Display module and electronic equipment
By coordinating multiple circuit boards and driver circuit boards, the power supply voltage is acquired and compensated, solving the problem of insufficient brightness and unevenness caused by power supply voltage transmission voltage drop, and achieving high brightness and uniform brightness of large-size display panels.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2026-03-27
AI Technical Summary
Because the power chip of the display device is far from the screen, the voltage drop during power supply transmission increases, affecting the brightness of the OLED and causing problems such as insufficient brightness and uneven brightness of the screen.
The power supply voltage is provided to the display panel through multiple circuit boards, and the voltage, equivalent impedance and current of the power chip are obtained through the drive circuit board. The target compensation voltage is calculated and the source drive voltage provided to the display panel is compensated to offset the transmission voltage drop of the power supply voltage and ensure that the display panel receives a similar power supply voltage at all positions.
It achieves high brightness and brightness uniformity in the display panel, especially in large-size display panels, ensuring consistent display effect and uniform brightness.
Smart Images

Figure CN121747460A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, specifically to a display module and electronic device. Background Technology
[0002] Organic light-emitting diodes (OLEDs) possess characteristics such as high brightness, low power consumption, fast response, good flexibility, and high luminous efficiency. Display devices integrate OLEDs onto the display screen and drive the OLEDs to emit light, enabling high-brightness, high-resolution, and high-smoothness image display, meeting consumers' new demands for display technology.
[0003] Typically, display devices supply power voltage to the display screen via a power chip, enabling the display screen to drive the OLED to emit light based on the received power voltage. The magnitude of the power voltage received by the display screen affects the brightness of the OLED. However, because the power chip of the display device is usually far from the display screen, meaning the power supply branch between the power chip and the display screen is relatively long, as the size of the display screen increases, the transmission voltage drop of the power supply voltage provided by the power chip will continue to increase, thus affecting the brightness of the OLED and resulting in insufficient display brightness. Summary of the Invention
[0004] This application provides a display module and electronic device that can compensate for the power supply voltage provided by multiple circuit boards when supplying power voltage to the display panel through multiple circuit boards, so as to ensure the brightness uniformity of the display panel and enable the display panel to achieve high brightness display.
[0005] Firstly, this application provides a display module, which includes a display panel and at least two circuit boards connected to the display panel. A power chip is mounted on a motherboard. Each of the at least two circuit boards has an input terminal for receiving a power supply voltage from the power chip on the motherboard, and an output terminal for supplying a power supply voltage to the display panel. Each of the at least two circuit boards includes a driver circuit board, which obtains a target compensation voltage based on the voltage magnitude at each circuit board's input terminal, the equivalent impedance of the power chip transmitting the power supply voltage to each circuit board's input terminal, and the current flowing through each circuit board's input terminal. The driver circuit board also compensates for the source drive voltage supplied to the display panel based on the target compensation voltage, thereby compensating for the voltage drop of the power supply voltage supplied to the display panel by the circuit boards. In this application, the display module inputs power voltage to the display panel through multiple circuit boards, and the multiple input power voltages work together to power the display panel, ensuring that different positions on the display panel receive similar power voltages. This avoids the problem of insufficient brightness caused by voltage drop during power supply transmission when only one side of the display panel receives power. Furthermore, the display module can obtain a target compensation voltage by acquiring the voltage magnitude at each circuit board input terminal, the equivalent impedance of the power chip transmitting power voltage to each circuit board input terminal, and the current flowing through each circuit board input terminal. Further, the display module compensates the source drive voltage supplied to the display panel based on this target compensation voltage, thereby compensating for the power voltages received by the display panel from multiple circuit boards. This counteracts the transmission voltage drop of the power voltages provided by each circuit board, further improving the problems of insufficient brightness and poor uniformity of the display panel, especially when the display panel size is large, ensuring high brightness uniformity.
[0006] In one possible implementation, the aforementioned driving circuit board includes a voltage acquisition module. This module is used to: acquire the voltage magnitude of the power supply terminal of the power chip, which outputs a power supply voltage to the input terminals of each circuit board; and obtain the voltage magnitude of each circuit board's input terminal based on the voltage magnitude of the power supply terminal, the equivalent impedance of the power chip transmitting the power supply voltage to each circuit board's input terminal, and the current flowing through each circuit board's input terminal. In this application, the display module acquires and calculates the voltage magnitude of the power supply terminal of the power chip, the equivalent impedance of the power chip transmitting the power supply voltage to each circuit board's input terminal, and the current flowing through each circuit board's input terminal using the voltage acquisition module, thereby obtaining the voltage magnitude of each circuit board's input terminal. This method is highly reliable and easy to implement.
[0007] In one possible implementation, the aforementioned driving circuit board includes a voltage acquisition module. This module is used to: acquire the equivalent impedance of the power chip transmitting power voltage to the input terminals of each circuit board and the magnitude of the current flowing through the input terminals of each circuit board; and obtain the voltage compensation coefficient for each circuit board based on the equivalent impedance of the power chip transmitting power voltage to the input terminals of each circuit board and the magnitude of the current flowing through the input terminals of each circuit board; and obtain the target compensation voltage based on the voltage magnitude at the input terminals of each circuit board and the voltage compensation coefficients of each circuit board. In this application, the display module acquires and calculates the equivalent impedance of the power chip transmitting power voltage to the input terminals of each circuit board and the magnitude of the current flowing through the input terminals of each circuit board through the voltage acquisition module, thereby obtaining the voltage compensation coefficient for each circuit board, and calculating the target compensation voltage based on the voltage magnitude at the input terminals of each circuit board and the corresponding voltage compensation coefficient. This method is highly accurate and easy to implement.
[0008] In one possible implementation, the aforementioned driving circuit board includes a voltage compensation module. The voltage compensation module is used to: obtain a first gamma voltage based on a target compensation voltage and a first voltage, wherein the first gamma voltage is the gamma voltage at which the display brightness of the driving display panel is greater than or equal to a first threshold; obtain a second gamma voltage based on the target compensation voltage and a second voltage, wherein the second gamma voltage is the gamma voltage at which the display brightness of the driving display panel is less than or equal to a second threshold; and perform gamma curve adjustment based on the first gamma voltage and the second gamma voltage to obtain a compensated source driving voltage. In this application, the display module calculates the first gamma voltage and the second gamma voltage based on the target compensation voltage through the voltage compensation module, and compensates the source driving voltage according to the first gamma voltage and the second gamma voltage, which is highly reliable and easy to implement.
[0009] In one possible implementation, the voltage acquisition module includes multiple voltage processing units and a first adder. One end of each voltage processing unit receives the voltage from an input terminal of a circuit board, and the other end is grounded. Each voltage processing unit includes a first resistor and a second resistor connected in series at a first connection point. The first adder connects to the first connection points of each voltage processing unit. The voltage processing units are used to divide the received voltage from the circuit board input terminal based on the first and second resistors, and transmit the initial compensation voltage obtained by the voltage division to the first adder through the first connection point. The first adder is used to obtain a target compensation voltage based on the initial compensation voltages output by each voltage processing unit. In this application, the voltage acquisition module adjusts the voltages at each circuit board input terminal through each voltage processing unit, and then the first adder sums them to obtain the target compensation voltage, which is easy to operate and has high accuracy.
[0010] In one possible implementation, the voltage acquisition module further includes a voltage follower. The input of the voltage follower is connected to the first adder, and the output of the voltage follower is connected to the voltage compensation module. The output of the voltage follower is also connected to its input. The voltage follower is used to stabilize the target compensation voltage output by the first adder. In this application, the voltage acquisition module stabilizes the output target compensation voltage by setting a voltage follower, which can improve the stability of the output target compensation voltage and is easy to implement.
[0011] In one possible implementation, the voltage compensation module includes a second adder, a third resistor, a fourth resistor, and a fifth resistor connected in series. One end of the third resistor receives the supply voltage, and the other end of the third resistor is connected to one end of the fifth resistor through the fourth resistor. The other end of the fifth resistor is grounded. The second adder is connected to the other end of the third resistor and is used to obtain a target compensation voltage. The third, fourth, and fifth resistors are used to divide the supply voltage, and the first voltage obtained by the voltage division is transmitted to the second adder through the other end of the third resistor. The second adder is used to obtain a first gamma voltage based on the received target compensation voltage and the first voltage. In this application, the voltage compensation module divides the supply voltage to obtain a first voltage through the series-connected third, fourth, and fifth resistors, and the second adder calculates the first gamma voltage based on the target compensation voltage and the first voltage, which is highly reliable and easy to implement.
[0012] In one possible implementation, the voltage compensation module further includes a subtractor, a third resistor, a fourth resistor, and a fifth resistor connected in series. One end of the third resistor receives the supply voltage, and the other end of the third resistor is connected to one end of the fifth resistor through the fourth resistor. The other end of the fifth resistor is grounded. The subtractor is also connected to one end of the fifth resistor and is used to obtain the target compensation voltage. The third, fourth, and fifth resistors are used to divide the supply voltage, and the second voltage obtained by the voltage division is transmitted to the subtractor through one end of the fifth resistor. The subtractor is used to obtain a second gamma voltage based on the received target compensation voltage and the second voltage. In this application, the voltage compensation module obtains a second voltage by dividing the supply voltage through the series-connected third, fourth, and fifth resistors, and the subtractor calculates the second gamma voltage based on the target compensation voltage and the second voltage, which is highly reliable and easy to implement.
[0013] Secondly, this application also provides an electronic device, which includes a power chip, a mid-frame, and a display module as described in the first aspect, wherein the display module is fixed to the mid-frame; and the power chip is connected to multiple circuit boards of the display panel.
[0014] In one possible implementation, the display module includes two circuit boards, one of which is a driver circuit board and the other is a power supply circuit board. The electronic device also includes a first flexible circuit board and a second flexible circuit board. The input terminal of the driver circuit board is connected to the first power supply terminal of the power chip through the first flexible circuit board, and the input terminal of the power supply circuit board is connected to the second power supply terminal of the power chip through the second flexible circuit board. The middle frame includes a middle plate and a frame, with the frame surrounding the middle plate. The display module, the power chip, and the first and second flexible circuit boards are respectively located on one side of the middle plate. The first flexible circuit board is used to acquire the power supply voltage provided by the power chip and provide it to the driver circuit board. The second flexible circuit board is used to acquire the power supply voltage provided by the power chip and provide it to the power supply circuit board.
[0015] In one possible implementation, the electronic device further includes a motherboard, on which a power chip is mounted; a display module is located on one side of a middle plate, and the motherboard, a first flexible circuit board, and a second flexible circuit board are located on the other side of the middle plate opposite to the display panel; a through hole is provided on the middle plate, through which a portion of the first flexible circuit board passes and connects to the drive circuit board of the display module, and through which a portion of the second flexible circuit board passes and connects to the power supply circuit board of the display module.
[0016] In one possible implementation, the electronic device also includes a hinge, and there are at least two mid-frames, which are respectively disposed on both sides of the hinge. The two mid-frames are rotated and engaged by the hinge, and the display module is disposed on at least two mid-frames and the hinge; the motherboard is disposed within one mid-frame.
[0017] The beneficial effects of the solution provided in the second aspect above can be referred to the description in the first aspect above, and will not be repeated here. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of an electronic device in a folded state, provided in an embodiment of this application.
[0019] Figure 2 This is a schematic diagram of an electronic device in an intermediate state, provided in an embodiment of this application.
[0020] Figure 3 This is a schematic diagram of an electronic device in a flattened state, provided in an embodiment of this application.
[0021] Figure 4 This is a schematic diagram of a disassembled structure of an electronic device provided in an embodiment of this application;
[0022] Figure 5 This is a schematic diagram of a split structure of a display module provided in an embodiment of this application;
[0023] Figure 6A front view of a display panel provided in an embodiment of this application;
[0024] Figure 7 A schematic diagram of the structure of a display panel provided in an embodiment of this application;
[0025] Figure 8 This is a schematic diagram of the structure of a pixel unit provided in an embodiment of this application;
[0026] Figure 9a A schematic diagram of the frame of an electronic device provided in an embodiment of this application;
[0027] Figure 9b Another schematic diagram of the electronic device provided in the embodiments of this application;
[0028] Figure 10 Another schematic diagram of the electronic device provided in the embodiments of this application;
[0029] Figure 11 A planar top view of the display module provided in an embodiment of this application;
[0030] Figure 12 This is another planar top view of the display module provided in the embodiments of this application;
[0031] Figure 13 A schematic diagram of the frame of a display module provided in an embodiment of this application;
[0032] Figure 14 A schematic diagram of a frame of a driver circuit board provided in an embodiment of this application. Detailed Implementation
[0033] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.
[0034] The electronic devices provided in this application embodiment may include, but are not limited to, televisions, monitors, mobile phones, tablets, laptops, desktop computers, all-in-one computers, Ultra-Mobile Personal Computers (UMPCs), handheld computers, touch-screen TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices (such as watches, bracelets, smartwatches, smart bracelets, etc.), virtual reality devices (VR) and mixed reality (MR) devices (such as VR glasses, AR glasses, AR helmets, VR helmets, MR helmets, etc.), in-vehicle devices, and other electronic devices with display modules.
[0035] The display module is used to display images, text, and video, and to provide an interactive interface for users. Specifically, it can be an OLED display module, that is, a display module that uses OLED as the organic light-emitting device. In other application scenarios, the display module can also be a micro organic light-emitting diode (MLOE) display module, an active-matrix organic light-emitting diode (AMOLED) display, a light-emitting diode (LED) display, a mini organic light-emitting diode (Mini LED) display, a micro organic light-emitting diode (Micro LED) display, a quantum dot light-emitting diode (QLED) display, or a liquid crystal display (LCD), etc. This application embodiment does not limit these possibilities. For ease of explanation, the following description uses an OLED display module as an example.
[0036] In some feasible embodiments, the electronic device can be a non-foldable electronic device. Taking a mobile phone as an example, the electronic device can be a candybar phone, such as a candybar horizontal screen phone or a candybar vertical screen phone. The mobile phone may include a mid-frame with a flat outline, and the display module is disposed on the mid-frame. The mid-frame can support and assemble the display module. In this case, the display module can also have a flat structure, and neither the display module nor the mid-frame can be folded.
[0037] Alternatively, the electronic device can also be a foldable electronic device. Taking a mobile phone as an example, the mobile phone can be a foldable phone, such as a landscape foldable phone or a portrait foldable phone. For example, the mobile phone can include at least two mid-frames, which can rotate relative to each other to achieve folding or unfolding. The display module is disposed on the above-mentioned at least two mid-frames. The display module can be a flexible screen. The flexible screen is flexible and can be freely bent, rolled, and folded, so that the display module can fold or unfold along with the folding or unfolding of the mid-frames.
[0038] It is understandable that the electronic device is a foldable electronic device, such as a foldable phone. This foldable phone can have its display module folded outwards. Alternatively, it can have its display module folded inwards. Or, it can have a foldable phone where part of the display module folds inwards and part of the display module folds outwards, etc.
