Temperature sensor digital modeling method and device, storage medium and electronic equipment

Abstract

The invention discloses a digital modeling method and device for a temperature sensor, a storage medium and electronic equipment, relates to the technical field of sensor modeling, and mainly aims to solve the problem of how to reduce temperature measurement deviation when the temperature sensor is interfered by various influence factors. Comprising the following steps: based on standard temperature characteristics, standard structure heat conduction characteristics and standard electronic circuit characteristics of a platinum resistor and related parameters of a specific platinum resistor temperature sensor, establishing a mathematical model reflecting the corresponding steady-state and dynamic characteristics of the specific platinum resistor temperature sensor; setting external physical conditions corresponding to the specific platinum resistance temperature sensor based on the nuclear reactor pipeline temperature field, and combining the external physical conditions with the mathematical model to obtain a measurement physical model of the specific platinum resistance temperature sensor in the nuclear reactor pipeline temperature field; any one of external physical conditions is changed to simulate the heat transfer process of the measurement physical model, and the heat transfer characteristic of the sleeve and the dynamic response characteristic of the temperature sensor are displayed.

Description

Technical Field

[0001] This invention relates to the field of sensor modeling technology, and in particular to a digital modeling method and apparatus for temperature sensors, a storage medium, and electronic equipment. Background Technology

[0002] The standards and requirements for process instrumentation in reactor systems are higher than those for general-purpose instruments, often necessitating customization before installation within the instrumentation and control system. Before actual deployment in engineering, reactor and instrumentation and control systems require modeling and integrated simulation. The simulation results provide a foundation for the actual placement of instrument measurement points, instrument selection, and measurement scheme optimization, ensuring system reliability and safety.

[0003] However, traditional simulation analysis of control and protection systems in the nuclear power field neglects the impact of the dynamic characteristics of temperature sensors on the system's simulation analysis, lacking consideration for the dynamic response characteristics of customized temperature sensors. However, temperature sensors are affected by various factors during operation (such as temperature stratification, different instrument input parameters, etc.), leading to significant deviations between the temperature sensor's response characteristics in the simulation analysis and the actual situation. Therefore, it is necessary to perform refined digital modeling of temperature sensors, combine it with the pipeline temperature field, dynamically observe the actual measurement and temperature transfer process of the temperature sensor model, analyze the key factors affecting the measurement, and thus reduce the deviation in temperature measurement caused by neglecting the response characteristics of the temperature sensor. Summary of the Invention

[0004] In view of this, the present invention provides a method and device for digital modeling of temperature sensors, a storage medium, and an electronic device, the main purpose of which is to solve the problem of reducing temperature measurement deviation when temperature sensors are affected by various influencing factors.

[0005] According to one aspect of the present invention, a method for digital modeling a temperature sensor is provided, comprising: Based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics, and relevant parameters of a specific platinum resistance temperature sensor, a mathematical model of a specific platinum resistance temperature sensor is established to reflect its steady-state and dynamic characteristics. Based on the temperature field of the nuclear reactor pipeline, the external physical conditions corresponding to the specific platinum resistance temperature sensor are set. The external physical conditions include the viscosity of the medium, the thermal conductivity of the medium, and the insertion depth. By combining the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipe is obtained. The heat transfer process of the measurement physical model is simulated by changing any one of the external physical conditions, and the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor are displayed.

[0006] Furthermore, the mathematical model for a specific platinum resistance temperature sensor, based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics, and relevant parameters of the specific platinum resistance temperature sensor, is established to reflect the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor. This includes: The platinum wire diameter, platinum wire length, and material purity are obtained from the relevant parameters of a specific platinum resistance temperature sensor, and the resistance ratio of the specific platinum resistance temperature sensor is calculated based on the platinum wire diameter, the platinum wire length, and the material purity. A temperature characteristic sub-model of the specific platinum resistance temperature sensor is obtained based on the resistance ratio of the specific platinum resistance temperature sensor and the standard temperature characteristics. The structure of the specific platinum resistance temperature sensor is simplified to determine the overall density and overall specific heat of the specific platinum resistance temperature sensor; Based on the overall density, the overall specific heat, and the standard structural thermal conductivity, a structural heat transfer response sub-model for the specific platinum resistance temperature sensor is determined. By combining the temperature characteristic sub-model, structural heat transfer response sub-model, and standard electronic circuit characteristic sub-model of the specific platinum resistance temperature sensor, a mathematical model of the specific platinum resistance temperature sensor corresponding to its steady-state and dynamic characteristics is obtained.

[0007] Furthermore, the step of determining the structural heat transfer response sub-model of the specific platinum resistance temperature sensor based on the overall density, the overall specific heat, and the standard structural thermal conductivity includes: Obtain the simplified surface area A and surface heat transfer coefficient of a specific platinum resistance temperature sensor. ; Combining the surface area A and the surface heat exchange coefficient The combined density and the combined specific heat determine the simplified time constant of the specific platinum resistance temperature sensor. N T The formula is as follows:

[0008] in, For overall density, V For the total volume, C p For overall specific heat; Based on the time constant N TDetermine the structural heat transfer response sub-model of the specific platinum resistance temperature sensor. G T (s), the formula is as follows:

[0009] in, s It is a complex frequency variable.

[0010] Furthermore, the step of combining the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor to obtain the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipe includes: Based on the mathematical model of the specific platinum resistance temperature sensor, and considering the dynamic temperature measurement performance of the specific platinum resistance temperature sensor when the thickness and material of the insulation layer and protective sleeve layer change, a cylindrical wall heat transfer model is established. Based on the mathematical model of the specific platinum resistance temperature sensor, considering the air gap between the protective sleeve layer and the temperature sensor body, the mixed heat transfer parameters are determined. Based on the hybrid heat transfer parameters, the cylindrical wall heat transfer model, and the external physical conditions, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipeline is obtained.

[0011] Furthermore, the establishment of the cylindrical wall heat transfer model based on the specific platinum resistance temperature sensor mathematical model, considering the dynamic temperature measurement performance of the specific platinum resistance temperature sensor under changes in the thickness and material of the insulation layer and protective sleeve layer, includes: Radial heat conduction differential equation based on the inner and outer radii of the cylindrical wall; The radial thermal conductivity differential equation is subjected to Laplace transform to obtain the output function of thermal conductivity in the complex frequency domain; The heat transfer model of the cylindrical wall is established based on the output function of the thermal conductivity in the complex frequency domain.

