Head chip, liquid ejecting head, and liquid ejecting recording apparatus

Abstract

The purpose of the present invention is to suppress non-conduction caused by disconnection of an electrode formed in a non-ejection channel, and to improve driving reliability. A head chip (50) is provided with: an actuator plate (53) in which discharge channels (61) filled with ink and non-discharge channels (62) not filled with ink extend in the Y-axis direction, and are alternately formed in the X-axis direction with drive walls (65) therebetween; a common electrode (85) formed on the inner surface of the discharge channel (61); and individual electrodes (88) formed on the inner surface of the non-discharge channel (62), and on a first main surface (53A) facing the-Z side of the actuator plate (53), provided are: an individual electrode power supply unit (89) that is disposed on the-Y side of the first opening (61A) and that supplies drive power to the pair of individual electrodes (88) that sandwich the discharge channel (61) in the X-axis direction, and a second electrode power supply unit (89) that is disposed on the-Y side of the second opening (61A) and that supplies drive power to the pair of individual electrodes (88) that sandwich the discharge channel (61) in the X-axis direction; and a bypass wiring (95) that is disposed on the + Y side of the first opening (61A) and connects the pair of individual electrodes (88).

Description

Technical Field

[0001] This disclosure relates to a head chip, a liquid jet head, and a liquid jet recording device. Background Technology

[0002] Patent Document 1 discloses a liquid injection head comprising an actuator plate for applying pressure to a liquid and a wiring substrate for injecting liquid. The actuator plate comprises a first surface, a second surface facing the opposite side to the first surface, and a discharge channel and a non-discharge channel, wherein at least one of the discharge channel and the non-discharge channel has an opening and are alternately arranged separately from each other.

[0003] A common electrode is provided on the sidewall of the ejection channel. Individual electrodes, electrically separate from the common electrode, are provided on the sidewall of the non-ejection channel. Furthermore, a common electrode pad is provided on the first surface to electrically connect the common electrode to the wiring substrate, and bypass wiring is provided on the second surface to electrically connect the individual electrodes of adjacent non-ejection channels.

[0004] Prior technology literature [Patent Documents] [Patent Document 1] Japanese Patent Application Publication No. 2020-75444. Summary of the Invention

[0005] [The problem the invention aims to solve] In the aforementioned prior art, if a break occurs in any of the individual electrodes in an adjacent non-ejection channel, while continuity can be ensured for a break in an individual electrode that occurs closer to the front side (tail side) than the bypass wiring, continuity cannot be ensured for a break in an individual electrode that occurs further inward than the bypass wiring (on the side opposite to the tail).

[0006] The purpose of this disclosure is to suppress nonconductivity caused by wire breaks in electrodes formed in non-jet channels, thereby improving the reliability of the drive.

[0007] [Solutions for solving the problem] To address the aforementioned issues, the present disclosure adopts the following solution.

[0008] (1): A head chip according to one aspect of the present invention includes: an actuator plate, wherein a jet channel filled with liquid and a non-jet channel not filled with the aforementioned liquid extend along a first direction and are alternately formed in a second direction intersecting the aforementioned first direction, sandwiching a drive wall; a first electrode formed on the inner surface of the aforementioned jet channel; and a second electrode formed on the inner surface of the aforementioned non-jet channel. On a first main surface of the aforementioned actuator plate facing one side of a third direction intersecting the aforementioned first direction and the aforementioned second direction, a second electrode power supply section is provided, which is disposed on one side of a first opening portion of the aforementioned jet channel sandwiched in the aforementioned first direction, and supplies drive power to a pair of the aforementioned second electrodes sandwiched in the aforementioned second direction; and a bypass wiring, which is disposed on the other side of the aforementioned first direction sandwiched in the aforementioned first direction, and connects the pair of the aforementioned second electrodes.

[0009] According to this solution, even if either of the pair of second electrodes breaks, the power supply unit of the second electrode can still connect to one of the second electrodes via the other unbroken second electrode through bypass wiring, thereby improving the reliability of the drive. Furthermore, since the bypass wiring is formed on the first main surface of the actuator board, it can be formed simultaneously with other conductor patterns, thus suppressing cost increases or lead times caused by increased manufacturing processes.

[0010] (2): Alternatively, in the head chip involved in the above scheme (1), a first electrode power supply part is provided on the first main surface, which is formed in a ring along the opening edge of the first opening and connected to the first electrode. When the shortest distance between the first electrode power supply part and the bypass wiring is set as D1 and the shortest distance between the first electrode power supply part and the second electrode is set as D2, the relationship is D1>D2.

[0011] According to this solution, by making the shortest distance between the first electrode power supply unit and the bypass wiring larger than the shortest distance between the first electrode power supply unit and the second electrode, it is possible to suppress short circuits caused by the liquid being laid between the first electrode power supply unit and the bypass wiring, thereby improving the reliability of the drive.

[0012] (3): Alternatively, in the head chip involved in the above scheme (1) or (2), a first electrode power supply part is provided on the first main surface, which is formed in a ring along the opening edge of the first opening and connected to the first electrode. When the shortest distance between the first electrode power supply part and the bypass wiring is set as D1 and the shortest distance between the first electrode and the second electrode is set as D3, the relationship is D1≥D3.

[0013] According to this solution, by making the shortest distance between the first electrode power supply unit and the bypass wiring greater than the shortest distance between the first electrode and the second electrode (i.e., the thickness of the drive wall), the distance between the first electrode power supply unit and the bypass wiring can be sufficiently ensured, and short circuits caused by liquid being placed between the first electrode power supply unit and the bypass wiring can be more reliably suppressed.

[0014] (4): Alternatively, in the head chip involved in any of the above schemes (1) to (3), the first main surface is provided with: a first electrode power supply part, which is formed in a ring along the opening edge of the first opening and connected to the first electrode; and a splitting groove, which extends along the second direction to split the first electrode power supply part and the second electrode power supply part. When the minimum width of the bypass wiring is set to W1 and the minimum width of the part of the second electrode provided with the splitting groove is set to W2, the relationship is W1≥W2.

[0015] According to this solution, the minimum width of the bypass wiring is greater than or equal to the minimum width of the portion of the second electrode where the break groove is located, thus suppressing the wiring resistance in the bypass wiring from being higher than that portion. Therefore, it is possible to prevent the bypass wiring from breaking due to electrical load during drive (ejection).

