Diamond micro-powder barrel nickel plating solution, preparation method and diamond micro-powder nickel plating method for fretsaw

Abstract

The invention discloses a diamond micro-powder barrel nickel plating solution, a preparation method and a diamond micro-powder nickel plating method for a fretsaw. The diamond micro powder barrel nickel plating solution is prepared from the following components in parts by weight according to mass concentration: 250 to 350 g / L of nickel sulfate, 20 to 40 g / L of nickel chloride, 30 to 40 g / L of boric acid, 0.06 to 0.15 g / L of hexadecyl trimethyl ammonium chloride, 0.3 to 0.6 g / L of 1, 4 butynediol and 0.02 to 0.06 g / L of saccharin sodium salt; according to the barrel nickel plating solution for the diamond micro powder and the nickel plating method for the diamond micro powder for the fretsaw by adopting the barrel nickel plating solution, the diamond micro powder subjected to chemical plating is thickened, the problems of uneven micro powder thickness, poor plating solution stability, plating leakage and the like are really solved, and the barrel nickel plating solution has the advantages of low cost, simple process, low product failure risk and the like.

Description

Technical Field

[0001] This invention relates to a barrel plating nickel solution, particularly to a diamond micron powder barrel plating nickel solution, and also to a method for preparing the aforementioned barrel plating nickel solution and a method for plating diamond micron powder for wire saws using the aforementioned barrel plating nickel solution. Background Technology

[0002] Diamond, with its high hardness, high wear resistance, and excellent thermal and electrical conductivity, maintains its sharpness even under extreme conditions and exhibits good thermal conductivity during grinding. Compared to other abrasives, diamond offers superior machining capabilities, achieves higher sharpness, excels in maintaining precision, and ensures the reliability of the machining process. These properties make diamond particularly important for machining hard and brittle materials, making it one of the most effective abrasives.

[0003] Currently, commonly used diamond surface coating methods include: chemical plating, electroplating, CVD, PVD, vapor deposition, and salt bath plating. Currently, diamond micron powder coating often employs chemical plating or a combination of chemical plating and electroplating (composite plating). In wire saw production applications, composite plating methods are frequently used to obtain the plating abrasive for the wire saw. The plating abrasive and the metal wire (substrate) are then pretreated separately before pre-plating, abrasive application, and thickening plating to obtain the diamond wire saw. The resulting coating exhibits good adhesion to the substrate, uniform plating abrasive distribution, and a longer service life, significantly improved wear resistance and holding strength. However, there are still some problems with barrel plating of diamond micron powder for nickel, such as powder clumping, incomplete plating in low-current areas, uneven thickness, poor plating solution stability, and powder adhesion to the cathode wire. Summary of the Invention

[0004] Purpose of the invention: The purpose of this invention is to provide a diamond micron powder barrel plating nickel solution with high stability, as well as a method for preparing the above-mentioned barrel plating nickel solution and a method for plating diamond micron powder into a wire saw using the above-mentioned barrel plating nickel solution.

[0005] Technical solution: The diamond micron powder barrel plating nickel solution of the present invention comprises the following components by mass concentration: nickel sulfate 250~350g / L, nickel chloride 20~40g / L, boric acid 30~40g / L, hexadecyltrimethylammonium chloride 0.06~0.15g / L, 1,4-butynediol 0.3~0.6g / L, and sodium saccharin 0.02~0.06g / L.

[0006] The nickel plating solution has a pH value of 4.5-5, a coating coverage rate of ≥95%, and no significant agglomeration.

[0007] The preparation method of the above-mentioned diamond micron powder barrel plating nickel solution is as follows: nickel sulfate, nickel chloride, boric acid, hexadecyltrimethylammonium chloride, 1,4-butynediol, and sodium saccharin are dissolved in water and then mixed. Specifically, nickel sulfate, nickel chloride, and boric acid are added to water in sequence according to the formula, and stirred until completely dissolved. Then, hexadecyltrimethylammonium chloride is added in the formula and stirred to ensure full dispersion. Subsequently, 1,4-butynediol and sodium saccharin are added in sequence, and the mixture is stirred after each additive to ensure complete dissolution. Water is added to make up to the target volume, and the pH value is adjusted to 4.4-4.6 using dilute sulfuric acid solution. After stirring evenly, the diamond micron powder barrel plating nickel solution is obtained.

