Multi-stage temperature control device and temperature control method
By using multi-stage temperature control devices and methods, combined with plate heat exchangers, temperature control components, and refrigeration components, precise control of the circulating medium temperature is achieved, solving the stability problem of the temperature controller under extreme operating conditions, meeting the requirements of semiconductor processes, and improving the reliability and economic efficiency of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-23
- Publication Date
- 2026-04-03
AI Technical Summary
Existing temperature controllers are unable to stably control temperature under extreme operating conditions, affecting the yield rate of semiconductor processes and the lifespan of equipment.
A multi-stage temperature control device is adopted, including a cooling device, a circulating medium circuit, and a refrigeration circuit. Through the combination of plate heat exchangers, temperature control components, and refrigeration components, precise control of the circulating medium temperature is achieved. By using a sliding plug, a throttling cylinder, and an electric heater, combined with an electric two-way valve and PID control, graded gradient control and fine adjustment are realized.
It achieves precise control of the output medium temperature, meets the stringent requirements of semiconductor processes, reduces energy consumption, improves equipment reliability and yield, and reduces operating costs.
Smart Images

Figure CN121785403A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of industrial temperature control technology, specifically to a multi-stage temperature control device and method. Background Technology
[0002] Semiconductor manufacturing is an extremely complex process with very demanding environmental requirements. As chip integration continues to increase and feature sizes shrink, the temperature stability requirements for semiconductor manufacturing processes have reached unprecedented levels. Any minute temperature change can trigger alterations in the physical properties of materials, leading to chip performance deviations, reduced yields, and even damage to production equipment.
[0003] In the early stages of semiconductor manufacturing, due to the relatively simple chip manufacturing process, the precision requirements for temperature control could be met through basic heat dissipation methods. However, with technological advancements, especially the emergence of high-precision processes such as photolithography, etching, and epitaxial growth, traditional heat dissipation methods are no longer sufficient to meet the ever-increasing heat dissipation demands. Photolithography, as a core component of chip manufacturing, generates a significant amount of heat during operation from key components such as optical lenses and laser sources. If this heat cannot be dissipated promptly and accurately, the minute deformations caused by the thermal expansion and contraction of the lenses will directly lead to deviations in the photolithographic pattern, severely impacting chip manufacturing precision.
[0004] Therefore, temperature controller technology has emerged. It utilizes circulating low-temperature coolant to efficiently absorb the heat generated during equipment operation, thereby achieving precise temperature control. Although temperature controllers are widely used in the semiconductor field, they still have shortcomings. For example, some traditional temperature controller technologies are relatively simple, with low cooling efficiency, limited cooling capacity, and high energy consumption. At the same time, some temperature controllers lack temperature control stability under extreme operating conditions, making it difficult to maintain the stringent temperature standards required for semiconductor processes, thus affecting yield and equipment lifespan. Summary of the Invention
[0005] To overcome the above-mentioned defects, embodiments of the present invention provide a multi-stage temperature control device and method, which solves the technical problem in the prior art that it is difficult to stably control the temperature under extreme operating conditions, thereby making it difficult to maintain the stringent temperature standards required for semiconductor processes, and thus affecting the yield and equipment lifespan.
[0006] According to one aspect, at least one embodiment of the present invention provides a multi-stage temperature control device, including a cooling device for conveying a heat exchange medium, a circulating medium circuit, and a refrigeration circuit, further comprising: A liquid tank, on which a medium return pipe is connected; A plate heat exchanger, wherein at least two plate heat exchangers are provided on the circulating medium loop, and the at least two plate heat exchangers are connected in series along the flow direction of the circulating medium loop via a circulation assembly for conveying the circulating medium. A temperature control component is installed at the outlet of the circulating medium and is used to control and adjust the temperature of the circulating medium in real time. The refrigeration component, which is included in the refrigeration circuit, is used to adjust the refrigeration effect on different plate heat exchangers and control the actual refrigeration capacity of several plate heat exchangers for the circulating medium.
[0007] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, the circulation component includes: A water pump, wherein a circulation input pipe is connected between the input end of the water pump and the liquid tank; Wherein, at least two of the plate heat exchangers are arranged in series along the flow direction of the circulating medium via a connecting pipe; The circulation output pipe is connected to the circulation medium inlet of the first plate heat exchanger at the uppermost end, and the circulation output pipe is connected to the output end of the water pump. The outlet pipe is connected to the circulating medium outlet of the last downstream plate heat exchanger.
