Wafer clamp fixing device

Abstract

The invention provides a wafer clamp fixing device. The first guide mechanism and the second guide mechanism are arranged on the two sides of the lower end face of the supporting plate respectively, the lower end of the first guide mechanism and the lower end of the second guide mechanism are each provided with a plurality of supporting legs, the first guide mechanism is parallel to the second guide mechanism, and the first guide mechanism and the second guide mechanism are used for bearing needle cards of the wafer clamp. A plurality of through holes corresponding to a plurality of positioning holes of the needle card in a one-to-one mode are formed in the supporting plate, a telescopic mechanism of the positioning mechanism is arranged at the upper end of the through hole, a positioning pin is connected with the extending end of the telescopic mechanism, and then the telescopic mechanism can drive the positioning pin to penetrate through the through hole, so that the needle card can slide out of the supporting plate. The jacking mechanism is provided with supporting legs, and the jacking mechanism drives the needle clamp to ascend to make contact with the supporting plate or descend to the initial position.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection, specifically to a wafer clamping device. Background Technology

[0002] Before wafer testing, the wafer to be tested needs to be placed on a heat sink. Then, a high-precision positioning and lifting mechanism is used to combine the heat sink with the probe card to form a wafer fixture. During the assembly process, a sealed cavity needs to be formed through a sealing structure, and the probe card and the wafer pads need to be precisely connected through probes.

[0003] However, during the precise connection between the pin holder and the wafer pad, the pin holder needs to overcome the pressure of all the pins and the resistance of the sealing structure. It is necessary to ensure that the pin holder does not deform or move excessively under this pressure. Therefore, there is an urgent need for a device that can fix the wafer fixture. Summary of the Invention

[0004] In view of this, embodiments of the present invention provide a wafer fixture fixing device to fix the wafer fixture.

[0005] To achieve the above objectives, the embodiments of the present invention provide the following technical solutions:

[0006] A wafer clamping device includes: a support plate, a first guiding mechanism, a second guiding mechanism, multiple lifting mechanisms, multiple positioning mechanisms, and multiple support legs;

[0007] The first guide mechanism and the second guide mechanism are respectively located on both sides of the lower end face of the support plate, and the lower ends of the first guide mechanism and the second guide mechanism are provided with multiple support legs. The first guide mechanism and the second guide mechanism are parallel.

[0008] The first and second guiding mechanisms are used to carry the pin holders of the wafer fixture and to allow the pin holders to slide into or out of the support plate.

[0009] The support plate has multiple through holes that correspond one-to-one with the multiple positioning holes of the pin card;

[0010] The positioning mechanism includes a telescopic mechanism and a positioning pin;

[0011] The telescopic mechanism is located at the upper end of the through hole;

[0012] The positioning pin is connected to the extended end of the telescopic mechanism, which is used to drive the positioning pin through the through hole and into the positioning hole.

[0013] The lifting mechanism is equipped with support legs. The lifting mechanism is used to drive the pin card to rise to contact the support plate or to fall back to the initial position.

[0014] Preferably, the first guiding mechanism includes: a first mounting base and a plurality of first guide wheels;

[0015] Multiple first guide wheels are arranged along the length direction of the first mounting base on the side of the first mounting base near the needle card, and the axial direction of the first guide wheel is perpendicular to the side of the first mounting base where the first guide wheel is mounted. The first guide wheel is used to slide and engage with the first side of the lower end face of the needle card.

[0016] The second guiding mechanism includes: a second mounting base and multiple second guide wheels;

[0017] Multiple second guide wheels are arranged along the length of the second mounting base on the side of the second mounting base near the needle holder, and the axial direction of the second guide wheels is perpendicular to the side of the second mounting base on which the second guide wheels are mounted. The second guide wheels are used to slide and engage with the second side of the lower end face of the needle holder.

[0018] Preferably, the first guiding mechanism further includes: a plurality of third guiding wheels;

[0019] The upper end face of the first mounting base is provided with a first mounting groove for mounting the third guide wheel along the length direction, wherein the first mounting groove is connected to the side of the first mounting base where the first guide wheel is mounted;

[0020] The axis of the third guide wheel is perpendicular to the upper end face of the first mounting base, and is used to abut against the side wall of the pin clip.

