Electronic device including flexible circuit board

Abstract

The invention relates to an electronic device. The electronic device according to an embodiment of the present invention comprises: a housing; the circuit board is arranged in the shell; a camera assembly spaced apart from the circuit board; and a flexible circuit board including a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board, and a flexible portion connecting the first rigid portion and the second rigid portion. The flexible circuit board may include: a substrate layer; a first conductive layer coupled to the substrate layer; a first shielding layer spaced apart from the first conductive layer and including a 1-1 shielding layer portion in the first rigid portion, a 1-2 shielding layer portion in the second rigid portion, and a 1-3 shielding layer portion in the flexible portion; and a first ground layer connected to the first shielding layer, and at least a portion of the first ground layer extends along a periphery of the first rigid portion. Various other embodiments are also possible.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to an electronic device, such as an electronic device including a flexible circuit board. Background Technology

[0002] Cutting-edge information and communication technologies and semiconductor technologies have accelerated the popularization and use of various electronic devices. In particular, new electronic devices that communicate while being carried are being developed.

[0003] The term "electronic device" can refer to a device that performs specific functions according to its equipped programs, such as home appliances, electronic dispatchers, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop PCs or laptop computers, car navigation systems, etc. For example, an electronic device can output stored information as voice or images. With the high integration of electronic devices and the prevalence of high-speed, high-capacity wireless communication, electronic devices such as mobile communication terminals have recently been equipped with a variety of functions. For example, electronic devices have integrated functions including entertainment (such as playing video games), multimedia (such as playing music / videos), communication and security functions (such as for mobile banking), and dispatch or e-wallet functions. The size of these electronic devices has been reduced to facilitate user portability.

[0004] The above information is provided as relevant technology for the purpose of aiding understanding of this disclosure. No statement or determination is made as to whether any of the foregoing content can be used as background technology in relation to this disclosure. Summary of the Invention

[0005] Solution to the problem An electronic device according to an embodiment of the present disclosure may include a housing.

[0006] The electronic device according to embodiments of the present disclosure may include a circuit board disposed in a housing.

[0007] The electronic device according to embodiments of this disclosure may include a camera assembly spaced apart from the circuit board.

[0008] The electronic device according to embodiments of the present disclosure may include a flexible circuit board, wherein the flexible circuit board includes a first rigid portion connected to the camera assembly, a second rigid portion connected to the circuit board, and a flexible portion connecting the first rigid portion and the second rigid portion.

[0009] The flexible circuit board according to embodiments of this disclosure may include a substrate layer.

[0010] The flexible circuit board according to embodiments of the present disclosure may include a first conductive layer bonded to the substrate layer.

[0011] The flexible circuit board according to the disclosed embodiments may include a first shielding layer, wherein the first shielding layer includes a first-1 shielding layer portion located in a first rigid portion, a first-2 shielding layer portion located in a second rigid portion, and a first-3 shielding layer portion located in a flexible portion, and is spaced apart from the first conductive layer.

[0012] The flexible circuit board according to embodiments of the present disclosure may include a first ground layer, wherein the first ground layer extends at least partially around the first rigid portion and is connected to the first shielding layer.

[0013] A flexible circuit board according to an embodiment of the present disclosure may include a substrate layer, wherein the substrate layer extends to each of a first rigid portion, a second rigid portion spaced apart from the first rigid portion, and a flexible portion connecting the first rigid portion and the second rigid portion.

[0014] The flexible circuit board according to embodiments of the present disclosure may include a first conductive layer bonded to the substrate layer.

[0015] The flexible circuit board according to the disclosed embodiments may include a first shielding layer, wherein the first shielding layer includes a first-1 shielding layer portion located in the first rigid portion, a first-2 shielding layer portion located in the second rigid portion, and a first-3 shielding layer portion located in the flexible portion, and the first shielding layer is spaced apart from the first conductive layer.

[0016] The flexible circuit board according to embodiments of the present disclosure may include a first ground layer that extends at least partially around a first rigid portion and is connected to a first shielding layer. Attached Figure Description

[0017] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0018] Figure 2 This is a perspective view illustrating an electronic device according to an embodiment of the present disclosure.

[0019] Figure 3 This is a perspective view illustrating an electronic device according to an embodiment of the present disclosure.

[0020] Figure 4 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0021] Figure 5 This is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0022] Figure 6A portion of an electronic device according to an embodiment of the present disclosure is shown.

[0023] Figure 7 A portion of an electronic device according to an embodiment of the present disclosure is shown.

[0024] Figure 8 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0025] Figure 9 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0026] Figure 10 A portion of an electronic device according to an embodiment of the present disclosure is shown.

[0027] Figure 11 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0028] Figure 12 This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0029] Figure 13a This is a cross-sectional view showing a portion of an electronic device according to an embodiment of the present disclosure.

[0030] Figure 13b This is a view showing an assembly of a flexible circuit board according to an embodiment of the present disclosure.

[0031] Figure 13c This is a cross-sectional view showing a flexible circuit board according to an embodiment of the present disclosure. Detailed Implementation

[0032] The following description, taken in conjunction with the accompanying drawings, provides an understanding of various exemplary embodiments of the present disclosure, including the claims and their equivalents. The specific embodiments disclosed in the following description require various specific details to aid understanding, but are considered as one of various embodiments. Therefore, those skilled in the art will understand that various changes and modifications can be made to the various embodiments described in this disclosure without departing from the scope and spirit of the present disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0033] The terms and words used in the following description and claims are not limited to their literal meaning, but are used to clearly and consistently describe embodiments of this disclosure. Therefore, those skilled in the art will understand that the following description of various embodiments of this disclosure is for descriptive purposes only and not for limiting the scope of this disclosure as defined by the claims and their equivalents.

[0034] Unless the context clearly indicates otherwise, the singular forms “a,” “one,” and “the” are intended to include the plural forms as well. Thus, as an example, “component surface” can be interpreted as including one or more surfaces of a component.

[0035] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0036] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In an embodiment, at least one of the components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to an embodiment, some components of the assembly (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0037] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 in conjunction with processor 120, and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculations, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to consume less power than the main processor 121, or may be configured to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0038] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated via machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0039] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0040] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0041] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0042] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0043] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of the force generated by the touch.

[0044] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or via headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0045] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0046] Interface 177 may support one or more specific protocols used to enable electronic device 101 to be directly (e.g., wired) or wirelessly coupled to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0047] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0049] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0050] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0051] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0052] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network, such as Bluetooth). TM The wireless communication module 192 can communicate with external electronic devices 104 via a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, Internet, or computer network (e.g., a local area network (LAN) or wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify or verify electronic devices 101 in a communication network (such as a first network 198 or a second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0053] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0054] Antenna module 197 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiator formed of a conductor or conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts besides the radiator (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0055] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals of the specified high-frequency band.

[0056] At least some of the aforementioned components can be combined with each other and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0057] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Electronic device 102 or electronic device 104 may each be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 may be performed on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service itself; or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In an embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0058] The electronic device according to various embodiments of this disclosure can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0059] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of a noun corresponding to a term may include one or more things. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., wiredly) combined with the second element, wirelessly combined with the second element, or combined with the second element via a third element.

[0060] As used herein, the term "module" can include units implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0061] The various embodiments set forth herein can be implemented as software (e.g., program 140) comprising one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0062] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0063] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be run in a different order or omitted, or one or more other operations may be added.

[0064] Figure 2 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure.

[0065] Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure.

[0066] Figure 2 and Figure 3 The embodiments can be compared with Figure 1 Implementation examples or Figures 4 to 13c Examples of combinations.

[0067] Reference Figure 2 and Figure 3 According to an embodiment, electronic device 101 (e.g., Figure 1 The electronic device 101 may include a housing 210, wherein the housing 210 includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. According to an embodiment (not shown), the housing 210 may represent a structure forming... Figure 2 First surface 210A, Figure 3The structure includes a second surface 210B and several side surfaces 210C. According to an embodiment, at least a portion of the first surface 210A may have a substantially transparent front panel 202 (e.g., a polymer panel or glass panel including various coatings). The second surface 210B may be formed from a substantially opaque back panel 211. The back panel 211 may be formed from, for example, laminated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these. The back panel 211 may form the second surface 210B. The side surfaces 210C may be formed from a side surface structure (or “side bezel structure”) 218, wherein the side surface structure 218 is bonded to the front panel 202 and the back panel 211 and includes metal and / or polymer. In an embodiment, the back panel 211 and the side surface structure 218 may be integrally formed together and include the same material (e.g., metal such as aluminum).

[0068] Although not shown, the front panel 202 may include one or more regions that bend and extend seamlessly toward the rear panel 211 from at least a portion of its edge. In an embodiment, only one region of the front panel 202 (or rear panel 211) that bends and extends toward the rear panel 211 (or front panel 202) may be included in one edge of the first surface 210A. According to an embodiment, the front panel 202 or the rear panel 211 may have a substantially flat shape. For example, the bent and extending regions may not be included. When the bent and extending regions are included, the thickness of the electronic device 101 at the portion including the bent and extending regions may be less than the thickness of the remaining portions.

