Smart IC substrate, smart IC module, and IC card including same

Abstract

A smart IC substrate according to an embodiment includes: a substrate including a first surface and a second surface opposite the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; and a plating layer disposed on the metal layer, in which the bonding layer includes a first layer and a second layer, the second layer is disposed between the first layer and the metal layer, the first layer includes beads, and the first layer has a color by the beads.

Description

TECHNICAL FIELD

[0001] Embodiments relate to a smart IC substrate, a smart IC module, and an IC card including the same. BACKGROUND

[0002] An IC card is a plastic card in which an integrated circuit chip capable of storing and processing information is embedded. In the IC card, an IC that stores desired information is mounted. The information is transmitted to a reader in the form of an electrical signal.

[0003] The IC card is manufactured by inserting a smart IC module into a main body portion of the card.

[0004] The smart IC module is classified into a single layer type or a double layer type according to the arrangement of a metal layer. In the single layer type, a metal layer and a plating layer are provided on only one surface of a substrate. In the double layer type, the metal layer and the plating layer are provided on both surfaces of the substrate.

[0005] In addition, the smart IC module is classified into a contact type card, a non-contact type card, a hybrid type card, and a combination type card according to a method of using the card. The contact type card transmits and receives information through physical contact. The non-contact type card transmits and receives information without physical contact. The hybrid type card and the combination type card include both a contact type function and a non-contact type function.

[0006] Accordingly, the smart IC module includes a contact surface and a bonding surface. The contact surface is in contact with an external device, and a chip is provided on the bonding surface. The bonding surface is inserted into the inside of a card main body portion.

[0007] The contact surface is exposed to the outside of the IC card. Accordingly, a user can visually recognize the contact surface. A plurality of conductive patterns is provided on the contact surface. The conductive patterns are spaced apart from each other by a separation region. Accordingly, a bonding layer can be exposed in the separation region. Accordingly, if the bonding layer has a color, the aesthetic feeling of the user can be improved.

[0008] The bonding layer can include a bead. The bonding layer can have a color through the bead. The adhesion of the bonding layer can be reduced through the bead. Accordingly, it can be possible to reduce the adhesion between the bonding layer and the metal layer. Accordingly, it can be possible to reduce the reliability of the smart IC module.

[0009] Accordingly, there is a need for a smart IC substrate, a smart IC module, and an IC card including the same having a new structure capable of solving the above-described problems.

[0010] As prior art related to a smart IC substrate, it is disclosed in Korean Patent Publication No. KR10-2022-0110247. SUMMARY

[0011] TECHNICAL PROBLEM

[0012] Embodiments provide an intelligent IC substrate having improved aesthetic feeling and reliability.

[0013] Technical Solution

[0014] The intelligent IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface, a bonding layer disposed on the first surface, a metal layer disposed on the bonding layer, and a plating layer disposed on the metal layer, wherein the bonding layer includes a first layer and a second layer disposed between the first layer and the metal layer, the first layer includes a bead, and the first layer has a color through the bead.

[0015] Advantageous Effects

[0016] The intelligent IC substrate and the intelligent IC module according to an embodiment include a bonding layer.

[0017] The bonding layer can include a plurality of layers. For example, the bonding layer can include a first layer and a second layer. The first layer can include a bead. In addition, the second layer can not include a bead. Alternatively, the second layer can include a small amount of beads.

[0018] Accordingly, the bonding layer can have a color through the first layer. Accordingly, a user can recognize the color through the division of the conductive pattern. Accordingly, the aesthetic feeling of the user can be improved.

[0019] In addition, the second layer does not include a bead. Alternatively, the second layer includes a small amount of beads. Accordingly, it is possible to prevent the adhesion between the bonding layer and the metal layer from being reduced. Accordingly, the reliability of the intelligent IC module is improved.

[0020] Alternatively, the bonding layer is formed as one layer. In addition, the bonding layer can include a plurality of regions. For example, the bonding layer can include a first region and a second region. The first region can include a bead. In addition, the second region can not include a bead. Alternatively, the second region can include a small amount of beads.

[0021] Accordingly, the bonding layer can have a color through the first region. Accordingly, a user can recognize the color through the division of the conductive pattern. Accordingly, the aesthetic feeling of the user can be improved.

[0022] In addition, the second region does not include a bead, or the second region includes a small amount of beads. Accordingly, it is possible to prevent the adhesion between the bonding layer and the metal layer from being reduced. Accordingly, the reliability of the intelligent IC module is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a top plan view of a first surface of an intelligent IC substrate according to a first embodiment.

[0024] Figure 2is a plan view of a second surface of the smart IC module according to the first embodiment.

[0025] Figure 3 is a sectional view taken along the line A-A' of Figure 2

[0026] Figures 4 to 11 is an enlarged view of the A region of Figure 3

[0027] Figure 12 is a plan view of a second surface of the smart IC module according to the first embodiment.

[0028] Figure 13 is a sectional view taken along the line B-B' of Figure 12

[0029] Figure 14 is a plan view of a first surface of the smart IC substrate according to the second embodiment.

[0030] Figure 15 is a plan view of a second surface of the smart IC substrate according to the second embodiment.

[0031] Figure 16 is a sectional view taken along the line C-C' of Figure 15

[0032] Figure 17 is a sectional view taken along the line D-D' of Figure 15

[0033] Figure 18 is an enlarged view of the B region and the C region of Figure 16

[0034] Figure 19 is an enlarged view of the D region and the E region of Figure 17

[0035] Figure 20 is a plan view of a second surface of the smart IC module according to the second embodiment.

[0036] Figure 21 is a sectional view taken along the line E-E' of Figure 20

[0037] Figure 22 is a sectional view taken along the line F-F' of Figure 20

[0038] Figure 23 is an exploded perspective view of the smart IC card according to the embodiment.

[0039] Figure 24 ​​​​​​​​​is a diagram for explaining the combination of the smart IC module according to an embodiment. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments of the disclosure will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the disclosure are not limited to a part of the described embodiments, and can be implemented in various other forms, and one or more elements of the embodiments can be selectively combined and rearranged within the spirit and scope of the disclosure.

[0041] In addition, unless clearly defined and described otherwise, the terms used in the embodiments of the disclosure, including technical terms and scientific terms, can be interpreted the same as the meanings that are commonly understood by those having ordinary knowledge in the art to which the disclosure belongs, and those terms defined in, for example, a commonly used dictionary can be interpreted as having meanings consistent with the context in the relevant art.

[0042] In addition, the terms used in the embodiments of the disclosure are used to describe the embodiments, and are not intended to limit the disclosure. In the present specification, the singular form can also include the plural form unless specifically stated in the context of the wording, and when described as "at least one of (or) a plurality of" A, B, and C, it can include at least one combination of A, B, and C that can be combined.

