Manufacturing apparatus for display device and method of manufacturing display device using same

Abstract

The present application relates to a manufacturing apparatus for a display device including an object having a display panel and a circuit board connected to the display panel, the manufacturing apparatus comprising: a first chuck clamping a first portion of the circuit board and bending the object; and a second chuck clamping the second portion of the display panel.

Description

Technical Field

[0001] This disclosure relates to an apparatus for manufacturing a display device, including a bending device. More specifically, this disclosure relates to an apparatus for manufacturing a display device, including a bending device, and a method for manufacturing a display device using the apparatus. Background Technology

[0002] With the advancement of information technology, the importance of display devices that connect users with information has increased rapidly. As a result, the use of display devices such as liquid crystal displays (“LCDs”), organic light-emitting diode displays (“OLEDs”), and plasma display panels (“PDPs”) has increased.

[0003] The display device includes a display area in which a plurality of pixels are positioned and a peripheral area in which a driving circuit chip for driving the plurality of pixels is positioned.

[0004] The connector may be located in the peripheral area. A printed circuit board (“PCB”), which is one of the moving parts in the display device, may be located in the connector. For example, the circuit board may include a flexible printed circuit board (“FPCB”), etc. Summary of the Invention

[0005] Embodiments of this disclosure provide a manufacturing apparatus for a display device having a reduced dead space.

[0006] Embodiments of this disclosure provide a method for manufacturing a display device using a manufacturing apparatus for a display device.

[0007] According to an embodiment, a manufacturing apparatus for a display device comprising an object having a display panel and a circuit board connected to the display panel is provided. The manufacturing apparatus includes: a first chuck for holding the circuit board and bending the object; and a second chuck for holding the display panel.

[0008] In an embodiment, the manufacturing apparatus may further include a controller that independently controls the operation of the first chuck and the second chuck.

[0009] In an implementation, the controller may further include a first controller that receives the size of the object and determines the movement path for the first chuck and the second chuck based on the size.

[0010] In one implementation, the controller may further include a second controller that determines whether the alignment error between the display panel and the circuit board meets the first reference range.

[0011] In an implementation, the controller may further include a third controller that determines whether the bending error, including the shape error and position error of the bent portion of the object, meets a second reference range.

[0012] In one implementation, the second chuck can move in a direction that reduces the bending error in response to the bending error being outside the second reference range.

[0013] In one embodiment, the bent portion may be located between a first flat portion in the display panel and a second flat portion in the circuit board. After the object is bent, the first and second flat portions may be stacked on top of each other, and the bent portion may have a first radius. The second chuck moves in a direction that reduces bending error, such that the bent portion may have a radius different from the first radius.

[0014] In one embodiment, the manufacturing apparatus for the display device may further include a camera positioned to photograph the side surface of the curved portion.

[0015] In an implementation, the controller may further include a fourth controller that compares alignment error with bending error.

[0016] In one embodiment, the second chuck may further include a vacuum suction cup for vacuuming a portion of the display panel.

[0017] According to an embodiment, the method for manufacturing a display device disclosed herein includes: preparing an object comprising a display panel and a circuit board connected to the display panel; a portion for securing the circuit board; a portion for securing the display panel; and bending the object to form a first flat portion, a second flat portion stacked on the first flat portion, and a curved portion having a first radius between the first flat portion and the second flat portion.

[0018] In an implementation, the method may further include: after bending the object, determining whether the bending error, including the shape error and position error of the bent portion, meets a second reference range.

[0019] In an implementation, the method may further include: modifying the shape of the bent portion in response to a bending error outside a second reference range.

[0020] In one implementation, after modifying the shape of the curved portion, the curved portion may have a second radius different from the first radius.

[0021] In an implementation, the method may further include: determining whether the alignment error of the display panel and the circuit board meets the first reference range after bending the object and before determining whether the bending error meets the second reference range.

[0022] In one implementation, the method can determine whether a bending error meets a second reference range in response to an alignment error meeting a first reference range, wherein the bending error can be determined based on an image of the side surface of the bent portion captured by photography.

[0023] In one implementation, the method may require determining whether the shape error and position error of the curved portion meet the second reference range before modifying the shape of the curved portion, and comparing the alignment error with the bending error.

[0024] In one implementation, the shape of the curved portion can be modified in response to an alignment error less than or equal to a bending error.

[0025] In an implementation, the method may further include: inputting the dimensions of the object before jamming it; and generating a first movement path for forming the curved portion and a second movement path for modifying the shape of the curved portion based on the dimensions.

[0026] In one implementation, the method requires vacuuming the portion of the display panel that is stuck in place.

[0027] According to an embodiment, a manufacturing apparatus for a display device comprising an object having a display panel and a circuit board connected to the display panel may include: a first chuck for holding a first portion of the circuit board and bending the object; and a second chuck for holding a second portion of the display panel. The first chuck is used to achieve the bent shape, and the second chuck is used to precisely control the bent shape, thereby enabling the manufacture of a borderless display device with reduced dead space by using a manufacturing apparatus for a display device and a method for manufacturing a display device using the manufacturing apparatus for a display device.

[0028] Furthermore, the manufacturing apparatus for the display device may also include a controller that independently controls the operation of the first chuck and the second chuck. The controller may include a first controller that takes the dimensions of an object as input and generates the movement paths of the first and second chucks based on those dimensions. Therefore, various bending trajectories can be achieved using a single apparatus, and display devices of various sizes can be manufactured.

[0029] Furthermore, the controller included in the manufacturing apparatus for the display device can determine whether the alignment error of the display panel and the circuit board meets a first reference range, determine whether the bending error, including the shape error and position error of the bent portion of the object therein, meets a second reference range, and can move the second chuck in a direction that reduces the bending error if the alignment error is less than or equal to the bending error. Therefore, the manufacturing apparatus and manufacturing method for the display device can minimize dead space and simultaneously compensate for alignment errors.

[0030] Furthermore, the manufacturing apparatus for the display device may also include a camera positioned to capture images of the side surface of the curved portion. Therefore, the manufacturing apparatus and method for the display device can inspect the curved shape in real time and control the curved shape more precisely. Attached Figure Description

[0031] The above and other features of the embodiments of this disclosure will become more apparent from the following description and accompanying drawings.

[0032] Figure 1 and Figure 2 An apparatus for manufacturing a display device according to an embodiment of the present disclosure is shown.

[0033] Figure 3 Is included Figure 1 A block diagram of a controller used in a manufacturing apparatus for a display device.

[0034] Figure 4 , Figure 5 and Figure 6 It shows the components included in Figure 1 and Figure 2 Images captured by a camera in a manufacturing apparatus used for display devices.

[0035] Figure 7 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0036] Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 It is shown Figure 7 A diagram illustrating the manufacturing method of a display device.

