PCR (Polymerase Chain Reaction) gene amplification device
By combining a water-cooling structure with a semiconductor Peltier in a PCR gene amplification instrument, and using a storage device to store and release the cold source, the problem of heat energy waste and low efficiency caused by waste heat emission in the existing technology is solved, achieving efficient cooling and component protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-27
- Publication Date
- 2026-03-24
AI Technical Summary
Existing PCR gene amplification instruments generate a large amount of waste heat when using Peltier elements for cooling, requiring forced heat dissipation, which leads to serious waste of heat energy and affects cooling efficiency.
It adopts a water-cooled structure combined with a semiconductor Peltier, which stores the cold source during heating and releases it during cooling, thus using the cold source for cooling and avoiding direct heat dissipation.
It improves cooling efficiency, reduces heat waste, protects components, and extends service life.
Smart Images

Figure CN121718408A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of gene amplification technology, and particularly relates to a PCR gene amplification device. BACKGROUND
[0002] The PCR gene amplification instrument is a temperature device for providing simulated gene amplification temperature at each stage and increasing functions such as low-temperature storage and fluorescence detection, and is suitable for the fields of polymerase chain reaction fluorescence quantitative detection in the research fields of human genome engineering, forensic science, oncology, tissue and population biology, paleontology, zoology, botany and the clinical diagnosis fields of viruses, tumors and genetic diseases.
[0003] When the PCR gene amplification instrument is used, a test tube containing reagents to be amplified is inserted into the PCR gene amplification instrument for amplification, the test tube is heated by a heating tube, and then data analysis is performed by a photoelectric probe of the PCR gene amplification instrument to obtain a result. The existing PCR gene amplification instrument usually uses a semiconductor Peltier element to heat or cool to realize temperature control inside the amplification device. When the Peltier element is used for cooling and refrigeration, a large amount of waste heat is generated on the other side of the hot surface, which must be forcibly removed, otherwise the refrigeration efficiency will be seriously affected or even the element will be damaged. In the prior art, this is realized by a radiator + powerful fan (air cooling) or a liquid cooling circulation system. However, this heat dissipation method will discharge a large amount of heat source, and the heat energy is wasted seriously. SUMMARY
[0004] TECHNICAL PROBLEM In view of the above-mentioned defects in the prior art, the present application provides a PCR gene amplification device, which can effectively solve the problem that when the PCR gene amplification instrument in the prior art is used, the other side of the hot surface of the Peltier element generates a large amount of waste heat during cooling and refrigeration, which must be forcibly removed, otherwise the refrigeration efficiency will be seriously affected or even the element will be damaged. This is usually realized by a radiator + powerful fan (air cooling) or a liquid cooling circulation system. However, this heat dissipation method will discharge a large amount of heat source, and the heat energy is wasted seriously. TECHNICAL SCHEME
[0005] To achieve the above purpose, the present application is realized by the following technical scheme: The present application provides a PCR gene amplification device, which comprises a shell, an amplification groove is formed above the shell, a heat conduction plate is fixedly installed at the bottom of the amplification groove, the heat conduction plate penetrates to the lower side of the amplification groove, a semiconductor Peltier element is installed on the lower side of the heat conduction plate, and a water cooling structure is arranged below the semiconductor Peltier element. The water-cooling structure includes a water-cooling box fixedly installed below a semiconductor Peltier and a heat sink fixedly installed on one side of the housing. The water-cooling box is provided with an inlet pipe and an outlet pipe. A storage device is connected in parallel to the outlet pipe. The storage device is used to keep the liquid flowing out of the outlet pipe warm and store it. The storage device is provided with a three-way control valve for connecting the liquid stored inside the storage device to the outlet pipe.
[0006] Furthermore, a partition is fixedly installed inside the housing, and filter elements are fixedly installed on both sides below the partition. Air inlets are provided on both sides of the filter elements, and an air outlet is provided on the top of the filter elements. A filter screen for filtering air is provided inside the filter elements, and a brush plate for cleaning the filter screen is provided inside the filter elements. A linkage frame for driving the brush plate is slidably installed below the partition.
[0007] Furthermore, a telescopic component for moving the linkage frame is fixedly installed on the partition plate, and a wedge-shaped slider is fixedly installed above the linkage frame. When the slider moves toward the three-way control valve, it drives the three-way control valve to connect the storage component to the water outlet pipe.
