Printing element substrate, liquid ejecting head, and liquid ejecting apparatus

Abstract

The invention relates to a printing element substrate, a liquid ejecting head, and a liquid ejecting apparatus. An object of the present disclosure is to provide a printing element substrate on which a printing element, a circulating element, and wiring are efficiently arranged. The printing element substrate includes: a first unit including a first element and a second element; a second unit including a third element and a fourth element; and a power supply wiring including a first portion and a second portion. The power supply wiring includes an extension portion extending along a boundary line between the first cell and the second cell. The first element and the third element are symmetrically arranged relative to the extension portion. The second element and the fourth element are symmetrically arranged relative to the extension portion. The first part and the second part are symmetrically arranged relative to the extending part.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a print element substrate, a liquid ejection head, and a liquid ejection apparatus. BACKGROUND

[0002] Generally, a liquid ejection apparatus that ejects liquid to perform printing includes a liquid ejection head that ejects liquid. The liquid ejection head includes a print element substrate that includes an energy-generating element that generates energy for ejecting liquid.

[0003] In a case where a liquid ejection head is not used for a long time, liquid can be concentrated or thickened inside the liquid ejection head. To prevent this, circulation of the liquid can be performed.

[0004] Japanese Patent Laid-Open No. 2020-104493 discloses a print element substrate that includes a first pump that circulates liquid between a common passage formed in the print element substrate and a pressure chamber, a second pump provided at a position different from the print element substrate, and a print element.

[0005] With the print element substrate according to Japanese Patent Laid-Open No. 2020-104493, even after a state in which liquid is not ejected continues for a long time, ejection of desired liquid from an ejection port is achieved by liquid circulation by the first pump and the second pump.

[0006] The print element substrate according to Japanese Patent Laid-Open No. 2020-104493 includes a substrate (element substrate) that includes the first pump (circulation element) and the print element. The substrate of the print element substrate is provided with various drivers and various wiring to drive the first pump and the print element, which is not mentioned in Japanese Patent Laid-Open No. 2020-104493. The print element substrate according to Japanese Patent Laid-Open No. 2020-104493 can be improved in arrangement of the print element, the circulation element, and the wiring to prevent an increase in size of the print element substrate. SUMMARY

[0007] Therefore, an object of the technology according to the present disclosure is to provide a print element substrate on which a print element, a circulation element, and wiring are efficiently arranged.

[0008] A print element substrate includes a first unit including a first element and a second element, a second unit including a third element and a fourth element, and a power supply wiring including a first portion that supplies power to the first unit and a second portion that supplies power to the second unit, wherein the power supply wiring includes an extension portion that extends along a boundary line between the first unit and the second unit, the first element and the third element are arranged symmetrically with respect to the extension portion, the second element and the fourth element are arranged symmetrically with respect to the extension portion, and the first portion and the second portion are arranged symmetrically with respect to the extension portion.

[0009] The features of the present disclosure will become apparent from the following description of embodiments with reference to the accompanying drawings. The following description of embodiments will be described in the order of examples. BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1 is a diagram illustrating an example of a liquid ejecting apparatus to which the embodiment is applicable.

[0011] FIG. 2A is an exploded perspective view illustrating an example of a liquid ejecting head to which the embodiment is applicable.

[0012] FIG. 2B is a general view illustrating an example of a print element substrate to which the embodiment is applicable.

[0013] FIG. 3A is a schematic plan view of the vicinity of the ejection port 11 when viewed in the direction in which the liquid droplets are ejected.

[0014] FIG. 3B is a diagram for describing a first flow.

[0015] FIG. 3C is a diagram for describing a second flow.

[0016] FIG. 4A is a diagram illustrating a growth process of a bubble B after the generation of the bubble B caused by film boiling of a liquid by driving a heater RhB.

[0017] FIG. 4B is a diagram for describing a shrinkage process of the bubble B.

[0018] FIG. 4C is a diagram for describing a process after the disappearance of the bubble B.

[0019] FIG. 5A is an explanatory diagram illustrating how to eliminate the concentration of the liquid.

[0020] FIG. 5B is an explanatory diagram illustrating how to eliminate the concentration of the liquid.

[0021] FIG. 5Cis an explanatory diagram illustrating how to eliminate concentration of liquid.

[0022] FIG. 5D is an explanatory diagram illustrating how to eliminate concentration of liquid.

[0023] FIG. 6 is a diagram illustrating an example of a circuit configuration applicable to the embodiment.

[0024] FIG. 7A is a diagram illustrating a control data supply circuit applicable to the embodiment.

[0025] FIG. 7B is a diagram illustrating a loop group selection circuit applicable to the embodiment.

[0026] FIG. 8 is a diagram illustrating an arrangement on an element substrate applicable to the embodiment.

[0027] FIG. 9 is a diagram illustrating a schematic enlarged view of a portion of a wiring configuration applicable to the embodiment.

[0028] FIG. 10 is a diagram illustrating a comparative example of a wiring configuration of an element substrate.

[0029] FIG. 11 is a diagram illustrating a schematic enlarged view of a portion of a wiring configuration applicable to the embodiment.

[0030] FIG. 12 is a diagram illustrating a schematic enlarged view of a portion of a wiring configuration applicable to the embodiment.

[0031] FIG. 13 is a diagram illustrating a schematic enlarged view of a portion of a wiring configuration applicable to the embodiment.

[0032] FIG. 14 is a diagram illustrating a relationship of FIG. 14A with FIG. 14B . FIG. 14A and FIG. 14B are collectively a diagram illustrating a schematic enlarged view of a portion of a wiring configuration applicable to the embodiment.

[0033] FIG. 15 is a diagram illustrating a relationship of FIG. 15A to FIG. 15D . FIG. 15A to FIG. 15D is a diagram illustrating a schematic enlarged view of a portion of a wiring configuration applicable to the embodiment.

[0034] FIG. 16A is a plan view of a configuration of a passage in a print element substrate applicable to the embodiment when viewed in a direction in which liquid droplets are ejected.

[0035] FIG. 16B is a plan view of a configuration of a passage in a print element substrate applicable to the embodiment when viewed in a direction in which liquid droplets are ejected.FIG. 16A The cross-sectional view taken by line XVIb-XVIb in the diagram.

[0036] FIG. 17A This is a schematic plan view of the channel structure applicable to the printed element substrate in this embodiment when viewed along the direction of the ejected droplets.

[0037] FIG. 17B It is along FIG. 17A A cross-sectional view taken from line XVII-XVII in the diagram.

[0038] FIG. 17C This is a diagram illustrating modifications to the channel that can be applied to this embodiment.

[0039] FIG. 18A This is a schematic plan view of the area near the nozzle.

[0040] FIG. 18B It is along FIG. 18A A cross-sectional view taken from line XVIIIb-XVIIIb in the diagram.

[0041] FIG. 18C yes FIG. 18A A magnified view of the focused channel in the channel array.

[0042] FIG. 19A This is a diagram illustrating an example of a printed element substrate applicable to an embodiment.

[0043] FIG. 19B This is a diagram illustrating an example of a printed element substrate applicable to this embodiment.

[0044] FIG. 20 This is a diagram illustrating an example of a liquid injection device applicable to the embodiments.

[0045] FIG. 21 This is a schematic cross-sectional view of the printed element substrate applicable to the embodiments. Detailed Implementation

[0046] In the following, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are not intended to limit the scope of the present disclosure, and not all combinations of features described in these embodiments are necessary for the solutions provided by the present disclosure. It should be noted that the same constituent elements will be given the same reference numerals, and descriptions of components having the same reference numerals will be appropriately omitted. In the following description, the basic structure of the present disclosure will be described first, followed by its features.

[0047] [First Embodiment]

[0048] <Liquid injection device 50>

[0049] FIG. 1 is a schematic perspective view illustrating an example of a liquid ejecting apparatus 50 to which the present embodiment can be applied.

[0050] FIG. 1 The liquid ejecting apparatus 50 shown in FIG. 1 is capable of performing printing by ejecting liquid onto a print medium P with a liquid ejecting head 1 that performs scanning in a scanning direction (X direction) intersecting (in this embodiment, orthogonal to) a conveyance direction (Y direction) of the print medium P. That is, in the present embodiment, a so-called serial type liquid ejecting apparatus 50 is used. The liquid ejecting head 1 is capable of ejecting liquid (for example, ink). For example, the liquid ejecting head 1 ejects four colors of ink, including black (K), cyan (C), magenta (M), and yellow (Y). By ejecting these inks, the liquid ejecting head 1 can print a full-color image. The ink ejected from the liquid ejecting head 1 is not limited to the above four colors of ink. Ink of another color can also be ejected from the liquid ejecting head 1. That is, the color and number of inks ejected from the liquid ejecting head 1 are not limited.

[0051] The liquid ejecting head 1 is detachably mounted on a carriage 60. The carriage 60 moves reciprocally along a guide shaft 51 and along the main scanning direction (X direction). The print medium P is conveyed by a conveyance unit in a conveyance direction (Y direction) intersecting (in this embodiment, orthogonal to) the scanning direction (X direction). The conveyance unit includes a first conveyance roller 55, a second conveyance roller 56, a third conveyance roller 57, and a fourth conveyance roller 58. Note that in the drawings to be referred to hereinafter, the Z direction indicates the vertical direction. The Z direction intersects (in this embodiment, is orthogonal to) the X-Y plane defined by the X direction and the Y direction.

[0052] In the present embodiment, a main tank 2 serving as a liquid reservoir is provided outside the liquid ejecting head 1. The liquid stored in the main tank 2 is supplied to a sub tank 54 included in the liquid ejecting head 1 via a supply tube 59 or the like by a driving force generated by an external pump 61. The liquid ejecting head 1 is fixed to the carriage 60 with a positioning unit and electrical contacts, not shown. The liquid ejecting head 1 ejects liquid while moving in the scanning direction (X direction) together with the carriage 60, thereby performing printing on the print medium P.

[0053] The supply tube 59 is connected to the external pump 61, which is connected to the main tank 2 serving as a supply source of ink. The supply tube 59 is provided with a connector, not shown, at its tip end. When the liquid ejecting head 1 is mounted on the liquid ejecting apparatus 50, the connector of the other end of the supply tube 59 is connected in a liquid-tight manner to a connector provided on a housing 53 (see FIG. 2A ) of the liquid ejecting head 1 and serving as an inlet of liquid, which is inserted into a slot. This forms a liquid supply passage from the main tank 2 to the liquid ejecting head 1 via the external pump 61.

[0054] In the present embodiment, the above-described four types of liquid are used. Accordingly, four sets corresponding to the four types of liquid are provided, each set including the main tank 2, the external pump 61, the supply pipe 59, and the sub-tank 54. That is, in the present embodiment, four liquid supply channels corresponding to the four types of liquid are formed independently. As seen from above, the liquid ejecting apparatus 50 of the present embodiment includes a liquid supply system that supplies liquid from the main tank 2.

