Side-light-emitting high-integration-level dynamic colorful LED lamp bead, preparation method and device

Abstract

The invention discloses a side-light-emitting high-integration-level dynamic color intrigue LED lamp bead and a preparation method and device, and relates to the field of color intrigue LED lamp beads, the side-light-emitting high-integration-level dynamic color intrigue LED lamp bead comprises an SMD packaging substrate, a heat dissipation frame is fixedly connected to the SMD packaging substrate, and a light reflection side plate is fixedly connected to the interior of the heat dissipation frame. An RGB light-emitting chip 105 and a driving IC 104 are highly integrated in a 4.0 * 2.0 mm package, the RGB light-emitting chip 105 is controlled through the built-in driving IC 104, intelligent design of'a single lamp bead, namely a pixel point 'is achieved, meanwhile, a light source is reflected through a light reflecting side plate, light emitted by the light source is emitted out from the side face, the uniform and soft side face linear lighting effect is achieved, the design that light cannot be seen is achieved, and the light-emitting efficiency is improved. And meanwhile, the core functions of independent addressing of a single lamp bead, infinite cascade connection, low consumption and stability are realized.

Description

Technical Field

[0001] This invention relates to the technology of dynamic color LED beads, specifically to a side-emitting, highly integrated dynamic color LED bead, its preparation method, and its apparatus. Background Technology

[0002] Most RGB LEDs on the market currently use a combination of "ordinary RGB LED beads" + "external independent control IC (such as WS2812B)" + "PCB board". Multiple components are soldered onto the PCB board to achieve circuit connection.

[0003] Its low integration, large size, numerous components, and large space occupation make it difficult to reduce the pixel pitch of the LEDs, affecting the display's sharpness. Furthermore, its complex assembly, high cost, and cumbersome production process, involving numerous SMT placement and soldering steps, result in high yield control and costs.

[0004] With numerous connection points, there are risks such as poor soldering and short circuits. Secondly, ordinary top-emitting LED beads mostly have a top-emitting structure, with light emanating directly from the top of the package. This makes it difficult to achieve uniform, soft, linear side lighting effects. In high-end decorative scenarios requiring "light without seeing the lamp," additional light guides are needed, increasing structural and manufacturing complexity. Furthermore, direct point light sources are prone to glare.

[0005] In light of the above background, the present invention aims to solve the problem of how to highly integrate dynamic color control function into a single LED bead and achieve efficient and uniform side-emitting effect, thereby simplifying downstream applications, reducing size, and improving luminous efficacy and reliability. Summary of the Invention

[0006] The purpose of this invention is to provide a side-emitting, highly integrated, dynamic, colorful LED bead, its preparation method, and apparatus to address the aforementioned shortcomings in the prior art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a side-emitting, highly integrated dynamic color LED lamp bead, comprising an SMD package substrate, a heat sink frame fixedly connected to the SMD package substrate, a reflective side plate fixedly connected inside the heat sink frame, a driver IC soldered onto the SMD package substrate, an RGB light-emitting chip connected to the SMD package substrate by gold wire soldering to the driver IC, pins soldered onto the SMD package substrate, and the heat sink frame being made of copper.

[0008] An LED bead testing device includes a mounting plate. A mounting shaft is rotatably connected to the top of the mounting plate. A mounting disk is fixedly connected to the outer surface of the mounting shaft. Multiple transmission plates are fixedly connected to the mounting disk. A transmission shaft is rotatably connected to each transmission plate. A transmission frame is fixedly connected to one end of the transmission shaft. A rotating shaft is rotatably connected to the transmission frame. A placement frame is fixedly connected to the top of the rotating shaft. A detection contact is fixedly connected inside the placement frame. A light sensor is fixedly connected to the top of the mounting disk via a connecting bracket. A clamping mechanism is fixedly connected inside the placement frame. The clamping mechanism is used to clamp and fix the LED beads.

[0009] The outer surface of the mounting shaft is connected to a first driving mechanism, which drives the mounting shaft to rotate. The outer surface of the drive shaft is connected to a second driving mechanism, which drives the drive shaft to rotate. The bottom end of the rotating shaft is connected to a third driving mechanism, which drives the rotating shaft to rotate.

[0010] Furthermore, the clamping mechanism includes two flexible clamping airbags fixedly connected to the placement frame. The outer surface of the clamping airbags is fixedly connected to an inflation mechanism connected to the placement frame, which is used to inflate the clamping airbags.

