Thermocouple fixing method, temperature measuring method and IGBT (Insulated Gate Bipolar Translator) module
By using pre-defined adhesive application tools and insulating adhesive curing methods, the problem of uneven adhesive application on IGBT modules for thermocouples was solved, achieving standardized fixation of thermocouples and accurate temperature measurement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-24
- Publication Date
- 2026-03-24
AI Technical Summary
In existing technologies, when thermocouples are manually fixed on IGBT modules with adhesive, the amount and shape of the adhesive applied are uneven, which affects the temperature measurement accuracy.
The thermocouple is fixed to the part being measured using a pre-specified adhesive applicator, and then cured with insulating adhesive to ensure that the size and shape of the adhesive are standardized.
This reduces the impact of adhesive application amount and uneven shape on thermocouple temperature measurement, improving the accuracy and reliability of temperature measurement.
Smart Images

Figure CN121720599A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of IGBT temperature measurement, and particularly relates to a fixing method of thermocouple, a temperature measurement method and an IGBT module. BACKGROUND
[0002] With the rapid development of the new energy automobile industry, the development of motor drive enters a high-speed development stage. Compared with the traditional powertrain development in the past, the motor drive has a short cycle, a large number of verifications, and puts forward strict requirements on design and verification. In the many verifications of the motor drive, the temperature test of the IGBT module is a key item, and is very important for the promotion of the project. The temperature test is a verification of the temperature rise performance of different parts of the IGBT module of the motor drive under different power and environmental temperatures. At present, various high-voltage components are distributed in the IGBT module, so the thermocouple (temperature sensor) must be coated with insulating glue on the surface.
[0003] In the prior art, the thermocouple is manually fixed on the IGBT module according to experience, which causes uneven amount and shape of the glue, and further causes different degrees of influence on the temperature measurement of the thermocouple. SUMMARY
[0004] Embodiments of the present application provide a fixing method of thermocouple, a temperature measurement method and an IGBT module to solve the technical problem that the existing thermocouple is manually fixed on the IGBT module according to experience in the related art, the amount and shape of the glue are uneven, and different degrees of influence on the temperature measurement of the thermocouple are caused.
[0005] In a first aspect, a fixing method of thermocouple is provided, including the following steps: A preset specification of a glue coating tool is arranged on a temperature measurement point of a temperature measurement component; An end of the thermocouple is arranged in the preset specification of the glue coating tool, and insulating glue is injected into the preset specification of the glue coating tool; The insulating glue is solidified to fix the thermocouple and the temperature measurement component.
[0006] In some embodiments, the preset specification of the glue coating tool includes a circular ring column and a handle part connected with the circular ring column.
[0007] In some embodiments, the circular ring column is provided with a notch.
[0008] In some embodiments, the circular ring column is provided with a position scale.
[0009] In some embodiments, the inner diameter of the circular ring column is not less than 5mm.
[0010] In some embodiments, after the step of curing the insulating glue and fixing the thermocouple with the temperature-measured component, the method further comprises the following steps: The thermocouple fixed in the insulating glue is subjected to a pull-out force test, and whether the thermocouple fixed in the insulating glue meets the fixing requirement is determined according to the pull-out force test result.
[0011] In a second aspect, a temperature-measuring method of a thermocouple is provided, which comprises the following steps: The glue-applying tool of a preset specification is arranged on the temperature-measured point of the temperature-measured component; The end of the thermocouple is arranged in the glue-applying tool of the preset specification, and the insulating glue is injected into the glue-applying tool of the preset specification; The insulating glue is cured to fix the thermocouple with the temperature-measured component; The thermocouple fixed in the insulating glue is subjected to temperature compensation.
[0012] In some embodiments, the step of subjecting the thermocouple fixed in the insulating glue to temperature compensation comprises the following steps: The thermocouple of the same specification is fixed in contact with the temperature-measured point of the temperature-measured component of the same specification; The temperature of the thermocouple fixed in contact and the temperature of the thermocouple fixed in the insulating glue under different environmental temperatures and different current conditions of the temperature-measured component are respectively tested; The thermocouple fixed in the insulating glue is subjected to temperature compensation according to the test result.
[0013] In some embodiments, the step of subjecting the thermocouple fixed in the insulating glue to temperature compensation according to the test result comprises the following steps: A thermocouple temperature compensation formula is obtained according to the temperature of the thermocouple fixed in contact and the temperature of the thermocouple fixed in the insulating glue; The thermocouple fixed in the insulating glue is subjected to temperature compensation according to the thermocouple temperature compensation formula.