[0008] The method for nickel plating wire saws using the above-mentioned diamond micropowder barrel plating solution includes the following steps:

[0009] (1) Pretreatment of diamond micro powder;

[0010] (2) Chemical nickel plating is performed on the pretreated diamond micro powder;

[0011] (3) The diamond micro powder after chemical nickel plating is obtained by barrel plating.

[0012] In step (1), the pretreatment is to sequentially degrease, acid wash, alkali wash, sensitize, activate and reduce the diamond micro powder.

[0013] The acid washing uses a dilute nitric acid solution, the alkaline washing uses a sodium hydroxide solution, the sensitization uses a sensitizing solution obtained by mixing stannous chloride and hydrochloric acid, the activation uses an activation solution obtained by mixing palladium chloride and hydrochloric acid, and the reduction uses a sodium hypophosphite reducing solution.

[0014] In step (2), the pretreated diamond micro powder is placed in a chemical nickel plating solution with a working temperature of 55~66℃, the mechanical stirring speed is 250~300r / min, the stirring time is 1~1.5 hours, and after washing with water, it is dried for later use.

[0015] The preparation method of the electroless nickel plating solution is as follows: Weigh 10-40g of nickel sulfate, 20-40g of sodium hypophosphite, 10-20g of sodium citrate, 20-40g of ammonium chloride, 0.001-0.0012g of thiourea, 0.06-0.12g of sodium saccharin, and 1g of sodium dodecylbenzenesulfonate, and dissolve them separately in a small amount of deionized water, continuously heating and stirring until dissolved; add the dissolved nickel sulfate, sodium hypophosphite, ammonium chloride, thiourea, sodium dodecylbenzenesulfonate, and sodium saccharin to the sodium citrate solution in sequence, continuously heating and stirring. Add an appropriate amount of deionized water to 1L, stir thoroughly, and then add ammonia water to adjust the plating solution to a working pH of 8-9.5.

[0016] In step (3), the chemically plated diamond micro powder is placed in a barrel plating bottle containing a nickel barrel plating solution of diamond micro powder. The cathode is connected with copper wire and the anode is connected with titanium blue. The titanium blue contains sulfur-containing nickel beads and is wrapped with a cloth bag to prevent anode mud from contaminating the plating solution and the workpiece, ensuring the quality of the plating layer. After the barrel plating is completed, the barrel-plated diamond micro powder is washed with water through a filter device until the pH value is neutral, and then dried for later use.

[0017] In step (3), the barrel plating bottle is spiral-shaped, the working temperature is 40~50℃, the working plating solution pH value is 4.5~5, the barrel rotation speed is 1~6 r / min, the working current is 4~5A, and the barrel plating time is 48h.

[0018] Invention Principle: In terms of formulation, the specific selection and synergistic effect of sodium saccharin and hexadecyltrimethylammonium chloride fundamentally solves the problems of micro-powder agglomeration and high stress in the coating, resulting in a dense, uniform, and high-performance coating. In terms of process, a composite plating process is employed, solving the problem of incomplete plating, and efficient filtration and washing significantly improve production efficiency. In terms of equipment, the spiral-shaped barrel plating bottle ensures micro-powder dispersion and current stability, guaranteeing a high-quality coating.

[0019] The present invention provides a diamond micron powder barrel plating nickel solution and a diamond micron powder nickel plating method for wire saws using the aforementioned barrel plating nickel solution. This method thickens the diamond micron powder after chemical plating, effectively solving problems such as uneven powder thickness, poor plating solution stability, and incomplete plating. It offers advantages such as low cost, simple process, and low product failure risk. By optimizing the concentration parameters of nickel sulfate, boric acid, and nickel chloride, a stable deposition environment is provided for the diamond micron powder during tumbling within the plating bottle. This ensures that the plating solution is not easily decomposed, and that pH and metal ion concentration fluctuations are small, thereby improving the stability of the plating solution and reducing the risk of incomplete plating due to plating solution failure. The synergistic effect of sodium saccharin and hexadecyltrimethylammonium chloride broadens the bright current density range and dispersion ability of the plating solution, enabling the micron powder within the plating bottle to form a uniform and dense coating.

