Vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control

Abstract

The invention discloses a vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control, relates to the technical field of chip packaging, and is characterized in that an action process in a conventional packaging process is improved, an annular top block and a pressed air bag form a pressure closed-loop feedback structure, and an electromagnetic action assembly realizes auxiliary stroke control. The base tool is provided with a clamping jaw assembly and an action cylinder body, the clamping jaw assembly and the action cylinder body are matched to complete substrate fixing and packaging cooperation so as to assist an action piece to optimize three action states including a static state, a follow-up state and a reverse state to be matched with the packaging process to form three stages, and the movement state of an action air shaft is dynamically adjusted through synchronous collection of a displacement sensor and pressure data, so that the packaging efficiency is improved. The method is mainly used for solving the problems of chip damage, bonding failure and the like caused by stroke deviation in packaging, and the packaging quality and the production efficiency of the vehicle-mounted sensor chip are effectively improved.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically to a vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control. Background Technology

[0002] The sensor chip packaging process is described as follows: the chip is adsorbed and transferred onto the substrate, and the electrical connection between the chip and the substrate is achieved by gold wire ball bonding or aluminum wire bonding. One of the key actions is the process of transferring the chip onto the substrate, as mentioned in the relevant content in publication numbers CN109390259A and CN118890805A.

[0003] This process utilizes a high-definition industrial camera system (machine vision) to ensure the pin embedding position and a high-precision drive / transmission structure to ensure the chip is embedded relative to the substrate. The key lies in the chip transfer stroke. Relying solely on a high-precision transmission structure and machine vision system requires extremely high precision, resulting in relatively high costs. Furthermore, during actual operation, issues such as mechanical fatigue damage or abnormal operation may cause deviations in the actual stroke, leading to the following problems: 1. If the stroke is excessive, it will inevitably lead to additional over-contact between the pin / chip and the substrate, causing irreversible damage to the pin, chip, or even the substrate. 2. If there is a shortfall in the bonding wire, there will be a noticeable gap between the chip and the substrate, stress concentration or local failure of the bonding wire, or fluctuations in thermal management capability, reduced mechanical strength / sealing performance, and abnormal electrical performance.

[0004] Based on the above, we propose a solution. Summary of the Invention

[0005] The purpose of this invention is to provide a vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control. Conventional chip packaging processes are mostly automated (mechanical vision system + high-precision drive structure), which has very high equipment operation requirements. In actual operation, multiple factors may affect the chip packaging stroke. Whether the stroke is excessive or insufficient, it will directly affect the subsequent use effect.

[0006] The objective of this invention can be achieved through the following technical solution: a vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control, including an actuation tooling assembly and a base tooling, wherein the base tooling includes a gripper assembly and an actuation cylinder, and the actuation tooling assembly includes a vertical moving component, an actuation pneumatic shaft, and a large sleeve rod. The action air shaft is arranged in the large sleeve rod, a partition plate, a ring top block, an electromagnetic action assembly, a pressure receiving air bag and an inner through rod are arranged in the internal position corresponding to the upper side of the action air shaft of the large sleeve rod, the partition plate is fixedly connected with the large sleeve rod, a pressure closed loop feedback structure is formed between the ring top block and the pressure receiving air bag, and the electromagnetic action assembly is used for assisting the action air shaft to perform the stroke structure.

[0007] Further arrangement is that the large sleeve rod moves along the linear direction of the vertical moving piece, and an auxiliary action piece is arranged at the external position of the vertical moving piece, and a connecting plate corresponding to the action air shaft is arranged at the action output position of the auxiliary action piece.

[0008] Further arrangement is that a plurality of displacement sensors are arranged on the connecting plate along the linear direction of the action air shaft, and a plurality of contact ball rods extending to the lower end of the action air shaft are arranged at the output end position of the displacement sensors.

