Chip tray detection method and system

Abstract

The present disclosure relates to a chip tray detection method and system, and relates to the technical field of semiconductor post-process detection. The method comprises: emitting a detection light beam emitted by a light source to a chip tray to be detected through a pre-configured lens; determining the uniformity of the illumination intensity of the detection light beam irradiated on the chip tray to be detected; in response to the uniformity of the illumination intensity being less than an illumination uniformity threshold, dynamically adjusting the position of the lens relative to the light source until the uniformity of the illumination intensity is greater than or equal to the illumination uniformity threshold; and determining a chip tray detection result of the chip tray to be detected according to the line distribution result of the detection light beam on the chip tray to be detected. The present disclosure can control the uniform distribution of the detection light beam by automatically adjusting the position of the lens, directly solve the problem of inherent non-uniformity of the divergence of the light source, ensure high-precision capture of clear information of the chip profile and surface details, and improve detection reliability. The automatic adjustment can directly reduce the downtime debugging time and improve the detection efficiency.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor back-end inspection technology, and more specifically, to a chip tray inspection method and a chip tray inspection system. Background Technology

[0002] In semiconductor back-end manufacturing, based on inspection requirements, some chips that have completed visual inspection are still placed in chip trays (traps) before being output from the equipment, ultimately shipped in tray form. To prevent defects such as chip stacking or tilting in the tray pockets, the machine needs to inspect each pocket during output. In relevant solutions, laser profilometry is typically used to inspect each pocket.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this disclosure is to provide a chip tray detection method, chip tray detection system, chip tray detection device, electronic device, computer-readable storage medium, and computer program product, thereby at least to some extent overcoming the problem that uneven light intensity distribution of the detection beam leads to insufficient light intensity in the captured laser lines, resulting in reduced signal-to-noise ratio in the image, inaccurate line positioning, and thus measurement errors.

[0005] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part by practice of the invention.

[0006] According to a first aspect of this disclosure, a chip tray inspection method is provided, comprising: emitting a detection beam emitted from a light source onto a chip tray to be inspected through a pre-configured lens; determining the uniformity of illumination intensity of the detection beam on the chip tray to be inspected; dynamically adjusting the position of the lens relative to the light source in response to the uniformity of illumination intensity being less than a threshold value, until the uniformity of illumination intensity is greater than or equal to the threshold value; and determining a chip tray inspection result of the chip tray to be inspected based on the line distribution result of the detection beam on the chip tray to be inspected.

[0007] In one exemplary embodiment of this disclosure, the step of emitting a detection beam emitted by a light source onto a chip tray to be tested via a pre-configured lens includes: determining a pre-configured beam divergence angle; emitting the detection beam by the light source based on the beam divergence angle; and emitting the detection beam onto the chip tray to be tested via the lens.

[0008] In one exemplary embodiment of this disclosure, determining the uniformity of illumination intensity of the detection beam illuminating the chip tray to be tested includes: acquiring a plurality of first illumination intensity values ​​distributed on the chip tray to be tested by a pre-configured light intensity sensor array; determining a first illumination intensity mean and a first illumination intensity standard deviation corresponding to the plurality of first illumination intensity values; and determining the illumination intensity uniformity based on the first illumination intensity mean and the first illumination intensity standard deviation.

[0009] In one exemplary embodiment of this disclosure, the step of dynamically adjusting the position of the lens relative to the light source in response to the light intensity uniformity being less than the light intensity uniformity threshold, until the light intensity uniformity is greater than or equal to the light intensity uniformity threshold, includes: determining a first position corresponding to the lens in response to the light intensity uniformity being less than the light intensity uniformity threshold; determining a light intensity uniformity index corresponding to the lens at different positions by adjusting the position of the lens; determining a lens displacement distance corresponding to the lens based on the light intensity uniformity index; and moving the lens from the first position to a second position based on the lens displacement distance, wherein the light intensity uniformity is greater than or equal to the light intensity uniformity threshold when the lens is at the second position.

[0010] In one exemplary embodiment of this disclosure, determining the uniformity index of light intensity corresponding to different positions of the lens by adjusting the position of the lens includes: determining the second average light intensity and the second standard deviation of light intensity corresponding to different positions of the lens by adjusting the position of the lens; and determining the uniformity index of light intensity based on the second average light intensity and the second standard deviation of light intensity.

[0011] In one exemplary embodiment of this disclosure, moving the lens from a first position to a second position based on the lens displacement distance includes: determining a second target position of the lens at a second time based on the lens displacement distance and a first target position of the lens at a first time; obtaining a second actual position of the lens at the second time; determining a position offset difference at the second time based on the second target position and the second actual position; and determining a device control quantity corresponding to the position adjustment device based on the position offset difference at the second time, so as to drive the position adjustment device to dynamically adjust the position of the lens according to the device control quantity.

[0012] In one exemplary embodiment of this disclosure, determining the device control quantity corresponding to the position adjustment device based on the position offset difference corresponding to the second time moment includes: determining the incremental adjustment parameter corresponding to the position adjustment device; determining the incremental control quantity of the position adjustment device at the second time moment compared to the first time moment based on the incremental adjustment parameter and the position offset difference corresponding to the second time moment; obtaining the first device control quantity of the position adjustment device at the first time moment; and determining the second device control quantity of the position adjustment device at the second time moment based on the first device control quantity and the incremental control quantity.

[0013] In one exemplary embodiment of this disclosure, determining the incremental control amount of the position adjustment device at the second time compared to the first time based on the position offset difference between the incremental adjustment parameter and the second time includes: obtaining a reference position offset value of the lens before the second time, the reference position offset value including the position offset difference of the lens at the first time and the position offset difference of the lens at the time before the first time; and determining the incremental control amount based on the incremental adjustment parameter, the reference position offset value, and the position offset difference at the second time.

[0014] In one exemplary embodiment of this disclosure, the incremental adjustment parameter includes one or more of the following: sampling period, proportional coefficient, integral coefficient, and derivative coefficient.

[0015] In one exemplary embodiment of this disclosure, the method further includes: obtaining pre-configured lens movement control parameters, the lens movement control parameters including one or more of maximum movement speed, maximum movement acceleration, positioning accuracy, and movement position limit range; and driving the position adjustment device to dynamically adjust the position of the lens according to the lens movement control parameters and the device control quantity.

[0016] According to a second aspect of this disclosure, a chip tray detection system is provided, comprising: a beam focusing module for emitting a detection beam emitted from a light source onto a chip tray to be detected via a lens; a light sensing module for acquiring the light intensity value of the detection beam illuminating the chip tray to be detected via a light intensity sensor array, the light intensity value being used to determine the uniformity of light intensity of the detection beam distributed on the chip tray to be detected; a lens adjustment module for adjusting the position of the lens relative to the light source according to the uniformity of light intensity until the uniformity of light intensity is greater than or equal to a light uniformity threshold; and a calculation control module for dynamically adjusting the position and optical path parameters of the lens to maintain the uniformity of light intensity greater than or equal to the light uniformity threshold.