[0039] For ease of understanding, the following content uses a foldable phone with an inward-folding display module as an example, combined with... Figures 1 to 3 Please provide an explanation. Figure 1 This is a schematic diagram of an electronic device in a folded state, provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shown is a structural schematic of the electronic device in an intermediate state. Figure 3 for Figure 1 The diagram shows the structure of the electronic device in a flattened state.
[0040] like Figure 1 , Figure 2 and Figure 3 As shown, the electronic device 100 may include a hinge 101, a middle frame 102, and a display module 103. The number of middle frames 102 may be at least two. For example, taking the number of middle frames 102 as two, the middle frames 102 may include a first middle frame 102a and a second middle frame 102b. The first middle frame 102a and the second middle frame 102b are respectively connected to the hinge 101 and located on both sides of the hinge 101.
[0041] The display module 103 can be disposed on the hinge 101 and the middle frame 102. For example, the display module 103 can be located on the same side of the first middle frame 102a, the second middle frame 102b, and the hinge 101. The portion of the display module 103 opposite to the first middle frame 102a (opposite in the thickness direction) can be laid flat on the first middle frame 102a, and the portion of the display module 103 opposite to the second middle frame 102b can be laid flat on the second middle frame 102b. The portion of the display module 103 opposite to the hinge 101 can be the bending area of the display module 103 (see reference). Figure 3 The bending region 103a shown can extend in the same direction as the axis of rotation.
[0042] The pivot 101 can be a structural component used to connect two middle frames 102 and allow relative rotation between the two middle frames 102. The first middle frame 102a and the second middle frame 102b are rotatably engaged through the pivot 101, allowing the first middle frame 102a and the second middle frame 102b to rotate relative to each other, thereby realizing the folding or unfolding of the first middle frame 102a and the second middle frame 102b. The display module 103 can be folded or unfolded with the movement of the first middle frame 102a and the second middle frame 102b, thereby allowing the electronic device 100 to switch between a folded state and a flattened state.
[0043] like Figure 1 As shown, the first middle frame 102a and the second middle frame 102b can be folded relative to each other to a closed state. At this time, the first middle frame 102a and the second middle frame 102b are in a closed state, and the two are completely closed and parallel to each other (a slight deviation is allowed). At the same time, the part of the display module 103 opposite to the pivot 101 (i.e., the bending area of the display module) is bent and in a folded state, and the electronic device 100 as a whole is in a closed state, also known as a folded state.
[0044] like Figure 2 As shown, the first middle frame 102a and the second middle frame 102b can be rotated relative to each other to an intermediate state so that the electronic device 100 is in an intermediate state. At this time, the part of the display module 103 opposite to the pivot 101 is also folded or unfolded and is in an intermediate state.
[0045] like Figure 3 As shown, the first middle frame 102a and the second middle frame 102b can be unfolded relative to each other to an open state. At this time, the first middle frame 102a and the second middle frame 102b are in the open state, and the unfolding angle between the first middle frame 102a and the hinge 101, and between the hinge 101 and the second middle frame 102b, can be approximately 180°. The electronic device 100 is in an open state, also known as a flattened state. The portion of the display module 103 opposite to the hinge 101 is also opened and flattened, meaning the display module 103 can be flattened into a plane approximately 180° in diameter.
[0046] It should be noted that slight deviations are allowed in the angles illustrated in the embodiments of this application. For example, Figure 3 The unfolding angle of the electronic device 100 (or the flattening angle of the display module 103) shown can be 180°, or approximately 180°, such as 170°, 175°, 185° or 190°.
[0047] also, Figure 2 The intermediate state shown can be any state between the folded state and the flattened state. That is, the middle frame 102 and the display module 103 of the electronic device 100 can switch between the flattened state (i.e., the open state) and the folded state (i.e., the closed state) through the movement of the pivot 101, thereby realizing the opening and closing of the electronic device 100.
[0048] For example, when the electronic device 100 is in a flattened state, rotating the first middle frame 102a and the second middle frame 102b towards each other and folding them relative to each other can switch the electronic device 100 from a flattened state to a folded state (or an intermediate state). When the electronic device 100 is in a folded state, rotating the first middle frame 102a and the second middle frame 102b away from each other and unfolding them relative to each other can switch the electronic device 100 from a folded state to a flattened state (or an intermediate state).
[0049] In the embodiments of this application, such as Figure 3 As shown, the width direction of the middle frame 102 (such as the first middle frame 102a) is taken as the x-direction, the length direction of the middle frame 102 is taken as the y-direction, and the thickness direction of the middle frame 102 is taken as the z-direction. The width direction, length direction, and thickness direction can intersect each other. For example, the middle frame 102 can be a rectangular flat plate structure, and the width direction, length direction, and thickness direction can be perpendicular to each other.
[0050] It is understood that the length, width, and thickness in the embodiments of this application are for descriptive convenience only and do not imply any limitation on the size. For example, the length can be greater than, equal to, or less than the width. In other application scenarios, the middle frame 102 can also be a flat structure in the shape of a square, circle, ellipse, rounded rectangle, etc.
[0051] It should be noted that the electronic device 100 may include only two middle frames 102, that is, one first middle frame 102a and one second middle frame 102b. In this case, the first middle frame 102a and the second middle frame 102b are rotatably connected by a pivot 101, and when folded to the folded state, the electronic device 100 has a form of two layers of middle frames 102 stacked together (e.g., Figure 1 (As shown).
[0052] Alternatively, the electronic device 100 may include two or more middle frames 102, that is, there may be multiple of at least one of the first middle frames 102a and the second middle frames 102b, and there may also be multiple hinges 101. In this case, adjacent first middle frames 102a and second middle frames 102b can be connected by a hinge 101, so that the electronic device 100 can be folded into a multi-layered form.
[0053] For example, the electronic device 100 may include two first middle frames 102a, one second middle frame 102b, and two pivots 101. The two first middle frames 102a are located on both sides of the second middle frame 102b, and the two first middle frames 102a are rotatably connected to the second middle frame 102b through a pivot 101. One of the first middle frames 102a can be folded relative to the second middle frame 102b, and the other first middle frame 102a can also be folded relative to the second middle frame 102b, so that the electronic device 100 is in a folded state, with the first middle frames 102a and the second middle frame 102b folded relative to each other to form a three-layer stacked middle frame 102. When one of the first middle frames 102a and the second middle frame 102b are unfolded relative to each other to a flattened state, the electronic device 100 is in a flattened state.
[0054] It is understood that, for foldable electronic devices with outward-folding display modules, the display module 103 can be disposed on the outer surfaces of the first middle frame 102a, the second middle frame 102b, and the hinge 101. For foldable electronic devices with inward-folding display modules, the display module 103 can be disposed on the inner surfaces of the first middle frame 102a, the second middle frame 102b, and the hinge 101.
[0055] When the electronic device 100 is in a folded state, the two adjacent and opposite surfaces of the first middle frame 102a and the second middle frame 102b can be the inner surfaces of the first middle frame 102a and the second middle frame 102b, respectively. The surface of the pivot 101 that is on the same side as the inner surfaces of the first middle frame 102a and the second middle frame 102b is the inner surface of the pivot 101. The two opposite surfaces of the first middle frame 102a and the second middle frame 102b are the outer surfaces of the first middle frame 102a and the second middle frame 102b, respectively. The surface of the pivot 101 that is on the same side as the outer surfaces of the first middle frame 102a and the second middle frame 102b is the outer surface of the pivot 101.
[0056] Alternatively, in some examples, such as when there are two or more middle frames 102, a portion of the display module 103 may be located on the outer surface of a portion of the middle frame 102, and a portion of the display module 103 may be located on the inner surface of a portion of the middle frame 102. For example, in the example described above where the electronic device 100 includes two first middle frames 102a, one second middle frame 102b, and two hinges 101, the display module 103 is disposed on the two first middle frames 102a, one second middle frame 102b, and the hinge 101. For example, a portion of the display module 103 may be located on the inner surface of one of the first middle frames 102a, one of the hinges 101, and the second middle frame 102b, and a portion of the display module 103 may be located on the outer surface of the other first middle frame 102a.
[0057] For some feasible implementation methods, please refer to Figure 4 , Figure 4This is a schematic diagram of a disassembled structure of an electronic device provided in an embodiment of this application. For example... Figure 4 As shown, the electronic device 100 may also include a back cover 104. The display module 103 and the back cover 104 may be located on opposite sides of the middle frame 102 and the pivot 101 along the thickness direction (z direction). The back cover 104, the display module 103 and the middle frame 102 together form a receiving space, which can be used to assemble and receive various structural components of the electronic device 100.
[0058] The side of the display module 103 facing away from the back cover 104 can serve as the display surface of the electronic device 100. The back cover 104 can serve as the exterior cover of the back of the electronic device 100, protecting the various structural components within the storage space of the electronic device 100 and enhancing the aesthetics of the electronic device 100.
[0059] The middle frame 102 may include a middle plate and a side frame. For example, the first middle frame 102a may include a first middle plate 1021 and a first side frame 1022, with the first side frame 1022 surrounding the outer periphery of the first middle plate 1021. The second middle frame 102b may also include a second middle plate 1023 and a second side frame 1024, with the second side frame 1024 surrounding the outer periphery of the second middle plate 1023. The pivot 101 may be connected to the first middle plate 1021 and the second middle plate 1023 respectively. The middle plate provides an assembly area for various structural components and enhances the strength of the middle frame.
[0060] Display module 103 is disposed on mid-frame 102. For example, part of display module 103 may be fixed to the frame, and part of display module 103 may be fixed to the mid-frame.
[0061] It should be noted that the middle plate and the frame can be molded separately, and the middle plate and the frame can be fixed together by welding, snap-fitting, gluing, etc. Alternatively, the middle plate and the frame can also be molded as a single piece.
[0062] The electronic device 100 may also include a motherboard, a battery, a charging management module, and a power chip, etc., which can be fixed within the aforementioned accommodating space.
[0063] A motherboard can be used to implement electrical connections or electrical insulation between various electronic components within an electronic device. For example, a motherboard may include a processor, which may include an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, a display processing unit (DPU), and / or a neural network processing unit (NPU), etc. The controller can be the central nervous system and command center of the electronic device 100. The controller can generate operation control signals based on instruction opcodes and timing signals to control instruction fetching and execution. The processor may also include memory for storing instructions and data.
[0064] The processor may include one or more interfaces, which can be used to connect a charger to charge the electronic device 100, and the interfaces can also be used to enable data transmission between the electronic device 100 and external devices, such as connecting headphones, a projection device, etc.
[0065] The charging management module receives charging input from a charger, which can be either a wireless charger or a wired charger. In some wired charging examples, the charging management module receives charging input from the wired charger via an interface. In some wireless charging embodiments, the charging management module receives wireless charging input via the wireless charging coil of the electronic device 100. The charging management module can charge the battery and also supply power to the electronic device 100 via a power chip.
[0066] The power chip connects the battery, charging management module, and processor. It receives input from the battery and / or charging management module to power the processor, memory, display module, camera module, etc. The power chip can also monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance).
[0067] In some examples, the power chip can be located within the processor on the motherboard. In other examples, the power chip and the charging management module can be located in the same device.
[0068] The first middle frame 102a, a portion of the back cover 104, and a portion of the display module 103 can form a receiving cavity, and the second middle frame 102b, a portion of the back cover 104, and a portion of the display module 103 can form another receiving cavity, both of which can be used to accommodate the aforementioned electronic components such as the motherboard, battery, power chip, and charging management module. In some examples, the electronic device may include two motherboards, one of which may be located within the first middle frame 102a to achieve electrical connection or electrical insulation between the electronic components within the first middle frame 102a, and the other motherboard may be located within the second middle frame 102b to achieve electrical connection or electrical insulation between the electronic components within the second middle frame 102b.
[0069] Alternatively, in some examples, the electronic device may not include the aforementioned mid-frame, and the back cover 104 may form a receiving cavity with the display module 103 to accommodate the aforementioned electronic components such as the motherboard, battery, power chip, and charging management module.
[0070] The electronic device also includes a through-shaft circuit board, which is used to realize electrical connection between electronic devices located in the receiving cavities enclosed by two middle frames. For example, a through-shaft hole may be provided on the rotating shaft, and the through-shaft circuit board may be disposed in the through-shaft hole, so that one end of the through-shaft circuit board can be located in the receiving cavity enclosed by the first middle frame, and the other end of the through-shaft circuit board can pass through the through-shaft hole and be located in the receiving cavity enclosed by the second middle frame, thereby realizing electrical connection between electronic devices in the two middle frames.
[0071] It is understandable that the through-shaft circuit board is a flexible circuit board. When the first middle frame 102a and the second middle frame 102b rotate relative to each other to fold or unfold, the through-shaft circuit board can bend along with the rotation of the first middle frame 102a and the second middle frame 102b.
[0072] The structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or arrange the components differently. For example, the electronic device 100 may also include a communication module, a camera module (e.g., a front-facing camera and a rear-facing camera), a microphone, a speaker, a flash, and other devices.
[0073] For some feasible implementation methods, please refer to Figure 5 , Figure 5 This is a schematic diagram of a split structure of a display module provided in an embodiment of this application. Figure 5As shown, the display module 103 includes a display panel 10 and a cover plate 20. The display panel 10 is used to realize the display function of the display module 103. The length, width, and thickness directions of the display panel 10 can correspond to the length, width, and thickness directions of the middle frame 102, respectively, as shown below. Figure 5 The y-direction, x-direction, and z-direction in the equation.
[0074] The cover plate 20 can be a light-transmitting plate structure; for example, the cover plate 20 can be a transparent glass plate. The cover plate 20 is disposed on one side of the display panel 10. For example, in the thickness direction of the electronic device 100, the cover plate 20 can be disposed on the side of the display panel 10 facing away from the middle plate (or rear cover), and the cover plate 20 can cover the side of the display panel 10 facing away from the middle plate, thus protecting the display panel 10. For example, the size of the cover plate 20 can be greater than or equal to the size of the display panel 10.
[0075] The display module 103 may also include a polarizer 30, which can be disposed between the cover plate 20 and the display panel 10. The polarizer 30 can selectively filter out light from certain directions, allowing light from specific directions to pass through. The polarizer 30 can adjust the direction of light propagation, adjust display brightness and contrast, and also reduce reflection and glare, thereby improving visual clarity.
[0076] For example, the polarizer 30 and the cover plate 20 can be fixedly assembled by adhesive bonding. For instance, there can be an optical adhesive layer between the cover plate 20 and the polarizer 30. The optical adhesive layer can be an adhesive layer formed by optical clear adhesive (OCA) or the like. The cover plate 20 and the polarizer 30 are fixed together by the optical adhesive layer.
