Radiation detector module, radiation detector and manufacturing method thereof, and imaging device
By employing a 4N or 4N+1 row arrangement of radiation detector modules in CT equipment, the problems of focal shift and mechanical vibration caused by reducing the number of Z-axis elements are solved, maintaining image quality and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2026-03-27
AI Technical Summary
In CT equipment, reducing the number of elements in the Z-direction of the radiation detector module can cause the X-ray source focal point to shift, affecting image quality and potentially altering the gantry structure or causing mechanical vibration.
The use of a radiation detector module design allows the radiation detector elements to be arranged in 4N or 4N+1 rows in the Z direction of the circuit board, which allows for a reduction in the number of radiation detector elements while maintaining central symmetry, avoiding the need to adjust the focal point position and rack structure.
This approach achieves the goal of maintaining image quality while reducing the number of radiation detector components, lowering manufacturing costs, and avoiding additional mechanical vibrations.
Smart Images
Figure CN121740913A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of imaging equipment technology, and in particular to a radiation detector module, a radiation detector, a method for manufacturing the same, and an imaging device. Background Technology
[0002] Imaging equipment is used to scan objects (such as patients or workpieces) in a non-invasive or non-destructive manner to obtain images of the internal structures of anatomical tissues or parts of interest in the object being examined, in order to assist in diagnosis.
[0003] Imaging equipment typically includes a circular scanning aperture (e.g., a gantry opening) for the object to be scanned to enter or exit, and a detector subsystem mounted along the entire circumference or a portion of the arc of the circular aperture. This detector subsystem comprises multiple detector modules mounted on the gantry. For example, computed tomography (CT) equipment is commonly used as a medical imaging device to scan patients to obtain tomographic medical images of areas of interest to assist physicians in diagnosis.
[0004] A CT scanner includes multiple radiation detector modules that receive X-rays emitted from an X-ray tube and passing through the patient. The shape and number of these modules depend on clinical needs and the design of the CT system. These modules communicate with each other. Each radiation detector module typically includes a radiation detector element, which may include, for example, a pixelated scintillator and a photoelectric conversion device arranged sequentially along the X-ray transmission direction. The scintillator receives the X-rays passing through the patient and generates light, while the photoelectric conversion device (e.g., a photodiode) converts the light generated by the scintillator into an electrical signal. Each detector module also includes a collimator to collimate the X-rays passing through the patient into a specific direction to avoid or reduce interference between the pixels of the scintillator. Each detector module also includes signal processing circuitry for processing the electrical signals generated by the photoelectric conversion device, and a frame for supporting the collimator, scintillator, photoelectric conversion device, circuit board, and heat dissipation devices.
[0005] CT equipment also includes a computer subsystem that reconstructs medical tomographic images based on processed electrical signals to generate diagnostic aids.
[0006] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solution of this application and facilitating the understanding of those skilled in the art. Summary of the Invention
[0007] In CT scanners, the number of images captured in a single exposure by a radiation detector module depends on the number of radiation detector elements arranged in the Z-direction (i.e., the direction in which the object enters or exits the CT scanner from the scanning port) and the number of X-ray transmission channels each radiation detector element has in the Z-direction. Generally, the more radiation detector elements arranged in the Z-direction, the shorter the examination time, making it more suitable for examining easily moving body parts. In some applications (e.g., when examining relatively stationary body parts), the number of radiation detector elements arranged in the Z-direction can be less, thus saving costs.
[0008] The inventors discovered that in imaging equipment such as CT scanners, if the number of radiation detector elements in the Z-direction of the radiation detector module is reduced (for example, by half), the center position of the remaining radiation detector elements in the Z-direction may shift. Therefore, it is necessary to adjust the position of the X-ray source focus in the Z-direction, or adjust the position of the remaining radiation detector elements in the Z-direction, so that the X-ray source focus is located at the center position of the remaining radiation detector elements in the Z-direction. This adjustment of the X-ray source focus position may affect the frame structure design or mechanical vibration of the imaging equipment, thereby affecting the imaging quality.
[0009] To address at least one of the aforementioned technical problems or other similar issues, embodiments of this application provide a radiation detector module, a radiation detector, a manufacturing method thereof, and an imaging device. In this radiation detector module, the number of radiation detector elements arranged in the Z-direction of the circuit board is 4N rows or 4N+1 rows, where N is an integer greater than or equal to 1. Therefore, in scenarios where it is necessary to reduce some radiation detector elements, it is permissible to reduce the radiation detector elements in a manner symmetrical with respect to the center of the circuit board in the Z-direction, for example, reducing 2N rows of radiation detector elements. In this way, the center position of the remaining radiation detector elements in the Z-direction remains unchanged. Therefore, it is not necessary to adjust the position of the remaining radiation detector elements, nor is it necessary to adjust the focal position of the radiation source (e.g., an X-ray source). Consequently, it is not necessary to change the frame structure and does not introduce additional mechanical vibration, ensuring imaging quality.
