Switching-type double-gas-path collaborative feeding detection system and switching-type double-gas-path collaborative feeding detection method

Abstract

The invention discloses a switching type double-gas-path collaborative feeding detection system and method, and relates to the field of packaged chip detection.The switching type double-gas-path collaborative feeding detection system comprises a detection platform, a material disc, a detection device and a double-gas-path detection device are arranged on the detection platform, and the double-gas-path detection device is used for conveying a packaged chip to a detection station of the detection platform; the double-gas-path detection device comprises a bottom plate, a sliding seat, a rotating shaft and 7-shaped negative pressure pipes, the bottom plate is fixed on the detection platform, the sliding seat is arranged on the bottom plate in a sliding mode, the rotating shaft rotatably penetrates through the sliding seat, the rotating shaft has the degree of freedom of moving in the axial direction of the mounting hole, and the two 7-shaped negative pressure pipes are connected to the end, close to the detection station, of the rotating shaft in a vertically symmetrical mode; one 7-shaped negative pressure pipe is in a working state, the other 7-shaped negative pressure pipe is in an idle to-be-switched state, the 7-shaped negative pressure pipes are directly associated with the rotating shaft, the rotating shaft rotates to drive a chip to synchronously complete 180-degree overturning in the conveying process, and the positioning precision of a detection station is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of packaged chip detection, in particular to a switching type double air path cooperative feeding detection system and method. BACKGROUND

[0002] In the current high-speed development of electronic information industry, packaged chips as the core components of various electronic devices, the quality directly determines the reliability and service life of the terminal product. The pin of the packaged chip as the key structure of signal transmission and power connection, its processing precision, integrity and arrangement standard are the core indexes of quality detection, once the pin bending, deformation, missing or spacing abnormality occurs, it will lead to the chip unable to work normally, and even cause the whole electronic system failure. Therefore, before the packaged chip leaves the factory, it must be screened through efficient and accurate detection means for the quality of the pin, which is the key link to ensure the stability of electronic industry supply chain. At present, the feeding detection of packaged chip mainly adopts manual assistance or single air path adsorption automatic equipment. The manual detection method has the problems of low efficiency, high labor intensity, inconsistent detection standards, etc., which is difficult to meet the demand of large-scale production; and the traditional automatic detection equipment generally has the following technical defects: first, the packaged chip needs to realize the state switching of pin upward and downward during the detection process to complete the comprehensive detection of different angles. The existing equipment usually adopts independent turnover mechanism and feeding mechanism, which leads to complex structure, large space occupation, and chip positioning deviation in the switching process, affecting the detection precision. Second, the traditional double air path detection device usually adopts electromagnetic valve to control the air path on-off, which has the problem of response delay, and the electromagnet needs to be set with air path, which will cause the problem of air path winding pipe under the premise of needing to turn over the packaged chip. SUMMARY

[0003] The purpose of the present application is to overcome the shortcomings of the prior art, and provide a switching type double air path cooperative feeding detection system and method, which solves the problems of the prior art.

[0004] The purpose of the application is achieved by the following technical scheme: a switching type double air path cooperative feeding detection system, comprising a detection platform, a tray, a detection device and a double air path detection device are arranged on the detection platform, the double air path detection device is used for conveying packaged chips to the detection station of the detection platform, a plurality of chip grooves are formed in the tray, the plurality of chip grooves are arranged in a rectangular array, the chip grooves are used for placing packaged chips, the double air path detection device comprises an air inlet block, a bottom plate, a sliding seat, a rotating shaft and a 7-shaped negative pressure pipe, the bottom plate is fixed on the detection platform, the sliding seat is slidingly arranged on the bottom plate, a mounting hole is formed in the side of the sliding seat close to the detection device, the rotating shaft is rotatably fitted in the mounting hole, and the rotating shaft has the freedom of moving along the axis of the mounting hole, two 7-shaped negative pressure pipes are symmetrically connected to the end of the rotating shaft close to the detection station, an air inlet hole is coaxially formed in the end of the rotating shaft away from the 7-shaped negative pressure pipe, the end of the air inlet hole close to the 7-shaped negative pressure pipe is divided into two air channels, the two air channels are respectively connected to the two 7-shaped negative pressure pipes, two switching holes are formed in the outer side wall of the rotating shaft, the two switching holes are respectively connected to the two air channels, a valve ball is slidingly arranged in the air channel, the valve ball is moved to make the air channel in a conductive or cut-off state, the top of the sliding seat is fixed with an air inlet block, the air inlet block is provided with an air inlet channel, one end of the air inlet channel is connected to a negative pressure pump through a hose, the other end of the air inlet channel is connected to a U-shaped air inlet pipe, the end of the U-shaped air inlet pipe away from the air inlet block penetrates into the air inlet hole, the 7-shaped negative pressure pipe negatively adsorbs the chips from the tray and conveys them to the detection device for detection, and rotates the packaged chips by 180 degrees during the conveying process, after the detection is completed, the 7-shaped negative pressure pipe conveys the packaged chips to the unloading conveyor belt, and during the conveying process, the rotating shaft does not rotate, so that the chips can be unloaded to the unloading conveyor belt in a state with the pins upward.

[0005] Further, a switching groove is formed in the inner bottom wall of the mounting hole, when the valve ball is partially located in the switching groove, the air channel corresponding to the valve ball is in a conductive state, the two ends of the switching groove along the radial direction of the rotating shaft are both inclined surfaces, and the axial width of the switching groove is greater than the length of the rotating shaft moving along the axis of the mounting hole.

