Method for forming multiple product patterns on large-size wafer
By spraying imprinting adhesive onto the graphic structure layer of the imprinting template and transferring it onto a large-size wafer, the problems of low utilization rate of large-size wafers and template contamination are solved, achieving more efficient product pattern reproduction and cost savings.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-22
- Publication Date
- 2026-03-24
AI Technical Summary
When forming multiple product patterns on large-size wafers using existing technologies, non-product patterns occupy space, resulting in low wafer utilization. Furthermore, traditional spin-coating and imprinting adhesives contaminate the template, affecting efficiency and cost.
The method involves spraying imprinting adhesive onto the graphic structure layer of the imprinting template and transferring it onto a large-size wafer. Only the graphic structure is reproduced, avoiding the reproduction of non-product patterns, reducing the amount of imprinting adhesive used, and improving the reproduction efficiency and template reusability.
This improves the utilization rate of large-size wafers, reduces the amount of imprinting adhesive used, lowers costs, increases production efficiency, and ensures that the secondary use of the template is not affected.
Smart Images
Figure CN121721901A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of diffractive waveguide fabrication technology, and more particularly to a method for forming multiple product patterns on a large-size wafer. Background Technology
[0002] With the growing demand for augmented reality glasses in the consumer market, increasing the production capacity of augmented reality waveguide lenses is urgently needed.
[0003] Currently, most manufacturers primarily produce 4-inch wafers. A single 4-inch wafer and its corresponding 4-inch template can only accommodate a maximum of two waveguide lenses, severely limiting equipment capacity. To improve production efficiency, manufacturers are gradually shifting towards producing larger wafers. Currently, the method for fabricating multiple product patterns on large-size wafers involves the following steps: using nanoimprinting technology to transfer the pattern from the 4-inch template onto a sub-film, and then using nanoimprinting technology to transfer the same pattern onto different locations on the large-size wafer, thus fabricating multiple product patterns on the large-size wafer.
[0004] However, a 4-inch template can only hold a maximum of two product patterns. When the entire 4-inch template area is transferred to a large-size wafer using nanoimprint technology, the non-product patterns in the 4-inch template are also transferred. This results in a large area of the large-size wafer being occupied by non-product patterns, making it impossible to arrange more product patterns on the large-size wafer and failing to fully utilize the space advantage of the large-size wafer. Summary of the Invention
[0005] This invention provides a method for forming multiple product patterns on a large-size wafer to increase the number of product patterns on the large-size wafer, thereby improving the utilization rate of the large-size wafer.
[0006] This invention provides a method for forming multiple product patterns on a large-size wafer, characterized by comprising:
[0007] S1. Prepare an embossing template, the embossing template including a substrate and a dielectric layer and a graphic structure layer formed on the substrate, the dielectric layer surrounding the graphic structure layer, the thickness of the graphic structure layer being greater than or equal to the thickness of the dielectric layer;
[0008] S2. Spray embossing adhesive onto the graphic structure layer of the embossing mold to obtain an embossing mold with embossing adhesive.
[0009] S3. The imprinting mold with imprinting adhesive is imprinted on the target position of the large-size wafer to form a product pattern on the target position of the large-size wafer; wherein the outer contour of the product pattern is the same as the outer contour of the graphic structure layer, and the graphic structure in the product pattern is complementary to the graphic structure in the graphic structure layer.
[0010] Repeat steps S2 to S3 to form multiple product patterns on the large-size wafer.
[0011] Optionally, the step of preparing the embossing mold includes:
[0012] A base and an initial template are provided; wherein the initial template includes at least one preset graphic structure;
[0013] A dielectric layer with an opening region is formed on the substrate;
[0014] The complementary graphic structure corresponding to a single preset graphic structure is transferred to the opening area to form the graphic structure layer.
[0015] Optionally, the step of transferring the complementary graphic structure corresponding to a single preset graphic structure to the opening region to form the graphic structure layer includes:
[0016] Spin-apply template adhesive to the side of the initial template that has a pre-set graphic structure.
[0017] The side of the substrate with the medium layer is oriented toward the template adhesive, and the opening area is aligned and bonded to a single pre-set graphic structure;
[0018] The template adhesive in the opening area is cured, and after the template adhesive in the opening area is demolded from the initial template, a complementary graphic structure corresponding to a single preset graphic structure is formed in the opening area to form the graphic structure layer on the substrate.
