Repair adhesive tape for photovoltaic module

Abstract

The invention belongs to the technical field of adhesive tapes, and particularly relates to a repairing adhesive tape for a photovoltaic module, the repairing adhesive tape comprises a base material layer, a functional adhesive layer and a release material layer which are sequentially arranged from bottom to top, and the base material layer and the functional adhesive layer are of an integrated whole-surface structure; the functional adhesive layer is of a three-section structure and comprises a middle core layer located in the middle area and side layers symmetrically located on the two sides of the middle core layer. And the release material layer is of a two-section structure. According to the repair adhesive tape provided by the invention, a laminating process can be simpler, more convenient and more efficient, and meanwhile, the repair adhesive tape has excellent insulativity, low water vapor transmittance and better weather resistance.

Description

Technical Field

[0001] This invention specifically relates to a repair tape for photovoltaic modules, belonging to the field of adhesive tape technology. Background Technology

[0002] Driven by the strategic goals of "carbon peaking and carbon neutrality," the photovoltaic industry, as a major force in clean energy, is developing at an unprecedented pace. Cost reduction and efficiency improvement are the eternal pursuit of the photovoltaic industry. Against this backdrop, lightweighting of photovoltaic glass has emerged as one of the key technological paths for cost reduction in the industry chain. Traditional photovoltaic modules use patterned glass with a thickness of 3.2mm. The core of lightweighting lies in reducing the thickness of the glass; currently, the mainstream technology is to reduce the thickness of the front panel glass from 3.2mm to 2.0mm, 1.6mm, or even thinner. However, while lightweighting brings significant advantages, it also introduces a significant technical challenge: the decrease in the mechanical strength of the glass makes it more susceptible to damage during manufacturing, transportation, installation, and operation. Therefore, the repair of damaged photovoltaic glass is an issue that requires careful consideration. The treatment method mainly depends on the type and severity of the damage.

[0003] For repairable damage, there are currently two repair methods: One is using transparent epoxy adhesive, which requires steps such as power off, cleaning the damaged area, preparing the adhesive, applying it, removing excess adhesive, heat curing, and inspection and polishing in a clean, dust-free environment. The second is using UV adhesive, which also requires similar steps in a clean, dust-free environment. The drawbacks of both methods are that the photovoltaic modules need to be removed and transported to a clean, dust-free workshop for repair. During this process, due to the crack-inducing properties of glass, the damaged area of ​​the photovoltaic module can expand, making the module difficult to repair or even unusable. Furthermore, the adhesive requires subsequent heat curing or UV curing, resulting in a long repair time.

[0004] In summary, the existing technology has obvious shortcomings. It is of great significance to prepare a simple and efficient repair tape for photovoltaic modules that also has excellent insulation, low water vapor transmission rate and better weather resistance. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a repair tape for photovoltaic modules. This repair tape simplifies and improves the bonding process, while also exhibiting excellent insulation, low water vapor transmission rate, and better weather resistance.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a repair tape for photovoltaic modules, the repair tape comprising a substrate layer, a functional adhesive layer and a release material layer arranged sequentially from bottom to top, wherein the substrate layer and the functional adhesive layer are an integral whole structure; the functional adhesive layer is a three-segment structure, including a core layer located in the middle region and side layers symmetrically located on both sides of the core layer; the release material layer is a two-segment structure.

[0007] Furthermore, the thickness of the substrate layer is 50~150μm, preferably 75~100μm; the thickness of the functional adhesive layer is 20~80μm, preferably 40~60μm; and the thickness of the release material layer is 25~75μm.

[0008] Furthermore, the ratio of the thickness of the substrate layer, the thickness of the functional adhesive layer, and the thickness of the release material layer is 1:(0.3~1.0):(0.25~1.0).

[0009] Furthermore, the width of the substrate layer is 20-100 mm, preferably 40-80 mm; the width of the core layer of the functional adhesive layer is 20-90 mm, preferably 40-60 mm; the width of one side of the edge layer of the functional adhesive layer is 5-15 mm, preferably 8-12 mm; and the width of each segment of the release material layer is 15-120 mm.

[0010] Furthermore, the sum of the widths of the two structural segments in the release material layer is (1~2) times that of the substrate layer.

[0011] Furthermore, the substrate layer is a polyester film; the polyester film is composed of a copolyester resin and nano-silica uniformly dispersed therein; the copolyester resin is formed from a copolyester resin of terephthalic acid, ethylene glycol, isophthalic acid and neopentyl glycol.

