Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a substrate; the isolation structure is positioned on one side of the substrate and comprises an isolation opening; a first electrode at least partially located in the isolation opening; the first luminescent material layer is positioned on one side, far away from the substrate, of the first electrode; the charge generation layer is positioned on one side, far away from the substrate, of the first light-emitting material layer; the second luminescent material layer is positioned on one side, far away from the substrate, of the charge generation layer; the second electrode is located on one side, away from the substrate, of the second light-emitting material layer. In the display panel adopting the isolation structure, the laminated light-emitting device is arranged to improve the light-emitting efficiency, and the first light-emitting material layer in the laminated light-emitting device extends to be in contact with the isolation structure, so that when a charge generation layer is subsequently arranged, the risk of electric leakage caused by contact between the charge generation layer and the isolation structure is reduced; the manufacturing error-tolerant rate of the display panel is improved, and the display effect is ensured.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the current manufacturing process of OLED display products needs improvement. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings in the prior art, the purpose of this application is to provide a display panel, the display panel comprising:

[0005] Substrate;

[0006] An isolation structure located on one side of the substrate, the isolation structure including an isolation opening;

[0007] The first electrode is located at least partially within the isolation opening;

[0008] A first light-emitting material layer is located on the side of the first electrode away from the substrate, and at least a portion of the first light-emitting material layer extends to contact the sidewall of the isolation structure facing the isolation opening;

[0009] A charge-generating layer is located on the side of the first light-emitting material layer away from the substrate, and the orthogonal projection of the charge-generating layer on the substrate is located within the orthogonal projection of the first light-emitting material layer on the substrate;

[0010] A second light-emitting material layer is located on the side of the charge-generating layer away from the substrate;

[0011] The second electrode is located on the side of the second luminescent material layer away from the substrate.

[0012] In some possible implementations, at least a portion of the second luminescent material layer extends to contact the sidewall of the isolation structure facing the isolation opening;

[0013] The orthogonal projection of the charge-generating layer on the substrate lies within the orthogonal projection of the second luminescent material layer on the substrate.

[0014] In some possible implementations, the display panel further includes a hole injection layer located between the first electrode and the first light-emitting material layer, wherein the orthographic projection of the hole injection layer on the substrate and the orthographic projection of the side of the isolation structure near the substrate on the substrate are separated by a gap.

[0015] In some possible implementations, at least a portion of the second electrode extends to contact the sidewall of the isolation structure facing the isolation opening;

[0016] The orthographic projection of the second luminescent material layer on the substrate lies within the orthographic projection of the second electrode on the substrate.

[0017] In some possible implementations, the display panel further includes a pixel defining layer located between the isolation structure and the substrate, the pixel defining layer including pixel openings, the orthographic projection of the pixel openings on the substrate being located within the orthographic projection of the isolation openings on the substrate.

[0018] In some possible implementations, the display panel further includes a packaging unit located on the side of the second electrode away from the substrate, the packaging unit extending from the isolation opening to the side of the isolation structure away from the substrate;

[0019] Preferably, at least two adjacent packaging units are separated by a gap located on the side of the isolation structure away from the substrate.

[0020] In some possible implementations, the display panel further includes a first encapsulation layer and a second encapsulation layer located on the side of the encapsulation unit and the isolation structure away from the substrate;

[0021] Preferably, the materials of the packaging unit and the second packaging layer include inorganic materials; the material of the first packaging layer includes organic materials.

[0022] In some possible implementations, the isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate, wherein the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate;

[0023] Preferably, the corrosion resistance of the support portion is weaker than that of the shielding portion;

[0024] Preferably, the material of the support portion includes aluminum, and / or the material of the shielding portion includes titanium.

[0025] In some possible implementations, the isolation structure further includes a receiving portion located between the support and the substrate;

[0026] Preferably, the orthographic projection of the receiving portion on the substrate is located within the orthographic projection of the blocking portion on the substrate;

[0027] Preferably, the material of the receiving part includes molybdenum.