[0008] Furthermore, multiple sets of filter screens are installed obliquely inside the filter element, with the end faces of the multiple sets of filter screens facing multiple air inlets respectively. A connecting rod extending out of the filter element is fixedly installed on the brush plate. The connecting rod is slidably connected to the filter element, and the other end of the connecting rod is connected to the linkage frame. During the reciprocating movement of the linkage frame, the brush plate is driven to reciprocate on the filter screen.
[0009] Furthermore, the storage component includes a top-sealed cylinder, an outlet pipe, and an inlet pipe. The outlet pipe and the inlet pipe are interconnected. One end of the outlet pipe and the inlet pipe are coiled inside the cylinder. The other end of the outlet pipe is connected to a heat dissipation tank inside the heat dissipation component. The other end of the inlet pipe is connected to one of the outlets of a three-way control valve. The inlet of the three-way control valve is connected to the outlet pipe. The other outlet of the three-way control valve is provided with a connecting pipe, and the other end of the connecting pipe is connected to the outlet pipe.
[0010] Furthermore, both the liquid outlet pipe and the liquid inlet pipe are made of thermally conductive metal material, the storage device is filled with a heat storage medium, and the outer layer of the storage device is wrapped with heat insulation material.
[0011] Furthermore, both the inlet and outlet pipes are made of metal, and the partition is provided with heat dissipation holes, which are used to guide air on the partition into the heat dissipation component and out of the housing.
[0012] Furthermore, a one-way flow valve is installed at each connection point between the outlet pipe and the connecting pipe.
[0013] Furthermore, a test tube rack is fixedly installed inside the amplification tank, the test tube rack is fixedly installed above the heat-conducting plate, and a cover plate is rotatably installed above the amplification tank.
[0014] Furthermore, a mounting bracket is fixedly installed on the outer side of the semiconductor Peltier, and the mounting bracket is fixed to the bottom of the amplification cell by screws. The mounting bracket is used to support the position of the semiconductor Peltier and the water-cooling box. Beneficial effects
[0015] The technical solution provided by this invention has the following advantages compared with known public technologies: This invention provides a storage device inside the housing, connected to the outlet pipe of the water-cooled box. The storage device can store the cold source generated below the semiconductor Peltier element when the semiconductor Peltier element heats the inside of the amplification cell, and release this cold source when the semiconductor Peltier element cools the inside of the amplification cell to cool the area below the semiconductor Peltier element. This fully utilizes the cold or heat source generated below the semiconductor Peltier element instead of directly discharging it.
[0016] In this invention, when the linkage frame adjusts the three-way control valve, it can easily move the connecting rods extending from the inside of the two filter elements on both sides, thereby easily driving the brush plates inside the two filter elements to scrape the dust off the filter screen. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the housing of the present invention; Figure 3 This is a side sectional view of the present invention; Figure 4 This is a schematic diagram of the installation structure of the heating element of the present invention; Figure 5 This is a schematic diagram of the installation structure of the water-cooled box of the present invention; Figure 6 This is a schematic diagram of the connection structure between the storage component and the water-cooled box of the present invention; Figure 7 This is a schematic diagram of the linkage frame installation structure of the present invention; Figure 8 This is a schematic diagram of the structure of the three-way control valve controlled by the linkage frame of the present invention; Figure 9 This is an internal cross-sectional view of the storage component of the present invention; Figure 10 This is a cross-sectional view of the filter element of the present invention; Figure 11 This is a schematic diagram of the internal structure of the filter element of the present invention.
[0019] The labels in the diagram represent: 1. Housing; 101. Amplification tank; 11. Screen; 12. Cover plate; 13. Test tube rack; 14. Heat sink; 15. Heat-conducting plate; 16. Partition plate; 1601. Heat dissipation through hole; 2. Water-cooled structure; 21. Semiconductor Peltier; 22. Mounting bracket; 23. Water-cooled box; 231. Inlet pipe; 232. Outlet pipe; 233. Connecting pipe; 3. Storage component; 31. Liquid outlet pipe; 32. Liquid inlet pipe; 33. Three-way control valve; 4. Filter element; 401. Air inlet; 402. Air outlet; 41. Connecting rod; 42. Filter screen; 43. Brush plate; 5. Linkage frame; 51. Telescopic component; 52. Slider. Detailed Implementation
[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.
[0021] The present invention will be further described below with reference to embodiments.