[0006] Further, a sliding groove is formed in the top surface of the sliding seat, the sliding groove is connected to the mounting hole, and the length direction of the sliding groove extends in the axial direction of the mounting hole, a sliding shaft is slidingly arranged in the sliding groove, the sliding shaft has the freedom of moving along the length direction of the sliding groove, an annular groove is formed in the side wall of the rotating shaft, one end of the sliding shaft extends into the annular groove, a gear is connected to the end of the rotating shaft away from the 7-shaped negative pressure pipe through the sliding seat, and a rack is fixed on the bottom plate, when the packaged chips are flipped, the gear engages with the rack, when the packaged chips detected are unloaded, the sliding shaft drives the rotating shaft to move so that the rack and the gear are in an interleaved state.

[0007] Furthermore, the base plate is connected to a first actuating plate and a second actuating plate at its two ends respectively, and the slide is located between the first actuating plate and the second actuating plate. The first actuating plate has a first actuating shaft groove at its end near the slide, and the inner wall of the first actuating shaft groove away from the detection station has a first wedge-shaped surface. The first wedge-shaped surface causes the width of the first actuating shaft groove to gradually increase along the direction near the slide. The second actuating plate has a second actuating shaft groove at its end near the slide, and the inner wall of the second actuating shaft groove near the detection station has a second wedge-shaped surface. The second wedge-shaped surface causes the width of the second actuating shaft groove to gradually increase along the direction near the slide.

[0008] When the gear meshes with the rack, the second wedge-shaped surface is located on the movement path of the sliding shaft, and the sliding shaft can slide into the end of the first gear slot; when the gear and the rack intersect along the axial direction of the mounting hole, the first wedge-shaped surface is located on the movement path of the sliding shaft, and the sliding shaft can slide into the end of the second gear slot.

[0009] Furthermore, the slide block is provided with a limiting cavity, which is connected to the mounting hole. A pressing block is slidably disposed in the limiting cavity. The end of the pressing block near the rotating shaft is provided with an arc surface. The end of the pressing block away from the rotating shaft is connected to a pressing spring. The end of the pressing spring away from the pressing block is connected to the slide block. Under the action of the pressing spring, the arc surface of the pressing block presses against the rotating shaft. A linear drive module is mounted on the top surface of the slide block. The slide block is mounted on the slide block of the linear drive module through a lifting assembly.

[0010] Furthermore, the lifting assembly includes a base and a lifting seat. The base is fixed on the slide of the linear drive module, the lifting seat is disposed above the base, the slide is fixed on the top of the lifting seat, a telescopic rod is fixed on the top of the base, the two ends of the telescopic rod are respectively connected to the base and the lifting seat, and a spring is sleeved on the telescopic rod.

[0011] Furthermore, the top of the base is provided with an installation groove, an electromagnet is installed in the installation groove, and a permanent magnet is installed at the bottom of the lifting seat. When the electromagnet is energized, it generates magnetic poles that are opposite to the magnetic properties of the permanent magnet.

[0012] Furthermore, the detection device includes an upper station camera, a front station camera, and a rear station camera. The upper station camera is located directly above the detection station, and the chips on both sides of the packaged chip correspond to the front station camera and the rear station camera, respectively.

[0013] Furthermore, a bidirectional drive assembly is provided below the material tray. The bidirectional drive assembly includes a first linear drive module, a drive plate, a second linear drive module, and a positioning plate. The first linear drive module is mounted on the detection platform, the drive plate is mounted on the slide of the first linear drive module, the second linear drive module is mounted on the drive plate, and the positioning plate is mounted on the slide of the second linear drive module. A rectangular positioning post is fixed to the top of the positioning plate, and a rectangular positioning groove is opened at the bottom of the material tray. The rectangular positioning post is adapted to fit into the rectangular positioning groove.

[0014] A switching dual-air-path coordinated feeding and detection method, utilizing the aforementioned switching dual-air-path coordinated feeding and detection system, includes the following steps:

[0015] S1. The packaged chip to be tested is placed in the chip slot with the pins of the packaged chip facing down, so that the top surface of the packaged chip is exposed.

[0016] S2. The slide moves the 7-shaped negative pressure tube to the material tray, and the 7-shaped negative pressure tube is adsorbed onto the top surface of the packaged chip by negative pressure.

[0017] The S3 and 7-shaped negative pressure tubes carry the packaged chip to the testing station. During the movement, the rotating shaft drives the packaged chip to rotate 180°, so that the pins of the packaged chip are exposed with the pins facing upwards.

[0018] S4. The packaged chip is imaged by the upper station camera, the front station camera and the rear station camera working together. The images are combined to form a three-dimensional image of the packaged chip, thereby determining whether there are quality problems with the chip pins.

[0019] The S5 and 7-shaped negative pressure tubes unload the tested packaged chips onto the unloading conveyor belt. During this process, the rotating shaft does not rotate, allowing the chips to be unloaded onto the unloading conveyor belt with the pins facing upwards.

[0020] S6. Adjust the position of the tray through the first linear drive module and the second linear drive module so that the next packaged chip to be tested is in the working position of the 7-shaped negative pressure tube;

[0021] S7. Repeat the above operations S1-S6 to complete the batch testing of packaged chips.

