Wafer image acquisition method and device, terminal equipment and readable storage medium

Abstract

The embodiment of the invention discloses a wafer image acquisition method and device, terminal equipment and a readable storage medium. The method comprises the following steps: controlling a motion table in wafer scanning equipment to move based on a motion control parameter so as to control a wafer to move on the motion table based on a target motion track; based on the scanning control parameter, controlling an image acquisition device in the wafer scanning device to scan the moving wafer to obtain a wafer image, the target movement track comprising a plurality of scanning feature points, and one scanning feature point corresponding to one movement radius; when the wafer moves to a target scanning feature point, adjusting a motion control parameter and / or a scanning control parameter; the motion radius corresponding to the target scanning feature point is smaller than or equal to the radius threshold value of the circle center area, the scanning precision of the wafer image can be improved, the wafer detection accuracy is improved, and the applicability is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and particularly relates to a wafer image acquisition method and device, a terminal device and a readable storage medium. BACKGROUND

[0002] In the production process of a semiconductor, semiconductor detection technology plays a vital role in the processes of semiconductor design, production, packaging and testing, and is a key to improving the production yield. When detecting a wafer semiconductor, an ultra-high resolution linear array camera is often used to scan the wafer and splice the scanned images into a complete wafer picture. How to improve the scanning efficiency and scanning accuracy of the center area of the wafer is a key to obtaining a high-quality wafer picture for wafer detection.

[0003] In the scanning process of the wafer, the wafer can be scanned according to an Archimedes spiral or a concentric circle scanning track. However, the radius of the center area of the wafer is small, and the inner diameter and the outer diameter of the scanning track of the linear array camera in the center area of the wafer are greatly different, so that the scanning speed of the linear array camera in the inner circle and the outer circle of the scanning track is inconsistent when the linear array camera scans the wafer, and thus the scanning speed and the line frequency of the linear array camera are mismatched, resulting in the phenomenon that the scanned wafer image is compressed in the inner circle of the scanning track and stretched in the outer circle of the scanning track. At the same time, the scanning speed of the linear array camera in the inner circle and the outer circle of the scanning track is inconsistent when the linear array camera scans the wafer, resulting in the phenomenon that the scanned wafer image is locally or totally overexposed, the scanning accuracy of the wafer image is poor, the wafer detection error rate is high, and the applicability is poor. SUMMARY

[0004] The present application provides a wafer image acquisition method and device, a terminal device and a readable storage medium, which can improve the scanning accuracy of the wafer image, improve the accuracy of wafer detection, and have strong applicability.

[0005] In a first aspect, the embodiments of the present application provide a wafer image acquisition method, which comprises: controlling a motion stage in a wafer scanning device to move based on motion control parameters to control a wafer to move on the motion stage based on a target motion trajectory; and controlling an image acquisition device in the wafer scanning device to scan the wafer in motion to obtain a wafer image based on scanning control parameters, wherein the target motion trajectory comprises a plurality of scanning feature points, and each scanning feature point corresponds to a motion radius; when the wafer moves to a target scanning feature point, the motion control parameters and / or the scanning control parameters are adjusted; and the motion radius corresponding to the target scanning feature point is less than or equal to a center area radius threshold. In the present application, when the wafer carried on the motion stage moves to a target scanning feature point with a motion radius less than or equal to a center area radius threshold, the motion control parameters or the scanning control parameters can be adjusted, so as to improve the scanning accuracy of the wafer image and the accuracy of wafer detection, and the applicability is strong.

[0006] In a possible implementation of the first aspect, the controlling the motion stage in the wafer scanning device to move based on the motion control parameters to control the wafer to move on the motion stage based on the target motion trajectory comprises: obtaining a plurality of motion radii corresponding to the plurality of scanning feature points based on the motion control parameters, generating a target motion trajectory of the wafer motion based on the plurality of motion radii; and controlling the motion stage to move from outside to inside based on the target motion trajectory to control the wafer to move on the motion stage based on the target motion trajectory; wherein the target motion trajectory comprises a concentric circle trajectory or a spiral trajectory, the concentric circle trajectory comprises a plurality of concentric circle trajectories, the plurality of scanning feature points are included in each circle trajectory, and the motion radii corresponding to the scanning feature points on each circle trajectory decrease from outside to inside; and the spiral trajectory comprises the plurality of scanning feature points, and the motion radii corresponding to the plurality of scanning feature points decrease from outside to inside. In the present application, the motion stage can be accurately controlled to move from outside to inside based on the concentric circle trajectory or the spiral trajectory based on the motion control parameters, so as to further improve the scanning accuracy of the wafer image, thereby improving the accuracy of wafer detection, and the method can be applied to different wafer motion trajectories, and the applicability is stronger.

[0007] In a possible implementation of the first aspect, the image acquisition device comprises a light source and a camera; and the scanning the wafer in motion by the image acquisition device based on the scanning control parameter to obtain the wafer image comprises: controlling the light source to illuminate the wafer based on a target light intensity that matches the motion speed of the motion stage based on the scanning control parameter; and controlling the camera to scan the wafer based on a target integral order that matches the target light intensity to obtain the wafer image based on the scanning control parameter while the light source is illuminating the wafer. In this way, the light source can be controlled to illuminate the wafer based on the scanning control parameter, and the camera can be controlled to scan the wafer based on the scanning control parameter while the light source is illuminating the wafer, so that the scanning accuracy of the wafer image can be further improved by controlling the light source and the camera, and the accuracy of wafer detection can be improved.

[0008] In a possible implementation of the first aspect, the motion control parameter comprises a speed control parameter of the motion stage; and the adjusting the motion control parameter comprises: adjusting the speed control parameter based on the motion radius corresponding to the target scanning feature point, so that the motion speed of the motion stage is reduced based on the adjusted speed control parameter, and the smaller the motion radius corresponding to the target scanning feature point, the smaller the motion speed of the motion stage controlled based on the motion control parameter. In this way, the motion speed of the motion stage can be reduced based on the speed control parameter, so that the motion speed of the motion stage is smaller when the motion radius is smaller, and the speed difference between the inner side and the outer side of the wafer image during camera scanning is reduced, so that the image distortion phenomenon caused by the mismatch between the scanning frequency of the camera and the motion speed is reduced, and thus the scanning accuracy of the wafer image can be further improved by changing the motion speed of the wafer, and the accuracy of wafer detection can be improved.

[0009] In a possible implementation of the first aspect, the scanning control parameter comprises a light intensity control parameter of the light source; and the adjusting the scanning control parameter comprises: adjusting the light intensity control parameter based on the motion speed of the motion stage, so that the target light intensity is reduced based on the adjusted light intensity control parameter, and the smaller the motion speed, the smaller the target light intensity of the light source controlled based on the light intensity control parameter. In this way, the target light intensity can be reduced based on the light intensity control parameter, so that the target light intensity matches the motion speed, and the wafer image is prevented from being overexposed, and thus the light source can be more accurately controlled by controlling the target light intensity, and the scanning accuracy of the wafer image can be further improved, and the accuracy of wafer detection can be improved.

[0010] In one possible implementation of the first aspect, the motion control parameters include motion radius control parameters for the motion stage; adjusting the motion control parameters includes: adjusting the motion radius control parameters based on the motion radius corresponding to the target scanning feature point, so as to control the reduction of the motion radius based on the adjusted motion radius control parameters, wherein the smaller the motion radius corresponding to the target scanning feature point, the smaller the reduction of the motion radius obtained based on the motion radius control parameters. In this application, the reduction of the motion radius can be reduced by using motion radius control parameters, thereby reducing the difference in motion radius between the inner and outer sides of the camera due to the length of the camera itself during camera scanning. Therefore, image distortion can be reduced while controlling camera scanning, thereby further improving the scanning accuracy of wafer images and improving the accuracy of wafer inspection.

