Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device, the display panel comprises a substrate, a plurality of connection bonding pads and a plurality of virtual bonding pads, and the substrate comprises a display area and a non-display area arranged around the display area; the plurality of connecting bonding pads are distributed on one side of the substrate at intervals; orthographic projections of the plurality of connecting bonding pads on the substrate are located in the display area; the plurality of virtual bonding pads are distributed on one side of the substrate at intervals; orthographic projections of the plurality of virtual bonding pads on the substrate are located in the non-display area, and the plurality of virtual bonding pads and the plurality of connecting bonding pads are arranged on the same layer. Therefore, the probability that metal residues exist on the substrate and the position of the connecting bonding pad deviates can be reduced, and the reliability of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to display panels, methods for manufacturing the same, and display devices. Background Technology

[0002] Micro-LED (micro-light-emitting diode display) and Mini-LED (sub-millimeter light-emitting diode) are next-generation advanced display technologies with significant advantages in brightness, contrast, color reproduction, and lifespan, and are expected to be applied in cutting-edge fields such as transparent displays, AR / VR displays, and large-screen displays.

[0003] In related technologies, when a metal layer, such as a eutectic layer, is deposited on a substrate, the eutectic layer is prone to wrinkling due to stress, resulting in metal residue on the substrate and displacement of the connection pads in the display area of ​​the substrate, which affects the reliability of the display panel. Summary of the Invention

[0004] Based on this, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device to improve reliability.

[0005] In a first aspect, embodiments of this application provide a display panel, including:

[0006] A substrate, comprising a display area and a non-display area disposed around the display area;

[0007] Multiple connection pads are spaced apart on one side of the substrate; the orthographic projection of the multiple connection pads on the substrate is located in the display area;

[0008] Multiple virtual pads are spaced apart on one side of the substrate; the orthographic projection of the multiple virtual pads on the substrate is located in the non-display area, and the multiple virtual pads are arranged on the same layer as the multiple connecting pads.

[0009] Secondly, embodiments of this application provide a method for manufacturing a display panel, comprising:

[0010] A substrate is provided, the substrate including a display area and a non-display area disposed around the display area;

[0011] A mask layer is formed on one side of the substrate, and the orthographic projection of the mask layer on the substrate covers the display area and the non-display area;

[0012] A plurality of first isolation openings and a plurality of second isolation openings are formed on the mask layer; the orthographic projection of the plurality of first isolation openings on the substrate is located in the display area; the orthographic projection of the plurality of second isolation openings on the substrate is located in the non-display area.

[0013] A pad film layer is formed on the side of the mask layer away from the substrate; the pad film layer includes a plurality of connecting pads corresponding to the plurality of first partition openings, a plurality of virtual pads corresponding to the plurality of second partition openings, and a redundant portion on the surface of the mask layer away from the substrate; the connecting pads and the redundant portion are spaced apart; the virtual pads and the redundant portion are spaced apart.

[0014] Remove the mask layer and the redundant portion.

[0015] Thirdly, embodiments of this application also provide a display device, which includes the display panel provided in the first aspect or a display panel prepared using the preparation method of the second aspect.

[0016] The display panel provided in this application embodiment has multiple connecting pads spaced apart on one side of the substrate, with the orthographic projection of the multiple connecting pads on the substrate located in the display area. Multiple virtual pads are also spaced apart on one side of the substrate, with the orthographic projection of the multiple virtual pads on the substrate located in the non-display area. The multiple virtual pads are disposed in the same layer as the multiple connecting pads. In other words, when depositing the pad film layer based on the mask layer, the pad film layer is divided into connecting pads located on one side of the substrate, virtual pads located on one side of the substrate, and redundant portions located on the mask layer away from the substrate surface. This can greatly reduce the area and stress of the redundant portions, thereby reducing the probability of wrinkles in the redundant portions and the probability of wrinkles, deformation, and cracks in the mask layer caused by wrinkles in the redundant portions. This, in turn, reduces the probability of metal residue on the substrate and positional displacement of the connecting pads, thus improving the reliability of the display panel. Attached Figure Description

[0017] Figure 1 This is a plan view of a display panel in some embodiments of this application.

[0018] Figure 2 This is a top view of a display panel in some embodiments of this application.

[0019] Figure 3 This is a top view of the first partition of the first area in the non-display area of ​​the display panel in some embodiments of this application.

[0020] Figure 4 This is a top view of the second area of ​​the non-display area of ​​the display panel in some embodiments of this application.

[0021] Figure 5 This is a top view of the third partition of the first area in the non-display area of ​​the display panel in some embodiments of this application.

[0022] Figure 6 This is a top view of the fourth partition of the first area in the non-display area of ​​the display panel in some embodiments of this application.

[0023] Figure 7 This is another top view of the display panel in some embodiments of this application.

[0024] Figure 8 This is a partial top view of the display panel in some embodiments of this application.

[0025] Figure 9 This is a partial top view of the display panel in some other embodiments of this application.

[0026] Figure 10 This is a partial cross-sectional view of a display panel in some embodiments of this application.

[0027] Figure 11 This is a partial cross-sectional view of a display panel in some other embodiments of this application.

[0028] Figure 12 This is a flowchart illustrating a method for fabricating a display panel as described in some embodiments of the application.

[0029] Figure 13 A flowchart illustrating a method for fabricating a display panel in some other embodiments of the application.

[0030] Figure 14 A process flow diagram of the method for manufacturing the display panel in some other embodiments of the application.

[0031] Figure 15 This is a schematic diagram of the structure of a display device in some embodiments of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10. Display panel; 10a. First side; 10b. Second side; 10c. Third side; 10d. Fourth side; 11. Substrate; 11a. Display area; 11a1. First sub-side; 11a2. Second sub-side; 11a3. Third sub-side; 11a4. Fourth sub-side; 11b. Non-display area; 11b1. First area; 11b11. First partition; 11b12. Third partition; 11b13. Fourth partition; 11b2. Second area; 11b21. Bonding area; 12. Connecting pad; 121. Eutectic layer; 122. Positive 123. Negative electrode connection pad; 13. Virtual pad; 13a. First virtual pad; 13b. Second virtual pad; 13c. Third virtual pad; 13d. Fourth virtual pad; 131. Conductive layer; 14. Light-emitting unit; 141. Electrode; 1411. First electrode; 1412. Second electrode; 15. Insulating layer; 151. Through hole; 16. Conductive part; 17. Mask layer; 171. First isolation opening; 172. Second isolation opening; 18. Insulating film layer; 19. Pad film layer; 191. Redundant part;

[0034] 20. Display device;

[0035] X, the first direction; Y, the second direction. Detailed Implementation

[0036] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0038] When describing positional relationships, unless otherwise specified, when an element, such as a layer, film, or substrate, is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more intermediate elements present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intermediate elements present.

[0039] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0040] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0041] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0042] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0043] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0044] In related technologies, when a metal layer, such as a eutectic layer, is deposited on a substrate, the eutectic layer is prone to wrinkling due to stress, resulting in metal residue on the substrate and displacement of the connection pads in the display area of ​​the substrate, which affects the reliability of the display panel.

[0045] Based on the aforementioned technical problems, the inventors discovered that when depositing metal on one side of a substrate using a mask layer, the pad film layer of the mask layer in the non-display area can be divided into a virtual pad on one side of the substrate and a redundant portion on the side of the mask layer away from the substrate. This breaks the continuity of the pad film layer in the non-display area, greatly reducing the area of ​​the continuous pad film layer in the non-display area. In other words, it greatly reduces the area of ​​the redundant portion on the side of the mask layer away from the substrate. This significantly reduces the stress on the redundant portion, thereby reducing the probability of wrinkles in the redundant portion. This reduces the probability of wrinkles in the mask layer, which in turn reduces the probability of metal residue on the substrate and positional displacement of the connecting pads, thus improving the reliability of the display panel.

[0046] Based on this, the inventors further developed the technical solutions of the embodiments of this application. Specifically, the embodiments of this application provide a display panel, including a substrate, a plurality of connection pads and a plurality of virtual pads. The substrate includes a display area and a non-display area surrounding the display area; the plurality of connection pads are spaced apart and distributed on one side of the substrate; the orthographic projection of the plurality of connection pads on the substrate is located in the display area; the plurality of virtual pads are spaced apart and distributed on one side of the substrate; the orthographic projection of the plurality of virtual pads on the substrate is located in the non-display area, and the plurality of virtual pads are disposed on the same layer as the plurality of connection pads.

[0047] By employing the above technical solution, multiple connecting pads are spaced apart on one side of the substrate; the orthographic projection of the multiple connecting pads on the substrate is located in the display area; multiple virtual pads are spaced apart on one side of the substrate; the orthographic projection of the multiple virtual pads on the substrate is located in the non-display area; and the multiple virtual pads are set in the same layer as the multiple connecting pads. In other words, when depositing the pad film layer based on the mask layer, the pad film layer is divided into connecting pads located on one side of the substrate, virtual pads located on one side of the substrate, and redundant portions located on the mask layer away from the substrate surface. This can greatly reduce the area and stress of the redundant portions, thereby reducing the probability of wrinkles in the redundant portions and the probability of wrinkles, deformation, and cracks in the mask layer caused by wrinkles in the redundant portions. Consequently, it can reduce the probability of metal residue on the substrate and positional displacement of the connecting pads, thus improving the reliability of the display panel.

[0048] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0049] See Figure 1 and Figure 2 As shown, in a first aspect, embodiments of this application provide a display panel 10, including a substrate 11, a plurality of connection pads 12 and a plurality of virtual pads 13. The substrate 11 includes a display area 11a and a non-display area 11b surrounding the display area 11a. The plurality of connection pads 12 are spaced apart and distributed on one side of the substrate 11. The orthographic projection of the plurality of connection pads 12 on the substrate 11 is located in the display area 11a. The plurality of virtual pads 13 are spaced apart and distributed on one side of the substrate 11. The orthographic projection of the plurality of virtual pads 13 on the substrate 11 is located in the non-display area 11b. The plurality of virtual pads 13 are disposed on the same layer as the plurality of connection pads 12.

[0050] Specifically, the substrate 11 can be a thin film transistor (TFT) array substrate 11, a complementary metal oxide semiconductor (CMOS) driving substrate 11, or other devices that drive the light-emitting unit 14 to emit light. The connecting pad 12 can be connected to the electrode 141 on the light-emitting unit 14. The virtual pad 13 is not connected to the light-emitting unit 14.

[0051] The display panel 10 provided in this application embodiment has multiple connecting pads 12 spaced apart on one side of a substrate 11. The orthographic projection of the multiple connecting pads 12 on the substrate 11 is located in the display area 11a. Multiple virtual pads 13 are spaced apart on one side of the substrate 11. The orthographic projection of the multiple virtual pads 13 on the substrate 11 is located in the non-display area 11b. The multiple virtual pads 13 are disposed on the same layer as the multiple connecting pads 12. That is, referring to... Figure 7 As shown, when the pad film layer 19 is deposited based on the mask layer 17, the pad film layer 19 is divided into a connecting pad 12 located on one side of the substrate 11, a virtual pad 13 located on one side of the substrate 11, and a redundant portion 191 located on the mask layer 17 away from the surface of the substrate 11. This can greatly reduce the area of ​​the redundant portion 191 and reduce the stress of the redundant portion 191, thereby reducing the probability of wrinkling of the redundant portion 191 and reducing the probability of wrinkling deformation and cracking of the mask layer 17 due to wrinkling of the redundant portion 191. In turn, it can reduce the probability of metal residue on the substrate 11 and positional displacement of the connecting pad 12, and improve the reliability of the display panel 10.

