Component mounting management system, component mounting machine, and component mounting method

Abstract

A component mounting management system includes a component mounting device and a management device that manages the component mounting device. The component mounting apparatus includes: a component mounting unit capable of performing a mounting process of mounting a component on a substrate; a storage unit that stores information relating to the performance of the component mounting apparatus for executing the mounting process; and a transmission unit that transmits the information stored in the storage unit to a management device. The management device is provided with: a reception unit that receives information transmitted from a transmission unit; and a calculation unit that calculates, on the basis of the information received by the reception unit, the mounting time required for performing the mounting process in the component mounting device.

Description

Technical Field

[0001] The technology disclosed in this specification relates to the technology of managing component mounting machines. Background Technology

[0002] Patent document 1 discloses a control device for production equipment capable of automatically changing software to improve the functions of production equipment.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 8-76818 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] The mounting time required for mounting components onto a substrate varies depending on the performance of the component mounting machine. Therefore, if the performance of the component mounting machine changes (e.g., component replacement), calculating the mounting time based on information related to the performance before the change may deviate from the actual mounting time. This specification discloses a technique for calculating accurate mounting time based on information related to the performance of the component mounting machine.

[0008] Methods for solving problems

[0009] The component mounting management system disclosed in this specification includes a component mounting machine and a management device for managing the component mounting machine. The component mounting machine includes: a component mounting unit capable of performing mounting processes to mount components onto a substrate; a storage unit storing information related to the performance of the component mounting machine used to perform the mounting processes; and a transmission unit transmitting the information stored in the storage unit to the management device. The management device includes: a receiving unit receiving the information transmitted from the transmission unit; and a calculation unit calculating the mounting time required for performing the mounting processes in the component mounting machine based on the information received by the receiving unit.

[0010] In the aforementioned component mounting management system, information related to the performance of the component mounting machine is stored in the component mounting machine. Based on this performance-related information sent from the component mounting machine, the management device calculates the installation time required for installation processing within the machine. Therefore, even if the performance of the component mounting machine changes, it is not necessary to manage these performance changes within the management device; an accurate installation time can be calculated based on the information sent from the component mounting machine.

[0011] The component mounting machine constituting the aforementioned component mounting management system and the method for managing the component mounting machine implemented by the component mounting management system are also novel and useful. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the component installation management system of an embodiment.

[0013] Figure 2 This is a side view of the component mounting machine.

[0014] Figure 3 This is the control structure diagram of the component installation management system.

[0015] Figure 4 This is a sequence diagram of the processes executed in the component installation management system. Detailed Implementation

[0016] The main features of the embodiments described below are listed. It should be noted that the technical elements described below are independent technical elements, which exert their technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of application.

[0017] (Feature 1) In the component installation management system described above, multiple component installation machines may be managed, each of which includes a component installation unit, a storage unit, and a transmission unit. In this case, the receiving unit can obtain the information transmitted from the transmission units of the multiple component installation machines, and the calculation unit can calculate the installation time of each of the multiple component installation machines based on the information received by the receiving unit from each of the multiple component installation machines.

[0018] With this structure, installation time can be accurately calculated based on information related to the performance of each component mounter, regardless of the number of mounters. However, in other embodiments, the component mount management system can also manage a single component mounter.

[0019] (Feature 2) In the component mounting management system described above, the component mounting machine may also include: an imaging unit for capturing images of the components; and an image processing device for analyzing the images of the components captured by the imaging unit. In this case, the information may be information related to the performance of the image processing device.

[0020] Based on this structure, the installation time can be accurately calculated using information related to the performance of the image processing device. However, in other embodiments, the information used for calculating the installation time may, for example, be information related to the performance of the component mounting section of the component mounting machine.

[0021] (Feature 3) In the component installation management system described above, the management device may also include a task determination unit, which determines the task to be performed in the installation process of the component installation machine based on the information obtained by the receiving unit. The task may also specify at least the type and number of components to be installed in the installation process.

[0022] Based on this structure, efficient tasks can be determined based on information related to the performance of the component mounting machine.

[0023] (Feature 4) In the component installation management system described above, the management device may also include a task sending unit that sends the task determined by the task decision unit to the component installation machine.

[0024] This structure enables the component mounting machine to perform efficient tasks based on information related to the performance of the component mounting machine.

[0025] (Feature 5) In the above-described component installation management system, the management device may also include an information request sending unit that sends an information request signal to the component installation machine, the information request signal being used to request the information to be sent to the management device.

