Laser pumping dispensing equipment and dispensing control method

Abstract

The invention discloses a laser pumping dispensing device and a dispensing control method, and relates to the technical field of laser pumping packaging, the laser pumping dispensing device is used for coating glue on a pumping base, the laser pumping dispensing device comprises a chip attaching mechanism, the chip attaching mechanism comprises a machine table, a laser pump and a dispensing control device, a feeding station and a laminating station are formed on the base; the glue spraying part is movably mounted on the machine table; the upper range finder is used for measuring Z-axis coordinate information of the material; the fitting positioning camera is used for acquiring second horizontal position information of a fitting area on the pump base at the fitting station; the moving module is used for driving the glue spraying part, the upper distance measuring instrument and the laminating positioning camera to move relative to the machine table; the controller is electrically connected with the glue spraying part, the moving module, the upper distance measuring instrument and the laminating positioning camera; according to the technical scheme provided by the invention, the gluing precision and uniformity are ensured, and the gluing efficiency is also ensured.

Description

Technical Field

[0001] This invention relates to the field of laser pumping and packaging technology, and in particular to a laser pumping dispensing equipment and dispensing control method. Background Technology

[0002] With the development of semiconductor laser technology, semiconductor lasers are widely used in cutting, welding, and cladding technologies, leading to an increasing demand for high-power pumps. However, the continuous increase in semiconductor laser chip power results in greater heat generation, placing increasingly stringent requirements on heat dissipation performance during chip packaging. To address the heat dissipation bottleneck at high power densities, a new nano-silver adhesive process is needed to replace traditional welding materials. Nano-silver adhesive can significantly reduce laser junction temperature, improve output power, efficiency, and lifespan, while ensuring stable low-resistance electrical contacts. This process has become one of the key technologies for improving semiconductor laser performance.

[0003] Currently, this new process cannot be completed manually and meets the actual mass production requirements; the dispensing accuracy of chip bonding is difficult to meet the requirements, which can easily lead to uneven glue application, affecting the chip connection strength and accuracy, and causing uneven glue overflow around the chip. Summary of the Invention

[0004] The main objective of this invention is to provide a laser-pumped dispensing device and a dispensing control method, which aims to ensure dispensing efficiency, dispensing accuracy, and dispensing uniformity.

[0005] To achieve the above objectives, the present invention proposes a laser pump dispensing device for applying adhesive to a pump base. The laser pump dispensing device includes a chip bonding mechanism, which comprises: The machine has a material loading station and a bonding station; The glue spraying unit is movably mounted on the machine base; The rangefinder is used to measure the Z-axis coordinate information of the material; A bonding positioning camera is used to obtain second horizontal position information of the bonding area on the pump base at the bonding station; A movable module for driving the glue spraying unit, the upper rangefinder, and the bonding positioning camera to move relative to the machine platform; and... The controller is electrically connected to the glue spraying unit, the moving module, the upper rangefinder, and the bonding and positioning camera.

[0006] In the above scheme, the loading station of the machine is used for chip loading, the bonding station is used for positioning the pump base, and the moving module is connected to the machine to drive the glue spraying unit, the upper rangefinder, and the bonding positioning camera to move. The glue spraying unit is used to spray glue on the bonding area on the pump base. The upper rangefinder is set downwards to accurately measure the Z-axis coordinate information of the material. The bonding positioning camera is used to position the horizontal position of the bonding area on the pump base. The combined use of the rangefinder and the positioning camera can achieve accurate positioning of the three-dimensional coordinates of the bonding area on the pump base. By controlling the coordinated work of the various components of the equipment through the controller, it can replace manual chip placement operation and greatly improve the chip placement efficiency and placement accuracy.

[0007] In one embodiment, the laser-pumped dispensing equipment further includes: A vacuum suction cup, located at the bonding station, is equipped with several positioning components for positioning the pump base; and... A loading stand is provided at the loading station, and the loading stand has several workpiece slots for positioning the laser chip.

[0008] In one embodiment, the positioning element includes an X-axis positioning block and a Y-axis positioning block, both of which are detachably mounted on the vacuum suction cup.

[0009] In one embodiment, the machine base is detachably provided with a plurality of limiting blocks, and the outer ring of the vacuum suction cup is provided with a plurality of positioning slots for cooperating with the limiting blocks.

[0010] In one embodiment, the feeding seat includes a material tray with a mounting slot. The bottom of the mounting slot has a vacuum adsorption port for connecting to a vacuum device, and a sealing ring is provided at the bottom of the mounting slot on the outer ring of the vacuum adsorption port.

[0011] In one embodiment, a chip box is engaged in the mounting slot, the top surface of the chip box has a plurality of workpiece slots, and the bottom surface of the chip box rests on the sealing ring.

[0012] The present invention also proposes a dispensing control method, based on the above-mentioned laser-pumped dispensing equipment, the dispensing control method comprising the following steps: Obtain the second horizontal position information and the second height information of the attachment area on the pump base; The movement of the mobile module is controlled according to the second height information to move the glue spraying part to the glue dispensing height corresponding to the application area; Based on the second horizontal position information of the application area, the glue dispensing trajectory coordinates are determined; the glue dispensing trajectory coordinates include an initial point, an open glue spray point, a start glue point, a closed glue spray point, an end glue point, and an end point distributed sequentially, wherein the start glue point and the end glue point correspond to the two endpoints of the glue segment on the application area; According to the dispensing trajectory coordinates, the dispensing unit 12 is controlled to move from the initial point to the end point. An opening command for the dispensing valve is issued at the opening dispensing point, and a closing command for the dispensing valve is issued at the closing dispensing point. During the process from the initial dispensing point to the end dispensing point, the dispensing unit 12 is controlled to move at a constant speed. The second height information refers to the distance between the upper end of the affixing area of ​​the pump base and the upper rangefinder.