[0077] The polarizer 30 and the display panel 10 can also be fixed together by adhesive bonding. For example, an optical adhesive layer can be used between the polarizer 30 and the display panel 10 to bond them together. In other applications, the cover plate 20 and the polarizer 30, as well as the polarizer 30 and the display panel 10, can be bonded together by other methods. For instance, the cover plate 20, the polarizer 30, and the display panel 10 can be bonded together by heat pressing.
[0078] The display module 103 may further include a protective film 40 and a support film 50. The protective film 40 and the support film 50 can be sequentially stacked on the side of the display panel 10 facing away from the cover plate 20. That is, in the thickness direction, the cover plate 20, polarizer 30, display panel 10, protective film 40, and support film 50 can be sequentially stacked. The protective film 40 can cover the side of the display panel 10 facing away from the cover plate 20, and the protective film 40 plays a protective role for the display panel 10. The support film 50 can provide a certain degree of support and reinforcement for the display panel 10, thereby improving the strength of the entire display module 103.
[0079] For example, the protective film 40 and the display panel 10 can be fixedly assembled by adhesive bonding. For instance, a pressure-sensitive adhesive layer can be present between the protective film 40 and the display panel 10. This pressure-sensitive adhesive layer can be formed of a pressure-sensitive adhesive (PSA) or similar material, and the protective film 40 and the display panel 10 can be bonded together by the pressure-sensitive adhesive layer. Alternatively, the protective film 40 and the support film 50 can also be fixedly assembled by adhesive bonding. For example, a pressure-sensitive adhesive layer can also be present between the protective film 40 and the support film 50, allowing the protective film 40 and the support film 50 to be bonded together by the pressure-sensitive adhesive layer.
[0080] For some feasible implementation methods, please refer to Figure 6 , Figure 6 This is a front view of a display panel provided in an embodiment of this application.
[0081] like Figure 6 As shown, the display panel 10 may include a display area AA and a peripheral area BB. Images and other data can be displayed within the display area AA. The peripheral area BB may surround the outside of the display area AA. For example, if the outline shape of the display area AA is rectangular, the outline shape of the peripheral area BB may be a square ring, surrounding the outer perimeter of the display area AA. The peripheral area BB may be a non-display area, meaning it may not be used for displaying images or other data.
[0082] For example, the peripheral area BB may include a first peripheral area 10c, a second peripheral area 10a, a third peripheral area 10b, and a fourth peripheral area 10d. For instance, in a first direction, the first peripheral area 10c and the fourth peripheral area 10d may be located on either side of the display area AA, and in a second direction, the second peripheral area 10a and the third peripheral area 10b may be located on either side of the display area AA. The first and second directions intersect; for example, the first direction may be perpendicular to the second direction, or the first direction may be aligned with the width direction of the display panel (e.g.,...). Figure 6 The x-direction in the image), and the second direction can be consistent with the length direction of the display panel (e.g., the x-direction). Figure 6The first peripheral area 10a, the third peripheral area 10b, the first peripheral area 10c, and the fourth peripheral area 10d form a ring-shaped area surrounding the display area AA. In other application scenarios, the first direction can be consistent with the length direction of the display panel, and the second direction can be consistent with the width direction of the display panel. The specific direction can be adjusted according to the actual needs of the display module design.
[0083] It is understood that the display panel 10 may also have a bending region 10e, and the bending region 10e of the display panel 10 and the bending region 103a of the display module 103 in the electronic device may approximately coincide in the thickness direction of the display module. The extending direction of the bending region 10e is consistent with the axis of rotation of the electronic device.
[0084] For some feasible implementation methods, please refer to Figure 7 , Figure 7 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application.
[0085] like Figure 7 As shown, the display panel 10 may include a substrate 11 and a plurality of pixel groups, with the substrate 11 serving as a support structure for the display panel 10. The substrate 11 includes a first surface and a second surface facing away from each other, and the plurality of pixel groups may be disposed on the first surface. Specifically, the plurality of pixel groups may be disposed on the first surface along a second direction (…). Figure 7 The pixels are arranged sequentially in the y-direction shown. For example, the multiple pixel groups include a first pixel group 122, a second pixel group 123, ..., an nth pixel group 12n, and the n pixel groups are arranged sequentially in the second direction.
[0086] In some feasible embodiments, the first surface side of the substrate 11 can be as described above. Figure 6 The area is divided into a display area AA and a peripheral area BB. Multiple pixel groups can then be positioned within the display area AA on the first surface of the substrate 11.
[0087] Each pixel group may include multiple pixel units 121, which serve as light-emitting units of the display panel 10 and can generate primary color light. For example, the multiple pixel units 121 can generate red, green, and blue primary color light respectively, forming a three-primary-color light model (RGB color model), thereby achieving color display. The multiple pixel units 121 in each pixel group can move along a first direction ( Figure 7 The pixels (in the x direction shown) are arranged in a row, and the distribution positions of multiple pixel units 121 in any two pixel groups can correspond one-to-one in the second direction, so that multiple pixel units 121 can form an array arranged in both the second and first directions.
[0088] It should be noted that, in order to achieve light-emitting display, each pixel unit 121 includes a pixel circuit and a sub-pixel. The multiple sub-pixels of the aforementioned pixel units 121 may include multiple red light pixels, multiple green light pixels, and multiple blue light pixels, which can emit red light, green light, and blue light, respectively. The pixel circuit in each pixel unit 121 is electrically connected to the sub-pixel to drive the sub-pixel to emit light or turn off, thereby enabling the display panel 10 to display an image. The pixel circuit may include one or more thin-film transistors (TFTs), and by driving the TFTs to turn on and off, the driving control of the sub-pixel's emission and extinguishing is achieved. For example, the aforementioned sub-pixel can be an OLED.
[0089] In addition, a source driving circuit 14 is provided on the display panel 10, which can provide source driving voltage for the pixel circuit. The source driving circuit 14 can be located in the peripheral region BB on the first surface of the substrate 11.
[0090] To facilitate understanding of the driving control principle of sub-pixels by the pixel circuit in each pixel unit 121, the following content combines... Figure 8 Please provide an example. See also... Figure 8 , Figure 8 This is a schematic diagram of a pixel unit provided in an embodiment of this application.
[0091] Specifically, such as Figure 8 As shown, pixel unit 121 includes sub-pixel D1 and pixel circuit 1211. Pixel circuit 1211 includes a first switch T1, a second switch T2, and a first capacitor C1. The gate of the first switch T1 is connected to a data select line, which can be connected to a gate driving circuit. The source of the first switch T1 is connected to a data line, which can be connected to a source driving circuit. The gate driving circuit provides a gate driving voltage Sy to pixel circuit 1211, and the source driving circuit provides a source driving voltage Sx to pixel circuit 1211. The drain of the first switch T1 is electrically connected to the gate of the second switch T2 and one end of the first capacitor C1. The drain of the second switch T2 is connected to a power supply voltage ELVDD, and its source is electrically connected to the anode of sub-pixel D1. The cathode of sub-pixel D1 is connected to a common ground voltage. One end of the first capacitor C1 is electrically connected to the gate of the second switch T2, and the other end is connected to a common ground voltage.
[0092] It is understandable that the above Figure 8The pixel circuit 1211 shown is only one example. There are many other variations of the pixel circuit. This application does not limit the specific structure of the pixel circuit and the connection relationship of each device. The pixel circuit that can be applied to the OLED display module and drive the sub-pixels to emit light is the pixel circuit described in this application.
[0093] In some feasible implementations, the gate drive circuit and the source drive circuit can be located at Figure 7 On the first surface of the substrate 11 shown. Further, on the first surface side of the substrate 11 as described above. Figure 6 In the case where the area is divided into a display area AA and a peripheral area BB, the gate driving circuit and the source driving circuit can be located within the peripheral area BB. For example, the gate driving circuit can be located within the peripheral area BB outside the display area AA along the first direction, and the source driving circuit can be located within the peripheral area BB outside the display area AA along the second direction.
[0094] The number of gate driving circuits can be the same as the number of pixel groups, with one gate driving circuit corresponding to one pixel group. Each gate driving circuit provides a gate driving voltage Sy to multiple pixel units 121 within a given pixel group, enabling the driving control of the light emission and extinguishing of the pixel unit 121. This improves the uniformity of the brightness of the pixel unit 121 and enhances the display effect. Furthermore, the gate driving circuits can be integrated onto the substrate 11 using Gate Driven On Array (GOA) technology. The gate driving circuits can include multiple cascaded shift registers to achieve functions such as data storage, serial-to-parallel data conversion, data computation, and processing.
[0095] Understandably, when the display panel is operating, the gate drive voltage Sy controls the first switch T1 to turn on, and the source drive voltage Sx flows through the first switch T1 to the first capacitor C1. Since the gate of the second switch T2 is connected to the first capacitor C1, after the source drive voltage Sx charges the first capacitor C1, it can increase the gate drive voltage Sy of the second switch T2, thereby turning on the second switch T2. Simultaneously, the first capacitor C1 has a storage function; after the first switch T1 is turned off, the gate drive voltage of the second switch T2 can still be maintained, allowing the second switch T2 to remain on. The power supply voltage ELVDD can form a drive current through the second switch T2. This drive current can flow through the sub-pixel D1, thereby driving the sub-pixel D1 to emit light.
[0096] It can be seen that the luminous intensity of sub-pixel D1 in pixel unit 121 is related to the magnitude of the power supply voltage ELVDD provided to pixel unit 121.
[0097] It should be noted that, typically, electronic device 100 supplies power voltage ELVDD to pixel unit 121 through different transmission paths. Since different transmission paths produce different impedances to the electrical signal, the electrical signal will experience different transmission voltage drops under the influence of these impedances. Therefore, when electronic device 100 supplies power voltage ELVDD to pixel unit 121 through different transmission paths, the transmission voltage drop generated by the power voltage ELVDD received by pixel unit 121 will be different.
[0098] To facilitate understanding of the transmission path by which pixel unit 121 in electronic device 100 obtains the power supply voltage ELVDD, the following content combines... Figure 9a and Figure 9b Please refer to the explanation. Figure 9a , Figure 9a A schematic diagram of a frame of an electronic device provided in an embodiment of this application.
[0099] Figure 9a The pixel unit 121 is integrated into the display panel of the illustrated electronic device 200. The power supply voltage ELVDD required for the operation of the pixel unit 121 in the display panel can be provided by a power chip on the motherboard, and a source drive voltage Sx is provided by a driver chip integrated on the flip-chip board. The motherboard, as the core component of the electronic device 200, is mainly used for processing display signals and image control. For example, the motherboard can receive analog or digital signals transmitted from various external interfaces and convert them into the signal format required by the display panel. The motherboard can also control the image display effect by adjusting parameters such as image brightness and color, and can control functions such as power on / off, volume, and menus of the electronic device 200. Furthermore, the power chip on the motherboard, as another key component of the electronic device 200, is mainly used for power conversion and power management. For example, the power chip converts the DC power output from the power adapter into the DC power required by the display panel, providing a stable power supply voltage ELVDD and a common voltage ELVSS for the display panel. Specifically, the power supply voltage ELVDD and the common voltage ELVSS transmitted by the power chip can be transmitted to the display panel through wires on the driver circuit board. At the same time, the power chip can also detect the power status, thereby ensuring the power management and protection of electronic device 200.
[0100] like Figure 9aAs shown, when the electronic device 200 is running, firstly, the power chip on the motherboard provides the power supply voltage ELVDD to the display panel, ensuring that each pixel unit in the display panel can operate normally. The central processing unit on the motherboard can receive signals from the computer or other input devices, decode and process these signals, and convert them into recognizable image data signals. The timing controller on the driver circuit board is equipped with a shift register, which can process image data signals and clock signals, convert them into control signals required to control the display panel, and then transmit the control signals and the data signals required for display to the driver chip. In addition, the power management circuit on the driver circuit board can provide the gamma correction voltage required for display driving. Furthermore, the gamma circuit in the driver chip can perform gamma curve correction on the control signals output by the timing controller, matching the color and brightness information of the displayed image, to ensure that the brightness and color of the image remain consistent during display. The adjustment of the gamma circuit can improve the visual effect of the display and enhance the user's viewing experience. Furthermore, after the gamma circuit transmits the grayscale voltage signal obtained after gamma curve adjustment to the driving circuit, the driving circuit can convert the input grayscale voltage signal into the source driving voltage Sx of the display panel, so as to provide the correct color and brightness information for each pixel unit of the display panel.
[0101] It should be noted that the principle by which each pixel unit of the display panel emits light based on the source driving voltage Sx provided by the driver chip and the power supply voltage ELVDD provided by the power supply chip can be referred to the above. Figure 8 The specific implementation of the pixel unit 121 shown will not be described in detail here.
[0102] The aforementioned driver chip can be integrated into the non-display area of the display panel (e.g., the one mentioned above). Figure 6 The peripheral area (BB) of the display panel shown. For example, the driver chip can be integrated in... Figure 6 The aforementioned source drive voltage is provided to all pixel units in the second peripheral region 10a of the display panel 10. Alternatively, the aforementioned drive chip can be mounted on a flip-chip thin film, which refers to a flexible circuit board used for screen display driving. This flip-chip thin film can be connected to one side of the display panel.
[0103] In the electronic device 200, the motherboard is located relatively far from the display panel, meaning the transmission path of the power supply voltage ELVDD is long. Therefore, the pixel units experience a significant voltage drop when receiving the ELVDD power supply voltage. Furthermore, since the brightness of a sub-pixel within a pixel unit is related to the magnitude of the power supply voltage ELVDD supplied to that pixel unit, the voltage drop caused by the ELVDD power supply voltage reduces the luminous intensity of the sub-pixels, resulting in insufficient brightness of the display panel. In addition, as the size of the electronic device 200 increases, the size of the display panel also becomes larger. For large display panels, the voltage drop of the power supply voltage ELVDD also causes significant differences in the luminous brightness of pixel units in different locations within the display panel, i.e., uneven brightness. This is especially noticeable when the display panel is blank, exhibiting a significant problem of poor brightness uniformity.
[0104] Therefore, this application provides an electronic device that can supply power voltage ELVDD to multiple sides of a display panel and use the ELVDD input from multiple sides to power each pixel unit in the display panel. This ensures that pixel units at different positions on the display panel can obtain similar power voltage ELVDD, avoiding the problem of insufficient brightness of the display panel caused by the transmission voltage drop of power voltage ELVDD when only one side of the display panel is supplied with power voltage ELVDD, and improving the brightness uniformity of the display panel.
[0105] Specifically, the electronic device provided in this application embodiment has multiple circuit boards in the display module, including one of the aforementioned driving circuit boards. Each circuit board receives the power supply voltage ELVDD from the power chip on the motherboard at its input terminal and supplies the power supply voltage ELVDD to the display panel through its output terminal. In other words, by providing multiple circuit boards connected to the display panel, the electronic device can increase the power supply voltage ELVDD supplied to the pixel units in the display panel. It is understood that the power supply voltage ELVDD received and transmitted to the display panel by different circuit boards collectively powers each pixel unit of the display panel, thereby compensating for the power supply voltage ELVDD received by each pixel unit. This offsets the voltage drop of the power supply voltage ELVDD caused by the long transmission path, effectively improving the problems of insufficient brightness and poor uniformity in large-size display panels.
