Gas-liquid two-phase radiator and electronic equipment

Abstract

The invention provides a gas-liquid two-phase radiator which comprises a substrate, the substrate comprises a first cover plate and a second cover plate overlapped with the first cover plate, a plurality of evaporation flow channels are arranged between the first cover plate and the second cover plate at intervals, at least one protruding part is arranged in each evaporation flow channel, and the protruding parts protrude in the radial direction of the evaporation flow channels; and the fins are fixedly connected with the base plate, condensation flow channels allowing working media to flow are arranged in the fins and communicate with the evaporation flow channels, and the working media absorb heat in the evaporation flow channels, convert the heat into the gas state and then flow into the condensation flow channels, release heat in the condensation flow channels, convert the heat into the liquid state and then flow into the evaporation flow channels. The invention further provides an electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a gas-liquid two-phase heat sink and electronic equipment. Background Technology

[0002] With the development of electronic technology, electronic devices are gradually evolving towards higher integration and higher power, leading to increased heat flux density. Heat dissipation capacity has become a crucial factor affecting the stability and efficiency of electronic equipment. Gas-liquid two-phase heat dissipation technology is one solution for heat dissipation in electronic devices. Furthermore, gas-liquid two-phase heat sinks have evolved from one-dimensional to three-dimensional temperature uniformity, and this technological iteration has enhanced their heat dissipation performance. However, the main driving forces for the working fluid circulation within a typical gas-liquid two-phase heat sink are gravity and buoyancy. When the heat sink is relatively high, the liquid working fluid has difficulty reaching the upper heat source, reducing heat dissipation efficiency and increasing the risk of "dry burning," which affects the stability of electronic equipment operation. Therefore, improving the heat dissipation efficiency of gas-liquid two-phase heat sinks is an urgent problem to be solved. Summary of the Invention

[0003] This disclosure provides a gas-liquid two-phase radiator and an electronic device.

[0004] In a first aspect, embodiments of this disclosure provide a gas-liquid two-phase radiator, comprising:

[0005] The substrate includes a first cover plate and a second cover plate stacked with the first cover plate. A plurality of evaporation channels are provided between the first cover plate and the second cover plate at intervals. At least one protrusion is provided in the evaporation channel, and the protrusion protrudes in the radial direction of the evaporation channel.

[0006] Multiple fins are fixedly connected to the substrate. A condensation channel for the working fluid to flow is provided in the fins. The condensation channel is connected to the evaporation channel. The working fluid absorbs heat in the evaporation channel and turns into a gaseous state before flowing into the condensation channel. It releases heat in the condensation channel and turns into a liquid state before flowing into the evaporation channel.

[0007] Secondly, embodiments of this disclosure provide an electronic device, including a heat-generating device and a heat sink, wherein the heat sink is used to dissipate heat generated by the heat-generating device, and the heat sink includes the gas-liquid two-phase heat sink provided in the disclosed embodiments.

[0008] Thirdly, embodiments of this disclosure provide a method for manufacturing a heat sink, comprising:

[0009] A substrate is provided, the substrate including a first cover plate and a second cover plate stacked with the first cover plate, a plurality of evaporation channels are provided at intervals between the first cover plate and the second cover plate, and at least one protrusion is provided in the evaporation channel, the protrusion protruding in the radial direction of the evaporation channel;

[0010] Multiple fins are provided, and the fins are provided with condensation channels for the flow of the working fluid;

[0011] The plurality of fins are fixedly connected to the substrate, and the condensation channel is connected to the evaporation channel so that the working fluid absorbs heat in the evaporation channel and turns into a gaseous state before flowing into the condensation channel, and releases heat in the condensation channel and turns into a liquid state before flowing into the evaporation channel.

[0012] The gas-liquid two-phase radiator in this embodiment includes a substrate and multiple fins fixed to the substrate. Multiple evaporation channels are spaced apart between a first cover plate and a second cover plate. Condensation channels are provided inside the fins. The evaporation channels and condensation channels are connected. The working fluid absorbs heat in the evaporation channel and turns into a gaseous state before flowing into the condensation channel. In the condensation channel, it releases heat and turns into a liquid state before flowing into the evaporation channel. That is, the working fluid circulates repeatedly in the evaporation channel and the condensation channel. At least one protrusion is provided in the evaporation channel, which protrudes in the radial direction of the evaporation channel, thereby changing the inner diameter of the evaporation channel and forming a gradually expanding and contracting structure. This is beneficial to increasing the flow velocity of the working fluid. The working fluid can easily change the pressure in the evaporation channel during the flow process. The liquid working fluid added from the fins can be easily carried to the upper part of the evaporation channel. Therefore, the dry burning phenomenon in the upper part of the evaporation channel can be improved, and the heat dissipation efficiency of the gradually expanding structure of the evaporation channel can also be improved, thereby improving the overall heat dissipation efficiency of the gas-liquid two-phase radiator. Attached Figure Description

[0013] In the accompanying drawings of the embodiments disclosed herein:

[0014] Figure 1 This is a diagram illustrating an application scenario of the gas-liquid two-phase radiator provided in an embodiment of this disclosure.

[0015] Figure 2 An exploded view of the gas-liquid two-phase radiator provided in the embodiments of this disclosure;

[0016] Figure 3 This is a schematic diagram of the structure of a gas-liquid two-phase radiator provided in an embodiment of the present disclosure;

[0017] Figure 4 An exploded view of a gas-liquid two-phase radiator provided in an embodiment of this disclosure;

[0018] Figure 5 A cross-sectional view of a gas-liquid two-phase radiator provided in an embodiment of this disclosure;

[0019] Figure 6 A schematic diagram of a first cover plate provided in an embodiment of this disclosure;

[0020] Figure 7 A schematic diagram of another first cover plate provided in an embodiment of this disclosure;

[0021] Figure 8 A cross-sectional view of another gas-liquid two-phase radiator provided in an embodiment of this disclosure;

[0022] Figure 9 A schematic diagram of another ejector structure provided in this disclosure embodiment;

[0023] Figure 10 A schematic diagram of yet another ejector structure provided in this disclosure embodiment;

[0024] Figure 11 A schematic diagram of another ejector structure provided in the embodiments of this disclosure;

[0025] Figure 12 An exploded view of another gas-liquid two-phase radiator provided in an embodiment of this disclosure;

[0026] Figure 13 A schematic diagram of yet another first cover plate provided in an embodiment of this disclosure;

[0027] Figure 14 Cross-sectional view of another gas-liquid two-phase radiator provided in this embodiment;

[0028] Figure 15 This is a schematic diagram of another second cover plate provided in an embodiment of the present disclosure;

[0029] Figure 16 An exploded view of the structure of another gas-liquid two-phase radiator provided in this embodiment of the present disclosure;

[0030] Figure 17 A schematic diagram of a condensation flow channel provided in an embodiment of this disclosure;

[0031] Figure 18 A schematic diagram of another condensation flow channel provided in an embodiment of this disclosure;

[0032] Figure 19 A schematic diagram of yet another condensation channel provided in an embodiment of this disclosure;

[0033] Figure 20 A schematic diagram of another condensation flow channel provided in an embodiment of this disclosure;

[0034] Figure 21 This is a schematic diagram showing the flow direction of the working fluid in this embodiment;

[0035] Figure 22 This is a flowchart illustrating a method for manufacturing a heat sink according to an embodiment of the present disclosure;

[0036] Figure 23 This disclosure provides a connection method between a gas-liquid two-phase radiator and an electronic device.

