Endoscope host equipment

Abstract

The embodiment of the invention provides endoscope host equipment and a radiator thereof. The endoscope host equipment comprises a shell, a light source module and a first heat dissipation module, the light source module and the first heat dissipation module are arranged in the shell, the first heat dissipation module is configured to dissipate heat of the light source module, the light source module comprises a side face light source set and an end face light source, and a first air path and a second air path are formed in the shell. The first heat dissipation module comprises a first heat dissipation unit and a second heat dissipation unit; the first air path is used for dissipating heat of the first heat dissipation unit, and the second air path is used for dissipating heat of the second heat dissipation unit.

Description

Cross-references

[0001] This application claims priority to Chinese application No. 202411364581.7, filed on September 27, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This manual relates to the field of medical devices, and in particular to an endoscope main unit device. Background Technology

[0003] In the medical field, especially during endoscopic examinations and surgeries, endoscopes typically employ high-energy light sources to meet the brightness requirements of different applications. While these sources provide sufficient illumination, they also generate significant amounts of heat. High temperatures can cause irreversible thermal deformation of some components and may affect the normal operation of internal electronic components, potentially leading to decreased instrument performance or damage. Despite heat dissipation measures for the light-emitting elements, drawbacks such as poor heat dissipation and inefficient equipment size design persist.

[0004] Therefore, it is necessary to provide a technical solution that can find a balance between device compactness and efficient heat dissipation. Summary of the Invention

[0005] This specification provides one or more embodiments of an endoscope host device, including a housing and a light source module and a first heat dissipation module disposed within the housing. The first heat dissipation module is configured to dissipate heat from the light source module. The light source module includes a side light source group and an end face light source. A first air path and a second air path are formed within the housing. The first heat dissipation module includes a first heat dissipation unit and a second heat dissipation unit. The first heat dissipation unit includes a first radiator and a first fan. The first radiator is configured to dissipate heat from the side light source group. The first fan is disposed adjacent to the rear plate of the housing and configured to generate the first air path passing through the first radiator. The rear end face of the first radiator is disposed adjacent to the first fan. The second heat dissipation unit includes a second radiator. The second radiator is configured to dissipate heat from the end face light source. The second air path passes through the second radiator and is offset from the first radiator.

[0006] In some embodiments, the first heat sink is disposed adjacent to the side light source group, and the length of the first heat sink is greater than the length of the second heat sink in the front-rear direction of the housing.

[0007] In some embodiments, the first radiator and the second radiator are staggered in at least one direction of the housing, and the first air passage and the second air passage are isolated from each other.

[0008] In some embodiments, the first heat dissipation unit includes a first air guide shroud, which covers at least the front end face and the rear end face of the first heat sink; the first air path includes a first vent and a second vent on the housing, the first vent being located on the rear plate of the housing and the second vent being located on the bottom plate of the housing; the first air guide shroud includes a deflecting air duct, which is located between the first heat sink and the second vent, and is used to change the airflow direction between the second vent and the first heat sink.

[0009] In some embodiments, the second heat dissipation unit is disposed between the end face light source and the rear plate of the housing, and in the left-right direction of the housing, the width of the first heat sink is greater than the width of the second heat sink.

[0010] In some embodiments, one side of the first heat sink is adjacent to the light source module, and the other side extends along the left-right direction of the housing and occupies the remaining width within the housing.

[0011] In some embodiments, the second air duct includes a third vent and a fifth vent on the housing, the third vent being located on the bottom plate or side of the housing, and the fifth vent being located on the rear plate of the housing.

[0012] In some embodiments, the first heat dissipation unit includes at least one heat-conducting plate and at least one heat-conducting pipe, the heat-conducting plate being disposed between the first heat sink and the side light source group, and the heat-conducting pipe being configured to transfer heat from the side light source group to the first heat sink.

[0013] In some embodiments, there are multiple heat-conducting plates, each heat-conducting plate is arranged corresponding to the light source of the side light source group, there are multiple heat-conducting pipes, one end of each heat-conducting pipe is connected to the heat-conducting plate, and the other end of each heat-conducting pipe is embedded in the first heat sink.

[0014] In some embodiments, the heat pipe extends backward from the heat-conducting plate into the first heat sink, and an installation cavity is formed in front of the heat pipe and in front of the first heat sink, the installation cavity being used to assemble other modules.

[0015] In some embodiments, the heat-conducting plate is a single plate, the heat-conducting plate includes a positioning part, the first heat sink includes a mating part, the positioning part and the mating part form a limiting fit, so that the heat-conducting plate and the first heat sink are docked at a preset relative position; and the area of ​​the heat exchange surface of the heat-conducting plate is greater than or equal to the area of ​​the heating area of ​​the side light source group, and the heat-conducting pipe is disposed on at least one side of the heat-conducting plate and extends along the side of the heat-conducting plate.

[0016] In some embodiments, the endoscope host device further includes a light guide module and a second heat dissipation module, the second heat dissipation module being configured to dissipate heat from the light guide module; the second heat dissipation module includes a third air guide shroud and a third fan, the third fan being configured to form a third air path within the third air guide shroud, the third air guide shroud being constructed through a channel structure, or the third air guide shroud being constructed through at least two guide vanes.

[0017] In some embodiments, the endoscope host device further includes a control module and a third heat dissipation module, the third heat dissipation module being configured to dissipate heat from the control module; and / or, the endoscope host device further includes at least one sensor, a temperature controller, and a second heat dissipation module, the sensor being used to collect the temperature of the light source module and / or the light guide module of the endoscope host device, the temperature controller being configured to control the operating power of the first heat dissipation module and the second heat dissipation module based on the temperature collected by the sensor.

[0018] This specification provides one or more embodiments of an endoscope host device, including a housing and a light source module and a first heat dissipation module disposed within the housing. The first heat dissipation module includes a first heat dissipation unit, which includes a first radiator and a first fan. The first radiator is configured to dissipate heat from the side light source group of the light source module. The first fan is disposed adjacent to the rear plate of the housing and is configured to generate a first airflow path passing through the first radiator. The rear end face of the first radiator is disposed adjacent to the first fan. One side of the first radiator is adjacent to the light source module, and the other side extends along the left-right direction of the housing and occupies the remaining width within the housing.

[0019] In some embodiments, the first heat dissipation unit includes a first air guide shroud, which covers at least the front end face and the rear end face of the first heat sink.

[0020] In some embodiments, the first air duct includes a first vent and a second vent disposed on the housing, the first vent being disposed on the rear plate of the housing and the second vent being disposed on the bottom plate of the housing;

[0021] The first air guide shroud includes a deflecting air duct located between the first radiator and the first vent, which is used to change the airflow direction between the first vent and the first radiator.

[0022] In some embodiments, the first heat dissipation module further includes a second heat dissipation unit, and the light source module further includes an end face light source. The second heat dissipation unit is disposed between the end face light source and the rear plate of the housing and is configured to dissipate heat from the end face light source.

[0023] According to the solutions in some of the above embodiments, the rear end face of the first heat sink is positioned adjacent to the first fan, reducing wasted space between the first heat sink and the first fan, and the airflow from the first fan directly acts on the first heat sink, reducing energy loss and improving heat dissipation efficiency. The second airflow path is staggered from the first heat sink to avoid cross-influence of heat from the first and second heat sinks, thus improving heat dissipation efficiency. Attached Figure Description

[0024] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0025] Figure 1 This is a schematic diagram of the appearance of the endoscope main unit device according to some embodiments of this specification;

[0026] Figure 2 This is an internal schematic diagram of an endoscope host device according to some embodiments of this specification;

[0027] Figure 3 This is an internal schematic diagram of the endoscope host device shown in some embodiments according to this specification from another perspective;

[0028] Figure 4 This is a block diagram of the internal structure of the endoscope main unit device shown in some embodiments of this specification, cut along the vertical direction;

[0029] Figure 5 This is a schematic diagram of the structure of a first heat sink according to some embodiments of this specification;

[0030] Figure 6 This is a schematic diagram of the cooperation between the first heat sink and the first air guide shroud according to some embodiments of this specification;

[0031] Figure 7 This is a top view of the internal structure of the endoscope main unit device shown in some embodiments of this specification;

[0032] Figure 8 It is based on Figure 7 A cross-sectional view of the endoscope host device shown in some embodiments, taken along line AA;

[0033] Figure 9 This is a top view of the internal structure of the endoscope main unit device shown in some embodiments of this specification;

[0034] Figure 10 It is based on Figure 9 A partial enlarged view of the endoscope host device shown in some embodiments at the second heat dissipation unit;

[0035] Figure 11 This is an exploded view of the internal structure of the endoscope main unit device shown in some embodiments of this specification;

[0036] Figure 12 This is a structural block diagram of an endoscope main unit device according to some embodiments of this specification;

