Semiconductor process chamber

Abstract

The embodiment of the invention provides a semiconductor process chamber. The semiconductor process chamber comprises a base adjusting device, a chamber body and a base, the base adjusting device comprises a support, a translation adjusting mechanism and a lifting driving assembly, the support is connected with the cavity body, the translation adjusting mechanism comprises a first rotating part and a first moving part, the first rotating part is rotationally connected to the support and provided with a first threaded part, and the first moving part is provided with a second threaded part; the first threaded part is connected with the second threaded part in a matched mode, the first moving part is connected with the lifting driving assembly, and the lifting driving assembly is connected with the base and used for driving the base to move in the vertical direction; under the condition that the first rotating piece is driven to rotate, the first rotating piece can drive the base to move along with the lifting driving assembly in the first direction, and the first direction is perpendicular to the vertical direction.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a semiconductor process chamber. Background Technology

[0002] In the semiconductor technology field, a substrate is typically used to support the wafer, thereby driving the wafer to the process location for processing. After a period of use, the substrate in a semiconductor process chamber may shift, requiring periodic adjustment. In related technologies, when substrate shift occurs, all components need to be disassembled and reassembled to reposition the substrate back to its original position. This presents a problem with the semiconductor process chambers in these technologies, making substrate repositioning difficult. Summary of the Invention

[0003] This application provides a semiconductor process chamber to address the problem of inconvenient base position adjustment in semiconductor process chambers in related technologies.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: The semiconductor process chamber provided in this application embodiment includes: a base adjustment device, a chamber body, and a base; the base adjustment device includes: a support, a translation adjustment mechanism, and a lifting drive assembly. The support is connected to the chamber body. The translation adjustment mechanism includes a first rotating member and a first moving member. The first rotating member is rotatably connected to the support. The first rotating member has a first threaded portion. The first moving member has a second threaded portion. The first threaded portion and the second threaded portion are engaged and connected. The first moving member is connected to the lifting drive assembly. The lifting drive assembly is connected to the base. The lifting drive assembly is used to drive the base to move in a vertical direction. When the first rotating member is driven to rotate, the first rotating member can drive the base to move along a first direction with the lifting drive assembly, wherein the first direction is perpendicular to the vertical direction.

[0005] Optionally, the translation adjustment mechanism further includes a first sliding engagement member and a second sliding engagement member that are slidably connected. The first sliding engagement member is connected to the bracket, and the second sliding engagement member is slidable relative to the first sliding engagement member along the first direction. The second sliding engagement member is connected to the first moving member.

[0006] Optionally, the first moving member has a first protrusion and a second protrusion at one end opposite to the first rotating member. The first protrusion and the second protrusion are spaced apart along a second direction, which is perpendicular to the first direction and the vertical direction, respectively. The mounting part of the lifting drive assembly is located between the first protrusion and the second protrusion and is connected to at least one of the first protrusion and the second protrusion.

[0007] Optionally, the first protrusion is provided with a first threaded hole extending along the second direction, and the second protrusion is provided with a second threaded hole extending along the second direction; the translation adjustment mechanism further includes a first threaded connector and a second threaded connector, the first threaded connector is engaged with the first threaded hole and abuts against the mounting part, and the second threaded connector is engaged with the second threaded hole and abuts against the mounting part.

[0008] Optionally, the translation adjustment mechanism further includes a rotating handle, which is connected to the first rotating member to drive the first rotating member to rotate.

[0009] Optionally, the lifting drive assembly includes a first connector, a second connector, and a lifting adjustment mechanism; the first connector and the second connector are spaced apart, the second connector is located above the first connector, the first moving member is connected to the first connector, the lifting adjustment mechanism is connected to the first connector and the second connector respectively, the lifting adjustment mechanism is used to drive the second connector to rise and fall relative to the first connector, and the second connector is connected to the base.

