Vapor chamber element for heterogeneous plates

Abstract

A vapor chamber element of a heterogeneous plate comprises a metal upper cover and a ceramic metal-clad lower plate, the ceramic metal-clad lower plate comprises a ceramic substrate and a first metal layer, the ceramic substrate is provided with a substrate upper surface and a substrate lower surface, the first metal layer is formed on the substrate upper surface opposite to the metal upper cover, and the first metal layer is formed on the substrate lower surface opposite to the metal upper cover. When the metal upper cover is coupled to the ceramic metal-clad lower plate, a vapor chamber element with a closed air cavity is formed, and the lower surface of the substrate is used for being in contact with a heat source; therefore, the ceramic copper-clad substrate is used as the lower plate of the uniform-temperature plate element, and the ceramic material has the advantages of high rigidity, high thermal conductivity and the like, so that the uniform-temperature plate element of the heterogeneous plate not only can ensure the phase change and two-phase flow circulation efficiency of working fluid in the element, but also can provide good structural strength for a heat absorption area of the lower plate; therefore, the problem that heat resistance is increased due to structural deformation of a heat absorption area of the vapor chamber caused by insufficient strength of a known vapor chamber lower plate metal structure under a high-power-density heat source is effectively solved.

Description

Technical Field

[0001] This invention relates to a heat spreader element, and more particularly to a heat spreader element formed by coupling an upper cover and a lower plate of two different materials into a heterogeneous plate. Background Technology

[0002] A vapor chamber is a conventional heat spreader consisting of a top cover and a bottom plate made of the same metal, coupled together by welding to form a sealed cavity. This allows the working fluid to undergo phase change and two-phase flow circulation within the sealed cavity. When heat spreaders are used for heat dissipation of high-power chips, as the heat power and heat power density of the chip increase, the area of ​​the copper bottom plate of the heat spreader in contact with the heat source will experience extremely high heat transfer. If the thickness of the copper bottom plate is insufficient, it is prone to deformation. A deformed bottom plate will cause poor adhesion between the heat spreader and the chip, resulting in greater thermal resistance and causing the chip temperature to rise.

[0003] Therefore, in order to address the challenges of heat dissipation and cooling of conventional vapor chamber components caused by the increasing thermal power and thermal power density of wafers, it is necessary to provide a vapor chamber component that has both good thermal conductivity and improved structural strength of the heat absorption zone. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a heat spreader element of heterogeneous material, which has a simple structure, can overcome the defects of the prior art, has good thermal conductivity, and effectively improves the structural strength of the heat absorption zone.

[0005] To achieve the above objectives, the present invention discloses a temperature distribution plate element of heterogeneous materials, characterized in that it comprises:

[0006] A metal top cover; and

[0007] A ceramic-coated metal lower plate includes a ceramic substrate and a first metal layer. The ceramic substrate has an upper surface and a lower surface. The first metal layer is formed on the upper surface of the substrate relative to the metal upper cover. When the metal upper cover is coupled to the ceramic-coated metal lower plate, a heat exchanger element with a sealed air cavity is formed.

[0008] The lower surface of the substrate is used to contact a heat source.

[0009] The metal top cover is a copper top cover, the ceramic-coated metal bottom plate is a ceramic-coated copper bottom plate, and the first metal layer is a first copper layer.

[0010] The copper top cover has a lower surface, a groove, and a first groove cavity. When the copper top cover is coupled to the ceramic copper-clad lower plate, the first groove cavity forms the sealed air cavity.

[0011] It also includes a porous capillary structure, and the upper cover groove has a first groove inner surface. The porous capillary structure is continuously disposed on the first groove inner surface and the surface of the first copper layer.

[0012] The ceramic copper-clad lower plate further includes a second copper layer formed on the upper surface of the substrate relative to the copper upper cover, and the copper upper cover is coupled to the surface of the second copper layer of the ceramic copper-clad lower plate.

[0013] The ceramic substrate is made of aluminum nitride, silicon carbide, or aluminum oxide.

[0014] The ceramic copper-clad lower plate also has a lower plate groove, which has a second groove cavity. When the copper upper cover is coupled to the ceramic copper-clad lower plate, the first groove cavity and the second groove cavity form the sealed air cavity.

[0015] The lower plate groove also has a second groove inner surface, the first copper layer is formed on the second groove inner surface relative to the upper cover groove, and the porous capillary structure is continuously disposed on the second groove inner surface and the surface of the first copper layer.

