Electronic device and manufacturing method thereof, circuit board, packaging module and manufacturing method thereof

Abstract

The embodiment of the invention provides an electronic device, a manufacturing method of the electronic device, a circuit board, a packaging module, a manufacturing method of the packaging module and electronic equipment. The electronic device comprises a device body and a plurality of pins arranged on the peripheral side of the device body, each pin comprises a first part and a second part, the first part is located on the bottom face of the device body, and the second part is located on the side face of the device body. According to the technical scheme provided by the embodiment of the invention, the mounting height of the electronic device can be reduced on the premise of meeting the mounting reliability requirement of the electronic device, so that the overall thickness of the packaging module is reduced.

Description

Technical Field

[0001] This application relates to the field of packaging technology, and in particular to an electronic device, a method for manufacturing the electronic device, a circuit board, a packaging module, a method for manufacturing the packaging module, and an electronic device. Background Technology

[0002] In related technologies, with the trend towards thinner electronic devices such as mobile phones and smartwatches, higher requirements are being placed on the size of the packaging modules used to support certain functions. Currently, the thickness of the packaging module has become a major factor restricting the further development of thinner electronic devices. How to reduce the thickness of the packaging module is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0003] This application provides an electronic device, a method for manufacturing the electronic device, a circuit board, a packaging module, a method for manufacturing the packaging module, and an electronic device, so as to reduce the overall thickness of the packaging module.

[0004] According to one aspect of this application, an electronic device is provided, which includes a device body and a plurality of pins, the plurality of pins being disposed on the periphery of the device body, wherein each pin includes a first part and a second part, the first part being located on the bottom surface of the device body and the second part being located on the side surface of the device body.

[0005] According to the technical solution of the embodiments of this application, at least the following technical effects can be obtained: On the one hand, since both the first part and the second part can be soldered to the pads of the circuit board by soldering, the soldering joint area is large, so the electronic device can be reliably mounted on the circuit board; on the other hand, under the premise of meeting the mounting reliability requirements, the amount of solder between the first part and the pads can be appropriately reduced, so that the mounting height of the electronic device is lower, and the overall thickness of the packaging module is smaller.

[0006] In some embodiments, the device body includes four sides and four corners, wherein a plurality of pins are distributed on the four sides; or, a plurality of pins are distributed on two opposite sides of the four sides; or, at least one of the plurality of pins is correspondingly located at at least one corner of the four corners. The number and position of the pins can be designed according to the specific product type of the electronic device.

[0007] In some embodiments, the second portion is flush with the top surface of the device body; or, there is a gap between the second portion and the top surface of the device body. The specific dimensions of the pins can be designed according to the product design requirements of the electronic device and related manufacturing processes.

[0008] In some embodiments, the electronic device includes a capacitor, a surface acoustic wave filter, or a power amplifier. Based on the aforementioned design, the electronic device can achieve a lower mounting height on a circuit board.

[0009] According to one aspect of this application, a method for manufacturing an electronic device is provided, comprising:

[0010] An electronic device wafer is provided, the electronic device wafer comprising a plurality of wafer cells spaced apart by mesh slots;

[0011] An electroplating layer is formed on one surface of an electronic device wafer. The electroplating layer comprises multiple electroplating units spaced apart from each other, wherein each electroplating unit is formed on the bottom and side surfaces of a mesh-like partition, and on the surface of an adjacent wafer unit; and

[0012] The electronic device wafer and the electroplated layer are cut along the mesh groove to separate multiple wafer units from each other and to form multiple pins on the periphery of each wafer unit. Each wafer unit serves as the device body of the electronic device, and each pin is cut from the electroplated layer. Each pin includes a first part and a second part. The first part is located on the bottom surface of the device body, and the second part is located on the side surface of the device body.

[0013] The electronic device manufactured according to the above-described embodiments of this application can not only be reliably mounted on a circuit board, but also achieve a lower mounting height, thereby making the overall thickness of the package module smaller.

[0014] According to one aspect of this application, a circuit board is provided, comprising a first side and a second side, and including: N metal layers arranged sequentially in a direction away from the first side; at least one dielectric layer spacing the N metal layers from each other; a plurality of via metals electrically connecting the N metal layers; and a solder resist layer covering a portion of the surface of the first metal layer, the solder resist layer having a first opening; wherein the first side has a groove exposed to the first opening, a portion of the metal of the m-th metal layer is exposed to the bottom of the groove, at least two via metals located on the side of the m-th metal layer near the first side are exposed to the side of the groove and together with the portion of the m-th metal layer serve as a first pad group, the first pad group including a plurality of first pads, wherein N≥2, 2≤m≤N.

[0015] In these embodiments, based on the circuit board design, the electronic components are partially recessed into the grooves in the thickness direction, which results in a lower mounting height for the electronic components and consequently a smaller overall thickness of the package module.

[0016] In some embodiments, the solder mask layer further has a second opening that exposes a portion of the metal of the first metal layer. This portion of the metal of the first metal layer serves as a second pad group, which includes multiple second pads. In actual circuit board design, the thickness of each electronic device to be mounted needs to be comprehensively considered. For example, for electronic devices with the largest or largest thickness, a first pad group can be designed on the circuit board, and the electronic device is designed with reference to the aforementioned structure. For electronic devices with smaller thickness, a second pad group can be designed on the circuit board; this electronic device can be a conventional electronic device. Thus, after assembling the circuit board with the various electronic devices, the overall thickness is small, resulting in a smaller overall thickness of the packaging module.

[0017] According to one aspect of this application, a packaging module is provided, comprising: a first circuit board including a plurality of pad groups, wherein each pad group includes a plurality of pads; and a plurality of electronic devices, which are configured one-to-one with the plurality of pad groups, wherein each electronic device includes a plurality of pins, the plurality of pins being soldered one-to-one with the plurality of pads of the corresponding pad group, and the plurality of electronic devices including a first electronic device, the first electronic device being an electronic device designed using the aforementioned embodiment.