[0014] In a third aspect, an IGBT module is provided, which uses the fixing method of the thermocouple or the temperature-measuring method of the thermocouple.
[0015] The technical solution provided by the application has the following beneficial effects: This invention provides a method for fixing a thermocouple, a temperature measurement method, and an IGBT module. The thermocouple fixing method first places a pre-sized adhesive applicator on the temperature point to be measured on the component being measured; then, the thermocouple tip is placed inside the pre-sized adhesive applicator, and insulating adhesive is injected into the applicator; finally, the insulating adhesive is cured, fixing the thermocouple to the component being measured. In other words, the thermocouple fixing method in this invention uses a pre-sized adhesive applicator to apply insulating adhesive to the thermocouple, standardizing the size and shape of the cured adhesive. This minimizes the impact of uneven adhesive application on temperature measurement. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 A schematic flowchart illustrating a method for fixing a thermocouple according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure for fixing the thermocouple and the temperature-measuring component according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the adhesive application tool provided in an embodiment of the present invention; Figure 4 This is a schematic flowchart of a thermocouple temperature measurement method provided in an embodiment of the present invention; Figure 5 Implementation provided for the embodiments of the present invention Figure 4 A flowchart illustrating step S40; Figure label: 1. Glue application tool; 11. Circular ring; 111. Notch; 112. Position scale; 12. Handle; 2. The component being measured; 3. Thermocouple; 4. Insulating adhesive. Detailed Implementation
[0018] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0019] The fixing method of the thermocouple provided by the embodiments of the present application can solve the technical problem that the thermocouple is manually fixed on an IGBT module according to experience, the amount and shape of the glue are not uniform, and the temperature measurement of the thermocouple is affected to different degrees.
[0020] Referring to FIGS. 1 and 2, Figure 1 The fixing method of the thermocouple provided by the embodiments of the present application comprises the following steps: In step S10, a preset-specification glue applying tool 1 is arranged on a temperature-measured point of a temperature-measured component 2.
[0021] Specifically, referring to FIGS. 1 and 2, Figure 2 and Figure 3 The preset-specification glue applying tool 1 comprises a circular column 11 and a handle part 12 connected with the circular column 11.
[0022] In step S20, a tip of a thermocouple 3 is arranged in the preset-specification glue applying tool 1, and insulation glue 4 is injected into the preset-specification glue applying tool 1.
[0023] Specifically, referring to FIGS. 1 and 2, Figure 2 The circular column 11 is provided with a notch 111, the thermocouple 3 is inserted into the circular column 11 through the notch 111, and then the insulation glue 4 is slowly injected into the preset-specification glue applying tool 1.
[0024] In step S30, the insulation glue 4 is solidified to fix the thermocouple 3 and the temperature-measured component 2.
[0025] Specifically, referring to FIGS. 1 and 2, Figure 2 A hot air gun is used to heat at a position about 5 cm away from the preset-specification glue applying tool 1, and the insulation glue 4 is solidified after ten minutes. After the insulation glue 4 is solidified, the preset-specification glue applying tool 1 can be taken down, cleaned and reused, which is simple and convenient.
[0026] The fixing method of the thermocouple in the embodiments of the present application uses the preset-specification glue applying tool to apply the insulation glue, the size and shape of the insulation glue after solidification are standardized, the situation that the amount and shape of the glue are not uniform can be avoided as much as possible, and the influence of the amount and shape of the glue on the temperature measurement of the thermocouple is reduced.
[0027] As an optional implementation, in one embodiment of the application, referring to Figure 2 As shown in the figure, the circular column 11 is provided with a position scale 112. Specifically, the end of the thermocouple 3 is placed at the intersection of the position scale 112 on the circular column 11, so that the end of the thermocouple 3 is located at the center of the circular column 11, ensuring the fixing effect.
[0028] As an optional implementation, in one embodiment of the application, referring to Figure 2 As shown in the figure, the inner diameter of the circular column 11 is not less than 5 mm, ensuring that the fixed size of the insulating glue 4 is not less than 5 mm, meeting the fixing requirements.
