Profiling jig and manufacturing method thereof

Abstract

The invention provides a profiling jig and a manufacturing method thereof. The manufacturing method of the profiling jig comprises the steps that an attached qualified product is provided; the attached qualified product comprises a body, at least one convex device and an adhesive tape layer, and the convex device is arranged on one side of the body; the adhesive tape layer is arranged on the side, away from the body, of the protruding device and at least covers part of the body to form an attaching face. The side, provided with the protruding device, of the attached qualified product is applied to the surface of the plastic transfer printing piece, and a transfer printing model is formed; the transfer printing model is provided with a negative cavity matched with the attaching surface; demolding the transfer printing model; and the transfer printing model serves as a female mold, a profiling jig is manufactured through a reverse mold process, and the profiling jig comprises a profiling working face corresponding to the negative mold cavity. By adopting a manufacturing mode of carrying out shape copying by taking an attached qualified product as a physical prototype, the copying working surface of the finally manufactured copying jig can form high-precision three-dimensional contour matching with the attached surface of the product.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a contour jig and its manufacturing method. Background Technology

[0002] In the assembly of precision products such as electronic components and display modules, adhesive backing is typically applied to the product surface to achieve functions such as connection, sealing, or shielding. To complete this application process, specialized application fixtures are generally required to position and support the product. Among these techniques, using a contour-following fixture that conforms to the product's shape is a common method to ensure application accuracy and consistency.

[0003] However, the performance of this profiling fixture needs to be improved. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above technical background, this application provides a profiling fixture and its manufacturing method, which is beneficial to improving the performance of the profiling fixture.

[0005] To achieve the above objectives, one embodiment of this application provides a method for manufacturing a contour jig, comprising: providing a qualified attachment product; the qualified attachment product includes a body, at least one protruding device, and an adhesive tape layer, wherein the protruding device is disposed on one side of the body; the adhesive tape layer is disposed on the side of the protruding device away from the body, and at least partially covers the body to form an attachment surface; applying the side of the qualified attachment product with the protruding device to the surface of a plastic transfer piece to form a transfer model; the transfer model has a negative cavity matching the attachment surface; demolding the transfer model; and using the transfer model as a master mold, manufacturing the contour jig through a casting process, wherein the contour jig includes a contouring working surface corresponding to the negative cavity.

[0006] In some embodiments, after demolding the transfer model, the method further includes: trimming the transfer model; the trimming includes cleaning up burrs and / or excess material from the transfer model.

[0007] In some embodiments, the step of forming the contour jig by using the transfer model as a master mold and a casting process includes: heating the jig material to form a liquid jig material; pouring the liquid jig material into the transfer model; and solidifying the liquid jig material to form the contour jig.

[0008] In some embodiments, the Shore hardness of the fixture material is in the range of 60 to 70.

[0009] In some embodiments, the fixture material includes at least one of silicone or epoxy resin.

[0010] In some embodiments, the step of applying the side of the qualified attaching product with the protruding device to the surface of the plastic transfer part to form a transfer model further includes: placing the plastic transfer part with the qualified attaching product applied on it in a vacuum environment for defoaming treatment.

[0011] In some embodiments, after the step of forming the profiling fixture by molding, the method further includes: machining and installing a positioning part on the profiling fixture, the positioning part including a positioning pin hole.

[0012] In some embodiments, the step of demolding the transfer model includes: peeling the attached qualified product from the transfer model; wherein the peeling start point is located on the edge portion of the transfer model corresponding to the flat area of ​​the attached qualified product, and the peeling direction is at 45 degrees to 90 degrees with the surface of the transfer model.

[0013] In some embodiments, the attached qualified product is a display module, and the protruding device is at least one of a chip, electronic component, or reinforcing plate.

[0014] One embodiment of this application provides a contour jig, applied to a contour jig manufactured by any of the above-described manufacturing methods, comprising: a contour working surface for conformally bonding with the surface of the product to be attached and the tape layer on the surface of the product to be attached.