[0018] According to the packaging module of the present application embodiment, the pin of at least one electronic device includes a first part and a second part. Both the first part and the second part can be soldered to the pad by solder, so that they can be reliably mounted on the first circuit board. Furthermore, since the amount of solder between the first part of the pin and the pad can be appropriately reduced, the mounting height of the at least one electronic device is lower, thereby helping to reduce the overall thickness of the packaging module.

[0019] In some embodiments, the first circuit board includes a first side and a second side, and includes: N metal layers arranged sequentially in a direction away from the first side; at least one dielectric layer spacing the N metal layers apart; a plurality of via metals electrically connecting the N metal layers; and a solder mask layer covering a portion of the surface of the first metal layer, the solder mask layer having a first opening, wherein the first side has a groove exposed in the first opening, a portion of the metal of the m-th metal layer is exposed at the bottom of the groove, at least two via metals located on the side of the m-th metal layer near the first side are exposed on the side of the groove, and the portion of the metal of the m-th metal layer serves as a pad group corresponding to a first electronic device, wherein N≥2, 2≤m≤N. In these embodiments, the first electronic device is partially recessed into the groove in the thickness direction, thus resulting in a lower mounting height and facilitating further reduction in the overall thickness of the package module.

[0020] In some embodiments, the plurality of electronic devices further includes a second electronic device; the solder mask layer also has a second opening that exposes a portion of the metal of the first metal layer, the portion of the metal of the first metal layer serving as a pad group corresponding to the second electronic device. In the actual design of the packaging module, the thickness dimensions of each electronic device need to be comprehensively considered. This ensures that after assembling the circuit board with each electronic device, the overall thickness is small, resulting in a smaller overall thickness of the packaging module.

[0021] In some embodiments, the first electronic device and the second electronic device are arranged sequentially along a direction away from the second surface, and the orthographic projection of the first electronic device on the second surface is located within the orthographic projection of the second electronic device on the second surface. Since the mounting height of the first electronic device is relatively low, various arrangement schemes can be selected for the first and second electronic devices, provided that the module thickness design requirements are met. For example, they can be arranged in a flat arrangement or along the thickness direction.

[0022] In some embodiments, the packaging module further includes a second circuit board, which is soldered to the first side via solder balls.

[0023] In some embodiments, at least one of the multiple electronic devices is disposed on the second side, and the packaging module further includes a second circuit board, which is soldered to the second side of the first circuit board via solder balls.

[0024] Because the mounting height of the first electronic component is relatively low, the package module can include multiple circuit boards, provided that the module thickness design requirements are met. The design can be more flexible; for example, one can be used as the motherboard and another as the sub-board.

[0025] According to one aspect of this application, a method for manufacturing a packaging module is provided, comprising:

[0026] A circuit board according to the foregoing embodiments is provided;

[0027] A stepped steel mesh is provided, which is aligned with the first surface of the circuit board to define a filling recess. The stepped steel mesh includes a planar shielding area, a stepped shielding area and a cutout area. A portion of the stepped shielding area is recessed into the groove and has a gap with a portion of the groove surface to expose the first pad group to the filling recess.

[0028] Fill the filling recess with brazing filler metal;

[0029] Separate the stepped steel mesh from the circuit board; and

[0030] An electronic device according to the foregoing embodiments is provided, wherein a plurality of pins of the electronic device are soldered to a first pad group by soldering metal left on the first pad group.

[0031] In the packaging module manufactured by the above-described embodiments of this application, at least one electronic device has a portion recessed into the groove in the thickness direction, which reduces the mounting height and thus allows the packaging module to have a smaller thickness dimension.

[0032] According to one aspect of this application, an electronic device is provided, which includes a housing and an encapsulation module disposed within the housing according to the foregoing embodiments.

[0033] Because the packaging module has a small thickness, it occupies less space inside the electronic device, which provides ample design space for further optimization of the internal structure of the electronic device and for the thinner design of the electronic device. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of a partial cross-sectional structure of an RF module based on some related technologies;

[0035] Figure 2 This is a partial cross-sectional structural diagram of an electronic device according to some embodiments of this application after being applied to a packaging module;

[0036] Figure 3A This is a top view and a cross-sectional view of an electronic device according to some embodiments of this application, cut along the AA direction.

[0037] Figure 3B This is a top view and a cross-sectional view of an electronic device according to some embodiments of this application, taken along the BB direction.

[0038] Figure 3C This is a top view and a cross-sectional view of an electronic device according to some embodiments of this application, cut along the CC direction.

[0039] Figure 4A This is a schematic flowchart illustrating a method for manufacturing an electronic device according to some embodiments of this application;

[0040] Figure 4B This is a graphical schematic diagram illustrating a method for manufacturing an electronic device according to some embodiments of this application;

[0041] Figure 5A This is a partial cross-sectional structural diagram of a packaging module according to some embodiments of this application;

[0042] Figure 5B This is a partial cross-sectional structural diagram of a packaging module according to some embodiments of this application;

[0043] Figure 5C This is a partial cross-sectional structural diagram of a packaging module according to some embodiments of this application;

[0044] Figure 6A This is a flowchart illustrating a method for manufacturing a packaging module according to some embodiments of this application;

[0045] Figure 6B This is a graphical schematic diagram illustrating a method for manufacturing a packaging module according to some embodiments of this application;

[0046] Figure 7 This is a structural block diagram of an electronic device according to some embodiments of this application.

[0047] Figure label:

[0048] Related technical aspects:

[0049] 001-RF module; 010-Circuit board; 011-Capacitor; 012-Surface acoustic wave filter; 013-Power amplifier;

[0050] 014-Metal layer; 015-Dielectric layer; 016-Through metal; 017-Pin; 018-Pad; 019-Solder metal.