[0012] Furthermore, the molecular weight of the copolyester resin is 20,000 to 40,000.

[0013] Furthermore, the amount of nano-silica added is 0.02% to 0.10% of the copolyester resin.

[0014] Furthermore, the amount of isophthalic acid added is 8% to 12% of the mass of terephthalic acid.

[0015] Furthermore, the amount of neopentyl glycol added is 10% to 15% of the mass of ethylene glycol.

[0016] Furthermore, the core layer of the functional adhesive layer is an organosilicon pressure-sensitive adhesive, and the side layers of the functional adhesive layer are high water-resistance pressure-sensitive adhesives.

[0017] Furthermore, high water-resistant pressure-sensitive adhesives include polyethylene-modified halogenated butyl rubber and maleic anhydride-grafted POE.

[0018] Furthermore, the mass of polyethylene is 10-30% of the total weight of the high water-resistant pressure-sensitive adhesive.

[0019] Furthermore, the mass of maleic anhydride-grafted POE is 5-10% of the total mass of the high water-resistance pressure-sensitive adhesive. The beneficial effects of this invention are: (1) The repair tape for photovoltaic modules provided by the present invention has better insulation, lower water vapor transmission rate and better weather resistance after being used to repair the glass of photovoltaic modules.

[0020] (2) The repair tape for photovoltaic modules provided by the present invention makes the bonding process simple, and can complete the repair of photovoltaic modules on site in a short time, which greatly improves the repair efficiency and reduces the repair cost, increases the service life of photovoltaic modules, and saves a lot of resources. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the repair tape for photovoltaic modules provided by the present invention; Figure 2 This is a top view of the functional adhesive layer; Figure 3 This is a top view of the release material layer. Detailed Implementation

[0022] The specific embodiments of the present invention will be described in detail below. The present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used is for describing particular embodiments only and is not intended to limit the invention.

[0024] The components used in the embodiments and comparative examples of this invention are only for better explaining the technology of this invention and are not intended to limit the technology of this invention. Unless otherwise stated, they are all derived from commercial products. The raw materials involved in the specific embodiments and comparative examples of this invention are as follows: Terephthalic acid: Zhejiang Yisheng Petrochemical Co., Ltd.

[0025] Ethylene glycol: China Petroleum & Chemical Corporation (Sinopec).

[0026] Isophthalic acid: Mitsubishi Chemical Corporation, Japan.

[0027] Neopentyl glycol: BASF Neopentyl glycol Co., Ltd.

[0028] Polyethylene: China Petroleum & Chemical Corporation 7050H.

[0029] Halogenated butyl rubber: ExxonMobil Chemicals Halogenated Exxon™ Bromobutyl 2222.

[0030] Maleic anhydride-grafted POE: Mitsui Chemicals TAFMER MH5020 (Japan).

[0031] The present invention provides a repair tape for photovoltaic modules, the schematic diagram of which is shown below. Figure 1 As shown, the repair tape includes a substrate layer 10, a functional adhesive layer 20, and a release material layer 30 arranged sequentially from bottom to top. The substrate layer 10 and the functional adhesive layer 20 are a single, integrated structure; the functional adhesive layer 20 has a three-segment structure; a top view of the functional adhesive layer 20 is shown below. Figure 2 As shown, it can be clearly seen that the functional adhesive layer 20 includes a core layer 21 located in the middle region and side layers 22 symmetrically located on both sides of the core layer; the release material layer 30 has a two-section structure, wherein the two-section structure is shown in the top view of the release material layer 30. Figure 3 As shown, this specifically refers to release material layer 31 and release material layer 32. Release material layer 31 and release material layer 32 can have equal widths, or release material layer 31 can be slightly wider than release material layer 32, with the excess covering the surface of release material layer 32. The three-section design of the functional adhesive layer achieves functional zoning with strong adhesion in the middle and high water resistance at the edges. The release material layer adopts a two-section design, covering the functional adhesive layer, facilitating step-by-step peeling, simplifying the bonding process, and ensuring a clean adhesive surface during construction.