[0055] Note that the liquid ejecting apparatus 50 of the present embodiment does not include a liquid collecting system that collects liquid remaining in the liquid ejecting head 1 to the main tank 2. Therefore, the liquid ejecting head 1 is provided with a connector insertion slot for connecting a pipe for collecting liquid.

[0056] < Liquid ejecting head 1 >

[0057] FIG. 2A is an exploded perspective view illustrating an example of the liquid ejecting head 1 applicable to the present embodiment.

[0058] As shown in FIG. 2A , the liquid ejecting head 1 includes a sub-tank 54 that temporarily stores liquid therein and a print element substrate 3 that causes liquid supplied from the sub-tank 54 to be ejected onto a print medium P (see FIG. 1 ). The liquid ejecting head 1 includes a channel forming substrate 4 that contains channels connecting the sub-tank 54 and the print element substrate 3, a support substrate 7 that supports the channel forming substrate 4, and a face cover 5 that covers the support substrate 7 except for the print element substrate 3.

[0059] In the liquid ejecting head 1, the ejection of liquid can become unstable. For example, when a volatile component (e.g., moisture, etc.) evaporates from the ejection port 11 from which liquid is ejected (see FIG. 2B , etc.), the ejection of liquid becomes unstable, whereby a solid component in the liquid is concentrated near the ejection port 11. To prevent this, various arrangements are conceived for the liquid ejecting head 1.

[0060] An example of the arrangement includes providing a cap member (not shown) that covers an ejection port surface on which the ejection port 11 is formed at a position away from a conveyance path (see FIG. 1 ) of the print medium P in the X direction. By covering the ejection port surface with the cap member to protect the ejection port surface, for example, when a print operation is not performed, it is possible to prevent the ejection port 11 from drying, thereby making it possible to prevent evaporation of the volatile component.

[0061] Further, a suction mechanism (not shown) for suctioning liquid can also be provided. In this case, the suction operation of, for example, suctioning liquid from the ejection port 11 is performed using the cap member. By the suction operation, it is possible to refresh the liquid near the ejection port 11, thereby making it possible to maintain the resulting image quality level.

[0062] The concentrated liquid can be discarded by performing a preliminary discharge when a printing operation is not performed. Further, during a printing operation, a small amount of liquid can be preliminarily discharged onto the printing medium P at a position where the liquid is not easily noticeable in terms of image quality.

[0063] The preliminary discharge and suction operations contribute significantly to maintaining the image quality level. In contrast, the preliminary discharge and suction operations are required to minimize the amount of discarded liquid. In contrast, the circulation of liquid in the print element substrate as described later can prevent the concentration, thickening, and the like of the liquid to maintain the image quality level without discarding the liquid.

[0064] For example, a technique as described in Japanese Patent Laid-Open No. 2020-104493, by driving a pump (circulation element) provided on a substrate of a print element substrate, it is possible to achieve prevention of drying of the ejection port and concentration of the liquid with a reduced amount of discarded liquid. With this technique, it is possible to achieve minimization of the number of times of the preliminary discharge and suction operations. Further, the minimization of the number of times of the preliminary discharge and suction operations achieves improvement of the throughput and yield.

[0065] Note that it is not necessary to provide a circulation element for each channel (individual channel described later) in the liquid ejection head 1. Providing a circulation element for each of some channels can improve the throughput and yield compared to a case where no circulation element is provided.

[0066] The liquid ejection head 1 can be provided with a circulation element at each position corresponding to the four types of liquid, or can be provided with a circulation element only at a position corresponding to one type of liquid. That is, the liquid ejection head 1 can be configured to enable circulation of all four types of liquid, or can be configured to circulate only one type of liquid.

[0067] <Print element substrate 3>

[0068] FIG. 2B is a general view illustrating an example of a print element substrate 3 applicable to the present embodiment.

[0069] FIG. 2B One print element substrate 3 capable of ejecting four types of liquid is illustrated. The print element substrate 3 is provided with ejection ports 11 from which liquid is ejected and pads 20 for electronic mounting. The print element substrate 3 ejects, for example, black, cyan, magenta, and yellow inks. The ejection ports 11 through which each color of liquid is ejected are formed along the Y direction (first direction), and these ejection ports 11 form one ejection port array.

[0070] In each of the jet port arrays, every two adjacent jet ports 11 are arranged to be offset in the X direction (second direction), and a large number of jet ports 11 are arranged at regular intervals along the Y direction. Note that in each of the jet port arrays, the jet ports 11 thereof can be arranged in a line along the Y direction, with no offset of the jet ports 11 in the X direction. Alternatively, two jet port arrays that jet black ink can be formed, and five jet port arrays that jet four-color inks can be formed.

[0071] Examples of the combination of the types of liquid to be jetted from the print element substrate 3 are not limited to the above-described examples. Furthermore, the types of liquid to be jetted from the print element substrate 3 are not limited to the above-described four types.

[0072] FIG. 3A to FIG. 3C is a schematic diagram for describing the configuration of the channel that can be applied to the print element substrate 3 of the present embodiment.

[0073] FIG. 3A is a schematic plan view of the vicinity of the jet port 11 when viewed along the direction in which the liquid droplet is jetted, FIG. 3B and FIG. 3C is a cross-sectional view taken along the line IIIb-IIIb in FIG. 3A .

[0074] As shown in FIG. 3B and FIG. 3C , the print element substrate 3 includes a jet port forming member 19 through which the jet port 11 is formed, and an element substrate 18 that includes an energy generating element that gives energy to the liquid. The element substrate 18 includes a first jet element that generates energy for jetting the liquid, and a first circulation element that generates energy for circulating the liquid.

[0075] In the present embodiment, electrothermal transducer elements are used as the first jet element and the first circulation element. As the first jet element, a jet heater RhA is used. As the first circulation element, a circulation heater RhB is used. Note that piezoelectric elements can be used as the first jet element and the first circulation element.

[0076] The element substrate 18 is formed with a first supply port 22 and a second supply port 32 that are connected to the channel formed in the jet port forming member 19. In the present embodiment, the first supply port 22 and the second supply port 32 are independent supply ports that are independent of each other.

[0077] In a state in which the jet port forming member 19 and the element substrate 18 are joined together, the jet port forming member 19 is formed with a plurality of partitions 21 that partition the inside of the print element substrate 3. The partitions 21 extend along a lateral direction (X direction) in which the short sides of the print element substrate 3 extend. This forms individual channels 23 of a straight-through type in the print element substrate 3 of the present embodiment.

[0078] In the present disclosure, "straight-through type" means a form in which the first ejection element and the first circulation element are arranged on one passage, both ends of the passage are positioned across the ejection port, and the passage extends along a direction intersecting the direction in which the ejection port array extends on a plane. That is, the printing element substrate 3 of the present embodiment including the straight-through type passage, the ejection heater RhA, and the circulation heater RhB is provided along a direction (second direction, X direction) orthogonal to the direction (first direction, Y direction) in which the ejection port array extends on a plane.

[0079] The passage of the printing element substrate 3 can be provided with a filter 31 that removes foreign matter in the liquid. In the present embodiment, the filter 31 is provided outside the individual passage 23 formed in the ejection port forming member 19. Specifically, the filter 31 is provided on the inflow side and the outflow side of the individual passage 23. Note that the filter 31 can be provided between the ejection heater RhA and the circulation heater RhB in the individual passage 23. In this case, it is not necessary to provide the filter 31 outside and on the upstream side (the side on which the circulation heater RhB is provided) of the individual passage 23.

[0080] The flow of the liquid flowing through the individual passage 23 is roughly divided into two flows. The first flow is a first flow (circulation flow 27) generated by the driving of the circulation heater RhB and circulating the liquid. As described above, both ends of each individual passage 23 of the straight-through type are opposite to each other in the second direction. That is, in the individual passage 23 of the straight-through type, the inlet of the circulation flow 27 and the outlet of the circulation flow 27 are opposite to and distant from each other. With this configuration, after the concentrated liquid is discharged through the outlet of the individual passage 23, fresh liquid is immediately supplied through the inlet of the individual passage 23, and thus it is possible to prevent the discharged liquid from entering the individual passage 23 from the inlet thereof.

[0081] In the case of the U-shaped passage to be described later, FIG. 18A to FIG. 18C The inlet and the outlet of each individual passage are provided close to each other, and thus the concentrated liquid discharged from the outlet can re-enter the individual passage from the inlet. That is, in the case of the U-shaped passage, it can be impossible to sufficiently eliminate the concentration of the liquid even when the circulation is performed. In contrast, the individual passage 23 of the straight-through type is capable of preventing such a situation from occurring compared to the U-shaped passage.

[0082] The second flow is a second flow generated by refilling after the ejection caused by the driving of the ejection heater RhA. Hereinafter, the first flow will be described with reference to FIG. 3B and the second flow will be described with reference to FIG. 3C .

[0083] FIG. 3B is a view for describing the first flow. Note that FIG. 3B is a view for describing the second flow. Note that FIG. 3AThe cross-sectional view taken by line IIIb-IIIb in the diagram.

[0084] like FIG. 3B As shown, a common channel 24 connecting the first supply port 22 and the second supply port 32 is formed on the component substrate 18. When the component substrate 18 is joined to the nozzle forming member 19, the common channel 24 is connected to a channel formed in a member that is joined to a surface facing a direction opposite to the direction facing the joint surface between the component substrate 18 and the nozzle forming member 19. In this way, when the component substrate 18 is joined to the nozzle forming member 19, a channel penetrating the component substrate 18 in the Z direction is formed on the component substrate 18.

[0085] The nozzle forming member 19 has a first connecting channel 13 located on the inlet (upstream) side of the individual channel 23 and a second connecting channel 25 located on the outlet (downstream) side of the individual channel 23. At the upstream end of the individual channel 23, the first connecting channel 13 is connected to the first supply port 22. At the downstream end of the individual channel 23, the second connecting channel 25 is connected to the second supply port 32. In this way, both ends of each individual channel 23 are positioned on opposite sides across the corresponding nozzle 11.

[0086] The first connecting channel 13 is positioned closer to the circulating heater RhB than the injection port 11. FIG. 3B In the middle, a meniscus of liquid is formed on the injection nozzle 11. That is, FIG. 3B The nozzle 11 shown is in a state where the nozzle interface is formed as an interface between the liquid and the atmosphere. When the circulating heater RhB, which is positioned closer to the first supply port 22 than the second supply port 32, is driven in this state, a circulating flow 27 for circulating liquid is generated.