[0009] Further arrangement is that the action air shaft, the partition plate and the large sleeve rod are slidably connected, a limiting sleeve is arranged at the upper position of the partition plate and fixedly connected with the inner through rod, the pressure receiving air bag is arranged in the internal position of the limiting sleeve, and the ring top block is arranged above the pressure receiving air bag in a fixedly connected manner with the inner wall of the large sleeve rod.

[0010] Further arrangement is that the electromagnetic action assembly is composed of a permanent magnet block and a power-on electromagnetic group arranged from top to bottom, the permanent magnet block is fixedly connected with the outer wall of the inner through rod and slidably connected with the inner wall of the large sleeve rod, and the power-on electromagnetic group is slidably connected with the inner wall of the large sleeve rod and the outer wall of the inner through rod.

[0011] Further arrangement is that the lower end of the ring top block extends into the limiting sleeve and is in contact with the outer wall of the pressure receiving air bag.

[0012] Further arrangement is that the action air shaft performs the chip adsorption action, and the following stages are arranged when the packaging action is performed by the action tool assembly: Stage one: first, the large sleeve rod is driven to move directionally by the vertical moving piece, the auxiliary action assembly is kept in a synchronous movement state with the vertical moving piece and drives the action air shaft to move directionally, and the display value in the displacement sensor represents the completion degree of stage one; Stage two: after stage one is completed, the movement state of the auxiliary action assembly is switched from the synchronous movement state to the static state, the follow-up state or the reverse state, and the movement state of the action air shaft relative to the large sleeve rod is changed when the large sleeve rod keeps moving directionally; Phase three: in phase two, the display value in the displacement sensor and the pressure value change in the pressure balloon are synchronously acquired, and the moving state of the action air shaft is changed through one of the electromagnetic action assembly, the auxiliary action piece or both.

[0013] The application has the following advantages: 1. The stroke change process in the chip transfer process in the chip packaging process is improved, the conventional structure is not obviously improved, a double monitoring and control process of "displacement sensor + pressure closed loop feedback" is mainly formed, the probability of occurrence of "excessive stroke leading to pin bending and chip rupture" and "insufficient stroke leading to bonding failure and abnormal electrical performance" in packaging is avoided, and the product failure rate is reduced. The key structure is embodied in the pressure balloon. The flexible deformation of the pressure balloon avoids the rigid impact of the chip and the substrate, and the linear magnetic force control of the electromagnetic action assembly ensures the accuracy of pressure regulation, solving the contradiction between "buffer protection" and "precision control". 2. The pressure closed loop feedback structure can sense the bonding pressure of the chip and the substrate in real time. When the stroke is insufficient, the pressure of the pressure balloon is lower than the preset value, the system immediately increases the thrust through the electromagnetic action assembly to drive the action air shaft to complete the stroke, ensuring seamless bonding of the chip and the substrate. Without relying on high-precision transmission structure and complex mechanical vision system, through the combined design of pneumatic buffer and dynamic pressure control, the packaging precision is ensured while the equipment manufacturing and maintenance cost is reduced. Different sizes and different packaging requirements of vehicle sensor chips can be adapted by switching the moving state of the auxiliary action piece and adjusting the electromagnetic action assembly force, and the application range is wider. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.

[0015] Figure 1 The structure diagram of the vehicle sensor chip packaging structure based on pneumatic buffer and dynamic pressure control is provided. Figure 2 The structure diagram of the clamping jaw assembly in the base tooling of the present application is provided. Figure 3 The structure diagram of the action air shaft in the action tooling assembly of the present application is provided. Figure 4 The cross-sectional view of the present application Figure 3 Figure 5 The cross-sectional view of the present application Figure 3 ​a sectional view.