[0010] According to one aspect of the embodiments of this application, a radiation detector module is provided for detecting ray signals passing through an object to be inspected in an imaging device, the object entering or exiting the imaging device in a first direction, the radiation detector module comprising:
[0011] A radiation detector element that receives rays emitted by a radiation source and converts the rays into electrical signals;
[0012] A circuit board, wherein a plurality of radiation detector elements are mounted on a first side of the circuit board, and in the first direction of the circuit board, the plurality of radiation detector elements are arranged in 4N rows or 4N+1 rows, where N is an integer greater than or equal to 1; and
[0013] A processing circuit chip is disposed on the second side of the substrate and communicates with the radiation detector element.
[0014] Therefore, the radiation detector can support image imaging of a specific number of rows, and can also directly remove 2N rows of radiation detector elements and related components arranged symmetrically along the Z direction on the circuit board, so as to support image imaging of about half of the rows. At the same time, the center position of the radiation detector in the Z direction remains unchanged. Thus, the structure of the detector, gantry and other devices or equipment does not need to be changed, thereby reducing manufacturing costs.
[0015] In some embodiments, in the first direction, a plurality of radiation detector elements are symmetrically arranged with respect to the center position of the circuit board in the first direction.
[0016] In some embodiments, each of the radiation detector elements has 16 rows of ray transmission channels distributed along the first direction.
[0017] In some embodiments, in the second direction of the circuit board, a plurality of radiation detector elements are arranged in one or more columns.
[0018] In some embodiments, one or more processing circuit chips are disposed in the area of the circuit board covered by each of the radiation detector elements.
[0019] In some embodiments, the radiation detector element is electrically connected to the processing circuit chip via a conductive path that penetrates the circuit substrate.
[0020] In some embodiments, the radiation detector element includes a scintillator and a photoelectric conversion element. The scintillator receives radiation and generates light, and the photoelectric conversion element converts the light generated by the scintillator into an electrical signal. The photoelectric conversion element includes a backlight photodiode.
[0021] In some embodiments, the radiation detector module has a flat plate configuration.
[0022] In some embodiments, the radiation detector module further includes:
[0023] A data collection circuit board is electrically connected to the circuit board via wires to receive data processed by the processing circuit chip.
[0024] In some embodiments, the radiation detector module further includes:
[0025] A collimator assembly disposed on the surface of the radiation detector element, the collimator assembly collimating rays emitted from a radiation source toward the radiation detector element.
[0026] According to another aspect of the embodiments of this application, a radiation detector is provided, the radiation detector comprising:
[0027] A guide rail and a radiation detector module supported on the guide rail according to any one of the above embodiments.
[0028] According to another aspect of the embodiments of this application, an imaging device is provided, the imaging device including a scanning space for accommodating an object to be examined, wherein the object to be examined enters or exits the scanning space in a first direction, the imaging device having a radiation detector as described in the above embodiments and an image reconstruction device, wherein the image reconstruction device performs image reconstruction based on an electrical signal generated by a radiation detector element in a radiation detector module of the radiation detector to generate a tomographic image of the object to be examined.
[0029] According to another aspect of the embodiments of this application, a method for manufacturing a radiation detector is provided, the method comprising:
[0030] Install two or more radiation detector modules as described in any of the above embodiments on a guide rail.
[0031] In some embodiments, two or more of the radiation detector modules are arranged along the extension direction of the guide rail.
[0032] Referring to the following description and accompanying drawings, specific implementation methods of the embodiments of this application are disclosed in detail, indicating how the principles of the embodiments of this application can be adopted. It should be understood that the implementation methods of this application are not limited in scope. Within the spirit and scope of the appended claims, the implementation methods of this application include many changes, modifications, and equivalents. Attached Figure Description
[0033] The accompanying drawings, which form part of the specification, are used to provide a further understanding of the embodiments of this application and illustrate the implementation methods of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other implementation methods based on these drawings without creative effort. In the drawings:
[0034] Figure 1 This is a schematic diagram of a CT device according to an embodiment of this application;
[0035] Figure 2This is a schematic diagram of a CT imaging system according to an embodiment of this application;
[0036] Figure 3 This is a schematic diagram of the cross-section of a radiation detector module for comparison;
[0037] Figure 4 This is a top view of the radiation detector module for comparison.