[0069] According to an embodiment, electronic device 101 may include at least one or more of the following: display 220, audio modules 203, 207 and 214, sensor modules 204 and 219, camera modules 205, 212 and 213, key input device 217, light-emitting device 206, and connector holes 208 and 209. In an embodiment, electronic device 101 may exclude at least one of the components (e.g., key input device 217 or light-emitting device 206), or other components may be added.

[0070] Display 220 can be visually exposed through a substantial portion of the front panel 202. In an embodiment, at least a portion of display 220 can be visually exposed through the front panel 202 forming the first surface 210A, or through a portion of the side surface 210C. In an embodiment, the edges of display 220 can be formed to be substantially identical in shape to the adjacent outer edges of the front panel 202. In an embodiment (not shown), the spacing between the outer edges of display 220 and the outer edges of the front panel 202 can be kept substantially uniform to give display 220 a larger visually exposed area.

[0071] In one embodiment (not shown), the screen display area of ​​the display 220 may have a recess or opening in a portion thereof, and at least one or more of the audio module 214, sensor module 204, camera module 205, and light-emitting device 206 may be aligned with the recess or opening. In another embodiment (not shown), at least one or more of the audio module 214, sensor module 204, camera module 205, fingerprint sensor (not shown), and light-emitting device 206 may be included on the rear surface of the screen display area of ​​the display 220. In another embodiment (not shown), the display 220 may be configured in conjunction with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digital converter for detecting a magnetic field type stylus.

[0072] Audio modules 203, 207, and 214 may include a microphone hole 203 and speaker holes 207 and 214. A microphone for acquiring external sound may be disposed in the microphone hole 203. In embodiments, multiple microphones may be disposed to detect the direction of sound. Speaker holes 207 and 214 may include an external speaker hole 207 and a telephone receiver hole 214. In embodiments, speaker holes 207 and 214 and microphone hole 203 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without speaker holes 207 and 214.

[0073] Sensor modules 204 and 219 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 101. For example, sensor modules 204 and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 210A of housing 210, and / or a third sensor module 219 and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface 210B of housing 210. The fingerprint sensor may be disposed on the second surface 210B or side surface 210C of housing 210 and the first surface 210A (e.g., display 220). Electronic device 101 may also include at least one of, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0074] Camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of electronic device 101, and a second camera device 212 disposed on a second surface 210B, and / or a flash 213. Camera devices 205 and 212 may include one or more lenses, image sensors, and / or image signal processors. Flash 213 may include, for example, a light-emitting diode (LED) or a xenon lamp. In embodiments, two or more lenses (infrared (IR) cameras, wide-angle lenses, and telephoto lenses) and image sensors may be disposed on one surface of electronic device 101. In embodiments, flash 213 may emit infrared light. Infrared light emitted by flash 213 and reflected by an object may be received by a third sensor module 219. Electronic device 101 or its processor may detect depth information about an object based on the time point at which infrared light is received from the third sensor module 219.

[0075] Key input device 217 may be disposed on side surface 210C of housing 210. In an embodiment, electronic device 101 may exclude all or some of the aforementioned key input devices 217, and the excluded key input devices 217 may be implemented on display 220 in other forms (e.g., as soft keys). In an embodiment, the key input device may include a sensor module disposed on second surface 210B of housing 210.

[0076] The light-emitting device 206 may be disposed, for example, on a first surface 210A of the housing 210. The light-emitting device 206 may provide information, for example, about the state of the electronic device 101, in the form of light. In an embodiment, the light-emitting device 206 may provide a light source that interacts with, for example, a camera module 205. The light-emitting device 206 may include, for example, a light-emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0077] Connector holes 208 and 209 may include a first connector hole 208 and / or a second connector hole 209 (e.g., a headphone jack), wherein the first connector hole 208 is used to accommodate a connector for transmitting power and / or data to or receiving power and / or data from an external electronic device (e.g., a Universal Serial Bus (USB) connector), and the second connector hole 209 is used to accommodate a connector for transmitting audio signals to or receiving audio signals from an external electronic device.

[0078] Figure 4 This is an exploded front perspective view showing an electronic device according to an embodiment of the present disclosure.

[0079] Figure 5 This is a rear exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0080] Figure 4 and Figure 5 The embodiments can be compared with Figures 1 to 3 Implementation examples or Figures 6 to 13c Examples of combinations.

[0081] Reference Figure 3 and Figure 4 Electronic device 101 (e.g., Figure 1 or Figure 2 The electronic device 101 may include a side structure 310, a first support member 311 (e.g., a bracket), and a front panel 320 (e.g., Figure 1 Front panel 202), display 330 (e.g., Figure 1 The display 220), at least one printed circuit board (or board assembly) 340a or 340b, battery 350, second support member 360 (e.g., rear housing), antenna, camera assembly 307, and rear plate 380 (e.g., Figure 2 (Rear panel 211). When multiple printed circuit boards 340a and 340b are included, the electronic device 101 may include at least one flexible printed circuit board 340c to electrically connect the different printed circuit boards. For example, printed circuit boards 340a and 340b may include a first circuit board 340a disposed above the battery 350 (e.g., in the +Y axis direction) and a second circuit board 340b disposed below the battery 350 (e.g., in the -Y axis direction), and the flexible circuit board 340c may be electrically connected to the first circuit board 340a and the second circuit board 340b.

[0082] According to embodiments, electronic device 101 may exclude at least one of the components (e.g., the first support member 311 or the second support member 360), or may add other components. At least one component of electronic device 101 may be associated with... Figure 1 or Figure 2 At least one component of the electronic device 101 is the same as or similar to that of the other device, and will not be described again below.

[0083] At least a portion of the first support member 311 may be configured as a flat plate. In embodiments, the first support member 311 may be disposed within the electronic device 101 to connect to or integrate with the side structure 310. The first support member 311 may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). When the first support member 311 is at least partially formed of a metallic material, the side structure 310 or a portion of the first support member 311 may serve as an antenna. A display 330 may be bonded to one surface of the first support member 311, and printed circuit boards 340a and 340b may be bonded to opposite surfaces of the first support member 311. A processor, memory, and / or interface may be mounted on the printed circuit boards 340a and 340b. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communication processor.

[0084] According to an embodiment, the housing 301 may include a first support member 311 and a side structure 310. According to an embodiment, the housing 301 can be understood as a structure for accommodating, protecting, or housing printed circuit boards 340a and 340b or a battery 350. In an embodiment, the housing 301 can be understood as including structures that a user can visually or tactilely identify from the exterior of the electronic device 101, such as the side structure 310, the front panel 320, and / or the rear panel 380. For example, the housing 301 may include structures that form the appearance of the electronic device 101 (e.g., the side structure 310, the front panel 320, and the rear panel 380). The housing 301 may be combined with... Figure 2 and Figure 3 The housing 210 described is the same. In the embodiment, "front surface or rear surface of housing 301" may refer to... Figure 1 First surface 210A or Figure 2 The second surface 210B. In an embodiment, the first support member 311 may be provided on the front plate 320 (e.g., Figure 2 The first surface 210A) and the rear plate 380 (e.g., Figure 3 Between the second surface 210B, and can be used as a structure for placing electrical / electronic components such as printed circuit boards 340a and 340b or camera assembly 307.

[0085] The memory may include, for example, volatile or non-volatile memory.

[0086] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) card interface, and / or an audio interface. The interface can electrically or physically connect, for example, electronic device 101 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0087] The second support member 360 may include, for example, an upper support member 360a or a lower support member 360b. In an embodiment, the upper support member 360a may be configured together with a portion of the first support member 311 to surround printed circuit boards 340a and 340b (e.g., the first circuit board 340a). For example, the upper support member 360a of the second support member 360 may be configured to face the first support member 311, wherein the first circuit board 340a is interposed between the upper support member 360a and the first support member 311. In an embodiment, the lower support member 360b of the second support member 360 may be configured to face the first support member 311, wherein the second circuit board 340b is interposed between the lower support member 360b and the first support member 311. Circuit devices (e.g., processors, communication modules, or memories) implemented in the form of integrated circuit chips or various electrical / electronic components may be disposed on the printed circuit boards 340a and 340b. According to an embodiment, the printed circuit boards 340a and 340b may obtain an electromagnetic shielding environment according to the second support member 360. In an embodiment, the lower support member 360b can serve as a structure on which electrical / electronic components, such as speaker modules or interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors), can be disposed. In an embodiment, electrical / electronic components, such as speaker modules or interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors), can be disposed on a separate printed circuit board (not shown). For example, the lower support member 360b can be configured to surround a separate printed circuit board (e.g., a second printed circuit board 340b) together with other portions of the first support member 311. The speaker module or interface disposed on the separate printed circuit board (not shown) or the lower support member 360b can be integrated with… Figure 2 The audio module 207 or connector holes 208 and 309 are set accordingly.