[0020] Beneficial effects: Compared with the prior art, the present invention has the following significant advantages: (1) The plating solution has good stability, long service life and low production cost. The synergistic stabilizing effect of hexadecyltrimethylammonium chloride and sodium saccharin greatly reduces the frequency of plating solution failure and replacement, and the maintenance cost of plating solution is reduced by about 30%. (2) The use of a micro powder filtration device for water washing reduces the water washing time from the original 2-3 hours to 15-20 minutes compared with the traditional static method, improving efficiency by nearly 10 times and reducing water consumption by about 60%. (3) The stable plating solution combined with the spiral barrel plating bottle makes the cathode current efficiency stable at over 90% and the current fluctuation range less than ±5%. Attached Figure Description

[0021] Figure 1Main effect diagram of signal-to-noise ratio for plating rate;

[0022] Figure 2 The trend of diamond micro powder barrel plating coverage as a function of plating bath temperature;

[0023] Figure 3 The surface morphology of diamond micro powder barrel plating at 45℃;

[0024] Figure 4 The trend of diamond micron powder coating rate with pH value;

[0025] Figure 5 The surface morphology of the diamond micron powder nickel plating solution at pH 4.5 is shown in the present invention.

[0026] Figure 6 The trend of diamond micron powder coating rate with the magnitude of current;

[0027] Figure 7 The surface morphology is shown under a barrel plating current of 5A.

[0028] Figure 8 The surface morphology of diamond micro powder after barrel plating;

[0029] Figure 9 This is an EDS image of the diamond particles after barrel plating. Detailed Implementation

[0030] The present invention will now be described in detail with reference to specific embodiments.

[0031] Example 1

[0032] The preparation method of the diamond micron powder barrel plating nickel solution of the present invention is as follows: In warm water at 60°C, nickel sulfate, nickel chloride and boric acid are added in sequence according to the formula amount and stirred until completely dissolved. Then, hexadecyltrimethylammonium chloride is added in sequence and stirred for 10 minutes to ensure full dispersion. Subsequently, 1,4-butynediol and sodium saccharin are added in sequence, and each additive is stirred for 10 minutes after addition to ensure complete dissolution. Water is added to make up to the target volume, and the pH value is adjusted to 4.4~4.6 using dilute sulfuric acid solution. After stirring evenly, the diamond micron powder barrel plating nickel solution is obtained.

[0033] The method for nickel plating with diamond micropowder for wire saws of the present invention includes the following steps:

[0034] (1) Degreasing: Place 20g of diamond micro powder in a 10% degreasing solution, stir and boil for 30 minutes;

[0035] Pickling: Place the degreased diamond powder in a 20% dilute nitric acid solution, stir and boil for 30 minutes;

[0036] Alkali washing: Place the acid-washed diamond micro powder in a 10% sodium hydroxide solution, stir and boil for 30 minutes;

[0037] Sensitization: Place the alkaline-washed diamond micro powder in a sensitization solution (stannous chloride 10g / L + hydrochloric acid: 50ml / L), soak for 32 minutes with moderate stirring, and heat to 40℃;

[0038] Activation: Place the sensitized diamond micro powder in an activation solution (palladium chloride 1g / L + hydrochloric acid: 50ml / L), soak for 32 minutes with moderate stirring, and heat to 40℃;

[0039] Reduction: Place the activated diamond micro powder in a reducing solution (sodium hypophosphite 30g / L), soak for 32min with moderate stirring, and heat to 40℃;

[0040] (2) Electroless plating: Weigh 30g of nickel sulfate, 30g of sodium hypophosphite, 10g of sodium citrate, 30g of ammonium chloride, 0.5mg of thiourea, 0.06g of sodium saccharin, and 1g of sodium dodecylbenzenesulfonate, and dissolve them separately in a small amount of deionized water. Continue heating and stirring until dissolved. Add the dissolved nickel sulfate, sodium hypophosphite, ammonium chloride, thiourea, sodium dodecylbenzenesulfonate, and sodium saccharin to the sodium citrate solution in sequence, and continue heating and stirring. Add an appropriate amount of deionized water to 1L, stir thoroughly, and then add ammonia to adjust the plating solution to a working pH of 9.5. Place the diamond micropowder from step six into an electroless nickel plating solution at a working temperature of 60℃, and mechanically stir at a speed of 250r / min for 1 hour. Wash with water and dry for later use.