[0087] The generation of the circulating flow 27 causes the liquid to flow in the following order: common channel 24, first supply port 22, first connecting channel 13, individual channel 23, second connecting channel 25, and second supply port 32. The liquid then returns to the common channel 24. In this way, in this embodiment, a cycle is performed where the liquid returns from the second supply port 32, passes through the common channel 24, and then flows back into the first supply port 22.

[0088] FIG. 3C This is a diagram used to describe the second flow. (Refer to...) FIG. 3C Provide a description. FIG. 3C Is with FIG. 3B Same cross-section.

[0089] like FIG. 3CAs shown in FIG. 1, the element substrate 18 is provided with a jet heater RhA at a position corresponding to the jet port 11. The jet heater RhA is positioned closer to the second supply port 32 than to the first supply port 22.

[0090] When liquid is jetted from the jet port 11, liquid is supplied from the first supply port 22 and the second supply port 32 to the first connection passage 13 and the second connection passage 25, respectively. Then, the individual passage 23 is refilled with liquid from both the first connection passage 13 and the second connection passage 25.

[0091] In a state where the individual passage 23 is refilled with liquid, by driving of the jet heater RhA, a bubble is generated in liquid present in the individual passage 23, and a liquid droplet can be jetted from the jet port 11 by a method of bubble generation energy. In this way, the individual passage 23 of the present embodiment also functions as a pressure chamber.

[0092] <Principle behind generation of circulation flow 27>

[0093] FIG. 4A to FIG. 4C is a diagram for describing the principle behind generation of the circulation flow 27. FIG. 4A to FIG. 4C The cross section shown in FIG. 2 is the same cross section as in FIG. 1. Note that, for convenience of description, the filter 31 (see FIG. 1) is not illustrated in the diagram. FIG. 3B FIG. 3A

[0094] FIG. 4A is a diagram illustrating a growth process of a bubble B after generation of the bubble B caused by film boiling of liquid by driving of the circulation heater RhB. FIG. 4A is a diagram illustrating the first flow resistance R1 and the second flow resistance R2 as an equivalent circuit of, for example, resistances.

[0095] As shown in FIG. 1, driving of the circulation heater RhB generates a bubble B in liquid flowing in the corresponding individual passage 23. FIG. 4A

[0096] The circulation heater RhB is positioned closer to the first supply port 22 than to the corresponding second supply port 32. Therefore, the first flow resistance R1 (which is a flow resistance between the circulation heater RhB and the corresponding first supply port 22) is smaller than the second flow resistance R2 (which is a flow resistance between the circulation heater RhB and the corresponding second supply port 32). The difference between the first flow resistance R1 and the second flow resistance R2 causes the growth of the bubble B generated by film boiling of liquid to be biased toward the first supply port 22 side where the first flow resistance R1 is smaller. Therefore, in the individual passage 23, the flow Fa of liquid toward the first supply port 22 is greater than the flow Fb of liquid toward the second supply port 32.

[0097] FIG. 4B is a diagram for describing a shrinkage process of the bubble B.​​​

[0098] As FIG. 4B shown in Fig. 8, during the contraction of the bubble B, liquid flows in from the first supply port 22 and the second supply port 32 to compensate for the volume of the bubble B that contracts, thereby generating the flow Fe and the flow Fd. As described above, the first flow resistance Rl (see Fig. 6) on the first supply port 22 side is smaller than the second flow resistance R2 on the second supply port 32 side. Therefore, the flow Fe of the liquid that flows in from the first supply port 22 is larger than the flow Fd of the liquid that flows in from the second supply port 32. In addition, the bubble B contracts on the second supply port 32 side of the circulation heater RhB. Then, the bubble B disappears at a position that is shifted from the circulation heater RhB toward the second supply port 32 side. FIG. 4A

[0099] FIG. 4C is a diagram for describing the process after the bubble B disappears.

[0100] As described above, the flow Fe is larger than the flow Fd. This generates the circulation flow 27 of the liquid from the first supply port 22 to the second supply port 32. The amount of the circulation flow 27 changes under the influence of the first flow resistance Rl, the second flow resistance R2, and the bubble B. The circulation heater RhB is preferably positioned closer to one of the two ends of the individual channel 23 than the corresponding ejection heater RhA. In addition, it is preferable that the value of the first flow resistance Rl divided by the second flow resistance R2 (Rl / R2) is between 0.05 and 0.40 inclusive.

[0101] By setting the value of the first flow resistance Rl / second flow resistance R2 so that the value falls within the above range, the circulation flow 27 can reach a maximum. For the circulation flow 27, it is important to make the flow Fa of the liquid toward the first supply port 22 large to increase the flow Fe of the liquid that flows in from the first supply port 22. Therefore, it is effective to make the first flow resistance Rl small.

[0102] It is also important to make the flow Fb of the liquid toward the second supply port 32 as small as possible to reduce the flow Fd of the liquid that flows in from the second supply port 32. Therefore, it is effective to make the second flow resistance R2 large. In accordance with the above, it is important to make the first flow resistance Rl small and the second flow resistance R2 large, that is, to make the value of the first flow resistance Rl / second flow resistance R2 (Rl / R2) less than 1. In addition, the bubble B is large, that is, the bubble B has a large volume, which causes the volume of the fluid generated in the individual channel 23 to be discharged to increase, thereby increasing the amount of the circulation flow 27.

[0103] Examples of the method of increasing the volume of the bubble include increasing the size of the circulation heater RhB and reducing the flow resistance by increasing the width and height of the individual channel 23. Examples also include reducing the viscosity of the liquid, increasing the temperature of the liquid ejection head 1 (see Fig. 1), and using a double pulse as the drive pulse. FIG. 1 ​​

[0104] A portion of the circulation flow 27 flows into the ejection port 11, and thus the liquid concentrated inside the ejection port 11 is sent to the second supply port 32 side. Then, fresh liquid flows into the ejection port 11 from the first supply port 22 side through the individual passage 23. By making it difficult for the concentrated liquid to remain inside the ejection port 11 in this way, it is possible to mitigate the influence of the concentrated liquid, and thus to maintain a good ejection condition of the liquid at the start of the ejection operation.

[0105] The circulation flow 27 is a transient flow generated in the growth process and the shrinkage process of the bubble B. Therefore, after the bubble B disappears, this inertial flow decays with time to stop after a certain period of time. Therefore, it is necessary to repeatedly drive the circulation heater RhB so as to stably generate the circulation flow 27 within a given period of time. The driving period of the circulation heater RhB is not limited as long as the concentrated liquid in the ejection port 11 can be discharged.

[0106] However, when driving using a driving frequency of around 100 kHz, which is a period of 10 μs as the period taken for the bubble B to be generated to disappear, the effect of the circulation is not very high. Therefore, in order to generate a suitable circulation effect, it is preferable to drive the circulation heater RhB at a period of, for example, 100 Hz to several tens of kHz.

[0107] The higher the driving frequency, the more the circulation flow 27 is maintained, and the stronger the effect of discharging the concentrated liquid. At the same time, it is necessary to take into account the temperature rise of the liquid due to the heat generated by the driving of the circulation heater RhB. Therefore, it is necessary to appropriately drive the circulation heater RhB.

[0108] FIG. 5A to FIG. 5D is an explanatory diagram illustrating how the concentration of the liquid is eliminated. In FIG. 5A to FIG. 5D , a dark color indicates a position where the liquid is concentrated, and the degree of concentration is indicated by a gradation of colors.

[0109] As shown in FIG. 5A , when the circulation heater RhB is temporarily stopped, the volatile component in the liquid evaporates from the ejection port 11, and thus the liquid near the ejection port 11 is concentrated.

[0110] As shown in FIG. 5B , by generating the circulation flow 27 by driving the circulation heater RhB, it is possible to eliminate the concentration of the liquid near the ejection port 11.

[0111] As shown in FIG. 5C , when the circulation heater RhB is temporarily stopped again, the liquid is concentrated near the ejection port 11.

[0112] As shown in FIG. 5DAs shown in FIG. 6, by driving the circulation heater RhB again to generate the circulation flow 27, the concentration of the liquid near the ejection port 11 can be eliminated.

[0113] As described above, in the straight-through individual channel 23, the concentration state of the liquid is reset each time the temporary stop and the circulation operation of the circulation heater RhB are alternated.

[0114] <Ink>

[0115] As described above, in the present embodiment, the liquid can be kept in a good ejection condition by the circulation. Therefore, the change in the ejection speed and the like can be reduced, and the ejection can be stabilized.

[0116] Depending on the application of the liquid ejecting apparatus 50 on which the liquid ejecting head 1 is mounted (see FIG. 1 ), ink of different types of coloring materials, content of solid components, and the like can be used. That is, the liquid ejecting head 1 preferably has a performance that enables a high level of ejection stability to be maintained regardless of the ink used.

[0117] For example, in order to address a problem that can occur due to the moisture in the ink (e.g., curling (warping), cockling (corrugation), and the like that can occur in ordinary paper), low-moisture ink can be used. The low-moisture ink tends to increase the concentration of solid components other than water, such as organic solvents, pigments, resins, and the like. Therefore, the low-moisture ink is likely to rapidly increase in viscosity as the moisture evaporates, and the stability of the ejection can be reduced.

[0118] The method of generating the circulation flow 27 in the individual channel 23 is very effective for such ink, because the increase in the viscosity of the ink can be prevented. In general, ink having a large amount of solid components has a solid component content of 10 wt% or more. For example, the technology according to the present disclosure is preferably applied to ink having a solid component content of 10 wt% (mass%) or more.

[0119] In addition, the viscosity of the ink changes depending on the temperature of the ink, and therefore the temperature at which the liquid ejecting head 1 is operated can have an influence on the viscosity of the ink, and in turn, on the stability of the ejection. Therefore, the entire substrate on which the printing element substrate 3 is arranged can be heated to a certain temperature with the circulation heater RhB.

[0120] In the case where the circulation flow 27 is generated by driving the circulation heater RhB, the flow rate of the circulation can be set in the range of several tens of mm / s to 1000 mm / s inclusive in terms of instantaneous flow rate. The flow rate of the circulation flow 27 depends on the driving frequency of the circulation heater RhB, and is on the order of several hundreds of microseconds. This is because the circulation flow 27 decays with time and stops after a certain period of time. In the case where the circulation heater RhB is driven at the same driving frequency (jetting frequency) as the driving frequency of the jetting heater RhA (from about 10 kHz to about 20 kHz), the flow rate of the circulation flow 27 can be set in the range of several mm / s to 100 mm / s inclusive.

[0121] In the case where a pigment ink having a relatively high concentration of pigment (for example, an ink having a viscosity of 3 cp to 6 cp inclusive at the temperature at which the liquid jetting head 1 is operated) is used, the ink tends to thicken at the jetting port 11 as the non-jetting period (stop time) elapses. Therefore, in the case where an ink having a relatively high concentration of pigment is used, the jetting speed tends to change, which can result in a decrease in jetting stability.

