Printed circuit board and manufacturing method thereof

Abstract

The invention provides a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board comprises the following steps: providing a polyimide, polyethylene glycol terephthalate or glass fiber combined epoxy resin substrate; forming a conductive ink layer on the substrate; a low resistance material layer is formed on the conductive ink layer. Particularly, the resistance of the low-resistance material layer is smaller than that of the conductive ink layer.

Description

Technical Field

[0001] This application relates to a printed circuit board and a method for manufacturing the same, and more particularly to a printed circuit board manufactured by printing conductive ink onto a PI, PET and / or FR4 substrate using screen printing technology, and a method for manufacturing the printed circuit board. Background Technology

[0002] In existing technologies, the conductive ink used in the manufacturing process of printed circuit boards has a problem of excessively high resistance, which affects subsequent processes and the characteristics of the finished printed circuit board.

[0003] Therefore, how to provide a printed circuit board that can solve the above problems and its manufacturing method is an important issue that the industry needs to consider. Summary of the Invention

[0004] In view of the above, one objective of this application is to provide a method for manufacturing a printed circuit board, the method comprising the following steps: providing a material type comprising at least one of polyimide (PI), polyethylene terephthalate (PET), or glass fiber bonded epoxy resin (FlameRetardant 4, FR4); forming a low-resistance material layer on the conductive ink layer, wherein the resistance of the low-resistance material layer is less than the resistance of the conductive ink layer.

[0005] Optionally, the conductive ink layer is formed on the substrate by a screen printing process.

[0006] Optionally, the low-resistivity material layer is a copper metal layer.

[0007] Optionally, the low-resistance material layer is formed on the conductive ink layer by an electroplating process or a chemical plating process.

[0008] Optionally, the manufacturing method further includes performing a surface mount technology (SMT) process. The surface mount technology process uses lead-free solder paste.

[0009] Another objective of this application is to provide a method for manufacturing a printed circuit board, the method comprising: providing a substrate, wherein the material of the substrate comprises at least one of PI, PET or FR4; performing a screen printing process to form a conductive ink layer on the substrate; and performing an electroplating process or a chemical plating process to form a low-resistance material layer on the conductive ink layer, wherein the resistance of the low-resistance material layer is less than the resistance of the conductive ink layer.

[0010] Optionally, the low-resistivity material layer is a copper metal layer.

[0011] Optionally, the manufacturing method further includes a process of performing a surface mount technology. The surface mount technology process uses a lead-free solder paste.

[0012] Another object of this application is to provide a method for manufacturing a printed circuit board, the method comprising: providing a substrate, wherein the material of the substrate comprises at least one of PI, PET or FR4; performing a screen printing process to form a conductive ink layer on the substrate; performing an electroplating process or a chemical plating process to form a copper metal layer on the conductive ink layer, wherein the resistance of the copper metal layer is less than the resistance of the conductive ink layer; and performing a surface mount technology process, wherein the surface mount technology process uses a lead-free solder paste.

[0013] Another object of this application is to provide a printed circuit board (PCB) comprising a substrate, a conductive ink layer, and a copper metal layer. The substrate is made of at least one of polyimide (PI), polyethylene terephthalate (PET), or glass fiber reinforced epoxy resin (Flame Retardant 4, FR4). The conductive ink layer is formed and disposed on the substrate using a screen printing process. The copper metal layer is formed and disposed on the conductive ink layer using an electroplating or chemical plating process. The resistance of the copper metal layer is less than the resistance of the conductive ink layer. The PCB is manufactured using a surface mount technology (SMT) process, and a lead-free solder paste is used in the SMT process.

[0014] In summary, the printed circuit board and its manufacturing method according to the embodiments disclosed herein utilize PI, PET, and / or FR4 substrates and copper as a conductor; furthermore, lead-free solder paste is used in the surface mount technology (SMT) process. Therefore, not only is the resistance of the conductive ink layer reduced by using conductors such as copper, but energy saving, carbon reduction, and cost reduction are also achieved.

