Corridor stack section generation method, apparatus and device, and storage medium

Abstract

The invention discloses a corridor stack section generation method and device, equipment and a storage medium, and belongs to the technical field of geophysical exploration. The method includes: acquiring seismic data of an observation well; determining the travel time of each reflection interface of the velocity model under each seismic trace according to the model information and the shot point coordinates and the receiving point coordinates corresponding to each seismic trace; according to the model information, determining the two-way travel time of each reflection interface of the speed model; according to the two-way travel time of each reflection interface and the travel time of each reflection interface under each seismic trace, performing dynamic correction on initial sampling time of sampling points included in each seismic trace to obtain target sampling time after dynamic correction of the sampling points included in each seismic trace; and generating a corridor stack section according to the target sampling time of the sampling points included in each seismic trace. And the generated corridor stacking section is more matched with the well track of the observation well.

Description

Technical Field

[0001] This application relates to the field of geophysical exploration technology, and in particular to a method, apparatus, device, and storage medium for generating corridor overlay profiles. Background Technology

[0002] With the continuous development of geophysical exploration technology, more and more seismic data from observation wells are available. Corridor overlay profiles can be generated from the acquired seismic data to obtain the structure of the subsurface medium at the location of the observation well.

[0003] In related technologies, the upwaves are aligned by multiplying their travel time by 2 and then subtracting the arrival time of the downwaves. The corridor overlay profile is then obtained by accumulating and summing the data of the aligned upwaves within a given time window.

[0004] However, the corridor overlay profile generated in the above manner differs significantly from the actual trajectory of the observation well, resulting in poor accuracy of the obtained subsurface medium structure. Summary of the Invention

[0005] This application provides a method, apparatus, device, and storage medium for generating corridor overlay profiles, which can be used to solve the problem in related technologies where the generated corridor overlay profiles differ significantly from the actual trajectories of observation wells, resulting in poor accuracy of the obtained subsurface medium structure. The technical solution is as follows:

[0006] On one hand, embodiments of this application provide a method for generating a corridor overlay profile, the method comprising:

[0007] Seismic data from observation wells are acquired, including model information of the velocity model, the coordinates of the shot point and receiver point corresponding to each seismic trace, and the initial sampling time of the sampling points included in each seismic trace.

[0008] Based on the model information, the shot point coordinates and receiver coordinates corresponding to each seismic trace, the travel time of each reflection interface of the velocity model under each seismic trace is determined. The travel time of any reflection interface under any seismic trace is used to indicate the time required from the shot point corresponding to any seismic trace to the receiver point corresponding to any seismic trace via the reflection interface.

[0009] Based on the model information, the two-way travel time of each reflection interface of the velocity model is determined. The two-way travel time of any reflection interface is used to indicate the time required from the any reflection interface to the ground surface and then from the ground surface to the any reflection interface.

[0010] Based on the two-way travel time of each reflecting interface and the travel time of each reflecting interface under each seismic trace, the initial sampling time of the sampling points included in each seismic trace is dynamically corrected to obtain the target sampling time of the sampling points included in each seismic trace after dynamic correction.

[0011] Based on the target sampling time of the sampling points included in each seismic trace, a corridor overlay profile is generated, which is used to reflect the structure of the subsurface medium at the location of the observation well.

[0012] In one possible implementation, determining the travel time of each reflection interface of the velocity model under each seismic trace, based on the model information, the shot point coordinates and receiver point coordinates corresponding to each seismic trace, includes:

[0013] Based on the model information, the shot point coordinates and receiver coordinates corresponding to each seismic trace, the ray parameters of each reflection interface of the velocity model under each seismic trace are determined.

[0014] Based on the model information and the ray parameters of each reflection interface of the velocity model under each seismic trace, the travel time of each reflection interface of the velocity model under each seismic trace is determined.

[0015] In one possible implementation, determining the ray parameters of each reflection interface of the velocity model under each seismic trace based on the model information, the shot point coordinates and receiver point coordinates corresponding to each seismic trace, includes:

[0016] Based on the shot point coordinates and receiver point coordinates of each seismic trace, determine the horizontal distance from the shot point to the receiver point of each seismic trace.

[0017] Based on the model information and the horizontal distance from the shot point to the receiver point of each seismic trace, the ray parameters of each reflection interface of the velocity model under each seismic trace are determined.

[0018] In one possible implementation, determining the two-way travel time of each reflecting interface of the velocity model based on the model information includes:

[0019] For any reflecting interface in the velocity model, the two-way travel time of any reflecting interface of the velocity model is determined based on the model information and the number of model layers traversed from the reflecting interface to the top surface of the velocity model.

[0020] In one possible implementation, the model information includes at least one of the thickness of each layer of the velocity model, the vertical velocity of each layer of the velocity model, or the velocity anisotropy coefficient of each layer of the velocity model.

[0021] In one possible implementation, the step of dynamically correcting the initial sampling time of the sampling points included in each seismic trace based on the two-way travel time of each reflecting interface and the travel time of each reflecting interface under each seismic trace, to obtain the dynamically corrected target sampling time of the sampling points included in each seismic trace, includes:

[0022] Based on the two-way travel time of each reflective interface, the travel time of each reflective interface under each seismic trace, and the initial sampling time of the sampling points included in each seismic trace, the dynamic correction time of the sampling points included in each seismic trace is determined.

[0023] Based on the initial sampling time and dynamic correction time of the sampling points included in each seismic trace, the target sampling time after dynamic correction for the sampling points included in each seismic trace is determined.

[0024] In one possible implementation, determining the dynamic correction time of the sampling points included in each seismic trace based on the two-way travel time of each reflecting interface, the travel time of each reflecting interface under each seismic trace, and the initial sampling time of the sampling points included in each seismic trace includes:

[0025] For any sampling point included in any seismic trace, the dynamic correction time of any sampling point is determined based on the two-way travel time of the reflecting interface adjacent to the sampling point, the travel time of the reflecting interface adjacent to the sampling point under any seismic trace, and the initial sampling time of the sampling point.

[0026] In one possible implementation, determining the target sampling time after dynamic correction for the sampling points included in each seismic trace, based on the initial sampling time and the dynamic correction time of the sampling points included in each seismic trace, includes:

[0027] For any sampling point included in any seismic trace, the sum of the initial sampling time and the dynamic correction time of any sampling point included in any seismic trace is determined to be the target sampling time after dynamic correction for any sampling point included in any seismic trace.

[0028] In one possible implementation, the generation of a corridor overlay profile based on the target sampling time of the sampling points included in each seismic trace, the corridor overlay profile being used to reflect the structure of the subsurface medium at the location of the observation well, includes:

[0029] Based on the target sampling time of the sampling points included in each seismic trace, a dynamic correction record of the vertical seismic profile is generated. The dynamic correction record of the vertical seismic profile is used to reflect the structure of the subsurface medium at the location of the observation well, and the dynamic correction record of the vertical seismic profile includes multiple noise and random noise.

[0030] According to the corridor cut-off time window parameters, the dynamic correction record of the vertical seismic profile is subjected to corridor cut-off to obtain a corridor profile. The corridor profile is used to reflect the structure of the subsurface medium at the location of the observation well, and the corridor profile includes random noise.

[0031] The corridor cross-sectional view is mapped to obtain the corridor overlay cross-sectional view.