[0008] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, the temperature control component includes: A throttling cylinder is connected to the output end of the liquid outlet pipe, and the throttling cylinder is arranged perpendicularly to the liquid outlet pipe; The electric heater and the branch pipe are provided with a first connection port and a second connection port on the side of the throttling cylinder, respectively. The first connection port is connected to the input end of the electric heater, and the second connection port is connected to the input end of the branch pipe. A throttling section, installed inside the throttling cylinder, is used to control the flow rate of the circulating medium entering the electric heater and the branch pipe; A flow equalization section is installed at the output end of the electric heater, and the output end of the flow equalization section is connected to a medium supply pipe.
[0009] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, the throttling section includes: The throttling cylinder contains two sliding plugs that are slidably and sealingly installed inside. The two sliding plugs are connected together by a connecting rod, forming a liquid supply chamber between them. The driving component is fixedly installed on the throttling cylinder, and the output end of the driving component is fixedly connected to one of the sliding plugs. The outlet pipe is always connected to the supply chamber. When the sliding plug slides to the first position, the supply chamber is completely aligned with the first connection port and completely offset from the second connection port. When the sliding plug slides from the first position to the second position, the overlap area between the supply chamber and the first connection port gradually decreases, while the overlap area with the second connection port gradually increases. When it slides to the second position, the supply chamber is completely aligned with the second connection port and completely offset from the first connection port.
[0010] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, the flow equalization section includes: A flow equalization cylinder is connected to the output end of the electric heater. A conveying cylinder is fixedly fitted to one end of the flow equalization cylinder near the electric heater. Several through holes are opened between the conveying cylinder and the flow equalization cylinder. The output end of the branch pipe is connected to the conveying cylinder. The first pressure sensor and the first temperature sensor are connected to the flow equalization cylinder and the medium supply pipe, and the first pressure sensor and the first temperature sensor are installed on the medium supply pipe.
[0011] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, a plurality of spiral guide vanes are fixedly installed in a circumferential shape at equal angles inside the flow equalizing cylinder, and the plurality of spiral guide vanes and the plurality of through holes are arranged alternately.
[0012] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, the refrigeration component includes: The cooling device includes a refrigeration return pipe and a refrigeration supply pipe. The input end of the cooling device is connected to the refrigeration return pipe, which is connected to the coolant outlet of the first downstream plate heat exchanger. The output end of the cooling device is connected to the refrigeration supply pipe. In this arrangement, at least two plate heat exchangers are connected in series along the flow direction of the coolant via a delivery pipe, and a T-joint is connected to the coolant inlet of each plate heat exchanger, with the T-joint at the corresponding position connected to the corresponding delivery pipe. Each of the three-way connectors is equipped with a conveying unit for conveying coolant.
[0013] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, the delivery section includes an infusion pipe, each of the three-way connectors is connected to the infusion pipe via an electric two-way valve, each of the infusion pipes is connected to the refrigeration supply pipe, and the refrigeration supply pipe is also equipped with a second pressure sensor and a second temperature sensor.
[0014] For example, in a multi-stage temperature control device provided in at least one embodiment of the present invention, a third temperature sensor is installed on the medium return pipe.
[0015] A multi-stage temperature control method, using the aforementioned multi-stage temperature control device, includes the following steps: S1. Circulation: Start the water pump to pump the circulating medium out of the liquid tank and flow through all the plate heat exchangers in series to form the main circulation. S2. Temperature monitoring: Real-time acquisition of data from the first temperature sensor on the medium supply pipe, which is used to compare the actual temperature value with the process set temperature. S3, Cooling mode switching: Determine the required cooling level (small, medium, large) based on the temperature difference, open the corresponding level electric two-way valve to allow the coolant to flow through the corresponding number of plate heat exchangers, and control the heat exchange by adjusting the opening of the electric two-way valve. During heating or compensating for cooling overshoot, reduce or close the opening of the electric two-way valve. S4. Fine-tune the temperature of the circulating medium. Using the data from the first temperature sensor as feedback, adjust the power of the electric heater for heating compensation. At the same time, control the drive to push the sliding plug and dynamically adjust the ratio of the medium flow rate entering the electric heater and the branch pipe to adjust the temperature of the output circulating medium. S5. Mixed output: The circulating medium, after being heated or input through a branch pipe, is fully mixed in the flow equalization cylinder to ensure uniform temperature, and finally the constant temperature circulating medium is provided to the customer through the medium supply pipe. S6, reflux: The medium refluxed from the client is returned to the liquid tank after being monitored by the third temperature sensor. The system continues to perform closed-loop control from S2 to S5 until the process ends.