[0017] According to a third aspect of this disclosure, a chip tray inspection device is provided, comprising: a beam emitting module for emitting a detection beam emitted from a light source onto a chip tray to be inspected via a pre-configured lens; a uniformity determination module for determining the uniformity of illumination intensity of the detection beam on the chip tray to be inspected; a lens position adjustment module for dynamically adjusting the position of the lens relative to the light source in response to the illumination intensity uniformity being less than an illumination uniformity threshold, until the illumination intensity uniformity is greater than or equal to the illumination uniformity threshold; and a detection result determination module for determining the chip tray inspection result of the chip tray to be inspected based on the line distribution result of the detection beam on the chip tray to be inspected.

[0018] According to a fourth aspect of this disclosure, an electronic device is provided, comprising: a processor; and a memory storing computer-readable instructions that, when executed by the processor, implement the chip tray detection method according to any one of the preceding claims.

[0019] According to a fifth aspect of this disclosure, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the chip tray detection method according to any one of the preceding claims.

[0020] According to a sixth aspect of this disclosure, a computer program product is provided, comprising a computer program that, when executed by a processor, implements the chip tray detection method described in any of the preceding claims.

[0021] The technical solution provided in this disclosure may include the following beneficial effects:

[0022] The chip tray inspection method in the exemplary embodiments of this disclosure, on the one hand, can control the uniform distribution of the detection beam on the surface of the chip tray to be inspected by adjusting the lens position, that is, the uniformity of illumination intensity is greater than or equal to the illumination uniformity threshold, directly solving the inherent divergence non-uniformity problem of the light source. On the other hand, chip tray inspection based on uniform illumination intensity can ensure high-precision capture of clear information of chip contours and surface details, thereby improving inspection reliability. Furthermore, chip tray inspection by automatically adjusting the lens position can directly reduce downtime for debugging and improve inspection efficiency.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:

[0025] Figure 1 The schematic diagrams show the optical path diagram and simplified diagram corresponding to the laser contour detection method in the relevant schemes;

[0026] Figure 2 The diagram illustrates the normal and abnormal states of the laser contour detection method when detecting a tray.

[0027] Figure 3 A flowchart illustrating a chip tray detection method according to an exemplary embodiment of the present disclosure is shown schematically.

[0028] Figure 4 This schematic diagram illustrates the structure of a chip tray detection system according to an exemplary embodiment of the present disclosure;

[0029] Figure 5 This schematically illustrates a flowchart of determining a lens displacement distance based on multiple light intensity values ​​according to an exemplary embodiment of the present disclosure;

[0030] Figure 6 A block diagram of a chip tray detection apparatus according to an exemplary embodiment of the present disclosure is shown schematically;

[0031] Figure 7 The schematic diagram illustrates a computer-readable storage medium according to an exemplary embodiment of the present disclosure;

[0032] Figure 8 A block diagram of an electronic device according to an exemplary embodiment of the present disclosure is shown schematically. Detailed Implementation

[0033] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0034] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details described, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known structures, methods, apparatuses, implementations, materials, or operations are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0035] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, or in one or more software-hardened modules, or in different network and / or processor devices and / or microcontroller devices.

[0036] According to embodiments of this disclosure, a chip tray detection method, a chip tray detection system, a chip tray detection device, a computer-readable storage medium, an electronic device, and a computer program product are proposed.

[0037] The principles and spirit of this disclosure will be explained in detail below with reference to several representative embodiments.

[0038] In relevant solutions, laser contour detection is typically used to detect Tray Pockets. (See reference...) Figure 1 , Figure 1 The schematic diagrams show the optical path diagram and simplified diagram corresponding to the laser profile detection method in the relevant scheme. Figure 1 The left figure is a schematic diagram of the optical path corresponding to the laser contour detection method. The laser contour detection method refers to emitting a laser line from the light source 110 to the tray. The laser line can be reflected by the reflector 120 to the tray 130 to be detected. Then the laser line is captured by the camera 140 after reflection. The camera 140 determines the chip status by capturing the laser lines on the edge of the chip and the Pocket and calculating their height difference and angle. Figure 1 The right figure is a simplified schematic diagram of the laser contour detection method, in which a laser line is irradiated onto the Tray disk 130 to be detected at a specific angle.

[0039] refer to Figure 2 , Figure 2 The diagram illustrates the normal and abnormal states of the laser profile detection method when detecting a tray. Figure 2 The laser emitter in the tray emits one or more laser lines that illuminate the tray pocket, such as... Figure 2As shown in the image above, under normal circumstances, the laser line appears as a straight line. In this case, there are no abnormalities, and the detection result for the chip tray under test is "pass". Figure 2 As shown in the image below, when the integrated circuit (IC) in the Tray Pocket is misaligned or overlapped, the infrared laser line at the location of the foreign object will be misaligned. At this time, the camera can detect the problem and issue an alarm.

[0040] Commonly used semiconductor lasers emit beams with a Gaussian intensity distribution, resulting in laser lines that are brighter at the center and weaker at the edges. For example, the intensity at the center of a tray can reach 1000 lux, while at the edges it may drop below 300 lux. When illuminating a large tray, the laser light source's intensity distribution is uneven due to its divergent characteristics. When the camera captures laser lines in the areas on both sides of the tray, insufficient light intensity leads to a reduced signal-to-noise ratio in the image and inaccurate line positioning. This directly causes measurement errors, resulting in false alarms about chip stacking or tilting, severely impacting equipment production efficiency and reliability, and posing a quality risk of chip stacking or tilting during shipment. Furthermore, the related laser detection system uses a fixed optical path without lens optimization, requiring 5-10 minutes of manual intervention for each adjustment, significantly slowing down production and becoming a bottleneck in high-throughput production lines.

[0041] Based on this, in this example embodiment, a chip tray detection method is first provided. The chip tray detection method of this disclosure can be implemented using a server or using a terminal device. The terminal described in this disclosure can include mobile terminals such as mobile phones, tablets, laptops, handheld computers, and personal digital assistants (PDAs), as well as fixed terminals such as desktop computers. Figure 3 A schematic diagram illustrating a chip tray detection method flow according to some embodiments of the present disclosure is provided. (Reference) Figure 3 The chip tray detection method may include the following steps:

[0042] Step S310: The detection beam emitted by the light source is emitted onto the chip tray to be detected through a pre-configured lens;

[0043] Step S320: Determine the uniformity of the illumination intensity of the detection beam on the chip tray to be tested;

[0044] Step S330: In response to the light intensity uniformity being less than the light intensity uniformity threshold, the position of the lens relative to the light source is dynamically adjusted until the light intensity uniformity is greater than or equal to the light intensity uniformity threshold.