[0019] Optionally, the step of forming a dielectric layer with an opening region on the substrate includes:
[0020] A dielectric thin film material is spin-coated onto the substrate;
[0021] A preset mask is used to expose and develop the dielectric thin film material on the side of the dielectric thin film material away from the substrate, so as to form a dielectric layer with an opening region on the substrate.
[0022] Optionally, after the step of forming the patterned structure layer on the substrate, the method further includes:
[0023] Use alcohol or acetone solvent to rinse away any remaining uncured stencil adhesive from the substrate's dielectric layer.
[0024] Optionally, before the step of spin-applying template adhesive to the side of the initial template with the pre-set graphic structure, the method further includes:
[0025] Anti-sticking treatment is applied to the side of the initial template with the preset graphic structure.
[0026] Optionally, before the step of imprinting the imprinting mold with imprinting adhesive onto the target location of the large-size wafer, the method further includes:
[0027] Provide large-size wafers;
[0028] Clean the large-size wafer;
[0029] An adhesion promoter is applied to the side of the large wafer facing the imprinting mold with imprinting adhesive.
[0030] Optionally, the substrate includes a first transparent plastic substrate.
[0031] Optionally, the substrate includes a second transparent plastic substrate and a transparent glass substrate, wherein the transparent glass substrate is located between the second transparent plastic substrate and the dielectric layer, or the second transparent plastic substrate is located between the transparent glass substrate and the dielectric layer.
[0032] Optionally, the size of the large-size wafer is greater than or equal to 6 inches.
[0033] This invention provides a method for forming multiple product patterns on a large-size wafer. An imprinting mold has a graphic structure layer. Imprinting adhesive is sprayed onto the graphic structure layer, and then transferred to the large-size wafer to form multiple product patterns. This invention sprays imprinting adhesive onto the graphic structure layer of the imprinting mold and then transfers it to the large-size wafer. This allows for the imprinting of only the graphic structure, rather than the entire pattern (e.g., graphic and non-graphic structures) in the initial mold, thus enabling the formation of more product patterns on the large-size wafer and improving its utilization rate. Furthermore, existing technologies directly spin-coat imprinting adhesive onto the large-size wafer and then press the imprinting mold onto the large-size wafer with the imprinting adhesive. This results in a large spraying area and a large amount of adhesive used. Moreover, traditional spin-coating of imprinting adhesive causes the adhesive to adhere to the dielectric layer of the imprinting mold, contaminating the dielectric layer, affecting the reusability of the imprinting mold, requiring repeated cleaning, and thus reducing efficiency. However, by spraying embossing adhesive onto the graphic structure layer of the embossing mold, this embodiment of the invention does not affect the secondary use of the embossing mold and can improve printing efficiency. Furthermore, it can reduce the amount of embossing adhesive used, thereby saving costs. Attached Figure Description
[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.
[0035] Figure 1 A flowchart illustrating a first method for forming multiple product patterns on a large-size wafer, provided by an embodiment of the present invention;
[0036] Figure 2 for Figure 1 The corresponding process flow diagram for forming multiple product patterns on large-size wafers;
[0037] Figure 3 A flowchart illustrating a second method for forming multiple product patterns on a large-size wafer, provided by an embodiment of the present invention;
[0038] Figure 4 for Figure 3 The corresponding process flow diagram for forming multiple product patterns on large-size wafers;
[0039] Figure 5 This is a schematic diagram of the structure of an embossing mold provided in an embodiment of the present invention;
[0040] Figure 6 A flowchart illustrating a third method for forming multiple product patterns on a large-size wafer, provided in an embodiment of the present invention;
[0041] Figure 7 for Figure 6 The corresponding process flow diagram for forming multiple product patterns on large-size wafers;
[0042] Figure 8 A flowchart illustrating the fourth method for forming multiple product patterns on a large-size wafer according to an embodiment of the present invention;
[0043] Figure 9 This is a schematic diagram illustrating the process of sequentially imprinting patterns formed by multiple imprinting adhesives onto a large-size wafer, as provided in an embodiment of the present invention. Detailed Implementation
[0044] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.
[0045] In the description of the embodiments of the present invention, the terms "upper" and "lower," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.