[0011] Furthermore, the air-blowing mechanism includes an air-blowing box fixedly connected to the placement frame, a first telescopic drive member fixedly connected inside the air-blowing box, and an extrusion plate slidably connected to the output end of the first telescopic drive member.

[0012] Furthermore, the first driving mechanism includes a first rotational driving member fixedly connected to the mounting plate, a first driving shaft fixedly connected to the output end of the first rotational driving member, a first gear fixedly sleeved on the outer surface of the first driving shaft, and a second gear fixedly sleeved on the outer surface of the first gear.

[0013] Furthermore, the second drive mechanism includes a second telescopic drive member fixedly connected to the transmission plate, and a transmission rack slidably connected to the output end of the second telescopic drive member. A third gear fixedly sleeved with the transmission shaft is engaged on one side of the transmission rack.

[0014] Furthermore, the third driving mechanism includes a second rotational driving member fixedly connected to the transmission frame, and the output end of the second rotational driving member is fixedly connected to a second driving shaft fixedly connected to the rotational shaft.

[0015] A method for fabricating a side-emitting, highly integrated, dynamic, colorful LED bead includes the following steps:

[0016] Step 1: Substrate preparation. Select an SMD packaging substrate with good thermal conductivity, insulation and mechanical properties, and weld a heat sink frame onto the SMD packaging substrate. At the same time, weld a reflective side plate inside the heat sink frame.

[0017] Step 2: Die bonding. Select RGB light-emitting chips with matching parameters according to the design requirements, adjust the die bonding machine to set the pick-up and place-up positions and other parameters, and start the die bonding machine to bond the chips onto the substrate one by one.

[0018] Step 3: Wire bonding. Select the appropriate gold wire specifications, adjust the wire bonding machine and set the key parameters such as arc and tension. Place the die-bonded substrate on the worktable and bond the wires according to the program. Check the shape and connection of the solder joints in real time.

[0019] Step 4: Encapsulation and molding. Select and prepare a high-transparency, high-performance encapsulation adhesive. Place the substrate in the mold, apply the adhesive using a dispensing device, and then vacuum to remove air bubbles.

[0020] Step 5: Curing. Select appropriate equipment and preheat and test it according to the curing requirements of the adhesive to ensure that the required curing temperature and time are reached. Place the mold on the equipment and process it according to the curing curve. After curing, allow it to cool naturally to room temperature.

[0021] Step 6: De-granulation. Select a suitable de-granulation equipment and clean and debug it to ensure that it can operate normally and does not damage the LED beads. Carefully de-granulate the cured LED beads from the mold.

[0022] Step 7: Testing and sorting. Set up the testing device, equip it with optical and electrical testing equipment and calibrate and debug it to ensure data accuracy. Conduct comprehensive performance testing on the threshed LED beads and sort qualified and unqualified products according to the results and standards.

[0023] Step 8: Finished products. Select packaging materials and methods according to specifications and customer requirements. Take precautions against collisions and squeezing, and ensure proper protection. After packaging, conduct a final inspection. Once qualified, the product will be put into storage or shipped according to the order.

[0024] Compared with the prior art, the side-emitting, highly integrated dynamic color LED bead, its preparation method, and apparatus provided by the present invention have the following beneficial effects:

[0025] This side-emitting, highly integrated, dynamic color-changing LED chip boasts significant advantages. In terms of display effect, its highly integrated design, coupled with a driver IC, achieves "one LED chip equals one pixel." Through PWM dimming technology, it achieves 256 levels of grayscale adjustment with a color synchronization error of less than ±1%, accurately presenting rich and delicate colors to meet high-end display demands. Its unique reflective side plate design reflects the light source and emits it from the side, forming a uniform and soft linear light effect, achieving a subtle effect where the light source is not visible, enhancing visual aesthetics. In terms of performance, the driver IC offers advantages such as low-voltage driving, energy saving, high brightness, wide scattering angle, good consistency, and ultra-long lifespan. Combined with a copper heat sink for efficient heat dissipation, it greatly enhances the stability of the LED chip. Its core functions of "independent addressing per LED chip, unlimited cascading, and low power consumption and stability" make it perfectly suited for high-density, confined-space display scenarios. Furthermore, the highly integrated built-in driver IC integrates multiple functions, supports single-wire communication protocols, and, combined with automated large-scale manufacturing methods, ensures quality while improving production efficiency, reducing costs, and enhancing market competitiveness.

