Measuring device manufacturing method and robot arm

Abstract

A method for manufacturing a measurement device according to the present disclosure is a method for manufacturing a measurement device integrally having a sensor that contributes to force measurement. Comprising a first step of forming a main body part (11) of the measuring device based on a first resin, and a second step of integrally forming a circuit (CB), which outputs an electric signal that changes according to the strain of the main body part (11), as a plating layer on the surface of the first resin.

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing a measuring device and a robotic arm. This application claims priority to Japanese Patent Application No. 2023-189468, filed on November 6, 2023, the entire disclosure of which is incorporated herein by reference. Background Technology

[0002] Previously, robotic arms for various applications, such as industrial robotic arms, medical robotic arms, and nursing robotic arms, were known for use in manufacturing sites. Furthermore, a technology related to end effectors is known, which are mounted on the front end of a robotic arm and include a manipulator and a gripper. For example, Patent Document 1 discloses a method for manufacturing a force sensor that can be mounted on an end effector and has improved sensitivity compared to conventional force sensors.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2023-19682 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] For end effectors that can also be used as measuring devices to aid in force measurement, miniaturization and weight reduction are required to limit the movable weight of the robotic arm. Furthermore, the end effector must be waterproof and water-resistant to allow for cleaning to prevent the spread of infection and for other hygiene purposes. Generally, end effectors are made of metal, which presents problems such as weight and rusting during cleaning.

[0008] End effectors typically require sensor components to perform their actions. For example, in order for a robotic arm to determine whether the end effector is holding an object, a sensor component such as a force sensor as described in Patent Document 1 is additionally mounted on the end effector. As a result, miniaturization and weight reduction of the end effector become difficult.

[0009] The purpose of this disclosure is to provide a method for manufacturing a measuring device that facilitates force measurement with a simpler configuration, as well as a robotic arm.

[0010] Methods for solving problems

[0011] The first viewpoint for solving the above-mentioned problem is a method for manufacturing a measuring device that integrally has a sensor that helps in measuring force, comprising: a first step of forming a main body of the measuring device based on a first resin, and a second step of integrally forming a circuit that outputs an electrical signal that varies according to the strain of the main body on the surface of the first resin as a plating layer.

[0012] The robotic arm of the second viewpoint has the aforementioned measuring device manufactured by the aforementioned measuring device manufacturing method as an end effector.

[0013] Invention Effects

[0014] According to this disclosure, a method for manufacturing a measuring device that facilitates force measurement with a simpler configuration, as well as a robotic arm, can be provided. Attached Figure Description

[0015] Figure 1 This is a perspective view showing an example of a robotic arm according to one embodiment of the present disclosure.

[0016] Figure 2 It means Figure 1 A block diagram illustrating an example of the structure of a robotic arm.

[0017] Figure 3 It means Figure 1 A first perspective view of an example of the end effector of a robotic arm.

[0018] Figure 4 It means Figure 1 A second perspective view of an example of the end effector of a robotic arm.

[0019] Figure 5 It means Figure 3 A side view of part of the end effector.

[0020] Figure 6 It is a schematic representation that will follow Figure 5 A magnified cross-sectional view of a portion of the section of the VI-VI arrow line.

[0021] Figure 7 This describes the manufacturing process. Figure 1 A flowchart illustrating an example of a manufacturing method for an end effector used as a measuring device. Detailed Implementation

[0022] Hereinafter, with reference to the accompanying drawings, one embodiment of the present disclosure will be described.

[0023] Figure 1 This is a perspective view showing an example of a robotic arm 1 according to one embodiment of the present disclosure. Figure 2 It means Figure 1 A block diagram illustrating an example of the configuration of robotic arm 1. Figure 3 It means Figure 1 A first perspective view of an example of the end effector 10 of the robotic arm 1. Figure 4 It means Figure 1 A second perspective view of an example of the end effector 10 of the robotic arm 1. Figure 5 It means Figure 3 A side view of a portion of the structure of the end effector 10. (Refer to...) Figures 1 to 5 The following description will focus on an example of the configuration of a robotic arm 1, which includes an end effector 10 as a measuring device in one embodiment.

[0024] like Figure 1 , Figure 3 as well as Figure 4 As shown, the robotic arm 1 has a housing 1a constituting the main body and an end effector 10 mounted on the housing 1a at the front end of the robotic arm 1. The end effector 10 corresponds to the measuring device described in the claims. The end effector 10 is supported by the housing 1a by mounting the end of the end effector 10 opposite to the part used for holding the object. The end effector 10 is driven while supported by the housing 1a to hold the object. The end effector 10 helps to measure the force borne by the reaction when holding the object.

[0025] In this disclosure, "object" includes solid objects that can be held by the end effector 10. It is not limited to this, and the object may also include any other object that becomes the object to be held by the end effector 10.

[0026] The end effector 10 is used in a robot. For example, the end effector 10 functions as part of a robot having a robotic arm 1. In this disclosure, "robot" includes, for example, industrial robots, nursing robots, marine robots, medical robots, and mobile bodies such as vehicles and drones that autonomously determine and move. "Industrial robots" include, for example, collaborative robots capable of working with an operator in the same space, as well as other robots that work in isolation from an operator. The end effector 10 is configured as a robotic hand or gripper in such a robot.

[0027] like Figures 2 to 4 As shown, the end effector 10 has a main body 11. The main body 11 forms the overall shape of the end effector 10. The main body 11 has a mounting portion 11a that is mounted on the housing 1a of the robotic arm 1. The main body 11 has a pair of claw portions 11b protruding from the end located on the side opposite to the housing 1a at the mounting portion 11a. The pair of claw portions 11b grips the object, for example, by shortening the distance between them so that it is approximately the same as the width of the object.

[0028] The claw portion 11b has a gripping portion 11b1 and a detection portion 11b2. The gripping portion 11b1 is located at the front end of the main body portion 11 on the side opposite to the mounting portion 11a. The gripping portion 11b1 grips an object. The detection portion 11b2 is formed in the main body portion 11 such that one end of the detection portion 11b2 is mounted to the mounting portion 11a, and the other end is continuous with the gripping portion 11b1. The detection portion 11b2 generates strain according to the force applied to the gripping portion 11b1. For example, the detection portion 11b2 is thinner than the gripping portion 11b1 in the separation direction D1 in which the pair of claw portions 11b are separated from each other.

[0029] The end effector 10 is driven while supported by the housing 1a. By shortening the distance between a pair of gripping portions 11b1 located at the front end of the end effector 10 along the separation direction D1 to approximately the same as the width of the object, the object is gripped using the pair of gripping portions 11b1. The end effector 10 helps to determine the force borne by the reaction when gripping the object based on the strain of the detection portion 11b2 when the object is gripped by the gripping portions 11b1.

[0030] The main body 11 contains resin. As an example, the entire main body 11, including the mounting part 11a and the claw part 11b, is formed of resin. The detection part 11b2, which helps to measure the force borne by the reaction when holding an object, also contains resin.

[0031] As described below, in this disclosure, the resin contained in the main body 11 includes, for example, a thermoplastic resin. "Thermoplastic resin" includes, for example, at least one selected from the group consisting of general-purpose plastics, engineering plastics, or super-engineering plastics. Thermoplastic resin is, for example, a polyarylene sulfide resin. More specifically, the thermoplastic resin includes polyarylene sulfide resins such as polyphenylene sulfide resin.

[0032] like Figure 2 As shown, in addition to the end effector 10 with the main body 11, the robotic arm 1 also has a storage unit 20, a drive unit 30, and a control unit 40. The storage unit 20, the drive unit 30, and the control unit 40 are housed in the housing 1a of the robotic arm 1.