[0045] Step S340: Determine the chip tray detection result of the chip tray to be detected based on the line distribution result of the detection beam on the chip tray to be detected.

[0046] According to the chip tray detection method in this example embodiment, on the one hand, by adjusting the lens position, the detection beam can be controlled to be uniformly distributed on the surface of the chip tray to be detected, that is, the uniformity of light intensity is greater than or equal to the light uniformity threshold, directly solving the inherent problem of non-uniform divergence of the light source. On the other hand, chip tray detection based on uniform light intensity can ensure high-precision capture of clear information on chip contours and surface details, thereby improving detection reliability. Furthermore, by automatically adjusting the lens position for chip tray detection, downtime for debugging can be directly reduced, improving detection efficiency.

[0047] The chip tray detection method in this example embodiment will be further described below.

[0048] In one exemplary embodiment of this disclosure, step S310, which involves emitting a detection beam emitted by a light source onto a chip tray to be tested via a pre-configured lens, includes: determining a pre-configured beam divergence angle; emitting a detection beam from the light source based on the beam divergence angle; and emitting the detection beam onto the chip tray to be tested via a lens.

[0049] To address the detection failure caused by uneven light intensity distribution due to the divergent characteristics of the light projected by the laser source, this embodiment employs a lens to adjust the detection beam emitted by the light source. (Reference) Figure 4 , Figure 4 The schematic diagram illustrates a structural diagram of a chip tray detection system according to an exemplary embodiment of the present disclosure. Figure 4 When the light source emits a detection beam, the beam is emitted through a lens, the lens's position having already been initially calibrated. The light source emits the detection beam based on a pre-configured beam divergence angle. The beam divergence angle refers to the cone angle formed in space by the beam emitted by the light source or optical system, reflecting the degree of beam diffusion or concentration in space. The beam divergence angle can include full divergence and half divergence.

[0050] In this embodiment, the beam divergence angle can be configured to 10° (half an angle). The light source emits a detection beam based on the beam divergence angle to detect the appearance of the tray. For example, the detection beam can be a fixed-wavelength laser line emitted by a laser emitter (such as visible light or near-infrared band). After the light source emits the detection beam, it can be projected onto the chip tray under test through a lens to detect whether the chips are stacked or tilted in the tray pocket, or other defects.

[0051] like Figure 4As shown, the detection beam focused by the lens can be reflected at a certain angle onto the surface of the chip tray under test by a reflector for testing. This disclosure eliminates the root cause of possible errors from the physical optics level (i.e., before the problem of uneven light intensity occurs), focuses and evenly distributes the light, and effectively solves the inherent problem of uneven divergence of the light source.

[0052] In one exemplary embodiment of this disclosure, step S320, determining the uniformity of illumination intensity of the detection beam illuminating the chip tray to be tested, includes: acquiring multiple first illumination intensity values ​​distributed on the chip tray to be tested by a pre-configured light intensity sensor array; determining the first illumination intensity mean and the first illumination intensity standard deviation corresponding to the multiple first illumination intensity values; and determining the illumination intensity uniformity based on the first illumination intensity mean and the first illumination intensity standard deviation.

[0053] When the detection beam shines on the surface of the chip tray under test, the initial light intensity distribution on the surface of the chip tray can be collected by a pre-configured light intensity sensor array, thus obtaining multiple first light intensity values. The light intensity sensor array can be an array composed of light intensity sensors or photodetectors used to collect the light intensity at different locations on the surface of the chip tray under test. The specific arrangement of the light intensity sensor array can be determined according to the distribution of the chip tray under test.

[0054] Continue to refer to Figure 4 , can Figure 4 The light sensing module 430 in the light intensity sensor array is arranged in a light intensity sensor array. In this embodiment, 16 high-precision light intensity sensors or light detectors can be configured in the light intensity sensor array, with 12 arranged at the edge (3 on each side) and 4 arranged in the central area. The parameters of the light intensity sensors can be configured as follows: sampling frequency: 1kHz; measurement range: 0-2000Lux; accuracy: ±10Lux, etc. In other embodiments of this disclosure, the number of light intensity sensors in the light intensity sensor array and the specific parameters of the light intensity sensors can be configured according to specific testing requirements, and this disclosure does not impose any special limitations on this.

[0055] The first illumination intensity value is acquired by the aforementioned light intensity sensor array. This first illumination intensity value can be the illumination intensity value detected when the detection beam shines on the surface of the chip tray after initial adjustment through the lens. Taking an array containing 16 light intensity sensors as an example, the initial light intensity distribution on the tray surface is acquired, and the real-time illumination intensity values ​​of the 16 light intensity sensors, E1-E16, are obtained as multiple first illumination intensity values.

[0056] refer to Figure 5 , Figure 5The illustration schematically shows a flowchart of determining the lens displacement distance based on multiple illumination intensity values ​​according to an exemplary embodiment of the present disclosure. In step S510, the first illumination intensity values ​​of each point are obtained as input. In step S520, the mean value and standard deviation of the first illumination intensity corresponding to the multiple first illumination intensity values ​​are calculated based on the illumination intensity equalization algorithm. Illumination intensity uniformity is then calculated based on these indicators. Illumination intensity uniformity can be a numerical indicator used to quantitatively describe the uniformity of illumination intensity distribution within a specific area. Specifically, as shown in Formula 1:

[0057] (Formula 1)

[0058] in, It can represent the first i The first light intensity value collected by a light intensity sensor; It can represent the average of multiple first light intensity values; It can represent the standard deviation of the first illuminance corresponding to multiple first illuminance values; It can represent the uniformity of light intensity corresponding to multiple first light intensity values. By calculating the uniformity of light intensity, it can be determined whether the light intensity illuminating the surface of the chip tray under test is evenly distributed, which serves as the basis for subsequent adjustment of the lens position.

[0059] In one exemplary embodiment of this disclosure, step S330, in response to the illumination intensity uniformity being less than the illumination uniformity threshold, dynamically adjusting the position of the lens relative to the light source until the illumination intensity uniformity is greater than or equal to the illumination uniformity threshold, includes: in response to the illumination intensity uniformity being less than the illumination uniformity threshold, determining a first position corresponding to the lens; determining the illumination intensity uniformity index corresponding to the lens at different positions by adjusting the position of the lens; determining the lens displacement distance corresponding to the lens based on the illumination intensity uniformity index; and moving the lens from the first position to a second position based on the lens displacement distance, wherein the illumination intensity uniformity is greater than or equal to the illumination uniformity threshold when the lens is at the second position.