[0046] Figure 1 This is a flowchart illustrating a first method for forming multiple product patterns on a large-size wafer, as provided in an embodiment of the present invention. Figure 2 for Figure 1 The corresponding process flow diagram for forming multiple product patterns on a large-size wafer, such as... Figure 1 and Figure 2 As shown, the method includes:
[0047] S1. Prepare an imprinting template. The imprinting template includes a substrate and a dielectric layer and a pattern structure layer formed on the substrate. The dielectric layer surrounds the pattern structure layer, and the thickness of the pattern structure layer is greater than or equal to the thickness of the dielectric layer.
[0048] For details, please refer to Figure 2 In step (a1), the imprinting template 10 includes a substrate 101 and a dielectric layer 102 and a patterned structure layer 103 formed on the substrate 101. The dielectric layer 102 may be a photoresist layer. Exemplarily, the substrate 101 may be a monolithic structure, consisting of a monolithic transparent plastic substrate, or it may be a separate structure, consisting of a transparent plastic substrate and a transparent glass substrate. Exemplarily, the substrate 101 and the dielectric layer 102 may be a monolithic structure or a separate structure.
[0049] Specifically, the graphic structure layer 103 can be understood as a pattern layer after a single preset pattern structure in the initial template has been reproduced. The medium layer 102 surrounds the graphic structure layer 103, that is, the medium layer 102 surrounds the graphic structure layer 103. The thickness of the graphic structure layer 103 is greater than or equal to the thickness of the medium layer 102. When the thickness of the graphic structure layer 103 is greater than the thickness of the medium layer 102, that is, the surface of the graphic structure layer 103 away from the substrate 10 protrudes from the surface of the medium layer 102 away from the substrate 101, so that an imprinting adhesive can be sprayed onto the side of the graphic structure layer 103 away from the substrate 101, and the pattern formed by the imprinting adhesive can be reproduced.
[0050] It should be noted that in a near-eye display device, a single preset pattern structure may include the outer contour of a diffractive waveguide lens and diffractive micro / nano structures on the lens. The diffractive micro / nano structures may include outgoing diffractive micro / nano structures and incoming diffractive micro / nano structures.
[0051] S2. Spray embossing adhesive onto the graphic structure layer of the embossing mold to obtain an embossing mold with embossing adhesive.
[0052] For details, please refer to Figure 2 In step (b1), embossing adhesive 20 is sprayed onto the graphic structure layer 103 of the embossing mold 10, that is, embossing adhesive 20 is sprayed onto the surface of the graphic structure layer 103 to obtain an embossing mold with embossing adhesive 20.
[0053] As a comparative example, existing technologies directly spin-coat imprinting adhesive onto large-size wafers and then press imprinting dies onto the large-size wafers with the imprinting adhesive. This results in a large area of adhesive spraying, and traditional spin-coating causes the adhesive to stick to the dielectric layer of the imprinting die, thus contaminating the dielectric layer, affecting the reusability of the imprinting die, requiring repeated cleaning, and thus reducing efficiency. However, the technical solution provided by the embodiments of the present invention sprays imprinting adhesive onto the graphic structure layer of the imprinting die, and then presses the imprinting die with the adhesive onto the target position on the large-size wafer. This reduces the amount of imprinting adhesive used, thereby saving costs. Furthermore, by spraying imprinting adhesive onto the graphic structure layer of the imprinting die, the embodiments of the present invention do not affect the reusability of the imprinting die and improve the printing efficiency.
[0054] For example, the main component of the imprinting adhesive 20 can be a fluorine-free imprinting adhesive, such as epoxy acrylate, polyurethane acrylate, or silicone-modified acrylate.
[0055] For example, inkjet printing technology can also be used to spray fluorine-free printing adhesive onto the graphic structure layer.
[0056] S3. Imprint an imprinting mold with imprinting adhesive onto the target position of a large-size wafer to form a product pattern on the target position of the large-size wafer; wherein, the outer contour of the product pattern is the same as the outer contour of the graphic structure layer, and the graphic structure in the product pattern is complementary to the graphic structure in the graphic structure layer.
[0057] Specifically, the target location can be understood as the location where product patterns need to be formed on a large-size wafer.
[0058] For details, please refer to Figure 2 In step (c1), the imprinting mold with imprinting adhesive 20 is aligned with the target position on the large-size wafer 40 to imprint the imprinting adhesive 20 onto the target position on the large-size wafer to form the product pattern 30.