[0015] To further illustrate the purpose, technical features, and effects of this application, specific embodiments are described in detail below with reference to the accompanying drawings. However, the drawings provided are for reference and illustration only and are not intended to limit this application. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart illustrating a method for manufacturing a printed circuit board according to one embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description of the embodiments of "printed circuit board and manufacturing method thereof" disclosed in this application is provided in conjunction with specific implementation methods and with reference to the accompanying drawings. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, it should be stated in advance that the accompanying drawings of this application are only simple schematic illustrations and are not depictions based on actual dimensions. Although this document provides examples of parameters containing specific values, it should be understood that the parameters do not need to be exactly equal to the corresponding values, but can approximate the corresponding values ​​within acceptable error tolerances or design constraints. In addition, unless the context clearly indicates or defines otherwise, the meanings of "a," "the," and "the" in this application include the plural.

[0019] It should be understood that although terms such as "first," "second," etc., may be used herein to describe various components or signals, each described component or signal should not be limited by the foregoing terms, which are primarily used to distinguish one component from another or one signal from another. Furthermore, directional terms mentioned in subsequent embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the scope of protection of this application. Additionally, the term "or" as used herein may, depending on the specific circumstances, include any combination of one or more of the associated listed items.

[0020] Furthermore, the terms "substantially" or "approximately" as used herein can refer to the average of a numerical or complex numerical value within a range of deviations from a particular value, which can be recognized or determined by those skilled in the art. This includes taking into account certain specific errors that may occur when measuring the particular value due to limitations of the measurement system or equipment. For example, a numerical value referred to "substantially" can include ±5%, ±3%, ±1%, ±0.5%, ±0.1%, or one or more standard deviations of the particular value.

[0021] First, please refer to Figure 1 , Figure 1 This illustration depicts a method for manufacturing a printed circuit board according to an embodiment of this application.

[0022] like Figure 1 As shown, in one embodiment of the first aspect of this application, the method for manufacturing a printed circuit board includes the following steps S1 to S4, for example: providing a substrate, wherein the substrate material type includes at least one of polyimide (PI), polyethylene terephthalate (PET), or glass fiber bonded epoxy resin (Flame Retardant 4, FR4) in step S1. Furthermore, in some embodiments, the substrate material type may simultaneously include PI, PET, and FR4 (but is not limited thereto); forming a conductive ink layer on the substrate in step S2; forming a low-resistance material layer on the conductive ink layer in step S3; and performing a surface mount technology (SMT) process in step S4, wherein a lead-free solder paste is used in the SMT process. In particular, the resistance of the low-resistance material layer is less than the resistance of the conductive ink layer.

[0023] In one embodiment of this application, the conductive ink layer is formed on the substrate by a screen printing process.

[0024] In one embodiment of this application, the low-resistivity material layer is a copper metal layer.

[0025] In one embodiment of this application, the low-resistance material layer is formed on the conductive ink layer by an electroplating process or a chemical plating process.

[0026] In addition, in one embodiment of the second aspect of this application, the method for manufacturing a printed circuit board includes the following steps S1 to S4, for example: step S1 of providing a substrate of at least one of the following material types: polyimide (PI), PET, or FR4; step S2 of performing a screen printing process to form a conductive ink layer on the substrate; step S3 of performing an electroplating process or a chemical plating process to form a low-resistance material layer on the conductive ink layer, wherein the resistance of the low-resistance material layer is less than the resistance of the conductive ink layer; and step S4 of performing a surface mount technology (SMT) process, wherein a lead-free solder paste is used in the surface mount technology (SMT) process.

[0027] In one embodiment of this application, the low-resistivity material layer is a copper metal layer.

[0028] In another embodiment of the third aspect of this application, the method for manufacturing a printed circuit board includes the following steps S1 to S4, for example: providing a substrate of at least one of the following material types: polyimide (PI), PET, or FR4 (S1); performing a screen printing process (S2) to form a conductive ink layer on the substrate; performing an electroplating process or a chemical plating process (S3) to form a copper metal layer on the conductive ink layer, wherein the resistance of the copper metal layer is less than the resistance of the conductive ink layer; and performing a surface mount technology (SMT) process (S4). The surface mount technology (SMT) process uses lead-free solder paste.