[0060] After calculating the corresponding illumination intensity uniformity based on multiple first illumination intensity values, the illumination intensity uniformity is compared with an illumination uniformity threshold to determine whether the illumination intensity uniformity is greater than the threshold. The illumination uniformity threshold can be a pre-configured reference value used for numerical comparison with the illumination intensity uniformity. When the detected illumination intensity uniformity is less than the illumination uniformity threshold, it is considered that the illumination intensity uniformity of the detection beam may not meet the detection requirements. In this case, the position of the lens needs to be adjusted to adjust the distance between the lens and the light source. (Continue to refer to...) Figure 5In step S530, based on the slide rail control algorithm, proportional-integral-derivative control (PID control) is performed on the z-axis to adjust the position of the z-axis.

[0061] Before adjusting the lens position, we can first determine the lens's initial position at the current moment, and then adjust the lens position. The lens position is represented by the z-axis coordinate. The distance of the lens displacement can be expressed as the z-axis displacement (…). (This is represented by the symbol ). During the position adjustment process, the uniformity index of light intensity corresponding to different positions of the lens can be determined, and the lens displacement distance corresponding to the lens can be determined based on the uniformity index of light intensity.

[0062] After determining the lens displacement distance, the lens is moved from a first position to a second position based on the lens displacement distance and a slide rail control algorithm. The distance between the second position and the first position is the lens displacement distance. In this embodiment, the corresponding lens displacement distance is calculated based on the lens's illumination intensity uniformity index. The illumination intensity uniformity index can be the illumination intensity uniformity corresponding to the surface of the chip tray to be tested, or other indicators that can measure whether the illumination intensity is evenly distributed, such as the illumination intensity uniformity index. When the lens is in the second position, when the detection beam shines on the surface of the chip tray to be tested through the lens, the detected illumination intensity uniformity is greater than or equal to the illumination uniformity threshold.

[0063] During the detection process, the computational control module 440 is the core processing unit of the entire adaptive optical path system, responsible for adjusting the optical path parameters in real time to maintain uniform illumination on the tray surface. When the computational control module 440 detects non-uniform areas, such as when the illumination intensity of the edge area is more than 30% lower than that of the center area, it adjusts the distance between the lens and the light source along the z-axis to change the beam half-angle, and collects the illumination intensity of the detection beam at different locations using a light intensity sensor array. Additionally, in some other embodiments, a camera can be additionally configured, and the camera focus can be adjusted synchronously to maintain optimal imaging. The camera collects images of the detection beam, thereby determining the detection result of the chip tray based on the collected detection images. During the stable detection phase, the optimized optical path configuration can be maintained, light intensity changes can be monitored in real time, and fine-tuning calibration can be performed every certain period of time (e.g., every 5 seconds).

[0064] During the inspection process, by dynamically adjusting the position of the lens, the uniformity of light intensity on the surface of the chip tray under inspection can be kept within the target uniformity index. Therefore, image noise caused by light differences can be eliminated, ensuring that the image sensor can capture clear information of chip contour and surface details with high precision, thereby improving inspection reliability.

[0065] In one exemplary embodiment of this disclosure, determining the light intensity uniformity index corresponding to different positions of the lens by adjusting the position of the lens includes: determining the second light intensity mean and the second light intensity standard deviation corresponding to different positions of the lens by adjusting the position of the lens; and determining the light intensity uniformity index based on the second light intensity mean and the second light intensity standard deviation.

[0066] During the dynamic adjustment phase, the lens position can be dynamically adjusted to different locations. Then, the mean and standard deviation of the second illumination intensity corresponding to these different lens positions are determined. Based on the mean and standard deviation of the second illumination intensity, and combined with a light intensity equalization algorithm, an illumination intensity uniformity index is calculated. The calculation methods for the mean and standard deviation of the second illumination intensity are the same as those for the mean and standard deviation of the first illumination intensity, and will not be elaborated upon further in this disclosure.

[0067] The uniformity of illumination intensity can also include the difference in illuminance values, which can be determined based on the calculated mean and standard deviation of illumination intensity. The functional goal of the light intensity equalization algorithm is to dynamically adjust the lens position to ensure that the uniformity of illumination intensity on the tray surface is greater than or equal to a light uniformity threshold (e.g., 90%). During focal length optimization, this is achieved by adjusting the z-axis displacement (…). Adjust the lens focal length to optimize the difference in illuminance values. The difference in illuminance values ​​is shown in Formula 2:

[0068] (Formula 2)

[0069] in, It can represent the average of multiple first light intensity values; It can represent the standard deviation of the first illuminance corresponding to multiple first illuminance values; It can represent the lens displacement distance, i.e., the z-axis displacement; It can be used to calculate the difference in illuminance values.

[0070] During the dynamic adjustment process, the calculation control algorithm determines the lens displacement distance through Formula 2, and works in conjunction with the slide rail control algorithm to quickly match the optimal lens position so that the lens position meets the detection target, that is, the uniformity of light intensity reaches or exceeds the threshold of uniformity of light intensity.

[0071] In one exemplary embodiment of this disclosure, moving a lens from a first position to a second position based on a lens displacement distance includes: determining a second target position of the lens at a second time based on the lens displacement distance and a first target position of the lens at a first time; obtaining a second actual position of the lens at the second time; determining a position offset difference at the second time based on the second target position and the second actual position; and determining a device control quantity corresponding to the position adjustment device based on the position offset difference at the second time, so as to drive the position adjustment device to dynamically adjust the position of the lens according to the device control quantity.

[0072] In this embodiment, the position of the lens is dynamically adjusted using a sliding rail control algorithm. The position of the lens is the position along the z-axis. The functional goal of the sliding rail control algorithm is to achieve fast and accurate positioning of the lens along the z-axis, such as a response time of <10ms. The control strategy can determine the z-axis position through PID control; the input to the sliding rail control algorithm can be the lens displacement distance determined based on the light intensity equalization algorithm. The output of the slide rail control algorithm can include equipment control quantities and increments of these quantities, such as motor current or drive pulses, to drive the slide rail. The specific calculation process of the slide rail control algorithm is as follows:

[0073] Determine the position of the first target corresponding to the lens at the first moment. The first moment can be... k At time -1, the first target position can be the lens at... k The target position at time -1. The second time could be... k At any given moment, the position of the second target can be determined by the lens. k The target position corresponding to a given moment. During dynamic adjustment, multiple different moments can be included, such as... k If time is taken as the current time, then k -1 could be the previous time corresponding to the current time. k +1 can represent the next moment corresponding to the current moment.

[0074] After determining the first target position corresponding to the lens at the first moment, the second target position corresponding to the lens at the second moment can be determined by combining the first target position with the lens displacement distance calculated by the light intensity equalization algorithm. This is illustrated in Formula 3.

[0075] (Formula 3)

[0076] Formula 3 shows that the target position of the lens is accumulated, where, This can indicate that the lens is in k The position of the second target at that moment; This can indicate that the lens is in k The position of the first target at time -1; It can represent the lens displacement distance, used to represent the relative displacement that needs to be moved this time, calculated by the light intensity equalization algorithm.