[0015] One embodiment of this application provides a method for manufacturing a contour jig, which, compared with existing technologies, offers the following advantages: By employing a manufacturing method that replicates the shape using a qualified product as a physical prototype, the contouring working surface of the final molded jig can achieve a high-precision three-dimensional contour match with the product's attachment surface. This precise conformal bonding ensures that the bonding pressure is evenly distributed across the entire attachment surface of the product during subsequent bonding operations, effectively eliminating the phenomenon of incomplete tape application due to insufficient pressure at the edges of protruding components. This improves the sealing reliability and assembly yield of the product, ensuring consistent product quality. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A flowchart illustrating a method for manufacturing a related profiling fixture, provided as one embodiment of this application; Figure 2 A schematic diagram of the structure of a related attached qualified article is provided for one embodiment of this application; Figure 3 A schematic diagram illustrating the relationship between a qualified adhesive product and a plastic transfer printing part, provided for one embodiment of this application; Figure 4 A schematic diagram of the structure of a related plastic transfer part is provided for one embodiment of this application; Figure 5 This is a schematic diagram of the structure of a related contour jig provided for one embodiment of this application.

[0018] Marker explanation: 100. Attached qualified product; 110. Body; 120. Raised component; 130. Adhesive tape layer; 140. Plastic transfer part; 141. Transfer model; 150. Profiling fixture. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this specification, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this specification without creative effort are within the scope of protection of this application.

[0020] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0021] The features and implementation methods of various aspects of this application will now be described in detail. Furthermore, the features, structures, or characteristics described in this application may be combined in any suitable manner in one or more implementations.

[0022] Currently, in actual production, the inventors have discovered that due to differences in the height and contour of the raised components, the adhesion surface formed after the tape layer is applied is a curved surface with a complex three-dimensional contour. Traditional methods rely on the product's theoretical design drawings, using CNC machining to cut the fixture substrate to form a contoured working surface. The shape data of this method is an idealized geometric model, which cannot reflect the actual three-dimensional contour formed after tape application, easily leading to a mismatch between the contoured fixture's working surface and the product's true shape. Contouring fixtures made using traditional methods typically have working surfaces based on theoretical dimensions—simple planes or regular grooves—making it difficult to achieve precise matching with the actual three-dimensional contour of the adhesion surface. This mismatch results in the contoured fixture failing to provide uniform support to the product during the application process, causing uneven distribution of application pressure between the top of the raised component and the flat area of ​​the body. This easily leads to incomplete tape application at the edges of the raised components, severely affecting the product's sealing reliability and assembly yield.

[0023] Please see Figures 1-5 To address the aforementioned problems, one embodiment of this application provides a method for manufacturing a contour jig 150, comprising the following steps: S110: Provide an attachment qualified product 100; the attachment qualified product 100 includes a body 110, at least one protruding device 120 and an adhesive tape layer 130, the protruding device 120 is disposed on one side of the body 110; the adhesive tape layer 130 is disposed on the side of the protruding device 120 away from the body 110, and at least covers a portion of the body 110 to form an attachment surface.

[0024] In this embodiment, the qualified adhesion sample 100 refers to a standard sample serving as a physical prototype. There are no gaps or unattached areas between the adhesive layer 130 on this standard sample and the surface of the body 110 with the raised device 120, achieving a qualified adhesion state. Specifically, the qualified adhesion sample 100 may include a body 110, at least one raised device 120, and an adhesive layer 130. The raised device 120 is disposed on one side of the body 110. The adhesive layer 130 is disposed on the side of the raised device 120 away from the body 110, and at least partially covers the body 110 to form an adhesion surface. For example, in one application scenario, the raised device 120 may be a chip, the body 110 may be a flexible circuit board, and the adhesive layer 130 may be a hot melt adhesive film covering the chip and partially adhered to the flexible circuit board; together, they constitute a reference model without any gaps in the adhesion.