[0016] The beneficial effects of this invention are as follows: 1. In this invention, by setting a throttling section consisting of a sliding plug and a throttling cylinder, as well as an electric heater and a branch pipe at the outlet end of the circulating medium, the temperature of the output medium can be precisely adjusted. The precise displacement of the sliding plug can steplessly adjust the ratio of the circulating medium entering the electric heater and the bypass branch. Combined with the rapid response of the electric heater, the temperature fluctuation of the output medium can be stably controlled within a certain accuracy range (such as ±0.1℃ or even higher), thereby meeting the stringent temperature requirements of semiconductor-related equipment for the production process.
[0017] 2. In this invention, multiple plate heat exchangers are connected in series in the circulating medium loop. Simultaneously, each heat exchanger is equipped with a parallel liquid delivery pipe controlled by an electrically operated two-way valve in the refrigeration loop. By controlling the opening and closing of different numbers of electrically operated two-way valves, the number of heat exchangers in operation (first-stage, second-stage, or third-stage refrigeration) can be flexibly selected. Furthermore, by designing different PID control modes, graded gradient control of the system is achieved, resulting in higher temperature control accuracy to meet the higher precision requirements of semiconductor manufacturing processes. This also reduces equipment energy consumption and improves COP (coefficient of performance). This not only effectively reduces operating costs but also comprehensively optimizes the overall performance of the refrigeration system, achieving a win-win situation for both economic and environmental benefits.
[0018] 3. In this invention, by using the data from the first temperature sensor as the detection value and the heating power of the electric heater as the feedback value, the temperature of the circulating medium can be raised and lowered quickly and stably with the cooperation of the branch pipe and the throttling section, so as to meet the application scenarios with stringent requirements for high and low temperature environments. Moreover, this design can also ensure that the temperature control accuracy is maintained within a very small error range, providing users with a highly reliable and accurate temperature control solution.
[0019] 4. By setting up circulation and temperature control components, the output medium temperature can be adjusted to meet the stringent process temperature requirements. At the same time, by setting up refrigeration components and controlling the number of heat exchangers in operation through an electric two-way valve, the cooling capacity can be adjusted in stages and gradients, which significantly improves the energy efficiency ratio and system response speed under partial load. It has outstanding advantages of rapid response and energy efficiency. Moreover, the overall structure is simple and compact, which greatly improves its reliability, effectively reduces the probability of failure, and makes the equipment run more stably and for longer. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are merely some exemplary embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the exemplary embodiments of the present invention and these drawings without any creative effort.
[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall structure from another angle in this invention; Figure 3 This is a top-view planar structural diagram of the multi-stage temperature control device in this invention; Figure 4 This is a schematic diagram of the structure of the circulation component, temperature control component, and refrigeration component working together in this invention; Figure 5This is a schematic diagram of the structure of the circulation component, temperature control component, and refrigeration component working together from another angle in this invention; Figure 6 This is a cross-sectional view of the temperature control component in this invention; Figure 7 This is a cross-sectional view of the temperature control component from another angle in this invention; Figure 8 This is a cross-sectional view of the flow equalization section in this invention.
[0022] In the diagram: 1. Cooling device; 2. Liquid tank; 3. Medium return pipe; 4. Plate heat exchanger; 5. Water pump; 6. Circulation input pipe; 7. Connecting pipe; 8. Circulation output pipe; 9. Liquid outlet pipe; 10. Throttling cylinder; 1001. First connecting port; 1002. Second connecting port; 11. Electric heater; 12. Branch pipe; 13. Medium supply pipe; 14. Sliding plug; 15. Driving component; 16. Connecting rod; 17. Flow equalization cylinder; 18. Conveying cylinder; 19. Through hole; 20. First pressure sensor; 21. First temperature sensor; 22. Spiral guide vane; 23. Refrigeration return pipe; 24. Refrigeration supply pipe; 25. Conveying pipe; 26. T-joint; 27. Liquid delivery pipe; 28. Electric two-way valve; 29. Second pressure sensor; 30. Second temperature sensor; 31. Third temperature sensor; Detailed Implementation The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it.