[0013] In the above scheme, by acquiring the second horizontal position information and the second height information, the controller can calculate the Z-axis movement parameters of the glue spraying part from the glue dispensing height, and then control the moving module to move the glue spraying part. Based on the second horizontal position information, the controller can calculate the position coordinates of the initial point, the start glue spraying point, the start glue point, the close glue spraying point, the end glue point, and the end point of the glue dispensing trajectory coordinates, and control the moving module to move the glue spraying part from the initial point to the end point. At the start glue spraying point, an open glue valve command is issued, and at the close glue spraying point, a close glue valve command is issued. The glue spraying part moves at a uniform speed between the start glue point and the end glue point to ensure that the width of the glue segment is consistent, thereby ensuring the uniformity of the glue layer after chip mounting and consistent glue overflow around the chip.

[0014] In one embodiment, determining the dispensing trajectory coordinates based on the second horizontal position information of the application area includes: Based on the second horizontal position information of the application area, determine four sets of adhesive trajectory coordinates; The initial points of the four sets of dispensing trajectory coordinates are distributed along a rectangle, and the ending points of the four sets of dispensing trajectory coordinates are all located at the center of the rectangle; and / or, Each segment of the adhesive is a straight line.

[0015] The step of controlling the glue spraying unit 12 to move from the initial point to the end point according to the glue dispensing trajectory coordinates includes: The glue spraying unit 12 is controlled to sequentially dispense glue along four sets of glue dispensing trajectory coordinates to form four glue segments on the pump base; wherein the four glue segments are distributed along the diagonal of a rectangle.

[0016] The initial points of the four sets of dispensing trajectory coordinates are distributed along a rectangle, and the ending points of the four sets of dispensing trajectory coordinates are all located at the center of the rectangle. The adhesive segments are distributed along the diagonal of the rectangle, which ensures the consistency and uniformity of the adhesive segments, thereby ensuring the bonding effect of the laser chip.

[0017] In one embodiment, the distance between the initial point and the starting glue point is greater than the distance of the acceleration segment of the moving module, so as to ensure that the moving module enters a constant speed state before the starting glue point. The calculation formula for the acceleration segment is as follows:

[0018] in, The set constant velocity, in mm / s; To reach the speed from the initial point Time required, in seconds; The distance of the acceleration phase is in mm; Peak acceleration, in units ; The coefficient is used to select values.

[0019] By calculating the distance of the acceleration section, the distance between the initial point and the starting glue dot is made greater than the distance of the acceleration section, so as to ensure that the moving speed of the glue spraying part is uniform during the glue segment formation process, thereby ensuring the consistency of the glue segment width.

[0020] The technical solution of this invention uses a bonding positioning camera to obtain the horizontal position information of the laser pump, uses an upper rangefinder to test the Z-axis position information of the pump base, and processes and calculates the above position information through a controller to control the moving module and the glue spraying unit to spray glue onto the bonding station of the pump base, which ensures both the accuracy and uniformity of glue application and the efficiency of glue application. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the structure of an embodiment of the laser-pumped patch assembly equipment and the laser-pumped dispensing equipment provided by the present invention; Figure 2 This is a schematic diagram of the span test of the upper and lower rangefinders in the embodiment; Figure 3 This is a schematic diagram of the test steps for an embodiment of the upper and lower rangefinders in this invention; Figure 4 A schematic diagram of the dispensing trajectory coordinates of an embodiment of the laser-pumped dispensing equipment provided by the present invention; Figure 5 This is a displacement-velocity curve of the dispensing process in one embodiment of the present invention; Figure 6 This is a dispensing trajectory diagram in one embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of an embodiment of the feeding seat in this invention; Figure 8 This is a schematic diagram of the structure of an actual dispensing segment in this invention. Figure 9 This is a schematic diagram of the structure of one embodiment of the suction nozzle in this invention; Figure 10 This is a schematic diagram of the structure of one embodiment of the vacuum suction cup in the invention; Figure 11 This is a schematic diagram of the structure of one embodiment of the controller in the invention; Figure 12 A flowchart of a patch control method in one embodiment of the invention; Figure 13 This is a flowchart of a dispensing control method in one embodiment of the invention.

[0023] Explanation of icon numbers: 1. Machine base; 101. Loading station; 102. Bonding station; 2. Suction nozzle; 201. Vacuum suction port; 202. Clearance groove; 3. ZR module; 4. 3D moving module; 5. Upper rangefinder; 6. Lower rangefinder; 7. Material picking positioning camera; 8. Bonding positioning camera; 9. Calibration positioning camera; 10. Vacuum suction cup; 1001. Positioning slot; 1002. Limiting block; 1003. Vacuum adsorption hole two; 11. Loading seat; 1101. Workpiece slot; 1102. Material tray; 1103. Mounting slot; 1104. Vacuum adsorption hole one; 1105. Sealing ring; 1106. Chip box; 12. Glue spraying section; 13. X-axis positioning block; 14. Y-axis positioning block; 15. Laser chip; 16. Pump base; 2001. Processor; 2002. Communication bus; 2003. User interface; 2004. Network interface; 2005. Memory.