[0026] A flexible clamping airbag is used to secure the LED chip. After the LED chip is placed in the placement frame, the first telescopic drive component of the inflation mechanism moves the compression plate, pushing the gas in the inflation box into the clamping airbag, causing it to inflate and flexibly compress the LED chip. Compared to traditional rigid clamping, this flexible clamping method effectively avoids damaging the LED chip due to excessive clamping force. This is especially beneficial for precision components such as side-emitting RGB LED chips, maximizing the protection of their appearance and internal structural integrity. Simultaneously, the flexible clamping better adapts to LED chips of different sizes and shapes, improving clamping stability and versatility, providing reliable assurance for subsequent comprehensive testing, ensuring that the testing process will not result in misjudgments due to LED chip damage, and improving the accuracy of the test results.

[0027] This device achieves comprehensive and automated testing of side-emitting, multi-colored LED beads. A first drive mechanism rotates the mounting shaft, positioning the placement frame at the light sensor location. A second drive mechanism rotates the rotating shaft, causing the placement frame to rotate the LED beads. Combined with energizing the detection contacts and applying a detection signal, the light sensor can detect each side of the LED bead, preventing missed detections. After testing, based on the results, the first and second drive mechanisms work together to place the qualified and unqualified LED beads into their respective stations. The entire process requires minimal manual intervention, boasts a high degree of automation, significantly reduces testing time, improves efficiency, and provides accurate and comprehensive testing, enhancing testing effectiveness and effectively ensuring product quality. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0029] Figure 1 This is a top view of the internal structure of the LED lamp bead of the present invention;

[0030] Figure 2 This is a side view of the internal structure of the LED lamp bead of the present invention;

[0031] Figure 3 This is a first perspective view of the external structure of the detection device of the present invention;

[0032] Figure 4 This is a second perspective view of the external structure of the detection device of the present invention;

[0033] Figure 5 This is a third perspective view of the external structure of the detection device of the present invention;

[0034] Figure 6 This is a top view of the internal structure of the air chamber of the present invention.

[0035] Explanation of reference numerals in the attached figures:

[0036] 101. SMD package substrate; 102. Heat sink frame; 103. Reflective side plate; 104. Driver IC; 105. RGB light-emitting chip; 106. Pin; 1. Mounting plate; 2. Mounting shaft; 3. Mounting plate; 4. Transmission plate; 5. Transmission shaft; 6. Transmission frame; 7. Rotation shaft; 8. Placement frame; 9. Detection contact; 10. Light sensor; 11. Clamping airbag; 12. Inflating box; 13. First telescopic drive component; 14. Squeezing plate; 21. First rotation drive component; 22. First drive shaft; 23. First gear; 24. Second gear; 31. Second telescopic drive component; 32. Transmission rack; 33. Third gear; 41. Second rotation drive component; 42. Second drive shaft. Detailed Implementation

[0037] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0038] Example 1

[0039] Please see Figures 1 to 2As shown, a side-emitting, highly integrated dynamic color LED lamp bead includes an SMD package substrate 101 with dimensions of 4.0 × 2.0 mm. A heat sink frame 102 is fixedly connected to the SMD package substrate 101, and a reflective side plate 103 is fixedly connected inside the heat sink frame 102. A driver IC 104 is soldered onto the SMD package substrate 101, and an RGB light-emitting chip 105 connected to the SMD package substrate 101 is soldered onto the driver IC 104 via gold wire. Pins 106 are soldered onto the SMD package substrate 101, and the heat sink frame 102 is made of copper.

[0040] A method for fabricating a side-emitting, highly integrated, dynamic, colorful LED bead includes the following steps:

[0041] Step 1: Substrate preparation. Select an SMD packaging substrate 101 with good thermal conductivity, insulation and mechanical properties, and weld a heat sink frame 102 onto the SMD packaging substrate 101. At the same time, weld a reflective side plate 103 inside the heat sink frame 102.

[0042] Step 2: Die bonding. Select RGB light-emitting chips 105 with matching parameters according to the design requirements, adjust the die bonding machine to set the pick-up and place-up positions and other parameters, and start the die bonding machine to bond the chips onto the substrate one by one.

[0043] Step 3: Wire bonding. Select the appropriate gold wire specifications, adjust the wire bonding machine and set the key parameters such as arc and tension. Place the die-bonded substrate on the worktable and bond the wires according to the program. Check the shape and connection of the solder joints in real time.

[0044] Step 4: Encapsulation and molding. Select and prepare a high-transparency, high-performance encapsulation adhesive. Place the substrate in the mold, apply the adhesive using a dispensing device, and then vacuum to remove air bubbles.