[0052] In one embodiment, see [reference] Figures 1 to 3 As shown, among the plurality of virtual pads 13 arranged in a direction away from the display area 11a, at least two virtual pads 13 have unequal orthogonal projection areas on the substrate 11.

[0053] Thus, by limiting the orthogonal projection areas of at least two virtual pads 13 on the substrate 11 to be unequal, that is, the orthogonal projection areas of at least two second partition openings 172 on the mask layer 17 to be unequal, and placing the second partition opening 172 with the larger orthogonal projection area at a position prone to wrinkling, the area of ​​the continuous pad film layer 19 (i.e., the redundant portion 191 located on the side of the mask layer 17 away from the substrate 11) at a position prone to wrinkling can be reduced, thereby reducing the probability of wrinkling of the redundant portion 191, thereby improving the offset of the connection pad 12 position of the display area 11a of the substrate 11 caused by wrinkling, reducing the probability of metal residue on the substrate 11, and thus improving the reliability of the display panel 10.

[0054] In one embodiment, see [reference] Figure 1 and Figure 2 As shown, the non-display area 11b includes a first area 11b1 and a second area 11b2; the first area 11b1 is located around the second area 11b2; the plurality of virtual pads 13 include a plurality of first virtual pads 13a and a plurality of second virtual pads 13b; the orthographic projection of the plurality of first virtual pads 13a on the substrate 11 is located in the first area 11b1; the orthographic projection of the plurality of second virtual pads 13b on the substrate 11 is located in the second area 11b2.

[0055] As the peripheral area of ​​the display area 11a, the non-display area 11b is prone to uneven tension due to material shrinkage or thermal stress during the vapor deposition process, leading to film wrinkles. Distributing the virtual pads 13 to the first area 11b1 and the second area 11b2 is equivalent to establishing multiple stress buffer points within the non-display area 11b. This allows the redundant portion 191 of the pad film layer 19 to be divided more evenly, thereby reducing the overall stress peak and the probability of wrinkles in the pad film layer 19. This also improves the offset of the connection pads 12 in the display area 11a of the substrate 11 caused by wrinkles, reduces the probability of metal residue on the substrate 11, and ultimately improves the reliability of the display panel 10. In addition, the first region 11b1 is located around the second region 11b2, which helps to balance the stress gradient from the edge of the display area 11a to the edge of the non-display area 11b, reduce the deformation of the film layer due to uneven tension, thereby further reducing the probability of wrinkles in the pad film layer 19, improving the offset of the connection pad 12 position of the display area 11a of the substrate 11 caused by wrinkles, reducing the probability of metal residue on the substrate 11, and further improving the reliability of the display panel 10.

[0056] In one embodiment, see [reference] Figure 1 and Figure 2 As shown, the second region 11b2 includes a bonding region 11b21, and a plurality of second virtual pads 13b are disposed around at least a portion of the outer periphery of the bonding region 11b21 by orthogonal projections onto the substrate 11.

[0057] The bonding area 11b21 is typically used to connect drive circuits or external components, and requires extremely high positional accuracy and surface flatness. If film wrinkles or metal residues occur near the bonding area 11b21, bonding failure or signal transmission malfunction can easily occur, severely affecting the performance of the display panel 10. Therefore, by arranging multiple second virtual pads 13b around the bonding area 11b21, the stress applied near the bonding area 11b21 can be effectively absorbed and dispersed, preventing stress concentration from directly impacting the bonding area 11b21. This reduces the risk of deformation and cracking of the mask layer 17 near the bonding area 11b21, ensuring the structural stability of the bonding area 11b21 while mitigating the offset of the connection pads 12 in the display area 11a of the substrate 11 caused by wrinkles, reducing the probability of metal residues on the substrate 11, and further improving the reliability of the display panel 10.

[0058] In one embodiment, see [reference] Figure 3 and Figure 7 As shown, the first region 11b1 includes a first partition 11b11, and the first partition 11b11 and the second region 11b2 are disposed opposite each other along the first direction X; the first direction X is perpendicular to the thickness direction of the substrate 11; a plurality of first virtual pads 13a are arranged along the direction from the display area 11a to the first partition 11b11, and their orthogonal projection area on the substrate 11 first increases and then decreases.

[0059] Along the direction from the display area 11a to the first partition 11b11, compared to the areas of the first partition 11b11 near the edge of the display panel 10 and the areas of the first partition 11b11 near the edge of the display area 11a, the middle area of ​​the first partition 11b11 is more prone to wrinkling due to stress. Based on this, by first increasing and then decreasing the projected area of ​​the plurality of first virtual pads 13a arranged along the direction from the display area 11a to the first partition 11b11 on the substrate 11, that is, by having a larger area for the first virtual pads 13a located in the middle area of ​​the first partition 11b11 and a smaller area for the redundant portion 191 on the side of the mask layer 17 facing away from the substrate 11, the probability of wrinkling in the middle area of ​​the first partition 11b11 can be effectively reduced. This improves the offset of the connection pads 12 in the display area 11a of the substrate 11 caused by wrinkles, reduces the probability of metal residue on the substrate 11, and further improves the reliability of the display panel 10.

[0060] In one embodiment, see [reference] Figure 3 and Figure 7 As shown, the display area 11a includes a first sub-side 11a1 and a second sub-side 11a2 arranged opposite to each other along the first direction X. The first sub-side 11a1 is arranged adjacent to the first partition 11b11. A plurality of first virtual pads 13a are arranged along the direction from the center of the first partition 11b11 to the first sub-side 11a1, and their orthogonal projection area on the substrate 11 gradually decreases.

[0061] In other words, from the center of the first partition 11b11 towards the edge of the adjacent display area 11a (first sub-edge 11a1), the area of ​​the virtual pad 13 gradually decreases. This matches the distribution law of the actual internal stress gradually weakening in this direction. By arranging the largest virtual pad 13 in the central area where the stress is strongest, the concentrated stress can be absorbed and dispersed most effectively. As the stress decreases towards the edge of the display area 11a, the correspondingly reduced pad area can maintain the necessary stress buffer and avoid over-design. This can effectively improve the offset of the connection pad 12 position of the display area 11a of the substrate 11 caused by wrinkles, reduce the probability of metal residue on the substrate 11, and improve the reliability of the display panel 10.

[0062] It should be noted that the center of the first partition 11b11 can be understood as the geometric center of the first partition 11b11.

[0063] In one embodiment, see [reference] Figure 3 and Figure 7As shown, the plurality of first virtual pads 13a arranged along the direction from the center of the first partition 11b11 to the first sub-edge 11a1 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the first direction X; the plurality of first virtual pads 13a arranged along the direction from the center of the first partition 11b11 to the first sub-edge 11a1 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the second direction Y; the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11.

[0064] In this way, by making the size of the virtual pad 13 gradually decrease synchronously in the intersecting first direction X and second direction Y, the overall area of ​​the pad smoothly transitions from the center of the first partition 11b11 to the first sub-edge 11a1, forming a two-dimensional, isotropic stress gradient release area. This can more effectively disperse and absorb the multi-dimensional internal stress transmitted from the center of the first partition 11b11 to the edge of the display area 11a, avoiding stress concentration or anisotropic deformation that may be caused by unidirectional size changes. This allows for more uniform suppression of mask layer 17 wrinkles on a two-dimensional plane, improving the offset of the connection pad 12 position of the substrate 11 display area 11a caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10.

[0065] In one embodiment, see [reference] Figure 3 and Figure 7 As shown, the display panel 10 includes a first side 10a and a second side 10b arranged opposite each other along a first direction X. The first side 10a is arranged adjacent to the first partition 11b11. A plurality of first virtual pads 13a are arranged along the direction from the center of the first partition 11b11 to the first side 10a, and their orthogonal projection area on the substrate 11 gradually decreases.

[0066] From the center of the first partition 11b11 where stress is most concentrated, towards the adjacent edge of the display panel 10 (first edge 10a), the internal stress of the vapor-deposited film layer gradually decreases. By synchronously reducing the area of ​​the virtual pads 13 along this direction, the largest pads can be placed in the central region where stress is strongest, providing the strongest stress absorption and dispersion capabilities; while in the edge region where stress is weaker, smaller pads are sufficient to maintain effective stress buffering, while avoiding material redundancy. This layout, coordinated with the stress field distribution, can optimally smooth the stress gradient of the entire region, thereby more accurately and efficiently suppressing the wrinkling deformation of the mask layer 17, further improving the process yield and long-term reliability of the display panel 10.

[0067] In one embodiment, see [reference] Figure 3 and Figure 7As shown, the plurality of first virtual pads 13a arranged along the direction from the center of the first partition 11b11 to the first side 10a have an orthographic projection on the substrate 11 whose size gradually decreases along the first direction X; the plurality of first virtual pads 13a arranged along the direction from the center of the first partition 11b11 to the first side 10a have an orthographic projection on the substrate 11 whose size gradually decreases along the second direction Y; the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11.

[0068] Thus, by synchronously shrinking the size of the first virtual pad 13a in the mutually perpendicular first direction X and second direction Y, its overall area smoothly decreases from the center of the first partition 11b11 to the first edge 10a, forming a two-dimensional, isotropic buffer zone. This structure achieves better matching with the two-dimensional stress field that radiates and decays from the center of the first partition 11b11 to the edge of the display panel 10, which can uniformly disperse the internal stress in each direction and avoid new stress concentration points that may be caused by unidirectional size changes or abrupt shape changes. This more effectively suppresses wrinkles in the mask layer 17 at the two-dimensional level and comprehensively improves the reliability of the display panel 10.

[0069] In one embodiment, see [reference] Figure 3 and Figure 7 As shown, the first region 11b1 includes a first partition 11b11, which is disposed opposite to the second region 11b2 along a first direction X; the first direction X is perpendicular to the thickness direction of the substrate 11; a plurality of first virtual pads 13a are arranged along the center of the first partition 11b11 and pointing to the first partition 11b11 along the second direction Y, and their orthogonal projection area on the substrate 11 gradually increases; wherein, the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11.

[0070] Stress concentration is prone to occur in the rounded corner or corner areas of the display panel 10, and the vapor-deposited film layer is prone to wrinkling in these areas, leading to cracks or displacement of the mask layer 17. To address this, this embodiment arranges a plurality of first virtual pads 13a, which are arranged along the center of the first partition 11b11 pointing towards the first partition 11b11 in the second direction Y, with their projected area on the substrate 11 gradually increasing. In other words, when the pad film layer 19 is vapor-deposited based on the mask layer 17, the larger the area of ​​the virtual pad 13 located in the corresponding rounded corner or corner area, the smaller the area of ​​the redundant portion 191 located in the corresponding rounded corner or corner area and on the side of the mask layer 17 away from the substrate 11. This reduces the probability of wrinkling of the redundant portion 191 and the probability of cracks or displacement of the mask layer 17 located in the rounded corner or corner area, thereby improving the positional displacement of the connection pads 12 on the substrate 11, reducing the probability of metal residue on the substrate 11, and ultimately improving the reliability of the display panel 10.

[0071] In one embodiment, see [reference] Figure 3 and Figure 7 As shown, the plurality of first virtual pads 13a arranged along the center of the first partition 11b11 and pointing to the first partition 11b11 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the first direction X; the plurality of first virtual pads 13a arranged along the center of the first partition 11b11 and pointing to the first partition 11b11 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the second direction Y.

[0072] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0073] In one embodiment, see [reference] Figure 3 and Figure 7 As shown, the multiple first virtual pads 13a arranged along the center of the first partition 11b11 and pointing to the other side of the second direction Y of the first partition 11b11 have an increasing orthogonal projection area on the substrate 11.