[0024] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0026] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0028] like Figure 1 This invention proposes a laser pumping and patching device for mounting a laser chip 15 onto a pump base 16. The laser pumping and patching device includes: Machine 1 has a feeding station 101 and a bonding station 102; An adsorption unit is movably mounted on the machine base 1 and is used to pick up and place the laser chip 15. The upper distance measuring instrument 5 and the lower distance measuring instrument 6 are arranged opposite each other in the vertical direction to measure the Z-axis coordinate information of the material between the upper distance measuring instrument 5 and the lower distance measuring instrument 6; The material handling and positioning camera 7 is used to acquire the first horizontal position information of the laser chip 15 at the loading station 101. The bonding positioning camera 8 is used to obtain second horizontal position information of the bonding area on the pump base 16 at the bonding station 102. The positioning camera 9 is used to obtain the third horizontal position information of the laser chip 15; A moving module is used to drive the adsorption unit, the upper rangefinder 5, the material picking and positioning camera 7, the bonding and positioning camera 8, and the calibration and positioning camera 9 to move relative to the machine base 1; and The controller is electrically connected to the moving module, the upper rangefinder 5, the lower rangefinder 6, the material picking and positioning camera 7, the bonding and positioning camera 8, and the calibration and positioning camera 9.

[0029] In one of the laser pumping and bonding equipment solutions described above, the loading station 101 of the machine base 1 is used for chip loading, and the bonding station 102 is used for positioning the pump base 16. A moving module is connected to the machine base 1, driving the adsorption unit, the upper rangefinder 5, the material picking and positioning camera 7, the bonding and positioning camera 8, and the calibration and positioning camera 9 to move. The adsorption unit can pick up and put down the laser chip 15, thereby realizing the movement and bonding of the laser chip 15. The upper rangefinder 5 and the lower rangefinder 6 are arranged opposite each other in the vertical direction, that is, the upper rangefinder 5 is set downwards and the lower rangefinder 6 is set upwards, for accurate measurement of materials. Z-axis coordinate information is used to locate the horizontal position of the laser chip 15 and the horizontal position of the bonding area on the pump base 16, respectively. The combined use of the rangefinder and the positioning camera enables precise positioning of the material's three-dimensional coordinates, replacing manual operation and improving bonding efficiency. The calibration positioning camera 9 is used to correct the positioning after the laser chip 15 shifts relative to the adsorption part, updating the third horizontal position information of the laser chip 15. By controlling the coordinated operation of various components of the equipment through the controller, manual bonding operations can be replaced, greatly improving chip bonding efficiency and bonding accuracy. In this embodiment, the calibration positioning camera 9 is set upwards.

[0030] The present invention also proposes a laser pump dispensing device for applying adhesive to a pump base 16, the laser pump dispensing device including a chip bonding mechanism, the chip bonding mechanism comprising: Machine 1 has a feeding station 101 and a bonding station 102; The glue spraying unit 12 is movably mounted on the machine base 1; The upper rangefinder 5 is used to measure the Z-axis coordinate information of the material; The bonding positioning camera 8 is used to obtain second horizontal position information of the bonding area on the pump base 16 at the bonding station 102. A movable module is used to drive the glue spraying unit 12, the upper rangefinder 5, and the bonding positioning camera 8 to move relative to the machine base 1; and... The controller is electrically connected to the glue spraying unit 12, the moving module, the upper rangefinder 5, and the bonding and positioning camera 8.

[0031] In the above scheme, the loading station 101 of the machine 1 is used for chip loading, and the bonding station 102 is used for positioning the pump base 16. The moving module is connected to the machine 1 and drives the glue spraying unit 12, the upper rangefinder 5, and the bonding positioning camera 8 to move. The glue spraying unit 12 is used to spray glue on the bonding area on the pump base 16. The upper rangefinder 5 is set downwards to accurately measure the Z-axis coordinate information of the material. The bonding positioning camera 8 is used to position the horizontal position of the bonding area on the pump base 16. The combined use of the rangefinder and the positioning camera realizes the accurate positioning of the three-dimensional coordinates of the bonding area on the pump base 16. By controlling the coordinated work of the various components of the equipment through the controller, it can replace manual chip bonding operation and greatly improve the chip bonding efficiency and bonding accuracy.

[0032] In this laser pump dispensing equipment and laser pump patching equipment, the machine base 1, upper rangefinder 5, bonding and positioning camera 8, moving module, and controller are common components, and their corresponding structural settings can be adjusted synchronously. One laser pump dispensing equipment adds a glue spraying section 12 to the aforementioned common components to achieve glue application to the pump base 16.

[0033] In this embodiment, the laser-pumped dispensing equipment further includes: A vacuum suction cup 10 is disposed at the bonding station 102, and the vacuum suction cup 10 is provided with a plurality of positioning elements for positioning the pump base 16; and... A loading seat 11 is provided at the loading station 101. The loading seat 11 has a plurality of workpiece slots 1101 for positioning the laser chip 15.

[0034] The vacuum chuck 10 has several vacuum adsorption holes 1003 for connecting to vacuum equipment, thereby providing suction to hold the pump base 16. It works with the positioning component to position the pump base 16, which is convenient for dispensing and bonding. The loading seat 11 uses the workpiece groove 1101 to initially position the laser chip 15, which is convenient for the adsorption part to adsorb the chip one by one and complete the bonding work.

[0035] like Figure 10 In this embodiment, the positioning element includes an X-axis positioning block 13 and a Y-axis positioning block 14, both of which are detachably mounted on the vacuum suction cup 10.

[0036] The X-axis positioning block 13 and the Y-axis positioning block 14 work together with the vacuum suction hole 1003 to position the pump base 16, preventing the pump base 16 from moving during dispensing and bonding, and ensuring the accuracy of dispensing and bonding. The X-axis positioning block 13 and the Y-axis positioning block 14 are connected to the vacuum suction cup 10 by bolts.