[0043] Furthermore, in describing elements of the embodiments of the disclosure, terms such as first, second, A, B, (a), and (b) can be used. These terms are only used to distinguish the elements from other elements, and the terms are not limited to the nature, order, or sequence of the elements.

[0044] In addition, when an element is described as being "connected", "coupled", or "contacted" with another element, it can not only include the case where the element is directly "connected", "coupled", or "contacted" with the other element, but also the case where the element is "connected", "coupled", or "contacted" with the other element through another element.

[0045] In addition, when described as being "on (above)" or "under (below)" each element, "on (above)" or "under (below)" can not only include the case where the two elements are directly connected to each other, but also the case where one or more other elements are formed or disposed between the two elements.

[0046] In addition, when expressed as "on (above)" or "under (below)", it can not only include the upward direction based on one element, but also the downward direction based on one element.

[0047] Hereinafter, a smart IC substrate, a smart IC module, and a smart IC card including the smart IC module according to an embodiment will be described with reference to the accompanying drawings.

[0048] An intelligent IC substrate 1000 and an intelligent IC module 2000 according to a first embodiment will be described with reference to the accompanying drawings. Figures 1 to 13 An intelligent IC substrate 1000 and an intelligent IC module 2000 according to a first embodiment will be described with reference to the accompanying drawings.

[0049] Referring to FIG. 1, Figures 1 to 11 The intelligent IC substrate includes a substrate 100, a bonding layer 200, a metal layer 300, and a plating layer.

[0050] The substrate 100 includes a first surface 1S and a second surface 2S. The first surface 1S and the second surface 2S are surfaces opposite to each other.

[0051] The first surface 1S is a contact surface. Specifically, the first surface 1S is a surface capable of recognizing information of the intelligent IC module through direct contact or indirect contact. In addition, the second surface 2S is a bonding surface. Specifically, the second surface 2S is a surface on which a chip is mounted and bonded to a main body of an IC card.

[0052] The substrate 100 includes a resin material. The substrate 100 can include a prepreg including glass fibers. Specifically, the substrate 100 can include a material in which glass fibers and a silicon-based filler (Si filler) are dispersed in an epoxy resin.

[0053] Alternatively, the substrate 100 can be rigid or flexible. For example, the substrate 100 can include glass or plastic. Specifically, the substrate 100 can include chemically strengthened / half-strengthened glass, such as soda lime glass or alumino-silicate glass. Alternatively, the substrate 100 can include polyimide (PI), polyethylene terephthalate (PET), propylene glycol (PPG), polycarbonate (PC), or sapphire.

[0054] Alternatively, the substrate 100 can include an optically isotropic film. As an example, the substrate 100 can include Cyclic Olefin Copolymer (COC), Cyclic Olefin Polymer (COP), optically isotropic polycarbonate (PC), or optically isotropic polymethyl methacrylate (PMMA).

[0055] Alternatively, the substrate 100 can be bendable while partially having a curved surface. That is, the substrate 100 can be bendable while partially having a flat surface and partially having a curved surface. Specifically, one end of the substrate 100 can be bendable while having a curved surface. Alternatively, the substrate 100 can be bendable while having a random curvature.

[0056] The substrate 100 can have a thickness within a set range. For example, the thickness of the substrate 100 can be 80 μm to 150 μm, 90 μm to 140 μm, or 100 μm to 120 μm. If the thickness of the substrate 100 is less than 80 μm, the supporting force of the substrate 100 decreases. In addition, if the thickness of the substrate 100 is greater than 150 μm, the thickness of the smart IC substrate can increase. Accordingly, the size of the IC card increases.

[0057] The substrate 100 has an insulating property. Accordingly, the substrate 100 prevents a short circuit between circuits. In addition, the substrate 100 is used to support the circuits during a process of forming the circuits.

[0058] The substrate 100 includes holes. Specifically, the substrate 100 includes a plurality of holes H.

[0059] At least one hole of the plurality of holes is an area in which wire bonding is performed. For example, all of the plurality of holes are areas in which wire bonding is performed. Alternatively, a portion of the plurality of holes are areas in which wire bonding is performed. The chip C and the plating layer are wire-bonded through the holes H.

[0060] The holes H have a width within a set range. The width of the holes H can be defined as a diameter of the hole or a minimum distance between inner side surfaces of the hole. For example, the width of the holes H can be 500 μm to 1000 μm, 600 μm to 900 μm, or 700 μm to 800 μm. If the width of the holes H is less than 500 μm, it is difficult to perform wire bonding through the holes H. In addition, if the width of the holes H is greater than 1000 μm, the supporting force of the substrate 100 decreases.

[0061] The bonding layer 200 is disposed on the substrate 100. Specifically, the bonding layer 200 is disposed on the first surface 1S.

[0062] The bonding layer 200 contains a resin material. For example, the bonding layer 200 can contain at least one of an epoxy resin, an acrylic resin, and a polyimide resin. In addition, the bonding layer 200 can contain at least one additive of a natural rubber, a plasticizer, a curing agent, and a phosphorus-based flame retardant. Accordingly, the flexibility of the bonding layer 200 is improved.

[0063] The bonding layer 200 can have a thickness within a set range. For example, the thickness of the bonding layer 200 can be 15 μm to 35 μm, 20 μm to 30 μm, or 22 μm to 28 μm. If the thickness of the bonding layer 200 is less than 15 μm, the adhesion force of the bonding layer 200 decreases. Accordingly, it is possible to peel off the metal layer on the bonding layer 200. In addition, if the thickness of the bonding layer 200 is greater than 35 μm, it is possible to increase the thickness of the smart IC substrate. Accordingly, the size of the IC card increases.

[0064] The bonding layer 200 can include a plurality of layers. For example, the bonding layer 200 can include a plurality of layers including the same resin material. Alternatively, the bonding layer 200 can include a plurality of layers including different resin materials.

[0065] Alternatively, the bonding layer 200 can include one layer. In addition, the bonding layer 200 can include a plurality of regions.

[0066] The bonding layer 200 can have a color. The bonding layer 200 will be described in detail below.

[0067] The metal layer 300 is disposed on the substrate 100. The metal layer 300 is disposed on the bonding layer 200. The metal layer 300 includes a metal material. For example, the metal layer 300 can include at least one material of gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Preferably, the metal layer 300 includes copper.

[0068] The metal layer 300 can have a thickness within a set range. For example, the thickness of the metal layer 300 can be 30 μm to 75 μm, 40 μm to 65 μm, or 50 μm to 60 μm. If the thickness of the metal layer 300 is less than 30 μm, the resistance of the metal layer 300 increases. In addition, when the thickness of the metal layer 300 is greater than 75 μm, the thickness of the smart IC substrate can increase. Accordingly, the size of the IC card increases. In addition, the process efficiency can decrease.