[0016] (5): Alternatively, in the head chip involved in any of the above schemes (1) to (4), the aforementioned jet channel has an upper cut portion whose size in the aforementioned first direction gradually decreases as viewed from the aforementioned second direction toward the aforementioned third direction, and the aforementioned bypass wiring is formed intersecting with the aforementioned upper cut portion when viewed from the aforementioned third direction.

[0017] According to this solution, by setting the bypass wiring and the forming range of the upper cutting part to intersect, it is possible to suppress the increase in the size of the actuator board in the first direction due to the addition of bypass wiring.

[0018] (6): Alternatively, in the head chip involved in any of the above schemes (1) to (5), the first main surface is provided with: a first electrode power supply section, which is formed in a ring along the opening edge of the first opening and connected to the first electrode; and a bypass groove, which extends along the second direction on one side of the first opening in the first direction, and the bypass wiring is formed in the bypass groove.

[0019] According to this solution, by setting a bypass groove, the bypass wiring is not formed on the same plane as the first electrode power supply section, which can reliably suppress short circuits caused by liquid being placed between the first electrode power supply section and the bypass wiring.

[0020] (7): Alternatively, in the head chip involved in any of the above schemes (1) to (6), the first main surface is provided with: a first electrode power supply part, which is formed in a ring along the opening edge of the first opening and connected to the first electrode; and a splitting groove, which extends along the second direction to split the first electrode power supply part and the second electrode power supply part. On the second main surface of the actuator plate facing the third direction, a second bypass wiring is provided, which is arranged in the first direction between the second opening in the jet channel that opens on the second main surface and the splitting groove, and extends along the second direction to connect a pair of the second electrodes.

[0021] According to this solution, the risk of wire breakage in the narrower breakage groove section of the second electrode can be avoided by using the second bypass wiring.

[0022] (8): The liquid jetting head involved in this disclosure has the head chip involved in any one of the above-mentioned schemes (1) to (7).

[0023] This solution can improve the reliability of the drive.

[0024] (9): The liquid jet recording device disclosed herein has the liquid jet head involved in the above scheme (8).

[0025] This solution can improve the reliability of the drive.

[0026] [Invention Effects] According to one aspect of this disclosure, nonconductivity caused by wire breaks in electrodes formed in non-jet channels can be suppressed, thereby improving the reliability of the drive. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the printer according to the first embodiment.

[0028] Figure 2 This is a schematic diagram of the inkjet head and ink circulation mechanism according to the first embodiment.

[0029] Figure 3 This is an exploded perspective view of the head chip according to the first embodiment.

[0030] Figure 4 Is with Figure 3 The cross-sectional view corresponding to line IV-IV.

[0031] Figure 5 This is a diagram showing the main components of the actuator plate according to the first embodiment.

[0032] Figure 6This is a flowchart illustrating a method for manufacturing a head chip according to the first embodiment.

[0033] Figure 7 This is a diagram showing the main components of the actuator plate according to the second embodiment.

[0034] Figure 8 This is a diagram showing the main components of the actuator plate according to the third embodiment.

[0035] Figure 9 This is a diagram showing the main components of the actuator plate according to the fourth embodiment. Detailed Implementation

[0036] The embodiments disclosed herein will now be described with reference to the accompanying drawings. In the embodiments or variations described below, corresponding components are sometimes labeled with the same symbols and descriptions are omitted. In the following description, expressions such as "parallel," "orthogonal," "center," and "coaxial," indicating relative or absolute configurations, not only strictly represent such configurations but also indicate a state of relative displacement by an angle or distance with tolerance or to the extent that the same function can be obtained. In the following embodiments, an inkjet printer (hereinafter simply referred to as a printer) that uses ink (liquid) to record on a recording medium is used as an example for description. In the accompanying drawings used in the following description, the scale of each component is appropriately changed to make each component a recognizable size.

[0037] (First Embodiment) Figure 1 This is a schematic diagram of the printer 1 according to the first embodiment.

[0038] like Figure 1 As shown, printer 1 (liquid jet recording device) includes a transport mechanism 2, 3, an ink tank 4, an inkjet head 5 (liquid jet head), an ink circulation mechanism 6, and a scanning mechanism 7.

[0039] In the following description, an orthogonal coordinate system of X, Y, and Z will be used accordingly. In this case, the X-axis direction is aligned with the transport direction (sub-scanning direction) of the recorded medium P (e.g., paper). The Y-axis direction is aligned with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z-axis direction represents the height direction (gravity direction) orthogonal to the X and Y axes. In the following description, the arrow side in the X, Y, and Z axes will be designated as the positive (+) side, and the side opposite to the arrow will be designated as the negative (-) side. Figure 1 In the equation, the +Z side corresponds to the upper side in the direction of gravity, and the -Z side corresponds to the lower side in the direction of gravity.

[0040] The conveying mechanisms 2 and 3 convey the recording medium P towards the +X side. The conveying mechanisms 2 and 3, for example, each include a pair of rollers 11 and 12 extending along the Y-axis direction.

[0041] The ink reservoir 4 contains, for example, four colors of ink: yellow, magenta, cyan, and black. The inkjet head 5 is configured to eject the four colors of ink—yellow, magenta, cyan, and black—correspondingly to the connected ink reservoir 4. Furthermore, the ink contained in the ink reservoir 4 can be, for example, water-based ink (conductive ink) that uses water as a solvent.

[0042] Figure 2 This is a schematic diagram of the inkjet head 5 and ink circulation mechanism 6 according to the first embodiment.

[0043] like Figure 2 As shown, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes: a circulation path 23 having an ink supply pipe 21 and an ink discharge pipe 22; a pressure pump 24 connected to the ink supply pipe 21; and a suction pump 25 connected to the ink discharge pipe 22.

[0044] The pressure pump 24 pressurizes the ink supply tube 21, and delivers the ink through the ink supply tube 21 to the inkjet head 5. As a result, the ink supply tube 21 is under positive pressure relative to the inkjet head 5.

[0045] The suction pump 25 depressurizes the ink discharge tube 22, drawing ink from the inkjet head 5 through it. This creates a negative pressure on the ink discharge tube 22 side relative to the inkjet head 5. Driven by the pressure pump 24 and the suction pump 25, the ink circulates between the inkjet head 5 and the ink tank 4 via the circulation path 23.