[0037] Figure 24 Another connection method between a gas-liquid two-phase radiator and an electronic device provided in this embodiment of the present disclosure;

[0038] Figure 25 This is another connection method between a gas-liquid two-phase radiator and an electronic device provided in the embodiments of this disclosure;

[0039] Figure 26 This provides another method for connecting a gas-liquid two-phase radiator to an electronic device, as provided in the embodiments of this disclosure. Detailed Implementation

[0040] To enable those skilled in the art to better understand the technical solutions of this disclosure, the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0041] The present disclosure will be described more fully below with reference to the accompanying drawings; however, the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as limited to the embodiments set forth below. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will enable those skilled in the art to fully understand the scope of the disclosure.

[0042] The accompanying drawings of the embodiments disclosed herein are provided to further illustrate the embodiments of this disclosure and form part of the specification. They are used together with the detailed embodiments to explain this disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the description of the detailed embodiments with reference to the accompanying drawings.

[0043] This disclosure may be described with reference to plan and / or cross-sectional views using the ideal schematic diagrams of this disclosure. Therefore, the example illustrations may be modified according to manufacturing techniques and / or tolerances.

[0044] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0045] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. The term "and / or" as used in this disclosure includes any and all combinations of one or more of the associated enumerated entries. The singular forms "a" and "the" as used in this disclosure are also intended to include the plural forms, unless the context clearly indicates otherwise. The terms "comprising," "made of," etc., as used in this disclosure specify the presence of the stated feature, integral, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0046] Unless otherwise specified, all terms used in this disclosure (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined in this disclosure.

[0047] This disclosure is not limited to the embodiments shown in the accompanying drawings, but includes modifications to the configuration based on the manufacturing process. Therefore, the areas illustrated in the drawings are schematic, and the shapes of the areas shown illustrate specific shapes of areas of an element, but are not intended to be limiting.

[0048] In some related technologies, a gas-liquid two-phase radiator includes a substrate and several fins. The substrate contains evaporation channels, and the fins contain condensation channels. The evaporation and condensation channels are connected. The working fluid absorbs heat in the evaporation channel and forms a gaseous state, then rises gradually due to buoyancy and flows into the condensation channel. In the condensation channel, the gaseous working fluid releases heat and forms a liquid state, which then collects at the bottom of the condensation channel due to gravity and flows into the evaporation channel. When the height of the gas-liquid two-phase radiator is large, due to gravity and gas pressure, the liquid working fluid has difficulty reaching the upper part of the evaporation channel. The upper part of the evaporation channel only contains gaseous working fluid. Therefore, boiling-evaporation phase change heat transfer cannot occur in the upper part of the evaporation channel, reducing the heat dissipation effect and causing a "dry burning" phenomenon. This results in higher pressure in the upper part of the evaporation channel, affecting the circulation of the working fluid in the lower part and further reducing the heat dissipation effect.

[0049] Figure 1 This diagram illustrates an application scenario of the gas-liquid two-phase radiator provided in this embodiment of the disclosure. Figure 1As shown, the evaporation surface of the gas-liquid two-phase radiator 10 is in contact with the heating surface of the heating element 20, and heat conduction occurs between the evaporation surface and the heating surface, carrying away the heat from the heating element 20. The gas-liquid two-phase radiator 10 and the heating element 20 are vertically arranged, with the evaporation channel parallel to the direction of gravity. The liquid working fluid converges towards the bottom of the condensation channel, and the gaseous working fluid converges towards the top of the evaporation channel. The heating surface of the heating element 20 is completely covered by the evaporation surface of the gas-liquid two-phase radiator 10.

[0050] Figure 2 This is an exploded view of a gas-liquid two-phase radiator provided in an embodiment of this disclosure. Figure 2 As shown, a portion of the heating surface of the heating device 20 has built-in heat dissipation fins 21, such as the lower part of the heating surface having built-in heat dissipation fins 21, but the upper part of the heating device 20 does not have built-in heat dissipation fins 21. In use, the evaporation surface of the gas-liquid two-phase radiator 10 is in contact with the upper part of the heating surface of the heating device 20; that is, the gas-liquid two-phase radiator 10 only covers a portion of the heating surface of the heating device 20, not completely. The heat generated by the heating device 20 can be dissipated through the built-in heat dissipation fins 21 and the gas-liquid two-phase radiator 10.

[0051] It should be noted that when the gas-liquid two-phase radiator 10 only covers part of the heating surface of the heating device 20, the gas-liquid two-phase radiator 10 is not limited to covering the upper part of the heating surface of the heating device 20, but may also only cover the lower part, middle part, left side or right side of the heating surface of the heating device 20.

[0052] In a first aspect, the present disclosure provides a gas-liquid two-phase radiator that can improve heat dissipation and avoid dry burning.

[0053] Figure 3 This is a schematic diagram of the structure of a gas-liquid two-phase radiator provided in an embodiment of this disclosure. Figure 4 This is an exploded view of a gas-liquid two-phase radiator provided in an embodiment of this disclosure. Figure 5 This is a cross-sectional view of a gas-liquid two-phase radiator provided in an embodiment of this disclosure. (In conjunction with...) Figures 3 to 5 This disclosure provides a gas-liquid two-phase radiator comprising:

[0054] The substrate 1 includes a first cover plate 11 and a second cover plate 12 stacked with the first cover plate 11. A plurality of evaporation channels 13 are spaced apart between the first cover plate 11 and the second cover plate 12. At least one protrusion 14 is provided in the evaporation channel 13. The protrusion 14 protrudes in the radial direction of the evaporation channel 13, thereby reducing the inner diameter of the evaporation channel 13. This results in the entire evaporation channel 13 forming a gradually narrowing and expanding ejector structure. This ejector structure can change the flow speed of the working fluid in the evaporation channel 13, which can not only improve the heat transfer coefficient, but also carry the liquid working fluid replenished from the fins to the upper region of the evaporation channel 13.

[0055] Multiple fins 2 are fixedly connected to the substrate 1. A condensation channel 21 for the working fluid to flow is provided in the fin 2. The condensation channel 21 is connected to the evaporation channel 13. The working fluid absorbs heat in the evaporation channel 13 and turns into a gaseous state before flowing into the condensation channel 21. It releases heat in the condensation channel 21 and turns into a liquid state before flowing into the evaporation channel 13.

