Liquid-cooled heat dissipation device

Abstract

The invention relates to a liquid-cooled heat dissipation device, which comprises a base, a heat absorption structure and a liquid driving mechanism, and is characterized in that the base is provided with an accommodating space, a heat exchange chamber and a first pipe body; the heat absorption structure is connected with the base, located in the heat exchange cavity and provided with an abutting plane. The liquid driving mechanism is connected with the base, located in the containing space and comprises a shell and a water pump, the shell comprises a containing cavity, a second pipe body and a third pipe body, the third pipe body is coupled with the base and communicated with the heat exchange cavity, and the water pump is arranged in the containing cavity and comprises an impeller, a rotor and a shaft rod. The middle shaft sleeve and the impeller are integrally formed and provided with an open hole for conveying cooling liquid in and out, and the shaft rod is connected with the middle shaft sleeve in a penetrating mode and provided with an axis parallel to the abutting plane. Therefore, not only can the service life of the whole device be prolonged, but also the temperature rise of the shaft rod in the operation process can be reduced.

Description

Technical Field

[0001] This application relates to the technology of a heat dissipation device, and more particularly to a liquid-cooled heat dissipation device. Background Technology

[0002] As the instruction cycles of components such as processors inside electronic products continue to increase, the heat they generate also increases, making it impossible for ordinary air-cooled heat dissipation devices to meet current heat dissipation requirements. It is necessary to use liquid-cooled heat dissipation devices with water-cooling circulation to effectively dissipate heat from the aforementioned electronic heat-generating components.

[0003] While existing liquid-cooled heat dissipation devices have solved most of the problems of air-cooled heat dissipation devices and can significantly improve the heat dissipation efficiency, there are still problems that need to be improved, such as short service life, shaft overheating, liquid leakage, poor airtightness, and poor exhaust.

[0004] Therefore, overcoming the problems of service life, shaft overheating, liquid leakage, airtightness and exhaust of the aforementioned device is the technical challenge that the applicant needs to solve. Summary of the Invention

[0005] One objective of this application is to provide a liquid-cooled heat dissipation device that can not only extend the service life of the overall device, but also reduce the temperature rise of the shaft during operation.

[0006] To achieve the above objectives, this application provides a liquid-cooled heat dissipation device, including a base, a heat-absorbing structure, and a liquid driving mechanism. The base has an accommodating space, a heat exchange chamber, and a first tube communicating with the heat exchange chamber. The heat-absorbing structure is connected to the base and located in the heat exchange chamber, and has a contacting plane. The liquid driving mechanism is connected to the base and located in the accommodating space. The liquid driving mechanism includes a housing and a water pump. The housing includes a cavity, a second tube communicating with the cavity, and a third tube. The third tube is coupled to the base and communicates with the heat exchange chamber. The water pump is installed in the cavity and includes an impeller, a rotor, and a shaft. The rotor has an intermediate bushing, which is integrally formed with the impeller. Multiple openings for coolant to enter and exit are provided around the intermediate bushing. The shaft passes through the intermediate bushing and is formed in the cavity. The shaft has a centerline, which is parallel to the contacting plane.

[0007] In one embodiment, a sealing assembly is also included. The base is provided with a water supply pipe communicating with the heat exchange chamber. An annular groove is provided around the water supply pipe. The sealing assembly is disposed in the annular groove and clamped between the water supply pipe and the third pipe body.

[0008] In one embodiment, the sealing assembly includes a base gasket and an inner and outer ring extending from the base gasket, and a third tube is covered by the base gasket, the inner ring, and the outer ring.

[0009] In one embodiment, at least one inner water-stop ring is provided on the side of the inner ring facing away from the outer ring.

[0010] In one embodiment, at least one outer water-stop ring is provided on the side of the outer ring facing away from the inner ring.

[0011] In one embodiment, a slot is provided on the outer side of the base to provide a mounting bracket for insertion.

[0012] In one embodiment, the water supply pipe and the heat absorption structure are connected by a water supply channel, which is configured perpendicular to the contact plane.

[0013] In one embodiment, the housing further includes a shaft support formed in a third tube.

[0014] In one embodiment, the liquid drive mechanism further includes a leak-proof ring, the housing has an internal thread, the water pump has an external thread, the leak-proof ring is clamped between the housing and the water pump, and the external thread corresponds to the internal thread screw connection.

[0015] In one embodiment, the heat-absorbing structure includes a heat-conducting plate and an inner cover covering the heat-conducting plate. The heat-conducting plate is provided with a plurality of heat dissipation fins arranged at intervals, and the inner cover is provided with an opening communicating with a water supply pipe.