[0041] (3) Barrel plating: The diamond micro powder after chemical plating in step seven is slowly placed into a 4L barrel plating bottle containing plating solution. The cathode is connected with copper wire, and the anode is connected with titanium blue. The titanium blue contains sulfur-containing nickel beads and is wrapped in a cloth bag to prevent anode mud from contaminating the plating solution and the workpiece, ensuring the quality of the plating layer. The barrel plating solution formula is: nickel sulfate 350g / L, nickel chloride 30g / L, boric acid 35g / L, hexadecyltrimethylammonium chloride 0.1g / L, 1,4-butynediol 0.6g / L, sodium saccharin 0.06g / L. Each reagent is dissolved in an appropriate amount of deionized water. Since the reagents do not react with each other, there is no requirement for the order of addition. The working temperature is 45℃, the working solution pH is 4.5, the barrel rotation speed is 6 r / min, the working current is 5A, and the barrel plating time is 48h. After the barrel plating is completed, the barrel-plated diamond micro powder is washed with water through a filter until the pH is neutral, and then dried for later use.

[0042] Figure 8 As shown, the surface morphology of diamond micron powder after barrel plating is bright, with no missed plating or nickel nodules. Figure 9The image shown is an EDS (Electro-Dispersive Oxidation) image of the diamond particles after barrel plating. The EDS image of the barrel-plated diamond particles shows that the main components of the coating are nickel and carbon. Elemental analysis was performed on five points selected from the morphology image. The nickel (Ct) contents of the five diamond particles were 68.8%, 53.4%, 74.5%, 64.1%, and 56.0%, respectively, meeting the experimental requirements for barrel plating and indicating the absence of impurities. The trace amounts of oxygen and phosphorus are due to surface adsorption of trace amounts of oxygen.

[0043] Example 2

[0044] The effect of parameter content on the results of barrel nickel plating:

[0045] In the process of barrel plating nickel with diamond micron powder, the content of plating solution parameters has a significant impact on the plating rate and surface morphology. Selecting appropriate parameter contents can increase the stability of the plating solution and improve the surface quality of the coating. Due to the large number of experiments, the traditional orthogonal method cannot meet the requirements of this experiment; therefore, the Taguchi design method was chosen to reduce the interference of noise factors on the output and achieve robust design. The Taguchi design method was used to investigate the effects of nickel sulfate, nickel chloride, and boric acid on the weight gain of barrel-plated nickel, and the results are shown in Table 1.

[0046] Table 1. Experimental table showing the effect of parameter content on barrel plating coverage.

[0047]

[0048] Table 2. Signal-to-noise ratio response table for coating rate analysis

[0049]

[0050] Table 2 shows the characteristic response analysis of the plating rate signal-to-noise ratio, indicating that the influence of different experimental parameter contents on the plating rate is ranked as follows: nickel sulfate > nickel chloride > boric acid. Figure 1 As shown, the main effect diagram of signal-to-noise ratio for each experimental factor was obtained. When the nickel sulfate concentration was 350 g / L, the nickel chloride concentration was 30 g / L, the boric acid concentration was 35 g / L, the cetyltrimethylammonium chloride concentration was 0.1 g / L, the 1,4-butynediol concentration was 0.6 g / L, the sodium saccharin concentration was 0.06 g / L, the working temperature was 45℃, the working solution pH was 4.5, the plating bottle rotation speed was 6 r / min, the working current was 5 A, and the barrel plating time was 48 hours, the expected optimal plating solution formulation and parameters for barrel plating of nickel were obtained.

[0051] Example 3

[0052] Under the following conditions: nickel sulfate 350 g / L, nickel chloride 30 g / L, boric acid 35 g / L, 1,4-butynediol 0.6 g / L, sodium saccharin 0.06 g / L, working temperature 45℃, working solution pH 4.5, plating bottle rotation speed 6 r / min, working current 5A, and barrel plating time 48 hours, a comparative experiment was conducted using different concentrations of hexadecyltrimethylammonium chloride (CTAB) and the traditional dispersant sodium dodecyl sulfate (SDS). Table 3 shows that, at the same concentration, the coating morphology obtained by hexadecyltrimethylammonium chloride is significantly better than that obtained by sodium dodecyl sulfate. It also shows that when the concentration range of hexadecyltrimethylammonium chloride is 0.09~0.12 g / L, it can ensure sufficient dispersion of diamond micropowder and eliminate incomplete plating, obtaining a dense, bright, high-quality coating, avoiding the side effects of excessive addition. As can be seen from Table 4, the coating surface obtained by the synergistic effect of hexadecyltrimethylammonium chloride and sodium saccharin has fine grains and a dense and smooth structure.