[0021] The second guiding mechanism also includes: multiple fourth guiding wheels;

[0022] The upper end face of the second mounting base is provided with a second mounting groove for mounting the fourth guide wheel along the length direction, wherein the second mounting groove is connected to the side of the second mounting base where the second guide wheel is mounted;

[0023] The axis of the fourth guide wheel is perpendicular to the upper end face of the second mounting base, and is used to abut against the side wall of the pin clip.

[0024] Preferably, the inner sides of the pin card are provided with a first positioning groove and a second positioning groove at both ends;

[0025] The first end of the first mounting base is provided with a first positioning structure that mates with the first positioning groove;

[0026] The first end of the second mounting base is provided with a second positioning structure that mates with the second positioning groove.

[0027] Preferably, the first positioning groove is a V-shaped groove;

[0028] The first positioning structure is a cylinder;

[0029] The second positioning groove is a C-shaped groove;

[0030] The second positioning structure is a cylinder.

[0031] Preferably, the plurality of first guide wheels are spaced at a preset distance along the length direction of the first mounting base;

[0032] Multiple second guide wheels are spaced at preset distances along the length of the second mounting base.

[0033] Preferably, the lifting mechanism includes: multiple telescopic components and multiple connecting plates;

[0034] Telescopic components are installed on the support legs;

[0035] The connecting plate is vertically positioned below the support plate and is connected to the extended end of the telescopic component. The upper part of the connecting plate has a clearance opening for avoiding the first guide wheel or the second guide wheel.

[0036] Preferably, the telescopic component is a cylinder.

[0037] Preferably, the lifting mechanism further includes: multiple adjusting bolts;

[0038] Multiple adjusting bolts are installed along the length of the upper end of the connecting plate, and the adjusting bolts are located between adjacent clearance openings.

[0039] Preferably, it also includes a lubrication guide sleeve disposed in the through hole.

[0040] Based on the wafer fixture fixing device provided by the present invention, a first guiding mechanism and a second guiding mechanism are respectively disposed on both sides of the lower end face of a support plate. Both the first and second guiding mechanisms have multiple supporting legs at their lower ends, and are parallel to each other. The first and second guiding mechanisms support the wafer fixture pins, which are used to slide into or out of the support plate. The support plate has multiple through holes corresponding to the multiple positioning holes of the pins. The telescopic mechanism of the positioning mechanism is disposed at the upper end of the through holes. The positioning pin is connected to the extended end of the telescopic mechanism, allowing the telescopic mechanism to drive the positioning pin through the through hole and into the positioning hole. A lifting mechanism with supporting legs is used to lift the pins to contact the support plate or lower them to their initial position. With the wafer fixture fixing device disclosed above, since the pins of this application can be laterally and longitudinally limited by the positioning mechanism and the lifting mechanism, when the wafer and pins are combined by the high-precision lifting mechanism, it can be ensured that the pins will not deform or move excessively under this pressure. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of a wafer clamping device provided in an embodiment of the present invention;

[0043] Figure 2 This is a schematic diagram of the pin card provided in an embodiment of the present invention;

[0044] Figure 3 A schematic diagram of the structure of the first guide mechanism provided in an embodiment of the present invention;

[0045] Figure 4 This is a schematic diagram of the structure of the second guide mechanism provided in an embodiment of the present invention;

[0046] Figure 5 This is a schematic diagram of the lifting mechanism provided in an embodiment of the present invention;

[0047] Figure 6 A front view of the lifting mechanism provided in an embodiment of the present invention;

[0048] Figure 7 This is a schematic diagram illustrating how the telescopic mechanism, according to an embodiment of the present invention, drives the positioning pin to engage with the positioning hole.

[0049] Figure 8 This is a schematic diagram of the structure of the lubrication guide sleeve provided in an embodiment of the present invention.