[0106] For example, please refer to Figure 9b , Figure 9b Another schematic diagram of the electronic device provided in an embodiment of this application. (See diagram below.) Figure 9aAs shown, in addition to providing the power supply voltage ELVDD and common voltage ELVSS output by the power chip to the display panel via the driver circuit board, the electronic device 200 also provides the power supply voltage ELVDD output by the power chip to the display panel via an additional circuit board, which can solve the problem of... Figure 9a The display panel shown has insufficient brightness, and this application aims to improve the brightness uniformity of the display panel. Furthermore, because the power supply voltage ELVDD transmitted to the display panel from different circuit boards has different transmission voltage drops, it reduces the brightness uniformity of the display panel. Therefore, the embodiments provided in this application address this issue. Figure 9b In the illustrated electronic device 200, a compensation circuit is also provided on the driver circuit board. This compensation circuit can calculate the target compensation voltage and enable the driver chip to provide a compensated source drive voltage Sx to the display panel based on the target compensation voltage, thereby further improving the brightness uniformity of the display panel. It is understood that... Figure 9b For details on the implementation principles of the central processing unit on the motherboard, the power management circuit on the driver circuit board, the timing controller, the driver chip, etc., please refer to [link / reference needed]. Figure 9a The electronic device 200 shown is not described in detail in this embodiment of the application.
[0107] In some feasible implementations, the electronic device provided in this application may include multiple flexible circuit boards, with each flexible circuit board having a first end connected to a power chip on a motherboard and a second end connected to a circuit board in a display module. These multiple flexible circuit boards can receive the power supply voltage ELVDD output by the power chip through their first ends and transmit it to the circuit board of the display module through their second ends.
[0108] For example, the electronic device provided in this application embodiment may have two circuit boards for the display module. In this case, the specific structure of the electronic device can be found in [reference needed]. Figure 10 As shown, Figure 10 This is yet another schematic diagram of the electronic device provided in an embodiment of this application. Specifically, Figure 10 The illustrated electronic device 300 includes a display module 310, a motherboard 320, a first flexible circuit board 330, and a second flexible circuit board 340. The display module includes a display panel 311 and two circuit boards: a circuit board 312 and a driver circuit board 313. The motherboard 320 is equipped with a power supply chip.
[0109] It is understood that the first end of the aforementioned first flexible circuit board 330 is connected to the power chip, the second end is connected to the input terminal of the circuit board 312, and the output terminal of the circuit board 312 is connected to the display panel 311. Specifically, the first end of the first flexible circuit board 330 can receive the power supply voltage ELVDD output by the power chip and transmit it to the input terminal of the circuit board 312 through the second end. The circuit board 312 has traces that can transmit the power supply voltage ELVDD received at the input terminal to the display panel 311 through its output terminal.
[0110] Similarly, the first end of the second flexible circuit board 340 is connected to the power chip, the second end is connected to the input terminal of the driver circuit board 313, and the output terminal of the driver circuit board 313 is connected to the display panel 311. The first end of the second flexible circuit board 340 can receive the power supply voltage ELVDD output by the power chip and transmit it to the input terminal of the driver circuit board 313 through the second end. The driver circuit board 313 has wiring that can transmit the power supply voltage ELVDD received at its input terminal to the display panel 311 through its output terminal.
[0111] In some feasible implementations, the first end of the first flexible circuit board 330 can be connected to the motherboard via connector 2 to receive the power supply voltage ELVDD output by the power chip on the motherboard, and the second end can be connected to the input terminal of the circuit board 312 via connector 2 to provide the power supply voltage ELVDD to the circuit board 312. Similarly, the first end of the second flexible circuit board 340 can be connected to the motherboard via connector 3 to receive the power supply voltage ELVDD output by the power chip on the motherboard, and the second end can be connected to the input terminal of the driver circuit board 313 via connector 4 to provide the power supply voltage ELVDD to the driver circuit board 313.
[0112] Therefore, the electronic device 300 can transmit the power supply voltage ELVDD to the circuit board 312 and the driving circuit board 313 respectively through the first flexible circuit board 330 and the second flexible circuit board 340. Thus, the circuit board 312 and the driving circuit board 313 can simultaneously provide the power supply voltage ELVDD to each pixel unit in the display panel 311, thereby offsetting the transmission voltage drop caused by the long transmission path of the power supply voltage ELVDD, and effectively improving the problems of insufficient brightness and poor uniformity in large-size display panels.
[0113] It should be noted that the purpose of the electronic device in this embodiment is to provide multiple power supply voltages ELVDD to the display module through multiple flexible circuit boards and connectors. Figure 10The specific structure of the electronic device 300 shown is only one example. In other application scenarios, the power chip can also transmit the power supply voltage ELVDD to the display module through other transmission methods. Meanwhile, the number of circuit boards in the display module can be other positive integers, and the positions of the circuit boards can also be adjusted according to the actual application scenario. This application embodiment will not provide specific examples of each. For ease of explanation, the following description uses an example of a display module including two circuit boards.
[0114] For some feasible implementation methods, please refer again. Figure 10 , Figure 10 The display panel 311 shown can be divided into a display area AA and a peripheral area BB. Images and other objects can be displayed within the display area AA, and the peripheral area BB can surround the outside of the display area AA. The display panel 311 can include multiple pixel units, which can be disposed within the display area AA.
[0115] It should be noted that the circuit board 312 in the display module 310 can be a flexible circuit board, which can transmit input signals related to the display image to each pixel unit of the display panel 311, such as power signals (e.g., power supply voltage ELVDD), control signals, or data signals. The circuit board 312 is provided with traces for connecting and transmitting the power supply voltage ELVDD.
[0116] The driver circuit board 313 in the display module 310 can transmit input signals related to the display image to each pixel unit of the display panel 311, such as power supply voltage ELVDD, control signals, or data signals. The driver circuit board 313 has traces for connecting and transmitting the power supply voltage ELVDD. Furthermore, the driver circuit board 313 may include a compensation circuit, a timing controller, a power management circuit, and multiple driver chips 314. The specific working principles of each component in the driver circuit board 313 can be found above. Figure 9a The specific implementation of the driving circuit board shown is not described in detail in this application.
[0117] In some feasible implementations, such as Figure 10 As shown, the driving circuit board 313 can be connected to the display panel 311 via a flexible circuit board 315. Specifically, the flexible circuit board 315 can transmit input signals related to the displayed image to each pixel unit of the display panel 311, such as power signals (e.g., power supply voltage ELVDD), control signals, or data signals. The circuit board 312 has traces for connecting and transmitting the power supply voltage ELVDD. In some applications, the aforementioned multiple driving chips 314 can be integrated into the flexible circuit board 315, or the aforementioned multiple driving chips 314 can also be disposed in the peripheral area of the display panel 311; this embodiment does not impose any limitations on this.
[0118] For some feasible implementation methods, please refer to Figure 11 , Figure 11 This is a top view of a display module provided in an embodiment of this application. Figure 11 In the display module 310 shown, the display panel 311 is divided into a display area AA and a peripheral area BB connected to and surrounding the display area AA, according to different functions. The display area AA can be as follows: Figure 7 The display panel 311 integrates multiple pixel units arranged in a matrix. The peripheral area BB can be equipped with a power supply voltage line ELVDD and a common voltage line. The power supply voltage line ELVDD can be connected to the first electrode of each pixel unit in the display panel 311. The first electrode of each pixel unit refers to... Figure 8 The source of the second switch T2 is shown. This common voltage line can be connected to the second electrode of each pixel unit in the display panel 311. The second electrode of each pixel unit refers to... Figure 8 The cathode of sub-pixel D1 is shown. It can be seen that the power supply voltage line ELVDD in the peripheral area BB can provide power supply voltage ELVDD to each pixel unit within the display area AA, and the common voltage line can provide a common voltage to each pixel unit within the display area AA.
[0119] For example, please refer to Figure 12 , Figure 12 This is another planar top view of the display module provided in the embodiments of this application. Figure 11 In the display module 310 shown, the first electrode layer VDD is a continuous transparent layer that covers at least the display area of the display panel, thus avoiding interference with the light emission of sub-pixels. The display area includes multiple first electrodes with insulating spacing, with one electrode corresponding to each pixel unit. The first electrode layer VDD is typically made of a metal with good conductivity. The aforementioned power supply voltage line ELVDD has a certain linewidth and partially overlaps with the edge portion of the first electrode layer VDD, thereby providing a power supply voltage ELVDD to the first electrode layer VDD, but this is not a limitation. Furthermore, the power supply voltage line ELVDD and the first electrode layer VDD can be located on different layers and can be electrically connected to each other through vias.
[0120] Furthermore, circuit board 312 and driving circuit board 313 are located at opposite ends of display panel 311. Circuit board 312 is provided with traces that can connect to the aforementioned power supply voltage line ELVDD located in the peripheral area BB of display panel 311. When circuit board 312 receives the power supply voltage ELVDD transmitted from the flexible circuit board through its input terminal, it can transmit it to the power supply voltage line ELVDD in the peripheral area BB through its internal traces, and then transmit it to the first electrode of each pixel unit in display panel 311 through the power supply voltage line ELVDD.
[0121] like Figure 11 As shown, the peripheral area BB can also include a gate driver GOA and a light-emitting driver EOA. These GOA and EOA can connect to the aforementioned multiple pixel units to provide gate driving voltage and source driving voltage to the pixel units. Specifically, the gate driver GOA and EOA are located between the display area AA and the power supply voltage line ELVDD. Furthermore, the peripheral area BB of the display panel 311 can also include a dummy circuit (Dummy) and a multiplexer (MUX).
[0122] In some feasible implementations, the display module includes a bending portion that can connect a display panel and a circuit board respectively, and the bending portion can be bent relative to the display panel to the back of the display panel, so that the circuit board in the display module is bent to the back of the display panel. For example, as... Figure 11 The dashed lines represent the bends of the first and second bends relative to the display panel 311, respectively. The first bend connects to the circuit board 312, and the second bend connects to the drive circuit board 313. The first and second bends can be bent relative to the display panel, thus bending the circuit board 312 and drive circuit board 313 to the back of the display panel 311. This minimizes the space occupied by the first and second bends on the front of the display panel.
[0123] In some feasible implementations, the display module is also connected to the motherboard via a flexible circuit board. In this case, the motherboard can be located on the back of the display panel, approximately in the area between the first and second bends. The circuit board and the driver circuit board are electrically connected to the motherboard via the flexible circuit board to connect to the power supply voltage ELVDD.
[0124] It should be noted that when the power chip transmits the power voltage ELVDD to the circuit board of the display module through the flexible circuit board or other transmission paths, a transmission voltage drop will occur due to the line impedance of the flexible circuit board or other transmission paths. Furthermore, since the power chip in this embodiment transmits the power voltage ELVDD to different circuit boards through different transmission paths, the transmission voltage drop generated by different transmission paths is different. Therefore, the power voltage ELVDD obtained by different circuit boards is not the same, and thus the multiple power voltages ELVDD provided to the display panel are also different. Further, the different power voltages ELVDD provided by different circuit boards will affect the luminous brightness of different pixel units in the display panel, thereby affecting the brightness uniformity of the display panel.
[0125] Therefore, the electronic device provided in this application embodiment can further improve the brightness uniformity of the display panel by compensating for the different power supply voltages ELVDD provided by different circuit boards.
[0126] It needs to be explained, such as Figure 8 As shown, when the display panel is working, the gate drive voltage Sy controls the first switch T1 to turn on, and the source drive voltage Sx enters the first capacitor C1 through the first switch T1. After the source drive voltage Sx charges the first capacitor C1, it can increase the gate drive voltage of the second switch T2, thereby turning on the second switch T2. The power supply voltage ELVDD can form a drive current through the turned-on second switch T2. This drive current can flow through the sub-pixel D1, thereby driving the sub-pixel D1 to emit light.
[0127] The magnitude of the driving current for the aforementioned sub-pixel D1 to emit light can be expressed by the following formula (1):
[0128] Formula (1) is: I = k × (Vgs - Vth)
[0129] Where I represents the driving current flowing through the second switch T2 and the sub-pixel D1, k is the intrinsic conductivity factor of the second switch T2, Vgs represents the voltage difference between the gate and source of the second switch T2, and Vth represents the threshold voltage of the second switch T2.
[0130] For an example illustrating the transmission path through which pixel units in electronic devices acquire the power supply voltage ELVDD and the source drive voltage Sx, please refer to the above content. Figure 9a The specific implementation details are not elaborated here.
[0131] The luminous intensity of sub-pixel D1 in each pixel unit 121 is proportional to the magnitude of the driving current flowing through sub-pixel D1. As shown in formula (1) above, the magnitude of the driving current is related to the magnitude of the gate driving voltage of the second switch T2 and the magnitude of the power supply voltage ELVDD (i.e., Vgs). Simultaneously, the gate driving voltage of the second switch T2 is obtained by charging the first capacitor C1 with the source driving voltage Sx. Therefore, the magnitude of the gate driving voltage of the second switch T2 is related to the magnitude of the source driving voltage Sx. Thus, it can be seen that the luminous intensity of sub-pixel D1 in pixel unit 121 is related to the magnitude of the source driving voltage Sx and the magnitude of the power supply voltage ELVDD provided to that pixel unit 121.
[0132] Therefore, the display module provided in this application embodiment can compensate for the source drive voltage (i.e., the aforementioned source drive voltage Sx) provided to the display panel when multiple circuit boards are used to supply power voltage ELVDD to the display panel, thereby compensating for the power voltage ELVDD provided by multiple circuit boards, thereby further improving the brightness uniformity of the display panel and meeting the requirements for the overall brightness of the display panel.
[0133] It should be noted that, since the power supply chip provides the power supply voltage ELVDD to the display panel through different transmission paths, and the impedance generated by different transmission paths to the power supply voltage ELVDD is different, the power supply voltage ELVDD transmitted to the display panel by different circuit boards has different transmission voltage drops. Therefore, in order to compensate for the power supply voltage ELVDD provided by multiple circuit boards, the display module provided in this application embodiment can obtain the operating parameters of each circuit board and calculate the target compensation voltage. The purpose of the display module obtaining the target compensation voltage is to use it as the target value of the power supply voltage ELVDD provided by each circuit board to the display panel. Furthermore, by using this target compensation voltage as the power supply voltage ELVDD provided by each circuit board to the display panel and compensating the source drive voltage, reasonable compensation can be performed on the power supply voltage ELVDD provided by each circuit board, achieving high brightness and brightness uniformity of the display panel. In some application scenarios, this target compensation voltage can be understood as the average value of the power supply voltage ELVDD provided by multiple circuit boards to the display panel, but it is not limited to this.
