Circuit board welding detection method and system, storage medium and intelligent terminal

Abstract

The invention relates to a circuit board welding detection method and system, a storage medium and an intelligent terminal, and relates to the field of circuit board detection technologies. The distance scanner scans a detection platform in the detection device to obtain a distance distribution image; determining a circuit board placement contour based on the distance distribution image; determining a detector movement vector and a horizontal rotation angle based on the circuit board placement contour; the detector moves according to the movement vector, rotates according to the horizontal rotation angle and then shoots to obtain an actual image; the detection result is output based on the actual image and the preset standard result image, and the method has the advantages that the shooting angle and the shooting position are determined through the scanning height, the circuit board does not need to be clamped at the corresponding position, the detector can detect multiple circuit boards at the same time, and the detection efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of circuit board inspection technology, and in particular to a circuit board soldering inspection method, system, storage medium, and smart terminal. Background Technology

[0002] Circuit boards make circuits miniaturized and more intuitive, playing an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Many SMT solder joints are soldered on circuit boards, and to ensure the normal operation of the circuit boards, the SMT solder joints need to be quality inspected.

[0003] In related technologies, such as the patent with publication number CN219830889U, a circuit board electrical component welding quality detector is disclosed. When the adjusting motor drives the bidirectional lead screw to rotate, the positioning bracket will drive the clamping plate to move, thereby adjusting the distance between the clamping plates and ensuring that the clamped circuit board is placed on the central axis of the placement plate. These designs enable the device to detect different types of circuit boards while ensuring accurate positioning of the circuit boards, thus improving the practicality of the device.

[0004] The existing technology has the following problems: the circuit board needs to be clamped in the corresponding position in the device, so that only one circuit board can exist on the placement plate, and the detector can only detect one one at a time, which greatly reduces the detection efficiency and there is still room for improvement. Summary of the Invention

[0005] To address the issue that detectors can only perform inspections one at a time, which significantly reduces inspection efficiency, this application provides a circuit board soldering inspection method, system, storage medium, and smart terminal.

[0006] Firstly, this application provides a circuit board soldering inspection method, which adopts the following technical solution: A circuit board soldering inspection method, comprising: Input circuit board dimensions and specifications; A distance scanner scans the detection platform within the detection device to obtain a distance distribution image. The detection device includes a frame, a detection platform, a distance scanner, and a detector. The detection platform is mounted on the frame for placing circuit boards. The distance scanner is movably connected to the frame along a horizontal plane to scan the detection platform. The detector is movably connected to the frame along a horizontal plane to inspect the circuit boards on the detection platform. The detection platform has discharge ports on two opposite sides, one for perfectly soldered circuit boards and the other for circuit boards with solder defects. Several pushing cylinders are arranged around the frame, with the piston rods of the pushing cylinders facing inwards towards the detection platform. Determine the circuit board placement outline based on the distance distribution image; The movement vector and horizontal rotation angle of the detector are determined based on the circuit board placement contour. The detector moves according to the motion vector, then rotates according to the horizontal rotation angle before taking a picture to obtain the actual image; The detection results are output based on the actual image and the preset standard result image.

[0007] By adopting the above technical solution, the placement position of the circuit board after welding is obtained by scanning the height, and then the shooting angle and shooting position are determined. The detection image is obtained and the detection result is obtained from the corresponding position. There is no need to clamp the circuit board in the corresponding position, which allows the detector to detect multiple circuits at the same time, thus improving the detection efficiency.

[0008] Optionally, methods for determining the circuit board placement profile based on distance distribution images include: Determine the upright and reverse placement heights of the circuit board based on its dimensions and specifications. Determine coordinate points and coordinate heights based on the distance distribution image; The coordinate height and coordinate points are used to determine the group of coordinate points whose coordinate height is not equal to the preset platform height, and to form the image outline; The image contour is matched with the height of the circuit board when it is placed upright and when it is placed upside down to obtain a successfully matched image contour. This image contour is defined as the circuit board placement contour.

[0009] Optionally, it also includes a method for processing image contours that fail to match both the upright and inverted heights of the circuit board, the method comprising: The random stacking height is calculated based on the circuit board upright height, circuit board reversed height, and a preset random natural number array; The matching of the image contour with the coordinate height is performed to obtain the successfully matched image contour. The image contour is defined as the combined placement contour, and the successfully matched random stacking height is defined as the matching stacking height. The number of stacks is determined based on the combined placement outline and the matching stacking height; When the number of stacked items is greater than or equal to 2, the numbering group of the push cylinder and the approach distance are determined based on the combined placement outline; The image outline will be redefined after the cylinder corresponding to the cylinder number group is impacted at a close distance and a preset impact speed.

[0010] By adopting the above technical solution, different heights can be obtained by matching with different stacking combinations, preventing the situation where multiple circuit boards are stacked together and causing height mismatch. When the matching is successful, the circuit board is pushed open by a cylinder so that each circuit board is evenly spread out, thereby improving the recognition efficiency of the circuit board.