[0088] Battery 350 may be a device for supplying power to at least one component of electronic device 101. Battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell. At least a portion of battery 350 may be disposed on a plane substantially the same as printed circuit boards 340a and 340b. Battery 350 may be integrally or detachably disposed within electronic device 101.

[0089] Although not shown, the antenna may include a conductor pattern formed on the surface of the second support member 360 by, for example, laser direct forming. In embodiments, the antenna may include a printed circuit pattern formed on the surface of a thin film. A thin-film antenna may be disposed between the rear plate 380 and the battery 350. The antenna may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna may perform short-range communication with, for example, an external device, or may wirelessly transmit or receive power required for charging. In embodiments of the invention, another antenna structure may be formed from a portion or combination of the side structure 310 and / or the first support member 311.

[0090] According to an embodiment, the camera assembly 307 may include at least one camera module. Inside the electronic device 101, the camera assembly 307 (or at least one camera module) may receive at least a portion of light incident through an optical aperture or camera window. In an embodiment, the camera assembly 307 may be disposed on a first support member 311 in a location adjacent to printed circuit boards 340a and 340b. In an embodiment, one or more camera modules of the camera assembly 307 may be substantially aligned with any one of the camera windows and at least partially surrounded by a second support member 360 (e.g., upper support member 360a).

[0091] According to an embodiment, electronic device 101 may include camera holes 312, 313, and 319. The plurality of camera holes 312, 313, and 319 may be configured to be spaced apart from each other. Camera assembly 307 may receive light passing through camera holes 312, 313, and 319. Multiple cameras (e.g., Figure 6 Cameras 3071, 3072 and 3073 may correspond to a plurality of camera holes spaced apart from each other (e.g., a plurality of camera holes 312).

[0092] According to an embodiment, the first support member 311 may include a receiving portion 3111. A battery 350 may be disposed within the receiving portion 3111. The battery 350 may include a terrace 353. The terrace 353 may face a circuit board (e.g., Figure 6 The circuit board 340 protrudes. The battery 350 may include a battery connection member 3501 that connects the platform 353 and the circuit board 340.

[0093] Figure 6 It shows from Figure 3 Electronic device 101 removes the back panel (e.g., Figure 4 and Figure 5 The view of the status of the back panel (380). Figure 7 yes Figure 6 A magnified view of a portion of region M. (Refer to...) Figure 6 and Figure 7 The described components can be compared with the reference Figures 1 to 5 The components described are identical, either wholly or partially. (See reference.) Figure 6 and Figure 7 Some or all of the components described may be related to the reference. Figures 8 to 13c The components described are the same.

[0094] According to an embodiment, the electronic device 101 may include a housing 301, an antenna 308, and a circuit board 340. The housing 301 may be combined with... Figure 4 and Figure 5 The housing 301 described is the same. (Refer to...) Figure 4 and Figure 5 The descriptions of circuit boards 340a, 340b, and 340c are equally applicable to the description of circuit board 340. Antenna 308 may be incorporated into housing 301 and may be part of housing 301. Antenna 308 may form part of the surface of housing 301. Antenna 308 may be spaced apart from camera assembly 307. Radio interference may occur between antenna 308 and camera assembly 307.

[0095] According to an embodiment, electronic device 101 may include camera assembly 307. Camera assembly 307 may capture images of a rear panel (e.g., Figure 5 The object outside the rear panel 380. The camera assembly 307 may include a plurality of cameras 3071, 3072 and 3073. Each of the plurality of cameras 3071, 3072 and 3073 may be aligned in one direction (e.g., the Y direction).

[0096] According to an embodiment, the electronic device 101 may include a flexible circuit board 400. The flexible circuit board 400 may connect the camera assembly 307 to the circuit board 340. The flexible circuit board 400 may connect any one of a plurality of cameras 3071, 3072, and 3073 to the circuit board 340. The flexible circuit board 400 may extend from the circuit board 340 toward the camera assembly 307 in one direction (e.g., the X direction).

[0097] According to an embodiment, the flexible circuit board 400 can connect the first camera 3071 and the circuit board 340. At least a portion of the flexible circuit board 400 can be formed to be deformable. The flexible circuit board 400 can include a flexible material. The flexible circuit board 400 can also include a rigid material.

[0098] According to an embodiment, the flexible circuit board 400 may include a first rigid portion 410. The flexible circuit board 400 may include a second rigid portion 420. The flexible circuit board 400 may include a flexible portion 430. The first rigid portion 410 may be connected to the camera assembly 307. The first rigid portion 410 may include a rigid material. The second rigid portion 420 may be connected to the circuit board 340. The second rigid portion 420 may include a rigid material. The flexible portion 430 may connect the first rigid portion 410 and the second rigid portion 420. The flexible portion 430 may include a flexible material.

[0099] According to an embodiment, electronic device 101 may include connector 480. Connector 480 may connect flexible circuit board 400 and circuit board 340. Connector 480 may connect second rigid portion 420 and circuit board 340.

[0100] Figure 8 This is a cross-sectional view showing a flexible circuit board 400 connected to a camera assembly 307 and a connector 480 according to an embodiment of the present disclosure. Figure 9 This is a cross-sectional view showing a flexible circuit board 400 connected to a camera assembly 307 and a connector 480 according to an embodiment of the present disclosure. Figure 8 It is shown along the embodiment Figure 6 and Figure 7 The cross-sectional view of the components (e.g., camera assembly 307, connector 480, and flexible circuit board 400) taken along reference line A-A' is shown. Figure 9 It is shown along the embodiment Figure 6 and Figure 7 The cross-sectional view of the components (e.g., camera assembly 307, connector 480, and flexible circuit board 400) taken along reference line A-A' is shown. (Refer to...) Figure 8 and Figure 9 Some or all of the components described may be related to the reference. Figures 1 to 7 The components described are the same. (See reference...) Figure 8 and Figure 9 Some or all of the components described may be related to the reference. Figures 10 to 13c The components described are the same.

[0101] According to an embodiment, the flexible circuit board 400 may include a first rigid portion 410, a second rigid portion 420, and a flexible portion 430. The flexible portion 430 may be disposed between the first rigid portion 410 and the second rigid portion 420, and may connect the first rigid portion 410 and the second rigid portion 420. The flexible circuit board 400 may be integrally formed. The first rigid portion 410, the second rigid portion 420, and the flexible portion 430 may be integrally formed.

[0102] According to an embodiment, the flexible circuit board 400 may include a base layer 441. The base layer 441 may be disposed between a first conductive layer 442 and a second conductive layer 446. A portion of the base layer 441 may be disposed in a first rigid portion 410. A portion of the base layer 441 may be disposed in a second rigid portion 420. A portion of the base layer 441 may be disposed in a flexible portion 430.

[0103] According to an embodiment, the flexible circuit board 400 may include a first conductive layer 442. The first conductive layer 442 may include a copper (Cu) material. The first conductive layer 442 may be disposed between a substrate layer 441 and a first adhesive layer 443. A portion of the first conductive layer 442 may be disposed in a first rigid portion 410. A portion of the first conductive layer 442 may be disposed in a second rigid portion 420. A portion of the first conductive layer 442 may be disposed in a flexible portion 430.

[0104] According to an embodiment, the flexible circuit board 400 may include a first adhesive layer 443. The first adhesive layer 443 may be disposed between a first conductive layer 442 and a first cover layer 444. The first adhesive layer 443 may bond the first conductive layer 442 and the first cover layer 444. A portion of the first adhesive layer 443 may be disposed in a first rigid portion 410. A portion of the first adhesive layer 443 may be disposed in a second rigid portion 420. A portion of the first adhesive layer 443 may be disposed in a flexible portion 430.

[0105] According to an embodiment, the flexible circuit board 400 may include a first cover layer 444. The first cover layer 444 may be disposed between a first adhesive layer 443 and a first shielding layer 445. A portion of the first cover layer 444 may be disposed in a first rigid portion 410. A portion of the first cover layer 444 may be disposed in a second rigid portion 420. A portion of the first cover layer 444 may be disposed in a flexible portion 430.

[0106] According to an embodiment, the flexible circuit board 400 may include a first shielding layer 445. A portion of the first shielding layer 445 may be disposed in a first rigid portion 410. A portion of the first shielding layer 445 may be disposed in a second rigid portion 420. A portion of the first shielding layer 445 may be disposed in a flexible portion 430.

[0107] According to an embodiment, the flexible circuit board 400 may include a second conductive layer 446. The second conductive layer 446 may include a copper (Cu) material. The second conductive layer 446 may be disposed between a substrate layer 441 and a second adhesive layer 447. A portion of the second conductive layer 446 may be disposed in a first rigid portion 410. A portion of the second conductive layer 446 may be disposed in a second rigid portion 420. A portion of the second conductive layer 446 may be disposed in a flexible portion 430.