[0010] Optionally, the lifting and adjusting mechanism includes a support assembly and a transmission assembly. The support assembly includes a second rotating member and a second moving member. The second rotating member is rotatably connected to the first connecting member. The second rotating member has a third threaded portion, and the second moving member has a fourth threaded portion. The third threaded portion and the fourth threaded portion are connected in a mating connection. The second moving member is connected to the second connecting member. The number of support assemblies is at least three, and the at least three support assemblies are circumferentially distributed around the vertical axis of the base. The transmission assembly is respectively connected to each of the second rotating members so that, when driven, it drives each of the second rotating members to rotate, causing each of the second moving members to synchronously extend and retract along the vertical direction.

[0011] Optionally, the transmission assembly includes a first gear and at least three second gears. The first gear is rotatably connected to the first connecting member, and each of the second gears is distributed on the outer periphery of the first gear and meshes with the first gear. The second gears are coaxially connected to the second rotating member in a one-to-one correspondence.

[0012] Optionally, the lifting drive assembly further includes a rotary driver, which is mounted on the first connector and connected to the first gear drive.

[0013] Optionally, the end of the second movable member opposite to the first connecting member is provided with a screw portion, the second connecting member is provided with a through hole, and the support assembly further includes a third threaded connecting member and a fourth threaded connecting member; the screw portion is sequentially passed through the third threaded connecting member, the through hole and the fourth threaded connecting member, the third threaded connecting member and the fourth threaded connecting member are respectively threadedly connected to the screw portion and clamped on both sides of the second connecting member.

[0014] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects: In the embodiments of this application, the lifting drive assembly is mainly used to drive the wafer to move with the base during the implementation of semiconductor processes, so that the wafer is raised to the process position or removed from the process position.

[0015] The first rotating component is threadedly connected to the first moving component, so that rotating the first rotating component can drive the threadedly connected first moving component to move along the first direction. Furthermore, since the first moving component is connected to the lifting drive assembly, and the lifting drive assembly is connected to the base, during maintenance, rotating the first rotating component can drive the base to move along the first direction, thereby correcting the position of the base.

[0016] Therefore, by adopting the solution provided in the embodiments of this application, the base can be driven to move along the first direction simply by rotating the first rotating component. In this way, after the base has shifted position after working in the semiconductor process chamber for a period of time, the position of the base can be easily corrected. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A front view of a semiconductor process chamber provided in an embodiment of this application; Figure 2 A cross-sectional view of a semiconductor process chamber provided in an embodiment of this application; Figure 3 A schematic diagram of a semiconductor process chamber provided for an embodiment of this application; Figure 4 A top view of a semiconductor process chamber provided in an embodiment of this application; Figure 5 A partial schematic diagram of the location of a translation adjustment mechanism in a semiconductor process chamber, provided for an embodiment of this application; Figure 6 A partial cross-sectional view of a semiconductor process chamber provided for an embodiment of this application, wherein the cross-section passes through the axis of a first rotating member; Figure 7 A schematic diagram of the mounting portion of a translation adjustment mechanism and a lifting drive assembly provided in an embodiment of this application; Figure 8 A schematic diagram of a lifting drive assembly and a base provided in an embodiment of this application; Figure 9 A cross-sectional view of a lifting drive assembly and a base provided in an embodiment of this application; Figure 10 A partial schematic diagram of a lifting drive assembly and a base provided in an embodiment of this application; Figure 11 This is a schematic diagram of a semiconductor process chamber and a reference device provided in an embodiment of this application.