[0032] In one possible implementation, the mapping process of the corridor cross-sectional view to obtain the corridor overlay cross-sectional view includes:

[0033] Based on the coordinates of the receiving point corresponding to each seismic trace and the coordinates of the wellhead of the observation well, the projection distance and azimuth angle corresponding to each seismic trace are determined. The projection distance corresponding to any seismic trace is the projection distance on the horizontal plane from the receiving point of any seismic trace to the wellhead of the observation well. The azimuth angle of any seismic trace is the angle between the line connecting the projection of the receiving point of any seismic trace on the horizontal plane and the wellhead of the observation well and the east coordinate.

[0034] Based on the projection distance and azimuth angle corresponding to each seismic trace, the projection distance of each seismic trace mapped onto the target vertical plane is determined, where the target vertical plane is the vertical plane where the projection plane of the target azimuth angle is located.

[0035] Based on the projection distance of each seismic trace onto the target vertical plane, the corridor profile is mapped onto the vertical plane to obtain the corridor overlay profile.

[0036] On the other hand, embodiments of this application provide an apparatus for generating corridor overlay profiles, the apparatus comprising:

[0037] The acquisition module is used to acquire seismic data from observation wells. The seismic data includes model information of the velocity model, the coordinates of the shot point and receiver point corresponding to each seismic trace, and the initial sampling time of the sampling points included in each seismic trace.

[0038] The determination module is used to determine the travel time of each reflection interface of the velocity model under each seismic trace based on the model information, the shot point coordinates and receiver point coordinates corresponding to each seismic trace, and the travel time of any reflection interface under any seismic trace is used to indicate the time required from the shot point corresponding to any seismic trace to the receiver point corresponding to any seismic trace via the any reflection interface.

[0039] The determining module is further configured to determine the two-way travel time of each reflection interface of the velocity model based on the model information. The two-way travel time of any reflection interface is used to indicate the time required from the any reflection interface to the ground surface and then from the ground surface to the any reflection interface.

[0040] The dynamic correction module is used to dynamically correct the initial sampling time of the sampling points included in each seismic trace based on the two-way travel time of each reflection interface and the travel time of each reflection interface under each seismic trace, so as to obtain the target sampling time of the sampling points included in each seismic trace after dynamic correction.

[0041] The generation module is used to generate a corridor overlay profile based on the target sampling time of the sampling points included in each seismic trace. The corridor overlay profile is used to reflect the structure of the subsurface medium at the location of the observation well.

[0042] In one possible implementation, the determining module is configured to determine the ray parameters of each reflection interface of the velocity model under each seismic trace based on the model information, the shot point coordinates and receiver point coordinates corresponding to each seismic trace; and to determine the travel time of each reflection interface of the velocity model under each seismic trace based on the model information and the ray parameters of each reflection interface of the velocity model under each seismic trace.

[0043] In one possible implementation, the determining module is configured to determine the horizontal distance from the shot point to the receiver point of each seismic trace based on the shot point coordinates and receiver point coordinates of each seismic trace; and to determine the ray parameters of each reflection interface of the velocity model under each seismic trace based on the model information and the horizontal distance from the shot point to the receiver point of each seismic trace.

[0044] In one possible implementation, the determining module is configured to determine, for any reflective interface in the velocity model, the two-way travel time of any reflective interface of the velocity model based on the model information and the number of model layers traversed from the any reflective interface to the top surface of the velocity model.

[0045] In one possible implementation, the model information includes at least one of the thickness of each layer of the velocity model, the vertical velocity of each layer of the velocity model, or the velocity anisotropy coefficient of each layer of the velocity model.

[0046] In one possible implementation, the dynamic correction module is configured to determine the dynamic correction time of the sampling points included in each seismic trace based on the two-way travel time of each reflective interface, the travel time of each reflective interface under each seismic trace, and the initial sampling time of the sampling points included in each seismic trace; and to determine the target sampling time after dynamic correction of the sampling points included in each seismic trace based on the initial sampling time of the sampling points included in each seismic trace and the dynamic correction time of the sampling points included in each seismic trace.

[0047] In one possible implementation, the dynamic correction module is used to determine the dynamic correction time of any sampling point for any sampling point included in any seismic trace, based on the two-way travel time of the reflecting interface adjacent to the sampling point, the travel time of the reflecting interface adjacent to the sampling point under the any seismic trace, and the initial sampling time of the sampling point.

[0048] In one possible implementation, the dynamic correction module is configured to, for any sampling point included in any seismic trace, determine the sum between the initial sampling time and the dynamic correction time of any sampling point included in any seismic trace as the target sampling time after dynamic correction for any sampling point included in any seismic trace.

[0049] In one possible implementation, the generation module is configured to generate a dynamic correction record of a vertical seismic profile based on the target sampling time of the sampling points included in each seismic trace. The dynamic correction record of the vertical seismic profile is used to reflect the structure of the subsurface medium at the location of the observation well, and the dynamic correction record of the vertical seismic profile includes multiple noise and random noise. Corridor cutting is performed on the dynamic correction record of the vertical seismic profile according to corridor cutting time window parameters to obtain a corridor profile map. The corridor profile map is used to reflect the structure of the subsurface medium at the location of the observation well, and the corridor profile map includes random noise. The corridor profile map is then mapped to obtain a corridor overlay profile map.

[0050] In one possible implementation, the generation module is configured to determine the projection distance and azimuth of each seismic trace based on the coordinates of the receiving point corresponding to each seismic trace and the wellhead coordinates of the observation well. The projection distance of any seismic trace is the projection distance on the horizontal plane from the receiving point of any seismic trace to the wellhead of the observation well. The azimuth of any seismic trace is the angle between the line connecting the projection of the receiving point of any seismic trace on the horizontal plane and the wellhead of the observation well and the east coordinate. Based on the projection distance and azimuth of each seismic trace, the module determines the projection distance of each seismic trace onto a target vertical plane, where the target vertical plane is the vertical plane where the projection plane of the target azimuth is located. Based on the projection distance of each seismic trace onto the target vertical plane, the module maps the corridor profile onto the vertical plane to obtain the corridor overlay profile.

[0051] On the other hand, embodiments of this application provide a computer device, the computer device including a processor and a memory, the memory storing at least one piece of program code, the at least one piece of program code being loaded and executed by the processor, so that the computer device implements any of the above-described methods for generating corridor overlay profiles.

[0052] On the other hand, a computer-readable storage medium is also provided, wherein at least one piece of program code is stored in the computer-readable storage medium, the at least one piece of program code being loaded and executed by a processor to enable a computer to implement the method for generating corridor overlay profiles as described above.

[0053] On the other hand, a computer program or computer program product is also provided, wherein the computer program or computer program product stores at least one computer instruction, which is loaded and executed by a processor to enable the computer to implement any of the above-described methods for generating corridor overlay profiles.