[0037] Figure 13 This is an internal schematic diagram of an endoscope host device according to some embodiments of this specification;

[0038] Figure 14 This is a top view of a portion of the structure of the endoscope main unit device as shown in some embodiments of this specification;

[0039] Figure 15 These are isometric views of some structural components of the endoscope main unit according to some embodiments shown in this specification;

[0040] Figure 16 This is a schematic diagram of the first side of the heat-conducting plate according to some embodiments of this specification;

[0041] Figure 17 This is a schematic diagram of the second side of the heat-conducting plate according to some embodiments of this specification;

[0042] Figure 18 This is a schematic diagram of the structure of a first heat sink according to some embodiments of this specification;

[0043] Figure 19 This is an isometric view of the top view of the endoscope host device shown in some embodiments of this specification;

[0044] Figure 20 This is an isometric view of the bottom of the endoscope main unit device shown in some embodiments of this specification;

[0045] Figure 21 This is a schematic diagram of the structure of the second heat dissipation unit according to some embodiments of this specification;

[0046] Figure 22A This is a schematic diagram of some components of an endoscope host device according to some embodiments of this specification;

[0047] Figure 22B It is based on Figure 22A A magnified view of a portion of component A of the endoscope main unit shown;

[0048] Figure 23A This is a schematic diagram of the structure of a third heat sink according to some embodiments of this specification;

[0049] Figure 23B It is based on Figure 23A A magnified view of region B of the third radiator shown;

[0050] Figure 24 This is a schematic diagram of the endoscope main unit device shown in some embodiments of this specification from the right frontal view.

[0051] Figure 25A This is a schematic diagram of the endoscope main unit device shown in some embodiments of this specification from the left frontal view.

[0052] Figure 25B This is a partial enlarged view of the left-side component of the endoscope main unit device shown in some embodiments of this specification;

[0053] Figure 26 These are front views of various heat sinks shown in some embodiments according to this specification;

[0054] Figure 27 These are isometric views of the endoscope main unit device shown in some embodiments of this specification;

[0055] Figure 28 This is a simplified structural diagram of the heat sink of an endoscope host device according to some embodiments of this specification.

[0056] Explanation of reference numerals in the attached figures:

[0057] 100. Endoscope main unit; 1. Housing; 11. Heat dissipation grille; 12. Mounting cavity; 2. Light source module; 21. Side light source group; 211. High-heat light source; 22. End face light source; 23. Light source control board; 3. Light guide module; 31. Light guide rod; 32. Light guide base; 4. First heat dissipation module; 41. First heat dissipation unit; 411. First heat sink; 4111. Second limiting part; 4112. Mating part; 412. Heat-conducting plate; 4121. First side; 4122. Second side; 4123. First limiting part; 4124. Positioning part; 413. Heat-conducting pipe; 4131. First heat-conducting pipe; 414. First fan; 415. 416. First air guide shroud; 417. Directional air duct; 418. First vent; 419. Second vent; 42. Second heat dissipation unit; 421. Second radiator; 422. Second heat pipe; 423. Second fan; 424. Second air guide shroud; 5. Second heat dissipation module; 51. Third radiator; 511. Base plate; 5111. Interface; 512. Heat dissipation fins; 513. Mounting plate; 514. Fastener; 52. Third air guide shroud; 53. Third fan; 54. Fourth fan; 6. Control module; 7. Third heat dissipation module; 71. Fifth fan; 72. Fourth radiator; 8. Gasket; 81. Thin sheet layer; 9. Power module; 10. Air source module. Detailed Implementation

[0058] The accompanying drawings used in the description of the embodiments will be briefly introduced below. The drawings do not represent all embodiments.

[0059] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0060] As indicated in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0061] In the medical field, endoscope main unit equipment is widely used in various types of surgery or treatment in gastroenterology, respiratory medicine, urology and other departments. It uses a built-in camera and lighting system to transmit images inside the body to an external monitor, enabling doctors to directly observe lesions and make accurate diagnoses and necessary treatments.

[0062] In endoscopic main unit equipment, a high-energy light source is one of the key components, providing sufficient illumination to ensure image clarity. However, this high-energy light source generates a significant amount of heat during operation, which can negatively impact the performance and lifespan of the equipment. Specifically, heat is transferred along the light guide to the socket, potentially causing irreversible thermal deformation of the light guide socket. It can also affect the normal operation of internal electronic components, and in severe cases, lead to a decline in instrument performance or damage.

[0063] In view of this, in some embodiments of this specification, it is desirable to provide an improved endoscope host device and its heat sink, which solves the problem of heat accumulation inside the endoscope host device by redesigning the heat dissipation module, especially by finding a balance between ensuring the compactness of the endoscope host device and efficient heat dissipation, so as to overcome the shortcomings of the prior art and ensure the stability and reliability of the endoscope host device under high brightness working conditions.

[0064] First, it should be noted that certain features, structures, or characteristics in one or more embodiments of this specification can be appropriately combined. The embodiments described in this specification are only used to illustrate the principles of the embodiments in this specification, and other variations may also fall within the scope of this specification.

[0065] Figure 1 This is a schematic diagram of the appearance of an endoscope host device 100 according to some embodiments of this specification.

[0066] like Figure 1 As shown, in some embodiments, the housing 1 of the endoscope main unit 100 is constructed as a hexahedron, including a front plate, a rear plate, a left side plate, a right side plate, a top plate, and a bottom plate. It should be noted that the directional terms such as "front," "rear," "left," "right," "top," and "bottom" used for each side are defined based on the perspective shown in the accompanying drawings and are only used to conveniently describe the relative positional relationships of the components. They do not limit the actual installation or use orientation of this specification, and in practical applications, these directional terms should not be considered as limitations on this specification. In other embodiments, the housing 1 can also be constructed in any other shape, such as a cylinder.

[0067] In some embodiments, the housing 1 is provided with a heat dissipation grille 11, which is constructed as a multi-opening structure or a multi-perforated structure and is disposed on at least one side of the housing 1 to enhance air circulation between the inside and outside of the housing 1. In some embodiments, depending on the placement of the heat dissipation modules inside the housing 1 and the airflow direction, at least one side of the housing 1 is provided with the heat dissipation grille 11, which may occupy part or all of the area of ​​that side. In some embodiments, at least two heat dissipation modules transfer heat from inside the housing 1 to the outside through the heat dissipation grille 11. For example, cold outside air enters the housing 1 through the heat dissipation grille 11, and hot air inside the housing 1 flows out to the outside through the heat dissipation grille 11, thereby achieving heat exchange between the inside and outside of the housing 1.

[0068] The endoscope host device 200 in Embodiment 1 of this manual will be described below.

[0069] Figure 2 This is an internal schematic diagram of an endoscope host device 100 according to some embodiments of this specification. Figure 3 This is an internal schematic diagram of the endoscope host device 100 shown in some embodiments according to this specification from another perspective.

[0070] like Figure 2 and Figure 3As shown, some embodiments of this specification provide an endoscope host device 100, which includes a housing 1 and a light source module 2 and a first heat dissipation module 4 disposed within the housing 1. The light source module 2 is a component in the endoscope host device 100 responsible for generating high-brightness light to provide illumination for the examination area of ​​the endoscope. The light source module 2 includes, but is not limited to, light-emitting elements, driving circuits, optical lenses, and other structures. For example, the first heat dissipation module 4 is configured to dissipate heat from the light source module 2. For instance, the first heat dissipation module 4 achieves air convection between the inside and outside of the housing 1 through ventilation openings formed by heat dissipation grilles 11, thereby dissipating heat from the light source module 2. Since the light source module 2 is the main heat-generating component of the endoscope host device 100, dedicated heat dissipation of the high-heat area by the first heat dissipation module 4 can improve heat dissipation efficiency, reduce deformation or damage to internal components, and ensure the stability and reliability of the endoscope host device 100 under high-brightness operating conditions.

[0071] In some embodiments, the light source module 2 includes a side light source group 21 and an end light source 22, a first airflow path and a second airflow path are formed within the housing 1, and the first heat dissipation module 4 includes a first heat dissipation unit 41 and a second heat dissipation unit 42. For example, the first heat dissipation unit 41 includes a first heat sink 411 and a first fan 414 (see...). Figure 8 The first heat sink 411 is configured to dissipate heat from the side light source group 21. The first fan 414 is disposed adjacent to the rear plate of the housing 1 and is configured to generate a first air path through the first heat sink 411. The rear end face of the first heat sink 411 is disposed adjacent to the first fan 414, that is, the distance between the rear end face of the first heat sink 411 and the first fan 414 is within a small range, for example, they are attached or almost attached, or the distance between them only allows some small lines or pipes to pass through. For example, the second heat dissipation unit 42 includes a second heat sink 421, which is configured to dissipate heat from the end face light source 22. The second air path passes through the second heat sink 421 and is offset from the first heat sink 411, that is, the first air path and the second air path are isolated from each other or arranged adjacent to each other.