[0011] Optionally, the method for processing image contours where the height of the circuit board when it is upright and the height of the circuit board when it is reversed are not successfully matched further includes: An image contour that fails to match the height of a circuit board placed upright, the height of a circuit board placed upside down, or the height of a randomly stacked circuit board is defined as an abnormal contour. When the coordinate height of the coordinate point corresponding to the abnormal contour does not match the height of the circuit board when it is placed upright, the height of the circuit board when it is placed upside down, or the height of the random stacking, the adjacent coordinate points around it are determined based on the coordinate point. Determine the height of adjacent coordinates based on abnormal contours; A circuit board plane is formed based on adjacent coordinate points, adjacent coordinate heights, and coordinate points and coordinate heights; If the circuit board plane does not exist, update the coordinate points according to the adjacent coordinate points and redetermine the adjacent coordinate points and the circuit board plane; When a circuit board plane exists, the tilt angle is determined based on the circuit board plane. Based on the tilt angle and the height of the circuit board when it is upright and when it is reversed, the range of the height of the circuit board when it is tilted upright and the range of the height of the circuit board when it is tilted reversed are calculated respectively. The random tilt stacking height is calculated based on the circuit board tilt height range, the circuit board tilt height range, and the random number array. The abnormal contour is obtained by matching the coordinate height corresponding to the abnormal contour with the random tilt stacking height. The abnormal contour is also defined as the combined placement contour.

[0012] By adopting the above technical solution, the tilt of the circuit board plane is identified to determine whether there is a situation where multiple circuit boards are stacked but not stable and tilted, thus preventing the height mismatch caused by multiple circuit boards being stacked together. When the match is successful, the circuit board is pushed apart by a cylinder so that each circuit board is evenly spread out, thereby improving the identification efficiency of the circuit board.

[0013] Optionally, methods for determining the cylinder number group and approach distance include: The center of the outline and the range of lateral movement coordinates are determined based on the combined placement outline. The minimum distance from the edge and the minimum moving boundary line are determined based on the contour center and the preset moving boundary line; The minimum distance from the edge is defined as the proximity distance; Match the horizontal adjustment coordinate range with any one of the preset adjustment range groups to obtain adjustment ranges that have an intersection, and define the set of successfully matched adjustment ranges as the adjustment range group. Based on the minimum actuation boundary line and actuation range group, the corresponding actuation cylinder number group is retrieved from the preset actuation database and output.

[0014] By adopting the above technical solution, and by determining the nearest pushing cylinder, the pushing cylinder has a corresponding pushing distance to break up the corresponding stacked circuit boards, thereby improving the efficiency of breaking up the circuit boards.

[0015] Optionally, a method for verifying the cylinder number group is also included, the method comprising: Arbitrarily select a push cylinder number group and define this push cylinder number group as the selected push cylinder number group; The range is determined based on the selected cylinder number group corresponding to the toggle range group and the minimum distance from the edge. When there is no intersection between the range and the combined placement outline, the push cylinder number group will be selected for output and the push cylinder number group will be reselected until all push cylinder number groups are selected; When there is an intersection between the combined placement contours of the range and other combined placement contours, the combined placement contour with the intersection is defined as the first intersection placement contour. Based on the first intersection placement outline, determine the corresponding push cylinder number group, and define the push cylinder number group as the first intersection cylinder number group; The first intersection cylinder number group and the selected push cylinder number group are combined to form a union to obtain the first union cylinder number group, which is then output as the selected push cylinder number group.

[0016] By adopting the above technical solution, when the pushing process interferes with other circuit boards, it can be pushed simultaneously to reduce the number of times the cylinder pushes in the overlapping area, thereby improving the efficiency of the pushing cylinder.

[0017] Optionally, when there is no intersection between the range and the combined placement outline, the method of selecting the cylinder number group for output includes: Based on the toggle range group, the corresponding horizontal range group is found from the preset range database; The range not to be traversed is determined based on the horizontal range group and the range traversed. When there is no intersection between the range and the combined placement outline, the push cylinder number group will be selected for output and the push cylinder number group will be reselected until all push cylinder number groups are selected; When there is an intersection between the combined placement contours without passing through the range, the combined placement contour with the intersection is defined as the second intersection placement contour, and the approach distance corresponding to the second intersection placement contour is defined as the reverse approach distance. The interval distance is calculated based on the minimum distance from the edge, the reverse approach distance, and the preset detection platform width corresponding to the selected cylinder number group; When the interval distance is less than the reverse approach distance and the reverse approach distance is greater than the preset maximum single push distance, the actual push distance is calculated based on the interval distance and the minimum distance from the edge. The actual pushing distance is defined as the approach distance; Based on the second intersection placement outline and the preset relative number group difference, the corresponding push cylinder number group is determined, and the push cylinder number group is defined as the second intersection cylinder number group; The second intersection cylinder number group and the selected push cylinder number group are combined to form a union to obtain the second union cylinder number group, which is then output as the selected push cylinder number group.

[0018] By adopting the above technical solution, when there is a corresponding circuit board in the opposite direction and the distance between the two circuit boards is relatively close, there is no need for an additional pushing cylinder to push them. The circuit board at that position can be pushed simultaneously, thereby reducing the number of times the cylinder pushes in the overlapping area and improving the efficiency of the pushing cylinder.

[0019] Secondly, this application provides a circuit board soldering inspection system, which adopts the following technical solution: A circuit board soldering inspection system, comprising: The acquisition module is used to acquire images of the circuit board dimensions and distance distribution. A memory for storing the program of the control method for any of the above-mentioned circuit board soldering inspection methods; A control method that enables the processor to load and execute programs in memory and implement any of the aforementioned circuit board soldering inspection methods.