[0059] Specifically, the outer contour of the product pattern 30 is the same as the outer contour of the graphic structure layer 103, that is, the projection contour of the imprinting adhesive 20 on the substrate 101 completely coincides with the projection contour of the graphic structure layer 103 on the substrate 101. Since the product pattern 30 is formed by imprinting the imprinting adhesive 20 onto the target position on the large-size wafer 40, the shape of the imprinting adhesive 20 is the same as the shape of the product pattern 30. Moreover, the imprinting adhesive 20 is sprayed on one side of the graphic structure layer 103, that is, the imprinting adhesive 20 fills the recessed portion of the graphic structure layer 103, thus the graphic structure in the product pattern 30 is complementary to the graphic structure in the graphic structure layer 103.
[0060] S101. Repeat steps S2 to S3 to form multiple product patterns on a large-size wafer.
[0061] For details, please refer to Figure 2 Step (d1) is repeated, and steps S2 to S3 are repeated, so that multiple product patterns 30 can be formed on the large-size wafer 40, and the multiple product patterns can be arranged on the large-size wafer 40.
[0062] It should be noted that, using the above technical solution, multiple product patterns (e.g., a splicing mold with multiple product patterns) can be formed on a large-size wafer, or multiple products (e.g., diffractive waveguide lenses) can be formed on a large-size wafer. A single diffractive optical product has a set of diffractive optical patterns. The diffractive optical patterns can be patterns of grating structures or patterns of metasurface structures. A set of diffractive optical patterns can include coupled-in diffractive micro / nano structure patterns and coupled-out diffractive micro / nano structure patterns.
[0063] As a comparison, existing technologies simultaneously transfer multiple pre-set pattern structures from an initial template onto a large-size wafer. Since the initial template contains non-product patterns (areas without pre-set pattern structures), these non-product patterns are also transferred to the large-size wafer during the transfer process. Therefore, the large-size wafer can accommodate a limited number of transferred pre-set pattern structures. For example, the non-pre-set pattern structure area can be any area other than the pre-set pattern structure. For instance, taking a 4-inch initial template containing two pre-set pattern structures and an 8-inch wafer as an example, in existing technologies, when the two pre-set pattern structures from the initial template are imprinted onto the 8-inch wafer, the 8-inch wafer can accommodate a maximum of three 4-inch initial template areas, resulting in only six imprinted pre-set pattern structures in the final 8-inch wafer. However, the imprinting template structure provided in this embodiment of the invention can be obtained by extracting a single pre-set graphic structure from the initial template. Since only the effective area in the initial template, i.e. the area of the pre-set graphic structure, is extracted, there is no need to extract the area of the non-pre-set graphic structure. In this way, a single pre-set graphic structure can be reproduced to a large-size wafer. The final 8-inch wafer includes 8 imprinted pre-set graphic structures, thereby increasing the number of pre-set graphic structures reproduced on the 8-inch wafer. That is, the number of imprinted patterns on the 8-inch wafer is increased from 6 to 8, which increases the production efficiency by 33% and improves the utilization rate of large-size wafers.
[0064] The method for forming multiple product patterns on a large-size wafer provided by this invention involves spraying imprinting adhesive onto the graphic structure layer of an imprinting mold and then transferring the imprinting adhesive onto the large-size wafer. This allows for the imprinting of only the graphic structure, rather than the entire pattern in the initial mold, thereby enabling the formation of more product patterns on the large-size wafer and improving its utilization rate. Furthermore, existing technologies directly spin-coat imprinting adhesive onto the large-size wafer and then press the imprinting mold onto the wafer with the imprinting adhesive. This results in a large spraying area and a large amount of imprinting adhesive used. Traditional spin-coating of imprinting adhesive also causes the adhesive to adhere to the dielectric layer of the imprinting mold, contaminating the dielectric layer and affecting the reusability of the imprinting mold, requiring repeated cleaning and thus reducing efficiency. However, this invention, by spraying imprinting adhesive onto the graphic structure layer of the imprinting mold, not only avoids affecting the reusability of the imprinting mold but also improves imprinting efficiency. In addition, it reduces the amount of imprinting adhesive used, thereby saving costs.
[0065] Optional, Figure 3 This is a flowchart illustrating a second method for forming multiple product patterns on a large-size wafer, as provided in an embodiment of the present invention. Figure 4 for Figure 3 The corresponding process flow diagram for forming multiple product patterns on large-size wafers. Figure 3 and Figure 4 Based on the above embodiments, the steps for preparing the embossing mold are described in detail, such as... Figure 3 and Figure 4 As shown, the method includes:
[0066] 201. Provide a base and an initial template; wherein the initial template includes at least one preset graphic structure.