[0011] In one possible implementation of the first aspect, the scanning control parameters include the camera's integration order control parameters; adjusting the scanning control parameters includes: adjusting the integration order control parameters based on the motion radius corresponding to the target scanning feature point, so as to control the reduction of the target integration order of the camera based on the adjusted integration order control parameters; the smaller the motion radius, the smaller the target integration order of the camera controlled by the integration order control parameters. In this application, the target integration order of the camera can be reduced by the integration order control parameters to reduce the overlap rate of the wafer image, thereby reducing the ghosting phenomenon of the wafer image. Therefore, the integration order of the camera can be precisely controlled to further improve the scanning accuracy of the wafer image and improve the accuracy of wafer inspection.

[0012] In one possible implementation of the first aspect, the scanning control parameters further include light intensity control parameters for the light source; adjusting the scanning control parameters includes: adjusting the light intensity control parameters based on the target integration order of the camera, so as to control the target light intensity to increase based on the adjusted light intensity control parameters, so that the target light intensity matches the target integration order; the smaller the target integration order, the greater the target light intensity of the light source controlled by the light intensity control parameters. In this application, the target light intensity of the light source can be adjusted based on the precise control of the camera integration order to prevent the wafer image from being too dark, thereby further improving the scanning accuracy of the wafer image and improving the accuracy of wafer inspection.

[0013] Secondly, embodiments of this application provide a wafer image acquisition apparatus, which includes modules or units for performing the wafer image acquisition method provided by the first aspect or any possible implementation of the first aspect.

[0014] For example, the device includes:

[0015] The first control unit is configured to control a motion stage in a wafer scanning device to move based on a motion control parameter, so as to control a wafer to move on the motion stage based on a target motion trajectory.

[0016] The second control unit is configured to control an image acquisition device in the wafer scanning device to scan the wafer in motion based on a scanning control parameter, so as to obtain a wafer image. The target motion trajectory includes a plurality of scanning feature points, and each scanning feature point corresponds to a motion radius.

[0017] The adjusting unit is configured to adjust the motion control parameter and / or the scanning control parameter when the wafer moves to a target scanning feature point. The motion radius corresponding to the target scanning feature point is less than or equal to a center region radius threshold.

[0018] In a third aspect, an embodiment of the present application provides a terminal device, including a processor and a memory. The processor is connected to the memory. The memory is configured to store program code. The processor is configured to call the program code to execute the wafer image acquisition method provided in the first aspect or any possible implementation manner of the first aspect.

[0019] In a fourth aspect, an embodiment of the present application provides a wafer image acquisition system, including a motion stage, an image acquisition device, and the terminal device of the third aspect. The motion stage is configured to carry a wafer. The image acquisition device is configured to acquire a wafer image.

[0020] In a fifth aspect, an embodiment of the present application provides a computer readable storage medium. The computer readable storage medium stores a computer program. The computer program is suitable for being loaded by a processor and executing the wafer image acquisition method provided in the first aspect or any possible implementation manner of the first aspect.

[0021] In a sixth aspect, an embodiment of the present application provides a computer program product. The computer program product includes computer instructions. The computer instructions are suitable for being loaded by a processor and executing the wafer image scanning method provided in the first aspect or any possible implementation manner of the first aspect. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 FIG. 1 is a schematic diagram of an architecture of a wafer image acquisition system provided by an embodiment of the present application;

[0023] Figure 2 FIG. 2 is a schematic diagram of a concentric circle trajectory provided by an embodiment of the present application;

[0024] Figure 3 FIG. 3 is a schematic diagram of a spiral trajectory provided by an embodiment of the present application;

[0025] Figure 4is a flowchart of a wafer image acquisition method provided by an embodiment of the present application;

[0026] Figure 5 is another flowchart of a wafer image acquisition method provided by an embodiment of the present application;

[0027] Figure 6 is a structural diagram of a wafer image acquisition device provided by an embodiment of the present application;

[0028] Figure 7 is a structural diagram of a terminal device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0030] For ease of understanding, the following simple explanations are first given for some nouns:

[0031] 1. Concentric circular trajectory, including a plurality of circular trajectories with the same center position, and the movement radius corresponding to each circular trajectory decreases from the outside to the inside. Each circular trajectory in the concentric circular trajectory includes at least one scanning feature point, and at least one scanning feature point includes a key scanning feature point. For example, one of the at least one scanning feature point in a circular trajectory can be determined as a key scanning feature point. The above key scanning feature point is used to indicate that the scanning of the circular trajectory corresponding to the key feature point is completed. In the embodiments of the present application, the above key scanning feature point can be determined as a target scanning feature point.

[0032] 2. Spiral trajectory, which can be an Archimedes spiral or a spiral derived from an Archimedes spiral, including at least one scanning feature point and at least one target scanning feature point. The spiral trajectory can also be understood as connecting at least one scanning feature point by a spiral line.

[0033] 3. Pitch, which can also be referred to as horizontal progressive distance, is the distance between two adjacent threads along the direction of the spiral line. Generally, it refers to the axial distance between the two points on the pitch diameter line corresponding to the adjacent two teeth on the thread.

[0034] 4. Scanning feature point, used to indicate the position of the wafer scanned by the image acquisition device. When the motion stage or the wafer moves to the scanning feature point, the image acquisition device can be triggered to scan the wafer.

[0035] 5. Target scanning feature point, used to indicate the position of adjusting the motion control parameter and / or the scanning control parameter. When the motion stage or the wafer moves to the target scanning feature point, the terminal device can be triggered to adjust the motion control parameter and / or the scanning control parameter.

[0036] 6. Integration order, usually refers to the number of times of exposure and accumulation of the same target by the camera in the imaging process. This technology can improve the sensitivity and signal-to-noise ratio of the camera, thereby improving the image quality.

[0037] The wafer image acquisition method provided by the embodiments of the present application can be applied to the wafer image acquisition scene in wafer production, the wafer image acquisition scene in wafer detection, etc., and can adjust the motion control parameter and / or the scanning control parameter in the scanning process of the wafer image to reduce the image distortion when acquiring the wafer image of the center area of the wafer, so that the scanning accuracy of the wafer image is improved, the accuracy of wafer detection is improved, and the applicability is strong. For ease of description, the wafer image acquisition scene in wafer detection is taken as an example for description.

[0038] For ease of understanding, the architecture of the wafer image acquisition system is first described, and the wafer image acquisition method described above can be used in the wafer image acquisition system. Please refer to Figure 1 , Figure 1 is the architecture schematic diagram of the wafer image acquisition system provided by the embodiments of the present application. As shown in Figure 1 , the wafer image acquisition system can include a motion stage 1a, an image acquisition device 1b, and a terminal device 1c. The motion stage 1a and the image acquisition device 1b are wafer scanning devices for wafer scanning, and the terminal device 1c can control the motion stage 1a and the image acquisition device 1b as a control system. For example, it can be a device such as a tablet computer for storing and calling program code to execute the wafer image acquisition method. Optionally, the terminal device 1c can include a processor and a controller, wherein the processor can be a device such as a host computer that can be used to receive and process wafer images, and the controller can be a motion controller or other type of controller, which is not limited by the present application. Optionally, the processor and the controller can be integrated into one functional module, for example, integrated into a central processing functional module in the motion controller, to realize the functions realized by the processor and the controller. The specific form can be determined according to the specific form of the product, which is not limited herein. For example, the wafer image acquisition system can include a motion stage 1a, an image acquisition device 1b, and a terminal device 1c, and the terminal device 1c has a microprocessor built-in, which is used to execute the implementation mode executed by the central processing functional module.

[0039] The motion table 1a can be an X / Z / Theta-axis motion table, or other motion table capable of carrying a wafer. The present application does not limit the motion table 1a, and only takes the X / Z / Theta-axis motion table as an example for description. It can be understood that the motion table 1a can move on the X-axis, Z-axis and Theta-axis, corresponding to horizontal movement, vertical movement and rotation angle movement respectively. The motion table 1a can be used to carry a wafer and adjust the wafer position through movement. Optionally, the motion table 1a can also include a Y-axis motion table, which can carry a wafer to move longitudinally. The motion table 1a can move according to the target motion trajectory determined by the terminal device 1c. The target motion trajectory can be a concentric circle trajectory or a spiral trajectory. The target motion trajectory includes a plurality of scanning feature points, and each scanning feature point corresponds to a motion radius. The image acquisition device 1b can include a camera 1e and a light source 1d. The image acquisition device 1b can be a line array camera or other device capable of acquiring wafer images. The present application does not limit the image acquisition device 1b, and only takes the line array camera as an example for description. The light source 1d can be a laser or other device capable of providing illumination when the camera 1e acquires a wafer image. The present application does not limit the light source 1d, and only takes the laser as an example for description.