[0020] By adopting the above technical solution, the placement position of the circuit board after welding is obtained by scanning the height, and then the shooting angle and shooting position are determined. The detection image is obtained and the detection result is obtained from the corresponding position. There is no need to clamp the circuit board in the corresponding position, which allows the detector to detect multiple circuits at the same time, thus improving the detection efficiency.

[0021] Thirdly, this application provides a smart terminal, which adopts the following technical solution: The intelligent terminal includes a memory and a processor, and the memory stores a computer program that can be loaded by the processor and executed any of the above-mentioned circuit board soldering inspection methods.

[0022] By adopting the above technical solution, the placement position of the circuit board after welding is obtained by scanning the height, and then the shooting angle and shooting position are determined. The detection image is obtained and the detection result is obtained from the corresponding position. There is no need to clamp the circuit board in the corresponding position, which allows the detector to detect multiple circuits at the same time, thus improving the detection efficiency.

[0023] Fourthly, this application provides a computer storage medium capable of storing corresponding programs, featuring fast interaction with large amounts of memory.

[0024] Computer-readable storage media adopt the following technical solutions: A computer-readable storage medium storing a computer program that can be loaded by a processor and executed for any of the circuit board soldering inspection methods described above.

[0025] By adopting the above technical solution, the placement position of the circuit board after welding is obtained by scanning the height, and then the shooting angle and shooting position are determined. The detection image is obtained and the detection result is obtained from the corresponding position. There is no need to clamp the circuit board in the corresponding position, which allows the detector to detect multiple circuits at the same time, thus improving the detection efficiency.

[0026] In summary, this application includes at least the following beneficial technical effects: 1. The shooting angle and position are determined by the scanning height, eliminating the need to clamp the circuit board at the corresponding position. This allows the detector to detect multiple devices simultaneously, improving detection efficiency. 2. The stacked circuit boards are pushed apart by a cylinder to ensure that each circuit board is evenly spread out, thereby improving the recognition efficiency of the circuit boards. Attached Figure Description

[0027] Figure 1 This is a flowchart of a circuit board soldering inspection method according to an embodiment of this application.

[0028] Figure 2 This is a schematic diagram of the detection device in the embodiments of this application.

[0029] Figure 3 This is a flowchart of a method for determining the layout outline of a circuit board based on a distance distribution image, as described in an embodiment of this application.

[0030] Figure 4 This is a height gradient diagram of the circuit board placement outline in the embodiments of this application.

[0031] Figure 5 This is a flowchart of a method for processing image contours in embodiments of this application where the height of the circuit board when it is placed upright or inverted fails to match.

[0032] Figure 6 This is a flowchart of a further method for image contour processing in embodiments of this application where the height of the circuit board when it is upright and the height of the circuit board when it is reversed are not successfully matched.

[0033] Figure 7 This is a flowchart of the method for determining the push cylinder number group and the approach distance in the embodiments of this application.

[0034] Figure 8 This is a flowchart of the method for verifying the number group of the push cylinder in the embodiments of this application.

[0035] Figure 9 This is a flowchart of a method for selecting and outputting the cylinder number group when there is no intersection between the range and the combined placement outline in this application embodiment.

[0036] Figure 10 This is a system module diagram of a circuit board soldering inspection method according to an embodiment of this application. Detailed Implementation

[0037] To make the purpose, technical solution, and advantages of this application clearer, the following description is provided in conjunction with the appendix. Figures 1-10 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the application.

[0038] This application discloses a method for inspecting circuit board soldering. (Refer to...) Figure 1 A circuit board soldering inspection method includes: Step 100: Enter the circuit board dimensions and specifications.

[0039] The circuit board size specifications refer to the dimensions of the circuit board, including its thickness, length, width, and the height, width, and length of the components after soldering, and even the position of the components on the circuit board, i.e., the dimensions of the circuit board after placement. The input method is manual input.

[0040] Step 101: The distance scanner scans the detection platform inside the detection device to obtain a distance distribution image.

[0041] The distance distribution image is an image showing the distance distribution of objects scanned by the scanner. Here, the distance value is calculated by first detecting the distance to the detection platform, then detecting the distance between the scanner and the circuit board, and finally subtracting the two values ​​to obtain the distance distribution image. For example... Figure 2 As shown, the testing device includes a frame, a testing platform, a distance scanner, and a testing instrument. The testing platform is mounted on the frame for placing circuit boards. The distance scanner is movably connected to the frame along the horizontal plane to scan the testing platform. In this embodiment, the distance scanner can be an infrared rangefinder. The testing instrument is movably connected to the frame along the horizontal plane to test the circuit boards on the testing platform. In this embodiment, the testing instrument can be a camera. To avoid interference from the distance scanner, the distance scanner moves to a corner during the testing. The testing platform has discharge ports on both opposite sides. Figure 2The circuit board is arranged with outlets on the left and right sides. One outlet is for perfectly soldered circuit boards, and the other is for circuit boards with solder defects. Several push cylinders are installed around the frame, with the piston rods of the push cylinders facing inwards towards the inspection platform. The push cylinders on the left and right sides push the outlets on opposite sides. When a qualified circuit board is detected, the push cylinder on the opposite side of the perfectly soldered circuit board outlet pushes it towards the perfectly soldered circuit board outlet. When a defective circuit board is detected, the push cylinder on the opposite side of the defective circuit board outlet pushes it towards the defective circuit board outlet. The function of the push cylinders on the other two sides will be introduced later and will not be repeated here.