[0051] Part of the embodiments of this application:

[0052] 100, 430 - Electronic components; 430a - First electronic component; 430b - Second electronic component; 110 - Component body; 120 - Pin;

[0053] 121 - Part 1; 122 - Part 2; 210 - Electronic device wafer; 211 - Mesh septum; 2100 - Wafer unit; 212 - Electroplating layer;

[0054] 2120 - Electroplating unit; 300, 130 - Circuit board; 300a - First side; 300b - Second side; 301 - Metal layer; 302 - Dielectric layer;

[0055] 303 - Via metal; 304 - Solder mask; 305 - First window; 306 - Groove; 307 - First pad group; 3070 - First pad;

[0056] 308 - Second pad group; 3080 - Second pad; 309 - Second window; 400 - Package module; 410 - First circuit board; 420 - Pad group;

[0057] 131, 421 - Pads; 450 - Solder balls; 440 - Second circuit board; 200, 500 - Manufacturing method; S11~S13, S21~S25 - Steps;

[0058] 501 - Stepped steel mesh; 502 - Filled recess; 503 - Planar shielding area; 504 - Stepped shielding area; 505 - Hollowed-out area; 506 - Brazing filler metal;

[0059] 600 - Electronic equipment; 610 - Housing. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of this application clearer, the application will be described in further detail below with reference to the accompanying drawings.

[0061] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0062] References to “an embodiment” or “a specific embodiment” as used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. The terms “comprising,” “including,” “having,” and variations thereof mean “including, but not limited to,” unless otherwise specifically emphasized.

[0063] With the trend towards thinner and smaller electronic devices, higher requirements are being placed on the size of the packaging modules inside to support certain functions. Taking mobile phones as an example, they generally contain an RF module that is mainly used to handle the wireless signal transmission between the phone and the communication network. This RF module is manufactured as a packaging module through packaging technology.

[0064] like Figure 1 The diagram shows a partial cross-sectional view of an RF module 001 based on some related technologies. The main structure of the RF module 001 includes a circuit board 010, and a 010015-type capacitor 011 (a passive device, 010015 being its specification number), a surface acoustic wave (SAW) filter 012, and a power amplifier 013, etc., mounted on the surface of the circuit board 010 using surface mount technology (SMT). The circuit board 010 includes multiple metal layers 014 spaced apart by dielectric layers 015 and electrically connected by vias 016. The capacitor 011, SAW filter 012, and power amplifier 013 are electrically connected to the metal layer 014 closest to the surface of the circuit board 010.

[0065] SMT (Surface Mount Technology) is a processing technology that mounts electronic components onto the surface of a circuit board. It is a crucial step in the packaging process and, compared to traditional through-hole technology (THT), significantly simplifies the process, reduces production time and costs, and improves production efficiency and product quality. The basic working principle of the surface acoustic wave (SAW) filter device 012 is that at the input end, it converts a wireless signal into an acoustic signal through the piezoelectric effect, which propagates on the surface of the medium. At the output end, it converts the acoustic signal back into a wireless signal through the inverse piezoelectric effect. The basic working principle of the power amplifier device 013 is that it uses the current control of a transistor or the voltage control of a field-effect transistor to convert the power from the power supply into a current that varies according to the input signal.

[0066] from Figure 1 As can be seen from these related technologies, the capacitor 011 has a larger thickness dimension H1 than the surface acoustic wave filter 012 and the power amplifier 013, making it the main factor restricting the further thinning of the RF module 001.

[0067] In view of this, embodiments of this application provide an electronic device, a method for manufacturing the electronic device, a circuit board, a packaging module, a method for manufacturing the packaging module, and an electronic device, to reduce the overall thickness of the packaging module. The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0068] like Figure 2 and Figure 3A As shown, where, Figure 2 This is a partial cross-sectional structural diagram of the packaging module 400 after the electronic device 100 according to some embodiments of this application is applied to the packaging module 400. Figure 3A The diagram shows a top view and cross-sectional view of an electronic device 100 according to some embodiments of this application. In these embodiments, the electronic device 100 includes a device body 110 and a plurality of pins 120. The device body 110 is used to implement the basic functions of the device, and the pins 120 serve as ports of the electronic device 100 for electrical connection with corresponding pads 131 on a circuit board 130 via soldering. In these embodiments of this application, the plurality of pins 120 are disposed on the periphery of the device body 110. Each pin 120 includes a first portion 121 and a second portion 122, wherein the first portion 121 is located on the bottom surface of the device body 110, and the second portion 122 is located on the side surface of the device body 110.

[0069] In this embodiment, the specific product type of electronic device 100 may include, but is not limited to, capacitor devices, surface acoustic wave filter devices, or power amplifier devices. The specific product type of packaging module 400 may include, but is not limited to, radio frequency modules.

[0070] In this embodiment, the "bottom surface of the device body 110" can be understood as the side of the device body 110 facing the circuit board 130 after the electronic device 100 and the circuit board 130 are assembled. The "side surface of the device body 110" and the "bottom surface of the device body 110" can be perpendicular or at a certain angle. The pins 120 and the corresponding pads 131 on the circuit board 130 can be electrically connected by soldering.

[0071] Brazing is a welding method in which both the filler metal and the workpiece are heated to their melting point (below the melting point of the filler metal), and the liquid filler metal fills the gaps between the workpieces to form a metal connection. Based on the welding temperature, brazing can be divided into two main categories: brazing with a welding temperature not exceeding 450°C is called soft brazing, and brazing with a temperature exceeding 450°C is called hard brazing. In the embodiments of this application, the welding of pin 120 to the corresponding pad 131 can be achieved through soft brazing, and the filler metal can be, for example, a tin-lead alloy.