[0122] In this case, it is thus necessary to circulate the ink during a relatively short period of time. For example, it is necessary to perform a steady or transient circulation at a high frequency during the intermittent period of the liquid jetting head 1 to eliminate thickening of the ink. In the case where the circulation heater RhB is used, a transient circulation is performed. Performing a transient circulation operation at a high frequency contributes to elimination of thickening of the ink at the jetting port 11.

[0123] In contrast, in the case where a pigment ink having a relatively low concentration of pigment (for example, an ink having a viscosity of 1 cp to 2 cp inclusive at the temperature at which the liquid jetting head 1 is operated) is used, the jetting speed can change depending on the stop time of the liquid jetting head 1. However, the influence of this case is relatively small compared to the case where the jetting speed changes in the case of an ink having a high concentration.

[0124] Depending on the stop time of the liquid jetting head 1, the ink can thicken at the jetting port 11. Therefore, when the operation of the liquid jetting head 1 is restarted after the liquid jetting head 1 has stopped for a certain period of time or more, it is necessary to perform a recovery process (a suction operation, a wiping operation, or a preliminary jetting including a combination thereof, or the like). However, in the recovery process, the ink is discarded. Therefore, in the present embodiment, by performing the recovery operation that generates the circulation flow 27, thickening of the ink at the jetting port 11 is eliminated without wasting ink.

[0125] After the liquid ejection head 1 is stopped for a certain period of time, only the circulation operation is performed to enable the recovery of the ejection performance of the liquid ejection head 1 without waste ink. Another possible recovery process for minimizing waste ink is such that, in addition to the suction operation for eliminating the concentration, the circulation operation for recovering the ejection performance is combined with, for example, a suction operation for removing air bubbles in the ejection head as a part of the process. Note that, in order to prevent the influence of the concentrated ink, it is desirable to restore the state of the ink to its initial fresh state regardless of the concentration of the ink.

[0126] <element substrate 18>

[0127] FIG. 6 is a diagram illustrating an example of a circuit configuration of the element substrate 18 applicable to the present embodiment.

[0128] As FIG. 6 indicated in the above-described

[0129] , the liquid ejection device 50 includes a power supply circuit 102 that supplies power to the element substrate 18 and a controller 101 that sends an enable signal to the element substrate 18.

[0129] The element substrate 18 includes an ejection module 104 for ejecting a liquid, a circulation module 105 for circulating the liquid, and a control data supply circuit 106 that outputs various signals. The element substrate 18 includes a time sharing selection signal line 111, a circulation group selection signal line 110, and an ejection group selection signal line 109 connected to the control data supply circuit 106.

[0130] Each ejection module 104 includes an ejection heater RhA, an ejection drive element MD1 for flowing a current to the ejection heater RhA, and an ejection wiring 107 for connecting the ejection heater RhA and the ejection drive element MD1. The ejection wiring 107 is a drain wiring. The ejection drive element MD1 is a transistor for driving the ejection heater RhA. The ejection heater RhA can also have the role of a circulation heater for circulating the liquid, an element that heats a specific region of the print element substrate, a temperature detection element that monitors temperature information about the heater, and the like.

[0131] Each ejection module 104 includes a first logic circuit AND1 for selectively driving the ejection drive element MD1. The current flowing through the ejection heater RhA generates heat, which generates air bubbles in the liquid to eject the liquid to perform printing on a print surface of a print medium P (see FIG. 1 ) along the Y direction in a line to form an ejection heater array 112 (ejection element array).

[0132] Each circulation module 105 includes a circulation heater RhB, a circulation drive element MD2 for causing current to flow to the circulation heater RhB, and a circulation wiring line 108 for connecting the circulation heater RhB and the circulation drive element MD2. The circulation wiring line 108 is a drain wiring line. The circulation drive element MD2 is a transistor for causing current to flow to the circulation heater RhB. Each circulation module 105 includes a second logic circuit AND2 for selectively driving the circulation drive element MD2.

[0133] Current flowing through the circulation heater RhB generates heat, which causes the bubble B to grow, thereby generating a circulation flow 27 (see FIG. 4A to FIG. 4C The plurality of circulation heaters RhB are arranged in a line along the Y direction to form a circulation heater array 113 (circulation element array). The circulation heater RhB can have the role of an ejection heater for ejecting liquid, an element for heating a specific region of the print element substrate, a temperature detection element for monitoring temperature information about the heater, and the like.

[0134] In each ejection module 104, the ejection group selection signal and the time sharing selection signal output from the control data supply circuit 106 and an enable signal for controlling the pulse width (period during which the ejection drive element MD1 is turned on to cause current to flow) are input into the first logic circuit AND1. The ejection group selection signal is input through a corresponding ejection group selection signal line 109. The time sharing selection signal is input through a corresponding time sharing selection signal line 111. The enable signal is input through an enable signal line HE. These input signals perform selective control so that the ejection drive element MD1 is in the on state, thereby causing current to flow to the ejection heater RhA.

[0135] In each circulation module 105, a circulation group selection signal, a time sharing selection signal, and an enable signal are input into the second logic circuit AND2. The circulation group selection signal is output from the control data supply circuit 106 and is input through a corresponding circulation group selection signal line 110. These input signals perform selective control so that the second logic circuit AND2 is in the on state, thereby causing current to flow to the corresponding circulation heater RhB.

[0136] Sharing the signal line for transmitting the time sharing selection signal between the ejection module 104 and the circulation module 105 contributes to reducing the amount of serial data to be transmitted and reducing the layout area of the signal wiring lines within the element substrate 18 (described later).

[0137] The element substrate 18 includes an external input terminal of an enable signal. The enable signal is sent from the controller 101. The enable signal controls the pulse width (period in which the transistor is turned on to allow current to flow) of the ejection drive element MD1 and the circulation drive element MD2 of the selected ejection module 104 and circulation module 105. In the production of the element substrate 18, variations in the heater resistance value, variations in the power source and the like, and voltage drop in the power supply wiring when a plurality of heaters are simultaneously driven, and the like can occur. The enable signal is used to adjust the pulse width of the current so that more desirable thermal energy can be generated taking into account these variations and the like.

[0138] Further, a clock signal, a data signal, and a latch signal are sent from the controller 101. The clock signal is input through a clock signal line CLK. The clock signal line CLK conveys selection information for selecting each of the ejection module 104 and the circulation module 105 to the first shift register 203a and the second shift register 203b (see FIG. 2) in the form of serial data. The data signal is input to the control data supply circuit 106 through a data signal line DATA. The latch signal is input to the control data supply circuit 106 through a latch signal line LT. The latch signal line LT retains the selection information. FIG. 7A ). The data signal is input to the control data supply circuit 106 through a data signal line DATA. The latch signal is input to the control data supply circuit 106 through a latch signal line LT. The latch signal line LT retains the selection information.

[0139] The power supply circuit 102 is capable of supplying power to the ejection module 104 and the circulation module 105. The element substrate 18 includes a ground wiring GNDH and a first power supply wiring VH for receiving power from the power supply circuit 102. The ejection module 104 and the circulation module 105 are supplied with power of the same voltage (for example, 24 V) through the first power supply wiring VH.

[0140] In order to further reduce fluctuations in the ejection energy due to voltage drop when a plurality of heaters are simultaneously driven, the ejection module 104 and the circulation module 105 can be supplied with power from the power supply circuit 102, respectively. In this case, supply wirings and external connection terminals for the supply of the power supply voltage and the ground potential for the ejection module 104 and supply wirings and external connection terminals for the supply of the power supply voltage and the ground potential for the circulation module 105 are separately provided to the element substrate 18.

[0141] Generally, a drive circuit operates at a higher voltage than a logic circuit. For this reason, a substrate in which a high-voltage resistant transistor and a normal transistor are mounted at the same time is used. In the present embodiment, the ejection drive element MD1 and the circulation drive element MD2 include a double-diffused MOSFET (DMOS) transistor as a high-voltage resistant transistor.

[0142] Generation of current to drive the circulation heater RhB circulates the liquid in the individual channel 23 (see FIG. 1). The circulation heater RhB is provided in the circulation module 105. FIG. 4AThe heat energy of the DMOS transistor is applied to the heat energy of the thermal energy of the cycle heater RhB. In the case where the current for driving the cycle heater RhB is smaller than the current for driving the jet heater RhA, the current driving capability of the DMOS transistor can be relatively low. The area of each cycle drive element MD2 is preferably smaller than the area of the jet drive element MD1.

[0143] FIG. 7A is a schematic diagram of the control data supply circuit 106 applicable to the present embodiment.

[0144] As shown in FIG. 7A , the control data supply circuit 106 includes a decoder circuit 205 connected to the time sharing selection signal line 111, a first latch circuit 204a connected to the decoder circuit 205, and a first shift register 203a connected to the first latch circuit 204a.

[0145] The control data supply circuit 106 includes a cycle group selection circuit 201 connected to the cycle group selection signal line 110 and a second latch circuit 204b connected to the jet group selection signal line 109. The control data supply circuit 106 includes a second shift register 203b connected to the second latch circuit 204b and external input terminals for receiving a clock signal, a data signal, and a latch signal.

[0146] In the control data supply circuit 106, each logic circuit includes a low-voltage tolerant MOS transistor. For example, the cycle group selection circuit 201, the first shift register 203a, the second shift register 203b, the first latch circuit 204a, the second latch circuit 204b, the decoder circuit 205, and the like each include a low-voltage tolerant MOS transistor. The first logic circuit AND1 and the second logic circuit AND2 (see FIG. 6 ) each also include a low-voltage tolerant MOS transistor.

[0147] FIG. 7B is a schematic diagram of the cycle group selection circuit 201 applicable to the present embodiment.

[0148] As shown in FIG. 7B , the cycle group selection circuit 201 includes the jet group selection signal line 109 and the cycle group selection signal line 110.

[0149] FIG. 8 is a schematic diagram illustrating an arrangement applicable to the element substrate 18 of the present embodiment.

[0150] As shown in FIG. 8 , the element substrate 18 includes a plurality of jet heaters RhA, a plurality of cycle heaters RhB, a plurality of jet drive elements MDI, and a plurality of cycle drive elements MD2. A plurality of jet heater arrays 112 and a plurality of cycle heater arrays 113 are formed along the direction (Y direction) in which the long sides of the element substrate 18 extend.

[0151] Specifically, the plurality of jet heaters RhA includes a first jet heater RhA-1, a second jet heater RhA-2, a third jet heater RhA-3, and a fourth jet heater RhA-4. Without necessarily distinguishing the first jet heater RhA-1, the second jet heater RhA-2, the third jet heater RhA-3, and the fourth jet heater RhA-4, they will be referred to as jet heaters RhA hereinafter.