[0072] According to the above scheme, the rear end face of the first heat sink 411 is positioned adjacent to the first fan 414, reducing the wasted space between the first heat sink 411 and the first fan 414. Furthermore, the airflow from the first fan 414 directly acts on the first heat sink 411, reducing energy loss and improving heat dissipation efficiency. The second airflow path is staggered from the first heat sink 411 to avoid cross-heating between the first heat sink 411 and the second heat sink 421, thus improving heat dissipation efficiency.

[0073] In some embodiments, the first heat sink 411 is arranged adjacent to the side light source group 21, shortening the heat transfer path between the first heat sink 411 and the side light source group 21 and improving the heat dissipation effect. In some embodiments, since the side light source group 21 has more light sources than the end face light source 22, and the high-heat light source is arranged in the side light source group 21 while the end face light source 22 is arranged at the end face, the length of the first heat sink 411 is greater than the length of the second heat sink 421 in the front-rear direction of the housing 1. That is, the heat dissipation capacity of the high-heat area is improved by using the larger first heat sink 411, realizing differentiated heat dissipation between high and low heat, avoiding local overheating, and improving the heat dissipation effect.

[0074] In some embodiments, the first heat sink 411 and the second heat sink 421 are staggered in at least one direction of the housing 1, and the first air path and the second air path are isolated from each other. The at least one direction of the housing 1 includes the front-back direction, the left-right direction, and the up-down direction. By staggering the first heat sink 411 and the second heat sink 421, mutual interference of airflow in different heat zones is avoided, improving heat dissipation and reducing fan energy consumption. For example, the first heat sink 411 and the second heat sink 421 are staggered in both the front-back and left-right directions. Referring to Embodiment 3, the first heat sink 411 and the second heat sink 421 can also be staggered in the up-down direction (or height direction).

[0075] In some embodiments, the second heat dissipation unit 42 is disposed between the end-face light source 22 and the rear plate of the housing 1. In the left-right direction of the housing 1, the width of the first heat sink 411 is greater than the width of the second heat sink 421. By disposing the second heat dissipation unit 42 between the end-face light source 22 and the rear plate of the housing 1, the second heat dissipation unit 42 is directly connected to the end-face light source 22, which improves heat dissipation efficiency and allows space on the side of the light source module 2 to be freed up, making it easier to increase the width of the first heat sink 411 and improve its heat dissipation capacity.

[0076] Figure 4 This is a modular diagram of the internal structure of the endoscope host device 100 cut along the vertical direction according to some embodiments of this specification.

[0077] In some embodiments, one side of the first heat sink 411 is adjacent to the light source module 2, and the other side extends along the left-right direction of the housing 1, occupying the remaining width within the housing 1. The remaining width refers to the width of the housing 1 in the left-right direction, excluding the width occupied by the light source module 2, other components (such as the air source module, heat-conducting plate 412, or heat pipe), assembly gaps, etc. This maximizes the utilization of the remaining space within the housing 1, increases the volume of the first heat sink 411, and improves its heat dissipation capacity. Furthermore, placing a single heat sink within the space on the side of the light source module 2 significantly improves the heat dissipation effect.

[0078] In some embodiments, the endoscope host device 100 further includes a power module 9, an air source module, and a control module 6. The light source module 2 is disposed near one side of the housing 1. The power module 9 is located below the light source module 2 and is used to supply power to the light source module 2 or other modules. One side of the first heat dissipation unit 41 is adjacent to the light source module 2, and the other side extends to the position of the air source module 10. The control module 6 is located above the light source module 2 and the heat dissipation module. In some other embodiments, the endoscope host device 100 does not have an air source module or the air source module 10 is located in another position. In this case, the first heat sink 411 can extend from the power module 9 to the side of the housing 1. In some other embodiments, some small-sized structures in the air source module 10 can pass under or to the side of the first heat sink 411, but the impact on the first heat sink 411 is small, so that the first heat sink 411 can almost occupy the remaining width of the housing 1 excluding the light source module 2.

[0079] Figure 5 This is a schematic diagram of the structure of the first heat sink 411 shown in some embodiments of this specification. Figure 6 This is a schematic diagram of the cooperation between the first heat sink 411 and the first air guide shroud 415 according to some embodiments of this specification. Figure 7 This is a top view of the internal structure of the endoscope host device 100 as shown in some embodiments of this specification. Figure 8 It is based on Figure 7 A cross-sectional view of the endoscope host device 100 shown in some embodiments, taken along line AA.

[0080] like Figures 5 to 8 As shown, in some embodiments, the first heat dissipation unit 41 includes a first air guide shroud 415, which covers at least the front and rear ends of the first heat sink 411. For example, if the first heat sink 411 has a closed flow channel formed inside, the first air guide shroud 415 only needs to cover the ventilation openings on the front and rear ends of the first heat sink 411. For instance, if the first heat sink 411 is formed by a U-shaped sheet metal inlay, creating a closed flow channel along the front-rear direction, the first air guide shroud 415 covers the front and rear ventilation openings of the closed flow channel. In other embodiments, the first air guide shroud 415 may also completely cover the first heat sink 411, as shown in Embodiment 3, where the entire first heat sink 411 is located within the channel of the first air guide shroud 415.

[0081] In some embodiments, the first airflow path includes a first vent 417 and a second vent 418 disposed on the housing 1. The first vent 417 is disposed on the rear plate of the housing 1, and the second vent 418 is disposed on the bottom plate of the housing 1. This arrangement allows airflow to flow forward or backward along the path of the second vent 418, the first air guide shroud 415, the first radiator 411, the first fan 414, and the first vent 417. The second vent 418 being disposed on the bottom plate of the housing 1 results in a shorter airflow path, more efficient heat dissipation, and also reduces the lateral space occupied by the first air guide shroud 415, thereby improving space utilization.

[0082] In some embodiments, the first air guide shroud 415 includes a deflecting air duct 416 located between the first radiator 411 and the second vent 418, for changing the airflow direction between the second vent 418 and the first radiator 411. For example, the deflecting air duct 416 can guide the vertical airflow flowing into the second vent 418 to turn into a horizontal airflow, allowing it to flow entirely into the first radiator 411. Alternatively, the deflecting air duct 416 can guide the horizontal airflow within the first radiator 411 to turn into a vertical flow and exit from the second vent 418.

[0083] For example, the second vent 418 can be disposed adjacent to the front end face of the first radiator 411, which can shorten the distance between the second vent 418 and the first radiator 411, thereby shortening the airflow path and improving heat dissipation efficiency.

[0084] Figure 9 This is a top view of the internal structure of the endoscope host device 100 as shown in some embodiments of this specification. Figure 10 It is based on Figure 9 A partial enlarged view of the endoscope host device 100 at the second heat dissipation unit 42 shown in some embodiments.

[0085] In some embodiments, the second airflow path includes a third vent and a fifth vent on the housing 1. The third vent is located on the side plate of the housing 1, and the fifth vent is located on the rear plate of the housing 1. The flow path of the second airflow path includes the third vent, the second heat sink 421, and the fifth vent. For example, the second heat dissipation unit 42 is disposed between the end-face light source 22 and the rear plate of the housing 1. The third vent is located on the left side plate of the housing 1, corresponding to the second heat sink 421, and the fifth vent is also located corresponding to the second heat sink 421, thereby shortening the path length of the second airflow path and improving heat dissipation efficiency. For example, a fifth fan can be provided at the location of the fifth vent. The fifth fan is located on the outside of the rear plate of the housing 1 and can form the second airflow path by suction. In other embodiments, the fifth fan can also guide the hot airflow of the control module 6 inside the housing 1 to the second heat sink 421, and then out through the fifth vent via the second heat sink 421, thereby achieving a dual heat dissipation effect for the end-face light source 22 and the control module 6.

[0086] In some other embodiments, the second heat dissipation unit 42 is arranged adjacent to the first heat dissipation unit 41. In this case, the third vent is located on the bottom plate of the housing 1, and the fifth vent is located on the rear plate of the housing 1, and is arranged corresponding to the second heat sink 421.

[0087] Figure 11 This is an exploded view of the internal structure of the endoscope host device 100 as shown in some embodiments of this specification.

[0088] like Figure 11 As shown, in some embodiments, the first heat dissipation unit 41 includes at least one heat-conducting plate 412 and at least one heat-conducting pipe 413. The heat-conducting plate 412 is disposed between the first heat sink 411 and the side light source group 21, and the heat-conducting pipe 413 is configured to transfer heat from the side light source group 21 to the first heat sink 411. By providing the heat-conducting plate 412 and the heat-conducting pipe 413, the heat conduction efficiency of the light source module 2 in transferring heat to the first heat sink 411 can be improved, thereby effectively controlling the temperature of the light source module 2.