[0040] To facilitate understanding of the application of the wafer image acquisition method provided by the present application in the wafer image acquisition system, the terminal device 1c is taken as the execution subject of the wafer image acquisition method in the embodiments of the present application. The terminal device 1c can be a device integrated with a processor (which can be a host computer), a controller (which can be a motion controller), a memory and other functional modules.

[0041] In some possible embodiments, the terminal device 1c can acquire the motion control parameters of the motion table 1a, and then generate the motion control instructions of the motion table 1a based on the motion control parameters to control the motion table 1a to move based on the target motion trajectory, so that the wafer carried by the motion table 1a moves with the motion table 1a. The terminal device 1c can also acquire the scanning control parameters of the image acquisition device 1b, and then control the light source 1d to illuminate the wafer based on the scanning control parameters, and control the camera 1e to acquire the wafer image of the wafer according to the target integral order. The target motion trajectory includes a plurality of scanning feature points, and each scanning feature point corresponds to a motion radius.

[0042] The aforementioned motion control parameters may include the speed control parameters of the motion stage 1a and / or the motion radius control parameters of the motion stage 1a; the aforementioned scanning control parameters may include the light intensity control parameters of the light source 1d and / or the integration order control parameters of the camera 1e. The aforementioned speed control parameters are used to generate speed control commands to control the motion speed of the motion stage 1a; the aforementioned motion radius control parameters are used to generate motion radius control commands to control the motion radius corresponding to the target scanning feature point; the aforementioned integration order control parameters are used to generate integration order control commands to control the target integration order of the camera 1e; the aforementioned light intensity control parameters are used to generate light intensity control commands to control the target light intensity of the light source 1d. It is understood that the aforementioned target light intensity should match both the motion speed of the motion stage 1a and the target integration order of the camera 1e, thereby preventing the obtained wafer image from being overexposed or underexposed.

[0043] When terminal device 1c detects that the aforementioned motion radius is greater than the center region radius threshold, it indicates that the area scanned by image acquisition device 1b is the outer region of the wafer (i.e., the non-center region). The motion radius reduction rate of motion stage 1a, motion speed, target light intensity of light source 1d, and target integration order of camera 1e can be kept constant. When terminal device 1c detects that the aforementioned motion radius is less than or equal to the center region radius threshold, it indicates that the area scanned by image acquisition device 1b is the center region of the wafer. Then, one or more of the motion radius reduction rate of motion stage 1a, motion speed, target light intensity of light source 1d, or target integration order of camera 1e can be adjusted to reduce image distortion in the acquired wafer image. The aforementioned center region is determined based on historical wafer scanning data. Based on historical data, areas with severe wafer image distortion can be identified, and the maximum value of the motion radius corresponding to these areas can be determined as the center region radius threshold. This center region radius threshold is configured in terminal device 1c so that terminal device 1c can call the center region radius threshold when scanning the wafer.

[0044] Optionally, in some feasible implementations, the terminal device 1c can adjust the reduction range of the motion radius of the motion stage 1a. The terminal device 1c can first determine the positions and motion radii of multiple scanning feature points that need to be scanned on the wafer, and then generate a target motion trajectory for the wafer motion based on these multiple scanning feature points. The target motion trajectory can be a concentric circle trajectory or a spiral trajectory, etc. See [link to relevant documentation]. Figure 2 , Figure 2 This is a schematic diagram of a concentric circle trajectory provided in an embodiment of this application. The concentric circle trajectory includes multiple concentric circle trajectories, such as... Figure 2 The first circle trajectory, the second circle trajectory, the third circle trajectory, ..., the Nth circle trajectory shown Figure 2 (Not all shown), each circular trajectory includes at least one scan feature point ( Figure 2(Not all are shown in the image), and the motion radius corresponding to the scanning feature points on each circular trajectory decreases with each circle from the outside in. Each circular trajectory may include a key scanning feature point, which indicates the start or completion of the circular trajectory scanning. It should be noted that during camera scanning, because the scanning trajectory is arc-shaped and has a scanning width, the scanning speed (i.e., linear speed) differs between the inner and outer sides, resulting in a mismatch between the camera's image capture frequency and scanning speed, leading to phenomena such as wafer image compression, stretching, and distortion. Figure 2 Taking scanning feature point a as an example, when the camera scans the aforementioned scanning feature point a to obtain a wafer image, there is a scanning width b, which causes the scanning speeds of the inner and outer sides to differ. Therefore, the deformation of the wafer image can be reduced by decreasing the difference in motion radius between the first and second circular trajectories (also known as pitch or horizontal progression distance), and / or reducing the motion speed of the stage, and / or reducing the target integration order of the camera.

[0045] The aforementioned motion stage 1a can begin its movement from a key scanning feature point in the circular trajectory. This is the first time it passes the key scanning feature point, which indicates the start of scanning. After the motion stage 1a completes one revolution based on the circular trajectory, it can return to the key scanning feature point, which is the second time it passes the key scanning feature point, indicating the completion of scanning. The aforementioned motion radius is the distance from the scanning feature point to the center of the circle. The direction of the motion stage can be clockwise or counterclockwise, and this application does not impose any restrictions on this. The terminal device 1c can control the motion stage 1a to switch to the key scanning feature point of the next circular trajectory, ordered from the outside to the inside, to begin scanning the next circular trajectory. In the aforementioned order from the outside to the inside, the motion radius corresponding to the scanning feature point in the target motion trajectory located on the outer side is greater than the motion radius corresponding to the scanning feature point in the target motion trajectory located on the inner side.

[0046] If the motion radius corresponding to the key scanning feature point is greater than the threshold of the radius of the circle center region, the motion radius difference (which can also be referred to as a horizontal progressive distance) between two adjacent circle tracks in an order from outside to inside can be the same. Alternatively, the motion radius difference between two adjacent circle tracks can also be different, which should be determined according to the specific form of the product, and the present application does not make any limitation in this regard. For example, the difference between the motion radius corresponding to the scanning feature point on the first circle track and the motion radius corresponding to the scanning feature point on the second circle track is different from the difference between the motion radius corresponding to the scanning feature point on the second circle track and the motion radius corresponding to the scanning feature point on the third circle track. If the motion radius corresponding to the key scanning feature point is less than or equal to the threshold of the radius of the circle center region, the key scanning feature point can be regarded as a target scanning feature point, that is, when the wafer moves to the target scanning feature point, the motion control parameter and / or the scanning control parameter can be adjusted. For example, the motion radius difference between two adjacent circle tracks in an order from outside to inside can be reduced.

[0047] It should be noted that one concentric circle track can include a plurality of circle tracks, and one circle track includes one key scanning feature point. Therefore, one concentric circle track can include a plurality of key scanning feature points, and the plurality of key scanning feature points can be regarded as a plurality of target scanning feature points, so that the terminal device 1c adjusts the motion control parameter and / or the scanning control parameter when the wafer moves to the target scanning feature point. Alternatively, in some feasible embodiments, if the motion control parameter and / or the scanning control parameter need to be adjusted multiple times in one circle track, the circle track can include a plurality of key scanning feature points.

