 441a to 441c of the substrate holding mechanism 440 includes a protrusion (i.e., protrusion 442) that is at least a portion of the concave portion (i.e., concave portion 321, 321a to 321c) of the mold of the forming device 300.

[0109] Furthermore, the conveying device 400, holding member 420, substrate holding mechanism 440, substrate forming system 100, and substrate forming method of this embodiment are not limited to the above-described manner and various modifications can be applied.

[0110] For example, positioning marks can be provided on the fixed mold 340 of the molding apparatus 300. In this case, when the molded article is taken out from the fixed mold 340, the conveying device 400 (specifically, the molded article holding part 460) can position the molded article to be taken out from the fixed mold 340.

[0111] In addition, as a molding apparatus for producing molded articles by forming sheet-like substrates, an apparatus with [missing information] can also be used. Figure 20 The forming apparatus 600 includes a movable mold 620 and a fixed mold 640. More specifically... Figure 20 The forming apparatus 600 shown includes: a movable mold 620, a fixed mold 640, a movable mold holding portion (not shown) for holding the movable mold 620, and a fixed mold holding portion (not shown) for holding the fixed mold 640. When the movable mold 620 and the fixed mold 640 are in contact with each other, a concave cavity (cavity portion) is formed between the movable mold 620 and the fixed mold 640. More specifically, a recess 621 is formed in the movable mold 620, and a protrusion 641 is provided in the fixed mold 640 that enters the recess 621. When the movable mold 620 and the fixed mold 640 are in contact with each other, and the protrusion 641 enters the recess 621, a concave cavity is formed between the protrusion 641 and the recess 621.

[0112] in addition, Figure 20 In the forming apparatus 600 shown, the surface 622 of the movable mold 620 and the surface 642 of the fixed mold 640 are respectively relative to the vertical plane (i.e., Figure 20 The surface is tilted (along the vertical direction). In this case, according to the conveying device 400 of this embodiment, the moving mechanism 410 of the movable holding member 420 is a multi-joint robot, therefore, the substrate holding mechanism 440 and the molded article holding portion 460 of the holding member 420 can be tilted relative to the vertical plane. Thus, the sheet-like substrate held by the substrate holding mechanism 440 of the holding member 420 can be appropriately transferred to the movable mold 620, or the molded article held by the protrusion 641 of the fixed mold 640 can be appropriately removed and discharged using the molded article holding portion 460 of the holding member 420.

[0113] Furthermore, in the substrate forming system 100 described above, the substrate is formed using movable molds 320 and 620 and fixed molds 340 and 640 (i.e., molds made of metal materials), but this method is not limited to this. For example, molds made of materials other than metal (e.g., ceramics) may also be used as molds for forming in the forming apparatus.

[0114] Additionally, it can also be used as a substrate holding part. Figure 21The substrate holding portion 470b (i.e., substrate holding mechanism 440b and heater 450) is shown, which holds the substrate in an upright position with the substrate facing downward and flat. In other words, a substrate holding mechanism that includes a main body without a three-dimensional shape including recesses or protrusions can also be used. With this substrate holding portion 470b, the substrate can be held and heated. Therefore, during the injection molding of resin onto the substrate in the molding apparatus 300, the next substrate can be transported and heated using the transport device 400. Thus, during the injection molding of resin onto the first substrate in the molding apparatus 300, the second substrate can be transported and heated using the transport device 400.

[0115] Furthermore, the forming apparatus of the substrate forming system of the present invention is not limited to vacuum forming of sheet-shaped substrates and resin injection molding. As the forming apparatus of the substrate forming system of the present invention, an apparatus that only performs vacuum forming of sheet-shaped substrates, an apparatus that only performs resin injection molding, or an apparatus that performs other types of forming may also be used.

Claims

1. A substrate holding mechanism in a substrate forming system for forming a substrate, for holding the generated substrate during transport of the generated substrate to the forming apparatus before it is formed by the forming apparatus, the substrate holding mechanism being characterized in that it comprises: The main body has a three-dimensional shape that includes at least a concave portion or a convex portion; and An adsorption section holds the substrate in place by adsorbing it onto the main body along the three-dimensional shape of the recess or protrusion provided on the main body.