[0077] The second actual position of the lens at the second moment is obtained, and the position offset difference at the second moment is determined based on the second target position and the second actual position; wherein, the position offset difference can represent the second moment. k The difference between the target position and the actual position at any given time. For example, in this embodiment, the position offset difference can be the offset difference between the second actual position and the second target position. The position offset difference is the core input of the PID controller, which is designed to eliminate this error. After determining the position offset difference, the corresponding device control quantity of the actuator can be determined based on the position offset difference. The second target position can be the position that the lens should have reached at the second time, and the second actual position can be the actual position of the lens at the second time. Specifically, as shown in Formula 4:

[0078] (Formula 4)

[0079] in, This can indicate that the lens is in k The second target position corresponding to the time, i.e., the position of the lens at... k The absolute target position that the z-axis should reach at any given time; This can indicate that the lens is in k The second actual position corresponding to time can be represented as the position at time . k At any given moment, the current position of the z-axis as actually measured by the sensor (such as a linear scale or encoder); It can represent the difference in the positional offset of the lens.

[0080] After determining the position offset difference of the lens at the second moment, the corresponding equipment control quantity of the position adjustment device can be determined based on the position offset difference, so that the position adjustment device can be driven to dynamically adjust the position of the lens according to the equipment control quantity.

[0081] In one exemplary embodiment of this disclosure, pre-configured lens movement control parameters are obtained, including one or more of the following: maximum movement speed, maximum movement acceleration, positioning accuracy, and movement position limit range; based on the lens movement control parameters and the device control quantity, the position adjustment device is driven to dynamically adjust the position of the lens.

[0082] Continue to refer to Figure 5 To further improve the stability during lens movement, this embodiment also incorporates anti-vibration design and fault tolerance mechanisms. By pre-configuring the lens movement control parameters during the z-axis movement, the position adjustment device is driven to dynamically adjust the lens position based on the lens movement control parameters and the device control quantity.

[0083] Lens movement control parameters may include, but are not limited to, the maximum moving speed, maximum moving acceleration, positioning accuracy, and movement position limit range of the lens mobile device during movement. The maximum moving speed can be the highest movement rate the lens can achieve during dynamic adjustment. The maximum moving acceleration can be the limiting rate of speed change of the lens during dynamic adjustment, including the upper limit of explosive force for both slow to fast and fast to slow transitions. Positioning accuracy can be the maximum deviation between the true position and the actual position of the lens, calculated by the lens mobile device using its built-in sensors. The movement position limit range can be the maximum distance range the lens mobile device can move during a single movement.

[0084] Continue to refer to Figure 5 In this embodiment, acceleration feedforward is used to predict the motor's inertia and reduce overshoot. During trajectory planning, a maximum moving speed of 10mm / s and an acceleration of 500mm / s² can be configured, with a positioning accuracy of ±0.05mm to avoid mechanical impact. After the slide rail is in place, a 50ms stabilization delay is added to allow mechanical vibration to decay. The added fault-tolerance mechanisms include a limit protection mechanism (hardware + software dual limit protection ±15mm) and a step loss detection mechanism, which is verified through encoder feedback and triggers automatic zeroing. By introducing anti-vibration design and fault-tolerance mechanisms, the stability of the lens during movement can be improved.

[0085] In one exemplary embodiment of this disclosure, determining the device control quantity corresponding to the position adjustment device based on the position offset difference at the second time includes: determining the incremental adjustment parameter corresponding to the position adjustment device; determining the incremental control quantity of the position adjustment device at the second time compared to the first time based on the incremental adjustment parameter and the position offset difference at the second time; obtaining the first device control quantity of the position adjustment device at the first time; and determining the second device control quantity of the position adjustment device at the second time based on the first device control quantity and the incremental control quantity.

[0086] Once the position offset difference of the position adjustment device at the second moment is determined, the control quantity for moving the device can be determined based on this position offset difference. For example, the incremental adjustment parameter corresponding to the position adjustment device is determined, and then the incremental control quantity of the position adjustment device at the second moment compared to the first moment is determined by combining the incremental adjustment parameter and the position offset difference. The incremental control quantity can be the amount of increase or decrease in force between the current moment and the previous moment. The incremental control quantity at the second moment can be... express.

[0087] In one exemplary embodiment of this disclosure, the incremental adjustment parameter includes one or more of the following: sampling period, proportional coefficient, integral coefficient, and derivative coefficient. The sampling period, also known as the control period, represents how often the control system performs calculations and adjustments, and can be expressed as... T s In other words, the system every... T s It collects data every second. Calculate once and output a new one .

[0088] The proportionality coefficient can represent the current error and can be used as follows: K p This indicates that during lens position adjustment, any error will immediately generate a reverse force, and the proportional coefficient determines the basic speed of the device's response. If it is too large, the lens will vibrate violently; if it is too small, the lens will move very slowly. In this embodiment, the proportional coefficient can be configured to 0.5.

[0089] The integral coefficient can represent past errors and can be used as follows: K i This indicates that it is used to eliminate steady-state error. A too-strong integral term in the integral coefficient can easily lead to overshoot (lens overshoot), while a smaller integral term... K i This indicates that the system prefers to approach the target steadily rather than rushing forward. In this embodiment, the integral coefficient can be configured to 0.02, which is a relatively small value and aligns with the description of "emphasizing smoothness".

[0090] Differential coefficients can be used to predict "future trends," and can be employed in various ways. K d This indicates that the predicted direction of error change generates a damping effect, and the differential term is used to suppress oscillations. When the lens rapidly approaches the target, the error decreases quickly, and the differential term generates a counterforce to stop it. In this embodiment, the differential coefficient can be configured to 0.05. This value helps prevent the lens from jittering at the target position while achieving rapid positioning (<10ms).

[0091] By determining the incremental adjustment parameters and configuring their specific values, the incremental control amount of the position adjustment device can be calculated using the configured values, thereby controlling the position adjustment device to adjust the position of the lens.

[0092] After determining the incremental control quantity at the second moment, the first device control quantity corresponding to the position adjustment device at the first moment is obtained. This device control quantity can be the total control quantity ultimately output to the actuator (e.g., motor) at different moments, for example, the total current value or the total pulse frequency. The first device control quantity can be... k -1 is the total control quantity output to the actuator. The second device control quantity can be at... k The total control quantity output to the actuator at all times.

[0093] After calculating the incremental control value, the second equipment control value corresponding to the position adjustment equipment at the second moment can be determined based on the incremental control value and the first equipment control value. This is illustrated in Formula 5.

[0094] (Formula 5)

[0095] in, It can represent the first device control quantity corresponding to the position adjustment device at the first moment; It can represent the second device control quantity corresponding to the position adjustment device at the second moment; This can represent the incremental control amount of the position adjustment device at the second moment compared to the first moment. The calculation determines the force that should be increased or decreased compared to the previous calculation. By determining the second device control value, the position adjustment device can be used to adjust the position of the lens based on the second device control value.