[0074] Thus, by arranging a plurality of first virtual pads 13a, which are arranged along the center of the first partition 11b11 and pointing to the other side of the second direction Y, the projected area on the substrate 11 gradually increases. In other words, the area of ​​the redundant portion 191, which corresponds to the R-corner or corner area and is located on the side of the mask layer 17 away from the substrate 11, is made smaller. This reduces the probability of wrinkles in the redundant portion 191 and the probability of cracks or positional displacement of the mask layer 17 located in the R-corner or corner area. This improves the positional displacement of the connection pads 12 on the substrate 11, reduces the probability of metal residue on the substrate 11, and further improves the reliability of the display panel 10.

[0075] In one embodiment, see [reference] Figure 3 and Figure 7 As shown, the plurality of first virtual pads 13a arranged along the center of the first partition 11b11 and pointing to the other side of the first partition 11b11 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the first direction X; the plurality of first virtual pads 13a arranged along the center of the first partition 11b11 and pointing to the other side of the first partition 11b11 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the second direction Y.

[0076] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0077] It should be noted that the virtual pad 13 includes a dimension W along the first direction X and a dimension L along the second direction Y. Figure 3The dimensions of the first virtual solder pad 13a in different regions of the first partition 11b11 along the first direction X and the second direction Y are shown. W1 is the dimension of the first virtual solder pad 13a in the edge region of the first partition 11b11 along the first direction X, and L1 is the dimension of the first virtual solder pad 13a in the edge region of the first partition 11b11 along the second direction Y. It can be understood that the edge region here refers to the region of the first partition 11b11 near the first edge 11a or the region of the first partition 11b11 near the first sub-edge 11a1. W2 is the dimension of the first virtual solder pad 13a in the center region of the first partition 11b11 along the first direction X, and L2 is the dimension of the first virtual solder pad 13a in the center region of the first partition 11b11 along the second direction Y, where L2 > L1 and W2 > W1. W3 represents the dimension of the first virtual pad 13a in the corner area of ​​the first partition 11b11 along the first direction X, and L3 represents the dimension of the first virtual pad 13a in the corner area of ​​the first partition 11b11 along the second direction Y, where L3 > L1 and W3 > W1. It should be noted that the dimensions of the virtual pads 13a in different areas of any of the second partition 11b2, third partition 11b12, and fourth partition 11b13 along the first direction X and the second direction Y can be understood with reference to the above.

[0078] In one embodiment, see [reference] Figure 4 and Figure 7 As shown, the multiple second virtual pads 13b arranged along the direction from the display area 11a to the second area 11b2 have an orthogonal projection area on the substrate 11 that first increases and then decreases.

[0079] Along the direction from the display area 11a to the second area 11b2, compared to the areas of the second area 11b2 near the edge of the display panel 10 and the areas of the second area 11b2 near the edge of the display area 11a, the middle area of ​​the second area 11b2 is more prone to wrinkling due to stress. Based on this, by first increasing and then decreasing the projected area of ​​the plurality of second virtual pads 13b arranged along the direction from the display area 11a to the second area 11b2 on the substrate 11, that is, by having a larger area for the second virtual pads 13b located in the middle area of ​​the second area 11b2 and a smaller area for the redundant portion 191 on the side of the mask layer 17 facing away from the substrate 11, the probability of wrinkling in the middle area of ​​the second area 11b2 can be effectively reduced. This improves the offset of the connection pads 12 in the display area 11a of the substrate 11 caused by wrinkles, reduces the probability of metal residue on the substrate 11, and further improves the reliability of the display panel 10.

[0080] In one embodiment, see [reference] Figure 4 and Figure 7As shown, the display area 11a includes a first sub-side 11a1 and a second sub-side 11a2 arranged opposite to each other along the first direction X. The second sub-side 11a2 is arranged adjacent to the second area 11b2. A plurality of second virtual pads 13b are arranged along the direction from the center of the second area 11b2 to the second sub-side 11a2, and their orthogonal projection area on the substrate 11 gradually decreases.

[0081] In other words, the area of ​​the virtual pad 13 gradually decreases from the center of the second region 11b2 toward the edge of the adjacent display region 11a (second sub-edge 11a2). This matches the distribution law of the actual internal stress gradually weakening in this direction. By arranging the virtual pad 13 with the largest area in the central region where the stress is strongest, the concentrated stress can be absorbed and dispersed most effectively. As the stress decreases toward the edge of the display region 11a, the correspondingly reduced pad area can maintain the necessary stress buffer and avoid over-design. This can effectively improve the offset of the connection pad 12 position of the display region 11a of the substrate 11 caused by wrinkles, reduce the probability of metal residue on the substrate 11, and improve the reliability of the display panel 10.

[0082] It should be noted that the center of the second zone 11b2 can be understood as the geometric center of the second zone 11b2.

[0083] In one embodiment, see [reference] Figure 4 and Figure 7 As shown, the plurality of second virtual pads 13b arranged along the direction from the center of the second region 11b2 to the second sub-side 11a2 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the first direction X; the plurality of second virtual pads 13b arranged along the direction from the center of the second region 11b2 to the second sub-side 11a2 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the second direction Y; wherein the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11.

[0084] Thus, by synchronously and gradually reducing the size of the virtual pad 13 in the intersecting first direction X and second direction Y, the overall area of ​​the pad smoothly transitions from the center of the second region 11b2 to the second sub-edge 11a2, forming a two-dimensional, isotropic stress gradient release area. This can more effectively disperse and absorb the multi-dimensional internal stress transmitted from the center of the second region 11b2 to the edge of the display area 11a, avoiding stress concentration or anisotropic deformation that may be caused by unidirectional size changes. This allows for more uniform suppression of mask layer 17 wrinkles on a two-dimensional plane, improving the offset of the connection pad 12 position of the display area 11a of the substrate 11 caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10.

[0085] In one embodiment, see [reference] Figure 4 and Figure 7 As shown, the display panel 10 includes a first side 10a and a second side 10b disposed opposite to each other along a first direction X, the second side 10b being disposed adjacent to a second region 11b2; a plurality of second virtual pads 13b are arranged along the direction from the center of the second region 11b2 to the second side 10b, and their orthogonal projection area on the substrate 11 gradually decreases.

[0086] From the center of the second region 11b2, where stress is most concentrated, towards the adjacent edge of the display panel 10 (second side 10b), the internal stress of the vapor-deposited film layer gradually decreases. By synchronously reducing the area of ​​the virtual pads 13 along this direction, the largest pads can be placed in the central region where stress is strongest, providing the strongest stress absorption and dispersion capabilities; while in the edge region where stress is weaker, smaller pads are sufficient to maintain effective stress buffering, while avoiding material redundancy. This layout, coordinated with the stress field distribution, can optimally smooth the stress gradient of the entire region, thereby more accurately and efficiently suppressing wrinkle deformation of the mask layer 17, further improving the process yield and long-term reliability of the display panel 10.

[0087] In one embodiment, see [reference] Figure 4 and Figure 7 As shown, the plurality of second virtual pads 13b arranged along the direction from the center of the second region 11b2 to the second side 10b have an orthographic projection on the substrate 11 whose size gradually decreases along the first direction X; the plurality of second virtual pads 13b arranged along the direction from the center of the second region 11b2 to the second side 10b have an orthographic projection on the substrate 11 whose size gradually decreases along the second direction Y; wherein the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11.

[0088] Thus, by synchronously shrinking the size of the second virtual pad 13b in the mutually perpendicular first direction X and second direction Y, its overall area smoothly decreases from the center of the second region 11b2 to the second side 10b, forming a two-dimensional, isotropic buffer zone. This structure achieves better matching with the two-dimensional stress field that radiates and decays from the center of the second region 11b2 to the edge of the display panel 10, which can uniformly disperse the internal stress in each direction and avoid new stress concentration points that may be caused by unidirectional size changes or abrupt shape changes. This more effectively suppresses wrinkles in the mask layer 17 at the two-dimensional level and comprehensively improves the reliability of the display panel 10.

[0089] In one embodiment, see [reference] Figure 4 and Figure 7As shown, a plurality of second virtual pads 13b are arranged along the center of the second region 11b2 and in the direction of the second region 11b2 along the second direction Y, and their orthogonal projection area on the substrate 11 gradually increases; wherein, the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11.

[0090] Thus, by arranging a plurality of second virtual pads 13b along the center of the second region 11b2 towards the second region 11b2 along the second direction Y, the projected area on the substrate 11 gradually increases. That is, when the pad film layer 19 is deposited based on the mask layer 17, the area of ​​the virtual pad 13 located in the corresponding R-corner or corner region is larger, and the area of ​​the redundant portion 191 located in the corresponding R-corner or corner region and on the side of the mask layer 17 away from the substrate 11 is smaller. In this way, the probability of the redundant portion 191 wrinkling can be reduced, the probability of the mask layer 17 located in the R-corner or corner region cracking or shifting can be reduced, thereby improving the positional shift of the connection pads 12 on the substrate 11, reducing the probability of metal residue on the substrate 11, and thus improving the reliability of the display panel 10.

[0091] In one embodiment, see [reference] Figure 4 and Figure 7 As shown, the plurality of second virtual pads 13b arranged along the center of the second region 11b2 and pointing to the second region 11b2 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the first direction X; the plurality of second virtual pads 13b arranged along the center of the second region 11b2 and pointing to the second region 11b2 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the second direction Y.

[0092] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0093] In one embodiment, see [reference] Figure 4 and Figure 7As shown, a plurality of second virtual pads 13b, which are arranged along the center of the second region 11b2 and pointing to the other side of the second direction Y of the second region 11b2, have an increasing orthogonal projection area on the substrate 11.

[0094] Thus, by gradually increasing the projected area of ​​the multiple second virtual pads 13b arranged along the center of the second region 11b2 and pointing to the other side of the second direction Y of the second region 11b2, the area of ​​the redundant portion 191 corresponding to the R-corner or corner area and located on the side of the mask layer 17 away from the substrate 11 is made smaller. In this way, the probability of wrinkles in the redundant portion 191 can be reduced, the probability of cracks or positional displacement of the mask layer 17 located in the R-corner or corner area can be reduced, thereby improving the positional displacement of the connection pads 12 on the substrate 11, reducing the probability of metal residue on the substrate 11, and thus improving the reliability of the display panel 10.

[0095] In one embodiment, see [reference] Figure 4 and Figure 7 As shown, the plurality of second virtual pads 13b arranged along the center of the second region 11b2 and pointing to the other side of the second region 11b2 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the first direction X; the plurality of second virtual pads 13b arranged along the center of the second region 11b2 and pointing to the other side of the second region 11b2 along the second direction Y have an orthographic projection on the substrate 11 with an increasing size along the second direction Y.

[0096] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0097] In one embodiment, see [reference] Figure 2As shown, the first region 11b1 further includes a third region 11b12 and a fourth region 11b13 disposed opposite to each other along the second direction Y; the third region 11b12 is connected to the first region 11b11 and the second region 11b2 on both sides along the first direction X respectively; the fourth region 11b13 is connected to the first region 11b11 and the second region 11b2 on both sides along the first direction X; the plurality of virtual pads 13 include a plurality of third virtual pads 13c and a plurality of fourth virtual pads 13d; the orthographic projection of the plurality of third virtual pads 13c on the substrate 11 is located in the third region 11b12; the orthographic projection of the plurality of fourth virtual pads 13d on the substrate 11 is located in the fourth region 11b13; the second direction Y is perpendicular to the thickness direction of the substrate 11.

