Instrument board air outlet surface treatment device

Abstract

The invention discloses an instrument board air outlet surface treatment device and relates to the technical field of semiconductors, the instrument board air outlet surface treatment device comprises a polishing machine shell, a sealing barrel and a sealing cover, the side face of the sealing barrel and the side face of the sealing cover are movably connected through a pin shaft, and the sealing barrel is fixed to the polishing machine shell; a polishing table for polishing a wafer is movably connected in the sealing barrel, a pressurizing head is movably connected to the sealing cover, and the pressurizing head is located above the polishing table; the polishing table comprises polishing discs and polishing pads fixed to the polishing discs, supporting limiting rings and balls are arranged at the bottoms of the polishing discs, and the polishing discs are positioned through limiting protrusions. According to the polishing disc, the limiting ring rotates along with rotation of the polishing disc and drives the balls to roll in the arc-shaped grooves, rotation is not affected while the polishing disc is supported, and therefore the situation that one side of the polishing disc is stressed for a long time and deviates is prevented, the service life is prolonged, and the use cost is reduced.

Description

Technical Field

[0001] This invention relates specifically to the field of semiconductor technology, and more specifically to a surface treatment device for an instrument panel air outlet. Background Technology

[0002] The instrument panel air vent surface treatment device is a material surface treatment device that can improve the surface smoothness and gloss of semiconductor materials through grinding and polishing, thereby improving the performance and reliability of semiconductor devices.

[0003] However, most polishing and grinding machines currently use a polishing disc to drive the polishing cloth to rotate, while a fixture that holds the wafer drives the wafer to rotate and applies downward pressure to the wafer. Under the combined pressure, the wafer adheres to one side of the polishing disc surface, and the wafer is polished and ground by friction and polishing fluid at the contact point. To ensure the high-speed rotation of the polishing pad, it is generally supported by a central shaft, with no other supporting components around it. When the mounting base rotates the wafer, it applies downward pressure to the sides of the polishing pad. Over time, this can cause the polishing pad and shaft to tilt. Even a slight tilt can affect the processing accuracy of semiconductors. Therefore, the polishing pad has a short lifespan and needs to be replaced frequently, resulting in high operating costs. Summary of the Invention

[0004] The purpose of this invention is to provide a surface treatment device for an instrument panel air vent. This device supports the polishing disc using a limiting ring and ball bearings while ensuring its normal rotation. Furthermore, a rubber pad inside the arc-shaped groove reduces noise during ball bearing rotation, thereby preventing damage to the polishing disc caused by prolonged unilateral stress, extending its service life, and reducing operating costs. This addresses the technical problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A surface treatment device for an instrument panel air outlet includes a polishing machine housing, a sealing barrel, and a sealing cover. The sides of the sealing barrel and the sealing cover are movably connected by a pin. The sealing barrel is fixed to the polishing machine housing, and a polishing table for polishing wafers is movably connected inside the sealing barrel. A pressure head is movably connected to the sealing cover, and the pressure head is located above the polishing table. The polishing table includes a polishing disc and a polishing pad fixed on the polishing disc. The bottom of the polishing disc is provided with a supporting limiting ring and a ball bearing, and the polishing discs are positioned by limiting protrusions.

[0006] As a further technical solution of the present invention, the end of the polishing disc passes through the polishing machine housing and is connected to the second motor for transmission, and the second motor is fixed in the polishing machine housing.

[0007] As a further technical solution of the present invention, the limiting ring is provided in two parts, one of which is inserted into the limiting protrusion and the other is fixed in the sealing barrel.

[0008] As a further technical solution of the present invention, the limiting rings are symmetrically arranged on both sides of the ball, and an arc-shaped groove for placing the ball is opened on the adjacent side of the two limiting rings.

[0009] As a further technical solution of the present invention, a movable plate is provided above the sealing cover, which is fixedly connected to the electric cylinder and the first motor, and the end of the electric cylinder passes through the movable plate and is connected to the sealing cover.

[0010] As a further technical solution of the present invention, the end of the first motor is connected to an extension rod, and the end of the extension rod is connected to the pressure head.

[0011] As a further technical solution of the present invention, the pressure head includes a connector and a polishing head, wherein the end of the connector is fixedly connected to the end of the extension rod.

[0012] Compared with the prior art, the beneficial effects of the present invention are: In this invention, two limiting rings are provided. One of the limiting rings is installed on the lower part of the polishing disc through a limiting protrusion. The limiting ring rotates with the polishing disc and drives the ball to roll in the arc groove. It supports the polishing disc without affecting its rotation, thereby preventing the polishing disc from shifting due to force on one side for a long time, extending its service life and reducing the cost of use. In this invention, the arc-shaped groove on the inner side of the limiting ring limits the ball, and a noise-reducing pad is also attached to the inner side of the arc-shaped groove, so that the ball rolls inside the limiting ring, reducing friction and noise when the ball rolls. In this invention, the limiting protrusion restricts the position of the limiting ring, preventing the limiting ring from moving as it rotates with the polishing disc, thus affecting the supporting effect of the limiting ring and the ball bearings on the polishing disc. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure in use of the present invention.