[0045] Step 5: Curing. Select appropriate equipment and preheat and test it according to the curing requirements of the adhesive to ensure that the required curing temperature and time are reached. Place the mold on the equipment and process it according to the curing curve. After curing, allow it to cool naturally to room temperature.

[0046] Step 6: De-granulation. Select a suitable de-granulation equipment and clean and debug it to ensure that it can operate normally and does not damage the LED beads. Carefully de-granulate the cured LED beads from the mold.

[0047] Step 7: Testing and sorting. Set up the testing device, equip it with optical and electrical testing equipment and calibrate and debug it to ensure data accuracy. Conduct comprehensive performance testing on the threshed LED beads and sort qualified and unqualified products according to the results and standards.

[0048] Step 8: Finished products. Select packaging materials and methods according to specifications and customer requirements. Take precautions against collisions and squeezing, and ensure proper protection. After packaging, conduct a final inspection. Once qualified, the product will be put into storage or shipped according to the order.

[0049] By highly integrating the RGB LED chip 105 and driver IC 104 into a 4.0×2.0mm package, and controlling the RGB LED chip 105 through the built-in driver IC 104, an intelligent design of "one LED as a pixel" is achieved. Simultaneously, PWM dimming technology can be used to achieve 256 levels of grayscale adjustment, with a color synchronization error of less than ±1%. The use of driver IC 104 provides advantages such as low-voltage driving, environmental friendliness and energy saving, high brightness, large scattering angle, good consistency, and ultra-long lifespan. The heat sink 102 efficiently dissipates heat from the LEDs, improving their stability. A reflective side plate reflects the light source, causing the emitted light to exit from the side, achieving a uniform and soft linear side light effect, realizing a design where the light is visible but the lamp is not. It also achieves the core functions of "independent addressing of each LED, infinite cascading, and low power consumption and stability," adapting to high-density, confined space display scenarios. It also features a highly integrated built-in driver IC that integrates data reception, shaping, latching, and PWM dimming functions, supports single-wire communication protocols, and is manufactured in a large-scale automated manner using the aforementioned manufacturing methods, thus improving efficiency.

[0050] Example 2

[0051] Please see Figures 1 to 6 As shown, this embodiment, based on embodiment one, includes an LED bead detection device comprising a mounting plate 1, a mounting shaft 2 rotatably connected to the top of the mounting plate 1, a mounting disk 3 fixedly connected to the outer surface of the mounting shaft 2, multiple transmission plates 4 fixedly connected to the mounting disk 3, a transmission shaft 5 rotatably connected to the transmission plate 4, a transmission frame 6 fixedly connected to one end of the transmission shaft 5, a rotating shaft 7 rotatably connected to the transmission frame 6, a placement frame 8 fixedly connected to the top of the rotating shaft 7, a detection contact 9 fixedly connected inside the placement frame 8, a light sensor 10 fixedly connected to the top of the mounting disk 3 via a connecting frame (the light sensor 10 is prior art and will not be described in detail here), and a clamping mechanism fixedly connected inside the placement frame 8 for clamping and fixing the LED beads.

[0052] The outer surface of the mounting shaft 2 is connected to a first drive mechanism, which drives the mounting shaft 2 to rotate. The outer surface of the transmission shaft 5 is connected to a second drive mechanism, which drives the transmission shaft 5 to rotate. The bottom end of the rotating shaft 7 is connected to a third drive mechanism, which drives the rotating shaft 7 to rotate.

[0053] The clamping mechanism includes two flexible clamping airbags 11 fixedly connected to the placement frame 8. An air-blowing mechanism connected to the placement frame 8 is fixedly connected to the outer surface of the clamping airbags 11. The air-blowing mechanism is used to inflate the clamping airbags 11.

[0054] The air-blowing mechanism includes an air-blowing box 12 fixedly connected to the placement frame 8. A first telescopic drive member 13 is fixedly connected inside the air-blowing box 12. The first telescopic drive member 13 is an electric telescopic rod. An extrusion plate 14 that is slidably connected to the air-blowing box 12 is fixedly connected to the output end of the first telescopic drive member 13.