[0028] Another object of this application is to provide a method for manufacturing a display panel, the method comprising:

[0029] Provide substrate;

[0030] A first electrode and an isolation structure are disposed on one side of the substrate, the isolation structure including an isolation opening, and at least a portion of the first electrode is located within the isolation opening;

[0031] A first light-emitting material layer, a charge-generating material layer, a second light-emitting material layer, and an electrode material layer are sequentially vapor-deposited from the side of the isolation structure away from the substrate; wherein, at least a portion of the first light-emitting material layer located within the isolation opening extends to contact the sidewall of the isolation structure facing the isolation opening, and the orthographic projection of the charge-generating material layer located within the isolation opening onto the substrate is located within the orthographic projection of the first light-emitting material layer onto the substrate;

[0032] The first light-emitting material layer, the charge-generating material layer, the second light-emitting material layer, and the electrode material layer are etched to form a first light-emitting material layer, a charge-generating layer, a second light-emitting material layer, and a second electrode that are sequentially stacked in a direction away from the substrate.

[0033] In some possible implementations, the step of sequentially depositing a first light-emitting material layer, a charge-generating material layer, a second light-emitting material layer, and an electrode material layer from the side of the isolation structure away from the substrate includes:

[0034] A first luminescent material layer is formed by vapor deposition from the side of the isolation structure away from the substrate using a first vapor deposition angle;

[0035] A charge-generating material layer is formed by evaporating from the side of the isolation structure away from the substrate using a second evaporation angle, wherein the first evaporation angle is greater than the second evaporation angle.

[0036] In some possible implementations, the step of sequentially depositing a first light-emitting material layer, a charge-generating material layer, a second light-emitting material layer, and an electrode material layer from the side of the isolation structure away from the substrate includes:

[0037] A third evaporation angle is used to deposit a second light-emitting material layer from the side of the isolation structure away from the substrate, where the third evaporation angle is greater than the second evaporation angle.

[0038] In some possible implementations, prior to the step of sequentially depositing the first light-emitting material layer, the charge-generating material layer, the second light-emitting material layer, and the electrode material layer from the side of the isolation structure away from the substrate, the method further includes:

[0039] A fourth evaporation angle is used to evaporate and form a hole injection material layer from the side of the isolation structure away from the substrate. The fourth evaporation angle is smaller than the first evaporation angle. There is a gap between the orthographic projection of the hole injection material layer located in the isolation opening on the substrate and the orthographic projection of the side of the isolation structure closer to the substrate on the substrate.

[0040] In some possible implementations, the step of sequentially depositing the first light-emitting material layer, the charge-generating material layer, the second light-emitting material layer, and the electrode material layer from the side of the isolation structure away from the substrate further includes:

[0041] An electrode material layer is formed by vapor deposition from the side of the isolation structure away from the substrate using a fifth vapor deposition angle, wherein the fifth vapor deposition angle is greater than the third vapor deposition angle.

[0042] Another object of this application is to provide an electronic device, the electronic device including the display panel provided in this application, or the electronic device including a display panel made by the manufacturing method of the display panel provided in this application.

[0043] Compared with the prior art, this application has the following beneficial effects:

[0044] This application provides a display panel and an electronic device. By setting a stacked light-emitting device in the display panel with an isolation structure to improve the luminous efficiency, and setting the first light-emitting material layer in the stacked light-emitting device to extend to contact the isolation structure, the risk of leakage caused by the contact between the charge generation layer and the isolation structure is reduced when the charge generation layer is subsequently set, thereby improving the fault tolerance of the display panel manufacturing and ensuring the display effect. Attached Figure Description

[0045] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 One of the schematic diagrams of the display panel provided in this embodiment;

[0047] Figure 2This is a second schematic diagram of the display panel provided in this embodiment;

[0048] Figure 3 This is one of the schematic diagrams of the isolation structure provided in this embodiment;

[0049] Figure 4 This is the third schematic diagram of the display panel provided in this embodiment;

[0050] Figure 5 This is the fourth schematic diagram of the display panel provided in this embodiment;

[0051] Figure 6 This is the second schematic diagram of the isolation structure provided in this embodiment;

[0052] Figure 7 This is a flowchart illustrating the steps of the manufacturing method for the display panel provided in this embodiment;

[0053] Figure 8 This is one of the schematic diagrams illustrating the manufacturing process of the display panel provided in this embodiment;

[0054] Figure 9 This is the second schematic diagram of the manufacturing process of the display panel provided in this embodiment.