[0038] Figure 5 It is Figure 3 A schematic diagram of the cross-section of a radiation detector module after some of its radiation detector elements have been removed;
[0039] Figure 6 yes Figure 5 Top view;
[0040] Figure 7 It is Figure 3 Another schematic diagram of the cross-section of the radiation detector module after some of the radiation detector elements have been removed;
[0041] Figure 8 yes Figure 7 Top view;
[0042] Figure 9 This is a schematic cross-sectional view of a radiation detector module according to an embodiment of this application;
[0043] Figure 10 This is a top view schematic diagram of a radiation detector module according to an embodiment of this application;
[0044] Figure 11 From Figure 9 A schematic diagram with some radiation detector elements removed;
[0045] Figure 12 From Figure 10 A schematic diagram with some radiation detector elements removed;
[0046] Figure 13 This is another top view of the radiation detector module according to an embodiment of this application;
[0047] Figure 14 From Figure 13 A schematic diagram with some radiation detector elements removed;
[0048] Figure 15 From Figure 13 Another schematic diagram with some radiation detector elements removed;
[0049] Figure 16 This is a three-dimensional schematic diagram of a radiation detector according to an embodiment of this application;
[0050] Figure 17This is a schematic diagram of one component of an imaging device;
[0051] Figure 18 This is a method for manufacturing a radiation detector according to an embodiment of this application. Detailed Implementation
[0052] Referring to the accompanying drawings, the foregoing and other features of the embodiments of this application will become apparent from the following description. Specific embodiments of this application are specifically disclosed in the description and drawings, illustrating partial implementations in which the principles of the embodiments of this application can be adopted. It should be understood that this application is not limited to the described embodiments; rather, the embodiments of this application include all modifications, variations, and equivalents falling within the scope of the appended claims.
[0053] In the embodiments of this application, the terms "first," "second," etc., are used to distinguish different elements by name, but do not indicate the spatial arrangement or chronological order of these elements, and these elements should not be limited by these terms. The term "and / or" includes any one or more of the terms listed in association and all combinations thereof. The terms "comprising," "including," "having," etc., refer to the presence of the stated features, elements, components, or assemblies, but do not exclude the presence or addition of one or more other features, elements, components, or assemblies.
[0054] In the embodiments of this application, the singular forms "a," "the," etc., including the plural forms, should be broadly understood as "a kind" or "a class" rather than limited to the meaning of "an." Furthermore, the term "the" should be understood to include both the singular and plural forms, unless the context explicitly indicates otherwise. Additionally, the term "according to" should be understood as "at least partially based on…," and the term "based on" should be understood as "at least partially based on…," unless the context explicitly indicates otherwise.
[0055] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments. The term "comprising / including" as used herein means the presence of a feature, integral, step, or component, but does not exclude the presence or addition of one or more other features, integrals, steps, or components.
[0056] In various embodiments of this application, "above" and "below" both include the stated number. For example, "two or more" includes two and more than two, and "two or less" includes two and less than two.
[0057] The medical imaging device described in this application can be applied to a variety of medical imaging modalities, including but not limited to CT (computed tomography) imaging devices, PET (positron emission tomography)-CT, or any other suitable medical imaging devices.
[0058] A system for acquiring medical image data may include the aforementioned medical imaging equipment, a separate computer connected to the medical imaging equipment, or a computer connected to an internet cloud, which is connected via the internet to the medical imaging equipment or a storage device for storing medical images. The imaging method may be implemented independently or in combination by the aforementioned medical imaging equipment, the computer connected to the medical imaging equipment, and the computer connected to the internet cloud. For example, a system for acquiring medical image data may be a CT imaging system, etc.
[0059] Exemplary examples are described below in conjunction with X-ray computed tomography (CT) imaging equipment. Those skilled in the art will understand that embodiments of this application can also be applied to other medical imaging equipment.
[0060] In various embodiments of this application: the X direction is, for example, Figure 1 The points of the arcs shown above point in the direction of the X-ray source 103, i.e., the X-direction. Figure 1 The scanning gantry 101 or patient table 102 shown is in the horizontal or left-right direction; the Y direction is, for example, Figure 1 The tangent direction of the arc centered on the X-ray source 103 shown can, for example, represent the extended trajectory of the guide rail 1201 described later, i.e., the Y direction. Figure 1 The vertical direction of the scanning gantry 101 or patient table 102 shown, the Y direction can also be referred to as the second direction; the Z direction is, for example, Figure 1 The patient table 102 shown is moved in or out of the scanning gantry opening 106 in the Z direction, i.e. Figure 1 The front-back direction of the scanning frame 101 and the scanning frame opening 106 shown, the Z direction, can also be referred to as the first direction.
[0061] Figure 1 This is a schematic diagram of a CT device according to an embodiment of this application, illustrating the CT device 100. For example... Figure 1 As shown, the CT equipment 100 includes a scanning gantry 101 and a patient table 102; the scanning gantry 101 has an X-ray source 103 that projects an X-ray beam toward a detector assembly or collimator 104 on the opposite side of the scanning gantry 101. The patient 105 can lie supine on the patient table 102 and moves into the scanning gantry opening 106 as the patient table 102 moves; medical imaging data of the patient 105 can be obtained by scanning with the X-ray source 103.
[0062] Figure 2 This is a schematic diagram of a CT imaging system according to an embodiment of this application, illustrating a block diagram of the CT imaging system 200. Figure 2 As shown, the detector assembly 104 includes multiple detector units 104a and a data acquisition system (DAS) 104b. The multiple detector units 104a sense projected X-rays passing through the object under inspection 105.