[0046] like Figure 1 As shown, the scanning mechanism 7 causes the inkjet head 5 to reciprocate scanning along the Y-axis. The scanning mechanism 7 includes a guide rail 28 extending along the Y-axis and a carriage 29 that is movably supported by the guide rail 28.

[0047] The inkjet head 5 is mounted on the carriage 29. In the illustrated example, multiple inkjet heads 5 are mounted side-by-side on a carriage 29 along the Y-axis. The inkjet head 5 includes: a head chip 50 (see reference). Figure 3 The ink supply unit (not shown) connects the ink circulation mechanism 6 and the head chip 50; and the control unit (not shown) applies a driving voltage to the head chip 50.

[0048] Figure 3 This is an exploded perspective view of the head chip 50 according to the first embodiment.

[0049] Figure 3The illustrated head chip 50 is a so-called circulating side-ejection type head chip 50 that ejects ink from the central portion of the ejection channel 61 in the extension direction (Y-axis direction). The head chip 50 includes a nozzle plate 51, an intermediate plate 52 (joint member), an actuator plate 53, and a cover plate 54. The head chip 50 is configured such that the nozzle plate 51, the intermediate plate 52, the actuator plate 53, and the cover plate 54 are stacked in this order along the Z-axis direction (third direction).

[0050] The actuator plate 53 is formed, for example, from a piezoelectric material containing oxides, such as PZT (lead zirconate titanate). The actuator plate 53 is, for example, a so-called monopolar substrate with the polarization direction set in one direction in the Z-axis direction. However, the actuator plate 53 may also be a so-called herringbone substrate with different polarization directions on the + and - sides in the Z-axis direction.

[0051] A channel array 60 is formed on the actuator plate 53. The channel array 60 has an ink-filled ejection channel 61 (ejection channel) and an ink-free non-ejection channel 62 (non-ejection channel). The ejection channel 61 and the non-ejection channel 62 are arranged alternately in the actuator plate 53 at intervals along the X-axis direction (second direction). In the first embodiment, a configuration in which the channel extension direction (first direction) is aligned with the Y-axis direction will be described, but the channel extension direction may also intersect the Y-axis direction.

[0052] Figure 4 Is with Figure 3 The cross-sectional view corresponding to line IV-IV.

[0053] like Figure 4 As shown, the discharge channel 61 is formed in an arc shape that protrudes downwards (to one side of the third direction) when viewed from the X-axis direction. That is, the dimension of the discharge channel 61 in the Y-axis direction gradually decreases from top to bottom. Specifically, the discharge channel 61 has a through portion 61a located at the center in the Y-axis direction and upper cut portions 61b connected to both sides of the through portion 61a in the Y-axis direction.

[0054] The through section 61a extends through the actuator plate 53 along the Z-axis. The central region of the through section 61a in the Y-axis direction constitutes a uniform section 63 whose dimensions in the X-axis direction are uniformly distributed throughout the Z-axis direction. The portions of the through section 61a located on either side of the uniform section 63 in the Y-axis direction constitute variable sections 64. The variable sections 64 gradually decrease in size in the X-axis direction (the distance between the inner surfaces of the discharge channel 61) from top to bottom. Alternatively, the through section 61a may be configured without the variable sections 64.

[0055] The upper cut portion 61b opens on the upper surface of the actuator plate 53, and its size gradually decreases in the Z-axis direction as it moves away from the through portion 61a along the Y-axis direction. That is, the upper opening of the discharge channel 61 is formed by the through portion 61a and the upper cut portion 61b. On the other hand, the lower opening of the discharge channel 61 is formed by the through portion 61a. Furthermore, the bottom surface of the upper cut portion 61b is formed in the shape of an arc with a uniform radius of curvature.

[0056] like Figure 3 As shown, the non-discharge channel 62 extends linearly along the Y-axis while penetrating the actuator plate 53 along the Z-axis. The portions of the actuator plate 53 located between adjacent discharge channels 61 and non-discharge channels 62 respectively constitute drive walls 65. Therefore, the two sides of channels 61 and 62 in the X-axis direction are surrounded by a pair of drive walls 65.

[0057] In this embodiment, the example described is a head chip 50 with a single channel column 60, but multiple channel columns 60 may also be provided along the Y-axis. In this case, it is preferable that if the number of channel columns 60 is set to n, the output channels 61 constituting adjacent channel columns 60 are staggered relative to the arrangement spacing of the output channels 61 in a channel column 60 at intervals of 1 / n.

[0058] The head chip 50 includes a processing film 110 and a protective film 120. The processing film 110 is used to ensure the adhesion between the actuator plate 53 and the adhesive, and is subjected to surface treatments such as silane coupling treatment. Furthermore, the processing film 110 is not limited to silane coupling treatment as long as it is made of a material with a higher adhesion to the actuator plate 53 than the adhesion between the actuator plate 53 and the adhesive.

[0059] The protective film 120 protects the electrodes formed on the actuator plate 53 from ink contamination. The protective film 120 is formed, for example, of an organic insulating material such as a para-xylylene resin (e.g., Parylene (registered trademark)). However, the protective film 120 may also be composed of tantalum oxide (Ta2O5), silicon nitride (SiN), silicon carbide (SiC), silicon oxide (SiO2), or diamond-like carbon, or may contain at least one of these materials.

[0060] like Figure 3 and Figure 4 As shown, the cover plate 54 is bonded to the upper surface of the actuator plate 53 via adhesive 70 in such a way that it covers the upper openings of each of the channels 61, 62. The adhesive 70 is, for example, an epoxy adhesive.

[0061] In the cover plate 54, at a position coinciding with the -Y side end of the channel column 60 when viewed from above, an inlet common ink chamber 71 is formed. The inlet common ink chamber 71 extends along the X-axis direction for example, spanning the length of the channel column 60, and has an opening on the upper surface of the cover plate 54.

[0062] In the common ink chamber 71, an entrance slit 72 is formed at a position that coincides with the ejection channel 61 when viewed from above. The entrance slit 72 connects the Y-side end of each ejection channel 61 to the inside of the common ink chamber 71.

[0063] In the cover plate 54, at a position coinciding with the +Y side end of the channel column 60 when viewed from above, an exit common ink chamber 75 is formed. The exit common ink chamber 75 extends along the X-axis direction, for example, across the length of the channel column 60, and has an opening on the upper surface of the cover plate 54.