[0023] To keep the drawings concise, each drawing only schematically shows the parts relevant to the invention; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."
[0024] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0025] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0026] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.
[0027] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0028] Example 1, as Figures 1 to 8 The diagram illustrates a multi-stage temperature control device according to an embodiment of the present invention, comprising a cooling device 1 for conveying a heat exchange medium, a circulating medium loop, and a refrigeration loop. The cooling device 1 can be configured as a chiller. It also includes a liquid tank 2, plate heat exchangers 4, a temperature control component, and a refrigeration component. Two level switches are installed on the liquid tank 2 for monitoring the level of the internal circulating medium. A medium return pipe 3 is connected to the liquid tank 2, and a third temperature sensor 31 is installed on the medium return pipe 3. At least two plate heat exchangers 4 are provided in the circulating medium loop, and the at least two plate heat exchangers 4 flow along the direction of the circulating medium loop. The circulating components are connected in series by circulating assemblies for conveying the circulating medium. The circulating assemblies include a water pump 5, a circulating output pipe 8, and a liquid outlet pipe 9. The input end of the water pump 5 is connected to the liquid tank 2 by a circulating input pipe 6. At least two plate heat exchangers 4 are arranged in series in sequence along the flow direction of the circulating medium through a connecting pipe 7. The circulating medium inlet of the first plate heat exchanger 4 located at the uppermost end is connected to the circulating output pipe 8, which is connected to the output end of the water pump 5. The circulating medium outlet of the last plate heat exchanger 4 located at the lowermost end is connected to the liquid outlet pipe 9, which is used to supply temperature-controlled circulating medium to external equipment.
[0029] Specifically, when heat exchange is performed on the relevant equipment using a circulating medium, the circulating medium needs to be delivered to the client. At this time, the water pump 5 is turned on, and the circulating medium in the liquid tank 2 is delivered to the first plate heat exchanger 4 at the top through the circulating output pipe 8 via the circulating input pipe 6. It then flows through all the plate heat exchangers 4 in sequence via the connecting pipe 7 along the circulating medium loop, and finally exits through the circulating medium outlet of the last plate heat exchanger 4 at the bottom. It is then delivered to the temperature control component via the liquid outlet pipe 9 and finally enters the client. After passing through the client, the circulating medium will enter the liquid tank 2 through the medium return pipe 3, and so on in a continuous cycle.
[0030] When the circulating medium flows through the plate heat exchanger 4, cooling water needs to be introduced into the plate heat exchanger 4. At this time, through the setting of the cooling device 1, the coolant (or PCW loop plant water, the temperature of PCW plant water in general semiconductor FAB plants is 18±2℃) enters the plate heat exchanger 4 under the control of the refrigeration components to provide a source of cooling, thereby dissipating heat from the circulating medium.
[0031] like Figures 4 to 8 As shown, the temperature control component is located at the outlet of the circulating medium and is used to control and adjust the temperature of the circulating medium in real time. The temperature control component includes a throttling cylinder 10, an electric heater 11, a branch pipe 12, a throttling section, and a flow equalization section. The throttling cylinder 10 is connected to the output end of the outlet pipe 9 and is arranged perpendicularly to the outlet pipe 9. The side of the throttling cylinder 10 is provided with a first connecting port 1001 and a second connecting port 1002. The first connecting port 1001 is connected to the input end of the electric heater 11, and the second connecting port 1002 is connected to the input end of the branch pipe 12. The throttling section is installed inside the throttling cylinder 10 and is used to control the flow rate of the circulating medium entering the electric heater 11 and the branch pipe 12. The flow equalization section is installed at the output end of the electric heater 11, and the output end of the flow equalization section is connected to the medium supply pipe 13.
[0032] Specifically, using the data from the first temperature sensor 21 as the detection value and the heating power of the electric heater 11 as the feedback value, when the circulating medium enters the throttling cylinder 10 through the outlet pipe 9, it enters the electric heater 11 under the action of the throttling section and is heated by the electric heater 11, thereby maintaining the temperature of the circulating medium at a required temperature to ensure the outlet temperature. The electric heater 11 is equipped with a temperature control switch to prevent the local liquid temperature from becoming too high and to supply the circulating medium with a stable temperature to the client. This process is repeated to form a cycle.