[0037] Figure 16 Is using Figure 1 Manufacturing apparatus for display devices and Figure 7 A top view of the display panel of a display device manufactured using a method for manufacturing a display device.

[0038] Figure 17 It is along Figure 16 A sectional view taken by line X-X'. Detailed Implementation

[0039] This disclosure can be modified and varied in many ways, and certain embodiments of this disclosure are intended to be described in detail with reference to the accompanying drawings. The effects and features of this disclosure, as well as the methods for achieving these effects and features, will be elucidated through the embodiments described in detail with reference to the accompanying drawings. However, it should be understood that this disclosure is not limited to the embodiments disclosed below, and can cover various forms or modifications within the scope of those skilled in the art.

[0040] When describing embodiments of this disclosure with reference to the accompanying drawings, the same or similar elements may be identified using the same reference numerals, and redundant descriptions thereof may be omitted.

[0041] In the following description, terms such as “first”, “second”, etc., may be used only to distinguish one element from another and are not intended to be used in a limiting sense.

[0042] In the following description, unless the context clearly indicates otherwise, singular expressions may include plural expressions.

[0043] In the following description, terms such as “including,” “having,” “comprising,” and variations thereof may indicate the presence of a feature or element described in the specification, but do not exclude the possibility of the presence of additional features or elements.

[0044] In the following description, when a portion of a layer, region, or element is referred to as being "on" another portion of a layer, region, or element, it can indicate not only that the portion of the layer, region, or element is directly on the other portion of the layer, region, or element, but also that the portion of the layer, region, or element is indirectly disposed on the other portion of the layer, region, or element (i.e., a third layer, third region, or third element may be inserted between the two layers, regions, or elements).

[0045] In the accompanying drawings, the dimensions of elements may be exaggerated or reduced for ease of illustration. For example, the dimensions and thickness of each element or configuration shown in the drawings are arbitrarily illustrated for ease of illustration, and this disclosure is not necessarily limited to what is shown.

[0046] In the following description, the first direction, the second direction, and the third direction may indicate directions along the x-axis, the y-axis, and the z-axis, but this disclosure is not limited to the three axes of a Cartesian coordinate system. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but they may also indicate different directions that are not orthogonal to each other.

[0047] If different implementation methods are possible, the specific process sequence can be performed in a different order than that described. For example, two processes described consecutively can be performed substantially simultaneously, or they can be performed in the reverse order of their description.

[0048] Figure 1 and Figure 2 An apparatus for manufacturing a display device according to an embodiment of the present disclosure is shown.

[0049] refer to Figure 1 and Figure 2 According to embodiments of the present disclosure, the manufacturing apparatus 1 for a display device may include a housing HO, a stage ST, a first chuck CK1, a driver DRS, an aligner AL, a first sensor VI1, a second sensor VI2, a third sensor VI3, a fourth sensor VI4, and a controller CO.

[0050] Manufacturing apparatus 1 for a display device according to embodiments of the present disclosure may include a bending device for bending a portion of an object OB to be processed.

[0051] The housing HO may include multiple frames, plates, etc. For example, the housing HO may have a cavity form. However, this disclosure is not limited thereto.

[0052] Object OB may include electronic components and adhesive AD. The electronic components may include a display panel PA and a circuit board CB connected to the display panel PA.

[0053] Some or all of the object OB can be flexible. For example, the substrate of the display panel PA may include plastic, and the circuit board CB may also include plastic. In this case, the display panel PA and the circuit board CB can be bent in whole or in part.

[0054] For example, the display panel PA and circuit board CB may include: a display panel PA and circuit board CB comprising a glass substrate and a driver integrated chip (“IC”) (“Chip-on-Glass (“COG” method).

[0055] For example, the film on which a thin-film printed circuit having a display panel PA and a driver IC is formed can be located on a glass substrate, and the circuit board CB can be located on the film (chip-on-film (“COF” method).

[0056] For example, the display panel PA, driver IC, and circuit board CB can be located on a polyimide substrate (chip-on-plastic (“COP” method).

[0057] For example, an electronic component may include a first surface S1 and a second surface S2 (see...) Figure 8 For example, the first surface S1 may (e.g., on a third-direction DR3) be opposite the second surface S2. For example, the first surface S1 may be adjacent to the stage ST, and the second surface S2 may be farther away from the stage ST than the first surface S1 (see [link to documentation]). Figure 8 ).

[0058] The display area may be defined in a second surface of the display panel PA or in a first surface of the display panel PA. For example, the display area may be defined in the second surface, and the first surface may be a back surface on which no display area is formed.

[0059] For example, object OB can be mounted on stage ST. Stage ST can include chuck CS. Chuck CS can be a device for securing electronic components to stage ST. For example, chuck CS can include electrostatic chuck, adhesive chuck, clamp, fixture, flow path connected to pump, etc.

[0060] For example, such as Figure 1As depicted, the first chuck CK1 can be located on the housing HO.

[0061] In one embodiment, the first chuck CK1 can hold a portion of the object OB and bend that portion. For example, the first chuck CK1 may include a first support, a first linear actuator, and a first rotator.

[0062] For example, the first support member may extend in a third direction DR3. For example, the third direction DR3 may be in a direction that intersects with the surface of the housing HO.

[0063] For example, the surface of the shell HO can be defined by a first direction DR1 and a second direction DR2. The first direction DR1, the second direction DR2, and the third direction DR3 can intersect each other. For example, the first direction DR1, the second direction DR2, and the third direction DR3 can be perpendicular to each other. The third direction DR3 can be the direction opposite to the direction of gravity.

[0064] For example, the first linear actuator may be connected to the first support and may move linearly in one direction (e.g., in a first direction DR1, a second direction DR2, and / or a third direction DR3). For example, the first linear actuator may include a ball screw and a motor connected to the ball screw. However, this disclosure is not limited thereto. For example, the first linear actuator may include pulleys and belts, a linear motor, etc.

[0065] For example, the first rotator may include a first chuck device and a first rotating device.

[0066] For example, the first chuck assembly may include an electrostatic chuck, an adhesive chuck, clamps, fixtures, a flow path connected to a pump, etc. For example, the first chuck assembly can hold the object OB by avoiding terminals, pads, conductors, etc., formed on the object OB. For example, the first chuck assembly can hold the clamping portion T.

[0067] For example, the first rotator may include a rotary motor and a gear unit connected to the rotary motor, a rotary cylinder, a rotary pulley connected to the rotary motor, a rotary belt connected to the rotary pulley, etc. However, this disclosure is not limited thereto. For example, the first rotator may follow an optional curved path (e.g., Figure 10 The first movement path WD1) moves.

[0068] According to the embodiment, a portion of the display panel PA (i.e., the first curved portion) (see reference) Figure 4 , Figure 5 and Figure 6The curved portions BA and BA' of the display panel PA can be bent. For example, the first curved portion of the display panel PA may not include terminals, pads, wires, etc. Furthermore, pixels may not be located in the first curved portion. However, this disclosure is not limited to any particular location of the pixels. For example, a portion of the circuit board CB (i.e., the second curved portion) (not shown) may be bent. Terminals, pads, wires, etc. may not be formed in the second curved portion.