[0016] This application also has the following advantages: it provides excellent airtightness and prevents liquid leakage, while facilitating the discharge of internal gases. The configuration of the various components results in a more compact overall structure and higher heat dissipation efficiency. The integral construction of the first tube and base, and the integral construction of the second tube and shell, significantly reduces liquid leakage. Attached Figure Description

[0017] Figure 1 This is an exploded view of the liquid-cooled heat dissipation device of this application.

[0018] Figure 2 This is an external view of the liquid-cooled heat dissipation device assembly of this application.

[0019] Figure 3 This is an exploded view of the liquid drive mechanism of this application.

[0020] Figure 4 This is a cross-sectional view of the liquid-cooled heat dissipation device assembly of this application.

[0021] Figure 5 This is a cross-sectional view of the liquid-cooled heat dissipation device of this application from another direction.

[0022] Figure 6 This is a schematic diagram of the liquid cooling heat dissipation device of this application applied to a motherboard assembly.

[0023] Figure 7This is a schematic diagram of the liquid-cooled heat dissipation device of this application applied to a liquid cooling system assembly.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1A: Liquid-cooled heat dissipation device;

[0026] 10A: Base;

[0027] 11: Storage space;

[0028] 12: Heat exchange chamber;

[0029] 13: The first tube body;

[0030] 14: Water supply pipe;

[0031] 15: Annular groove;

[0032] 16: Stud;

[0033] 17: Slot;

[0034] 18: Fixture;

[0035] 19: Water conveyance channel;

[0036] 20: Heat-absorbing structure;

[0037] 21: Heat-conducting plate;

[0038] 211: Heat dissipation fins;

[0039] 22: Inner cover;

[0040] 221: Opening;

[0041] 30: Liquid-driven mechanism;

[0042] 31: Shell;

[0043] 311: Cavity;

[0044] 312: Second tube body;

[0045] 313: The third tube body;

[0046] 314: Protruding ear;

[0047] 315: Perforation;

[0048] 316: Internal thread;

[0049] 317: Shaft support;

[0050] 32: Water pump;

[0051] 321: Impeller;

[0052] 322: Rotor;

[0053] 3221: Intermediate bushing;

[0054] 3222: Opening;

[0055] 323: Stator;

[0056] 324: Shaft;

[0057] 325: External thread;

[0058] 33: Screw fastening assembly;

[0059] 34: Leak-proof ring;

[0060] 40: Sealing assembly;

[0061] 41: Base pad;

[0062] 42: Inner Ring Road;

[0063] 421: Inner water-stop ring;

[0064] 43: Outer Ring Road;

[0065] 431: Outer water-stop ring;

[0066] 60: First connector;

[0067] 70: Second connector;

[0068] L: Centerline;

[0069] PL: Surface against;

[0070] 8: Motherboard;

[0071] 9: Liquid cooling system;

[0072] 91: Liquid cooling radiator;

[0073] 92: Infusion tube. Detailed Implementation

[0074] The detailed description and technical content of this application are explained below with reference to the accompanying drawings. However, the accompanying drawings are provided for reference and illustration only and are not intended to limit this application.

[0075] Please see Figures 1 to 5 As shown, this application provides a liquid-cooled heat dissipation device. The liquid-cooled heat dissipation device 1A in this embodiment mainly includes a base 10A, a heat absorption structure 20, and a liquid driving mechanism 30.

[0076] The base 10A is generally L-shaped and has a accommodating space 11, a heat exchange chamber 12, and a first pipe 13. The accommodating space 11 is formed in the upper part of the base 10A, the heat exchange chamber 12 is formed in the lower part of the base 10A, and the first pipe 13 is connected to the heat exchange chamber 12. The first pipe 13 and the base 10A are integrally formed. A water supply pipe 14 connected to the heat exchange chamber 12 is provided on the side of the accommodating space 11 of the base 10A, and an annular groove 15 is provided around the water supply pipe 14.

[0077] The heat-absorbing structure 20 is connected to the base 10A and located within the heat exchange chamber 12. The heat-absorbing structure 20 mainly includes a heat-conducting plate 21 and an inner cover 22. The heat-conducting plate 21 can be made of materials with good thermal conductivity, such as copper, aluminum, magnesium, or their alloys, and has multiple heat dissipation fins 211 arranged at intervals on its inner side (see...). Figure 4 As shown, the outer side of the heat-conducting plate 21 has an abutting plane PL for attaching and contacting the heat source. The inner cover 32 is a cover above each heat dissipation fin 211, and has an opening 221 that connects to the aforementioned water pipe 14.