[0064] In the common ink chamber 75, an exit slit 76 is formed at a position coinciding with the non-ejection channel 62 when viewed from above. The exit slit 76 connects the +Y side end of each ejection channel 61 to the common ink chamber 75. Therefore, the inlet slit 72 and the outlet slit 76 are connected to each ejection channel 61, but not to the non-ejection channel 62.

[0065] The intermediate plate 52 is bonded to the lower surface of the actuator plate 53 via adhesive 77. The intermediate plate 52 is formed of a material such as polyimide with a thickness of about tens of μm (e.g., 50 μm). Alternatively, the intermediate plate 52 may also be formed of a material other than polyimide (e.g., a piezoelectric material such as PZT or a non-conductive material such as alumina).

[0066] A connecting hole 52a is formed in the intermediate plate 52 at a position that coincides with the discharge channel 61 (through portion 61a) when viewed from above. The connecting hole 52a penetrates the intermediate plate 52 along the Z-axis. The connecting hole 52a communicates with the discharge channel 61 through the lower end opening of the discharge channel 61. Furthermore, the intermediate plate 52 is not a necessary component.

[0067] The nozzle plate 51 is bonded to the lower surface of the intermediate plate 52 via adhesive 78. The nozzle plate 51 is formed of a metal material (such as SUS or Ni-Pd) with a thickness of about 50 μm. However, in addition to metal materials, the nozzle plate 51 can also be a single-layer or laminated structure using resin materials (such as polyimide), glass, silicon, etc.

[0068] A plurality of nozzle holes 51a are formed in the nozzle plate 51, extending through the nozzle plate 51 along the Z-axis. The nozzle holes 51a are formed, for example, in a tapered shape whose inner diameter gradually decreases from top to bottom. The nozzle holes 51a are arranged at intervals along the X-axis. Each nozzle hole 51a is connected to a corresponding discharge channel 61 via a connecting hole 52a. Therefore, each non-discharge channel 62 is not connected to the nozzle hole 51a and is covered from below by the nozzle plate 51.

[0069] On actuator board 53, common wiring 81 and individual wiring (in) are formed. Figure 4 (Not shown in the diagram). The common wiring 81 includes a common electrode 85 (first electrode) and a common electrode power supply section 86 (first electrode power supply section). A pair of common electrodes 85 are formed on the inner surfaces facing each other in the X-axis direction on the inner surface of the discharge channel 61. Each common electrode 85 is formed in the lower half of the inner surface of the discharge channel 61 (through section 61a).

[0070] A common electrode power supply section 86 surrounds the lower end opening edge of the ejection channel 61 in the lower surface of the actuator plate 53, connecting a pair of common electrodes 85 to each other. The common electrode power supply section 86 includes a take-out section 86a and a connecting section 86b. The take-out section 86a is formed on both sides of the lower end opening edge of the ejection channel 61 in the X-axis direction. The connecting section 86b is formed in the portion of the lower surface of the actuator plate 53 located on the -Y side relative to the ejection channel 61 (hereinafter referred to as the tail section 90).

[0071] A connecting portion 86b is provided on the lower surface of the tail portion 90 corresponding to each dispensing channel 61. Each connecting portion 86b extends linearly along the Y-axis relative to the corresponding dispensing channel 61. The +Y side end of the connecting portion 86b is connected to each of the two dispensing portions 86a. In the illustrated example, the +Y side end of the connecting portion 86b reaches the -Y side end edge of the lower opening edge of the dispensing channel 61.

[0072] On the lower surface of the tail portion 90, an individual electrode power supply section 89 (second electrode power supply section) is formed. The individual electrode power supply section 89 is formed on the lower surface of the tail portion 90 at a position further towards the -Y side than the common electrode power supply section 86. The individual electrode power supply section 89 is located at the lower end opening edge of the non-ejection channel 62, which clamps the ejection channel 61 and faces each other in the X-axis direction, with an individual electrode 88 (see below) clamping the ejection channel 61 and facing each other in the X-axis direction. Figure 5 They are connected to each other.

[0073] At the tail portion 90, a dividing groove 91 (splitting groove) is formed in the portion located between the common electrode power supply section 86 and the individual electrode power supply section 89. The dividing groove 91 extends along the X-axis direction at the tail portion 90. The dividing groove 91 separates the common electrode power supply section 86 and the individual electrode power supply section 89. A flexible printed circuit board 92 is pressed onto the lower surface of the tail portion 90. The flexible printed circuit board 92 is connected to the common electrode power supply section 86 and the individual electrode power supply section 89 on the lower surface of the tail portion 90. The flexible printed circuit board 92 is led upward through the outside of the actuator plate 53.

[0074] Figure 5 This is a diagram showing the main structural components of the actuator plate 53 according to the first embodiment. Furthermore, Figure 5 (a) is a perspective view of a portion of the actuator plate 53 viewed from the -Z side. Figure 5 (b) is a top view of a portion of the actuator plate 53 viewed from the -Z side. Figure 5 (c) is a side view of a portion of the actuator plate 53 viewed from the -X side. (Further details will follow.) Figures 7 to 9 The same diagram is shown in the middle.

[0075] Furthermore, in the following description, the surface of the actuator plate 53 facing the -Z side (one side of the third direction) is referred to as the first main surface 53A, and the surface of the actuator plate 53 facing the +Z side (the other side of the third direction) is referred to as the second main surface 53B.

[0076] like Figure 5 As shown, each individual wiring includes an individual electrode 88 (the second electrode) and the aforementioned individual electrode power supply section 89. The individual electrode 88 is formed on the inner surface of each non-ejection channel 62, facing each other in the X-axis direction. In the illustrated example, the individual electrode 88 is formed on approximately half of the inner surface of the non-ejection channel 62. Furthermore, the individual electrode 88 only needs to be formed in an area overlapping with the common electrode 85 when viewed from the X-axis direction, as long as it ensures conduction with the individual electrode power supply section 89. The individual electrode power supply section 89 is formed on the Y-side of the tail 90, supplying driving power to the pair of individual electrodes 88 that sandwich the ejection channel 61 in the X-axis direction.

[0077] On the first main surface 53A of the actuator plate 53, a first opening 61A (lower end opening) of the discharge channel 61 is formed. Figure 5 The diagram shows a rectangular shape extending along the Y-axis when viewed from above, but its opening end is actually an arc or taper at the end; it is not limited to this shape. (Further details will follow.) Figures 7 to 9The same applies to the middle section. A common electrode power supply section 86 is formed at the opening edge of the first opening 61A in the first main surface 53A. The common electrode power supply section 86 is formed in a rectangular ring extending along the Y-axis direction when viewed from above. The common electrode power supply section 86 is connected to a pair of common electrodes 85 formed on the inner surface of the discharge channel 61.