[0069] In the implementation, the first chuck CK1 can hold the first part of the circuit board CB (e.g., Figure 4 The first part PA1). After the first part of the circuit board CB is locked in place, the first part can be bent. Therefore, the position on the circuit board CB can be changed on the third direction DR3 (i.e., from the bottom part to the top). At this time, the display panel PA can also be moved. Therefore, a part of the display panel PA can be bent so that the two parts of the second side surface (e.g., reference) Figure 11 They face each other. However, this disclosure is not limited to this implementation.

[0070] As described above, the first chuck CK1 can move linearly in the first direction DR1 and / or in the third direction DR3, and can rotate at an optional angle. However, this is merely an example, and the structure of the first chuck CK1 can be modified in various ways.

[0071] For example, the first chuck CK1 may also include a pusher. The pusher may be connected to the first chuck CK1, or it may be a separate device from the first chuck CK1. For example, the pusher may include a ball screw and a motor or pressurizing cylinder connected to the ball screw. However, this disclosure is not limited thereto.

[0072] For example, a pusher can apply pressure to an object OB. Therefore, a portion of the second side surface of the display panel PA and a portion of the second side surface of the circuit board CB can be bonded to adhesive AD.

[0073] For example, the second chuck CK2 can be located on the housing HO. Figure 1 As depicted, the first chuck CK1 and the second chuck CK2 can be positioned adjacent to each other.

[0074] In one implementation, the second chuck CK2 can hold a portion of the electronic component and modify its curved shape. For example, the second chuck CK2 may include a second support, a second linear actuator, and a second rotator.

[0075] For example, the second support member may extend onto DR3 from a third party. For example, the first and second supports members may be identical.

[0076] For example, the second linear actuator may be connected to the second support and may move linearly in one direction (e.g., in a first direction DR1, in a second direction DR2, and / or in a third direction DR3). For example, the second linear actuator may include a ball screw and a motor connected to the ball screw. However, this disclosure is not limited thereto. For example, the second linear actuator may include pulleys and belts, etc.

[0077] The second rotary device may include a second chuck assembly (e.g., Figure 4 , Figure 5 and Figure 6 The second chuck device (PP) and the second rotating device.

[0078] In one embodiment, the second chuck assembly (included in the second chuck CK2) may include a vacuum suction cup. The vacuum suction cup can vacuum-pump a portion of the display panel PA.

[0079] However, this disclosure is not limited thereto. For example, a physical chuck (e.g., clamps, etc.) can be used if there is no risk of physical damage, or an electrostatic chuck can be used if there is no risk such as a short circuit. For example, the second chuck device can avoid terminals, pads, conductors, etc. formed in the object OB when it is clamped.

[0080] For example, the second rotator may include a rotary motor and a gear unit connected to the rotary motor, a rotary cylinder, a rotary pulley connected to the rotary motor, a rotary belt connected to the rotary pulley, etc. However, this disclosure is not limited thereto. For example, the second rotator may modify the bending path.

[0081] In the implementation, the second chuck CK2 can hold the second part of the display panel PA (e.g., Figure 4 The second part, PA2). For example, if the display panel PA and the circuit board CB are connected by a film (COF method), the second chuck CK2 can hold the film in place.

[0082] For example, the first chuck CK1 and the second chuck CK2 can perform the bending process while minimizing the risk of breakage. With the second portion of the display panel PA held in place, the object OB can be bent using the first chuck CK1. Subsequently, the second chuck CK2 can move and modify the shape of the first and / or second bent portions.

[0083] As described above, the second chuck CK2 can move linearly in the first direction DR1 and / or in the third direction DR3, and can rotate at an optional angle. Furthermore, the second chuck CK2 can also be driven by the first chuck CK1 or controlled independently by the first chuck CK1. However, this is just an example, and the structure of the second chuck CK2 can be modified.

[0084] For example, the second chuck CK2 may also include a damper. The damper may include a cylinder, etc. When a certain force is applied, the cylinder can suppress the bending portion (e.g., the first bending portion and / or the second bending portion). However, this disclosure is not limited thereto. The damper may include a variety of devices.

[0085] The actuator DRS can be located between the housing HO and the stage ST. For example, the actuator DRS can move the stage ST in one direction (e.g., in the first direction DR1). For example, the actuator DRS may include a ball screw and a motor, linear motor, variable cylinder, etc. connected to the ball screw.

[0086] The aligner AL can be located on the stage ST. For example, the aligner AL can adjust the position of the stage ST. For example, the aligner AL can move the stage ST in a first direction DR1 and / or in a second direction DR2. With the aligner AL, the stage ST can move linearly in the first direction DR1 and / or in the second direction DR2, or it can rotate. For example, the aligner AL may include a motor, cylinder, etc.

[0087] For example, the first sensor VI1 may be located on the moving path of the stage ST. For example, the first sensor VI1 may be located between the initial position of the stage ST and the first chuck CK1. The first sensor VI1 can detect the first position of the object OB on the stage ST. For example, the first sensor VI1 may include a charge-coupled device (CCD), a camera, etc.

[0088] For example, the second sensor VI2 may be spaced apart from the first chuck CK1 on the third-direction DR3. The second sensor VI2 can detect the position of the object OB below the first chuck CK1. For example, the second sensor VI2 may include a CCD, a camera, etc.

[0089] For example, the first sensor VI1 and the second sensor VI2 can be the same type of device, or they can be different devices.

[0090] For example, the first sensor VI1 can detect the first position of the object OB on the stage ST by means of a first alignment mark A1 formed on the display panel PA. For example, the first alignment mark A1 can be formed on the display panel PA.

[0091] After alignment based on the first alignment mark A1, the object OB can be moved toward the first chuck CK1. At this time, the driver DRS can move the stage ST so that the object OB can be adjacent to the first chuck CK1. However, this disclosure is not limited thereto. For example, the stage ST can be fixed, and the first chuck CK1 can be movable.

[0092] For example, the second sensor VI2 can detect the position of the object OB below the first chuck CK1 by means of a second alignment mark A2 formed on the circuit board CB. For example, the second alignment mark A2 can be formed on the circuit board CB.

[0093] The second alignment mark A2 allows for the determination of the positioning accuracy of the bending adhesion process. For example, if the second alignment mark A2 is within a selectable range compared to the reference alignment mark, it can be determined that the bending adhesion process was performed at the correct location. However, if the second alignment mark A2 is outside the selectable range compared to the reference alignment mark, it can be determined that the bending adhesion process was performed at the wrong location, resulting in poor adhesion. In the case of poor adhesion, breakage or damage to electronic components may occur due to stress concentration after bending.