[0152] The plurality of circulation heaters RhB includes a first circulation heater RhB-1, a second circulation heater RhB-2, a third circulation heater RhB-3, and a fourth circulation heater RhB-4. Without necessarily distinguishing the first circulation heater RhB-1, the second circulation heater RhB-2, the third circulation heater RhB-3, and the fourth circulation heater RhB-4, they will be referred to as circulation heaters RhB hereinafter.

[0153] The plurality of jet drive elements MD1 and the plurality of circulation drive elements MD2 are arranged alternately along the Y direction. The plurality of jet drive elements MD1 and the plurality of circulation drive elements MD2 arranged alternately along the Y direction form a drive element array 301.

[0154] The jet heaters RhA and the circulation heaters RhB contain a resistive material as a main component thereof. For example, the jet heaters RhA and the circulation heaters RhB contain tantalum silicon nitride, tungsten silicon nitride, or the like as the resistive material.

[0155] The jet drive elements MD1 and the circulation drive elements MD2 are provided in the same semiconductor layer. For the jet drive elements MD1 and the circulation drive elements MD2, an N-type field effect transistor can be used. Note that, FIG. 8 The example of the arrangement of the plurality of jet heater arrays 112 and the plurality of circulation heater arrays 113 shown in FIG. 12A can be reversed. That is, two jet heater arrays 112 can be arranged between two circulation heater arrays 113.

[0156] FIG. 9 is a schematic enlarged view of a portion of the wiring structure of the element substrate 18.

[0157] As FIG. 9 As shown in FIG. 13A, the element substrate 18 includes a first unit 403-1 including a plurality of electrical components and a second unit 403-2 including a plurality of electrical components.

[0158] The first unit 403-1 includes a first ejection heater RhA-1 that generates energy for ejecting liquid and a first circulation heater RhB-1 that generates energy for circulating liquid. The first unit 403-1 includes a first ejection drive element MD1-1 that drives the first ejection heater RhA-1 and a first circulation drive element MD2-1 that drives the first circulation heater RhB-1. The first unit 403-1 includes a first ejection wiring 107-1 that connects the first ejection heater RhA-1 and the first ejection drive element MD1-1 and a first circulation wiring 108-1 that connects the first circulation heater RhB-1 and the first circulation drive element MD2-1.

[0159] Without particularly distinguishing the first ejection wiring 107-1, the second ejection wiring 107-2, the third ejection wiring 107-3, and the fourth ejection wiring 107-4, they will be referred to as ejection wirings 107 hereinafter. Without particularly distinguishing the first circulation wiring 108-1, the second circulation wiring 108-2, the third circulation wiring 108-3, and the fourth circulation wiring 108-4, they will be referred to as circulation wirings 108 hereinafter.

[0160] The second unit 403-2 includes a second ejection heater RhA-2 that generates energy for ejecting liquid and a second circulation heater RhB-2 that generates energy for circulating liquid. The second unit 403-2 includes a second ejection drive element MD1-2 that drives the second ejection heater RhA-2 and a second circulation drive element MD2-2 that drives the second circulation heater RhB-2. The second unit 403-2 includes a second ejection wiring 107-2 that connects the second ejection heater RhA-2 and the second ejection drive element MD1-2 and a second circulation wiring 108-2 that connects the second circulation heater RhB-2 and the second circulation drive element MD2-2.

[0161] The element substrate 18 includes a first power supply wiring VH (see Fig. 2) that supplies electric power to the first ejection heater RhA-1, the first circulation heater RhB-1, the second ejection heater RhA-2, and the second circulation heater RhB-2. FIG. 6 The first power supply wiring VH includes a first extension portion 402-1 that extends between the first ejection heater RhA-1 and the second ejection heater RhA-2. Without particularly distinguishing the first extension unit 402-1 and the second extension unit 402-2, they will be referred to as extension portions 402 hereinafter.

[0162] The first unit 403-1 and the second unit 403-2 are arranged symmetrically with respect to the first extension portion 402-1. Specifically, the first extension portion 402-1 is located on the boundary line between the first unit 403-1 and the second unit 403-2. The first unit 403-1 and the second unit 403-2 are arranged symmetrically with respect to the boundary line between the first unit 403-1 and the second unit 403-2.

[0163] The first power supply line VH also includes a longitudinal portion 401 extending along the long side of the component substrate 18. A plurality of jet heaters RhA and a plurality of circulating heaters RhB are connected to the longitudinal portion 401 of the first power supply line VH and are supplied with power from the first power supply line VH.

[0164] The component substrate 18 also includes a second power supply line 404 extending along the long side of the component substrate 18. A proximal portion of the first extension 402-1 is connected to the longitudinal portion 401. A distal portion of the first extension 402-1 is connected to the second power supply line 404 via a conductive plug 405. The conductive plug 405 comprises a metallic material as its main component. Examples of materials for the conductive plug 405 include tungsten or copper.

[0165] In this embodiment, when using liquid injection head 1 (see...) FIG. 1 In this orientation, the component substrate 18 is formed by sequentially laminating a first layer, an insulating layer, and a second layer along the Z-direction from bottom to top. The first and second layers contain metals as their main components. For example, the first and second layers are made of aluminum or copper. The first layer ( FIG. 9 The innermost layer includes a first extension 402-1, a longitudinal portion 401, a jet wiring 107, and a loop wiring 108. The insulating layer includes a conductive plug 405. The second layer ( FIG. 9 The first layer (the one at the very front) includes the second power wiring 404.

[0166] The component substrate 18 includes a first unit 403-1, a second unit 403-2, a third unit 403-3, and a fourth unit 403-4 arranged continuously in the Y direction. Similar to the first unit 403-1 and the second unit 403-2, the third unit 403-3 and the fourth unit 403-4 each include a plurality of electrical components.

[0167] The third unit 403-3 includes a third ejection heater RhA-3 that generates energy for ejecting liquid and a third circulation heater RhB-3 that generates energy for circulating liquid. The third unit 403-3 includes a third ejection driving element MD1-3 that drives the third ejection heater RhA-3 and a third circulation driving element MD2-3 that drives the third circulation heater RhB-3. The third unit 403-3 includes a third ejection wiring 107-3 that connects the third ejection heater RhA-3 and the third ejection driving element MD1-3 and a third circulation wiring 108-3 that connects the third circulation heater RhB-3 and the third circulation driving element MD2-3.

[0168] The fourth unit 403-4 includes a fourth ejection heater RhA-4 that generates energy for ejecting liquid and a fourth circulation heater RhB-4 that generates energy for circulating liquid. The fourth unit 403-4 includes a fourth ejection driving element MD1-4 that drives the fourth ejection heater RhA-4 and a fourth circulation driving element MD2-4 that drives the fourth circulation heater RhB-4. The fourth unit 403-4 includes a fourth ejection wiring 107-4 that connects the fourth ejection heater RhA-4 and the fourth ejection driving element MD1-4 and a fourth circulation wiring 108-4 that connects the fourth circulation heater RhB-4 and the fourth circulation driving element MD2-4.

[0169] The element substrate 18 includes a first power supply wiring VH (see FIG. 6) that supplies electric power to the third ejection heater RhA-3, the third circulation heater RhB-3, the fourth ejection heater RhA-4, and the fourth circulation heater RhB-4. FIG. 6 ) The first power supply wiring VH includes a second extension portion 402-2 that extends between the third ejection heater RhA-3 and the fourth ejection heater RhA-4.

[0170] The third unit 403-3 and the fourth unit 403-4 are arranged symmetrically with respect to the second extension portion 402-2. Specifically, the second extension portion 402-2 is located on a boundary line between the third unit 403-3 and the fourth unit 403-4. The third unit 403-3 and the fourth unit 403-4 are arranged symmetrically with respect to the boundary line between the third unit 403-3 and the fourth unit 403-4.

[0171] The first power supply wiring VH can supply electric power to the third ejection heater RhA-3 and the fourth ejection heater RhA-4 with the longitudinal portion 401 and a portion that extends along a direction intersecting the longitudinal portion 401. The above-described configuration can provide an area for arranging the first extension portion 402-1 having a relatively large width (length in the Y direction) between the first ejection heater RhA-1 and the second ejection heater RhA-2.

[0172] The above configuration can also provide a region for arranging the second extended portion 402-2 having a relatively large width (length in the Y direction) between the third jet heater RhA-3 and the fourth jet heater RhA-4.

[0173] Between the second jet heater RhA-2 and the third jet heater RhA-3, the second loop wiring 108-2 and the third loop wiring 108-3 need to be arranged. The widths (lengths in the Y direction) of the second loop wiring 108-2 and the third loop wiring 108-3 are smaller than the width (length in the Y direction) of each extended portion 402. Therefore, it is entirely feasible to arrange two loop wirings 108 between two jet heaters RhA. Note that the arrangement of the plurality of jet heaters RhA and the plurality of loop heaters RhB can be reversed.

[0174] FIG. 10 is a drawing illustrating a comparative example of a wiring configuration with respect to the element substrate 18 of the present embodiment.

[0175] As FIG. 10 shown in , the first unit 403-1 and the second unit 403-2 are arranged in the same orientation. In this way, in this comparative example, the first unit 403-1 and the second unit 403-2 are asymmetrically arranged with respect to the first extended portion 402-1. Likewise, the third unit 403-3 and the fourth unit 403-4 are asymmetrically arranged with respect to the second extended portion 402-2 in the same orientation.

[0176] In FIG. 10 , the element substrate 18 in which two adjacent jet heaters RhA have different lengths in the Y direction, and therefore FIG. 10 , the element substrate 18 in the example of FIG. 9 has the same size in the Y direction as the element substrate 18 in the example of FIG. 9 . One of the two types of jet heaters RhA has the same length in the Y direction as each jet heater RhA used in the example of FIG. 9 , and the other jet heater RhA has a shorter length in the Y direction than the jet heaters RhA used in the example of

[0177] In other words, if all the jet heaters RhA in this comparative example are made to have the same length in the Y direction as the jet heaters RhA used in the example of FIG. 9the length of the entire element substrate 18 in the Y direction increases. As seen from the above, in the comparative example, it is difficult to continuously arrange two jet heaters RhA having a relatively large width (length in the Y direction) in the Y direction. Furthermore, using two types of jet heaters RhA having different sizes complicates control because each jet heater RhA has a different amount of heat generation.

[0178] Furthermore, in this comparative example, it is difficult to satisfy the requirement to arrange a plurality of relatively thin wiring lines (e.g., the jet wiring line 107, the circulation wiring line 108, or both, etc.) between the two jet heaters RhA.