[0019] Explanation of reference numerals in the attached figures: 1- Semiconductor process chamber; 10-Base adjustment device; 11-Staff; 12-Translation adjustment mechanism; 121-First rotating component; 122-First moving component; 1221-First protrusion; 1222-Second protrusion; 1223-First threaded hole; 1224-Second threaded hole; 1231-First sliding fit component; 1232-Second sliding fit component; 1233-Connecting frame; 1241-First threaded connector; 1242-Second threaded connector; 125-Rotation handle; 13-Lifting drive assembly; 131-First connector; 1311-Mounting part; 132-Second connector; 133-Lifting adjustment mechanism; 1331-Support assembly; 13311-Second rotating part; 13312-Second moving part; 13313-Screw part; 13314-Third threaded connector; 13315-Fourth threaded connector; 1332-Transmission assembly; 13321-First gear; 13322-Second gear; 134-Rotary driver; 20-chamber body; 30-Base; 2-Reference component; 2a-Reference ring. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] Furthermore, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application specification may have been selected by the applicant at his or her own discretion, and their detailed meanings are explained in the relevant sections of this description.

[0023] Furthermore, this application should be understood not only through the actual terms used, but also through the meaning implied by each term.

[0024] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0025] This application provides a semiconductor process chamber. (See reference...) Figures 1 to 10 The semiconductor process chamber 1 provided in this application embodiment includes: a base adjustment device 10, a chamber body 20, and a base 30.

[0026] For example, the semiconductor process chamber 1 can be an etching and cleaning chamber. It should be noted that a semiconductor process chamber can also be called a semiconductor process equipment, and an etching and cleaning chamber can also be called an etching and cleaning device. During the etching and cleaning process, the wafer is supported on the base of the etching and cleaning chamber, and the base moves the wafer to the process station for etching. Referring to this example, the chamber body 20 forms a process cavity. The base 30 is used to support the workpiece to be processed in the semiconductor process; for example, the base 30 is used to support the wafer. In the following description, the workpiece is mainly described using a wafer as an example. The base adjustment device 10 is used to drive the base 30 to move the wafer together.

[0027] refer to Figure 1 and Figure 2The base adjustment device 10 includes a bracket 11, a translation adjustment mechanism 12, and a lifting drive assembly 13. The bracket 11 is connected to the chamber body 20. Exemplarily, the bracket 11 can be fixedly connected to the outer wall of the chamber body 20 via a threaded connector such as a screw.

[0028] refer to Figure 6 The translation adjustment mechanism 12 includes a first rotating member 121 and a first moving member 122. The first rotating member 121 is rotatably connected to the bracket 11. The first rotating member 121 is provided with a first threaded portion, and the first moving member 122 is provided with a second threaded portion, and the first threaded portion and the second threaded portion are engaged and connected.

[0029] refer to Figure 2 and Figure 3 The first moving part 122 is connected to the lifting drive assembly 13, which is connected to the base 30. The lifting drive assembly 13 is used to drive the base 30 to move vertically. Figure 6 When the first rotating member 121 is driven to rotate, the first rotating member 121 can drive the base 30 to move along the first direction with the lifting drive assembly 13, wherein the first direction is perpendicular to the vertical direction.

[0030] In this manner, in the embodiments of this application, the lifting drive component 13 is mainly used to drive the wafer to move with the base 30 during the implementation of the semiconductor process, so that the wafer is raised to the process position or moved away from the process position.

[0031] The first rotating member 121 is threadedly connected to the first moving member 122. Thus, rotating the first rotating member 121 drives the threadedly connected first moving member 122 to move along a first direction. Furthermore, since the first moving member 122 is connected to the lifting drive assembly 13, and the lifting drive assembly 13 is connected to the base 30, during maintenance, rotating the first rotating member 121 drives the base 30 to move along the first direction, thereby correcting the position of the base 30.

[0032] Therefore, by adopting the solution provided in this application embodiment, the base 30 can be driven to move along the first direction simply by rotating the first rotating member 121. In this way, after the base 30 has shifted position after working in the semiconductor process chamber 1 for a period of time, the position of the base 30 can be easily corrected.

[0033] To improve the translational stability of the first moving part 122, refer to Figure 6In some embodiments, the translation adjustment mechanism 12 further includes a first sliding engagement member 1231 and a second sliding engagement member 1232 that are slidably connected. For example, the first sliding engagement member 1231 is provided with a slide rail, and the second sliding engagement member 1232 is embedded in the slide rail, so that the second sliding engagement member 1232 and the first sliding engagement member 1231 are slidably connected.