[0029] In addition, in one embodiment of the fourth aspect of this application, the printed circuit board includes: a substrate, a conductive ink layer and a copper metal layer, wherein the material type of the substrate includes at least one of polyimide (PI), polyethylene terephthalate (PET) or glass fiber bonded epoxy resin (Flame Retardant 4, FR4).

[0030] In one embodiment, the conductive ink layer is formed and disposed on the substrate using a screen printing process.

[0031] In one embodiment, the copper metal layer is formed and disposed on the conductive ink layer using an electroplating process or a chemical plating process, wherein the resistance of the copper metal layer is less than the resistance of the conductive ink layer.

[0032] In one embodiment, the printed circuit board is manufactured using a surface mount technology (SMT) process, and a lead-free solder paste is used in the SMT process.

[0033] In summary, the printed circuit board and its manufacturing method according to the embodiments disclosed herein utilize high-temperature resistant polyimide (PI), PET, and / or FR4 substrates, and copper metal as a conductor; furthermore, lead-free solder paste is used in the surface mount technology (SMT) process. Therefore, not only is the resistance of the conductive ink layer reduced by using conductors such as copper metal, but energy saving, carbon reduction, and cost reduction are also achieved.

[0034] The above description is merely a preferred and feasible embodiment of this application and does not limit the scope of protection of the claims of this application. Therefore, any equivalent changes that can be conceived by those skilled in the art based on the technical content disclosed in this application without creative effort should be included within the scope of protection of the claims of this application.

Claims

1. A method for manufacturing a printed circuit board, characterized in that, The manufacturing method includes: A substrate is provided, wherein the material of the substrate comprises at least one of polyimide, polyethylene terephthalate, or glass fiber bonded epoxy resin; A conductive ink layer is formed on the substrate; and A low-resistance material layer is formed on the conductive ink layer, wherein the resistance of the low-resistance material layer is less than the resistance of the conductive ink layer.

2. The manufacturing method according to claim 1, characterized in that, The conductive ink layer is formed on the substrate by a screen printing process.

3. The manufacturing method according to claim 1, characterized in that, The low-resistivity material layer is a copper metal layer.

4. The manufacturing method according to claim 1, characterized in that, The low-resistance material layer is formed on the conductive ink layer by an electroplating or chemical plating process.

5. The manufacturing method according to claim 1, characterized in that, The manufacturing method further includes: A surface mount technology process is performed, wherein a lead-free solder paste is used in the surface mount technology process.

6. A method for manufacturing a printed circuit board, characterized in that, The manufacturing method includes: A substrate is provided, wherein the material of the substrate comprises at least one of polyimide, polyethylene terephthalate, or glass fiber bonded epoxy resin; Perform a screen printing process to form a conductive ink layer on the substrate; and An electroplating or chemical plating process is performed to form a low-resistance material layer on the conductive ink layer, wherein the resistance of the low-resistance material layer is less than the resistance of the conductive ink layer.

7. The manufacturing method according to claim 6, characterized in that, The low-resistivity material layer is a copper metal layer.

8. The manufacturing method according to claim 6, characterized in that, The manufacturing method further includes: A surface mount technology process is performed, wherein a lead-free solder paste is used in the surface mount technology process.

9. A method for manufacturing a printed circuit board, characterized in that, The manufacturing method includes: A substrate is provided, wherein the material of the substrate comprises at least one of polyimide, polyethylene terephthalate, or glass fiber bonded epoxy resin (FR4); Perform a screen printing process to form a conductive ink layer on the substrate; Perform an electroplating or chemical plating process to form a copper metal layer on the conductive ink layer, wherein the resistance of the copper metal layer is less than the resistance of the conductive ink layer; and A surface mount technology process is performed, wherein a lead-free solder paste is used in the surface mount technology process.

10. A printed circuit board, characterized in that, The printed circuit board includes: A substrate, the material of which comprises at least one of polyimide, polyethylene terephthalate or glass fiber bonded epoxy resin; A conductive ink layer is formed and disposed on the substrate using a screen printing process; and A copper metal layer is formed and disposed on the conductive ink layer using an electroplating process or a chemical plating process, wherein the resistance of the copper metal layer is less than the resistance of the conductive ink layer. The printed circuit board is manufactured using a surface mount technology process, and a lead-free solder paste is used in the surface mount technology process.

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