[0179] In contrast, in the element substrate 18 of the present embodiment, two units are arranged to have line symmetry. As a result, a space for continuously arranging jet heaters RhA having a desired size in a predetermined direction is provided. Furthermore, continuously arranging jet heaters RhA (print elements) having a desired size in the space provided in this manner makes it possible to manufacture a print element substrate 3 without causing the element substrate 18 to increase in size.

[0180] Accordingly, the technology according to the present embodiment makes it possible to provide a print element substrate on which print elements, circulation elements, and wiring lines are efficiently arranged.

[0181] [Second Embodiment]

[0182] Hereinafter, a description of components that are the same as or correspond to those in the first embodiment will be omitted, and a description of points of difference from the first embodiment will be given.

[0183] FIG. 11 is a schematic enlarged view that illustrates a portion of the wiring configuration of the element substrate 18 applicable to the second embodiment.

[0184] As FIG. 11 As shown in FIG. 6A, the element substrate 18 of the present embodiment includes a ninth unit 602 including a plurality of units. The ninth unit 602 includes a first unit 403-1, a second unit 403-2, a third unit 403-3, and a fourth unit 403-4.

[0185] In the present embodiment, for ease of description, one of the two second supply ports 32 will be referred to as second supply port 32-1, and the other second supply port 32 will be referred to as second supply port 32-2.

[0186] The second supply port 32-1 is provided so as to extend above the first unit 403-1 and the second unit 403-2. The second supply port 32-1 is located substantially at the center in the X direction of the region including the first unit 403-1 and the second unit 403-2. The first ejection wiring 107-1 and the second ejection wiring 107-2 are provided so as to bypass the second supply port 32-1. The second supply port 32-1 is located between the first ejection wiring 107-1 and the second ejection wiring 107-2 in the Y direction.

[0187] The second supply port 32-2 is provided so as to extend above the third unit 403-3 and the fourth unit 403-4. The second supply port 32-2 is located substantially at the center in the X direction of the region including the third unit 403-3 and the fourth unit 403-4. The third ejection wiring 107-3 and the fourth ejection wiring 107-4 are provided so as to bypass the second supply port 32-2. The second supply port 32-2 is located between the third ejection wiring 107-3 and the fourth ejection wiring 107-4 in the Y direction.

[0188] This configuration also produces the same effect as in the first embodiment.

[0189] [Third Embodiment]

[0190] Hereinafter, the description of components common to the first and second embodiments or corresponding to components in the first and second embodiments will be omitted, and the points of difference from the first and second embodiments will be described.

[0191] FIG. 12 is a schematic enlarged view illustrating a portion of the wiring configuration of the element substrate 18 applicable to the third embodiment.

[0192] As shown in FIG. 12 The element substrate 18 of the present embodiment includes a fifth unit 403-5, a sixth unit 403-6, a seventh unit 403-7, and an eighth unit 403-8. The fifth unit 403-5, the sixth unit 403-6, the seventh unit 403-7, and the eighth unit 403-8 are arranged in this order along the Y direction.

[0193] The fifth unit 403-5 includes a first circulation drive element MD2-1, a first ejection drive element MD1-1, a second circulation drive element MD2-2, and a second ejection drive element MD1-2. The fifth unit 403-5 includes a first ejection heater RhA-1, a second ejection heater RhA-2, a first circulation heater RhB-1, and a second circulation heater RhB-2.

[0194] The fifth unit 403-5 includes the first circulation wiring 108-1 connecting the first circulation drive element MD2-1 and the first circulation heater RhB-1. The fifth unit 403-5 includes the first ejection wiring 107-1 connecting the first ejection drive element MD1-1 and the first ejection heater RhA-1.

[0195] The fifth unit 403-5 includes the second circulation wiring 108-2 connecting the second circulation drive element MD2-2 and the second circulation heater RhB-2. The fifth unit 403-5 includes the second ejection wiring 107-2 connecting the second ejection drive element MD1-2 and the second ejection heater RhA-2.

[0196] The sixth unit 403-6 includes the third ejection drive element MD1-3, the third circulation drive element MD2-3, the fourth ejection drive element MD1-4, and the fourth circulation drive element MD2-4. The sixth unit 403-6 includes the third ejection heater RhA-3, the fourth ejection heater RhA-4, the third circulation heater RhB-3, and the fourth circulation heater RhB-4.

[0197] The sixth unit 403-6 includes the third ejection wiring 107-3 connecting the third ejection drive element MD1-3 and the third ejection heater RhA-3. The sixth unit 403-6 includes the third circulation wiring 108-3 connecting the third circulation drive element MD2-3 and the third circulation heater RhB-3.

[0198] The sixth unit 403-6 includes the fourth ejection wiring 107-4 connecting the fourth ejection drive element MD1-4 and the fourth ejection heater RhA-4. The sixth unit 403-6 includes the fourth circulation wiring 108-4 connecting the fourth circulation drive element MD2-4 and the fourth circulation heater RhB-4.

[0199] The seventh unit 403-7 includes the fifth circulation drive element MD2-5, the fifth ejection drive element MD1-5, the sixth circulation drive element MD2-6, and the sixth ejection drive element MD1-6. The seventh unit 403-7 includes the fifth ejection heater RhA-5, the sixth ejection heater RhA-6, the fifth circulation heater RhB-5, and the sixth circulation heater RhB-6.

[0200] The seventh unit 403-7 includes the fifth circulation wiring 108-5 connecting the fifth circulation drive element MD2-5 and the fifth circulation heater RhB-5. The seventh unit 403-7 includes the fifth ejection wiring 107-5 connecting the fifth ejection drive element MD1-5 and the fifth ejection heater RhA-5.

[0201] The seventh unit 403-7 includes a sixth circulation wiring 108-6 connecting the sixth circulation driving element MD2-6 and the sixth circulation heater RhB-6. The seventh unit 403-7 includes a sixth ejection wiring 107-6 connecting the sixth ejection driving element MD1-6 and the sixth ejection heater RhA-6.

[0202] The eighth unit 403-8 includes a seventh ejection driving element MD1-7, a seventh circulation driving element MD2-7, an eighth ejection driving element MD1-8, and an eighth circulation driving element MD2-8. The eighth unit 403-8 includes a seventh ejection heater RhA-7, an eighth ejection heater RhA-8, a seventh circulation heater RhB-7, and an eighth circulation heater RhB-8.

[0203] The eighth unit 403-8 includes a seventh ejection wiring 107-7 connecting the seventh ejection driving element MD1-7 and the seventh ejection heater RhA-7. The eighth unit 403-8 includes a seventh circulation wiring 108-7 connecting the seventh circulation driving element MD2-7 and the seventh circulation heater RhB-7.

[0204] The eighth unit 403-8 includes an eighth ejection wiring 107-8 connecting the eighth ejection driving element MD1-8 and the eighth ejection heater RhA-8. The eighth unit 403-8 includes an eighth circulation wiring 108-8 connecting the eighth circulation driving element MD2-8 and the eighth circulation heater RhB-8.

[0205] In the present embodiment, a third extension portion 402-3 is provided between the second ejection heater RhA-2 and the third ejection heater RhA-3. Without necessarily distinguishing the third extension unit 402-3 from the fourth extension unit 402-4, they will be referred to as extension portions 402 hereinafter.

[0206] The third extension portion 402-3 extends in the X direction along the short side of the element substrate 18. One end of the third extension portion 402-3 is connected to the second power supply wiring 404 via a conductive plug 405. The other end of the third extension portion 402-3 is connected to the longitudinal portion 401 of the first power supply wiring VH.

[0207] The members constituting the fifth unit 403-5 are arranged symmetrically with respect to the third extension portion 402-3 as the members constituting the sixth unit 403-6. A fourth extension portion 402-4 is provided between the sixth ejection heater RhA-6 and the seventh ejection heater RhA-7.

[0208] The fourth extension portion 402-4 extends in the X direction along the short side of the element substrate 18. One end of the fourth extension portion 402-4 is connected to the second power supply wiring 404 via a conductive plug 405. The other end of the fourth extension portion 402-4 is connected to the longitudinal portion 401 of the first power supply wiring VH. The members constituting the seventh unit 403-7 are arranged symmetrically with respect to the fourth extension portion 402-4 as are the members constituting the eighth unit 403-8. The third extension portion 402-3 and the fourth extension portion 402-4 contain a metal material (e.g., aluminum, copper, etc.) as a main component thereof.

[0209] This configuration also produces the same effect as in the first embodiment.

[0210] Note that, although each unit of the present embodiment includes two ejection heaters, two circulation heaters, and two sets of two types of drain wiring, the numbers can be three or more.

[0211] [Fourth Embodiment]

[0212] Hereinafter, the description of components common to or corresponding to those in the first to third embodiments will be omitted, and the points of difference from the first to third embodiments will be described.

[0213] FIG. 13 is a schematic enlarged view illustrating a portion of the wiring configuration of the element substrate 18 applicable to the fourth embodiment.

[0214] As shown in FIG. 13 In the element substrate 18 of the present embodiment, a second supply port 32-1 is formed between the second ejection wiring 107-2 and the third ejection wiring 107-3. Further, a second supply port 32-2 is also formed between the sixth ejection wiring 107-6 and the seventh ejection wiring 107-7.

[0215] This configuration also produces the same effect as in the first embodiment.

[0216] [Fifth Embodiment]

[0217] Hereinafter, the description of components common to or corresponding to those in the first to fourth embodiments will be omitted, and the points of difference from the first to fourth embodiments will be described.

[0218] FIG. 14 is a schematic enlarged view illustrating a portion of the wiring configuration of the element substrate 18 applicable to the fifth embodiment.

[0219] As shown in FIG. 14As shown, the component substrate 18 of this embodiment includes a tenth unit 902 comprising two ninth units 602. In the following text, for ease of description, one of the two ninth units 602 will be referred to as "ninth unit 602L" and the other ninth unit 602 will be referred to as "ninth unit 602R".

[0220] In the component substrate 18 of this embodiment, at the center of the component substrate 18 in the direction of the short side extension (X direction), a plurality of supply ports 901 (four in this embodiment) for supplying liquid to the ninth unit 602 are formed along the direction of the long side extension (Y direction) of the component substrate 18.

[0221] For ease of description, in the following text, in the plan view of the component substrate 18, the four supply ports 901 will be referred to from top to bottom as "supply port 901-1", "supply port 901-2", "supply port 901-3" and "supply port 901-4". Supply ports 901-1, 901-2, 901-3 and 901-4 supply liquid to the ninth unit 602L and the ninth unit 602R.

[0222] This configuration allows liquid to be supplied to the ninth unit 602L and the ninth unit 602R using a single supply port array consisting of multiple supply ports formed along the Y direction.

[0223] Therefore, compared with the construction of two supply port arrays in the X direction, including a supply port array that supplies liquid only to the ninth unit 602L and a supply port array that supplies liquid only to the ninth unit 602R, the size of the element substrate 18 can be reduced in the X direction.