[0055] Icons: 111-Substrate; 112-Array functional layer; 120-First electrode; 130-Pixel defining layer; 140-Isolation structure; 910-Isolation opening; 1401-Support portion; 1402-Shielding portion; 143-Receiving portion; 800-Light-emitting device; 151-Hole injection layer; 152-First light-emitting material layer; 153-Charge generation layer; 154-Second light-emitting material layer; 160-Second electrode; 1510-Hole injection material layer; 1520-First light-emitting material layer; 1530-Charge generation material layer; 1540-Second light-emitting material layer; 1540-Electrode material layer; 170-Encapsulation unit; 180-First encapsulation layer; 190-Second encapsulation layer. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0057] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0058] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0059] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0060] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0061] In some related technologies, an isolation structure is set in the display panel, so that different light-emitting devices can be formed in different isolation openings by patterned etching after the entire layer of organic light-emitting material is evaporated.

[0062] Among them, patent applications CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 describe relevant technical solutions for isolation structures (or partition structures or isolation columns), the contents of which are incorporated herein by reference.

[0063] Building upon this, to improve luminous efficiency, some related technologies employ a stacked luminous device within the isolation opening. This device comprises two stacked luminescent material layers and a charge-generation layer (CGL) located between them. However, this approach requires strict boundary control for the charge-generation layer. If the charge-generation layer contacts the isolation structure, lateral leakage can occur, affecting the display performance of the upper luminescent material layer.

[0064] In view of this, this embodiment provides a solution to reduce lateral leakage current in the display panel. The solution provided in this embodiment will be described in detail below.

[0065] Please see Figure 1 This application provides a display panel, which includes a substrate 111, an isolation structure 140, a first electrode 120, a first light-emitting material layer 152, a charge-generating layer 153, a second light-emitting material layer 154, and a second electrode 160.

[0066] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass; or the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0067] Optionally, an array functional layer 112 may also be disposed on one side of the substrate 111. The array functional layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layer structures of the array functional layer 112 can form multiple thin film transistors (TFTs) at different locations. The thin film transistors can cooperate with each other to form multiple pixel driving units or driving circuits.

[0068] The isolation structure 140 is located on one side of the substrate 111. For example, the isolation structure 140 may be located on the side of the array functional layer 112 away from the substrate 111. The isolation structure 140 may include a plurality of isolation openings 910, which are spaced apart. For example, see [link to relevant documentation]. Figure 2 , Figure 1 for Figure 2 The cross-sectional view at position AA shows that the isolation structure 140 may include multiple spaced isolation openings 910, and different light-emitting devices may be placed in different isolation openings 910.

[0069] Optionally, please see Figure 3The isolation structure 140 includes a support portion 141 and a shielding portion 142 located on the side of the support portion 141 away from the substrate 111. The orthographic projection of the support portion 141 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111.

[0070] At least a portion of the first electrode 120 is located within the isolation opening 910. That is, the isolation opening 910 exposes at least a portion of the first electrode 120.

[0071] The first light-emitting material layer 152 is located on the side of the first electrode 120 away from the substrate 111, and at least a portion of the first light-emitting material layer 152 extends to contact the sidewall of the isolation structure 140 toward the isolation opening 910.

[0072] The charge generation layer 153 is located on the side of the first light-emitting material layer 152 away from the substrate 111, and the orthogonal projection of the charge generation layer 153 on the substrate 111 lies within the orthogonal projection of the first light-emitting material layer 152 on the substrate 111. That is, the boundary of the charge generation layer 153 does not exceed the boundary of the first light-emitting material layer 152.

[0073] Optionally, in this embodiment, when the first light-emitting material layer 152 and the charge-generating layer 153 are formed by vapor deposition, due to the presence of the shielding portion 142 of the isolation structure 140, the first light-emitting material layer 152 and the charge-generating layer 153 formed by vapor deposition can have different coverage ranges by controlling the vapor deposition angle under its shielding effect.

[0074] The second light-emitting material layer 154 is located on the side of the charge-generating layer 153 away from the substrate 111.

[0075] The second electrode 160 is located on the side of the second light-emitting material layer 154 away from the substrate 111.

[0076] Based on the above design, in the solution provided in the embodiment, the first light-emitting material layer 152 in the stacked light-emitting device 800 is set to extend to contact the isolation structure 140 to form a larger coverage area. When the charge generation layer 153 is subsequently deposited, the risk of the charge generation layer 153 contacting the isolation structure 140 can be reduced, the fault tolerance rate of the manufacturing process can be improved, and the display effect can be guaranteed.