[0067] For details, please refer to [link / reference]. Figure 4 In step (a2), the substrate 101 is the substrate 101 in the imprinting template 10. The initial template 50 is a small-sized wafer including at least one preset pattern structure 501. For example, the initial template 50 may be a 4-inch wafer, and the 4-inch wafer may include two preset pattern structures 501.
[0068] It should be noted that when the initial template includes multiple preset graphic structures, multiple embossing templates can be copied, thereby further improving utilization.
[0069] Optional, continue to refer to Figure 4 In step (a2), the substrate 101 includes a first transparent plastic substrate.
[0070] For example, the first transparent plastic substrate may be a polyethylene terephthalate plastic film, etc.
[0071] Optional, Figure 5 This is a schematic diagram of the structure of an embossing mold provided in an embodiment of the present invention, as shown below. Figure 5 As shown, the substrate 101 includes a second transparent plastic substrate 1011 and a transparent glass substrate 1012. The transparent glass substrate 1012 is located between the second transparent plastic substrate 1011 and the dielectric layer 102, or the second transparent plastic substrate 1011 is located between the transparent glass substrate 1012 and the dielectric layer 102. This ensures the thickness of the substrate 101 and reduces the deformation of the imprinting mold 10 during the imprinting process.
[0072] Specifically, the substrate 101 includes a second transparent plastic substrate 1011 and a transparent glass substrate 1012. The transparent glass substrate 1012 is located between the second transparent plastic substrate 1011 and the dielectric layer 102. That is, the transparent glass substrate 1012 is closer to the dielectric layer and the pattern structure layer, which can further reduce the deformation of the imprinting template 10 during the imprinting process.
[0073] 202. Spin-coat a layer of dielectric thin film material onto the substrate.
[0074] For details, please refer to [link / reference]. Figure 4 In step (b2), a dielectric thin film material 100 is spin-coated onto the substrate 101. For example, the dielectric thin film material 100 may be a BM photoresist.
[0075] 203. Using a preset mask, the dielectric thin film material is exposed and developed on the side away from the substrate to form a dielectric layer with an opening region on the substrate.
[0076] For details, please refer to [link / reference]. Figure 4 In steps (c2) and (d2), the preset mask 70 is placed on one side of the imprinting template 10, and the dielectric film material 100 is exposed on the side away from the substrate 101 using ultraviolet light with a wavelength of 365nm (as shown by the small black arrow in the figure). The area not covered by the preset mask is exposed, and then the dielectric film material 100 in the unexposed area is dissolved and removed using a developing solution. In this way, the dielectric film material 100 covered by the preset mask 70 can be removed to form the opening area 10-1.
[0077] Specifically, a dielectric layer 102 with an opening region 10-1 is formed on the substrate 10. That is, the membrane layer on which the dielectric layer 102 is located includes a portion of the substrate 101 that is exposed. In other words, the orthographic projection of the opening region 10-1 on the substrate 101 does not overlap with the orthographic projection of the dielectric layer 102 on the substrate 101.
[0078] 204. Apply anti-sticking treatment to the side of the initial template with the preset graphic structure.
[0079] For details, please refer to [link / reference]. Figure 4 In step (e2), an anti-stick layer 80 is formed on one side of the pre-set graphic structure 501. By preparing the anti-stick layer 80, it can play an anti-fouling role, thereby protecting the pre-set graphic structure 501, and it is also conducive to better demolding in the future.
[0080] For example, the material of the anti-stick layer 80 may be a fluorine-containing anti-fouling coating.
[0081] 205. Spin-apply template adhesive to the side of the initial template with the pre-set graphic structure.
[0082] For details, please refer to [link / reference]. Figure 4 In step (f2), stencil adhesive 60 is spin-coated onto one side of the initial stencil 50 with the pre-set graphic structure 501, i.e., stencil adhesive 60 is spin-coated onto the upper surface of the anti-adhesive layer 80. For example, the main component of the stencil adhesive can be a negative adhesive based on acrylic resin modification, which cross-links and cures after exposure to ultraviolet light, such as fluorosilicone resin modified acrylate or perfluoropolyether acrylate, etc.
[0083] 206. Position the side of the substrate with the medium layer toward the template adhesive, and align and attach the opening area with the single pre-set graphic structure.