[0089] In some embodiments, there are multiple heat-conducting plates 412, each heat-conducting plate 412 is arranged corresponding to a light source of the side light source group 21, and there are multiple heat-conducting pipes 413, one end of each heat-conducting pipe 413 is connected to a heat-conducting plate 412, and the other end of each heat-conducting pipe 413 is embedded in a first heat sink 411. Embedding the heat-conducting pipe 413 in the first heat sink 411 can increase the contact area between the two, and quickly transfer the heat of the heat-conducting pipe 413 to the first heat sink 411.

[0090] Combination Figure 7 and Figure 11As shown, in some embodiments, the heat pipe 413 extends backward from the heat-conducting plate 412 into the first heat sink 411. An installation cavity 12 is formed in front of the heat pipe 413 and in front of the first heat sink 411, for assembling other modules. These other modules include, but are not limited to, the air source module 10 and the control module 6. By tilting the heat pipe 413 backward, the spatial layout between the modules can be made more reasonable and compact, maximizing the usable space of the first heat sink 411.

[0091] In some embodiments, the endoscope host device 100 further includes a light guide module 3 and a second heat dissipation module 5. The second heat dissipation module 5 is configured to dissipate heat from the light guide module 3. The second heat dissipation module 5 includes a third air guide shroud 52 and a third fan 53. The third fan 53 is configured to form a third airflow path within the third air guide shroud 52. The third air guide shroud 52 is constructed using a channel structure, or it can be constructed using at least two guide vanes. For example, the at least two guide vanes can be arranged in a V-shape with openings at both ends to increase heat dissipation and simplify the structure. For example, the third air guide shroud 52 is constructed using a channel structure, and a third heat sink 51 can be disposed within the third air guide shroud 52 to improve heat dissipation. More examples of the light guide module 3 and the second heat dissipation module 5 can be found in Embodiment 3 and its related description.

[0092] In some embodiments, the endoscope host device 100 further includes a control module 6 and a third heat dissipation module, the third heat dissipation module being configured to dissipate heat from the control module 6; and / or, the endoscope host device 100 further includes at least one sensor, a temperature controller, and a second heat dissipation module 5, the sensor being used to collect the temperature of the light source module 2 and / or the light guide module 3 of the endoscope host device 100, and the temperature controller being configured to control the operating power of the first heat dissipation module 4 and the second heat dissipation module 5 based on the temperature collected by the sensor. Further examples of the control module 6 and the third heat dissipation module can be found in Embodiment 3 and its related description.

[0093] The endoscope host device 100 in Embodiment 2 of this manual will be described below.

[0094] Embodiment 2 of this specification also provides an endoscope host device 100, including a housing 1 and a light source module 2 and a first heat dissipation module 4 disposed within the housing 1. The first heat dissipation module 4 includes a first heat dissipation unit 41, which includes a first heat sink 411 and a first fan 414. The first heat sink 411 is configured to dissipate heat from the side light source group 21 of the light source module 2. The first fan 414 is disposed adjacent to the rear plate of the housing 1 and is configured to generate a first airflow path through the first heat sink 411. The rear end face of the first heat sink 411 is disposed adjacent to the first fan 414. One side of the first heat sink 411 is adjacent to the light source module 2, and the other side extends along the left and right direction of the housing 1 and occupies the remaining width within the housing 1. According to the above scheme, the rear end face of the first heat sink 411 is positioned adjacent to the first fan 414, reducing the wasted space between the first heat sink 411 and the first fan 414. Furthermore, the first heat sink 411 occupies the remaining width within the housing 1, maximizing its dimensions in both the front-to-back and left-to-right directions, thus increasing its volume and improving its heat dissipation capacity. Additionally, placing a single first heat sink 411 on the left or right side of the light source module 2 eliminates the need for other heat sinks, further maximizing its volume. Moreover, the airflow from the first fan 414 directly acts on the first heat sink 411, reducing energy loss and improving heat dissipation efficiency.

[0095] In some embodiments, in the vertical direction of the housing 1, the bottom of the first heat sink 411 is located on the bottom plate of the housing 1, and the top of the first heat sink 411 extends upward and occupies the remaining height. The remaining height can be the height inside the housing 1 excluding the height occupied by components such as the control module 6.

[0096] In some embodiments, the first heat dissipation unit 41 includes a first air guide shroud 415, which covers at least the front end face and the rear end face of the first heat sink 411.

[0097] In some embodiments, the first airflow path includes a first vent 417 and a second vent 418 disposed on the housing 1. The first vent 417 is disposed on the rear plate of the housing 1, and the second vent 418 is disposed on the bottom plate of the housing 1. The first air guide shroud 415 includes a deflecting air duct 416, which is located between the first radiator 411 and the first vent 417, and is used to change the airflow direction between the first vent 417 and the first radiator 411. More examples of the first air guide shroud 415, the first vent 417, and the second vent 418 can be found in [reference needed]. Figures 5 to 8 And its related descriptions.

[0098] In some embodiments, the first heat dissipation module 4 further includes a second heat dissipation unit 42, and the light source module 2 further includes an end-face light source 22. The second heat dissipation unit 42 is disposed between the end-face light source 22 and the rear plate of the housing 1, and is configured to dissipate heat from the end-face light source 22. More examples of the second heat dissipation unit 42 can be found in [reference needed]. Figure 9 and Figure 10 And its related descriptions.

[0099] Figure 12 This is a structural block diagram of an endoscope host device 100 according to some embodiments of this specification.

[0100] like Figure 12 As shown, some embodiments of this specification provide an endoscope host device 100, which includes a housing 1 and a light source module 2, a light guide module 3, and at least two heat dissipation modules disposed within the housing 1. The light source module 2 is the component in the endoscope host device 100 responsible for generating high-brightness light to provide illumination for the examination area of ​​the endoscope. The light source module 2 includes, but is not limited to, light-emitting elements, driving circuits, optical lenses, and other structures. The light guide module 3 is the part of the endoscope host device 100 responsible for transmitting the light generated by the light source module 2 to the front end of the endoscope, ensuring that the light can reach the examination area efficiently and safely. The light guide module 3 includes, but is not limited to, light guide elements (optical fibers, etc.), interfaces connecting the light source module 2 and the light guide elements, sockets, and other structures.

[0101] In some embodiments, at least two heat dissipation modules include a first heat dissipation module 4 and a second heat dissipation module 5. The first heat dissipation module 4 is configured to dissipate heat from the light source module 2, and the second heat dissipation module 5 is configured to dissipate heat from the light guide module 3. Both the first heat dissipation module 4 and the second heat dissipation module 5 are located inside the housing 1 and dissipate heat through the heat dissipation grille 11, making the components more concentrated and compact, which helps to reduce the size of the endoscope main unit 100. Since the light source module 2 and the light guide module 3 are the main heat-generating components of the endoscope main unit 100, dissipating heat from the high-heat areas by the first heat dissipation module 4 and the second heat dissipation module 5 can improve heat dissipation efficiency, reduce deformation or damage to the internal components of the device, and ensure the stability and reliability of the endoscope main unit 100 under high-brightness operating conditions.

[0102] Figure 13 This is an internal schematic diagram of an endoscope host device 100 according to some embodiments of this specification.

[0103] like Figure 13As shown, in some embodiments, the output end of the light guide module 3 is located on the front panel of the housing 1, and the input end is connected to the light source module 2. The second heat dissipation module 5 is arranged around the input end of the light guide module 3 to dissipate the heat accumulated near the input end of the light guide module 2. In some embodiments, the light source module 2 includes an end face and a side face. The end face includes a front end face near the light guide module 3 and a rear end face away from the light guide module 3. The other surface located between the front end face and the rear end face is the side face. In some embodiments, the light source module 2 includes a side light source group 21 and an end face light source 22 (e.g., ...). Figure 14 As shown), the side light source group 21 is set on the left or right side plate of the light source module 2, and the end light source 22 is set on the rear plate of the light source module 2.

[0104] Figure 14 This is a top view of a portion of the structure of the endoscope host device 100 as shown in some embodiments of this specification.