[0098] Thus, by adding a third partition 11b12 and a fourth partition 11b13 arranged opposite each other along the second direction Y, and connecting them with the first partition 11b11 and the second partition 11b2, a complete frame surrounding the display area 11a is formed. The third and fourth virtual pads 13d are arranged within this frame, which can extend the stress management mechanism to the left and right sides of the display panel 10, so that the stress of the entire non-display area 11b edge can be evenly distributed, avoiding the weak point of stress concentration due to the lack of virtual pads 13 protection in a specific direction or area. In this way, the overall stability of the mask layer 17 during the evaporation process can be comprehensively enhanced, and the risk of wrinkles and cracks at each edge and corner can be further reduced, thereby systematically improving the reliability of the display panel 10.

[0099] In one embodiment, see [reference] Figure 5 and Figure 7 As shown, the multiple third virtual pads 13c arranged along the direction from the display area 11a to the third partition 11b12 have an orthogonal projection area on the substrate 11 that first increases and then decreases.

[0100] Along the direction from the display area 11a to the third partition 11b12, the central region of the third partition 11b12 is more prone to wrinkling due to stress compared to the regions of the third partition 11b12 near the edge of the display panel 10 and the regions of the third partition 11b12 near the edge of the display area 11a. Therefore, by first increasing and then decreasing the projected area of ​​the multiple third virtual pads 13c arranged along the direction from the display area 11a to the third partition 11b12 on the substrate 11, that is, by increasing the area of ​​the third virtual pads 13c located in the central region of the third partition 11b12 and correspondingly decreasing the area of ​​the redundant portion 191 on the side of the mask layer 17 facing away from the substrate 11, the probability of wrinkling in the central region of the third partition 11b12 can be effectively reduced. This improves the offset of the connection pads 12 in the display area 11a of the substrate 11 caused by wrinkles, reduces the probability of metal residue on the substrate 11, and further improves the reliability of the display panel 10.

[0101] In one embodiment, see [reference] Figure 5 and Figure 7 As shown, the display area 11a includes a third sub-side 11a3 and a fourth sub-side 11a4 arranged opposite each other along the second direction Y. The third sub-side 11a3 is arranged adjacent to the third partition 11b12. A plurality of third virtual pads 13c are arranged along the direction from the center of the third partition 11b12 to the third sub-side 11a3, and their orthogonal projection area on the substrate 11 gradually decreases.

[0102] In other words, the area of ​​the virtual pad 13 gradually decreases from the center of the third partition 11b12 toward the edge of the adjacent display area 11a (third sub-edge 11a3). This matches the distribution law of the actual internal stress gradually weakening in this direction. By arranging the largest virtual pad 13 in the central area where the stress is strongest, the concentrated stress can be absorbed and dispersed most effectively. As the stress decreases toward the edge of the display area 11a, the correspondingly reduced pad area can maintain the necessary stress buffer and avoid over-design. This can effectively improve the offset of the connection pad 12 position of the display area 11a of the substrate 11 caused by wrinkles, reduce the probability of metal residue on the substrate 11, and improve the reliability of the display panel 10.

[0103] In one embodiment, see [reference] Figure 5 and Figure 7 As shown, the plurality of third virtual pads 13c arranged along the direction from the center of the third partition 11b12 to the third sub-side 11a3 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the first direction X; the first direction X intersects the second direction Y, and both the first direction X and the second direction Y are perpendicular to the thickness direction of the substrate 11; the plurality of third virtual pads 13c arranged along the direction from the center of the third partition 11b12 to the third sub-side 11a3 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the second direction Y.

[0104] Thus, by synchronously and gradually reducing the size of the virtual pad 13 in the intersecting first direction X and second direction Y, the overall area of ​​the pad smoothly transitions from the center of the third partition 11b12 to the third sub-edge 11a3, forming a two-dimensional, isotropic stress gradient release area. This can more effectively disperse and absorb the multi-dimensional internal stress transmitted from the center of the third partition 11b12 to the edge of the display area 11a, avoiding stress concentration or anisotropic deformation that may be caused by unidirectional size changes. This allows for more uniform suppression of mask layer 17 wrinkles on a two-dimensional plane, improving the offset of the connection pad 12 position of the substrate 11 display area 11a caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10.

[0105] In one embodiment, see [reference] Figure 5 and Figure 7 As shown, the display panel 10 includes a third side 10c and a fourth side 10d arranged opposite each other along the second direction Y. The third side 10c is arranged adjacent to the third partition 11b12. A plurality of third virtual pads 13c are arranged along the direction from the center of the third partition 11b12 to the third side 10c, and their projected area on the substrate 11 gradually decreases.

[0106] From the center of the third partition 11b12, where stress is most concentrated, towards the adjacent edge of the display panel 10 (third side 10c), the internal stress of the vapor-deposited film layer gradually decreases. By synchronously reducing the area of ​​the virtual pads 13 along this direction, the largest pads can be placed in the central region where stress is strongest, providing the strongest stress absorption and dispersion capabilities; while in the edge region where stress is weaker, smaller pads are sufficient to maintain effective stress buffering, while avoiding material redundancy. This layout, coordinated with the stress field distribution, can optimally smooth the stress gradient throughout the region, thereby more accurately and efficiently suppressing wrinkle deformation of the mask layer 17, further improving the process yield and long-term reliability of the display panel 10.

[0107] It should be noted that the center of the third partition 11b12 can be understood as the geometric center of the third partition 11b12.

[0108] In one embodiment, see [reference] Figure 5 and Figure 7 As shown, the plurality of third virtual pads 13c arranged along the direction from the center of the third partition 11b12 to the third side 10c have a gradually decreasing size in their orthogonal projection on the substrate 11 along the first direction X; the first direction X intersects the second direction Y, and both the first direction X and the second direction Y are perpendicular to the thickness direction of the substrate 11; the plurality of third virtual pads 13c arranged along the direction from the center of the third partition 11b12 to the third side 10c have a gradually decreasing size in their orthogonal projection on the substrate 11 along the second direction Y.

[0109] Thus, by synchronously shrinking the dimensions of the third virtual pad 13c in the mutually perpendicular first direction X and second direction Y, its overall area smoothly decreases from the center of the third partition 11b12 to the third side 10c, forming a two-dimensional, isotropic buffer zone. This structure achieves better matching with the two-dimensional stress field that radiates and decays from the center of the third partition 11b12 to the edge of the display panel 10, which can uniformly disperse the internal stress in each direction and avoid new stress concentration points that may be caused by unidirectional size changes or abrupt shape changes. This more effectively suppresses wrinkles in the mask layer 17 at the two-dimensional level and comprehensively improves the reliability of the display panel 10.

[0110] In one embodiment, see [reference] Figure 5 and Figure 7As shown, a plurality of third virtual pads 13c, which are arranged along the center of the third partition 11b12 and pointing to the third partition 11b12 along the first direction X, have an increasing orthogonal projection area on the substrate 11; the first direction X intersects the second direction Y, and both the first direction X and the second direction Y are perpendicular to the thickness direction of the substrate 11.

[0111] Stress concentration is prone to occur in the rounded corner or corner areas of the display panel 10, and the vapor-deposited film layer is prone to wrinkling in these areas, leading to cracks or displacement of the mask layer 17. To address this, this embodiment arranges multiple third virtual pads 13c, which are arranged along the direction X of the third partition 11b12 from the center of the third partition 11b12, so that their projected area on the substrate 11 gradually increases. In other words, when the pad film layer 19 is vapor-deposited based on the mask layer 17, the larger the area of ​​the virtual pad 13 located in the corresponding rounded corner or corner area, the smaller the area of ​​the redundant portion 191 located in the corresponding rounded corner or corner area and on the side of the mask layer 17 away from the substrate 11. This reduces the probability of wrinkling of the redundant portion 191 and the probability of cracks or displacement of the mask layer 17 located in the rounded corner or corner area, thereby improving the positional displacement of the connection pads 12 on the substrate 11, reducing the probability of metal residue on the substrate 11, and ultimately improving the reliability of the display panel 10.

[0112] In one embodiment, see [reference] Figure 5 and Figure 7 As shown, the plurality of third virtual pads 13c arranged along the center of the third partition 11b12 and pointing to the third partition 11b12 along the first direction X have an orthographic projection on the substrate 11 with an increasing size along the first direction X; the plurality of third virtual pads 13c arranged along the center of the third partition 11b12 and pointing to the third partition 11b12 along the first direction X have an orthographic projection on the substrate 11 with an increasing size along the second direction Y.

[0113] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0114] In one embodiment, see [reference] Figure 5and Figure 7 As shown, the multiple third virtual pads 13c arranged along the center of the third partition 11b12 and pointing to the other side of the third partition 11b12 along the first direction X have an increasing orthogonal projection area on the substrate 11.

[0115] Thus, by arranging multiple third virtual pads 13c along the direction of the center of the third partition 11b12 pointing to the other side of the second direction Y, the projected area on the substrate 11 gradually increases. In other words, the area of ​​the redundant portion 191 corresponding to the R-corner or corner area and located on the side of the mask layer 17 away from the substrate 11 is made smaller. This reduces the probability of wrinkles in the redundant portion 191 and the probability of cracks or positional displacement of the mask layer 17 located in the R-corner or corner area. This improves the positional displacement of the connection pads 12 on the substrate 11, reduces the probability of metal residue on the substrate 11, and further improves the reliability of the display panel 10.

[0116] In one embodiment, see [reference] Figure 5 and Figure 7 As shown, the plurality of third virtual pads 13c arranged along the center of the third partition 11b12 and pointing to the other side of the third partition 11b12 along the first direction X have an orthographic projection on the substrate 11 with an increasing size along the first direction X; the plurality of third virtual pads 13c arranged along the center of the third partition 11b12 and pointing to the other side of the third partition 11b12 along the first direction X have an orthographic projection on the substrate 11 with an increasing size along the second direction Y.

[0117] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0118] In one embodiment, see [reference] Figure 6 and Figure 7 As shown, the multiple fourth virtual pads 13d arranged along the direction from the display area 11a to the fourth partition 11b13 have an orthogonal projection area on the substrate 11 that first increases and then decreases.

[0119] Along the direction from the display area 11a to the fourth partition 11b13, the central region of the fourth partition 11b13 is more prone to wrinkling due to stress compared to the regions of the fourth partition 11b13 near the edge of the display panel 10 and the regions of the fourth partition 11b13 near the edge of the display area 11a. Therefore, by first increasing and then decreasing the projected area of ​​the multiple fourth virtual pads 13d arranged along the direction from the display area 11a to the fourth partition 11b13 on the substrate 11, that is, by increasing the area of ​​the fourth virtual pads 13d located in the central region of the fourth partition 11b13 and correspondingly decreasing the area of ​​the redundant portion 191 on the side of the mask layer 17 facing away from the substrate 11, the probability of wrinkling in the central region of the fourth partition 11b13 can be effectively reduced. This improves the offset of the connection pads 12 in the display area 11a of the substrate 11 caused by wrinkles, reduces the probability of metal residue on the substrate 11, and further improves the reliability of the display panel 10.

[0120] In one embodiment, see [reference] Figure 6 and Figure 7 As shown, the display area 11a includes a third sub-side 11a3 and a fourth sub-side 11a4 arranged opposite each other along the second direction Y. The fourth sub-side 11a4 is arranged adjacent to the fourth partition 11b13. A plurality of fourth virtual pads 13d are arranged along the direction from the center of the fourth partition 11b13 to the fourth sub-side 11a4, and their orthogonal projection area on the substrate 11 gradually decreases.