[0026] Based on this structure, the management device can cause the component mounter to send information related to the performance of the component mounter to the management device at a desired time.

[0027] (Example)

[0028] Figure 1This is a schematic diagram showing the component mounting management system 100 of this embodiment. The component mounting management system 100 includes a management device 50 and a component mounting production line 10. The component mounting management system 100 is a system for mounting electronic components onto a circuit board using the component mounting production line 10. The component mounting production line 10 includes three component mounting machines 10A, 10B, and 10C. Although not shown in the diagram, the component mounting production line 10 includes other board processing machines such as a solder printer and a board inspection machine, in addition to each component mounting machine 10A to 10C. The circuit board is transported in the order of the component mounting machines 10A, 10B, and 10C. Multiple electronic components are mounted on the circuit board using each component mounting machine 10A to 10C. The management device 50 is a computer that manages each component mounting machine 10A to 10C of the component mounting production line 10. The management device 50 is capable of communicating with each component mounting machine 10A to 10C. In this embodiment, all component mounting machines 10A to 10C in the component mounting production line 10 are of the same type and have the same structure, except for the structure of the control device 22 described later. Therefore, in this specification, the structure of the component mounting machine 10A will be mainly described. Hereinafter, electronic components will be abbreviated as "components" and circuit boards will be abbreviated as "boards".

[0029] Reference Figure 2 The detailed structure of the component mounting machine 10A will be described below. The component mounting machine 10A performs the mounting process of mounting component 4 onto the mounting position of substrate 2. For example... Figure 2 As shown, the component mounting machine 10A includes a component feeder unit 12, a touch panel 13, a feeder holding section 14, a component mounting section 15 consisting of an assembly head 16 and a head moving device 18, a photographing device 30, a substrate conveyor 20, and a control device 22. The component feeder unit 12 has a feeder along the +X direction (i.e., ...). Figure 2 Multiple feeders are arranged in the direction of the inside of the paper, and each feeder contains multiple components 4. Each feeder of the component feeder unit 12 is installed in a detachable manner on the feeder holding part 14 and supplies components 4 to the assembly head 16.

[0030] The touch panel 13 displays various information related to the component mounting machine 10A. In addition, the touch panel 13 also functions as an operating unit for receiving various instructions from the operator.

[0031] The assembly head 16 includes a suction nozzle 6 that can be detachably fixed. The suction nozzle 6 has a cylindrical shape extending downward toward the substrate 2. A negative pressure is maintained inside the suction nozzle 6, thereby allowing the suction nozzle 6 to adsorb the element 4. The assembly head 16 moves the suction nozzle 6 along the Z-axis (i.e., Figure 2The assembly head 16 moves (up and down on the paper surface). It can pick up the component 4 from the feeder via the suction nozzle 6 and assemble the component 4 picked up by the suction nozzle 6 onto the mounting position on the substrate 2. Furthermore, the assembly head 16 is not limited to having a single suction nozzle 6, but may have multiple suction nozzles 6. Moreover, the assembly head 16 may also have a chuck instead of a suction nozzle 6 to hold and retain the component 4.

[0032] The head moving device 18 is a device that moves the assembly head 16 and the imaging device 30 along the XY plane. The head moving device 18 moves the assembly head 16 to the mounting position on the substrate 2.

[0033] The shooting device 30 includes a camera 32 (an example of a shooting unit), a light source for illumination (not shown), and a prism (not shown). The camera 32 is positioned from the side (i.e., Figure 2 The camera 32 is used to photograph the side of the component 4 adsorbed on the nozzle 6 from the right side of the paper. For example, a CCD camera is used for the camera 32. The illumination light source is composed of LEDs, illuminating the photographed surface of the component 4. Furthermore, in a variation, the photographing device 30 may replace the camera 32, which photographs the side of the component 4 adsorbed on the nozzle 6 from the side, and instead include, for example, a camera that photographs the bottom surface of the component 4 adsorbed on the nozzle 6 from below. In this case, the camera may be located, for example, between the feeder holding section 14 and the substrate conveyor 20 of the component mounting machine 10A. In this variation, the camera is an example of a "photographing section". Alternatively, in other variations, the photographing device 30 may include both a camera 32 that photographs the side of the component 4 from the side and a camera that photographs the bottom surface of the component 4 from below.