[0025] The body 110 is the basic structural component constituting the qualified product 100, providing physical support and a fixed base for the raised device 120 and the adhesive tape layer 130. Specifically, the body 110 can be, but is not limited to, a flexible circuit board, a rigid printed circuit board, or a display screen in a display module; the body 110 has two opposing sides, one of which is used to set at least one raised device 120, and the adhesive tape layer 130 covers the raised device 120 and part of the surface of the body 110 to form an attachment surface. The material, thickness, and surface flatness of the body 110 directly affect the overall contour and state of the attachment surface, thereby determining the forming accuracy of the subsequent transfer model 141 and the final contour jig 150. By accurately replicating the complete attachment surface contour, including the surface morphology of the body 110, it can be ensured that the resulting contour jig 150 can provide uniform support and positioning for the product to be attached.

[0026] In this embodiment, the protruding device 120 can be an electronic or mechanical component with a three-dimensional structure fixed to one side of the body 110, constituting a key contour feature of the attachment surface. Specifically, the protruding device 120 can be at least one of a chip, electronic component, reinforcing plate, connector, or sensor; the protruding device 120 is fixed to the surface of the body 110 by welding, bonding, or insert molding, and its edge contour includes right angles, rounded corners, or beveled structures. The presence of the protruding device 120 causes the tape layer 130 to form a non-planar composite curved surface shape when covering. This shape feature is accurately recorded by the transfer model 141 and finally copied to the contour working surface of the contour jig 150, so that the contour jig 150 can provide matching three-dimensional support for the protruding device 120 and its surrounding area when attaching the product to be attached, thereby eliminating the problems of incomplete tape application and stress concentration caused by height difference and contour mismatch.

[0027] In this embodiment, the tape layer 130 can be a flexible film structure covering the surface of the protruding device 120 and part of the body 110 and in an adhered state, constituting the final outer surface morphology of the qualified product 100. Specifically, the tape layer 130 can be any one of hot melt adhesive film, pressure-sensitive tape, optical adhesive, or conductive tape; the tape layer 130 forms a continuous and smooth transition covering shape above the protruding device 120, which completely reproduces the three-dimensional contour of the protruding device 120 and forms a tight, bubble-free, and wrinkle-free adhesion with the surface of the body 110. The thickness, extensibility, and surface tension characteristics of the tape layer 130 together determine the microstructure characteristics of the adhesion surface.

[0028] In this embodiment, the attached qualified product 100 provides a basis for the subsequent fabrication of the profiling fixture 150.

[0029] S120: The side of the qualified product 100 with the protruding device 120 is applied to the surface of the plastic transfer part 140 to form a transfer model 141; the transfer model 141 has a negative cavity that matches the attachment surface.

[0030] In this embodiment, plastic transfer is a material component with plasticity and reproducibility. Its initial state can be paste, slurry, or liquid. It can flow under pressure and fill all the microscopic contours of the attachment surface of the qualified product 100, and then accurately record the contours by curing and shaping. Specifically, the side of the qualified product 100 with the protrusion device 120 is applied to the surface of the plastic transfer part 140. Its function is to completely copy the three-dimensional morphology of the qualified product 100 onto the plastic transfer part 140 by imprinting.

[0031] The transfer model 141 can be an intermediate mold component formed by the interaction and curing of the plastic transfer part 140 and the bonding surface of the qualified product 100. It carries a precise negative image of the three-dimensional morphology of the bonding surface. Specifically, the transfer model 141 has a negative cavity that is completely complementary to the concave and convex features of the bonding surface. The contour accuracy of the negative cavity reaches the micron level, which can completely reproduce the covering shape of the tape layer 130 above the protruding device 120 and the microscopic flat features of the surface of the body 110. The negative cavity of the transfer model 141 serves as the geometric reference for shape transfer. Through the molding process, its spatial features are accurately transferred to the contour working surface of the contour jig 150. This secondary conversion mechanism based on the physical morphology breaks through the limitations of traditional jigs designed based on theoretical dimensions, ensuring the conformal consistency between the final contour jig 150 and the real product shape, and fundamentally solving the problem of incomplete tape bonding caused by geometric mismatch.

[0032] In this embodiment, the plastic transfer part 140 solidifies to form a transfer model 141. This transfer model 141 has a negative cavity, which is a recessed cavity with a shape complementary to and opposite to the attachment surface of the qualified product 100. For example, the protruding chip and adhesive tape layer 130 on the qualified product 100 are represented as a precisely matching recess in the negative cavity of the transfer model 141.