[0108] According to an embodiment, the flexible circuit board 400 may include a second adhesive layer 447. The second adhesive layer 447 may be disposed between the second conductive layer 446 and the second cover layer 448. The second adhesive layer 447 may bond the second conductive layer 446 and the second cover layer 448. A portion of the second adhesive layer 447 may be disposed in a first rigid portion 410. A portion of the second adhesive layer 447 may be disposed in a second rigid portion 420. A portion of the second adhesive layer 447 may be disposed in a flexible portion 430.

[0109] According to an embodiment, the flexible circuit board 400 may include a second cover layer 448. The second cover layer 448 may be disposed between the second adhesive layer 447 and the second shielding layer 449. A portion of the second cover layer 448 may be disposed in the first rigid portion 410. A portion of the second cover layer 448 may be disposed in the second rigid portion 420. A portion of the second cover layer 448 may be disposed in the flexible portion 430.

[0110] According to an embodiment, the flexible circuit board 400 may include a second shielding layer 449. A portion of the second shielding layer 449 may be disposed in the first rigid portion 410. A portion of the second shielding layer 449 may be disposed in the second rigid portion 420. A portion of the second shielding layer 449 may be disposed in the flexible portion 430.

[0111] According to an embodiment, the flexible circuit board 400 may include a first ground layer 471. The first ground layer 471 may be disposed within the first rigid portion 410. The first ground layer 471 may surround at least a portion of the first rigid portion 410. A portion of the first ground layer 471 may be disposed between the first rigid layer 451 and the camera assembly 307. A portion of the first ground layer 471 may cover the end of each of a plurality of layers (e.g., substrate layer 441, first conductive layer 442, first adhesive layer 443, first cover layer 444, first shielding layer 445, second conductive layer 446, second adhesive layer 447, and second cover layer 448). A portion of the first ground layer 471 may be disposed between the first rigid layer 452 and the second shielding layer 449. The cross-section of the first ground layer 471 may be rectangular with an open side.

[0112] According to an embodiment, the flexible circuit board 400 may include a first grounding protrusion 473. The first grounding protrusion 473 may be connected to a first ground layer 471. The first grounding protrusion 473 may protrude from the first ground layer 471 toward a first shielding layer 445. The first grounding protrusion 473 may be disposed between the first shielding layer 445 and a first cover layer 444. The first grounding protrusion 473 provides a grounding structure for the first shielding layer 445.

[0113] According to an embodiment, the flexible circuit board 400 may include first rigid layers 451 and 452. The first rigid layers 451 and 452 may include a rigid material. The first rigid layers 451 and 452 may include a first-first rigid layer 451 and a first-second rigid layer 452. Multiple layers (e.g., a substrate layer 441, a first conductive layer 442, a first adhesive layer 443, a first cover layer 444, a first shielding layer 445, a second conductive layer 446, a second adhesive layer 447, and a second cover layer 448) may be disposed between the first-first rigid layer 451 and the first-second rigid layer 452. The first-first rigid layer 451 may be disposed between a first ground layer 471 and a first shielding layer 445. The first-second rigid layer 452 may be disposed between the first ground layer 471 and the second cover layer 448.

[0114] According to an embodiment, the flexible circuit board 400 may include first rigid bodies 453 and 454. The first rigid bodies 453 and 454 may include a first-first rigid body 453 and a first-second rigid body 454. The first-first rigid body 453 may be disposed between a first ground layer 471 and a first conductive layer 442. The first-first rigid body 453 may be disposed between a substrate layer 441 and a first adhesive layer 443. The first-second rigid body 454 may be disposed between the first ground layer 471 and a second conductive layer 446. The first-second rigid body 454 may be disposed between the substrate layer 441 and a second adhesive layer 447.

[0115] According to an embodiment, the flexible circuit board 400 may include a second ground layer 472. The second ground layer 472 may be disposed within the second rigid portion 420. The second ground layer 472 may surround at least a portion of the second rigid portion 420. A portion of the second ground layer 472 may be disposed between the second rigid layer 461 and the connector 480. A portion of the second ground layer 472 may cover the end of each of a plurality of layers (e.g., substrate layer 441, first conductive layer 442, first adhesive layer 443, first cover layer 444, first shielding layer 445, second conductive layer 446, second adhesive layer 447, and second cover layer 448). A portion of the second ground layer 472 may be disposed between the second rigid layer 462 and the second shielding layer 449. The cross-section of the second ground layer 472 may be rectangular with an open side.

[0116] According to an embodiment, the flexible circuit board 400 may include a second grounding protrusion 474. The second grounding protrusion 474 may be connected to a second grounding layer 472. The second grounding protrusion 474 may protrude from the second grounding layer 472 toward a first shielding layer 445. The second grounding protrusion 474 may be disposed between the first shielding layer 445 and the first cover layer 444. The second grounding protrusion 474 provides a grounding structure for the first shielding layer 445.

[0117] According to an embodiment, the flexible circuit board 400 may include second rigid layers 461 and 462. The second rigid layers 461 and 462 may include a rigid material. The second rigid layers 461 and 462 may include a second-first rigid layer 461 and a second-second rigid layer 462. Multiple layers (e.g., a substrate layer 441, a first conductive layer 442, a first adhesive layer 443, a first cover layer 444, a first shielding layer 445, a second conductive layer 446, a second adhesive layer 447, and a second cover layer 448) may be disposed between the second-first rigid layer 461 and the second-second rigid layer 462. The second-first rigid layer 461 may be disposed between the second ground layer 472 and the first shielding layer 445. The second-second rigid layer 462 may be disposed between the second ground layer 472 and the second cover layer 448.

[0118] According to an embodiment, the flexible circuit board 400 may include second rigid bodies 463 and 464. The second rigid bodies 463 and 464 may include a second-first rigid body 463 and a second-second rigid body 464. The second-first rigid body 463 may be disposed between the second ground layer 472 and the first conductive layer 442. The second-first rigid body 463 may be disposed between the substrate layer 441 and the first adhesive layer 443. The second-second rigid body 464 may be disposed between the second ground layer 472 and the second conductive layer 446. The second-second rigid body 464 may be disposed between the substrate layer 441 and the second adhesive layer 447.

[0119] According to an embodiment, the substrate layer 441 may include a first substrate layer portion 4411, a second substrate layer portion 4412, and a third substrate layer portion 4413. The first substrate layer portion 4411, the second substrate layer portion 4412, and the third substrate layer portion 4413 may be integral. The first substrate layer portion 4411 may be disposed in the first rigid portion 410. The second substrate layer portion 4412 may be disposed in the second rigid portion 420. The third substrate layer portion 4413 may be disposed in the flexible portion 430. The first substrate layer portion 4411 may be disposed between the first-1 conductive portion 4421 and the second-1 conductive portion 4461. The second substrate layer portion 4412 may be disposed between the first-2 conductive portion 4422 and the second-2 conductive portion 4462. The third substrate layer portion 4413 may be disposed between the first-3 conductive portion 4423 and the second-3 conductive portion 4463.

[0120] According to an embodiment, the first conductive layer 442 may include a first-1 conductive portion 4421, a first-2 conductive portion 4422, and a first-3 conductive portion 4423. The first-1 conductive portion 4421, the first-2 conductive portion 4422, and the first-3 conductive portion 4423 may be integral. The first-1 conductive portion 4421 may be disposed in the first rigid portion 410. The first-2 conductive portion 4422 may be disposed in the second rigid portion 420. The first-3 conductive portion 4423 may be disposed in the flexible portion 430. The first-1 conductive portion 4421 may be disposed between the first substrate layer portion 4411 and the first-1 adhesive layer portion 4431. The first-2 conductive portion 4422 may be disposed between the second substrate layer portion 4412 and the first-2 adhesive layer portion 4432. The first-3 conductive portion 4423 may be disposed between the third substrate layer portion 4413 and the first-3 adhesive layer portion 4433.

[0121] According to an embodiment, the first adhesive layer 443 may include a first-1 adhesive layer portion 4431, a first-2 adhesive layer portion 4432, and a first-3 adhesive layer portion 4433. The first-1 adhesive layer portion 4431, the first-2 adhesive layer portion 4432, and the first-3 adhesive layer portion 4433 may be integral. The first-1 adhesive layer portion 4431 may be disposed in the first rigid portion 410. The first-2 adhesive layer portion 4432 may be disposed in the second rigid portion 420. The first-3 adhesive layer portion 4433 may be disposed in the flexible portion 430. The first-1 adhesive layer portion 4431 may be disposed between the first-1 conductive portion 4421 and the first-1 cover layer portion 4441. The first-2 adhesive layer portion 4432 may be disposed between the first-2 conductive portion 4422 and the first-2 cover layer portion 4442. The first-third adhesive layer portion 4433 may be disposed between the first-third conductive portion 4423 and the first-third cover layer portion 4443.