[0012] Furthermore, the determination of the mixed heat transfer parameters based on the specific platinum resistance temperature sensor mathematical model, considering the air gap between the protective sheath and the temperature sensor body, includes: The air gap is modeled in a microscopic local magnification, and the heat transfer response under different air gap conditions is simulated using simulation software based on the specific platinum resistance temperature sensor mathematical model, so as to obtain the temperature-time response curves under different air gap conditions. Based on the temperature-time response curves under different air gap conditions, the heat transfer coefficients of gas and solid are fitted by the heat balance equation to obtain the fitted gas heat transfer coefficient and solid heat transfer coefficient. The volume ratio of gas and solid in the model is determined, and the mixed heat transfer parameters are determined based on the volume ratio of gas and solid, the heat transfer coefficient of gas, and the heat transfer coefficient of solid.

[0013] Furthermore, the method also includes: Based on the fault mechanism of temperature sensor, fault transfer functions are set up for several typical fault types; the typical fault types include constant deviation fault, constant gain fault, impact fault, drift fault, accuracy degradation fault, and output constant / jamming fault. Receive the target typical fault type determined by the user, and obtain the target fault transfer function corresponding to the target typical fault type; Based on the target fault transfer function and the mathematical model of the specific platinum resistance temperature sensor, a simulation of the dynamic temperature change process is performed, and the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor under typical target fault types are displayed; or, The heat transfer process is simulated based on the target fault transfer function and the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipeline. The heat transfer animation of the sleeve and the dynamic response curve of the temperature sensor under the typical fault type of the target are displayed.

[0014] According to another aspect of the present invention, a digital modeling apparatus for a temperature sensor is provided, comprising: The mathematical modeling module is used to establish a mathematical model of a specific platinum resistance temperature sensor based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics of platinum resistance temperature sensors and relevant parameters of specific platinum resistance temperature sensors, which reflects the steady-state and dynamic characteristics of a specific platinum resistance temperature sensor. The temperature field setting module is used to set the external physical conditions corresponding to the specific platinum resistance temperature sensor based on the temperature field of the nuclear reactor pipeline. The external physical conditions include the viscosity of the medium, the thermal conductivity of the medium, and the insertion depth. The physical modeling module is used to combine the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor to obtain the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipe. The dynamic simulation module is used to simulate the heat transfer process of the measurement physical model by changing any one of the external physical conditions, and to display the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor.

[0015] Furthermore, the mathematical modeling module includes a temperature characteristic modeling unit, a structural heat transfer modeling unit, and an integration unit; The temperature characteristic modeling unit is used for: The platinum wire diameter, platinum wire length, and material purity are obtained from the relevant parameters of a specific platinum resistance temperature sensor, and the resistance ratio of the specific platinum resistance temperature sensor is calculated based on the platinum wire diameter, the platinum wire length, and the material purity. A temperature characteristic sub-model of the specific platinum resistance temperature sensor is obtained based on the resistance ratio of the specific platinum resistance temperature sensor and the standard temperature characteristics. The structural heat transfer modeling unit is used for: The structure of the specific platinum resistance temperature sensor is simplified to determine the overall density and overall specific heat of the specific platinum resistance temperature sensor; Based on the overall density, the overall specific heat, and the standard structural thermal conductivity, a structural heat transfer response sub-model for the specific platinum resistance temperature sensor is determined. The integration unit is used for: By combining the temperature characteristic sub-model, structural heat transfer response sub-model, and standard electronic circuit characteristic sub-model of the specific platinum resistance temperature sensor, a digital model of the specific platinum resistance temperature sensor corresponding to the specific platinum resistance temperature sensor is obtained.

[0016] Furthermore, the structural heat transfer modeling unit is also used for: Obtain the simplified surface area A and surface heat transfer coefficient of a specific platinum resistance temperature sensor. ; Combining the surface area A and the surface heat exchange coefficient The combined density and the combined specific heat determine the simplified time constant of the specific platinum resistance temperature sensor. N T The formula is as follows:

[0017] in, For overall density, V For the total volume, C p For overall specific heat; Based on the time constant N T Determine the structural heat transfer response sub-model of the specific platinum resistance temperature sensor. G T (s), the formula is as follows:

[0018] in, s It is a complex frequency variable.

[0019] Furthermore, the physical modeling module is also used for: Based on the mathematical model of the specific platinum resistance temperature sensor, and considering the dynamic temperature measurement performance of the specific platinum resistance temperature sensor when the thickness and material of the insulation layer and protective sleeve layer change, a cylindrical wall heat transfer model is established. Based on the mathematical model of the specific platinum resistance temperature sensor, considering the air gap between the protective sleeve layer and the temperature sensor body, the mixed heat transfer parameters are determined. Based on the hybrid heat transfer parameters, the cylindrical wall heat transfer model, and the external physical conditions, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipeline is obtained.

[0020] Furthermore, the physical modeling module is also used for: Radial heat conduction differential equation based on the inner and outer radii of the cylindrical wall; The radial thermal conductivity differential equation is subjected to Laplace transform to obtain the output function of thermal conductivity in the complex frequency domain; The heat transfer model of the cylindrical wall is established based on the output function of the thermal conductivity in the complex frequency domain.

[0021] Furthermore, the physical modeling module is also used for: The air gap is modeled in a microscopic local magnification, and the heat transfer response under different air gap conditions is simulated using simulation software based on the specific platinum resistance temperature sensor mathematical model, so as to obtain the temperature-time response curves under different air gap conditions. Based on the temperature-time response curves under different air gap conditions, the heat transfer coefficients of gas and solid are fitted by the heat balance equation to obtain the fitted gas heat transfer coefficient and solid heat transfer coefficient. The volume ratio of gas and solid in the model is determined, and the mixed heat transfer parameters are determined based on the volume ratio of gas and solid, the heat transfer coefficient of gas, and the heat transfer coefficient of solid.

[0022] Furthermore, the device also includes a fault modeling module, which is used for: Based on the fault mechanism of temperature sensor, fault transfer functions are set up for several typical fault types; the typical fault types include constant deviation fault, constant gain fault, impact fault, drift fault, accuracy degradation fault, and output constant / jamming fault. Receive the target typical fault type determined by the user, and obtain the target fault transfer function corresponding to the target typical fault type; Based on the target fault transfer function and the mathematical model of the specific platinum resistance temperature sensor, a simulation of the dynamic temperature change process is performed, and the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor under typical target fault types are displayed; or, The heat transfer process is simulated based on the target fault transfer function and the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipeline, and the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor under the typical fault type of the target are displayed.