[0121] In other words, from the center of the fourth partition 11b13 towards the edge of the adjacent display area 11a (fourth sub-edge 11a4), the area of ​​the fourth virtual pad 13d gradually decreases. This matches the distribution law of the actual internal stress gradually weakening in this direction. By arranging the largest virtual pad 13 in the central area where the stress is strongest, the concentrated stress can be absorbed and dispersed most effectively. As the stress decreases towards the edge of the display area 11a, the correspondingly reduced pad area can maintain the necessary stress buffer and avoid over-design. This can effectively improve the offset of the connection pad 12 position of the display area 11a of the substrate 11 caused by wrinkles, reduce the probability of metal residue on the substrate 11, and improve the reliability of the display panel 10.

[0122] It should be noted that the center of the fourth partition 11b13 can be understood as the geometric center of the fourth partition 11b13.

[0123] In one embodiment, see [reference] Figure 6 and Figure 7As shown, the plurality of fourth virtual pads 13d arranged along the direction from the center of the fourth partition 11b13 to the fourth sub-side 11a4 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the first direction X; the first direction X intersects with the second direction Y, and both the first direction X and the second direction Y are perpendicular to the thickness direction of the substrate 11; the plurality of fourth virtual pads 13d arranged along the direction from the center of the fourth partition 11b13 to the fourth sub-side 11a4 have a gradually decreasing size in their orthogonal projection on the substrate 11 along the second direction Y.

[0124] Thus, by synchronously and gradually reducing the size of the virtual pad 13 in the intersecting first direction X and second direction Y, the overall area of ​​the pad smoothly transitions from the center of the fourth partition 11b13 to the fourth sub-edge 11a4, forming a two-dimensional, isotropic stress gradient release area. This can more effectively disperse and absorb the multi-dimensional internal stress transmitted from the center of the fourth partition 11b13 to the edge of the display area 11a, avoiding stress concentration or anisotropic deformation that may be caused by unidirectional size changes. This allows for more uniform suppression of mask layer 17 wrinkles on a two-dimensional plane, improving the offset of the connection pad 12 position of the substrate 11 display area 11a caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10.

[0125] In one embodiment, see [reference] Figure 6 and Figure 7 As shown, the display panel 10 includes a third side 10c and a fourth side 10d arranged opposite each other along the second direction Y. The fourth side 10d is arranged adjacent to the fourth partition 11b13. A plurality of fourth virtual pads 13d are arranged along the direction from the center of the fourth partition 11b13 to the fourth side 10d, and their projected area on the substrate 11 gradually decreases.

[0126] From the center of the fourth partition 11b13, where stress is most concentrated, towards the adjacent edge of the display panel 10 (third side 10c), the internal stress of the vapor-deposited film layer gradually decreases. By synchronously reducing the area of ​​the virtual pads 13 along this direction, the largest pads can be placed in the central region where stress is strongest, providing the strongest stress absorption and dispersion capabilities; while in the edge region where stress is weaker, smaller pads are sufficient to maintain effective stress buffering, while avoiding material redundancy. This layout, coordinated with the stress field distribution, can optimally smooth the stress gradient of the entire region, thereby more accurately and efficiently suppressing wrinkle deformation of the mask layer 17, further improving the process yield and long-term reliability of the display panel 10.

[0127] In one embodiment, see [reference] Figure 6 and Figure 7As shown, the plurality of fourth virtual pads 13d arranged along the direction from the center of the fourth partition 11b13 to the fourth side 10d have a gradually decreasing size in their orthogonal projection on the substrate 11 along the first direction X; the first direction X intersects the second direction Y, and both the first direction X and the second direction Y are perpendicular to the thickness direction of the substrate 11; the plurality of fourth virtual pads 13d arranged along the direction from the center of the fourth partition 11b13 to the fourth side 10d have a gradually decreasing size in their orthogonal projection on the substrate 11 along the second direction Y.

[0128] Thus, by synchronously shrinking the size of the fourth virtual pad 13d in the mutually perpendicular first direction X and second direction Y, its overall area smoothly decreases from the center of the fourth partition 11b13 to the fourth side 10d, forming a two-dimensional, isotropic buffer zone. This structure achieves better matching with the two-dimensional stress field that radiates and decays from the center of the fourth partition 11b13 to the edge of the display panel 10, which can uniformly disperse the internal stress in each direction and avoid new stress concentration points that may be caused by unidirectional size changes or abrupt shape changes. This more effectively suppresses wrinkles in the mask layer 17 at the two-dimensional level and comprehensively improves the reliability of the display panel 10.

[0129] In one embodiment, see [reference] Figure 6 and Figure 7 As shown, a plurality of fourth virtual pads 13d, which are arranged along the center of the fourth partition 11b13 and pointing to the fourth partition 11b13 along the first direction X, have an increasing orthogonal projection area on the substrate 11; the first direction X intersects the second direction Y, and both the first direction X and the second direction Y are perpendicular to the thickness direction of the substrate 11.

[0130] Stress concentration is prone to occur in the rounded corner or corner areas of the display panel 10, and the vapor-deposited film layer is prone to wrinkling in these areas, leading to cracks or displacement of the mask layer 17. To address this, this embodiment arranges multiple fourth virtual pads 13d, which are arranged along the direction X of the fourth partition 11b13 from the center of the fourth partition 11b13, so that their projected area on the substrate 11 gradually increases. In other words, when the pad film layer 19 is vapor-deposited based on the mask layer 17, the larger the area of ​​the virtual pad 13 located in the corresponding rounded corner or corner area, the smaller the area of ​​the redundant portion 191 located in the corresponding rounded corner or corner area and on the side of the mask layer 17 away from the substrate 11. This reduces the probability of wrinkling of the redundant portion 191 and the probability of cracks or displacement of the mask layer 17 located in the rounded corner or corner area, thereby improving the positional displacement of the connection pads 12 on the substrate 11, reducing the probability of metal residue on the substrate 11, and ultimately improving the reliability of the display panel 10.

[0131] In one embodiment, see [reference] Figure 6 and Figure 7 As shown, the plurality of fourth virtual pads 13d arranged along the center of the fourth partition 11b13 and pointing to the fourth partition 11b13 along the first direction X have an orthographic projection on the substrate 11 with an increasing size along the first direction X; the plurality of fourth virtual pads 13d arranged along the center of the fourth partition 11b13 and pointing to the fourth partition 11b13 along the first direction X have an orthographic projection on the substrate 11 with an increasing size along the second direction Y.

[0132] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0133] In one embodiment, see [reference] Figure 6 and Figure 7 As shown, the multiple fourth virtual pads 13d, which are arranged along the center of the fourth partition 11b13 and pointing to the other side of the first direction X, have an increasing orthogonal projection area on the substrate 11.

[0134] Thus, by arranging multiple fourth virtual pads 13d along the center of the fourth partition 11b13 towards the other side of the second direction Y, the projected area on the substrate 11 gradually increases. In other words, the area of ​​the redundant portion 191 corresponding to the R-corner or corner area and located on the side of the mask layer 17 away from the substrate 11 is made smaller. This reduces the probability of wrinkles in the redundant portion 191 and the probability of cracks or positional displacement of the mask layer 17 located in the R-corner or corner area. This improves the positional displacement of the connection pads 12 on the substrate 11, reduces the probability of metal residue on the substrate 11, and further improves the reliability of the display panel 10.

[0135] In one embodiment, see [reference] Figure 6 and Figure 7As shown, the plurality of fourth virtual pads 13d arranged along the center of the fourth partition 11b13 and pointing to the other side of the fourth partition 11b13 along the first direction X have an orthogonal projection on the substrate 11 with an increasing size along the first direction X; the plurality of fourth virtual pads 13d arranged along the center of the fourth partition 11b13 and pointing to the other side of the fourth partition 11b13 along the first direction X have an orthogonal projection on the substrate 11 with an increasing size along the second direction Y.

[0136] In this way, by gradually increasing the size of the virtual pad 13 in the first direction X and the second direction Y, it provides stronger support in both dimensions when facing the R-corner or corner area where stress is more concentrated. It can form a more precise match with the complex multi-directional stress field at the corner, thereby establishing a larger and more stable buffer anchor point on the path of strongest stress. This more effectively divides and absorbs concentrated stress from different directions, greatly enhances the protection of this vulnerable area, and significantly reduces the risk of wrinkles and cracks in the mask layer 17 at this location. This can significantly improve the positional offset of the connection pad 12 on the substrate 11, reduce the probability of metal residue on the substrate 11, and thus effectively improve the reliability of the display panel 10.

[0137] In one embodiment, see [reference] Figure 8 and Figure 9 As shown, the multiple virtual pads 13 arranged along the direction from the display area 11a to the non-display area 11b have gradually varying orthogonal projection areas on the substrate 11.

[0138] See one example. Figure 8 As shown, the multiple virtual pads 13 arranged along the direction from the display area 11a to the non-display area 11b have a gradually decreasing positive projection area on the substrate 11.

[0139] See another example. Figure 9 As shown, the multiple virtual pads 13 arranged along the direction from the display area 11a to the non-display area 11b have an increasing orthogonal projection area on the substrate 11.

[0140] The internal stress distribution of the vapor-deposited film layer is not uniform from the display area 11a to the non-display area 11b. In this embodiment, by gradually varying the projected area of ​​the multiple virtual pads 13 arranged along the direction from the display area 11a to the non-display area 11b, the stress variation law of the vapor-deposited film layer can be effectively matched. This allows for more efficient and uniform absorption and release of internal stress, significantly reducing the risk of overall mask layer wrinkling and comprehensively improving the process yield and long-term reliability of the display panel 10.

[0141] In one embodiment, see [reference] Figure 10 and Figure 14As shown, the connecting pad 12 includes a eutectic layer 121; the virtual pad includes a conductive layer 131; the conductive layer 131 and the eutectic layer 121 are disposed on the same layer, and the conductive layer 131 and the eutectic layer 121 are made of the same material.

[0142] In other words, when the eutectic film layer is deposited based on the mask layer 17, the eutectic film layer is divided by the mask layer 17 into the eutectic layer 121 located in the display area 11a, the conductive layer 131 located in the non-display area 11b, and the redundant portion 191 located on the side of the mask layer 17 away from the substrate 11. This reduces the area of ​​the redundant portion 191 located on the side of the mask layer 17 away from the substrate 11, reduces the probability of wrinkling of the redundant portion 191, and reduces the probability of wrinkling deformation and cracking of the mask layer 17 due to wrinkling of the redundant portion 191. In turn, it can reduce the probability of metal residue on the substrate 11 and positional displacement of the connecting pads 12, and improve the reliability of the display panel 10.

[0143] In one embodiment, see [reference] Figure 2 As shown, the orthographic projection of the virtual pad 13 onto the substrate 11 includes at least one of a circle, a polygon, and an ellipse.

[0144] In one embodiment, see [reference] Figure 11 As shown, it also includes multiple light-emitting units 14, which correspond to multiple connection pads 12; the electrodes 141 on the light-emitting units 14 are connected to the corresponding connection pads 12.

[0145] Specifically, the light-emitting unit 14 is a component capable of emitting light of a specific color, such as red, green, or blue. In this embodiment, the light-emitting unit 14 may be a mini light-emitting diode display (Mini LED) or a micro light-emitting diode display (Micro LED), etc. See also... Figure 9 As shown, the light-emitting unit 14 includes a first electrode 1411 and a second electrode 1412. The electrode 141 on the light-emitting unit 14 can be either the first electrode 1411 or the second electrode 1412. The connecting pad 12 includes a positive electrode connecting pad 122 and a negative electrode connecting pad 123. One of the positive electrode connecting pad 122 and the negative electrode connecting pad 123 is connected to the first electrode 1411, and the other is connected to the second electrode 1412.