[0077] In some possible implementations, at least a portion of the second light-emitting material layer 154 extends to contact the sidewall of the isolation structure 140 facing the isolation opening 910. The orthographic projection of the charge-generating layer 153 onto the substrate 111 lies within the orthographic projection of the second light-emitting material layer 154 onto the substrate 111. That is, the second light-emitting material layer 154 covers the boundary of the charge-generating layer 153.

[0078] In this way, the second electrode 160 subsequently formed on the second light-emitting material layer 154 will not directly contact the charge generation layer 153, thereby avoiding leakage between the charge generation layer 153 and the second electrode 160, which would affect the light-emitting effect of the second light-emitting material layer 154.

[0079] For some possible implementations, please refer again. Figure 2 The display panel also includes a hole injection layer 151 located between the first electrode 120 and the first light-emitting material layer 152, and there is a gap between the orthogonal projection of the hole injection layer 151 on the substrate 111 and the orthogonal projection of the side of the isolation structure 140 near the substrate 111 on the substrate 111.

[0080] That is, in this embodiment, the boundary of the hole injection layer 151 can be limited by controlling the evaporation angle during evaporation to avoid the hole injection layer 151 contacting the isolation structure 140 and causing lateral leakage.

[0081] In some possible implementations, at least a portion of the second electrode 160 extends to contact the sidewall of the isolation structure 140 toward the isolation opening 910. The orthographic projection of the second light-emitting material layer 154 onto the substrate 111 lies within the orthographic projection of the second electrode 160 onto the substrate 111.

[0082] That is, the coverage area of ​​the second electrode 160 exceeds the coverage area of ​​the second light-emitting material layer 154, thus ensuring that the second electrode 160 is in electrical contact with the isolation structure 140.

[0083] Optionally, the first electrode 120 can be connected to the pixel driving circuit in the array functional layer 112, and the second electrode 160 can be connected to the common voltage supply circuit through the isolation structure 140. When there is a potential difference between the first electrode 120 and the second electrode 160, the first light-emitting material layer 152 and the second light-emitting material layer 154 located between the first electrode 120 and the second electrode 160 are driven to emit light.

[0084] In some possible implementations, the display panel also includes a pixel defining layer 130 located between the isolation structure 140 and the substrate 111. The pixel defining layer 130 includes pixel openings, the orthographic projection of which onto the substrate 111 lies within the orthographic projection of the isolation opening 910 onto the substrate 111.

[0085] Optionally, in this embodiment, the first electrode 120 can be fabricated first, and then the pixel defining layer 130 and the isolation structure 140 can be fabricated, and the connected pixel opening and the isolation opening 910 can be made to expose the first electrode 120.

[0086] See also some possible implementations. Figure 4The display panel also includes a packaging unit 170 located on the side of the second electrode 160 away from the substrate 111, the packaging unit 170 extending from the isolation opening 910 to the side of the isolation structure 140 away from the substrate 111.

[0087] Optionally, at least two adjacent packaging units 170 have a gap between them, the gap being located on the side of the isolation structure 140 away from the substrate 111.

[0088] See also some possible implementations. Figure 5 The display panel also includes a first encapsulation layer 180 and a second encapsulation layer 190 located on the side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 111.

[0089] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials; the material of the first encapsulation layer 180 includes organic materials. For example, the encapsulation unit 170 and the second encapsulation layer 190 can be formed by chemical vapor deposition (CVD), and the first encapsulation layer 180 can be formed by inkjet printing (IJP).

[0090] In some possible implementations, the corrosion resistance of the support portion 141 is weaker than that of the shielding portion 142.

[0091] Optionally, the material of the support portion 141 may include aluminum, and / or the material of the shielding portion 142 may include titanium.

[0092] See also some possible implementations. Figure 6 The isolation structure 140 also includes a receiving portion 143 located between the support portion 141 and the substrate 111.

[0093] Optionally, the orthographic projection of the receiving portion 143 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111.

[0094] Preferably, the material of the receiving part 143 includes molybdenum.

[0095] Please see Figure 7 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0096] Step S110: Provide substrate 111.

[0097] In step S120, a first electrode 120 and an isolation structure 140 are disposed on one side of the substrate 111. The isolation structure 140 includes an isolation opening 910, and at least a portion of the first electrode 120 is located within the isolation opening 910.