[0023] According to another aspect of the present invention, a storage medium is provided, wherein at least one executable instruction is stored therein, the executable instruction causing a processor to perform an operation corresponding to the above-described digital modeling method for temperature sensors.

[0024] According to another aspect of the present invention, an electronic device is provided, including a processor, a memory, a communication interface, and a communication bus, wherein the processor, the memory, and the communication interface communicate with each other through the communication bus; The memory is used to store at least one executable instruction, which causes the processor to perform operations corresponding to the above-described digital modeling method for temperature sensors.

[0025] By employing the above-described technical solutions, the technical solutions provided by the embodiments of the present invention have at least the following advantages: This invention provides a digital modeling method and device for temperature sensors, a storage medium, and electronic equipment. Compared with existing technologies, this invention establishes a mathematical model of a specific platinum resistance temperature sensor based on the standard temperature characteristics, standard structural thermal conductivity characteristics, standard electronic circuit characteristics, and relevant parameters of the specific platinum resistance temperature sensor. Combined with the dynamic mathematical model of the specific platinum resistance temperature sensor, a physical model of the platinum resistance temperature sensor measuring the heat transfer response model is obtained by changing the parameters of the platinum resistance measurement model. As the types of external media, media viscosity, media thermal conductivity, and the insertion of the thermal resistor change, the measurement physical model simulates the heat transfer process, displaying a heat transfer animation of the casing and a dynamic response curve of the temperature sensor. This provides a more realistic signal input source for the simulation analysis of reactor and primary loop instrumentation and control systems, and provides digital simulation analysis tools for reactor process instrumentation research and development, design, and process measurement system layout.

[0026] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0027] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A flowchart illustrating a digital modeling method for a temperature sensor provided by an embodiment of the present invention is shown. Figure 2 The diagram illustrates the digital modeling process of temperature sensors at different levels provided in the embodiments of the present invention; Figure 3 This diagram illustrates a structural schematic of a cylindrical wall heat transfer model provided in an embodiment of the present invention. Figure 4 This diagram illustrates a specific platinum resistance temperature sensor provided in an embodiment of the present invention being inserted into a process pipeline and subjected to heat transfer simulation. Figure 5 This diagram illustrates the structure for air gap analysis and modeling between the protective sleeve and the sensor body provided in an embodiment of the present invention. Figure 6 A schematic diagram of the response time curves under different air gaps provided in the embodiments of the present invention is shown; Figure 7 This diagram illustrates the structure of a temperature sensor digital modeling device according to an embodiment of the present invention. Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of the present invention is shown. Detailed Implementation

[0028] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0029] This invention provides a method for digital modeling of temperature sensors, such as... Figure 1 As shown, the method includes: 101. Based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics of platinum resistance thermometers and the relevant parameters of specific platinum resistance temperature sensors, establish a mathematical model of a specific platinum resistance temperature sensor that reflects its steady-state and dynamic characteristics. In this embodiment of the invention, the current execution end establishes a digital model of a specific platinum resistance temperature sensor corresponding to that specific platinum resistance temperature sensor from three aspects: a temperature characteristic sub-model, a structural heat transfer response sub-model, and a combined electronic circuit characteristic sub-model. For example... Figure 2 As shown.

[0030] (a) Temperature characteristic sub-model In this embodiment of the invention, the current execution terminal obtains relevant parameters such as platinum wire diameter, platinum wire length, and material purity from the relevant parameters of a specific platinum resistance temperature sensor, and calculates the resistance ratio of the specific platinum resistance temperature sensor based on the platinum wire diameter, platinum wire length, and material purity. In this embodiment, to analyze the influence of platinum wire purity on platinum resistance temperature measurement, the resistance ratio is introduced. W Taking a Pt100 platinum resistance thermometer as an example, its resistance ratio is defined as:

[0031] in, R 0 and R 100 These are the resistance values ​​of standard purity platinum resistance and Pt100 platinum resistance (under the same platinum wire diameter and length). Temperature coefficient of resistance (TCR) represents the relationship between a platinum resistance thermometer and temperature; that is, the change in resistance (in Kelvin) when the temperature changes by 1 K within a given temperature interval. -1 Temperature coefficient of resistance The calculation formula is as follows:

[0032] in, R t0 , R t They represent temperatures respectively. t 0℃ and t The resistance value of a platinum resistance thermometer at ℃. Temperature coefficient of resistance. Resistance is a physical quantity that characterizes the intrinsic relationship between a conductor's resistance and temperature; its value is related to the purity of the conductor itself. Generally, the higher the purity, the better. The larger the value, the greater the resistance. Based on the above resistance-temperature relationship model of platinum resistance thermometers, the characteristic function of the standard temperature characteristic is determined.

[0033] In this embodiment of the invention, the current execution terminal obtains a temperature characteristic sub-model of the specific platinum resistance temperature sensor based on the resistance ratio of the specific platinum resistance temperature sensor and the standard temperature characteristics. It is known that, under otherwise constant conditions, the resistance of a resistance wire of the same material is directly proportional to its length and inversely proportional to its cross-sectional area. The conductor resistance of the specific platinum resistance temperature sensor is related to the material constituting it. Based on the characteristic function of the standard temperature characteristics, the external parameter, the diameter of the platinum resistance wire, is used... d pt Platinum wire length L pt Material purity By changing the input resistance ratio calculation model, and altering the coefficients of the characteristic curve of the standard platinum resistance temperature sensor, the temperature characteristic function curve of a specific platinum resistance temperature sensor can be obtained.

[0034] (II) Structural heat transfer response sub-model In this embodiment of the invention, the specific platinum resistance temperature sensor includes related structures such as the thickness of the insulating layer, the thickness of the metal outer shell layer, and the thickness of the protective sleeve. These structures affect the thermal conductivity of the platinum resistance, thus influencing its temperature measurement performance. Considering the dynamic thermal conductivity of a standard platinum resistance, the internal heat transfer process is taken into account, with heat flowing from higher-temperature areas to lower-temperature areas. The current execution end simplifies the structure of the specific platinum resistance temperature sensor, which includes the insulating layer, the metal outer shell layer, and the protective sleeve layer, to determine the overall density and overall specific heat of the specific platinum resistance temperature sensor. Specifically, the structure of the specific platinum resistance temperature sensor can be simplified into a multi-layer cylindrical structure composed of a protective sleeve layer, a metal outer shell layer, and an insulating layer. The overall density is calculated by dividing the total mass by the total volume. Specifically, the current execution end obtains the material composition and volume of each component of the multi-layer cylindrical structure; calculates the mass of each component based on the material composition and volume; calculates the total mass and total volume based on the mass and volume of each component; and calculates the overall density of the specific platinum resistance temperature sensor by dividing the total mass by the total volume. Specifically, the comprehensive specific heat is calculated by dividing the total heat capacity by the total mass. Specifically, the current execution terminal obtains the specific heat capacity of the materials of each component of the multi-layer cylindrical structure, and calculates the heat capacity of each component based on the specific heat capacity and mass of each component; the total heat capacity is calculated based on the heat capacity of each component, and the comprehensive specific heat of the specific platinum resistance temperature sensor is calculated by dividing the total heat capacity by the total mass.