[0054] The technical solution provided in this application has at least the following beneficial effects:

[0055] The technical solution provided in this application determines the two-way travel time of each reflection interface of the velocity model and the travel time of each reflection interface under each seismic trace based on the model information of the velocity model, the shot point coordinates and receiver coordinates of each seismic trace of the observation well, and the initial sampling time of the sampling points included in each seismic trace. Then, based on the two-way travel time of each reflection interface of the velocity model and the travel time of each reflection interface under each seismic trace, dynamic correction is performed on each sampling point included in each seismic trace. A corridor overlay profile is generated based on the sampling time of each sampling point after dynamic correction. This generated corridor overlay profile matches the well trajectory of the observation well, thereby enabling the acquisition of a more realistic understanding of the subsurface medium structure at the location of the observation well and improving the accuracy of seismic exploration. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] Figure 1 This is a schematic diagram of the implementation environment for a method for generating a corridor overlay profile provided in an embodiment of this application;

[0058] Figure 2 This is a flowchart of a method for generating a corridor overlay profile provided in an embodiment of this application;

[0059] Figure 3 This is a schematic diagram of a velocity model provided in an embodiment of this application;

[0060] Figure 4 This is a schematic diagram showing a VSP record provided in an embodiment of this application;

[0061] Figure 5 This is a schematic diagram of a dynamic correction record of a vertical seismic profile provided in an embodiment of this application;

[0062] Figure 6 This is a schematic diagram of a corridor cross-section provided in an embodiment of this application;

[0063] Figure 7 This is a schematic diagram of a corridor overlay section provided in an embodiment of this application;

[0064] Figure 8 This is a schematic diagram of the structure of a device for generating a corridor overlay profile according to an embodiment of this application;

[0065] Figure 9This is a schematic diagram of the structure of a terminal device provided in an embodiment of this application;

[0066] Figure 10 This is a schematic diagram of the structure of a server provided in an embodiment of this application. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0068] It should be noted that the terms "first," "second," etc., used in this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0069] Figure 1 This is a schematic diagram illustrating the implementation environment of a method for generating a corridor overlay profile provided in this application embodiment, such as... Figure 1 As shown, the implementation environment includes a computer device 101, which can be a terminal device or a server; this embodiment does not limit the specific type of device. The computer device 101 is used to execute the corridor overlay profile generation method provided in this embodiment.

[0070] Optionally, computer device 101 is a terminal device. A terminal device can be any electronic device that allows human-computer interaction with a user through one or more methods such as a keyboard, touchpad, remote control, voice interaction, or handwriting device. Examples include PCs (Personal Computers), mobile phones, smartphones, PDAs (Personal Digital Assistants), wearable devices, PPCs (Pocket PCs), tablets, smart car systems, smart TVs, smart speakers, and smartwatches.

[0071] A terminal device can refer to one of multiple terminal devices; this embodiment uses only one terminal device as an example. Those skilled in the art will understand that the number of terminal devices can be more or less. For example, there may be only one terminal device, or there may be dozens or hundreds, or even more. This application embodiment does not limit the number or type of terminal devices.

[0072] When computer device 101 is a server, the server can be a single server, a server cluster consisting of multiple servers, or any of the following: a cloud computing platform or a virtualization center. This application embodiment does not limit this. The server and terminal devices communicate via a wired or wireless network. The server has data receiving, data processing, and data sending functions. Of course, the server may also have other functions, which this application embodiment does not limit.

[0073] Those skilled in the art should understand that the above-described terminal devices and servers are merely illustrative examples. Other existing or future terminal devices or servers that are applicable to this application should also be included within the scope of protection of this application, and are hereby incorporated by reference.

[0074] This application provides a method for generating a corridor overlay profile, which can be applied to the above-mentioned... Figure 1 The implementation environment shown is as follows: Figure 2 The flowchart shown in this application embodiment illustrates a method for generating a corridor overlay profile. This method can be achieved by... Figure 1 The computer device 101 in the middle performs the operation. For example... Figure 2 As shown, the method includes the following steps 201 to 205.

[0075] In step 201, seismic data from the observation wells are acquired. The seismic data includes model information of the velocity model, the coordinates of the shot point and receiver point corresponding to each seismic trace, and the initial sampling time of the sampling points included in each seismic trace.

[0076] In one possible implementation, the model information of the velocity model includes the thickness of each layer of the velocity model, the vertical velocity of each layer of the velocity model, or the velocity anisotropy coefficient of each layer of the velocity model.

[0077] like Figure 3 This is a schematic diagram of a speed model provided in an embodiment of this application. Figure 3 The velocity model shown consists of four layers. The vertical velocity of the first layer is 2000 m / s, the second layer is 3000 m / s, the third layer is 4000 m / s, and the fourth layer is 5000 m / s. The thickness and velocity anisotropy coefficient of each layer will not be described in detail here.

[0078] In one possible implementation, the shot point coordinates and receiver coordinates corresponding to each seismic trace can be placed at the corresponding trace head. The shot point coordinates and receiver coordinates corresponding to any seismic trace include horizontal axis coordinates, vertical axis coordinates, and y-axis coordinates. For example, the horizontal axis is the X-axis, the vertical axis is the Y-axis, and the y-axis is the Z-axis. For instance, the shot point coordinates corresponding to any seismic trace are S(X... SX S Z S ), the coordinates of the receiver point corresponding to any seismic trace are G(X). G Y G Z G The coordinates of the shot points and receiver points corresponding to other seismic traces will not be described here.

[0079] Optionally, a velocity model can be used to generate VSP (Vertical Seismic Profile) records based on the shot point coordinates and receiver point coordinates corresponding to each seismic trace. For example... Figure 4 This is a schematic diagram showing a VSP record provided in an embodiment of this application.

[0080] In step 202, based on the model information, the shot point coordinates and receiver coordinates corresponding to each seismic trace, the travel time of each reflection interface of the velocity model under each seismic trace is determined. The travel time of any reflection interface under any seismic trace is used to indicate the time required to travel from the shot point corresponding to any seismic trace to the receiver point corresponding to any seismic trace via any reflection interface.

[0081] In one possible implementation, the process of determining the travel time of each reflection interface of the velocity model under each seismic trace, based on model information, the shot point coordinates and receiver coordinates corresponding to each seismic trace, includes: determining the ray parameters of each reflection interface of the velocity model under each seismic trace based on model information, the shot point coordinates and receiver coordinates corresponding to each seismic trace; determining the travel time of each reflection interface of the velocity model under each seismic trace based on model information and the ray parameters of each reflection interface of the velocity model under each seismic trace, wherein the travel time of any reflection interface under any seismic trace is used to indicate the time required from the shot point of any seismic trace to the receiver point of any seismic trace via any reflection interface.

[0082] The process of determining the ray parameters of each reflection interface of the velocity model under each seismic trace, based on model information, the shot point coordinates and receiver coordinates corresponding to each seismic trace, includes: determining the horizontal distance from the shot point to the receiver point of each seismic trace based on the shot point coordinates and receiver coordinates of each seismic trace; and determining the ray parameters of each reflection interface of the velocity model under each seismic trace based on model information and the horizontal distance from the shot point to the receiver point of each seismic trace.

[0083] Optionally, the process of determining the horizontal distance from the shot point to the receiver point of each seismic trace based on the shot point coordinates and receiver point coordinates of each seismic trace is similar. This embodiment of the application only uses the example of determining the horizontal distance from the shot point to the receiver point of any seismic trace based on the shot point coordinates and receiver point coordinates of any given seismic trace for illustration. For example, the horizontal distance L from the shot point to the receiver point of any given seismic trace is determined according to the following formula (1) based on the shot point coordinates and receiver point coordinates of any given seismic trace.