[0078] On the first main surface 53A of the actuator plate 53, an individual electrode power supply section 89 and a bypass wiring 95 are formed in the Y-axis direction (first direction) sandwiching the first opening 61A and the common electrode power supply section 86. The individual electrode power supply section 89 is disposed on the -Y side (one side in the first direction) relative to the first opening 61A and the common electrode power supply section 86, and is connected to the -Y side end of a pair of individual electrodes 88 sandwiching the discharge channel 61 in the X-axis direction.

[0079] A bypass wiring 95 is disposed on the +Y side (the other side of the first direction) relative to the first opening 61A and the common electrode power supply section 86, connecting a pair of individual electrodes 88 sandwiching the discharge channel 61 in the X-axis direction. The bypass wiring 95 is a conductor of a certain width extending along the X-axis direction, connecting the +Y side ends of the pair of individual electrodes 88 to each other. The bypass wiring 95 connects the pair of individual electrodes 88 on the side opposite to the individual electrode power supply section 89 relative to the first opening 61A and the common electrode power supply section 86, thereby enabling the supply of driving power to one of the pair of individual electrodes 88 via the other even if a break occurs on either side. This bypass wiring 95 is formed using the same process as the common electrode 85, the common electrode power supply section 86, the individual electrodes 88, and the individual electrode power supply section 89, as described later.

[0080] The bypass wiring 95 is formed with a gap relative to the common electrode power supply section 86. When the shortest distance between the common electrode power supply section 86 and the bypass wiring 95 is set as D1, and the shortest distance between the common electrode power supply section 86 and the individual electrodes 88 is set as D2, the relationship is D1 > D2. That is, the bypass wiring 95 is formed further away from the common electrode power supply section 86 than the individual electrodes 88. Furthermore, D2, the shortest distance between the common electrode power supply section 86 and the individual electrodes 88, is designed to suppress short circuits caused by ink mounting.

[0081] Furthermore, when the shortest distance between the common electrode power supply section 86 and the bypass wiring 95 is set to D1, and the shortest distance between the common electrode 85 and the individual electrodes 88 is set to D3, the relationship D1 ≥ D3 exists. D3, the shortest distance between the common electrode 85 and the individual electrodes 88, is a dimension corresponding to the thickness of the drive wall 65 in the X-axis direction. That is, the bypass wiring 95 is formed to be sufficiently far away from the common electrode power supply section 86 than the thickness of the drive wall 65.

[0082] On the first main surface 53A, a dividing groove 91 is formed to separate the common electrode power supply section 86 and the individual electrode power supply section 89. The dividing groove 91 is formed at a certain depth relative to the first main surface 53A. Therefore, at the individual electrode 88, there is a portion whose width in the Z-axis direction is partially narrowed (see reference). Figure 5 (c) Here, when the minimum width of the bypass wiring 95 is set to W1 and the minimum width of the portion of the individual electrode 88 with the dividing groove 91 is set to W2, the relationship is W1≥W2. W2, the minimum width of the individual electrode 88, is designed to have a wiring resistance such that the individual electrode 88 will not break due to the electrical load during driving (ejection). That is, the wiring resistance of the bypass wiring 95 is lower than that of the individual electrode 88, which is the width on the safe side.

[0083] Next, the manufacturing method of the head chip 50 including the aforementioned actuator board 53 will be described. Figure 6 This is a flowchart illustrating a method for manufacturing the header chip 50 according to the first embodiment. In the following description, for convenience, the case of manufacturing the header chip 50 at the chip level will be used as an example.

[0084] The manufacturing method of the head chip 50 includes an actuator board processing step S1, a cover plate bonding step S2, a grinding step S3, a wiring forming step S4, a conductive material removal step S5, a treatment film forming step S6, an intermediate plate bonding step S7, a protective film forming step S8, and a nozzle plate bonding step S9.

[0085] In actuator plate processing step S1, the disc-shaped cutting machine enters the actuator plate 53 from above, relative to the areas where the ejection channel 61 and the non-ejection channel 62 are formed. In actuator plate processing step S1, the travel distance of the cutting machine in the Y-axis direction is increased relative to the area where the non-ejection channel 62 is formed compared to the area where the ejection channel 61 is formed. Therefore, when viewed from the X-axis direction, the bottom surface of the ejection channel 61 is formed in a downward-convex arc shape, while the bottom surface of the non-ejection channel 62 is formed in a straight line shape.

[0086] In the cover plate joining process S2, the cover plate 54 is adhered to the upper surface of the actuator plate 53 via adhesive 70. Thus, the cover plate 54 is stacked on the actuator plate 53.

[0087] In the grinding process S3, the lower surface of the actuator plate 53 is ground. Specifically, the actuator plate 53 is ground until the discharge channel 61 and the non-discharge channel 62 open on the lower surface of the actuator plate 53. As a result, a first main surface 53A is formed on the actuator plate 53.

[0088] In the wiring formation process S4, drive wiring is formed by depositing electrode material onto the first main surface 53A of the actuator plate 53. In the wiring formation process S4, the first main surface 53A of the actuator plate 53 is subjected to inclined vapor deposition from the +X and -X sides. Thus, an electrode film comprising a common electrode 85, a common electrode power supply section 86, individual electrodes 88, individual electrode power supply sections 89, and bypass wiring 95 is formed on the lower surface of the actuator plate 53. Furthermore, the common electrode 85 is formed on the inner surface of the discharge channel 61, while the individual electrodes 88 are formed on the inner surface of the non-discharge channel 62.

[0089] In the conductive material removal step S5, unwanted portions of the electrode film formed in the wiring formation step S4 are removed. Specifically, a laser is scanned along the X-axis and Y-axis directions on the first main surface 53A of the actuator plate 53. For example, by removing the conductive material attached to the common electrode power supply section 86 in the actuator plate 53, the common electrode power supply section 86 is separated from the individual electrodes 88 and the bypass wiring 95. As a result, a blank area with residual laser irradiation marks is formed around the common electrode power supply section 86. Furthermore, after the conductive material removal step S5, the common electrode power supply section 86 and the individual electrode power supply section 89 are separated by forming a dividing groove 91 on the first main surface 53A of the actuator plate 53.