[0016] In the figure: 1, action tool assembly; 2, base tool; 201, clamping jaw assembly; 202, action cylinder; 101, vertical moving part; 102, action air shaft; 103, large sleeve rod; 3, auxiliary action part; 4, displacement sensor; 5, contact ball rod; 6, inner through rod; 7, ring top block; 8, pressure receiving air bag; 9, partition plate; 10, electromagnetic action assembly; 11, direction limiting sleeve. DETAILED DESCRIPTION

[0017] The technical solutions of the present application will be described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0018] Embodiment one: Because the conventional chip packaging process is mainly based on automatic structure (mechanical vision system + high precision driving structure), the equipment operation requirement is very high, and in the actual operation process, the packaging stroke of the chip may be affected by multiple factors, whether the stroke is excessive or insufficient will directly affect the subsequent use effect, for this, the following technical content is proposed: Referring to Figures 1-5 The vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control in the embodiment includes an action tool assembly 1 and a base tool 2. The base tool 2 includes a clamping jaw assembly 201 and an action cylinder 202. The action tool assembly 1 includes a vertical moving part 101, an action air shaft 102, and a large sleeve rod 103. The action air shaft 102 is arranged in the large sleeve rod 103, and the baffle 9, the ring top block 7, the electromagnetic action assembly 10, the pressure receiving air bag 8 and the inner through rod 6 are arranged in the inner position corresponding to the upper side of the action air shaft 102 of the large sleeve rod 103, the baffle 9 is fixedly connected with the large sleeve rod 103, the pressure closed loop feedback structure is formed between the ring top block 7 and the pressure receiving air bag 8, the auxiliary stroke structure is performed on the action air shaft 102 through the electromagnetic action assembly 10, the large sleeve rod 103 moves along the linear direction of the large sleeve rod 103 through the vertical moving part 101, and the auxiliary action part 3 is arranged at the outer position of the vertical moving part 101, the connecting plate corresponding to the action air shaft 102 is arranged at the action output position of the auxiliary action part 3, a plurality of displacement sensors 4 are arranged on the connecting plate along the linear direction of the action air shaft 102, a plurality of contact ball rods 5 extending to the lower end of the action air shaft 102 are arranged at the output end position of the displacement sensor 4, the action air shaft 102 and the baffle 9 are slidably connected with the large sleeve rod 103, the limiting sleeve 11 is arranged at the upper position of the baffle 9 and is fixedly connected with the inner through rod 6, the pressure receiving air bag 8 is arranged in the inner position of the limiting sleeve 11, the ring top block 7 is arranged above the pressure receiving air bag 8 in a manner that the ring top block 7 is fixedly connected with the inner wall of the large sleeve rod 103, the electromagnetic action assembly 10 is composed of the permanent magnet block and the power-on electromagnetic group arranged from top to bottom, the permanent magnet block is fixedly connected with the outer wall of the inner through rod 6 and slidably connected with the inner wall of the large sleeve rod 103, the power-on electromagnetic group is slidably connected with the inner wall of the large sleeve rod 103 and the outer wall of the inner through rod 6, and the lower end of the ring top block 7 extends into the limiting sleeve 11 and is in contact with the outer wall of the pressure receiving air bag 8.