[0037] In this embodiment, the machine base 1 is detachably provided with a plurality of limiting blocks 1002, and the outer ring of the vacuum suction cup 10 is provided with a plurality of positioning slots 1001 for cooperating with the limiting blocks 1002.

[0038] A limiting block 1002 is bolted to the machine base 1. The limiting block 1002 cooperates with the positioning groove 1001 on the outer ring of the vacuum suction cup 10 to realize the connection and positioning between the vacuum suction cup 10 and the machine base 1.

[0039] like Figure 7 In an embodiment, the feeding seat 11 includes a material tray 1102, the material tray 1102 is provided with a mounting slot 1103, the bottom of the mounting slot 1103 is provided with a vacuum adsorption hole 1104 for connecting a vacuum device, and the bottom of the mounting slot 1103 is provided with a sealing ring 1105 located on the outer ring of the vacuum adsorption hole 1104.

[0040] A chip box 1106 is fitted into the mounting slot 1103. The top surface of the chip box 1106 has several workpiece slots 1101, and the bottom surface of the chip box 1106 is placed on the sealing ring 1105.

[0041] A mounting slot 1103 is provided on the tray 1102 to engage and position the chip box 1106. A vacuum suction hole 1104 at the bottom of the mounting slot 1103 provides suction to the bottom of the chip box 1106, maintaining stable positioning of the chip box 1106 during placement. A sealing ring 1105 supports the bottom of the chip box 1106 and ensures effective suction between the vacuum suction hole 1104 and the chip box 1106. A workpiece slot 1101 is provided on the chip box 1106 to hold the laser chip 15, facilitating rapid positioning and batch placement of the laser chip 15.

[0042] like Figure 9 In this embodiment, the adsorption unit includes: The nozzle 2 has a plurality of vacuum suction ports 201 at its output end, and a void-avoiding groove 202 is provided between the plurality of vacuum suction ports 201. The mobile module includes: ZR module 3 is used to adjust the Z-axis position and angle of the suction nozzle 2 to adjust the position coordinates of the laser chip 15, and... The three-dimensional moving module 4 is used to drive the ZR module 3 to move relative to the machine base 1.

[0043] The adsorption unit is connected to a vacuum device, and the laser chip 15 is adsorbed through the vacuum suction port 201 on the suction nozzle 2. The anti-cavity groove 202 on the suction nozzle 2 is used to avoid the structural part in the middle of the laser chip 15 to avoid interference. Two rectangular vacuum suction ports 201 are symmetrically arranged on each suction nozzle 2. The three-dimensional movement module 4 of the moving module is used to synchronously drive the adsorption unit, the glue spraying unit 12, the upper rangefinder 5, the material picking and positioning camera 7, the bonding positioning camera 8, and the calibration positioning camera 9 to move relative to the machine base 1. On this basis, the ZR module 3 independently realizes the Z-axis position adjustment and horizontal rotation angle adjustment of the suction nozzle 2, thereby achieving precise position adjustment of the laser chip 15 and ensuring the accuracy of the bonding.

[0044] like Figure 12 The present invention also proposes a patch control method, based on the above-mentioned laser-pumped patch device, the patch control method comprising the following steps: S100: After calibrating the span between the upper rangefinder 5 and the lower rangefinder 6 in the vertical direction, the first horizontal position information and the first height position information of the laser chip 15 at the loading station 101 are obtained. Obtain the second horizontal position information and the second height information of the bonding area on the pump base 16 at the bonding station 102; S200: Determine the target Z-axis movement parameters of the laser chip 15 based on the span, the first height position information, the second height information, and the preset glue thickness parameters; S300: After dispensing adhesive on the pump base 16, the moving module is controlled to move according to the first horizontal position information and the second horizontal position information to move the laser chip 15 to be aligned with the bonding area. S400: Control the movement of the moving module according to the target Z-axis movement parameters to move the laser chip 15 onto the colloid pressed onto the pump base 16; Wherein, the first height position information is the distance between the bottom of the laser chip 15 and the lower rangefinder 6, and the second height information is the distance between the upper end of the attachment area of ​​the pump base 16 and the upper rangefinder 5.

[0045] In the above scheme, the span between the upper rangefinder 5 and the lower rangefinder 6 in the vertical direction is calibrated, that is, the distance between the upper rangefinder 5 and the lower rangefinder 6 in the vertical direction is fixed. The span remains a constant value during the subsequent bonding process. The first horizontal position information of the laser chip 15 and the second horizontal position information of the pump base 16 are obtained by the material picking positioning camera 7 and the bonding positioning camera 8. The laser chip 15 can be adsorbed by the first horizontal position information. The controller calculates the horizontal displacement parameters based on the first horizontal position information and the second horizontal position information. Based on the span, the first height position information, the second height information, and the preset adhesive thickness parameters, the target Z-axis movement parameters of the current height of the computer chip and the height after reaching the preset adhesive thickness can be obtained. After dispensing, the controller controls the moving module to move the laser chip 15 horizontally to the relative position of the mounting area on the laser pump through the horizontal displacement parameters. Then, the laser chip 15 is pressed onto the adhesive on the pump base 16 through the target Z-axis movement parameters, thus completing the mounting according to the mounting requirements. The mounting efficiency is high and the precision is high.