[0022] Example: A PCR gene amplification device, such as Figure 1 - Figure 11 As shown, the device includes a housing 1, on which a screen 11 is mounted. An amplification tank 101 is formed above the housing 1. A heat-conducting plate 15 is fixedly mounted at the bottom of the amplification tank 101, extending below the amplification tank 101. A test tube rack 13 is fixedly mounted inside the amplification tank 101, and the test tube rack 13 is fixedly mounted above the heat-conducting plate 15. A cover plate 12 is rotatably mounted above the amplification tank 101. Both sides of the test tube rack 13 and the heat-conducting plate 15 are made of metal thermally conductive material, which can have good thermal conductivity and can quickly heat or cool the test tubes on the test tube rack 13. A semiconductor Peltier 21 is attached to the bottom of the heat-conducting plate 15, and a water-cooling structure 2 is provided below the semiconductor Peltier 21. The water-cooling structure 2 includes a water-cooling box 23 fixedly installed below the semiconductor Peltier 21 and a heat sink 14 fixedly installed on one side of the housing 1. A mounting bracket 22 is fixedly installed on the outside of the semiconductor Peltier 21. The mounting bracket 22 is fixed to the bottom of the amplification tank 101 by screws. The mounting bracket 22 is used to support the position of the semiconductor Peltier 21 and the water-cooling box 23. The mounting bracket 22 can make the semiconductor Peltier 21 and the water-cooling box 23 fit tightly together, which can easily remove the heat below the semiconductor Peltier 21 and avoid the accumulation of heat below the semiconductor Peltier 21 when it is heated. At the same time, it can also make the upper end of the semiconductor Peltier 21 fit tightly against the lower part of the heat-conducting plate 15, so that the heat exchange between the upper part of the semiconductor Peltier 21 and the heat-conducting plate 15 can be completed quickly.
[0023] The water-cooled box 23 is provided with an inlet pipe 231 and an outlet pipe 232. A storage device 3 is connected in parallel to the outlet pipe 232. The storage device 3 is used to keep the liquid flowing out of the outlet pipe 232 warm and store it. The storage device 3 is provided with a three-way control valve 33 for connecting the liquid stored inside the storage device 3 to the outlet pipe 232.
[0024] In this invention, by setting a storage device 3 inside the housing 1 and connecting the storage device 3 to the water outlet pipe 232 of the water-cooled box 23, the storage device 3 can store the cold source generated below the semiconductor Peltier 21 element when the semiconductor Peltier 21 element heats the inside of the amplification cell 101, and release these cold sources when the semiconductor Peltier 21 element cools the inside of the amplification cell 101 to cool the area below the semiconductor Peltier 21 element, making full use of the cold or heat source generated below the semiconductor Peltier 21 element instead of directly discharging it.
[0025] A parallel storage unit 3 is installed on the outlet pipe 232. When the coolant in the water-cooled box 23 flows out, a portion of the coolant will enter the storage unit 3 for heat preservation and storage. This can effectively reduce the heat loss of the coolant during storage. When the coolant in the storage unit 3 needs to be used, the storage unit 3 can be connected to the outlet pipe 232 by controlling the three-way control valve 33, so that the stored coolant can re-participate in the water cooling cycle, thereby achieving effective cooling of the hot surface of the semiconductor Peltier 21, avoiding a large waste of heat, improving cooling efficiency, and also protecting the semiconductor Peltier 21 element and extending its service life.
[0026] To prevent excessive dust from entering the housing 1 during the cooling process and affecting its heat dissipation, this embodiment includes a partition 16 fixedly installed inside the housing 1. Filter elements 4 are fixedly installed on both sides of the lower portion of the partition 16. Air inlets 401 are provided on both sides of each filter element 4, allowing external air to enter the housing 1 through the inlets 401 and flow above the partition 16. An air outlet 402 is provided at the top of each filter element 4. A filter screen 42 is installed inside the filter element 4 to filter the air. As the air rises inside the filter element 4, dust is trapped below the filter screen 42. A brush plate 43 is installed inside the filter element 4 to clean the filter screen 42. A sliding device for moving the brush plate 43 is installed below the partition 16. The linkage frame 5 allows the brush plate 43 to move easily inside the filter element 4, facilitating the removal of dust filtered from below the filter screen 42. The removed dust falls directly to the bottom of the filter element 4 under gravity, making cleaning convenient. A telescopic component 51 for moving the linkage frame 5 is fixedly installed on the partition plate 16. A wedge-shaped slider 52 is fixedly installed above the linkage frame 5. When the slider 52 moves towards the three-way control valve 33, it drives the valve to connect the storage element 3 to the outlet pipe 232. A switching button is elastically installed below the three-way control valve 33, and a ball is rotatably installed below the button. After the wedge-shaped slider 52 moves towards the three-way control valve 33, the upper surface of the slider 52 abuts against the ball, simultaneously causing the switching button to move upwards, connecting the storage element 3 to the outlet pipe 232.