[0019] The action principle is explained as follows: first, the base tool 2 is fixedly connected with the substrate, the action air shaft 102 of the action tool assembly 1 completes the chip adsorption, the displacement sensor 4 is initially calibrated through the contact ball rod 5, and the pressure receiving air bag 8 is in the initial pressure state. Theoretically, the action air shaft 102 can be moved downward by a distance A to complete the chip adsorption, but in actual situation, the actual travel distance is different due to various problems such as mechanical wear / fatigue and parameter difference, and the chip adsorption is completed in multiple stages. In the first stage, the vertical moving part 101 is started, the large sleeve rod 103 is driven to move in the linear direction, the auxiliary action part 3 moves synchronously with the vertical moving part 101, the action air shaft 102 moves synchronously through the connecting plate, gradually approaches the substrate, and the real-time value of the displacement sensor 4 is used to determine whether the action air shaft 102 reaches the preset first end position. Phase two operation: after the completion of phase one, the auxiliary action piece 3 switches the moving state (static, follow-up or reverse), at this time the large sleeve rod 103 continues to keep the directional movement, and the moving state of the action air shaft 102 relative to the large sleeve rod 103 changes, and enters the fine adjustment stage; Phase three operation: the real-time displacement data of the displacement sensor 4 and the pressure change data of the pressure receiving air bag 8 are synchronously collected, according to the data feedback, one of the electromagnetic action assembly 10 (adjusting the magnetic force action of the permanent magnet block and the energized electromagnetic group) and the auxiliary action piece 3 or the combination of the two is operated, and the moving speed and stroke of the action air shaft 102 are dynamically adjusted until the chip is accurately attached to the substrate, the packaging positioning is completed, and then the gold ball welding or aluminum wire bonding process is carried out; And the key components of the present application are pressure closed loop feedback, electromagnetic action assembly and displacement detection method. The displacement detection is carried out synchronously on the premise of the moving parameters of the vertical moving piece 101; Pressure closed loop feedback: when the action air shaft 102 moves, the force is transmitted through the inner connecting rod 6 to make the pressure receiving air bag 8 deform, the ring top block 7 keeps contact with the pressure receiving air bag 8, and the pressure change is sensed in real time to form a closed loop feedback, which provides the pressure basis for adjusting the action air shaft 102; Electromagnetic action assembly: the permanent magnet block is fixedly connected with the inner connecting rod 6, and the energized electromagnetic group is slidingly connected with the inner wall of the large sleeve rod 103. By changing the current size and direction of the energized electromagnetic group, the attraction or repulsion force between the permanent magnet block and the energized electromagnetic group is adjusted to realize the precise stroke auxiliary control of the action air shaft 102; Displacement detection operation: a plurality of displacement sensors 4 are arranged along the linear direction of the action air shaft 102, and the contact ball rod 5 continuously contacts the lower end of the action air shaft 102 to output displacement data in real time, so as to ensure that the moving state of the action air shaft 102 is monitored in all directions.

[0020] Example two: in combination with the technical content in example one, the whole packaging process is supplemented: When the action air shaft 102 performs the chip adsorption action, and the packaging action is performed through the action tool assembly 1, the following stages are set: Phase one: first, the large sleeve rod 103 is driven to move directionally by the vertical moving piece 101, and the auxiliary action assembly 3 keeps synchronous movement with the vertical moving piece 101 and drives the action air shaft 102 to move directionally, and the display value in the displacement sensor 4 represents the completion degree of phase one; Phase two: after the completion of phase one, the moving state of the auxiliary action assembly 3 is switched from the synchronous movement state to the static state, the follow-up state or the reverse state, and the moving state of the action air shaft 102 relative to the large sleeve rod 103 is changed when the large sleeve rod 103 keeps directional movement; Phase three: in phase two, the display value in displacement sensor 4 and the pressure value change in pressure balloon 8 are synchronously acquired, and the moving state of action air shaft 102 is changed through one of electromagnetic action assembly 10 and auxiliary action component 3 or through the simultaneous action of both.