[0050] The components include: wafer fixture 1, pin holder 11, positioning hole 111, first positioning groove 112, second positioning groove 113; support plate 2; first guide mechanism 3, first mounting base 31, first mounting groove 311, first positioning structure 312, first guide wheel 32, third guide wheel 33; second guide mechanism 4, second mounting base 41, second mounting groove 411, second positioning structure 412, second guide wheel 42, fourth guide wheel 43; lifting mechanism 5, telescopic component 51, connecting plate 52, clearance opening 521, adjusting bolt 53; positioning mechanism 6, telescopic mechanism 61, positioning pin 62; support leg 7; and lubricating guide sleeve 8. Detailed Implementation

[0051] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0052] In this application, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0053] This invention provides a wafer clamping device, see [link to relevant documentation]. Figure 1 and combined Figures 2 to 7 , Figure 1 The wafer clamping device includes: a support plate 2, a first guiding mechanism 3, a second guiding mechanism 4, multiple lifting mechanisms 5, multiple positioning mechanisms 6, and multiple support legs 7.

[0054] The first guide mechanism 3 and the second guide mechanism 4 are respectively disposed on both sides of the lower end face of the support plate 2, and the lower ends of the first guide mechanism 3 and the second guide mechanism 4 are provided with multiple support legs 7, wherein the first guide mechanism 3 and the second guide mechanism 4 are parallel.

[0055] The first guiding mechanism 3 and the second guiding mechanism 4 are used to carry the pin clip 11 of the wafer fixture 1, and to allow the pin clip 11 to slide into or out of the support plate 2.

[0056] The support plate 2 has multiple through holes that correspond one-to-one with the multiple positioning holes 111 of the pin card 11;

[0057] The positioning mechanism 6 includes a telescopic mechanism 61 and a positioning pin 62;

[0058] The telescopic mechanism 61 is located at the upper end of the through hole;

[0059] The positioning pin 62 is connected to the extended end of the telescopic mechanism 61. The telescopic mechanism 61 is used to drive the positioning pin 62 through the through hole and into the positioning hole 111.

[0060] The lifting mechanism 5 is equipped with support legs 7. The lifting mechanism 5 is used to drive the needle card 11 to rise to contact with the support plate 2 or to fall to the initial position.

[0061] It should be noted that the first guide mechanism 3 and the second guide mechanism 4 are respectively set on both sides of the lower end face of the support plate 2, and the needle clip 11 is carried by the first guide mechanism 3 and the second guide mechanism 4, so that the needle clip 11 can easily slide into or out of the support plate 2 through the first guide mechanism 3 and the second guide mechanism 4.

[0062] Based on the above technical solution, when assembling the needle holder 11 with the heat sink, the needle holder 11 is first slid into the support plate 2 through the first guide mechanism 3 and the second guide mechanism 4. Then, the telescopic mechanism 61 drives the positioning pin 62 to pass through the through hole and insert into the positioning hole 111. At this time, multiple lifting mechanisms 5 simultaneously lift the needle holder 11 upward until the back of the needle holder 11 is completely in contact with the support plate 2. During this process, the positioning pin 62 extends into the positioning hole 111 to ensure that the needle holder 11 will not move laterally or longitudinally, thus completing the needle assembly. The card 11 is fixed, and then the heat sink on which the wafer is placed is lifted upward by the high-precision positioning and lifting mechanism, so that the wafer comes into contact with the probe of the card 11 and the heat sink and the card 11 form a sealed cavity. The wafer fixture 1 is assembled by the adsorption and fixation of the card 11. After completion, the lifting mechanism 5 retracts at the same time, driving the wafer fixture 1 to descend. At the same time, the positioning mechanism 6 drives the positioning pin 62 to retract upward, so that the positioning pin 62 is pulled out from the positioning hole 111. At this time, the wafer fixture 1 can be pulled out through the first guide mechanism 3 and the second guide mechanism 4.

[0063] When it is necessary to disassemble the wafer jig 1, the wafer jig 1 is first slid into the support plate 2 through the first guide mechanism 3 and the second guide mechanism 4. Then, the positioning pin 62 is driven through the through hole and inserted into the positioning hole 111 by the telescopic mechanism 61. At this time, multiple lifting mechanisms 5 simultaneously lift the wafer jig 1 upward until the back of the pin card 11 is completely in contact with the support plate 2. During this process, the positioning pin 62 extends into the positioning hole 111 to ensure that the pin card 11 will not move in the horizontal and vertical directions, thus completing the fixing of the wafer jig 1. Then, the high-precision positioning lifting mechanism rises and breaks the vacuum in the sealed cavity formed by the heat sink and the pin card 11. At this time, the high-precision positioning lifting mechanism can drive the heat sink and the wafer to descend until the heat sink and the pin card 11 are separated. Finally, the pin card 11 is driven to descend by the lifting mechanism 5 and the positioning mechanism 6 drives the positioning pin 62 to retract upward, so that the positioning pin 62 is pulled out from the positioning hole 111. At this time, the pin card 11 can be pulled out from under the support plate 2 through the first guide mechanism 3 and the second guide mechanism 4.