[0027] Multiple sets of filter screens 42 are installed obliquely inside the filter element 4. The end faces of the multiple sets of filter screens 42 face multiple air inlets 401 respectively. During the filtration process, the air entering through the multiple air inlets 401 passes directly through the multiple sets of filter screens 42, quickly filtering out dust in the air. A connecting rod 41 extending out of the filter element 4 is fixedly installed on the brush plate 43. The connecting rod 41 is slidably connected to the filter element 4. The other end of the connecting rod 41 is connected to the linkage frame 5. During the reciprocating movement of the linkage frame 5, the brush plate 43 is driven to reciprocate on the filter screen 42. By driving the linkage frame 5 to move, the connecting rods 41 extending out of the two filter elements 4 on both sides can be easily moved, thereby easily driving the brush plates 43 inside the two filter elements 4 to scrape the dust on the filter screen 42.
[0028] In practical use, the storage component 3 can include various structures that can maintain and store temperature. In this embodiment, the storage component 3 includes a cylindrical body with a sealed top, an outlet pipe 31, and an inlet pipe 32. The outlet pipe 31 and the inlet pipe 32 are interconnected. One end of the outlet pipe 31 and the inlet pipe 32 is coiled inside the cylindrical body, and the other end of the outlet pipe 31 is connected to the heat dissipation tank inside the heat sink 14. The heat sink 14 includes a cooling fan and a heat sink. When water flows through the heat sink, it exchanges heat with the heat sink. Then, the cooling fan blows air towards the heat sink to dissipate the heat source on the surface of the heat sink. The other end of the inlet pipe 32 is connected to one of the outlets of the three-way control valve 33. The inlet of the three-way control valve 33 is connected to the outlet pipe 232. The other outlet of the three-way control valve 33 is provided with a connecting pipe 233. The liquid discharged from the outlet pipe 232 can be selected to enter the inlet pipe 32 (i.e., the inside of the storage device 3) or the connecting pipe 233 (i.e., directly discharged into the heat dissipation tank) through the three-way control valve 33. The other end of the connecting pipe 233 is connected to the outlet pipe 31. One-way flow valves are provided at the positions where the outlet pipe 31 and the connecting pipe 233 are connected to each other. The one-way flow valves can prevent liquid backflow.
[0029] To further increase the heat dissipation efficiency inside the casing 1, this embodiment uses metal thermally conductive materials for both the outlet pipe 31 and the inlet pipe 32. The storage unit 3 is filled with a heat storage medium and wrapped with insulation material. This allows the storage unit 3 to store a cold or heat source inside the heat storage medium when connected to the outlet pipe 232. When the semiconductor Peltier 21 element switches its operating state, connecting the storage unit 3 back to the outlet pipe 232 allows for rapid cooling or heating of the area below the semiconductor Peltier 21 element. The heat or cold source generated below the semiconductor Peltier 21 element can be fully utilized; the inlet pipe 231 and the outlet pipe 232 are both made of metal material; the partition 16 is provided with heat dissipation holes 1601, which are used to guide air on the partition 16 into the heat sink 14 and out of the housing 1. When the air enters above the partition 16 from the filter 4, it will exchange heat with the outlet pipe 31, the inlet pipe 32, the inlet pipe 231 and the outlet pipe 232 above the partition 16, which can remove the heat inside the housing 1 more quickly.
[0030] When the semiconductor Peltier 21 element heats the inside of the amplification tank 101, the temperature of the lower side of the semiconductor Peltier 21 will drop. At this time, by connecting the storage device 3 to the water outlet pipe 232 of the water-cooled box 23, the cooling water can enter the storage device 3 for storage. Then, the three-way control valve 33 is closed to disconnect the storage device 3 from the water outlet pipe 232. Afterwards, when the semiconductor Peltier 21 cools the inside of the amplification tank 101, heat will accumulate at the bottom of the semiconductor Peltier 21. At this time, the linkage 5 is moved towards the three-way control valve 33. The storage unit 3 is connected to the water outlet pipe 232. The low-temperature liquid inside the storage unit 3 will flow through the liquid outlet pipe 31, the heat dissipation tank, the water inlet pipe 231 and the water cooling box 23 in sequence to cool these structures. At the same time, it will also cool the area below the semiconductor Peltier 21. It can absorb and carry away the heat as soon as it starts to generate heat below the semiconductor Peltier 21, avoiding heat contact. In addition, when the linkage frame 5 adjusts the three-way control valve 33, the linkage frame 5 will also drive the connecting rod 41 to move, so that the brush plate 43 cleans the filter screen 42.