[0014] Figure 2 In this invention Figure 1 A magnified view of a portion of the image.

[0015] Figure 3 In this invention Figure 1 A magnified view of a portion of the image.

[0016] Figure 4 This is a schematic diagram of the internal structure of the sealed barrel in this invention.

[0017] Figure 5This is a three-dimensional structural diagram of the polishing table in this invention.

[0018] Figure 6 In this invention Figure 5 The main view.

[0019] Figure 7 In this invention Figure 5 A magnified view of a portion of the image.

[0020] In the picture: Polishing machine housing-1, sealing barrel-2, sealing cover-3, moving plate-4, electric cylinder-5, first motor-6, pressure head-7, connector-71, polishing head-72, polishing table-8, polishing disc-81, polishing pad-82, limiting protrusion-83, limiting ring-84, ball bearing-85, second motor-86. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figure 1-7 This invention provides a surface treatment device for an instrument panel air outlet, including a polishing machine housing 1, a sealing barrel 2, and a sealing cover 3. The sides of the sealing barrel 2 and the sealing cover 3 are movably connected by a pin. The sealing barrel 2 is fixed on the polishing machine housing 1, and a polishing table 8 for polishing wafers is movably connected in the sealing barrel 2. The polishing table 8 can rotate horizontally inside the sealing barrel 2. A pressure head 7 is movably connected to the sealing cover 3, and the pressure head 7 is located above the polishing table 8. The wafer is polished by friction between the pressure head 7 and the polishing table 8. The polishing table 8 includes a polishing disc 81 and a polishing pad 82 fixed on the polishing disc 81. The bottom of the polishing disc 81 is provided with a supporting limiting ring 84 and a ball bearing 85 to prevent the polishing disc 81 from being subjected to force on one side for a long time. The polishing discs 81 are positioned by limiting protrusions 83.

[0023] Furthermore, the end of the polishing disc 81 passes through the polishing machine housing 1 and is connected to the second motor 86 for transmission. The second motor 86 is fixed in the polishing machine housing and provides power for the horizontal rotation of the polishing disc 81.

[0024] In this embodiment, two limiting rings 84 are provided, one of which is inserted into the limiting protrusion 83, and the other is fixed in the sealing barrel 2, and is supported by evenly distributed balls 85.

[0025] In this embodiment, the limiting rings 84 are symmetrically arranged on both sides of the ball 85. An arc-shaped groove for placing the ball 85 is opened on the adjacent side of the two limiting rings 84 to restrict the path of the limiting rings 84 when they roll.

[0026] In this embodiment, a movable plate 4 is provided above the sealing cover 3, which is fixedly connected to the electric cylinder 5 and the first motor 6. The end of the electric cylinder 5 passes through the movable plate 4 and is connected to the sealing cover 3, thereby driving the first motor 6 to move through the movable plate 4.

[0027] In this embodiment, the end of the first motor 6 is connected to an extension rod, and the end of the extension rod is connected to the pressure head 7.

[0028] In this embodiment, the pressure head 7 includes a connector 71 and a polishing head 72, wherein the end of the connector 71 is fixedly connected to the end of the extension rod.

[0029] By adopting the above technical solution, when the second motor 86 drives the polishing disc 81 to rotate, the limiting ring 84 connected to the polishing disc 81 also rotates. At this time, the ball 85 rolls in the arc groove inside the limiting ring 84. At the same time, the limiting ring 84 and the ball 85 support the polishing disc 81. Even if the side of the polishing disc 81 is subjected to downward pressure, it will not shift, preventing the polishing disc 81 from shifting during rotation, which could lead to damage to the polishing disc 81 or semiconductor materials during processing. This extends the service life of the polishing disc 81, reduces the number of times the polishing disc 81 needs to be replaced, and lowers the cost of use. Furthermore, since the rotor of the first motor 6 generally has a length limitation, the first motor 6 needs to move under the action of the control cylinder 5, and at the same time needs to pass through the sealing cover 3 and connect to the end of the pressure head 7. At this time, the length of the rotor may not be enough. The extension rod here is a synchronous rotating rod for extending the rotor, which plays the role of synchronous connection and rotation. Its two ends are connected to the rotor of the first motor 6 and the end of the pressure head 7, respectively. Meanwhile, an air hole is provided at the center of the polishing head at the bottom of the pressure head 7. This air hole is connected to the inside of the extension rod. A valve is installed on the side of the extension rod where it connects to the rotor. Before operation, a small vacuum machine is connected through this valve to evacuate the inside of the device for vacuum treatment.

[0030] In this embodiment, the side of the sealed container 2 is sealed with a spray pipe for adding polishing liquid, and the end of the spray pipe extends to the inside of the sealed container 2, so that polishing liquid can be added at any time.

[0031] In this embodiment, buckles are installed on the outer sides of both the sealing barrel 2 and the sealing cover 3. The buckles are used to fix the sealing barrel 2 and the sealing cover 3, thereby sealing the inner side of the sealing barrel 2.