[0056] In some embodiments, one of the first cover plate 11 and the second cover plate 12 may be attached to the heating device 20. When the first cover plate 11 is attached to the heating device 20, the second cover plate 12 is away from the heating device 20, and the fins 2 are fixed to the second cover plate 12. When the second cover plate 12 is attached to the heating device 20, the first cover plate 11 is away from the heating device 20, and the fins 2 are fixed to the first cover plate 11.

[0057] In this embodiment, the working fluid circulates within the evaporation channel 13 and the condensation channel 21. The working fluid includes both liquid and gaseous states, and can transform from liquid to gaseous or vice versa during a phase change. For example, within the evaporation channel 13, the liquid working fluid absorbs heat and undergoes a phase change, transforming into a gaseous state, which then moves upward within the evaporation channel 13 due to buoyancy. Within the condensation channel 21, the gaseous working fluid releases heat and undergoes a phase change, transforming into a liquid state, which then flows downward within the condensation channel 21 due to gravity. The fins 2 facilitate the heat release of the gaseous working fluid.

[0058] In the embodiments disclosed herein, the working fluid includes, but is not limited to, refrigerants such as ammonia, acetone, water, ethanol, methanol, and fluorinated liquid.

[0059] For ease of description, this disclosure defines the fin arrangement direction (left-right direction on the paper) as the first direction, the direction in which the fins extend from the fixed end to the free end (perpendicular to the paper) as the second direction, and the extension direction of the evaporation channel (vertical direction) as the third direction.

[0060] In some embodiments, a plurality of support columns 15 are spaced apart between the first cover plate 11 and the second cover plate 12, and an evaporation channel 13 is formed between adjacent support columns 15. A protrusion 14 is disposed on the side of the support column 15 near the evaporation channel 13.

[0061] The support column 15 can be provided on the first cover plate 11 or the second cover plate 12, or support columns can be provided on both the first cover plate 11 and the second cover plate 12. The following description takes the provision of support column 15 on the first cover plate 11 as an example.

[0062] Figure 6 This is a schematic diagram of a first cover plate provided in an embodiment of this disclosure. (In conjunction with...) Figure 4 and Figure 6 The first cover plate 11 includes a first surface and a second surface, wherein the first surface is away from the heat source and the second surface is close to the heat source. Support columns 15 are disposed on the first surface of the first cover plate 11. Evaporation channels 13 are formed between adjacent support columns 15. When multiple support columns 15 are provided, the multiple support columns 15 are spaced apart, forming multiple evaporation channels 13 arranged at intervals.

[0063] like Figure 6 As shown, the protrusion 14 is disposed on the support column 15 and protrudes towards the evaporation channel 13. That is, the protrusion 14 reduces the inner diameter of the evaporation channel 13 in the first direction, and a gradually expanding and contracting structure is formed near the protrusion 14. When the working fluid flows through this structure, the contracting portion of the evaporation channel 13 can accelerate the upward flow velocity of the working fluid, increasing the heat transfer coefficient in the local area, and forming a low-pressure zone within the evaporation channel 13 near the protrusion 14, which helps improve the heat dissipation effect of the gas-liquid two-phase radiator. Furthermore, the increased flow velocity of the working fluid, combined with the contracting portion of the evaporation channel 13, helps carry the liquid working fluid added from the fins to the upper part of the evaporation channel 13, enabling the upper part of the evaporation channel 13 to maintain phase change evaporation of the working fluid, thereby improving the heat dissipation effect in the upper region of the substrate. After the liquid working fluid is added, the expanding portion of the evaporation channel 13 can decrease the flow velocity and increase the pressure of the working fluid, ensuring that a gradient pressure is formed within the evaporation channel 13, thus completing the flow cycle.

[0064] In this embodiment, the protrusion 14 and the support column 15 can be an integral structure or separate structures. When the protrusion 14 and the support column 15 are an integral structure, the protrusion 14 can be machined together when machining the support column 15. When the protrusion 14 and the support column 15 are separate structures, the protrusion 14 and the support column 15 can be machined separately, and then fixed together by welding, bonding, or other methods.

[0065] In this embodiment, the protrusion 14 can be disposed on the support column 15, or it can be disposed in other locations, such as on the first cover plate 11 and / or the second cover plate 12. Moreover, the protrusion 14 is disposed on the first cover plate 11 and / or the second cover plate 12 and is located opposite to the evaporation channel 13. The following description uses the example of the protrusion 14 being disposed on the first cover plate 11.

[0066] Figure 7 This is a schematic diagram of another gas-liquid two-phase radiator provided in an embodiment of this disclosure. Figure 8 A cross-sectional view of another gas-liquid two-phase radiator provided in an embodiment of this disclosure. (See figure) Figure 7 and Figure 8 As shown, the protrusion 14 is disposed on the first surface of the first cover plate 11, and the protrusion 14 is positioned opposite to the evaporation channel 13. That is, the protrusion 14 reduces the inner diameter of the evaporation channel 13 in the second direction, and can also form a gradually shrinking and expanding structure.

[0067] In this embodiment, the protrusion 14 and the first cover plate 11 can be an integral structure or separate structures. When the protrusion 14 and the first cover plate 11 are an integral structure, the protrusion 14 can be machined on the first surface of the first cover plate 11 during the machining of the first cover plate 11. When the protrusion 14 and the first cover plate 11 are separate structures, the protrusion 14 and the first cover plate 11 can be machined separately, and then the protrusion 14 and the first cover plate 11 can be fixed together by welding, bonding or other methods.

[0068] In this embodiment of the disclosure, the surface of the protrusion 14 facing the evaporation channel 13 is a plane, an arc surface, or a combination of a plane and an arc surface. Figure 7 and Figure 8 The surface of the protrusion 14 facing the evaporation channel 13 is flat, forming a straight ejector structure. Figure 9 This is a schematic diagram of another ejector structure provided in an embodiment of this disclosure. (See diagram below.) Figure 9 As shown, the surface of the protrusion 14 facing the evaporation channel 13 is an arc surface, forming an arc-shaped ejector structure.

[0069] When the surface of the protrusion 14 facing the evaporation channel 13 is a plane, the inclination angle of the plane can be set arbitrarily, and this disclosure does not limit it.

[0070] When the surface of the protrusion 14 facing the evaporation channel 13 is an arc surface, the curvature of the arc surface can be arbitrarily set. When the curvature of the arc surface is large, it forms... Figure 9 The ejector structure shown. When the curvature of the curved surface is small, an hourglass-shaped ejector structure is formed, such as... Figure 10 As shown.