[0042] Step 102: Determine the circuit board placement outline based on the distance distribution image.

[0043] The circuit board placement outline refers to the outline of the circuit boards placed on the testing platform. The method for determining this outline will be explained in other steps and will not be repeated here.

[0044] Step 103: Determine the movement vector and horizontal rotation angle of the detector based on the circuit board placement contour.

[0045] The detector's movement vector is the distance and direction it needs to move from the origin to the position of the circuit board's layout outline. The horizontal rotation angle is the angle at which the detector faces the circuit board for inspection. It is determined by first determining the center coordinates of the circuit board based on its layout outline, then calculating the vector from the center coordinates to the origin. This vector is the detector's movement vector. The circuit board's layout outline can also determine its length and width, thus determining the detector's orientation, so that the left and right sides of the detector represent its width, and the top and bottom sides represent its length.

[0046] Step 104: The detector moves according to the motion vector, then rotates according to the horizontal rotation angle and takes a picture to obtain the actual image.

[0047] The actual image is taken by the detector after it has moved and is directly facing the circuit board corresponding to its outline. The image taken here is an X-ray image.

[0048] Step 105: Output the detection results based on the actual image and the preset standard result image.

[0049] The standard result image is an image that reflects the corresponding result, such as an image of a perfect weld and an image of a weld with defects. The detection result is the result of a successful match; that is, when the actual image is the same as the image of a perfect weld, a good detection result is output; when the actual image is the same as the image of a weld with defects, a bad detection result is output.

[0050] Reference Figure 3Methods for determining the circuit board placement contour based on distance distribution images include: Step 200: Determine the upright and reverse placement heights of the circuit board based on its dimensions and specifications.

[0051] The height of a circuit board when placed upright refers to the height of the board itself, or the height of every point on it, including the height of soldered components. The height of a circuit board when placed upside down refers to the height of the board itself, or the height of every point on it, including the height of soldered components.

[0052] Step 201: Determine the coordinate points and coordinate heights based on the distance distribution image.

[0053] The coordinate point is any point within the distance distribution image. The height coordinate is the height detected by the distance detector. This can be determined by reading the corresponding data from the distance distribution image.

[0054] Step 202: Determine the group of coordinate points whose coordinate height is not equal to the preset platform height by using coordinate height and coordinate points, and form an image outline.

[0055] Platform height refers to the height of the detection platform, which is set to 0 by default. The coordinate point group is a group of points whose coordinate height is not equal to the platform height. Each coordinate point in this group has adjacent coordinate points, and any two points can be connected by a curve formed by linking the coordinate points within the group. The image contour is a contour that includes the coordinate point group but is not limited to the boundary line.

[0056] Step 203: Match the coordinate height corresponding to the image contour with the upright and reversed heights of the circuit board to obtain a successfully matched image contour, and define the image contour as the circuit board placement contour.

[0057] The matching method involves mapping the height of the circuit board (both upright and inverted) to coordinate heights one-to-one. If components on the same side of the circuit board have different heights, the upright and inverted heights will represent a varying height distribution diagram, as shown below. Figure 3 As shown, the image contour is also a varying height distribution map. Therefore, the matching method is to overlap the polylines at any angle.

[0058] Reference Figure 5 It also includes a method for processing image contours that fail to match both the upright and inverted heights of the circuit board, the method comprising: Step 300: Calculate the random stacking height based on the circuit board upright height, circuit board reversed height, and a preset random natural number array.

[0059] The random stacking height refers to the height of the circuit board surface after the circuit boards are randomly placed and stacked. The random natural number array is an array formed by random natural numbers, which here represents the number of circuit boards at the upright height and the reversed height. In this embodiment, the difference between the two numbers is 1 because, regardless of whether the circuit boards are upright or reversed, the lower circuit boards have both upright and reversed heights, while only the top circuit board displays a single height. The calculation method is to multiply the upright height of the circuit board by the first random number and then add the reversed height of the circuit board by the second random number. The difference between the first and second random numbers is 1, thus obtaining the random stacking height.

[0060] Step 301: Match the coordinate height corresponding to the image contour with the random stacking height to obtain the successfully matched image contour, define the image contour as the combined placement contour, and define the successfully matched random stacking height as the matched stacking height.

[0061] The matching method is similar to step 203, and will not be repeated here.

[0062] Step 302: Determine the number of stacks based on the combined placement outline and matching stacking height.

[0063] The stacking quantity refers to the number of circuit boards corresponding to the matching stacking height. This is determined by first calculating the maximum height of a single circuit board based on the sum of its upright and reversed heights. Then, the matching stacking height is divided by the maximum height of a single circuit board, and the result is rounded down. Adding one to this integer gives the number of circuit boards.

[0064] Step 303: When the number of stacked items is greater than or equal to 2, determine the push cylinder number group and approach distance based on the combined placement outline.