[0055] The first drive mechanism includes a first rotation drive component 21 fixedly connected to the mounting plate 1. The first rotation drive component 21 is a servo motor, which is controlled by a PLC programming program. The servo motor can be controlled to rotate forward and backward and rotate at different angles. The output end of the first rotation drive component 21 is fixedly connected to a first drive shaft 22. A first gear 23 is fixedly sleeved on the outer surface of the first drive shaft 22. A second gear 24 fixedly sleeved on the outer surface of the first gear 23 is meshed with the mounting shaft 2. The first rotation drive component 21 drives the first drive shaft 22 to rotate, and the first drive shaft 22 drives the mounting shaft 2 to rotate through the first gear 23 and the second gear 24.

[0056] The second drive mechanism includes a second telescopic drive member 31 fixedly connected to the transmission plate 4. The second telescopic drive member 31 is an electric telescopic rod. The output end of the second telescopic drive member 31 is fixedly connected to a transmission rack 32 that is slidably connected to the transmission plate 4. One side of the transmission rack 32 is meshed with a third gear 33 that is fixedly sleeved with the transmission shaft 5. The second telescopic drive member 31 drives the transmission rack 32 to move, and the transmission rack 32 drives the third gear 33 and the transmission shaft 5 to rotate.

[0057] The third drive mechanism includes a second rotation drive component 41 fixedly connected to the transmission frame 6. The second rotation drive component 41 is a servo motor, which is controlled by a PLC programming program. The servo motor can be controlled to rotate forward and backward and rotate at different angles. The output end of the second rotation drive component 41 is fixedly connected to a second drive shaft 42 fixedly connected to the rotation shaft 7. The second rotation drive component 41 drives the second drive shaft 42 to rotate, and the second drive shaft 42 drives the rotation shaft 7 to rotate.

[0058] The produced side-emitting iridescent LED beads are placed in a vibratory feeder, which then transports them to a robotic arm. The robotic arm picks up the beads and places them into a placement frame 8, ensuring the leads of the beads contact the contact points 9 within the frame. Simultaneously, the first telescopic drive 13 within the air chamber 12 moves the extrusion plate 14, pushing the gas within the chamber through a pipe into the clamping airbag 11. This inflates the airbag 11, which gently compresses the LED beads in the placement frame 8, preventing damage. The first rotation drive 21 then rotates the mounting shaft 2, which in turn rotates the mounting plate 3, transmission plate 4, transmission frame 6, and placement frame 8 until they reach the position of the light sensor 10. Finally, the second rotation drive 41 rotates the rotation shaft 7 and the placement frame 8, causing the clamping airbag 8 to move. The LED beads rotate, simultaneously energizing and transmitting a detection signal to the detection contacts 9 within the placement frame 8. At this time, the light sensor 10 detects each side of the LED bead, enabling comprehensive and automated detection of side-emitting LED beads, preventing missed detections. After detection, the first drive mechanism rotates the mounting shaft 2 to the qualified station. If the detected LED bead is qualified, the second drive mechanism rotates the transmission shaft 5, which in turn flips the transmission frame 6. The clamping mechanism then releases, placing the qualified LED bead. The placement frame 8 then rotates to the loading station for the next LED bead detection. When a detected LED bead fails, the first drive mechanism rotates the placement frame 8 to the unloading station, flipping it to the bottom to place the failed LED bead. It then returns to the loading station, thus achieving comprehensive and automated detection of the LED beads, significantly improving the efficiency and effectiveness of side-emitting LED bead detection.

[0059] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A side-emitting, highly integrated, dynamic, multi-colored LED light bead, characterized in that, The device includes an SMD packaging substrate (101), a heat sink frame (102) fixedly connected to the SMD packaging substrate (101), a reflective side plate (103) fixedly connected inside the heat sink frame (102), a driver IC (104) soldered on the SMD packaging substrate (101), an RGB light-emitting chip (105) connected to the SMD packaging substrate (101) soldered to the driver IC (104) via gold wire, pins (106) soldered on the SMD packaging substrate (101), and the heat sink frame (102) is made of copper.

2. An LED bead testing device, characterized in that, The device is used to detect the side-emitting high-integration dynamic color LED beads as described in claim 1. It includes a mounting plate (1), a mounting shaft (2) is rotatably connected to the top of the mounting plate (1), a mounting disk (3) is fixedly connected to the outer surface of the mounting shaft (2), a plurality of transmission plates (4) are fixedly connected to the mounting disk (3), a transmission shaft (5) is rotatably connected to the transmission plate (4), a transmission frame (6) is fixedly connected to one end of the transmission shaft (5), a rotating shaft (7) is rotatably connected to the transmission frame (6), a placement frame (8) is fixedly connected to the top of the rotating shaft (7), a detection contact (9) is fixedly connected inside the placement frame (8), a light sensor (10) is fixedly connected to the top of the mounting disk (3) through a connecting frame, and a clamping mechanism is fixedly connected inside the placement frame (8). The clamping mechanism is used to clamp and fix the LED beads. The outer surface of the mounting shaft (2) is connected to a first driving mechanism, which is used to drive the mounting shaft (2) to rotate. The outer surface of the transmission shaft (5) is connected to a second driving mechanism, which is used to drive the transmission shaft (5) to rotate. The bottom end of the rotating shaft (7) is connected to a third driving mechanism, which is used to drive the rotating shaft (7) to rotate.