[0032] The repair tape for photovoltaic module glass of the present invention has an integral, full-surface structure consisting of a substrate layer 10, a core layer 21 of a functional adhesive layer 20, and side layers 22 located on both sides of the core layer. This full-surface bonding improves the insulation of the tape material, is more effective in blocking moisture, and has better weather resistance. The two-section release material layer simplifies the bonding process and increases bonding efficiency. During the repair bonding process, the two-section release material layer 31 is first removed, and the portion of the integral, full-surface structure of the substrate layer 10 and functional adhesive layer 20 of the repair tape is bonded to the glass. Then, the release material layer 32 is removed, so that the remaining portion of the integral, full-surface structure of the substrate layer 10 and functional adhesive layer 20 of the repair tape is completely bonded to the photovoltaic glass. This ensures that the adhesive surface is not contacted or contaminated during installation, providing better water resistance and insulation performance. Furthermore, the full-piece bonding of the present invention has a better appearance and higher bonding efficiency than segmented bonding.

[0033] Specifically, the thickness of the substrate layer 10 is 50~150μm, preferably 75~100μm; the thickness of the functional adhesive layer 20 is 20~80μm, preferably 40~60μm; and the thickness of the release material layer 30 is 25~75μm. The ratio of the thickness of the substrate layer 10, the functional adhesive layer 20, and the release material layer 30 is 1:(0.3~1.0):(0.25~1.0). If the substrate layer 10 is less than 50μm, it is prone to wrinkling during use, causing moisture penetration, corrosion, and affecting module performance. If the substrate layer 10 is greater than 150μm, it will result in low light transmittance, affecting photoelectric conversion efficiency. If the functional adhesive layer 20 is less than 20μm, the bonding strength is low, and poor adhesion is prone to occur, causing moisture penetration, corrosion, and affecting module performance. If the functional adhesive layer 20 is greater than 80μm, it will result in low light transmittance, affecting photoelectric conversion efficiency.

[0034] Specifically, the width of the substrate layer 10 is 20-100mm, preferably 40-80mm; the width of the core layer 21 of the functional adhesive layer 20 is 20-90mm, preferably 40-60mm; the width of one side of the side layer 22 of the functional adhesive layer is 5-15mm, preferably 8-12mm; the width of each segment in the release material layer is 15-120mm; the sum of the widths of the two segments in the release material layer is (1-2) times that of the substrate layer. The sum of the widths of both sides of the core layer 21 of the functional adhesive layer 20 and the side layer 22 of the functional adhesive layer is the width of the substrate layer. If the width of one side of the side layer 22 is less than 5mm, its water-blocking efficiency is low, causing water vapor to penetrate, resulting in corrosion and affecting the performance of the module; if the width of one side of the side layer 22 is greater than 15mm, it will reduce the light absorption area of ​​the module and affect the photoelectric conversion efficiency. If the width of the core layer 21 is less than 10mm, the bonding strength between the adhesive surface and the glass will be low, resulting in poor bonding, water vapor penetration, corrosion, and affecting the performance of the module. If the width of the core layer 21 is greater than 90mm, the resulting maintenance surface will be too large, affecting the photoelectric conversion efficiency.

[0035] Specifically, the substrate layer of this invention is a polyester film; the polyester film is composed of a copolyester resin and uniformly dispersed nano-silica therein; the copolyester resin is formed from a copolyester resin of terephthalic acid (PTA), ethylene glycol (EG), isophthalic acid (IPA), and neopentyl glycol (NPG). PTA / EG is the polymer backbone, providing the basic mechanical strength, thermal stability, and weather resistance framework of the polyester. The meta-structure of IPA disrupts the regularity of the molecular chain, reduces crystallinity, thereby increasing the flexibility of the film and the wettability / adhesion to subsequent functional adhesive layers; the side methyl groups of NPG generate steric hindrance, further inhibiting crystallization ability and crystal size, thereby reducing light scattering, increasing light transmittance, and significantly improving the hydrolysis resistance and UV aging resistance of the polymer chain. The nano-silica is uniformly dispersed in the amorphous region, providing a large number of nucleation sites, forming numerous, extremely small (nanoscale) uniform crystals in the copolyester resin during cooling and stretching, with crystal size less than 380 nm. The specific molecular weight range of the copolyester resin, 20,000 to 40,000, ensures that the resin has suitable melt strength and flowability, allowing the copolyester containing nanoparticles to form films smoothly, thus balancing processability and final performance.

[0036] Specifically, the amount of nano-silica added is 0.02% to 0.10% of the copolyester resin.

[0037] Specifically, the amount of isophthalic acid added is 8% to 12% of the mass of terephthalic acid.

[0038] Specifically, the amount of neopentyl glycol added is 10% to 15% of the mass of ethylene glycol.