[0072] Electronic devices employing conventional designs, such as the capacitor 011, surface acoustic wave filter 012, and power amplifier 013 mentioned above, refer to... Figure 1 As shown, multiple pins 017 are located at the bottom of the device. To reliably solder to the corresponding pads 018 on the circuit board 010, sufficient solder 019 needs to be filled between the pins 017 and the pads 018, resulting in a relatively high mounting height for the electronic component. For example, the 010015 type capacitor 011, due to its larger thickness compared to the surface acoustic wave filter 012 and power amplifier 013, has a higher mounting height H1, which is crucial in determining the overall thickness of the RF module 001. In this paper, "mounting height of electronic components" can be understood as the height of the electronic component protruding from the circuit board surface after mounting.

[0073] like Figure 2 As shown, according to the technical solution of the embodiment of this application, the first part 121 of each pin 120 is located on the bottom surface of the device body 110, and the second part 122 of each pin 120 is located on the side surface of the device body 110. In this way, at least the following technical effects can be obtained:

[0074] On the one hand, since both the first part 121 and the second part 122 can be soldered to the pad 131 by the solder 506, the soldering area is large, so the electronic device 100 can be reliably mounted on the circuit board 130.

[0075] On the other hand, while meeting the requirements for mounting reliability, the amount of solder between the first part 121 and the pad 131 can be appropriately reduced. In this way, compared with the traditionally designed electronic devices, the mounting height H2 of the electronic device 100 is lower, resulting in a smaller overall thickness of the packaging module 400.

[0076] In some embodiments of this application, the device body 110 may be generally rectangular, such as square (e.g. Figure 3A (As shown) or a rectangle, which includes four sides and four corners. The number of pins 120 included in the electronic device 100 is not limited; for example, it can have two, four, six, or eight pins, etc. The number and position of the pins 120 can be designed according to the specific product type of the electronic device 100. For example... Figure 3A , 3B and Figure 3C As shown, it illustrates the top view and cross-sectional structure of some electronic devices 100 with different design forms.

[0077] like Figure 3A As shown, in some embodiments of this application, a plurality of pins 120 may be distributed on the four sides of the device body 110. For example, eight pins 120 are distributed in pairs on the four sides of the device body 110.

[0078] like Figure 3B As shown, in some embodiments of this application, a plurality of pins 120 may be distributed on two opposite sides of the four sides. For example, the four pins 120 are distributed in pairs on two opposite sides of the device body 110.

[0079] In some embodiments of this application, at least one of the plurality of pins 120 can be correspondingly located at at least one of the four corners. For example... Figure 3C As shown, in these embodiments, the four pins 120 are respectively located at the four corners.

[0080] Understandably, based on the number and location of the pins 120 of the electronic device 100, the number and location of the pads 131 on the circuit board 130 corresponding to the electronic device 100 should be designed accordingly.

[0081] like Figure 3A and Figure 3B As shown, in some embodiments of this application, the second portion 122 of pin 120 can be flush with the top surface of the device body 110. This allows for more solder to be positioned between the second portion 122 and the pad 131, thereby reducing the amount of solder used between the first portion 121 and the pad 131, further lowering the mounting height of the electronic device 100. Furthermore, this design facilitates soldering operations.

[0082] like Figure 3CAs shown, in some other embodiments of this application, the second part 122 of pin 120 may also have a gap with the top surface of the device body 110. Specifically, it can be designed according to the product design requirements of electronic device 100, related production processes, etc.

[0083] According to some embodiments of this application, a method for manufacturing the electronic device 100 of the foregoing embodiments is also provided. For example... Figure 4A and Figure 4B As shown, where, Figure 4A This illustration shows a flowchart of a method for manufacturing an electronic device 100 according to some embodiments of this application. Figure 4B This is a graphical representation of the manufacturing method 200. The manufacturing method 200 may include the following steps S11 to S13.

[0084] In step S11, an electronic device wafer 210 is provided. Figure 4B The diagram illustrates a partial structure of the electronic device wafer 210, which includes multiple wafer units 2100 spaced apart by mesh trenches 211. Each wafer unit 2100 will eventually be fabricated into the device body 110 of the electronic device 100 to realize the basic functions of the electronic device 100.

[0085] In step S12, an electroplating layer 212 is formed on one side surface of the electronic device wafer 210. The electroplating layer 212 includes a plurality of electroplating units 2120 spaced apart from each other. Each electroplating unit 2120 is formed on the bottom and side surfaces of the mesh trench 211 and on the surface of the adjacent wafer unit 2100. The electroplating layer 212 is used to form the pins 120 of the electronic device 100, thereby serving as a port of the electronic device 100.

[0086] In step S13, the electronic device wafer 210 and the electroplated layer 212 are cut along the mesh groove 211 to separate multiple wafer units 2100 from each other and to form multiple pins 120 on the periphery of each wafer unit 2100. Each wafer unit 2100 serves as the device body 110 of the electronic device 100. Each pin 120 is cut from the electroplated layer 212 and includes a first part 121 and a second part 122. The first part 121 is located on the bottom surface of the device body 110 and the second part 122 is located on the side surface of the device body 110.

[0087] In some embodiments of this application, the above-described manufacturing method 200 may include other manufacturing steps in addition to steps S11 to S13, such as thinning the electronic device wafer 210 or peeling off the support layer, edge processing of the cut electronic device wafer 210, etc. This application does not limit these steps.

[0088] like Figure 2As shown, the electronic device 100 manufactured according to the above-described embodiment of this application can not only be reliably mounted on the circuit board 130, but also achieve a lower mounting height compared to conventionally designed electronic devices, thereby making the overall thickness of the packaging module 400 smaller.

[0089] According to some embodiments of this application, a circuit board is also provided. For example... Figure 5A The diagram shows a partial cross-sectional view of a packaging module 400 after a circuit board 300 according to some embodiments of this application is applied. The circuit board 300 includes a first surface 300a and a second surface 300b, and includes: N metal layers 301 (N=4 in the diagram) arranged sequentially in a direction away from the first surface 300a; at least one dielectric layer 302 spacing the N metal layers 301 from each other; a plurality of via metals 303 electrically connecting the N metal layers 301; and a solder resist layer 304 covering a portion of the surface of the first metal layer. The solder resist layer 304 has a first opening 305. The first surface 300a... A groove 306 is exposed to the first opening 305. Part of the metal of the m-th (m=2 in the figure) metal layer is exposed at the bottom of the groove 306. At least two via metals 303 located on the side of the m-th metal layer near the first surface 300a are exposed on the side of the groove 306 and together with the part of the metal of the m-th metal layer, they are used as a first pad group 307. The first pad group 307 includes a plurality of first pads 3070, where N≥2 and 2≤m≤N.