[0105] In some embodiments, the light source module 2 includes a side light source group 21, which refers to a plurality of light-emitting elements located on the side of the light source module 2. The first heat dissipation module 4 includes a first heat dissipation unit 41, which includes a first heat sink 411 configured to dissipate heat from the side light source group 21. In some embodiments, the heat exchange surface of the first heat sink 411 is adapted to the heat-generating area of ​​the side light source group 21, and the area of ​​the heat exchange surface is greater than or equal to the area of ​​the heat-generating area, ensuring the heat dissipation effect of the entire heat-generating area. The heat exchange surface of the first heat sink 411 refers to the surface of the first heat sink 411 close to the side light source group 21; the heat-generating area of ​​the side light source group 21 includes the heat radiation area formed on the side of the light source module 2 after the side light-emitting elements, driving circuits, optical lenses, etc., generate heat. The heat radiation boundary can be defined by a temperature threshold, thereby determining the heat radiation area. The entire side heat-generating area can be dissipated by a single first heat sink 411, reducing the number of components, simplifying the internal structure of the endoscope host device 100, and making the structure more compact. In some embodiments, the first heat sink 411 is arranged adjacent to the side light source group 21, and the structure is made more compact by changing the arrangement position.

[0106] Figure 15 This is an isometric view of a portion of the structure of the endoscope host device 100 as shown in some embodiments of this specification.

[0107] like Figure 15As shown, in some embodiments, the first heat dissipation unit 41 further includes a heat-conducting plate 412, which is disposed between the side light source group 21 and the first heat sink 411. The heat-conducting plate 412 is used to transfer the heat from the side light source group 21 to the first heat sink 411, thereby improving the heat transfer efficiency between the side light source group 21 and the first heat sink 411. In some embodiments, the heat-conducting plate 412 includes a first side 4121 and a second side 4122. The first side 4121 faces the light source module 2, and the second side 4122 faces the first heat sink 411. The heat from the side light source group 21 is directly transferred to the first heat sink 411 via the heat-conducting plate 412, shortening the heat transfer path and improving the heat dissipation efficiency. In some embodiments, the area of ​​the heat-conducting plate 412 covers the light-emitting area of ​​the side light source group 21 to ensure the heat dissipation effect. In some embodiments, the heat-conducting plate 412 is attached to the light source module 2 or maintains a small gap, and / or the heat-conducting plate 412 is attached to the first heat sink 411 or maintains a small gap, thereby improving the heat dissipation efficiency.

[0108] Figure 16 This is a schematic diagram of the first side 4121 of the heat-conducting plate 412 as shown in some embodiments of this specification. Figure 17 This is a schematic diagram of the second side 4122 of the heat-conducting plate 412 as shown in some embodiments of this specification.

[0109] In some embodiments, the first heat dissipation unit 41 further includes at least one heat pipe 413, which is disposed on at least one side of the heat-conducting plate 412 and extends along the side of the heat-conducting plate 412. Specifically, the first side 4121 and / or the second side 4122 of the heat-conducting plate 412 are provided with heat pipes 413. The heat pipes 413 on either side can be continuous or intermittently arranged. The heat pipes 413 can extend meanderingly on the surface of the heat-conducting plate 412 or be arranged in a straight line. In some embodiments, depending on the heat generation of the side light source group 21, the heat pipes 413 at locations with high heat are arranged more densely, while those at locations with low heat are arranged more sparsely. This not only optimizes the heat dissipation path and avoids excessively high local temperatures, but also avoids unnecessary material waste.

[0110] In some embodiments, the side light source group 21 includes a high-heat light source 211, which refers to a light source whose heating temperature is greater than a preset temperature threshold. In some embodiments, the high-heat light source 211 may be a light source located in the middle position of the side light source group 21, or a light source located at the edge position. In some embodiments, at least one heat pipe 413 includes a first heat pipe 4131, which is disposed between the heat-conducting plate 412 and the light source module 2, i.e., the first side 4121 of the heat-conducting plate 412. For example, the first heat pipe 4131 may be a single heat pipe 413 or multiple heat pipes 413. In some embodiments, at least a portion of the first heat pipe 4131 is arranged adjacent to the high-heat light source 211 to improve the heat dissipation efficiency near the high-heat light source 211 and avoid excessively high local temperature of the high-heat light source 211.

[0111] Figure 18 This is a schematic diagram of the structure of the first heat sink 411 shown in some embodiments of this specification.

[0112] like Figures 16 to 18 As shown, in some embodiments, the heat-conducting plate 412 includes a first limiting portion 4123, which is configured to form a limiting engagement with the heat-conducting pipe 413. In some embodiments, the heat-conducting plate 412 has a certain thickness, and the first limiting portion 4123 includes a groove on the heat-conducting plate 412, in which the heat-conducting pipe 413 is embedded, thereby achieving a stable connection with the heat-conducting plate 412. In other embodiments, the heat-conducting pipe 413 can be fixed to the heat-conducting plate 412 by various methods such as welding, bonding, or snap-fit ​​connection.

[0113] In some embodiments, the first heat sink 411 includes a second limiting portion 4111, which is configured to form a limiting engagement with the heat pipe 413. In some embodiments, the second limiting portion 4111 includes a groove on the first heat sink 411, and the heat pipe 413 can be embedded in the groove, so that the heat pipe 413 engages with the first heat sink 411. This not only makes the heat pipe 413 and the first heat sink 411 more compact, but also improves the heat dissipation effect of the first heat sink 411 on the heat pipe 413.

[0114] In some embodiments, the heat-conducting plate 412 includes a positioning part 4124, and the first heat sink 411 includes a mating part 4112. The positioning part 4124 and the mating part 4112 form a limiting fit, so that the heat-conducting plate 412 and the first heat sink 411 are connected at a preset relative position. In some embodiments, one of the positioning part 4124 and the mating part 4112 includes a positioning groove, and the other includes a positioning protrusion. After the positioning groove and the positioning protrusion are engaged, the heat-conducting plate 412 and the first heat sink 411 can be accurately connected, so that the first heat sink 411 can cover the entire area of ​​the heat-conducting plate 412, improving the installation accuracy and enhancing the heat transfer efficiency.

[0115] Figure 19 This is an isometric view of the top view of the endoscope host device 100 as shown in some embodiments of this specification. Figure 20 This is an isometric view of the bottom view of the endoscope host device 100 shown in some embodiments of this specification.

[0116] In some embodiments, the housing 1 includes a first vent and a second vent (not shown in the figure). In some embodiments, the first vent and the second vent are located on different side plates of the housing 1, for example, the first vent is located on the rear plate of the housing 1 and the second vent is located on the bottom plate of the housing 1. In some embodiments, the first vent and the second vent are composed of heat dissipation grilles 11, which serve both ventilation and dust prevention functions.

[0117] like Figure 19 and Figure 20 As shown, in some embodiments, the first heat dissipation unit 41 further includes a first fan 414 and a first air guide shroud 415. The first fan 414 is located at the first vent. One end of the first air guide shroud 415 is connected to the second vent, and the other end is connected to the first vent. The first fan 414 is configured to form a first air path between the first vent and the second vent, and the first air path passes through the first radiator 411.

[0118] In some embodiments, the first airflow path can be from the first vent to the second vent, or from the second vent to the first vent, such as... Figure 19 and Figure 20 The arrows in the diagram indicate the flow direction. When the first airflow passes through the first radiator 411, it transfers the heat from the first radiator 411 to the outside of the housing 1, thereby carrying away the heat.

[0119] In some embodiments, the first air guide shroud 415 includes an air guide channel surrounded by multiple inner shells, which can guide the air to flow along a specific path. Its flexible arrangement facilitates the rational planning of the optimal heat dissipation path, preventing heat retention and accumulation within the housing 1 and improving heat dissipation efficiency. In some embodiments, the side of the first air guide shroud 415 closest to the side light source module 2 does not have an inner shell, allowing both the heat-conducting plate 412 and the first heat sink 411 to be positioned along the first airflow path, thus improving heat dissipation efficiency.

[0120] The heat transfer path of the first heat dissipation unit 41 includes: the heat of the heating area of ​​the side light source group 21 is transferred to the heat pipe 413 and the heat plate 412, the heat pipe 413 and the heat plate 412 transfer the heat to the first heat sink 411, the first heat sink 411 is in the first air path, and the heat of the first heat sink 411 is transferred to the outside of the housing 1 through the first air path.

[0121] Figure 21This is a schematic diagram of the structure of the second heat dissipation unit 42 according to some embodiments of this specification.

[0122] like Figure 14 and Figure 11 As shown, the light source module 2 also includes an end-face light source 22, which refers to a light source disposed on the rear end face of the light source module 2, which is arranged opposite to the light guide module 3. In some embodiments, the first heat dissipation module 4 includes a second heat dissipation unit 42, which includes a second heat sink 421. The second heat sink 421 and the first heat sink 411 are disposed adjacent to each other, with the first heat sink 411 disposed between the light source module 2 and the second heat sink 421.