[0094] In one embodiment, the third sensor VI3 and the fourth sensor VI4 may be positioned to capture images of the side surface of the curved portion (e.g., the first curved portion and the second curved portion). In another embodiment, the third sensor VI3 and the fourth sensor VI4 may include a CCD, a camera, etc.

[0095] For example, the third sensor VI3 and the fourth sensor VI4 can be connected to the station ST and can move together with the station ST.

[0096] For example, the third sensor VI3 and the fourth sensor VI4 can be located on opposite sides of the stage ST (i.e., the left and right sides), respectively. The third sensor VI3 and the fourth sensor VI4 can detect a portion of the object OB (see reference). Figure 4 , Figure 5 and Figure 6 For example, after bending an object OB, the left and right sides may end up with different shapes. In this case, the left and right sides are controlled independently using a third sensor VI3 and a fourth sensor VI4, which can capture images of the left and right sides of the bent portion.

[0097] The following will be referenced Figure 4 , Figure 5 and Figure 6 Detailed description of the third sensor VI3 and the fourth sensor VI4.

[0098] The controller CO can control the operation of the first sensor VI1, the second sensor VI2, the third sensor VI3, the fourth sensor VI4, the stage ST, the first chuck CK1, and the second chuck CK2.

[0099] For example, the controller CO can be equipped with a separate device, or it can be embedded in the device as a computer program, etc. However, this disclosure is not limited to any particular form of controller CO.

[0100] In one implementation, the controller CO can control the first sensor VI1, the second sensor VI2, the third sensor VI3, and the fourth sensor VI4 to generate an input image. Furthermore, the controller CO can independently control the operation of the console ST, the first chuck CK1, and the second chuck CK2 by providing the input image. For example, the controller CO can linearly drive the console ST, the first chuck CK1, and the second chuck CK2. Alternatively, the controller CO can control the first chuck CK1 and the second chuck CK2 to be driven simultaneously. In another implementation, the controller CO can control the operation so that only the second chuck CK2 is driven.

[0101] The following will be referenced Figure 3 A detailed description of the controller CO.

[0102] Figure 1 and Figure 2 This is an example, and this disclosure is not limited to... Figure 1 and Figure 2 The content is explicitly disclosed in the document. For example, the manufacturing apparatus 1 for the display device may include more components (multiple components), or all or part of the components may be omitted / replaced.

[0103] For example, in Figure 1 In this embodiment, the bending arm BAR is described as including a first chuck CK1 and a second chuck CK2; however, this disclosure is not limited thereto. For example, the bending arm BAR for performing the bending process may only include the first chuck CK1, and the second chuck CK2 may be included in a separate device. In this case, after the bending process is performed using the bending arm BAR, the shape of the bent portion can be modified by the second chuck CK2 (through the moving cavity). In another embodiment, the bending arm BAR for performing the bending process may include the first chuck CK1, and the second chuck CK2 may be separately provided (in the same cavity). In this case, after the bending process and shape modification process of the bent portion are completed, the object OB can be moved to another cavity. However, this disclosure is not limited thereto.

[0104] Figure 3 It is shown that it includes Figure 1 A block diagram of a controller used in a manufacturing apparatus for a display device.

[0105] refer to Figure 1 , Figure 2 and Figure 3 In the implementation, the controller CO may include a first controller CO1, a second controller CO2, a third controller CO3, and a fourth controller CO4.

[0106] For example, when controller CO is configured in the form of a program, the first controller CO1, the second controller CO2, the third controller CO3, and the fourth controller CO4 can each perform the function of the program. However, this disclosure is not limited thereto.

[0107] In the implementation, the first controller CO1 can be input with respect to the size of the object OB (e.g., Figure 9 The dimensions SZ are used to generate the movement paths of the first chuck CK1 and the second chuck CK2 based on the dimensions.

[0108] In the manufacturing apparatus for a display device according to the first comparative embodiment, the display panel PA can be fixed to the stage ST, the first chuck CK1 can hold the circuit board CB, and the circuit board CB can be bent to achieve a bent shape of the object OB. In this case, the bent shape (e.g., the size and position of the bending radius) can be indirectly controlled by the first chuck CK1. Without using the first chuck CK1, the bent shape is uncontrolled.

[0109] In the manufacturing apparatus for a display device according to the second comparative embodiment, the apparatus can control the size of the bending radius. For example, the display panel PA can be fixed to the stage ST, the first chuck CK1 can hold the circuit board CB, and the circuit board CB can be bent to achieve a desired bending shape of the object OB. At this time, since the first chuck CK1 is driven linearly, the size of the bending radius can be different at the beginning of the bending state and at the end of the bending state. For example, the bending radius at the end of the bending state can be smaller than the bending radius at the beginning of the bending state.

[0110] In the manufacturing apparatus for a display device according to the third comparative embodiment, the apparatus can control the bending shape. For example, the bending shape can be realized on a stage ST. For example, the bending shape can have an "L" shape. However, this disclosure is not limited thereto. For example, a display panel PA can be fixed to the stage ST, a first chuck CK1 can hold a circuit board CB, the circuit board CB can be bent and located on the display panel PA and is pressurized. In this case, the bending shape is pre-realized in the stage ST such that the portions of the display panel PA and the circuit board CB that are pressurized can have the same / similar form as the pre-realized bending shape.

[0111] The manufacturing apparatus for a display device according to the comparative embodiment cannot directly control the bending shape. For example, the bending shape can be formed indirectly by a bending process (e.g., by a linear drive and / or rotator according to the RΘ coordinate system), or the bending shape can be achieved before the object OB is placed on the stage ST.

[0112] The manufacturing apparatus for the display device according to embodiments of the present disclosure can use a first chuck CK1 to realize a curved shape and a second chuck CK2 to precisely control the curved shape (e.g., bending radius, position, etc.) to manufacture a borderless display device with reduced dead space.

[0113] For example, if the second chuck CK2 holds part of the display panel PA in place, the bending shape can be further modified after the bending process. For example, as the bending process proceeds, the bending shape can be modified to finely adjust the bending radius (e.g., to make the bending radius smaller).

[0114] For example, the second chuck CK2 can use two linear actuators and a rotator based on the YZΘ coordinate system. For example, the bending trajectory can include N segments (e.g., N is a natural number of 2 or greater). The first controller CO1 can more precisely control the length, orientation, etc., of each segment of the bending shape. Therefore, various bending trajectories can be implemented using a single device, and display devices with multiple sizes can be manufactured.

[0115] In this implementation, the second controller CO2 can determine whether the alignment error between the display panel PA and the circuit board CB meets a first reference range. For example, if the alignment error meets the first reference range, it is determined that the quality standard is met. If the alignment error is outside the first reference range, it can be determined that the product is defective. For example, the alignment error is a tolerance of the material itself, and the attachment process of the display panel PA and the circuit board CB can vary depending on the tolerance of the object OB.