[0090] In the processing film formation step S6, the laminate formed by stacking the actuator plate 53 and the cover plate 54 is immersed in a processing agent (silane coupling agent). As a result, a processing film 110 is formed on the lower surface of the actuator plate 53, the inner surfaces of each channel 61, 62, and the portion of the lower surface of the cover plate 54 exposed in each channel 61, 62.

[0091] The intermediate plate bonding process S7 bonds the intermediate plate 52 to the lower surface of the actuator plate 53. Specifically, after applying adhesive 77 to the lower surface of the actuator plate 53 via the treatment film 110, the intermediate plate 52 is bonded via adhesive 77.

[0092] In the protective film forming process S8, a protective film 120 is formed on the inner surfaces of each channel 61, 62, the lower surface of the intermediate plate 52, the inner surface of the connecting hole 52a, and the lower surface of the cover plate 54, the portions of the protective film 120 exposed within each channel 61, 62. Furthermore, when a para-xylene-based resin material is used as the protective film 120, a chemical vapor deposition (CVD) method can be used, for example, to form the protective film 120.

[0093] In the nozzle plate joining process S9, with the nozzle hole 51a and the discharge channel 61 aligned, the nozzle plate 51 is attached to the lower surface of the intermediate plate 52 via adhesive 78.

[0094] Through the above processes, head chip 50 is manufactured.

[0095] Next, the following will discuss the use of Figure 1 The operation of the printer 1 shown is explained when it records text or graphics on the recording medium P.

[0096] As an initial state, printer 1 is set to a state where each ink tank 4 is fully filled with ink of a different color. The ink in the ink tank 4 is then filled into the print head 5 via the ink circulation mechanism 6.

[0097] In this initial state, if printer 1 is activated, the recording medium P is clamped by rollers 11 and 12 of conveying mechanisms 2 and 3 and simultaneously conveyed to the +X side. The carriage 29 moves along the Y-axis simultaneously with the conveying of the recording medium P, thereby causing the inkjet head 5 mounted on the carriage 29 to reciprocate along the Y-axis.

[0098] During the reciprocating movement of the inkjet head 5, ink is appropriately ejected from each inkjet head 5 to the recording medium P. This enables the recording of text or images on the recording medium P.

[0099] The operation of each inkjet head 5 will be explained in detail below.

[0100] In the circulating side-ejection type inkjet head 5 as in the first embodiment, firstly, by making Figure 2 The pressure pump 24 and suction pump 25 shown operate to allow ink to circulate within the circulation path 23. In this case, as... Figure 4 As shown, ink flowing through ink supply tube 21 is supplied to each ejection channel 61 via inlet common ink chamber 71 and inlet slit 72. The ink supplied to each ejection channel 61 flows along the Y-axis in each ejection channel 61. Afterward, the ink is discharged through outlet slit 76 to outlet common ink chamber 75, and then returns to ink tank 4 via ink discharge tube 22. This allows ink to circulate between inkjet head 5 and ink tank 4.

[0101] If via carriage 29 (refer to) Figure 1 The reciprocating movement of the inkjet head 5 is initiated by the movement of the inkjet head 5, and a driving voltage is applied between the common electrode 85 and the individual electrodes 88 via the flexible printed circuit board 92. At this time, the individual electrodes 88 are set to the driving potential Vdd, and the common electrode 85 is set to the reference potential GND, and a driving voltage is applied between each electrode 85 and 88. Thus, by generating an electric field in the portion of each driving wall 65 sandwiched between the opposing regions, each driving wall 65 bends and deforms in a V-shape around its central portion in the Z-axis direction. That is, the driving wall 65 deforms in a manner that expands the volume of the ejection channel 61.

[0102] After increasing the volume of each ejection channel 61, the voltage applied between the common electrode 85 and the individual electrodes 88 is reduced to zero. The drive wall 65 then returns to its original position, and the temporarily increased volume of the ejection channels 61 is restored to its original volume. This increases the internal pressure of the ejection channels 61, pressurizing the ink. As a result, the ink is ejected in droplets through the nozzle orifice 51a. The ink ejected from the nozzle orifice 51a falls onto the recording medium P, thereby enabling the recording of text or images on the recording medium P.

[0103] As explained above, the head chip 50 of this embodiment includes: an actuator plate 53, wherein an ink (liquid) ejection channel 61 (ejection channel) and an ink-free non-ejection channel 62 (non-ejection channel) extend along the Y-axis direction (first direction) respectively, and are alternately formed in the X-axis direction (second direction) intersecting the Y-axis direction, sandwiching a drive wall 65; a common electrode 85 (first electrode) formed on the inner surface of the ejection channel 61; and individual electrodes 88 (second electrodes) formed on the inner surface of the non-ejection channel 62, oriented in the actuator plate 53 in the same direction as the Y-axis direction. The first main surface 53A on the -Z side (one side) of the Z-axis direction (third direction) where the Y-axis and X-axis directions intersect is provided with: an individual electrode power supply unit 89 (second electrode power supply unit), which is disposed on the -Y side (one side) of the first opening 61A that opens in the first main surface 53A and sandwiches the discharge channel 61 in the Y-axis direction, and supplies driving power to a pair of individual electrodes 88 that sandwich the discharge channel 61 in the X-axis direction; and a bypass wiring 95, which is disposed on the +Y side (other side) of the first opening 61A sandwiched in the Y-axis direction, and connects the pair of individual electrodes 88.

[0104] According to this configuration, even if either of the pair of individual electrodes 88 breaks down, the individual electrode power supply unit 89 can still connect to the other individual electrode 88 via the bypass wiring 95 through the other individual electrode that has not broken down, thereby improving the reliability of the drive. In addition, the bypass wiring 95 is formed on the first main surface 53A of the actuator board 53, so it can be formed simultaneously with other conductor patterns, which can suppress the increase in cost or lead time caused by the increase in manufacturing processes.

[0105] Thus, according to this embodiment, non-conduction caused by the breakage of individual electrodes 88 formed in the non-ejection channel 62 can be suppressed, thereby improving the reliability of the drive.