[0034] The substrate conveyor 20 is a device for loading, positioning, and unloading the substrate 2. As an example, the substrate conveyor 20 in this embodiment has a pair of belt conveyors and a support device (not shown) that supports the substrate 2 from below. When the component 4 in the component mounting machine 10A is installed, the substrate conveyor 20 moves the substrate 2 to the adjacent component mounting machine 10B.

[0035] Control device 22 is the computer of each part of the control element mounting machine 10A, and management device 50 (see reference). Figure 1 It can be connected communicatively.

[0036] Reference Figure 3The control structure of each device 50, 10A to 10C in the component mounting management system 100 will be described. The management device 50 is, for example, a terminal device such as a laptop computer, and includes an operation unit 52, a display unit 54, a communication I / F (interface) 56, and a management control board 60. Alternatively, the management device 50 can be a desktop personal computer, or a terminal device such as a smartphone or PDA. The operation unit 52 receives various instructions from the user. The display unit 54 displays various information related to the component mounting production line 10. The communication I / F 56 is an I / F used for connecting to each component mounting machine 10A to 10C of the component mounting production line 10. In this embodiment, the management device 50 and each component mounting machine 10A to 10C are connected via a wired LAN through the communication I / F 56; however, in a variant, each device of the component mounting management system 100 can also be connected via a wireless LAN through the communication I / F 56 of the management device 50.

[0037] The management control board 60 is a control board used to control the management device 50. The management control board 60 includes a CPU 62 and a memory 64. The memory 64 consists of non-volatile memory and volatile memory, storing a program 66. The program 66 is a program for controlling the component mounting production line 10, including, for example, a program for performing task decision processing described later. The program 66 is installed in the management device 50 at the time of shipment. In a variation, the program 66 can be downloaded to the management device 50 afterward from an external server, for example, it can be retrieved from a medium shipped with the component mounting machine 10A. The CPU 62 executes various processes according to the program 66 stored in the memory 64. For example, based on the production program received from a higher-level production management device (not shown), the CPU 62 sends task information to each component mounting machine 10A-10C. The task information is an instruction for each component mounting machine 10A-10C to perform mounting processing.

[0038] like Figure 3 As shown, the component mounting machine 10A, in addition to referring to Figure 2 In addition to the touch panel 13, component mounting section 15, and camera 32 described herein, a communication I / F 11 is also provided. The communication I / F 11 is connected to the communication I / F 56 of the management device 50.

[0039] The control device 22 includes a mounting control board 40 and a parsing control board 41. The mounting control board 40 is a control board mainly used to control the component mounting section 15. The mounting control board 40 includes a CPU 42 and a memory 46. The memory 46 consists of non-volatile memory and volatile memory, and stores a program 48. The program 48 is a program related to the mounting process and is installed on the component mounting machine 10A at the time of manufacture. In a modified example, the program 48 can also be retrieved from a medium shipped with the component mounting machine 10A. For example, the CPU 42 of the mounting control board 40, according to the program 48, mounts the component 4 to the mounting position of the substrate 2 via the component mounting section 15.

[0040] The image processing control board 41 is primarily used to analyze the image of the component 4 captured by the camera 32 to determine whether the component 4 is properly attached to the nozzle 6. That is, the image processing control board 41 analyzes the image of the component 4 captured by the camera 32. The image processing control board 41 includes a CPU 43 and a memory 45. The memory 45 includes non-volatile memory and volatile memory, and stores a program 47. The program 47 is a program related to image processing and includes a calculation formula F1. The program 47 is installed on the component mounting machine 10A at the factory, but can also be taken from a medium shipped with the component mounting machine 10A. The calculation formula F1 is a formula used to calculate the processing time required for the image processing control board 41 to process the image of the component 4. The processing time varies, for example, depending on the size of the component 4 and the number of electrodes on the image processing control board 41. The larger the size of the component 4, the longer the processing time; the smaller the size of the component 4, the shorter the processing time. Furthermore, the electrodes of the image processing control board 41 process signals during image processing. Therefore, the more electrodes the resolution control substrate 41 has, the higher the image resolution and the longer the resolution time. Conversely, the fewer electrodes the resolution control substrate 41 has, the lower the image resolution and the shorter the resolution time. Thus, the calculation formula F1 includes, for example, a size factor C1 multiplied by the size value of the element 4 contained in the image and an electrode factor C2 multiplied by the number of electrodes on the resolution control substrate 41.