[0034] Furthermore, in the embodiments of this application, the first sliding engagement member 1231 is connected to the bracket 11, and the second sliding engagement member 1232 is slidable relative to the first sliding engagement member 1231 along a first direction. The second sliding engagement member 1232 is connected to the first moving member 122. For example, the second sliding engagement member 1232 can be connected to the first moving member 122 via a connecting bracket 1233. In this way, the sliding engagement member 1231 and the second sliding engagement member 1232 can be used to guide the movement of the first moving member 122, enabling the first moving member 122 to slide smoothly along the first direction.

[0035] Combination Figure 4 The solution provided above can drive the base 30 to move left and right along the first direction to correct the position of the base 30. To further improve the accuracy of the corrected position of the base 30, it can be driven to move back and forth along the second direction. See below for details.

[0036] refer to Figures 2 to 7 In some embodiments, the end of the first moving member 122 opposite to the first rotating member 121 is provided with a first protrusion 1221 and a second protrusion 1222, which are spaced apart along a second direction. The second direction is perpendicular to the first direction and the vertical direction, respectively. The mounting portion 1311 of the lifting drive assembly 13 is located between the first protrusion 1221 and the second protrusion 1222, and is connected to at least one of the first protrusion 1221 and the second protrusion 1222.

[0037] refer to Figure 7 In some embodiments, the first protrusion 1221 is provided with a first threaded hole 1223 extending in a second direction, and the second protrusion 1222 is provided with a second threaded hole 1224 extending in a second direction. The translation adjustment mechanism 12 also includes a first threaded connector 1241 and a second threaded connector 1242. The first threaded connector 1241 is engaged with the first threaded hole 1223 and abuts against the mounting portion 1311. The second threaded connector 1242 is engaged with the second threaded hole 1224 and abuts against the mounting portion 1311.

[0038] For example, both the first threaded connector 1241 and the second threaded connector 1242 are adjusting set screws. In this way, by adjusting the screwing depth of the first threaded connector 1241 and the second threaded connector 1242, the lifting drive assembly 13 can be driven to move back and forth in the second direction, thereby causing the base 30 connected to the lifting drive assembly 13 to move in the second direction, so as to correct the position of the base 30 during the maintenance of the semiconductor process chamber 1.

[0039] In some embodiments, after the position of the base 30 is corrected, the mounting part 1311 and the first moving part 122 can be connected by fasteners such as screws or bolts to prevent the mounting part 1311 and the first moving part 122 from moving relative to each other due to accident.

[0040] refer to Figures 3 to 6 In some embodiments, the translation adjustment mechanism 12 further includes a rotating handle 125. The rotating handle 125 is connected to the first rotating member 121 to drive the first rotating member 121 to rotate. In this way, the first rotating member 121 can be driven to rotate by manipulating the rotating handle 125.

[0041] Of course, in some embodiments, a power tool can also be used to drive the first rotating member 121 to rotate. For example, a power tool can be connected to the first rotating member 121, thereby using the power tool to drive the first rotating member 121 to rotate. Of course, once the first rotating member 121 is adjusted to a suitable position, it can be manually driven to rotate to improve the adjustment accuracy.

[0042] refer to Figure 3 In some embodiments, the lifting drive assembly 13 includes a first connector 131, a second connector 132, and a lifting adjustment mechanism 133. The first connector 131 and the second connector 132 are spaced apart, with the second connector 132 located above the first connector 131. The first movable member 122 is connected to the first connector 131. Exemplarily, the mounting portion 1311 described above can be disposed on the first connector 131, thereby enabling the first movable member 122 to be connected to the lifting drive assembly 13 by connecting the first movable member 122 to the mounting portion 1311.