[0134] In some feasible implementations, when the display module in this embodiment provides the power supply voltage ELVDD to the display panel through multiple circuit boards, one of these circuit boards may include a driver circuit board. This driver circuit board can perform the steps described above: acquiring the operating parameters of each circuit board, calculating the target compensation voltage, and compensating the source drive voltage based on the target compensation voltage. In some application scenarios, this driver circuit board can be understood as... Figure 9a and Figure 9b The driver circuit board in the electronic device 200 shown is, or is Figure 10 The driving circuit board 313 in the electronic device 300 shown.
[0135] First, the driver circuit board can acquire the operating parameters of each circuit board and calculate the target compensation voltage. Specifically, the operating parameters acquired by the driver circuit board can include the voltage magnitude at the input terminals of each circuit board, the current magnitude flowing through the input terminals of each circuit board, and the equivalent impedance when the power supply voltage ELVDD is transmitted between the input terminals of each circuit board and the power chip.
[0136] The voltage at the input terminals of each of the aforementioned circuit boards is the magnitude of the power supply voltage ELVDD received by the circuit board when it is transmitted to the input terminals of each circuit board via the flexible circuit board or other transmission path. For example, such as... Figure 10As shown, the display module 310 includes two circuit boards: circuit board 312 and driver circuit board 313. It can be understood that driver circuit board 313 can be connected to the input terminal of circuit board 312, and when the power chip transmits the power supply voltage ELVDD to circuit board 312, it obtains the voltage V1 at the input terminal of circuit board 312. Simultaneously, when the power chip transmits the power supply voltage ELVDD to driver circuit board 313, driver circuit board 313 can obtain the voltage V2 at its own input terminal. Therefore, the voltage magnitudes obtained by driver circuit board 313 at the input terminals of each circuit board of the display module 310 are the aforementioned voltages V1 and V2. Specifically, when the input terminal of circuit board 312 is connected to the first flexible circuit board 330 via connector 1, driver circuit board 313 obtains the voltage magnitude of connector 1, which is the aforementioned voltage V1. Similarly, when the input terminal of driver circuit board 313 is connected to the second flexible circuit board 340 via connector 4, driver circuit board 313 obtains the voltage magnitude of connector 4, which is the aforementioned voltage V2.
[0137] The magnitude of the current flowing through each circuit board's input terminal is the magnitude of the current at the circuit board's input terminal when the power supply voltage ELVDD is transmitted to the circuit board through the flexible circuit board or other transmission paths. When there are no other parallel paths for the power supply chip to transmit the power supply voltage ELVDD to the circuit board, the current between the power supply chip and the circuit board is equal everywhere. In this case, the driver circuit board can obtain the current magnitude at the circuit board's input terminal as the magnitude of the current flowing through each circuit board's input terminal. Alternatively, when the power supply chip is connected to the circuit board through a flexible circuit board, the driver circuit board can obtain the current magnitude at the first or second end of the flexible circuit board as the magnitude of the current flowing through each circuit board's input terminal.
[0138] For example, such as Figure 10 As shown, the display module 310 includes two circuit boards: circuit board 312 and driver circuit board 313. It can be understood that driver circuit board 313 can be connected to the input terminal of circuit board 312, and obtain the current i1 at the input terminal of circuit board 312 when the power chip transmits the power supply voltage ELVDD to circuit board 312. Alternatively, driver circuit board 313 can be connected to either the first or second terminal of the first flexible circuit board 330, and obtain the current i1 at either the first or second terminal of the first flexible circuit board 330 when the power chip transmits the power supply voltage ELVDD to circuit board 312. Specifically, when the input terminal of circuit board 312 is connected to the first flexible circuit board 330 via connector 1, and the first flexible circuit board 330 is connected to the motherboard via connector 2, driver circuit board 313 obtains the current magnitude of connector 1 or connector 2, which is the aforementioned current i1.
[0139] Simultaneously, when the power supply chip transmits the power supply voltage ELVDD to the driver circuit board 313, the driver circuit board 313 can obtain the current i2 at its own input terminal. Alternatively, the driver circuit board 313 can be connected to either the first or second terminal of the second flexible circuit board 340, and obtain the current i2 at either the first or second terminal of the second flexible circuit board 340 when the power supply chip transmits the power supply voltage ELVDD to the driver circuit board 313. Specifically, when the input terminal of the driver circuit board 313 is connected to the second flexible circuit board 340 via connector 4, and the second flexible circuit board 340 is connected to the motherboard via connector 3, the driver circuit board 313 obtains the current magnitude of connector 3 or connector 4, which is the aforementioned current i2.
[0140] It is understandable that the driving circuit board 313 obtains the current magnitudes of the current flowing through each circuit board input terminal of the display module 310 as described above, namely current i1 and current i2.
[0141] The equivalent impedance between the input terminals of the aforementioned circuit boards and the power supply chip when transmitting the power supply voltage ELVDD is the equivalent impedance between the circuit board and the power supply chip when the power supply voltage ELVDD is transmitted to the input terminals of the respective circuit boards through the flexible circuit board or other transmission paths. For example, ... Figure 10 As shown, the display module 310 includes two circuit boards: circuit board 312 and driving circuit board 313. It can be understood that the driving circuit board 313 can be connected to the input terminal of circuit board 312, and when the power chip transmits the power supply voltage ELVDD to circuit board 312, it obtains the equivalent impedance Rx1 of the input terminal of circuit board 312. Simultaneously, when the power chip transmits the power supply voltage ELVDD to the driving circuit board 313, the driving circuit board 313 can obtain the equivalent impedance Rx2 of its own input terminal. Therefore, the equivalent impedance obtained by the driving circuit board 313 when the power supply voltage ELVDD is transmitted between the input terminals of each circuit board of the display module 310 and the power chip is the aforementioned equivalent impedance Rx1 and equivalent impedance Rx2. Specifically, when the input terminal of circuit board 312 is connected to the first flexible circuit board 330 through connector 1, the driving circuit board 313 obtains the equivalent impedance of connector 1, which is the aforementioned equivalent impedance Rx1. Similarly, when the input terminal of the drive circuit board 313 is connected to the second flexible circuit board 340 through the connector 4, the drive circuit board 313 obtains the equivalent impedance of the connector 4, which is the equivalent impedance Rx2 mentioned above.
[0142] It is understandable that the voltage magnitude at the input terminals of each circuit board, the equivalent impedance of the power chip transmitting the power supply voltage ELVDD to the input terminals of each circuit board, and the current flowing through the input terminals of each circuit board are used as operating parameters for each circuit board. These parameters reflect the transmission voltage drop of the power supply voltage ELVDD obtained by each circuit board through different transmission paths. Based on the transmission voltage drop of the power supply voltage ELVDD obtained by each circuit board through different transmission paths, the driver circuit board can determine the compensation value of the power supply voltage ELVDD provided by each circuit board to the display panel, and thus determine the compensation value of the source drive voltage.
[0143] In the display module provided in this application embodiment, the driving circuit board can calculate the target compensation voltage based on the voltage magnitude of each circuit board input terminal, the equivalent impedance of the power chip transmitting the power supply voltage ELVDD to each circuit board input terminal, and the current flowing through each circuit board input terminal. Furthermore, when the driving circuit board uses this target compensation voltage as the power supply voltage ELVDD provided by each circuit board to the display panel and compensates the source drive voltage, it can adjust the output current of the pixel circuit in the display panel to adjust the brightness of the sub-pixels. This allows for effective compensation of the power supply voltage ELVDD provided by different circuit boards, solving the problems of insufficient brightness and poor uniformity caused by a decrease in the power supply voltage ELVDD.
[0144] The specific implementation process of calculating the target compensation voltage based on the voltage magnitude of each circuit board input terminal, the equivalent impedance of the power chip when transmitting the power supply voltage ELVDD to each circuit board input terminal, and the current flowing through each circuit board input terminal is not detailed here.
[0145] In some feasible implementations, the target compensation voltage characterizes the transmission voltage drop generated when each of the multiple circuit boards supplies the power supply voltage ELVDD to the display panel. After calculating the target compensation voltage, the driving circuit board can compensate the source drive voltage supplied to each pixel unit accordingly based on this target compensation voltage. It is understood that the transmission voltage drop received by each circuit board from the power supply voltage ELVDD may differ, resulting in different actual power supply voltage ELVDD supplied to the display panel. However, since the target compensation voltage characterizes the transmission voltage drop generated when each circuit board supplies the power supply voltage ELVDD, and the luminous brightness of each pixel unit in the display panel is related to both the power supply voltage ELVDD supplied to the display panel and the source drive voltage supplied to each pixel unit, the driving circuit board can reasonably compensate for the transmission voltage drop generated by the power supply voltage ELVDD supplied by each circuit board by compensating the source drive voltage supplied to each pixel unit based on the target compensation voltage, thereby improving the brightness uniformity of the display panel.
[0146] The display module provided in this application embodiment, by setting multiple circuit boards to provide the power supply voltage ELVDD to multiple sides of the display panel, can avoid the problem of reduced display panel brightness caused by the transmission voltage drop when only one side of the display panel is supplied with the power supply voltage ELVDD. Simultaneously, for large-size display panels, the display module's provision of the power supply voltage ELVDD to the display panel through multiple circuit boards can also improve the brightness uniformity of the display panel and ensure brightness uniformity when the display panel is at high brightness. Furthermore, since the transmission voltage drop generated by the power supply voltage ELVDD provided by each circuit board in the multiple circuit boards is different, the display module in this application embodiment can obtain the equivalent impedance of the power chip transmitting the power supply voltage ELVDD to each circuit board, the voltage magnitude at the input terminal of each circuit board, and the current flowing through them through the driver circuit board in the multiple circuit boards, and calculate the target compensation voltage power supply voltage ELVDD. Meanwhile, since the luminous intensity of each pixel unit in the display panel is related to the source drive voltage and the power supply voltage ELVDD provided to the display module, when the display module compensates the source drive voltage according to the target compensation voltage, it can compensate for the transmission voltage drop generated by the power supply voltage ELVDD. This further improves the brightness uniformity of the display panel, ensuring it meets high brightness requirements, even when multiple circuit boards supply the power supply voltage ELVDD to the display panel. It is understood that each of the multiple circuit boards in the display module supplies power to the display panel, and the driver circuit boards, in addition to supplying power to the display panel, can also perform the steps of obtaining the target compensation voltage and compensating the source drive voltage.
[0147] In some feasible implementations, the driver circuit board can obtain the voltage magnitudes at the input terminals of the aforementioned circuit boards through a voltage acquisition module in the compensation circuit. The compensation circuit can be understood as... Figure 9b and Figure 10 The compensation circuit is shown. This voltage acquisition module is connected to the power supply terminal of the aforementioned power chip and can acquire the voltage magnitude of the power supply terminal. Here, the power supply terminal of the power chip refers to the port where the power chip outputs the power supply voltage ELVDD to the input terminals of each circuit board.
[0148] It should be noted that the voltage at the power supply terminal of the power chip is the power supply voltage ELVDD without transmission voltage drop, while the power supply voltage ELVDD received at each circuit board input terminal is the power supply voltage ELVDD with transmission voltage drop. To determine the magnitude of the power supply voltage ELVDD received at each circuit board input terminal after transmission voltage drop, i.e., the voltage magnitude at each circuit board input terminal, the voltage acquisition module acquires the transmission voltage drop generated by the transmission path from the power chip to each circuit board. Specifically, the voltage acquisition module can be connected to the input terminals of each circuit board to acquire the equivalent impedance of the power chip transmitting the power supply voltage ELVDD to each circuit board input terminal and the magnitude of the current flowing through each circuit board input terminal. Based on the product of the equivalent impedance of the power chip transmitting the power supply voltage ELVDD to each circuit board and the magnitude of the current flowing through each circuit board input terminal, the transmission voltage drop generated by the power supply voltage ELVDD received at each circuit board input terminal is calculated.
[0149] For example, please refer to Figure 13 , Figure 13 This is a schematic diagram of a display module frame provided in an embodiment of this application. Figure 13The display module 400 shown includes a display panel 410 and two circuit boards, namely circuit board 420 and driver circuit board 430. Driver circuit board 430 further includes a voltage acquisition module 431, which is connected to the power supply terminal of the power chip and acquires the voltage magnitude Vo of the power supply terminal. Voltage acquisition module 431 is also connected to the input terminals of circuit board 420 and driver circuit board 430, respectively, and acquires the current flowing through the input terminal of circuit board 420 as i11 and the current flowing through the input terminal of driver circuit board 430 as i12. It also acquires the equivalent impedance Rx11 when the power chip transmits the power supply voltage ELVDD to the input terminal of circuit board 420 and the equivalent impedance Rx12 when the power chip transmits the power supply voltage ELVDD to the input terminal of driver circuit board 430. Furthermore, the voltage acquisition module can calculate the transmission voltage drop Vd1 = Rx11 × i11 caused by the power supply voltage ELVDD received by the circuit board 420 based on the current i11 flowing through the input terminal of the circuit board 420 and the equivalent impedance Rx11 when the power supply chip transmits the power supply voltage ELVDD to the input terminal of the circuit board 420. Similarly, the voltage acquisition module can calculate the transmission voltage drop Vd2 = Rx12 × i12 caused by the power supply voltage ELVDD received by the drive circuit board 430 based on the current i12 flowing through the input terminal of the drive circuit board 430 and the equivalent impedance Rx12 when the power supply chip transmits the power supply voltage ELVDD to the input terminal of the drive circuit board 430.
[0150] Furthermore, the voltage acquisition module can calculate that the voltage at the input terminal of the circuit board 420 is equal to Vo - Vd1, and the voltage at the input terminal of the drive circuit board 430 is equal to Vo - Vd2.
[0151] In some feasible implementations, the driver circuit board can also directly obtain the voltage magnitudes of the input terminals of each of the aforementioned circuit boards via a voltage acquisition module. In this case, the voltage acquisition module can be directly connected to the input terminals of each of the aforementioned circuit boards and obtain the voltage magnitudes of the input terminals of each circuit board.
[0152] In some feasible implementations, the voltage magnitude acquired by the voltage acquisition module at each circuit board input terminal is the actual power supply voltage ELVDD received at each circuit board input terminal, while the target compensation voltage is the calculated voltage magnitude at each circuit board input terminal. To determine the target compensation voltage, the voltage acquisition module can calculate the voltage compensation coefficient for each circuit board based on the acquired current flowing through each circuit board input terminal and the equivalent impedance of the power supply chip transmitting the power supply voltage ELVDD to each circuit board input terminal. Furthermore, the voltage acquisition module can process the voltage magnitude at each circuit board input terminal according to the voltage compensation coefficient of each circuit board to obtain the target compensation voltage.