[0029] As an optional implementation, in one embodiment of the application, after the step of curing the insulating glue 4 and fixing the thermocouple 3 with the temperature measuring component 2, the following steps are included: The thermocouple 3 fixed in the insulating glue 4 is subjected to a pull-out force test, and whether the thermocouple 3 fixed in the insulating glue 4 meets the fixing requirements is determined according to the pull-out force test result.
[0030] Specifically, the thermocouple 3 fixed in the insulating glue 4 is subjected to a pull-out force test, and a pull-out force greater than 20 N is qualified, confirming that the fixed size of the insulating glue 4 is not less than 5 mm, determining whether the thermocouple 3 fixed in the insulating glue 4 meets the fixing requirements, and further meeting the subsequent use requirements, ensuring the reliability of the subsequent temperature measurement of the temperature measuring component 2.
[0031] Referring to Figure 4 As shown in the figure, the embodiment of the application further provides a temperature measuring method of a thermocouple, including the following steps: Step S10, a preset specification of a glue applying tool 1 is arranged on a temperature measuring point of a temperature measuring component 2.
[0032] Specifically, the preset specification of the glue applying tool 1 includes a circular column 11 and a handle part 12 connected with the circular column 11.
[0033] Step S20, an end of a thermocouple 3 is arranged in the preset specification of the glue applying tool 1, and insulating glue 4 is injected into the preset specification of the glue applying tool 1.
[0034] Specifically, referring to Figure 2 As shown in the figure, the circular column 11 is provided with a notch 111, the thermocouple 3 extends into the inside of the circular column 11 through the notch 111, and then the insulating glue 4 is slowly injected into the preset specification of the glue applying tool 1.
[0035] Step S30, the insulating glue 4 is cured, and the thermocouple 3 is fixed with the temperature measuring component 2.
[0036] Step S40, the thermocouple 3 fixed in the insulating glue 4 is subjected to temperature compensation.
[0037] The temperature measuring method of the thermocouple in the embodiment of the application uses a preset specification of a gluing tool to perform the insulating glue coating operation, so that the size and shape of the cured insulating glue are standardized, and the amount and shape of the insulating glue can be as uniform as possible, thereby reducing the influence of the amount and shape of the insulating glue on the temperature measurement of the thermocouple. Meanwhile, the temperature compensation of the fixed thermocouple can ensure the accuracy of the final temperature measurement result.
[0038] As an optional implementation, in one embodiment of the application, referring to FIG. 3, the step of performing temperature compensation on the thermocouple 3 fixed in the insulating glue 4 includes the following steps. Figure 5 Step S401, the thermocouple 3 of the same specification is fixed in contact with the temperature measuring point of the temperature measuring component 2 of the same specification.
[0039] Step S402, the temperature of the thermocouple 3 fixed in contact with the temperature measuring component 2 under different environmental temperatures and different current conditions and the temperature of the thermocouple 3 fixed in the insulating glue 4 are respectively tested. Specifically, the temperature of the thermocouple fixed in contact with the temperature measuring component 2 under the condition of 0A current under different environmental temperatures is tested; the temperature of the thermocouple fixed in contact with the temperature measuring component 2 under the condition of 100A current at room temperature is tested; and the temperature of the thermocouple fixed in contact with the temperature measuring component 2 under the condition of 200A current at room temperature is tested.
[0040] The temperature of the thermocouple fixed in the insulating glue 4 under the condition of 0A current under different environmental temperatures is tested; the temperature of the thermocouple fixed in the insulating glue 4 under the condition of 100A current at room temperature is tested; and the temperature of the thermocouple fixed in the insulating glue 4 under the condition of 200A current at room temperature is tested.
[0041] The test results are shown in Table 1, Table 2 and Table 3. Table 1
[0042] Table 2
[0043] Table 3
[0044] Step S403, the temperature of the thermocouple 3 fixed in the insulating glue 4 is compensated according to the test results.
[0045] Further, the step of compensating the temperature of the thermocouple 3 fixed in the insulating glue 4 according to the test result comprises the following steps: According to the temperature of the contact-fixed thermocouple 3 and the temperature of the thermocouple 3 fixed in the insulating glue 4, a thermocouple temperature compensation formula is obtained; Specifically, according to the test results in Table 1, Table 2 and Table 3, considering the influence of working current, the comprehensive thermocouple temperature compensation formula is: Y=0.001(1+(Z-100) / 500)X 2 +(0.765-3(Z-150) / 10000)X+3.95-(Z-50) / 1000; Wherein, Y is the temperature of the contact-fixed thermocouple, X is the thermocouple fixed in the insulating glue, and Z is the working current of the measured temperature component.