[0033] In some embodiments, the qualified product 100 may further include an embedded device, which may be embedded inside the body 110 or placed in a groove formed by the body 110. Specifically, at least a portion of the embedded device is covered by the material of the body 110, such that the exposed surface of the embedded device and the upper surface of the body 110 together form a continuous or composite plane with a predetermined step. When fabricating the contour jig 150, the corresponding transfer model 141 can accurately replicate the curved surface shape of the tape layer 130 of the qualified product 100, thereby enabling the final contour working surface to provide precise conformal support for the qualified product 100 and its surrounding area.

[0034] S130: Demold the transfer model 141.

[0035] In this embodiment, demolding the transfer model 141 is an operation process that separates the transfer model 141 from the qualified attached product 100, which serves as the prototype. The purpose of this step is to obtain an independent transfer model 141 with a negative cavity for subsequent fabrication of the prototyping fixture 150.

[0036] In this embodiment, demolding is a precise operation process that separates the cured transfer model 141 from the attachment surface of the qualified product 100. It provides a geometrically complete intermediate mold for the subsequent preparation of a high-precision contour jig 150 through the molding process, thereby ensuring that the final contour working surface maintains a high degree of conformity with the actual attachment state.

[0037] S140: Using the transfer model 141 as the master mold, a molding jig 150 is formed by a casting process. The molding jig 150 includes a molding working surface corresponding to the negative cavity.

[0038] In this embodiment, the profiling fixture 150 is manufactured using a casting process based on the transfer model 141 master mold. Specifically, the molding method for producing the final profiling fixture 150 is replicated by filling its cavity with fixture material, using the transfer model 141 as the shape master. The resulting profiling fixture 150 includes a profiling working surface corresponding to the negative cavity. The shape of this profiling working surface is a precise reproduction of the attachment surface of the qualified product 100, and it is used to support and position the product to be attached in subsequent production.

[0039] In this embodiment, the master mold is the original mold used as a shape replication reference in the casting process, and its surface features determine the geometry of the final product. Specifically, when the transfer model 141 is used as the master mold, the contour accuracy, surface quality, and structural integrity of its negative cavity are directly related to the molding quality of the contour jig 150. The master mold carries the three-dimensional topographic information of the attached qualified product 100, realizing the transfer and conversion of shape features during the casting process: when the liquid jig material is poured into the negative cavity of the master mold, the material solidifies along the cavity surface, forming a contour working surface that is completely opposite to the concave and convex features of the negative cavity of the master mold. This master mold needs to have low shrinkage rate, high dimensional stability, and good mold release properties to ensure the fidelity of geometric features during shape replication. By using the transfer model 141 as the master mold for casting replication, high-precision shape transfer from the physical object topography to the contour working surface of the contour jig 150 is achieved.

[0040] In this embodiment, the molding process uses the transfer model 141 as a shape master mold and involves filling and transforming the jig material to create the contour jig 150. Specifically, the molding process may include pouring liquid jig material into the negative cavity of the transfer model 141, controlling the fluidity of the jig material to fully fill the curved transition area corresponding to the covering shape of the tape layer 130, the steep edge area corresponding to the contour of the protruding device 120, and the flat reference area corresponding to the surface of the body 110 within the negative cavity. Subsequently, a curing process is performed to transform the liquid jig material into a solid structure, forming a contour working surface that is completely opposite to the concave and convex features of the negative cavity. The curing method includes thermosetting, ultraviolet curing, or natural cooling phase change. The shape conversion achieved by the molding process accurately reproduces the three-dimensional shape of the qualified product 100 recorded in the transfer model 141 onto the working surface of the contour jig 150, forming a support interface that matches the actual product's bonding state space. This provides a stress environment that is completely consistent with the ideal bonding state for each product to be bonded during the batch bonding process, fundamentally eliminating process defects such as incomplete bonding of the tape layer 130 and uneven pressure caused by the shape deviation of the contour jig 150.