[0064] In this embodiment of the invention, the first guide mechanism 3 and the second guide mechanism 4 are respectively disposed on both sides of the lower end face of the support plate 2, and the lower ends of the first guide mechanism 3 and the second guide mechanism 4 are provided with multiple support legs 7, and the first guide mechanism 3 and the second guide mechanism 4 are parallel to each other. The first guide mechanism 3 and the second guide mechanism 4 carry the pin holder 11 of the wafer fixture and are used for the pin holder 11 to slide into or out of the support plate 2. The support plate 2 has multiple through holes that correspond one-to-one with the multiple positioning holes 111 of the pin holder 11. The telescopic mechanism 61 of the positioning mechanism 6 is disposed at the upper end of the through hole, and the positioning pin 62 is connected to the extended end of the telescopic mechanism 61. Thus, the telescopic mechanism 61 can drive the positioning pin 62 to pass through the through hole and insert into the positioning hole 111. The lifting mechanism 5 is provided with support legs 7, and the lifting mechanism 5 drives the pin holder 11 to rise to contact the support plate 2 or to fall to the initial position. With the wafer clamp 1 fixing device disclosed above, since the pin holder 11 of this application can be laterally and longitudinally limited by the positioning mechanism 6 and the lifting mechanism 5, when the wafer is driven to combine with the pin holder 11 by the high-precision lifting mechanism, it can be ensured that the pin holder 11 will not undergo excessive deformation and movement under this pressure.

[0065] Preferably, the telescopic mechanism 61 is a cylinder.

[0066] It should be noted that the telescopic mechanism 61 can be a pneumatic cylinder, a hydraulic cylinder, or other mechanisms capable of driving the pin to rise and fall. Those skilled in the art can choose according to their needs.

[0067] Preferably, the telescopic mechanism 61 is fixed to the support plate 2 by a support frame, and the extension rod of the telescopic mechanism 61 is connected to the positioning pin 62 by a non-rigid connector.

[0068] Specifically, the first guide mechanism 3 includes: a first mounting base 31 and a plurality of first guide wheels 32;

[0069] Multiple first guide wheels 32 are disposed along the length direction of the first mounting base 31 on the side of the first mounting base 31 near the needle clip 11, and the axial direction of the first guide wheel 32 is perpendicular to the side of the first mounting base 31 on which the first guide wheel 32 is mounted. The first guide wheel 32 is used to slide and engage with the first side of the lower end face of the needle clip 11.

[0070] The second guide mechanism 4 includes: a second mounting base 41 and a plurality of second guide wheels 42;

[0071] Multiple second guide wheels 42 are disposed along the length direction of the second mounting base 41 on the side of the second mounting base 41 near the needle holder 11, and the axial direction of the second guide wheels 42 is perpendicular to the side of the second mounting base 41 on which the second guide wheels 42 are mounted. The second guide wheels 42 are used to slide and engage with the second side of the lower end face of the needle holder 11.

[0072] It should be noted that multiple first guide wheels 32 are arranged along the length of the first mounting base 31 on the side of the first mounting base 31 near the needle card 11, and the axial direction of the first guide wheels 32 is perpendicular to the side of the first mounting base 31 on which the first guide wheels 32 are mounted. The first guide wheels 32 are used to slide and engage with the first side of the lower end face of the needle card 11. Similarly, multiple second guide wheels 42 are arranged along the length of the second mounting base 41 on the side of the second mounting base 41 near the needle card 11, and the axial direction of the second guide wheels 42 is perpendicular to the side of the second mounting base 41 on which the second guide wheels 42 are mounted. The second guide wheels 42 are used to slide and engage with the second side of the lower end face of the needle card 11. Thus, when the needle card 11 is pushed down towards the support plate 2, it can not only support the needle card 11, but also reduce the resistance of pushing the needle card 11 in, effectively reduce the wear of the needle card 11, and avoid generating friction debris that contaminates the wafer or affects the operating accuracy of the equipment.