[0048] Referring to Figure 3 , Figure 3 is a schematic diagram of a spiral track provided by an embodiment of the present application. As shown in Figure 3 , the spiral track can be an Archimedes spiral, and a plurality of scanning feature points are connected by one spiral line. The plurality of scanning feature points can include at least one key scanning feature point, and the motion radius corresponding to the plurality of scanning feature points in an order from outside to inside decreases. The motion radius is the distance between the scanning feature point and the circle center, and the motion radius corresponding to the scanning feature point located on the outside is greater than the motion radius corresponding to the scanning feature point located on the inside. For example, when the difference between the two motion radii corresponding to two scanning feature points is greater than an adjustment threshold, the scanning feature point located on the inside is regarded as a key scanning feature point. When the motion radius of the key scanning feature point is less than or equal to the threshold of the radius of the circle center region, the key scanning feature point can be regarded as a target scanning feature point. It should be noted that Figure 3The key scanning feature points and the selection of the scanning feature points shown are only examples, and the application does not limit the selection method. The actual product form should be determined. When the terminal device 1c controls the motion stage 1a to move to the target scanning feature point, the motion control parameter and / or the scanning control parameter can be adjusted. For example, the pitch of the spiral trajectory (also referred to as the horizontal progression distance) can be reduced. It should be noted that the reason for the image distortion in the spiral trajectory is the same as that in the concentric circle trajectory, i.e. Figure 3 As shown, when the camera scans the scanning feature point c, there is a scanning width d, resulting in different scanning speeds on the inside and outside, and thus causing the obtained wafer image to have distortion.

[0049] Optionally, in some possible embodiments, the terminal device 1c can generate a motion radius control instruction based on the above motion control parameter, to control the reduction amplitude of the motion radius based on the motion radius control instruction. When the terminal device 1c detects that the motion stage 1a moves to the target scanning feature point, the motion radius control parameter can be obtained based on the motion radius corresponding to the target scanning feature point, and then the motion radius control instruction is generated to reduce the reduction amplitude of the motion radius. The terminal device 1c can adjust the target motion trajectory based on the adjusted reduction amplitude of the motion radius, so that the motion stage 1a moves based on the adjusted target motion trajectory. The target motion trajectory can be a concentric circle trajectory, a spiral trajectory, or other possible motion trajectories, which are not limited by the application.

[0050] Optionally, in some possible embodiments, the terminal device 1c can generate a speed control instruction based on the above motion control parameter, to control the motion speed of the motion stage 1a based on the speed control instruction. When the terminal device 1c detects that the motion stage 1a moves to the target scanning feature point, the speed control parameter can be obtained based on the motion radius corresponding to the target scanning feature point, and then the speed control instruction is generated to reduce the motion speed of the motion stage 1a, so that the motion stage 1a moves based on the adjusted motion speed.

[0051] Optionally, in some possible embodiments, the terminal device 1c can generate a light intensity control instruction based on the above scanning control parameter, to control the target light intensity of the light source 1d based on the light intensity control instruction to illuminate the wafer. When the motion speed of the above motion stage 1a changes, the target light intensity of the light source 1d can be adjusted accordingly, so that the target light intensity matches the motion speed. When the motion speed of the motion stage 1a increases, the target light intensity should correspondingly decrease. That is, when the terminal device 1c detects that the wafer moves to the target scanning feature point, the target light intensity of the light source 1d can be controlled to decrease with the decrease of the motion speed, so that the light source 1d illuminates the wafer based on the adjusted target light intensity.

[0052] Optionally, the terminal device 1c can also generate an integral order control instruction of the camera 1e based on the scanning control parameter, and then control the camera 1e to scan the wafer based on the target integral order under the illumination of the light source 1d to obtain a wafer image. When the terminal device 1c detects that the wafer moves to the target scanning feature point, the terminal device 1c can reduce the target integral parameter of the camera 1e based on the motion radius, so that the camera 1e scans the wafer based on the adjusted target integral parameter to obtain a wafer image. That is, the smaller the motion radius, the smaller the target integral order of the camera 1e controlled by the integral order control parameter. Optionally, the target light intensity of the light source 1d can also change with the change of the target integral order, so as to match the target light intensity and the target integral order. When the target integral order is reduced, the target light intensity should be increased correspondingly, so that the light source illuminates the wafer based on the adjusted target light intensity.

[0053] For the sake of understanding, the implementation process of the wafer image acquisition method in the wafer image acquisition scene in the wafer detection is described below.

[0054] In some possible implementations, the terminal device 1c can send a motion control instruction to the motion stage 1a based on the motion control parameter to control the motion stage 1a carrying the wafer to move from outside to inside based on the target motion trajectory, wherein the motion speed of the motion stage 1a in the motion process is constant, and the wafer and the motion stage 1a are relatively static. The motion control parameter can include a motion radius control parameter and a speed control parameter. The motion radius control parameter is used to control the target motion trajectory of the motion stage 1a, and the speed control parameter is used to control the motion speed of the motion stage 1a. The terminal device 1c can also send a light intensity control instruction to the light source 1d based on the light intensity control parameter in the scanning control parameter, to control the light source 1d (such as a laser) to illuminate the wafer based on the target light intensity. The terminal device 1c can also send an integral order control instruction to the camera 1e (such as a linear array camera 1e) based on the integral order control parameter in the scanning control parameter, to control the camera 1e to scan the wafer based on the target integral order to obtain a wafer image. The scanning of the camera 1e on the wafer is performed under the illumination of the light source 1d.

[0055] In some possible implementations, the target motion trajectory includes a plurality of scanning feature points, and one scanning feature point corresponds to one motion radius. The terminal device 1c can detect whether the motion radius corresponding to the scanning feature point passed by the motion stage 1a is greater than the center region radius threshold based on the motion radius control parameter in the motion control parameter. When the terminal device 1c detects that the motion radius is less than or equal to the center region radius threshold, that is, when the target scanning feature point is passed, the terminal device 1c can adjust the motion control parameter and / or the scanning control parameter downward, that is, reduce or decrease the value of the motion control parameter and / or the scanning control parameter.

[0056] Optionally, the terminal device 1c can adjust the movement speed of the movement platform 1a. Specifically, the terminal device 1c can adjust the speed control parameter based on the movement radius corresponding to the target scanning feature point, and then control the movement speed of the movement platform 1a to decrease based on the adjusted speed control parameter. For example, the movement speed of the movement platform 1a can be adjusted from 0.2 cm / s to 0.1 cm / s, so that the movement platform moves at a speed of 0.1 cm / s.

[0057] Optionally, the terminal device 1c can adjust the target light intensity of the light source 1d to match the movement speed of the movement platform 1a. Specifically, the terminal device 1c can adjust the light intensity control parameter based on the movement speed of the movement platform 1a, and then reduce the target light intensity based on the adjusted light intensity control parameter to match the movement speed. For example, when the movement speed of the movement platform 1a is adjusted from 0.2 cm / s to 0.1 cm / s, the terminal device 1c can adjust the target light intensity from 10 W to 9 W, so that the light source provides illumination at a target light intensity of 9 W. The smaller the movement speed, the smaller the target light intensity of the light source 1d controlled by the light intensity control parameter.

[0058] Optionally, the terminal device 1c can also adjust the movement radius of the movement platform 1a. Specifically, the terminal device 1c can adjust the movement radius control parameter based on the movement radius corresponding to the target scanning feature point, and control the reduction amplitude of the movement radius to decrease based on the adjusted movement radius control parameter. For example, the terminal device 1c can adjust the reduction amplitude of the movement radius from 0.1 cm to 0.05 cm, so that the movement radius decreases by 0.05 cm each time. The smaller the movement radius corresponding to the target scanning feature point, the smaller the reduction amplitude of the movement radius controlled by the movement radius control parameter. That is, the closer to the center position of the wafer, the smaller the horizontal progressive distance of the scanning feature point.

[0059] Optionally, the terminal device 1c can also adjust the integral order control parameter of the camera 1e. Specifically, the terminal device 1c can adjust the integral order control parameter based on the movement radius corresponding to the target scanning feature point, and control the target integral order of the camera 1e to decrease based on the adjusted integral order control parameter. For example, the terminal device 1c can adjust the target integral order of the camera 1e from 1000 to 900, so that the camera scans the wafer at a target integral order of 900. The smaller the movement radius, the smaller the target integral order of the camera 1e controlled by the integral order control parameter.

[0060] Optionally, the terminal device 1c can adjust the target light intensity of the light source 1d based on the target integral order of the camera 1e, so that the target light intensity also matches the target integral order. Specifically, the light intensity control parameter can be adjusted based on the target integral order, so that the target light intensity is controlled to increase based on the adjusted light intensity control parameter. For example, when the terminal device 1c adjusts the target integral order from 1000 to 900, the target light intensity can be adjusted from 9W to 10W, so that the light source provides illumination at a target light intensity of 10W. Wherein, the smaller the target integral order, the greater the target light intensity of the light source 1d controlled by the light intensity control parameter.