[0069] The metal layer 300 includes a plurality of conductive patterns P. The conductive patterns P are formed by patterning the metal layer 300.

[0070] The conductive patterns P are disposed on the first surface 1S. The conductive patterns P are disposed on the bonding layer 200. The conductive patterns P are disposed on the contact surface.

[0071] Accordingly, a separation region S is formed between the plurality of conductive patterns P. The bonding layer 200 is exposed by the separation region S. Accordingly, the conductive patterns P are spaced apart by the separation region S. The hole H is disposed in a region corresponding to each of the conductive patterns P.

[0072] A plating layer is disposed on the metal layer 300. In detail, the plating layer is disposed on one surface 301 and another surface 302 opposite to the one surface 301.

[0073] Referring to Figure 3 , the plating layer is classified into a plurality of plating layers according to positions. In detail, the plating layer can include a first plating layer 410 and a second plating layer 420 disposed at different positions.

[0074] The first plating layer 410 is provided on one surface 301 of the metal layer 300. The conductive pattern P is formed of the metal layer 300 and the first plating layer 410. The second plating layer 420 is provided on the other surface 302 of the metal layer 300. The second plating layer 420 is provided in a region overlapping the hole H. The second plating layer 420 can be a pad portion for wire bonding.

[0075] The first plating layer 410 includes a 1-1 layer 411 and a 1-2 layer 412. The 1-1 layer 411 is in contact with the metal layer 300. The 1-2 layer 412 is in contact with the 1-1 layer 411. Thus, the 1-1 layer 411 is provided between the metal layer 300 and the 1-2 layer 412.

[0076] On the other hand, although not shown in the drawings, an organic coating layer can be provided on the 1-2 layer 412. The organic coating layer protects the 1-2 layer 412. Thus, corrosion of the 1-2 layer 412 can be prevented.

[0077] The second plating layer 420 includes a 2-1 layer 421 and a 2-2 layer 422. The 2-1 layer 421 is in contact with the metal layer 300. The 2-2 layer 422 is in contact with the 2-1 layer 421. Thus, the 2-1 layer 421 is provided between the metal layer 300 and the 2-2 layer 422.

[0078] The 1-1 layer 411 and the 2-1 layer 421 can contain the same material. Specifically, the 1-1 layer 411 and the 2-1 layer 421 can contain the same metal. For example, the 1-1 layer 411 and the 2-1 layer 421 can contain nickel.

[0079] The 1-2 layer 412 and the 2-2 layer 422 can contain the same material. Specifically, the 1-2 layer 412 and the 2-2 layer 422 can contain the same metal. For example, the 1-2 layer 412 and the 2-2 layer 422 can contain gold (Au) or palladium (Pd).

[0080] The first plating layer 410 and the second plating layer 420 can have different sizes. Specifically, the thickness T1 of the first plating layer 410 and the thickness T2 of the second plating layer 420 can be different.

[0081] The thickness T2 of the second plating layer 420 is greater than the thickness T1 of the first plating layer 410. The thickness T1-1 of the 1-1 layer 411 and the thickness T2-1 of the 2-1 layer 421 can be different. Specifically, the thickness T1-1 of the 1-1 layer 411 can be less than the thickness T2-1 of the 2-1 layer 421. In addition, the thickness T1-2 of the 1-2 layer 412 and the thickness T2-2 of the 2-2 layer 422 can be different. Specifically, the thickness T1-2 of the 1-2 layer 412 can be less than the thickness T2-2 of the 2-2 layer 422. Accordingly, the thickness T2 of the second plating layer 420 is greater than the thickness T1 of the first plating layer 410.

[0082] Figures 4 to 11 FIG. 1 is a diagram for explaining the bonding layer 200.

[0083] Referring to Figures 4 to 9 , the bonding layer 200 can include a plurality of layers. Referring to Figure 4 , the bonding layer 200 can include a first layer L1 and a second layer L2. The first layer L1 can be disposed between the substrate 100 and the second layer L2. The second layer L2 can be disposed between the first layer L1 and the metal layer 300.

[0084] The thicknesses of the first layer L1 and the second layer L2 can be the same or different. For example, the thickness of the first layer L1 can be equal to or greater than the thickness of the second layer L2. Accordingly, the adhesion of the bonding layer can be maintained while the bonding layer 200 is colored.

[0085] The first layer L1 can include a plurality of beads 250. The beads 250 are not disposed in the second layer L2. The beads 250 can have a color. Accordingly, the first layer L1 can have a color through the beads 250. The second layer L2 does not include the beads 250. Accordingly, the second layer L2 has a color of a resin material. Specifically, the second layer L2 can be transparent or translucent.

[0086] Accordingly, the bonding layer 200 can partially have a color. A user can recognize the color of the bonding layer 200 through the separation region S. Because the second layer L2 is transparent or translucent, the user can recognize the color of the first layer L1.

[0087] In the related art, a user can recognize only the color of a substrate through the separation region S. That is, the user recognizes the color of the substrate through the transparent or translucent bonding layer.

[0088] However, the smart IC substrate according to an embodiment includes a bonding layer having a color. The color of the bonding layer can be differently formed by controlling the color of the beads. Accordingly, a user can recognize various colors through the separation region. Accordingly, since the design of the IC card is diversified, the aesthetic feeling of the user can be improved.

[0089] Further, the bonding layer includes a second layer having no color. That is, the second layer does not include the beads. The bonding layer is disposed between the substrate and the metal layer. The bonding layer bonds the substrate and the metal layer. However, the adhesion between the bonding layer and the metal layer can be reduced by the beads. Accordingly, only the first layer includes the beads, and the second layer does not include the beads. Accordingly, it is possible to prevent the adhesion between the metal layer and the substrate from being reduced due to the beads. Accordingly, the reliability of the smart IC substrate is improved.

[0090] Referring to Figure 5 The first layer L1 and the second layer L2 can include a plurality of beads.

[0091] The first layer L1 can include first beads 251. The second layer L2 can include second beads 252.

[0092] The first beads 251 and the second beads 252 can have the same or different colors. The first beads 251 and the second beads 252 can have different sizes.

[0093] The first beads 251 and the second beads 252 can include different amounts. Specifically, a volume of the first beads included in the first layer L1 can be different from a volume of the second beads included in the second layer L2. Specifically, a ratio of the volume of the first beads to a total volume of the first layer L1 can be greater than a ratio of the volume of the second beads to a total volume of the second layer L2.

[0094] Accordingly, the darkness of the first layer L1 and the darkness of the second layer L2 can be different. Specifically, the color of the first layer L1 can be a dark color. Also, the color of the second layer L2 can be a light color.