[0073] Furthermore, the first guiding mechanism 3 also includes: multiple third guiding wheels 33;

[0074] The upper end face of the first mounting base 31 is provided with a first mounting groove 311 for mounting the third guide wheel 33 along the length direction, wherein the first mounting groove 311 communicates with the side of the first mounting base 31 where the first guide wheel 32 is mounted.

[0075] The axis of the third guide wheel 33 is perpendicular to the upper end face of the first mounting base 31, and is used to abut against the side wall of the pin clip 11.

[0076] The second guide mechanism 4 also includes: multiple fourth guide wheels 43;

[0077] The upper end face of the second mounting base 41 is provided with a second mounting groove 411 for mounting the fourth guide wheel 43 along the length direction, wherein the second mounting groove 411 communicates with the side of the second mounting base 41 where the second guide wheel 42 is mounted.

[0078] The axial direction of the fourth guide wheel 43 is perpendicular to the upper end face of the second mounting base 41, and is used to abut against the side wall of the pin clip 11.

[0079] It should be noted that by setting a third guide wheel 33 and providing a first mounting groove 311 for mounting the third guide wheel 33 along the length direction on the upper end face of the first mounting base 31, the first mounting groove 311 communicates with the side of the first mounting base 31 where the first guide wheel 32 is mounted. The axial direction of the third guide wheel 33 is perpendicular to the upper end face of the first mounting base 31 and abuts against the side wall of the pin holder 11. Additionally, a second mounting groove 411 for mounting the fourth guide wheel 43 is provided along the length direction on the upper end face of the second mounting base 41. The second mounting groove 411 communicates with the side of the second mounting base 41 where the second guide wheel 42 is mounted. The axial direction of the fourth guide wheel 43 is perpendicular to the upper end face of the second mounting base 41 and abuts against the side wall of the pin holder 11. Therefore, when the pin holder 11 is pushed downwards towards the support plate 2, the friction between the two sides of the pin holder 11 and the first and second mounting bases 31 is effectively reduced, thereby reducing wear on both sides of the pin holder 11 and further preventing friction debris from contaminating the wafer or affecting the operating accuracy of the equipment.

[0080] Specifically, the inner sides of the pin card 11 are provided with a first positioning groove 112 and a second positioning groove 113 at both ends;

[0081] The first end of the first mounting base 31 is provided with a first positioning structure 312 that cooperates with the first positioning groove 112;

[0082] The first end of the second mounting base 41 is provided with a second positioning structure 412 that cooperates with the second positioning groove 113.

[0083] It should be noted that by providing a first positioning groove 112 and a second positioning groove 113 at both ends of the inner side of the needle clip 11, and providing a first positioning structure 312 that cooperates with the first positioning groove 112 at the first end of the first mounting base 31, and a second positioning structure 412 that cooperates with the second positioning groove 113 at the first end of the second mounting base 41, when the needle clip 11 is pushed down towards the support plate 2, the position of the needle clip 11 can be fixed by the cooperation of the first positioning structure 312 with the first positioning groove 112 and the cooperation of the second positioning structure 412 with the second positioning groove 113, ensuring that the positioning hole 111 is coaxial with the through hole, so as to ensure that the telescopic mechanism 61 can drive the positioning pin 62 to pass through the through hole and insert into the positioning hole 111.

[0084] Specifically, the first positioning groove 112 is a V-shaped groove;

[0085] The first positioning structure 312 is a cylinder;

[0086] The second positioning groove 113 is a C-shaped groove;

[0087] The second positioning structure 412 is a cylinder.

[0088] It should be noted that the first positioning groove 112 can be a V-shaped groove or a groove of other shapes (such as a C-shaped groove), and those skilled in the art can choose according to their needs.

[0089] The second positioning groove 113 can be a C-shaped groove or a groove of other shapes (such as a V-shaped groove), and those skilled in the art can choose according to their needs.

[0090] Furthermore, multiple first guide wheels 32 are spaced at preset intervals along the length direction of the first mounting base 31;

[0091] Multiple second guide wheels 42 are spaced at preset distances along the length direction of the second mounting base 41.