2. The substrate holding mechanism according to claim 1, characterized in that: The main body has a structure consisting of a base component and an elastic component made of elastic material stacked on top of each other. When the adsorption portion adsorbs the substrate along the three-dimensional shape of the main body, the elastic member comes into contact with the substrate.

3. The substrate holding mechanism according to claim 2, characterized in that: The elastic material is formed from a heat-resistant material.

4. The substrate holding mechanism according to claim 2, characterized in that: The elastic material is silicone resin.

5. The substrate holding mechanism according to claim 1, characterized in that: The main body includes a frame-shaped component with an opening.

6. The substrate holding mechanism according to claim 5, characterized in that: It also includes a retaining auxiliary component disposed inside the opening of the frame-shaped component to assist the frame-shaped component in retaining the generated substrate.

7. The substrate holding mechanism according to claim 1, characterized in that: The adsorption section retains the generated substrate by vacuum adsorption.

8. The substrate holding mechanism according to claim 1, characterized in that: The main body comprises a porous material with multiple adsorption pores. The adsorption section draws gas through each of the adsorption holes, causing the substrate to adhere to the main body along the three-dimensional shape of the recess or protrusion provided on the main body.

9. The substrate holding mechanism according to claim 1, characterized in that: Multiple through holes are provided in the main body. The adsorption section draws gas through each of the through holes, causing the substrate to adhere to the main body along the three-dimensional shape of the recess or protrusion provided on the main body.

10. The substrate holding mechanism according to claim 9, characterized in that: Each of the aforementioned through holes is a slit.

11. The substrate holding mechanism according to claim 9, characterized in that: Each of the through holes is circular, elliptical, or polygonal in shape.

12. A substrate forming system for producing molded articles by forming a substrate, the substrate forming system being characterized by comprising: Substrate forming apparatus for producing substrates; A forming apparatus that forms a substrate generated by the substrate forming apparatus; and A conveying device that transports the substrate from the substrate generating device to the forming device. The conveying device includes: a substrate holding mechanism for holding the generated substrate; and a moving mechanism for moving the substrate holding mechanism. The substrate holding mechanism has: a main body having a three-dimensional shape including at least a concave portion or a convex portion; and an adsorption portion that holds the generated substrate by adsorbing it onto the main body along the three-dimensional shape of the concave portion or the convex portion provided on the main body.

13. The substrate forming system according to claim 12, characterized in that: The forming device has a concave mold, which has a three-dimensional shape including at least a concave portion. The main body of the substrate holding mechanism includes a protrusion in at least a portion of the recess of the mold of the forming device.

14. The substrate forming system according to claim 12, characterized in that: The forming apparatus performs vacuum forming of the substrate and injection forming of the resin.

15. The substrate forming system according to claim 12, characterized in that: The forming apparatus performs vacuum forming on one side of the generated substrate and resin injection forming on the other side.

16. The substrate forming system according to claim 12, characterized in that: The moving mechanism of the transport device includes a multi-joint robot.

17. The substrate forming system according to claim 12, characterized in that: The forming device includes a movable mold and a fixed mold. The substrate is vacuum-formed by the movable mold. Resin is supplied to a concave cavity formed between the movable mold and the fixed mold, thereby performing resin injection molding on the surface of the substrate that has been vacuum-formed by the movable mold.

18. The substrate forming system according to claim 12, characterized in that: The main body has a structure consisting of a base component and an elastic component made of elastic material stacked on top of each other. The elastic component is formed of a heat-resistant material.

19. The substrate forming system according to claim 12, characterized in that: The conveying device includes a heater for heating the generated substrate held by the substrate holding mechanism.

20. A substrate holding method for holding a substrate in a substrate forming system, the substrate holding method being characterized by comprising: The process of generating a substrate using a substrate generating apparatus; and The process of retaining the generated substrate by adsorbing it along the three-dimensional shape of the main body having at least a concave or convex portion, thereby holding the generated substrate generated by the substrate generating apparatus.

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