[0046] In an embodiment, after controlling the movement of the moving module according to the target Z-axis movement parameters to move the laser chip 15 onto the colloid pressed against the pump base 16, the method further includes: S410: Obtain the actual pressure value of the adsorption section; When the actual pressure value is greater than a preset threshold, the laser pump patch device is controlled to enter an anti-collision mode, and in the anti-collision mode, the moving module is controlled to lift the laser chip 15.

[0047] During the bonding process where the laser chip 15 moves onto the adhesive pressed against the pump base 16, the pressure sensor in the ZR module monitors the pressure on the nozzle in real time to prevent the pressure value from exceeding a preset threshold and damaging the chip. The preset threshold can be set according to the chip type and installation requirements. If the actual pressure value does not exceed the preset threshold, the device will perform the bonding step normally.

[0048] In this embodiment, after obtaining the second horizontal position information and the second height information of the bonding area on the pump base 16 at the bonding station 102, the method further includes: S101: Control the mobile module to move the laser chip 15 to the upper end of the mounting area on the pump base 16, and obtain the third height information of the distance between the upper rangefinder 5 and the upper end of the laser chip 15. After controlling the movement of the moving module according to the target Z-axis movement parameters to move the laser chip 15 onto the colloid pressed against the pump base 16, the method further includes: S420: Obtain the fourth height information between the upper surface of the laser chip 15 after it has been attached and the upper rangefinder 5; S430: Determine the actual thickness value of the colloid based on the third height information and the fourth height information; A prompting command is determined based on the actual thickness value of the colloid and output to the prompting device. This includes: When the actual thickness of the colloid is less than 0.03mm or greater than 0.05mm, a non-compliance command is generated and output to the prompting device; When the actual thickness of the colloid is greater than or equal to 0.03 mm and less than or equal to 0.05 mm, a qualified instruction is generated and output to the prompting device.

[0049] The third and fourth height information are obtained through testing. The difference is then calculated to obtain the actual thickness value of the colloid, avoiding errors caused by colloid deformation after patching. An instruction is output to the prompting device so that personnel can easily know the actual thickness value of the colloid. Through testing, the actual thickness of the colloid can be controlled within the range of greater than or equal to 0.03mm and less than or equal to 0.05mm, ensuring product accuracy.

[0050] In this embodiment, before the step of acquiring the first horizontal position information and the first height position information of the laser chip 15 at the loading station 101, the method further includes: S001: After placing the standard gauge block between the upper rangefinder 5 and the lower rangefinder 6, obtain the first calibration height of the upper rangefinder 5 to the upper end face of the standard gauge block, and the second calibration height of the lower rangefinder 6 to the lower end face of the standard gauge block. The span between the upper rangefinder 5 and the lower rangefinder 6 in the vertical direction is determined based on the thickness of the gauge block, the first calibration height, and the second calibration height.

[0051] By placing a standard gauge block between the upper rangefinder 5 and the lower rangefinder 6, the actual span between the two instruments can be tested and calculated, which facilitates subsequent calculations.

[0052] In an embodiment, after the steps of controlling the moving module to move the laser chip 15 to the upper end of the mounting area attached to the pump base 16 and obtaining the third height information of the distance between the upper rangefinder 5 and the upper end of the laser chip 15, the method further includes: S102: controlling the moving module to move the laser chip 15 to the calibration positioning camera 9, obtaining the third horizontal position information of the laser chip 15, and controlling the moving module to perform calibration.

[0053] The first, second, and third horizontal position information are all XYR two-dimensional coordinate information.

[0054] After the moving module re-controls the nozzle to adsorb the laser chip 15, the position parameters of the laser chip 15 change slightly. By calibrating the positioning camera 9, the third horizontal position information of the laser chip 15 is retested, and the XYR axis relative movement parameters of the laser chip 15 relative to the bonding area of ​​the pump base 16 are calculated. The moving module is then controlled to move the laser chip 15 accordingly, thereby achieving precise bonding of the laser chip 15.

[0055] like Figure 13 The present invention also proposes a dispensing control method, based on the above-mentioned laser-pumped dispensing equipment, the dispensing control method comprising the following steps: S110: Obtain the second horizontal position information and the second height information of the attachment area on the pump base 16; The movement of the mobile module is controlled according to the second height information to move the glue spraying part 12 to the glue dispensing height corresponding to the application area; S160: Determine the glue dispensing trajectory coordinates based on the second horizontal position information of the pasting area; the glue dispensing trajectory coordinates include an initial point, an open glue spray point, a start glue point, a closed glue spray point, an end glue point, and an end point distributed sequentially, wherein the start glue point and the end glue point correspond to the two endpoints of the glue segment on the pasting area; S210: Based on the dispensing trajectory coordinates, control the dispensing unit 12 to move from the initial point to the end point, issue an opening command for the dispensing valve at the opening dispensing point, and issue a closing command for the dispensing valve at the closing dispensing point; control the dispensing unit 12 to move at a constant speed during the process from the initial dispensing point to the end dispensing point. The second height information is the distance between the upper end of the attachment area of ​​the pump base 16 and the upper rangefinder 5.

[0056] In the above scheme, by acquiring the second horizontal position information and the second height information, the controller can calculate the Z-axis movement parameters of the glue spraying unit 12 from the glue dispensing height, and then control the moving module to move the glue spraying unit 12. According to the second horizontal position information, the controller can calculate the position coordinates of the initial point, the start glue spraying point, the start glue point, the close glue spraying point, the end glue point, and the end point of the glue dispensing trajectory coordinates, and control the moving module to move the glue spraying unit 12 from the initial point to the end point. At the start glue spraying point, an open glue valve command is issued, and at the close glue spraying point, a close glue valve command is issued. The glue spraying unit moves at a uniform speed between the start glue point and the end glue point to ensure that the width of the glue segment is consistent, thereby ensuring the uniformity of the glue layer after chip mounting and consistent glue overflow around the chip.