[0123] In some embodiments, the second heat dissipation unit 42 includes a second heat sink 421 and a second heat pipe 422. The second heat sink 421 is configured to dissipate heat from the end-face light source 22. One end of the second heat pipe 422 is adjacent to the end-face light source 22, and the other end is connected to the second heat sink 421. The second heat pipe 422 quickly and evenly transfers the heat from the end-face light source 22 to the second heat sink 421. Furthermore, the second heat pipe 422 can be bent according to the internal component layout, allowing for flexible arrangement and minimal space occupation, resulting in a more compact structure.

[0124] In some embodiments, the end-face light source 22 is closer to the rear plate of the housing 1, so the second heat sink 421 is arranged near the rear plate of the housing 1 to shorten the heat transfer path and improve heat transfer efficiency. In some embodiments, at least a portion of the second heat pipe 422 passes through the first heat dissipation unit 41, so some of the heat from the second heat pipe 422 is dissipated in advance in the first heat dissipation unit 41, and the excess heat is then transferred to the second heat sink 421 for heat dissipation, which enables the second heat pipe 422 to cool down more quickly and improves heat dissipation efficiency. For example, the second heat pipe 422 passes between the first fan 414 and the first heat sink 411, and the first airflow path formed by the first fan 414 can dissipate part of the heat from the second heat pipe 422 in advance.

[0125] In some embodiments, the housing 1 includes a first vent and a third vent (not shown in the figures). The first vent is the same as the first vent of the first heat dissipation unit 41. The first vent and the third vent can be located on different side panels of the housing 1; for example, the first vent may be located on the rear panel of the housing 1, and the third vent may be located on the bottom panel of the housing 1. In other embodiments, the third vent may also be located on other sides of the housing 1, such as the right side panel or the front panel.

[0126] like Figure 19 and Figure 20As shown, in some embodiments, the second heat dissipation unit 42 further includes a second fan 423 and a second air guide shroud 424. The second fan 423 is disposed at the first vent, and one end of the second air guide shroud 424 is connected to the third vent, while the other end is connected to the first vent through the second fan 423. The second fan 423 is configured to form a second airflow path between the first vent and the third vent, and the second airflow path passes through the second heat sink 421. In some embodiments, the second airflow path can flow from the first vent to the third vent, or from the third vent to the first vent, and the flow direction can be as follows: Figure 19 and Figure 20 As shown by the arrow in the image.

[0127] The heat transfer path of the second heat dissipation unit 42 includes: the heat of the heat-generating area of ​​the end face light source 22 is transferred to the second heat pipe 422, the second heat pipe 422 transfers the heat to the second heat sink 421, the second heat sink 421 is in the second air path, and the heat of the second heat sink 421 is transferred to the outside of the housing 1 through the second air path.

[0128] Figure 22A This is a schematic diagram of some components of an endoscope host device 100 according to some embodiments of this specification. Figure 22B It is based on Figure 22A A magnified view of a portion of the components of the endoscope host device 100 shown in region A.

[0129] like Figure 22A and Figure 22B As shown, in some embodiments, the light guide module 3 includes a light guide rod 31 and a light guide seat 32. The light source end of the light guide rod 31 is connected to the light source module 2, and the output end of the light guide rod 31 is connected to the light guide seat 32. The light guide seat 32 serves as the overall output end of the light guide module 3 and is used to output light to the front end of the endoscope.

[0130] In some embodiments, the second heat dissipation module 5 includes a third heat sink 51, which is disposed at the light source end of the light guide rod 31 and configured to dissipate heat from the heat-generating area around the light guide rod 31. For example, after the light from the light source module 2 passes through the optical lens, it is focused at the light source end of the light guide rod 31. Some of the light falls on other components outside the range of the light source end, causing high heat in those components. Therefore, by providing a third heat sink 51 at the light source end of the light guide rod 31 to dissipate heat from the heat-generating components near the light source end, deformation of the heat-generating components can be effectively prevented, improving equipment stability and service life.

[0131] Figure 23A This is a schematic diagram of the structure of the third heat sink 51 shown in some embodiments of this specification. Figure 23B It is based on Figure 23A A partial enlarged view of region B of the third heat sink 51 shown.

[0132] Combination Figures 22A to 23B As shown, in some embodiments, the third heat sink 51 includes a substrate 511, which is disposed at the light source end of the light guide rod 31. For example, the substrate 511 is provided with an interface 5111 that mates with the light guide rod 31. After the light source end of the light guide rod 31 engages with the interface 5111, the substrate 511 can receive light outside the range of the light source end, thereby forming a heat-generating area on the substrate 511 for heat dissipation.

[0133] In some embodiments, the third heat sink 51 further includes heat dissipation fins 512, which increase the surface area of ​​the heat sink and improve heat dissipation efficiency. In some embodiments, the heat dissipation fins 512 are disposed on one side of the substrate 511 facing the light guide seat 32, so that heat can be quickly transferred from the substrate 511 to the heat dissipation fins 512, and then dissipated through the airflow around the light guide rod 31, forming an efficient heat dissipation path. The heat dissipation fins 512 being disposed on one side of the substrate 511 facing the light guide seat 32 allows the other side of the substrate 511 to remain flat. This design facilitates a compact layout between the light guide module 3 and the light source module 2, reducing unnecessary space occupation.

[0134] In some embodiments, the third heat sink 51 further includes a pad 8, which is detachably attached to the substrate 511 of the third heat sink 51 to adjust the total thickness of the third heat sink 51, ensuring a tight fit between the light source end of the light guide rod 31 and the substrate 511 of the third heat sink 51. In some embodiments, the pad 8 comprises a plurality of thin sheet layers 81, and the thickness of the pad 8 can be determined based on the number of thin sheet layers 81. By adjusting the number of thin sheet layers 81, the thickness of the pad 8 is made equal to or substantially equal to the distance between the light source end and the substrate 511, wherein substantially equal means that the ratio of the difference between the two to the thickness of the pad 8 is in the range of 0% to 5%.

[0135] Figure 24 This is a schematic diagram of the endoscope host device 100 shown in some embodiments of this specification from the right frontal view. Figure 25A This is a schematic diagram of the endoscope host device 100 shown in some embodiments of this specification from the left frontal view. Figure 25B This is a partial enlarged view of the left-side component of the endoscope host device 100 shown in some embodiments of this specification.

[0136] like Figure 13 , Figures 24 to 25BAs shown, the housing 1 includes a first vent and a fourth vent, wherein the first vent and the first vent of the first heat dissipation module 4 are the same vent. The first vent and the fourth vent can be located on different sides of the housing 1. For example, the first vent can be located on the rear panel of the housing 1, and the fourth vent can be located on the right side panel of the housing 1. In some other embodiments, the fourth vent can also be located on other sides such as the right side panel or the front panel of the housing 1.

[0137] In some embodiments, the second heat dissipation module 5 further includes a third air guide shroud 52, a third fan 53, and a fourth fan 54. At least a portion of the light guide module 3 and at least a portion of the third heat sink 51 are disposed within the third air guide shroud 52. The third fan 53 is arranged adjacent to the light guide module 3, and the fourth fan 54 is disposed at the first vent. One end of the third air guide shroud 52 faces the fourth vent, and the other end faces the third fan 53. The third fan 53 and the fourth fan 54 are configured to form a third air path between the first vent and the fourth vent, and the third air path passes through the third heat sink 51. In some embodiments, the third air guide shroud 52 may be arranged around the outer periphery of the light guide module 3, for example, around the outer periphery of the light guide rod 31. In some embodiments, the nozzles at both ends of the third air guide shroud 52 are disposed around the light guide module 3, without extending to the first and fourth vents. That is, part of the third air path flows inside the third air guide shroud 52, and another part flows outside the third air guide shroud 52, which helps to reduce the overall structure. In some other embodiments, the third air guide shroud 52 may also extend from the first vent to the fourth vent, so that the third airflow path flows within the third air guide shroud 52.

[0138] In some embodiments, the flow path of the third air passage includes: under the action of the third fan 53, the air flows from the fourth vent on the right side plate of the housing 1 into the housing 1, and flows along the front plate of the housing 1 to the third air guide shroud 52, and is guided by the third air guide shroud 52 to the left side plate of the housing 1, and then flows along the left side plate of the housing 1 under the action of the fourth fan 54, and flows to the outside through the first vent.

[0139] In some embodiments, the light source module 2 further includes a light source control board 23, which is arranged adjacent to the ventilation opening of the third air guide shroud 52. The third air path passes through the light source control board 23 to dissipate heat from the light source control board 23.

[0140] The heat transfer path of the second heat dissipation module 5 includes: the heat of the heat-generating area of ​​the light guide module 3 is transferred to the third heat sink 51, and the third air path passes through the third heat sink 51 and the light source control board 23, thereby transferring the heat of the third heat sink 51 and the light source control module 6 to the outside of the housing 1.

[0141] Figure 26These are front views of various heat sinks shown in some embodiments of this specification.