[0084] For details, please refer to [link / reference]. Figure 4 In step (g2), the side of the substrate 101 with the dielectric layer 102 is oriented toward the stencil adhesive 60, and the opening area 10-1 is aligned and bonded with the single pre-set graphic structure 501 so that the single pre-set graphic structure 501 is transferred to the opening area 10-1 by the stencil adhesive 60.
[0085] 207. After the template adhesive in the opening area is demolded from the initial template, a complementary graphic structure corresponding to a single pre-set graphic structure is formed in the opening area to form a graphic structure layer on the substrate.
[0086] For details, please refer to [link / reference]. Figure 4 In steps (g2) and (h2), the template adhesive 60 is irradiated with ultraviolet light above the substrate 101 to cure the template adhesive 60 in the opening area 10-1. After the template adhesive 60 in the opening area 10-1 is demolded from the initial template 50, a complementary pattern structure corresponding to a single pre-set pattern structure 501 is formed in the opening area 10-1, thereby forming a pattern structure layer 103 on the substrate 101 so that multiple product patterns 30 can be formed on the large-size wafer 40 in the future.
[0087] Specifically, the imprinting template can be mounted on a nanoimprinting machine, and the initial template coated with template adhesive is placed on the machine platform with the template adhesive 60 facing upwards, and the side of the imprinting template 10 containing the dielectric layer 102 facing the template adhesive 60. A positioning camera can be used to identify individual pre-set pattern structures on the opening area 10-1 and the initial template 50 respectively. After alignment, the imprinting template 10 is attached to the initial template 50 using rollers, and then ultraviolet light exposure is performed (ultraviolet light has a wavelength of 365nm, and the exposure energy is generally 20J / cm²). 2 -40J / cm 2 After demolding, the graphic structure layer 103 is obtained.
[0088] It should be noted that if the dielectric layer in the imprinting stencil faces away from the machine platform (i.e., the photoresist faces upwards), the reflection of light will cause the exposed area to overflow, resulting in an irregular and uneven outline of the patterned structure layer. This embodiment of the invention provides an imprinting stencil with the photoresist side facing the stencil adhesive, i.e., towards the machine platform. This reduces the overflow of the exposed area and improves the smoothness of the outer contour of the patterned structure layer after imprinting.
[0089] Optionally, after forming the graphic structure layer on the substrate, the substrate's dielectric layer can be rinsed with alcohol or acetone to remove any remaining uncured stencil adhesive, in order to prevent the residual stencil adhesive from affecting subsequent imprinting processes.
[0090] S2. Spray embossing adhesive onto the graphic structure layer of the embossing mold to obtain an embossing mold with embossing adhesive.
[0091] For details, please refer to [link / reference]. Figure 4 Step (i2) in the process.
[0092] S3. Imprint an imprinting mold with imprinting adhesive onto the target position of a large-size wafer to form a product pattern on the target position of the large-size wafer; wherein, the outer contour of the product pattern is the same as the outer contour of the graphic structure layer, and the graphic structure in the product pattern is complementary to the graphic structure in the graphic structure layer.
[0093] For details, please refer to [link / reference]. Figure 4 Step (j2) in the process.
[0094] S208. Repeat steps S2 to S3 to form multiple product patterns on a large-size wafer.
[0095] For details, please refer to [link / reference]. Figure 4 Step (k2) in the process.
[0096] The method for forming multiple product patterns on a large-size wafer provided in this invention can extract a pre-set graphic structure by preparing an imprinting template. This allows for the extraction of only the effective area in the initial template without extracting non-product pattern areas. As a result, a single pre-set graphic structure can be imprinted onto the large-size wafer, and the resulting large-size wafer includes multiple product patterns, thereby increasing the number of product patterns imprinted onto the large-size wafer.
[0097] Optional, Figure 6 This is a flowchart illustrating a third method for forming multiple product patterns on a large-size wafer, as provided in an embodiment of the present invention. Figure 7 for Figure 6 The corresponding process flow diagram for forming multiple product patterns on large-size wafers. Figure 6 and Figure 7 Based on the above embodiments, the steps of imprinting an imprinting mold with imprinting adhesive onto a target location on a large-size wafer to form a product pattern on the target location of the large-size wafer are described in detail, such as... Figure 6 and Figure 7 As shown, the method includes:
[0098] S1. Prepare an imprinting template. The imprinting template includes a substrate and a dielectric layer and a pattern structure layer formed on the substrate. The dielectric layer surrounds the pattern structure layer, and the thickness of the pattern structure layer is greater than or equal to the thickness of the dielectric layer.