[0053] Table 3. Comparison Test of Two Dispersants

[0054]

[0055] Table 4. Synergistic effect of hexadecyltrimethylammonium chloride and sodium saccharin

[0056]

[0057] Example 4

[0058] Effect of plating bath temperature on the results of barrel nickel plating

[0059] Figure 2 The figure shows the trend of diamond micron powder barrel plating coverage as a function of bath temperature. When the bath temperature is between 39 and 42°C, the viscosity of the bath is relatively high, which affects the diffusion and migration of ions, resulting in a decrease in the migration rate of nickel ions and a slow deposition rate of nickel at the cathode, leading to a low coverage rate. When the bath temperature is 45°C, the increased temperature increases the migration rate between ions, accelerates the deposition rate of nickel ions, increases the current density at the cathode, and inhibits the hydrogen evolution reaction. The ability of boric acid to regulate the pH value and buffer the bath reaches a balance, thus improving the coverage rate. When the bath temperature is between 48 and 51°C, the hydrogen evolution side reaction rate exceeds the nickel deposition rate, resulting in a violent side reaction. The hydrogen bubbles generated by the side reaction are adsorbed on the cathode surface, hindering the deposition of nickel ions and thus reducing the coverage rate. Therefore, a bath temperature of 45°C is chosen for barrel plating. Figure 3 As shown, the surface morphology obtained at 45℃ is complete, with fine and dense grains, a smooth and flat surface, and the best morphology.

[0060] Example 5

[0061] Effect of bath pH on the results of barrel nickel plating

[0062] Figure 4 The figure shows the trend of diamond micron powder coating rate with pH value. When the pH value of the plating solution is 3-4, the hydrogen ion concentration in the plating solution is high, the hydrogen evolution side reaction is intense, a large number of electrons in the plating solution are consumed, and the reduction of nickel ions is inhibited. The generated hydrogen bubbles are adsorbed on the diamond surface, which can easily lead to incomplete plating and uneven coating. When the pH value of the plating solution is within the optimal concentration range, the hydrogen ion concentration in the plating solution is moderate, the reduction efficiency of nickel ions is increased, and the diffusion rate between ions and the reduction rate of nickel reach a balance. The resulting coating is smooth, uniform and dense. The coating rate reaches its highest when the pH value of the plating solution is 4.5. When the pH value of the plating solution is 5, the hydroxide ion concentration in the plating solution is high. Nickel ions will react with hydroxide ions to form nickel hydroxide precipitate, which will not only reduce the concentration of nickel ions in the plating solution, but the nickel hydroxide precipitate will also be adsorbed on the surface of diamond particles and participate in deposition, hindering nickel deposition, making the coating rough and uneven, and leading to a decrease in the coating rate. Therefore, the pH value of the plating solution for barrel plating should be 4.5. Figure 5 The image shows the surface morphology of the plating solution at pH 4.5. The coating is complete, without any missing coating defects, and the coating is dense, uniform, and smooth.

[0063] Example 6

[0064] The effect of current magnitude on the results of barrel nickel plating

[0065] Figure 6 The figure shows the trend of diamond micron powder coating rate with current. When the current is between 3 and 4 A, the diffusion and transfer rates between ions are slow, and the deposition rate of nickel ions is also slow. Deposition occurs preferentially only at active sites on the diamond particle surface, resulting in less nickel deposition per unit time and leading to incomplete coating. When the current increases to 5 A, the diffusion between ions and the reduction reaction of nickel reach equilibrium, with the reduction reaction of nickel dominating and suppressing the hydrogen evolution side reaction. The nickel deposition rate is stable and efficient. The coating rate increases with increasing current, and nickel grows uniformly on the diamond grain surface, resulting in a dense, uniform, and smooth coating surface. When the current is between 6 and 7 A, the diffusion and migration rates of nickel ions accelerate, causing the nickel ion deposition rate to exceed the coating formation rate, leading to abnormal coating growth and the appearance of dendrite growth or nickel nodules. Therefore, a current of 5 A is chosen for barrel plating. Figure 7 As shown, the surface morphology is under a current of 5A. The coating is complete and uniform, with no missed coatings or nodules. The coating structure is dense and smooth, without loose dendrites or irregular nodules.