[0065] The cylinder number group is a combination of cylinder numbers that can push the assembled layout outline. For example... Figure 2 The numbers shown indicate the positions of the front and rear sets of cylinders, ensuring that the pushing process can only occur from front to back. The approach distance is the distance the pushing cylinder travels to propel the assembled shape; specifically, it's the distance along the front-rear direction between the piston rod of the pushing cylinder and the assembled shape. Here, the coordinates on the assembled shape are the center coordinates to ensure a collision. The method for determining this will be explained in subsequent steps and will not be elaborated upon here.

[0066] Step 304: After impacting the cylinders corresponding to the cylinder number group at a proximity distance and a preset impact speed, the image contour is redefined.

[0067] The impact speed is the speed at which the circuit board is impacted, causing it to detach due to the impact force. This speed is manually set. The cylinders corresponding to the numbered groups of the push cylinders impact the circuit boards corresponding to the assembled layout according to the approach distance and impact speed, thus breaking up the circuit boards. To enhance the impact effect, stepped surfaces can be added to the push plates of the push cylinders, so that the impact force and impact time on the circuit boards at different heights vary, resulting in different actions and improving the breaking-up efficiency.

[0068] Reference Figure 6 The method for processing image contours where the heights of the circuit board placed upright and the circuit board placed upside down fail to match further includes: Step 400: Define the image contours that fail to match the circuit board upright height, circuit board reversed height, and random stacking height as abnormal contours.

[0069] Step 401: When the coordinate height of the coordinate point corresponding to the abnormal contour does not match the height of the circuit board when it is upright, the height of the circuit board when it is reversed, or the height of the random stacking, determine the adjacent coordinate points around it based on the coordinate point.

[0070] An adjacent coordinate point is a coordinate point that is next to the current coordinate point; that is, there are no other coordinate points between the current coordinate point and the line connecting the current coordinate point and the line connecting the current coordinate point. The number of adjacent coordinate points is several; that is, all coordinate points around the current coordinate point should be determined.

[0071] Step 402: Determine the height of adjacent coordinates based on the abnormal contour.

[0072] The adjacent coordinate height is the height of adjacent coordinate points. It is determined by finding the position of the adjacent coordinate points in the abnormal contour, and then extracting the coordinate height of that position.

[0073] Step 403: Form a circuit board plane based on adjacent coordinate points, adjacent coordinate heights, coordinate points, and coordinate heights.

[0074] The circuit board plane is a plane formed by adjacent coordinate points and the coordinate points themselves. The method for determining this plane is to arbitrarily select three points to form a triangle, and then sequentially add all other adjacent coordinate points to this triangle. If they are on the same plane, then a circuit board plane is formed; if they are not, it means it is not on a circuit board plane, and the output will be "Not a circuit board plane".

[0075] Step 404: If the circuit board plane does not exist, update the coordinate points according to the adjacent coordinate points and redetermine the adjacent coordinate points and the circuit board plane.

[0076] If a point does not exist, it means that at least one point is not on the circuit board plane, so the circuit board plane cannot be determined. It may not coincide with the circuit board plane, so new coordinate points and adjacent coordinate points need to be determined.

[0077] Step 405: Determine the tilt angle based on the circuit board plane when the circuit board plane exists.

[0078] When a point exists, it indicates that it is already located on the circuit board plane. Since the three-dimensional coordinates of the point on the circuit board plane are known, the tilt angle can be determined. The calculation method is as follows: the tilt direction on the horizontal plane is obtained by projecting the vertical line onto the circuit board plane; then, the sine value is obtained by projecting any segment of the vertical line onto the circuit board plane; finally, the tilt angle on the vertical plane is obtained by using the inverse function of the sine value; the combination of these two methods gives the tilt angle.

[0079] Step 406: Calculate the range of the circuit board tilt height for upright placement and the range of the circuit board tilt height for reverse placement based on the tilt angle and the height of the circuit board placed upright and reverse placement, respectively.

[0080] The height range for a circuit board tilted upright is between half and the entire height of the top circuit board when tilted and upright. The height range for a circuit board tilted upside down is between half and the entire height of the top circuit board when tilted and upside down. Since the circuit boards are tilted because a portion of them is outside the next circuit board, and because the center of gravity is off-center from the next circuit board, it is assumed that half of the height is outside. Therefore, the height should be calculated by half when tilted.

[0081] Step 407: Calculate the random tilt stacking height based on the circuit board tilt height range, the circuit board tilt height range, and the random number array.

[0082] The random tilt stacking height is the height of the stacked circuit board surface after the top circuit board is tilted and the circuit boards below are randomly placed. The calculation method is similar to step 300, except that the topmost height is not the height of the circuit board placed upright and the height of the circuit board placed upside down, but rather the range of the height of the circuit board tilted upright and the range of the height of the circuit board tilted upside down.

[0083] Step 408: Match the coordinate height corresponding to the abnormal contour with the random tilt stacking height to obtain the successfully matched abnormal contour, and also define the abnormal contour as the combined placement contour.

[0084] The matching method here is similar to that in step 301, and will not be repeated here.

[0085] Reference Figure 7 The methods for determining the cylinder number group and approach distance include: Step 500: Determine the center of the outline and the range of horizontal movement coordinates based on the combined placement outline.