[0063] DAS104b converts the collected information into projection data based on the sensing of detector unit 104a for subsequent processing. During the scan that acquires X-ray projection data, the scanning gantry 101 and the components mounted thereon rotate around the rotation center 101c.
[0064] The rotation of the scanning gantry 101 and the operation of the X-ray source 103 are controlled by the control mechanism 203 of the CT imaging system 200. The control mechanism 203 includes an X-ray controller 203a that provides power and timing signals to the X-ray source 103, and a scanning gantry motor controller 203b that controls the rotational speed and position of the scanning gantry 101. The image reconstruction unit 204 receives projection data from the DAS 104b and performs image reconstruction. The reconstructed image is transmitted as input to the computer 205, which stores the image in a mass storage device 206.
[0065] Computer 205 also receives commands and scanning parameters from the operator via console 207. Console 207 has some form of operator interface, such as a keyboard, mouse, voice-activated controller, or any other suitable input device. An associated display 208 allows the operator to view reconstructed images and other data from computer 205. Commands and parameters provided by the operator are used by computer 205 to provide control signals and information to DAS 104b, X-ray controller 203a, and scanning gantry motor controller 203b. Additionally, computer 205 operates patient table motor controller 209, controlling patient table 102 to position the examination subject 105 and scanning gantry 101. Specifically, patient table 102 allows the examination subject 105 to be moved wholly or partially through… Figure 1 The scanning rack opening is 106.
[0066] The above illustrations depict devices and systems for acquiring medical imaging data (or medical images or medical image data) according to embodiments of this application, but this application is not limited thereto. Medical imaging devices may be CT equipment, PET-CT, or any other suitable imaging equipment. Storage devices may be located within the medical imaging device, on a server outside the medical imaging device, in a standalone medical image storage system (e.g., PACS, Picture Archiving and Communication System), and / or in a remote cloud storage system.
[0067] Furthermore, medical imaging workstations can be located locally on the medical imaging equipment, meaning they are situated close to the equipment, and both can be located in the same scanning room, radiology department, or within the same hospital. Meanwhile, the medical image cloud platform analysis system can be located away from the medical imaging equipment, for example, in the cloud where it communicates with the equipment.
[0068] As an example, after a medical institution completes an imaging scan using medical imaging equipment, the scanned data is stored in a storage device. A medical imaging workstation can directly read the scanned data and perform image processing through its processor. As another example, a medical image cloud platform analysis system can remotely access medical images stored in the storage device to provide "Software as a Service" (SaaS). SaaS can exist between hospitals, between hospitals and imaging centers, or between hospitals and third-party online medical service providers.
[0069] The above illustrations illustrate medical image scanning. The embodiments of this application will be described in detail below with reference to the accompanying drawings. In the following embodiments, a CT scanner is used as an example for description; however, this description is equally applicable to other medical imaging devices.
[0070] Figure 3 This is a schematic diagram of a cross-section of a radiation detector module for comparison, observed along the Y direction. Figure 4 This is a top-view schematic diagram of the radiation detector module for comparison, viewed along the X-axis. (As shown) Figure 3 and Figure 4 As shown, in the comparison, the radiation detector module 300 is used to detect radiation passing through the object 105 in the imaging device. Figure 1 The X-ray signal (as shown) indicates that the object 105 enters or exits the imaging device in the Z direction.
[0071] The radiation detector module 300 includes a radiation detector element 301, a processing circuit chip 302, and a circuit board 303. The radiation detector element 301 receives radiation from a radiation source (e.g., Figure 1 The X-ray source 103 (shown) emits rays and converts the rays into electrical signals. A plurality of radiation detector elements 301 are mounted on a first side of the circuit board 303 (e.g., the side facing the radiation source in the X-direction). The radiation detector elements 301 are arranged in two rows in the Z-direction of the circuit board 303. The center of the radiation detector module 300 along the Z-direction (e.g., the geometric center of the entire structure formed by the radiation detector elements 301) is located at the position of the dashed line 3071, for example, the focal point of the rays projected from the radiation source onto the radiation detector module 300. A processing circuit chip 302 is disposed on a second side of the circuit board 303 (e.g., the side away from the radiation source in the X-direction) and communicates with the radiation detector elements 301.
[0072] In some examples, radiation detector element 301 includes scintillator 3011 and photoelectric conversion element 3012.
[0073] The radiation detector module 300 also includes a data collection circuit board 306, a flexible circuit 304, and a connection circuit 305.
[0074] Figure 3 and Figure 4 The radiation detector module 300, for example, can acquire images with 64 channels. If it needs to be modified to acquire images with 32 channels, the number of radiation detector elements 301 distributed in the Z direction can be reduced by half. For example, the two rows of radiation detector elements 301 in the Z direction can be reduced to one row. To keep the focal point of the radiation source at the center position of the remaining radiation detector elements 301 in the Z direction, the position of the X-ray source focal point in the Z direction can be adjusted, or the position of the remaining radiation detector elements in the Z direction can be adjusted, such as... Figures 5-8 As shown.