[0122] According to an embodiment, the first cover layer 444 may include a first-1 cover layer portion 4441, a first-2 cover layer portion 4442, and a first-3 cover layer portion 4443. The first-1 cover layer portion 4441, the first-2 cover layer portion 4442, and the first-3 cover layer portion 4443 may be integral. The first-1 cover layer portion 4441 may be disposed in the first rigid portion 410. The first-2 cover layer portion 4442 may be disposed in the second rigid portion 420. The first-3 cover layer portion 4443 may be disposed in the flexible portion 430. The first-1 cover layer portion 4441 may be disposed between the first-1 adhesive layer portion 4431 and the first-1 shielding layer portion 4451. The first-2 cover layer portion 4442 may be disposed between the first-2 adhesive layer portion 4432 and the first-2 shielding layer portion 4452. The first-third cover layer portion 4443 may be disposed between the first-third adhesive layer portion 4433 and the first-third shielding layer portion 4453.

[0123] According to an embodiment, the first shielding layer 445 may include a first-1 shielding layer portion 4451, a first-2 shielding layer portion 4452, and a first-3 shielding layer portion 4453. The first-1 shielding layer portion 4451, the first-2 shielding layer portion 4452, and the first-3 shielding layer portion 4453 may be integral. The first-1 shielding layer portion 4451 may be disposed in the first rigid portion 410. The first-2 shielding layer portion 4452 may be disposed in the second rigid portion 420. The first-3 shielding layer portion 4453 may be disposed in the flexible portion 430. The first-1 shielding layer portion 4451 may be disposed between the first-1 cover layer portion 4441 and the first-1 rigid layer 451. The first-2 shielding layer portion 4452 may be disposed between the first-2 cover layer portion 4442 and the second-1 rigid layer 461. The first-1 shielding layer portion 4451 may include an extension portion 4451a and a bent portion 4451b. The extension portion 4451a may be disposed between the first rigid layer 451 and the first cover layer 444. The bent portion 4451b may be bent from the extension portion 4451a. The bent portion 4451b may surround at least a portion of the first grounding protrusion 473. The bent portion 4451b may be connected to the first grounding layer 471. The first grounding protrusion 473 may be disposed between the bent portion 4451b and the first cover layer 444. The first grounding protrusion 473 may be disposed between the extension portion 4451a and the first grounding layer 471. The first-2 shielding layer portion 4452 may include an extension portion 4452a and a bent portion 4452b. The extension portion 4452a may be disposed between the second rigid layer 461 and the first cover layer 444. The bent portion 4452b may be bent from the extension portion 4452a. The bent portion 4452b may surround at least a portion of the second grounding protrusion 474. The bent portion 4452b may be connected to the second grounding layer 472. The second grounding protrusion 474 may be disposed between the bent portion 4452b and the first cover layer 444. The second grounding protrusion 474 may be disposed between the extension portion 4452a and the second grounding layer 472.

[0124] According to an embodiment, the second conductive layer 446 may include a second-first conductive portion 4461, a second-second conductive portion 4462, and a second-third conductive portion 4463. The second-first conductive portion 4461, the second-second conductive portion 4462, and the second-third conductive portion 4463 may be integral. The second-first conductive portion 4461 may be disposed in the first rigid portion 410. The second-second conductive portion 4462 may be disposed in the second rigid portion 420. The second-third conductive portion 4463 may be disposed in the flexible portion 430. The second-first conductive portion 4461 may be disposed between the first substrate layer portion 4411 and the second-first adhesive layer portion 4471. The second-second conductive portion 4462 may be disposed between the second substrate layer portion 4412 and the second-second adhesive layer portion 4472. The second-third conductive portion 4463 may be disposed between the third substrate layer portion 4413 and the second-third adhesive layer portion 4473.

[0125] According to an embodiment, the second adhesive layer 447 may include a second-first adhesive layer portion 4471, a second-second adhesive layer portion 4472, and a second-third adhesive layer portion 4473. The second-first adhesive layer portion 4471, the second-second adhesive layer portion 4472, and the second-third adhesive layer portion 4473 may be integral. The second-first adhesive layer portion 4471 may be disposed in the first rigid portion 410. The second-second adhesive layer portion 4472 may be disposed in the second rigid portion 420. The second-third adhesive layer portion 4473 may be disposed in the flexible portion 430. The second-first adhesive layer portion 4471 may be disposed between the second-first conductive portion 4461 and the second-first cover layer portion 4481. The second-second adhesive layer portion 4472 may be disposed between the second-second conductive portion 4462 and the second-second cover layer portion 4482. The second-third adhesive layer portion 4473 may be disposed between the second-third conductive portion 4463 and the second-third cover layer portion 4483.

[0126] According to an embodiment, the second cover layer 448 may include a second-1 cover layer portion 4481, a second-2 cover layer portion 4482, and a second-3 cover layer portion 4483. The second-1 cover layer portion 4481, the second-2 cover layer portion 4482, and the second-3 cover layer portion 4483 may be integral. The second-1 cover layer portion 4481 may be disposed in the first rigid portion 410. The second-2 cover layer portion 4482 may be disposed in the second rigid portion 420. The second-3 cover layer portion 4483 may be disposed in the flexible portion 430. The second-1 cover layer portion 4481 may be disposed between the second-1 adhesive layer portion 4471 and the second-1 shielding layer portion 4491. The second-2 cover layer portion 4482 may be disposed between the second-2 adhesive layer portion 4472 and the second-2 shielding layer portion 4492. The second-third cover layer portion 4483 may be disposed between the second-third adhesive layer portion 4473 and the second-third shielding layer portion 4493.

[0127] According to an embodiment, the second shielding layer 449 may include a second-first shielding layer portion 4491, a second-second shielding layer portion 4492, and a second-third shielding layer portion 4493. The second-first shielding layer portion 4491, the second-second shielding layer portion 4492, and the second-third shielding layer portion 4493 may be integral. The second-first shielding layer portion 4491 may be disposed in the first rigid portion 410. The second-second shielding layer portion 4492 may be disposed in the second rigid portion 420. The second-third shielding layer portion 4493 may be disposed in the flexible portion 430. The second shielding layer 449 may include a first connecting portion 4494 and a second connecting portion 4495. The first connecting portion 4494 may connect the second-first shielding layer portion 4491 and the second-third shielding layer portion 4493. The second connecting portion 4495 may connect the second-second shielding layer portion 4492 and the second-third shielding layer portion 4493.

[0128] According to an embodiment, the first grounding layer 471 may include a first side portion 4711, a first device bonding portion 4712, and a first shielding layer bonding portion 4713. The first side portion 4711, the first device bonding portion 4712, and the first shielding layer bonding portion 4713 may be integrally formed. The first side portion 4711 may cover the end of each of a plurality of layers (e.g., a substrate layer 441, a first conductive layer 442, a first adhesive layer 443, a first cover layer 444, a first shielding layer 445, a second conductive layer 446, a second adhesive layer 447, and a second cover layer 448). The first shielding layer 445 may be connected to the first side portion 4711. A first grounding protrusion 473 may protrude from the first side portion 4711 toward the first shielding layer 445. A first rigid body 453 may be disposed between the conductive layer 442 and the first side portion 4711, and a first rigid body 454 may be disposed between the conductive layer 446 and the first side portion 4711. The first device bonding portion 4712 may be disposed between the camera assembly 307 and the first-1 rigid layer 451. The first shielding layer bonding portion 4713 may be disposed between the first-2 rigid layer 452 and the second-1 shielding layer portion 4491.

[0129] According to an embodiment, the second grounding layer 472 may include a second side portion 4721, a second device bonding portion 4722, and a second shielding layer bonding portion 4723. The second side portion 4721, the second device bonding portion 4722, and the second shielding layer bonding portion 4723 may be integrally formed. The second side portion 4721 may cover the end of each of a plurality of layers (e.g., a substrate layer 441, a first conductive layer 442, a first adhesive layer 443, a first cover layer 444, a first shielding layer 445, a second conductive layer 446, a second adhesive layer 447, and a second cover layer 448). The first shielding layer 445 may be connected to the second side portion 4721. A second grounding protrusion 474 may protrude from the second side portion 4721 toward the first shielding layer 445. A second rigid body 463 may be disposed between the conductive layer 442 and the second side portion 4721, and the second rigid body 464 may be disposed between the conductive layer 446 and the second side portion 4721. The second device bonding portion 4722 may be disposed between the connector 480 and the second-1 rigid layer 461. The second shielding layer bonding portion 4723 may be disposed between the second-2 rigid layer 462 and the second-2 shielding layer portion 4492.