[0043] Furthermore, the lifting adjustment mechanism 133 is connected to the first connecting member 131 and the second connecting member 132 respectively. The lifting adjustment mechanism 133 is used to drive the second connecting member 132 to move up and down relative to the first connecting member 131, and the second connecting member 132 is connected to the base 30. In this way, the lifting adjustment mechanism 133 can be used to drive the second connecting member 132 to move up and down, thereby driving the base 30 to move up and down.

[0044] refer to Figure 3 , Figures 8 to 10In some embodiments, the lifting and adjusting mechanism 133 includes a support assembly 1331 and a transmission assembly 1332. The support assembly 1331 includes a second rotating member 13311 and a second moving member 13312, with the second rotating member 13311 rotatably connected to the first connecting member 131. The second rotating member 13311 has a third threaded portion, and the second moving member 13312 has a fourth threaded portion, with the third threaded portion and the fourth threaded portion engaging. Thus, during the rotation of the second rotating member 13311, the second moving member 13312, which is threadedly engaged with it, can be driven to rise and fall. Furthermore, the second moving member 13312 is connected to the second connecting member 132. Therefore, during the lifting and lowering movement of the second moving member 13312, the second connecting member 132 and the base 30 can be driven to rise and fall together.

[0045] In some embodiments, the number of support components 1331 is at least three, and the at least three support components 1331 are circumferentially distributed around the vertical axis of the base 30. The transmission components 1332 are respectively connected to each of the second rotating members 13311 so as to drive each of the second rotating members 13311 to rotate when driven, so that each of the second moving members 13312 can move synchronously in the vertical direction.

[0046] It should be noted that if the top surface of the base 30 becomes less level after the semiconductor process chamber 1 has been working for a period of time, the level of the base 30 can be adjusted by adjusting the length of each support component 1331 so that the top surface of the base 30 can be restored to a level state.

[0047] For example, the second movable member 13312 and the second connecting member 132 are connected by a threaded connector. When it is necessary to adjust the length of the support assembly 1331, the threaded connector can be loosened, allowing the second rotating member 13311 or the second movable member 13312 to be rotated to adjust the length of the support assembly 1331. After the top surface of the base 30 is adjusted to a horizontal state, the threaded connector can be used to lock the second movable member 13312 and the second connecting member 132 together.

[0048] To facilitate those skilled in the art in implementing the solutions provided in the embodiments of this application, the following provides a more detailed description of the structure of the transmission component 1332 for reference.

[0049] refer to Figure 3 , Figures 8 to 10In some embodiments, the transmission assembly 1332 includes a first gear 13321 and at least three second gears 13322. The first gear 13321 is rotatably connected to the first connecting member 131. Each of the second gears 13322 is distributed on the outer periphery of the first gear 13321 and meshes with the first gear 13321. Each of the second gears 13322 is coaxially connected to a second rotating member 13311. In this way, by driving the first gear 13321 to rotate, each of the second gears 13322 can be driven to rotate synchronously, thereby driving the second rotating member 13311 connected to the second gear 13322 to rotate; thus, the second moving member 13312, the second connecting member 132, and the base 30 can be driven to rise and fall synchronously.

[0050] It should be noted that in some embodiments, the thread pitch of each support component 1331 is equal, and the number of teeth of each second gear 13322 is also equal. This ensures that the lifting speed of each second moving member 13312 is equal. Of course, in some embodiments, based on basic mechanical principles, the thread pitch of each support component 1331 and the number of teeth of each second gear 13322 can be set differently to also ensure that the lifting speed of each second moving member 13312 is equal. This will not be elaborated further here.

[0051] It should also be noted that the above mainly provides a scheme for driving each second rotating component 13311 to rotate synchronously using a gear transmission mechanism. In other embodiments, each second rotating component 13311 can also be driven to rotate synchronously based on the principles of belt drive, chain drive, etc., which will not be elaborated here.