[0098] In step S130, a first light-emitting material layer 1520, a charge-generating material layer 1530, a second light-emitting material layer 1540, and an electrode material layer 1600 are sequentially vapor-deposited from the side of the isolation structure 140 away from the substrate 111. At least a portion of the first light-emitting material layer 1520 located within the isolation opening 910 extends to contact the sidewall of the isolation structure 140 facing the isolation opening 910, and the orthographic projection of the charge-generating material layer 1530 located within the isolation opening 910 on the substrate 111 is located within the orthographic projection of the first light-emitting material layer 1520 on the substrate 111.

[0099] Please see Figure 8 In this embodiment, the first light-emitting material layer 1520, the charge-generating material layer 1530, the second light-emitting material layer 1540, and the electrode material layer 1600 can all be deposited using a whole-layer vapor deposition method. In this case, after the vapor deposition operation is completed, at least a portion of the first light-emitting material layer 1520, the charge-generating material layer 1530, the second light-emitting material layer 1540, and the electrode material layer 1600 are located within the isolation opening 910, and at least a portion of the first light-emitting material layer 1520, the charge-generating material layer 1530, the second light-emitting material layer 1540, and the electrode material layer 1600 are located on the side of the isolation structure 140 away from the substrate 111.

[0100] The first light-emitting material layer 1520, the charge-generating material layer 1530, the second light-emitting material layer 1540, and the electrode material layer 1600 located within the isolation opening 910 may have different boundary ranges.

[0101] In step S140, the first light-emitting material layer 1520, the charge-generating material layer 1530, the second light-emitting material layer 1540 and the electrode material layer 1600 are etched to form the first light-emitting material layer 152, the charge-generating layer 153, the second light-emitting material layer 154 and the second electrode 160, which are sequentially stacked along the direction away from the substrate 111.

[0102] Please see Figure 9 In this embodiment, the first light-emitting material layer 1520, the charge-generating material layer 1530, the second light-emitting material layer 1540 and the electrode material layer 1600 located on the side of the isolation structure 140 away from the substrate 111 can be removed by patterned etching to form the first light-emitting material layer 152, the charge-generating layer 153, the second light-emitting material layer 154 and the second electrode 160 located in the isolation opening 910.

[0103] In this embodiment, the first light-emitting material layer 152, the charge-generating layer 153, the second light-emitting material layer 154, and the second electrode 160 can all be formed by patterned etching after whole-layer vapor deposition. The formation boundaries of different film layers within the isolation opening 910 can be defined by setting different vapor deposition angles.

[0104] Optionally, in some possible implementations, step S130 may include the following sub-steps.

[0105] In step S131, a first light-emitting material layer 1520 is formed by vapor deposition from the side of the isolation structure 140 away from the substrate 111 using a first vapor deposition angle θ1.

[0106] In step S132, a charge generation material layer 1530 is formed by vapor deposition from the side of the isolation structure 140 away from the substrate 111 using a second vapor deposition angle θ2. The first vapor deposition angle θ1 is greater than the second vapor deposition angle θ2.

[0107] Please see Figure 7 Since the shielding part 142 and the supporting part 141 of the isolation structure 140 form an undercut structure, the position of the boundary of the vapor-deposited film layer below the shielding part 142 can be controlled by controlling the vapor deposition angle of the vapor deposition source.

[0108] Setting the first evaporation angle θ1 when evaporating the first light-emitting material layer 1520 to be greater than the second evaporation angle θ2 when evaporating the charge-generating material layer 1530 can make the formed first light-emitting material layer 152 have a larger coverage area, ensuring that the orthogonal projection of the charge-generating layer 153 on the substrate 111 is located within the orthogonal projection of the first light-emitting material layer 152 on the substrate 111.

[0109] In some possible implementations, step S130 may also include the following sub-steps.

[0110] In step S133, a second light-emitting material layer 1540 is formed by evaporating from the side of the isolation structure 140 away from the substrate 111 using a third evaporation angle θ3. The third evaporation angle θ3 is greater than the second evaporation angle θ2.

[0111] Setting the third evaporation angle θ3 when evaporating the second light-emitting material layer 1540 to be greater than the second evaporation angle θ2 when evaporating the charge-generating material layer 1530 can result in a larger coverage area. This ensures that the orthogonal projection of the charge-generating layer 153 on the substrate 111 is within the orthogonal projection of the second light-emitting material layer 154 on the substrate 111, thus ensuring that the second light-emitting material layer 154 covers the charge-generating layer 153. This avoids direct contact between the second electrode 160 formed by subsequent evaporation and the charge-generating layer 153.