[0041] The size factor C1 is determined by the resolution time of the resolution control substrate 41 for each unit of element 4. That is, the size factor C1 varies according to the resolution performance of the resolution control substrate 41 (processing power of CPU 43, etc.). The electrode factor C2 is determined by the resolution time of the resolution control substrate 41 for each electrode. That is, the electrode factor C2 varies according to the performance of the electrode and the resolution performance of the resolution control substrate 41. The calculation formula F1 includes the expression of adding the value obtained by multiplying the size value of the element 4 contained in the image by the size factor C1 to the value obtained by multiplying the number of electrodes of the resolution control substrate 41 by the electrode factor C2.

[0042] The control device 22 of the component mounting machine 10B, like that of the component mounting machine 10A, includes a resolution control board 41. However, the control device 22 of the component mounting machine 10C replaces the resolution control board 41 with a resolution control board 41R. The resolution control board 41R is a control board obtained by improving the resolution control board 41. For example, the resolution control board 41R is equipped with a CPU 43R with improved processing power, and the resolution processing power is improved. That is, regarding the CPU equipped on the resolution control board, it is sometimes difficult to supply components with the same performance, and sometimes a higher-performance CPU is used so that it can also cope with the increase in future processing burden. Therefore, as a component mounting machine 10, even for the same product, the resolution control board may not have the same performance. Therefore, the improved resolution control board 41R has a calculation formula F2 instead of the calculation formula F1 of the resolution control board 41. The calculation formula F2 is different from the calculation formula F1 and includes a size factor C3 and an electrode factor C4. In this embodiment, the size factor C3 of the calculation formula F2 is smaller than the size factor C1 of the calculation formula F1. In addition, the electrode coefficient C4 of formula F2 is greater than the electrode coefficient C2 of formula F1.

[0043] Here, as described above, all component mounting machines 10A to 10C are of the same type. However, component mounting machines 10A and 10B have a resolution control board 41, while component mounting machine 10C has a resolution control board 41R. That is, although component mounting machine 10C is of the same type as component mounting machines 10A and 10B, the performance of its image resolution device is different. For example, if an improved resolution control board 41R is subsequently mounted on component mounting machine 10C instead of the resolution control board 41 that was mounted on component mounting machine 10C at the time of manufacture, the performance of the image resolution device of each component mounting machine 10A to 10C may sometimes be different.

[0044] Reference Figure 4 This section describes the processes performed between the various devices 50, 10A to 10C of the component mounting management system 100. Hereinafter, the processes performed by the management control board 60, the mounting control board 40, and the parsing control boards 41 and 41R will not be primarily described using the control boards 60, 40, 41, and 41R, but rather using the devices 50, 10A to 10C. Furthermore, Figure 4 All communication between the devices 50, 10A to 10C is performed via communication I / F 56, 11, but the phrase "via communication I / F" will be omitted below.

[0045] First, the management device 50 obtains the production program from the superior production management device (T10). In this case, the management device 50 sends an information request signal (T20) to the component mounting machine 10A. The information request signal is used to request the component mounting machine 10A to send performance information indicating the current performance of the component mounting machine 10A. By sending the information request signal to the component mounting machine 10A, the management device 50 enables the component mounting machine 10A to send performance information.

[0046] When the component mounter 10A receives an information request signal from the management device 50 (T20), it sends its performance information to the management device 50 (T22). The performance information includes a calculation formula F1 stored in the memory 45 of the analysis control board 41 of the component mounter 10A.

[0047] When the management device 50 receives performance information from the component mounting machine 10A (T22), it stores the received performance information (T24).

[0048] Similarly, the management device 50 sends an information request signal (T30) to the component mounting machine 10B and receives performance information containing the calculation formula F1 from the component mounting machine 10B (T32). The management device 50 then stores the received performance information (T34).

[0049] Furthermore, the management device 50 sends an information request signal (T40) to the component mounting machine 10C and receives performance information containing the calculation formula F2 from the component mounting machine 10C (T42). The management device 50 stores the received performance information (T44).

[0050] Based on the received performance information, the management device 50 executes task decision processing (T50). Task decision processing determines the installation process for each component mounting machine 10A-10C. In task decision processing, the management device 50 optimizes the installation process in each component mounting machine 10A-10C to maximize the installation efficiency of the component mounting production line 10. Task decision processing is executed based on performance information received from all component mounting machines 10A-10C of the component mounting production line 10.

[0051] Specifically, the management device 50 first assigns the components included in the production process to each component mounting machine 10A to 10C (S10). Specifically, this assigns information on the number of components included in the production process, component type information, and the three component groups to be mounted by each component mounting machine 10A to 10C. The component type information includes mounting position information indicating the mounting location of the component.