[0075] Figure 5 It is Figure 3 A schematic diagram of the cross-section of a radiation detector module after some of the radiation detector elements have been removed, as observed along the Y direction. Figure 6 yes Figure 5 Top view, viewed along the X direction Figure 5 Obtain. For example... Figure 5 and Figure 6 As shown, removing half of the radiation detector element 301 along the Z-direction of the radiation detector module can reduce the number of rows for image acquisition, but the center of the radiation detector along the Z-direction is shifted from the dashed line 3071 to the dashed line 3072, by a distance, for example, half the length of the radiation detector element 301 along the Z-direction. Figure 5 and Figure 6In the process, the focusing position of the X-ray source 103 on the Z-axis also needs to be readjusted to the dotted line 3072. This adjustment of the focusing position of the X-ray source 103 may affect the frame structure or mechanical vibration of the imaging equipment, thereby affecting the imaging quality.
[0076] Figure 7 It is Figure 3 Another schematic diagram of the cross-section of the radiation detector module after some radiation detector elements have been removed, which is observed along the Y direction. Figure 8 yes Figure 7 Top view, viewed along the X direction Figure 7 Obtain. For example... Figure 7 and Figure 8 As shown, after removing half of the radiation detector element 301 along the Z-axis of the radiation detector module, the position of the remaining radiation detector element 301 on the surface of the substrate 303 was further adjusted so that the center position of the remaining radiation detector element 301 along the Z-axis was maintained at the dashed line 3071. Although this eliminates the need to adjust the focusing position of the X-ray source 103 on the Z-axis, it does require adjusting the position of the remaining radiation detector element 301 on the surface of the substrate 303. This necessitates rearranging or rewiring the radiation detector element 301, and may even require replacing the circuit board 303 or the entire radiation detector module, thus increasing costs.
[0077] To address the aforementioned problems or at least similar issues, embodiments of this application provide a radiation detector module.
[0078] Figure 9 This is a schematic diagram of a cross-section of a radiation detector module according to an embodiment of this application, which is viewed along the Y direction. Figure 10 This is a top view schematic diagram of a radiation detector module according to an embodiment of this application, which can be viewed along the X direction. Figure 9 And thus obtained.
[0079] like Figure 9 and Figure 10 As shown, the radiation detector module 900 of this application embodiment is used to detect radiation passing through the object 105 (e.g., ...) in an imaging device. Figure 1 The X-ray signal (as shown) indicates that the object 105 enters or exits the imaging device in the Z direction.
[0080] The radiation detector module 900 includes: a radiation detector element 901, a processing circuit chip 902, and a circuit board 903.
[0081] Radiation detector element 901 receives radiation from a radiation source (e.g., Figure 1 The X-ray source 103 shown emits rays (e.g., X-rays) and converts the rays into electrical signals.
[0082] In some examples, the radiation detector element 901 includes a scintillator 9011 and a photoelectric conversion element 9012, which can be arranged correspondingly in the direction of X-ray radiation. For example, the scintillator 9011 is closer to the radiation source than the photoelectric conversion element 9012. The scintillator 9011 receives the rays emitted by the X-ray source and produces light, such as visible light. The photoelectric conversion element 9012 receives the light produced by the scintillator 9011 and converts the received light into an electrical signal. The photoelectric conversion element 9012 can be a photodiode, such as a backlit photodiode.
[0083] In other examples, the radiation detector element 901 may not have a scintillator 9011, thus allowing the radiation detector element 901 to directly receive rays emitted from the radiation source and generate electrical signals. The radiation detector element 901 can be a photon counting detector or a direct conversion detector, etc.
[0084] A plurality of radiation detector elements 901 are mounted on a first side of the circuit board 903 (e.g., the side facing the radiation source in the X direction). In the Z direction of the circuit board 903, the plurality of radiation detector elements 901 are arranged in 4N rows, where N is an integer greater than or equal to 1. For example, in... Figure 10 In the example shown, N=1, that is, four radiation detector elements 901 are provided in the Z direction of the circuit board 903.
[0085] The processing circuit chip 902 is disposed on the second side of the circuit board 903 (e.g., the side away from the radiation source in the X direction) and communicates with the radiation detector element 901.
[0086] Figure 13 This is another top view of the radiation detector module according to an embodiment of this application. Figure 13 Another arrangement of multiple radiation detector elements 901 on the surface of circuit board 903 is shown. For example... Figure 13 As shown, in the Z direction of the circuit board 903, multiple radiation detector elements 901 are arranged in 4N+1 rows, where N is an integer greater than or equal to 1. For example, in Figure 13 In the example shown, N=1, that is, five radiation detector elements 901 are provided in the Z direction of the circuit board 903.