[0090] In this embodiment, the circuit board can be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPC). The metal layer 301 can be, for example, a copper layer, used for the circuit structure of the circuit board 300. The dielectric layer 302 can be, for example, a prepreg (PP) layer or a core layer, used as an interlayer insulating layer. The via metal 303 can be, for example, copper, used to achieve electrical connections between different metal layers 301. The solder mask layer 304 can be, for example, an acrylic oligomer (also known as green solder mask), used as a protective layer.

[0091] like Figure 5AAs shown, in the circuit board 300 according to an embodiment of this application, a portion of the metal of the m-th metal layer and at least two via metals 303 located on the side of the m-th metal layer near the first surface 300a together constitute a first pad group 307, which can be soldered to the electronic device 100 of the above embodiment or to a plurality of pins 120 of the electronic device manufactured according to the manufacturing method 200 of the above embodiment. The portion of the metal of the m-th metal layer is used to solder to the first portion 121 of the plurality of pins 120, and the at least two via metals 303 located on the side of the m-th metal layer near the first surface 300a are used to solder to the second portion 122 of the plurality of pins 120. In this way, a portion of the electronic device 100 is recessed into the groove 306 in the thickness direction, resulting in a lower mounting height for the electronic device 100 and consequently, a smaller overall thickness of the package module 400. In some embodiments, using the circuit board 300 and electronic device 100 designed above, the mounting height of the electronic device 100 can be reduced by 25–40 micrometers.

[0092] In the embodiments of this application, the parameters N and m take values ​​within the above-defined range, and the specific values ​​are not limited in the embodiments of this application. For example, in some embodiments, the circuit board structure can be designed such that a portion of the metal of the third metal layer and a plurality of via metals 303 located on the side of the third metal layer near the first surface 300a together constitute a first pad group 307, which can be soldered to the electronic device 100 of the above embodiments or a plurality of pins 120 of the electronic device manufactured according to the manufacturing method 200 of the above embodiments. These embodiments are not illustrated in the accompanying drawings.

[0093] like Figure 5A As shown, in some embodiments of this application, the solder mask layer 304 may also have a second opening 309 that exposes a portion of the metal of the first metal layer. This portion of the metal of the first metal layer serves as a second pad group 308, which includes a plurality of second pads 3080. The second pad group 308 can be used to mount electronic devices, such as those described above, employing conventional designs. To distinguish them from conventional electronic devices, in some descriptions below, the electronic device 100 designed according to embodiments of this application will be referred to as a first electronic device 430a, and the conventional electronic device will be referred to as a second electronic device 430b.

[0094] In this embodiment, the specific number and location of the first pad group 307 and the second pad group 308 are not limited. When designing the circuit board 300, the thickness of each electronic device to which it is mounted needs to be comprehensively considered. For example, for electronic devices with the largest or largest thickness, a first pad group 307 can be designed on the circuit board 300, and the electronic device is designed with reference to the structure of the aforementioned first electronic device 430a. For electronic devices with smaller thickness, a second pad group 308 can be designed on the circuit board 300; this electronic device can be a conventional electronic device, i.e., the aforementioned second electronic device 430b. Thus, after assembling the circuit board 300 with the various electronic devices, the overall thickness is small, resulting in a smaller overall thickness of the packaging module 400.

[0095] In some embodiments of this application, the second surface 300b of the circuit board 300 may also be designed with reference to the above embodiments to create the structure of the first pad group 307, thereby providing the first pad group 307 on both sides of the circuit board 300. Furthermore, when the circuit board 300 includes a plurality of second pad groups 308, the plurality of second pad groups 308 may be disposed on both sides or one side of the circuit board 300. For any second pad group 308, it may be located on the same side or a different side of the circuit board 300 as the first pad group 307. These embodiments are not illustrated in the accompanying drawings.

[0096] In some embodiments of this application, such as Figure 5A As shown, the first pad group 307 and the second pad group 308 are located on the same side of the circuit board 300, and their areas do not overlap. Thus, after the corresponding first electronic device 430a and second electronic device 430b are mounted, the first electronic device 430a and the second electronic device 430b are arranged in a flat manner without overlapping in the thickness direction of the circuit board 300.

[0097] In some embodiments of this application, such as Figure 5B The diagram shows a partial cross-sectional view of the packaging module 400 after the circuit board 300 according to other embodiments of this application is applied to the packaging module 400. The first pad group 307 and the second pad group 308 of the circuit board 300 are located on the same side of the circuit board 300, and a plurality of second pads 3080 of the second pad group 308 are distributed outside the first pad group 307. Thus, after the corresponding first electronic device 430a and second electronic device 430b are mounted, the first electronic device 430a is closer to the circuit board 300, and the second electronic device 430b is located on the side of the first electronic device 430a facing away from the circuit board 300.

[0098] According to some embodiments of this application, a packaging module is also provided. For example... Figure 2As shown, the packaging module 400 includes a first circuit board 410 and multiple electronic devices 430 (only one is shown in the figure). The first circuit board 410 includes multiple pad groups 420, and each pad group 420 includes multiple pads 421. The multiple electronic devices 430 are arranged one-to-one with the multiple pad groups 420, wherein each electronic device 430 includes multiple pins, which are soldered one-to-one with the multiple pads 421 of the corresponding pad group 420. Among the multiple electronic devices 430, at least one electronic device 430 is a first electronic device 430a (i.e., the aforementioned electronic device 100), whose pin 120 includes a first portion 121 and a second portion 122, wherein the first portion 121 is located on the bottom surface of the device body 110, and the second portion 122 is located on the side surface of the device body 110.