[0041] In this embodiment, by providing a qualified adhesive product 100 and replicating its shape through transfer and molding processes, the manufacturing method can produce a conformal jig 150 that matches the adhesive surface, thereby eliminating the problem of incomplete adhesive tape layer 130 application and improving the adhesive quality and production efficiency.

[0042] In some embodiments, after demolding the transfer model 141, the method further includes: trimming the transfer model 141; trimming includes cleaning up burrs and / or overflow from the transfer model 141.

[0043] In this embodiment, after demolding the transfer model 141, the transfer model 141 is further trimmed to improve its quality.

[0044] In this embodiment, finishing is an operation that performs fine processing on the demolded transfer model 141. Specifically, finishing may include cleaning up the flash and / or excess material from the transfer model 141. Flash may be a thin edge or burr formed along the parting line or edge during the transfer process. Excess material may be excess material that exceeds the predetermined cavity range. For example, a precision blade can be used to carefully remove the thin film-like flash from the edge of the transfer model 141 to ensure a clear and accurate negative cavity profile.

[0045] By refining the transfer model 141, defects generated during the molding process can be removed, ensuring that the final profiling fixture 150 has higher precision and surface quality.

[0046] In some embodiments, the step of forming a contour jig 150 by using a transfer model 141 as a master mold and a casting process includes: heating the jig material to form a liquid jig material; pouring the liquid jig material into the transfer model 141; and solidifying the liquid jig material to form the contour jig 150.

[0047] In this embodiment, the step of creating the profiling fixture 150 using the transfer model 141 as the master mold through a casting process includes heating the profiling material to form a liquid fixture material. In this embodiment, the fixture material is the base material constituting the final profiling fixture 150; the liquid fixture material is a molten or flowable state formed by heating the fixture material. Subsequently, the liquid fixture material is poured into the transfer model 141, and the profiling fixture 150 is formed after the liquid fixture material solidifies. Solidification can be a process in which the liquid fixture material transforms into a solid state through cooling or a chemical reaction. By first liquefying the fixture material and then pouring it, it can be ensured that the material fully fills the negative cavity of the transfer model 141, thereby replicating its shape.

[0048] In some implementations, the Shore hardness of the fixture material is in the range of 60 to 70.

[0049] In this embodiment, the Shore hardness of the jig material is in the range of 60 to 70, so that the conforming jig 150 achieves the best balance between durability and product protection. Specifically, for example, the Shore hardness can be 60, 61, 62, 63, 64, 65, 66, 67, 68, 69 or 70, etc.

[0050] When the Shore hardness of the fixture material is less than 60, the contouring working surface will undergo excessive elastic deformation under attachment pressure, leading to a series of adverse consequences. Specifically, an overly soft contouring working surface will cause significant collapse in the area corresponding to the protruding device 120, failing to provide stable and uniform support for the product to be attached. Therefore, maintaining the Shore hardness of the fixture material above 60 is a key technical means to ensure that the contouring fixture 150 possesses the necessary structural support, shape retention, and durability.

[0051] When the Shore hardness of the fixture material is greater than 70, the contour working surface will lack the necessary micro-deformation compensation capability due to excessive stiffness.

[0052] Shore hardness is a physical quantity that measures the ability of the working surface of the profiling fixture 150 to resist elastic deformation, plastic deformation, or scratches. For example, Shore hardness can refer to Shore A hardness. Controlling the Shore hardness within this range ensures that the profiling fixture 150 has sufficient support strength while also possessing a certain degree of micro-elasticity to avoid scratching precision components during the attachment process.

[0053] In some embodiments, the fixture material includes at least one of silicone or epoxy resin.

[0054] In this embodiment, the jig material may include at least one of silicone or epoxy resin. Silicone is an organosilicon polymer with good elasticity and reproducibility. Epoxy resin is a thermosetting polymer with high strength and low shrinkage. For example, when liquid silicone with a Shore hardness within a certain range is selected as the jig material, a flexible conformal jig 150 can be fabricated, which is very suitable for attaching fragile components. By specifying the specific type of jig material, a variety of feasible and efficient material selections are provided.