[0087] according to Figure 9 , Figure 10 and Figure 13For example, in the Z direction of the circuit board 903, multiple radiation detector elements 901 are arranged in 4N rows or 4N+1 rows. Thus, when some radiation detector elements 901 in the Z direction are reduced, the center position of the remaining radiation detector elements in the Z direction can remain unchanged. Therefore, there is no need to adjust the position of the remaining radiation detector elements 901, which reduces costs. Furthermore, there is no need to adjust the focal position of the radiation source (e.g., X-ray source), which eliminates the need to change the frame structure of the imaging device and avoids additional mechanical vibration, thus ensuring the imaging quality of the imaging device.
[0088] like Figure 9 , Figure 10 and Figure 13 In the Z direction, multiple radiation detector elements 901 are symmetrically arranged relative to the center position 9071 of the circuit board 903 in the Z direction. For example, in Figure 10 In the example shown, the circuit board 903 has two radiation detector elements 901 on each side of the center position 9071 in the Z direction. For example, in... Figure 13 In the example shown, the center position 9071 of the circuit board 903 in the Z direction coincides with the center position of the radiation detector element 901 arranged in the middle in the Z direction, and there are two radiation detector elements 901 on each side of the radiation detector element 901 arranged in the middle.
[0089] Furthermore, in the Z direction, the focal point of the radiation source can be located at the center position 9071 of the circuit board 903 in the Z direction.
[0090] In this application, as Figure 9 or Figure 13 In the radiation detector module 900 shown, each radiation detector element 901 has M rows of ray transmission channels distributed along the Z direction, where M can be a natural number equal to or greater than 1. In one example, M = 16.
[0091] In some examples, such as Figure 9 As shown, if four rows of radiation detector elements 901 are arranged along the Z direction, then the radiation detector module 900 has 16*4=64 channels along the Z direction.
[0092] In some examples, such as Figure 13 As shown, if five rows of radiation detector elements 901 are arranged along the Z direction, then the radiation detector module 900 has 16*5=80 channels along the Z direction.
[0093] Figure 9 and Figure 10The radiation detector module 900 shown can, for example, acquire images with 64 channels. If it is necessary to adjust to acquire images with 32 channels, several rows (e.g., two rows) of radiation detector elements 901 that are symmetrically arranged relative to the center position 9071 can be removed.
[0094] Figure 11 and Figure 12 They are from Figure 9 and Figure 10 A schematic diagram with some radiation detector elements removed. (See attached image.) Figure 11 and Figure 12 As shown, it can be removed Figure 9 and Figure 10 The two outermost rows of radiation detector elements 901 and their corresponding processing circuit chips 902 are located in the middle. As a result, the scanning width of the remaining radiation detector elements 901 in the Z direction of the radiation detector module 900 is reduced by half, the number of image acquisition channels is reduced by half, and the center position of the remaining radiation detector elements 901 in the Z direction remains unchanged. Therefore, it is not necessary to adjust the position of the remaining radiation detector elements 901 or the focal position of the radiation source (e.g., X-ray source), thereby saving costs and ensuring the imaging quality of the imaging equipment.
[0095] Figure 13 The radiation detector module 900 shown can, for example, acquire images with 80 channels. If it is necessary to adjust to acquire images with 48 channels, several rows (e.g., two rows) of radiation detector elements 901 that are symmetrically arranged relative to the center position 9071 can be removed.
[0096] Figure 14 From Figure 13 A schematic diagram with some radiation detector elements removed. (See attached image.) Figure 14 As shown, it can be removed Figure 13 The two outermost rows of radiation detector elements 901 and their corresponding processing circuit chips 902 reduce the scanning width of the remaining radiation detector elements 901 in the Z direction by nearly half, for example, by reducing the scanning width of two radiation detector elements 901 in the Z direction. The number of image acquisition channels is also reduced by nearly half, for example, by reducing the number of image acquisition channels of two radiation detector elements 901 in the Z direction. Furthermore, the center position of the remaining radiation detector elements 901 in the Z direction remains unchanged. Therefore, it is not necessary to adjust the position of the remaining radiation detector elements 901 or the focal position of the radiation source (e.g., X-ray source), thereby saving costs and ensuring the imaging quality of the imaging equipment.
[0097] against Figure 13If the radiation detector module 900 shown needs to be further adjusted to acquire images with 16 channels, more rows (e.g., four rows) of radiation detector elements 901 that are symmetrically arranged relative to the center position 9071 can be removed.