[0084]

[0085] In the above formula (1), X G Let X be the x-axis coordinate of the receiver point corresponding to any seismic trace. S Let Y be the x-axis coordinate of the shot point corresponding to any seismic trace. G Let Y be the ordinate of the receiver point corresponding to any seismic trace. S Let be the ordinate of the shot point corresponding to any seismic trace.

[0086] In one possible implementation, the process of determining the ray parameters of each reflection interface of the velocity model under each seismic trace based on model information and the horizontal distance from the shot point to the receiver point of each seismic trace is similar. This application embodiment only takes the determination of the ray parameters of each reflection interface of the velocity model under any seismic trace based on model information and the horizontal distance from the shot point to the receiver point of any seismic trace as an example for illustration.

[0087] Optionally, based on the model information and the horizontal distance from the shot point to the receiver point of any seismic trace, the ray parameter P of each reflection interface of the velocity model under any seismic trace is determined according to the following formula (2).

[0088]

[0089] In the above formula (2), k is the layer number of the velocity model traversed from the shot point of any seismic trace through any reflecting interface to the receiver point of any seismic trace, and n srg H represents the model layer number of the velocity model, k0 is the layer number of the velocity model where the shot point of any seismic trace is located, and H represents the model layer number of the velocity model. k Let V be the thickness of the k-th layer in the velocity model. k Let A be the vertical velocity of the k-th layer in the velocity model. k Let L be the velocity anisotropy coefficient of the k-th layer of the velocity model, and L be the horizontal distance from the shot point of any seismic trace to the receiver point of any seismic trace.

[0090] By solving formula (2) using the bisection method for solving nonlinear equations, the ray parameters of any reflection interface of the velocity model under any seismic trace can be obtained.

[0091] After determining the ray parameters of each reflection interface of the velocity model under each seismic trace, the travel time of each reflection interface of the velocity model under each seismic trace is determined based on the model information and the ray parameters of each reflection interface of the velocity model under each seismic trace. Optionally, the travel time t of any reflection interface of the velocity model under any seismic trace is determined according to the astaxanthin formula (3) based on the model information and the ray parameters of any reflection interface of the velocity model under any seismic trace.

[0092]

[0093] In the above formula (3), k is the layer number of the velocity model traversed from the shot point of any seismic trace through any reflecting interface to the receiver point of any seismic trace, and n srg H represents the model layer number of the velocity model, k0 is the layer number of the velocity model where the shot point of any seismic trace is located, and H represents the model layer number of the velocity model. k Let V be the thickness of the k-th layer in the velocity model. k Let A be the vertical velocity of the k-th layer in the velocity model. k Let P be the velocity anisotropy coefficient of the k-th layer of the velocity model, and let P be the ray parameter of any reflecting interface under any seismic trace.

[0094] In step 203, based on the model information, the two-way travel time of each reflection interface of the velocity model is determined. The two-way travel time of any reflection interface is used to indicate the time required to travel from any reflection interface to the ground surface and then from the ground surface to any reflection interface.

[0095] In one possible implementation, the process of determining the two-way travel time of each reflecting interface in the velocity model is similar. This application embodiment only uses the process of determining the two-way travel time of any reflecting interface in the velocity model as an example for illustration.

[0096] Optionally, for any reflecting interface in the velocity model, the two-way travel time of any reflecting interface of the velocity model is determined based on the model information and the number of model layers traversed from any reflecting interface to the top surface of the velocity model.

[0097] For example, the two-way travel time T of any reflection interface of the velocity model is determined according to the following formula (4) based on the model information and the number of model layers traversed from any reflection interface to the top surface of the velocity model.

[0098]

[0099] In the above formula (4), nr H represents the number of model layers traversed from any reflecting interface to the top surface of the velocity model. k Let V be the thickness of the k-th layer in the velocity model. k Let be the vertical velocity of the k-th layer in the velocity model.

[0100] In step 204, based on the two-way travel time of each reflecting interface and the travel time of each reflecting interface under each seismic trace, the initial sampling time of the sampling points included in each seismic trace is dynamically corrected to obtain the target sampling time of the sampling points included in each seismic trace after dynamic correction.

[0101] In one possible implementation, the process of dynamically correcting the initial sampling time of the sampling points included in each seismic trace based on the two-way travel time of each reflecting interface and the travel time of each reflecting interface under each seismic trace, to obtain the target sampling time of the sampling points included in each seismic trace after dynamic correction, includes: determining the dynamic correction time of the sampling points included in each seismic trace based on the two-way travel time of each reflecting interface, the travel time of each reflecting interface under each seismic trace, and the initial sampling time of the sampling points included in each seismic trace; and determining the target sampling time of the sampling points included in each seismic trace after dynamic correction based on the initial sampling time of the sampling points included in each seismic trace and the dynamic correction time of the sampling points included in each seismic trace.

[0102] Optionally, for any sampling point included in any seismic trace, the dynamic correction time of any sampling point is determined based on the two-way travel time of the reflecting interface adjacent to the sampling point, the travel time of the reflecting interface adjacent to the sampling point under any seismic trace, and the initial sampling time of the sampling point.

[0103] The reflective interface adjacent to any sampling point includes a first reflective interface and a second reflective interface. The first reflective interface is the reflective interface adjacent to any sampling point and above any sampling point, and the second reflective interface is the reflective interface adjacent to any sampling point and below any sampling point.

[0104] For example, the dynamic correction time of any sampling point is determined according to the following formula (5) based on the two-way travel time of the reflecting interface adjacent to any sampling point, the travel time of the reflecting interface adjacent to any sampling point under any seismic trace, and the initial sampling time of any sampling point.

[0105]

[0106] In the above formula (5), Δt j Let t be the dynamic correction time of the j-th sampling point in any seismic trace. jLet T be the initial sampling time of the j-th sampling point in any seismic trace. m For a two-way trip to the reflection interface adjacent to the j-th sampling point in any seismic trace and above the j-th sampling point, T m-1 For a two-way trip to the reflection interface adjacent to the j-th sampling point in any seismic trace and below the j-th sampling point, t m Let t be the travel time of the reflection interface adjacent to and above the j-th sampling point in any seismic trace under any seismic trace. m-1 The travel time of the reflection interface adjacent to and below the j-th sampling point in any seismic trace under any seismic trace.

[0107] In one possible implementation, after determining the dynamic correction time of the sampling points included in each seismic trace, for any sampling point included in any seismic trace, the sum of the initial sampling time and the dynamic correction of any sampling point included in any seismic trace is determined to be the target sampling time after the dynamic correction of any sampling point included in any seismic trace.

[0108] In step 205, a corridor overlay profile is generated based on the target sampling time of the sampling points included in each seismic trace. The corridor overlay profile is used to reflect the structure of the subsurface medium at the location of the observation well.

[0109] In one possible implementation, after obtaining the target sampling time for each sampling point included in each seismic trace, a dynamic correction record of the vertical seismic profile is generated based on the target sampling time of the sampling points included in each seismic trace. This dynamic correction record reflects the subsurface structure at the location of the observation well and includes multiple noise and random noise. According to the corridor cut-off time window parameters, corridor cut-off is performed on the dynamic correction record of the vertical seismic profile to obtain a corridor profile map. This corridor profile map reflects the subsurface structure at the location of the observation well and includes random noise. The corridor profile map is then mapped to obtain a corridor overlay profile map.

[0110] like Figure 5 This is a schematic diagram of a dynamic correction record of a vertical seismic profile provided in an embodiment of this application.