[0057] In this embodiment, determining the dispensing trajectory coordinates based on the second horizontal position information of the application area includes: S161: Determine four sets of adhesive dispensing trajectory coordinates based on the second horizontal position information of the application area; The initial points of the four sets of dispensing trajectory coordinates are distributed along a rectangle, and the ending points of the four sets of dispensing trajectory coordinates are all located at the center of the rectangle; and / or, Each segment of the adhesive is a straight line.

[0058] The step of controlling the glue spraying unit 12 to move from the initial point to the end point according to the glue dispensing trajectory coordinates includes: The glue spraying unit 12 is controlled to sequentially dispense glue along four sets of glue dispensing trajectory coordinates to form four glue segments on the pump base 16; wherein the four glue segments are distributed along the diagonal of a rectangle.

[0059] The initial points of the four sets of dispensing trajectory coordinates are distributed along a rectangle, and the ending points of the four sets of dispensing trajectory coordinates are all located at the center of the rectangle. The adhesive segments are distributed along the diagonal of the rectangle, which ensures the consistency and uniformity of the adhesive segments, thereby ensuring the bonding effect of the laser chip 15.

[0060] In this embodiment, the distance between the initial point and the starting adhesive point is greater than the distance of the acceleration segment of the moving module, so as to ensure that the moving module enters a constant speed state before the starting adhesive point. The calculation formula for the acceleration segment is as follows:

[0061] in, The set constant velocity, in mm / s; To reach the speed from the initial point Time required, in seconds; The distance of the acceleration phase is in mm; Peak acceleration, in units ; The coefficient is used to select values.

[0062] By calculating the distance of the acceleration section, the distance between the initial point and the starting glue point is made greater than the distance of the acceleration section, so as to ensure that the moving speed of the glue spraying part 12 is uniform during the glue segment formation process, thereby ensuring the consistency of the glue segment width.

[0063] like Figure 2 Before the equipment is put into formal production, the upper distance measuring instrument 5 and the lower distance measuring instrument 6 need to be adjusted to a coaxial state and calibrated. The distance between the upper distance measuring instrument 5 and the lower distance measuring instrument 6 is then calculated as h1 + δ1 + h2. The relative distance between them remains constant during the operation of the equipment. Here, δ1 is the thickness of the gauge block, h1 is the distance between the upper distance measuring instrument 5 and the gauge block, and h2 is the distance between the lower distance measuring instrument 6 and the gauge block.

[0064] Then, the pump base 16 is manually placed into the bonding station 102 for coarse positioning and vacuum adsorption. The chip picking and positioning camera 7 moves to the chip loading position to take pictures, and the suction nozzle 2 moves to the chip loading position to pick up the chip. After the suction nozzle 2 adsorbs the chip, it moves to the top of the lower distance measuring instrument 6 and measures the distance h3 between the bottom of the chip and the lower distance measuring instrument 6, which is the first height position information. The upper distance measuring instrument 5 moves to the area on the product to be glued on the bonding station 102 to measure the distance. Four data points are measured in each bonding area, and the average value is calculated to obtain the distance h4 between the upper distance measuring instrument 5 and the bonding area of ​​the pump base 16, which is the second height information. Then, the chip bonding and positioning camera 8 moves to the bonding area to take pictures and position it. The suction nozzle 2 attaches the chip to the area to be glued on. The upper distance measuring instrument 5 moves to the top of the chip and measures four points, and the average value is calculated to obtain the distance h5 between the top of the chip and the top of the chip, which is the third height information. After the measurement is completed, the suction nozzle 2 moves the chip to the top of the lower chip calibration and positioning camera 9 to take pictures and obtain the chip's XYR two-dimensional coordinate information.

[0065] The nozzle 2 picks up the chip in the area to be dispensed with adhesive. The dispensing unit 12 includes a piezoelectric dispensing valve, which moves to the area to be dispensed. The controller includes a host computer, which obtains a map of the dispensing trajectory coordinates of the area to be dispensed by taking a visual image through a chip bonding camera. Figure 4 First, the piezoelectric jet valve, under the action of the XY axes of the moving module, begins linear interpolation motion from point a. The motion control card monitors the actual position of the encoder in real time in the background. When the piezoelectric jet valve moves to point b, the host computer sends an open glue valve command to the piezoelectric jet valve; when the piezoelectric jet valve moves to point d, the host computer sends a close glue valve command to the piezoelectric jet valve. Finally, the piezoelectric jet valve moves to the center point o of the glue dispensing area and stops, thus completing the glue dispensing between the straight lines ce. The same method can be used to complete the glue dispensing of three straight lines: hj, mp, and su. Finally, the glue dispensing area forms a total of four glue trajectory lines: ce, hj, mp, and su. During the equipment debugging process, the host computer controls eight line segments (ac, eo, fh, jo, km, po, qs, and uo) at appropriate distances to ensure that the glue spraying process is consistently at a uniform speed. Figure 5 , Figure 6 In the host computer, eight line segments, namely bc, de, gh, ij, lm, np, rs, and tu, are set at appropriate distances. Figure 5 middle, The displacements at points b, c, d, e, and o are respectively. The arrival times at points b, c, d, e, and o are sequentially used to compensate for the valve opening and closing signal delays, ensuring the accuracy and consistency of the droplet width W and length L within the predetermined trajectory area. Figure 8 .