[0098] Figure 15 From Figure 13 Another schematic diagram with some radiation detector elements removed. (See diagram below.) Figure 15 As shown, it can be removed Figure 13 The four outermost rows of radiation detector elements 901 and their corresponding processing circuit chips 902 are retained, while the middle row of radiation detector elements 901 and their corresponding processing circuit chips 902 in the Z direction are retained. As a result, the scanning width and the number of image acquisition channels of the remaining radiation detector elements 901 in the Z direction of the radiation detector module 900 are further reduced. Furthermore, the center position of the remaining radiation detector elements 901 in the Z direction remains unchanged. Therefore, it is not necessary to adjust the position of the remaining radiation detector elements 901 or the focal position of the radiation source (e.g., X-ray source), thereby saving costs and ensuring the imaging quality of the imaging equipment.
[0099] In this application, as Figure 10 or Figure 13 As shown, in the Y direction of the circuit board 903, multiple radiation detector elements 901 are arranged in a column (e.g., Figure 10 ) or more than 2 columns, for example, it can be set to 3 columns (e.g. Figure 13 ).
[0100] In this application, a (e.g.,) is provided in the area of the circuit board 903 covered by each radiation detector element 901. Figure 9 (as shown) or two or more processing circuit chips 902.
[0101] In this application, as Figure 9 and Figure 11 As shown, the radiation detector element 901 is electrically connected to the corresponding processing circuit chip 902 through a conductive path 909 that penetrates the circuit board 903.
[0102] The radiation detector module also includes a collimator assembly 908. The collimator assembly 908 is disposed on the surface of the radiation detector element 901. The collimator assembly 908 collimates the rays emitted from the radiation source toward the radiation detector element 901.
[0103] In some examples, rays emitted by a radiation source (e.g., X-rays) are collimated by a collimator assembly 908 and then irradiate a scintillator 9011. The light generated by the scintillator 9011 after being irradiated by the rays is converted into an electrical signal by a photoelectric conversion element 9012. The electrical signal generated by the photoelectric conversion element 9012 is used for tomographic imaging of the object.
[0104] In addition, in other examples, radiation detector element 901 may not include scintillator 9011, whereby rays emitted from a radiation source (e.g., X-rays) are collimated by collimator assembly 908 and then irradiate radiation detector element 901, which is used for photon counting or direct conversion, and radiation detector element 901 generates an electrical signal.
[0105] In this application, the electrical signal generated by the radiation detector element 901 (e.g., the electrical signal generated by the photoelectric conversion element 9012) is transmitted to the processing circuit chip 902 via the circuit board 903. The processing circuit chip 902 processes the received electrical signal. For example, if the electrical signal received by the processing circuit chip 902 is an analog signal, the processing circuit chip 902 converts the analog signal into a digital signal, that is, performs analog-to-digital conversion.
[0106] The radiation detector module 900 has a flat panel form factor. The flat panel form factor of the radiation detector module 900 means that the size of the radiation receiving plane of the radiation detector module, which receives the radiation or faces the radiation source, is much larger than or several times larger than the size of the radiation detector module parallel to the path of the radiation propagation. For example, the length or width of the radiation detector module with a rectangular radiation receiving plane is much larger than its thickness.
[0107] The radiation detector module 900 also includes a data collection circuit board 906. The data collection circuit board 906 is electrically connected to the circuit board 903 via a flexible circuit 904 and a connection circuit 905. The signal (e.g., a digital signal) processed by the processing circuit chip 902 is transmitted to the data collection circuit board 906 via the flexible circuit 904 and the connection circuit 905.
[0108] This application also provides a radiation detector.
[0109] Figure 16 This is a three-dimensional schematic diagram of a radiation detector according to an embodiment of this application. Figure 16 As shown, the radiation detector 1600 includes: a guide rail 1601, and two or more radiation detector modules 900 as described in the previous embodiment, which are supported on the guide rail 1601. The radiation detector modules 900 have 4N or 4N+1 radiation detector elements 301 arranged in the Z direction.
[0110] The radiation detector modules 900 are arranged along the Y direction extending from the guide rail 1601. The number of radiation detector modules 900 is 3 to 15. For example, a radiation detector may include 9 radiation detector modules 900, and the field of view (FOV) of the radiation detector in the Y direction is 50 cm; or a radiation detector may include 11 radiation detector modules 900, and the field of view (FOV) of the radiation detector in the Y direction is 60 cm.
[0111] In the radiation detector of this application, the radiation detector module 900 can have a large area. Therefore, while ensuring that the radiation detector reaches a predetermined scanning field of view in the Y direction, the number of columns in the radiation detector module 900 can be reduced, for example, to 1 column or more, thereby reducing the interconnection complexity between radiation detector modules.
[0112] This application also provides an imaging device, such as a medical imaging device, which includes a scanning space for accommodating an object to be examined, and the object to be examined enters or exits the scanning space in the Z direction.
[0113] Figure 17 This is a schematic diagram of one component of an imaging device. For example... Figure 17 As shown, the imaging device 1700 includes Figure 16 The radiation detector 1600 and image reconstruction device 1701 are shown. The image reconstruction device 1701 uses the photoelectric conversion element 9012 (e.g., in the radiation detector module of the radiation detector) in the radiation detector. Figure 9 The electrical signals generated (as shown) are used to perform tomographic imaging of the object.