[0016] It also includes a plurality of fins, and the metal cover has an upper surface on which the fins are formed.

[0017] The fins are spaced apart on the upper surface of the cover to form multiple microchannels, and the width of the microchannels is less than or equal to 1 mm.

[0018] In summary, this invention provides a vapor chamber element with heterogeneous substrates. The upper cover uses a copper metal substrate, while the lower cover uses a copper-clad ceramic substrate. A porous capillary structure is formed by directly sintering copper powder or copper mesh onto the lower surface of the copper substrate of the upper cover and the copper-clad surface of the ceramic substrate of the lower cover, thereby further processing and manufacturing the vapor chamber element with heterogeneous substrates. Due to the advantages of ceramic materials such as high rigidity and high thermal conductivity, combined with the good thermal conductivity of copper, the vapor chamber element with heterogeneous substrates of this invention can improve overall heat dissipation efficiency. Compared to the prior art, the vapor chamber element with heterogeneous substrates of this invention also provides good structural strength, thereby effectively improving the problem of insufficient structural strength of the lower metal plate of conventional vapor chambers under high power density heat sources, which leads to structural deformation of the heat absorption zone and thus increased thermal resistance.

[0019] In addition, since the vapor chamber element of the heterogeneous plate of the present invention has both good structural strength and good heat dissipation efficiency, it can effectively dissipate heat for high power density chips (such as power density exceeding 200W), and will not cause the problem of increased contact thermal resistance caused by deformation of the heat absorption area of ​​the lower plate of the vapor chamber element during the heat dissipation process. Attached Figure Description

[0020] Figure 1 A cross-sectional view of a temperature distribution plate element of a heterogeneous plate according to a specific embodiment of the present invention is shown.

[0021] Figure 2 A cross-sectional view of a heat exchanger element of a heterogeneous plate according to another specific embodiment of the present invention is shown.

[0022] Figure 3 A cross-sectional view of a heat exchanger element of a heterogeneous plate according to another specific embodiment of the present invention is shown.

[0023] Figure 4 A cross-sectional view of a heat exchanger element of a heterogeneous plate according to another specific embodiment of the present invention is shown.

[0024] Figure 5 Showing according to Figure 4 An exploded view of a vapor chamber component made of heterogeneous materials.

[0025] Figure 6 A cross-sectional view of a heat exchanger element of a heterogeneous plate according to another specific embodiment of the present invention is shown. Detailed Implementation

[0026] To make the advantages, spirit, and features of the present invention easier and clearer to understand, detailed descriptions and discussions will follow with reference to specific embodiments and the accompanying drawings. It should be noted that these specific embodiments are merely representative examples of the present invention, and the specific methods, apparatus, conditions, materials, etc., exemplified are not intended to limit the present invention or the corresponding specific embodiments. Furthermore, the elements in the figures are only used to illustrate their relative positions and are not drawn to scale; the step numbers in the present invention are only for distinguishing different steps and do not represent the order of the steps, as will be stated previously.

[0027] Please see Figure 1 , Figure 1 A cross-sectional view of a temperature distribution plate element 1 of a heterogeneous material according to a specific embodiment of the present invention is shown. Figure 1 As shown, the heat spreader element 1 of the heterogeneous plate material in this specific embodiment includes a metal upper cover 10 and a ceramic-coated metal lower plate 12. The ceramic-coated metal lower plate 12 includes a ceramic substrate 121 and a first metal layer 1212. The ceramic substrate 121 has an upper substrate surface 1211 and a lower substrate surface 1220. The first metal layer 1212 is formed on the upper substrate surface 1211 relative to the metal upper cover 10. When the metal upper cover 10 is coupled to the ceramic-coated metal lower plate 12, a heat spreader element with a sealed air cavity 14 is formed. The lower substrate surface 1220 is used to contact the heat source 90.

[0028] Please continue reading. Figure 1In this specific embodiment, the metal cover 10 has a lower surface 101, and the lower surface 101 has a groove 1011. The groove 1011 further has a first inner surface 1013. After the porous capillary structure 16 is continuously disposed on the inner surface 1013 of the first groove and the surface of the first metal layer 1212, the working fluid is injected between the groove 1011 of the metal cover 10 and the ceramic-coated metal lower plate 12, and a vacuum is drawn. After the vacuum is drawn, the first groove cavity 1012 in the groove 1011 forms a sealed air cavity 14. In practice, the working fluid can be water or a two-phase coolant, such as R134a.