[0066] During the dispensing process, point 'a' is the initial position of the axis movement, which is estimated manually and then set. The X and Y axes start from point 'a' and perform an interpolation S-curve acceleration. Since the calculation of the acceleration distance of the S-curve is theoretically very complex, involving piecewise integration, a more pragmatic trapezoidal approximation method is used in actual debugging. The formula for calculating the acceleration segment distance is as follows:

[0067] The average acceleration of the S-curve is approximately 70%-80% of the peak acceleration, and the distance between points A and C is S. ac S1*1.2 (1.2 is the safety factor) to ensure that the shaft is 100% in a constant velocity V0 state before entering point c; in, The set constant velocity, in mm / s; To reach the speed from the initial point Time required, in seconds; The distance of the acceleration phase is in mm; Peak acceleration, in units ; This is the coefficient, with a value of 75%.

[0068] Point b marks the location where the glue spraying command is issued. The output port of the motion control card is directly electrically connected to the input port of the piezoelectric injection valve, completely bypassing the latency of the non-real-time Windows operating system and C# application. The main latency is the delay of the fixed mechanical action of the piezoelectric injection valve. During actual debugging, S is set in the host computer software. ac >S bc The distance S between bc bc This is a fixed value derived from actual debugging based on the actual acceleration phase speed and response delay time t4; Point c is the initial position of the glue, which is determined manually based on the actual process effect. Point d is the location where the glue-off command is issued, and the distance S between d and d is... de This is a fixed value obtained from actual debugging based on the actual uniform speed stage speed V0 and the fixed mechanical action delay response time t4 of the injection valve; Point e is the endpoint of the glue application, which is determined manually based on the actual process effect. o represents the stopping position of the axis movement, and the coordinates of the center point of the dispensing area calculated by visual positioning.

[0069] The acceleration phase distance S between AC is set in the host computer.ac The distance S between bc for premature glue separation bc The length S of the adhesive line between ce ce The advance closing distance S between the glue spraying speed V0 and de de The deceleration phase distance S between eo eo By utilizing the position-based comparison output function of the motion control card, a specific command is triggered when the axis moves to the specified coordinate position. The manual process parameter values ​​are set through the host computer interface to ensure that the glue can form glue lines with uniform line width and precise position between CE.

[0070] The droplet spacing d = v / f, where f is the frequency of the pressure-point injection valve and v is the instantaneous velocity during adhesive spraying. During the acceleration phase, the velocity increases, and since the injection frequency f remains constant, the droplet spacing increases while the adhesive line width gradually narrows. During the deceleration phase, the velocity decreases, and since the injection frequency f remains constant, the droplet spacing decreases while the adhesive line width gradually widens. During the uniform speed phase, because the injection frequency f remains constant, the droplet spacing also remains constant, and the adhesive line width remains uniform, thus ensuring consistent adhesive overflow after patch application.

[0071] When spraying glue at a constant speed, increasing the speed v can increase the distance between glue droplets, making the glue line width thinner overall; decreasing the speed v can decrease the distance between glue droplets, making the glue line width thicker overall.

[0072] After dispensing is complete, the host computer acquires the coordinate information of the chip bonding camera and calculates the XYR two-dimensional coordinates of the chip bonding. The host computer also acquires the preset control adhesive thickness data δ (0.03mm < δ < 0.05mm) and the measurement data from the upper and lower rangefinders, calculating the target Z-axis movement parameter h7 = (h1 + δ1 + h2) - h3 - h4 + δ = h1 + δ1 + h2 + δ - h3 - h4. Here, the height value of h7 is the Z-axis coordinate relative to when the nozzle is directly above the lower rangefinder. When h7 > 0, the Z-axis rises; when h7 < 0, the Z-axis falls. Real-time testing by the upper and lower rangefinders during each bonding process avoids assembly errors caused by thickness deviations in the laser chip 15, improving bonding accuracy. After the host computer acquires and calculates the chip's three-dimensional coordinates (XYZR), the nozzle 2 precisely attaches the chip to the designated area. During the chip attachment process, the pressure sensor in the ZR module 3 monitors the pressure on the nozzle 2 in real time. When the pressure exceeds the set threshold, the ZR module 3 activates the anti-collision mode and quickly lifts vertically upward to prevent damage to the chip.

[0073] After the chip bonding is complete, the upper rangefinder moves to directly above the chip to measure the distance, obtaining four data points and calculating the average value h6. At this point, the host computer acquires the various measurement data from the upper and lower rangefinders and calculates the adhesive thickness δ3 = h5 - h.6， like Figure 3 If 0.03mm < δ3 < 0.05mm, the software will display an "OK" message indicating that the process requirements are met; if δ3 < 0.03mm or δ3 > 0.05mm, the software will display an "NG" message indicating that the process requirements are not met.

[0074] If the adhesive thickness is too thin, the connection strength between the chip and the pump base 16 after sintering will be insufficient. If the adhesive thickness is too thick, the heat dissipation performance of the chip during power-on operation after sintering will be insufficient. Both insufficient and excessive adhesive thickness will affect the subsequent normal operation lifespan and performance of the laser pump. When the adhesive spraying stage is at a constant speed, the spacing between the sprayed adhesive droplets is uniform, such as... Figure 6 The glue trail has a uniform line width, as shown. Figure 8 After bonding, the glue overflow around the chip is uniform and consistent, and the glue creep height does not exceed half the chip thickness. When the glue spraying stage is in a variable speed state, the following situation occurs: the distance between the sprayed glue droplets is uneven, the glue trajectory line width is uneven, the glue overflow around the chip is uneven after bonding, and the glue creep height exceeds half the chip thickness.