[0116] For example, the alignment error can be determined based on the first alignment mark A1, the second alignment mark A2, an image of the first alignment mark A1 captured by the first sensor VI1, and an image of the second alignment mark A2 captured by the second sensor VI2.

[0117] In this implementation, the third controller CO3 can determine whether the bending error, including the shape error and positional error of the bent portion (which is the part of the object OB that is bent), meets a second reference range. For example, the border can also be referred to as dead space. Dead space can refer to an area in which no pixels are positioned. The second reference range can include the size, position, etc. of the border. For example, if the bending error meets the second reference range, it is determined that the quality standard is met. On the other hand, if the bending error is outside the second reference range, it can be determined to be defective. For example, the bent portion can also be included in the dead space in which no pixels are positioned.

[0118] For example, the bending error can be determined using a third sensor VI3 and a fourth sensor VI4. For example, the third sensor VI3 and the fourth sensor VI4 could be a vision camera that captures images of the bent portion from a side surface.

[0119] The third sensor VI3 and the fourth sensor VI4 can inspect the bending shape in real time, allowing for precise control of the bending shape.

[0120] In this implementation, the fourth controller CO4 can compare alignment error with bending error.

[0121] For example, alignment error and bending error can be traded off. For instance, if the second chuck CK2 is moved to reduce bending error, the alignment error can be larger. The greater the movement of the second chuck CK2, the greater the alignment error can be.

[0122] In order to reduce dead space and minimize alignment error in the display device, the second chuck CK2 can only modify the bending shape when the alignment error is less than or equal to the bending error.

[0123] Figure 4 , Figure 5 and Figure 6 It is shown that it is included by Figure 1 and Figure 2 An image taken by a camera in a manufacturing apparatus used for display devices.

[0124] For example, Figure 4 , Figure 5 and Figure 6 It can be included by Figure 2 The input image is acquired by either the third sensor VI3 or the fourth sensor VI4. For example, Figure 4 The first input image IM1 can be an input image acquired before bending the object OB, and Figure 5 The second input image IM2 can be the input image obtained after bending the object OB using the first chuck CK1, and Figure 6 The third input image IM3 can be the input image obtained after modifying the curved shape using the second chuck CK2.

[0125] refer to Figure 2 and Figure 4 In this embodiment, the object OB may include a display panel PA, a circuit board CB, and an adhesive AD on the display panel PA. For example, the adhesive AD may be located on the display panel PA.

[0126] For example, the adhesive AD can be positioned in various ways depending on the size of the electronic component. For example, the adhesive AD may be located only on a portion of the display panel PA.

[0127] For example, the adhesive AD can include a pressure-sensitive adhesive. For example, a pressure-sensitive adhesive can include an optically transparent adhesive. A pressure-sensitive adhesive can be a material that acts as an adhesive material when pressure is applied to the adhesive surface. An optical adhesive can be a type of pressure-sensitive adhesive. Compared to air-gap structures (i.e., structures filled with air), structures with optical adhesives can improve visibility by minimizing changes caused by reflection and refraction of light at different material layers.

[0128] For example, optical adhesives can include both ultraviolet (UV) adhesives and conventional adhesives. UV adhesives can be adhesives whose modulus increases through UV curing, and conventional adhesives can be adhesives with high modulus that do not require UV curing. However, this disclosure is not limited thereto.

[0129] In this implementation, the object OB can be divided into a first flat portion FA1, a second flat portion FA2, and curved portions BA and BA'. For example, before the object OB is curved, the first flat portion FA1, the second flat portion FA2, and the curved portion BA can be located on substantially the same plane. The first flat portion FA1 can be included in the display panel PA. The second flat portion FA2 can be included in the circuit board CB. The curved portion BA can be located between the first flat portion FA1 and the second flat portion FA2.

[0130] For example, a portion of object OB may be located on stage ST, and the remainder of object OB may be spaced apart from stage ST. For example, a portion of the first flat portion FA1 of display panel PA may be in contact with stage ST, and the remainder of the first flat portion FA1 and circuit board CB may not be in contact with stage ST.

[0131] In this implementation, the first chuck CK1 can hold the first portion PA1 of the circuit board CB. The second chuck CK2 can hold the second portion PA2 of the display panel PA.

[0132] refer to Figure 5 In this implementation, after the object OB has been bent, the first flat portion FA1 and the second flat portion FA2 overlap each other in one direction (e.g., third direction DR3). The bent portion BA may have a first radius R1.

[0133] refer to Figure 6 In this implementation, if the bending error is outside the second reference range, the second chuck CK2 can move in the direction that reduces the bending error. For example, the second chuck CK2 can move in the opposite direction to the first direction DR1 (reference range). Figure 6 (Move upwards to the left). Therefore, the curved portion BA' can have a smaller than 1. Figure 5 The first radius R1 and the second radius R2.

[0134] Figure 1 and Figure 2 The manufacturing apparatus 1 for a display device can be applied to various objects OB. For example, the object OB may include a display panel PA, a backing layer protecting the back of the display panel PA, and an adhesive AD for bonding the display panel PA to the backing layer. For example, the object OB may include a display panel PA, a fingerprint sensor located on the display panel PA, and an adhesive AD for bonding the fingerprint sensor to the display panel PA. For example, the object OB may include a display panel PA, a mold surrounding the outer edge of the display panel PA, and an adhesive AD for bonding the display panel PA to the mold.

[0135] Figure 7 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure. Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 and Figure 15 It is shown Figure 7 A diagram illustrating the manufacturing method of a display device.

[0136] For ease of explanation, references will be omitted or simplified in the following text. Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 Redundant description of the manufacturing apparatus used for display devices.

[0137] refer to Figure 1 , Figure 2 , Figure 7 and Figure 8 An object OB, including a circuit board CB connected to a display panel PA, can be prepared (step S100).

[0138] Figure 1 and Figure 2 The manufacturing apparatus 1 for the display device may include a bending device. Before the bending process using the bending device, the circuit board CB may be pre-attached to the display panel PA. For example, the display panel PA and the circuit board CB may be connected using a COF method. However, this disclosure is not limited thereto. Furthermore, the adhesive AD may also be pre-positioned on the display panel PA.

[0139] Object OB may be located on stage ST. Object OB may include a first side surface S1 and a second side surface S2 that are opposing surfaces (e.g., separated on a third-direction DR3) as components. A portion of the first side surface S1 (e.g., a portion of the display panel PA) may contact stage ST, and another portion of the first side surface S1 may contact circuit board CB.

[0140] refer to Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 7 , Figure 9 and Figure 10 In the implementation, the size SZ of object OB can be input (step S200), and a first movement path WD1 and a second movement path of object OB can be generated based on the size SZ of object OB (e.g., Figure 15 The second moving path WD2 (step S300). In the embodiment, a portion of the circuit board CB can be locked, and a portion of the display panel PA can be locked. Specifically, as Figure 4 As shown, the first part PA1 of the circuit board CB can be held by the first chuck CK1, and the second part PA2 of the display panel PA can be held by the second chuck CK2 (step S400).