[0111] Optionally, the corridor removal time window parameter is set based on experience or adjusted according to the implementation environment; this embodiment of the application does not limit this. For example, the corridor removal time window parameter is 200 milliseconds.

[0112] The process of performing corridor cut-off on the dynamic correction records of the vertical seismic profile according to the corridor cut-off time window parameters to obtain a corridor profile includes: according to the corridor cut-off time window parameters, using the first arrival time of the dynamic correction records of the vertical seismic profile as the baseline, performing corridor cut-off on the dynamic correction records of the vertical seismic profile to obtain a corridor profile. For example... Figure 6 This is a schematic diagram of a corridor cross-section provided in an embodiment of this application.

[0113] In one possible implementation, the process of mapping the corridor profile to obtain the corridor overlay profile includes: determining the projection distance and azimuth of each seismic trace based on the coordinates of the receiver point and the wellhead coordinates of each seismic trace, wherein the projection distance of any seismic trace is the projection distance of the distance from the receiver point of any seismic trace to the wellhead on the horizontal plane, and the azimuth of any seismic trace is the angle between the line connecting the projection of the receiver point of any seismic trace on the horizontal plane and the wellhead of the well and the east coordinate; determining the projection distance of each seismic trace onto the target vertical plane based on the projection distance and azimuth of each seismic trace, wherein the target vertical plane is the vertical plane on which the projection plane of the target azimuth is located; and mapping the corridor profile onto the vertical plane based on the projection distance of each seismic trace onto the target vertical plane to obtain the corridor overlay profile.

[0114] Optionally, the wellhead coordinates of the observation well are W(X) W Y W Z W The process of determining the projected distance and azimuth of each seismic trace based on the coordinates of the receiving point and the wellhead coordinates of the observation well is similar. This application embodiment only uses the process of determining the projected distance and azimuth of any seismic trace based on the coordinates of the receiving point and the wellhead coordinates of any seismic trace as an example for illustration.

[0115] Optionally, the projected distance R corresponding to any seismic trace can be determined according to the following formula (6) based on the coordinates of the receiving point and the wellhead coordinates of any seismic trace.

[0116]

[0117] In the above formula (6), X G Y represents the x-axis coordinate of the receiver point corresponding to any seismic trace. G X represents the ordinate of the receiver point corresponding to any seismic trace. W Y is the horizontal axis coordinate of the wellhead of the observation well. W This represents the vertical coordinate of the wellhead of the observation well.

[0118] Based on the coordinates of the receiving point and the wellhead coordinates of any seismic trace, the azimuth β corresponding to any seismic trace is determined according to the following formula (7).

[0119] β=atan [(Y G -Y W ) / (X G -X W )] Formula (7)

[0120] In the above formula (7), Y G Let Y be the ordinate of the receiver point corresponding to any seismic trace. W X represents the vertical coordinate of the wellhead of the observation well. G Let X be the x-axis coordinate of the receiver point corresponding to any seismic trace. W denoted as the x-axis coordinate of the wellhead, and 'a' as a coefficient.

[0121] In one possible implementation, the target azimuth angle is set based on experience or adjusted according to the implementation environment; this application embodiment does not limit this. For example, the target azimuth angle is α.

[0122] The process of determining the projected distance of each seismic trace mapped onto the target vertical plane based on the projected distance and azimuth angle corresponding to each seismic trace is similar. This embodiment only uses the example of determining the projected distance of any seismic trace mapped onto the target vertical plane based on the projected distance and azimuth angle corresponding to any seismic trace for illustration. Optionally, the projected distance R of any seismic trace mapped onto the target vertical plane can be determined according to the following formula (8) based on the projected distance and azimuth angle corresponding to any seismic trace. ′ .

[0123] R ′ =Rcos(α-β) Formula (8)

[0124] In the above formula (8), R is the projected distance corresponding to any seismic trace, β is the azimuth angle corresponding to any seismic trace, and α is the target azimuth angle.

[0125] In one possible implementation, the corridor profile is mapped onto the corresponding time-space location of the vertical plane containing the projection plane with the target azimuth angle, and the corridor amplitude values ​​at the same time are superimposed to obtain a superimposed corridor profile on a two-dimensional time-space plane. For example... Figure 7 This is a schematic diagram of a corridor overlay section provided in an embodiment of this application. Figure 7 The left side of the image shows a superimposed cross-sectional view of the corridor obtained using conventional methods. Figure 7The right side of the image shows a corridor overlay profile obtained using the method provided in this application embodiment. It can be seen that the reflected waves near the initial arrival point are mapped to the temporal and spatial locations corresponding to the observation well trajectory using the method provided in this application embodiment, which can more realistically reflect the structure of the underground medium.

[0126] The above method determines the two-way travel time of each reflection interface of the velocity model and the travel time of each reflection interface under each seismic trace based on the model information of the velocity model, the shot point coordinates, the receiver coordinates, and the initial sampling time of each sampling point included in each seismic trace. Then, based on the two-way travel time of each reflection interface of the velocity model and the travel time of each reflection interface under each seismic trace, dynamic correction is performed on each sampling point included in each seismic trace. Based on the sampling time of each sampling point after dynamic correction, a corridor overlay profile is generated. The generated corridor overlay profile matches the well trajectory of the observation well, thereby obtaining a more realistic subsurface structure at the location of the observation well and improving the accuracy of seismic exploration.

[0127] Figure 8 The diagram shown is a structural schematic of a corridor overlay profile generation device provided in an embodiment of this application. Figure 8 As shown, the device includes:

[0128] The acquisition module 801 is used to acquire seismic data from observation wells. The seismic data includes model information of the velocity model, the coordinates of the shot point and receiver point corresponding to each seismic trace, and the initial sampling time of the sampling points included in each seismic trace.

[0129] The determination module 802 is used to determine the travel time of each reflection interface of the velocity model under each seismic trace based on the model information, the shot point coordinates and receiver point coordinates corresponding to each seismic trace. The travel time of any reflection interface under any seismic trace is used to indicate the time required to travel from the shot point corresponding to any seismic trace to the receiver point corresponding to any seismic trace via any reflection interface.

[0130] The determination module 802 is also used to determine the two-way travel time of each reflection interface of the velocity model based on the model information. The two-way travel time of any reflection interface is used to indicate the time required to travel from any reflection interface to the ground surface and then from the ground surface to any reflection interface.

[0131] The dynamic correction module 803 is used to dynamically correct the initial sampling time of the sampling points included in each seismic trace based on the two-way travel time of each reflection interface and the travel time of each reflection interface under each seismic trace, so as to obtain the target sampling time of the sampling points included in each seismic trace after dynamic correction.

[0132] The generation module 804 is used to generate a corridor overlay profile based on the target sampling time of the sampling points included in each seismic trace. The corridor overlay profile is used to reflect the structure of the subsurface medium at the location of the observation well.

[0133] In one possible implementation, the determining module 802 is used to determine the ray parameters of each reflection interface of the velocity model under each seismic trace based on the model information, the shot point coordinates and receiver point coordinates corresponding to each seismic trace; and to determine the travel time of each reflection interface of the velocity model under each seismic trace based on the model information and the ray parameters of each reflection interface of the velocity model under each seismic trace.