[0095] Accordingly, the bonding layer 200 can have a color. A user can recognize the color of the bonding layer 200 through the partition S.

[0096] For example, the color of the first beads and the color of the second beads can be the same. Accordingly, the first layer and the second layer can have a shadow effect due to the difference in darkness. Accordingly, since the design of the IC card is diversified, the aesthetic feeling of the user can be improved.

[0097] Alternatively, the color of the first beads and the color of the second beads can be different. Accordingly, the first layer and the second layer can have different colors. Accordingly, the user can recognize two colors. Alternatively, the user can recognize a mixed color of the two colors. Accordingly, since the design of the IC card is diversified, the aesthetic feeling of the user can be improved.

[0098] Further, the second layer includes a small amount of beads. Accordingly, it is possible to prevent the adhesion between the bonding layer and the metal layer from being reduced due to the beads. Accordingly, the reliability of the smart IC substrate is improved.

[0099] Referring to Figure 6The bonding layer 200 can further include a third layer L3. For example, the bonding layer 200 can include the first layer L1, the second layer L2, and the third layer L3. The second layer L2 and the third layer L3 are disposed above and below the first layer L1. The first layer L1 can be disposed between the second layer L2 and the third layer L3. The second layer L2 can be disposed between the first layer L1 and the metal layer 300. The third layer L3 can be disposed between the substrate 100 and the first layer L1.

[0100] The first layer L1 can include a plurality of beads 250. The beads 250 are not disposed in the second layer L2 and the third layer L3. The beads 250 can have a color. Accordingly, the first layer L1 can have a color through the beads 250. The second layer L2 and the third layer L3 do not include the beads 250. Accordingly, the second layer L2 and the third layer L3 have a color of a resin material. Specifically, the second layer L2 can be transparent or translucent.

[0101] Accordingly, the bonding layer 200 can partially have a color. A user can recognize a color of the bonding layer 200 through the partition S. Because the second layer L2 is transparent or translucent, the user can recognize a color of the first layer L1. Accordingly, the user can recognize various colors through the partition. Accordingly, since designs of IC cards are diversified, an aesthetic feeling of a user can be improved.

[0102] In addition, the second layer does not include beads. Accordingly, an adhesive force between the metal layer and the substrate can be prevented from being reduced due to the beads. Accordingly, reliability of the smart IC substrate is improved.

[0103] Referring to Figures 7 to 9 At least one layer of the second layer L2 and the third layer can include beads.

[0104] Referring to Figure 7 The first layer L1 and the second layer L2 can include a plurality of beads. The first layer L1 can include first beads 251. The second layer L2 can include second beads 252.

[0105] The first beads 251 and the second beads 252 can have the same or different colors. The first beads 251 and the second beads 252 can have different sizes.

[0106] The first beads 251 and the second beads 252 can include different amounts. Specifically, a volume of the first beads included in the first layer L1 can be different from a volume of the second beads included in the second layer L2. Specifically, a ratio of the volume of the first beads to a total volume of the first layer L1 can be greater than a ratio of the volume of the second beads to a total volume of the second layer L2.

[0107] Accordingly, a darkness of the first layer L1 and a darkness of the second layer L2 can be different. Specifically, a color of the first layer L1 can be a dark color. In addition, a color of the second layer L2 can be a light color.

[0108] Accordingly, the bonding layer 200 can have a color. A user can recognize the color of the bonding layer 200 through the separation section S.

[0109] For example, the color of the first beads and the color of the second beads can be the same. Accordingly, the first layer and the second layer can have a shadow effect due to a difference in darkness. Accordingly, since the design of the IC card is diversified, the aesthetic feeling of a user can be improved.

[0110] Alternatively, the color of the first beads and the color of the second beads can be different. Accordingly, the first layer and the second layer can have different colors. Accordingly, a user can recognize two colors. Alternatively, a user can recognize a mixed color of the two colors. Accordingly, since the design of the IC card is diversified, the aesthetic feeling of a user can be improved

[0111] Further, the second layer includes a small amount of beads. Accordingly, it is possible to prevent the adhesion between the bonding layer and the metal layer from being reduced due to the beads. Accordingly, the reliability of the smart IC substrate is improved.

[0112] Further, the third layer does not include beads. When the substrate and the metal layer are bonded, a part of the beads can move toward the substrate. Accordingly, the beads can be exposed at the interface between the bonding layer and the substrate. Accordingly, it is possible to reduce the adhesion of the substrate. However, the third layer according to an embodiment does not include beads. Accordingly, the above-described problem can be solved.

[0113] Referring to Figure 8 , the first layer L1 and the third layer L3 can include a plurality of beads. The first layer L1 can include first beads 251. The third layer L3 can include third beads 253.

[0114] The first beads 251 and the third beads 253 can have the same or different colors. The first beads 251 and the third beads 253 can have different sizes.

[0115] The first beads 251 and the third beads 253 can include the same or different amounts. Specifically, the volume of the first beads included in the first layer L1 and the volume of the third beads included in the third layer L3 can be similar. Alternatively, the volume of the first beads included in the first layer L1 and the volume of the third beads included in the third layer L3 can be different. For example, the ratio of the volume of the third beads to the total volume of the third layer L3 can be greater than the ratio of the volume of the first beads to the total volume of the first layer L1.

[0116] Accordingly, the darkness of the first layer L1 and the darkness of the third layer L3 can be the same or different.

[0117] Accordingly, the bonding layer 200 can have a color. A user can recognize the color of the bonding layer 200 through the separation section S.

[0118] For example, the color of the first bead and the color of the third bead can be the same. Also, the darkness of the first layer and the darkness of the third layer can be different. Thus, a shadow effect can be obtained due to the difference in darkness. Thus, since the design of the IC card is diversified, the user's aesthetic feeling can be improved.

[0119] Alternatively, the color of the first bead and the color of the third bead can be different. Thus, the first layer and the third layer can have different colors. Thus, the user can recognize two colors. Alternatively, the user can recognize a mixed color of the two colors. Thus, since the design of the IC card is diversified, the user's aesthetic feeling can be improved.

[0120] Further, the second layer does not include a bead. Thus, it is possible to prevent the adhesive force between the bonding layer and the metal layer from being reduced due to the bead. Thus, the reliability of the smart IC substrate is improved.

[0121] Referring to Figure 9 The first layer L1, the second layer L2, and the third layer L3 can include a plurality of beads. The first layer L1 can include first beads 251. The second layer L2 can include second beads 252. The third layer L3 can include third beads 253.

[0122] The first beads 251, the second beads 252, and the third beads 253 can have the same or different colors. The first beads 251, the second beads 252, and the third beads 253 can have the same or different sizes.