[0039] When the amount of nano-silica added is less than 0.02% of the polyester film, insufficient nucleation sites result in the formation of large and uneven crystals. When the amount added is higher than 0.10%, the nano-silica is prone to agglomeration, and the agglomerates become large-sized defects and excessive nucleation, both of which affect light transmittance. Copolyester resins with a molecular weight less than 20,000 have too short polymer chains, resulting in poor mechanical strength and heat resistance of the film; those with a molecular weight higher than 40,000 have extremely high polymer melt viscosity, making processing extremely difficult.

[0040] When the amount of isophthalic acid added is less than 8% of the mass of terephthalic acid, it will cause the formation of larger crystals, resulting in severe light scattering and low light transmittance. When the amount of isophthalic acid added is more than 12% of the mass of terephthalic acid, the glass transition temperature of the copolyester decreases, and the heat resistance drops sharply. When the amount of neopentyl glycol added is less than 10% of the mass of ethylene glycol, it is insufficient to significantly inhibit the formation of large spherulites. When the amount of neopentyl glycol added is more than 15% of the mass of ethylene glycol, the glass transition temperature of the copolyester decreases, and the heat resistance drops sharply.

[0041] Specifically, the core layer 21 of the functional adhesive layer is an organosilicon pressure-sensitive adhesive, and the side layer 22 of the functional adhesive layer is a high water resistance pressure-sensitive adhesive.

[0042] Specifically, high water-resistant pressure-sensitive adhesives include polyethylene-modified halogenated butyl rubber and maleic anhydride-grafted POE.

[0043] Specifically, the mass of polyethylene is 10-30% of the total mass of the high water-resistant pressure-sensitive adhesive.

[0044] Specifically, the mass of maleic anhydride-grafted POE is 5-10% of the total mass of the high water-resistance pressure-sensitive adhesive, which improves the interface and prevents phase separation that could lead to leakage.

[0045] When the mass of polyethylene is less than 10% of the total mass of the high water-resistant pressure-sensitive adhesive, it is insufficient to form a continuous or dense barrier path. Water molecules can easily bypass a few polyethylene particles, limiting the diffusion path extension and affecting the water resistance. When the mass is greater than 30%, severe phase separation occurs between polyethylene and halogenated butyl rubber, increasing interfacial defects (micropores, gaps). These interfacial defects facilitate rapid water molecule penetration. In the side layer 22, the mass of maleic anhydride-grafted POE is less than 5% of the total mass of the high water-resistant pressure-sensitive adhesive, insufficient to form a complete "bridge" layer at the two-phase interface. This results in weak adhesion between the halogenated butyl rubber and PE, making the interface prone to microcracks and voids under stress or heat. These interfacial micropores become channels for rapid water vapor penetration. When the addition of maleic anhydride-grafted POE exceeds 10%, excess polymer molecules self-aggregate in the rubber matrix, forming micro-regions with very low strength. These soft and weak micro-regions become new stress concentration points and potential defects, leading to a decrease in tensile strength, modulus, and hardness.

[0046] More specifically, in the embodiments and comparative examples of the present invention, the preparation of the polyester film of the substrate layer includes the following steps: (1) Ingredients: In the polymerization reactor, add copolyester resin consisting of terephthalic acid (PTA), ethylene glycol (EG), isophthalic acid (IPA) and neopentyl glycol (NPG), as well as esterification catalyst.

[0047] (2) Polymerization: Esterification reaction is carried out under nitrogen protection, and then the mixture is transferred to a polycondensation reactor for polycondensation under high temperature and high vacuum to obtain copolyester resin.

[0048] (3) Preparation of nano masterbatch: The above-mentioned copolyester resin and nano silica are premixed in a high-speed mixer, and then melt-blended and extruded in a twin-screw extruder (temperature 250-270℃) to obtain masterbatch.

[0049] (4) Melting and film formation: The masterbatch is melted and extruded at 280°C, cast through a T-die, then stretched 3.5 times in the longitudinal direction and 3.5 times in the transverse direction, and then heat-set at 220°C. Finally, it is wound up to obtain a polyester film.

[0050] More specifically, in the embodiments and comparative examples of the present invention, the preparation of the high water-resistance pressure-sensitive adhesive of the functional adhesive layer includes the following steps: Weigh out an appropriate amount of polyethylene and halogenated butyl rubber, mix them evenly to obtain polyethylene-modified halogenated butyl rubber, and dissolve the polyethylene-modified halogenated butyl rubber and maleic anhydride-grafted POE in xylene containing tackifying resin to obtain a pressure-sensitive adhesive with high water resistance.