[0130] According to an embodiment, the flexible circuit board 400 may include a first conductive via 491 and a second conductive via 492. The first conductive via 491 may be disposed in a first rigid portion 410. The first conductive via 491 may be disposed in the boundary portion between the first rigid portion 410 and the flexible portion 430. The second conductive via 492 may be disposed in a second rigid portion 420. The second conductive via 492 may be disposed in the boundary portion between the second rigid portion 420 and the flexible portion 430. The first conductive via 491 may extend through multiple layers (e.g., substrate layer 441, first conductive layer 442, first adhesive layer 443, first cover layer 444, first shielding layer 445, second conductive layer 446, second adhesive layer 447, second cover layer 448, first rigid layers 451 and 452, and first ground layer 471). The first conductive via 491 may extend between a first device bonding portion 4712 and a first shielding layer bonding portion 4713. A first conductive via 491 can pass through the first ground layer 471 and connect to the camera assembly 307. The first conductive via 491 can pass through the first ground layer 471 and connect to the second shielding layer 449. A second conductive via 492 can extend through multiple layers (e.g., substrate layer 441, first conductive layer 442, first adhesive layer 443, first cover layer 444, first shielding layer 445, second conductive layer 446, second adhesive layer 447, second cover layer 448, second rigid layers 461 and 462, and second ground layer 472). The second conductive via 492 can extend between the second device bonding portion 4722 and the second shielding layer bonding portion 4723. The second conductive via 492 can pass through the second ground layer 472 and connect to the second shielding layer 449.

[0131] Figure 10 This is a conceptual view illustrating the structure of the flexible circuit board 400. (Refer to...) Figure 10 Some or all of the components described may be related to the reference. Figures 1 to 9 The components described are the same. (See reference...) Figure 10 Some or all of the components described may be related to the reference. Figures 11 to 13c The components described are the same.

[0132] According to an embodiment, the flexible portion 430 may be connected to the first rigid portion 410 and the second rigid portion 420.

[0133] According to an embodiment, a first ground layer 471 may surround at least a portion of the first rigid portion 410. A second ground layer 472 may surround at least a portion of the second rigid portion 420.

[0134] Figure 11 This is a cross-sectional view showing the state in which the flexible circuit board 400 according to an embodiment of the present disclosure is connected to the camera assembly 307 and the connector 480. (Refer to...) Figure 11Some or all of the components described may be related to the reference. Figures 1 to 10 The components described are the same. (See reference...) Figure 11 Some or all of the components described may be related to the reference. Figures 12 to 13c The components described are the same.

[0135] According to an embodiment, the flexible circuit board 400 may include a substrate layer 441, a first conductive layer 442, a first adhesive layer 443, a first cover layer 444, a first shielding layer 445, a second conductive layer 446, a second adhesive layer 447, a second cover layer 448, first rigid layers 451 and 452, second rigid layers 461 and 462, a first ground layer 471, a second ground layer 472, a first conductive via 491, and a second conductive via 492. (See also...) Figure 8 and Figure 9 The descriptions provided can also be applied to the descriptions of the aforementioned components (e.g., substrate layer 441, first conductive layer 442, first adhesive layer 443, first cover layer 444, first shielding layer 445, second conductive layer 446, second adhesive layer 447, second cover layer 448, first rigid layers 451 and 452, second rigid layers 461 and 462, first ground layer 471, second ground layer 472, first conductive via 491 and second conductive via 492).

[0136] According to an embodiment, the flexible circuit board 400 may include a second shielding layer 549. A portion of the second shielding layer 549 may be disposed in the first rigid portion 410. A portion of the second shielding layer 549 may be disposed in the second rigid portion 420. A portion of the second shielding layer 549 may be disposed in the flexible portion 430.

[0137] According to an embodiment, the second shielding layer 549 may include a first shielding layer portion 5491, a second shielding layer portion 5492, and a third shielding layer portion 5493. The first shielding layer portion 5491 may be disposed between the second cover layer 448 and the first-second rigid layer 452. The second shielding layer portion 5492 may be disposed between the second cover layer 448 and the second-second rigid layer 462.

[0138] According to an embodiment, the second shielding layer 549 may include a first shielding layer bent portion 5494 and a second shielding layer bent portion 5495. The first shielding layer bent portion 5494 may be bent from the first shielding layer portion 5491. The first shielding layer bent portion 5494 may be connected to the first ground layer 471. The second shielding layer bent portion 5495 may be bent from the second shielding layer portion 5492. The second shielding layer bent portion 5495 may be connected to the second ground layer 472.

[0139] According to an embodiment, the flexible circuit board 400 may include a third grounding protrusion 575 and a fourth grounding protrusion 576. The third grounding protrusion 575 may be disposed between the first ground layer 471 and the first shielding layer portion 5491. The third grounding protrusion 575 may be disposed between the second cover layer 448 and the bent portion 5494 of the first shielding layer. The fourth grounding protrusion 576 may be disposed between the second ground layer 472 and the second shielding layer portion 5492. The fourth grounding protrusion 576 may be disposed between the second cover layer 448 and the bent portion 5495 of the second shielding layer.

[0140] Figure 12 This is a cross-sectional view showing a flexible circuit board 400 according to an embodiment of the present disclosure. (Refer to...) Figure 12 Some or all of the components described may be related to the reference. Figures 1 to 11 The components described are the same. (See reference...) Figure 12 Some or all of the components described may be related to the reference. Figures 13a to 13c The components described are the same.

[0141] According to an embodiment, the flexible circuit board 400 may include a substrate layer 441, a first conductive layer 442, a first adhesive layer 443, a first cover layer 444, a second conductive layer 446, a second adhesive layer 447, a second cover layer 448, first rigid layers 451 and 452, second rigid layers 461 and 462, a first ground layer 471, and a second ground layer 472. (Refer to...) Figure 8 and Figure 9 The descriptions provided can also be applied to the descriptions of the aforementioned components (e.g., substrate layer 441, first conductive layer 442, first adhesive layer 443, first cover layer 444, second conductive layer 446, second adhesive layer 447, second cover layer 448, first rigid layers 451 and 452, second rigid layers 461 and 462, first ground layer 471 and second ground layer 472).

[0142] According to an embodiment, the flexible circuit board 400 may include a first shielding layer 645. The first shielding layer 645 may include a first-1 shielding layer portion 6451 disposed in the first rigid portion 410. The first shielding layer 645 may include a first-2 shielding layer portion 6452 disposed in the second rigid portion 420. The first shielding layer 645 may include a first-3 shielding layer portion 6453 disposed in the flexible portion 430. The first-1 shielding layer portion 6451 may be connected to a first ground layer 471. The first-1 shielding layer portion 6451 may be disposed between the first rigid layer 451 and the first cover layer 444. The first-2 shielding layer portion 6452 may be connected to a second ground layer 472. The first-2 shielding layer portion 6452 may be disposed between the second rigid layer 461 and the first cover layer 444.

[0143] According to an embodiment, the flexible circuit board 400 may include a second shielding layer 649. The second shielding layer 649 may include a second-first shielding layer portion 6491 disposed in the first rigid portion 410. The second shielding layer 649 may include a second-second shielding layer portion 6492 disposed in the second rigid portion 420. The second shielding layer 649 may include a second-third shielding layer portion 6493 disposed in the flexible portion 430. The second-first shielding layer portion 6491 may be connected to a first ground layer 471. The second-first shielding layer portion 6491 may be disposed between the first rigid layer 452 and the second cover layer 448. The second-second shielding layer portion 6492 may be connected to the second ground layer 472. The second-second shielding layer portion 6492 may be disposed between the second rigid layer 462 and the second cover layer 448.

[0144] According to an embodiment, the flexible circuit board 400 may include first reinforcing layers 671 and 672. The first reinforcing layers 671 and 672 may be disposed between the first rigid layers 451 and 452 and the first ground layer 471. The first reinforcing layers 671 and 672 may include a first-first reinforcing layer 671 disposed between the first-first rigid layer 451 and the first ground layer 471. The first reinforcing layers 671 and 672 may include a first-second reinforcing layer 672 disposed between the first-second rigid layer 452 and the first ground layer 471.

[0145] According to an embodiment, the flexible circuit board 400 may include second reinforcing layers 673 and 674. The second reinforcing layers 673 and 674 may be disposed between the second rigid layers 461 and 462 and the second ground layer 472. The second reinforcing layers 673 and 674 may include a second-first reinforcing layer 673 disposed between the second-first rigid layer 461 and the second ground layer 472. The second reinforcing layers 673 and 674 may include a second-second reinforcing layer 674 disposed between the second-second rigid layer 462 and the second ground layer 472.

[0146] Figure 13a , Figure 13b and Figure 13c This is a view illustrating a method for manufacturing a flexible circuit board 400 according to an embodiment of the present disclosure. (Refer to...) Figures 13a to 13c Some or all of the components described may be related to the reference. Figures 1 to 12 The components described are the same.

[0147] According to an embodiment, a method for manufacturing a flexible circuit board 400 may include a first process S100, a second process S200, and a third process S300. For example... Figure 13a As shown, the first process S100 can be the operation of setting the substrate layer 441 and the conductive layers 442 and 446. Figure 13b As shown, the second process S200 can be an operation that stacks multiple layers. For example... Figure 13c As shown, the third process S300 can be used to complete the operation of the flexible circuit board 400.