[0099] According to the packaging module 400 of the present application embodiment, at least one electronic device 430 has a pin 120 including a first part 121 and a second part 122. Both the first part 121 and the second part 122 can be soldered to the pad 421 by solder 506, so that they can be reliably mounted on the first circuit board 410. Moreover, as described above, since the amount of solder between the first part 121 of the pin 120 and the pad 421 can be reduced compared with conventional electronic devices, the mounting height of these electronic devices (i.e., electronic devices 100) is lower, which is beneficial to reducing the overall thickness of the packaging module 400.

[0100] like Figure 5A As shown, in some embodiments of this application, the first circuit board 410 of the packaging module 400 can adopt the design concept of the aforementioned circuit board 300. The first circuit board 410 includes a first surface 300a and a second surface 300b, and includes: N metal layers 301 (N=4 in the figure) arranged sequentially in a direction away from the first surface 300a; at least one dielectric layer 302 spacing the N metal layers 301 from each other; a plurality of via metals 303 electrically connecting the N metal layers 301; and a solder resist layer 304 covering a portion of the surface of the first metal layer. The solder resist layer 304 has a first opening 305. The first surface 300a... 00a has a groove 306 exposed to the first opening 305. Part of the metal of the m-th (m=2 in the figure) metal layer is exposed at the bottom of the groove 306. At least two via metals 303 located on the side of the m-th metal layer near the first surface 300a are exposed on the side of the groove 306 and together with part of the metal of the m-th metal layer, they are used as a first pad group 307. The first pad group 307 includes a plurality of first pads 3070, where N≥2 and 2≤m≤N.

[0101] In some embodiments of this application (these embodiments are not illustrated in the accompanying drawings), the above-mentioned multiple electronic devices 430 can all be the first electronic device 430a.

[0102] Continue to refer to Figure 5A As shown, in some embodiments of this application, the aforementioned plurality of electronic devices 430 may further include conventional electronic devices with pins located at the bottom of the device, namely the aforementioned second electronic device 430b. In these embodiments, the solder mask layer 304 of the first circuit board 410 may further have a second opening 309, which exposes a portion of the metal of the first metal layer, wherein the portion of the metal of the first metal layer serves as the pad group 420 corresponding to the second electronic device 430b.

[0103] When the packaging module 400 includes both a first electronic device 430a and a second electronic device 430b, the specific number and placement of the first electronic device 430a and the second electronic device 430b are not limited. In actual design, the thickness of each electronic device 430 needs to be considered comprehensively. For example, for the electronic device 430 with the largest or largest thickness, a first pad group 307 can be designed for it on the first circuit board 410. Correspondingly, this electronic device 430 is designed with reference to the aforementioned first electronic device 430a (i.e., electronic device 100). For the electronic device 430 with a smaller thickness, a second pad group 308 can be designed for it on the first circuit board 410. This electronic device 430 can be a conventional electronic device (i.e., the second electronic device 430b). In this way, the packaging module 400 as a whole has a smaller thickness.

[0104] In some embodiments of this application (not illustrated in the accompanying drawings), there are multiple first electronic devices 430a, which are mounted on both sides of the first circuit board 410. Furthermore, when the first circuit board 410 includes multiple second electronic devices 430b, these multiple second electronic devices 430b can be mounted on both sides or one side of the first circuit board 410. For any one second electronic device 430b, it can be located on the same side or a different side of the first circuit board 410 as the first electronic device 430a.

[0105] In some embodiments of this application, such as Figure 5A As shown, the first electronic device 430a and the second electronic device 430b are located on the same side of the first circuit board 410 and are arranged in a flat manner.

[0106] In some embodiments of this application, such as Figure 5BAs shown, the first electronic device 430a and the second electronic device 430b are located on the first surface 300a of the first circuit board 410. The first electronic device 430a and the second electronic device 430b are arranged sequentially in a direction away from the second surface 300b. That is, the first electronic device 430a is closer to the circuit board 300, and the second electronic device 430b is located on the side of the first electronic device 430a facing away from the circuit board 300. Thus, the orthographic projection of the first electronic device 430a on the second surface 300b is located within the orthographic projection of the second electronic device 430b on the second surface 300b.

[0107] like Figure 5C The diagram shows a partial cross-sectional view of a packaging module 400 according to other embodiments of this application. In some embodiments, a first electronic device 430a is disposed on a first surface 300a of a first circuit board 410. The packaging module 400 may also include a second circuit board 440 (the second circuit board 440 is simplified in the figure, and its layer structure is not shown), which is soldered to the first surface 300a of the first circuit board 410 via solder balls 450. Solder balls are a welding material, commonly used for joining and repairing metallic materials. Solder balls can be made of materials such as carbon steel or stainless steel, and have waterproof and corrosion-resistant properties.

[0108] Compared to some packaging modules in related technologies that use multi-layer circuit board designs, the packaging module 400 of these embodiments in this application is based on the design of the first electronic device 430a and the first pad group 307. Its thickness is smaller, thus occupying less space inside the electronic device and making it more conducive to the further thinning of the electronic device.

[0109] One or more electronic devices may be disposed on the second circuit board 440. In some embodiments, the second circuit board 440 and the electronic devices disposed thereon may be used as the motherboard of an electronic device, and the first circuit board 410 and the electronic devices 430 disposed thereon may be used as a sub-board of an electronic device; or, the second circuit board 440 and the electronic devices disposed thereon may be used as a sub-board of an electronic device, and the first circuit board 410 and the electronic devices 430 disposed thereon may be used as the motherboard of an electronic device.

[0110] In some embodiments (not illustrated in the accompanying drawings), the packaging module 400 may also be designed such that: a first electronic device 430a is disposed on a first surface 300a of the first circuit board 410, and a second electronic device 430b is disposed on a second surface 300b of the first circuit board 410 (or the first electronic device 430a is disposed thereon). The packaging module 400 further includes a second circuit board 440, which is soldered to the second surface 300b of the first circuit board 410 via solder balls 450.