[0021] Scheme description: the moving stroke of the chip in the overall packaging process is a fixed value A, in phase one, the chip is only transferred to the relative position close to the substrate, but the pin and the substrate do not have embedded connection action, which is specifically represented as the value change of displacement sensor 4 through contact ball rod 5, which indicates the completion node of phase one action, so as to enter phase two; Supplementary description of phase two, the essence is the moving state of auxiliary action component 3: The static state means that the action air shaft 102 keeps unchanged under the action of auxiliary action component 3, but the large sleeve rod 103 keeps moving, so that the action air shaft 102 generates negative stroke relative to the large sleeve rod 103; The following state means that the action air shaft 102 is not limited by the auxiliary action component 3, and under the premise of not considering the friction resistance with the large sleeve rod 103, the action air shaft 102 can keep synchronous movement with the large sleeve rod 103, or generate upward reaction force due to reaction force when the chip contacts the substrate; The reverse state means that the action air shaft 102 is completely interfered by the auxiliary action component 3, and the relative movement between the action air shaft 102 and the large sleeve rod 103 can be in the same direction or in the opposite direction, so as to generate negative stroke or increase stroke; Combine phase two with phase three: if electromagnetic action assembly 10 is not powered and has no magnetism, it mainly depends on the extrusion action between pressure balloon 8 and ring top block 7 on the partition plate 9 to form the change of air pressure, which is one of the key parameters in the invention, and the value change after the displacement sensor 4 can also be integrated and calculated, the key purpose is to feedback the actual stroke of action air shaft 102, such as the continuous directional movement of large sleeve rod 103, but the actual stroke can be micro controlled and adjusted through the negative stroke or increase stroke of action air shaft 102, and the specific feedback process is as follows: Because the partition plate 9 and the inner through rod 6 keep connected, and the inner through rod 6 is fixedly connected with the action air shaft 102 as a channel structure of the supplementary air source of the action air shaft 102, so in the three states of static state, following state or reverse state, the ring top block 7 generates obvious displacement change relative to the pressure balloon 8 to change the internal pressure change, when the action air shaft 102 synchronously moves down, the inner through rod 6 has no relative displacement with the action air shaft 102, the pressure balloon 8 is not extruded, a pressure sensor is arranged inside or outside the pressure balloon 8, the pressure maintains the initial value P0, and each component needs to be calibrated before the equipment runs; In the second stage, the core of the "fine positioning transition" process is to reduce the moving speed of the action air shaft 102, gradually approach the substrate, and prepare for the precise bonding in the third stage. After the auxiliary action part 3 switches the state, the large sleeve rod 103 drives the partition plate 9 and the limiting sleeve 11 to move downward synchronously, the inner through rod 6 moves downward with the action air shaft 102 at a reduced speed, the pressure air bag 8 is gradually extruded by the limiting sleeve 11, the pressure starts to rise linearly from P0, the pressure sensor and the displacement sensor collect data synchronously, and the "displacement-pressure" correlation curve is established: in the ideal state, the pressure rises by a corresponding value (corresponding to the air bag deformation) for every several mm of displacement increase. If the pressure rise rate is high, it is determined that the action air shaft 102 is stuck or the substrate surface is protruding; if there is no obvious pressure fluctuation in the pressure air bag, it is determined that the action air shaft 102 is moving too fast or the air bag is not in good contact; The actual process specifically includes the following pressure states: The pressure of the pressure air bag 8 rises obviously: quickly reduce the pushing force of the action air shaft 102 on the substrate, and reduce the contact pressure to the qualified range; The pressure of the pressure air bag 8 is obviously insufficient: increase the pushing force of the action air shaft 102 on the substrate, and increase the contact pressure to the qualified range; The pressure of the pressure air bag 8 is not obviously fluctuating and is relatively stable: maintain the current pressure and displacement state to avoid the influence of fluctuation on the bonding effect.

[0022] As shown above: the action process in the conventional packaging process is improved, the pressure closed-loop feedback structure is formed by the ring top block and the pressure air bag, and the electromagnetic action assembly realizes auxiliary stroke control; the base tooling is provided with a clamping jaw assembly and an action cylinder body, which cooperate to complete the fixing of the substrate and the packaging cooperation, so as to optimize the three action states of static, follow-up and reverse to cooperate with the packaging process to form three stages. Through the synchronous collection of displacement sensor and pressure data, the moving state of the action air shaft is dynamically adjusted, which is mainly used to solve the problems of chip damage and bonding failure caused by stroke deviation in packaging, and effectively improves the packaging quality and production efficiency of the vehicle-mounted sensor chip.