[0096] In one exemplary embodiment of this disclosure, determining the incremental control amount of the position adjustment device at the second time relative to the first time based on the position offset difference between the incremental adjustment parameter and the second time includes: obtaining a reference position offset value of the lens before the second time, the reference position offset value including the position offset difference of the lens at the first time and the position offset difference of the lens at the time before the first time; and determining the incremental control amount based on the incremental adjustment parameter, the reference position offset value, and the position offset difference at the second time.

[0097] The reference position offset value can be a reference value of the position offset at different times used as the basis for determining the incremental control quantity. The reference position offset value can include the position offset difference of the lens at the first time and the position offset difference of the lens at the previous time; wherein, the position offset difference at the first time can be the position offset difference of the lens at... k The position offset difference at time -1, and the position offset difference at the previous time can be the lens at... k The position offset difference corresponding to time -2.

[0098] After determining the reference position offset, the incremental control quantity is calculated based on the incremental adjustment parameter, the reference position offset, and the position offset difference at the second time point, as shown in Formula 6:

[0099] (Formula 6)

[0100] in, It can represent incremental control quantity; It can represent the proportionality coefficient; It can represent the integral coefficient; It can represent differential coefficients; It can represent the sampling period; This can represent the positional offset difference of the lens at the second moment; It can represent the positional offset difference of the lens at the first moment; the second moment can be the moment following the first moment. It can represent the positional offset difference of the lens at the previous moment corresponding to the first moment.

[0101] Equation 3-6 is the mathematical description of the incremental PID (Incremental PID) control algorithm, used to control the precise positioning of the lens on the z-axis. Integral term. It can represent the accumulation of errors. This approximately represents the increase in the area of ​​error over this time period. Differential term. This can represent the rate (velocity) of error change, divided by This is to calculate the slope, specifically the slope corresponding to Δerror / Δtime. The incremental control quantity calculated based on the above steps can be used to determine the corresponding equipment control quantity for the position adjustment equipment.

[0102] For the entire system, in order to achieve a response time of less than 10ms, It must be very small. Usually It should be at least 5-10 times smaller than the target response time. For example, if a 10ms response time is required, It can be set between 0.5ms and 1ms (0.0005s-0.001s). If If the value is too large (e.g., 5ms), the system will react sluggishly and will not be able to stabilize within 10ms; if... Too small a size would place excessive demands on the processor's processing speed and could easily introduce high-frequency noise. (Continue to refer to...) Figure 5 Through the above steps, in step S540, an output is obtained. The output can be a device control quantity, which is used to achieve fast and accurate positioning of the z-axis.

[0103] In one exemplary embodiment of this disclosure, for step S340, the chip tray detection result of the chip tray to be detected is determined based on the line distribution result of the detection beam on the chip tray to be detected.

[0104] When the uniformity of the illumination intensity of the detection beam on the surface of the chip tray under test is greater than or equal to the illumination intensity uniformity threshold, the line distribution result of the detection beam on the chip tray surface can be obtained. The line distribution result reflects the distribution of the detection beam on the surface of the chip tray under test. If the detection beam appears as a straight line on the Tray Pocket surface, it indicates that there is no abnormality on the chip tray surface, and the chip tray detection result is determined to be pass. When there is a misalignment or overlap problem of IC inside the Tray Pocket, the detection beam at the foreign object location will show a misaligned state, that is, the line distribution result will show a misaligned or broken state. The detection equipment will detect this abnormality and alarm.

[0105] As described above, the chip tray detection method disclosed herein mainly includes an initialization phase, which involves system power-on self-testing and resetting each module to its reference position. The calibration phase involves acquiring the initial light intensity distribution using a light intensity sensor array and calculating the uniformity index. If the light intensity uniformity is <90%, automatic calibration is initiated, and the lens z-axis position is adjusted. The operation phase continuously monitors the light intensity distribution, such as automatically fine-tuning every 5 seconds, triggering alarms for abnormal conditions, and recording the results.

[0106] During the entire testing process, key parameters can be set in advance, such as the light intensity uniformity threshold can be configured to 90%. In addition, some maintenance operations can be performed, such as regularly cleaning the lens surface, calibrating the light intensity sensor array, and checking the wear of the slide rail.

[0107] In summary, the chip tray inspection method disclosed herein uses a pre-configured lens to project a detection beam emitted from a light source onto the chip tray to be inspected; determines the uniformity of illumination intensity of the detection beam on the chip tray; dynamically adjusts the position of the lens relative to the light source in response to the uniformity of illumination intensity being less than a threshold, until the uniformity of illumination intensity is greater than or equal to the threshold; and determines the chip tray inspection result based on the line distribution of the detection beam on the chip tray. On one hand, it can control the uniform distribution of the detection beam on the surface of the chip tray, i.e., the uniformity of illumination intensity is greater than or equal to the threshold, directly solving the inherent divergence problem of the light source. On the other hand, chip tray inspection based on uniform illumination intensity ensures high-precision capture of clear information about the chip outline and surface details, thereby improving inspection reliability. Furthermore, by automatically adjusting the lens position for chip tray inspection, downtime for debugging can be directly reduced, improving inspection efficiency. Finally, the above inspection scheme improves inspection accuracy and reliability, significantly reducing the false detection rate of chip misalignment / overlapping.

[0108] It should be noted that although the steps of the method in this invention are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps.

[0109] Additionally, in this example embodiment, a chip tray detection system is also provided, which can be further referenced. Figure 4 The chip tray detection system may include: a beam focusing module 410, a light sensing module 420, a lens adjustment module 430, and a calculation control module 440.

[0110] Specifically, the beam focusing module 410 is used to project the detection beam emitted by the light source onto the chip tray under test through a lens; the light sensing module 420 is used to collect the light intensity value of the detection beam illuminating the chip tray under test through a light intensity sensor array, and the light intensity value is used to determine the uniformity of the light intensity of the detection beam distributed on the chip tray under test; the lens adjustment module 430 is used to adjust the position of the lens relative to the light source according to the uniformity of the light intensity until the uniformity of the light intensity is greater than or equal to the light uniformity threshold; and the calculation control module 440 is used to dynamically adjust the position of the lens and the optical path parameters to maintain the uniformity of the light intensity greater than or equal to the light uniformity threshold.

[0111] The above modules are connected via standard interfaces and installed on the rack of the testing equipment. The beam focusing module 410 may include a detection light source, which can be a 650nm wavelength semiconductor laser with an adjustable output power range of 10-100mW and a beam divergence angle configurable to 10° (half-angle), and is mounted on a sliding rail adjustment platform. A high-precision convex lens is used, with a diameter matching the tray disk; a typical value is 150-300mm. The lens material can be fused silica with a refractive index of 1.458 (587.6nm), and the focal length is designed to be 100mm (adjusted via a sliding rail to control the beam half-angle).