[0134] In one possible implementation, the determination module 802 is used to determine the horizontal distance from the shot point to the receiver point of each seismic trace based on the shot point coordinates and receiver point coordinates of each seismic trace; and to determine the ray parameters of each reflection interface of the velocity model under each seismic trace based on the model information and the horizontal distance from the shot point to the receiver point of each seismic trace.

[0135] In one possible implementation, the determining module 802 is used to determine the two-way travel time of any reflecting interface in the velocity model, based on model information and the number of model layers traversed from any reflecting interface to the top surface of the velocity model.

[0136] In one possible implementation, the model information includes at least one of the following: the thickness of each layer of the velocity model, the vertical velocity of each layer of the velocity model, or the velocity anisotropy coefficient of each layer of the velocity model.

[0137] In one possible implementation, the dynamic correction module 803 is used to determine the dynamic correction time of the sampling points included in each seismic trace based on the two-way travel time of each reflective interface, the travel time of each reflective interface under each seismic trace, and the initial sampling time of the sampling points included in each seismic trace; and to determine the target sampling time after dynamic correction of the sampling points included in each seismic trace based on the initial sampling time of the sampling points included in each seismic trace and the dynamic correction time of the sampling points included in each seismic trace.

[0138] In one possible implementation, the dynamic correction module 803 is used to determine the dynamic correction time of any sampling point for any sampling point included in any seismic trace, based on the two-way travel time of the reflecting interface adjacent to the sampling point, the travel time of the reflecting interface adjacent to the sampling point under any seismic trace, and the initial sampling time of the sampling point.

[0139] In one possible implementation, the dynamic correction module 803 is used to determine, for any sampling point included in any seismic trace, the sum between the initial sampling time and the dynamic correction time of any sampling point included in any seismic trace is the target sampling time after dynamic correction for any sampling point included in any seismic trace.

[0140] In one possible implementation, the generation module 804 is used to generate a dynamic correction record of the vertical seismic profile based on the target sampling time of the sampling points included in each seismic trace. The dynamic correction record of the vertical seismic profile is used to reflect the structure of the subsurface medium at the location of the observation well, and includes multiple noise and random noise. According to the corridor cutting time window parameters, the dynamic correction record of the vertical seismic profile is subjected to corridor cutting to obtain a corridor profile map. The corridor profile map is used to reflect the structure of the subsurface medium at the location of the observation well, and includes random noise. The corridor profile map is then mapped to obtain a corridor overlay profile map.

[0141] In one possible implementation, the generation module 804 is used to determine the projection distance and azimuth of each seismic trace based on the coordinates of the receiving point and the wellhead coordinates of each seismic trace. The projection distance of any seismic trace is the projection distance of the distance from the receiving point of any seismic trace to the wellhead on the horizontal plane, and the azimuth of any seismic trace is the angle between the line connecting the projection of the receiving point of any seismic trace on the horizontal plane and the wellhead of the observation well and the east coordinate. Based on the projection distance and azimuth of each seismic trace, the projection distance of each seismic trace mapped onto the target vertical plane is determined, and the target vertical plane is the vertical plane where the projection plane of the target azimuth is located. Based on the projection distance of each seismic trace mapped onto the target vertical plane, the corridor profile is mapped onto the vertical plane to obtain the corridor overlay profile.

[0142] The aforementioned device determines the two-way travel time of each reflection interface of the velocity model and the travel time of each reflection interface under each seismic trace based on the model information of the velocity model, the coordinates of the shot point and receiver point of each seismic trace of the observation well, and the initial sampling time of the sampling points included in each seismic trace. Then, based on the two-way travel time of each reflection interface of the velocity model and the travel time of each reflection interface under each seismic trace, dynamic correction is performed on each sampling point included in each seismic trace. Based on the sampling time of each sampling point after dynamic correction, a corridor overlay profile is generated. The generated corridor overlay profile matches the well trajectory of the observation well, thereby obtaining a more realistic structure of the subsurface medium at the location of the observation well and improving the accuracy of seismic exploration.

[0143] It should be understood that the above-described apparatus is only illustrated by the division of the functional modules described above when implementing its functions. In practical applications, the functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the apparatus and method embodiments provided in the above embodiments belong to the same concept, and their specific implementation process can be found in the method embodiments, which will not be repeated here.

[0144] Figure 9 This illustration shows a structural block diagram of a terminal device 900 provided in an exemplary embodiment of this application. The terminal device 900 can be any electronic device product capable of human-computer interaction with a user through one or more methods such as a keyboard, touchpad, remote control, voice interaction, or handwriting device. Examples include PCs (Personal Computers), mobile phones, smartphones, PDAs (Personal Digital Assistants), wearable devices, PPCs (Pocket PCs), tablet computers, smart car systems, smart TVs, smart speakers, and smartwatches.

[0145] Typically, terminal device 900 includes a processor 901 and a memory 902.

[0146] Processor 901 may include one or more processing cores, such as a quad-core processor, an octa-core processor, etc. Processor 901 may be implemented using at least one hardware form selected from DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). Processor 901 may also include a main processor and a coprocessor. The main processor, also known as a CPU (Central Processing Unit), is used to process data in the wake-up state; the coprocessor is a low-power processor used to process data in the standby state. In some embodiments, processor 901 may integrate a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content required to be displayed on the screen. In some embodiments, processor 901 may also include an AI (Artificial Intelligence) processor, which is used to handle computational operations related to machine learning.

[0147] The memory 902 may include one or more computer-readable storage media, which may be non-transitory. The memory 902 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In some embodiments, the non-transitory computer-readable storage media in the memory 902 are used to store at least one instruction, which is executed by the processor 901 to implement the corridor overlay profile generation method provided in the method embodiments of this application.

[0148] In some embodiments, the terminal device 900 may optionally include a peripheral device interface 903 and at least one peripheral device. The processor 901, memory 902, and peripheral device interface 903 can be connected via a bus or signal line. Each peripheral device can be connected to the peripheral device interface 903 via a bus, signal line, or circuit board. Specifically, the peripheral device includes at least one of the following: a radio frequency circuit 904, a display screen 905, a camera assembly 906, an audio circuit 907, and a power supply 908.

[0149] Peripheral device interface 903 can be used to connect at least one I / O (Input / Output) related peripheral device to processor 901 and memory 902. In some embodiments, processor 901, memory 902 and peripheral device interface 903 are integrated on the same chip or circuit board; in some other embodiments, any one or two of processor 901, memory 902 and peripheral device interface 903 can be implemented on separate chips or circuit boards, which is not limited in this embodiment.

[0150] The radio frequency (RF) circuit 904 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The RF circuit 904 communicates with communication networks and other communication devices via electromagnetic signals. The RF circuit 904 converts electrical signals into electromagnetic signals for transmission, or converts received electromagnetic signals back into electrical signals. Optionally, the RF circuit 904 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, etc. The RF circuit 904 can communicate with other terminal devices through at least one wireless communication protocol. This wireless communication protocol includes, but is not limited to: the World Wide Web, metropolitan area networks, intranets, various generations of mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks, and / or WiFi (Wireless Fidelity) networks. In some embodiments, the RF circuit 904 may also include circuitry related to NFC (Near Field Communication), which is not limited in this application.