[0112] In some possible implementations, the method provided in this embodiment may also employ a fourth evaporation angle θ4 before step S131 to evaporate and form a hole injection material layer 1510 from the side of the isolation structure 140 away from the substrate 111. The fourth evaporation angle θ4 is smaller than the second evaporation angle θ2. There is a gap between the orthographic projection of the hole injection material layer 1510 located in the isolation opening 910 on the substrate 111 and the orthographic projection of the side of the isolation structure 140 close to the substrate 111 on the substrate 111.

[0113] That is, the first evaporation angle θ1 when evaporating the first light-emitting material layer 1520 is set to be greater than the fourth evaporation angle θ4 when evaporating the hole injection material layer 1510, thereby ensuring that the formed first light-emitting material layer 152 covers the hole injection layer 151, avoiding direct contact between the subsequently formed charge generation layer 153 and the hole injection layer 151, and the fourth evaporation angle θ4 can prevent the hole injection layer 151 from being separated from the isolation structure 140 and causing lateral leakage.

[0114] In some possible implementations, step S130 may also include the following sub-steps.

[0115] In step S134, an electrode material layer 1600 is formed by vapor deposition from the side of the isolation structure 140 away from the substrate 111 using a fifth vapor deposition angle θ5. The fifth vapor deposition angle θ5 is greater than the third vapor deposition angle θ3.

[0116] Setting the fifth evaporation angle θ5 when evaporating the electrode material layer 1600 to be greater than the third evaporation angle θ3 when evaporating the second light-emitting material layer 1540 can ensure that the second electrode 160 formed by evaporation extends beyond the second light-emitting material layer 154, and ensure that the second electrode 160 is in contact with the sidewall of the isolation structure 140.

[0117] Optionally, in step S130, a full-coverage encapsulation material layer can be deposited by vapor deposition, and then in step S140, the encapsulation unit 170 can be etched.

[0118] This application also provides an electronic device, which includes the display panel provided in this application, or a display panel manufactured using the manufacturing method of the display panel provided in this application. The electronic device may include devices with display functions such as mobile phones, tablets, smart wearable devices, televisions, laptops, and monitors.

[0119] In summary, this application provides a display panel and an electronic device. By setting a stacked light-emitting device in a display panel with an isolation structure to improve luminous efficiency, and setting the first light-emitting material layer in the stacked light-emitting device to extend to contact the isolation structure, the risk of leakage caused by the contact between the charge generation layer and the isolation structure is reduced when the charge generation layer is subsequently set, thereby improving the manufacturing tolerance of the display panel and ensuring the display effect.

[0120] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0121] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Substrate; An isolation structure located on one side of the substrate, wherein an isolation opening is provided on the isolation structure; The first electrode, the orthographic projection of the first electrode on the substrate overlaps with the orthographic projection of the isolation opening on the substrate; A first light-emitting material layer is located on the side of the first electrode away from the substrate, and at least a portion of the first light-emitting material layer extends to contact the sidewall of the isolation structure facing the isolation opening; A charge-generating layer is located on the side of the first luminescent material layer away from the substrate, and the orthogonal projection of the charge-generating layer on the substrate lies within the orthogonal projection of the first luminescent material layer on the substrate.

2. The display panel according to claim 1, characterized in that, The display panel also includes: A second light-emitting material layer is located on the side of the charge-generating layer away from the substrate; The second electrode is located on the side of the second luminescent material layer away from the substrate.

3. The display panel according to claim 2, characterized in that, At least a portion of the second luminescent material layer extends to contact the sidewall of the isolation structure facing the isolation opening; The orthogonal projection of the charge-generating layer on the substrate lies within the orthogonal projection of the second luminescent material layer on the substrate.

4. The display panel according to claim 1, characterized in that, The display panel further includes a hole injection layer located between the first electrode and the first light-emitting material layer, wherein there is a gap between the orthogonal projection of the hole injection layer on the substrate and the orthogonal projection of the side of the isolation structure near the substrate on the substrate.

5. The display panel according to claim 2, characterized in that, At least a portion of the second electrode extends to contact the sidewall of the isolation structure facing the isolation opening; The orthographic projection of the second luminescent material layer on the substrate lies within the orthographic projection of the second electrode on the substrate.