[0146] In one embodiment, see [reference] Figure 10 and Figure 11As shown, it also includes an insulating layer 15 disposed on one side of the substrate 11, and virtual pads 13 and connection pads 12 are located on the side of the insulating layer 15 away from the substrate 11; a through hole 151 is provided on the insulating layer 15 located in the display area 11a, and a conductive part 16 is provided in the through hole 151, and the conductive part 16 is connected to the connection pad 12.

[0147] In this way, the virtual pad 13 can be separated from the metal layer in the substrate 11 by using the insulating layer 15, and the conductive part 16 in the through hole 151 can be used to easily connect the connection pad 12 to the device in the substrate 11, thereby improving the reliability of the display panel 10.

[0148] See Figure 12 and Figure 14 As shown, in a second aspect, embodiments of this application provide a method for manufacturing a display panel 10, comprising:

[0149] S10. A substrate 11 is provided, the substrate 11 including a display area 11a and a non-display area 11b disposed around the display area 11a;

[0150] S20. A mask layer 17 is formed on one side of the substrate 11. The orthographic projection of the mask layer 17 on the substrate 11 covers the display area 11a and the non-display area 11b.

[0151] S30. A plurality of first isolation openings 171 and a plurality of second isolation openings 172 are formed on the mask layer 17; the orthographic projection of the plurality of first isolation openings 171 on the substrate 11 is located in the display area 11a; the orthographic projection of the plurality of second isolation openings 172 on the substrate 11 is located in the non-display area 11b.

[0152] S40. A pad film layer 19 is formed on the side of the mask layer 17 away from the substrate 11. The pad film layer 19 includes a plurality of connecting pads 12 corresponding to a plurality of first partition openings 171, a plurality of virtual pads 13 corresponding to a plurality of second partition openings 172, and a redundant portion 191 located on the surface of the mask layer 17 away from the substrate 11. The connecting pads 12 and the redundant portion 191 are spaced apart. The virtual pads 13 and the redundant portion 191 are spaced apart.

[0153] S50, Remove mask layer 17 and redundant portion 191.

[0154] The method for manufacturing the display panel 10 provided in this application embodiment involves forming a plurality of first isolation openings 171 and a plurality of second isolation openings 172 on a mask layer 17. The orthographic projection of the plurality of first isolation openings 171 onto the substrate 11 is located in the display area 11a; the orthographic projection of the plurality of second isolation openings 172 onto the substrate 11 is located in the non-display area 11b. When a pad film layer 19 is formed on the side of the mask layer 17 away from the substrate 11, the first isolation openings 171 and the second isolation openings 172 isolate the pad film layer 19, thus separating the pad film layer. The 19th partition is divided into a connection pad 12 located at the first partition opening 171, a virtual pad 13 located at the second partition opening 172, and a redundant portion 191 located on the mask layer 17. This can greatly reduce the area of ​​the redundant portion 191 and reduce the stress of the redundant portion 191, thereby reducing the probability of wrinkling of the redundant portion 191. This can further improve the positional offset of the connection pad 12 of the display area 11a of the substrate 11 caused by wrinkles, reduce the probability of metal residue on the substrate 11, and thus improve the reliability of the display panel 10.

[0155] In one embodiment, S30, forming a plurality of first partition openings 171 and a plurality of second partition openings 172 on the mask layer 17 includes:

[0156] A plurality of first isolation openings 171 are formed on the mask layer 17, and the orthographic projection of the plurality of first isolation openings 171 on the substrate 11 is located in the display area 11a;

[0157] A plurality of second partition openings 172 are formed on the mask layer 17, and the orthographic projection of the plurality of second partition openings 172 on the substrate 11 is located in the non-display area 11b; and at least two of the plurality of second partition openings 172 arranged in a direction away from the display area 11a have unequal orthographic projection areas on the substrate 11.

[0158] In this way, the second partition opening 172 with a large projected area can be placed at a position where wrinkles are likely to occur. This reduces the area of ​​the continuous pad film layer 19 (i.e., the redundant portion 191 located on the side of the mask layer 17 away from the substrate 11) at the position where wrinkles are likely to occur, thereby reducing the probability of wrinkles in the redundant portion 191. This can improve the offset of the connection pad 12 position of the display area 11a of the substrate 11 caused by wrinkles, reduce the probability of metal residue on the substrate 11, and thus improve the reliability of the display panel 10.

[0159] In one embodiment, the non-display area 11b includes a first area 11b1 and a second area 11b2. The first area 11b1 includes a first partition 11b11, which is disposed opposite to the second area 11b2 along a first direction X. The second area 11b2 includes a bonding area 11b21. The first direction X is perpendicular to the thickness direction of the substrate 11.

[0160] A plurality of second partition openings 172 are formed on the mask layer 17, including:

[0161] Multiple first sub-partitions and multiple second sub-partitions are formed on the mask layer 17; the orthographic projection of the multiple first sub-partitions on the substrate 11 is located in the first partition 11b11; the multiple first sub-partitions arranged along the direction from the display area 11a to the first partition 11b11 have an orthographic projection area on the substrate 11 that first increases and then decreases; the multiple first sub-partitions arranged along the center of the first partition 11b11 to the direction along the second direction Y of the first partition 11b11 have an orthographic projection area that gradually increases; the multiple first sub-partitions arranged along the center of the first partition 11b11 to the direction along the other side of the second direction Y of the first partition 11b11 have an orthographic projection area that gradually increases; wherein, the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11;

[0162] The orthographic projection of a plurality of second sub-partitions on the substrate 11 is located in the second region 11b2, and the orthographic projection of the plurality of second sub-partitions on the substrate 11 is disposed around at least a portion of the outer periphery of the bonding region 11b21; the plurality of second sub-partitions arranged along the direction from the display region 11a to the second region 11b2 have an orthographic projection area on the substrate 11 that first increases and then decreases; the plurality of second sub-partitions arranged along the center of the second region 11b2 to the direction along the second direction Y of the second region 11b2 have an orthographic projection area on the substrate 11 that gradually increases; the plurality of second sub-partitions arranged along the center of the second region 11b2 to the direction along the other side of the second direction Y of the second region 11b2 have an orthographic projection area that gradually increases.

[0163] Thus, by making the projected area on the substrate 11 of the plurality of first sub-partitions arranged along the direction pointing from the display area 11a to the first partition 11b11 first increase and then decrease; the projected area on the substrate 11 of the plurality of first sub-partitions arranged along the direction from the center of the first partition 11b11 to one side of the first partition 11b11 along the second direction Y gradually increase; the projected area on the substrate 11 of the plurality of first sub-partitions arranged along the direction from the center of the first partition 11b11 to the other side of the first partition 11b11 along the second direction Y gradually increase, this allows the projected area on the substrate 11 of the plurality of first sub-partitions arranged along the direction from the center of the first partition 11b11 to the other side of the first partition 11b11 to gradually increase. In the direction of partition 11b11, the area of ​​the redundant portion 191 on the side of the mask layer 17 away from the substrate 11 first decreases and then increases. That is, in the direction of the display area 11a pointing to the first partition 11b11, the area of ​​the redundant portion 191 in the middle region of the first partition 11b11 is minimized. This can effectively reduce the probability of wrinkles in the redundant portion 191 in the middle region of the first partition 11b11, thereby improving the positional offset of the connection pad 12 of the display area 11a of the substrate 11 caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10. By arranging a plurality of second sub-partitions along the direction from the display area 11a to the second area 11b2, the projected area on the substrate 11 first increases and then decreases; by arranging a plurality of second sub-partitions along the direction from the center of the second area 11b2 to one side of the second direction Y of the second area 11b2, the projected area on the substrate 11 gradually increases; by arranging a plurality of second sub-partitions along the direction from the center of the second area 11b2 to the other side of the second direction Y of the second area 11b2, the projected area on the substrate 11 gradually increases. This allows for a gradual increase in the projected area from the display area 11a to the second area 11b2. In the direction of 11b2, the area of ​​the redundant portion 191 on the side of the mask layer 17 away from the substrate 11 first decreases and then increases. That is, in the direction from the display area 11a to the second area 11b2, the area of ​​the redundant portion 191 in the middle region of the second area 11b2 is minimized. This can effectively reduce the probability of wrinkles in the redundant portion 191 in the middle region of the second area 11b2, thereby improving the positional offset of the connection pad 12 of the display area 11a of the substrate 11 caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10.

[0164] In one embodiment, the first region 11b1 includes a third region 11b12 and a fourth region 11b13 disposed opposite to each other along the second direction Y; the third region 11b12 is connected to the first region 11b11 and the second region 11b2 on both sides along the first direction X; the fourth region 11b13 is connected to the first region 11b11 and the second region 11b2 on both sides along the first direction X; the second direction Y intersects the first direction X, and both the second direction Y and the first direction X are perpendicular to the thickness direction of the substrate 11;

[0165] A plurality of second partition openings 172 are formed on the mask layer 17, including:

[0166] Multiple third sub-partitions and multiple fourth sub-partitions are formed on the mask layer 17; the orthographic projection of the multiple third sub-partitions on the substrate 11 is located in the third partition 11b12; the multiple third sub-partitions arranged along the direction from the display area 11a to the third partition 11b12 have an orthographic projection area on the substrate 11 that first increases and then decreases; the multiple third sub-partitions arranged along the center of the third partition 11b12 to the direction of the third partition 11b12 along the first direction X have an orthographic projection area on the substrate 11 that gradually increases; the multiple third sub-partitions arranged along the center of the third partition 11b12 to the direction of the third partition 11b12 along the other side of the first direction X have an orthographic projection area on the substrate 11 that gradually increases.

[0167] The orthographic projection of multiple fourth sub-partitions on the substrate 11 is located in the fourth partition 11b13; the orthographic projection area of ​​multiple fourth sub-partitions arranged along the direction from the display area 11a to the fourth partition 11b13 first increases and then decreases on the substrate 11; the orthographic projection area of ​​multiple fourth sub-partitions arranged along the center of the fourth partition 11b13 to the side of the fourth partition 11b13 along the first direction X gradually increases; the orthographic projection area of ​​multiple fourth sub-partitions arranged along the center of the fourth partition 11b13 to the other side of the fourth partition 11b13 along the first direction X gradually increases.

[0168] Thus, by arranging a plurality of third sub-partitions along the direction pointing from the display area 11a to the third partition 11b12, the projected area on the substrate 11 first increases and then decreases; the plurality of third sub-partitions arranged along the center of the third partition 11b12 pointing to one side of the third partition 11b12 along the first direction X, the projected area on the substrate 11 gradually increases; the plurality of third sub-partitions arranged along the center of the third partition 11b12 pointing to the other side of the third partition 11b12 along the first direction X, the projected area on the substrate 11 gradually increases. This allows the projected area of ​​the plurality of third sub-partitions along the direction pointing from the display area 11a to the third partition 11b12 to gradually increase. In the direction of the third partition 11b12, the area of ​​the redundant portion 191 on the side of the mask layer 17 away from the substrate 11 first decreases and then increases. That is, in the direction from the display area 11a to the third partition 11b12, the area of ​​the redundant portion 191 in the middle region of the third partition 11b12 is minimized. This can effectively reduce the probability of wrinkles in the redundant portion 191 in the middle region of the third partition 11b12, thereby improving the positional offset of the connection pad 12 of the display area 11a of the substrate 11 caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10. By arranging a plurality of fourth sub-partitions along the direction pointing from the display area 11a to the fourth partition 11b13, the projected area on the substrate 11 first increases and then decreases; the plurality of fourth sub-partitions arranged along the center of the fourth partition 11b13 pointing to one side of the fourth partition 11b13 along the first direction X, the projected area on the substrate 11 gradually increases; the plurality of fourth sub-partitions arranged along the center of the fourth partition 11b13 pointing to the other side of the fourth partition 11b13 along the first direction X, the projected area on the substrate 11 gradually increases. Thus, the projected area on the display area 11a pointing to the fourth partition 11b13 can be made larger and smaller. In the direction of partition 11b13, the area of ​​the redundant portion 191 on the side of the mask layer 17 away from the substrate 11 first decreases and then increases. That is, in the direction from the display area 11a to the fourth partition 11b13, the area of ​​the redundant portion 191 in the middle region of the fourth partition 11b13 is minimized. This can effectively reduce the probability of wrinkles in the redundant portion 191 in the middle region of the fourth partition 11b13, thereby improving the positional offset of the connection pad 12 of the display area 11a of the substrate 11 caused by wrinkles, reducing the probability of metal residue on the substrate 11, and improving the reliability of the display panel 10.