[0123] For example, the first beads 251, the second beads 252, and the third beads 253 can have the same color. Alternatively, the first beads 251, the second beads 252, and the third beads 253 can have different colors. Alternatively, the colors of two of the first beads 251, the second beads 252, and the third beads 253 can be the same, and the color of the other bead can be different from the colors of the other two beads.

[0124] The first beads 251, the second beads 252, and the third beads 253 can include the same amount or different amounts. For example, the volume of the first beads included in the first layer L1, the volume of the second beads included in the second layer L2, and the volume of the third beads included in the third layer L3 can be the same or different.

[0125] For example, the ratio of the volume of the first bead to the total volume of the first layer L1 can be less than the ratio of the volume of the second bead to the total volume of the second layer L2. Also, the ratio of the volume of the first bead to the total volume of the first layer L1 can be less than the ratio of the volume of the third bead to the total volume of the third layer L3. Also, the ratio of the volume of the second bead to the total volume of the second layer L2 and the ratio of the volume of the third bead to the total volume of the third layer L3 can be the same or different. For example, the ratio of the volume of the second bead to the total volume of the second layer L2 and the ratio of the volume of the third bead to the total volume of the third layer L3 can be the same. Alternatively, the ratio of the volume of the third bead to the total volume of the third layer L3 can be greater than the ratio of the volume of the second bead to the total volume of the second layer L2.

[0126] As an example, the amount of the bead in the bonding layer can decrease as the bonding layer extends from the third layer L3 toward the second layer L2.

[0127] Accordingly, the bonding layer can have a shadow effect and various colors.

[0128] For example, the first bead, the second bead, and the third bead can have the same color. Accordingly, the first layer, the second layer, and the third layer can have different darkness. Accordingly, a shadow effect can be obtained due to the difference in darkness. Accordingly, since the design of the IC card is diversified, the user's aesthetic feeling can be improved.

[0129] Alternatively, the first bead, the second bead, and the third bead can have different colors. Accordingly, the first layer, the second layer, and the third layer can have different colors. Accordingly, a shadow effect can be obtained due to the difference in darkness. Accordingly, the user can recognize three colors or three mixed colors. Accordingly, since the design of the IC card is diversified, the user's aesthetic feeling can be improved.

[0130] Referring to Figure 10 and Figure 11 , the bonding layer 200 can include one layer. Referring to Figure 10 , the bonding layer 200 can include one layer. For example, the first layer L1 and the second layer L2 can be integrally formed to form one layer.

[0131] The bonding layer 200 can include a plurality of regions. The bonding layer 200 can include a first region 1A and a second region 2A. The first region 1A can be disposed between the substrate 100 and the second region 2A. The second region 2A can be disposed between the first region 1A and the metal layer 300.

[0132] The thicknesses of the first region 1A and the second region 2A can be the same or different. For example, the thickness of the first region 1A can be equal to or greater than the thickness of the second region 2A. Accordingly, the adhesion of the bonding layer can be maintained while imparting color to the bonding layer 200.

[0133] The first region 1A and the second region 2A can be distinguished by the beads. For example, the first region 1A is a region in which the beads are provided. The second region 2A is a region in which the beads are not provided.

[0134] The thickness of the second region 2A can be greater than a distance between the beads provided in the first region 1A. The thickness of the second region 2A can be greater than an average distance between the beads provided in the first region 1A. The thickness of the second region 2A can be greater than a distance between an uppermost bead in a thickness direction of the substrate and a bead most adjacent to the uppermost bead. The thickness of the second region 2A can be greater than twice the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead. The thickness of the second region 2A can be greater than five times the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead. The thickness of the second region 2A can be greater than ten times the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead. The thickness of the second region 2A can be greater than thirty times the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead.

[0135] The thickness of the second region 2A can be greater than a particle diameter of the beads provided in the first region 1A. The thickness of the second region 2A can be greater than twice the particle diameter of the beads. The thickness of the second region 2A can be greater than five times the particle diameter of the beads. The thickness of the second region 2A can be greater than ten times the particle diameter of the beads. The thickness of the second region 2A can be greater than thirty times the particle diameter of the beads.

[0136] The thickness of the second region 2A can be less than the thickness of the first region 1A.

[0137] The bonding layer 200 can have a color by the beads present in the first region 1A. In addition, the adhesion of the bonding layer can be maintained by the second region 2A.

[0138] The beads 250 can have a color. Accordingly, the first region 1A can have a color by the beads 250. In addition, the second region 2A has a color of the resin material. Specifically, the second region 2A can be transparent or translucent.

[0139] Accordingly, the bonding layer 200 can partially have a color. A user can recognize the color of the bonding layer 200 through the separation zone S. Because the second region 2A is transparent or translucent, the user can recognize the color of the first region 1A.

[0140] In the related art, a user can recognize only the color of the substrate through the separation zone S. That is, the user recognizes the color of the substrate through the transparent or translucent bonding layer.

[0141] However, the smart IC substrate according to an embodiment includes a bonding layer having a color. The color of the bonding layer can be differently formed by controlling the color of the beads. Accordingly, a user can recognize various colors through the partition. Accordingly, since the design of the IC card is diversified, the aesthetic feeling of the user can be improved.

[0142] The smart IC substrate according to an embodiment includes a second area having no color. Accordingly, the adhesion force between the metal layer and the substrate can be prevented from being reduced due to the beads. Accordingly, the reliability of the smart IC substrate is improved.

[0143] Referring to Figure 11 The bonding layer 200 can include one layer. For example, the first layer L1, the second layer L2, and the third layer L3 can be integrally formed to form one layer.

[0144] The bonding layer 200 can further include a third area 3A. For example, the bonding layer 200 can include the first area 1A, the second area 2A, and the third area 3A. The second area 2A and the third area 3A are disposed above and below the first area 1A. The first area 1A can be disposed between the second area 2A and the third area 3A. The second area 2A can be disposed between the first area 1A and the metal layer 300. The third area 3A can be disposed between the substrate 100 and the first area 1A.

[0145] The first area 1A can include a plurality of beads 250. The beads 250 are not disposed in the second area 2A and the third area 3A. The beads 250 can have a color. Accordingly, the first area 1A can have a color through the beads 250. The second area 2A and the third area 3A do not include the beads 250. Accordingly, the second area 2A and the third area 3A have the color of the resin material. In detail, the second area 2A can be transparent or translucent.

[0146] The thickness of at least one of the second region 2A and the third region 3A can be greater than the distance between the beads disposed in the first region 1A. The thickness of at least one of the second region 2A and the third region 3A can be greater than the average distance between the beads disposed in the first region 1A. The thickness of at least one of the second region 2A and the third region 3A can be greater than the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead. The thickness of at least one of the second region 2A and the third region 3A can be two times or more of the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead. The thickness of at least one of the second region 2A and the third region 3A can be five times or more of the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead. The thickness of at least one of the second region 2A and the third region 3A can be ten times or more of the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead. The thickness of at least one of the second region 2A and the third region 3A can be thirty times or more of the distance between the uppermost bead in the thickness direction of the substrate and the bead most adjacent to the uppermost bead.