[0035] After obtaining the comprehensive density and comprehensive specific heat, the current execution terminal further determines the structural heat transfer response sub-model of the specific platinum resistance temperature sensor based on the comprehensive density, comprehensive specific heat, and the standard structural thermal conductivity. In this embodiment, since the dynamic model of heat transfer on the cylindrical wall of a multi-layer cylindrical structure is too complex, a simplified analysis is adopted to construct a model that is fast in calculation, reflects the key dynamic performance of the temperature sensor, and can build a joint testing environment for the subsequent control and protection system. When describing the dynamic characteristic function of a resistance temperature detector (RTD), the internal temperature distribution and heat exchange errors are generally ignored, and the energy balance equation of a general RTD is directly obtained through the model. When the surrounding temperature changes, its heat balance equation is as follows:

[0036] in, For overall density, V For the total volume, C p To consider specific heat, T j , T g These are the body temperature of the temperature sensor and the temperature of the medium, respectively, in °C; The surface heat exchange coefficient between the temperature sensor and the medium; A Let be the surface area of ​​the temperature sensor. The above formula can be rewritten as:

[0037] in, N T This represents the time constant of the simplified temperature sensor. The current execution terminal obtains the simplified surface area A and surface heat transfer coefficient of a specific platinum resistance temperature sensor. ; combined with the surface area A and the surface heat exchange coefficient The combined density and the combined specific heat determine the simplified time constant of the specific platinum resistance temperature sensor. N T The formula is as follows:

[0038] in, For overall density, V For the total volume, C p For overall specific heat; In this embodiment of the invention, the current execution end uses a Laplace transform based on the time constant. N T Determine the structural heat transfer response sub-model of the specific platinum resistance temperature sensor. G T (s), the formula is as follows:

[0039] in, s For complex frequency variables, this is also a general variable representation of the Laplace transform transfer function. The thickness and material of the insulation layer, the metal outer shell layer, and the protective sheath layer of a specific platinum resistance temperature sensor will all change parameters such as the sensor's overall density and specific heat, correspondingly altering the time constant of the sensor's dynamic response. N T This, in turn, changes the structural heat transfer response sub-model. G T (s).

[0040] (III) Combining electronic circuit characteristic sub-models Because the control and protection systems receive standard signals of 4mA to 20mA during the joint commissioning and analysis of the nuclear reactor and primary loop instrumentation and control system, the temperature sensor signals are converted into standard signals of 4mA to 20mA by constructing electronic circuit characteristic models of three-wire and four-wire platinum resistance temperature sensors. In this embodiment of the invention, the current execution terminal combines the temperature characteristic sub-model and structural heat transfer response sub-model of the specific platinum resistance temperature sensor with the standard electronic circuit characteristic sub-model to obtain the mathematical model of the specific platinum resistance temperature sensor corresponding to the specific platinum resistance temperature sensor.

[0041] It should be noted that in the mathematical models described above, the temperature characteristic sub-model of the specific platinum resistance temperature sensor provides the steady-state output thermal resistance value and temperature during measurement, while the structural heat transfer response sub-model of the specific platinum resistance temperature sensor provides the dynamic process of the thermal resistance reaching the completion of measurement from the start of measurement (when there is a temperature difference with the measured medium). This invention uses the Modelica language to establish the temperature characteristic sub-model, structural heat transfer response sub-model, and electronic circuit model of a specific platinum resistance temperature sensor (such as Pt100 or Pt1000), and integrates them to obtain a mathematical model of the specific platinum resistance temperature sensor corresponding to it.

[0042] 102. Based on the temperature field of the nuclear reactor pipeline, set the external physical conditions corresponding to the specific platinum resistance temperature sensor, wherein the external physical conditions include the viscosity of the medium, the thermal conductivity of the medium, and the insertion depth; In this embodiment of the invention, as the type of external medium, its viscosity, its thermal conductivity, and the insertion depth of the thermal resistor are varied, the thermal resistance characteristics of the specific platinum resistance temperature sensor and the related thermal balance analysis model (convective heat conduction model) will be altered. Figure 2As shown, the current execution end sets the external physical conditions corresponding to the specific platinum resistance temperature sensor based on the temperature field of the nuclear reactor pipeline, including medium viscosity, medium thermal conductivity and insertion depth, etc., which are not specifically limited in this embodiment of the invention.

[0043] 103. By combining the external physical conditions with the digital model of the specific platinum resistance temperature sensor, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipeline is obtained. In this embodiment of the invention, the current execution end establishes a measurement physical model of a specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipeline from three aspects: establishing a cylindrical heat transfer model, determining mixed heat transfer parameters, and integrating modeling.

[0044] (a) Establishing a cylindrical heat transfer model In this embodiment of the invention, the current execution terminal establishes a cylindrical wall heat transfer model based on the mathematical model of the specific platinum resistance temperature sensor, considering the dynamic temperature measurement performance of the specific platinum resistance temperature sensor under changes in the thickness and material of the insulation layer and protective sleeve layer. Specifically, an example of the structure of the cylindrical wall heat transfer model is shown below. Figure 3 As shown, the radial heat conduction differential equation of the model is first determined based on the inner radius r0 and outer radius r1 of the cylinder wall. The specific formula is as follows:

[0045] The boundary conditions for the above radial heat conduction differential equation are as follows:

[0046] in, The value representing the heat source within the column indicates the amount of heat generated or dissipated per unit time, expressed in units of [unit missing]. W / m 3 ; T Representing temperature, the temperature coefficient in the above formula It's Changshu, the temperature... T It depends only on the radius. λ is the thermal conductivity. 0 and 1 and are the heat transfer coefficients of the inner and outer walls of the cylinder, respectively. T 0 and T 1 and are the ambient temperatures of the inner and outer walls of the cylinder, respectively.