[0033] The storage unit 20 may include, for example, a semiconductor memory, a magnetic memory, an optical memory, or any combination thereof. The storage unit 20 may function as, for example, a main storage device, an auxiliary storage device, or a cache memory. The storage unit 20 stores information for the actions of the robotic arm 1 and information obtained from the actions of the robotic arm 1. For example, the storage unit 20 stores system programs, application programs, and various data obtained through communication or other means.

[0034] The drive unit 30 includes, for example, any drive mechanism for driving the end effector 10. The drive mechanism includes, for example, multiple gears and a motor for rotating the gears. The drive unit 30 drives the end effector 10 according to a control signal from the control unit 40. For example, the drive unit 30 drives the claw 11b according to a control signal from the control unit 40, so that the claw 11b of the main body 11 of the end effector 10 grasps the object.

[0035] The control unit 40 includes a microcontroller, a processor, a programmable circuit, a special-purpose circuit, or any combination thereof. The processor is a general-purpose processor such as a CPU or GPU, or a special-purpose processor dedicated to specific processing. "CPU" is an abbreviation for Central Processing Unit. "GPU" is an abbreviation for Graphics Processing Unit. The programmable circuit is, for example, an FPGA. "FPGA" is an abbreviation for Field-Programmable Gate Array. The special-purpose circuit is, for example, an ASIC. "ASIC" is an abbreviation for Application Specific Integrated Circuit. The control unit 40 is communicatively connected to each component constituting the robotic arm 1, controlling each component while performing various processes related to the movements of the robotic arm 1.

[0036] like Figure 5 As shown, the detection unit 11b2 has a circuit CB integrally formed with the resin, which outputs an electrical signal that varies according to the strain of the detection unit 11b2. The circuit CB is formed, for example, on the inner surfaces of a pair of claw portions 11b in a separation direction D1, where the claw portions 11b are separated from each other. The inner surface of the claw portion 11b is the surface on the same side as the side of the claw portion 11b that is being held, i.e., the ventral side of the claw portion 11b. The circuit CB is formed throughout the entire detection unit 11b2 except for the holding portion 11b1, on the inner surface of the claw portion 11b. The circuit CB functions as a sensor that aids in force measurement. The measuring device integrally includes such a sensor.

[0037] The circuit CB is constructed, for example, by directly drawing onto the surface of the resin forming the detection section 11b2 of the main body 11. In the circuit CB, wiring and electrodes are formed in various areas of the resin surface forming the detection section 11b2. The circuit CB is, for example, configured as a molding circuit using LDS in a MID (Molded Interconnect Device). "MID" is an abbreviation for Molded Interconnect Device. "LDS" is an abbreviation for Laser Direct Structuring. The circuit CB is formed by directly irradiating the surface of the detection section 11b2, which is a molded article, with a laser and then plating it.

[0038] The circuit CB has wiring W formed on the surface of the resin of the detection section 11b2. The circuit CB has an input electrode E1 and an output electrode E2 formed on the surface of the resin of the detection section 11b2. The input electrode E1 and the output electrode E2 are formed side by side. The wiring W of the circuit CB includes multiple straight lines connecting the input electrode E1 and the output electrode E2, which are integrally formed with the resin.

[0039] For example, wiring W has connecting lines W1 extending in a straight line from input electrode E1 and output electrode E2, respectively, and bent at 90°. Wiring W also has gauge lines W2 that connect the two ends of the two connecting lines W1 located on opposite sides of input electrode E1 and output electrode E2, respectively. Gauge lines W2 function as strain gauges. For example, gauge lines W2 are formed by repeatedly bending a straight line 180° at one end and then further bending the bent straight line 180° at the other end.

[0040] Regarding the wiring W, for example, the line width d1 of gauge line W2 is not particularly limited, but is preferably 1 mm or less, more preferably 500 μm or less, more preferably 250 μm or less, more preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. The lower limit of the width d1 is not particularly limited, but is preferably 10 μm or more, more preferably 20 μm or more, more preferably 30 μm or more, more preferably 40 μm or more, and even more preferably 50 μm or more.

[0041] In the wiring W, the line spacing d2 between a pair of adjacent gauge lines W2 is not particularly limited, but is preferably 1 mm or less, more preferably 500 μm or less, more preferably 250 μm or less, more preferably 200 μm or less, more preferably 150 μm or less, and even more preferably 100 μm or less. The lower limit of the spacing d2 is not particularly limited, but is preferably 10 μm or more, more preferably 20 μm or more, more preferably 30 μm or more, more preferably 40 μm or more, and even more preferably 50 μm or more.

[0042] As an example, the width d1 and the spacing d2 can be narrowed to about 50 μm.

[0043] The circuit CB formed on the surface of the detection unit 11b2 outputs an electrical signal to the control unit 40, which varies according to the resistance of the wiring W itself. Thus, the detection unit 11b2, based on the wiring W itself, assists the control unit 40 in measuring force. For example, the circuit CB includes a strain gauge. More specifically, the circuit CB functions as a strain gauge based on the aforementioned configuration of the wiring W.

[0044] For example, when the detection unit 11b2 experiences strain due to the gripping unit 11b1's gripping of the object, the wiring W, which forms multiple straight lines connecting the input electrode E1 and the output electrode E2, also experiences strain, and the resistance of the wiring W changes according to the degree of strain. The strain in the detection unit 11b2 is related to the resistance value of the wiring W. As a result, the voltage between the input electrode E1 and the output electrode E2 changes according to the strain of the detection unit 11b2. The circuit CB outputs a voltage signal corresponding to the resistance of the wiring W itself, which changes according to the strain of the detection unit 11b2, to the control unit 40 as an example of the aforementioned electrical signal.

[0045] For example, the control unit 40 of the robotic arm 1 determines whether a pair of grippers 11b are holding an object based on an electrical signal output from the circuit CB of the main body 11. At this time, the control unit 40 measures the force applied to the grippers 11b based on an electrical signal output from the circuit CB of the detection unit 11b2. For example, the control unit 40 calculates the magnitude of the force applied to the grippers 11b based on this electrical signal. More specifically, the control unit 40 measures the voltage change between the input electrode E1 and the output electrode E2 based on this electrical signal, thereby measuring the magnitude of the force borne by the grippers 11b of the end effector 10. The process for measuring the magnitude of the force executed by the control unit 40 of the robotic arm 1 will be explained.

[0046] First, the control unit 40 acquires measured data, for example, during a pre-calibration operation before actually grasping an object using the end effector 10 of the robotic arm 1, and stores it in the storage unit 20. In this disclosure, "measured data" includes, for example, data relating the voltage value of the electrical signal output from the detection unit 11b2 to the magnitude of the force borne by the gripping part 11b1 of the claw 11b. Based on such measured data, the control unit 40 calculates an approximate formula, etc., representing the relationship between the voltage value and the magnitude of the force borne by the gripping part 11b1, and stores it in the storage unit 20.

[0047] When determining whether a pair of claws 11b has gripped an object by measuring the magnitude of the force borne by the claws 11b, the control unit 40 calculates the magnitude of the force corresponding to the voltage value of the electrical signal output from the detection unit 11b2, while referring to the aforementioned approximation formula based on past measured data stored in the storage unit 20. The control unit 40 calculates the magnitude of the force borne by the gripping part 11b1 based on past measured data obtained in advance through a calibration operation. When a pair of claws 11b grips an object, a force is applied to the gripping part 11b1 through its reaction. Therefore, the control unit 40 determines that the pair of claws 11b has gripped the object, for example, if the calculated force exceeds a predetermined threshold.