[0061] It can be understood that the terminal device 1c can adjust one or more of the movement speed of the movement platform 1a, the movement radius, the target integral order of the camera 1e, or the target light intensity of the light source 1d, and the number of adjustments can be one or more times. The present application does not limit this.

[0062] In some possible implementations, the target motion trajectory can include a plurality of target scanning feature points, and the terminal device 1c adjusts the operation control parameter and / or the scanning control parameter once every time the movement platform 1a passes a target scanning feature point, so that the movement platform 1a moves based on the target motion trajectory based on the adjusted operation control parameter or the wafer is scanned by the image acquisition device based on the adjusted scanning control parameter to obtain a wafer image. For example, if the target motion trajectory is a concentric circle trajectory, the target scanning feature point can be a key scanning feature point indicating that one circle trajectory scanning is completed. That is, the terminal device 1c adjusts the operation control parameter and / or the scanning control parameter once every time the movement platform 1a runs a circle. If the target motion trajectory is a spiral trajectory, the target scanning feature point can be determined according to the difference between the movement radii of two scanning feature points. For example, when the difference between the movement radii corresponding to the scanning feature point and the last target scanning feature point is greater than the adjustment threshold, the terminal device 1c adjusts the operation control parameter or the scanning control parameter once, so that the movement platform 1a moves based on the adjusted operation control parameter or the wafer is scanned by the image acquisition device based on the adjusted scanning control parameter. The terminal device 1c can repeat the above operation until the wafer is scanned to obtain a wafer image.

[0063] By using the wafer image acquisition method provided in the present application, the movement platform in the wafer scanning device can be controlled to move based on the movement control parameter to control the wafer to move based on the target motion trajectory, and the image acquisition device in the wafer scanning device can be controlled to scan the wafer in motion to obtain a wafer image based on the scanning control parameter; when the wafer carried on the movement platform moves to a target scanning feature point with a movement radius less than or equal to a center region radius threshold, the movement control parameter and / or the scanning control parameter are adjusted, thereby improving the scanning accuracy of the wafer image and the accuracy of wafer detection, and having strong applicability.

[0064] Referring to Figure 4 , Figure 4 is a flowchart of a wafer image acquisition method provided by an embodiment of the present application. Figure 4 The wafer image acquisition method shown is applicable to Figure 1 The wafer image acquisition system shown is described below with the terminal device as the execution subject for the sake of description. As shown in Figure 4 The wafer image acquisition method described above can include the following steps:

[0065] In step S101, the motion stage in the wafer scanning device is controlled to move based on the motion control parameters to control the wafer to move on the motion stage based on a target motion trajectory.

[0066] In some possible implementations, the terminal device can obtain a plurality of motion radii corresponding to a plurality of scanning feature points based on the motion control parameters, generate a target motion trajectory based on the plurality of scanning feature points and the motion radii corresponding thereto, generate a motion control instruction according to the target motion trajectory, and control the motion stage to move based on the target motion trajectory based on the motion control instruction. The motion control parameters include a motion radius control parameter and a speed control parameter. The motion radius control parameter is used to control the motion radius of the scanning feature point to control the target motion trajectory of the motion stage, and the speed control parameter is used to control the motion speed of the motion stage. The wafer can be carried on the motion stage, and the wafer and the motion stage are relatively stationary.

[0067] Optionally, the target motion trajectory can be a concentric circular trajectory or a spiral trajectory. If the target motion trajectory is a concentric circular trajectory, the terminal device can control the motion stage to move based on the circular trajectory on the outer side first, and then move based on the circular trajectory on the inner side until the scanning is completed. For example, if the circular trajectories are sorted from the outside to the inside as the first circular trajectory, the second circular trajectory,..., and the Nth circular trajectory, the terminal device can control the motion stage to move based on the first circular trajectory first, and when the motion stage moves to the key scanning feature point in the first circular trajectory, it is indicated that the first circular trajectory has been scanned, and the motion stage switches to the key scanning feature point of the second circular trajectory to start moving. In this way, the Nth circular trajectory is scanned until the scanning is completed. If the target motion trajectory is a spiral trajectory, the terminal device can control the motion stage to move from the outside to the inside based on the spiral trajectory until the scanning is completed. It can be understood that the concentric circular trajectory includes a plurality of concentric circular trajectories, one circular trajectory includes a plurality of scanning feature points, and the motion radius corresponding to the scanning feature points on each circular trajectory decreases from the outside to the inside; the spiral trajectory includes a plurality of scanning feature points, and the motion radius corresponding to the plurality of scanning feature points decreases from the outside to the inside.

[0068] In step S102, the image acquisition device in the wafer scanning device is controlled to scan the wafer in motion based on the scanning control parameters to obtain a wafer image. The target motion trajectory includes a plurality of scanning feature points, and each scanning feature point corresponds to a motion radius.

[0069] In some possible implementation manners, the terminal device can control the image acquisition device in the wafer scanning device to scan the wafer based on the scanning control parameters. The image acquisition device includes a camera and a light source, and the scanning control parameters can include an integral order control parameter of the camera and a light intensity control parameter of the light source. The terminal device can control a target light intensity of the light source based on the light intensity control parameter of the light source, so that the light source provides illumination for the wafer according to the target light intensity. The terminal device can control a target integral order of the camera based on the integral order control parameter of the camera, so that the camera scans the wafer according to the target integral order under the illumination of the light source to obtain a wafer image. The target light intensity should be matched with the target integral order. For example, when the target integral order is increased, the target light intensity should be correspondingly decreased to prevent the wafer image from being overexposed; when the target integral order is decreased, the target light intensity should be correspondingly increased to prevent the wafer image from being too dark. It can be understood that the target light intensity should also be matched with the motion speed of the motion stage, for example, when the motion speed is increased, the target light intensity should be correspondingly increased; when the motion speed is decreased, the target light intensity should be correspondingly decreased.

[0070] In some possible implementation manners, the terminal device can generate a control instruction based on the scanning control parameters, and then control the image acquisition device to scan the wafer through the control instruction. For example, the terminal device can generate an integral order control instruction based on the integral order control parameter, and then adjust the target integral order of the camera based on the integral order control instruction. The terminal device can also generate a light intensity control instruction based on the light intensity control parameter, and then adjust the target light intensity of the light source based on the light intensity control instruction. Alternatively, the terminal device can control the image acquisition device in other manners, which are not limited in the present application.

[0071] In step S103, the motion control parameters and / or the scanning control parameters are adjusted when the wafer moves to a target scanning feature point. The motion radius corresponding to the target scanning feature point is less than or equal to a threshold of the radius of the center region.

[0072] In some possible implementation manners, the motion control parameter and / or the scanning control parameter can be adjusted when the terminal device controls the motion stage carrying the wafer to move to a target scanning feature point, i.e., the wafer moves to the target scanning feature point. The motion radius corresponding to the target scanning feature point is less than or equal to a center region radius threshold. The center region radius threshold is used to indicate a center region, i.e., a scanning feature point with a motion radius less than or equal to the center region radius threshold is located in the center region of the wafer, and vice versa, a scanning feature point with a motion radius greater than the center region radius threshold is located in a non-center region (i.e., a peripheral region) of the wafer. Taking the center region radius threshold of 1 cm as an example, if the terminal device detects that the motion radius is 1.5 cm, it is determined that the motion radius is greater than the center region radius threshold, and the scanning feature point is located in the non-center region of the wafer; if the terminal device detects that the motion radius is 0.5 cm, it is determined that the motion radius is less than the center region radius threshold, and the scanning feature point is located in the center region of the wafer; and if the terminal device detects that the motion radius is 1 cm, it is determined that the motion radius is equal to the center region radius threshold, and the scanning feature point is located in the center region of the wafer.