Claims

1. A nickel plating solution using diamond micropowder, characterized in that, The nickel plating solution, by mass concentration, comprises the following components: nickel sulfate 340~360 g / L, nickel chloride 28~32 g / L, boric acid 34~36 g / L, hexadecyltrimethylammonium chloride 0.06~0.15 g / L, 1,4-butynediol 0.3~0.6 g / L, and sodium saccharin 0.02~0.06 g / L.

2. The diamond micron powder nickel plating solution according to claim 1, characterized in that, The pH value of the nickel plating solution is 4.4~4.6, and the coating coverage is ≥95%.

3. A method for preparing the diamond micropowder nickel plating solution according to claim 1, characterized in that, Add nickel sulfate, nickel chloride, and boric acid in water in sequence according to the formula, and stir until completely dissolved. Add hexadecyltrimethylammonium chloride in sequence according to the formula, and stir to disperse it fully. Then add 1,4-butynediol and sodium saccharin in sequence, and stir after each additive to ensure complete dissolution. Add water to make up to the target volume, and adjust the pH value to 4.4-4.6 using dilute sulfuric acid solution. After stirring evenly, the diamond micro powder nickel plating solution is obtained.

4. A method for nickel plating wire saws using the diamond micropowder barrel plating solution described in claim 1, characterized in that, Includes the following steps: (1) Pretreatment of diamond micro powder; (2) Chemical nickel plating is performed on the pretreated diamond micro powder; (3) The diamond micro powder after chemical nickel plating is obtained by barrel plating.

5. The preparation method according to claim 4, characterized in that, In step (1), the pretreatment is to sequentially degrease, acid wash, alkali wash, sensitize, activate and reduce the diamond micro powder.

6. The preparation method according to claim 5, characterized in that, The acid washing uses a dilute nitric acid solution, the alkaline washing uses a sodium hydroxide solution, the sensitization uses a sensitizing solution obtained by mixing stannous chloride and hydrochloric acid, the activation uses an activation solution obtained by mixing palladium chloride and hydrochloric acid, and the reduction uses a sodium hypophosphite reducing solution.

7. The preparation method according to claim 4, characterized in that, In step (2), the pretreated diamond micro powder is placed in a chemical nickel plating solution with a working temperature of 55~66℃, the mechanical stirring speed is 250~300r / min, the stirring time is 1~1.5 hours, and after washing with water, it is dried for later use.

8. The preparation method according to claim 7, characterized in that, The preparation method of the electroless nickel plating solution is as follows: Weigh 10-40g of nickel sulfate, 20-40g of sodium hypophosphite, 10-20g of sodium citrate, 20-40g of ammonium chloride, 0.001-0.0012g of thiourea, 0.06-0.12g of sodium saccharin, and 1g of sodium dodecylbenzenesulfonate, and dissolve them separately in a small amount of deionized water, continuously heating and stirring until dissolved; add the dissolved nickel sulfate, sodium hypophosphite, ammonium chloride, thiourea, sodium dodecylbenzenesulfonate, and sodium saccharin to the sodium citrate solution in sequence, continuously heating and stirring. Add an appropriate amount of deionized water to 1L, stir thoroughly, and then add ammonia water to adjust the plating solution to a working pH of 8-9.

5.

9. The preparation method according to claim 4, characterized in that, In step (3), the chemically plated diamond micro powder is placed in a barrel plating bottle containing a nickel barrel plating solution of diamond micro powder. The cathode is connected with copper wire and the anode is connected with titanium blue. The titanium blue contains sulfur-containing nickel beads and is wrapped with a cloth bag to prevent anode mud from contaminating the plating solution and the workpiece, ensuring the quality of the plating layer. After the barrel plating is completed, the barrel-plated diamond micro powder is washed with water through a filter device until the pH value is neutral, and then dried for later use.

10. The preparation method according to claim 4, characterized in that, In step (3), the barrel plating bottle is spiral-shaped, the working temperature is 40~50℃, the working plating solution pH value is 4.5~5, the barrel rotation speed is 1~6 r / min, the working current is 4~5A, and the barrel plating time is 48h.

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