[0071] In some embodiments, such as Figure 6 , Figure 9 and Figure 10 As shown, the evaporation channel 13 includes a first evaporation channel section 13a and a second evaporation channel section 13b. The first evaporation channel section 13a and the second evaporation channel section 13b are connected on the same straight line, that is, the axes of the first evaporation channel section 13a and the second evaporation channel section 13b coincide. The protrusion 14 is provided at the connection position of the first evaporation channel section 13a and the second evaporation channel section 13b, that is, the protrusion 14 divides the evaporation channel into the connected first evaporation channel section 13a and the second evaporation channel section 13b.

[0072] Figure 11 A schematic diagram of another ejector structure provided in the embodiments of this disclosure, as shown below. Figure 11 As shown, the evaporation channel 13 includes a first evaporation channel section 13a and a second evaporation channel section 13b. The first evaporation channel section 13a and the second evaporation channel section 13b are staggered, that is, the axes of the first evaporation channel section 13a and the second evaporation channel section 13b do not coincide. The protrusion 14 is provided at the end of the first evaporation channel section 13a near the end of the second evaporation channel section 13b, that is, the protrusion 14 is provided at the lower end of the first evaporation channel section 13a.

[0073] When the axes of the first evaporation channel section 13a and the second evaporation channel section 13b do not coincide, the support column 15 corresponding to the first evaporation channel section 13a and the support column 15 corresponding to the second evaporation channel section 13b are not on a straight line. For example, as Figure 11 As shown, the position of the support column 15 corresponding to the second evaporation channel section 13b is opposite to that of the first evaporation channel section 13a, that is, the axis of the support column 15 corresponding to the second evaporation channel section 13b coincides with the axis of the first evaporation channel section 13a. In this case, the support column 15 may affect the second interface 24. The support column 15 can be misaligned so that it does not obstruct the second interface 24.

[0074] In this embodiment of the disclosure, each support column 15 may be a continuous support column or may be composed of multiple support column segments of shorter length.

[0075] exist Figure 6 , Figure 9 , Figure 10 and Figure 11 In the substrate shown, a protrusion 14 is provided within the evaporation channel 13, that is, an ejector structure is provided within the evaporation channel 13. However, the embodiments disclosed herein are not limited to this. Multiple protrusions 14 can be provided within each evaporation channel 13, that is, multiple ejector structures can be provided within each evaporation channel 13. When the energy of the gas-liquid two-phase radiator is high, multiple ejector structures can be provided within each evaporation channel 13, and all heat can be dissipated to the ambient air by the gas-liquid two-phase radiator.

[0076] Figure 13A schematic diagram of another ejector structure provided in this disclosure embodiment is shown below. Figure 13 As shown, two protrusions 14 are provided at intervals in the evaporation channel 13. The present invention does not limit the spacing or number of the two protrusions 14.

[0077] In some embodiments, see Figures 4 to 6 A first opening 16 is provided between the first cover plate 11 and the second cover plate 12 and at the first end. The first opening 16 connects the first ends of multiple evaporation channels 13 to balance the pressure of the gaseous working fluid in each evaporation channel 13. This can prevent some evaporation channels 13 from experiencing saturation pressure and saturation temperature rise, thereby preventing the liquid working fluid in the evaporation channel 13 from being difficult to evaporate.

[0078] A second opening 17 is provided between the first cover plate 11 and the second cover plate 12 and at the second end. The second opening 17 connects the second ends of the multiple evaporation channels 13 to balance the liquid level of the liquid working medium in each evaporation channel 13 and prevent the liquid working medium in some evaporation channels 13 from being burned dry in areas with local high heat flux density.

[0079] It should be noted that the first end and the second end mentioned in this disclosure are two opposite ends, and the specific positions of the first end and the second end are not limited in the embodiments of this disclosure. For ease of description, the end located higher is referred to as the first end, and the end located lower is referred to as the second end. For example, the first end of the first cover plate 11 is the top end of the first cover plate 11, and the second end of the first cover plate 11 is the bottom end of the first cover plate 11. The definitions of the first end and the second end of other components are similar and will not be repeated here.

[0080] In some embodiments, such as Figure 4 As shown, the second cover plate 12 is provided with a plurality of first connection holes 121 and a plurality of second connection holes 122 extending through its thickness. The first connection holes 121 are located at the first end of the second cover plate 12, and the second connection holes 122 are located at the second end of the second cover plate 12. Each evaporation channel 13 is connected to a first connection hole 121 and a second connection hole 122.

[0081] In this embodiment, a plurality of first connecting holes 121 are arranged at intervals at the first end of the second cover plate 12, and each first connecting hole 121 communicates with an evaporation channel 13. A plurality of second connecting holes 122 are arranged at intervals at the second end of the second cover plate 12, and each second connecting hole 122 communicates with an evaporation channel 13, that is, each evaporation channel 13 corresponds to one first connecting hole 121 and one second connecting hole 122. Gaseous working fluid flows out of the evaporation channel 13 from the first connecting hole 121, and liquid working fluid enters the evaporation channel 13 from the second connecting hole 122.

[0082] like Figure 5 As shown, the first end of the fin 2 is provided with a first interface 23, one end of which is connected to the condensation channel 21, and the other end is connected to a first connection hole 121. The second end of the fin is provided with a second interface 24, one end of which is connected to the condensation channel 21, and the other end is connected to a second connection hole 122.

[0083] The gaseous working fluid flows out of the evaporation channel 13 through the first connection hole 121 and enters the condensation channel 21 through the first interface 23. The liquid working fluid flows out of the condensation channel 21 through the second interface 24 and enters the evaporation channel 13 through the second connection hole 122.

[0084] In some embodiments, the flow channel of the second interface 24 is an inclined flow channel, and the height of one side of the fin 2 is lower than that of the substrate 1. The inclined flow channel helps the bubbles generated during the evaporation of the liquid working fluid to rise smoothly and leave the second interface 24, and can prevent the bubbles in the substrate from entering the fins from the second interface 24, thereby avoiding the problem of poor liquid working fluid return caused by the accumulation and blockage of the second interface 24, and preventing the flow of bubbles and the return of liquid working fluid from conflicting. At the same time, the return of bubbles to the evaporation flow channel 13 can also increase the flow velocity of the working fluid, increase the disturbance of the gaseous working fluid, and improve the heat exchange effect.

[0085] In some embodiments, a plurality of third connection holes 123 penetrating through the thickness of the second cover plate 12 are also provided on the second cover plate 12, each evaporation channel 13 communicating with at least one third connection hole 123, and at least one third connection hole 123 being spaced apart between the first connection hole 121 and the second connection hole 122.

[0086] like Figure 4 As shown, a third connecting hole 123 is provided on the second cover plate 12. The third connecting hole 123 is located between the first connecting hole 121 and the second connecting hole 122, and is located at the protrusion 14. That is, the third connecting hole 123 is opposite to the position with the smallest inner diameter in the evaporation channel 13.

[0087] like Figure 5 As shown, at least one third interface 25 corresponding to the third connection hole 123 is also provided on the fin 2. One end of each third interface 25 is connected to the condensation channel 21, and the other end is connected to the third connection hole 123.