[0224] Units 9, 602L and 602R, are arranged symmetrically with respect to the center point 180 of unit 10, 902. Note that... FIG. 14 The center point 180 is an imaginary point. This structure can balance the heat generation between the left and right sides of the component substrate 18.

[0225] Therefore, the printing element substrate according to this embodiment enables efficient arrangement of printing elements, circulation elements, and wiring while balancing heat generation.

[0226] [Sixth Embodiment]

[0227] Hereinafter, descriptions of components that are the same as those in the first to fifth embodiments or that correspond to those in the first to fifth embodiments will be omitted, and the differences from the first to fifth embodiments will be described.

[0228] FIG. 15 This is a schematic enlarged view illustrating a portion of the wiring structure of the component substrate 18 applicable to the sixth embodiment.

[0229] As FIG. 15 shown in FIG. 9B, in the element substrate 18 of the present embodiment, two tenth units 902 are arranged in the X direction. Note that more than three tenth units 902 can be arranged in the X direction.

[0230] This configuration also produces the same effect as in the fifth embodiment.

[0231] [Seventh Embodiment]

[0232] Hereinafter, the description of components common to or corresponding to those in the first through sixth embodiments will be omitted, and the points of difference from the first through sixth embodiments will be described.

[0233] FIG. 16A is a plan view of the configuration of the channel in the print element substrate 3 of the present embodiment as viewed along the direction in which droplets are ejected.

[0234] FIG. 16B is a cross-sectional view taken along the XVIb-XVIb line in FIG. 16A . As FIG. 16B shown in FIG. 9B, in the element substrate 18 of the present embodiment, two tenth units 902 are arranged in the X direction. Note that more than three tenth units 902 can be arranged in the X direction. FIG. 3B In the example of FIG. 9B, channels extending in parallel to the Z direction are formed in the element substrate 18. In contrast, as shown in FIG. 9C, channels that expand as they extend in the direction away from the ejection port 11 can be formed in the element substrate 18. This configuration also produces the same effect as in the first embodiment. FIG. 16B

[0235] [Eighth Embodiment]

[0236] Hereinafter, the description of components common to or corresponding to those in the first through seventh embodiments will be omitted, and the points of difference from the first through seventh embodiments will be described.

[0237] FIG. 17A is a plan view of the configuration of the channel in the print element substrate 3 of the present embodiment as viewed along the direction in which droplets are ejected.

[0238] As FIG. 17A shown in FIG. 9B, in the element substrate 18 of the present embodiment, two tenth units 902 are arranged in the X direction. Note that more than three tenth units 902 can be arranged in the X direction.

[0239] ​Further, a plurality of ejection ports 11 are formed along the X direction. Along the X direction, a plurality of ejection port arrays are formed along the X direction, each of which extends in the Y direction. In this way, in the present embodiment, both the number of first supply ports 22 in the X direction and the number of ejection ports 11 in the X direction are increased compared to the first embodiment.

[0240] In the present embodiment, the two ejection ports 11 arranged in the X direction are arranged so as to be offset from each other in the Y direction. By offsetting the ejection ports 11 in the ejection port arrays from each other in the Y direction in this way, it is possible to improve the resolution of printing compared to the case in which the ejection ports 11 included in the ejection port arrays shown in FIG. 17 are aligned in the Y direction. However, these ejection ports 11 need not be offset in the Y direction. FIG. 2B

[0241] At the center in the X direction, no wiring is provided between the supply ports. This configuration improves the degree of freedom of the size of the first supply ports 22 provided at the center in the X direction compared to a configuration in which wiring is provided between the supply ports at the center in the X direction.

[0242] The two ejection ports 11 provided in the X direction are positioned relatively close to each of the first supply ports 22 provided at the center in the X direction. One possible configuration is such that there is no wiring region between the openings in the ink supply port array at the center, thereby increasing the degree of freedom of the size or density of the openings in the ink supply port array at the center. This enables the ejection ports 11 to be rapidly refilled with liquid, improving the productivity of printing compared to a configuration in which the ejection ports 11 are formed relatively far from the first supply ports 22.

[0243] Note that in the present embodiment, the positions of the three first supply ports 22 formed along the X direction are aligned in the Y direction. The positions of the three first supply ports 22 in the Y direction can be offset depending on the positions of the ejection ports 11, the layout of the wiring, or both.

[0244] FIG. 17B is a cross-sectional view taken along the XVII-XVII line in FIG. 17A

[0245] As shown in FIG. 17B In the present embodiment, the element substrate 18 is formed with a passage that expands as it extends away from the two ejection ports 11 formed along the X direction in the -Z direction.

[0246] As described above, the configuration of the present embodiment can reduce the size in the X direction compared to the first embodiment (a configuration in which the configuration shown in FIG. 3 is repeated and arranged in the X direction). The configuration of the present embodiment can further improve the degree of freedom of design.

[0247] FIG. 17C ​​is a diagram illustrating a modification of the passage applicable to the present embodiment.

[0248] FIG. 17B The passages in the element substrate 18 expand as the passages extend away from the ejection port 11. In contrast, as shown in FIG. 17C , the plurality of passages formed in the element substrate 18 can all extend linearly along the Z direction. This configuration can also produce the same effect as the configuration in FIG. 17B .

[0249] [Ninth Embodiment]

[0250] [U-shaped]

[0251] Hereinafter, the description of components common to those in the first to eighth embodiments or corresponding to the components in the first to eighth embodiments will be omitted, and the points of difference from the first to eighth embodiments will be described.

[0252] In the above-described embodiments, straight individual passages 23 (see FIG. 3A , etc.) were provided. A U-shaped passage can be provided. Hereinafter, a liquid ejection head 1 including a U-shaped individual passage 23 (see FIG. 1 ) will be described.

[0253] FIG. 18A to FIG. 18C is a diagram for describing the configuration of the passages in the print element substrate 3 applicable to the present embodiment. FIG. 18A is a schematic plan view of the ejection port 11 and its vicinity, FIG. 18B is a cross-sectional view taken along the line XVIIIb-XVIIIb in FIG. 18A , and FIG. 18C is a close-up view of a focusing passage in the passage in FIG. 18A .

[0254] As shown in FIG. 18A , in the present embodiment, the print element substrate 3 is formed with an individual passage 23 that is U-shaped in a plan view of the print element substrate 3.

[0255] In the present disclosure, the term "U-shaped" means that the shape of the passage including the ejection heater RhA and the circulation heater RhB is U-shaped.

[0256] In the present embodiment, a plurality of U-shaped individual passages 23 are formed in the Y direction. In each U-shaped individual passage 23, its ejection heater RhA and circulation heater RhB are arranged in the Y direction. Thus, in the present embodiment, the ejection heater RhA and the circulation heater RhB are alternately arranged in the direction in which the ejection port array extends.

[0257] In each of the U-shaped individual channels 23, the end portion of the circulating flow 27 that turns back is positioned further out than the array of ejection ports. In the individual channel 23, the circulating flow 27 passes through a portion provided with the circulating heater RhB, then turns back at the end portion of the individual channel 23, and passes through a portion provided with the ejection heater RhA.

[0258] In the present embodiment, a supply groove 42 extending in the Y direction and supplying liquid from the element substrate 18 to the ejection port formation member 19 is formed at the center in the X direction of the print element substrate 3. In the ejection port formation member 19, two arrays of ejection ports extending in the Y direction are formed along the X direction. In a plan view of the print element substrate 3, one of the two arrays of ejection ports is formed on the left side of the supply groove 42, and the other array of ejection ports is formed on the right side of the supply groove 42. In this way, in the present embodiment, liquid is supplied from the supply groove 42 to the individual channels 23 formed on both sides of the supply groove 42.

[0259] In the print element substrate 3, a plurality of individual channels 23 are arranged along the Y direction, and the end portions of these U-shaped individual channels 23 of the circulating flow 27 turn back adjacent to each other along the Y direction.

[0260] As shown in FIG. 6, in a state in which the element substrate 18 and the ejection port formation member 19 are joined together, the supply groove 42 is formed to penetrate the element substrate 18 in the Z direction. The diameter of the supply groove 42 gradually decreases as the supply groove 42 extends in the direction in which liquid is supplied (the Z direction). This configuration can provide a certain flow rate of the supplied liquid. However, this configuration is not essential. FIG. 18B When liquid is ejected from the ejection ports 11, the supply groove 42 formed at the center in the X direction of the element substrate 18 supplies liquid. In the ejection port formation member 19, the individual channels 23 serving as the pressure chambers 12 are formed to spread out from the portions through which liquid is supplied from the supply groove 42. In each of the pressure chambers 12, when liquid is circulated, a flow from both ends toward the center in the X direction and a flow toward the outside are generated. In this way, at the center of the supply groove 42, the inflow and outflow of liquid occur simultaneously. Note that, although one supply groove 42 is formed in the present embodiment, a plurality of first supply ports 22 (see FIG. 1) can be formed as in the first embodiment. In this case, as in the first embodiment, the first supply ports 22 are shared inside the element substrate 18. Even in this configuration, U-shaped individual channels 23 can be formed.

[0261] FIG. 3A With the present embodiment as described above, the ejection heater RhA and the circulating heater RhB can be arranged in a line along the Y direction. Therefore, it is possible to make the width of the print element substrate in the X direction compared to the straight-through type.

[0262] With the present embodiment as described above, the ejection heater RhA and the circulating heater RhB can be arranged in a line along the Y direction. Therefore, it is possible to make the width of the print element substrate in the X direction compared to the straight-through type. ​

[0263] [Eleventh Embodiment]

[0264] Hereinafter, description of components common to or corresponding to those in the first to ninth embodiments will be omitted, and only the points different from the first to ninth embodiments will be described.

[0265] FIG. 19A and FIG. 19B is a diagram illustrating an example of the print element substrate 3 applicable to the present embodiment.

[0266] In the first embodiment, one print element substrate 3 is attached to the liquid ejecting head 1 (see FIG. 2). Four types of liquid are ejected from the one print element substrate 3. A plurality of print element substrates 3 can be attached to the liquid ejecting head 1. For example, as shown in FIG. 19A in the case where the print element substrate 3 is configured to eject two types of liquid, two print element substrates 3 can be attached to the liquid ejecting head 1. This configuration can also produce the same effect as in the first embodiment.

[0267] The liquid ejecting head 1 including one of the print element substrates 3 of the present embodiment and the liquid ejecting head 1 including the other print element substrate 3 can also produce the same effect as in the first embodiment using the print element substrate 3 of the first embodiment. That is, two liquid ejecting heads 1 can be used.

[0268] As shown in FIG. 19B in the case where the print element substrate 3 is configured to eject one type of liquid, four print element substrates 3 can be attached to the liquid ejecting head 1. This configuration can also produce the same effect as in the first embodiment.