[0052] The management device 50 calculates the installation time required for the installation processing of the component groups allocated in S10 (S12). Here, the management device 50 calculates the installation time of the component mounting machine 10A, for example, based on the performance information received in T22. That is, the management device 50 calculates the parsing time included in the installation time of the component mounting machine 10A based on calculation formula F1. Similarly, the management device 50 calculates the installation time of the component mounting machine 10B based on the performance information received in T32, and calculates the installation time of the component mounting machine 10C based on the performance information received in T42. That is, the management device 50 calculates the parsing time included in the installation time of the component mounting machine 10C based on calculation formula F2.

[0053] The management device 50 determines whether the installation time of each component mounting machine 10A to 10C calculated in S12 has been optimized (S20). Specifically, the management device 50 determines whether the difference in installation time among each component mounting machine 10A to 10C is within a predetermined threshold. That is, the management device 50 determines whether the cycle balance of each component mounting machine 10A to 10C has been optimized. If the difference in installation time among each component mounting machine 10A to 10C exceeds the predetermined threshold (no in S20), the management device 50 redistributes the components (S10). If the difference in installation time among each component mounting machine 10A to 10C is within the predetermined threshold (yes in S20), the management device 50 proceeds to S30. The management device 50 repeats the processes of S10 and S20 until the cycle balance of each component mounting machine 10A to 10C is optimized.

[0054] The management device 50 determines the type and number of components in the component groups of each component mounting machine 10A-10C, which were determined to be optimized in S20, as the task (S30). Thus, the management device 50 calculates the installation time of each component mounting machine 10A-10C based on the calculation formulas F1 and F2 contained in the performance information received from each component mounting machine 10A-10C, and determines the task based on the calculated installation time. Therefore, the task can be optimized based on the accurate installation time calculated using the latest parsing time formula.

[0055] Next, the management device 50 sends the task information of component mounting machine 10A, determined in S30, to component mounting machine 10A (T60). Similarly, the management device 50 sends the task information of component mounting machine 10B to component mounting machine 10B (T62), and the task information of component mounting machine 10C to component mounting machine 10C (T64). The task information includes the type and number of components in the mounting process of each component mounting machine 10A to 10C.

[0056] When the component mounting machine 10A receives task information from the management device 50 (T60), it performs the mounting process based on the type and number of components contained in the task information (T70).

[0057] Similarly, when component mounter 10B receives task information from management device 50 (T62), it performs installation processing based on the task information (T72), and when component mounter 10C receives task information from management device 50 (T64), it performs installation processing based on the task information (T74). In this way, management device 50 sends tasks to each component mounter 10A to 10C, thereby enabling each component mounter 10A to 10C to perform tasks optimized based on the latest parsing time calculation formula.

[0058] (Effect of this embodiment)

[0059] In conventional component mounting management systems, for example, the management device stores the parsing time calculation formula in association with the model name of the component mounting machine. Therefore, in conventional component mounting management systems, even if the parsing time calculation formula is changed afterward in the component mounting machine, the management device calculates the mounting time based on the formula before the change. As a result, the actual parsing time in the component mounting machine deviates from the parsing time calculated by the management device, and consequently, the calculated mounting time may deviate from the actual mounting time. In the component mounting management system 100 of this embodiment, for example, the mounting time of the component mounting machine 10A is calculated based on performance information including the calculation formula F2 of the component mounting machine 10C (S12). Therefore, even if the image parsing performance of the component mounting machine 10C is changed after setup, the accurate mounting time can be calculated based on the latest calculation formula F2. In this embodiment, calculation formulas F1 and F2 are examples of "performance-related information". It should be noted that while the performance information of each component mounting machine 10A to 10C can also be stored (managed) through the management device 50, since the component mounting machines 10A to 10C are the same type, managing them as different component mounting machines through the management device 50 would complicate management. In this embodiment, the performance information of each component mounting machine 10A to 10C is stored in each component mounting machine (e.g., the improved resolution control board 41R). Therefore, the management in the management device 50 is not complicated, and the mounting time can be accurately calculated while taking into account various improvements implemented by the component mounting machines 10A to 10C.

[0060] The following describes points of attention related to the component mounting management system 100 illustrated in the embodiments. Performance information may, for example, be identification information identifying the version of the resolution control board of each component mounting machine 10A-10C. In this case, the management device 50 may also associate the identification information of each component mounting machine 10A-10C with calculation formulas F1 and F2 for resolution time and store them. The management device 50 may also determine the calculation formula and calculate the mounting time based on the identification information received from each component mounting machine 10A-10C. In this modified example, the identification information is an example of "performance-related information".