[0055] In some embodiments, the step of applying the side of the qualified product 100 with the protruding device 120 to the surface of the plastic transfer part 140 to form a transfer model 141 further includes: placing the plastic transfer part 140 with the qualified product 100 applied on it in a vacuum environment for defoaming treatment.

[0056] In this embodiment, the plastic transfer part 140 with the attached qualified product 100 is placed in a vacuum environment for debubbling treatment. Through debubbling treatment, transfer defects caused by air bubbles can be eliminated, ensuring the integrity and accuracy of the negative cavity, thereby ensuring the molding quality of the final profiling fixture 150.

[0057] In this embodiment, the vacuum environment is maintained by using vacuum equipment to keep the air pressure in the space between the plastic transfer part 140 and the qualified product 100 below the standard atmospheric pressure. Specifically, the absolute pressure value of the vacuum environment is controlled within the range of -0.095 MPa to -0.1 MPa. The function of the vacuum environment is to eliminate the resistance of the gas medium to the material flow and the air cushion effect, so that the plastic transfer part 140 can fully wet the micro-contour of the attachment surface in a liquid or semi-solid state. At the same time, the negative pressure accelerates the escape of dissolved gas inside the plastic transfer part 140 and the expansion and rupture of micro-bubbles, thereby avoiding gas residue from forming transfer defects. Specifically, when the plastic transfer part 140 covers the raised device 120 in a vacuum environment, its material can fill the acute angle area at the junction of the tape layer 130 and the raised device 120, as well as the recessed area formed by the sidewall of the raised device 120 and the tape layer 130, without obstruction, ensuring that the negative cavity of the transfer model 141 completely reproduces the geometric features of these key parts. Through the defoaming treatment in a vacuum environment, the problems of local morphological loss, surface pitting, and weakened structural strength of the transfer model 141 caused by micro-bubbles are effectively solved, providing the necessary process guarantee for obtaining a high-fidelity negative cavity.

[0058] In some embodiments, after the step of forming the profiling fixture 150 by molding process, the method further includes: machining and installing a positioning part on the profiling fixture 150, the positioning part including a positioning pin hole.

[0059] In this embodiment, the positioning part is a functional structure disposed on the contour jig 150 for precisely positioning and fixing it to the external automated bonding equipment. Specifically, the positioning part may include positioning pin holes. For example, two positioning pin holes with a diameter of 3mm can be machined on the contour jig 150 to precisely mate with the positioning pins on the equipment. By machining and installing the positioning part, the contour jig 150 is quickly and accurately integrated with the production equipment, improving the automation level of production and bonding consistency.

[0060] In some embodiments, the step of demolding the transfer model 141 includes: peeling the attached qualified product 100 from the transfer model 141; wherein the starting end of the peeling is located on the edge portion of the transfer model 141 corresponding to the flat area of ​​the attached qualified product 100, and the peeling direction is at 45 degrees to 90 degrees with the surface of the transfer model 141.

[0061] In this embodiment, the demolding step of the transfer model 141 includes peeling the attached qualified product 100 from the transfer model 141. Peeling is a specific action that separates the transfer model 141 from the attached qualified product 100. Specifically, the starting point of peeling is located at the edge portion of the flat area of ​​the attached qualified product 100 corresponding to the transfer model 141, and the peeling direction is at an angle of 45 to 90 degrees to the surface of the transfer model 141. For example, the operator should start from the edge of the flat area of ​​the transfer model 141 corresponding to the attached qualified product 100 and pull it vertically upward at an angle close to 90 degrees. By standardizing the starting position and angle of peeling, the tensile and shear stress on the negative cavity can be reduced, preventing deformation or damage to the transfer model 141 during demolding and ensuring the fidelity of shape replication.

[0062] In some embodiments, the attached qualified product 100 is a display module, and the protruding device 120 is at least one of a chip, electronic component, or reinforcing plate.

[0063] In this embodiment, the display module is an assembly including a display panel and related driving circuitry. The protruding device 120 is at least one of a chip, an electronic component, or a reinforcing plate. For example, the display module may be a mobile phone OLED display, and the protruding device 120 thereon may include at least one of a driving chip and a reinforcing plate for strengthening the connection.