[0073] It can be understood that when the image acquisition device scans the center region of the wafer, the image deformation caused by the mismatch between the shooting efficiency and the motion speed of the camera in the image acquisition device can be reduced by adjusting the motion control parameter and / or the scanning control parameter. Optionally, the terminal device can adjust the speed control parameter of the motion stage to reduce the motion speed of the motion stage, and then control the motion stage to move based on the adjusted motion speed. The terminal device can also adjust the target light intensity of the light source according to the motion speed, and then control the light source to provide illumination for the wafer based on the adjusted target light intensity. Optionally, the terminal device can also adjust the motion radius control parameter of the motion stage to reduce the reduction amplitude of the motion radius, and then control the motion stage to move based on the target motion trajectory generated by the adjusted reduction amplitude of the motion radius. Optionally, the terminal device can also adjust the integral order control parameter of the camera to reduce the target integral order of the camera, and then control the camera to scan the wafer based on the adjusted target integral order. The terminal device can also adjust the target light intensity of the light source based on the target integral order, and then control the light source to illuminate the wafer based on the adjusted target light intensity. It can be understood that the target light intensity can be matched with the motion speed of the motion stage and the target integral order of the camera.

[0074] Optionally, the terminal device can adjust the motion control parameter and / or the scanning control parameter once or multiple times. That is, the terminal device can pass one or more target scanning feature points in the process of controlling the motion stage to move and the image acquisition device to scan the wafer, and adjust the motion control parameter and / or the scanning control parameter once per target scanning feature point, so as to adjust the motion control parameter and / or the scanning control parameter once or multiple times. The terminal device can trigger the motion stage to move based on the adjusted motion control parameter each time the terminal device adjusts the motion control parameter, and can trigger the image acquisition device to scan the wafer based on the adjusted scanning control parameter each time the terminal device adjusts the scanning control parameter, to obtain the wafer image. The motion control parameter and / or the scanning control parameter can be adjusted upward or downward, that is, the values of the motion control parameter and / or the scanning control parameter can be adjusted upward or downward, which should be determined according to the specific morphology of the product, and the present application does not limit this. For example, if the motion stage moves from outside to inside, the motion speed, the motion radius reduction amplitude, the target integral order of the camera, and the like of the motion stage can be adjusted downward, and the target light intensity of the light source can also be adjusted upward or downward based on the motion speed and / or the target integral order; if the motion stage moves from inside to outside, the motion speed, the motion radius reduction amplitude, the target integral order of the camera, and the like of the motion stage can be adjusted upward, and the target light intensity of the light source can also be adjusted upward or downward based on the motion speed and / or the target integral order.

[0075] Optionally, the terminal device can also control the motion stage to move from inside to outside, and then control the image acquisition device to scan the wafer from inside to outside, so that when the image acquisition device scans the center region of the wafer, the motion control parameter and / or the scanning control parameter can be adjusted upward as the motion radius increases, and the present application does not limit this.

[0076] For further understanding of the above Figure 4 The wafer image acquisition method provided in the embodiments will be described below with reference to the wafer image acquisition method provided in the embodiments. Figure 5 , Figure 5 is another flowchart of the wafer image acquisition method provided in the embodiments of the present application. Taking the terminal device as an execution subject, the wafer image acquisition method can include the following steps:

[0077] In step S10, the motion stage in the wafer scanning device is controlled to move based on the motion control parameter, so as to control the wafer to move on the motion stage based on the target motion trajectory.

[0078] In some possible embodiments, the terminal device can control the motion stage in the wafer scanning device to move based on the target motion trajectory at a constant motion speed, or can also control the motion speed of the motion stage to change according to the specific morphology of the product.

[0079] For the convenience of understanding, the implementation of step S10 can be seen together with the description of step S101, and will not be repeated here.

[0080] Step S20, based on the scanning control parameters, controlling the image acquisition device in the wafer scanning device to scan the wafer in motion to obtain a wafer image, the target motion trajectory includes a plurality of scanning feature points, and one scanning feature point corresponds to one motion radius.

[0081] In some possible implementations, the terminal device can control the light source in the image acquisition device to illuminate the wafer, and control the camera in the image acquisition device to scan the wafer.

[0082] For the convenience of understanding, the implementation of step S20 can be seen together with the description of step S102, and will not be repeated here.

[0083] Step S30, judging whether the motion radius corresponding to the scanning feature point is greater than the threshold of the center region radius.

[0084] In some possible implementations, the terminal device can obtain the motion radius corresponding to the plurality of scanning feature points in the target motion trajectory, and detect whether the motion radius is greater than the threshold of the center region radius. If the terminal device detects that the motion radius corresponding to the scanning feature point where the wafer moves is greater than the threshold of the center region radius, step S10 is executed; if the terminal device detects that the motion radius corresponding to the scanning feature point where the wafer moves is less than or equal to the threshold of the center region radius, one or more of step S401, step S402 or step S403 can be executed when the wafer moves to the target scanning feature point in the plurality of scanning feature points.

[0085] Step S401, based on the speed control parameter, controlling the motion speed of the motion stage to be reduced, and based on the light intensity control parameter, reducing the target light intensity.

[0086] Optionally, in some possible implementations, when the terminal device detects that the motion radius is less than or equal to the center region radius threshold, the motion speed of the motion platform can be adjusted. The present application takes the following adjustment of the motion speed of the motion platform as an example for illustration. Specifically, the terminal device can adjust the speed control parameter based on the motion radius corresponding to the target scanning feature point, and control the motion speed of the motion platform to decrease based on the adjusted speed control parameter. For example, when the motion radius corresponding to the target scanning feature point is 1 cm, the initial speed control parameter obtained is 0.1 cm / s. At this time, in order to reduce the motion speed of the motion platform, the speed control parameter can be adjusted to 0.09 cm / s. If the motion radius corresponding to the next target scanning feature point is 0.9 cm, the corresponding initial speed control parameter is 0.09 cm / s, and the speed control parameter can be set to 0.08 cm / s when the motion platform passes through the next target scanning feature point. It can be understood that, in the process of moving from the target scanning feature point with a motion radius of 1 cm to the target scanning feature point with a motion radius of 0.9 cm, the motion speed of the motion platform remains 0.09 cm / s, and after passing through the target scanning feature point with a motion radius of 0.9 cm, the motion speed of the motion platform is adjusted to 0.08 cm / s. That is, in the process of moving from outside to inside of the motion platform, the smaller the motion radius corresponding to the target scanning feature point, the smaller the motion speed of the motion platform controlled based on the motion control parameter.

[0087] Optionally, in some possible implementations, when the terminal device detects that the motion speed of the motion platform changes, the light intensity control parameter of the light source can be adjusted to match the target light intensity with the motion speed. Specifically, the terminal device can obtain the motion speed of the motion platform, and adjust the light intensity control parameter based on the motion speed. For example, if the terminal device detects that the motion speed of the motion platform is adjusted from 0.09 cm / s to 0.08 cm / s, the light intensity control parameter can be adjusted from 10 W to 9 W. That is, in the process of moving from outside to inside of the motion platform, as the motion speed of the motion platform decreases, the target light intensity of the light source can decrease accordingly. Optionally, the terminal device can adjust the light intensity control parameter every time the motion speed of the motion platform changes, or can adjust the light intensity control parameter once when the motion speed changes reaches a motion speed change threshold (for example, 0.02 cm / s), or can adjust the light intensity control parameter once every interval (for example, 1 second). The specific form should be determined according to the product, and the present application does not limit this. It should be noted that the target light intensity can also be adjusted upward when the motion speed of the motion platform increases, and the present application takes the following adjustment of the motion speed of the motion platform as an example for illustration.

[0088] In step S402, the decrease amplitude of the motion radius is controlled based on the motion radius control parameter.