[0106] Furthermore, in this embodiment, a common electrode power supply section 86 is provided on the first main surface 53A, which is formed in a ring along the opening edge of the first opening 61A and connected to the common electrode 85. When the shortest distance between the common electrode power supply section 86 and the bypass wiring 95 is set as D1 and the shortest distance between the common electrode power supply section 86 and the individual electrode 88 is set as D2, the relationship is D1>D2. According to this configuration, by making the shortest distance between the common electrode power supply section 86 and the bypass wiring 95 larger than the shortest distance between the common electrode power supply section 86 and the individual electrode 88, short circuits caused by ink being laid between the common electrode power supply section 86 and the bypass wiring 95 can be suppressed, thereby improving the reliability of the drive.

[0107] Furthermore, in this embodiment, when the shortest distance between the common electrode power supply unit 86 and the bypass wiring 95 is set to D1 and the shortest distance between the common electrode 85 and the individual electrodes 88 is set to D3, the relationship is D1≥D3. Based on this configuration, by making the shortest distance between the common electrode power supply unit 86 and the bypass wiring 95 greater than or equal to the shortest distance between the common electrode 85 and the individual electrodes 88 (i.e., the thickness of the drive wall 65), the distance between the common electrode power supply unit 86 and the bypass wiring 95 can be sufficiently ensured, and short circuits caused by ink being placed between the common electrode power supply unit 86 and the bypass wiring 95 can be more reliably suppressed.

[0108] Furthermore, in this embodiment, the first main surface 53A includes: a common electrode power supply section 86, which is formed in a ring along the opening edge of the first opening 61A and connected to the common electrode 85; and a dividing groove 91 (splitting groove), which extends along the X-axis direction and separates the common electrode power supply section 86 and the individual electrode power supply section 89. When the minimum width of the bypass wiring 95 is set to W1 and the minimum width of the portion of the individual electrode 88 where the dividing groove 91 is provided is set to W2, there is a relationship that W1 ≥ W2. According to this configuration, the minimum width of the bypass wiring 95 is greater than or equal to the minimum width of the portion of the individual electrode 88 where the dividing groove 91 is provided, thus suppressing the wiring resistance in the bypass wiring 95 from being higher than that portion. As a result, it is possible to prevent the bypass wiring 95 from breaking due to the electrical load during driving (ejection).

[0109] Furthermore, the inkjet head 5 (liquid jet head) according to this embodiment includes the aforementioned head chip 50. This configuration improves the reliability of the drive.

[0110] Furthermore, the printer 1 (liquid jet recording device) according to this embodiment includes the aforementioned inkjet head 5. This configuration improves the reliability of the drive.

[0111] (Second Implementation) Next, the second embodiment of the present invention will be described. In the following description, the same reference numerals are used to refer to the same or equivalent components as those in the embodiments described above, and their descriptions are simplified or omitted.

[0112] Figure 7 This is a diagram showing the main components of the actuator plate 53 according to the second embodiment.

[0113] like Figure 7 As shown in (c), the discharge channel 61 has an upper tangent 61b whose size in the Y-axis direction gradually decreases as it moves towards the -Z side (first main surface 53A side) in the Z-axis direction when viewed from the X-axis direction. Figure 7 As shown in (b), the bypass wiring 95 of the second embodiment is formed intersecting the upper cut portion 61b when viewed from the Z-axis direction.

[0114] In the second embodiment, the bypass wiring 95 is arranged to intersect with the formation range of the upper slit 61b. By arranging the bypass wiring 95 in this way, the enlargement of the actuator board 53 in the Y-axis direction (especially the +Y side) caused by the addition of the bypass wiring 95 can be suppressed. That is, it can help to miniaturize the head chip 50.

[0115] (Third implementation) Next, the third embodiment of the present invention will be described. In the following description, the same reference numerals are used to refer to the same or equivalent components as those in the embodiments described above, and their descriptions are simplified or omitted.

[0116] Figure 8 This is a diagram showing the main components of the actuator plate 53 according to the third embodiment.

[0117] In the third embodiment, such as Figure 8 As shown in (a) and (b), a bypass groove 96 extending linearly along the X-axis is provided on the first main surface 53A, on the +Y side of the first opening 61A and the common electrode power supply section 86. Furthermore, a bypass wiring 95 is formed on the bottom surface of the bypass groove 96. In addition, the bypass wiring 95 can also be formed on the side wall of the bypass groove 96 as long as it can connect a pair of individual electrodes 88 sandwiching the discharge channel 61.

[0118] In the third embodiment, the bypass wiring 95 is formed in the bypass groove 96 at a certain depth relative to the first main surface 53A. By providing the bypass groove 96 in this way, the bypass wiring 95 is not formed on the same plane as the common electrode power supply section 86, and short circuits caused by ink being laid between the common electrode power supply section 86 and the bypass wiring 95 can be reliably suppressed.

[0119] (Fourth implementation) Next, the fourth embodiment of the present invention will be described. In the following description, the same reference numerals are used to refer to the same or equivalent components as those in the embodiments described above, and their descriptions are simplified or omitted.

[0120] Figure 9 This is a diagram showing the main components of the actuator plate 53 according to the fourth embodiment.

[0121] In the fourth embodiment, such as Figure 9 As shown in (a) and (c), on the second main surface 53B, on the -Y side of the second opening (upper opening) in the discharge channel 61 that opens on the second main surface 53B and on the +Y side of the dividing groove 91, a second bypass groove 98 extending linearly in the X-axis direction is provided. Furthermore, a second bypass wiring 97 is formed on the bottom surface of the second bypass groove 98. In addition, the second bypass wiring 97 can also be formed on the sidewall of the second bypass groove 98, provided it can connect a pair of individual electrodes 88 sandwiching the discharge channel 61.

[0122] Thus, in the fourth embodiment, a second bypass wiring 97 is provided on the second main surface 53B of the actuator plate 53. The second bypass wiring 97 is arranged in the Y-axis direction between the second opening portion of the ejection channel 61 that opens on the second main surface 53B and the dividing groove 91, connecting a pair of individual electrodes 88. According to this configuration, the risk of wire breakage in the dividing groove 91 portion where the width of the individual electrodes 88 narrows can be avoided by the second bypass wiring 97. For example, the risk of wire breakage in the portion of the individual electrodes 88 indicated by symbol 88b is higher than that in the portion indicated by symbol 88a. However, even if a wire breakage occurs at the portion indicated by symbol 88b, since a pair of individual electrodes 88 are connected via the second bypass wiring 97 further inward (on the +Y side) than that portion, the reliability of the drive can be improved even if the bypass wiring 95 is broken. Furthermore, if a break occurs at the location indicated by symbol 88a, the second bypass wiring 97 will not function, but the bypass wiring 95 will function to connect the pair of individual electrodes 88. Incidentally, when the second bypass wiring 97 is provided, it is necessary to additionally form an electrode film on the second main surface 53B.