3. The LED bead detection device according to claim 2, characterized in that, The clamping mechanism includes two flexible clamping airbags (11) fixedly connected to the placement frame (8). The outer surface of the clamping airbags (11) is fixedly connected to an air-blowing mechanism connected to the placement frame (8). The air-blowing mechanism is used to inflate the clamping airbags (11).

4. The LED bead detection device according to claim 3, characterized in that, The air-blowing mechanism includes an air-blowing box (12) fixedly connected to the placement frame (8), a first telescopic drive member (13) fixedly connected inside the air-blowing box (12), and an extrusion plate (14) slidably connected to the output end of the first telescopic drive member (13).

5. The LED bead detection device according to claim 2, characterized in that, The first drive mechanism includes a first rotation drive member (21) fixedly connected to the mounting plate (1), the output end of the first rotation drive member (21) is fixedly connected to a first drive shaft (22), the outer surface of the first drive shaft (22) is fixedly sleeved with a first gear (23), and the outer surface of the first gear (23) is meshed with a second gear (24) fixedly sleeved with the mounting shaft (2).

6. The LED bead detection device according to claim 2, characterized in that, The second drive mechanism includes a second telescopic drive member (31) fixedly connected to the transmission plate (4). The output end of the second telescopic drive member (31) is fixedly connected to a transmission rack (32) that is slidably connected to the transmission plate (4). One side of the transmission rack (32) is meshed with a third gear (33) that is fixedly sleeved with the transmission shaft (5).

7. The LED bead detection device according to claim 2, characterized in that, The third drive mechanism includes a second rotation drive member (41) fixedly connected to the transmission frame (6), and the output end of the second rotation drive member (41) is fixedly connected to a second drive shaft (42) fixedly connected to the rotation shaft (7).

8. A method for fabricating a side-emitting, highly integrated, dynamic, variegated LED bead, used to fabricate the side-emitting, highly integrated, dynamic, variegated LED bead as described in claim 1, characterized in that, Includes the following steps: Step 1: Substrate preparation. Select an SMD packaging substrate (101) with good thermal conductivity, insulation and mechanical properties, and weld a heat sink frame (102) on the SMD packaging substrate (101). At the same time, weld a reflective side plate (103) inside the heat sink frame (102). Step 2: Die bonding. Select RGB light-emitting chips (105) with matching parameters according to design requirements, adjust the die bonding machine to set the pick-up and put-down positions and other parameters, and start the die bonding machine to bond the chips onto the substrate one by one. Step 3: Wire bonding. Select the appropriate gold wire specifications, adjust the wire bonding machine and set the key parameters such as arc and tension. Place the die-bonded substrate on the worktable and bond the wires according to the program. Check the shape and connection of the solder joints in real time. Step 4: Encapsulation and molding. Select and prepare a high-transparency, high-performance encapsulation adhesive. Place the substrate in the mold, apply the adhesive using a dispensing device, and then vacuum to remove air bubbles. Step 5: Curing. Select appropriate equipment according to the curing requirements of the adhesive and preheat and test it to ensure that the required curing temperature and time are reached. Place the mold on the equipment and process it according to the curing curve. After curing, allow it to cool naturally to room temperature. Step 6: De-granulation. Select a suitable de-granulation equipment and clean and debug it to ensure that it can operate normally and does not damage the LED beads. Carefully de-granulate the cured LED beads from the mold. Step 7: Testing and sorting. Set up the testing device, equip it with optical and electrical testing equipment and calibrate and debug it to ensure data accuracy. Conduct comprehensive performance testing on the threshed LED beads and sort qualified and unqualified products according to the results and standards. Step 8: Finished products. Select packaging materials and methods according to specifications and customer requirements. Take precautions against collisions and squeezing, and ensure proper protection. After packaging, conduct a final inspection. Once qualified, the product will be put into storage or shipped according to the order.

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