[0153] It should be noted that the voltage compensation coefficient of each circuit board can be understood as the degree of transmission voltage drop caused by the power supply voltage ELVDD received by each circuit board. The larger the transmission voltage drop caused by the power supply voltage ELVDD received by a circuit board compared to the transmission voltage drop caused by the power supply voltage ELVDD received by other circuit boards, the larger the voltage compensation coefficient of that circuit board. Specifically, if the transmission voltage drop caused by the power supply voltage ELVDD received by a circuit board is relatively large, the voltage acquisition module can focus on calculating the target compensation voltage based on the voltage magnitude at the input terminal of that circuit board, and then focus on compensating the power supply voltage ELVDD of that circuit board when compensating the source drive voltage. Conversely, if the transmission voltage drop caused by the power supply voltage ELVDD received by a circuit board is relatively small, the voltage acquisition module can reduce the emphasis on the voltage magnitude at the input terminal of that circuit board when calculating the target compensation voltage, and then focus on compensating the power supply voltage ELVDD of other circuit boards with larger transmission voltage drops when compensating the source drive voltage.
[0154] For example, assuming the transmission voltage drop generated by the power supply voltage ELVDD received by circuit board 420 is Vd1, and the transmission voltage drop generated by the power supply voltage ELVDD received by drive circuit board 430 is Vd2, then the voltage acquisition module 431 can calculate the voltage compensation coefficient of circuit board 420 as a = Vd1 / (Vd1+Vd2), and the voltage compensation coefficient of drive circuit board 430 as b = Vd2 / (Vd1+Vd2). Simultaneously, the voltage acquisition module can calculate that the voltage magnitude at the input terminal of circuit board 420 is equal to Vo - Vd1, and the voltage magnitude at the input terminal of drive circuit board 430 is equal to Vo - Vd2.
[0155] The voltage acquisition module 431 can calculate the target compensation voltage Vfb = a × (Vo - Vd1) + b × (Vo - Vd2) based on the voltage compensation coefficient of each circuit board and the voltage magnitude of the input terminal of each circuit board.
[0156] It should be noted that the above are merely examples and do not constitute a limitation on the embodiments of this application.
[0157] In some feasible implementations, the voltage acquisition module can acquire the magnitude of the current flowing through the input terminals of each circuit board and the equivalent impedance of the power chip transmitting the power voltage ELVDD to the input terminals of each circuit board when the power chip provides the power supply voltage ELVDD to each circuit board and the display panel displays at any display brightness, so as to calculate the voltage compensation coefficient of each circuit board.
[0158] Preferably, the voltage acquisition module can acquire the magnitude of the current flowing through the input terminals of each circuit board and the equivalent impedance of the power chip transmitting the power voltage ELVDD to the input terminals of each circuit board when the power chip provides the power supply voltage ELVDD to each circuit board and the display panel is displaying at the highest brightness (i.e., the display panel is white screen), in order to calculate the voltage compensation coefficient of each circuit board. It should be noted that when the display panel is white screen, the power supply voltage ELVDD provided by the power chip to each circuit board is at its maximum, and the transmission voltage drop generated by the power supply voltage ELVDD received by each circuit board is also at its maximum. Therefore, the voltage compensation coefficient of each circuit board calculated by the voltage acquisition module when the display panel is white screen is more accurate than the voltage compensation coefficient calculated when the display panel is not white screen.
[0159] Understandably, after obtaining the voltage compensation coefficients of each circuit board when the display panel is white, the voltage acquisition module can calculate the target compensation voltage based on the current voltage magnitude of the input terminals of each circuit board and the voltage compensation coefficients of each circuit board obtained when the display panel is white, under the condition that the power chip provides the power supply voltage ELVDD to each circuit board and the display panel is displaying at any display brightness.
[0160] For example, such as Figure 13 As shown, the voltage acquisition module 431 is connected to the power supply terminal of the power chip. When the display panel is white, the voltage acquisition module 431 can acquire the current flowing through the input terminal of the circuit board 420 as i21, the current flowing through the input terminal of the drive circuit board 430 as i22, and acquire the equivalent impedance of the power chip transmitting the power supply voltage ELVDD to the input terminal of the circuit board 420 as R21, and the equivalent impedance of the power chip transmitting the power supply voltage ELVDD to the input terminal of the drive circuit board 430 as R22.
[0161] Furthermore, the voltage acquisition module 431 can calculate the transmission voltage drop Vd3 = R21 × i21 when the display panel is white, based on the current i21 flowing through the input terminal of the circuit board 420 and the equivalent impedance R21 when the power chip transmits the power supply voltage ELVDD to the input terminal of the circuit board 420. Similarly, the voltage acquisition module 431 can calculate the transmission voltage drop Vd4 = R22 × i22 when the display panel is white, based on the current i12 flowing through the input terminal of the driver circuit board 430 and the equivalent impedance R22 when the power chip transmits the power supply voltage ELVDD to the input terminal of the driver circuit board 430.
[0162] It is understandable that the voltage acquisition module 431 can calculate the voltage compensation coefficient of the circuit board 420 as a = Vd3 / Vd3+Vd4, and the voltage compensation coefficient of the drive circuit board 430 as b = Vd4 / Vd3+Vd4.
[0163] It is understandable that after obtaining the target compensation voltage, the driving circuit board can compensate the source driving voltage provided to the display panel based on the target compensation voltage. The source driving voltage is the source driving voltage Sx provided by the driving chip mentioned above. In this way, the luminous intensity of each pixel unit in the display panel can be adjusted to compensate for the transmission voltage drop caused by the power supply voltage ELVDD provided by each circuit board, and further improve the brightness uniformity of the display panel.
[0164] In some feasible implementations, the compensation circuit in the driver circuit board may include a voltage compensation module. The compensation circuit of the driver circuit board can be understood as... Figure 9b and Figure 10 The compensation circuit shown above. The voltage compensation module can acquire the target compensation voltage calculated by the voltage acquisition module, and perform a step of compensating the source drive voltage supplied to the display panel based on the target compensation voltage.
[0165] Specifically, the voltage compensation module can compensate the source drive voltage by compensating the first gamma voltage and the second gamma voltage.
[0166] It should be noted that the first gamma voltage mentioned above is the maximum value of the gamma voltage when the voltage compensation module performs gamma curve adjustment, and the second gamma voltage is the minimum value of the gamma voltage when the voltage compensation module performs gamma curve adjustment. The display brightness of a display panel can typically be divided into gray levels from 0 to 255. Gray level 0 represents the lowest display brightness, and its corresponding gamma voltage is the first gamma voltage. Gray level 255 represents the highest display brightness, and its corresponding gamma voltage is the second gamma voltage. It can be understood that since the luminous brightness of each pixel unit in the display panel is limited between the highest and lowest brightness, the value of the aforementioned gamma voltage ranges from the second gamma voltage to the first gamma voltage. When driving the display panel to emit light, the voltage compensation module can obtain the corresponding gamma voltage based on the gray level value to be displayed by each pixel unit and the aforementioned first and second gamma voltages. After gamma curve adjustment of this gamma voltage, the source driving voltage is obtained. This source driving voltage can be used to drive the pixel units to emit light.
[0167] The gamma curve maps each gamma voltage to a source drive voltage. Specifically, for each gamma voltage in the gamma curve, the voltage compensation module stores a source drive voltage and a corresponding register value; that is, each node voltage value of the source drive voltage corresponds one-to-one with each node stored value of the stored value. Taking a gamma voltage range from the second gamma voltage to the first gamma voltage, and a stored value range from 0 to 1024, as an example, the gamma circuit can determine the source drive voltage corresponding to each node stored value (0-1024) in the register based on the gamma voltage range. This allows the grayscale value represented by the image data to be converted into the corresponding source drive voltage during image data input; this process is called gamma curve adjustment.
[0168] For example, assuming the voltage compensation module obtains a first gamma voltage of VGMP and a second gamma voltage of VGSP, and the stored values range from 0 to 1024, the voltage compensation module can store various gamma voltages between VGSP and VGMP, and various stored values corresponding one-to-one between each gamma voltage and 0 to 1024. When the grayscale value displayed by a pixel unit on the display panel is 100, the voltage compensation module can find the gamma voltage corresponding to the stored value of 100 among the stored values from 0 to 1024, which is Vp1 = (VGMP - VGSP) / 1024. Therefore, the value of the gamma voltage Vp1 is related to the range from VGSP to VGMP. Furthermore, when the voltage compensation module performs gamma curve correction based on the first gamma voltage VGMP and the second gamma voltage VGSP, it can compensate the corrected source drive voltage.
[0169] It should be noted that the implementation principle of gamma curve correction in the embodiments of this application, as well as the specific uses of the first gamma voltage and the second gamma voltage, can be found in the descriptions of gamma encoding, gamma decoding, gamma curve correction, etc. in the prior art. The embodiments of this application will not be described in detail here.
[0170] In summary, the voltage compensation module can compensate the source drive voltage by adjusting the first gamma voltage and the second gamma voltage. Therefore, after obtaining the target compensation voltage, the voltage acquisition module can first obtain the first gamma voltage and the second gamma voltage based on this target compensation voltage.
[0171] In some feasible implementations, the voltage compensation module can obtain a first gamma voltage based on a first voltage and a target compensation voltage. As described above, the target compensation voltage can be understood as the calculated power supply voltage ELVDD provided to the display panel by each circuit board. The first voltage refers to the difference between the first gamma voltage and the power supply voltage ELVDD received by the display panel at that time when each circuit board provides power supply voltage ELVDD to the display panel, and the aforementioned target compensation voltage characterizes the power supply voltage ELVDD provided to the display panel by each circuit board at that time. Therefore, the voltage compensation module can calculate the first gamma voltage based on the sum of the first voltage and the target compensation voltage.
[0172] For example, assuming the target compensation voltage is Vfb and the first voltage is V1, the voltage compensation module can calculate the first gamma voltage VGMP = Vfb + V1. The above is merely an example and does not constitute a limitation on the embodiments of this application.
[0173] In some feasible implementations, the voltage compensation module can obtain the second gamma voltage based on the second voltage and the target compensation voltage. As described above, the target compensation voltage can be understood as the calculated power supply voltage ELVDD provided to the display panel by each circuit board. The second voltage refers to the difference between the second gamma voltage and the power supply voltage ELVDD received by the display panel at that time when each circuit board provides power supply voltage ELVDD to the display panel, and the aforementioned target compensation voltage characterizes the power supply voltage ELVDD provided to the display panel by each circuit board at that time. Therefore, the voltage compensation module can calculate the second gamma voltage based on the sum of the second voltage and the target compensation voltage.
[0174] For example, assuming the target compensation voltage is Vfb and the second voltage is V2, the voltage compensation module can calculate the second gamma voltage VGSP = Vfb - V2. The above is merely an example and does not constitute a limitation on the embodiments of this application.
[0175] Understandably, after the voltage compensation module calculates the first gamma voltage and the second gamma voltage based on the target compensation voltage, since the first gamma voltage and the second gamma voltage have been adjusted accordingly based on the transmission voltage drop generated by the power supply voltage ELVDD of each circuit board, when the voltage compensation module adjusts the gamma curve based on the first gamma voltage and the second gamma voltage, the obtained source drive voltage can compensate for the transmission voltage drop generated by the power supply voltage ELVDD of each circuit board, further improving the high brightness uniformity of the display panel.
[0176] For example, please refer to [the document / reference]. Figure 13 , Figure 13The display module 400 shown includes a display panel 410 and two circuit boards, namely a circuit board 420 and a driving circuit board 430. The driving circuit board 430 further includes a voltage acquisition module 431 and a voltage compensation module 432. The voltage compensation module 432 is connected to the voltage acquisition module 431 to receive the target compensation voltage calculated by the voltage acquisition module 431. The voltage compensation module 432 can also calculate a first gamma voltage and a second gamma voltage based on the target compensation voltage, and compensate for the source driving voltage supplied to the display panel 410.
[0177] It should be noted that in some application scenarios, the voltage compensation module in the driver circuit board can be integrated into the aforementioned driver chip. The gamma circuit and drive circuit in the driver chip can receive the target compensation voltage output by the voltage acquisition module and perform the aforementioned gamma encoding, gamma curve adjustment, and other steps to obtain the compensated source drive voltage. Alternatively, the voltage compensation module can also be located outside the driver chip; this application embodiment does not impose any limitations on this.
[0178] In some feasible implementations, Figure 13 The driver circuit board 430 shown may also include a timing controller, a power management circuit, etc. The specific working principles of the timing controller and power management circuit can be found above. Figure 9a The specific implementation of the driving circuit board shown is not described in detail in this application.
[0179] In some feasible implementations, as described above, the voltage acquisition module can calculate the target compensation voltage based on the voltage compensation coefficient of each circuit board and the voltage magnitude at the input terminals of each circuit board. Specifically, the voltage acquisition module can calculate the product of the voltage at the input terminals of each circuit board and the corresponding voltage compensation coefficient, and then add the products of the voltage at the input terminals of each circuit board and the corresponding voltage compensation coefficient to obtain the target compensation voltage.
[0180] Therefore, in this embodiment, the voltage acquisition module may specifically include multiple voltage processing units. Each voltage processing unit corresponds one-to-one with a circuit board. One end of each voltage processing unit can be connected to the input terminal of a circuit board, while the other end of each voltage processing unit is grounded. Each voltage processing unit can receive the voltage from the input terminal of the corresponding circuit board and adjust the magnitude of the received voltage. Furthermore, as mentioned above, the voltage compensation coefficient of each circuit board is related to the degree of transmission voltage drop generated by the power supply voltage ELVDD received by each circuit board. The larger the transmission voltage drop generated by the power supply voltage ELVDD received by a circuit board compared to the transmission voltage drop generated by the power supply voltage ELVDD received by other circuit boards, the larger the voltage compensation coefficient of that circuit board. Therefore, each voltage processing unit can adjust the input voltage accordingly based on the voltage compensation coefficient of the corresponding circuit board, so that the output voltage is equal to the product of the voltage at the input terminal of the circuit board and the corresponding voltage compensation coefficient.
[0181] Specifically, the voltage processing unit may include a first resistor and a second resistor connected in series at the first connection point. In the series circuit, the current flowing through the first resistor and the current flowing through the second resistor are equal, and the sum of the voltages across the first and second resistors equals the total circuit voltage, which is equal to the voltage at the corresponding circuit board input terminal. It can be understood that the voltage division ratio of the first and second resistors is R1:R2 = U1:U2. Where R1 is the resistance of the first resistor, U1 is the voltage across the first resistor, R2 is the resistance of the second resistor, and U2 is the voltage across the second resistor. The voltage processing unit can divide the voltage at the circuit board input terminal through the voltage division effect of the series-connected first and second resistors, and output the divided voltage at the first connection point. The divided voltage output at the first connection point is the product of the circuit board input terminal voltage and the corresponding voltage compensation coefficient.