[0047] Next, the above radial heat conduction differential equation is subjected to Laplace transform to obtain the output function of thermal conductivity in the complex frequency domain, as shown in the following formula:

[0048] in, It is transformed to the complex frequency domain. s Let the image function on the above, (where m is a system eigenvalue), then the solution to the following equation is obtained:

[0049]

[0050]

[0051] in, T 00 and T g For the reason T 0 / and The determined particular solution, The determinant of the coefficient matrix, G ai , G bi ( i =0,1) are the coefficient matrix elements related to the Bessel function; J 0 and J 1 represents the zeroth and first order Bessel numbers of the first kind, respectively; Y 0 and Y 1 represents the zeroth and first order Bessel numbers of the second kind, respectively; Let be the output function of the heat conduction system in the complex frequency domain, and let its input be [ T 0, T 1] T [ H 0, H 1] T Let be the thermal transfer function of the long cylindrical wall.

[0052] The current execution end outputs a function based on the aforementioned thermal conductivity in the complex frequency domain. A heat transfer model of the cylindrical wall is established. The model inputs include the inner and outer radii of the multi-layered thermal resistance structure (protective sleeve layer, metal outer shell layer, insulation layer, etc.), thermal conductivity, surface heat transfer coefficient, and the insertion depth of the specific platinum resistance temperature sensor in the process pipeline, all of which affect the characteristic analysis of the specific platinum resistance temperature sensor. Based on this heat transfer equation, the current execution end can establish a physical model of the specific platinum resistance temperature sensor in ANSYS, including the process pipeline, the dynamic temperature field inside the pipeline, and the specific platinum resistance temperature sensor, as shown in the attached figure. Figure 4 As shown. Based on the established physical model and the flow field within the pipe, the complex frequency domain output and dynamic response characteristics corresponding to this transfer function can be obtained.

[0053] (ii) Determining the mixing heat transfer parameters To ensure response time requirements, the temperature sensor body and the protective sleeve of a specific platinum resistance temperature sensor with a protective sleeve must be designed to fit tightly together. The tighter the fit, the faster the response; conversely, the smaller the air gap between the temperature sensor body and the protective sleeve, the faster the response. In this embodiment of the invention, the influence of the air gap is modeled and quantitatively analyzed, and its influence is reflected in a mathematical model, resulting in a temperature sensor mathematical model that is more consistent with engineering applications. Specifically, based on the digital model of the specific platinum resistance temperature sensor, the current execution end determines the mixed heat transfer parameters, considering the air gap between the protective sleeve layer and the temperature sensor body.

[0054] First, a microscopic local magnification model can be performed on the air gap between the protective sleeve layer and the temperature sensor body. Assuming the plate is 0.5mm long and wide, and 15µm thick, with three 5µm layers and the middle layer representing the gas gap, the model is as follows: Figure 5 As shown. Among them, (1) is a large air gap with a gas-metal interface length of 0.5 mm; (2) is a small air gap with an interface length of 5.656 mm; (3) and (4) are air blocks with different dispersion degrees, with interface lengths of 1 mm and 1.416 mm respectively.

[0055] Next, the left side of the plate was set to a constant temperature of 373.15K, with an initial plate temperature of 298.15K. The temperature change on the right side of the plate was observed through heat transfer. Ansys was used to simulate the heat transfer response under different conditions in the intermediate gas gap, as shown in the attached figure. Figure 6 As shown in the figure, (a) the middle layer is all air (the thickness of the plate is 10 μm); (b) the middle layer is a large piece of air with an interface length of 0.5 mm between the gas and metal; (c) and (d) the middle layer is a piece of air with different degrees of dispersion, with an interface length of 1 mm in (c) and 1.416 mm in (d); (e) the middle layer is a small piece of air with an interface length of 5.656 mm; and (f) the middle layer is the heat transfer response curve under the condition of no air. It can be seen that as the degree of air dispersion in the gas gap between the plates gradually increases, the response time gradually decreases.

[0056] When the intermediate layer is a mixture of air and metal, the response curves show that the greater the dispersion of air in the intermediate layer, the shorter the thermal response time. Therefore, heat transfer parameters are fitted, assuming the heat transfer parameters for the mixed state are... k mix Based on the spatial structure of the plate, the heat transfer process can be considered as the sum of two heat transfer paths. Therefore, the mixed heat transfer parameters of the two substances are calculated as follows:

[0057] in, dis aThe degree of gas dispersion in the interstitial layer is characterized by the length of the gas-solid contact interface. r a , r m Indicates the volume ratio of gas to solid, parameter k 1. k 2 is the adjustment parameter. k a , k m The heat transfer coefficients between the gas and the solid are obtained by fitting the following heat balance equation:

[0058] in, The overall density of the board; V Let be the volume of the plate; c p Overall specific heat; T j and T g Temperature on the right and left sides of the plate; The heat exchanged per unit length of plate per unit time; L The thickness of the plate.

[0059] When there is no air gap in the middle or the whole is an air layer, the density and specific heat of the metal and air can be directly fitted.

[0060] When the middle layer is a mixed layer, take , ,in, vr a , vr m These represent the volume percentages of gas and solid, respectively. mr a , mr m These represent the mass percentages of gas and solid, respectively. and These represent the densities of gases and solids, respectively. c m and c a These represent the specific heat of gases and solids, respectively.

[0061] Based on the established physical model of a multilayer platinum resistance temperature sensor with a protective sleeve, this invention further analyzes and verifies the quantitative impact of different air gap ratios on response time through air gap ratio analysis between the protective sleeve and the temperature sensing element.

[0062] (III) Integrated Modeling In this embodiment of the invention, the current execution terminal obtains a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipeline based on the mixed heat transfer parameters, the cylindrical wall heat transfer model, and the external physical conditions, such as... Figure 2 As shown.

[0063] 104. Change any one of the external physical conditions to simulate the heat transfer process of the measurement physical model, and display the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor.

[0064] In this embodiment of the invention, the current execution terminal changes any one of the external physical conditions to simulate the heat transfer process of the measurement physical model, displaying a heat transfer animation of the sleeve and a dynamic response curve of the temperature sensor. The above analysis allows dynamic observation of the actual measurement and temperature transfer process of the established specific platinum resistance temperature sensor physical model, and analysis of key factors affecting temperature measurement. Furthermore, combined with the flow field inside the pipe and the installation of the protective sleeve, mechanical analysis of the protective sleeve can be performed, including structural integrity, fluid vibration, and vibration fatigue analysis, etc., which are not specifically limited in this embodiment of the invention.