[0092] It should be noted that by setting multiple first guide wheels 32 at preset intervals along the length direction of the first mounting base 31, and multiple second guide wheels 42 at preset intervals along the length direction of the second mounting base 41, the force is more even when the pin clip 11 is pushed into or pulled out from under the support plate 2, further reducing the resistance to the movement of the pin clip 11 and further reducing the wear of the pin clip 11, thereby avoiding the generation of friction debris that contaminates the wafer or affects the operating accuracy of the equipment.

[0093] Specifically, the lifting mechanism 5 includes: multiple telescopic components 51 and multiple connecting plates 52;

[0094] Telescopic component 51 is provided on support leg 7;

[0095] The connecting plate 52 is vertically disposed below the support plate 2, and the connecting plate 52 is connected to the extended end of the telescopic member 51. The upper part of the connecting plate 52 is provided with a clearance opening 521 for avoiding the first guide wheel 32 or the second guide wheel 42.

[0096] It should be noted that the telescopic component 51 is set on the support leg 7, and the connecting plate 52 is vertically set below the support plate 2. The connecting plate 52 is connected to the extended end of the telescopic component 51, and a clearance opening 521 is provided on the upper part of the connecting plate 52 to avoid the first guide wheel 32 or the second guide wheel 42. When the telescopic component 51 extends and retracts, it can drive the connecting plate 52 to move upward. When the connecting plate 52 contacts the needle clip 11, the telescopic mechanism 61 continues to drive the connecting plate 52 to rise. At this time, the connecting plate 52 pushes the needle clip 11 upward, causing the needle clip 11 to move upward until the back of the needle clip 11 is completely abutted against the support plate 2. During this process, the positioning pin 62 extends into the positioning hole 111 to ensure that the needle clip 11 will not move laterally or longitudinally, thus completing the fixation of the needle clip 11.

[0097] Preferably, each connecting plate 52 is connected to two telescopic members 51.

[0098] It should be noted that by connecting each connecting plate 52 to two telescopic components 51, the connecting plate 52 can be raised and lowered simultaneously by the two telescopic components 51, which can effectively ensure the stability of the raising and lowering of the connecting plate 52 and provide sufficient lifting force.

[0099] Specifically, the telescopic component 51 is a cylinder.

[0100] It should be noted that the telescopic component 51 can be a pneumatic cylinder, a hydraulic cylinder, or a mechanism that can drive the connecting plate 52 to rise and fall. Those skilled in the art can choose according to their needs.

[0101] Furthermore, the lifting mechanism 5 also includes: multiple adjusting bolts 53;

[0102] Multiple adjusting bolts 53 are arranged along the length of the upper end of the connecting plate 52, and the adjusting bolts 53 are located between adjacent clearance openings 521.

[0103] It should be noted that the adjusting bolt 53 is set along the length of the upper end of the connecting plate 52, and the adjusting bolt 53 is located between adjacent clearance openings 521. Thus, by adjusting the adjusting bolt 53, the upper end of the connecting plate 52 can be fully in contact with the lower end of the pin clip 11, avoiding uneven force on the pin clip 11 and damage.

[0104] Furthermore, the wafer fixture 1 fixing device also includes a lubrication guide sleeve 8 disposed in the through hole.

[0105] It should be noted that by setting a lubricating guide sleeve 8 inside the through hole, the friction between the pin and the through hole can be reduced, thereby reducing the wear of the pin and extending its service life.

[0106] Preferred, Reference Figure 8 The lubrication guide sleeve 8 is a graphite copper sleeve.

[0107] It should be noted that graphite copper bushing is a self-lubricating bearing with a copper alloy base and embedded solid lubricating material.

[0108] Preferably, the lower end of the locating pin 62 is chamfered.

[0109] It should be noted that by setting a chamfer at the lower end of the positioning pin 62, a larger range of guiding positioning can be achieved. Thus, even if the position of the pin card 11 is not particularly accurate, the positioning pin 62 can still be fully inserted into the positioning hole 111, and the pin card 11 can be accurately positioned.