[0182] For example, assuming the voltage processing unit receives an input voltage U from the corresponding circuit board, and the circuit board's voltage compensation coefficient is 0.5, this means that after processing the received input voltage U, the voltage processing unit will output a voltage of 0.5U, which is half the input voltage. Based on this voltage compensation coefficient of 0.5, the voltage processing unit can set the values of the first resistor and the second resistor to be equal, so that after the voltage from the circuit board's input flows into the voltage processing unit, the voltage drop across the first and second resistors is equal. It can be understood that the output voltage at the connection point of the first and second resistors is 0.5U. Therefore, the voltage processing unit can determine the values of the first and second resistors based on the corresponding circuit board's voltage compensation coefficient. Specifically, the ratio of the first resistor's value to the second resistor's value can be equal to the corresponding circuit board's voltage compensation coefficient.
[0183] It should be noted that, in the embodiments of this application, the voltage processing unit is responsible for outputting the product of the voltage at the input terminal of the circuit board and the corresponding voltage compensation coefficient, based on the voltage at the input terminal of the circuit board. Therefore, there can be many variations of the voltage processing unit. The above content is only an example and does not constitute a limitation on the embodiments of this application.
[0184] Furthermore, in this embodiment, the voltage acquisition module can add the product of the voltage at each circuit board input terminal and the corresponding voltage compensation coefficient to obtain the target compensation voltage. To this end, the voltage acquisition module also includes a first adder, which is connected to each of the aforementioned voltage processing units and can receive the product of the voltage at each circuit board input terminal output by each voltage processing unit and the corresponding voltage compensation coefficient. It is understood that the first adder can add the product of the voltage at each circuit board input terminal and the corresponding voltage compensation coefficient to obtain the target compensation voltage.
[0185] For example, in the case where the display module includes two circuit boards, the specific structure of the voltage acquisition module in the drive circuit board can be found in [reference needed]. Figure 14 As shown, Figure 14 A schematic diagram of a frame of a driver circuit board provided in an embodiment of this application. Figure 14 The driving circuit board 430 shown includes a voltage acquisition module 431.
[0186] The voltage acquisition module 431 specifically includes a voltage processing unit 4311 and a voltage processing unit 4312. The voltage processing unit 4311 includes a first resistor R1 and a second resistor R2. One end of the first resistor R1 and one end of the second resistor R2 are connected to a first connection point, and the other end of the second resistor R2 is grounded. The first resistor R1 can receive the input voltage Vfb1 of a circuit board corresponding to the voltage processing unit 4311. For example, assuming the circuit board corresponding to the voltage processing unit 4311 is... Figure 10 The circuit board 312 shown indicates that the first resistor R1 can be connected to... Figure 10 Connector 1, as shown, receives the voltage from the input terminal of circuit board 312, i.e., Figure 14 The first resistor R1 receives Vfb1 and can output the voltage after being divided by the first resistor R1 and the second resistor R2 to the first adder OP1 through the first connection point. This voltage is the product of the voltage Vfb1 at the input terminal of the circuit board and the corresponding voltage compensation coefficient.
[0187] Similarly, the voltage processing unit 4312 includes a first resistor R3 and a second resistor R4. One end of the first resistor R3 and one end of the second resistor R4 are connected to a first connection point, and the other end of the second resistor R4 is grounded. The first resistor R3 can receive the input voltage Vfb2 of a circuit board corresponding to the voltage processing unit 4312. For example, assuming that the circuit board corresponding to the voltage processing unit 4312 is... Figure 10 The first resistor R3 can be connected to the drive circuit board 313 shown. Figure 10 Connector 4, as shown, receives the voltage from the input terminal of the driver circuit board 313, i.e., Figure 14 The voltage Vfb2 is shown. After the first resistor R3 receives Vfb2, it can output the voltage divided by the first resistor R3 and the second resistor R4 to the first adder OP1 through the first connection point. This voltage is the product of the voltage Vfb2 at the circuit board input terminal and the corresponding voltage compensation coefficient. The first adder OP1 can add the two input voltages to obtain the target compensation voltage mentioned above.
[0188] In some feasible implementations, the voltage acquisition module may further include a voltage follower. The input of this voltage follower can be connected to the output of the first adder to receive the target compensation voltage output by the first adder. The output of the voltage follower is also connected to its input, thereby stabilizing the received target compensation voltage and ensuring the stability of the target compensation voltage output by the voltage acquisition module.
[0189] For example, in the case where the display module includes two circuit boards, the specific structure of the voltage acquisition module in the drive circuit board can be found in [reference needed]. Figure 14 As shown, Figure 14 The voltage acquisition module 431 shown includes a voltage follower OP2. One input terminal of the voltage follower OP2 is connected to the output terminal of the first adder OP1, and the other input terminal is connected to the output terminal of the voltage follower OP2 itself. The output terminal of the voltage follower OP2 can be connected to the voltage compensation module 432, and can output a stable target compensation voltage to the voltage compensation module 432.
[0190] In some feasible implementations, as described above, the voltage compensation module can acquire the target compensation voltage calculated by the voltage acquisition module, and perform a step of compensating the source drive voltage provided to the display panel based on the target compensation voltage. Specifically, the voltage compensation module can calculate a first gamma voltage and a second gamma voltage for acquiring the source drive voltage based on the target compensation voltage.
[0191] Therefore, in this embodiment, the voltage compensation module may specifically include a third resistor, a fourth resistor, and a fifth resistor connected in series. These three resistors can divide the supply voltage to obtain a first voltage, and then a first gamma voltage can be obtained based on the first voltage and the target compensation voltage.
[0192] For example, such as Figure 14 As shown, Figure 14 The drive circuit board 430 shown includes a voltage compensation module 432.
[0193] The voltage compensation module 432 specifically includes a third resistor R5, a fourth resistor R6, a fifth resistor R7, and a second adder OP3. One end of the third resistor R5 can be connected to a power management circuit to receive the supply voltage VGH provided by the power management circuit. This power management circuit can... Figure 9a and Figure 9b The power management circuit shown is as follows. The other end of the third resistor R5 is connected to one end of the fourth resistor R6, the other end of the fourth resistor R6 is connected to one end of the fifth resistor R7, and the other end of the fifth resistor R7 is grounded. One end of the fourth resistor R6 can be connected to one input terminal of the second adder OP3 to provide a first voltage to the second adder OP3.
[0194] It is understandable that in the series circuit composed of the third resistor R5, the fourth resistor R6, and the fifth resistor R7, the current flowing through each resistor is equal, and the sum of the voltages across each resistor equals the total circuit voltage, which is equal to the supply voltage VGH. It is also understandable that the voltage division ratio of the third resistor R5, the fourth resistor R6, and the fifth resistor R7 is R5:R6:R7 = U5:U6:U7, where U5 is the voltage across the third resistor R5, U6 is the resistance of the fourth resistor R6, and U7 is the voltage across the fifth resistor R7. It is also understandable that due to the resistor voltage division, the aforementioned supply voltage VGH can be obtained by outputting the first voltage after voltage division through one end of the fourth resistor R6. Therefore, the voltage compensation module 432 can determine the specific resistance values of the third resistor R5, the fourth resistor R6, and the fifth resistor R7 based on the magnitude of the supply voltage VGH and the magnitude of the first voltage. It is understood that the specific values of the third resistor R5, the fourth resistor R6, and the fifth resistor R7 can be adjusted according to the magnitude of the first voltage and the supply voltage VGH in the actual application scenario. This application embodiment will not provide specific examples for each of them.
[0195] The other input terminal of the second adder OP3 is connected to the output terminal of the voltage acquisition module 431, and can receive the target compensation voltage output by the voltage acquisition module 431. Furthermore, the second adder OP3 can add the input target compensation voltage and the first voltage output from one end of the fourth resistor R6 to calculate the first gamma voltage VGMP.
[0196] In some feasible implementations, the voltage compensation module in this application embodiment can divide the supply voltage using the third resistor, the fourth resistor and the fifth resistor to obtain a second voltage, and then obtain a second gamma voltage based on the second voltage and the target compensation voltage.
[0197] For example, such as Figure 14 As shown, Figure 14 The drive circuit board 430 shown includes a voltage compensation module 432.
[0198] The voltage compensation module 432 specifically includes a third resistor R5, a fourth resistor R6, a fifth resistor R7, and a second adder OP3. One end of the third resistor R5 can be connected to a power management circuit to receive the supply voltage VGH provided by the power management circuit. This power management circuit can... Figure 9a and Figure 9b The power management circuit shown is as follows. The other end of the third resistor R5 is connected to one end of the fourth resistor R6, the other end of the fourth resistor R6 is connected to one end of the fifth resistor R7, and the other end of the fifth resistor R7 is grounded. The other end of the fourth resistor R6 can be connected to one input terminal of the subtractor OP4 to provide a second voltage to the subtractor OP4.
[0199] It is understandable that in the series circuit composed of the third resistor R5, the fourth resistor R6, and the fifth resistor R7, the current flowing through each resistor is equal, and the sum of the voltages across each resistor equals the total circuit voltage, which is equal to the supply voltage VGH. It is also understandable that the voltage division ratio of the third resistor R5, the fourth resistor R6, and the fifth resistor R7 is R5:R6:R7 = U5:U6:U7, where U5 is the voltage across the third resistor R5, U6 is the resistance of the fourth resistor R6, and U7 is the voltage across the fifth resistor R7. It is also understandable that due to the resistor voltage division, the aforementioned supply voltage VGH can be output as a second voltage through the other end of the fourth resistor R6. Therefore, the voltage compensation module 432 can determine the specific resistance values of the third resistor R5, the fourth resistor R6, and the fifth resistor R7 based on the magnitude of the supply voltage VGH, the first voltage, and the second voltage. It is understood that the specific values of the third resistor R5, the fourth resistor R6, and the fifth resistor R7 can be adjusted according to the magnitude of the first voltage, the second voltage, and the supply voltage VGH in the actual application scenario. Examples of these values will not be provided in this application.
[0200] The other input terminal of the subtractor OP4 is connected to the output terminal of the voltage acquisition module 431, and can receive the target compensation voltage output by the voltage acquisition module 431. Furthermore, the subtractor OP4 can calculate the second gamma voltage VGSP by subtracting the second voltage output from the other end of the fourth resistor R6 based on the target compensation voltage at the input terminal.
[0201] It is understandable that after obtaining the first gamma voltage and the second gamma voltage, the voltage compensation module can determine the corresponding gamma voltage based on the first gamma voltage and the second gamma voltage to the input grayscale value, and perform gamma curve correction to obtain the source drive voltage, thereby compensating the source drive voltage.
[0202] Specifically, the voltage compensation module can transmit the first gamma voltage and the second gamma voltage to the driver chip, for example... Figure 13The driver chip shown is used to determine the maximum gamma voltage value and the minimum gamma voltage value. When the driver chip drives the display panel to emit light, it can obtain a gamma voltage corresponding to each grayscale value based on the first gamma voltage, the second gamma voltage, and the input grayscale value. Furthermore, the driver chip can perform gamma curve adjustment on the gamma voltage to obtain the source drive voltage. The gamma curve maps each gamma voltage to a source drive voltage. Taking a gamma voltage range from the second gamma voltage to the first gamma voltage, and a stored value range of 0 to 1024 as an example, the gamma circuit can determine the source drive voltage corresponding to each node's stored value (0-1024) in the register based on the gamma voltage range. This allows the grayscale value represented by the image data to be converted into the corresponding source drive voltage during image data input; this process is called gamma curve adjustment.
[0203] For example, suppose the voltage compensation module obtains a first gamma voltage of VGMP and a second gamma voltage of VGSP, and sends them to the driver chip. The driver chip's gamma circuit can store various gamma voltages ranging from VGSP to VGMP, as well as stored values corresponding one-to-one between each gamma voltage and 0 to 1024. When a pixel unit on the display panel displays a grayscale value of 100, the voltage compensation module can find the gamma voltage corresponding to the stored value of 100 among the stored values from 0 to 1024, which is Vp1 = 100(VGMP - VGSP) / 1024. Therefore, the value of this gamma voltage Vp1 is related to the range from VGSP to VGMP. Furthermore, when the voltage compensation module performs gamma curve correction based on the first gamma voltage VGMP and the second gamma voltage VGSP, since the first and second gamma voltages obtained by the driver chip have already been compensated and adjusted according to the transmission voltage drop generated by the power supply voltage ELVDD of each circuit board, the driver chip can also compensate the corrected source drive voltage when obtaining the source drive voltage based on the first and second gamma voltages. It can be understood that when the driver circuit board drives the display panel to emit light based on the compensated source drive voltage, it can adjust the brightness of the display panel to meet high brightness requirements and further improve the brightness uniformity of the display panel.
[0204] It should be noted that the implementation principle of gamma curve correction in the embodiments of this application, as well as the specific uses of the first gamma voltage and the second gamma voltage, can be found in the descriptions of gamma encoding, gamma decoding, gamma curve correction, etc. in the prior art. The embodiments of this application will not be described in detail here.
[0205] To facilitate understanding of the specific implementation process of the embodiments of this application, the following content is combined with Figure 10 and Figure 14 To illustrate, when a power chip provides a power supply voltage ELVDD through multiple circuit boards, to compensate for the transmission voltage drop generated when each circuit board provides the ELVDD power supply voltage, one of the driving circuit boards can be equipped with a compensation circuit. This compensation circuit can compensate for the transmission voltage drop generated when the multiple circuit boards provide the ELVDD power supply voltage by compensating for the source drive voltage supplied to the display panel, thereby ensuring high brightness uniformity of the display panel. Specifically, the compensation circuit can include a voltage acquisition module and a voltage compensation module. The voltage acquisition module and voltage compensation module can implement source drive voltage compensation based on the following method flow.
[0206] Step S101: Obtain the current magnitude and equivalent impedance magnitude of each circuit board input terminal.
[0207] As can be understood from the above, the voltage acquisition module can calculate the voltage compensation coefficient for each circuit board by acquiring the magnitude of the current flowing through the input terminals of each circuit board and the equivalent impedance of each circuit board's input terminals. Therefore, the voltage acquisition module can be connected to the input terminals of each circuit board to obtain the current magnitude at each circuit board's input terminals.
[0208] For example, such as Figure 10 As shown, when the input terminal of circuit board 312 is connected to the first flexible circuit board 330 via connector 1, and the first flexible circuit board 330 is connected to the main board via connector 2, the voltage acquisition module can obtain the current magnitude of connector 1 or connector 2, which is the current magnitude of each circuit board. Similarly, the voltage acquisition module can connect to the input terminals of each circuit board to obtain the equivalent impedance of each circuit board's input terminal. For example, when the input terminal of drive circuit board 313 is connected to the second flexible circuit board 340 via connector 4, and the input terminal of circuit board 312 is connected to the first flexible circuit board 330 via connector 1, the voltage acquisition module can obtain the equivalent impedance of connector 4 and the equivalent impedance of connector 1, which is the equivalent impedance of each circuit board's input terminal.
[0209] Step S102: Obtain the voltage compensation coefficient.