[0051] More specifically, in the embodiments and comparative examples of the present invention, the preparation of repair tape for photovoltaic modules includes the following steps: S1. Substrate unwinding: Clean the polyester film and unwind it.

[0052] S2. Coating: A precision coating machine with a multi-die system is used. The central wide die is used to coat the silicone pressure-sensitive adhesive, and the two narrow dies on both sides are used to coat the high water resistance pressure-sensitive adhesive. The coating width and thickness of each adhesive strip are precisely controlled to coat the adhesive in the core layer and the side layer areas to form a functional adhesive layer.

[0053] S3. Drying: Bake at 120℃ for 5 minutes.

[0054] S4. Rewinding: After complete drying, cover the adhesive layer with the designed two-section release film, and rewind to obtain the repair tape for photovoltaic modules.

[0055] More specifically, in the embodiments and comparative examples of the present invention, the bonding process of the repair tape for photovoltaic modules includes the following steps: (1) Clean the photovoltaic module glass that has abnormalities.

[0056] (2) Repairing the cleaned photovoltaic module glass with photovoltaic module repair tape. The specific process is as follows: Before applying the photovoltaic module repair tape, fix its position, flip up one end of the photovoltaic module glass repair tape, tear open and pull up the release material layer 31 at the corresponding end, and use a pressure roller to roll from the middle to one end to remove air bubbles, thus completing the application of half of the photovoltaic module repair tape; use the same process to tear open and pull up the release material layer 32, and apply the other half of the photovoltaic module repair tape. The pressure roller used can avoid air bubbles during application, ensuring the quality of application. The repair effect of the repaired photovoltaic module glass can be quickly judged by wet leakage current test, ensuring controllable repair quality and convenient inspection.

[0057] Example 1 The preparation of repair tape for photovoltaic modules includes the following steps: S1. Substrate unwinding: Clean and unwind a polyester film with a thickness of 50μm and a width of 30mm; wherein, the amount of isophthalic acid added is 8% of the mass of terephthalic acid, the amount of neopentyl glycol added is 10% of the mass of ethylene glycol, the amount of nano silica added is 0.02% of the copolyester resin, and the molecular weight of the copolyester resin is 40000.

[0058] S2. Coating: A precision coating machine with a multi-die system is used. The central wide die is used to coat the silicone pressure-sensitive adhesive, and the two narrow dies on both sides are used to coat the high water-resistant pressure-sensitive adhesive. The thickness is precisely controlled to be 20μm. The width of the core layer 21 is 20mm, and the width of each side layer is 5mm. The adhesive is applied to the areas of the core layer 21 and the side layer 22. Among them, the mass of polyethylene in the high water-resistant pressure-sensitive adhesive is 10% of the total mass of the high water-resistant pressure-sensitive adhesive, and the mass of maleic anhydride-grafted POE is 5% of the total mass of the high water-resistant pressure-sensitive adhesive, forming a functional adhesive layer.

[0059] S3. Drying: Bake at 120℃ for 5 minutes.

[0060] S4. Winding: After complete drying, cover the adhesive layer with the designed two-section release material layer 30, wherein the thickness of the release material layer is 25μm and the sum of the widths of the two sections is 30mm; wind up to obtain the repair tape for photovoltaic modules.

[0061] The prepared photovoltaic modules are bonded together using repair tape according to the following bonding process: (1) Clean the photovoltaic module glass that has abnormalities.

[0062] (2) Repairing the cleaned photovoltaic module glass with photovoltaic module repair tape. The specific process is as follows: Before applying the photovoltaic module repair tape, fix its position, flip up one end of the photovoltaic module glass repair tape, tear open and pull up the release material layer 31 at the corresponding end, and use a pressure roller to roll from the middle to one end to remove air bubbles, thus completing the application of half of the photovoltaic module repair tape; use the same process to tear open and pull up the release material layer 32, and apply the other half of the photovoltaic module repair tape. The pressure roller used can avoid air bubbles during application, ensuring the quality of application. The repair effect of the repaired photovoltaic module glass can be quickly judged by wet leakage current test, ensuring controllable repair quality and convenient inspection.

[0063] Example 2 The preparation of repair tape for photovoltaic modules includes the following steps: S1. Substrate unwinding: Clean and unwind a polyester film with a thickness of 150μm and a width of 100mm; wherein, the amount of isophthalic acid added is 12% of the mass of terephthalic acid, the amount of neopentyl glycol added is 15% of the mass of ethylene glycol, the amount of nano silica added is 0.1% of the copolyester resin, and the molecular weight of the copolyester resin is 20000.