[0147] The thickness of at least one of the second region 2A and the third region 3A can be greater than the particle diameter of the beads disposed in the first region 1A. The thickness of at least one of the second region 2A and the third region 3A can be two times or more of the particle diameter of the beads. The thickness of at least one of the second region 2A and the third region 3A can be five times or more of the particle diameter of the beads. The thickness of at least one of the second region 2A and the third region 3A can be ten times or more of the particle diameter of the beads. The thickness of at least one of the second region 2A and the third region 3A can be thirty times or more of the particle diameter of the beads.

[0148] The thickness of at least one of the second region 2A and the third region 3A can be less than the thickness of the first region 1A.

[0149] The sum of the thicknesses of the second region 2A and the third region 3A can be less than the thickness of the first region 1A.

[0150] The bonding layer 200 can have a color by the beads disposed in the first region 1A. In addition, the adhesion of the bonding layer can be maintained by the second region 2A and the third region 3A.

[0151] Accordingly, the bonding layer 200 can partially have a color. The user can recognize the color of the bonding layer 200 through the separation zone S. Since the second region 2A is transparent or translucent, the user can recognize the color of the first region 1A. Accordingly, the user can recognize various colors through the separation zone. Accordingly, since the design of the IC card is diversified, the aesthetic feeling of the user can be improved.

[0152] In addition, the second region 2A does not include the beads. Accordingly, it is possible to prevent the adhesive force between the metal layer and the substrate from being reduced due to the beads. Thus, the reliability of the smart IC substrate is improved.

[0153] On the other hand, the beads can also be provided in at least one of the second region 2A and the third region 3A. For example, at least one of the second region 2A and the third region 3A can include the beads, such as Figure 5 and Figures 7 to 9 the second layer or the third layer. Accordingly, the bonding layer can have a shadow effect. In addition, the user can recognize various colors.

[0154] Hereinafter, a smart IC module according to a first embodiment will be described with reference to Figure 12 and Figure 13 .

[0155] Referring to Figure 12 and Figure 13 , the smart IC module 2000 includes the above-described smart IC substrate 1000 and a chip C.

[0156] The chip C is disposed on the second surface 2S. Specifically, the chip C is disposed on the bonding surface.

[0157] The chip C is connected to the second plating layer 420. Specifically, the chip C is wire-bonded to the second plating layer 430 through a wire W. Accordingly, the chip C is electrically connected to the conductive pattern P.

[0158] The wire W contains a metal. Specifically, the wire W can contain the same or different material as the second plating layer 420. For example, the wire W can contain gold, copper, or aluminum.

[0159] A molding member M can be disposed on the chip C. The molding member M is disposed to cover the chip C and the wire W. Accordingly, it is possible to prevent the wire bonding from being damaged by external impact.

[0160] The smart IC substrate and the smart IC module according to the first embodiment include a bonding layer.

[0161] The bonding layer can include a plurality of layers. For example, the bonding layer can include a first layer and a second layer. The first layer can include beads. In addition, the second layer can not include beads. Alternatively, the second layer can include a small amount of beads.

[0162] Accordingly, the bonding layer can have a color through the first layer. Thus, the user can recognize the color through the division of the conductive pattern. Accordingly, it is possible to improve the aesthetic feeling of the user.

[0163] Further, the second layer does not include the beads, or the second layer includes a small amount of the beads. Accordingly, it is possible to prevent the adhesive force between the bonding layer and the metal layer from being reduced. Accordingly, the reliability of the smart IC module is improved.

[0164] Alternatively, the bonding layer is formed as one layer. In addition, the bonding layer can include a plurality of regions. For example, the bonding layer can include a first region and a second region. The first region can include the beads. In addition, the second region can not include the beads. Alternatively, the second region can include a small amount of the beads.

[0165] Accordingly, the bonding layer can have the color through the first region. Accordingly, the user can recognize the color through the division of the conductive pattern. Accordingly, it is possible to improve the aesthetic feeling of the user.

[0166] Further, the second region does not include the beads, or the second region includes a small amount of the beads. Accordingly, it is possible to prevent the adhesive force between the bonding layer and the metal layer from being reduced. Accordingly, the reliability of the smart IC module is improved.

[0167] Hereinafter, the smart IC substrate and the smart IC module according to a second embodiment will be described with reference to Figures 14 to 22 The smart IC substrate and the smart IC module according to the second embodiment will be described. The description of the contents same as or similar to those of the first embodiment will be omitted. In addition, the same reference numerals are assigned to the components same as those of the first embodiment.

[0168] Referring to Figures 14 to 19 , the smart IC substrate includes a substrate 100, a bonding layer 200, a metal layer 300, and a plating layer.

[0169] The substrate 100 includes a first surface 1S and a second surface 2S. The first surface 1S and the second surface 2S are surfaces opposite to each other. The first surface 1S is defined as a contact surface. In addition, the second surface 2S is defined as a bonding surface.

[0170] The material, shape, and thickness of the substrate 100 are the same as those of the first embodiment.

[0171] The substrate 100 includes a hole H. The hole H includes a plurality of holes. At least one hole of the plurality of holes is a region in which wire bonding is performed. For example, all of the plurality of holes are regions in which wire bonding is performed. Alternatively, a part of the plurality of holes are regions in which wire bonding is performed. The chip C and the plating layer are wire-bonded through the hole H.

[0172] The hole H has a width within a set range. The width of the hole H can be defined as a diameter of the hole or a minimum distance between inner side surfaces of the hole. For example, the width of the hole H can be 500 pm to 1000 pm, 600 pm to 900 pm, or 700 pm to 800 pm. If the width of the hole H is less than 500 pm, it is difficult to perform wire bonding through the hole H. In addition, if the width of the hole H is greater than 1000 pm, the support force of the substrate 100 is reduced.

[0173] The bonding layer 200 is provided on the substrate 100. Specifically, the bonding layer 200 includes a first bonding layer 210 and a second bonding layer 220. The first bonding layer 210 is provided on the first surface 1S. The second bonding layer 220 is provided on the second surface 2S.

[0174] The material and thickness of the bonding layer 200 are the same as those of the first embodiment.

[0175] At least one of the first bonding layer 210 and the second bonding layer 220 can include a plurality of layers. For example, at least one of the first bonding layer 210 and the second bonding layer 220 can include a plurality of layers including the same resin material. Alternatively, at least one of the first bonding layer 210 and the second bonding layer 220 can include a plurality of layers including different resin materials.