[0022] The beneficial effects of this invention are:

[0023] 1. The 7-shaped negative pressure tube is directly connected to the rotating shaft. The rotation of the rotating shaft drives the chip to complete a 180° flip during the transportation process. No additional flipping device is required. The equipment structure is more compact by more than 40%, which not only saves installation space, but also reduces the positioning error caused by the linkage of multiple mechanisms. The position offset of the chip after flipping is controlled within ±0.02mm, which greatly improves the positioning accuracy of the detection station.

[0024] 2. The air path switching is achieved through the mechanical cooperation between the valve ball and the switching groove. When the rotating shaft moves axially, the valve ball automatically completes the opening or blocking of the air path under the guidance of the inclined surface of the switching groove. The response time is shortened, there is no problem of electronic component aging, the air path sealing is improved, and there is no need to configure a solenoid valve air path, avoiding the problem of pipe winding.

[0025] 3. A three-stage imaging system is implemented, consisting of an upper-stage camera, a front-stage camera, and a rear-stage camera. The upper-stage camera precisely captures the flatness, spacing, and missing parts of the pin tops. The front and rear-stage cameras, corresponding to the two sides of the packaged chip respectively, comprehensively collect defect features such as bending and deformation on the sides of the pins. The combined imaging data from these three cameras forms a 3D image of the packaged chip, effectively eliminating the blind spots of traditional single-camera inspection. This improves inspection accuracy by more than 30% compared to existing technologies, significantly reducing the risk of electronic system failures due to missed defects and ensuring the reliability of end products. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a switching dual-air-path coordinated feeding and detection system according to the present invention. Figure 1 ;

[0027] Figure 2 This is a schematic diagram of the assembly of the slide and the rotating shaft in a switching dual-air-path coordinated feeding and detection system of the present invention.

[0028] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0029] Figure 4 This is a schematic diagram of the structure of a switching dual-air-path coordinated feeding and detection system according to the present invention. Figure 2 ;

[0030] Figure 5 This is a schematic diagram of the structure of a switching dual-air-path coordinated feeding and detection system according to the present invention. Figure 3 ;

[0031] Figure 6 for Figure 5 Enlarged view at point B in the middle;

[0032] Figure 7 This is a schematic diagram of the assembly of the positioning plate and the material tray in a switching dual-air-path collaborative feeding and detection system of the present invention.

[0033] Figure 8 This is a schematic diagram of the structure of a switching dual-air-path coordinated feeding and detection system according to the present invention. Figure 4 ;

[0034] In the diagram, 1-detection platform, 2-material tray, 3-chip slot, 4-air inlet block, 5-base plate, 6-slide seat, 7-rotating shaft, 8-7-shaped negative pressure pipe, 9-mounting hole, 10-air inlet, 11-air passage, 12-slide groove, 13-slide shaft, 14-annular groove, 15-gear, 16-rack, 17-first actuating plate, 18-second actuating plate, 19-first actuating shaft groove, 20-first wedge surface, 21-second actuating shaft groove, 22-second wedge surface, 23-limiting cavity, 24-lowering block, 25-lowering spring, 26-linear drive Module, 27-base, 28-lifting seat, 29-telescopic rod, 31-spring, 32-mounting slot, 33-electromagnet, 34-permanent magnet, 35-switching hole, 36-valve ball, 37-air inlet channel, 38-U-shaped air inlet pipe, 39-feeding conveyor belt, 40-switching slot, 41-upper station camera, 42-front station camera, 43-rear station camera, 44-first linear drive module, 45-drive plate, 46-second linear drive module, 47-positioning plate, 48-rectangular positioning post, 49-rectangular positioning groove, 50-sealing ring. Detailed Implementation

[0035] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.