[0064] S2. Coating: A precision coating machine with a multi-die system is used. The central wide die is used to coat the silicone pressure-sensitive adhesive, and the two narrow dies on both sides are used to coat the high water-resistant pressure-sensitive adhesive. The thickness is precisely controlled to be 80μm. The width of the core layer 21 is 70mm, and the width of each side layer 22 is 15mm. The adhesive is applied to the core layer and the side layer areas. Among them, the mass of polyethylene in the high water-resistant pressure-sensitive adhesive is 30% of the total mass of the high water-resistant pressure-sensitive adhesive, and the mass of maleic anhydride-grafted POE is 10% of the total mass of the high water-resistant pressure-sensitive adhesive, forming a functional adhesive layer.

[0065] S3. Drying: Bake at 120℃ for 5 minutes.

[0066] S4. Winding: After complete drying, cover the adhesive layer with the designed two-section release material layer 30, wherein the thickness of the release material layer is 75μm and the sum of the widths of the two sections is 110mm; wind up to obtain the repair tape for photovoltaic modules.

[0067] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0068] Example 3 The preparation of repair tape for photovoltaic modules includes the following steps: S1. Substrate unwinding: Clean and unwind a polyester film with a thickness of 75μm and a width of 60mm; wherein, the amount of isophthalic acid added is 10% of the mass of terephthalic acid, the amount of neopentyl glycol added is 12.5% ​​of the mass of ethylene glycol, the amount of nano silica added is 0.06% of the copolyester resin, and the molecular weight of the copolyester resin is 30000.

[0069] S2. Coating: A precision coating machine with a multi-die system is used. The central wide die is used to coat the silicone pressure-sensitive adhesive, and the two narrow dies on both sides are used to coat the high water-resistant pressure-sensitive adhesive. The thickness is precisely controlled to be 50μm. The width of the core layer is 40mm, and the width of each side layer is 10mm. The adhesive is applied to the core layer 21 and the side layer 22. Among them, the mass of polyethylene in the high water-resistant pressure-sensitive adhesive is 20% of the total mass of the high water-resistant pressure-sensitive adhesive, and the mass of maleic anhydride-grafted POE is 7.5% of the total mass of the high water-resistant pressure-sensitive adhesive, forming a functional adhesive layer.

[0070] S3. Drying: Bake at 120℃ for 5 minutes.

[0071] S4. Winding: After complete drying, cover the adhesive layer with the designed two-section release material layer 30, wherein the thickness of the release material layer is 50μm and the sum of the widths of the two sections is 90mm; wind up to obtain the repair tape for photovoltaic modules.

[0072] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0073] The repair tape for photovoltaic modules provided by this invention, when used to repair the glass of photovoltaic modules, exhibits superior insulation, low water vapor transmission rate, and better weather resistance. This repair tape simplifies the bonding process, enabling on-site repair of photovoltaic modules in a short time, greatly improving maintenance efficiency and reducing maintenance costs, extending the service life of photovoltaic modules, and saving significant resources.

[0074] Comparative Example 1 The preparation method of the repair tape for the comparative photovoltaic module is the same as that in Example 3, except that the thickness and width of each layer are different, specifically: In step S1, substrate unwinding: clean and unwind a polyester film with a thickness of 35μm and a width of 18mm.

[0075] In step S2, the coating process is as follows: the thickness is precisely controlled to be 15 μm, the width of the core layer 21 is 4 mm, and the width of each side of the side layer 22 is 10 mm.

[0076] In step S4, the thickness of the release material layer 30 is 50 μm, and the sum of the widths of the two structures is 18 mm.

[0077] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0078] According to the data in Table 1, the water resistance and insulation performance of this comparative example are significantly reduced compared to Example 3.

[0079] Comparative Example 2 The preparation method of the repair tape for the comparative photovoltaic module is the same as that in Example 3, except that the thickness and width of each layer are different, specifically: In step S1, substrate unwinding: clean and unwind a polyester film with a thickness of 175μm and a width of 110mm.

[0080] In step S2, the coating process is as follows: the thickness is precisely controlled to be 85 μm, the width of the core layer 21 is 18 mm, and the width of one side of the side layer 22 is 74 mm.

[0081] In step S4, the thickness of the release material layer 30 is 50 μm, and the sum of the widths of the two structures is 110 mm.

[0082] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0083] According to the data in Table 1, compared with Example 3, the insulation performance of this comparative example is significantly reduced and the light transmittance is decreased.