[0088] The liquid working fluid in the condensation channel 21 can flow back into the evaporation channel 13 through the third connecting hole 123. Since the third connecting hole 123 is located at the protrusion 14, the low pressure generated by the rapid flow of the working fluid at the protrusion 14 helps the liquid working fluid to flow back to the upper region of the evaporation channel 13 after being ejected, that is, to the top of the protrusion 14. This replenishes the liquid in the upper region of the evaporation channel 13, allowing the upper region of the evaporation channel 13 to obtain more liquid working fluid, which can improve the heat exchange efficiency and prevent dry burning.

[0089] In some embodiments, the flow channel of the third interface 25 is an inclined flow channel, and the height of one side of the fin is lower than that of the substrate side. The inclined flow channel helps the bubbles generated during the evaporation of the liquid working fluid to rise smoothly and leave the third interface 25, and prevents bubbles in the substrate from entering the fins from the third interface 25, thereby avoiding the problem of poor liquid working fluid return caused by bubble accumulation and blockage of the third interface 25, and preventing the conflict between bubble flow and liquid working fluid return. At the same time, the return of bubbles to the evaporation flow channel 13 can also increase the flow velocity of the working fluid and increase the disturbance of the gaseous working fluid, thereby improving the heat exchange effect.

[0090] exist Figure 4 On the substrate shown, each evaporation channel 13 is provided with a protrusion 14 and a third interface 25, but the embodiments disclosed herein are not limited thereto. Each evaporation channel 13 may be provided with two or more protrusions 14 and third interfaces 25.

[0091] For example, Figure 12 This is an exploded view of another gas-liquid two-phase radiator provided in an embodiment of this disclosure. (Combined with...) Figure 12 and Figure 13 Each evaporation channel 13 is provided with two protrusions 14, and two third connecting holes 123 are provided on the second cover plate 12. The two protrusions 14 are spaced apart in the third direction, and the two third connecting holes 123 are spaced apart in the third direction. Moreover, the positions of the third connecting holes 123 and the protrusions 14 are corresponding.

[0092] When each evaporation channel 13 can be provided with two or more protrusions 14, a third connecting hole 123 equal in number to the protrusions 14 can be provided on the second cover plate 12, and a third interface 25 equal in number to the protrusions 14 can be provided on the fin 2.

[0093] For example, combined Figures 12 to 14Each evaporation channel 13 is provided with two protrusions 14, the second cover plate 12 is provided with two third connecting holes 123, and the fins 2 are provided with two third interfaces 25. The positions of the protrusions 14, the third connecting holes 123, and the third interfaces 25 are corresponding. When each evaporation channel 13 is provided with multiple protrusions 14, the second cover plate 12 is provided with multiple third connecting holes 123, and the fins 2 are provided with multiple third interfaces 25, the liquid replenishment channel between the condensation channel 21 and the evaporation channel 13 can be increased, and liquid working fluid can be replenished to different heights in the evaporation channel 13, which helps to improve the heat dissipation efficiency of the gas-liquid two-phase radiator.

[0094] In some embodiments, the support column 15 is disposed on the second surface of the second cover plate 12, i.e., on the side closer to the heat source. Figure 15 This is a schematic diagram of another second cover plate provided in an embodiment of this disclosure. Figure 16 This is an exploded view of the structure of a gas-liquid two-phase radiator provided in an embodiment of this disclosure. Figure 15 and Figure 16 As shown, multiple support columns 15 are spaced apart on the surface of the second cover plate 12, forming an evaporation channel 13 between adjacent support columns 15. A protrusion 14 is provided on the side of each support column 15, protruding towards the evaporation channel 13. A fourth connecting hole 124 is also provided on the second cover plate 12, communicating with the filling pipe 3, for filling the evaporation channel 13 with working fluid.

[0095] In this embodiment of the disclosure, the condensation channel 21 may take different shapes or combinations of different shapes. In some embodiments, the shape of the condensation channel 21 includes one or more combinations of honeycomb shape, circular hole shape, diagonal shape, bent shape and Tesla valve shape.

[0096] like Figure 5 As shown, the shape of the condensation channel 21 is a combination of honeycomb and oblique line shapes, that is, the shape of the condensation channel 21 at the top of the fin 2 is honeycomb, and the shape of the condensation channel 21 at the bottom is oblique line.

[0097] Figure 17 This is a schematic diagram of a condensation flow channel provided in an embodiment of this disclosure. Figure 17 As shown, the shape of the condenser channel 21 is a combination of the Tesla valve shape and the circular hole shape, that is, the shape of the condenser channel 21 at the top of the fin 2 is the circular hole shape, and the middle and lower parts are the Tesla valve shape.

[0098] Figure 18 This is a schematic diagram of another condensation flow channel provided in an embodiment of this disclosure. (See diagram below.) Figure 18As shown, the shape of the condensation channel 21 is a combination of a circular hole shape and a bent shape. That is, a bent condensation channel is provided inside the fin 2. The bent condensation channel 21 has a larger shape. A circular hole condensation channel 21 is provided inside the bent condensation channel 21. That is, a circular hole condensation channel is embedded inside the bent condensation channel.

[0099] Figure 19 This is a schematic diagram of yet another condensation flow channel provided in an embodiment of this disclosure. (See diagram below.) Figure 19 As shown, the condensation channel 21 is in the shape of an oblique line, that is, only the condensation channel in the shape of an oblique line is provided in the fin 2.

[0100] Figure 20 This is a schematic diagram of yet another condensation flow channel provided in an embodiment of this disclosure. (See diagram below.) Figure 20 As shown, the condensation channel 21 is honeycomb shaped, that is, only honeycomb shaped condensation channels are provided in the fin 2.

[0101] In this embodiment, the condensation channel 21 can enhance phase change heat transfer inside the fins 2 and improve the heat dissipation performance of the gas-liquid two-phase radiator.

[0102] In some embodiments, the fin 2 includes a first fin plate and a second fin plate stacked together, with a condensation channel 21 formed between the first fin plate and the second fin plate.

[0103] like Figure 16 As shown, the first cover plate 11 is disposed on the heat source side, and the second cover plate 12 is disposed on the side away from the heat source. Multiple fins are spaced apart on the surface of the second cover plate 12 on the side away from the heat source.

[0104] The gas-liquid two-phase radiator also includes a first side plate 18 and a second side plate 19, which are respectively disposed on both sides of a plurality of fins 2. The first side plate 18 and the second side plate 19 can be used for heat dissipation and also to protect the fins, preventing the radiator from deforming when subjected to external impact, which could lead to working fluid leakage and affect heat dissipation performance. In some embodiments, the first side plate 18 and the second side plate 19 can be fixed to both sides of the plurality of fins 2 by a substrate 1.

[0105] In some embodiments, the gas-liquid two-phase radiator further includes a filling pipe 3, which is connected to the evaporation channel 13 or the condensation channel 21, and is used to fill the radiator with working fluid.