[0046] According to the thermocouple temperature compensation formula, the temperature of the thermocouple 3 fixed in the insulating glue 4 is compensated. That is, in actual application, Y is calculated according to X and Z, and Y is used as the actual measurement temperature.
[0047] The embodiment of the present application also provides an IGBT module using the aforementioned thermocouple fixing method or using the aforementioned thermocouple temperature measurement method. The IGBT module can be understood as the aforementioned measured temperature component.
[0048] In the description of the present application, it should be noted that the positions or position relationships indicated by the terms "upper", "lower" and the like are based on the positions or position relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular position, be constructed and operated in a particular position, and therefore cannot be understood as a limitation on the present application. Unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0049] It should be noted that, in the present application, the relational terms such as "first" and "second", and the like, are used solely to distinguish one from another entity or action, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
[0050] The foregoing is considered as illustrative only of the principles of the application. Numerous modifications and changes will readily occur to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Accordingly, the scope of the application is indicated by the appended claims rather than by the foregoing description, and all changes that come within the meaning and range of equivalents are intended to be embraced therein.
Claims
1. A method for fixing a thermocouple, characterized in that, Includes the following steps: Place the glue application tool (1) of the preset specification on the temperature point to be measured on the part (2) to be measured; Place the end of the thermocouple (3) inside the glue applicator (1) of the preset specification, and inject insulating glue (4) into the glue applicator (1) of the preset specification. The insulating adhesive (4) is cured to fix the thermocouple (3) to the temperature measuring component (2).
2. The method for fixing a thermocouple according to claim 1, characterized in that: The pre-defined adhesive application tool (1) includes a circular post (11) and a handle (12) connected to the circular post (11).
3. The method for fixing a thermocouple according to claim 2, characterized in that: The annular column (11) has a notch (111).
4. The method for fixing a thermocouple according to claim 2, characterized in that: The annular column (11) is provided with position scale (112).
5. The method for fixing a thermocouple according to claim 2, characterized in that, The inner diameter of the annular column (11) is not less than 5 mm.
6. The method for fixing a thermocouple according to claim 1, characterized in that, After the step of curing the insulating adhesive (4) to fix the thermocouple (3) to the temperature measuring component (2), the following steps are also included: A pull-out force test is performed on the thermocouple (3) fixed in the insulating glue (4), and the results of the pull-out force test are used to determine whether the thermocouple (3) fixed in the insulating glue (4) meets the fixing requirements.
7. A method for measuring temperature using a thermocouple, characterized in that, Includes the following steps: Place the glue application tool (1) of the preset specification on the temperature point to be measured on the part (2) to be measured; Place the end of the thermocouple (3) inside the glue applicator (1) of the preset specification, and inject insulating glue (4) into the glue applicator (1) of the preset specification. The insulating adhesive (4) is cured to fix the thermocouple (3) to the temperature measuring component (2); Temperature compensation is performed on the thermocouple (3) fixed in the insulating glue (4).
8. The thermocouple temperature measurement method according to claim 7, characterized in that, The step of temperature compensation for the thermocouple (3) fixed in the insulating adhesive (4) includes the following steps: The thermocouple (3) of the same specification is fixed in contact with the temperature point of the temperature measuring component (2) of the same specification; The temperature of the thermocouple (3) fixed in contact under different ambient temperatures, the temperature of the measured component (2) under different current conditions, and the temperature of the thermocouple (3) fixed in the insulating glue (4) were tested respectively. Temperature compensation was performed on the thermocouple (3) fixed in the insulating glue (4) based on the test results.
9. The thermocouple temperature measurement method according to claim 8, characterized in that, The step of temperature compensation for the thermocouple (3) fixed in the insulating adhesive (4) based on the test results includes the following steps: The thermocouple temperature compensation formula is obtained based on the temperature of the contact-fixed thermocouple (3) and the temperature of the thermocouple (3) fixed in the insulating glue (4). Temperature compensation is performed on the thermocouple (3) fixed in the insulating glue (4) according to the thermocouple temperature compensation formula.
10. An IGBT module, characterized in that, Use the thermocouple fixing method according to claim 1 or the thermocouple temperature measurement method according to claim 7.