[0084] Comparative Example 3 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that: in step S2, the core layer 21 and the side layer 22 of the functional adhesive layer 20 are coated with silicone pressure-sensitive adhesive with a thickness of 50μm; the release material layer is a one-piece release material layer with a width of 60mm.

[0085] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0086] According to the data in Table 1, the water resistance and insulation performance of this comparative example are significantly reduced compared to Example 3.

[0087] Comparative Example 4 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that: in step S2, the core layer 21 and the side layer 22 of the functional adhesive layer 20 are coated with a high water resistance pressure-sensitive adhesive with a thickness of 50μm; the release material layer is a one-piece release material layer with a width of 60mm.

[0088] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0089] According to the data in Table 1, the light transmittance of this comparative example is lower than that of Example 3.

[0090] Comparative Example 5 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S1, the amount of isophthalic acid added to the copolyester resin is 7% of the mass of terephthalic acid.

[0091] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0092] According to the data in Table 1, the transmittance of this comparative example is significantly reduced compared to Example 3.

[0093] Comparative Example 6 The preparation method of the repair tape for photovoltaic modules in this comparative example is the same as that in Example 3, except that in step S1, the amount of isophthalic acid added to the copolyester resin is 13% of the mass of terephthalic acid.

[0094] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0095] According to the data in Table 1, the insulation performance of this comparative example decreased compared to Example 3. This is because when the amount of isophthalic acid added is higher than 12% of the mass of terephthalic acid, the glass transition temperature of the copolyester decreases, and the heat resistance decreases.

[0096] Comparative Example 7 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S1, the amount of neopentyl glycol added to the copolyester resin is 9% of the mass of ethylene glycol.

[0097] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0098] According to the data in Table 1, the light transmittance of this comparative example decreased compared to Example 3.

[0099] Comparative Example 8 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S1, the amount of neopentyl glycol added to the copolyester resin is 16% of the mass of ethylene glycol.

[0100] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0101] According to the data in Table 1, the insulation performance of this comparative example decreased compared to Example 3. This is because when the amount of neopentyl glycol added is higher than 15% of the mass of ethylene glycol, the glass transition temperature of the copolyester decreases, resulting in a decrease in heat resistance.

[0102] Comparative Example 9 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S1, the amount of nano-silica added to the copolyester resin is 0.01% of the copolyester resin.

[0103] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0104] According to the data in Table 1, the light transmittance of this comparative example decreased compared to Example 3. This is because when the amount of nano-silica added is less than 0.02% of the polyester film, there are insufficient nucleation sites, resulting in the formation of large and uneven crystals.

[0105] Comparative Example 10 The preparation method of the repair tape for photovoltaic modules in this comparative example is the same as that in Example 3, except that in step S1, the amount of nano-silica added to the copolyester resin is 0.12% of the copolyester resin.

[0106] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0107] According to the data in Table 1, the transmittance of this comparative example decreased compared with that of Example 3. This is because the excess of nano-silica makes it prone to agglomeration. The agglomerates become large-size defects and excessive nucleation, which affects the transmittance.

[0108] Comparative Example 11 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S2, the mass of polyethylene in the high water resistance pressure-sensitive adhesive is 8% of the total mass of the high water resistance pressure-sensitive adhesive.

[0109] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0110] According to the data in Table 1, the water-blocking and insulation properties of this comparative example are significantly reduced compared to Example 3. This is because the polyethylene content is low and insufficient to form continuous or dense barrier paths. Water molecules can easily bypass a few polyethylene particles, and the diffusion path extension is limited, affecting the water-blocking rate.

[0111] Comparative Example 12 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S2, the mass of polyethylene in the high water resistance pressure-sensitive adhesive is 32% of the total mass of the high water resistance pressure-sensitive adhesive.

[0112] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0113] According to the data in Table 1, the water resistance and insulation performance of this comparative example are significantly reduced compared with Example 3. This is because the phase separation of polyethylene and halogenated butyl rubber is severe, and the number of interface defects increases. These interface defects can lead to rapid penetration of water molecules.

[0114] Comparative Example 13 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S2, the mass of POE grafted with maleic anhydride in the high water resistance pressure-sensitive adhesive is 4% of the total mass of the high water resistance pressure-sensitive adhesive.

[0115] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0116] According to the data in Table 1, the water resistance and insulation performance of this comparative example are significantly reduced compared with Example 3. This is because the mass of maleic anhydride-grafted POE is less than 5% of the total mass of the high water resistance pressure-sensitive adhesive, which is insufficient to form a complete "bridge" layer at the interface between the two phases. This results in weak adhesion between the halogenated butyl rubber and PE, and microcracks and voids are easily generated at the interface under stress or heat.