[0029] The ceramic copper-clad lower plate 13 of the heat spreader element 1 of the heterogeneous substrate in this specific embodiment further has a second metal layer 1214, formed on the upper surface 1211 of the substrate relative to the copper upper cover 11. It is worth noting that the materials of the first metal layer 1212 and the second metal layer 1214 must be the same as the material of the metal upper cover 10. For example, when copper is selected as the metal material in this embodiment, the metal upper cover is a copper upper cover, the ceramic metal-clad lower plate is a ceramic copper-clad lower plate, the first metal layer is a first copper layer, and the second metal layer is a second copper layer. Please note that in practice, the first metal layer 1212 corresponds to the position where the upper cover groove 1011 is provided, and the second metal layer 1214 corresponds to the remaining positions outside the groove. In the figure, for clarity, the boundary of the first metal layer 1212 and the second metal layer 1214 is shown. In fact, the first metal layer and the second metal layer can be formed integrally on the ceramic substrate by using copper powder or copper foil or other metal powders through sintering or vacuum sputtering. In practice, the ceramic substrate is made of any one of aluminum nitride (AlN), silicon carbide (SiC), or aluminum oxide (Al2O3). Furthermore, the choice of metal is not limited to these materials; for example, titanium or other metals can also be used.

[0030] In practical applications, the lower surface of the ceramic-coated metal lower plate 12 of the heterogeneous plate heat exchanger element 1 serves as the heat absorption zone, preferentially absorbing the heat energy of the heat source 90. The working fluid in the sealed air chamber 14 of the heterogeneous plate heat exchanger element 1 absorbs the heat energy, undergoes a phase change from liquid to gaseous working fluid, and flows into the condensation zone. Then, due to the temperature drop after entering the condensation zone, the cooled working fluid undergoes another phase change and becomes liquid again. Finally, it flows back to the bottom heat absorption zone along the capillary structure, thus repeating the two-phase flow cycle inside the heterogeneous plate heat exchanger element 1.

[0031] It is worth noting that the vapor chamber element of the heterogeneous plate material of the present invention uses a ceramic copper-clad substrate, and is manufactured by directly sintering copper powder or copper foil onto the ceramic surface. Due to the advantages of ceramic materials such as high rigidity and high thermal conductivity, combined with the good thermal conductivity of copper, the vapor chamber element of the heterogeneous plate material of the present invention not only improves the overall heat dissipation efficiency, but also provides good structural strength compared to the prior art, thereby effectively improving the problem of deformation caused by insufficient structural strength in conventional vapor chambers.

[0032] Furthermore, the present invention provides other embodiments; please refer to [link / reference]. Figure 2 , Figure 2 A cross-sectional view of a temperature distribution plate element 2 of a heterogeneous plate according to another specific embodiment of the present invention is shown. Figure 2 As shown, the ceramic copper-clad lower plate 13 of the heat spreader element 2 of the heterogeneous material in this specific embodiment includes a lower plate groove 1217, which has a second groove inner surface 1218 and a second groove cavity 1219. At this time, the surface of the first copper layer 1213 is formed in the second groove inner surface 1218 relative to the copper upper cover 11, and a porous capillary structure 16 is continuously disposed on the lower surface of the upper cover, the second groove inner surface 1218, and the surface of the first copper layer 1213. When the copper upper cover 11 is coupled to the ceramic copper-clad lower plate 13, the second groove cavity 1219 forms a sealed air cavity 14. It is worth noting that the first copper layer 1213 of the heat spreader element 2 of the heterogeneous material in this specific embodiment is disposed on the second groove inner surface 1218 corresponding to the lower plate groove 1217, and the second copper layer 1215 is disposed elsewhere outside the groove. In other words, when the copper top cover 11 and the ceramic copper-clad lower plate 13 are coupled, the first copper layer 1213 is coupled with the porous capillary structure 16 and provides a working fluid for internal operation; the second copper layer 1215 acts as a welding layer to couple the copper top cover 11 and the ceramic copper-clad lower plate 13 together. Copper is chosen as the material in this specific embodiment, but the choice of material is not limited to this; other metal materials can be selected according to usage requirements. Other devices in this specific embodiment are substantially the same as those in the aforementioned specific embodiments, and therefore will not be described again here.