[0023] The preferred embodiments disclosed above are only used to help explain the present application. The preferred embodiments do not describe all the details and limit the application to the specific embodiments. Obviously, many modifications and changes can be made according to the content of the present application. The embodiments are selected and described in detail in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well understand and utilize the present application. The present application is limited by the claims and their entire scope and equivalents.

Claims

1. A vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control, comprising an actuation tooling assembly (1) and a base tooling (2), characterized in that, The base fixture (2) includes a gripper assembly (201) and an actuating cylinder (202). The actuating fixture assembly (1) includes a vertical moving part (101), an actuating air shaft (102), and a large sleeve rod (103). The actuating air shaft (102) is installed in the large sleeve rod (103). A partition (9), a ring top block (7), an electromagnetic actuating component (10), a pressure-bearing airbag (8), and an inner through rod (6) are provided in the inner position of the large sleeve rod (103) on the upper side of the actuating air shaft (102). The partition (9) is fixedly connected to the large sleeve rod (103). A pressure closed-loop feedback structure is formed between the ring top block (7) and the pressure-bearing airbag (8). The electromagnetic actuating component (10) performs an auxiliary stroke structure on the actuating air shaft (102).

2. The vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control according to claim 1, characterized in that, The large sleeve rod (103) moves along its linear direction via a vertical moving part (101), and an auxiliary action part (3) is provided at the external position of the vertical moving part (101). A connecting plate corresponding to the action air shaft (102) is installed at the action output position of the auxiliary action part (3).

3. The vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control according to claim 2, characterized in that, Multiple displacement sensors (4) are mounted on the connecting plate along the linear direction of the actuating air shaft (102), and multiple contact rods (5) extending to the lower end of the actuating air shaft (102) are mounted on the output end of the displacement sensors (4).

4. The vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control according to claim 3, characterized in that, The actuating air shaft (102), the partition (9) and the large sleeve rod (103) are slidably connected. A directional sleeve (11) is installed on the upper side of the partition (9) and is fixedly connected to the inner through rod (6). The pressure-bearing airbag (8) is located inside the directional sleeve (11). The ring top block (7) is located above the pressure-bearing airbag (8) in a fixed connection with the inner wall of the large sleeve rod (103).

5. The vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control according to claim 4, characterized in that, The electromagnetic actuation component (10) consists of a permanent magnet block and a magnetic flux group arranged sequentially from top to bottom. The permanent magnet block is fixedly connected to the outer wall of the inner through rod (6) and slidably connected to the inner wall of the large sleeve rod (103). The magnetic flux group is slidably connected to the inner wall of the large sleeve rod (103) and slidably connected to the outer wall of the inner through rod (6).

6. The vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control according to claim 5, characterized in that, The lower end of the ring top block (7) extends into the directional sleeve (11) and remains in contact with the outer wall of the pressure-bearing airbag (8).

7. The vehicle-mounted sensor chip packaging structure based on pneumatic buffering and dynamic pressure control according to claim 6, characterized in that, When the chip adsorption action is performed by the aforementioned actuating air shaft (102) and the packaging action is performed by the actuating tooling assembly (1), the following stages are set: Phase 1: First, the vertical moving part (101) drives the large sleeve rod (103) to move in a direction. The auxiliary action component (3) keeps in a state of synchronous movement with the vertical moving part (101) and drives the action air shaft (102) to move in a direction. The degree of completion of Phase 1 is indicated by the display value in the displacement sensor (4). Phase 2: After completing Phase 1, switch the movement state of the auxiliary motion component (3) from synchronous movement state to stationary state, follow-up state or reverse state, and change the movement state of the motion air shaft (102) relative to the large sleeve (103) while the large sleeve (103) maintains directional movement. Phase 3: In Phase 2, the display values ​​in the displacement sensor (4) and the pressure value changes in the pressure bag (8) are acquired synchronously, and the movement state of the actuating air shaft (102) is changed by one or both of the electromagnetic actuating component (10) and the auxiliary actuating component (3).

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