[0052] In some embodiments, the lifting drive assembly 13 further includes a rotary driver 134, which is mounted on the first connector 131. Exemplarily, the rotary driver 134 is located on the side of the first connector 131 opposite to the support assembly 1331. The rotary driver 134 is drivenly connected to the first gear 13321. Exemplarily, the rotary driver 134 is a device capable of outputting driving force, such as a rotary motor, pneumatic motor, or hydraulic motor.

[0053] In addition, this application embodiment also provides other solutions for adjusting the levelness of the top surface of the base 30, and the specific solutions are described below.

[0054] refer to Figures 8 to 10In some embodiments, the end of the second movable member 13312 facing away from the first connecting member 131 is provided with a screw portion 13313, and the second connecting member 132 is provided with a through hole. The support assembly 1331 also includes a third threaded connector 13314 and a fourth threaded connector 13315. The screw portion 13313 is sequentially passed through the third threaded connector 13314, the through hole, and the fourth threaded connector 13315. The third threaded connector 13314 and the fourth threaded connector 13315 are respectively threadedly connected to the screw portion 13313 and are sandwiched on both sides of the second connecting member 132. Exemplarily, both the third threaded connector 13314 and the fourth threaded connector 13315 are nuts.

[0055] Thus, when it is necessary to adjust the levelness of the top surface of the base 30, a level can be installed on the top surface of the base 30, and the fourth threaded connector 13315 can be loosened. Then, the levelness of the top surface of the base 30 can be adjusted by turning the third threaded connector 13314. After adjustment, the fourth threaded connector 13315 can be tightened.

[0056] To enable those skilled in the art to better understand the solutions provided in the embodiments of this application, the following is a brief description of the method for adjusting the base 30.

[0057] Combination Figure 2 and Figure 11 Before adjusting the base 30, a reference member 2 can be installed on the top of the chamber body 20, with a reference ring 2a surrounding the base 30. Further, a feeler gauge can be used to measure the distance between the inner wall of the reference ring 2a and the outer wall of the base 30 to determine the offset of the base 30. Figure 4 For example, the distance between the inner wall of the reference ring 2a and the outer wall of the base 30 along a first direction and along a second direction can be detected to determine the offset of the base 30. Further, combined with... Figure 3 , Figure 4 and Figure 6 The deviation of the base 30 along the first direction can be eliminated by rotating the first rotating component 121. Figure 7 The deviation of the base 30 along the second direction can be eliminated by adjusting the first threaded connector 1241 and the second threaded connector 1242. Furthermore, a level can be installed on the top surface of the base 30. Figure 8 The levelness of the top surface of the base 30 can be adjusted by adjusting the third threaded connector 13314 and the fourth threaded connector 13315.

[0058] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0059] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the embodiments of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor process chamber (1), characterized in that, include: The base adjustment device (10), the chamber body (20), and the base (30); The base adjustment device (10) includes: a bracket (11), a translation adjustment mechanism (12), and a lifting drive assembly (13). The bracket (11) is connected to the chamber body (20). The translation adjustment mechanism (12) includes a first rotating member (121) and a first moving member (122). The first rotating member (121) is rotatably connected to the bracket (11). The first rotating member (121) is provided with a first threaded portion. The first moving member (122) is provided with a second threaded portion. The first threaded portion and the second threaded portion are connected in a cooperative manner. The first moving member (122) is connected to the lifting drive assembly (13). The lifting drive assembly (13) is connected to the base (30). The lifting drive assembly (13) is used to drive the base (30) to move in the vertical direction. When the first rotating member (121) is driven to rotate, the first rotating member (121) can drive the base (30) to move along the first direction with the lifting drive assembly (13), wherein the first direction is perpendicular to the vertical direction.

2. The semiconductor process chamber (1) according to claim 1, characterized in that, The translation adjustment mechanism (12) further includes a first sliding engagement member (1231) and a second sliding engagement member (1232) that are slidably connected. The first sliding engagement member (1231) is connected to the bracket (11), and the second sliding engagement member (1232) can slide relative to the first sliding engagement member (1231) along the first direction. The second sliding engagement member (1232) is connected to the first moving member (122).