[0086] The outline center is the center coordinate of the combined placement outline. This can be determined by drawing in CAD, or by dividing the combined placement outline into multiple regular shapes, calculating the center of each individual regular shape, and then using size as a weight to obtain the center position. The horizontal adjustment coordinate range is along the vertical... Figure 2 During the forward and backward movement, the combined placement outline occupies the area in the left and right directions.

[0087] Step 501: Determine the minimum distance from the edge and the minimum moving boundary line based on the contour center and the preset moving boundary line.

[0088] The boundary line is the coordinate of the boundary line in the direction of movement. For example... Figure 2 The diagram shows the coordinates of the boundary lines in the front-back direction. The minimum distance from the edge is the minimum distance from the center of the contour to these two boundary lines, which is obtained by drawing perpendicular lines from the center of the contour to the two boundary lines and then comparing the lengths of the perpendicular lines. The minimum displacement boundary line is the boundary line with the smallest perpendicular distance.

[0089] Step 502: Define the minimum distance from the edge as the proximity distance.

[0090] Step 503: Match the horizontal adjustment coordinate range with any one of the preset adjustment range groups to obtain adjustment ranges that have an intersection, and define the set of successfully matched adjustment ranges as the adjustment range group.

[0091] The matching method is to determine whether there are common coordinates within the range. If they exist, the range corresponding to those coordinates is considered a successful match.

[0092] Step 504: Based on the minimum actuation boundary line and actuation range group, find the corresponding actuation cylinder number group from the preset actuation database and output it.

[0093] The cylinder number group is a group of cylinder numbers that can move the corresponding range of the moving range set on the minimum moving boundary line. The database stores the mapping relationship between the minimum moving boundary line, the moving range, and the cylinder numbers. This mapping is obtained by those skilled in the art through actual numbering and observation and recording based on the boundary line where the cylinder is located and the range it can move. When the system receives the moving range group and the minimum moving boundary line, it first narrows down the range according to the minimum moving boundary line, then sequentially finds the corresponding cylinder number according to the moving range corresponding to the moving range group, and finally outputs a group.

[0094] Reference Figure 8 It also includes a method for verifying cylinder number groups, which includes: Step 600: Select any push cylinder number group and define the push cylinder number group as the selected push cylinder number group.

[0095] Step 601: Determine the range based on the toggle range group corresponding to the selected cylinder number group and the minimum distance from the edge.

[0096] The range is defined as the area traversed by the push plate of the cylinder, starting from the minimum actuation boundary line and continuing until the minimum distance from the edge is reached. It is determined by multiplying the lateral range corresponding to the actuation range group by the minimum distance from the edge.

[0097] Step 602: When there is no intersection between the range and the combined placement outline, select the push cylinder number group for output and reselect the push cylinder number group until all push cylinder number groups are selected.

[0098] When there is no intersection, it means that the cylinder corresponding to the selected cylinder number group will not collide with other circuit boards during the process of pushing the circuit board corresponding to the combined placement outline.

[0099] Step 603: When there is an intersection between the range and other combined placement contours, the combined placement contour with the intersection is defined as the first intersection placement contour.

[0100] When there is an intersection, it means that the cylinder corresponding to the selected cylinder number group will collide with other circuit boards during the process of pushing the circuit board corresponding to the combined placement outline.

[0101] Step 604: Determine the corresponding push cylinder number group based on the first intersection placement outline, and define the push cylinder number group as the first intersection cylinder number group.

[0102] The determination method is the same as that in steps 500-504, and will not be repeated here.

[0103] Step 605: Form a union between the first intersection cylinder number group and the selected push cylinder number group to obtain the first union cylinder number group, and output it as the selected push cylinder number group. The first union of cylinder number groups is the union of the first intersection of cylinder number groups and the numbers of the selected push cylinder.

[0104] It should be noted that after forming the first group of cylinder numbers, it is still necessary to follow steps 600-605 to determine whether there are any overlapping combination layout outlines until no combination layout outlines exist.

[0105] Reference Figure 9 When there is no intersection between the range and the combined placement outline, the method of selecting the cylinder number group for output includes: Step 700: Based on the toggle range group, find the corresponding horizontal range group from the preset range database.

[0106] The lateral range group is a combination of the lateral ranges of the actuation range, i.e., the maximum travel distance of the push cylinder during forward and backward movement. The database stores the mapping relationship between the actuation range and the lateral range. After the push cylinder is installed, a person skilled in the art measures the lateral distance of the push cylinder as the actuation range, then starts the push cylinder, and measures the maximum travel distance of the push cylinder as the lateral range. This mapping relationship is then stored in the database. When the system receives a corresponding actuation range group, it automatically searches the database sequentially according to the actuation range to find the corresponding lateral range, and outputs the group.

[0107] Step 701: Determine the non-passage range based on the horizontal range group and the passed range.

[0108] The "non-passage range" refers to the area that the push plate of the cylinder does not pass through. The calculation method is to subtract the "passage range" from the lateral range group.

[0109] Step 702: When there is no intersection between the range and the combined placement outline, select the push cylinder number group for output and reselect the push cylinder number group until all push cylinder number groups are selected.

[0110] When there is no intersection, it means that there are no other combinations of placement outlines on the same route.

[0111] Step 703: When there is an intersection between the combined placement contours without passing through the range, the combined placement contour with the intersection is defined as the second intersection placement contour, and the approach distance corresponding to the second intersection placement contour is defined as the reverse approach distance.