[0112] The light sensing module 420 may include a light intensity sensor array, such as a 16-point light intensity sensor array, evenly distributed on the edge and center of the tray disk; and the sampling frequency of the light intensity sensor array can be configured to 1kHz, the light intensity detection range can be configured to 0-2000Lux, and the resolution can be configured to ±10Lux.

[0113] The lens adjustment module 430 can be installed in a precision electric slide rail system. This system can be driven by a stepper motor and configured with a Z-axis travel of 150mm, a positioning accuracy of ±0.05mm, and a maximum speed of 10mm / s to adapt to production line cycles. In this embodiment, by dynamically adjusting the lens position, light is focused and evenly distributed, improving the uniformity of illumination intensity on the tray surface and reducing the difference in illumination intensity between the edges and the center.

[0114] The computational control module 440 is the core processing unit of the entire adaptive optical path system, responsible for adjusting optical path parameters in real time to maintain uniform illumination on the tray surface. Its design integrates high-speed hardware and advanced algorithms, including light intensity equalization and sliding rail control algorithms. The computational control module 440 can be a closed-loop control system based on a PID algorithm, configured with a response time of <10ms, and supports adaptive learning. Through a closed-loop linkage mechanism of "lens + sliding rail + light intensity sensor + computational control unit" and intelligent control algorithms, the core problems of uneven light intensity and poor adaptability in traditional chip detection are solved; the detection time of the chip tray is shortened, production efficiency is improved, and equipment changeover adjustment time is reduced.

[0115] Furthermore, in this example embodiment, a chip tray detection device is also provided. (See reference...) Figure 6 The chip tray detection device 600 may include: a beam emitting module 610, a uniformity determination module 620, a position adjustment module 630, and a detection result determination module 640.

[0116] Specifically, the beam emitting module 610 is used to emit a detection beam emitted by the light source onto the chip tray to be tested through a pre-configured lens; the uniformity determination module 620 determines the uniformity of the illumination intensity of the detection beam on the chip tray to be tested; the position adjustment module 630 dynamically adjusts the position of the lens relative to the light source in response to the illumination intensity uniformity being less than the illumination uniformity threshold, until the illumination intensity uniformity is greater than or equal to the illumination uniformity threshold; and the detection result determination module 640 is used to determine the chip tray detection result of the chip tray to be tested based on the line distribution result of the detection beam on the chip tray to be tested.

[0117] The specific details of the virtual modules of each chip tray detection device mentioned above have been described in detail in the corresponding chip tray detection methods. For any undisclosed details, please refer to the implementation methods in the method section, and therefore will not be repeated here.

[0118] It should be noted that although several modules or units of the chip tray detection device have been mentioned in the detailed description above, this division is not mandatory. In fact, according to embodiments of this disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0119] Exemplary embodiments of this disclosure also provide a computer program product. The computer program product includes a computer program that, when executed by a processor, implements the chip tray detection method described above.

[0120] In one implementation, the computer program product may be a tangible product containing a computer program, such as a computer-readable storage medium storing the computer program. (See reference...) Figure 7 , Figure 7 The schematic diagram illustrates a computer-readable storage medium 700 according to an exemplary embodiment of the present disclosure. The computer-readable storage medium 700 can be a storage medium based on electrical, magnetic, optical, electromagnetic, infrared, or other signals, including but not limited to: random access memory (RAM), read-only memory (ROM), magnetic tape, floppy disk, flash memory, hard disk drive (HDD), solid-state drive (SSD), etc. Exemplarily, a computer program product can be implemented as a non-volatile storage medium storing a computer program, such as read-only memory, NAND flash memory, etc.

[0121] In one implementation, the computer program product can be an intangible product containing a computer program. For example, the computer program product can be implemented as a virtual digital product, such as an executable file, installation package, or other digital file storing the computer program.

[0122] Computer program code can be written in one or more programming languages. Examples of programming languages ​​include C, Java, and C++. Program code can execute entirely on the user's computing device, partially on the user's computing device, or as a standalone software package. It can also execute partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, such as a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via an internet connection provided by a mobile network operator).

[0123] Computer programs can be carried or transmitted via signals such as electrical, magnetic, optical, electromagnetic, and infrared rays. Electronic devices can convert the signals carrying computer programs into digital signals, thereby running the computer programs. When a computer program runs on an electronic device, its code is used to cause the electronic device to execute (more specifically, the processor of the electronic device to execute) the method steps of various exemplary embodiments of this disclosure, such as the chip tray detection method described above.

[0124] Exemplary embodiments of this disclosure also provide an electronic device, which may include a processor and a memory. The memory stores executable instructions of the processor, such as a computer program. The processor executes the executable instructions to perform the method steps of various exemplary embodiments of this disclosure. Furthermore, the electronic device may also include a display for displaying a graphical user interface.

[0125] The following is for reference. Figure 8 The electronic device is illustrated by way of a general-purpose computing device. It should be understood that... Figure 8 The electronic device 800 shown is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments disclosed herein.

[0126] like Figure 8 As shown, the electronic device 800 may include: a processor 810, a memory 820, a bus 830, an I / O (input / output) interface 840, a network adapter 850, and a display 860.

[0127] The memory 820 may include volatile memory, such as RAM 821 and cache unit 822, and may also include non-volatile memory, such as ROM 823. The memory 820 may also include one or more program modules 824, including but not limited to: an operating system, one or more application programs, other program modules, and program data. Each or some combination of these examples may include an implementation of a network environment. For example, program module 824 may include the modules described above.

[0128] The processor 810 may include one or more processing units, such as an AP (Application Processor), a modem processor, a GPU (Graphics Processing Unit), an ISP (Image Signal Processor), a controller, an encoder, a decoder, a DSP (Digital Signal Processor), a baseband processor, and / or an NPU (Neural-Network Processing Unit).

[0129] The processor 810 can be used to execute executable instructions stored in the memory 820, such as the chip tray detection method described above.

[0130] Bus 830 is used to connect different components of electronic device 800 and may include data bus, address bus and control bus.

[0131] Electronic device 800 can communicate with one or more external devices 900 (such as keyboard, mouse, external controller, etc.) through I / O interface 840.

[0132] Electronic device 800 can communicate with one or more networks via network adapter 850. For example, network adapter 850 can provide mobile communication solutions such as 3G / 4G / 5G, or wireless communication solutions such as wireless LAN, Bluetooth, and near-field communication. Network adapter 850 can communicate with other modules of electronic device 800 via bus 830.

[0133] The electronic device 800 can display a graphical user interface via a display 860, such as a display interface showing the detection results of the chip tray.