[0106] Figure 21 This is a schematic diagram showing the flow direction of the working fluid in this embodiment. (Combined with...) Figure 4 , Figure 5 and Figure 21As shown, due to gravity, inside the two-phase radiator, the liquid working fluid forms a liquid zone at the bottom and a vapor zone at the top. The working fluid circulation process includes:

[0107] The first cover plate 11 transfers the heat generated by the heat source to the liquid working medium in the evaporation channel 13. The liquid working medium undergoes a phase change when heated, forming a gaseous working medium. The gaseous working medium flows upward under the action of buoyancy, while carrying some liquid working medium with it.

[0108] The gaseous working fluid flows upward to the top of the evaporation channel 13, and enters the condensation channel 21 of the fin through the first connecting hole and the first interface 23. In the condensation channel 21, heat is released and a phase change occurs to form a liquid working fluid, which flows downward under the action of gravity.

[0109] The liquid working fluid flows into the liquid region within the condensation channel 21. In the upper part of the liquid region, the liquid working fluid is drawn into the upper region of the evaporation channel 13 through the third interface 25 and the third connecting hole 123 by the ejector structure (liquid replenishment). In the lower part of the liquid region, the liquid working fluid flows back to the bottom of the evaporation channel 13 through the second interface 24, the second connecting hole 122, and the second opening 17. The liquid working fluid flowing into the evaporation channel 13 absorbs heat from the heat source and is converted back into gaseous working fluid, completing the cycle. As the amount of gaseous working fluid in the evaporation channel 13 increases, the pressure within the evaporation channel 13 increases, accelerating the flow of gaseous working fluid into the condensation channel, thereby increasing heat dissipation efficiency.

[0110] The gas-liquid two-phase radiator in this embodiment includes a substrate and multiple fins fixed to the substrate. Multiple evaporation channels are spaced apart between a first cover plate and a second cover plate. Condensation channels are provided inside the fins. The evaporation channels and condensation channels are connected. The working fluid absorbs heat in the evaporation channel and turns into a gaseous state before flowing into the condensation channel. In the condensation channel, it releases heat and turns into a liquid state before flowing into the evaporation channel. That is, the working fluid circulates repeatedly in the evaporation channel and the condensation channel. At least one protrusion is provided in the evaporation channel, which protrudes in the radial direction of the evaporation channel, thereby changing the inner diameter of the evaporation channel and forming a gradually expanding and contracting structure. This is beneficial to improving the flow velocity of the working fluid. The gaseous working fluid can easily change the pressure in the evaporation channel during the flow process. The liquid working fluid added from the fins can easily be carried to the upper part of the evaporation channel. Therefore, the dry burning phenomenon in the upper part of the evaporation channel can be improved. It can also improve the heat dissipation efficiency and heat dissipation uniformity of the gradually expanding structure of the evaporation channel, thereby improving the overall heat dissipation efficiency of the gas-liquid two-phase radiator.

[0111] Secondly, embodiments of this disclosure provide a method for manufacturing a heat sink.

[0112] Figure 22 This is a flowchart illustrating a method for manufacturing a heat sink according to an embodiment of this disclosure. Figure 22As shown, this disclosure provides a method for manufacturing a heat sink, including:

[0113] Step S10: Set a substrate. The substrate includes a first cover plate and a second cover plate stacked with the first cover plate. A plurality of evaporation channels are provided between the first cover plate and the second cover plate. At least one protrusion is provided in the evaporation channel and the protrusion protrudes in the radial direction of the evaporation channel.

[0114] Step S20: Set multiple fins, and set condensation channels for the working fluid to flow inside the fins.

[0115] Step S30: Fix multiple fins to the substrate and connect the condensation channel to the evaporation channel so that the working fluid absorbs heat in the evaporation channel, turns into a gaseous state, and flows into the condensation channel. In the condensation channel, it releases heat, turns into a liquid state, and flows into the evaporation channel.

[0116] In some embodiments, the first cover plate can be manufactured by precision forging, liquid die casting, or semi-solid die casting, and then support columns and protrusions can be fabricated on the first cover plate. When the support columns and protrusions are provided on the first cover plate, the first cover plate, support columns, and protrusions can be directly manufactured by precision forging, liquid die casting, or semi-solid die casting, and then dimensionally trimmed using a CNC machine tool. In some embodiments, the first cover plate, support columns, and protrusions are directly machined using a CNC machine tool.

[0117] When the first cover plate has no supporting pillars and protruding structures, the excess part can be removed from the plate by means of stamping, etching, etc., and the first cover plate can be obtained after shaping.

[0118] In some embodiments, the first cover plate can serve as the housing of the heating element, or the housing of the heating element can be considered as the first cover plate. In this case, the housing with structural features such as support columns and protrusions can be obtained in one step by forging or die casting processes, and it can also be trimmed by a CNC machine tool to ensure dimensional accuracy.

[0119] In some embodiments, a heat sink housing with structural features such as support columns and protrusions, as well as other structural features (such as heat dissipation teeth, bosses, etc.) can be directly machined using a CNC machine tool.

[0120] In some embodiments, capillary structures can also be provided within the evaporation channel to provide capillary force for drawing the liquid working fluid. The capillary structure can be a sintered powder capillary structure, a wire mesh capillary structure, a porous foam metal capillary structure, etc. Capillary materials, such as metal powder, metal wire mesh, foam metal, etc., are arranged at corresponding positions in the evaporation channel on the first cover plate; then, the first cover plate with the arranged capillary materials undergoes a high-temperature sintering or partial welding process.

[0121] In some embodiments, the capillary structure of the evaporation channel arrangement can also be an electrodeposited capillary structure. The first cover plate is immersed in a polishing solution for polishing, and then the polished first cover plate is cleaned and immersed in the solution. A layer of metal is prepared on the first cover plate at the corresponding position of the evaporation channel as a capillary structure by electrochemical deposition.

[0122] In some embodiments, the second cover plate can be machined using a CNC machine tool. When the second cover plate is provided with support columns and protrusions, the second cover plate and its connecting holes, support columns, protrusions, and other structures can be directly machined using a CNC machine tool. When the second cover plate does not have support columns or other structures, the excess part of the sheet metal is removed by punching, laser cutting, or other methods, and after shaping, a second cover plate with connecting holes (including a first connecting hole and a second connecting hole, or a first connecting hole, a second connecting hole, and a third connecting hole) is obtained.

[0123] In some embodiments, fins can be obtained by roll-blowing. For example, fins are obtained through the following steps:

[0124] Cleaning: Clean the first fin plate and the second fin plate to remove oil stains from their surfaces.

[0125] Printing and plate riveting: The flow channel shape is printed on the first fin plate and the second fin plate by graphite printing, and the two plates are riveted together.

[0126] Rolling involves rolling the first and second fin plates after riveting, which can be done through hot rolling pressing and cold rolling forming processes.