[0099] For details, please refer to [link / reference]. Figure 7 Step (a3) in the text.
[0100] S2. Spray embossing adhesive onto the graphic structure layer of the embossing mold to obtain an embossing mold with embossing adhesive.
[0101] For details, please refer to [link / reference]. Figure 7 Step (b3) in the text.
[0102] S301. Orient the side of the embossing mold with embossing adhesive toward the large-size wafer and align the pattern structure layer with the target position.
[0103] For details, please refer to [link / reference]. Figure 7 In step (c3), the side of the imprinting mold with imprinting adhesive 20 is oriented toward the large-size wafer 40, and the pattern structure layer 103 is aligned with the target position so that the pattern formed by imprinting adhesive 20 can be imprinted onto the target position of the large-size wafer 40.
[0104] S302. Imprint the imprinting adhesive onto a large-size wafer, cure the imprinting adhesive and demold to form a product pattern at the target position on the large-size wafer; wherein, the outer contour of the product pattern is the same as the outer contour of the graphic structure layer, and the graphic structure in the product pattern is complementary to the graphic structure in the graphic structure layer.
[0105] For details, please refer to [link / reference]. Figure 7 In step (d3), the imprinting adhesive 20 is imprinted onto the large-size wafer 40. After the imprinting adhesive 40 is cured and demolded, the product pattern 30 can be formed at the target position on the large-size wafer 40.
[0106] S303. Repeat steps S2 to S302 to form multiple product patterns on a large-size wafer.
[0107] For details, please refer to [link / reference]. Figure 7 Step (e3) in the middle.
[0108] The method for forming multiple product patterns on a large-size wafer provided in this embodiment of the invention involves facing the large-size wafer with the side of the imprinting mold containing imprinting adhesive, aligning the pattern structure layer with the target position, imprinting the imprinting adhesive onto the large-size wafer, curing the imprinting adhesive and demolding, so as to form a product pattern at the target position on the large-size wafer. This allows the product pattern to be obtained at the target position on the large-size wafer.
[0109] Optional, Figure 8 This is a flowchart illustrating the fourth method for forming multiple product patterns on a large-size wafer according to an embodiment of the present invention. Figure 8 Based on the above embodiments, the steps prior to imprinting the imprinting mold with imprinting adhesive onto the target location of a large-size wafer are described in detail, such as... Figure 8 As shown, the method includes:
[0110] S1. Prepare an imprinting template. The imprinting template includes a substrate and a dielectric layer and a pattern structure layer formed on the substrate. The dielectric layer surrounds the pattern structure layer, and the thickness of the pattern structure layer is greater than or equal to the thickness of the dielectric layer.
[0111] S2. Spray embossing adhesive onto the graphic structure layer of the embossing mold to obtain an embossing mold with embossing adhesive.
[0112] S401 provides large-size wafers.
[0113] Specifically, large-size wafers are 6 inches or larger, which can accommodate more printed patterns, thereby improving the utilization rate of large-size wafers and the production efficiency of waveguides.
[0114] For example, this embodiment of the invention uses a circular shape for the large-size wafer as an example. The large-size wafer can also be other shapes, such as 8 inches, 10 inches, or 16 inches.
[0115] S402, Cleaning large-size wafers.
[0116] Specifically, oxygen plasma is used to clean large-size wafers to remove contaminants from the substrate surface and to modify the substrate surface.
[0117] S403. Apply an adhesive to the side of the large wafer facing the imprinting die with imprinting adhesive.
[0118] Specifically, a spin coater can be used to spin-coat an adhesive onto the surface of a large-size wafer and then bake it to increase the adhesion of the imprinting adhesive to the surface of the large-size wafer, thereby ensuring the stability and reliability of the product pattern at the target position on the large-size wafer.
[0119] For example, the main component of the tackifier may be a silane coupling agent. For example, the baking temperature may be 120°C-150°C.
[0120] S3. Imprint an imprinting mold with imprinting adhesive onto the target position of a large-size wafer to form a product pattern on the target position of the large-size wafer; wherein, the outer contour of the product pattern is the same as the outer contour of the graphic structure layer, and the graphic structure in the product pattern is complementary to the graphic structure in the graphic structure layer.