[0176] Alternatively, at least one of the first bonding layer 210 and the second bonding layer 220 can include one layer. In addition, at least one of the first bonding layer 210 and the second bonding layer 220 can include a plurality of regions.

[0177] At least one of the first bonding layer 210 and the second bonding layer 220 can have a color. The bonding layer 200 will be described in detail below.

[0178] The metal layer 300 is provided on the substrate 100. The metal layer 300 includes a first metal layer 310 and a second metal layer 320. The first metal layer 310 is provided on the first bonding layer 210. The second metal layer 320 is provided on the second bonding layer 220.

[0179] The material and thickness of the metal layer 300 are the same as those of the first embodiment.

[0180] The metal layer 300 includes a plurality of conductive patterns P. The conductive patterns P are formed by patterning the metal layer 300.

[0181] The conductive patterns P are provided on the first surface 1S. The conductive patterns P are provided on the bonding layer 200. The conductive patterns P are provided on the contact surface.

[0182] Accordingly, a separation area S is formed between the plurality of conductive patterns P. The bonding layer 200 is exposed by the separation area S. Accordingly, the conductive patterns P are spaced apart by the separation area S. The hole H is provided in an area corresponding to each conductive pattern P.

[0183] The smart IC substrate 1000 includes a wiring pattern 500. The wiring pattern 500 is disposed on the second surface 2S. The wiring pattern 500 is disposed on the second bonding layer 220. The wiring pattern 500 is disposed on the bonding surface.

[0184] The wiring pattern 500 is connected to an external antenna pattern. Accordingly, the smart IC module can be operated in a non-contact manner.

[0185] The wiring pattern 500 can include a wiring portion 510 and a connection portion 520.

[0186] The wiring portion 510 can include a first wiring portion 511, a second wiring portion 512, and a third wiring portion 513. The first wiring portion 511 and the connection portion 520 are disposed inside the molding area MA. The second wiring portion 512 and the third wiring portion 513 are disposed outside the molding area MA.

[0187] The first wiring portion 511 and the third wiring portion 513 can be connected through the second wiring portion 512.

[0188] The first wiring portion 511, the second wiring portion 512, and the third wiring portion 513 can have different line widths. For example, the line width of the second wiring portion 512 can be greater than the line width of the first wiring portion 511. Accordingly, after the molding portion M is disposed inside the molding area MA, damage to the wiring portion disposed outside the molding portion M can be prevented.

[0189] The line width of the third wiring portion 513 can be greater than the line widths of the first wiring portion 511 and the second wiring portion 512. The third wiring portion 513 is an area connected to the card body. Since the line width of the third wiring portion 513 is formed to be large, the smart IC substrate and the card body can be easily connected.

[0190] The connection portion 520 can include a first connection portion 521 and a second connection portion 522. In detail, at least one wiring pattern of the plurality of wiring patterns can include the first connection portion 521 and the second connection portion 522.

[0191] The sizes of the first connection portion 521 and the second connection portion 522 can be smaller than the size of the hole H. In addition, the size of the second connection portion 522 can be smaller than the size of the third wiring portion 513. For example, the area of the second connection portion 522 can be smaller than the area of the third wiring portion 513. Accordingly, a wide space of a chip mounting area can be secured, and a package size can be reduced.

[0192] In addition, the first connection part 521 or the second connection part 522 is wire-bonded to the chip. The connection part includes two or more connection parts. Thus, if a wire-bonding problem occurs in one connection part, it can be solved by wire-bonding to another connection part. For example, if a problem occurs in wire-bonding of the first connection part 521, additional wire-bonding can be performed on the second connection part 522.

[0193] A plating layer is disposed on the metal layer 300. Referring to Figure 16 and Figure 17 , the plating layer is classified into a plurality of plating layers according to positions. Specifically, the plating layer can include a first plating layer 410, a second plating layer 420, and a third plating layer 430 disposed at different positions.

[0194] The first plating layer 410 is disposed on one surface 311 of the first metal layer 310. The second plating layer 420 is disposed on the other surface 312 of the first metal layer 310. The second plating layer 420 is disposed in an area overlapping the hole H. The second plating layer 420 can be a pad portion to which wire-bonding is performed. The third plating layer 430 is disposed on one surface 321 of the second metal layer 320. The wiring pattern 500 is formed of the second metal layer 320 and the third plating layer 440. The third plating layer 430 can be a pad portion to which wire-bonding is performed.

[0195] The first plating layer 410 includes a 1-1 layer 411 and a 1-2 layer 412. The 1-1 layer 411 is in contact with the first metal layer 310. The 1-2 layer 412 is in contact with the 1-1 layer 411. Thus, the 1-1 layer 411 is disposed between the first metal layer 310 and the 1-2 layer 412.

[0196] The second plating layer 420 includes a 2-1 layer 421 and a 2-2 layer 422. The 2-1 layer 421 is in contact with the first metal layer 310. The 2-2 layer 422 is in contact with the 2-1 layer 421. Thus, the 2-1 layer 421 is disposed between the first metal layer 310 and the 2-2 layer 422.

[0197] The third plating layer 430 includes a 3-1 layer 431 and a 3-2 layer 432. The 3-1 layer 431 is in contact with the second metal layer 320. The 3-2 layer 432 is in contact with the 3-1 layer 431. Thus, the 3-1 layer 431 is disposed between the second metal layer 320 and the 3-2 layer 432.

[0198] The first plating layer 410, the second plating layer 420, and the third plating layer 430 can contain the same material. The first plating layer 410, the second plating layer 420, and the third plating layer 430 can be formed to have the same layer structure.

[0199] Hereinafter, the first bonding layer and the second bonding layer will be described with reference to Figures 16 to 19 .

[0200] Referring to Figure 16 and Figure 18 , the first bonding layer 210 and the second bonding layer 220 can have different layer structures.

[0201] The first bonding layer 210 can include a plurality of layers. For example, the first bonding layer can include a first layer L1 and a second layer L2. The first layer L1 can be disposed between the substrate 100 and the second layer L2. The second layer L2 can be disposed between the first layer L1 and the metal layer 300. Alternatively, the first bonding layer can further include a third layer L3.

[0202] The first bonding layer 210 corresponds to the bonding layer of the first embodiment. Thus, the description of the first bonding layer will be omitted.

[0203] The second bonding layer 220 can include one layer.

[0204] The first bonding layer 210 and the second bonding layer can have different thicknesses. Specifically, the thickness T1 of the first bonding layer can be greater than the thickness T2 of the second bonding layer. The first bonding layer includes a plurality of layers. Thus, the first bonding layer is formed thicker than the second bonding layer.

[0205] Referring to Figure 17 and Figure 19 , the first bonding layer 210 and the second bonding layer 220 can have different layer structures.