[0032] In this embodiment, a power switch and an adjustment knob are also fixed on the side of the polishing machine housing 1, and the power switch and the adjustment knob are electrically connected to the control circuit board inside the polishing machine housing 1.

[0033] In this embodiment, the control circuit board inside the polishing machine housing 1 is electrically connected to the electric cylinder 5, the first motor 6, and the second motor 86, respectively.

[0034] In this embodiment, the power switch is also electrically connected to a power cord, which extends through the polishing machine housing 1 to the outside of the polishing machine housing 1 and is connected to an external power source.

[0035] Power is supplied to the control circuit board inside the polishing machine housing 1 via the power cord. When the power switch is turned on, the control circuit board controls the rotation of the first motor 6 and the second motor 86 respectively. The extension length of the electric cylinder 5 is controlled by rotating the adjustment knob.

[0036] In this embodiment, the connector 71, polishing head 72, and extension rod are respectively provided with interconnected air holes on their inner sides, and the other end of the extension rod is threaded with a valve. The inner side of the valve is connected to the air hole, which can be connected to a small vacuum machine. The small vacuum machine is used to evacuate the inner side of the air hole, thereby fixing the wafer.

[0037] In this embodiment, a rubber pad is also attached to the arc-shaped groove inside the limiting ring 84, and the ball 85 is in contact with the rubber pad to reduce the noise when the ball 85 rolls and reduce the wear of the ball 85 when it rolls inside the limiting ring 84.

[0038] The working principle of this invention is as follows: In use, firstly, a small vacuum pump is connected to the valve via an air pipe. Then, the wafer is placed against the lower part of the polishing head 72. The valve is opened, and the small vacuum pump evacuates the air from the vent. Then, the valve and the small vacuum pump are closed, and the air pipe is removed. At this point, the negative pressure in the vent will attract the wafer to the polishing head 72. Then, the sealing cover 3 is fixed to the sealing container 2 using a snap fastener. The power switch is turned on, and power is supplied to the control circuit board inside the polishing machine housing 1 via the power cord. The control circuit board controls the first motor 6 and the second motor 86 to be energized. The pressure head 7 and the pressure head 7 rotate respectively, and the output rod of the electric cylinder 5 is moved by adjusting the knob. The electric cylinder 5 drives the first motor 6 and the pressure head 7 to move through the moving plate 4 until the wafer is in contact with the polishing pad 82 for polishing. While the polishing disc 81 rotates, it will drive the limiting ring 84 to rotate. At this time, the ball bearing 85 will roll in the arc groove inside the limiting ring 84, supporting the polishing disc 81 without affecting the normal rotation of the polishing disc 81. This prevents the polishing disc 81 from being offset due to force on one side for a long time, which could lead to damage to the polishing disc 81 or the wafer. This reduces the replacement frequency of the polishing disc 81 and lowers the cost of use.

[0039] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0040] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A surface treatment device for an instrument panel air outlet, characterized in that: The machine includes a polishing machine housing (1), a sealing barrel (2), and a sealing cover (3). The sides of the sealing barrel (2) and the sealing cover (3) are movably connected by a pin. The sealing barrel (2) is fixed on the polishing machine housing (1), and a polishing table (8) for polishing wafers is movably connected in the sealing barrel (2). A pressure head (7) is movably connected on the sealing cover (3), and the pressure head (7) is located above the polishing table (8). The polishing table (8) includes a polishing disc (81) and a polishing pad (82) fixed on the polishing disc (81). The bottom of the polishing disc (81) is provided with a supporting limiting ring (84) and a ball bearing (85), and the polishing disc (81) and the polishing disc (81) are positioned by a limiting protrusion (83).

2. The instrument panel air outlet surface treatment device according to claim 1, characterized in that: The end of the polishing disc (81) passes through the polishing machine housing (1) and is connected to the second motor (86) for transmission, and the second motor (86) is fixed in the polishing machine housing.

3. The instrument panel air outlet surface treatment device according to claim 1, characterized in that: The limiting ring (84) is provided in two parts, one of which is inserted into the limiting protrusion (83) and the other is fixed in the sealing barrel (2).

4. The instrument panel air outlet surface treatment device according to claim 3, characterized in that: The limiting rings (84) are symmetrically arranged on both sides of the ball (85), and an arc-shaped groove for placing the ball (85) is opened on the adjacent side of the two limiting rings (84).

5. The instrument panel air outlet surface treatment device according to claim 1, characterized in that: The sealing cover (3) is provided with a movable plate (4) that is fixedly connected to the electric cylinder (5) and the first motor (6), and the end of the electric cylinder (5) passes through the movable plate (4) and is connected to the sealing cover (3).

6. The instrument panel air outlet surface treatment device according to claim 1, characterized in that: The first motor (6) has an extension rod at its end, and the end of the extension rod is connected to the pressure head (7).

7. The instrument panel air outlet surface treatment device according to claim 6, characterized in that: The pressure head (7) includes a connector (71) and a polishing head (72), wherein the end of the connector (71) is fixedly connected to the end of the extension rod.

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