[0121] S404. Repeat steps S2 to S3 to form multiple product patterns on a large-size wafer.
[0122] The method for forming multiple product patterns on a large-size wafer provided in this invention removes surface contaminants and modifies the substrate by cleaning the large-size wafer. By preparing an adhesion promoter on one side of the large-size wafer, the adhesion of the imprinting adhesive to the wafer surface can be increased, thereby ensuring the stability and reliability of the product patterns at the target location.
[0123] Optionally, the control unit moves the large-size wafer along a preset path.
[0124] Specifically, a machine can be understood as a motion platform that carries large-sized wafers. A preset path can be understood as the path along which the machine moves the large-sized wafers.
[0125] Specifically, Figure 9 This is a schematic diagram illustrating the process of sequentially imprinting multiple patterns formed by imprinting adhesives onto a large-size wafer, as provided in an embodiment of the present invention. Figure 9 As shown, the control machine can move large-size wafers in an "S" shaped path. This curve for moving large-size wafers is optimal, thereby improving the fabrication efficiency of the panel mold.
[0126] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A method for forming multiple product patterns on a large-size wafer, characterized in that, include: S1. Prepare an embossing template, the embossing template including a substrate and a dielectric layer and a graphic structure layer formed on the substrate, the dielectric layer surrounding the graphic structure layer, the thickness of the graphic structure layer being greater than or equal to the thickness of the dielectric layer; S2. Spray embossing adhesive onto the graphic structure layer of the embossing mold to obtain an embossing mold with embossing adhesive. S3. The imprinting mold with imprinting adhesive is imprinted on the target position of the large-size wafer to form a product pattern on the target position of the large-size wafer; wherein the outer contour of the product pattern is the same as the outer contour of the graphic structure layer, and the graphic structure in the product pattern is complementary to the graphic structure in the graphic structure layer. Repeat steps S2 to S3 to form multiple product patterns on the large-size wafer.
2. The method according to claim 1, characterized in that, The step of preparing the embossing mold includes: A base and an initial template are provided; wherein the initial template includes at least one preset graphic structure; A dielectric layer with an opening region is formed on the substrate; The complementary graphic structure corresponding to a single preset graphic structure is transferred to the opening area to form the graphic structure layer.
3. The method according to claim 2, characterized in that, The step of transferring the complementary graphic structure corresponding to a single preset graphic structure to the opening region to form the graphic structure layer includes: Spin-apply template adhesive to the side of the initial template that has a pre-set graphic structure. The side of the substrate with the medium layer is oriented toward the template adhesive, and the opening area is aligned and bonded to a single pre-set graphic structure; The template adhesive in the opening area is cured, and after the template adhesive in the opening area is demolded from the initial template, a complementary graphic structure corresponding to a single preset graphic structure is formed in the opening area to form the graphic structure layer on the substrate.
4. The method according to claim 2, characterized in that, The step of forming a dielectric layer with an opening region on the substrate includes: A dielectric thin film material is spin-coated onto the substrate; A preset mask is used to expose and develop the dielectric thin film material on the side of the dielectric thin film material away from the substrate, so as to form a dielectric layer with an opening region on the substrate.
5. The method according to claim 3, characterized in that, After the step of forming the patterned structure layer on the substrate, the method further includes: Use alcohol or acetone solvent to rinse away any remaining uncured stencil adhesive from the substrate's dielectric layer.
6. The method according to claim 3, characterized in that, Before the step of spin-applying template adhesive to the side of the initial template with the pre-set graphic structure, the method further includes: Anti-sticking treatment is applied to the side of the initial template with the preset graphic structure.
7. The method according to claim 1, characterized in that, Prior to the step of imprinting the imprinting mold with imprinting adhesive onto the target location of the large-size wafer, the method further includes: Provide large-size wafers; Clean the large-size wafer; An adhesion promoter is applied to the side of the large wafer facing the imprinting mold with imprinting adhesive.
8. The method according to claim 1, characterized in that, The substrate includes a first transparent plastic substrate.
9. The method according to claim 1, characterized in that, The substrate includes a second transparent plastic substrate and a transparent glass substrate, wherein the transparent glass substrate is located between the second transparent plastic substrate and the dielectric layer, or the second transparent plastic substrate is located between the transparent glass substrate and the dielectric layer.
10. The method according to claim 1, characterized in that, The size of the large-size wafer is greater than or equal to 6 inches.