[0206] The first bonding layer 210 can include a plurality of regions. For example, the first bonding layer can include a first region 1A and a second region 2A. The first region 1A can be disposed between the substrate 100 and the second region 2A. The second region 2A can be disposed between the first region 1A and the metal layer 300. Alternatively, the first bonding layer can further include a third region 3A.

[0207] The first bonding layer 210 corresponds to the bonding layer of the first embodiment. Thus, the description of the first bonding layer will be omitted.

[0208] The second bonding layer 220 can include one layer.

[0209] The first bonding layer 210 and the second bonding layer can have different thicknesses. Specifically, the thickness T1 of the first bonding layer can be greater than the thickness T2 of the second bonding layer. The first bonding layer includes a plurality of regions. Thus, the first bonding layer is formed thicker than the second bonding layer.

[0210] The smart IC substrate according to the embodiment includes a first bonding layer having a color. The color of the first bonding layer can be differently formed by controlling the color of the beads. Thus, the user can recognize various colors through the partition. Thus, since the design of the IC card is diversified, the aesthetic feeling of the user can be improved.

[0211] The first bonding layer includes the second layer without color. That is, the second layer does not include the beads. Alternatively, the second layer includes a small amount of beads. Accordingly, it is possible to prevent the adhesive force between the metal layer and the substrate from being reduced due to the beads. Accordingly, the reliability of the smart IC substrate is improved.

[0212] Hereinafter, a smart IC module according to a second embodiment will be described with reference to Figures 20 to 22

[0213] Referring to Figures 20 to 22 , the smart IC module 2000 includes the above-described smart IC substrate 1000 and a chip C.

[0214] The chip C is disposed on the second bonding layer 220.

[0215] The chip C is connected to the second plating layer 420 and the third plating layer 430. Specifically, the chip C is wire-bonded to the second plating layer 430 by the wire W. Accordingly, the chip C is electrically connected to the conductive pattern P. In addition, the chip C and the third plating layer 430 are wire-bonded by the wire W. Accordingly, the chip C and the antenna pattern are electrically connected.

[0216] A molding member M is disposed on the chip C. Accordingly, the molding member M is disposed to cover the chip C and the wire W. Accordingly, it is possible to prevent the wire from being damaged by external impact.

[0217] Hereinafter, an IC card according to an embodiment will be described with reference to Figure 23 and Figure 24

[0218] Referring to Figure 23 and Figure 24 , the IC card 3000 can include a main body part 3100, an upper layer 3210, and a lower layer 3220.

[0219] The main body part 3100 includes a receiving part 3110. The smart IC module 2000 is disposed inside the receiving part 3110.

[0220] The IC card can operate in various modes. For example, the IC card can operate as a contact card.

[0221] Alternatively, the antenna pattern AP can be disposed on the main body part 3100. Specifically, the antenna pattern can be disposed in a coil shape at an edge of the main body part 3100. Accordingly, the IC card can operate as a non-contact card, a combination card, or a hybrid card.

[0222] The smart IC module 2000 is inserted into the receiving part 3110. The smart IC module 2000 and the main body part 3100 are bonded by the adhesive layer 3300. Accordingly, the smart IC module 2000 is inserted and fixed in the receiving part 3110.​​

[0223] The upper layer 3210 is disposed at an upper portion of the main body 3100. The upper layer 3210 can include a transparent material. The upper layer 3210 can include a transparent resin material. The upper layer 3210 can be disposed as at least one layer. That is, the upper layer 3210 can include a plurality of layers.

[0224] The lower layer 3220 is disposed at a lower portion of the main body 3100. A magnetic stripe can be disposed on the lower layer 3220. The lower layer 3220 can include a transparent material. The lower layer 3220 can include a transparent resin material. The lower layer 3220 can be disposed as at least one layer. That is, the lower layer 3220 can include a plurality of layers.

[0225] The characteristics, structures, and effects described in the above-described embodiments include at least one embodiment, but are not limited to one embodiment. In addition, even with respect to other embodiments, a person of ordinary skill in the art to which the embodiments belong can combine or modify the characteristics, structures, and effects, etc. shown in each embodiment. Therefore, it should be understood that the content related to such a combination and such a modification is included in the scope of the embodiments.

[0226] The description is focused on the embodiments, but it is only illustrative and does not limit the embodiments. A person of ordinary skill in the art to which the embodiments belong can understand that various modifications and applications not shown above can be made without departing from the essential characteristics of the embodiments. For example, each component specifically indicated in the embodiments can be modified and implemented. In addition, it should be understood that the differences related to these changes and applications are included in the scope of the embodiments defined in the appended claims.

Claims

1. A smart IC substrate, comprising: A substrate, the substrate including a first surface and a second surface opposite to the first surface; A bonding layer is disposed on the first surface; A metal layer disposed on the bonding layer; as well as A plating layer, wherein the plating layer is disposed on the metal layer, The bonding layer includes a first layer and a second layer. The second layer is disposed between the first layer and the metal layer. The first layer includes beads, and The first layer has color through the beads.

2. The smart IC substrate according to claim 1, wherein, The second layer is transparent or semi-transparent.

3. The smart IC substrate according to claim 1, wherein, The first layer includes a first bead, and the second layer includes a second bead.

4. The smart IC substrate according to claim 3, wherein, The color of the first bead is the same as or different from the color of the second bead, and The ratio of the volume of the first bead to the total volume of the first layer is greater than the ratio of the volume of the second bead to the total volume of the second layer.

5. The smart IC substrate according to claim 1, wherein, The bonding layer also includes a third layer. The first layer is disposed between the second layer and the third layer. The second layer is disposed between the first layer and the metal layer. The third layer is disposed between the substrate and the first layer, and Wherein, at least one of the second layer and the third layer is transparent or semi-transparent.

6. The smart IC substrate according to claim 5, wherein, The first layer includes the first bead. The second layer includes a second bead, and The third layer is either transparent or semi-transparent.

7. The smart IC substrate according to claim 5, wherein, The first layer includes the first bead. The third layer includes a third bead, and The second layer is either transparent or semi-transparent.

8. The smart IC substrate according to claim 1, wherein, The bonding layer also includes a third layer. The first layer is disposed between the second layer and the third layer. The second layer is disposed between the first layer and the metal layer. The third layer is disposed between the substrate and the first layer. The first layer includes a first bead. The second layer includes a second bead, and The third layer includes a third bead.

9. The smart IC substrate according to claim 8, wherein, The amount of beads decreases as it extends from the third layer toward the second layer.

10. The smart IC substrate according to claim 1, wherein, The first layer and the second layer are formed as a single unit to create one layer. The bonding layer includes a first region and a second region. The first region includes beads. The first region is colored by the beads, and The second region is transparent or semi-transparent.

Images