[0112] When there is an intersection, it means there is also a combined placement outline on the opposite side that needs to be moved in the opposite direction. The reason for not considering movement in the same direction here is that the two have already been merged in the previous steps 600-605.

[0113] Step 704: Calculate the interval distance based on the minimum distance from the edge, the reverse approach distance, and the preset detection platform width corresponding to the selected push cylinder number group.

[0114] The detection platform width is the width of the detection platform itself, which is essentially the width of the horizontal range group. The interval distance is the distance between the center coordinates of two opposing pushing combined placement contours. It is calculated by subtracting the minimum distance from the edge and the reverse approach distance from the detection platform width.

[0115] Step 705: When the interval distance is less than the reverse approach distance and the reverse approach distance is greater than the preset maximum single push distance, calculate the actual push distance based on the interval distance and the minimum distance from the edge.

[0116] The maximum distance of a single push is the distance the circuit board is pushed by the impact at the impact speed. The actual pushing distance is the distance actually pushed by the selected push cylinder group, that is, pushing not only the combined placement outline but also the second intersection placement outline. The calculation method is the interval distance plus the minimum distance from the edge.

[0117] An interval distance less than the reverse approach distance indicates that the distance pushed from one side of the selected push cylinder group is small. A reverse approach distance greater than the maximum distance of a single push indicates that the second intersection placement outline will not fall out when pushed from one side of the selected push cylinder group.

[0118] Step 706: Define the actual push distance as the approach distance.

[0119] Step 707: Determine the corresponding push cylinder number group based on the second intersection placement outline and the preset relative number group difference, and define the push cylinder number group as the second intersection cylinder number group.

[0120] The relative number group difference is the conversion method from the number group of the push cylinder corresponding to the boundary line on the opposite side to the number group of the push cylinder on this side. Here, this value is the number of cylinders in a single row. That is, if there are 10 cylinders in a row, then the number in the front row is 1-10, and the number in the back row is 11-20. Therefore, the relative number group difference is 10, and the numbers that differ by 10 are exactly on the opposite side.

[0121] Step 708: Form a union between the second intersection cylinder number group and the selected push cylinder number group to obtain a second union cylinder number group, and output it as the selected push cylinder number group.

[0122] The second union of cylinder number groups is the union of the second intersection of cylinder number groups and the number of the selected push cylinder.

[0123] Based on the same inventive concept, embodiments of the present invention provide a circuit board welding inspection system.

[0124] Reference Figure 10 A circuit board soldering inspection system, comprising: The acquisition module is used to acquire images of the circuit board dimensions and distance distribution. A memory used to store a program for controlling a circuit board soldering inspection method; A processor is a control method for a circuit board soldering inspection method that allows programs in memory to be loaded and executed by the processor.

[0125] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0126] This invention provides a computer-readable storage medium storing a computer program that can be loaded by a processor and executed as a circuit board soldering inspection method.

[0127] Computer storage media include, for example, USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, optical disks, and other media that can store program code.

[0128] Based on the same inventive concept, embodiments of the present invention provide a smart terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded and executed by the processor to perform a circuit board soldering inspection method.

[0129] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Any feature disclosed in this specification (including the abstract and drawings) may be replaced by other equivalent or similar features unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is only one example of a series of equivalent or similar features.

Claims

1. A method for inspecting circuit board soldering, characterized in that, include: Input circuit board dimensions and specifications; A distance scanner scans the detection platform within the detection device to obtain a distance distribution image. The detection device includes a frame, a detection platform, a distance scanner, and a detector. The detection platform is mounted on the frame for placing circuit boards. The distance scanner is movably connected to the frame along a horizontal plane to scan the detection platform. The detector is movably connected to the frame along a horizontal plane to inspect the circuit boards on the detection platform. The detection platform has discharge ports on two opposite sides, one for perfectly soldered circuit boards and the other for circuit boards with solder defects. Several pushing cylinders are arranged around the frame, with the piston rods of the pushing cylinders facing inwards towards the detection platform. Determine the circuit board placement outline based on the distance distribution image; The movement vector and horizontal rotation angle of the detector are determined based on the circuit board placement contour. The detector moves according to the motion vector, then rotates according to the horizontal rotation angle before taking a picture to obtain the actual image; The detection results are output based on the actual image and the preset standard result image.

2. The circuit board soldering inspection method according to claim 1, characterized in that, Methods for determining the circuit board placement outline based on distance distribution images include: Determine the upright and reverse placement heights of the circuit board based on its dimensions and specifications. Determine coordinate points and coordinate heights based on the distance distribution image; The coordinate height and coordinate points are used to determine the group of coordinate points whose coordinate height is not equal to the preset platform height, and to form the image outline; The image contour is matched with the height of the circuit board when it is placed upright and when it is placed upside down to obtain a successfully matched image contour. This image contour is defined as the circuit board placement contour.

3. The circuit board soldering inspection method according to claim 2, characterized in that, It also includes a method for processing image contours that fail to match both the upright and inverted heights of the circuit board, the method comprising: The random stacking height is calculated based on the circuit board upright height, circuit board reversed height, and a preset random natural number array; The matching of the image contour with the coordinate height is performed to obtain the successfully matched image contour. The image contour is defined as the combined placement contour, and the successfully matched random stacking height is defined as the matching stacking height. The number of stacks is determined based on the combined placement outline and the matching stacking height; When the number of stacked items is greater than or equal to 2, the numbering group of the push cylinder and the approach distance are determined based on the combined placement outline; The image outline will be redefined after the cylinder corresponding to the cylinder number group is impacted at a close distance and a preset impact speed.