[0089] Optionally, in some possible implementations, when the terminal device detects that the motion radius is less than or equal to the threshold of the radius of the center region, the terminal device can adjust the motion radius of the motion table, and the application takes the adjustment of the motion radius of the motion table as an example for illustration. Specifically, the terminal device can adjust the speed control parameter based on the motion radius corresponding to the target scanning feature point, and control the motion speed of the motion table to decrease based on the adjusted speed control parameter. For example, if the terminal device detects that the motion radius corresponding to the target scanning feature point is 1 cm, and the motion radius corresponding to the next scanning feature point is 0.8 cm, it is determined that the motion radius decreases by 0.2 cm. The terminal device can adjust the decrease of the motion radius to 0.1 cm, that is, the motion radius corresponding to the next scanning feature point is adjusted from 0.8 cm to 0.9 cm. It can be understood that the decrease of the motion radius can be adjusted once or multiple times. When adjusted once, the adjusted decrease can be applied to all the scanning feature points, for example, the motion radius corresponding to the next scanning feature point is 0.9 cm, and the motion radius corresponding to the scanning feature point after the next scanning feature point is 0.8 cm, and the decrease of the motion radius is 0.1 cm. When adjusted multiple times, the decrease of the motion radius decreases, for example, the motion radius corresponding to the next scanning feature point is 0.9 cm, and the motion radius corresponding to the scanning feature point after the next scanning feature point is 0.85 cm, and the decrease of the motion radius decreases from 0.1 to 0.05. That is, in the process of the motion table moving from outside to inside, the smaller the motion radius corresponding to the target scanning feature point, the smaller the decrease of the motion radius controlled based on the motion radius control parameter. The decrease of the motion radius and the number of adjustments should be determined according to the specific product form, and the application does not limit this.

[0090] In step S403, the terminal device controls the target integral order of the camera to decrease based on the integral order control parameter, and controls the target light intensity to increase based on the light intensity control parameter.

[0091] Optionally, in some possible implementations, when the terminal device detects that the motion radius is less than or equal to the threshold of the radius of the center region, the terminal device can adjust the target integral order of the camera, and the application takes the adjustment of the motion speed of the motion table as an example for illustration. Specifically, the terminal device adjusts the integral order control parameter based on the motion radius corresponding to the target scanning feature point, and controls the target integral order of the camera to decrease based on the adjusted integral order control parameter. For example, if the initial integral order control parameter of the target scanning feature point is 1000, the integral order control parameter can be set to 900 after adjusting the integral order control parameter. That is, in the process of the motion table moving from outside to inside, the smaller the motion radius, the smaller the target integral order of the camera controlled based on the integral order control parameter.

[0092] Optionally, in some possible implementation, when the terminal device detects the change of the target integral order of the camera, the terminal device can adjust the target light intensity of the light source to match the target light intensity with the target integral order. The terminal device can adjust the light intensity control parameter based on the target integral order of the camera, and control the target light intensity to increase with the decrease of the target integral order based on the adjusted light intensity control parameter. It can be understood that if the terminal device detects the increase of the target integral order, the target light intensity should decrease accordingly. Optionally, the terminal device can adjust the light intensity control parameter each time the target integral order of the camera changes, or can adjust the light intensity control parameter once when the change of the target integral order reaches an integral order change threshold (for example, 200), or can adjust the light intensity control parameter once every certain period of time (for example, 1 second). The specific form of the product should be determined, and the present application does not limit this.

[0093] It can be understood that the terminal device can execute one or more of the above steps S401-S403 according to the specific form of the product, and the implementation of the above steps S401-S403 can be jointly referred to the description of the above step S103, which will not be repeated here. The motion control parameter and / or the scanning control parameter can be adjusted upwards or downwards, and the specific form should be determined according to the specific form of the product, which is not limited by the present application.

[0094] Step S50: determining whether the wafer scanning is completed.

[0095] In some possible implementation, the terminal device can determine whether the wafer scanning is completed. For example, the terminal device can determine whether the wafer scanning is completed based on the motion radius of the scanning feature point. When the motion radius is less than or equal to a scanning completion threshold (for example, 0.1 cm), it is determined that the wafer scanning is completed; when the motion radius is greater than the scanning completion threshold, it is determined that the wafer scanning is not completed. If it is determined that the wafer scanning is completed, the terminal device can execute step S60; if it is determined that the wafer scanning is not completed, the terminal device can execute step S10.

[0096] Step S60: obtaining a wafer image.

[0097] In some possible implementation, if the terminal device determines that the wafer scanning is completed, the terminal device can process the wafer image obtained by scanning based on the integral order of the camera to obtain a complete wafer image.

[0098] The wafer image acquisition method provided in this application can control the movement of the motion stage in the wafer scanning device based on motion control parameters to control the wafer to move according to the target motion trajectory. Based on the scanning control parameters, the image acquisition device in the wafer scanning device can scan the moving wafer to obtain a wafer image. When the wafer on the motion stage moves to the target scanning feature point with a motion radius less than or equal to the radius threshold of the center region, the motion control parameters and / or the scanning control parameters are adjusted, thereby improving the scanning accuracy of the wafer image, improving the accuracy of wafer detection, and having strong applicability.

[0099] Please see Figure 6 , Figure 6 This is a schematic diagram of the structure of the wafer image acquisition device provided in an embodiment of this application. Figure 6 The wafer image acquisition device 1 shown can be a computer device having a computer program (including program code) that implements the wafer image acquisition method described above. The wafer image acquisition device 1 can also be a computer program, such as an application software. This device can be used to execute the corresponding steps in the wafer image acquisition method provided in the embodiments of this application. Figure 6 As shown, the wafer image acquisition device 1 described above may include: a first control module 101, a second control module 102, and an adjustment module 103.

[0100] The first control module 101 is used to control the motion stage in the wafer scanning equipment based on motion control parameters so as to control the wafer to move on the motion stage based on the target motion trajectory.

[0101] The second control module 102 is used to control the image acquisition device in the wafer scanning device to scan the moving wafer to obtain a wafer image based on the scanning control parameters. The target motion trajectory includes multiple scanning feature points, and one of the scanning feature points corresponds to one motion radius.

[0102] The adjustment module 103 is used to adjust the motion control parameters and / or the scanning control parameters when the wafer moves to the target scanning feature point; the motion radius corresponding to the target scanning feature point is less than or equal to the radius threshold of the center region.

[0103] The specific functions implemented by the first control module 101 can be found in the above description. Figure 4 The corresponding step S101 in the embodiment, or, can be taken from the above. Figure 5 The corresponding step S10 in the embodiment; the specific functions implemented by the second control module 102 can be found in the above. Figure 4 Step S102 in the illustrated embodiment, or as described above, can be found elsewhere. Figure 5The specific function of the adjustment module 103 in the embodiment shown in step S20 can be seen from the foregoing Figure 4 The specific function of the adjustment module 103 in the embodiment shown in step S20 can be seen from the foregoing Figure 5 The specific function of the adjustment module 103 in the embodiment shown in step S20 can be seen from the foregoing

[0104] The specific function of the adjustment module 103 in the embodiment shown in step S20 can be seen from the foregoing Figure 7 , Figure 7 is a structural schematic diagram of a terminal device provided by an embodiment of the present application. As shown in the figure, Figure 7 The terminal device 1000 can include a processor 1001, a network interface 1004, a memory 1005, and a controller 1006. In addition, the terminal device 1000 can also include a user interface 1003 and at least one communication bus 1002. The communication bus 1002 is used to realize the connection and communication between the components. The user interface 1003 can include a display screen (Display), a keyboard (Keyboard), and an optional user interface 1003 can also include a standard wired interface, a wireless interface. The network interface 1004 can optionally include a standard wired interface, a wireless interface (such as a WI-FI interface). The memory 1005 includes a random access memory (RAM) and a non-volatile memory (NVM), such as an erasable programmable read-only memory (EPROM). The memory 1005 can also be at least one storage device located away from the aforementioned processor 1001. The controller 1006 can be used to receive data sent by the processor and generate control instructions to control devices such as motion stages, image acquisition devices, etc. The aforementioned controller 1006 can be used to execute the functions of the controller involved in the embodiment shown in the foregoing Figures 2 to 5 The controller 1006 can be a motion controller or other type of controller, which should be determined according to the actual application scenario. The present application only takes a motion controller as an example for description. As shown in the figure, Figure 7 The memory 1005 can include an operating system, a network communication module, a user interface module, and a device control application program. The memory 1005 in the embodiment can execute the functions of the memory in the wafer image acquisition system shown in the foregoing Figure 1 The processor 1001 can execute the functions of the processor provided in the foregoing Figure 1 The processor 1001 can execute the functions of the processor provided in the foregoing

[0105] As shown in the foregoing Figure 7The terminal device 1000 shown in the figure, the network interface 1004 can provide network communication function; and the user interface 1003 is mainly used for providing the interface for the user to input; and the processor 1001 can be used to call the device control application program stored in the memory 1005, to realize the foregoing Figures 4 to 5 The wafer image acquisition method in the embodiment shown.