[0064] In some implementations, the display panel can be an OLED display panel. OLED display panels are based on the light-emitting properties of organic materials. When current passes through the organic light-emitting layer, electrons and holes recombine, causing organic molecules to transition from an excited state to a ground state, releasing photons and thus emitting light. Each pixel unit can emit light independently, eliminating the need for a backlight. OLED display panels have self-emissive properties, thus achieving extremely high contrast; black areas can remain completely black, displaying pure black. Simultaneously, they have a fast response time, enabling excellent display of fast-moving images, and their color performance is also outstanding. Furthermore, OLED display panels can be made very thin and light, and can even be bent and folded, providing greater flexibility in product design and allowing for application in a variety of devices. Specifically, examples include high-end smartphones, tablets, televisions, wearable devices, and automotive displays. Of course, other types of display panels can also be used.

[0065] In this embodiment, the display panel may include a substrate, which provides stable physical support for other film layers of the display panel, ensuring they remain in a fixed position during manufacturing and use. The substrate may have numerous conductive lines and contacts for connecting different electronic components, enabling circuit conduction and signal transmission. For example, in the display panel, the lines on the substrate connect pixel driving circuits to power supplies, data input ports, etc. In some high-power or high-density electronic devices, the substrate can also aid in heat dissipation. For example, by embedding heat dissipation channels in the substrate or using highly thermally conductive materials, the heat generated by components during operation can be effectively reduced, improving the stability and lifespan of the device. The substrate can also be a flexible substrate. Specifically, for example, the substrate may be a polyethylene terephthalate substrate, a polyethylene naphthalate substrate, or a polyimide substrate. Flexible substrates have good flexibility and can be bent, folded, or even rolled, making them suitable for flexible display devices; therefore, the display panel can be a flexible display panel.

[0066] The substrate may include a pixel driving circuit electrically connected to the pixel unit, driving the pixel unit to emit light. The display panel may include multiple pixel units, some of which display the same color. Specifically, for example, the pixel unit may display red, green, or blue. All pixel units of the display panel display at least two colors. The brightness (grayscale) of each pixel unit can be adjusted, and multiple colors can be displayed through color combination and superposition, thereby achieving full-color display of the display panel.

[0067] In some implementations, the pixel driving circuit directly determines the performance and display effect of the display panel. The pixel driving circuit primarily controls the luminous intensity (for self-emissive display panels like OLEDs) or transmittance (for backlight-required display panels like LCDs) of each pixel unit. By precisely controlling the current or voltage, the driving circuit can adjust the brightness and color of the pixel units, thereby achieving image display. The image signals received by the display panel are typically digital signals, while the pixel units require analog signals to drive them to emit or transmit light. The pixel driving circuit is responsible for converting the digital signals into analog signals and amplifying them to a sufficient intensity to drive the pixel units. The pixel driving circuit needs to precisely control the timing of the signals to ensure that each pixel unit lights up or turns off at the correct time. This is crucial for achieving high refresh rates and smooth dynamic displays.

[0068] In this embodiment, two adjacent pixel units on the display panel can display different colors. Specifically, for example, one pixel unit can display red, and the other adjacent pixel unit can display green. Of course, one pixel unit can also display green, and the other adjacent pixel unit can display blue. Alternatively, one pixel unit can display blue, and the other adjacent pixel unit can display red.

[0069] In some implementations, the arrangement of pixel units in the display panel can be determined based on factors such as color performance, resolution, and brightness uniformity. There are many possible pixel unit arrangements. Specifically, examples include red-green-blue pixel unit arrangements, red-green-blue-white pixel unit arrangements, PenTile pixel arrangements, and triangular pixel unit arrangements. The red-green-blue pixel unit arrangement can mix various colors, resulting in rich and accurate color reproduction. The red-green-blue-white pixel unit arrangement can improve the brightness and contrast of the display panel while reducing power consumption. The PenTile pixel arrangement can achieve higher pixel density within the same area, improving the display panel resolution. The triangular pixel unit arrangement can improve pixel density and color mixing effects.