[0061] The component mounting production line 10 may also include a component mounting machine 10A. Generally, the component mounting management system 100 may not manage multiple component mounting machines 10A to 10C.

[0062] Performance information may include, for example, a formula for calculating the installation time of the component mounting section 15 instead of formulas F1 and F2 for calculating the resolution time. In this modified example, the formula for calculating the installation time is an example of "performance-related information".

[0063] Management device 50 can also be in Figure 4 In the T50, task decision processing is not performed. In this case, the management device 50 may also not send tasks to each component mounting machine 10A-10C. In this modified example, for example, the installation time calculated based on performance information may be displayed on the display unit 54 of the management device 50. Thus, the manager can know the accurate installation time calculated based on performance information.

[0064] The management device 50 may also choose not to send information request signals to each component mounting machine 10A-10C. In this modified example, for example, each component mounting machine 10A-10C may also send performance information to the management device 50 at a predetermined time.

[0065] The technical elements illustrated in this specification or drawings exert their technical usefulness individually or in various combinations, and are not limited to the combinations recited in the claims at the time of application. Furthermore, the technology illustrated in this specification or drawings simultaneously achieves multiple objectives, and achieving one of these objectives is itself technically useful.

[0066] For example, this specification also discloses the technical idea of ​​changing "the component installation management system described in technical solution 1" to "the component installation management system described in technical solution 1 or 2" in technical solution 3. Similarly, it also discloses the technical idea of ​​changing "the component installation management system described in technical solution 1" to "the component installation management system described in any one of technical solutions 1 to 3" in technical solution 4, and the technical idea of ​​changing "the component installation management system described in technical solution 1" to "the component installation management system described in any one of technical solutions 1 to 5" in technical solution 6.

Claims

1. A component mounting management system, comprising a component mounting machine and a management device for managing the component mounting machine, wherein, The component mounting machine includes: The component mounting section is capable of performing mounting processes to mount components onto a substrate; The storage unit stores information related to the performance of the component mounting machine used to perform the mounting process; and The sending unit sends the information stored in the storage unit to the management device. The management device includes: The receiving unit receives the information transmitted from the transmitting unit; and The calculation unit calculates the installation time required to perform the installation process in the component mounting machine based on the information received by the receiving unit.

2. The component installation management system according to claim 1, wherein, The management device manages multiple component installation machines. The plurality of component mounting machines each include a component mounting section, a storage section, and a sending section. The receiving unit acquires the information transmitted from the transmitting units of the plurality of component mounting machines, respectively. The calculation unit calculates the installation time of each of the plurality of component mounting machines based on the information received by the receiving unit from each of the plurality of component mounting machines.

3. The component installation management system according to claim 1, wherein, The component mounting machine includes: The imaging unit captures images of the components; and The image processing device analyzes the image of the element captured by the imaging unit. The information is related to the performance of the image processing device.

4. The component installation management system according to claim 1, wherein, The management device further includes a task decision unit, which determines the tasks to be performed in the installation process of the component mounting machine based on the information obtained by the receiving unit. The task specifies at least the type and number of components to be installed in the installation process.

5. The component installation management system according to claim 4, wherein, The management device also includes a task sending unit, which sends the task determined by the task decision unit to the component mounting machine.

6. The component installation management system according to claim 1, wherein, The management device also includes an information request sending unit, which sends an information request signal to the component mounting machine. The information request signal is used to request the information to be sent to the management device.

7. A component mounting machine, comprising: The component mounting section is capable of performing mounting processes to mount components onto a substrate; The storage unit stores information related to the performance of the component mounting machine used to perform the mounting process; and The sending unit sends the information stored in the storage unit to the management device. The management device includes: The receiving unit receives the information transmitted from the transmitting unit; and The calculation unit calculates the installation time required for the installation process in the component mounting machine based on the information received by the receiving unit.

8. A method for managing a component mounting machine, wherein, The component mounting machine includes: The component mounting section is capable of performing mounting processes to mount components onto a substrate; and The storage unit stores information related to the performance of the component mounting machine used to perform the mounting process. The method includes: The process involves obtaining the information sent from the component mounting machine; and The calculation process calculates the installation time required to perform the installation process in the component mounting machine based on the information received in the acquisition process.

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