[0048] Figure 6 It is a schematic representation that will follow Figure 5 A magnified cross-sectional view of a portion of the section of the VI-VI arrow line.

[0049] In the detection section 11b2 located in the claw 11b of the end effector 10, the elastic modulus of the resin contained in the detection section 11b2 is not particularly limited, but is preferably 1 GPa or more and 50 GPa or less.

[0050] In the detection section 11b2 of the claw 11b of the end effector 10, the circuit CB is integrally formed as a plating layer on the surface of the resin contained in the detection section 11b2. Figure 6 In the diagram, gauge line W2 is shown in wiring W as part of circuit CB. Using... Figure 6 The configuration of gauge line W2 described below also applies to other components of circuit CB, such as input electrode E1, output electrode E2, and connecting line W1.

[0051] The coating, starting from the resin side of the detection unit 11b2, sequentially includes a first layer W21, a second layer W22, and a third layer W23. The first layer W21 is integrally formed with the resin contained in the detection unit 11b2. The first layer W21 contains a first metal. For example, if the resin contained in the detection unit 11b2 is combined with a metal oxide as a filler, the first metal contains a metal corresponding to that metal oxide. The first metal, for example, includes copper.

[0052] A second layer, W22, is formed directly above the first layer, W21. The second layer, W22, contains a second metal that reduces rust on the first metal contained in the first layer, W21. This second metal may include, for example, nickel. A third layer, W23, is formed directly above the second layer, W22. The third layer, W23, contains a third metal with the lowest electrical resistance among the plating layers. This third metal may include, for example, gold.

[0053] The overall thickness of the coating is not particularly limited, but is preferably 1 μm or more and 30 μm or less. Specifically, the thickness of the first layer W21 is not particularly limited, but is preferably 2 μm. The thickness of the second layer W22 is not particularly limited, but is preferably 2 μm. The thickness of the third layer W23 is not particularly limited, but is preferably 0.03 μm.

[0054] In the detection section 11b2 of the claw portion 11b of the end effector 10, a protective layer P is further formed directly above the circuit CB. The protective layer P covers the circuit CB. For example, the protective layer P is formed directly above the circuit CB where the circuit CB is formed, fills the gaps in the circuit CB where the circuit CB is not formed, and is formed directly above the resin contained in the detection section 11b2.

[0055] The protective layer P contains a resin. In this disclosure, the resin contained in the protective layer P includes, for example, a thermosetting resin. "Thermosetting resin" includes, for example, acrylic resin and epoxy resin. The overall thickness of the protective layer P, i.e., its height from the surface of the detection part 11b2, is not particularly limited, but is preferably, for example, 15 μm.

[0056] Figure 7 This means to explain Figure 1 The flowchart shows an example of a manufacturing method for the end effector 10 during the manufacture of a measuring device. Figure 7 The flowchart shown focuses primarily on the steps that are characteristic of this disclosure in the entire process of manufacturing the measuring device, representing an outline of the manufacturing method of the measuring device.

[0057] In step S101, the method for manufacturing the measuring device includes a first step of forming the main body 11 of the measuring device based on resin (first resin).

[0058] In step S102, the manufacturing method of the measuring device includes a second step of integrally forming a circuit CB, which outputs an electrical signal that varies according to the strain of the main body 11, as a plating layer on the surface of the first resin. In the second step, the circuit CB is formed as a plating layer on the surface of the detection part 11b2, which is a molded article, by irradiation with an LDS-based laser. The second step further includes: a step of forming a first layer W21 containing a first metal, a step of forming a second layer W22 containing a second metal, and a step of forming a third layer W23 containing a third metal.

[0059] In step S103, the method for manufacturing the measuring device includes a third step of forming a protective layer P covering the coating based on a resin (second resin).

[0060] In one embodiment, the resin used for the main body 11 of the end effector 10 is preferably a thermoplastic resin. There are no particular limitations on the thermoplastic resin; examples include polyolefin resins such as polypropylene, polyethylene, and polybutene; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyamide resins or aromatic polyamide resins such as nylon 6 and nylon 6,6; thermoplastic polyimide resins; polyamide-imide resins, polystyrene resins such as polystyrene, syndiotactic polystyrene, acrylonitrile-styrene copolymer resins, or acrylonitrile-butadiene-styrene copolymer resins; polyaryl sulfide resins such as polyphenylene sulfide; polyphenylene ether resins; polyurethane resins; polylactic acid; polyetheretherketone resins; polyetherimide resins; polyketide resins; polyaryl ester resins such as amorphous polyaryl esters and liquid crystal polyaryl esters; and liquid crystal polyester resins.

[0061] Among them, the thermoplastic resin used in one embodiment is preferably a thermoplastic polyimide resin, polyamide-imide resin, polyarylene sulfide resin, polyphenylene ether resin, polyether ether ketone resin, polyetherimide resin, polyketide resin, polyarylene ester resin, and liquid crystal polyester resin, which are so-called engineering plastics or super engineering plastics with excellent heat resistance and mechanical properties. From the viewpoint of chemical resistance, heat resistance and mechanical properties, polyarylene sulfide resin is more preferred, and among polyarylene sulfide resins (hereinafter also referred to as "PAS resin"), polyphenylene sulfide resin (hereinafter also referred to as "PPS resin") is particularly preferred.

[0062] In one embodiment, the above-described resin can be used alone or in the form of a polymer alloy containing multiple of the above-described resins. The resin in one embodiment may contain fillers. A resin containing fillers is sufficient to contain both the fillers described later and the above-described resins, and may, as needed, be in the form of a composition containing any of the additives described later (colorants, antistatic agents, antioxidants, heat stabilizers, UV stabilizers, UV absorbers, foaming agents, flame retardants, flame retardant additives, rust inhibitors, coupling agents, silane coupling agents, thermoplastic elastomers, or synthetic resins).

[0063] Polyarylene sulfide resins have a resin structure in which an aromatic ring bonded to a sulfur atom is a repeating unit. Specifically, it is a resin in which a structural part represented by the following general formula (1) and a 3-functional structural part represented by the following general formula (2) are repeating units as needed.

[0064] [Chemistry 1]

[0065]

[0066] In equation (1), R 1 and R 2 Alkyl, nitro, amino, phenyl, methoxy, and ethoxy groups, which are used to independently represent hydrogen atoms and carbon atoms in the range of 1 to 4.

[0067] [Chemistry 2]

[0068]

[0069] The total number of moles of the 3-functional structural part represented by Equation (2) relative to the total number of other structural parts is preferably in the range of 0.001 to 3 mol%, and particularly preferably in the range of 0.01 to 1 mol%.

[0070] Here, the structural part represented by the above general formula (1), especially R in the formula, 1 and R 2From the perspective of the mechanical strength of the above-mentioned PAS resin, hydrogen atoms are preferred. In this case, para-bonded groups shown in the following formula (3) and meta-bonded groups shown in the following formula (4) can be cited.

[0071] [Chemistry 3]

[0072]

[0073] In particular, considering the heat resistance and crystallinity of the PAS resin, the structure in which the sulfur atom in the repeating unit is bonded to the aromatic ring in the para-bonded structure shown in the above general formula (3) is preferred.

[0074] The PAS resin described above not only includes the structural parts shown in the above general formulas (1) and (2), but may also contain the structural parts shown in the following structural formulas (5) to (8) in a total of less than 30 mol% of the structural parts shown in the above general formulas (1) and (2).

[0075] [Chemistry 4]

[0076]

[0077] In one particular embodiment, from the perspective of the heat resistance and mechanical strength of the PAS resin, it is preferable that the structural portions shown in the above general formulas (5) to (8) are 10 mol% or less. When the above PAS resin contains the structural portions shown in the above general formulas (5) to (8), the bonding mode can be any one of random copolymers or block copolymers.