[0036] Example 1

[0037] like Figures 1 to 8As shown, a switching dual-air-path collaborative feeding and testing system includes a testing platform 1, on which a material tray 2, a testing device, and a dual-air-path testing device are mounted. The dual-air-path testing device is used to transport packaged chips to the testing station of the testing platform 1. The material tray 2 has several chip slots 3 arranged in a rectangular array. The chip slots 3 are used to place packaged chips. The dual-air-path testing device includes an air inlet block 4, a base plate 5, a slide block 6, a rotating shaft 7, and a 7-shaped negative pressure pipe 8. The base plate 5 is fixed on the testing platform 1, and the slide block 6 is slidably mounted on the base plate 5. A mounting hole 9 is provided on the side of the slide block 6 near the testing device. The rotating shaft 7 is adapted to rotate within the mounting hole 9 and has the freedom to move axially along the mounting hole 9. Two 7-shaped negative pressure pipes 8 are symmetrically connected at one end of the measuring station. An air inlet 10 is coaxially opened at the end of the rotating shaft 7 furthest from the 7-shaped negative pressure pipes 8. The end of the air inlet 10 near the 7-shaped negative pressure pipes 8 splits into two air passages 11, each connected to one of the two 7-shaped negative pressure pipes 8. Two switching holes 35 are opened on the outer wall of the rotating shaft 7, each connected to one of the two air passages 11. A valve ball 36 is slidably installed inside each air passage 11. The valve ball 36 moves to open or close the air passage 11. An air inlet block 4 is fixed to the top of the slide block 6. An air inlet channel 37 is provided inside the air inlet block 4. One end of the air inlet channel 37 is connected to a negative pressure pump via a hose, and the other end of the air inlet channel 37 is connected to a U-shaped air inlet pipe 38. The U-shaped air inlet pipe 38 is far from the negative pressure pipe 8. One end of the air inlet block 4 is inserted into the air inlet hole 10. The L-shaped negative pressure tube 8 is used to negatively adsorb the chip from the material tray 2 and transport it to the testing device for testing. During the transport process, the packaged chip is rotated 180°. After the test is completed, the L-shaped negative pressure tube 8 transports the packaged chip to the unloading conveyor belt 39. During the transport process, the rotating shaft 7 does not rotate, so that the chip is placed on the unloading conveyor belt 39 with the pins facing upwards. The testing device includes an upper station camera 41, a front station camera 42, and a rear station camera 43. The upper station camera 41 is located directly above the testing station. The chips on both sides of the packaged chip correspond to the front station camera 42 and the rear station camera 43, respectively. One packaged chip to be tested is placed in each chip slot 3, with the pins of the packaged chip facing downwards. This arrangement exposes the packaged chip with its top surface facing upwards, facilitating the loading of the 7-shaped negative pressure tube 8 into the negative pressure fixture. One of the two 7-shaped negative pressure tubes 8 is in working condition with its surface facing downwards, while the other is in idle condition awaiting switching. The valve ball 36 corresponding to the working 7-shaped negative pressure tube 8 moves downwards under its own weight, disengaging from the corresponding air passage 11. This air passage 11 then connects to the 7-shaped negative pressure tube 8, placing it in the fixture position. Meanwhile, the valve ball 36 corresponding to the idle 7-shaped negative pressure tube 8 falls into the air passage 11 under its own weight, closing the idle 7-shaped negative pressure tube 8. Thus, naturally, one of the two 7-shaped negative pressure tubes 8 is in working condition, while the other is in idle, closed-off condition.When the rotating shaft 7 rotates 180°, the states of the two 7-shaped negative pressure pipes 8 automatically switch, enabling uninterrupted feeding operations without the need for additional solenoid valves. The structure is simple and avoids pipe entanglement issues. A negative pressure is generated in the air intake block 4 by a negative pressure pump. This negative pressure acts on the 7-shaped negative pressure pipe 8 through the conductive air passage 11, while the other 7-shaped negative pressure pipe 8 is in a throttling state, which concentrates the negative pressure and ensures strong negative pressure adsorption force, achieving stable feeding of packaged chips. Furthermore, the U-shaped air intake pipe 38 and the air intake hole 10 have relative rotational and movement freedom, achieving negative pressure transmission without affecting the movement and rotation of the rotating shaft 7, thus avoiding interference issues. A sealing ring 50 is set between the U-shaped air intake pipe 38 and the air intake hole 10 to improve sealing performance. The specific testing process is as follows: The slide 6 moves the 7-shaped negative pressure tube 8 toward the material tray 2, so that the 7-shaped negative pressure tube 8 adsorbs the packaged chip by negative pressure. Then, the slide 6 moves the packaged chip to the testing station. During the movement, the rotating shaft 7 rotates the packaged chip 180°, so that the packaged chip is in an inverted state with the pins facing upwards, so that the pins of the packaged chip are exposed at the top and can be imaged without obstruction. When the packaged chip moves to the testing station, the packaged chip is in an inverted suspended state. The upper station camera 41, the front station camera 42 and the rear station camera 43 work together to image. The upper station camera 41 accurately captures the flatness, spacing and missing parts of the top of the pins. The front station camera 42 and the rear station camera 43 correspond to the two sides of the packaged chip respectively, and comprehensively collect the defects such as bending and deformation of the pin sides. The combined imaging data from the three cameras forms a stereoscopic image of the packaged chip, effectively eliminating the blind spot problem of traditional single-camera inspection. After inspection, the slide 6 moves the packaged chip closer to the unloading conveyor belt 39. During the conveying process, the rotating shaft 7 moves axially along the mounting hole 9, causing the 7-shaped negative pressure tube 8 to place the packaged chip on the unloading conveyor belt 39. The unloading conveyor belt 39 then transports the packaged chip to the tray loading station, thus completing the automatic loading, inspection, and unloading of the packaged chip. The "negative pressure adsorption conveying" and "180° flipping" functions are integrated into one, and the flipping action is completed during the conveying process, improving inspection efficiency. After completing one inspection operation, the two 7-shaped negative pressure tubes 8 automatically switch states, achieving uninterrupted loading operation without the need for additional control mechanisms. In practice, a feeding cylinder is installed on one side of the feeding conveyor belt 39. The feeding cylinder operates based on the detection results. When a packaged chip fails the detection test, the feeding cylinder pushes the packaged chip off the feeding conveyor belt 39, while the qualified packaged chips are transported by the feeding conveyor belt 39 to the tray loading station.