[0065] Furthermore, as a refinement and extension of the specific implementation of the above embodiments, in order to facilitate the verification and analysis of fault-tolerant control strategies with the reactor control system through fault settings, another digital modeling method for temperature sensors is provided, the method further including: Based on the fault mechanism of temperature sensor, fault transfer functions are set up for several typical fault types; the typical fault types include constant deviation fault, constant gain fault, impact fault, drift fault, accuracy degradation fault, and output constant / jamming fault. Receive the target typical fault type determined by the user, and obtain the target fault transfer function corresponding to the target typical fault type; Based on the target fault transfer function and the mathematical model of the specific platinum resistance temperature sensor, a simulation of the dynamic temperature change process is performed, and the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor under typical target fault types are displayed; or, The heat transfer process is simulated based on the target fault transfer function and the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipeline. The heat transfer animation of the sleeve and the dynamic response curve of the temperature sensor under the typical fault type of the target are displayed.

[0066] In this embodiment of the invention, the current execution end, based on the analysis of the temperature sensor fault mechanism, establishes fault models such as constant deviation, constant gain, impact, drift value, and accuracy degradation for typical faults of platinum resistance temperature sensors. The input can be set as deviation value (constant deviation fault), gain value (constant gain), impact strength (impact fault), drift rate (drift fault), accuracy degradation (periodic interference fault, random noise fault) and jam flag (jamming / constant output fault).

[0067] The transfer function models for each fault type of the temperature sensor are as follows. x yes t The fault-free sensor value at any given time. x 'yes t The fault sensor value at time η is the normal white noise in the sensor data. f ( t ) indicates at time t Detected value: 1) Normal situation f ( t )= x +η 2) Constant deviation fault: x ′= K 1+ x + η in, x ′∈ f ( t ), K 1 is a constant value (deviation value) added to the normal measurement data.

[0068] 3) Constant gain fault: x ′= K 2 x + η , in, x ′∈ f ( t ), K 2 is the constant value (gain value) multiplied by the normal reading. 4) Impact failure: | f ( t )- x | / t > λ Where λ represents the normal trend of change, and when a fault is injected due to an impact fault, a larger or smaller instantaneous value is superimposed on the normal data.

[0069] 5) Drifting fault:

[0070] in, x ′∈ f ( t ), t 0 is the moment when drift failure begins. K 3 represents the drift rate.

[0071] 6) Accuracy degradation fault: x ′= x + η ′ in, x ′∈ f ( t ), η ′ is random noise or periodic noise whose amplitude exceeds the normal accuracy fluctuation range.

[0072] 7) Constant output / stuck fault: x ′= K 4, of which x ′∈ f ( t ), K 4 is the constant value sensed.

[0073] In this embodiment of the invention, the current execution terminal receives a target typical fault type determined by the user and obtains the target fault transfer function corresponding to the target typical fault type. For each type of fault, a corresponding mathematical function is designed using Modelica language. The probability of fault occurrence is controlled by a time-varying random function and integrated with the mathematical model. Based on the target fault transfer function and the physical model of the measurement of the specific platinum resistance temperature sensor in the nuclear reactor pipeline temperature field, the heat transfer process is simulated, and the sleeve heat transfer animation and temperature sensor dynamic response curve under the target typical fault type are displayed. The temperature sensor mathematical model is integrated with the fault model and jointly debugged with the reactor primary loop instrumentation and control system. This not only reflects the steady-state and dynamic characteristics of the temperature sensor but also allows for fault-tolerant control strategy verification and analysis with the reactor control system through fault settings. It should be noted that the fault model can be connected to both the mathematical model and the physical model. All three types of models are encapsulated into modules (FMU modules), which can be dragged and dropped to connect and simulate in the software platform.

[0074] This invention provides a digital modeling method for temperature sensors. Compared with existing technologies, this invention establishes a mathematical model of a specific platinum resistance temperature sensor based on its standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics, and relevant parameters, reflecting the steady-state and dynamic characteristics of that sensor. Combining this dynamic mathematical model with changes in the parameters of the platinum resistance temperature sensor's heat transfer response model, a physical model of the sensor's measurement in the face of the physical environment is obtained. As the types of external media, viscosity, thermal conductivity, and the insertion of the resistance thermometer change, the physical model simulates the heat transfer process, displaying a heat transfer animation of the casing and a dynamic response curve of the temperature sensor. This provides a more realistic signal input source for reactor and primary loop instrumentation and control system simulation analysis, offering digital simulation analysis tools for reactor process instrumentation research and development, design, and process measurement system layout.

[0075] As a response to the above Figure 1 The implementation of the method shown in this invention provides a digital modeling device for temperature sensors, such as... Figure 7 As shown, the device includes: Mathematical modeling module 21 is used to establish a mathematical model of a specific platinum resistance temperature sensor based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuits, and relevant parameters of the specific platinum resistance temperature sensor, which reflects the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor. Temperature field setting module 22 is used to set external physical conditions corresponding to the specific platinum resistance temperature sensor based on the temperature field of the nuclear reactor pipeline. The external physical conditions include medium viscosity, medium thermal conductivity and insertion depth. The physical modeling module 23 is used to combine the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor to obtain the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipe. The dynamic simulation module 24 is used to change any one of the external physical conditions to simulate the heat transfer process of the measurement physical model, and display the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor.

[0076] Furthermore, the mathematical modeling module 21 includes a temperature characteristic modeling unit, a structural heat transfer modeling unit, and an integration unit; The temperature characteristic modeling unit is used for: The platinum wire diameter, platinum wire length, and material purity are obtained from the relevant parameters of a specific platinum resistance temperature sensor, and the resistance ratio of the specific platinum resistance temperature sensor is calculated based on the platinum wire diameter, the platinum wire length, and the material purity. A temperature characteristic sub-model of the specific platinum resistance temperature sensor is obtained based on the resistance ratio of the specific platinum resistance temperature sensor and the standard temperature characteristics. The structural heat transfer modeling unit is used for: The structure of the specific platinum resistance temperature sensor is simplified to determine the overall density and overall specific heat of the specific platinum resistance temperature sensor; Based on the overall density, the overall specific heat, and the standard structural thermal conductivity, a structural heat transfer response sub-model for the specific platinum resistance temperature sensor is determined. The integration unit is used for: By combining the temperature characteristic sub-model and structural heat transfer response sub-model of the specific platinum resistance temperature sensor with the standard electronic circuit characteristic sub-model, a digital model of the specific platinum resistance temperature sensor corresponding to the specific platinum resistance temperature sensor is obtained.