[0269] The use of four liquid ejecting heads 1 including respective four print element substrates 3 can also produce the same effect as in the first embodiment.

[0270] Note that in the examples shown in FIG. 19A and FIG. 19B the lengths (lengths in the Y direction) of the plurality of print element substrates 3 are all the same. The lengths of these print element substrates 3 can be different.

[0271] [Eleventh Embodiment]

[0272] Hereinafter, description of components common to or corresponding to those in the first to tenth embodiments will be omitted, and only the points different from the first to tenth embodiments will be described.

[0273] FIG. 20 is a diagram illustrating an example of the liquid ejecting apparatus 50 applicable to the present embodiment.

[0274] In the first embodiment, the liquid is supplied from the main tank 2 (see FIG. 1 ) to the sub tank 54. Even in the case where the main tank 2 is not provided, the technology according to the present disclosure is equally applicable.

[0275] As shown in FIG. 20 , the liquid ejection device 50 of the present embodiment includes a cartridge configured to be attachable to or detachable from the liquid ejection head 1.

[0276] With this configuration, when the liquid in the cartridge is depleted, the cartridge is replaced with a new cartridge, so that the ejection of the liquid can be restored. Note that a head cartridge that integrates the liquid ejection head 1 and the cartridge can be detachably mounted on the cradle 60. This configuration can also produce the same effect as in the first embodiment.

[0277] [Twelfth Embodiment]

[0278] Hereinafter, the description of components common to or corresponding to those in the first to eleventh embodiments will be omitted, and the points different from the first to eleventh embodiments will be described.

[0279] FIG. 21 is a schematic cross-sectional view for describing the configuration of the passages in the print element substrate 3 applicable to the present embodiment. FIG. 21 illustrates another example of a cross-sectional view taken along the line IIIb-IIIb of FIG. 3A .

[0280] In the element substrate 18 of the first embodiment, the passages located on the upstream side of the first supply port 22 and on the downstream side of the second supply port 32 are shared as the common passage 24. The passages on the upstream side of the first supply port 22 and on the downstream side of the second supply port 32 can be formed separately. For example, as shown in FIG. 21 , the element substrate 18 of the present embodiment is formed with a first substrate passage 221 for supplying the liquid to the first supply port 22 and a second substrate passage 222 for collecting the liquid supplied from the second supply port 32. This configuration can also produce the same effect as in the first embodiment.

[0281] [Other Embodiments]

[0282] The first to twelfth embodiments have been described above. The values, forms, numbers, and the like to which the technology according to the present disclosure is applicable are not limited to the above-described examples. The values, forms, numbers, and the like described above can be appropriately changed according to the configuration of the print element substrate.

[0283] The number of ejection ports constituting an ejection port array is not limited to the number of examples. For example, the number can be an even larger number, such as 512. In the above examples, two nozzle arrays are formed as nozzle arrays that can eject one type of liquid. The number of nozzle arrays that can eject one type of liquid can be one, or can be three or more.

[0284] Note that the device to which the technology according to the present disclosure is applicable is not limited to a serial liquid ejection device. For example, the technology according to the present disclosure can be applied to a page width liquid ejection device in which a line-type ejection head (page width ejection head) that is long in the page width direction (X direction) of a print medium P is used to eject liquid onto a print medium P that is conveyed in a conveyance direction to perform printing.

[0285] In the above-described examples, ink is used as the liquid. However, the liquid to which the technology according to the present disclosure can be used is not limited to ink. In addition to ink, various printing liquids can be used, including treatment liquids for improving the fixing properties of ink on a print medium, reducing gloss unevenness, and improving abrasion resistance.

[0286] The technology according to the present disclosure enables a print element substrate on which print elements, circulation elements, and wiring are efficiently arranged to be provided.

[0287] While the present disclosure has been described with reference to the examples, it is to be understood that the present disclosure is not limited to the disclosed examples. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A printed component substrate, comprising: The first unit includes a first element and a second element; The second unit includes the third and fourth elements; as well as The power wiring includes a first part and a second part. The first part supplies power to the first unit, and the second part supplies power to the second unit. The power wiring includes an extension that runs along the boundary line between the first unit and the second unit. The first and third elements are arranged symmetrically with respect to the extension portion. The second and fourth elements are arranged symmetrically with respect to the extension portion, and The first and second parts are arranged symmetrically with respect to the extended portion.

2. The printed element substrate according to claim 1, wherein... The first element and the second element have different dimensions. The third and fourth components have different dimensions. The first element and the third element have the same dimensions, and The second element and the fourth element have the same dimensions.

3. The printed element substrate according to claim 1, wherein... The first element and the third element are arranged along a first direction to form a first element array, the first direction intersecting the extension portion, and The second and fourth elements are arranged along the first direction to form a second element array.

4. The printed element substrate according to claim 1, wherein... The first and third elements are jetting elements used for spraying liquid. The first unit also includes: The first injection drive element that drives the first component; as well as The first injection wiring connects the first element and the first injection drive element. The second unit also includes: The second injection drive element drives the third element; as well as The second injection wiring connects the third element and the second injection drive element. The first injection drive element and the second injection drive element are arranged symmetrically with respect to the boundary line, and The first injection wiring and the second injection wiring are arranged symmetrically with respect to the boundary line.

5. The printed element substrate according to claim 4, wherein... The second and fourth elements are circulation elements used to circulate the liquid. The first unit also includes: The first cyclic drive element that drives the second element; as well as The first loop wiring connects the second element and the first loop drive element. The second unit also includes: The second cycle drive element drives the fourth element; as well as The second loop wiring connects the fourth element and the second loop drive element. The first and second cyclic drive elements are arranged symmetrically with respect to the boundary line, and The first and second loop wirings are arranged symmetrically with respect to the boundary line.

6. The printing element substrate of claim 5, wherein the first element is arranged closer to the first jet driving element and the first cycle driving element than the second element.

7. The printed element substrate according to claim 4, further comprising: A first supply port supplies liquid to both the first channel and the second channel. The first channel supplies liquid to the first and second elements, and the second channel supplies liquid to the third and fourth elements. A first supply port is located between the first injection line and the second injection line in a first direction intersecting the boundary line.

8. The printed element substrate according to claim 7, wherein a plurality of first supply ports are provided in a first direction, and each first supply port is a first supply port.

9. The printed element substrate according to claim 8, wherein... The first supply port is configured to extend above the first and second units, and The first supply port is located at the center of the area that includes the first unit and the second unit.

10. The printed element substrate according to claim 5, wherein The first loop wiring is not located between the second and fourth components, and The first injection wiring is not located between the first element and the third element.

11. The printed element substrate according to claim 7, further comprising: The third unit includes the fifth and sixth elements; The fourth unit includes the seventh and eighth elements; as well as The second power supply wiring includes sections three and four. Section three supplies power to unit three, and section four supplies power to unit four. The second power supply wiring includes a second extension that extends along the second boundary line between the third unit and the fourth unit. The fifth and seventh elements are arranged symmetrically with respect to the second extension. The sixth and eighth elements are arranged symmetrically with respect to the second extension, and The units including the first unit and the second unit are arranged symmetrically with respect to the third boundary line between the second unit and the third unit.

12. The printed element substrate according to claim 11, wherein The fifth and seventh elements are injection elements used for spraying liquids, and The sixth and eighth elements are circulation elements used to circulate the liquid.

13. The printed element substrate according to claim 11, wherein a plurality of first supply ports are provided in a first direction, each first supply port being a first supply port.

14. The printed element substrate according to claim 7, further comprising: The third unit includes the fifth and sixth elements; The fourth unit includes the seventh and eighth elements; as well as The second power supply wiring includes sections three and four. Section three supplies power to unit three, and section four supplies power to unit four. The second power supply wiring includes a second extension that extends along the second boundary line between the third unit and the fourth unit. The fifth and seventh elements are arranged symmetrically with respect to the second extension. The sixth and eighth elements are arranged symmetrically with respect to the second extension. The third and fourth parts are arranged symmetrically with respect to the second extension, and The fifth and sixth units are arranged symmetrically with respect to a predetermined point. The fifth unit includes the first and second units, and the sixth unit includes the third and fourth units.

15. The printed element substrate according to claim 14, wherein two units, each comprising a first unit, a second unit, a third unit, and a fourth unit, are symmetrically arranged with respect to a predetermined point.

16. The printed element substrate according to claim 14, wherein The printed element substrate also includes a second supply port for supplying liquid to a first channel on which a first element and a second element are disposed, and a second channel on which a third element and a fourth element are disposed. The second supply port is different from the first supply port. The first element and the second element are arranged between the first supply port and the second supply port in the direction in which the boundary line extends.

17. The printed element substrate according to claim 16, wherein a plurality of second supply ports are provided in a first direction, each second supply port being a second supply port.

18. The printing element substrate of claim 1, further comprising an ejector forming member, the ejector forming member including an ejector formed therein and from which liquid is ejected by a drive of the first element and the third element.

19. The printed element substrate according to claim 1, wherein The materials constituting the substrate of the printed element include: Including the first layer of metal; as well as The second layer includes metal.

20. The printed element substrate of claim 19, wherein at least one of the first layer and the second layer comprises aluminum.

21. The printed element substrate of claim 19, wherein at least one of the first layer and the second layer comprises copper.

22. The printed element substrate according to claim 15, further comprising: Power supply wiring for supplying power to the power supply wiring, wherein The power wiring is located in the first layer, and The power supply wiring is located on the second floor.

23. A liquid injection head, comprising: A printed element substrate, the printed element substrate including a first unit, a second unit and a power wiring including a first part and a second part, the first unit including a first element and a second element, the second unit including a third element and a fourth element, the first part supplying power to the first unit, and the second part supplying power to the second unit; as well as A tank for storing the liquid to be supplied to the printed component substrate. The power wiring includes an extension that runs along the boundary line between the first unit and the second unit. The first and third elements are arranged symmetrically with respect to the extension portion. The second and fourth elements are arranged symmetrically with respect to the extension portion, and The first and second parts are arranged symmetrically with respect to the extended portion.

24. A liquid injection device, comprising: A printed element substrate, the printed element substrate including a first unit, a second unit and a power wiring including a first part and a second part, the first unit including a first element and a second element, the second unit including a third element and a fourth element, the first part supplying power to the first unit, and the second part supplying power to the second unit; as well as A tank for storing the liquid to be supplied to the substrate of the printed component; as well as A transport unit used to transport printing media. The power wiring includes an extension that runs along the boundary line between the first unit and the second unit. The first and third elements are arranged symmetrically with respect to the extension portion. The second and fourth elements are arranged symmetrically with respect to the extension portion, and The first and second parts are arranged symmetrically with respect to the extended portion.

Images