[0169] In one embodiment, see [reference] Figure 14 As shown, in step S30, a plurality of first partition openings 171 and a plurality of second partition openings 172 are formed on the mask layer 17, including:

[0170] A plurality of first isolation openings 171 and a plurality of second isolation openings 172 are formed on the mask layer 17; the cross-sectional area of ​​the first isolation openings 171 gradually decreases along the direction away from the substrate 11; the cross-sectional area of ​​the second isolation openings 172 gradually decreases along the direction away from the substrate 11.

[0171] Thus, by gradually reducing the cross-sectional area of ​​the first partition opening 171 in the direction away from the substrate 11, and gradually reducing the cross-sectional area of ​​the second partition opening 172 in the direction away from the substrate 11, that is, the cross-sectional shape of the first partition opening 171 and the second partition opening 172 can be trapezoidal, thereby allowing the vapor-deposited pad film layer 19 to be disconnected at the first partition opening 171 and the second partition opening 172, so that the redundant portion 191 on the side of the mask layer 17 away from the substrate 11 is disconnected from the connecting pad 12 in the first partition opening 171 and the virtual pad 13 in the second partition opening 172, reducing the area of ​​the redundant portion 191, reducing the probability of wrinkling of the redundant portion 191, and thus improving the positional offset of the connecting pad 12 of the display area 11a of the substrate 11 caused by wrinkles, thereby improving the reliability of the display panel 10.

[0172] In one embodiment, see [reference] Figure 13 and Figure 14 As shown, S20, before forming the mask layer 17 on one side of the substrate 11, includes:

[0173] S20a. An insulating film layer 18 is formed on one side of the substrate 11;

[0174] S20b, A through hole 151 is formed on the insulating film layer 18 located in the display area 11a, and a conductive part 16 is formed in the through hole 151.

[0175] In this way, the virtual pad 13 can be separated from the metal layer in the substrate 11 by the insulating layer 15, and the conductive part 16 in the through hole 151 can be used to connect the connection pad 12 to the device in the substrate 11, thereby improving the reliability of the display panel 10.

[0176] Thirdly, see Figure 15 As shown, this application embodiment also provides a display device 20, including a display panel 10 provided according to the first aspect or a display panel 10 prepared using the preparation method of the second aspect. This improves the reliability of the display device 20.

[0177] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0178] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: A substrate, comprising a display area and a non-display area disposed around the display area; Multiple connection pads are spaced apart on one side of the substrate; the orthographic projection of the multiple connection pads on the substrate is located in the display area; Multiple virtual pads are spaced apart on one side of the substrate; the orthographic projection of the multiple virtual pads on the substrate is located in the non-display area, and the multiple virtual pads are arranged on the same layer as the multiple connecting pads.

2. The display panel according to claim 1, characterized in that, Of the plurality of virtual pads arranged in a direction away from the display area, at least two virtual pads have unequal projected areas on the substrate.

3. The display panel according to claim 1 or 2, characterized in that, The non-display area includes a first area and a second area; the first area is located around the second area. The plurality of virtual pads includes a plurality of first virtual pads and a plurality of second virtual pads; The orthogonal projection of the plurality of first virtual pads on the substrate is located in the first region; The orthogonal projection of the plurality of second virtual pads on the substrate is located in the second region.

4. The display panel according to claim 3, characterized in that, The second region includes a bonding region, and the orthographic projections of the plurality of second virtual pads on the substrate are arranged around at least a portion of the outer periphery of the bonding region.

5. The display panel according to claim 3, characterized in that, The first region includes a first partition, which is disposed opposite to the second region along a first direction; the first direction is perpendicular to the thickness direction of the substrate. The first virtual pads, arranged along the direction from the display area to the first partition, have a projected area on the substrate that first increases and then decreases.

6. The display panel according to claim 5, characterized in that, The display area includes a first sub-side and a second sub-side that are disposed opposite to each other along the first direction, and the first sub-side is disposed adjacent to the first partition. The first virtual pads, arranged along the center of the first partition in the direction pointing to the first sub-side, have a gradually decreasing projected area on the substrate.

7. The display panel according to claim 6, characterized in that, The first virtual pads, arranged along the direction from the center of the first partition to the first sub-side, have a gradually decreasing size in their orthogonal projection onto the substrate along the first direction. The first virtual pads, arranged along the direction from the center of the first partition to the first sub-side, have a size that gradually decreases along the second direction when projected onto the substrate. The second direction intersects the first direction, and both the second direction and the first direction are perpendicular to the thickness direction of the substrate.

8. The display panel according to claim 5, characterized in that, The display panel includes a first side and a second side disposed opposite to each other along a first direction, wherein the first side is disposed adjacent to the first partition. The first virtual pads, arranged along the center of the first partition and pointing towards the first side, have a gradually decreasing projected area on the substrate.

9. The display panel according to claim 8, characterized in that, The first virtual pads, arranged along the direction from the center of the first partition to the first side, have an orthographic projection on the substrate whose size gradually decreases along the first direction. The first virtual pads, arranged along the direction from the center of the first partition to the first side, have a size that gradually decreases along the second direction when projected onto the substrate. The second direction intersects the first direction, and both the second direction and the first direction are perpendicular to the thickness direction of the substrate.

10. The display panel according to claim 3, characterized in that, The first region includes a first partition, which is disposed opposite to the second region along a first direction; the first direction is perpendicular to the thickness direction of the substrate. The first virtual pads, arranged along the center of the first partition and pointing to one side of the first partition along the second direction, have an increasing orthogonal projection area on the substrate. Wherein, the second direction intersects with the first direction, and both the second direction and the first direction are perpendicular to the thickness direction of the substrate.

11. The display panel according to claim 10, characterized in that, The first virtual pads, which are arranged along the center of the first partition and pointing to one side of the first partition along the second direction, have an orthogonal projection on the substrate with a size that gradually increases along the first direction. The first virtual pads, arranged along the center of the first partition and pointing to one side of the first partition in the second direction, have an orthographic projection on the substrate whose size gradually increases along the second direction.

12. The display panel according to claim 10, characterized in that, The first virtual pads, which are arranged along the center of the first partition and pointing to the other side of the first partition along the second direction, have an increasing orthogonal projection area on the substrate.

13. The display panel according to claim 12, characterized in that, The first virtual pads, which are arranged along the center of the first partition and pointing to the other side of the first partition along the second direction, have an orthogonal projection on the substrate with a size that gradually increases along the first direction. The first virtual pads, which are arranged along the center of the first partition and pointing to the other side of the first partition along the second direction, have an orthographic projection on the substrate whose size gradually increases along the second direction.

14. The display panel according to claim 3, characterized in that, The multiple second virtual pads arranged along the direction from the display area to the second area have a projected area on the substrate that first increases and then decreases.

15. The display panel according to claim 14, characterized in that, The display area includes a first sub-side and a second sub-side disposed opposite to each other along a first direction, the first direction being perpendicular to the thickness direction of the substrate; the second sub-side is disposed adjacent to the second area; a plurality of second virtual pads are arranged along the direction from the center of the second area to the second sub-side, and the projected area on the substrate gradually decreases.

16. The display panel according to claim 15, characterized in that, The plurality of second virtual pads, arranged along the direction from the center of the second region to the second sub-side, have a size that gradually decreases along the first direction when projected onto the substrate. The size of the second virtual pads, which are arranged along the direction from the center of the second region to the second sub-side, gradually decreases along the second direction when projected onto the substrate. Wherein, the second direction intersects with the first direction, and both the second direction and the first direction are perpendicular to the thickness direction of the substrate.

17. The display panel according to claim 14, characterized in that, The display panel includes a first side and a second side disposed opposite to each other along a first direction, the second side being disposed adjacent to the second region; the first direction is perpendicular to the thickness direction of the substrate; The second virtual pads, arranged along the direction from the center of the second region to the second side, have a gradually decreasing projected area on the substrate.

18. The display panel according to claim 17, characterized in that, The size of the plurality of second virtual pads arranged along the direction from the center of the second region to the second side gradually decreases along the first direction when projected onto the substrate. The size of the plurality of second virtual pads arranged along the direction from the center of the second region to the second side gradually decreases along the second direction when projected onto the substrate. Wherein, the second direction intersects with the first direction, and both the second direction and the first direction are perpendicular to the thickness direction of the substrate.

19. The display panel according to claim 3, characterized in that, The second virtual pads, arranged along the center of the second region and pointing to one side of the second region in the second direction, have an increasing orthogonal projection area on the substrate. The second direction is perpendicular to the thickness direction of the substrate.

20. The display panel according to claim 19, characterized in that, A plurality of second virtual pads are arranged along the center of the second region and pointing to one side of the second region along the second direction. The size of their orthogonal projection on the substrate gradually increases along the first direction. The first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate. The second virtual pads, arranged along the center of the second region and pointing to one side of the second region in the second direction, have an orthographic projection on the substrate whose size gradually increases along the second direction.

21. The display panel according to claim 19, characterized in that, The second virtual pads, arranged along the center of the second region and pointing to the other side of the second region in the second direction, have an increasing orthogonal projection area on the substrate.

22. The display panel according to claim 21, characterized in that, A plurality of second virtual pads, arranged along the center of the second region and pointing to the other side of the second region along the second direction, have an orthographic projection on the substrate whose size gradually increases along the first direction; the first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate; The second virtual pads, which are arranged along the center of the second region and pointing to the other side of the second region along the second direction, have an orthographic projection on the substrate whose size gradually increases along the second direction.

23. The display panel according to claim 5, characterized in that, The first area further includes a third section and a fourth section arranged opposite to each other along a second direction; the third section is connected to the first section and the second area on both sides along the first direction; the fourth section is connected to the first section and the second area on both sides along the first direction. The plurality of virtual pads includes a plurality of third virtual pads and a plurality of fourth virtual pads; the orthographic projection of the plurality of third virtual pads on the substrate is located in the third partition; the orthographic projection of the plurality of fourth virtual pads on the substrate is located in the fourth partition; The second direction intersects with the second direction, and the intersection of the second direction and the second direction is perpendicular to the thickness direction of the substrate.

24. The display panel according to claim 23, characterized in that, The plurality of third virtual pads, arranged along the direction from the display area to the third partition, have a projected area on the substrate that first increases and then decreases.

25. The display panel according to claim 24, characterized in that, The display area includes a third sub-side and a fourth sub-side disposed opposite to each other along the second direction, wherein the third sub-side is disposed adjacent to the third partition. The plurality of third virtual pads, arranged along the direction from the center of the third partition to the third sub-side, have a gradually decreasing projected area on the substrate.