[0078] The PAS resin described above may have naphthyl thioether bonds in its molecular structure, but the total molar percentage of these bonds relative to the total molar percentage of other structural sites is preferably 3 mol% or less, and particularly preferably 1 mol% or less.

[0079] The physical properties of the PAS resin are not particularly limited as long as they do not impair the effectiveness of an embodiment, as described below.

[0080] (Melt viscosity)

[0081] The melt viscosity of PAS resin is not particularly limited. However, to achieve a good balance between flowability and mechanical strength, the melt viscosity (V6) measured at 300°C is preferably in the range of 2 Pa·s or higher, more preferably in the range of 1000 Pa·s or lower, more preferably in the range of 500 Pa·s or lower, and even more preferably in the range of 200 Pa·s or lower. The melt viscosity (V6) is measured using a Shimadzu CFT-500D flow testing instrument at 300°C and a load of 1.96 × 10⁻⁶. 6The measured melt viscosity was determined after holding the sample at Pa, L / D = 10 (mm) / 1 (mm) for 6 minutes.

[0082] (Non-Newtonian exponent)

[0083] The non-Newtonian index of PAS resin is not particularly limited, but is preferably in the range of 0.90 or higher to 2.00 or lower. When using linear polyarylene sulfide resin, the non-Newtonian index is preferably in the range of 0.90 or higher, more preferably in the range of 0.95 or higher, more preferably in the range of 1.50 or lower, and even more preferably in the range of 1.20 or lower. Such polyarylene sulfide resin exhibits excellent mechanical properties, flowability, and abrasion resistance. In one embodiment, the non-Newtonian index (N value) is calculated using a capillary rheometer at a melting point of +20°C and with the ratio of orifice length (L) to orifice diameter (D) L / D = 40, based on the measured shear rate (SR) and shear stress (SS), and using the following formula. The closer the non-Newtonian index (N value) is to 1, the closer it is to a linear structure; the higher the non-Newtonian index (N value), the more branched the structure.

[0084] [Number 1]

[0085]

[0086] Where SR represents the shear rate (seconds) -1 SS represents shear stress (Dyne / cm). 2 K represents a constant.

[0087] In one embodiment, the resin used for the main body 11 of the end effector 10 is combined with a metal oxide containing at least one of copper and chromium for the purpose of forming a molded circuit using LDS. The metal oxide has the following functions: in the obtained molded article, it can be heated by laser irradiation, causing the resin to melt and thus roughening the surface of the molded article; it can be activated by laser irradiation, selectively forming a plating layer, etc. By setting the first metal contained in the first layer W21 to at least one of copper and chromium, the interfacial adhesion between the first layer W21 and the resin is improved.

[0088] The aforementioned metal oxides include at least one of copper and chromium. The aforementioned metal oxides may also include other metals such as iron, aluminum, gallium, boron, molybdenum, tungsten, and selenium.

[0089] As specific examples of the aforementioned metal oxides, without particular limitation, CuFe can be cited. 0.5 B 0.5 O 2.5 CuAl 0.5 B 0.5 O 2.5CuGa 0.5 B 0.5 O 2.5 CuB2O4, CuB 0.7 O2, CuMo 0.7 O3, CuMo 0.5 O 2.5 Examples of metal oxides include CuMoO4, CuWO4, CuSeO4, and CuCr2O4. Among these, CuCr2O4 and CuFe are preferred. 0.5 B 0.5 O 2.5 CuAl 0.5 B 0.5 O 2.5 More preferably CuCr2O4 or CuFe 0.5 B 0.5 O 2.5 These metal oxides can be used alone or in combination of two or more.

[0090] The average particle size of the aforementioned metal oxide is preferably 0.01 μm or more, more preferably 0.05 μm or more, more preferably 50 μm or less, and even more preferably 30 μm or less. When the average particle size of the aforementioned metal oxide is 0.01 μm or more, efficient and stable production is possible, and therefore it is preferred. On the other hand, if the average particle size of the aforementioned metal oxide is 50 μm or less, the material strength can be maintained, and therefore it is preferred. In this disclosure, "average particle size of the metal oxide" is an exponential average particle size, measured by electron microscopy. Specifically, the particle size of 100 randomly selected metal oxide particles in one field of view of an electron microscope is measured, and their average value is calculated.

[0091] The Mohs hardness of the aforementioned metal oxide is preferably 4.0 or higher, preferably 6.5 or lower, and more preferably 6.0 or lower.

[0092] The amount of the metal oxide in addition to 100 parts by weight of the PAS resin is preferably 15 parts by weight or more, more preferably 20 parts by weight or more, even more preferably 25 parts by weight or more, and most preferably in the range of 90 parts by weight or less. When the amount of the metal oxide in addition to 100 parts by weight of the PAS resin is 15 parts by weight or more, it is preferable from the viewpoint that it can produce a high degree of surface roughening based on laser irradiation and that the metal oxide has excellent activation and plating properties. On the other hand, when the amount of the metal oxide in addition to 100 parts by weight of the PAS resin is 90 parts by weight or less, the material strength can be maintained, which is therefore preferable.

[0093] As other fillers, any known and commonly used materials can be used as long as the effect of one embodiment is not compromised. Examples include fillers of various shapes such as fibrous fillers, granular fillers, and non-fibrous fillers such as plate-shaped fillers. Specifically, fibrous fillers such as glass fiber, carbon fiber, silane glass fiber, ceramic fiber, aramid fiber, metal fiber, potassium titanate, silicon carbide, calcium silicate, wollastonite, and natural fiber can be used. Non-fibrous fillers such as glass beads, glass sheets, barium sulfate, clay, pyrophyllite, bentonite, sericite, mica, talc, wax serpentine, grease serpentine, pyrophyllite, hydrotalcite, kaolinite, palygorskite, ferrite, calcium silicate, calcium carbonate, glass beads, zeolite, ground fiber, and calcium sulfate can also be used.

[0094] In one embodiment, the filler content is not particularly limited as long as it does not impair the effect of the embodiment. The filler amount is preferably 1 part by weight or more, more preferably 10 parts by weight or more, more preferably 600 parts by weight or less, and more preferably 200 parts by weight or less, relative to 100 parts by weight of resin. Within this range, the resin exhibits good mechanical strength and moldability, and is therefore preferred.

[0095] In one embodiment, the resin used in the main body 11 of the end effector 10 may be combined with a silane coupling agent as an arbitrary component as needed. There are no particular limitations on the silane coupling agent, as long as it does not impair the effect of one embodiment. Examples of preferred silane coupling agents include those with functional groups that react with carboxyl groups, such as epoxy, isocyanate, amino, or hydroxyl groups. Examples of such silane coupling agents include epoxy-containing alkoxysilane compounds such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; γ-isocyanate-propyltrimethoxysilane, γ-isocyanate-propyltriethoxysilane, γ-isocyanate-propylmethyldimethoxysilane, γ-isocyanate-propylmethyldiethoxysilane, and γ-isocyanate-propylethyltrimethoxysilane. Alkoxysilane compounds containing isocyanate groups, such as dimethoxysilane, γ-isocyanate-propylethyldiethoxysilane, and γ-isocyanate-propyltrichlorosilane; amino-containing alkoxysilane compounds, such as γ-(2-aminoethyl)aminopropylmethyldimethoxysilane, γ-(2-aminoethyl)aminopropyltrimethoxysilane, and γ-aminopropyltrimethoxysilane; and hydroxyl-containing alkoxysilane compounds, such as γ-hydroxypropyltrimethoxysilane and γ-hydroxypropyltriethoxysilane. In one embodiment, the silane coupling agent is not an essential component, but when used in combination, its amount is not particularly limited as long as it does not impair the effect of one embodiment. The amount added is preferably 0.01 parts by weight or more, more preferably 0.1 parts by weight or more, more preferably 10 parts by weight or less, and more preferably 5 parts by weight or less, relative to 100 parts by weight of the resin. Within this range, the resin exhibits good corona resistance and moldability, especially good release properties, and the molded articles show excellent adhesion to epoxy resin, and further improved mechanical strength, thus making it preferred.