[0134] although Figure 8As not shown in the diagram, other hardware and / or software modules may also be configured in the electronic device 800, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0135] As can be seen from the above, the technical solutions disclosed herein can be implemented as methods, apparatus, systems, computer program products, storage media, electronic devices, etc. Those skilled in the art will understand that various aspects of this disclosure can be specifically implemented in the following forms: a completely hardware implementation, a completely software implementation (including firmware, microcode, etc.), or an implementation combining hardware and software aspects, which may be referred to as "circuit," "module," or "system," respectively.

[0136] It should be understood that this disclosure is not limited to the specific methods, steps, or structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. Those skilled in the art will readily conceive of other embodiments based on the specific implementations provided in this disclosure. Therefore, the specific implementations provided in this disclosure are merely exemplary, and the scope and spirit of this disclosure are indicated by the claims, and should cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary technical means in the art not disclosed in this disclosure.

Claims

1. A method for detecting chip trays, characterized in that, include: The detection beam emitted by the light source is projected onto the chip tray under test through a pre-configured lens; Determine the uniformity of the illumination intensity of the detection beam illuminating the chip tray under test; In response to the light intensity uniformity being less than the light intensity uniformity threshold, the position of the lens relative to the light source is dynamically adjusted until the light intensity uniformity is greater than or equal to the light intensity uniformity threshold. The chip tray detection result of the chip tray to be detected is determined based on the line distribution result of the detection beam on the chip tray to be detected; The step of dynamically adjusting the position of the lens relative to the light source in response to the light intensity uniformity being less than the light intensity uniformity threshold, until the light intensity uniformity is greater than or equal to the light intensity uniformity threshold, includes: In response to the light intensity uniformity being less than the light uniformity threshold, a first position corresponding to the lens is determined; By adjusting the position of the lens, the uniformity index of light intensity corresponding to the lens at different positions is determined; The lens displacement distance corresponding to the lens is determined based on the light intensity uniformity index; Based on the lens displacement distance, the lens is moved from the first position to the second position. When the lens is in the second position, the light intensity uniformity is greater than or equal to the light uniformity threshold. The step of moving the lens from the first position to the second position based on the lens displacement distance includes: Based on the lens displacement distance and the first target position corresponding to the lens at the first moment, the second target position corresponding to the lens at the second moment is determined; Obtain the second actual position of the lens at the second moment; Based on the second target position and the second actual position, determine the position offset difference corresponding to the second moment; Based on the position offset difference corresponding to the second moment, the device control quantity corresponding to the position adjustment device is determined, so as to drive the position adjustment device to dynamically adjust the position of the lens according to the device control quantity.

2. The method according to claim 1, characterized in that, The step of projecting a detection beam emitted from a light source onto the chip tray to be tested via a pre-configured lens includes: Determine the pre-configured beam divergence angle; The detection beam is emitted by the light source based on the beam divergence angle; The detection beam is emitted onto the chip tray to be detected through the lens.

3. The method according to claim 1, characterized in that, Determining the uniformity of light intensity illuminating the chip tray under test by the detection beam includes: The detection beam is distributed on the chip tray under test by a pre-configured light intensity sensor array to obtain multiple first light intensity values. Determine the mean of the first light intensity and the standard deviation of the first light intensity corresponding to multiple first light intensity values; The uniformity of light intensity is determined based on the mean of the first light intensity and the standard deviation of the first light intensity.

4. The method according to claim 1, characterized in that, The step of determining the uniformity index of light intensity at different positions of the lens by adjusting the position of the lens includes: By adjusting the position of the lens, the mean value of the second illumination intensity and the standard deviation of the second illumination intensity corresponding to different positions of the lens are determined; The light intensity uniformity index is determined based on the second average light intensity and the second standard deviation of light intensity.

5. The method according to claim 1, characterized in that, The step of determining the equipment control quantity corresponding to the position adjustment device based on the position offset difference at the second time point includes: Determine the incremental adjustment parameters corresponding to the position adjustment device; Based on the difference between the incremental adjustment parameter and the position offset corresponding to the second time, the incremental control amount of the position adjustment device at the second time compared to the first time is determined; Obtain the first device control quantity corresponding to the position adjustment device at the first moment; Based on the first device control quantity and the incremental control quantity, the second device control quantity corresponding to the position adjustment device at the second moment is determined.

6. The method according to claim 5, characterized in that, The step of determining the incremental control amount of the position adjustment device at the second time compared to the first time based on the difference between the incremental adjustment parameter and the position offset at the second time includes: Obtain the reference position offset value of the lens before the second time moment. The reference position offset value includes the position offset difference of the lens at the first time moment and the position offset difference of the lens at the previous time moment. The incremental control quantity is determined based on the incremental adjustment parameter, the reference position offset value, and the position offset difference corresponding to the second time moment.

7. The method according to claim 5 or 6, characterized in that, The incremental adjustment parameters include one or more of the following: sampling period, proportional coefficient, integral coefficient, and derivative coefficient.

8. The method according to claim 1, characterized in that, The method further includes: Obtain pre-configured lens movement control parameters, which include one or more of the following: maximum movement speed, maximum movement acceleration, positioning accuracy, and movement position limit range; Based on the lens movement control parameters and the device control quantity, the position adjustment device is driven to dynamically adjust the position of the lens.

9. A chip tray detection system, characterized in that, include: The beam focusing module is used to project the detection beam emitted by the light source onto the chip tray to be tested through a lens; A light-sensing detection module is used to collect the light intensity value of the detection beam illuminating the chip tray under test through a light intensity sensor array. The light intensity value is used to determine the uniformity of the light intensity of the detection beam distributed on the chip tray under test. A lens adjustment module is used to adjust the position of the lens relative to the light source according to the light intensity uniformity, until the light intensity uniformity is greater than or equal to the light uniformity threshold. The calculation and control module is used to dynamically adjust the position and optical path parameters of the lens to keep the uniformity of the illumination intensity greater than or equal to the illumination uniformity threshold. The lens adjustment module is further configured to determine the first position corresponding to the lens in response to the light intensity uniformity being less than the light uniformity threshold. By adjusting the position of the lens, the uniformity index of light intensity corresponding to the lens at different positions is determined; The lens displacement distance corresponding to the lens is determined based on the light intensity uniformity index; Based on the lens displacement distance, the lens is moved from the first position to the second position. When the lens is in the second position, the light intensity uniformity is greater than or equal to the light uniformity threshold. The step of moving the lens from the first position to the second position based on the lens displacement distance includes: Based on the lens displacement distance and the first target position corresponding to the lens at the first moment, the second target position corresponding to the lens at the second moment is determined; Obtain the second actual position of the lens at the second moment; Based on the second target position and the second actual position, determine the position offset difference corresponding to the second moment; Based on the position offset difference corresponding to the second moment, the device control quantity corresponding to the position adjustment device is determined, so as to drive the position adjustment device to dynamically adjust the position of the lens according to the device control quantity.

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