6. The display panel according to claim 1, characterized in that, The display panel further includes a pixel defining layer located between the isolation structure and the substrate, the pixel defining layer including a pixel opening, the orthographic projection of the pixel opening on the substrate being located within the orthographic projection of the isolation opening on the substrate.

7. The display panel according to claim 2, characterized in that, The display panel further includes a packaging unit located on the side of the second electrode away from the substrate, the packaging unit extending from the isolation opening to the side of the isolation structure away from the substrate; Preferably, at least two adjacent packaging units are separated by a gap located on the side of the isolation structure away from the substrate.

8. The display panel according to claim 7, characterized in that, The display panel further includes a first encapsulation layer and a second encapsulation layer located on the side of the encapsulation unit and the isolation structure away from the substrate; Preferably, the materials of the packaging unit and the second packaging layer include inorganic materials; the material of the first packaging layer includes organic materials.

9. The display panel according to claim 1, characterized in that, The isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate, wherein the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; Preferably, the corrosion resistance of the support portion is weaker than that of the shielding portion; Preferably, the material of the support portion includes aluminum, and / or the material of the shielding portion includes titanium; Preferably, the isolation structure further includes a receiving portion located between the support portion and the substrate; Preferably, the orthographic projection of the receiving portion on the substrate is located within the orthographic projection of the blocking portion on the substrate; Preferably, the material of the receiving part includes molybdenum.

10. A method for manufacturing a display panel, characterized in that, The method includes: Provide substrate; A first electrode and an isolation structure are disposed on one side of the substrate. The isolation structure includes an isolation opening, and the orthographic projection of the first electrode on the substrate overlaps with the orthographic projection of the isolation opening on the substrate. A first light-emitting material layer, a charge-generating material layer, a second light-emitting material layer, and an electrode material layer are sequentially vapor-deposited from the side of the isolation structure away from the substrate; wherein, at least a portion of the first light-emitting material layer located within the isolation opening extends to contact the sidewall of the isolation structure facing the isolation opening, and the orthographic projection of the charge-generating material layer located within the isolation opening onto the substrate is located within the orthographic projection of the first light-emitting material layer onto the substrate; The first light-emitting material layer, the charge-generating material layer, the second light-emitting material layer, and the electrode material layer are etched to form a first light-emitting material layer, a charge-generating layer, a second light-emitting material layer, and a second electrode that are sequentially stacked in a direction away from the substrate.

11. The method according to claim 10, characterized in that, The step of sequentially depositing a first light-emitting material layer, a charge-generating material layer, a second light-emitting material layer, and an electrode material layer from the side of the isolation structure away from the substrate includes: A first luminescent material layer is formed by vapor deposition from the side of the isolation structure away from the substrate using a first vapor deposition angle; A charge-generating material layer is formed by evaporating from the side of the isolation structure away from the substrate using a second evaporation angle, wherein the first evaporation angle is greater than the second evaporation angle.

12. The method according to claim 11, characterized in that, The further step of sequentially depositing a first light-emitting material layer, a charge-generating material layer, a second light-emitting material layer, and an electrode material layer from the side of the isolation structure away from the substrate includes: A third evaporation angle is used to deposit a second light-emitting material layer from the side of the isolation structure away from the substrate, where the third evaporation angle is greater than the second evaporation angle.

13. The method according to claim 11, characterized in that, Before the step of sequentially depositing the first light-emitting material layer, the charge-generating material layer, the second light-emitting material layer, and the electrode material layer from the side of the isolation structure away from the substrate, the method further includes: A fourth evaporation angle is used to evaporate and form a hole injection material layer from the side of the isolation structure away from the substrate. The fourth evaporation angle is smaller than the first evaporation angle. There is a gap between the orthographic projection of the hole injection material layer located in the isolation opening on the substrate and the orthographic projection of the side of the isolation structure closer to the substrate on the substrate.

14. The method according to claim 11, characterized in that, The step of sequentially depositing the first light-emitting material layer, the charge-generating material layer, the second light-emitting material layer, and the electrode material layer from the side of the isolation structure away from the substrate further includes: An electrode material layer is formed by vapor deposition from the side of the isolation structure away from the substrate using a fifth vapor deposition angle, wherein the fifth vapor deposition angle is greater than the third vapor deposition angle.

15. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-9, or the electronic device includes a display panel made by a manufacturing method of a display panel as described in any one of claims 10-14.

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