[0111] Similarly, compared to some packaging modules 400 in related technologies that employ multi-layer circuit board designs, the packaging modules 400 of these embodiments in this application are based on the design of the first electronic device 430a and the first pad group 307, resulting in a smaller thickness and thus occupying less space inside the electronic device, which is more conducive to the further thinning of the electronic device.

[0112] The specific product type of the aforementioned packaging module 400 is not limited; for example, it can be an RF module. The specific product type of the first electronic device 430a is not limited; for example, it can be a capacitor, and its thickness is relatively large. The specific product type of the second electronic device 430b is not limited; for example, it can be a surface acoustic wave filter or a power amplifier, and its thickness is smaller than that of the first electronic device 430a.

[0113] According to some embodiments of this application, a method for manufacturing a packaging module is also provided, such as... Figure 6A and Figure 6B As shown, where, Figure 6A This is a flowchart illustrating a method 500 for manufacturing a packaging module according to some embodiments of this application. Figure 6B This is a graphical representation of the manufacturing method 500. The manufacturing method 500 may include the following steps S21 to S25.

[0114] In step S21, a circuit board 300 is provided. This circuit board is a circuit board 300 designed using the aforementioned embodiments, such as... Figure 6B As shown, it includes a first surface 300a and a second surface 300b, and includes N metal layers 301 (N=4 in the figure) arranged sequentially in a direction away from the first surface 300a, at least one dielectric layer 302 spacing the N metal layers 301 from each other, a plurality of via metals 303 electrically connecting the N metal layers 301, and a solder resist layer 304 covering a portion of the surface of the first metal layer. The solder resist layer 304 has a first opening 305, wherein the first surface 300a... The groove 306 has a first opening 305 exposed. Part of the metal of the m-th (m=2 in the figure) metal layer is exposed at the bottom of the groove 306. At least two via metals 303 located on the side of the m-th metal layer near the first surface 300a are exposed on the side of the groove 306 and together with part of the metal of the m-th metal layer, they are used as a first pad group 307. The first pad group 307 includes a plurality of first pads 3070, where N≥2 and 2≤m≤N.

[0115] In step S22, a stepped steel mesh 501 is provided and aligned with the first surface 300a of the circuit board 300 to define a filling recess 502 together with the circuit board 300. The filling recess 502 is used to fill solder 506. The stepped steel mesh 501 includes a planar shielding area 503, a stepped shielding area 504, and a cutout area 505. A portion of the stepped shielding area 504 is recessed into the groove 306 and has a gap with a portion of the groove surface of the groove 306, thereby exposing the first pad group 307 to the filling recess 502.

[0116] The stepped stencil 501 serves as a mask, preventing the filling of unnecessary areas with solder 506 in subsequent step S23. The specific structure of the stepped stencil 501 needs to be designed based on the specific structure of the circuit board 300, the specific structure of the electronic device to be mounted, and the amount and depth of solder 506 to be filled.

[0117] In step S23, the brazing filler metal 506 is filled into the filling recess 502. For example, a brazing filler metal scraper can be used to scrape a sufficient amount of brazing filler metal 506 along the surface of the stepped steel mesh 501 under a certain pressure, thereby filling the filling recess 502 with brazing filler metal 506.

[0118] In step S24, the stepped stencil 501 is separated from the circuit board 300. In this step, the stepped stencil 501 is lifted, leaving the solder 506 on each pad.

[0119] In step S25, an electronic device 100 is provided, and multiple pins 120 of the electronic device 100 are soldered to a first pad group 307 using solder 506 left on the first pad group 307. This completes the surface mount assembly of the electronic device 100 on the circuit board 300.

[0120] Continue to refer to Figure 6B As shown, in some embodiments, the first surface 300a of the circuit board 300 is also provided with a second pad group 308. Thus, in step S23, solder 506 can be filled into the filling recess 502 corresponding to each second pad 3080 at the same time. In step S24, solder 506 can be left on each second pad 3080. In this way, in step S25, the surface mount assembly of the electronic device 100 on the second pad group 308 or the surface mount assembly of the second electronic device (not shown in the figure) on the second pad group 308 can also be realized.

[0121] In some embodiments of this application, such as Figure 6B As shown, step S25 above may include:

[0122] Sub-step one: align and assemble multiple pins of one electronic device 100 with the first pad group 307, and align and assemble multiple pins of another electronic device 100 with the second pad group 308.

[0123] Sub-step two involves soldering multiple pins of one of the electronic devices 100 to the first pad group 307 using a reflow soldering process, and soldering multiple pins of the other electronic device 100 to the second pad group 308. Reflow soldering is a surface mount technology that uses high temperature for a short time to apply solder to pads on electronic devices and circuit boards to achieve soldering.

[0124] In this embodiment, the specific product type of the packaging module 400 is not limited; for example, it can be a radio frequency module. The specific product type of the electronic device 100 is not limited; for example, it can be a capacitor with a relatively large thickness. The specific product type of the second electronic device is not limited; for example, it can be a surface acoustic wave filter or a power amplifier, with a thickness smaller than that of the electronic device 100.

[0125] In some embodiments of this application, electronic devices need to be surface-mounted on both sides of the circuit board of the packaging module. When manufacturing the packaging module, the relevant electronic devices can be surface-mounted on one side of the circuit board first, and then the relevant electronic devices can be surface-mounted on the other side of the circuit board.

[0126] The packaging module 400 manufactured according to the above-described embodiments of this application has at least one electronic device whose thickness is partially recessed into the groove 306. This reduces the mounting height, thereby resulting in a smaller thickness dimension for the packaged module 400.