[0096] In one embodiment, the resin used in the main body 11 of the end effector 10 may contain a thermoplastic elastomer as an optional component, as needed. Examples of thermoplastic elastomers include polyolefin-based elastomers, fluorinated elastomers, or silicone-based elastomers, with polyolefin-based elastomers being preferred. When these elastomers are added, their amount is not particularly limited as long as it does not impair the effect of one embodiment; it is preferably 0.01 parts by weight or more, more preferably 0.1 parts by weight or more, more preferably 10 parts by weight or less, and more preferably 5 parts by weight or less, relative to 100 parts by weight of resin (A). Within this range, the resulting resin exhibits improved impact resistance, and is therefore preferred.

[0097] For example, the aforementioned polyolefin-based elastomers may include homopolymers of α-olefins, copolymers of two or more α-olefins, and copolymers of one or more α-olefins with vinyl polymerizable compounds having functional groups. In this case, examples of the aforementioned α-olefins include ethylene, propylene, 1-butene, and other α-olefins with 2 or more but less than 8 carbon atoms. Examples of the aforementioned functional groups include carboxyl groups, anhydride groups (-C(=O)OC(=O)-), epoxy groups, amino groups, hydroxyl groups, mercapto groups, isocyanate groups, and oxazoline groups. Examples of vinyl polymeric compounds having the aforementioned functional groups include vinyl acetate, α,β-unsaturated carboxylic acids such as (meth)acrylic acid, alkyl esters of α,β-unsaturated carboxylic acids such as methyl acrylate, ethyl acrylate, and butyl acrylate, metal salts of α,β-unsaturated carboxylic acids such as ionomers (as metals, alkali metals such as sodium, alkaline earth metals such as calcium, zinc, etc.), glycidyl esters of α,β-unsaturated carboxylic acids such as glycidyl methacrylate, α,β-unsaturated dicarboxylic acids such as maleic acid, fumaric acid, and itaconic acid, and derivatives of the aforementioned α,β-unsaturated dicarboxylic acids (monoesters, diesters, anhydrides), etc. These thermoplastic elastomers can be used alone or in combination of two or more.

[0098] Furthermore, in one embodiment, the resin used in the main body 11 of the end effector 10, in addition to the components described above, may also appropriately incorporate polyester resin, polyamide resin, polyimide resin, polyetherimide resin, polycarbonate resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyetheretherketone resin, polyetherketone resin, polyaryl resin, polyethylene resin, polypropylene resin, polytetrafluoroethylene resin, polydifluoroethylene resin, polystyrene resin, ABS resin, phenolic resin, polyurethane resin, liquid crystal polymer, and other synthetic resins (hereinafter referred to as synthetic resins) as optional components, depending on the application. In one embodiment, the aforementioned synthetic resins are not essential components, but when incorporated, their proportion is not particularly limited as long as it does not impair the effect of one embodiment. Moreover, depending on the respective purpose, it cannot be generalized. For example, the proportion of synthetic resin incorporated in the resin of one embodiment may be in the range of 5 parts by mass or more relative to 100 parts by mass of resin, and can be in the range of 15 parts by mass or less. In other words, the ratio of resin (A) to the total of resin (A) and synthetic resin is preferably in the range of (100 / 115) or more by mass, and more preferably in the range of (100 / 105) or more.

[0099] In one embodiment, the resin used in the main body 11 of the end effector 10 may, as needed, contain commonly known additives such as colorants, antistatic agents, antioxidants, heat stabilizers, ultraviolet stabilizers, ultraviolet absorbers, foaming agents, flame retardants, flame retardant additives, rust inhibitors, and coupling agents as optional components. These additives are not essential components; for example, their use is preferably in the range of 0.01 parts by weight or more, and more preferably in the range of 100 parts by weight or less, relative to 1000 parts by weight of the resin, and can be appropriately adjusted according to the purpose and application without impairing the effect of one embodiment.

[0100] Hereinafter, a method for manufacturing resin for the main body 11 of the end effector 10 in one embodiment will be described in detail.

[0101] In one embodiment, the resin used for the main body 11 of the end effector 10 is formulated with all necessary components and any other optional components as needed. As for the method of manufacturing the resin for the main body 11 of the end effector 10 in one embodiment, there is no particular limitation; examples include a method of melt-mixing with necessary components and any optional components as needed; more specifically, a method of uniformly dry-mixing using a mixer or Henschel mixer as needed, followed by melt-mixing in a twin-screw extruder.

[0102] Melt mixing can be performed by heating the resin to a temperature range above the resin's melting point, preferably above the melting point +10°C, more preferably above the melting point +10°C, even more preferably above the melting point +20°C, preferably below the melting point +100°C, and more preferably below the melting point +50°C.

[0103] From the viewpoint of dispersibility and productivity, a twin-screw compounding extruder is preferred as the aforementioned melt mixing mill. For example, it is preferable to perform melt mixing simultaneously by appropriately adjusting the resin component discharge rate to a range of 5-500 kg / hr and the screw speed to a range of 50-500 rpm. More preferably, melt mixing is performed under conditions where the ratio (discharge rate / screw speed) is in the range of 0.02-5 kg / hr / rpm. The addition and mixing of each component into the melt mixing mill can be performed simultaneously or separately. For example, when adding additives to the aforementioned components, from the viewpoint of dispersibility, it is preferable to feed them into the extruder through the side feeder of the aforementioned twin-screw compounding extruder. The ratio of the position of this side feeder to the distance from the resin input section (top feeder) of the extruder to the side feeder along the entire length of the screw of the aforementioned twin-screw compounding extruder is preferably 0.1 or more, more preferably 0.3 or more. This ratio is preferably 0.9 or less, more preferably 0.7 or less.

[0104] The resin obtained by melt mixing in this manner is a molten mixture containing the aforementioned essential components as well as any components added as needed and their source components. After melt mixing, it is preferably processed by a known method, such as extruding the molten resin into a filament, then processing it into granules, flakes, particles, powders, etc., and then pre-drying it at a temperature range of 100 to 150°C as needed.

[0105] One embodiment of the molded article is formed by molding resin. One embodiment of the method for manufacturing the molded article includes a step of melt-molding the aforementioned resin. This will be described in detail below.

[0106] In one embodiment, resin for the main body 11 of the end effector 10 is supplied for injection molding. Various molding conditions are not particularly limited, and molding can be performed using conventional methods. For example, in an injection molding machine, after melting the resin at a temperature above the resin's melting point, preferably above the melting point +10°C, more preferably between the melting point +10°C and the melting point +100°C, and even more preferably between the melting point +20°C and the melting point +50°C, the resin is injected into the mold from the resin outlet to form the mold. In this case, the mold temperature only needs to be set to a known temperature range, such as room temperature (23°C) to 300°C, preferably between 120°C and 180°C.