[0038] Furthermore, such as Figure 1 and Figure 8As shown, a bidirectional drive assembly is provided below the material tray 2. The bidirectional drive assembly includes a first linear drive module 44, a drive plate 45, a second linear drive module 46, and a positioning plate 47. The first linear drive module 44 is mounted on the detection platform 1, the drive plate 45 is mounted on the slide of the first linear drive module 44, the second linear drive module 46 is mounted on the drive plate 45, and the positioning plate 47 is mounted on the slide of the second linear drive module 46. A rectangular positioning post 48 is fixed to the top of the positioning plate 47, and a rectangular positioning groove 49 is provided at the bottom of the material tray 2. The rectangular positioning post 48 is fitted into the rectangular positioning groove 49. The first linear drive module 44 drives the tray 2 to move along the length direction of the detection platform 1, and the second linear drive module 46 drives the tray to move along the width direction of the detection platform 1. This allows the tray 2 to deliver the packaged chips one by one to the loading position of the 7-shaped negative pressure tube 8, achieving precise loading. After the packaged chips on the tray 2 have been inspected, a new tray 2 is replaced. The positioning operation is completed by the cooperation of the rectangular positioning post 48 and the rectangular positioning groove 49, ensuring that the loading of packaged chips is not affected by the replacement of the tray.

[0039] Example 2

[0040] Based on Example 1, such as Figures 1 to 3 As shown, a switching groove 40 is provided on the inner bottom wall of the mounting hole 9. When the valve ball 36 is partially located in the switching groove 40, the air passage 11 corresponding to the valve ball 36 is in a conductive state. Both ends of the switching groove 40 along the radial direction of the rotation axis 7 are inclined surfaces. The axial width of the switching groove 40 is greater than the length of the rotation axis 7 moving axially along the mounting hole 9. The diameter of the valve ball 36 is equal to the diameter of the switching hole 35, so that the valve ball 36 can always block the switching hole 35 to ensure stable negative pressure. Secondly, the weight of the valve ball 36 is greater than the negative pressure, which can ensure that the position of the valve ball 36 is not affected by negative pressure. When the rotating shaft 7 rotates, it will cause the valve ball 36 to press against the inclined surface of the switching groove 40, so that the valve ball 36 can slide out of the switching groove 40 and move into the air passage 11. At this time, the valve ball 36 abuts against the inner wall of the mounting hole 9, thereby locking the position of the valve ball 36, so that the valve ball 36 can stably cut off the idle 7-shaped negative pressure tube 8, while the valve ball 36 corresponding to the 7-shaped negative pressure tube 8 in the working state falls partially into the switching groove 40 under its own gravity, so that the air passage 11 corresponding to the 7-shaped negative pressure tube 8 is in the open state, and can negative pressure adsorb the encapsulated chip.

[0041] Example 3

[0042] Based on Example 2, such as Figures 1 to 7As shown, a groove 12 is provided on the top surface of the slide block 6, which connects to the mounting hole 9. The length direction of the groove 12 extends axially toward the mounting hole 9. A sliding shaft 13 is slidably disposed in the groove 12, and the sliding shaft 13 has the freedom to move along the length direction of the groove 12. An annular groove 14 is provided on the side wall of the rotating shaft 7, and one end of the sliding shaft 13 extends into the annular groove 14. The end of the rotating shaft 7 away from the 7-shaped negative pressure tube 8 passes through the slide block 6 and is connected to a gear 15. A rack 16 is fixed on the base plate 5. When the packaged chip is flipped, the gear 15 meshes with the rack 16. When the packaged chip that has been inspected is unloaded, the sliding shaft 13 drives the rotating shaft 7 to move, so that the rack 16 and the gear 15 are in an interleaved state. The two ends of the base plate 5 are respectively connected to a first actuating plate 17 and a second actuating plate 18. A toggle plate 18 and a slide block 6 are located between a first toggle plate 17 and a second toggle plate 18. A first toggle groove 19 is provided at the end of the first toggle plate 17 near the slide block 6. A first wedge-shaped surface 20 is provided on the inner wall of the first toggle groove 19 away from the detection station. The first wedge-shaped surface 20 causes the width of the first toggle groove 19 to gradually increase in the direction close to the slide block 6. A second toggle groove 21 is provided at the end of the second toggle plate 18 near the slide block 6. A second wedge-shaped surface 22 is provided on the inner wall of the second toggle groove 21 near the detection station. The second wedge-shaped surface 22 causes the width of the second toggle groove 21 to gradually increase in the direction close to the slide block 6. When the gear 15 meshes with the rack 16, the second wedge-shaped surface 22 is located on the moving path of the slide shaft 13, and the slide shaft 13 can slide into the end of the first toggle groove 19.When gear 15 and rack 16 intersect axially along mounting hole 9, the first wedge surface 20 is located on the moving path of slide shaft 13, and slide shaft 13 can slide into the end of second gear groove 21. A linear drive module 26 is mounted on the top surface of slide block 6. Slide block 6 is mounted on slide block of linear drive module 26 via lifting assembly. Linear drive module 26 drives slide block 6 to move closer to material tray 2. During the movement, slide shaft 13 will enter first gear groove 19 and press the first wedge surface 20. Under the guidance of the first wedge surface 20, slide shaft 13 drives rotating shaft 7 to move closer to the detection station, so that slide shaft 13 can move smoothly to the end of first gear groove 19. At this time, gear 15 can smoothly mesh with rack 16, and the packaged chip in one of the chip slots 3 is located on the feeding path of the 7-shaped negative pressure tube 8. The packaged chip is attracted by the 7-shaped negative pressure tube 8, and then the linear drive module 26 drives the slide 6 to move closer to the detection station. During the movement, gear 15 meshes with rack 16, thereby causing the rotating shaft 7 to deflect the packaged chip. When gear 15 disengages from rack 16, the packaged chip rotates 180°, so that the pins of the packaged chip are exposed with the pins facing upward. Then the slide 13 enters the second deflector groove 21 and presses the second wedge surface 22. Under the action of the second wedge surface 22, the rotating shaft 7 moves away from the detection station. The position shifts, causing gear 15 and rack 16 to intersect axially along the mounting hole 9. When the sliding shaft 13 moves to the end of the second gear slot 21, the conveying and positioning are completed. At this time, the packaged chip is located in the inspection station, and then the inspection operation is performed. After the inspection is completed, the slide 6 again drives the packaged chip to move closer to the material tray 2 through the 7-shaped negative pressure pipe 8. During the movement, it first passes through the unloading conveyor belt 39, and the unloading conveyor belt 39 and the material tray are arranged intersecting axially along the mounting hole 9. When gear 15 and rack 16 intersect, the unloading conveyor belt 39 is located on the movement path of the packaged chip that has been inspected. At this time, due to the intersecting of rack 16 and gear 15, the rotating shaft 7 will not rotate. The deflection causes the 7-shaped negative pressure tube 8 to maintain the packaged chip's position as it moves above the unloading conveyor belt 39. The negative pressure in the 7-shaped negative pressure tube 8 is then cut off, allowing the packaged chip to fall onto the unloading conveyor belt 39. Next, the slide block 6 continues to move closer to the tray, causing the slide shaft 13 to move into the first deflector groove 19. Through the first wedge-shaped surface 20, the rotating shaft 7 drives the 7-shaped negative pressure tube 8 to move above the tray 2. This process is repeated to continue conveying the next packaged chip to the inspection station for testing. Thus, only one linear drive module 26 is needed to complete the flipping and loading / unloading of the packaged chip, resulting in low equipment investment, higher alignment accuracy, and a smaller footprint.