[0148] Reference Figure 13a A first conductive layer 442 and a second conductive layer 446 may be bonded to a substrate layer 441. The first conductive layer 442 may be bonded to a first surface of the substrate layer 441, and the second conductive layer 446 may be bonded to a second surface of the substrate layer 441 opposite to the first surface. The first conductive layer 442 may include a plurality of holes 4424 and 4425 and a plurality of portions 4421, 4422 and 4423 spaced apart from each other relative to the plurality of holes 4424 and 4425.

[0149] Reference Figure 13b Other layers (e.g., first adhesive layer 443, first cover layer 444, first shielding layer 445, second adhesive layer 447, second cover layer 448, first rigid layers 451 and 452, second rigid layers 461 and 462, first ground layers 4712 and 4713, second ground layers 4722 and 4723, and grounding protrusions 473, 575, 474, and 576) may be stacked on top of each other. Figure 13a On components 441, 442, and 446. The first shielding layer 445 may include multiple through holes 445a.

[0150] Reference Figure 13c In such Figure 13b After assembly as shown, the second shielding layer 449, the first grounding layer 471, the second grounding layer 472, the conductive vias 491, 492 and 493, and the reinforcements 456, 457, 466 and 467 can be assembled.

[0151] The electronic device includes a housing, a circuit board disposed within the housing, a camera assembly connected to the circuit board, and an antenna. The electronic device includes a flexible circuit board connecting the camera assembly and the circuit board. The camera assembly and the antenna are spaced apart from each other, and radio wave interference may occur between components of the camera assembly and the antenna. The flexible circuit board may include a shielding layer for reducing radio wave interference. Due to the structure of the shielding layer, steps may form at the points where the flexible circuit board connects to the camera assembly or connector. Due to the structure of the shielding layer, the shielding layer may not be properly grounded.

[0152] The purpose of this disclosure is to reduce radio wave interference between the antenna and the camera assembly.

[0153] The purpose of this disclosure is to facilitate the grounding of flexible circuit boards.

[0154] The purpose of this disclosure is not limited to the purposes mentioned, and may be determined differently without departing from the spirit and scope of this disclosure.

[0155] Electronic devices according to various embodiments of the present disclosure can reduce radio wave interference between an antenna and a camera assembly by providing a shielding layer on a flexible circuit board.

[0156] Electronic devices according to various embodiments of this disclosure can make it easier to ground flexible circuit boards by connecting a shielding layer and a grounding layer.

[0157] The effects that can be obtained from this disclosure are not limited to those described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

[0158] Electronic devices according to embodiments of the present disclosure (e.g., Figures 1 to 13c 101) may include a housing (e.g., Figures 1 to 13c (301).

[0159] Electronic devices according to embodiments of the present disclosure (e.g., Figures 1 to 13c 101) may include a housing (e.g., Figures 1 to 13c The circuit board in 301) (e.g., Figures 1 to 13c (of 340).

[0160] Electronic devices according to embodiments of the present disclosure (e.g., Figures 1 to 13c 101) may include circuit boards (e.g., Figures 1 to 13c 340) spaced-apart camera assemblies (e.g., Figures 1 to 13c (307).

[0161] Electronic devices according to embodiments of the present disclosure (e.g., Figures 1 to 13c 101) may include flexible circuit boards (e.g., Figures 1 to 13c (400), wherein the flexible circuit board includes connections to the camera assembly (e.g., Figures 1 to 13c The first rigid part of 307) (e.g., Figures 1 to 13c 410), connected to the circuit board (e.g., Figures 1 to 13c The second rigid part of (e.g., 340) Figures 1 to 13c 420), and connecting the first rigid part (e.g., Figures 1 to 13c 410) and the second rigid part (e.g., Figures 1 to 13c The flexible portion of (e.g., 420) Figures 1 to 13c (430).

[0162] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a matrix layer (e.g., Figures 1 to 13c (441).

[0163] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include bonding to the matrix layer (e.g., Figures 1 to 13c The first conductive layer of 441) (e.g., Figures 1 to 13c (442).

[0164] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a first shielding layer (e.g., Figures 1 to 13c 445), wherein the first shielding layer (e.g., Figures 1 to 13c 445) includes the portion located in the first rigid part (e.g., Figures 1 to 13c The first-1 shielding layer portion of (410) (e.g., Figures 1 to 13c 4451), located in the second rigid part (e.g., Figures 1 to 13c The first and second shielding layers in (e.g., 420) Figures 1 to 13c 4452) and located in the flexible part (e.g., Figures 1 to 13c The first to third shielding layers in (e.g., 430) Figures 1 to 13c (4453), and with the first conductive layer (e.g., Figures 1 to 13c (442) are separated.

[0165] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a first ground plane (e.g., Figures 1 to 13c 471), wherein the first grounding layer (e.g., Figures 1 to 13c 471) at least partially along the first rigid portion (e.g., Figures 1 to 13c The circumference of 410 extends around and connects to the first shielding layer (e.g., Figures 1 to 13c (445).

[0166] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a first grounding protrusion (e.g., Figures 1 to 13c 473), wherein the first grounding protrusion (e.g., Figures 1 to 13c 473) from the first ground plane (e.g., Figures 1 to 13c 471) is highlighted and is set in the first ground plane (e.g., Figures 1 to 13c 471) and the first shielding layer (e.g., Figures 1 to 13c Between 445).

[0167] According to embodiments of this disclosure, the first shielding layer (e.g., Figures 1 to 13c 445) may include an extension (e.g., Figures 1 to 13c(4451a), wherein the extension portion (e.g., Figures 1 to 13c 4451a) and the first ground layer (e.g., Figures 1 to 13c (471) are separated.

[0168] According to embodiments of this disclosure, the first shielding layer (e.g., Figures 1 to 13c 445) may include a curved portion (e.g., Figures 1 to 13c (4451b), wherein the curved portion (e.g., Figures 1 to 13c 4451b) Connecting extension portion (e.g., Figures 1 to 13c 4451a) and the first ground plane (e.g., Figures 1 to 13c 471) and surrounds the first grounding protrusion (e.g., Figures 1 to 13c At least a portion of (473).

[0169] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a second ground plane (e.g., Figures 1 to 13c 472), wherein the second grounding layer (e.g., Figures 1 to 13c 472) at least partially along the second rigid portion (e.g., Figures 1 to 13c Extending around and connecting to the first shielding layer (e.g., 420) Figures 1 to 13c (445).

[0170] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a second grounding protrusion (e.g., Figures 1 to 13c 474), wherein the second grounding protrusion (e.g., Figures 1 to 13c 474) from the second grounding layer (e.g., Figures 1 to 13c 472) is highlighted and is set in the second ground layer (e.g., Figures 1 to 13c 472) and the first shielding layer (e.g., Figures 1 to 13c Between 445).

[0171] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a second conductive layer (e.g., Figures 1 to 13c 446), wherein the second conductive layer (e.g., Figures 1 to 13c 446) is set relative to the substrate layer (e.g., Figures 1 to 13c 441) and the first conductive layer (e.g., Figures 1 to 13c At the relative position of 442).

[0172] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a second shielding layer (e.g., Figures 1 to 13c449), wherein the second shielding layer (e.g., Figures 1 to 13c 449) and the second conductive layer (e.g., Figures 1 to 13c The 446) are spaced apart and bonded to the first ground layer (e.g., Figures 1 to 13c (471).

[0173] The second shielding layer according to embodiments of this disclosure (e.g., Figures 1 to 13c 449) may include the portion located in the first rigid part (e.g., Figures 1 to 13c The second-1 shielding layer portion of (410) (e.g., Figures 1 to 13c (4491).

[0174] The second shielding layer according to embodiments of this disclosure (e.g., Figures 1 to 13c 449) may include the second rigid portion (e.g., Figures 1 to 13c The second-2 shielding layer in (e.g., 420) Figures 1 to 13c (4492).

[0175] The second shielding layer according to embodiments of this disclosure (e.g., Figures 1 to 13c 449) may include the flexible portion (e.g., Figures 1 to 13c The second-third shielding layer portion (e.g., of 430) Figures 1 to 13c (4493).

[0176] The second shielding layer according to embodiments of this disclosure (e.g., Figures 1 to 13c 449) may include the connection of the second-first shielding layer portion (e.g., Figures 1 to 13c (4491) and the second-third shielding layer (e.g., Figures 1 to 13c The first connecting part of (e.g., 4493) Figures 1 to 13c (4494).

[0177] The second shielding layer according to embodiments of this disclosure (e.g., Figures 1 to 13c 449) may include the connection of the second-2nd shielding layer portion (e.g., Figures 1 to 13c (4492) and the second-third shielding layer (e.g., Figures 1 to 13c The second connecting part of (e.g., 4493) Figures 1 to 13c (4495).