[0078] The liquid drive mechanism 30 is connected to the base 10A and located within the accommodating space 11. The liquid drive mechanism 30 mainly includes a housing 31 and a water pump 32. The housing 31 includes a cavity 311, a second tube 312 communicating with the cavity 311, and a third tube 313 communicating with the cavity 311. The second tube 312 is integrally formed with the housing 31. The water pump 32 is installed in the cavity 311 and has an axis L. The axis L is parallel to the aforementioned abutment plane PL. The third tube 313 is located in the annular groove 15 and communicates with the water supply pipe 14.

[0079] The liquid drive mechanism 30 is connected to the base 10 and located within the accommodating space 11. The liquid drive mechanism 30 mainly includes a housing 31 and a water pump 32. The housing 31 includes a cavity 311, a second pipe 312 communicating with the cavity 311, and a third pipe 313 communicating with the cavity 311. The second pipe 312 and the housing 31 are integrally formed. The water pump 32 is installed within the cavity 311, and the third pipe 313 is located within the annular groove 15 and communicates with the water supply pipe 14. The water pump 32 includes an impeller 321, a rotor 322, a stator 323, and a shaft 324. The rotor 322 and the impeller 321 are located inside the cavity 311, while the stator 323 is located inside and outside the cavity 311. The rotor 322 has an intermediate bushing 3221, which is integrally formed with the impeller 321. Multiple openings 3222 (e.g., ...) are provided around the intermediate bushing 3221 for the inlet and outlet of coolant. Figure 4 and 6As shown, shaft 324 passes through intermediate bushing 3221, both of which are made of ceramic material. This ceramic material possesses high heat resistance and wear resistance, thus extending the service life of the water pump 32. The stator 323 is configured corresponding to the rotor 322 and mainly consists of circuit boards, silicon steel sheets, and winding assemblies. Since this part of the structure is existing technology, it will not be described in detail.

[0080] In one embodiment, the liquid-cooled heat dissipation device 1A further includes a sealing component 40, which is disposed in the annular groove 15 and clamped between the water supply pipe 14 and the third pipe body 313. After the sealing component 40 is clamped by the third water pipe 313 and the water supply pipe 14, due to the tolerance size fit, the third water pipe 313 can be tightly fitted onto the water supply pipe 14 by means of the sealing component 40 being disposed and partially deformed.

[0081] In one embodiment, the sealing assembly 40 mainly includes a base gasket 41 and an inner ring 42 and an outer ring 43 extending from the base gasket 41, wherein the base gasket 41, the inner ring 42, and the outer ring 43 are fitted over the end of the aforementioned third tube 313. The longitudinal height of the inner ring 42 is greater than the longitudinal height of the outer ring 43, resulting in a better tight fit and improved leak-proof performance (due to increased resistance to liquid creep). Furthermore, at least one inner water-stop ring 421 is provided on the surface of the inner ring 42 facing away from the outer ring 43, and at least one outer water-stop ring 431 is provided on the surface of the outer ring 43 facing away from the inner ring 42. Due to the structural design of the sealing assembly 40, installation can be performed by direct insertion, making the connection simpler and easier, and superior to traditional clamping or screwing methods.

[0082] In one embodiment, the first pipe 13 can be an inlet pipe or an outlet pipe, depending on the rotation direction of the water pump 32. Similarly, the second pipe 312 can also be an inlet pipe or an outlet pipe, with its flow direction opposite to that of the first pipe 13.

[0083] In one embodiment, the accommodating space 11 of the base 10A is provided with a plurality of studs 16, the housing 31 is generally cylindrical, and a plurality of lugs 314 extend from the periphery of the housing 31. Each lug 314 is provided with a through hole 315. The housing 31 is fixed to the base 10A by a plurality of fastening components 33 passing through the aforementioned through holes 315 and studs 16 respectively.

[0084] In one embodiment, a slot 17 is provided in the middle region of the outer side of the base 10A to provide a mounting bracket 18 for insertion connection.

[0085] In one embodiment, the water supply pipe 14 and the heat absorption structure 20 are connected by a water supply channel 19, wherein the water supply channel 19 is configured perpendicular to the aforementioned abutment plane PL.

[0086] In one embodiment, the housing 31 is provided with an internal thread 316, and the water pump 32 is provided with an external thread 325. The external thread 325 is screwed onto the internal thread 316 to fix the water pump 32 onto the housing 31.