[0031] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.
Claims
1. A PCR gene amplification device, comprising a housing (1), wherein an amplification groove (101) is formed on the upper part of the housing (1), and a heat-conducting plate (15) is fixedly installed at the bottom of the amplification groove (101), the heat-conducting plate (15) extending through to the bottom of the amplification groove (101), characterized in that, A semiconductor Peltier (21) is attached to the bottom of the heat-conducting plate (15), and a water-cooling structure (2) is provided below the semiconductor Peltier (21). The water-cooling structure (2) includes a water-cooling box (23) fixedly installed below the semiconductor Peltier (21) and a heat sink (14) fixedly installed on one side of the housing (1). The water-cooling box (23) is provided with an inlet pipe (231) and an outlet pipe (232). A storage device (3) is connected in parallel on the outlet pipe (232). The storage device (3) is used to keep the liquid flowing out of the outlet pipe (232) warm and store it. A three-way control valve (33) is provided on the storage device (3) for connecting the liquid stored inside the storage device (3) to the outlet pipe (232).
2. The PCR gene amplification device according to claim 1, characterized in that, A partition (16) is fixedly installed inside the housing (1). Filter elements (4) are fixedly installed on both sides below the partition (16). Air inlets (401) are provided on both sides of the filter elements (4). An air outlet (402) is provided on the top of the filter elements (4). A filter screen (42) for filtering air is provided inside the filter elements (4). A brush plate (43) for cleaning the filter screen (42) is provided inside the filter elements (4). A linkage frame (5) for driving the brush plate (43) is slidably installed below the partition (16).
3. The PCR gene amplification device according to claim 2, characterized in that, The partition (16) is fixedly installed with a telescopic component (51) for moving the linkage frame (5). A wedge-shaped slider (52) is fixedly installed above the linkage frame (5). When the slider (52) moves toward the three-way control valve (33), it drives the three-way control valve (33) to connect the storage component (3) to the water outlet pipe (232).
4. The PCR gene amplification device according to claim 3, characterized in that, Multiple sets of filter screens (42) are installed at an incline inside the filter element (4). The end faces of the multiple sets of filter screens (42) are respectively facing multiple air inlets (401). A connecting rod (41) extending out of the filter element (4) is fixedly installed on the brush plate (43). The connecting rod (41) is slidably connected to the filter element (4). The other end of the connecting rod (41) is connected to the linkage frame (5). During the reciprocating movement of the linkage frame (5), the brush plate (43) is driven to reciprocate on the filter screen (42).
5. The PCR gene amplification device according to claim 4, characterized in that, The storage component (3) includes a top-sealed cylinder, an outlet pipe (31), and an inlet pipe (32). The outlet pipe (31) and the inlet pipe (32) are interconnected. One end of the outlet pipe (31) and the inlet pipe (32) are coiled inside the cylinder. The other end of the outlet pipe (31) is connected to the heat dissipation tank inside the heat dissipation component (14). The other end of the inlet pipe (32) is connected to one of the outlets of the three-way control valve (33). The inlet of the three-way control valve (33) is connected to the outlet pipe (232). The other outlet of the three-way control valve (33) is provided with a connecting pipe (233). The other end of the connecting pipe (233) is connected to the outlet pipe (31).
6. The PCR gene amplification device according to claim 5, characterized in that, The liquid outlet pipe (31) and liquid inlet pipe (32) are both made of metal thermally conductive material. The storage component (3) is filled with a heat storage medium and the outer layer of the storage component (3) is wrapped with heat insulation material.
7. A PCR gene amplification device according to claim 6, characterized in that, Both the inlet pipe (231) and the outlet pipe (232) are made of metal. The partition (16) has a heat dissipation hole (1601) for guiding air on the partition (16) into the heat sink (14) and out of the housing (1).
8. The PCR gene amplification device according to claim 7, characterized in that, One-way flow valves are provided at the points where the outlet pipe (31) and the connecting pipe (233) are connected.
9. A PCR gene amplification device according to claim 1, characterized in that, A test tube rack (13) is fixedly installed inside the amplification tank (101). The test tube rack (13) is fixedly installed above the heat-conducting plate (15). A cover plate (12) is rotatably installed above the amplification tank (101).
10. A PCR gene amplification device according to claim 1, characterized in that, A mounting bracket (22) is fixedly installed on the outside of the semiconductor Peltier (21). The mounting bracket (22) is fixed to the bottom of the amplification tank (101) by screws. The mounting bracket (22) is used to support the position of the semiconductor Peltier (21) and the water cooling box (23).