[0107] The end effector 10, which serves as a measuring device, obtained through the manufacturing method described in the above embodiment, facilitates force measurement with a simpler configuration. The end effector 10 is manufactured in a second process by integrally forming a circuit CB, whose output changes according to the strain of the main body 11, onto the surface of the resin as a plating layer. This eliminates the need for additional sensor components such as strain gauges during force measurement, as is the case in the prior art. For example, considering the strain gauge force sensor described in Patent Document 1, the force sensor exists merely as an additional component and needs to be separately mounted on the target device. Therefore, additional space is required in the target device for mounting the force sensor as an additional component, or this increases the weight of the target device.

[0108] On the other hand, in one embodiment, the end effector 10 can omit the configuration of leads and the like corresponding to the strain gauge. The end effector 10 does not require additional sheet or film for sensor components or a substrate for forming the circuit. The end effector 10 does not require additional joints or bonding portions for the sheet, film, and substrate. The end effector 10, with its simpler configuration as described above, facilitates force measurement.

[0109] The end effector 10 enables the reduction of the number of parts, miniaturization, and weight reduction, while also meeting the movable weight limitations of the robotic arm 1. The end effector 10 also allows for greater freedom in its shape design. Furthermore, by incorporating resin into the main body 11, the end effector 10's water resistance and waterproofness are improved, allowing for cleaning to prevent the spread of infection and for other hygiene purposes. Unlike conventional metal end effectors, the end effector 10 is resistant to even slight rusting during cleaning.

[0110] By utilizing such Figure 7 The manufacturing method shown for the end effector 10 can also shorten its manufacturing process. Therefore, the end effector 10 can be delivered as a product within a short lead time, and the cost incurred from manufacturing to delivery can also be reduced. On the other hand, if we consider the force sensor of the strain gauge described in Patent Document 1, the manufacturing process of the circuit pattern involves multiple aspects such as coating → resist coating → pre-baking → exposure → development / rinsing → post-baking → etching → resist removal.

[0111] The end effector 10 is manufactured through a third process in which a protective layer P is formed based on a second resin to cover the plating layer, thereby protecting the circuit CB, which is the plating layer. For example, the end effector 10 can mitigate contamination, damage, and breakage of the circuit CB through the protective layer P.

[0112] The circuit CB has wiring W formed on the resin surface, and outputs an electrical signal that varies according to the resistance of the wiring W itself. Thus, the end effector 10 becomes an integral molded product in which the circuit CB is directly drawn on the end effector 10, facilitating force measurement. The end effector 10 makes the drawn circuit CB itself a unit for transmitting electrical signals, thus eliminating the need for additional wiring harnesses or substrates. The end effector 10 does not require the shape and space to accommodate a substrate with wired wiring harnesses and circuits, avoiding complex shapes and simplifying its structure.

[0113] The end effector 10 tends to become charged due to the resin contained in the main body 11, but even in this case, the charge can be easily removed by means of the plated wiring W in the metal circuit CB formed on the surface. The end effector 10 can effectively remove static electricity based on the path shape of the wiring W drawn directly on its surface.

[0114] By setting the linewidth d1 of the wiring W to 10 μm or more and 1 mm or less, the end effector 10 can form an optimal circuit pattern based on the flexibility of the detection section 11b2, which varies depending on the thickness and material of the claw portion 11b. For example, when the resin of the detection section 11b2 has a high elastic modulus and is formed into a hard claw portion 11b, even for small strains in the detection section 11b2, it is preferable to narrow the width d1 to more easily generate the resistance change of the wiring W itself. Conversely, when the resin of the detection section 11b2 has a low elastic modulus and is formed into a soft claw portion 11b, even for large strains in the detection section 11b2, it is not a problem to generate the resistance change of the wiring W itself appropriately. As described above, by variably setting the value of the linewidth d1 of the wiring W, the end effector 10 can enable the detection section 11b2 to function as a strain gauge with appropriate sensitivity corresponding to the elastic modulus of the resin of the claw portion 11b.

[0115] The end effector 10, by setting the line spacing d2 of the wiring W to 10 μm or more and 1 mm or less, can form an optimal circuit pattern based on the flexibility of the detection section 11b2, which varies depending on the thickness and material of the claw 11b. For example, when the resin of the detection section 11b2 has a high elastic modulus and is formed into a hard claw 11b, even for small strains in the detection section 11b2, it is preferable to narrow the spacing d2 to more easily generate the resistance change of the wiring W itself. Conversely, when the resin of the detection section 11b2 has a low elastic modulus and is formed into a soft claw 11b, even for large strains in the detection section 11b2, it is not a problem to generate the resistance change of the wiring W itself appropriately. As described above, by variably setting the value of the line spacing d2 of the wiring W, the end effector 10 can enable the detection section 11b2 to function as a strain gauge with appropriate sensitivity corresponding to the elastic modulus of the resin of the claw 11b.

[0116] By narrowing both the width d1 and the spacing d2 to approximately 50 μm, the end effector 10 can more easily detect changes in the resistance of the wiring W itself, even with minute strains in the detection section 11b2. Therefore, the end effector 10 can assist in force measurement even when the force is small or the resin of the detection section 11b2 has a high elastic modulus. The end effector 10 enables the detection section 11b2 to function as a more sensitive strain gauge.

[0117] By integrally forming a first layer W21 containing a first metal with the first resin through a plating, for example, by using a metal oxide containing the same metal as the first metal, the interfacial adhesion between the first resin and the first layer W21 is improved. Therefore, the end effector 10 can stably form the plating on the resin surface of the detection section 11b2. By forming a second layer W22 containing a second metal directly above the first layer W21, the end effector 10 can reduce rust on the first metal. By forming a third layer W23 containing a third metal with the lowest resistance directly above the second layer W22, the end effector 10 can reduce the resistance experienced by the electrical signal transmitted in the circuit CB.

[0118] By using a coating thickness of 1 μm or more and 30 μm or less, even minute strains in the detection unit 11b2 can more easily generate resistance changes in the wiring W itself. Therefore, even when the force is small or the resin of the detection unit 11b2 has a high elastic modulus, the end effector 10 can assist in force measurement. The end effector 10 enables the detection unit 11b2 to function as a more sensitive strain gauge.

[0119] The end effector 10 includes a strain gauge via circuit CB, and can output a voltage signal corresponding to the force applied to the gripping part 11b1 to the control unit 40. Therefore, the end effector 10 can assist the control unit 40 in measuring the magnitude of the force. Based on the voltage signal obtained from the end effector 10, the control unit 40 can calculate the magnitude of the force applied to the gripping part 11b1 with high accuracy.

[0120] By including a thermoplastic resin, specifically a polyarylene sulfide resin, the end effector 10 can improve water resistance and water resistance. Furthermore, due to the excellent chemical resistance and heat resistance of the polyarylene sulfide resin, the end effector 10 can also improve chemical resistance and heat resistance. Therefore, the end effector 10 can also be used in pharmaceuticals and in high-temperature applications. For example, the end effector 10 can also hold objects requiring chemical resistance.

[0121] The end effector 10 is easily formed using an LDS-based molding circuit by incorporating a metal oxide containing at least one of copper and chromium into a resin. The end effector 10 can provide functions such as: roughening the surface of the resin by heating it with a laser using a metal oxide containing at least one of copper and chromium; and selectively forming a plating layer by activation with laser irradiation.

[0122] The end effector 10 can variably set the bendability of the claw portion 11b, including the detection unit 11b2, within a range where the elastic modulus of the first resin is 1 GPa or more and 50 GPa or less. Therefore, the end effector 10 can achieve an optimal bendability of the claw portion 11b corresponding to the circuit pattern of the strain gauge in the detection unit 11b2. Since the detection unit 11b2 facilitates force measurement, the end effector 10 can optimize the elastic modulus of the first resin in the claw portion 11b.