[0127] like Figure 7 As shown, according to some embodiments of this application, an electronic device 600 is also provided, which includes a housing 610 and a packaging module 400 of any of the aforementioned embodiments disposed within the housing 610. The specific product type of the packaging module 400 is not limited; for example, it can be a radio frequency module. The specific product type of the electronic device 600 is not limited; for example, it can be a mobile phone, tablet computer, laptop computer, smart wearable device, in-vehicle computer, medical electronic device, server, router, switch, etc.

[0128] Because the packaging module 400 has a small thickness, it occupies less space inside the electronic device 600, which provides ample design space for further optimization of the internal structure of the electronic device 600 and for the thinner design of the electronic device 600.

[0129] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized by comprising: The electronic device comprises: a device body; and a plurality of pins arranged on a peripheral side of the device body, wherein each pin comprises a first part and a second part, the first part is located on a bottom surface of the device body, and the second part is located on a side surface of the device body.

2. The electronic device according to claim 1, wherein the device body comprises four edge portions and four corner portions, and the plurality of pins are arranged on the four edge portions; or the plurality of pins are arranged on opposite two edge portions of the four edge portions; or at least one pin of the plurality of pins is arranged in one-to-one correspondence with at least one corner portion of the four corner portions.

3. The electronic device according to claim 1 or 2, wherein the second part is flush with a top surface of the device body; or a spacing is provided between the second part and the top surface of the device body.

4. The electronic device according to any one of claims 1 to 3, wherein the electronic device comprises a capacitor device, a surface acoustic wave filter device, or a power amplifier device. The method comprises:

5. A method for manufacturing an electronic device, characterized by providing an electronic device wafer, the electronic device wafer comprising a plurality of wafer units separated by a mesh-shaped separation groove; forming an electroplating layer on a side surface of the electronic device wafer, the electroplating layer comprising a plurality of electroplating units separated from each other, wherein each electroplating unit is formed on a bottom surface and a side surface of the mesh-shaped separation groove and a surface of an adjacent wafer unit; and cutting the electronic device wafer and the electroplating layer along the mesh-shaped separation groove to separate the plurality of wafer units from each other and form a plurality of pins on a peripheral side of each wafer unit, wherein each wafer unit serves as a device body of the electronic device, each pin is obtained by cutting the electroplating layer, and each pin comprises a first part and a second part, the first part is located on a bottom surface of the device body, and the second part is located on a side surface of the device body. The electronic device comprises a first surface and a second surface, and comprises:

6. A circuit board, characterized by N metal layers arranged in sequence in a direction away from the first surface; at least one dielectric layer separating the N metal layers from each other; a plurality of via metals electrically connecting the N metal layers; and a solder mask layer covering part of a surface of the first metal layer, the solder mask layer having a first opening window; wherein the first surface has a groove exposed to the first opening window, part of a metal of an mth metal layer is exposed to a bottom of the groove, and at least two via metals located on a side of the mth metal layer close to the first surface are exposed to a side of the groove and serve as a first pad group with part of the metal of the mth metal layer, the first pad group comprising a plurality of first pads, wherein N≥2 and 2≤m≤N.

7. The circuit board according to claim 6, wherein the solder mask layer further has a second opening window, the second opening window exposing part of a metal of the first metal layer, the part of the metal of the first metal layer serving as a second pad group, the second pad group comprising a plurality of second pads. The method comprises:

8. A packaging module, characterized by providing a first circuit board comprising a plurality of pad groups, wherein each pad group comprises a plurality of pads; and ​ a plurality of electronic devices, which are arranged one-to-one corresponding to the plurality of pad groups, wherein each electronic device comprises a plurality of pins, which are welded one-to-one corresponding to the plurality of pads of the corresponding pad group, and the plurality of electronic devices comprises a first electronic device, which is the electronic device according to any one of claims 1 to 4.

9. The package module according to claim 8, wherein the first circuit board comprises a first surface and a second surface, and comprises: N metal layers arranged in sequence in a direction away from the first surface, at least one dielectric layer spacing the N metal layers from each other, a plurality of via metals electrically connecting the N metal layers, and a solder mask layer covering part of the surface of the first metal layer, the solder mask layer having a first opening window, wherein the first surface has a groove exposed to the first opening window, part of the metal of the mth metal layer is exposed to the bottom of the groove, and at least two via metals located on the side of the mth metal layer close to the first surface are exposed to the side of the groove and serve as the pad group corresponding to the first electronic device with part of the metal of the mth metal layer, wherein N≥2 and 2≤m≤N.

10. The package module according to claim 9, wherein the plurality of electronic devices further comprises a second electronic device; the solder mask layer further has a second opening window, which exposes part of the metal of the first metal layer, and part of the metal of the first metal layer serves as the pad group corresponding to the second electronic device.

11. The package module according to claim 10, wherein the first electronic device and the second electronic device are arranged in sequence in a direction away from the second surface, and the orthographic projection of the first electronic device on the second surface is located within the orthographic projection of the second electronic device on the second surface.

12. The package module of claim 9, wherein, further comprising: a second circuit board welded to the first surface by solder balls.

13. The package module according to claim 9, wherein at least one electronic device of the plurality of electronic devices is arranged on the second surface, and the package module further comprises a second circuit board welded to the second surface of the first circuit board by solder balls.

14. A method for fabricating a package module, the method comprising: comprising: providing a circuit board according to claim 6; providing a stepped steel mesh, aligning the stepped steel mesh with the first surface of the circuit board to define a filling recess, wherein the stepped steel mesh comprises a planar shielding area, a stepped shielding area, and a hollowed area, part of the stepped shielding area is sunken into the groove and has a gap with part of the groove surface, so as to expose the first pad group to the filling recess; filling the filling recess with solder; separating the stepped steel mesh from the circuit board; and providing an electronic device according to claim 1, and welding the plurality of pins of the electronic device to the first pad group by the solder left on the first pad group.

15. An electronic device, comprising: comprising: a housing and the package module according to any one of claims 8 to 13 arranged in the housing.

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