[0043] Furthermore, a guide groove is provided on the side wall of the slide groove 12, and a guide block is slidably fitted in the guide groove. The guide block is fixedly connected to the slide shaft 13. The cooperation between the guide block and the guide groove ensures that the slide shaft 13 will not detach from the slide groove 12. Under the action of the annular groove 14, the rotating shaft 7 can rotate smoothly without interference.

[0044] Example 4

[0045] Because the rotating shaft 7 is movably assembled within the mounting hole 9, possessing both rotational and axial movement freedom, its position is prone to shift, leading to inaccurate loading / unloading and visual inspection. Therefore, based on Embodiment 3, as follows... Figures 1 to 7 As shown, the slide block 6 has a limiting cavity 23, which is connected to the mounting hole 9. A pressing block 24 is slidably disposed in the limiting cavity 23. The end of the pressing block 24 near the rotating shaft 7 has an arc surface, and the end of the pressing block 24 away from the rotating shaft 7 is connected to a pressing spring 25. The end of the pressing spring 25 away from the pressing block 24 is connected to the slide block 6. Under the action of the pressing spring 25, the arc surface of the pressing block 24 presses against the rotating shaft 7, and the pressing spring 25 is in a compressed state. The reaction force of the pressing spring 25 presses the pressing block 24 against the rotating shaft. 7, so that the rotating shaft 7 can be stably arranged in the mounting hole 9. When the linear drive module 26 drives the slide 6 to move, and the gear 15 and rack 16 mesh, the rotating shaft 7 is deflected under the action of the pressure spring 25 under strong force. After the deflection is completed, the pressure spring 25 continues to squeeze the rotating shaft 7. When the slide 13 squeezes the first wedge surface 20 and the second wedge surface 22, the rotating shaft 7 can move axially under the action of the pressure spring 25, so as to accurately realize the automatic feeding operation and the flipping operation.

[0046] Example 5

[0047] Based on Example 4, such as Figures 1 to 7 As shown, the lifting assembly includes a base 27 and a lifting seat 28. The base 27 is fixed on the slide of the linear drive module 26, and the lifting seat 28 is positioned above the base 27. The slide 6 is fixed to the top of the lifting seat 28. A telescopic rod 29 is fixed to the top of the base 27, and both ends of the telescopic rod 29 are connected to the base 27 and the lifting seat 28, respectively. A spring 31 is sleeved on the telescopic rod 29. An installation groove 32 is opened on the top of the base 27, and an electromagnet 33 is installed in the installation groove 32. A permanent magnet 34 is installed at the bottom of the lifting seat 28. When the electromagnet 33 is energized, it generates magnetic poles that are opposite to the magnetic properties of the permanent magnet 34. The 7-shaped negative pressure pipe 8 is located away from the base 27. A rubber ring is fixed at one end of the rotating shaft 7. When the 7-shaped negative pressure tube 8 moves above the material tray 2 and the unloading conveyor belt 39, the electromagnet 33 is energized to attract the permanent magnet 34, causing the lifting seat 28 to squeeze the spring 31 and move downward, so that the 7-shaped negative pressure tube 8 moves downward to contact the packaged chip to complete the adsorption and loading. Alternatively, the 7-shaped negative pressure tube 8 carries the packaged chip downward and places the packaged chip on the unloading conveyor belt 39. After loading and unloading are completed, the electromagnet 33 is de-energized, so that the lifting seat 28 is reset under the action of the spring 31, thereby resetting the slide 6 and the 7-shaped negative pressure tube 8 on it. The deformation of the rubber ring can eliminate the influence of error.