[0151] Display screen 905 is used to display a UI (User Interface). This UI may include graphics, text, icons, videos, and any combination thereof. When display screen 905 is a touch display screen, it also has the ability to collect touch signals on or above its surface. These touch signals can be input as control signals to processor 901 for processing. In this case, display screen 905 can also be used to provide virtual buttons and / or a virtual keyboard, also known as soft buttons and / or a soft keyboard. In some embodiments, there may be one display screen 905, disposed on the front panel of terminal device 900; in other embodiments, there may be at least two display screens 905, disposed on different surfaces of terminal device 900 or in a folded design; in other embodiments, display screen 905 may be a flexible display screen, disposed on a curved or folded surface of terminal device 900. Furthermore, display screen 905 may be configured as a non-rectangular irregular shape, i.e., a non-rectangular screen. Display screen 905 may be made of materials such as LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode).

[0152] The camera assembly 906 is used to acquire images or videos. Optionally, the camera assembly 906 includes a front-facing camera and a rear-facing camera. Typically, the front-facing camera is located on the front panel of the terminal device 900, and the rear-facing camera is located on the back of the terminal device 900. In some embodiments, there are at least two rear-facing cameras, which are any one of a main camera, a depth-sensing camera, a wide-angle camera, and a telephoto camera, to achieve background blurring by fusion of the main camera and the depth-sensing camera, panoramic shooting by fusion of the main camera and the wide-angle camera, VR (Virtual Reality) shooting, or other fusion shooting functions. In some embodiments, the camera assembly 906 may also include a flash. The flash can be a single-color temperature flash or a dual-color temperature flash. A dual-color temperature flash refers to a combination of a warm light flash and a cool light flash, which can be used for light compensation at different color temperatures.

[0153] The audio circuit 907 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, converting them into electrical signals that are input to the processor 901 for processing, or to the radio frequency circuit 904 for voice communication. For stereo sound acquisition or noise reduction purposes, multiple microphones may be used, each positioned at a different location on the terminal device 900. The microphone may also be an array microphone or an omnidirectional microphone. The speaker is used to convert electrical signals from the processor 901 or the radio frequency circuit 904 into sound waves. The speaker may be a conventional diaphragm speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can convert electrical signals not only into audible sound waves but also into inaudible sound waves for purposes such as distance measurement. In some embodiments, the audio circuit 907 may also include a headphone jack.

[0154] Power supply 908 is used to supply power to the various components in terminal device 900. Power supply 908 can be AC ​​power, DC power, a disposable battery, or a rechargeable battery. When power supply 908 includes a rechargeable battery, the rechargeable battery can be a wired rechargeable battery or a wireless rechargeable battery. A wired rechargeable battery is a battery that is charged via a wired line, while a wireless rechargeable battery is a battery that is charged via a wireless coil. The rechargeable battery can also be used to support fast charging technology.

[0155] In some embodiments, the terminal device 900 further includes one or more sensors 909. The one or more sensors 909 include, but are not limited to, an accelerometer 910, a gyroscope 911, a pressure sensor 912, an optical sensor 913, and a proximity sensor 914.

[0156] Accelerometer 910 can detect the magnitude of acceleration along the three coordinate axes of a coordinate system established by terminal device 900. For example, accelerometer 910 can be used to detect the components of gravitational acceleration along the three coordinate axes. Processor 901 can control display screen 905 to display the user interface in either a landscape or portrait view based on the gravitational acceleration signal acquired by accelerometer 910. Accelerometer 910 can also be used for games or for acquiring user motion data.

[0157] The gyroscope sensor 911 can detect the orientation and rotation angle of the terminal device 900. The gyroscope sensor 911, in conjunction with the accelerometer sensor 910, can collect the user's 3D movements on the terminal device 900. Based on the data collected by the gyroscope sensor 911, the processor 901 can perform the following functions: motion sensing (e.g., changing the UI based on the user's tilt), image stabilization during shooting, game control, and inertial navigation.

[0158] The pressure sensor 912 can be disposed on the side bezel of the terminal device 900 and / or on the lower layer of the display screen 905. When the pressure sensor 912 is disposed on the side bezel of the terminal device 900, it can detect the user's grip signal on the terminal device 900, and the processor 901 can perform left / right hand recognition or quick operation based on the grip signal collected by the pressure sensor 912. When the pressure sensor 912 is disposed on the lower layer of the display screen 905, the processor 901 can control the operable controls on the UI interface based on the user's pressure operation on the display screen 905. The operable controls include at least one of button controls, scroll bar controls, icon controls, and menu controls.

[0159] An optical sensor 913 is used to collect ambient light intensity. In one embodiment, the processor 901 can control the display brightness of the display screen 905 based on the ambient light intensity collected by the optical sensor 913. Specifically, when the ambient light intensity is high, the display brightness of the display screen 905 is increased; when the ambient light intensity is low, the display brightness of the display screen 905 is decreased. In another embodiment, the processor 901 can also dynamically adjust the shooting parameters of the camera assembly 906 based on the ambient light intensity collected by the optical sensor 913.

[0160] The proximity sensor 914, also known as a distance sensor, is typically located on the front panel of the terminal device 900. The proximity sensor 914 is used to detect the distance between the user and the front of the terminal device 900. In one embodiment, when the proximity sensor 914 detects that the distance between the user and the front of the terminal device 900 is gradually decreasing, the processor 901 controls the display screen 905 to switch from a screen-on state to a screen-off state; when the proximity sensor 914 detects that the distance between the user and the front of the terminal device 900 is gradually increasing, the processor 901 controls the display screen 905 to switch from a screen-off state to a screen-on state.

[0161] Those skilled in the art will understand that Figure 9 The structure shown does not constitute a limitation on the terminal device 900, and may include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0162] Figure 10This is a schematic diagram of the server structure provided in the embodiments of this application. The server 1000 can vary considerably due to different configurations or performance. It may include one or more Central Processing Units (CPUs) 1001 and one or more memories 1002. The one or more memories 1002 store at least one line of program code, which is loaded and executed by the one or more processors 1001 to implement the corridor overlay profile generation method provided in the various method embodiments described above. Of course, the server 1000 may also have wired or wireless network interfaces, a keyboard, and input / output interfaces for input and output. The server 1000 may also include other components for implementing device functions, which will not be elaborated here.

[0163] In an exemplary embodiment, a computer-readable storage medium is also provided, which stores at least one piece of program code that is loaded and executed by a processor to enable a computer to implement any of the above-described methods for generating corridor overlay profiles.

[0164] Optionally, the aforementioned computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a compact disc read-only memory (CD-ROM), magnetic tape, floppy disk, and optical data storage device, etc.

[0165] In an exemplary embodiment, a computer program or computer program product is also provided, which stores at least one computer instruction that is loaded and executed by a processor to enable the computer to implement any of the above-described methods for generating corridor overlay profiles.

[0166] It should be noted that the information (including but not limited to user device information, user personal information, etc.), data (including but not limited to data used for analysis, data stored, data displayed, etc.) and signals involved in this application are all authorized by the user or fully authorized by all parties, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions.