[0117] Comparative Example 14 The preparation method of the repair tape for the photovoltaic module in this comparative example is the same as that in Example 3, except that in step S2, the mass of maleic anhydride-grafted POE in the high water resistance pressure-sensitive adhesive is 11% of the total mass of the high water resistance pressure-sensitive adhesive.

[0118] The prepared photovoltaic modules were bonded together using the same bonding process as in Example 1 with repair tape.

[0119] According to the data in Table 1, the water resistance and insulation performance of this comparative example are significantly reduced compared with Example 3. This is because the amount of maleic anhydride-grafted POE added is higher than 10%. The excess polymer molecules self-aggregate in the rubber matrix, forming micro-regions with very low strength. These soft and weak micro-regions become new stress concentration points and potential defects, resulting in a decrease in tensile strength, modulus and hardness.

[0120] The photovoltaic module repair tapes obtained in the embodiments and comparative examples of this invention underwent performance testing before repair, and the test results are shown in Table 1. The performance tests involved included: testing of the double 85 aging insulation resistance value and TC 200 aging insulation resistance according to IEC 61215 standard; testing of water vapor transmission rate according to ASTM F 1249 standard; and testing of light transmittance according to ISO 13468-1 standard.

[0121] Table 1 Performance test data of repair tape for photovoltaic modules obtained in the examples and comparative examples. The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are exhaustively listed. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0122] For those skilled in the art, various modifications and improvements can be made without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention. The scope of protection of the present invention is defined by the appended claims.

Claims

1. A repair tape for a photovoltaic module, characterized by, The repairing tape comprises, from bottom to top, a substrate layer, a functional adhesive layer and a release material layer; The substrate layer and the functional adhesive layer are of an integral full-surface structure; The functional adhesive layer is of a three-section structure, comprising a middle core layer in the middle region and side layers symmetrically located on both sides of the middle core layer; The release material layer is of a two-section structure.

2. The repair tape for a photovoltaic module according to claim 1, wherein The thickness of the substrate layer is 50-150 µm; The thickness of the functional adhesive layer is 20-80 µm; The thickness of the release material layer is 25-75 µm.

3. The repair tape for a photovoltaic module according to claim 2, wherein The ratio of the thickness of the substrate layer, the thickness of the functional adhesive layer and the thickness of the release material layer is 1:(0.3-1.0):(0.25-1.0).

4. The repair tape for a photovoltaic module according to claim 1, wherein The width of the substrate layer is 20-100 mm; The width of the middle core layer of the functional adhesive layer is 20-90 mm, and the width of one side of the side layers of the functional adhesive layer is 5-15 mm; The width of each section of the release material layer is 15-120 mm.

5. The repair tape for a photovoltaic module according to claim 4, wherein The sum of the widths of the two sections of the release material layer is (1-2) times the width of the substrate layer.

6. The repair tape for a photovoltaic module according to claim 1, wherein The substrate layer is a polyester film; The polyester film is composed of a copolymer polyester resin and nano-silicon dioxide uniformly dispersed therein; The copolymer polyester resin is formed by copolymerization of terephthalic acid, ethylene glycol, isophthalic acid and neopentyl glycol.

7. The repair tape for a photovoltaic module according to claim 6, wherein The addition amount of the nano-silicon dioxide is 0.02%-0.10% of the copolymer polyester resin.

8. The repair tape for a photovoltaic module according to claim 6, wherein The addition amount of the isophthalic acid is 8%-12% of the mass of the terephthalic acid; The addition amount of the neopentyl glycol is 10%-15% of the mass of the ethylene glycol.

9. The mending tape for a photovoltaic module according to claim 1, wherein The middle core layer of the functional adhesive layer is a silicone pressure-sensitive adhesive, and the side layers of the functional adhesive layer are high-water-resistance pressure-sensitive adhesives; the high-water-resistance pressure-sensitive adhesive comprises polyethylene-modified halogenated butyl rubber and maleic anhydride-grafted POE.

10. The repair tape for a photovoltaic module according to claim 9, wherein The mass of the polyethylene is 10-30% of the total mass of the high-water-resistance pressure-sensitive adhesive; The mass of the maleic anhydride-grafted POE is 5-10% of the total mass of the high-water-resistance pressure-sensitive adhesive.

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