[0127] Annealing is the process of annealing rolled sheet metal to increase the strength of the first and second finned plates.

[0128] The expansion process involves blowing with high-pressure gas to create a condensation channel between the first and second fin plates.

[0129] Punching and trimming: Punching and trimming are performed on the first and second fin plates after inflation to remove excess parts.

[0130] Laser cutting is used to cut the positions on the first and second fin plates used to connect the fins and the second cover plate to obtain the connection port.

[0131] Enlarging is performed on the interface (including the first interface and the second interface, or the first interface, the second interface and the third interface) with the flow channel fins and the second cover plate to ensure that the dimensions of the connecting holes on the interface and the second cover plate are well matched and meet the subsequent welding and sealing conditions.

[0132] Shaping and inspection: Shaping and inspecting the fins to compensate for deformations that occur during processing, in order to meet the requirements for dimensional accuracy and surface shape.

[0133] In some embodiments, fins can also be processed by brazing. For example, fins can also be obtained through the following steps:

[0134] Cutting: Cut the first fin plate and the second fin plate to remove excess parts and obtain the desired shape.

[0135] The flow channel is formed by stamping or machining on the first and second fin plates.

[0136] Cleaning involves cleaning the first and second fin plates that have been processed to create the flow channels, removing oil and dirt.

[0137] Apply solder to the welding surfaces of the first and second fin plates. A mask can be used to prevent solder from remaining in the flow channel and causing blockage.

[0138] Overlapping and fixing: The first and second fin plates to be welded are overlapped and fixed.

[0139] Brazing involves placing the first and second fin plates, which have been overlapped and fixed, into a brazing furnace for brazing to obtain fins.

[0140] Enlarge the hole at the interface between the fin and the second cover plate to ensure a good dimensional match between the interface and the connecting hole on the second cover plate, so as to meet the subsequent welding and sealing conditions.

[0141] Shaping and inspection: Shaping and inspecting the fins to compensate for deformations that occur during processing, in order to meet the requirements for dimensional accuracy and surface shape.

[0142] The first and second side plates can be obtained by punching, laser cutting, or other methods.

[0143] After obtaining components such as the first cover plate, the second cover plate, fins, the first side plate, and the second side plate, a gas-liquid two-phase radiator is obtained through the following steps.

[0144] Cleaning and degreasing: Clean each part to remove oil and grease from its surface.

[0145] Brazing filler metal is applied to the welding locations on the first cover plate, second cover plate, fins, first side plate, and second side plate.

[0146] Clamp the first cover plate, second cover plate, fins, first side plate, second side plate, and filling tube together using a tooling fixture. Alternatively, the filling tube can be brazed as a single unit without initial assembly and then welded separately later.

[0147] Brazing involves placing the assembled components into a brazing furnace for brazing, resulting in a gas-liquid two-phase radiator.

[0148] After welding is completed, remove the tooling fixtures used to fix the components.

[0149] Shaping and inspection: Shaping and inspecting the gas-liquid two-phase radiator to compensate for deformations caused during processing, so as to meet the requirements of dimensional accuracy and surface shape.

[0150] The gas-liquid two-phase radiator is evacuated and then filled with working fluid through a filling pipe.

[0151] After the filling tube is crimped and sealed, it is punched and cut, and then laser welding is used to complete the sealing, resulting in a gas-liquid two-phase radiator.

[0152] Thirdly, embodiments of this disclosure provide an electronic device, including a heat-generating device and a heat sink, wherein the heat sink is used to dissipate heat generated by the heat-generating device, and the heat sink includes the gas-liquid two-phase heat sink provided in embodiments of this disclosure.

[0153] In some embodiments, the first cover plate of the gas-liquid two-phase radiator and the housing of the heating element are separate structures; a thermally conductive material is provided between the first cover plate and the housing of the heating element.

[0154] Among them, thermally conductive materials include, but are not limited to, thermal interface materials such as thermally conductive gel, thermally conductive grease, thermally conductive pads, and phase change plates, which help to conduct heat from heat-generating devices to heat sinks.

[0155] In some embodiments, the first cover plate of the gas-liquid two-phase heat sink is integrally formed with the housing of the heating element, or the first cover plate and the housing of the heating element are separate structures. When the first cover plate and the housing of the heating element are separate structures, the gas-liquid two-phase heat sink can be modularized and universalized, allowing it to be applied to different electronic devices. When the first cover plate and the housing of the heating element are integrally formed, the structure and processing can be simplified, saving manufacturing costs.

[0156] In some embodiments, the evaporation area of ​​the heat sink's substrate is equal to or smaller than the heat dissipation area of ​​the casing. For example... Figure 1 As shown, the evaporation area of ​​the substrate is equal to the heat dissipation area of ​​the casing. For example... Figure 2 The evaporation area of ​​the substrate is smaller than the heat dissipation area of ​​the casing.

[0157] In some embodiments, the evaporation channel is opposite to the heat source area of ​​the housing, so that the heat generated by the heat source can be quickly carried away by the working fluid in the evaporation channel, ensuring the stability of the electronic equipment operation.

[0158] Two-phase heat sinks and electronic devices can be connected in the following ways.

[0159] When the first cover plate and the housing of the heat-generating device are separate structures, the heat sink can be connected to the housing of the electronic device by means of screw connection (screw fitting), friction stir welding, laser welding, etc.

[0160] Figure 23 This disclosure provides a connection method between a gas-liquid two-phase radiator and an electronic device. For example... Figure 23 As shown, the first cover plate of the gas-liquid two-phase radiator 10 is connected to the housing 30 by screws 60. A circuit board (PCB) 40 with heating elements is disposed on the side of the housing 30 away from the first cover plate. The gas-liquid two-phase radiator 10 indirectly conducts heat generated by the heating elements on the circuit board 40 through the housing 30. Thermal interface materials such as thermally conductive silicone grease are disposed between the first cover plate and the housing 30 to improve heat conduction efficiency. Sealing rings 50 are used at the contact surfaces between the four edges of the first cover plate of the gas-liquid two-phase radiator 10 and the housing to prevent water, dust, or silicone grease overflow. The evaporation surface of the gas-liquid two-phase radiator 10 covers the upper part of the heating surface of the housing 30, and fins without condensation channels are disposed at the lower part of the heating surface of the housing 30.

[0161] Figure 24 This disclosure provides another method for connecting a gas-liquid two-phase radiator to an electronic device. For example... Figure 24 As shown, the first cover plate of the gas-liquid two-phase radiator 10 is connected to the housing 30 by screws. A circuit board (PCB) 40 with heating elements is disposed on the side of the housing 30 away from the first cover plate. An opening is provided on the housing 30, and the first cover plate is embedded in the opening and adheres to the circuit board 40. Thermal interface materials such as thermally conductive silicone grease are disposed between the first cover plate and the circuit board 40 to improve heat transfer efficiency. Sealing rings 50 are used at the contact surfaces between the first cover plate of the gas-liquid two-phase radiator 10 and the housing to prevent water, dust, or silicone grease leakage. The evaporation surface of the gas-liquid two-phase radiator 10 covers the upper part of the heating surface of the housing 30, and fins without condensation channels are disposed on the lower part of the heating surface of the housing 30.