[0077] Furthermore, the structural heat transfer modeling unit is also used for: Obtain the simplified surface area A and surface heat transfer coefficient of a specific platinum resistance temperature sensor. ; Combining the surface area A and the surface heat exchange coefficient The combined density and the combined specific heat determine the simplified time constant of the specific platinum resistance temperature sensor. N T The formula is as follows:

[0078] in, For overall density, V For the total volume, C p For overall specific heat; Based on the time constant N T Determine the structural heat transfer response sub-model of the specific platinum resistance temperature sensor. G T (s), the formula is as follows:

[0079] in, s It is a complex frequency variable.

[0080] Furthermore, the physical modeling module 23 is also used for: Based on the mathematical model of the specific platinum resistance temperature sensor, and considering the dynamic temperature measurement performance of the specific platinum resistance temperature sensor when the thickness and material of the insulation layer and protective sleeve layer change, a cylindrical wall heat transfer model is established. Based on the mathematical model of the specific platinum resistance temperature sensor, considering the air gap between the protective sleeve layer and the temperature sensor body, the mixed heat transfer parameters are determined. Based on the hybrid heat transfer parameters, the cylindrical wall heat transfer model, and the external physical conditions, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipeline is obtained.

[0081] Furthermore, the physical modeling module 23 is also used for: Radial heat conduction differential equation based on the inner and outer radii of the cylindrical wall; The radial thermal conductivity differential equation is subjected to Laplace transform to obtain the output function of thermal conductivity in the complex frequency domain; The heat transfer model of the cylindrical wall is established based on the output function of the thermal conductivity in the complex frequency domain.

[0082] Furthermore, the physical modeling module 23 is also used for: The air gap is modeled in a microscopic local magnification, and the heat transfer response under different air gap conditions is simulated using simulation software based on the specific platinum resistance temperature sensor mathematical model, so as to obtain the temperature-time response curves under different air gap conditions. Based on the temperature-time response curves under different air gap conditions, the heat transfer coefficients of gas and solid are fitted by the heat balance equation to obtain the fitted gas heat transfer coefficient and solid heat transfer coefficient. The volume ratio of gas and solid in the model is determined, and the mixed heat transfer parameters are determined based on the volume ratio of gas and solid, the heat transfer coefficient of gas, and the heat transfer coefficient of solid.

[0083] Furthermore, the device also includes a fault modeling module, which is used for: Based on the fault mechanism of temperature sensor, fault transfer functions are set up for several typical fault types; the typical fault types include constant deviation fault, constant gain fault, impact fault, drift fault, accuracy degradation fault, and output constant / jamming fault. Receive the target typical fault type determined by the user, and obtain the target fault transfer function corresponding to the target typical fault type; Based on the target fault transfer function and the mathematical model of the specific platinum resistance temperature sensor, a simulation of the dynamic temperature change process is performed, and the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor under typical target fault types are displayed; or, The heat transfer process is simulated based on the target fault transfer function and the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipeline, and the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor under the typical fault type of the target are displayed.

[0084] This invention provides a digital modeling device for temperature sensors. Compared with existing technologies, this invention establishes a mathematical model of a specific platinum resistance temperature sensor based on its standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics, and relevant parameters of the specific platinum resistance temperature sensor. Combining this dynamic mathematical model with changes in the parameters of the platinum resistance measurement heat transfer response model, a physical model of the platinum resistance temperature sensor measuring the physical environment is obtained. As the types of external media, media viscosity, media thermal conductivity, and the insertion of the thermal resistor change, the physical model simulates the heat transfer process, displaying a heat transfer animation of the casing and a dynamic response curve of the temperature sensor. This provides a more realistic signal input source for the simulation analysis of reactor and primary loop instrumentation and control systems, and offers digital simulation analysis tools for reactor process instrumentation research and development, design, and process measurement system layout.

[0085] According to one embodiment of the present invention, a storage medium is provided, the storage medium storing at least one executable instruction, the computer-executable instruction being able to execute the temperature sensor digital modeling method in any of the above method embodiments.

[0086] Figure 8 The diagram illustrates the structure of an electronic device according to an embodiment of the present invention. The specific embodiments of the present invention do not limit the specific implementation of the electronic device.

[0087] like Figure 8 As shown, the electronic device may include: a processor 302, a communications interface 304, a memory 306, and a communications bus 308.

[0088] The processor 302, communication interface 304, and memory 306 communicate with each other via communication bus 308.

[0089] Communication interface 304 is used to communicate with other network elements such as clients or other servers.

[0090] The processor 302 is used to execute program 310, which can specifically perform the relevant steps of the above-mentioned digital modeling method for temperature sensors.

[0091] Specifically, program 310 may include program code that includes computer operation instructions.

[0092] Processor 302 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement embodiments of the present invention. The electronic device includes one or more processors, which may be processors of the same type, such as one or more CPUs; or they may be processors of different types, such as one or more CPUs and one or more ASICs.

[0093] Memory 306 is used to store program 310. Memory 306 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0094] Specifically, program 310 can be used to cause processor 302 to perform the following operations: Based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics, and relevant parameters of a specific platinum resistance temperature sensor, a mathematical model of a specific platinum resistance temperature sensor is established to reflect its steady-state and dynamic characteristics. Based on the temperature field of the nuclear reactor pipeline, the external physical conditions corresponding to the specific platinum resistance temperature sensor are set. The external physical conditions include the viscosity of the medium, the thermal conductivity of the medium, and the insertion depth. By combining the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipe is obtained. The heat transfer process of the measurement physical model is simulated by changing any one of the external physical conditions, and the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor are displayed.

[0095] It is obvious to those skilled in the art that the modules or steps of the present invention described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented herein, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, the present invention is not limited to any particular combination of hardware and software.

[0096] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for digital modeling a temperature sensor, characterized in that, include: Based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics, and relevant parameters of a specific platinum resistance temperature sensor, a mathematical model of a specific platinum resistance temperature sensor is established to reflect its steady-state and dynamic characteristics. Based on the temperature field of the nuclear reactor pipeline, the external physical conditions corresponding to the specific platinum resistance temperature sensor are set. The external physical conditions include the viscosity of the medium, the thermal conductivity of the medium, and the insertion depth. By combining the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipe is obtained. The heat transfer process of the measurement physical model is simulated by changing any one of the external physical conditions, and the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor are displayed.