[0142] In some embodiments, with the bottom plate of the housing 1 as a reference, the height of the second radiator 421 is less than the height of the first radiator 411. Here, "height" refers to the distance between the bottom of the radiator and the bottom plate of the housing 1, or the distance between the geometric center of the radiator and the bottom plate of the housing 1. The difference in height between the second radiator 421 and the first radiator 411 allows the two radiators to be staggered, preventing their heat from affecting each other and avoiding interference between their airflow paths, thus improving heat dissipation efficiency.

[0143] In some embodiments, the first heat dissipation module 4 includes a first heat sink 411, and the second heat dissipation module 5 includes a third heat sink 51. With the bottom plate of the housing 1 as a reference, the height of the third heat sink 51 is greater than the height of the first heat sink 411. Here, "height" refers to the distance between the bottom of the heat sink and the bottom plate of the housing 1, or the distance between the geometric center of the heat sink and the bottom plate of the housing 1. The height of the first heat sink 411 is adapted to the height arrangement of the light source module 2, and the height of the third heat sink 51 is adapted to the height arrangement of the light guide module 3, to ensure closer contact between the heat sink and the heat-generating area and improve heat dissipation.

[0144] Figure 27 This is an isometric view of the endoscope host device 100 shown according to some embodiments of this specification.

[0145] like Figure 27 As shown, in some embodiments, the endoscope host device 100 further includes a control module 6, which includes multiple integrated circuit boards that generate heat during operation. In some embodiments, the control module 6 is positioned above the first air guide shroud 415 and the second air guide shroud 424 to make efficient use of space.

[0146] In some embodiments, the endoscope host device 100 further includes a third heat dissipation module 7, which is configured to dissipate heat from the control module 6 to prevent the control module 6 from overheating.

[0147] In some embodiments, the housing 1 includes a first vent and a fourth vent. The first vent and the first vent of the first heat dissipation module 4 are the same vent, and the fourth vent and the fourth vent of the second heat dissipation module 5 are the same vent. In some embodiments, the first vent is located on the rear panel of the housing 1, and the fourth vent may be located on the right side panel of the housing 1.

[0148] In some embodiments, the third heat dissipation module 7 includes a fifth fan 71 and a fourth heat sink 72. The fourth heat sink 72 is arranged adjacent to the control module 6. The fifth fan 71 is configured to form a fourth airflow path between the first vent and the fourth vent, and the fourth airflow path passes through the fourth heat sink 72. In some embodiments, the fourth heat sink 72 is disposed above the integrated circuit board of the control module 6, and the fifth fan 71 is disposed above the fourth fan 54. Under the action of the fifth fan 71, the fourth airflow path enters from the fourth vent and reaches the top of the control module 6, carrying away the heat from the fourth heat sink 72 from above. For example... Figure 27 The direction of the wind path is indicated by the middle arrow.

[0149] In some embodiments, the endoscope host device 100 further includes at least one sensor (not shown) for collecting the temperature of the light source module 2 and / or the light guide module 3. In some embodiments, the sensor is configured to collect temperature information in real time to monitor the temperature inside the endoscope host device 100 and prevent malfunctions caused by excessive temperature.

[0150] In some embodiments, the sensor is located at at least one of the following locations: the side light source group 21 of the light source module 2, the end light source 22 of the light source module 2, the heat-conducting plate 412 or heat-conducting pipe 413 of the first heat dissipation module 4, the light guide rod 31 of the light guide module 3, the light source control board 23, the control module 6, the first heat sink 411, the second heat sink 421, the third heat sink 51, etc.

[0151] In some embodiments, the endoscope host device 100 further includes a temperature controller (not shown in the figure), which is configured to control the operating power of the first heat dissipation module 4 and the second heat dissipation module 5 based on the temperature collected by the sensor. In some embodiments, the temperature controller acquires the temperature information collected by the sensor in real time and determines the heat dissipation module corresponding to the sensor. When the temperature information is less than a temperature threshold, the control module controls the fan in the corresponding heat dissipation module to reduce its operating power to reduce the energy consumption and noise of the heat dissipation module. When the temperature information is greater than the temperature threshold, the control module controls the fan in the corresponding heat dissipation module to increase its operating power to improve the heat dissipation efficiency and achieve a better heat dissipation effect.

[0152] Figure 28 This is a simplified structural diagram of the heat sink of the endoscope host device 100 according to some embodiments of this specification.

[0153] like Figure 28As shown, in some embodiments, the heat sink includes a substrate 511 and a pad 8. The substrate 511 conducts heat, and the pad 8 is detachably attached to the substrate 511 and configured to adjust the total thickness of the heat sink according to preset conditions. By adjusting the thickness of the substrate 511 with the pad 8, the contact area and contact pressure between the heat sink and the heat source can be optimized, reducing thermal resistance and improving heat conduction efficiency.

[0154] In some embodiments, the gasket 8 and the substrate 511 are identical in shape and area, ensuring uniform heat transfer between the substrate 511 and the gasket 8 and preventing localized overheating. In some embodiments, the area of ​​the gasket 8 is smaller than that of the substrate 511, facilitating the installation of other structures and making the structure more compact.

[0155] In some embodiments, the shims 8 are configured to adjust the total thickness of the heat sink according to preset conditions, which include at least one of the following: the temperature of the heat sink is outside a preset temperature range; the reserved assembly gap of the heat sink is greater than the thickness of the substrate 511. In some embodiments, when the temperature of the heat sink is less than the preset temperature range, the thickness of the substrate 511 can be reduced by decreasing the thickness of the shims 8 or by removing the shims 8, thereby simplifying the structure and reducing weight; when the temperature of the heat sink is greater than the preset temperature range, the thickness of the substrate 511 can be increased by increasing the thickness of the shims 8, thereby improving the heat dissipation capacity of the heat sink. In some embodiments, when the reserved assembly gap of the heat sink is greater than the thickness of the substrate 511, the thickness of the heat sink can be adjusted by adjusting the number of shims 8, so that the heat sink is equal to or substantially equal to the reserved assembly gap. In some embodiments, taking the third heat sink 51 disposed between the light source module 2 and the light guide module 3 as an example, the thickness of the third heat sink 51 is adjusted by the shim 8 so that the light source end of the light guide rod 31 can be smoothly connected with the interface 5111 of the substrate 511, thereby achieving a tight fit between the light source end of the light guide rod 31 and the substrate 511 of the third heat sink 51.

[0156] In some embodiments, the gasket 8 includes at least one sheet layer 81, which is detachably bonded to the substrate 511 or an adjacent sheet layer 81. The thickness of the gasket 8 is determined based on the number of sheet layers 81. In some embodiments, adjacent sheet layers 81 are engaged by means of protrusions and recesses, hooks, snaps, or threaded fasteners, facilitating the installation and removal of the sheet layers 81 and allowing the number of sheet layers 81 to be adjusted as needed. In some embodiments, the substrate 511 is provided with a first mounting hole, and the gasket 8 is provided with a second mounting hole. When the gasket 8 and the substrate 511 are engaged, the first and second mounting holes are aligned, and fasteners 514, such as bolts or pins, engage with the first and second mounting holes, thereby allowing the gasket 8 and the substrate 511 to be detachably connected.

[0157] like Figure 23A and Figure 23BAs shown, in some application scenarios, the substrate 511 is provided with an interface 5111 for connecting the light guide rod 31, and the pad 8 is provided with a through hole or slot that matches the interface 5111. The light source end of the light guide rod 31 can extend into the interface 5111 and the through hole for docking. Therefore, multiple thin film layers 81 and the pad 8 and the substrate 511 can cooperate with each other under the limiting action of the light guide rod 31.

[0158] In some embodiments, the heat sink includes multiple pads 8 of different thicknesses. Depending on the actual usage, pads 8 of different thicknesses can be replaced to meet heat dissipation or assembly requirements. In some embodiments, the pads 8 include multiple thin sheet layers 81, each with a different thickness. Different thin sheet layers 81 can be flexibly selected and combined according to the required thickness of the heat sink. In some embodiments, the pads 8 include multiple thin sheet layers 81, each with the same thickness, for example, all having a unit thickness (1 mm), making it easier to calculate the thickness of the pads 8 more directly.

[0159] In some embodiments, the heat sink further includes a mounting plate 513 and heat dissipation fins 512. The mounting plate 513 is integrally formed with the heat dissipation fins 512. The mounting plate 513 supports the heat dissipation fins 512 and is detachably coupled to the substrate 511 or the gasket 8. In some embodiments, the mounting plate 513 and the heat dissipation fins 512 are disposed on at least one side of the substrate, that is, the mounting plate 513 and the heat dissipation fins 512 can be installed on either side of the substrate 511, or the heat dissipation fins 512 can be installed on both sides of the substrate 511. The heat dissipation fins 512 are detachably connected to the substrate 511 by the mounting plate 513. The installation of the heat dissipation fins 512 can be selected according to the heat dissipation requirements. Alternatively, heat sinks with different heat dissipation capabilities can be assembled by selecting heat dissipation fins 512 of different densities, which provides high flexibility. Furthermore, the heat dissipation fins 512 increase the surface area of ​​the heat sink and improve the heat dissipation efficiency.