[0075] like Figure 11 As shown, the controller may include: a processor 2001, such as a central processing unit (CPU), a communication bus 2002, a user interface 2003, a network interface 2004, and a memory 2005. The communication bus 2002 is used to enable communication between these components. The user interface 2003 may include a display screen or an input unit such as a keyboard; optionally, the user interface 2003 may also include a standard wired interface or a wireless interface. The network interface 2004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface). The memory 2005 may be a high-speed random access memory (RAM) or a stable non-volatile memory (NVM), such as a disk drive. The memory 2005 may also optionally be a storage device independent of the aforementioned processor 2001.

[0076] Those skilled in the art will understand that Figure 11 The structure shown does not constitute a limitation on the user behavior recognition device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0077] like Figure 11As shown, the memory 2005, which serves as a storage medium, may include an operating system, a data storage module, a network communication module, a user interface module, and a resource access program based on a Virtual Private Network (VPN).

[0078] exist Figure 11 In the controller shown, the network interface 2004 is mainly used for data communication with the network server; the user interface 2003 is mainly used for data interaction with the user; the processor 2001 and the memory 2005 in the controller of the present invention can be set in the controller, and the controller calls the patch control program stored in the memory 2005 through the processor 2001 and executes the patch control method provided in the embodiment of the present invention.

[0079] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A laser pump dispensing device for applying adhesive to a pump base, characterized in that: The laser-pumped dispensing equipment includes a chip bonding mechanism, which comprises: The machine has a material loading station and a bonding station; The glue spraying unit is movably mounted on the machine base; The rangefinder is used to measure the Z-axis coordinate information of the material; A bonding positioning camera is used to obtain second horizontal position information of the bonding area on the pump base at the bonding station; A movable module for driving the glue spraying unit, the upper rangefinder, and the bonding positioning camera to move relative to the machine platform; and... The controller is electrically connected to the glue spraying unit, the moving module, the upper rangefinder, and the bonding and positioning camera.

2. The laser-pumped dispensing equipment as described in claim 1, characterized in that: The laser-pumped dispensing equipment also includes: A vacuum suction cup, located at the bonding station, is equipped with several positioning components for positioning the pump base; and... A loading stand is provided at the loading station, and the loading stand has several workpiece slots for positioning the laser chip.

3. The laser-pumped dispensing equipment as described in claim 2, characterized in that: The positioning component includes an X-axis positioning block and a Y-axis positioning block, both of which are detachably mounted on the vacuum suction cup.

4. The laser-pumped dispensing equipment as described in claim 2, characterized in that: The machine base is detachably provided with several limiting blocks, and the outer ring of the vacuum suction cup is provided with several positioning slots for cooperating with the limiting blocks.

5. The laser-pumped dispensing equipment as described in claim 2, characterized in that: The feeding base includes a material tray with a mounting slot. The bottom of the mounting slot has a vacuum adsorption port for connecting to a vacuum device, and a sealing ring is provided at the bottom of the mounting slot on the outer ring of the vacuum adsorption port.

6. The laser-pumped dispensing equipment as described in claim 5, characterized in that: A chip box is fitted into the mounting slot. The top surface of the chip box has several workpiece slots, and the bottom surface of the chip box rests on the sealing ring.

7. A dispensing control method, based on the laser-pumped dispensing equipment as described in any one of claims 1-6, characterized in that: The dispensing control method includes the following steps: Obtain the second horizontal position information and the second height information of the attachment area on the pump base; The movement of the mobile module is controlled according to the second height information to move the glue spraying part to the glue dispensing height corresponding to the application area; Based on the second horizontal position information of the application area, the glue dispensing trajectory coordinates are determined; the glue dispensing trajectory coordinates include an initial point, an open glue spray point, a start glue point, a closed glue spray point, an end glue point, and an end point distributed sequentially, wherein the start glue point and the end glue point correspond to the two endpoints of the glue segment on the application area; Based on the dispensing trajectory coordinates, the dispensing unit is controlled to move from the initial point to the end point. An opening command for the dispensing valve is issued at the opening dispensing point, and a closing command for the dispensing valve is issued at the closing dispensing point. During the process from the initial dispensing point to the end dispensing point, the dispensing unit is controlled to move at a constant speed. The second height information refers to the distance between the upper end of the affixing area of ​​the pump base and the upper rangefinder.

8. The dispensing control method as described in claim 7, characterized in that: Determining the adhesive dispensing trajectory coordinates based on the second horizontal position information of the application area includes: Based on the second horizontal position information of the application area, determine four sets of adhesive trajectory coordinates; The step of controlling the glue spraying unit to move from the initial point to the end point according to the glue dispensing trajectory coordinates includes: The glue spraying unit is controlled to sequentially dispense glue along four sets of glue dispensing trajectory coordinates to form four glue segments on the pump base; wherein the four glue segments are distributed along the diagonal of a rectangle.

9. The dispensing control method as described in claim 8, characterized in that: The initial points of the four sets of dispensing trajectory coordinates are distributed along a rectangle, and the ending points of the four sets of dispensing trajectory coordinates are all located at the center of the rectangle; and / or, Each segment of the adhesive is a straight line.

10. The dispensing control method as described in claim 7, characterized in that: The distance between the initial point and the starting glue point is greater than the distance of the acceleration segment of the moving module to ensure that the moving module enters a constant speed state before the starting glue point. The calculation formula for the acceleration segment is as follows: in, The set constant velocity, in mm / s; To reach the speed from the initial point Time required, in seconds; The distance of the acceleration phase is in mm; Peak acceleration, in units ; The coefficient is used to select values.

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