[0087] In one embodiment, the liquid drive mechanism 30 further includes a leak-proof ring 34, which is clamped between the housing 31 and the water pump 32.

[0088] In one embodiment, the housing 31 further includes a shaft support 317, which is formed in the aforementioned third tube 313.

[0089] In one embodiment, the liquid-cooled heat dissipation device 1A of this application further includes a first connector 60 and a second connector 70. The first connector 60 is connected and conductive to the aforementioned first tube 13, and the second connector 70 is connected and conductive to the aforementioned second tube 312.

[0090] Please see Figure 6 As shown, the liquid-cooled heat dissipation device 1A of this application can be applied to the motherboard 8, which has multiple heat sources (not shown in the figure). During assembly, the contact surface PL of the heat conduction plate 21 is attached to the heat source and fixed to the motherboard 8 by means of bolts or other locking components through the fixing bracket 18. During use, since the axis L of the water pump 32 is vertical to the ground or horizontal plane, it is conducive to the discharge of internal gas.

[0091] Please see Figure 7 As shown, the liquid-cooled heat dissipation device 1 of this application can be used in combination with the liquid cooling system 9. The liquid cooling system 9 mainly includes a liquid cooling radiator 91 and two liquid inlet pipes 92. The liquid inlet pipe 92 is connected to the liquid cooling radiator 91 by connecting to the first connector 60, and the other liquid inlet pipe 92 is connected to the liquid cooling radiator 91 by connecting to the second connector 70. Together, they form a circulation loop for heat dissipation.

[0092] The above description is only a preferred embodiment of this application and is not intended to limit the patent scope of this application. Other equivalent changes that utilize the patent spirit of this application should all fall within the patent scope of this application.

Claims

1. A liquid-cooled heat dissipation device, characterized in that, include: The base has an accommodating space, a heat exchange chamber, and a first tube body communicating with the heat exchange chamber; A heat-absorbing structure, connected to the base and located in the heat exchange chamber, the heat-absorbing structure having a contacting plane; and A liquid-driven mechanism is connected to the base and located in the accommodating space. The liquid-driven mechanism includes a housing and a water pump. The housing includes a cavity, a second tube and a third tube communicating with the cavity. The third tube is coupled to the base and communicates with the heat exchange chamber. The water pump is installed in the cavity and includes an impeller, a rotor and a shaft. The rotor has an intermediate bushing. The intermediate bushing and the impeller are integrally formed. Multiple openings for the inlet and outlet of coolant are provided around the intermediate bushing. The shaft passes through the intermediate bushing and is formed in the cavity. The shaft has an axis line that is parallel to the abutment plane.

2. The liquid-cooled heat dissipation device as described in claim 1, characterized in that, It also includes a sealing assembly. The base is provided with a water supply pipe that communicates with the heat exchange chamber. An annular groove is provided around the water supply pipe. The sealing assembly is disposed in the annular groove and is clamped between the water supply pipe and the third pipe body.

3. The liquid-cooled heat dissipation device as described in claim 2, characterized in that, The sealing assembly includes a base gasket and an inner ring and an outer ring extending from the base gasket, and the third tube is covered by the base gasket, the inner ring and the outer ring.

4. The liquid-cooled heat dissipation device as described in claim 3, characterized in that, The inner ring is provided with at least one inner water-stop ring on the side facing away from the outer ring.

5. The liquid-cooled heat dissipation device as described in claim 3 or 4, characterized in that, The outer ring is provided with at least one outer water-stop ring on the side opposite to the inner ring.

6. The liquid-cooled heat dissipation device as described in claim 1, characterized in that, The base has a slot on its outer side to provide a mounting bracket for connection.

7. The liquid-cooled heat dissipation device as described in claim 6, characterized in that, The water supply pipe and the heat absorption structure are connected by a water supply channel, which is configured perpendicular to the contact plane.

8. The liquid-cooled heat dissipation device as described in claim 1, characterized in that, The housing also includes a shaft support formed within the third tube.

9. The liquid-cooled heat dissipation device as described in claim 1, characterized in that, The liquid drive mechanism also includes a leak-proof ring. The housing has an internal thread, the water pump has an external thread, and the leak-proof ring is clamped between the housing and the water pump. The external thread corresponds to the internal thread and is screwed in.

10. The liquid-cooled heat dissipation device as described in claim 1, characterized in that, The heat-absorbing structure includes a heat-conducting plate and an inner cover that covers the heat-conducting plate. The heat-conducting plate is provided with a plurality of heat dissipation fins arranged at intervals, and the inner cover is provided with an opening that connects to the water supply pipe.

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