[0114] In some examples, the image reconstruction device 1701 can, for example, utilize Figure 9 The data collected by the data collection circuit board 906 is used for image reconstruction. For a detailed description of the image reconstruction device 1701, please refer to related technologies.
[0115] The imaging device described in this application is, for example, a CT (computed tomography) imaging device, a PET-CT, or any other suitable imaging device.
[0116] This application also provides a method for manufacturing a radiation detector, such as... Figure 18 As shown, the manufacturing method includes:
[0117] 1801. Install two or more radiation detector modules 900 on the guide rail 1601.
[0118] In operation 1801, the number of radiation detector modules 900 is, for example, 3 to 15.
[0119] In operation 1801, two or more radiation detector modules 900 are arranged along the extension direction of guide rail 1601, for example, along the Y direction.
[0120] In this application, as Figure 18 As shown, the manufacturing method may further include:
[0121] 1802. Remove some radiation detector elements 901 from the radiation detector module 900, or add some radiation detector elements 901 to the radiation detector module 900.
[0122] For example, in operation 1802, in the first direction (Z direction), a portion of the radiation detector elements 901 on both sides of the center position 9071 may be removed or a predetermined number of radiation detector elements 901 may be installed on both sides of the center position 9071 in a symmetrical manner relative to the center position 9071 of the circuit board 903 in the first direction.
[0123] The above embodiments are merely illustrative examples of embodiments of this application, but this application is not limited thereto, and appropriate modifications can be made based on the above embodiments. For example, the above embodiments can be used alone, or one or more of the above embodiments can be combined.
[0124] The present application has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are exemplary and not intended to limit the scope of protection of the present application. Those skilled in the art can make various modifications and variations to the present application based on the principles thereof, and these modifications and variations are also within the scope of the present application.
Claims
1. A radiation detector module for detecting ray signals passing through an object being inspected in an imaging device, the object entering or exiting the imaging device in a first direction, characterized in that, The radiation detector module includes: A radiation detector element that receives rays emitted by a radiation source and converts the rays into electrical signals; A circuit board, wherein a plurality of radiation detector elements are mounted on a first side of the circuit board, and in the first direction of the circuit board, the plurality of radiation detector elements are arranged in 4N rows or 4N+1 rows, where N is an integer greater than or equal to 1; and A processing circuit chip is disposed on the second side of the substrate and communicates with the radiation detector element.
2. The radiation detector module according to claim 1, characterized in that, In the first direction, a plurality of radiation detector elements are symmetrically arranged with respect to the center position of the circuit board in the first direction.
3. The radiation detector module according to claim 1, characterized in that, Each of the radiation detector elements has 16 rows of ray transmission channels distributed along the first direction.
4. The radiation detector module according to claim 1, characterized in that, In the second direction of the circuit board, a plurality of radiation detector elements are arranged in one or more columns.
5. The radiation detector module according to claim 1, characterized in that, One or more processing circuit chips are disposed in the area of the circuit board covered by each of the radiation detector elements.
6. The radiation detector module according to claim 1, characterized in that, The radiation detector element is electrically connected to the processing circuit chip through a conductive path that penetrates the circuit substrate.
7. The radiation detector module according to claim 1, characterized in that, The radiation detector element includes a scintillator and a photoelectric conversion element. The scintillator receives radiation and generates light, and the photoelectric conversion element converts the light generated by the scintillator into an electrical signal. The photoelectric conversion element includes a backlight photodiode.
8. The radiation detector module according to claim 1, characterized in that, The radiation detector module has a flat plate configuration.
9. The radiation detector module according to claim 1, characterized in that, The radiation detector module also includes: A data collection circuit board is electrically connected to the circuit board via wires to receive data processed by the processing circuit chip.
10. The radiation detector module according to claim 1, characterized in that, The radiation detector module also includes: A collimator assembly disposed on the surface of the radiation detector element, the collimator assembly collimating rays emitted from a radiation source toward the radiation detector element.
11. A radiation detector, characterized in that, The radiation detector includes a guide rail and two or more radiation detector modules supported on the guide rail as described in any one of claims 1 to 10.
12. An imaging device, characterized in that, The imaging device includes a scanning space for accommodating the object to be examined, and the object to be examined enters or exits the scanning space in the first direction. The imaging device has a radiation detector as described in claim 11 and an image reconstruction device, the image reconstruction device performing image reconstruction based on electrical signals generated by radiation detector elements in the radiation detector module of the radiation detector to generate a tomographic image of the object to be examined.
13. A method for manufacturing a radiation detector, characterized in that, The method for manufacturing the radiation detector includes: Two or more radiation detector modules as described in any one of claims 1 to 10 are mounted on a guide rail.
14. The manufacturing method as described in claim 13, characterized in that, Two or more of the radiation detector modules are arranged along the extension direction of the guide rail.