[0033] This invention provides other embodiments; please refer to [link / reference]. Figure 3 , Figure 3 A cross-sectional view of a temperature distribution plate element 3 of a heterogeneous plate according to another specific embodiment of the present invention is shown. Figure 3As shown, in this specific embodiment, the copper upper cover 11 of the heat spreader element 3 of the heterogeneous plate has an upper cover groove 1011, and the ceramic copper-clad lower plate 13 has a lower plate groove 1217. At this time, the porous capillary structure 16 is continuously disposed on the inner surface 1013 of the first groove, the inner surface 1218 of the second groove, and the surface of the first copper layer 1213. When the copper upper cover 11 is coupled to the ceramic copper-clad lower plate 13, the first groove cavity 1012 and the second groove cavity 1219 form a sealed air cavity 14. Other devices in this specific embodiment are substantially the same as those in the aforementioned specific embodiments, and therefore will not be described again here.

[0034] Furthermore, heat dissipation fins can also be disposed in the heat spreader element of the heterogeneous material of the present invention, thereby increasing heat dissipation efficiency. Please refer to the following: Figure 4 as well as Figure 5 . Figure 4 A cross-sectional view of a temperature distribution plate element 4 of a heterogeneous plate according to another specific embodiment of the present invention is shown. Figure 5 Showing according to Figure 4 An exploded view of the heat exchanger element 4 made of heterogeneous materials. (See diagram below.) Figure 4 as well as Figure 5 As shown, the heat spreader element 4 of the heterogeneous material in this specific embodiment further includes a plurality of fins 15, and the copper cover 11 has an upper surface 102, on which the plurality of fins 15 are formed. In practice, the fins of the heat spreader element 4 of the heterogeneous material in this specific embodiment can be milled using a tooth-shaving process, wherein the gap between each fin forms a microchannel 151, and then the fins are joined to the copper cover by welding. In another embodiment, the fins can be directly integrally formed onto the copper cover using a CNC process. Other devices in this specific embodiment are substantially the same as those corresponding to the aforementioned specific embodiments, and therefore will not be described in detail here.

[0035] It is worth noting that, in practical applications, the vapor chamber element 4 of the heterogeneous plate material in this specific embodiment can be used for both air cooling and liquid cooling. When using air cooling, the two-phase flow circulation system inside the vapor chamber element is the same as in the aforementioned specific embodiment, and therefore will not be repeated here. When using coolant for liquid cooling, in addition to heat dissipation through the internal two-phase flow circulation, the vapor chamber element of the heterogeneous plate material can also directly exchange heat with each fin along the microchannel when the coolant comes into contact with the fins, carrying away a large amount of heat energy. Considering the heat exchange area of ​​the microchannel and the flow velocity of the coolant, the channel width d of the microchannel 151 is less than or equal to 1 mm. In practice, the channel width, fin thickness, and microchannel size are not limited to this and can be adjusted according to the design.

[0036] Furthermore, for increasingly higher power chip specifications, in addition to specifications with a single heat source, there will also be designs with multiple chips of different power levels. This invention further provides corresponding embodiments. Please refer to... Figure 6 , Figure 6 A cross-sectional view of a temperature distribution plate element 5 of a heterogeneous plate material according to another specific embodiment of the present invention is shown. Figure 6 As shown, the copper top cover 11 of the heat spreader element 5 of the heterogeneous plate material in this specific embodiment has three sets of top cover grooves 1011. When the copper top cover 11 is coupled with the ceramic copper-clad lower plate 13, the first groove cavity 1012 of each of the three sets of top cover grooves 1011 simultaneously forms a sealed air cavity 14 with the ceramic copper-clad lower plate 13. In practical applications, the position of the top cover groove 1011 corresponds to the position of the heat source 90. In addition, in another embodiment, the size of the top cover groove 1011 can also correspond to the power of the heat source 90. For example, the main heat source has the highest power, and secondary heat sources with lower power are respectively provided on both sides of the main heat source. At this time, the copper top cover of the heat spreader element of the heterogeneous plate material is designed to have one set of larger top cover grooves; two sets of smaller top cover grooves are provided next to it. Other devices in this specific embodiment are generally the same as the devices corresponding to the aforementioned specific embodiments, so they will not be described again here. In practice, the number, size, and location of the grooves in the copper cover are not limited to this and can be designed according to the actual size, quantity, and specifications of the heat source.