[0110] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer chuck fixing device, characterized in that, the wafer chuck fixing device comprises a support plate, a first guide mechanism, a second guide mechanism, a plurality of lifting mechanisms, a plurality of positioning mechanisms and a plurality of support legs; the first guide mechanism and the second guide mechanism are respectively arranged on both sides of the lower end surface of the support plate, and the lower ends of the first guide mechanism and the second guide mechanism are each provided with a plurality of support legs, wherein the first guide mechanism is parallel to the second guide mechanism; the first guide mechanism and the second guide mechanism are used to bear a needle chuck of a wafer chuck and to slide the needle chuck into or out from under the support plate; the support plate is provided with a plurality of through holes corresponding to a plurality of positioning holes of the needle chuck; the positioning mechanism comprises a telescopic mechanism and a positioning pin; the telescopic mechanism is arranged at the upper end of the through hole; the positioning pin is connected to the extension end of the telescopic mechanism, and the telescopic mechanism is used to drive the positioning pin to pass through the through hole and insert into the positioning hole; the lifting mechanism is arranged on the support leg, and the lifting mechanism is used to drive the needle chuck to rise to contact the support plate or to drop to an initial position.

2. The wafer chuck fixture apparatus of claim 1, wherein, the first guide mechanism comprises a first mounting seat and a plurality of first guide wheels; a plurality of first guide wheels are arranged on the side of the first mounting seat close to the needle chuck along the length direction of the first mounting seat, and the axial direction of the first guide wheel is perpendicular to the side of the first mounting seat on which the first guide wheel is mounted, and the first guide wheel is used to slide with the first side of the lower end surface of the needle chuck; the second guide mechanism comprises a second mounting seat and a plurality of second guide wheels; a plurality of second guide wheels are arranged on the side of the second mounting seat close to the needle chuck along the length direction of the second mounting seat, and the axial direction of the second guide wheel is perpendicular to the side of the second mounting seat on which the second guide wheel is mounted, and the second guide wheel is used to slide with the second side of the lower end surface of the needle chuck.

3. The wafer chuck fixture apparatus of claim 2, wherein, the first guide mechanism further comprises a plurality of third guide wheels; the upper end surface of the first mounting seat is provided with a first mounting groove along the length direction for mounting the third guide wheel, wherein the first mounting groove is communicated with the side of the first mounting seat on which the first guide wheel is mounted; the axial direction of the third guide wheel is perpendicular to the upper end surface of the first mounting seat, and the third guide wheel is used to abut against the side wall of the needle chuck; the second guide mechanism further comprises a plurality of fourth guide wheels; the upper end surface of the second mounting seat is provided with a second mounting groove along the length direction for mounting the fourth guide wheel, wherein the second mounting groove is communicated with the side of the second mounting seat on which the second guide wheel is mounted; the axial direction of the fourth guide wheel is perpendicular to the upper end surface of the second mounting seat, and the fourth guide wheel is used to abut against the side wall of the needle chuck.

4. The wafer chuck fixture apparatus of claim 2, wherein, first and second positioning grooves are respectively arranged at the two ends of the inner side of the needle chuck; the first end of the first mounting seat is provided with a first positioning structure matched with the first positioning groove; the first end of the second mounting seat is provided with a second positioning structure matched with the second positioning groove.

5. The wafer chuck fixture apparatus of claim 2, wherein, the first positioning groove is a V-shaped groove; the first positioning structure is a cylinder; the second positioning groove is a C-shaped groove; The second positioning structure is a cylinder.

6. The wafer chuck fixture apparatus of claim 2, wherein, A plurality of the first guide wheels are arranged along the length direction of the first mounting base at a preset distance. A plurality of the second guide wheels are arranged along the length direction of the second mounting base at the preset distance.

7. The wafer chuck fixture apparatus of claim 6, wherein, The jacking mechanism comprises a plurality of telescopic members and a plurality of connecting plates. The telescopic members are arranged on the support legs. The connecting plates are arranged vertically below the support plates, and the connecting plates are connected to the extending ends of the telescopic members.

8. The wafer chuck fixture apparatus of claim 7, wherein, The telescopic members are air cylinders.

9. The wafer chuck fixture apparatus of claim 7, wherein, The jacking mechanism further comprises a plurality of adjusting bolts. The adjusting bolts are arranged along the length direction of the upper ends of the connecting plates, and the adjusting bolts are located between adjacent avoiding openings.

10. The wafer chuck fixture apparatus of claim 1, wherein, Further comprising: A lubricating guide sleeve arranged in the through hole.

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