[0123] The control unit 40 of the robotic arm 1 determines whether it is holding an object based on the electrical signal output from the circuit CB of the main body 11, thereby enabling the robotic arm 1 to perform actions such as moving the object. When the robotic arm 1 is identified as holding an object, it can also move the held object from one location to another.

[0124] For example, the detection unit 11b2 Figure 3 As shown, the claw portion 11b is thinner than the gripping portion 11b1. Therefore, the end effector 10 can also form a larger and more robust gripping portion 11b1 that contacts the object, and narrow the width of the detection portion 11b2, which includes the strain gauge portion of the circuit CB, thereby facilitating strain generation. Therefore, even when the force is small or the resin of the detection portion 11b2 has a high elastic modulus, the end effector 10 can assist in force measurement. The end effector 10 enables the detection portion 11b2 to function as a more sensitive strain gauge.

[0125] The end effector 10 has, for example, wiring W through circuit CB. Figure 5 The pattern shown makes it easier to generate the resistance change of the wiring W itself accompanying the strain of the detection unit 11b2. Therefore, even when the force is small or the elastic modulus of the resin of the detection unit 11b2 is high, the end effector 10 can help in force measurement. The end effector 10 enables the detection unit 11b2 to function as a more sensitive strain gauge.

[0126] Those skilled in the art will understand that this disclosure may be implemented in other predetermined ways besides the embodiments described above without departing from its spirit or essential characteristics. Therefore, the foregoing description is exemplary and not limiting. The scope of the disclosure is not defined by the foregoing description but by the appended claims. Several modifications within their equivalent scope are included therein.

[0127] For example, the shape, pattern, size, arrangement, orientation, type, and number of each of the above-described components are not limited to the contents illustrated in the above description and the accompanying drawings. The shape, pattern, size, arrangement, orientation, type, and number of each component can be arbitrarily configured as long as it can realize its function. The components of the end effector 10 and the robotic arm 1 shown in the illustrations are functional conceptual elements, and the specific form of each component is not limited to the form shown in the illustrations.

[0128] For example, the functions contained in each step of a manufacturing method can be reconfigured in a logically consistent manner, and multiple steps can be combined into one or separated.

[0129] In one embodiment described above, the measuring device includes an end effector 10, but is not limited thereto. The measuring device may also include any other device. For example, the measuring device may include other devices such as joints for the robotic arm 1 and other arbitrary parts of the robot having the robotic arm 1, and may also include devices such as actuators. The measuring device is not limited to robotic devices such as the end effector 10 used by the robotic arm 1, and may also include devices for precision equipment and devices mounted at the front end of a viscometer in a stirring apparatus. The measuring device may also include all devices that require an integrally formed sensor such as a strain gauge.

[0130] In one embodiment described above, the method for manufacturing the measuring device includes a third step of forming a protective layer P based on a second resin coating, but is not limited to this. The method for manufacturing the measuring device may also exclude such a third step. In this case, the protective layer P may not be formed directly above the circuit CB in the end effector 10. The circuit CB may also be exposed without being covered by the protective layer P.

[0131] In one embodiment described above, the circuit CB is shown to have wiring W formed on the resin surface, and outputs an electrical signal that varies according to the resistance of the wiring W itself, but it is not limited to this. The circuit CB may also have a substrate integrally molded with the resin of the main body 11 and wiring formed on the substrate, and output an electrical signal that varies according to the resistance of the wiring itself.

[0132] The circuit CB can also be constructed based on a substrate integrally molded with resin by means of embedding molding or the like. Wiring and electrodes can also be formed on this substrate in the circuit CB. The circuit CB can also be configured as a molded circuit using IME (In-Mold Electronics) in a MID (Made-in-the-Mold Device). The circuit CB can also be formed by embedding it into a flexible substrate during injection molding. Thus, the end effector 10 becomes an integrally molded product that integrates the substrate and resin, facilitating force measurement.

[0133] In one embodiment described above, it is shown that the circuit CB facilitates force measurement based on the wiring W itself, but it is not limited thereto. The circuit CB may replace the wiring W that facilitates force measurement, or it may have a sensor component that is mounted on the circuit CB by soldering or the like and facilitates force measurement.

[0134] In addition, the circuit CB may also have a control element mounted on the circuit CB by welding or the like and performing the processing required to achieve force measurement. In this disclosure, "control element" may include, for example, a microcontroller, a processor, a programmable circuit, a special-purpose circuit, or any combination thereof. Thus, the end effector 10 can also perform the various processes described above performed by the control unit 40 of the robotic arm 1 by the end effector 10 itself. The end effector 10 can independently perform decision processing, learning processing, and other arbitrary processing.

[0135] In one embodiment described above, the linewidth d1 of the wiring W is described as being 10 μm or more and 1 mm or less, but it is not limited to this. The linewidth d1 of the wiring W may also not be included in such a numerical range.

[0136] In one embodiment described above, the line spacing d2 of the wiring W is described as being 10 μm or more and 1 mm or less, but it is not limited to this. The line spacing d2 of the wiring W may also not be included in such a numerical range.

[0137] In one embodiment described above, the coating is described as sequentially comprising a first layer W21, a second layer W22, and a third layer W23, but this is not a limitation. The coating is not limited to a three-layer structure; it may contain at least one layer. Although it is stated that the coating contains copper, nickel, and gold as the first, second, and third metals, respectively, this is not a limitation. The coating may also contain a nickel alloy. In this disclosure, "nickel alloy" includes nickel-copper alloys, nickel-gold alloys, and nickel-chromium alloys, etc. As a result, the coating exhibits improved properties such as corrosion resistance, thermal conductivity, and oxidation resistance.

[0138] In one embodiment described above, the thickness of the coating is described as being 1 μm or more and 30 μm or less, but it is not limited to this. The thickness of the coating may also not be included in such a numerical range.

[0139] In the above embodiment, the circuit CB includes a strain gauge, but is not limited thereto. The circuit CB may also include any other components that can facilitate force measurement, such as the end effector 10.

[0140] In one embodiment described above, the elastic modulus of the first resin is described as being 1 GPa or more and 50 GPa or less, but it is not limited thereto. The elastic modulus of the first resin may also not be included in such a numerical range.

[0141] In one embodiment described above, the first resin is described as being composed of a metal oxide containing at least one of copper and chromium, but this is not a limitation. The first resin may also be composed without such a metal oxide. Even if no metal oxide is incorporated into the first resin, the formation of the LDS coating can be achieved through an anchoring effect. The coating catalyst flows into the pores formed by surface roughening of the molded article due to the melting of the resin by laser irradiation, thereby physically integrating the coating with the first resin.

[0142] In one embodiment described above, the control unit 40 of the robotic arm 1 determines whether it has grasped an object based on an electrical signal output from the circuit CB of the main body 11, but it is not limited to this. The control unit 40 may also choose not to perform such determination processing.

[0143] In one embodiment described above, it is explained that the end effector 10 assists in force measurement, and the control unit 40 of the robotic arm 1 calculates the magnitude of the force applied to the gripper 11b based on electrical signals, but this is not a limitation. For example, the end effector 10 can also be configured with multiple strain gauges to assist not only in measuring the magnitude of the force but also in measuring its direction. The end effector 10 can also assist in measuring the six-axis directions (i.e., the X, Y, and Z axes) and the rotational direction centered on each axis. The end effector 10 can also integrate a force sensor as a sensor formed in the detection unit 11b2.

[0144] In one embodiment described above, the detection section 11b2 is thinner than the gripping section 11b1, but this is not a limitation. The detection section 11b2 may have the same width as the gripping section 11a or may be thicker than the gripping section 11b1, as long as the end effector 10 can help in force measurement.