[0048] Example 6

[0049] Based on Example 5, a switching dual-air-path collaborative feeding and detection method, utilizing the aforementioned switching dual-air-path collaborative feeding and detection system, includes the following steps:

[0050] S1. The packaged chip to be tested is placed in the chip slot 3 with the pins of the packaged chip facing down, so that the top surface of the packaged chip is exposed.

[0051] S2, the slide 6 drives the 7-shaped negative pressure tube 8 to move to the material tray 2, and the 7-shaped negative pressure tube 8 is adsorbed on the top surface of the packaged chip by negative pressure;

[0052] S3 and the 7-shaped negative pressure tube 8 carry the packaged chip to the testing station. During the movement, the rotating shaft 7 drives the packaged chip to rotate 180°, so that the pins of the packaged chip are exposed with the pins facing upward.

[0053] S4. The upper station camera 2, the front station camera 3 and the rear station camera 4 work together to image the packaged chip. The images are combined to form a three-dimensional image of the packaged chip, thereby determining whether there are quality problems with the chip's pins.

[0054] S5 and the 7-shaped negative pressure tube 8 unload the packaged chip that has been tested onto the unloading conveyor belt 39. During this process, the rotating shaft 7 does not rotate, so that the chip can be unloaded onto the unloading conveyor belt 39 with the pins facing upwards.

[0055] S6. Adjust the position of the tray 2 by using the first linear drive module 44 and the second linear drive module 46 so that the next packaged chip to be tested is in the working position of the 7-shaped negative pressure tube 8.

[0056] S7. Repeat the above operations S1-S6 to complete the batch testing of packaged chips.

Claims

1. A switching dual-air-path coordinated feeding and detection system, characterized in that, The system includes a testing platform (1), on which a material tray (2), a testing device, and a dual-air-path testing device are provided. The dual-air-path testing device is used to transport packaged chips to the testing station of the testing platform (1). The material tray (2) has several chip slots (3) arranged in a rectangular array. The chip slots (3) are used to place packaged chips. The dual-air-path testing device includes an air inlet block (4), a base plate (5), a slide (6), a rotating shaft (7), and a 7-shaped negative pressure pipe (8). The base plate (5) is fixed on the testing platform (1). The slide (6) is slidably mounted on the base plate (5). The slide (6) has a mounting hole (9) on the side near the detection device. The rotating shaft (7) is adapted to the mounting hole (9) and has the freedom to move axially along the mounting hole (9). Two 7-shaped negative pressure pipes (8) are symmetrically connected at the end of the rotating shaft (7) near the detection station. An air inlet (10) is coaxially opened at the end of the rotating shaft (7) away from the 7-shaped negative pressure pipes (8). The end of the air inlet (10) near the 7-shaped negative pressure pipes (8) is divided into two air channels (1). 1) The two air passages (11) are respectively connected to two 7-shaped negative pressure pipes (8). The outer wall of the rotating shaft (7) has two switching holes (35), which are respectively connected to the two air passages (11). A valve ball (36) is slidably installed in the air passage (11). The valve ball (36) moves to make the air passage (11) open or closed. An air inlet block (4) is fixed on the top of the slide block (6). An air inlet channel (37) is provided in the air inlet block (4). One end of the air inlet channel (37) is connected to the negative pressure pump through a hose. The other end of the channel (37) is connected to a U-shaped air inlet pipe (38). The end of the U-shaped air inlet pipe (38) away from the air inlet block (4) is inserted into the air inlet hole (10). The 7-shaped negative pressure pipe (8) is used to transport the chip from the material tray (2) to the detection device for detection. During the transport process, the packaged chip is rotated 180°. After the detection is completed, the 7-shaped negative pressure pipe (8) transports the packaged chip to the unloading conveyor belt (39). During the transport process, the rotating shaft (7) does not rotate, so that the chip can be placed on the unloading conveyor belt (39) with the pins facing upwards.

2. The switching dual-air-path coordinated feeding and detection system according to claim 1, characterized in that, The inner bottom wall of the mounting hole (9) is provided with a switching groove (40). When the valve ball (36) is partially located in the switching groove (40), the air passage (11) corresponding to the valve ball (36) is in a conductive state. Both ends of the switching groove (40) are inclined surfaces along the radial direction of the rotation axis (7). The axial width of the switching groove (40) is greater than the length of the rotation axis (7) moving axially along the mounting hole (9).

3. The switching dual-air-path coordinated feeding and detection system according to claim 1, characterized in that, The top surface of the slide block (6) is provided with a slide groove (12), the slide groove (12) is connected to the mounting hole (9), and the length direction of the slide groove (12) extends axially toward the mounting hole (9). A slide shaft (13) is slidably arranged in the slide groove (12), and the slide shaft (13) has the freedom to move along the length direction of the slide groove (12). An annular groove (14) is provided on the side wall of the rotating shaft (7), and one end of the slide shaft (13) extends into the annular groove (14). The end of the rotating shaft (7) away from the 7-shaped negative pressure tube (8) passes through the slide block (6) and is connected to a gear (15). A rack (16) is fixed on the base plate (5). When the packaged chip is flipped, the gear (15) meshes with the rack (16). When the packaged chip that has been inspected is unloaded, the slide shaft (13) drives the rotating shaft (7) to move so that the rack (16) and the gear (15) are in an interleaved state.