[0106] It should be understood that the terminal device 1000 described in the embodiments of the present application can execute the foregoing Figures 4 to 5 The wafer image acquisition method of the embodiment shown, without further description. In addition, the beneficial effects of using the same method are also not described.

[0107] In addition, it needs to be pointed out here that: the present application also provides a computer readable storage medium, and the above-mentioned computer readable storage medium stores the computer program executed by the wafer image acquisition method mentioned above, and the above-mentioned computer program includes program instructions, when the above-mentioned processor executes the above-mentioned program instructions, the foregoing Figures 4 to 5 The wafer image acquisition method provided by the embodiment shown, therefore, without further description. In addition, the beneficial effects of using the same method are also not described. For the technical details not disclosed in the computer readable storage medium embodiments involved in the present application, please refer to the description of the method embodiments of the present application.

[0108] The above-mentioned computer readable storage medium can be the wafer image acquisition method provided by any of the foregoing embodiments or the internal storage unit of the above-mentioned terminal device, such as the hard disk or memory of the terminal device. The computer readable storage medium can also be an external storage device of the terminal device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped in the terminal device. Further, the computer readable storage medium can include both the internal storage unit of the terminal device and the external storage device. The computer readable storage medium is used to store the computer program and other programs and data required by the terminal device. The computer readable storage medium can also be used to temporarily store data that has been output or will be output.

[0109] In addition, it needs to be pointed out here that: the present application also provides a computer program product or computer program, the computer program product or computer program includes computer instructions, the computer instructions are stored in a computer readable storage medium. The processor of the terminal device loads and executes the computer instructions, so that the terminal device can execute the foregoing Figures 4 to 5 The method provided by the embodiment shown.

[0110] Those of ordinary skill in the art will realize that the systems and algorithms described in connection with the embodiments disclosed herein can be embodied in electronic hardware, computer software, or both. The disclosure is not intended to be limited to one technology or illustrative language. The use of the terms "example" and "exemplary" is intended to present concepts in a concrete form. The functions described can be implemented in hardware, software, or combinations thereof. However, such an implementation is merely one example and other implementations are possible. Specifically, different examples of circuits and systems can be constructed to implement the described functions and aspects. These are merely a few examples of systems that can be employed to implement functionality described herein. Accordingly, it is submitted that one of ordinary skill in the art will recognize the interchangeability of various hardware and software implementations, and it is intended that the scope of the disclosure should encompass all such variations.

Claims

1. A method for acquiring wafer images, characterized in that, The method includes: The motion stage in the wafer scanning equipment is controlled based on motion control parameters to control the wafer to move on the motion stage according to the target motion trajectory. Based on the scanning control parameters, the image acquisition device in the wafer scanning equipment is controlled to scan the moving wafer to obtain a wafer image. The target motion trajectory includes multiple scanning feature points, and each scanning feature point corresponds to a motion radius. When the wafer moves to the target scanning feature point, the motion control parameters and / or the scanning control parameters are adjusted; the motion radius corresponding to the target scanning feature point is less than or equal to the radius threshold of the center region.

2. The method according to claim 1, characterized in that, The method of controlling the motion stage in the wafer scanning equipment based on motion control parameters to control the wafer to move on the motion stage according to a target motion trajectory includes: Multiple motion radii corresponding to multiple scanning feature points are obtained based on motion control parameters, and a target motion trajectory of wafer motion is generated based on the multiple motion radii. The motion stage is controlled to move from the outside to the inside based on the target motion trajectory in order to control the wafer to move on the motion stage based on the target motion trajectory. The target motion trajectory includes a concentric circle trajectory or a spiral trajectory. The concentric circle trajectory includes multiple concentric circular trajectories. Each circular trajectory includes multiple scanning feature points, and the motion radius corresponding to each scanning feature point on each circular trajectory decreases from the outside to the inside in each circle. The spiral trajectory includes multiple scanning feature points, and the motion radius corresponding to each scanning feature point decreases from the outside to the inside.

3. The method according to claim 2, characterized in that, The image acquisition device includes a light source and a camera; the step of controlling the image acquisition device in the wafer scanning device based on scanning control parameters to scan the moving wafer to obtain a wafer image includes: The light source is controlled to illuminate the wafer based on a target light intensity, which is matched with the movement speed of the motion stage, according to the scanning control parameters. When the light source is used to illuminate the wafer, the camera is controlled to scan the wafer based on the target integration order to obtain a wafer image, and the target integration order is matched with the target light intensity.

4. The method according to any one of claims 1-3, characterized in that, The motion control parameters include the speed control parameters of the motion platform; adjusting the motion control parameters includes: The speed control parameters are adjusted based on the motion radius corresponding to the target scanning feature point, so as to control the motion speed of the motion stage to decrease based on the adjusted speed control parameters. The smaller the motion radius corresponding to the target scanning feature point, the smaller the motion speed of the motion stage controlled by the motion control parameters.

5. The method according to claim 4, characterized in that, The scanning control parameters include the light intensity control parameters of the light source; adjusting the scanning control parameters includes: The light intensity control parameters are adjusted based on the movement speed of the motion platform to reduce the target light intensity, so that the target light intensity matches the movement speed; wherein, the smaller the movement speed, the smaller the target light intensity of the light source controlled by the light intensity control parameters.

6. The method according to any one of claims 1-5, characterized in that, The motion control parameters include the motion radius control parameters of the motion platform; adjusting the motion control parameters includes: The motion radius control parameter is adjusted based on the motion radius corresponding to the target scanning feature point, so as to control the reduction of the motion radius by a smaller magnitude based on the adjusted motion radius control parameter. The smaller the motion radius corresponding to the target scanning feature point, the smaller the reduction of the motion radius obtained by the motion radius control parameter.

7. The method according to any one of claims 1-6, characterized in that, The scanning control parameters include the camera's integration order control parameters; adjusting the scanning control parameters includes: The integral order control parameter is adjusted based on the motion radius corresponding to the target scanning feature point, so as to control the target integral order of the camera to decrease based on the adjusted integral order control parameter; the smaller the motion radius, the smaller the target integral order of the camera controlled by the integral order control parameter.

8. The method according to claim 7, characterized in that, The scanning control parameters also include the light intensity control parameters of the light source; adjusting the scanning control parameters includes: The light intensity control parameters are adjusted based on the target integration order of the camera to control the increase of the target light intensity, so that the target light intensity matches the target integration order; the smaller the target integration order, the greater the target light intensity of the light source controlled by the light intensity control parameters.

9. A wafer image acquisition device, characterized in that, include: The first control module is used to control the motion stage in the wafer scanning equipment based on motion control parameters so as to control the wafer to move on the motion stage according to the target motion trajectory. The second control module is used to control the image acquisition device in the wafer scanning equipment to scan the moving wafer to obtain a wafer image based on the scanning control parameters. The target motion trajectory includes multiple scanning feature points, and one scanning feature point corresponds to one motion radius. An adjustment module is used to adjust the motion control parameters and / or the scanning control parameters when the wafer moves to the target scanning feature point; the motion radius corresponding to the target scanning feature point is less than or equal to the radius threshold of the center region.

10. A terminal device, characterized in that, include: Processor and memory; The processor is connected to the memory, wherein the memory is used to store program code, and the processor is used to call the program code to execute the method according to any one of claims 1-8.

11. A wafer image acquisition system, characterized in that, include: The device includes a motion stage, an image acquisition device, and a terminal device as described in claim 10; wherein the motion stage is used to carry a wafer, and the image acquisition device is used to acquire wafer images.

12. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program adapted to be loaded by a processor and executed as described in any one of claims 1-8.

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