[0141] The manufacturing method and apparatus for a display device according to the comparative embodiment cannot directly control the bending shape. In the comparative embodiment, the bending shape can be indirectly controlled through the bending process, or the bending shape can be achieved on the stage ST before the bending process. Therefore, if the dimension SZ of the object OB changes, the update will not be reflected in the comparative embodiment.

[0142] The manufacturing method of the display device according to embodiments of the present disclosure can use a first chuck CK1 to realize a curved shape, and can use a second chuck CK2 to finely adjust the curved shape (e.g., bending radius, position, etc.) to manufacture a borderless display device with reduced dead space. The manufacturing method of the display device according to embodiments of the present disclosure can set a first movement path WD1 and a second movement path WD2 based on the size SZ of the object OB. Therefore, various bending trajectories can be realized.

[0143] The first moving path WD1 can be the path of the first chuck CK1. In other words, the first moving path WD1 can be the path by which the first chuck CK1 moves to form the curved portion BA.

[0144] Second movement path WD2 (see Figure 15The second movement path WD2 can be the path by which the second chuck CK2 moves to modify the shape of the curved portion BA (i.e., the curved shape). For example, it can be modified... Figure 5 The shape of the curved portion BA is used to achieve Figure 6 The shape of the curved part BA'.

[0145] As described above, in the embodiments, the first movement path WD1 and / or the second movement path WD2 may include multiple segments. The manufacturing method of the display device according to the embodiments of this disclosure allows for independent control of the size, position, etc., of each of the multiple segments. Therefore, the shape of the curved portions BA and BA' can be controlled more precisely.

[0146] As described above, in this embodiment, a portion of the display panel PA can be vacuum-squeezed.

[0147] refer to Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 7 and Figure 11 In one implementation, the object OB can be bent to form a first flat portion FA1, a second flat portion FA2 facing the first flat portion FA1 in one direction (e.g., third direction DR3), and a curved portion BA having a first radius R1 and connecting the first flat portion FA1 to the second flat portion FA2. Specifically, the first chuck CK1 can be bent such that the first flat portion FA1 and the second flat portion FA2 are stacked in one direction (e.g., third direction DR3), and the curved portion BA having the first radius R1 connects the first flat portion FA1 and the second flat portion FA2 (step S500). The first chuck CK1 can move along a first movement path WD1.

[0148] For example, the first chuck CK1 can bend the object OB such that a portion of the second side surface S2 of the object OB is formed (e.g., Figure 12 The first surface portion S21 of the second side surface of the display panel PA shown in the diagram and the remaining portions of the second side surface S2 of the object OB (e.g., the second surface portion S22 of the second side surface of the display panel PA and the circuit board CB) can be stacked on the third-party DR3. Adhesive AD can be located between the first surface portion S21 and the second surface portion S22 of the second side surface S2.

[0149] like Figure 4 and Figure 5As shown, before the object OB bends, the first flat portion FA1, the bent portion BA, and the second flat portion FA2 of the object OB can extend in one direction (e.g., a first direction DR1), and after the object OB bends, the first flat portion FA1 and the second flat portion FA2 can be positioned in a direction intersecting that one direction (e.g., a third direction DR3), and the bent portion BA can have a first radius R1 between the first flat portion FA1 and the second flat portion FA2.

[0150] refer to Figure 1 , Figure 2 , Figure 7 and Figure 12 In the implementation, the alignment error between the display panel PA and the circuit board CB can be determined (e.g., Figure 14 Check whether the alignment error ER1 meets the first reference range (step S600).

[0151] Alignment errors can include positional errors of the display panel PA and the circuit board CB.

[0152] For example, alignment errors can be identified using a vision camera (VI). Figure 12 The visual camera VI can correspond to Figure 1 and Figure 2 The first sensor VI1 and the second sensor VI2.

[0153] For example, if the alignment error is outside the range of the first reference range, the display device being manufactured is determined to be defective, and subsequent processes may not be performed.

[0154] refer to Figure 1 , Figure 2 , Figure 7 and Figure 13 In an implementation, if the alignment error meets a first reference range, the bending error can be determined (e.g., Figure 14 Whether the bending error ER2 meets the second reference range (step S700).

[0155] More specifically, if the alignment error meets the first reference range, the bending error can be determined to meet the second reference range using, for example, the dimensional error of the bending radius of the bending portion, the shape error of the bending portion, the positional error of the bending portion, etc.

[0156] In one implementation, the bending error can be determined based on images taken from the side of the bent portion. In another implementation, the bending error can be identified using a vision camera VI'. For example, Figure 13 The visual camera VI' can correspond to Figure 1 and Figure 2The third sensor VI3 and the fourth sensor VI4.

[0157] If the bending error meets the second reference range, the bending process can be terminated.

[0158] refer to Figure 14 In the implementation, the alignment error ER1 can be compared with the bending error ER2 (step S800).

[0159] If the bending error is outside the second reference range, the bending shape can be modified by comparing the alignment error ER1 with the bending error ER2.

[0160] In an implementation, if the alignment error ER1 is less than or equal to the bending error ER2, the bending shape can be modified.

[0161] As described above, the alignment error ER1 and the bending error ER2 can be traded off. For example, if the second chuck CK2 moves in one direction (e.g., in the opposite direction to the first direction DR1) to reduce the bending error ER2, the alignment error ER1 can increase. If the alignment error ER1 is outside the first reference range, the display device can be determined to be defective. Therefore, if the alignment error ER1 is less than or equal to the bending error ER2, the manufacturing method of the display device according to the embodiments of this disclosure can modify the bending shape to reduce dead space.

[0162] If the alignment error ER1 is greater than the bending error ER2, the display device being manufactured can be identified as defective, and the manufacturing process can be stopped.

[0163] refer to Figure 15 In this implementation, if the bending error ER2 is outside the second reference range, the bending shape can be modified. Specifically, if the bending error ER2 is outside the second reference range, the second chuck CK2 can be moved to modify the bending shape (step S900).

[0164] For example, the second chuck CK2 can move in one direction (e.g., in the opposite direction to the first direction DR1). The second movement path WD2 of the second chuck CK2 can be set based on the type, size, alignment error ER1, bending error ER2, etc. of the object OB. Therefore, the bent portion BA' has a radius smaller than the first radius ( Figure 4 The first radius R1) and the second radius ( Figure 5 The second radius R2).

[0165] For example, if the first chuck CK1 and the second chuck CK2 can be connected to a support, then the first chuck CK1 and the second chuck CK2 can be driven simultaneously during bending (see [link]). Figure 11However, when modifying the bending shape, the first chuck CK1 is fixed, while the second chuck CK2 can be moved. Since the second chuck CK2 is controlled independently, the shape of the bent portions BA and BA' can be directly and independently controlled (see reference). Figure 15 ).