[0037] In summary, this invention provides a vapor chamber element with heterogeneous substrates. The upper cover uses a copper metal substrate, while the lower cover uses a copper-clad ceramic substrate. A porous capillary structure is formed by directly sintering copper powder or copper mesh onto the lower surface of the copper substrate of the upper cover and the copper-clad surface of the ceramic substrate of the lower cover, thereby further processing and manufacturing the vapor chamber element with heterogeneous substrates. Due to the advantages of ceramic materials such as high rigidity and high thermal conductivity, combined with the good thermal conductivity of copper, the vapor chamber element with heterogeneous substrates of this invention can improve overall heat dissipation efficiency. Compared to the prior art, the vapor chamber element with heterogeneous substrates of this invention also provides good structural strength, thereby effectively improving the problem of insufficient structural strength of the lower metal plate of conventional vapor chambers under high power density heat sources, which leads to structural deformation of the heat absorption zone and thus increased thermal resistance.

[0038] In addition, since the vapor chamber element of the heterogeneous plate of the present invention has both good structural strength and good heat dissipation efficiency, it can effectively dissipate heat for high power density chips (such as power density exceeding 200W), and will not cause the problem of increased contact thermal resistance caused by deformation of the heat absorption area of ​​the lower plate of the vapor chamber element during the heat dissipation process.

[0039] The detailed description of the preferred embodiments above is intended to more clearly describe the features and spirit of the present invention, and is not intended to limit the scope of the invention to the preferred embodiments disclosed above. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims made by this invention. Therefore, the scope of the patent claims made by this invention should be interpreted in the broadest possible sense based on the foregoing description, so as to cover all possible modifications and equivalent arrangements.

Claims

1. A heat spreader element made of heterogeneous materials, characterized in that... Includes: A metal top cover; and A ceramic-coated metal lower plate includes a ceramic substrate and a first metal layer. The ceramic substrate has an upper surface and a lower surface. The first metal layer is formed on the upper surface of the substrate relative to the metal upper cover. When the metal upper cover is coupled to the ceramic-coated metal lower plate, a heat exchanger element with a sealed air cavity is formed. The lower surface of the substrate is used to contact a heat source.

2. The temperature distribution plate element of heterogeneous plates as described in claim 1, characterized in that, The metal top cover is a copper top cover, the ceramic-coated metal bottom plate is a ceramic-coated copper bottom plate, and the first metal layer is a first copper layer.

3. The temperature distribution plate element of heterogeneous plates as described in claim 2, characterized in that, The copper top cover has a lower surface with a groove and a first groove cavity. When the copper top cover is coupled to the ceramic copper-clad lower plate, the first groove cavity forms the sealed air chamber.

4. The temperature distribution plate element of heterogeneous plates as described in claim 3, characterized in that, It also includes a porous capillary structure, and the upper cover groove has a first groove inner surface. The porous capillary structure is continuously disposed on the first groove inner surface and the surface of the first copper layer.

5. The temperature distribution plate element of heterogeneous plates as described in claim 2, characterized in that, The ceramic copper-clad substrate further includes a second copper layer formed on the upper surface of the substrate relative to the copper top cover, and the copper top cover is coupled to the surface of the second copper layer of the ceramic copper-clad substrate.

6. The temperature distribution plate element of heterogeneous plates as described in claim 1, characterized in that, The ceramic substrate is made of aluminum nitride, silicon carbide, or aluminum oxide.

7. The temperature distribution plate element of heterogeneous plates as described in claim 3, characterized in that, The ceramic copper-clad lower plate also has a lower plate groove, which has a second groove cavity. When the copper upper cover is coupled to the ceramic copper-clad lower plate, the first groove cavity and the second groove cavity form the sealed air cavity.

8. The temperature distribution plate element of heterogeneous plates as described in claim 7, characterized in that, The lower plate groove also has a second groove inner surface, the first copper layer is formed on the second groove inner surface relative to the upper cover groove, and the porous capillary structure is continuously disposed on the second groove inner surface and the surface of the first copper layer.

9. The temperature distribution plate element of heterogeneous plates as described in claim 1, characterized in that, It also includes a plurality of fins, and the metal cover has an upper surface on which the fins are formed.

10. The temperature distribution plate element of heterogeneous plates as described in claim 9, characterized in that, The fins are spaced apart on the upper surface of the cover and form multiple microchannels, and the width of the microchannels is less than or equal to 1 mm.

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