[0033] like Figure 6 , Figure 7As shown above, the throttling section includes a sliding plug 14 and a driving member 15. Two sliding plugs 14 are slidably and sealed inside the throttling cylinder 10. The two sliding plugs 14 are connected together by a connecting rod 16, forming a liquid supply chamber between the two sliding plugs 14. The driving member 15 is fixedly installed on the throttling cylinder 10 and is configured as a servo electric cylinder. The output end of the driving member 15 is fixedly connected to one of the sliding plugs 14. The liquid outlet pipe 9 is always in communication with the liquid supply chamber. When the sliding plug 14 slides to the first position, the liquid supply chamber is completely aligned with the first connecting port 1001 and completely offset from the second connecting port 1002. When the sliding plug 14 slides from the first position to the second position, the overlap area between the liquid supply chamber and the first connecting port 1001 gradually decreases, while the overlap area with the second connecting port 1002 gradually increases. When it slides to the second position, the liquid supply chamber is completely aligned with the second connecting port 1002 and completely offset from the first connecting port 1001.
[0034] Specifically, when the circulating medium needs to be delivered to the electric heater 11, the sliding plug 14 is in its initial position. At this time, the circulating medium entering the throttling cylinder 10 enters the liquid supply chamber and enters the electric heater 11 through the first connecting port 1001. When it is necessary to reduce the temperature of the output circulating medium, the driving component 15 can be activated. The driving component 15, through the setting of the connecting rod 16, synchronously pushes the two sliding plugs 14 to move, thereby changing the position of the liquid supply chamber. During the movement of the sliding plug 14, the overlapping area between the liquid supply chamber and the first connecting port 1001 gradually decreases, while the overlapping area with the second connecting port 1002 gradually increases. This controls a portion of the circulating medium to enter the branch pipe 12 and the flow equalization section, where it mixes with the heated circulating medium, thereby quickly reducing the temperature of the circulating medium output from the medium supply pipe 13. At the same time, the real-time monitoring by the first temperature sensor 21, combined with the precise control of the driving component 15, improves the stability of temperature control.
[0035] like Figures 6 to 8 As shown above, the flow equalization section includes a flow equalization cylinder 17, a first pressure sensor 20, and a first temperature sensor 21. The flow equalization cylinder 17 is connected to the output end of the electric heater 11. A conveying cylinder 18 is fixedly fitted to one end of the flow equalization cylinder 17 near the electric heater 11. Several through holes 19 are opened between the conveying cylinder 18 and the flow equalization cylinder 17. The output end of the branch pipe 12 is connected to the conveying cylinder 18. The flow equalization cylinder 17 is connected to the medium supply pipe 13. The first pressure sensor 20 and the first temperature sensor 21 are installed on the medium supply pipe 13. Several spiral guide vanes 22 are fixedly installed in a circumferential shape at equal angles inside the flow equalization cylinder 17. The spiral guide vanes 22 and the several through holes 19 are arranged alternately.
[0036] Specifically, when the circulating medium heated by the electric heater 11 enters the flow equalization cylinder 17, and the temperature of the circulating medium needs to be reduced, the unheated circulating medium is transported to the inside of the conveying cylinder 18 through the branch pipe 12, and enters the inside of the flow equalization cylinder 17 through the through hole 19. As the circulating medium flows, under the action of the spiral guide vane 22, the heated circulating medium and the unheated circulating medium are fully mixed, thereby rapidly reducing the temperature of the cooling medium.
[0037] like Figures 1 to 5 As shown, the refrigeration circuit includes a refrigeration assembly for adjusting the refrigeration effect on different plate heat exchangers 4 and controlling the actual refrigeration capacity of several plate heat exchangers 4 for the circulating medium. The refrigeration assembly includes a refrigeration return pipe 23, a refrigeration supply pipe 24, and a conveying section. The input end of the cooling device 1 is connected to the refrigeration return pipe 23, which is connected to the coolant outlet of the first downstream plate heat exchanger 4. The output end of the cooling device 1 is connected to the refrigeration supply pipe 24. At least two plate heat exchangers 4 pass through the refrigeration supply pipe 24 along the flow direction of the coolant. The delivery pipes 25 are arranged in series. Each plate heat exchanger 4 has a tee connector 26 connected to its coolant inlet. The tee connector 26 at the corresponding position is connected to the corresponding delivery pipe 25. Each tee connector 26 is equipped with a delivery part for delivering coolant. The delivery part includes a delivery pipe 27. Each tee connector 26 is connected to a delivery pipe 27 via an electric two-way valve 28. Each delivery pipe 27 is connected to a refrigeration supply pipe 24. A second pressure sensor 29 and a second temperature sensor 30 are also installed on the refrigeration supply pipe 24.