[0162] Figure 25 This disclosure provides another method for connecting a gas-liquid two-phase radiator to an electronic device. For example... Figure 25 As shown, the gas-liquid two-phase radiator 10 is connected to the housing 30 via friction stir welding and laser welding. An opening is provided on the housing 30, and the edge of the first cover plate of the gas-liquid two-phase radiator 10 is aligned with the edge of the opening in the housing 30. After assembly, the connecting edges of the housing 30 and the gas-liquid two-phase radiator 10 are welded to form a sealed weld. Thermal interface materials such as thermally conductive silicone grease are applied between the first cover plate of the gas-liquid two-phase radiator 10 and the circuit board 40 to improve heat transfer efficiency. The gas-liquid two-phase radiator 10 covers part of the circuit board 40; the remaining portion of the circuit board 40 is cooled by fins integrated into the housing.

[0163] Figure 26 This disclosure provides yet another method for connecting a gas-liquid two-phase radiator to an electronic device. For example... Figure 26 As shown, when the first cover plate 11 is integrally formed with the housing, the first cover plate of the gas-liquid two-phase heat sink can be used as the housing during the assembly of electronic equipment, and the installation method of the gas-liquid two-phase heat sink remains unchanged. Since the first cover plate 11 and the housing are integrally formed, there is no thermal interface material or welding surface between the first cover plate 11 and the housing, which avoids additional thermal resistance caused by thermal interface materials and reduces the problem of voids in the thermal interface material or welding surface affecting heat conduction. Furthermore, when a heat sink housing with structural features such as support columns and protrusions is obtained in one step using forging or die casting processes, the number of parts and machining time can be reduced, resulting in lower processing costs.

[0164] This disclosure has disclosed exemplary embodiments, and although specific terminology has been used, it is for general illustrative purposes only and should not be construed as limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A gas-liquid two-phase heat sink, comprising: a substrate, the substrate comprising a first cover plate and a second cover plate stacked with the first cover plate, a plurality of evaporation flow channels being spaced between the first cover plate and the second cover plate, at least one protrusion being arranged in the evaporation flow channel, the protrusion protruding towards a radial direction of the evaporation flow channel; a plurality of fins fixedly connected with the substrate, a condensation flow channel being arranged in the fin, the condensation flow channel being communicated with the evaporation flow channel, a working medium flowing into the condensation flow channel after absorbing heat and being converted into a gaseous state in the evaporation flow channel, the working medium flowing into the evaporation flow channel after releasing heat and being converted into a liquid state in the condensation flow channel.

2. The gas-liquid two-phase heat sink of claim 1, wherein, a plurality of support columns being spaced between the first cover plate and the second cover plate, the evaporation flow channel being formed between adjacent support columns, the protrusion being arranged on a side of the support column close to the evaporation flow channel, or the protrusion being arranged on the first cover plate and / or the second cover plate and opposite to the evaporation flow channel.

3. The gas-liquid two-phase heat sink of claim 1, wherein, A surface of the protrusion on a side of the evaporation flow channel is a plane or an arc surface, or a combination of a plane and an arc surface.

4. The gas-liquid two-phase heat sink of claim 1, wherein, The evaporation flow channel comprises a first evaporation flow channel segment and a second evaporation flow channel segment, the first evaporation flow channel segment and the second evaporation flow channel segment being arranged in a same straight line, the protrusion being arranged at a connecting position of the first evaporation flow channel segment and the second evaporation flow channel segment.

5. The gas-liquid two-phase heat sink of claim 1, wherein, The evaporation flow channel comprises a first evaporation flow channel segment and a second evaporation flow channel segment, the first evaporation flow channel segment and the second evaporation flow channel segment being arranged in a staggered manner. The protrusion is arranged at an end of the first evaporation flow channel segment close to the second evaporation flow channel segment.

6. The gas-liquid two-phase heat sink of claim 1, wherein, A first opening is arranged between the first cover plate and the second cover plate and at a first end portion, the first opening communicating first ends of the plurality of evaporation flow channels; A second opening is arranged between the first cover plate and the second cover plate and at a second end portion, the second opening communicating second ends of the plurality of evaporation flow channels.

7. The gas-liquid two-phase heat sink of claim 1, wherein, The second cover plate is provided with a plurality of first connecting holes and a plurality of second connecting holes penetrating a thickness of the second cover plate, the first connecting holes being arranged at a first end portion of the second cover plate, the second connecting holes being arranged at a second end portion of the second cover plate, each evaporation flow channel being communicated with one first connecting hole and one second connecting hole; A first interface is arranged at a first end portion of the fin, one end of the first interface being communicated with the condensation flow channel and the other end being communicated with one first connecting hole; a second interface is arranged at a second end portion of the fin, one end of the second interface being communicated with the condensation flow channel and the other end being communicated with the second connecting hole.

8. The gas-liquid two-phase heat sink of claim 7, wherein, A flow channel of the second interface is an inclined flow channel, and a height of one side of the fin is lower than a height of one side of the substrate.

9. The gas-liquid two-phase heat sink of claim 7, wherein, The second cover plate is further provided with a plurality of third connecting holes penetrating a thickness of the second cover plate; Each evaporation flow channel is communicated with at least one third connecting hole, the at least one third connecting hole being arranged between the first connecting hole and the second connecting hole and at a position of the protrusion. At least one third interface corresponding to the third connecting hole is arranged on the fin, one end of each third interface is communicated with the condensation flow channel, and the other end is communicated with one third connecting hole.

10. The gas-liquid two-phase heat sink of claim 9, wherein, The flow channel of the third interface is an inclined flow channel, and the height of one side of the fin is lower than that of one side of the base plate.

11. The gas-liquid two-phase heat sink of claim 1, wherein, The shape of the condensation flow channel includes one or more combinations of a honeycomb shape, a diagonal line shape, a bending shape, and a Tesla valve shape.

12. The gas-liquid two-phase heat sink of claim 1, wherein, The fin includes a first fin plate and a second fin plate stacked together, and the condensation flow channel is formed between the first fin plate and the second fin plate.

13. The gas-liquid two-phase heat sink of claim 1, wherein, First and second side plates are further included, and the first and second side plates are arranged on both sides of the plurality of fins respectively.

14. The gas-liquid two-phase heat sink of claim 1, wherein, A liquid filling pipe is further included, and the liquid filling pipe is communicated with the evaporation flow channel or the condensation flow channel. 15.An electronic device comprising a heat generating device and a heat sink for dissipating heat generated by the heat generating device, the heat sink comprising the gas-liquid two-phase heat sink of any one of claims 1-14.

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