[0145] In the above embodiment, the entire main body 11 is described as being formed of resin, but this is not a limitation. As long as the portion of the main body 11 in which the circuit CB is formed is at least formed of resin, the other portions of the main body 11 can be formed of any material other than resin.

[0146] In one embodiment described above, the end effector 10 is shown to have only one pair of claws 11b in the main body 11, but it is not limited to this. The end effector 10 may have three or more claws 11b, or it may have only one claw 11b.

[0147] In the above embodiment, it was described that the control unit 40 of the robotic arm 1 determines the magnitude of the force based on past measured data obtained in advance through calibration operations, but it is not limited to this. The control unit 40 may also calculate the magnitude of the force without using such past measured data. For example, the control unit 40 may also calculate the magnitude of the force based on information such as a theoretical formula for calculating the magnitude of the force, which includes parameters such as the voltage value of the electrical signal output from the circuit CB of the detection unit 11b2.

[0148] The following describes some embodiments of the present disclosure. However, it should be noted that the embodiments of the present disclosure are not limited thereto.

[0149] [Appendix 1] A method for manufacturing a measuring device, wherein the measuring device integrally has a sensor that facilitates the measurement of force, the method comprising: a first step of forming a main body portion of the measuring device based on a first resin, and a second step of integrally forming a circuit that outputs an electrical signal that varies according to the strain of the main body portion on the surface of the first resin as a plating layer.

[0150] [Note 2] The manufacturing method of the measuring device according to Note 1 further includes a third step of forming a protective layer covering the above-mentioned coating based on a second resin.

[0151] [Appendix 3] According to the manufacturing method of the measuring device described in Appendix 1 or 2, the circuit has wiring formed on the surface of the first resin and outputs the electrical signal that varies according to the resistance of the wiring itself.

[0152] [Note 4] According to the manufacturing method of the measuring device described in Note 3, the line width of the above wiring is 10 μm or more and 1 mm or less.

[0153] [Note 5] According to the manufacturing method of the measuring device described in Note 3 or 4, the spacing between the wires is 10 μm or more and 1 mm or less.

[0154] [Appendix 6] The method for manufacturing the measuring device according to any one of Appendices 1 to 5, wherein the coating comprises, in sequence, a first layer integrally formed with the first resin and containing a first metal, a second layer containing a second metal that reduces rust on the first metal, and a third layer containing a third metal with the lowest resistance.

[0155] [Appendix 7] The method for manufacturing the measuring device according to any one of Appendices 1 to 6, wherein the above-mentioned coating contains a nickel alloy.

[0156] [Appendix 8] The method for manufacturing the measuring device according to any one of Appendices 1 to 7, wherein the thickness of the above-mentioned coating is 1 μm or more and 30 μm or less.

[0157] [Note 9] The method of manufacturing the measuring device according to any one of Notes 1 to 8, wherein the circuit includes a strain gauge.

[0158] [Note 10] The method for manufacturing the measuring device according to any one of Notes 1 to 9, wherein the first resin comprises a thermoplastic resin.

[0159] [Note 11] According to the manufacturing method of the measuring device described in Note 10, the thermoplastic resin comprises at least one selected from the group consisting of general-purpose plastics, engineering plastics or super engineering plastics.

[0160] [Note 12] According to the manufacturing method of the measuring device described in Note 11, the thermoplastic resin is a polyarylene sulfide resin.

[0161] [Appendix 13] The method for manufacturing the measuring device according to any one of Appendices 1 to 12, wherein the elastic modulus of the first resin is 1 GPa or more and 50 GPa or less.

[0162] [Appendix 14] The method for manufacturing the measuring device according to any one of Appendices 1 to 13, wherein the first resin is composed of a metal oxide comprising at least one of copper and chromium.

[0163] [Note 15] A robotic arm comprising the aforementioned measuring device manufactured by the manufacturing method of the measuring device described in any one of Notes 1 to 14 as an end effector.

[0164] [Note 16] The robotic arm according to Note 15 includes a control unit that determines whether an object is being held based on the electrical signal output from the circuit of the main body.

[0165] [Appendix 17] According to the robotic arm described in Appendix 15 or 16, the main body of the measuring device includes: a gripping part for gripping an object, and a detection part that generates strain according to the force applied to the gripping part and has the circuit described above, and the detection part is thinner than the gripping part.

[0166] Explanation of reference numerals in the attached figures

[0167] 1: Robotic arm, 1a: Housing, 10: End effector (measuring device), 11: Main body, 11a: Mounting part, 11b: Claw part, 11b1: Holding part, 11b2: Detection part, 20: Storage part, 30: Drive part, 40: Control part, CB: Circuit, D1: Separation direction, E1: Input electrode, E2: Output electrode, P: Protective layer, W: Wiring, W1: Connecting line, W2: Gauge line, d1: Width, d2: Spacing.

Claims

1. A method for manufacturing a measuring device, the measuring device integrally having a sensor that facilitates the measurement of force, the manufacturing method comprising: The first step involves forming the main body of the measuring device based on the first resin; as well as In the second step, a circuit that outputs an electrical signal that changes according to the strain of the main body is integrally formed as a plating layer on the surface of the first resin.

2. The method for manufacturing the measuring device according to claim 1, further comprising: The third step involves forming a protective layer covering the coating based on the second resin.

3. The method for manufacturing the measuring device according to claim 1 or 2, wherein, The circuit has wiring formed on the surface of the first resin and outputs an electrical signal that varies according to the resistance of the wiring itself.

4. The method for manufacturing the measuring device according to claim 3, wherein, The wiring width is 10μm or more and 1mm or less.

5. The method for manufacturing the measuring device according to claim 3, wherein, The spacing between the wires in the wiring is greater than 10μm and less than 1mm.

6. A method for manufacturing the measuring device according to claim 1 or 2, wherein, The coating comprises, in sequence: The first layer is integrally formed with the first resin and contains the first metal; The second layer contains a second metal that reduces rust on the first metal; and The third layer contains a third metal with the lowest electrical resistance.

7. The method for manufacturing the measuring device according to claim 1 or 2, wherein, The coating contains a nickel alloy.

8. A method for manufacturing the measuring device according to claim 1 or 2, wherein, The thickness of the coating is greater than 1 μm and less than 30 μm.

9. A method for manufacturing the measuring device according to claim 1 or 2, wherein, The circuit includes a strain gauge.

10. A method for manufacturing the measuring device according to claim 1 or 2, wherein, The first resin comprises a thermoplastic resin.

11. The method for manufacturing the measuring device according to claim 10, wherein, The thermoplastic resin comprises at least one selected from the group consisting of general-purpose plastics, engineering plastics, or super engineering plastics.

12. The method for manufacturing the measuring device according to claim 11, wherein, The thermoplastic resin is a polyarylene sulfide resin.

13. The method for manufacturing the measuring device according to claim 1 or 2, wherein, The elastic modulus of the first resin is above 1 GPa and below 50 GPa.

14. A method for manufacturing the measuring device according to claim 1 or 2, wherein, The first resin is composed of a metal oxide containing at least one of copper and chromium.

15. A robotic arm comprising the measuring device manufactured by the method of manufacturing the measuring device according to claim 1 or 2 as an end effector.

16. The robotic arm according to claim 15, comprising a control unit that determines whether an object is being held based on an electrical signal output from the circuit of the main body.

17. The robotic arm according to claim 15, wherein, The main body of the measuring device includes: The holding part, the object it holds; and The detection unit, which generates strain based on the force applied to the gripping unit, and has the aforementioned circuitry, The detection section is thinner than the holding section.

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