2. The method according to claim 1, characterized in that, The mathematical model of a specific platinum resistance temperature sensor, based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics, and relevant parameters of the specific platinum resistance temperature sensor, is established to reflect the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor. This includes: The platinum wire diameter, platinum wire length, and material purity are obtained from the relevant parameters of a specific platinum resistance temperature sensor, and the resistance ratio of the specific platinum resistance temperature sensor is calculated based on the platinum wire diameter, the platinum wire length, and the material purity. A temperature characteristic sub-model of the specific platinum resistance temperature sensor is obtained based on the resistance ratio of the specific platinum resistance temperature sensor and the standard temperature characteristics. The structure of the specific platinum resistance temperature sensor is simplified to determine the overall density and overall specific heat of the specific platinum resistance temperature sensor; Based on the overall density, the overall specific heat, and the standard structural thermal conductivity, a structural heat transfer response sub-model for the specific platinum resistance temperature sensor is determined. By combining the temperature characteristic sub-model, structural heat transfer response sub-model, and standard electronic circuit characteristic sub-model of the specific platinum resistance temperature sensor, a mathematical model of the specific platinum resistance temperature sensor corresponding to its steady-state and dynamic characteristics is obtained.

3. The method according to claim 2, characterized in that, The determination of the structural heat transfer response sub-model of the specific platinum resistance temperature sensor based on the overall density, the overall specific heat, and the standard structural thermal conductivity includes: Obtain the simplified surface area A and surface heat transfer coefficient of a specific platinum resistance temperature sensor. ; Combining the surface area A and the surface heat exchange coefficient The combined density and the combined specific heat determine the simplified time constant of the specific platinum resistance temperature sensor. N T The formula is as follows: in, For overall density, V For the total volume, C p For overall specific heat; Based on the time constant N T Determine the structural heat transfer response sub-model of the specific platinum resistance temperature sensor. G T (s), the formula is as follows: in, s It is a complex frequency variable.

4. The method according to claim 1, characterized in that, The process of combining the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor to obtain the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipe includes: Based on the mathematical model of the specific platinum resistance temperature sensor, and considering the dynamic temperature measurement performance of the specific platinum resistance temperature sensor when the thickness and material of the insulation layer and protective sleeve layer change, a cylindrical wall heat transfer model is established. Based on the mathematical model of the specific platinum resistance temperature sensor, considering the air gap between the protective sleeve layer and the temperature sensor body, the mixed heat transfer parameters are determined. Based on the hybrid heat transfer parameters, the cylindrical wall heat transfer model, and the external physical conditions, a measurement physical model of the specific platinum resistance temperature sensor in the temperature field of a nuclear reactor pipeline is obtained.

5. The method according to claim 4, characterized in that, The establishment of the cylindrical wall heat transfer model based on the specific platinum resistance temperature sensor, considering the dynamic temperature measurement performance of the specific platinum resistance temperature sensor under changes in the thickness and material of the insulating layer and protective sleeve, includes: Radial heat conduction differential equation based on the inner and outer radii of the cylindrical wall; The radial thermal conductivity differential equation is subjected to Laplace transform to obtain the output function of thermal conductivity in the complex frequency domain; The heat transfer model of the cylindrical wall is established based on the output function of the thermal conductivity in the complex frequency domain.

6. The method according to claim 4, characterized in that, The mathematical model based on the specific platinum resistance temperature sensor, considering the air gap between the protective sheath and the temperature sensor body, determines the mixed heat transfer parameters, including: The air gap is modeled in a microscopic local magnification, and the heat transfer response under different air gap conditions is simulated using simulation software based on the specific platinum resistance temperature sensor mathematical model, so as to obtain the temperature-time response curves under different air gap conditions. Based on the temperature-time response curves under different air gap conditions, the heat transfer coefficients of gas and solid are fitted by the heat balance equation to obtain the fitted gas heat transfer coefficient and solid heat transfer coefficient. The volume ratio of gas and solid in the model is determined, and the mixed heat transfer parameters are determined based on the volume ratio of gas and solid, the heat transfer coefficient of gas, and the heat transfer coefficient of solid.

7. The method according to any one of claims 1 to 6, characterized in that, The method further includes: Based on the fault mechanism of temperature sensor, fault transfer functions are set up for several typical fault types; the typical fault types include constant deviation fault, constant gain fault, impact fault, drift fault, accuracy degradation fault, and output constant / jamming fault. Receive the target typical fault type determined by the user, and obtain the target fault transfer function corresponding to the target typical fault type; Based on the target fault transfer function and the mathematical model of the specific platinum resistance temperature sensor, a simulation of the dynamic temperature change process is performed, and the steady-state and dynamic characteristics of the specific platinum resistance temperature sensor under typical target fault types are displayed; or, The heat transfer process is simulated based on the target fault transfer function and the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipeline. The heat transfer animation of the sleeve and the dynamic response curve of the temperature sensor under the typical fault type of the target are displayed.

8. A digital modeling device for a temperature sensor, characterized in that, include: The mathematical modeling module is used to establish a mathematical model of a specific platinum resistance temperature sensor based on the standard temperature characteristics, standard structural thermal conductivity, standard electronic circuit characteristics of platinum resistance temperature sensors and relevant parameters of specific platinum resistance temperature sensors, which reflects the steady-state and dynamic characteristics of a specific platinum resistance temperature sensor. The temperature field setting module is used to set the external physical conditions corresponding to the specific platinum resistance temperature sensor based on the temperature field of the nuclear reactor pipeline. The external physical conditions include the viscosity of the medium, the thermal conductivity of the medium, and the insertion depth. The physical modeling module is used to combine the external physical conditions with the mathematical model of the specific platinum resistance temperature sensor to obtain the measurement physical model of the specific platinum resistance temperature sensor in the temperature field of the nuclear reactor pipe. The dynamic simulation module is used to simulate the heat transfer process of the measurement physical model by changing any one of the external physical conditions, and to display the heat transfer characteristics of the casing and the dynamic response characteristics of the temperature sensor.

9. A storage medium, characterized in that, The storage medium stores at least one executable instruction, which performs the operation corresponding to the temperature sensor digital modeling method as described in any one of claims 1-7.

10. An electronic device, characterized in that, It includes a processor, a memory, a communication interface, and a communication bus, wherein the processor, the memory, and the communication interface communicate with each other through the communication bus; The memory is used to store at least one executable instruction, which causes the processor to perform the operation corresponding to the temperature sensor digital modeling method as described in any one of claims 1-7.

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