[0070] One embodiment of this application provides a contour jig 150, which is applied to any of the above-described manufacturing methods. The contour jig 150 includes a contour working surface for conformally bonding with the surface of the product to be attached and the tape layer 130 on the surface of the product to be attached.

[0071] In this embodiment, the contour jig 150 may include a contour working surface for conformal bonding with the surface of the product to be bonded and the adhesive layer 130 on the surface of the product to be bonded. In this embodiment, the product to be bonded may be a workpiece for which the adhesive layer 130 needs to be bonded; conformal bonding means that the contour of the contour working surface is highly consistent with the contour of the surface of the product to be bonded (including the protruding device 120 and the adhesive layer 130), forming full contact between surfaces. Since the contour jig 150 is manufactured by a specific method, its contour working surface is an accurate reproduction of the perfect bonding state of a qualified product. Therefore, when used to support the product to be bonded, it can ensure uniform distribution of bonding pressure, achieve complete bonding between the adhesive layer 130 and the object to be bonded, completely eliminate incomplete bonding, and improve the waterproof sealing performance and structural reliability of the product.

[0072] The various embodiments described in this application emphasize the parts that differ from other embodiments, and these embodiments can be explained by comparison with each other. Any combination of the various embodiments in this specification is covered by the disclosure of this specification based on general technical knowledge and is applicable to those skilled in the art.

[0073] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The above are only some embodiments described in this specification and are not intended to limit this specification. Any modifications or equivalent substitutions made within the spirit and principles of this specification should be included within the scope of this specification.

Claims

1. A method for manufacturing a contour jig, characterized in that, include: Provide a qualified adhesive product; the qualified adhesive product includes a body, at least one raised component and an adhesive tape layer, the raised component is disposed on one side of the body; the adhesive tape layer is disposed on the side of the raised component away from the body, and at least partially covers the body to form an adhesive surface; The side of the qualified product with the protruding device is applied to the surface of the plastic transfer part to form a transfer model; the transfer model has a negative cavity that matches the attachment surface; Demold the transferred model; Using the transfer model as the master mold, the molding fixture is formed by a casting process. The molding fixture includes a molding working surface corresponding to the negative cavity.

2. The manufacturing method according to claim 1, characterized in that, After demolding the transfer model, the process further includes: trimming the transfer model; the trimming includes cleaning up the flash and / or excess material from the transfer model.

3. The manufacturing method according to claim 1, characterized in that, The step of forming the contour jig by using the transfer model as the master mold and the molding process includes: heating the jig material to form a liquid jig material; pouring the liquid jig material into the transfer model; and solidifying the liquid jig material to form the contour jig.

4. The manufacturing method according to claim 3, characterized in that, The Shore hardness of the fixture material is in the range of 60 to 70.

5. The manufacturing method according to claim 3, characterized in that, The fixture material includes at least one of silicone or epoxy resin.

6. The manufacturing method according to claim 1, characterized in that, The step of applying the side of the qualified product with the protruding device to the surface of the plastic transfer part to form a transfer model further includes: placing the plastic transfer part with the qualified product applied on it in a vacuum environment for defoaming treatment.

7. The manufacturing method according to claim 1, characterized in that, After the step of forming the profiling fixture by molding process, the method further includes: machining and installing a positioning part on the profiling fixture, the positioning part including a positioning pin hole.

8. The manufacturing method according to claim 1, characterized in that, The step of demolding the transfer model includes: peeling the attached qualified product from the transfer model; wherein the starting end of the peeling is located on the edge portion of the transfer model corresponding to the flat area of ​​the attached qualified product, and the peeling direction is at an angle of 45 degrees to 90 degrees to the surface of the transfer model.

9. The manufacturing method according to claim 1, characterized in that, The qualified product to be attached is a display module, and the protruding device is at least one of a chip, electronic component or reinforcing plate.

10. A contour jig, characterized in that, A conformal jig used in the manufacturing method described in any one of claims 1 to 9 includes: the conformal working surface, used for conformal bonding with the surface of the product to be attached and the tape layer on the surface of the product to be attached.

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