[0178] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a first rigid layer (e.g., Figures 1 to 13c 451), wherein the first rigid layer (e.g., Figures 1 to 13c 451) is set in the first ground plane (e.g., Figures 1 to 13c 471) and the first shielding layer (e.g., Figures 1 to 13cBetween 471).

[0179] According to embodiments of the present disclosure, the first ground layer (e.g., Figures 1 to 13c 471) may include a first side portion (e.g., Figures 1 to 13c 4711), wherein the first side portion (e.g., Figures 1 to 13c 4711) covering the matrix layer (e.g., Figures 1 to 13c 441), the first conductive layer (e.g., Figures 1 to 13c 442) and the first shielding layer (e.g., Figures 1 to 13c The end of each of the 445).

[0180] The electronic device according to embodiments of this disclosure may further include a first device coupling portion (e.g., Figures 1 to 13c (4712), the first device connecting part (e.g., Figures 1 to 13c 4712) from the first side portion (e.g., Figures 1 to 13c (4711) extends and is disposed in the first rigid layer (e.g., Figures 1 to 13c 451) and camera assembly (e.g., Figures 1 to 13c Between 307).

[0181] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a connection to the first ground plane (e.g., Figures 1 to 13c The first conductive via (e.g., 471) Figures 1 to 13c (491).

[0182] According to embodiments of the present disclosure, a first conductive via (e.g., Figures 1 to 13c 491) can penetrate the matrix layer (e.g., Figures 1 to 13c 441), the first conductive layer (e.g., Figures 1 to 13c 442) and the first shielding layer (e.g., Figures 1 to 13c (445).

[0183] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a first adhesive layer (e.g., Figures 1 to 13c 443), wherein the first adhesive layer (e.g., Figures 1 to 13c 443) is disposed in the first conductive layer (e.g., Figures 1 to 13c 442) and the first shielding layer (e.g., Figures 1 to 13c Between 445).

[0184] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a first overlay (e.g., Figures 1 to 13c 444), wherein the first overlay (e.g., Figures 1 to 13c 444) is set in the first adhesive layer (e.g., Figures 1 to 13c 443) and the first shielding layer (e.g., Figures 1 to 13c Between 445).

[0185] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a first rigid body (e.g., Figures 1 to 13c 453), where the first rigid body (e.g., Figures 1 to 13c 453) is disposed in the first conductive layer (e.g., Figures 1 to 13c 442) and the first ground plane (e.g., Figures 1 to 13c Between 471).

[0186] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a second conductive layer (e.g., Figures 1 to 13c 446), wherein the second conductive layer (e.g., Figures 1 to 13c 446) is set relative to the substrate layer (e.g., Figures 1 to 13c 441) and the first conductive layer (e.g., Figures 1 to 13c At the relative position of 442).

[0187] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a second conductive layer (e.g., Figures 1 to 13c The second shielding layer (e.g., 446) spaced apart Figures 1 to 13c (of 549).

[0188] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a third grounding protrusion (e.g., Figures 1 to 13c 575), of which the third grounding protrusion (e.g., Figures 1 to 13c 575) from the first ground plane (e.g., Figures 1 to 13c 471) is highlighted and is at least partially shielded by a second shielding layer (e.g., Figures 1 to 13c 549) surrounds.

[0189] According to the first-1 shielding layer portion of the embodiments of this disclosure (e.g., Figures 1 to 13c 6451), the first-second shielding layer (e.g., Figures 1 to 13c (6452) and the first to third shielding layers (e.g., Figures 1 to 13c (6453) can be arranged side by side.

[0190] Flexible circuit boards according to embodiments of the present disclosure (e.g., Figures 1 to 13c The 400) may include a matrix layer (e.g., Figures 1 to 13c 441), wherein the matrix layer (e.g., Figures 1 to 13c 441) extends to correspond to the first rigid portion (e.g., Figures 1 to 13c 410), and the first rigid part (e.g., Figures 1 to 13c The second rigid portion (e.g., 410) spaced apart Figures 1 to 13c 420) and connecting the first rigid part (e.g., Figures 1 to 13c 410) and the second rigid part (e.g., Figures 1 to 13c The flexible portion of (e.g., 420) Figures 1 to 13c Each of the 430).

[0191] While this disclosure has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and detail may be made to this disclosure without departing from the spirit and scope of this disclosure as defined by the appended claims.

Claims

1. An electronic device (101), comprising: Casing (301); A circuit board (340) is disposed in a housing (301); A camera assembly (307) includes a camera and is spaced apart from a circuit board (340); as well as The flexible circuit board (400) includes a first rigid portion (410) connected to a camera assembly (307), a second rigid portion (420) connected to a circuit board (340), and a flexible portion (430) connecting the first rigid portion (410) and the second rigid portion (420). The flexible circuit board (400) includes: Matrix layer (441); The first conductive layer (442) is bonded to the substrate layer (441); The first shielding layer (445) includes a first-1 shielding layer portion (4451) located in the first rigid portion (410), a first-2 shielding layer portion (4452) located in the second rigid portion (420), and a first-3 shielding layer portion (4453) located in the flexible portion (430), and is spaced apart from the first conductive layer (442); and A first grounding layer (471) is provided, wherein at least a portion of the first grounding layer (471) extends around the first rigid portion (410), and the first grounding layer (471) is connected to the first shielding layer (445).

2. The electronic device as claimed in claim 1, wherein, Flexible circuit board (400) includes: A first grounding protrusion (473) protrudes from the first grounding layer (471) and is disposed between the first grounding layer (471) and the first shielding layer (445).

3. The electronic device as claimed in claim 2, wherein, The first shielding layer (445) includes: The extension portion (4451a) is spaced apart from the first ground layer (471); and The curved portion (4451b) connects the extension portion (4451a) and the first ground layer (471) and is disposed around at least a portion of the first ground protrusion (473).

4. The electronic device as claimed in any one of claims 1 to 3, wherein, The flexible circuit board (400) also includes: The second grounding layer (472) extends around the second rigid portion (420) and is connected to the first shielding layer (445).

5. The electronic device as claimed in claim 4, wherein, Flexible circuit board (400) includes: The second grounding protrusion (474) protrudes from the second grounding layer (472) and is disposed between the second grounding layer (472) and the first shielding layer (445).

6. The electronic device as claimed in any one of claims 1 to 5, wherein, The flexible circuit board (400) also includes: The second conductive layer (446) is disposed opposite to the first conductive layer (442) relative to the substrate layer (441); and The second shielding layer (449) is spaced apart from the second conductive layer (446) and is bonded to the first ground layer (471).

7. The electronic device as claimed in claim 6, wherein, The second shielding layer (449) includes: The second-first shielding layer portion (4491) is located in the first rigid portion (410); The second-second shielding layer (4492) is located in the second rigid part (420); The second and third shielding layers (4493) are located in the flexible portion (430); The first connecting portion (4494) connects the second-1 shielding layer portion (4491) and the second-3 shielding layer portion (4493); and The second connecting part (4495) connects the second-2 shielding layer part (4492) and the second-3 shielding layer part (4493).

8. The electronic device as claimed in any one of claims 1 to 7, wherein, The flexible circuit board (400) also includes: A first rigid layer (451) is disposed between a first grounding layer (471) and a first shielding layer (445).

9. The electronic device as claimed in claim 8, wherein, The first grounding layer (471) includes: The first side portion (4711) covers the edge of each of the substrate layer (441), the first conductive layer (442), and the first shielding layer (445); and The first device assembly portion (4712) extends from the first side portion (4711) and is disposed between the first rigid layer (451) and the camera assembly (307).

10. The electronic device according to any one of claims 1 to 9, wherein, The flexible circuit board (400) also includes: The first conductive via (491) is connected to the first ground layer (471).

11. The electronic device of claim 10, wherein, The first conductive via (491) penetrates the substrate layer (441), the first conductive layer (442), and the first shielding layer (445).

12. The electronic device as claimed in any one of claims 1 to 11, wherein, Flexible circuit board (400) includes: A first adhesive layer (443) is disposed between the first conductive layer (442) and the first shielding layer (445); and A first cover layer (444) is disposed between a first adhesive layer (443) and a first shielding layer (445).

13. The electronic device as claimed in any one of claims 1 to 12, wherein, The flexible circuit board (400) also includes: A first rigid body (453) is disposed between a first conductive layer (442) and a first ground layer (471).

14. The electronic device as claimed in any one of claims 1 to 13, wherein, The flexible circuit board (400) also includes: The second conductive layer (446) is disposed opposite to the first conductive layer (442) relative to the substrate layer (441); The second shielding layer (549) is spaced apart from the second conductive layer (446); and A third grounding protrusion (575) protrudes from the first grounding layer (471), wherein at least a portion of the third grounding protrusion (575) is surrounded by a second shielding layer (549).

15. The electronic device as claimed in any one of claims 1 to 14, wherein, The first shielding layer portion (6451), the first shielding layer portion (6452), and the first shielding layer portion (6453) are arranged in a direction parallel to each other.

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