[0160] The beneficial effects that the embodiments of this application may bring include, but are not limited to:

[0161] (1) Since the light source module and the light guide module are the main heat-generating components of the endoscope host device, the heat dissipation efficiency can be improved by using the first heat dissipation module and the second heat dissipation module to dissipate heat in the high heat area, thereby reducing the deformation or damage of the internal components of the device and ensuring the stability and reliability of the endoscope host device under high brightness working conditions.

[0162] (2) A single first heat sink can dissipate heat from the entire side heat-generating area, reducing the number of components, simplifying the internal structure of the endoscope host device, and making the structure more compact. For example, the first heat sink is arranged adjacent to the side light source group, and the structure is made more compact by changing the arrangement position.

[0163] (3) Based on the heat generation of the side light source group, the heat pipes in the high heat area are arranged in a denser manner, and the heat pipes in the low heat area are arranged in a sparser manner. This not only optimizes the heat dissipation path and avoids excessive local temperature, but also avoids unnecessary material waste.

[0164] (4) The second heat sink is configured to dissipate heat from the end face light source, and the second heat pipe transfers heat between the end face light source and the second heat sink. The second heat pipe quickly and evenly transfers the heat from the end face light source to the second heat sink, and the second heat pipe can be bent according to the internal component layout, which makes the arrangement flexible and occupies little space, making the structure more compact.

[0165] (5) By setting a third heat sink at the light source end of the light guide rod, heat dissipation can be provided to the heat-generating components near the light source end, which can effectively prevent the deformation of the heat-generating components and improve the stability and service life of the equipment.

[0166] (6) The heat dissipation fins of the third heat sink are located on one side of the light guide seat on the substrate surface, so that the other side of the substrate can remain flat. This design is conducive to the compact layout between the light guide module and the light source module, reducing unnecessary space occupation.

[0167] (7) The third air path passes through the light source control board, thereby dissipating heat from the light source control board.

[0168] (8) By adjusting the thickness of the substrate by using shims, the contact area and contact pressure between the heat sink and the heat source can be optimized, reducing thermal resistance and improving heat conduction efficiency.

[0169] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

[0170] Furthermore, certain features, structures, or characteristics in one or more embodiments of this specification may be appropriately combined.

[0171] It should be noted that, in order to simplify the descriptions disclosed herein and thus aid in the understanding of one or more embodiments, the foregoing description of embodiments in this specification sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this method of disclosure does not imply that the subject matter of this specification requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0172] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. An endoscope main unit device, characterized in that, The device includes a housing and a light source module and a first heat dissipation module disposed within the housing. The first heat dissipation module is configured to dissipate heat from the light source module. The light source module includes a side light source group and an end light source. A first air path and a second air path are formed within the housing. The first heat dissipation module includes a first heat dissipation unit and a second heat dissipation unit. The first heat dissipation unit includes a first heat sink and a first fan. The first heat sink is configured to dissipate heat from the side light source group. The first fan is disposed adjacent to the rear plate of the housing and is configured to generate a first airflow path through the first heat sink. The rear end face of the first heat sink is disposed adjacent to the first fan. The second heat dissipation unit includes a second heat sink, which is configured to dissipate heat from the end face light source. The second airflow passes through the second heat sink and is offset from the first heat sink.

2. The endoscope main unit device as described in claim 1, characterized in that, The first heat sink is disposed adjacent to the side light source group, and in the front-rear direction of the housing, the length of the first heat sink is greater than the length of the second heat sink.

3. The endoscope main unit device as described in claim 1, characterized in that, The first radiator and the second radiator are staggered in at least one direction of the housing, and the first air passage and the second air passage are isolated from each other.

4. The endoscope main unit device as described in claim 1, characterized in that, The first heat dissipation unit includes a first air guide shroud, which covers at least the front end face and the rear end face of the first heat sink; The first air duct includes a first vent and a second vent provided on the housing, the first vent being located on the rear plate of the housing and the second vent being located on the bottom plate of the housing; The first air guide shroud includes a deflecting air duct located between the first radiator and the second vent, which is used to change the airflow direction between the second vent and the first radiator.

5. The endoscope main unit device as described in claim 1 or 2, characterized in that, The second heat dissipation unit is disposed between the end face light source and the rear plate of the housing. In the left-right direction of the housing, the width of the first heat sink is greater than the width of the second heat sink.

6. The endoscope main unit device as described in claim 5, characterized in that, One side of the first heat sink is adjacent to the light source module, and the other side extends along the left and right direction of the housing and occupies the remaining width of the housing.

7. The endoscope main unit device as described in claim 1, characterized in that, The second air duct includes a third vent and a fifth vent on the housing. The third vent is located on the bottom plate or side of the housing, and the fifth vent is located on the rear plate of the housing.

8. The endoscope main unit device as described in claim 1, characterized in that, The first heat dissipation unit includes at least one heat-conducting plate and at least one heat-conducting pipe. The heat-conducting plate is disposed between the first heat sink and the side light source group, and the heat-conducting pipe is configured to transfer heat from the side light source group to the first heat sink.

9. The endoscope main unit device as described in claim 8, characterized in that, There are multiple heat-conducting plates, each of which is arranged corresponding to the light source of the side light source group. There are multiple heat-conducting pipes, one end of each heat-conducting pipe is connected to a heat-conducting plate, and the other end of each heat-conducting pipe is embedded in the first heat sink. The heat pipe extends backward from the heat-conducting plate into the first heat sink. An installation cavity is formed in front of the heat pipe and in front of the first heat sink. The installation cavity is used to assemble other modules.

10. The endoscope main unit device as described in claim 8, characterized in that, The heat-conducting plate is a single unit, and the heat-conducting plate includes a positioning part. The first heat sink includes a mating part, and the positioning part and the mating part form a limiting fit, so that the heat-conducting plate and the first heat sink are connected at a preset relative position; and... The area of ​​the heat exchange surface of the heat-conducting plate is greater than or equal to the area of ​​the heating area of ​​the side light source group, and the heat-conducting pipe is disposed on at least one side of the heat-conducting plate and extends along the side of the heat-conducting plate.

11. The endoscope main unit device as described in claim 1, characterized in that, The endoscope main unit also includes a light guide module and a second heat dissipation module, wherein the second heat dissipation module is configured to dissipate heat from the light guide module. The second heat dissipation module includes a third air guide shroud and a third fan. The third fan is configured to form a third airflow path within the third air guide shroud. The third air guide shroud is constructed through a channel structure, or it is constructed through at least two air guide vanes.

12. The endoscope main unit device as described in claim 1, characterized in that, The endoscope host device further includes a control module and a third heat dissipation module, the third heat dissipation module being configured to dissipate heat from the control module; and / or, The endoscope host device also includes at least one sensor, a temperature controller, and a second heat dissipation module. The sensor is used to collect the temperature of the light source module and / or the light guide module of the endoscope host device. The temperature controller is configured to control the operating power of the first heat dissipation module and the second heat dissipation module based on the temperature collected by the sensor.

13. An endoscope main unit device, characterized in that, The device includes a housing and a light source module and a first heat dissipation module disposed within the housing. The first heat dissipation module includes a first heat dissipation unit, which includes a first radiator and a first fan. The first radiator is configured to dissipate heat from the side light source group of the light source module. The first fan is disposed adjacent to the rear plate of the housing and is configured to generate a first airflow path passing through the first radiator. The rear end face of the first radiator is disposed adjacent to the first fan. One side of the first radiator is adjacent to the light source module, and the other side extends along the left-right direction of the housing and occupies the remaining width within the housing.

14. The endoscope main unit device as described in claim 13, characterized in that, The first heat dissipation unit includes a first air guide shroud, which covers at least the front end and rear end of the first heat sink.

15. The endoscope main unit device as described in claim 14, characterized in that, The first air duct includes a first vent and a second vent provided on the housing, the first vent being located on the rear plate of the housing and the second vent being located on the bottom plate of the housing; The first air guide shroud includes a deflecting air duct located between the first radiator and the first vent, which is used to change the airflow direction between the first vent and the first radiator.

16. The endoscope main unit device as described in claim 13, characterized in that, The first heat dissipation module further includes a second heat dissipation unit, and the light source module further includes an end face light source. The second heat dissipation unit is disposed between the end face light source and the rear plate of the housing and is configured to dissipate heat from the end face light source.

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