[0166] Figure 16 Is using Figure 1 Manufacturing apparatus for display devices and Figure 7 A top view of the display panel of a display device manufactured using a method for manufacturing a display device. Figure 17 It is along Figure 16 A sectional view taken by line X-X'.

[0167] refer to Figure 16 and Figure 17 The display panel (PA) can include multiple layers on the base substrate (SUB). The pads (PADs) can be... Figure 1 The display panel PA and the circuit board BC are connected therein. For example, the pixels included in the display panel PA may include a base substrate SUB, a buffer layer BUF, a display layer DL, and a packaging layer TFE.

[0168] The display layer DL may include a transistor TFT, a gate insulating layer GI, an interlayer insulating layer II, a passivation layer PAS, a light-emitting element LED, and a pixel defining layer PDL.

[0169] The display area DA can include both light-emitting and non-light-emitting areas. For example, a transistor TFT and a light-emitting element LED can be located in the light-emitting area.

[0170] For example, a transistor TFT may include an active layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. A light-emitting element LED may include a first electrode E1, an intermediate layer ML, and a second electrode E2.

[0171] Non-luminous areas can surround luminous areas in a plan view. Here, "plan view" can refer to a view along a third direction DR3.

[0172] The base substrate (SUB) can include glass, quartz, plastic, SUS, titanium (“Ti”), etc. For example, the base substrate (SUB) can have flexible, bendable, or rollable properties.

[0173] A buffer layer BUF can be disposed on a base substrate SUB. The buffer layer BUF may include an inorganic insulating material. For example, the buffer layer BUF may include silicon oxide, silicon nitride, silicon oxide nitride, etc. The buffer layer BUF can prevent impurities from diffusing into the active layer ACT of the transistor TFT or damaging the active layer ACT of the transistor TFT. However, this disclosure is not limited thereto. For example, the buffer layer BUF may include an organic insulating material.

[0174] The active layer ACT can be disposed on the buffer layer BUF. According to embodiments, the active layer ACT may include silicon semiconductor materials. For example, the active layer ACT may include amorphous silicon, polycrystalline silicon, etc. According to embodiments, the active layer ACT may include oxide semiconductor materials. For example, the active layer ACT may include zinc oxide, zinc tin oxide, zinc indium oxide, indium oxide, titanium oxide, indium gallium zinc oxide, indium zinc tin oxide, etc. According to embodiments, the active layer ACT may include organic semiconductor materials.

[0175] The active layer ACT may include a source region SEA, a drain region DEA, and a channel region CHA interposed between the source region SEA and the drain region DEA.

[0176] For example, the active layer ACT can be formed by depositing an amorphous silicon layer on the buffer layer BUF, crystallizing the amorphous silicon layer, and patterning the crystallized silicon layer. For example, depending on the type of transistor TFT (e.g., driving transistor, switching transistor, etc.), the active layer ACT can be doped with impurities in the source region SEA and the drain region DEA.

[0177] A gate insulating layer GI can be disposed on the active layer ACT. The gate insulating layer GI can include inorganic insulating materials. For example, the gate insulating layer GI can include silicon oxide, silicon nitride, silicon nitride, titanium oxide, tantalum oxide, etc. The gate insulating layer GI electrically insulates the active layer ACT from the gate electrode GE.

[0178] The gate electrode GE can be disposed on the gate insulating layer GI. The gate electrode GE can include a conductive material. For example, the gate electrode GE can include a metal, alloy, conductive metal oxide, transparent conductive material, etc. A gate signal can be applied to the gate electrode GE. The gate signal can turn the transistor TFT on / off to adjust the conductivity of the active layer ACT.

[0179] Interlayer insulation layer II may be disposed on the gate electrode GE. Interlayer insulation layer II may include organic insulating materials and / or inorganic insulating materials. Interlayer insulation layer II can electrically insulate the source electrode SE and drain electrode DE from the gate electrode GE.

[0180] The source electrode SE and drain electrode DE can be disposed on the interlayer insulating layer II. The source electrode SE and drain electrode DE can include conductive materials. For example, the source electrode SE and drain electrode DE can include metals, alloys, conductive metal oxides, transparent conductive materials, etc.

[0181] The source electrode SE and drain electrode DE can be electrically contacted with the active layer ACT through contact holes H1 that pass through the interlayer insulating layer II and the gate insulating layer GI. For example, through contact holes H1 in the interlayer insulating layer II and the gate insulating layer GI, the source electrode SE can be connected to the source region SEA and the drain electrode DE can be connected to the drain region DEA.

[0182] The passivation layer PAS can be disposed on the source electrode SE and the drain electrode DE. The passivation layer PAS can include an organic insulating material. For example, the passivation layer PAS can include polyacrylic acid resin, polyimide-based resin, acrylic acid-based resin, etc. The top surface of the passivation layer PAS can be substantially flat. For example, the passivation layer PAS can be formed using a transparent insulator to achieve a resonant effect. For example, the passivation layer PAS can include two or more layers containing organic and / or inorganic substances. However, this disclosure is not limited thereto.

[0183] In another embodiment, the top surface of the passivation layer PAS can be formed to be curved according to the curvature of the underlying layer. In this case, the passivation layer PAS may also comprise an inorganic insulating material.

[0184] The first electrode E1 can be disposed on the passivation layer PAS. The first electrode E1 may include a conductive material. For example, the first electrode E1 may include a metal, an alloy, a conductive metal oxide, a transparent conductive material, etc.

[0185] The first electrode E1 can be electrically connected to the source electrode SE or the drain electrode DE through the contact hole H2 passing through the passivation layer PAS. According to the embodiment, the first electrode E1 can be referred to as the anode electrode.

[0186] A pixel defining layer (PDL) may be disposed on the passivation layer (PAS) and cover a portion of the first electrode (E1). The pixel defining layer (PDL) may include an organic insulating material. For example, the pixel defining layer (PDL) may include a polyacrylic acid compound, a polyimide-based compound, etc. The pixel defining layer (PDL) may include pixel openings to delineate the light-emitting regions of the pixels. The pixel openings defined in the pixel defining layer (PDL) may extend to the first electrode (E1).

[0187] An intermediate layer ML can be disposed on the first electrode E1 within a pixel aperture. The intermediate layer ML may include an organic light-emitting material. According to an embodiment, the intermediate layer ML may have a multilayer structure including various functional layers. For example, the intermediate layer ML may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0188] The second electrode E2 can be disposed on the intermediate layer ML and cover the pixel defining layer PDL. According to an embodiment, the second electrode E2 can be referred to as a cathode electrode.

[0189] In addition, the intermediate layer ML and the second electrode E2 can be formed on the first electrode E1.