4. The circuit board soldering inspection method according to claim 3, characterized in that, The method for processing image contours where the height of the circuit board when it is upright and the height of the circuit board when it is upside down are not matched further includes: An image contour that fails to match the height of a circuit board placed upright, the height of a circuit board placed upside down, or the height of a randomly stacked circuit board is defined as an abnormal contour. When the coordinate height of the coordinate point corresponding to the abnormal contour does not match the height of the circuit board when it is placed upright, the height of the circuit board when it is placed upside down, or the height of the random stacking, the adjacent coordinate points around it are determined based on the coordinate point. Determine the height of adjacent coordinates based on abnormal contours; A circuit board plane is formed based on adjacent coordinate points, adjacent coordinate heights, and coordinate points and coordinate heights; If the circuit board plane does not exist, update the coordinate points according to the adjacent coordinate points and redetermine the adjacent coordinate points and the circuit board plane; When a circuit board plane exists, the tilt angle is determined based on the circuit board plane. Based on the tilt angle and the height of the circuit board when it is upright and when it is reversed, the range of the height of the circuit board when it is tilted upright and the range of the height of the circuit board when it is tilted reversed are calculated respectively. The random tilt stacking height is calculated based on the circuit board tilt height range, the circuit board tilt height range, and the random number array. The abnormal contour is obtained by matching the coordinate height corresponding to the abnormal contour with the random tilt stacking height. The abnormal contour is also defined as the combined placement contour.

5. The circuit board soldering inspection method according to claim 3, characterized in that, The methods for determining the cylinder number group and approach distance include: The center of the outline and the range of lateral movement coordinates are determined based on the combined placement outline. The minimum distance from the edge and the minimum moving boundary line are determined based on the contour center and the preset moving boundary line; The minimum distance from the edge is defined as the proximity distance; Match the horizontal adjustment coordinate range with any one of the preset adjustment range groups to obtain adjustment ranges that have an intersection, and define the set of successfully matched adjustment ranges as the adjustment range group. Based on the minimum actuation boundary line and actuation range group, the corresponding actuation cylinder number group is retrieved from the preset actuation database and output.

6. The circuit board soldering inspection method according to claim 5, characterized in that, It also includes a method for verifying cylinder number groups, which includes: Arbitrarily select a push cylinder number group and define this push cylinder number group as the selected push cylinder number group; The range is determined based on the selected cylinder number group corresponding to the toggle range group and the minimum distance from the edge. When there is no intersection between the range and the combined placement outline, the push cylinder number group will be selected for output and the push cylinder number group will be reselected until all push cylinder number groups are selected; When there is an intersection between the combined placement contours of the range and other combined placement contours, the combined placement contour with the intersection is defined as the first intersection placement contour. Based on the first intersection placement outline, determine the corresponding push cylinder number group, and define the push cylinder number group as the first intersection cylinder number group; The first intersection cylinder number group and the selected push cylinder number group are combined to form a union to obtain the first union cylinder number group, which is then output as the selected push cylinder number group.

7. The circuit board soldering inspection method according to claim 6, characterized in that, When there is no intersection between the range and the combined placement outline, the methods for selecting the cylinder number group for output include: Based on the toggle range group, the corresponding horizontal range group is found from the preset range database; The range not to be traversed is determined based on the horizontal range group and the range traversed. When there is no intersection between the range and the combined placement outline, the push cylinder number group will be selected for output and the push cylinder number group will be reselected until all push cylinder number groups are selected; When there is an intersection between the combined placement contours without passing through the range, the combined placement contour with the intersection is defined as the second intersection placement contour, and the approach distance corresponding to the second intersection placement contour is defined as the reverse approach distance. The interval distance is calculated based on the minimum distance from the edge, the reverse approach distance, and the preset detection platform width corresponding to the selected cylinder number group; When the interval distance is less than the reverse approach distance and the reverse approach distance is greater than the preset maximum single push distance, the actual push distance is calculated based on the interval distance and the minimum distance from the edge. The actual pushing distance is defined as the approach distance; Based on the second intersection placement outline and the preset relative number group difference, the corresponding push cylinder number group is determined, and the push cylinder number group is defined as the second intersection cylinder number group; The second intersection cylinder number group and the selected push cylinder number group are combined to form a union to obtain the second union cylinder number group, which is then output as the selected push cylinder number group.

8. A circuit board soldering inspection system, characterized in that, include: The acquisition module is used to acquire images of the circuit board dimensions and distance distribution. A memory for storing a program of a control method for a circuit board soldering inspection method as described in any one of claims 1 to 7; The processor and the program in the memory can be loaded and executed by the processor to implement the control method of the circuit board soldering inspection method as described in any one of claims 1 to 7.

9. A smart terminal, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as described in any one of claims 1 to 7 for circuit board soldering inspection.

10. A computer-readable storage medium, characterized in that, The computer program is stored and can be loaded by a processor and executed as described in any one of claims 1 to 7.

Images