26. The display panel according to claim 25, characterized in that, The plurality of third virtual pads arranged along the direction from the center of the third partition to the third sub-side have a gradually decreasing size in their orthogonal projection onto the substrate along the first direction; the first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate; The plurality of third virtual pads, arranged along the direction from the center of the third partition to the third sub-side, have a gradually decreasing size in their orthogonal projection onto the substrate along the second direction.

27. The display panel according to claim 24, characterized in that, The display panel includes a third side and a fourth side disposed opposite to each other along the second direction, wherein the third side is disposed adjacent to the third partition. The multiple third virtual pads arranged along the direction from the center of the third partition to the third side have a gradually decreasing projected area on the substrate.

28. The display panel according to claim 27, characterized in that, A plurality of third virtual pads are arranged along the direction from the center of the third partition to the third side, and the size of their orthogonal projection on the substrate gradually decreases along the first direction; the first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate; The third virtual pads, arranged along the direction from the center of the third partition to the third side, have a gradually decreasing size in their orthogonal projection onto the substrate along the second direction.

29. The display panel according to claim 23, characterized in that, The plurality of third virtual pads, arranged along the center of the third partition and pointing to one side of the third partition along the first direction, have an increasing orthogonal projection area on the substrate; the first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate.

30. The display panel according to claim 29, characterized in that, The plurality of third virtual pads, which are arranged along the center of the third partition and pointing to one side of the third partition along the first direction, have an orthogonal projection on the substrate whose size gradually increases along the first direction. The plurality of third virtual pads, arranged along the center of the third partition and pointing to one side of the third partition in the first direction, have an orthographic projection on the substrate whose size gradually increases along the second direction.

31. The display panel according to claim 29, characterized in that, The plurality of third virtual pads, arranged along the center of the third partition and pointing to the other side of the third partition along the first direction, have an increasing orthogonal projection area on the substrate.

32. The display panel according to claim 31, characterized in that, The plurality of third virtual pads, which are arranged along the center of the third partition and in a direction pointing to the other side of the third partition along the first direction, have an orthogonal projection on the substrate whose size gradually increases along the first direction. The plurality of third virtual pads, which are arranged along the center of the third partition and in a direction pointing to the other side of the third partition along the first direction, have an orthogonal projection on the substrate with a size that gradually increases along the second direction.

33. The display panel according to claim 23, characterized in that, The multiple fourth virtual pads arranged along the direction from the display area to the fourth partition have a projected area on the substrate that first increases and then decreases.

34. The display panel according to claim 33, characterized in that, The display area includes a third sub-side and a fourth sub-side that are arranged opposite to each other along the second direction, and the fourth sub-side is arranged adjacent to the fourth partition. The multiple fourth virtual pads, arranged along the direction from the center of the fourth partition to the fourth sub-side, have a gradually decreasing projected area on the substrate.

35. The display panel according to claim 34, characterized in that, The plurality of fourth virtual pads, arranged along the direction from the center of the fourth partition to the fourth sub-side, have a gradually decreasing size in their orthogonal projection onto the substrate along a first direction; the first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate; The plurality of fourth virtual pads, arranged along the direction from the center of the fourth partition to the fourth sub-side, have a gradually decreasing size in their orthogonal projection onto the substrate along the second direction.

36. The display panel according to claim 33, characterized in that, The display panel includes a third side and a fourth side disposed opposite to each other along the second direction, wherein the fourth side is disposed adjacent to the fourth partition. The multiple fourth virtual pads, arranged along the direction from the center of the fourth partition to the fourth side, have a gradually decreasing projected area on the substrate.

37. The display panel according to claim 36, characterized in that, The plurality of fourth virtual pads arranged along the direction from the center of the fourth partition to the fourth side have a gradually decreasing size in the orthographic projection on the substrate along the first direction; the first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate; The plurality of fourth virtual pads, arranged along the direction from the center of the fourth partition to the fourth side, have a gradually decreasing size in their orthogonal projection onto the substrate along the second direction.

38. The display panel according to claim 23, characterized in that, The plurality of fourth virtual pads, which are arranged along the center of the fourth partition and pointing to one side of the fourth partition in the first direction, have an increasing orthogonal projection area on the substrate. The first direction intersects the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the substrate.

39. The display panel according to claim 38, characterized in that, The plurality of fourth virtual pads, which are arranged along the center of the fourth partition and pointing to one side of the fourth partition along the first direction, have an orthogonal projection on the substrate whose size gradually increases along the first direction. The plurality of fourth virtual pads, arranged along the center of the fourth partition and pointing to one side of the fourth partition in the first direction, have an orthographic projection on the substrate whose size gradually increases along the second direction.

40. The display panel according to claim 38, characterized in that, The plurality of fourth virtual pads, which are arranged along the center of the fourth partition and in a direction pointing to the other side of the fourth partition along the first direction, have an increasing orthogonal projection area on the substrate.

41. The display panel according to claim 40, characterized in that, The plurality of fourth virtual pads, which are arranged along the center of the fourth partition and in a direction pointing to the other side of the fourth partition along the first direction, have an orthogonal projection on the substrate whose size gradually increases along the first direction. The plurality of fourth virtual pads, which are arranged along the center of the fourth partition and pointing to the other side of the fourth partition along the first direction, have an orthographic projection on the substrate whose size gradually increases along the second direction.

42. The display panel according to any one of claims 1, 2, 4 to 41, characterized in that, The connection pad includes a eutectic layer; the virtual pad includes a conductive layer; the conductive layer and the eutectic layer are disposed on the same layer, and the conductive layer and the eutectic layer are made of the same material.

43. The display panel according to any one of claims 1, 2, 4 to 41, characterized in that, The orthographic projection of the virtual pad on the substrate includes at least one of a circle, a polygon, and an ellipse.

44. The display panel according to any one of claims 1, 2, 4 to 41, characterized in that, It also includes multiple light-emitting units, which correspond to the multiple connection pads; the electrodes on the light-emitting units are connected to the corresponding connection pads.

45. The display panel according to any one of claims 1, 2, 4 to 41, characterized in that, It also includes an insulating layer disposed on one side of the substrate, wherein the virtual pad and the connection pad are both disposed on the side of the insulating layer away from the substrate; a through hole is provided on the insulating layer located in the display area, and a conductive part is disposed in the through hole, the conductive part being connected to the connection pad.

46. ​​A method for manufacturing a display panel, characterized in that, include: A substrate is provided, the substrate including a display area and a non-display area disposed around the display area; A mask layer is formed on one side of the substrate, and the orthographic projection of the mask layer on the substrate covers the display area and the non-display area; A plurality of first isolation openings and a plurality of second isolation openings are formed on the mask layer; the orthographic projection of the plurality of first isolation openings on the substrate is located in the display area; the orthographic projection of the plurality of second isolation openings on the substrate is located in the non-display area. A pad film layer is formed on the side of the mask layer away from the substrate; the pad film layer includes a plurality of connecting pads corresponding to the plurality of first partition openings, a plurality of virtual pads corresponding to the plurality of second partition openings, and a redundant portion on the surface of the mask layer away from the substrate; the connecting pads and the redundant portion are spaced apart; the virtual pads and the redundant portion are spaced apart. Remove the mask layer and the redundant portion.

47. The method for manufacturing a display panel according to claim 46, characterized in that, The step of forming a plurality of first partition openings and a plurality of second partition openings on the mask layer includes: A plurality of first isolation openings are formed on the mask layer, and the orthographic projection of the plurality of first isolation openings on the substrate is located in the display area; A plurality of second partition openings are formed on the mask layer, the orthographic projection of the plurality of second partition openings on the substrate is located in the non-display area; and at least two of the plurality of second partition openings arranged in a direction away from the display area have unequal orthographic projection areas on the substrate.

48. The method for manufacturing a display panel according to claim 47, characterized in that, The non-display area includes a first area and a second area. The first area includes a first partition, which is disposed opposite to the second area along a first direction. The second area includes a bonding area. The first direction is perpendicular to the thickness direction of the substrate. The step of forming a plurality of second partition openings on the mask layer includes: A plurality of first sub-partitions and a plurality of second sub-partitions are formed on the mask layer; the orthographic projection of the plurality of first sub-partitions on the substrate is located in the first partition; the plurality of first sub-partitions arranged along the direction from the display area to the first partition have an orthographic projection area on the substrate that first increases and then decreases; the plurality of first sub-partitions arranged along the center of the first partition to one side of the first partition along a second direction have an orthographic projection area on the substrate that gradually increases; the plurality of first sub-partitions arranged along the center of the first partition to the other side of the first partition along the second direction have an orthographic projection area that gradually increases; wherein, the second direction intersects the first direction, and both the second direction and the first direction are perpendicular to the thickness direction of the substrate; The orthographic projections of the plurality of second sub-partitions on the substrate are located in the second region, and the orthographic projections of the plurality of second sub-partitions on the substrate are arranged around at least a portion of the outer periphery of the bonding region; the orthographic projection area of ​​the plurality of second sub-partitions arranged along the direction from the display area to the second region first increases and then decreases on the substrate; the orthographic projection area of ​​the plurality of second sub-partitions arranged along the center of the second region to one side of the second region along the second direction gradually increases; the orthographic projection area of ​​the plurality of second sub-partitions arranged along the center of the second region to the other side of the second region along the second direction gradually increases.

49. The method for manufacturing a display panel according to claim 48, characterized in that, The first region includes a third region and a fourth region disposed opposite to each other along a second direction; the third region is connected to the first region and the second region on both sides along a first direction; the fourth region is connected to the first region and the second region on both sides along a first direction; the second direction intersects the first direction, and both the second direction and the first direction are perpendicular to the thickness direction of the substrate; The step of forming a plurality of second partition openings on the mask layer includes: A plurality of third sub-partitions and a plurality of fourth sub-partitions are formed on the mask layer; the orthographic projection of the plurality of third sub-partitions on the substrate is located in the third partition; the plurality of third sub-partitions arranged along the direction from the display area to the third partition have an orthographic projection area on the substrate that first increases and then decreases; the plurality of third sub-partitions arranged along the center of the third partition to one side of the third partition along the first direction have an orthographic projection area that gradually increases; the plurality of third sub-partitions arranged along the center of the third partition to the other side of the third partition along the first direction have an orthographic projection area that gradually increases. The orthographic projection of the plurality of fourth sub-partitions on the substrate is located in the fourth partition; the orthographic projection area of ​​the plurality of fourth sub-partitions arranged along the direction from the display area to the fourth partition first increases and then decreases on the substrate; the orthographic projection area of ​​the plurality of fourth sub-partitions arranged along the center of the fourth partition to one side of the fourth partition along the first direction gradually increases; the orthographic projection area of ​​the plurality of fourth sub-partitions arranged along the center of the fourth partition to the other side of the fourth partition along the first direction gradually increases.

50. The method for manufacturing a display panel according to claim 46, characterized in that, A plurality of first partition openings and a plurality of second partition openings are formed on the mask layer, including: A plurality of first isolation openings and a plurality of second isolation openings are formed on the mask layer; the cross-sectional area of ​​the first isolation openings gradually decreases in the direction away from the substrate; the cross-sectional area of ​​the second isolation openings gradually decreases in the direction away from the substrate.

51. The method for manufacturing a display panel according to claim 46, characterized in that, Before forming a mask layer on one side of the substrate, the process includes: An insulating film layer is formed on one side of the substrate; A through hole is formed on the insulating film layer located in the display area, and a conductive part is formed in the through hole.

52. A display device, characterized in that, This includes the display panel according to any one of claims 1 to 45 or the display panel prepared by the preparation method according to any one of claims 46 to 51.

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