[0190] The first electrode E1 and the second electrode E2 can be separated from each other through the intermediate layer ML, and light can be emitted from the organic light-emitting layer by applying voltages of different polarities to the intermediate layer ML. On the other hand, a unit pixel can include multiple sub-pixels, and the multiple sub-pixels can emit light of various colors. For example, each of the multiple sub-pixels can emit any one of red, green, and blue light. However, this disclosure is not limited thereto. For example, the multiple sub-pixels can emit white light.

[0191] The encapsulation layer TFE can have a multilayer structure. For example, the encapsulation layer TFE may include at least one organic layer interposed between at least two inorganic layers. For example, the encapsulation layer TFE may include at least one inorganic layer interposed between at least two organic layers. For example, the encapsulation layer TFE may include at least one organic layer interposed between at least two inorganic layers and at least one inorganic layer interposed between at least two organic layers.

[0192] For example, the encapsulation layer TFE may include an organic layer. For example, the organic layer may include a polymer. For example, the polymer may include polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, polyacrylate, etc. Each of these may be used alone or in combination with each other. However, this disclosure is not limited thereto. The organic layer may include a polymeric monomer composition material. For example, the monomer composition may include monoacrylate-based monomers, deacrylate-based monomers, triacrylate-based monomers, photoinitiators such as TPO (2,4,6-trimethylbenzoyl-diphenylphosphine oxide), etc. Each of these may be used alone or in combination with each other. However, this disclosure is not limited thereto.

[0193] For example, the TFE encapsulation layer may include an inorganic layer. For example, the inorganic layer may include a metal oxide or a metal nitride. For example, the inorganic layer may include SiN. x Al2O3, SiO2, TiO2, etc. Each of them can be used alone or in combination with each other. However, this disclosure is not limited thereto.

[0194] For example, the encapsulation layer TFE may include a first inorganic layer, a first organic layer, and a second inorganic layer stacked sequentially from the top of the light-emitting element LED. For example, the encapsulation layer TFE may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer stacked sequentially from the top of the light-emitting element LED. For example, the encapsulation layer TFE may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, a third inorganic layer, a third organic layer, and a fourth inorganic layer stacked sequentially from the top of the light-emitting element LED.

[0195] An inorganic layer may be formed on the top layer of the TFE encapsulation layer, which is the outermost layer of the display panel PA, to prevent moisture from penetrating into the light-emitting element LED. However, this disclosure is not limited thereto.

[0196] A metal halide layer may also be included between the light-emitting element (LED) and the first inorganic layer. For example, the metal halide layer may include lithium fluoride (“LiF”). When the first inorganic layer is formed by sputtering, the metal halide layer can prevent damage to the LED. However, this disclosure is not limited thereto.

[0197] The manufacturing apparatus for display devices according to embodiments of the present disclosure can be applied to the manufacturing process of display devices used in computers, laptops, mobile phones, smartphones, smart tablets, PMPs, PDAs, MP3 players, etc.

[0198] Although embodiments of this disclosure have been described above with reference to them, it will be understood that modifications and alterations to this disclosure can be made in various ways by those skilled in the art without substantially departing from the novel teachings and advantages of this disclosure. Therefore, it will be understood that all such modifications are intended to be included within the scope of this disclosure as defined in the appended claims.

Claims

1. An apparatus for manufacturing a display device, the display device comprising an object having a display panel and a circuit board connected to the display panel, the manufacturing apparatus comprising: A first chuck clamps the circuit board and bends the object; as well as The second chuck locks the display panel in place.

2. The manufacturing apparatus according to claim 1, further comprising: The controller independently controls the operation of the first chuck and the second chuck.

3. The manufacturing apparatus according to claim 2, wherein, The controller includes a first controller that receives the dimensions of the object and determines movement paths for the first chuck and the second chuck based on the dimensions.

4. The manufacturing apparatus according to claim 2, wherein, The controller includes a second controller that determines whether the alignment error between the display panel and the circuit board meets a first reference range.

5. The manufacturing apparatus according to claim 4, wherein, The controller also includes a third controller for determining whether the bending error, including the shape error and position error of the bent portion of the object, meets the second reference range.

6. The manufacturing apparatus according to claim 5, wherein, The second chuck moves in a direction that reduces the bending error in response to the bending error being outside the second reference range.

7. The manufacturing apparatus according to claim 6, wherein, The curved portion is located between the first flat portion in the display panel and the second flat portion in the circuit board. After the object is bent, the first flat portion and the second flat portion stack on top of each other, and the bent portion has a first radius, and The second chuck moves in the direction that reduces the bending error, such that the bent portion has a second radius different from the first radius.

8. The manufacturing apparatus according to claim 7, further comprising: The camera is positioned to capture images of the side surface of the curved portion.

9. The manufacturing apparatus according to claim 5, wherein, The controller also includes a fourth controller that compares the alignment error with the bending error.

10. The manufacturing apparatus according to claim 1, wherein, The second chuck includes a vacuum suction cup for vacuuming a portion of the display panel.

11. A method for manufacturing a display device, comprising: Prepare an object including a display panel and a circuit board connected to the display panel; The portion that is jamming the circuit board; The part that is stuck in the display panel; as well as The object is bent to form a first flat portion, a second flat portion stacked on the first flat portion, and a curved portion having a first radius between the first flat portion and the second flat portion.

12. The manufacturing method according to claim 11, further comprising: After bending the object, it is determined whether the bending error, including the shape error and position error of the bent portion, meets the second reference range.

13. The manufacturing method according to claim 12, further comprising: The shape of the bent portion is modified in response to the bending error being outside the second reference range.

14. The manufacturing method according to claim 13, wherein, After modifying the shape of the curved portion, the curved portion has a second radius different from the first radius.

15. The manufacturing method according to claim 13, further comprising: After bending the object and before determining whether the bending error meets the second reference range, determine whether the alignment error of the display panel and the circuit board meets the first reference range.

16. The manufacturing method according to claim 15, further comprising: In response to the alignment error satisfying the first reference range, it is determined whether the bending error satisfies the second reference range, wherein the bending error is determined based on an image of the side surface of the bent portion taken by photography.

17. The manufacturing method according to claim 15, further comprising: Before modifying the shape of the curved portion, it is determined whether the shape error and the position error of the curved portion meet the second reference range, and Compare the alignment error with the bending error.

18. The manufacturing method according to claim 17, wherein, The shape of the bent portion is modified in response to the alignment error being less than or equal to the bending error.

19. The manufacturing method according to claim 13, further comprising: Enter the dimensions of the object before it gets stuck; as well as Based on the dimensions, a first movement path is generated for forming the curved portion and a second movement path is generated for modifying the shape of the curved portion.

20. The manufacturing method of claim 11, further comprising vacuum-suctioning the portion of the display panel while the portion of the display panel is locked.

Images