[0167] It should be understood that "multiple" as used in this article refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0168] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0169] The above description is merely an exemplary embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method of generating a corridor stack profile, characterized by, The method comprises: acquiring seismic data of an observation well, the seismic data comprising model information of a velocity model, coordinates of a shot point and coordinates of a receiving point corresponding to each seismic trace, and initial sampling time of sampling points included in each seismic trace; determining, according to the model information and the coordinates of the shot point and the coordinates of the receiving point corresponding to each seismic trace, travel time of each reflection interface of the velocity model under each seismic trace, the travel time of any reflection interface under any seismic trace being used to indicate time required from the shot point corresponding to the any seismic trace to the receiving point corresponding to the any seismic trace via the any reflection interface; determining, according to the model information, two-way travel time of each reflection interface of the velocity model, the two-way travel time of any reflection interface being used to indicate time required from the any reflection interface to the ground surface and from the ground surface to the any reflection interface; performing moveout correction on the initial sampling time of the sampling points included in each seismic trace according to the two-way travel time of each reflection interface and the travel time of each reflection interface under each seismic trace, to obtain target sampling time of the sampling points included in each seismic trace after moveout correction; generating a corridor stack profile according to the target sampling time of the sampling points included in each seismic trace, the corridor stack profile being used to reflect the structure of a subsurface medium at a position where the observation well is located.

2. The method of claim 1, wherein, The determining, according to the model information and the coordinates of the shot point and the coordinates of the receiving point corresponding to each seismic trace, travel time of each reflection interface of the velocity model under each seismic trace comprises: determining, according to the model information and the coordinates of the shot point and the coordinates of the receiving point corresponding to each seismic trace, ray parameters of each reflection interface of the velocity model under each seismic trace; determining, according to the model information and the ray parameters of each reflection interface of the velocity model under each seismic trace, travel time of each reflection interface of the velocity model under each seismic trace.

3. The method of claim 2, wherein, The determining, according to the model information and the coordinates of the shot point and the coordinates of the receiving point corresponding to each seismic trace, ray parameters of each reflection interface of the velocity model under each seismic trace comprises: determining, according to the coordinates of the shot point and the coordinates of the receiving point of each seismic trace, horizontal distance from the shot point of each seismic trace to the receiving point of each seismic trace; determining, according to the model information and the horizontal distance from the shot point of each seismic trace to the receiving point of each seismic trace, ray parameters of each reflection interface of the velocity model under each seismic trace.

4. The method of claim 1, wherein, The determining, according to the model information, two-way travel time of each reflection interface of the velocity model comprises: for any reflection interface in the velocity model, determining, according to the model information and the number of model layers passed by the any reflection interface to a top surface of the velocity model, two-way travel time of the any reflection interface of the velocity model.

5. The method according to any one of claims 1 to 4, characterized in that, The model information comprises at least one of thickness of each layer of the velocity model, vertical velocity of each layer of the velocity model, or anisotropy coefficient of velocity of each layer of the velocity model.

6. The method according to any one of claims 1 to 4, characterized in that, The method comprises the following steps: According to the two-way travel time of each reflection interface, the travel time of each reflection interface under each seismic trace and the initial sampling time of the sampling points included in each seismic trace, the dynamic correction time of the sampling points included in each seismic trace is determined. According to the initial sampling time of the sampling points included in each seismic trace and the dynamic correction time of the sampling points included in each seismic trace, the target sampling time of the sampling points included in each seismic trace after dynamic correction is determined.

7. The method of claim 6, wherein, The method comprises the following steps: For any sampling point included in any seismic trace, according to the two-way travel time of the reflection interface adjacent to the any sampling point, the travel time of the reflection interface adjacent to the any sampling point under the any seismic trace and the initial sampling time of the any sampling point, the dynamic correction time of the any sampling point is determined.

8. The method of claim 6, wherein, The method comprises the following steps: For any sampling point included in any seismic trace, the sum value between the initial sampling time of the any sampling point included in the any seismic trace and the dynamic correction time of the any sampling point included in the any seismic trace is determined as the target sampling time of the any sampling point after dynamic correction.

9. The method according to any one of claims 1 to 4, characterized in that, The method comprises the following steps: According to the target sampling time of the sampling points included in each seismic trace, a corridor stack profile is generated, and the corridor stack profile is used to reflect the structure of the underground medium where the observation well is located. According to the target sampling time of the sampling points included in each seismic trace, a dynamic correction record of a vertical seismic profile is generated, the dynamic correction record of the vertical seismic profile is used to reflect the structure of the underground medium where the observation well is located, and the dynamic correction record of the vertical seismic profile includes multiple wave noises and random noises. According to the corridor cut-off time window parameters, the dynamic correction record of the vertical seismic profile is subjected to corridor cut-off to obtain a corridor profile map, the corridor profile map is used to reflect the structure of the underground medium where the observation well is located, and the corridor profile map includes random noises.

10. The method of claim 9, wherein, The corridor profile map is subjected to mapping processing to obtain the corridor stack profile. The method comprises the following steps: The method comprises the following steps: According to the coordinates of the receiving point corresponding to each seismic trace and the coordinates of the wellhead of the observation well, a projection distance and an azimuth angle corresponding to each seismic trace are determined, the projection distance of any seismic trace being a projection distance on a horizontal plane of a distance from the receiving point of the seismic trace to the wellhead of the observation well, and the azimuth angle of the seismic trace being an included angle between a line connecting the projection of the receiving point corresponding to the seismic trace on the horizontal plane and an east coordinate; According to the projection distance and the azimuth angle corresponding to each seismic trace, a projection distance of each seismic trace on a target vertical plane is determined, the target vertical plane being a vertical plane on which a projection plane of a target azimuth angle is located; According to the projection distance of each seismic trace on the target vertical plane, the corridor profile is mapped onto the vertical plane to obtain a corridor stack profile.

11. An apparatus for generating a corridor stack profile, the apparatus comprising: The device comprises: An acquisition module is configured to acquire seismic data of an observation well, the seismic data comprising model information of a velocity model, coordinates of a shot point and coordinates of a receiving point corresponding to each seismic trace, and initial sampling times of sampling points included in each seismic trace; A determination module is configured to determine, according to the model information and the coordinates of the shot point and the receiving point corresponding to each seismic trace, a travel time of each reflection interface of the velocity model under each seismic trace, the travel time of any reflection interface under any seismic trace being used to indicate a time required from the shot point corresponding to the seismic trace to the receiving point corresponding to the seismic trace via the reflection interface; The determination module is further configured to determine, according to the model information, a two-way travel time of each reflection interface of the velocity model, the two-way travel time of any reflection interface being used to indicate a time required from the reflection interface to the ground surface and from the ground surface to the reflection interface; A dynamic correction module is configured to perform dynamic correction on the initial sampling times of the sampling points included in each seismic trace according to the two-way travel time of each reflection interface and the travel time of each reflection interface under each seismic trace, to obtain target sampling times of the sampling points included in each seismic trace after dynamic correction; A generation module is configured to generate a corridor stack profile according to the target sampling times of the sampling points included in each seismic trace, the corridor stack profile being used to reflect a structure of a subsurface medium at a position where the observation well is located.

12. A computer device, comprising: The computer device comprises a processor and a memory, and at least one piece of program code is stored in the memory, the at least one piece of program code being loaded and executed by the processor, so that the computer device implements the generation method of the corridor stack profile according to any one of claims 1 to 10.

13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one piece of program code, and the at least one piece of program code is loaded and executed by the processor, so that the computer implements the generation method of the corridor stack profile according to any one of claims 1 to 10.

14. A computer program product, characterised in that, The computer program product stores at least one computer instruction, and the at least one computer instruction is loaded and executed by the processor to enable the computer to implement the generation method of the corridor superimposed profile according to any one of claims 1 to 10.

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