[0123] Furthermore, the scope of this disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of this disclosure.

[0124] For example, in the above embodiments, an inkjet printer was described as an example of a liquid jet recording device, but it is not limited to a printer. For example, it could also be a fax machine or an on-demand printer.

[0125] In the above embodiments, a configuration in which the inkjet head moves relative to the recorded medium during printing (a so-called shuttle) has been described as an example, but it is not limited to this configuration. The configuration involved in this disclosure can also be used in a configuration in which the recorded medium moves relative to the inkjet head while the inkjet head is fixed (a so-called fixed-head machine).

[0126] In the above embodiments, the case where the recording medium P is paper has been described, but the configuration is not limited to this. The recording medium P is not limited to paper, but may also be a metal material, a resin material, or even food, etc.

[0127] In the above embodiments, the configuration of the liquid jet head mounted on the liquid jet recording device has been described, but the configuration is not limited to this. That is, the liquid jetted from the liquid jet head is not limited to the liquid sprayed onto the recording medium, but may also be, for example, a medicinal solution prepared in a medicine preparation, a food additive such as seasonings or spices added to food, or a fragrance sprayed into the air.

[0128] In the above embodiments, the configuration in which the Z-axis direction is aligned with the direction of gravity has been described, but it is not limited to this configuration; the Z-axis direction may also be aligned with the horizontal direction.

[0129] In the above embodiments, a configuration (so-called pull-in) was described where ink is ejected by deforming the actuator plate in a direction that expands the volume of the ejection channel using an applied voltage, followed by restoring the actuator plate to its original position. However, this configuration is not limited to this one. The head chip disclosed herein can also be configured to eject ink by deforming the actuator plate in a direction that shrinks the volume of the ejection channel using an applied voltage (so-called pressure-in). In pressure-injection, by applying a driving voltage, the actuator plate deforms in a manner that bulges outward toward the ejection channel. As a result, by reducing the volume within the ejection channel, the pressure within the ejection channel increases, and the ink within the ejection channel is ejected to the outside through the nozzle orifice. If the driving voltage is reduced to zero, the actuator plate returns to its original position. Consequently, the volume within the ejection channel returns to its original state.

[0130] Furthermore, without departing from the spirit of this disclosure, the constituent elements in the above embodiments can be appropriately replaced with known constituent elements, and the above variations can also be appropriately combined.

[0131] [Symbol Explanation] 1. Printer (Liquid Jet Recording Device) 5. Inkjet head (liquid jet head) 50-head chip 53 Actuator Plate 53A 1st main surface 53B 2nd main side 61. Ejection Channel (Jet Channel) 61A First opening 61b Upper tangent 62 Non-ejection channel 61. Discharge Channel (Non-Jet Channel) 65 Drive Wall 85 Common electrode (electrode 1) 86 Common Electrode Power Supply Section (First Electrode Power Supply Section) 88 Individual electrodes (Electrode 2) 89 Individual electrode power supply section (second electrode power supply section) 90 tail 91. Dividing slot (segmentation slot) 95 Bypass wiring 96 Bypass Trough 97 Second Bypass Wiring 98. Second bypass channel.

Claims

1. A head chip, comprising: An actuator plate in which a liquid-filled injection channel and a liquid-free non-injection channel extend along a first direction and are alternately formed in a second direction intersecting the first direction, sandwiching a drive wall; The first electrode is formed on the inner surface of the injection channel; as well as The second electrode is formed on the inner surface of the non-jet channel. On the first main surface of the actuator plate facing one of the third directions intersecting the first and second directions, there is provided: The second electrode power supply unit is disposed on one side of the first opening portion of the injection channel that is opened on the first main surface in the first direction, and supplies driving power to the pair of second electrodes that are sandwiched in the second direction. as well as A bypass wiring, disposed on the other side of the first opening in the first direction, connects a pair of the second electrodes.

2. The head chip according to claim 1, wherein, On the first main surface, a first electrode power supply section is provided, which is formed in a ring shape along the opening edge of the first opening and is connected to the first electrode. When the shortest distance between the first electrode power supply unit and the bypass wiring is set to D1, and the shortest distance between the first electrode power supply unit and the second electrode is set to D2, The relationship is D1>D2.

3. The head chip according to claim 1 or 2, wherein, On the first main surface, a first electrode power supply section is provided, which is formed in a ring shape along the opening edge of the first opening and is connected to the first electrode. When the shortest distance between the first electrode power supply unit and the bypass wiring is set to D1, and the shortest distance between the first electrode and the second electrode is set to D3, It has the relationship that D1≥D3.

4. The head chip according to claim 1 or 2, wherein, On the first main surface, there is provided: The first electrode power supply section is formed in a ring shape along the opening edge of the first opening and is connected to the first electrode; as well as A separation groove, extending along the second direction, separates the first electrode power supply section and the second electrode power supply section. When the minimum width of the bypass wiring is set to W1 and the minimum width of the portion of the second electrode with the break groove is set to W2, They have a relationship that W1 ≥ W2.

5. The head chip according to claim 1 or 2, wherein, The injection channel has an upper cut portion whose size in the first direction gradually decreases as viewed from the second direction toward the third direction. The bypass wiring is formed intersecting the upper cut when viewed from the third direction.

6. The head chip according to claim 1 or 2, wherein, On the first main surface, there is provided: The first electrode power supply section is formed in a ring shape along the opening edge of the first opening and is connected to the first electrode; as well as A bypass channel, which extends along the second direction on the side of the first opening sandwiched between the first opening and the second opening. The bypass wiring is formed in the bypass slot.

7. The head chip according to claim 1 or 2, wherein, On the first main surface, there is provided: The first electrode power supply section is formed in a ring shape along the opening edge of the first opening and is connected to the first electrode; as well as A separation groove, extending along the second direction, separates the first electrode power supply section and the second electrode power supply section. The second main surface on the other side of the actuator plate facing the third direction. A second bypass wiring is provided, which is disposed in the first direction between the second opening on the second main surface of the injection channel and the splitting groove, and extends along the second direction to connect a pair of the second electrodes.

8. A liquid injection head comprising the head chip according to claim 1 or 2.

9. A liquid jet recording device comprising a liquid jet head according to claim 8.

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