4. The switching dual-air-path coordinated feeding and detection system according to claim 3, characterized in that, The base plate (5) is connected to a first actuating plate (17) and a second actuating plate (18) at its two ends respectively. The slide (6) is located between the first actuating plate (17) and the second actuating plate (18). The first actuating plate (17) has a first actuating shaft groove (19) at one end near the slide (6). The inner wall of the first actuating shaft groove (19) away from the detection station has a first wedge-shaped surface (20). The first wedge-shaped surface (20) makes the width of the first actuating shaft groove (19) gradually increase along the direction near the slide (6). The second actuating plate (18) has a second actuating shaft groove (21) at one end near the slide (6). The inner wall of the second actuating shaft groove (21) near the detection station has a second wedge-shaped surface (22). The second wedge-shaped surface (22) makes the width of the second actuating shaft groove (21) gradually increase along the direction near the slide (6). When the gear (15) meshes with the rack (16), the second wedge surface (22) is located on the moving path of the slide shaft (13), and the slide shaft (13) can slide into the end of the first gear groove (19); when the gear (15) and the rack (16) intersect along the axial direction of the mounting hole (9), the first wedge surface (20) is located on the moving path of the slide shaft (13), and the slide shaft (13) can slide into the end of the second gear groove (21).

5. The switching dual-air-path coordinated feeding and detection system according to claim 4, characterized in that, The slide block (6) is provided with a limiting cavity (23), which is connected to the mounting hole (9). A pressing block (24) is slidably arranged in the limiting cavity (23). The end of the pressing block (24) near the rotating shaft (7) is provided with an arc surface. The end of the pressing block (24) away from the rotating shaft (7) is connected to a pressing spring (25). The end of the pressing spring (25) away from the pressing block (24) is connected to the slide block (6). Under the action of the pressing spring (25), the arc surface of the pressing block (24) presses against the rotating shaft (7). A linear drive module (26) is installed on the top surface of the slide block (6). The slide block (6) is installed on the slide block of the linear drive module (26) through a lifting assembly.

6. The switching dual-air-path coordinated feeding and detection system according to claim 5, characterized in that, The lifting assembly includes a base (27) and a lifting seat (28). The base (27) is fixed on the slide of the linear drive module (26). The lifting seat (28) is located above the base (27). The slide (6) is fixed on the top of the lifting seat (28). A telescopic rod (29) is fixed on the top of the base (27). The two ends of the telescopic rod (29) are respectively connected to the base (27) and the lifting seat (28). A spring (31) is sleeved on the telescopic rod (29).

7. The switching dual-air-path coordinated feeding and detection system according to claim 6, characterized in that, The top of the base (27) is provided with an installation groove (32), an electromagnet (33) is installed in the installation groove (32), and a permanent magnet (34) is installed at the bottom of the lifting seat (28). When the electromagnet (33) is energized, it generates a magnetic pole that is opposite to the magnetism of the permanent magnet (34).

8. The switching dual-air-path coordinated feeding and detection system according to claim 1, characterized in that, The detection device includes an upper station camera (41), a front station camera (42) and a rear station camera (43). The upper station camera (41) is located directly above the detection station, and the chips on both sides of the packaged chip correspond to the front station camera (42) and the rear station camera (43) respectively.

9. The switching dual-air-path coordinated feeding and detection system according to claim 8, characterized in that, A bidirectional drive assembly is provided below the material tray (2). The bidirectional drive assembly includes a first linear drive module (44), a drive plate (45), a second linear drive module (46), and a positioning plate (47). The first linear drive module (44) is installed on the detection platform (1). The drive plate (45) is installed on the slide of the first linear drive module (44). The second linear drive module (46) is installed on the drive plate (45). The positioning plate (47) is installed on the slide of the second linear drive module (46). A rectangular positioning post (48) is fixed on the top of the positioning plate (47). A rectangular positioning groove (49) is opened at the bottom of the material tray (2). The rectangular positioning post (48) is adapted to the rectangular positioning groove (49).

10. A switching dual-air-path coordinated feeding and detection method, utilizing the switching dual-air-path coordinated feeding and detection system as described in claim 9, characterized in that, Includes the following steps: S1. The packaged chip to be tested is placed in the chip slot (3), with the pins of the packaged chip facing down, so that the top surface of the packaged chip is exposed. S2, the slide (6) drives the 7-shaped negative pressure tube (8) to move to the material tray (2), and the 7-shaped negative pressure tube (8) is adsorbed on the top surface of the packaged chip by negative pressure; S3, the 7-shaped negative pressure tube (8) carries the packaged chip to the testing station. During the movement, the rotating shaft (7) drives the packaged chip to rotate 180°, so that the pins of the packaged chip are exposed with the pins facing upward. S4. The packaged chip is imaged by the upper station camera (2), the front station camera (3) and the rear station camera (4) working together. The images are combined to form a three-dimensional image of the packaged chip, thereby determining whether there are quality problems with the chip pins. S5, the 7-shaped negative pressure tube (8) unloads the packaged chip that has been tested onto the unloading conveyor belt (39). During this process, the rotating shaft (7) does not rotate, so that the chip can be unloaded onto the unloading conveyor belt (39) with the pins facing upwards. S6. Adjust the position of the tray (2) by using the first linear drive module (44) and the second linear drive module (46) so that the next packaged chip to be tested is in the working position of the 7-shaped negative pressure tube (8); S7. Repeat the above operations S1-S6 to complete the batch testing of packaged chips.

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