3. The semiconductor process chamber (1) according to claim 1, characterized in that, The first moving member (122) has a first protrusion (1221) and a second protrusion (1222) at one end opposite to the first rotating member (121). The first protrusion (1221) and the second protrusion (1222) are spaced apart along a second direction, which is perpendicular to the first direction and the vertical direction, respectively. The mounting part (1311) of the lifting drive assembly (13) is located between the first protrusion (1221) and the second protrusion (1222) and is connected to at least one of the first protrusion (1221) and the second protrusion (1222).

4. The semiconductor process chamber (1) according to claim 3, characterized in that, The first protrusion (1221) is provided with a first threaded hole (1223) extending in the second direction, and the second protrusion (1222) is provided with a second threaded hole (1224) extending in the second direction. The translation adjustment mechanism (12) further includes a first threaded connector (1241) and a second threaded connector (1242). The first threaded connector (1241) is connected to the first threaded hole (1223) and abuts against the mounting part (1311). The second threaded connector (1242) is connected to the second threaded hole (1224) and abuts against the mounting part (1311).

5. The semiconductor process chamber (1) according to claim 1, characterized in that, The translation adjustment mechanism (12) further includes a rotating handle (125), which is connected to the first rotating component (121) to drive the first rotating component (121) to rotate.

6. The semiconductor process chamber (1) according to claim 1, characterized in that, The lifting drive assembly (13) includes a first connector (131), a second connector (132), and a lifting adjustment mechanism (133). The first connector (131) and the second connector (132) are spaced apart. The second connector (132) is located above the first connector (131). The first moving part (122) is connected to the first connector (131). The lifting adjustment mechanism (133) is connected to the first connector (131) and the second connector (132) respectively. The lifting adjustment mechanism (133) is used to drive the second connector (132) to rise and fall relative to the first connector (131). The second connector (132) is connected to the base (30).

7. The semiconductor process chamber (1) according to claim 6, characterized in that, The lifting adjustment mechanism (133) includes a support assembly (1331) and a transmission assembly (1332). The support assembly (1331) includes a second rotating member (13311) and a second moving member (13312). The second rotating member (13311) is rotatably connected to the first connecting member (131). The second rotating member (13311) is provided with a third threaded portion, and the second moving member (13312) is provided with a fourth threaded portion. The third threaded portion and the fourth threaded portion are connected in a mating connection. The second moving member (13312) is connected to the second connecting member (132). The number of the support components (1331) is at least three, and the at least three support components (1331) are circumferentially distributed around the vertical axis of the base (30). The transmission components (1332) are respectively connected to each of the second rotating members (13311) for transmission, so as to drive each of the second rotating members (13311) to rotate when driven, so that each of the second moving members (13312) can move synchronously in the vertical direction.

8. The semiconductor process chamber (1) according to claim 7, characterized in that, The transmission assembly (1332) includes a first gear (13321) and at least three second gears (13322). The first gear (13321) is rotatably connected to the first connector (131). Each of the second gears (13322) is distributed on the outer periphery of the first gear (13321) and meshes with the first gear (13321). The second gears (13322) are coaxially connected to the second rotating member (13311) in a one-to-one correspondence.

9. The semiconductor process chamber (1) according to claim 8, characterized in that, The lifting drive assembly (13) further includes a rotary driver (134), which is mounted on the first connector (131) and is driven by the first gear (13321).

10. The semiconductor process chamber (1) according to claim 7, characterized in that, The second movable member (13312) has a screw portion (13313) at the end opposite to the first connector (131), and the second connector (132) has a through hole. The support assembly (1331) also includes a third threaded connector (13314) and a fourth threaded connector (13315). The screw portion (13313) is sequentially inserted through the third threaded connector (13314), the through hole and the fourth threaded connector (13315). The third threaded connector (13314) and the fourth threaded connector (13315) are respectively threaded to the screw portion (13313) and sandwiched on both sides of the second connector (132).

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