[0210] Furthermore, the voltage acquisition module can calculate the target compensation coefficient for each circuit board based on the current magnitude and equivalent impedance of each circuit board's input terminal. For example, assuming the voltage acquisition module acquires a current magnitude of i1 and an equivalent impedance of Rx1 at the input terminal of circuit board 312, and acquires a current magnitude of i2 and an equivalent impedance of Rx2 at the input terminal of drive circuit board 313, then the target compensation coefficient for circuit board 312 is (i1×Rx1) / (i1×Rx1+i2×Rx2), and the target compensation coefficient for drive circuit board 313 is (i2×Rx2) / (i1×Rx1+i2×Rx2). The above are merely examples and do not constitute a limitation on the embodiments of this application.
[0211] It should be noted that after obtaining the voltage compensation coefficients of each circuit board, the voltage acquisition module can adjust the resistance values of the first and second resistors in the corresponding voltage processing unit based on these coefficients, so that the ratio of the first resistor value to the second resistor value equals the voltage compensation coefficient of the corresponding circuit board. For example, suppose... Figure 14 The first resistor R1 shown is connected Figure 10 As shown in connector 1, the first resistor R1 can receive the voltage Vfb1 from the input terminal of circuit board 312. When the voltage compensation coefficient of circuit board 312 is 0.4, the voltage acquisition module 431 can adjust the resistance ratio of the first resistor R1 to the second resistor R2 to be equal to 0.4, thereby completing the parameter setting of the first resistor R1 and the second resistor R2. Similarly, the voltage acquisition module 431 can adjust and set the parameters of the first resistor R3 and the second resistor R4.
[0212] Step S103: Obtain the voltage magnitude and target compensation voltage at the input terminals of each circuit board.
[0213] Understandably, after adjusting the parameter settings of the first and second resistors of each voltage processing unit, the voltage acquisition module can obtain the voltage magnitude at the input terminals of each circuit board in order to calculate the target compensation voltage.
[0214] For example, such as Figure 14 As shown, assume the first resistor R1 is connected... Figure 10 As shown in connector 1, the first resistor R1 can obtain the voltage Vfb1 at the input terminal of circuit board 312; and the first resistor R3 is connected to... Figure 10As shown in connector 4, the first resistor R3 can obtain the voltage Vfb2 from the input terminal of the driver circuit board 313. Furthermore, when the voltage compensation coefficient of the circuit board 312 is 0.4, the resistance ratio of the first resistor R1 to the second resistor R2 is equal to 0.4, so the voltage output after voltage division by the first resistor R1 and the second resistor R2 is equal to 0.4Vfb1. Similarly, when the voltage compensation coefficient of the driver circuit board 313 is 0.6, the resistance ratio of the first resistor R3 to the second resistor R4 is equal to 0.6, so the voltage output after voltage division by the first resistor R3 and the second resistor R4 is equal to 0.6Vfb2.
[0215] Furthermore, Figure 14 The first adder OP1 shown can add the voltages 0.6Vfb2 and 0.4Vfb1 obtained by the above resistor voltage division to obtain the target compensation voltage Vfb.
[0216] In some feasible implementations, such as Figure 14 As shown, the voltage acquisition module 431 may also include a voltage follower OP2, which can stabilize the target compensation voltage Vfb output by the first adder.
[0217] Step S104: Compensate the source drive voltage based on the target compensation voltage.
[0218] It is understandable that after obtaining the target compensation voltage, the voltage acquisition module can transmit this target compensation voltage to the voltage compensation module, which can then compensate the source drive voltage supplied to the display panel based on this target compensation voltage. As described above, the luminous intensity of each sub-pixel in the display panel is related to the magnitude of the source drive voltage supplied to that pixel unit and the power supply voltage. Therefore, in different application scenarios, the voltage compensation module can determine the compensation amount for the source drive voltage based on the relationship between the source drive voltage and the power supply voltage when the sub-pixel emits light, and based on the obtained target compensation voltage. For example, the larger the target compensation voltage obtained by the voltage compensation module, the larger the compensated source drive voltage needs to be, so that when the driving circuit board drives the display panel to emit light based on the compensated source drive voltage, it can adjust the luminous brightness of the display panel, ensuring that the luminous brightness of the display panel meets the high-brightness requirements and further improving the brightness uniformity of the display panel.
[0219] In some feasible approaches, for example, the voltage compensation module can obtain a first gamma voltage and a second gamma voltage based on a target compensation voltage, and compensate the source drive voltage according to the first gamma voltage and the second gamma voltage. Specifically, such as... Figure 14As shown, one end of the fourth resistor R6 in the voltage compensation module 432 can output a first voltage to the second adder OP3. The second adder OP3 can add the input target compensation voltage and the first voltage to calculate the first gamma voltage. The magnitude of the first voltage can be equal to the difference between the first gamma voltage and the power supply voltage ELVDD when the display panel is emitting light; in practical applications, this can be determined based on experimental data. After determining the magnitude of the first voltage, the voltage compensation module can pre-set the third resistor R5, the fourth resistor R6, and the fifth resistor R7 so that one end of the fourth resistor R6 outputs a first voltage of the corresponding magnitude.
[0220] Similarly, Figure 14 The other end of the fourth resistor R6 shown can output a second voltage to the subtractor OP4. The subtractor OP4 subtracts the input target compensation voltage and the second voltage to calculate the second gamma voltage. The magnitude of the second voltage can be equal to the difference between the second gamma voltage and the power supply voltage ELVDD when the display panel is emitting light; in practical applications, this can be determined based on experimental data. After determining the magnitude of the second voltage, the voltage compensation module can pre-set the third resistor R5, the fourth resistor R6, and the fifth resistor R7 so that the other end of the fourth resistor R6 outputs a second voltage of the corresponding magnitude.
[0221] It is understandable that after obtaining the first gamma voltage and the second gamma voltage, the voltage compensation module can transmit the first gamma voltage and the second gamma voltage to the driver chip. Alternatively, when the voltage compensation module is integrated into the driver chip, the voltage acquisition module can transmit the voltage to the driver chip when acquiring the target compensation voltage, and then the voltage compensation module in the driver chip can acquire the first gamma voltage and the second gamma voltage.
[0222] Furthermore, as described above, the driver chip can use the first gamma voltage as the maximum value and the second gamma voltage as the minimum value. When the driver chip drives the display panel to emit light, it can obtain a gamma voltage corresponding to each grayscale value based on the first gamma voltage, the second gamma voltage, and the input grayscale value. Further, the driver chip can adjust the gamma curve of this gamma voltage to obtain the source drive voltage. Simultaneously, since the first and second gamma voltages obtained by the driver chip have been compensated for according to the transmission voltage drop generated by the power supply voltage ELVDD of each circuit board, the driver chip can also compensate for the corrected source drive voltage when obtaining it based on the first and second gamma voltages. It can be understood that when the driver circuit board drives the display panel to emit light based on the compensated source drive voltage, it can adjust the brightness of the display panel to meet high brightness requirements and further improve the brightness uniformity of the display panel.
[0223] In summary, the display module provided in this application, by setting multiple circuit boards to provide power voltage to multiple sides of the display panel, can avoid the problem of reduced display panel brightness caused by transmission voltage drop when only one side of the display panel is supplied with power voltage. Simultaneously, for large-size display panels, the display module's provision of power voltage to the display panel through multiple circuit boards can also improve the brightness uniformity of the display panel and ensure brightness uniformity when the display panel is at high brightness. Furthermore, since the transmission voltage drop generated by the power voltage provided by each circuit board in the multiple circuit boards is different, the display module in this application can obtain the equivalent impedance of the power chip transmitting power voltage to each circuit board, the voltage magnitude at the input terminal of each circuit board, and the current flowing through them through the driving circuit board in the multiple circuit boards, and calculate the target compensation voltage. The power supply voltage is understood to be related to the source driving voltage and the power supply voltage provided to the display module, since the luminous brightness of each pixel unit in the display panel is related to the source driving voltage and the power supply voltage provided to the display module. Therefore, when the display module compensates the source driving voltage according to the target compensation voltage, it can compensate for the transmission voltage drop generated by the power supply voltage. Specifically, the display module can obtain a compensated first gamma voltage and a second gamma voltage based on the target compensation voltage, and then perform gamma curve adjustment according to the compensated first gamma voltage and second gamma voltage to obtain a compensated source drive voltage. It can be understood that, with power supply voltages provided to the display panel through multiple circuit boards, the display module can drive the display panel to display based on the compensated source drive voltage, adjust the brightness of the display panel to meet high brightness requirements, and further improve the brightness uniformity of the display panel, ensuring that the display panel can meet high brightness requirements.
[0224] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0225] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A display module, characterized in that, The display module includes a display panel and at least two circuit boards, each of the at least two circuit boards being connected to the display panel; The input terminal of each circuit board is used to receive the power supply voltage provided by the power chip, and the output terminal of each circuit board is used to provide the power supply voltage to the display panel; The at least two circuit boards include a driving circuit board, which is used to obtain a target compensation voltage based on the voltage magnitude at the input terminal of each circuit board, the equivalent impedance of the power chip when transmitting the power supply voltage to the input terminal of each circuit board, and the current magnitude flowing through the input terminal of each circuit board. The driving circuit board is used to compensate the source driving voltage supplied to the display panel based on the target compensation voltage.
2. The display module according to claim 1, characterized in that, The driving circuit board includes a voltage acquisition module, which is used for: Obtain the voltage magnitude of the power supply terminal of the power chip, which is used to output the power supply voltage to the input terminal of each circuit board; The voltage at the power supply terminal of the power chip, the equivalent impedance of the power chip when transmitting the power supply voltage to the input terminals of each circuit board, and the current flowing through the input terminals of each circuit board are used to obtain the voltage at the input terminals of each circuit board.
3. The display module according to claim 1 or 2, characterized in that, The driving circuit board includes a voltage acquisition module, which is used for: The equivalent impedance of the power chip when transmitting the power voltage to the input terminals of each circuit board and the current flowing through the input terminals of each circuit board are obtained, and the voltage compensation coefficient of each circuit board is obtained based on the equivalent impedance of the power chip when transmitting the power voltage to the input terminals of each circuit board and the current flowing through the input terminals of each circuit board. The target compensation voltage is obtained based on the voltage magnitude at the input terminals of each circuit board and the voltage compensation coefficient of each circuit board.
4. The display module according to any one of claims 1-3, characterized in that, The drive circuit board includes a voltage compensation module, which is used for: A first gamma voltage is obtained based on the target compensation voltage and the first voltage. The first gamma voltage is the gamma voltage when the display brightness of the display panel is greater than or equal to a first threshold. A second gamma voltage is obtained based on the target compensation voltage and the second voltage. The second gamma voltage is the gamma voltage when the display brightness of the display panel is less than or equal to a second threshold. The gamma curve is adjusted based on the first gamma voltage and the second gamma voltage to obtain the compensated source drive voltage.
5. The display module according to claim 2 or 3, characterized in that, The voltage acquisition module includes multiple voltage processing units and a first adder. One end of each voltage processing unit is used to receive the voltage of an input terminal of the circuit board, and the other end of the voltage processing unit is grounded. Each voltage processing unit includes a first resistor and a second resistor connected in series at a first connection point. The first adder is connected to the first connection point of each voltage processing unit. The voltage processing unit is used to divide the voltage received at the input terminal of the circuit board based on the first resistor and the second resistor, and transmit the initial compensation voltage obtained by voltage division to the first adder through the first connection point. The first adder is used to obtain the target compensation voltage based on the initial compensation voltage received from the output of each of the voltage processing units.
6. The display module according to claim 5, characterized in that, The voltage acquisition module further includes a voltage follower, the input of which is connected to the first adder, the output of which is connected to the voltage compensation module, and the output of which is also connected to the input of the voltage follower.
7. The display module according to claim 4, characterized in that, The voltage compensation module includes a second adder, a third resistor, a fourth resistor, and a fifth resistor connected in series. One end of the third resistor is used to receive the supply voltage, and the other end of the third resistor is connected to one end of the fifth resistor through the fourth resistor. The other end of the fifth resistor is grounded. The second adder is connected to the other end of the third resistor and is used to obtain the target compensation voltage. The third resistor, the fourth resistor, and the fifth resistor are used to divide the supply voltage and transmit the first voltage obtained by voltage division to the second adder through the other end of the third resistor; The second adder is used to obtain the first gamma voltage based on the received target compensation voltage and the first voltage.
8. The display module according to claim 4, characterized in that, The voltage compensation module further includes a subtractor, a third resistor, a fourth resistor, and a fifth resistor connected in series. One end of the third resistor is used to receive the supply voltage, and the other end of the third resistor is connected to one end of the fifth resistor through the fourth resistor. The other end of the fifth resistor is grounded, and the subtractor is also connected to one end of the fifth resistor. The subtractor is used to obtain the target compensation voltage. The third resistor, the fourth resistor, and the fifth resistor are used to divide the supply voltage, and the second voltage obtained by voltage division is transmitted to the subtractor through one end of the fifth resistor; The subtractor is used to obtain the second gamma voltage based on the received target compensation voltage and the second voltage.
9. An electronic device, characterized in that, The electronic device includes a power chip, a mid-frame, and a display module as described in any one of claims 1-8, wherein the display module is fixed to the mid-frame; The power chips are connected to multiple circuit boards of the display panel.
10. The electronic device according to claim 9, characterized in that, The display module includes two circuit boards, one of which is a driver circuit board and the other is a power supply circuit board. The electronic device also includes a first flexible circuit board and a second flexible circuit board. The input terminal of the driver circuit board is connected to the first power terminal of the power chip through the first flexible circuit board, and the input terminal of the power supply circuit board is connected to the second power terminal of the power chip through the second flexible circuit board. The mid-frame includes a mid-plate and a frame, with the frame surrounding the mid-plate. The display module, the power chip, and the first flexible circuit board and the second flexible circuit board are respectively located on one side of the mid-plate. The first flexible circuit board is used to acquire the power supply voltage provided by the power chip and provide it to the drive circuit board; The second flexible circuit board is used to acquire the power supply voltage provided by the power chip and provide it to the power supply circuit board.
11. The electronic device according to claim 10, characterized in that, It also includes a motherboard, on which the power chip is mounted; The display module is located on one side of the middle plate, and the motherboard, the first flexible circuit board and the second flexible circuit board are located on the other side of the middle plate opposite to the display panel; The middle plate has through holes, through which a portion of the first flexible circuit board passes and connects to the driving circuit board of the display module, and through which a portion of the second flexible circuit board passes and connects to the power supply circuit board of the display module.
12. The electronic device according to any one of claims 9-11, characterized in that, It also includes a hinge, and the number of middle frames is at least two. The two middle frames are respectively disposed on both sides of the hinge, and the two middle frames are rotatably engaged through the hinge. The display module is disposed on the at least two middle frames and the hinge; the motherboard is disposed within one of the middle frames.