[0038] The opening degree of all the aforementioned electric two-way valves 28 depends on the internal control PID algorithm of the temperature control device. Specifically, when the system requires less cooling, the first-stage mode is activated. At this time, the electric two-way valve 28 at point A is opened first, while the electric two-way valves 28 at points B and C are closed. The data from the first temperature sensor 21 is used as the detection value, and the opening degree of the electric two-way valve 28 at point A is used as the feedback value. At this time, the opening degree increases, the flow rate of coolant through the plate heat exchanger 4 at point A increases, the heat exchange increases, the cooling capacity increases, and the temperature decreases.
[0039] When the system needs cooling, the electric two-way valve 28 at point B is opened first, while the electric two-way valves 28 at points A and C are closed. The data from the first temperature sensor 21 is used as the detection value, and the opening degree of the electric two-way valve 28 at point B is used as the feedback value. At this time, the opening degree increases, the flow rate of the coolant passing through the plate heat exchangers 4 at points A and B increases, thus increasing the heat exchange, increasing the cooling capacity, and decreasing the temperature.
[0040] When the system requires a larger cooling capacity, the third-level mode is activated. In this mode, the electric two-way valve 28 at point C is opened first, while the electric two-way valves 28 at points A and B are closed. The data from the first temperature sensor 21 is used as the detection value, and the opening degree of the electric two-way valve 28 at point C is used as the feedback value. At this time, the opening degree increases, the flow rate of coolant through the plate heat exchangers 4 at points A, B, and C increases, thus increasing the heat exchange, increasing the cooling capacity, and decreasing the temperature.
[0041] The heating process is similar to the cooling process. When the system needs to be heated, the opening of the electric two-way valve 28 decreases. At this time, the flow rate through the plate heat exchanger 4 decreases, the heat exchange decreases, the cooling capacity decreases, and the temperature rises. In addition, the heating power of the electric heater 11 increases during this process, which together stabilizes the outlet temperature.
[0042] By setting the second pressure sensor 29 and the second temperature sensor 30, the temperature of the output coolant is ensured to be stable.
[0043] The working principle or usage process of this application is as follows: When heat exchange is performed on related equipment using circulating media, the circulating media needs to be delivered to the client. At this time, water pump 5 is turned on, and the circulating media in liquid tank 2 is delivered through circulating input pipe 6 and circulating output pipe 8 to the first upstream plate heat exchanger 4. It then flows along the circulating media loop through connecting pipe 7 through all plate heat exchangers 4 sequentially, finally exiting through the circulating media outlet of the last downstream plate heat exchanger 4. The data from the first temperature sensor 21 is used as the detection value, and the heating power of the electric heater 11 is used as the feedback value. When the circulating media enters the throttling cylinder 10 through the liquid outlet pipe 9, it enters the electric heater 11 through the first connecting port 1001. When it is necessary to lower the temperature of the output circulating media, the drive unit 15 is activated. The drive unit 15, through the connecting rod 16, synchronously pushes the two sliding plugs 14 to move, thereby changing the position of the liquid supply chamber. During the movement of the sliding plugs 14, the liquid supply chamber and the first connecting port 1001... The overlapping area of 01 gradually decreases, while the overlapping area with the second connecting port 1002 gradually increases, thereby controlling part of the circulating medium to enter the branch pipe 12. The unheated circulating medium is transported to the inside of the conveying cylinder 18 through the branch pipe 12 and enters the inside of the flow equalization cylinder 17 through the through hole 19. As the circulating medium flows, under the action of the spiral guide vane 22, the heated circulating medium and the unheated circulating medium are fully mixed, thereby rapidly reducing the temperature of the cooling medium. At the same time, the real-time monitoring of the first temperature sensor 21, combined with the precise control of the drive component 15, improves the stability of temperature control, thereby keeping the temperature of the circulating medium that passes through at a required temperature to ensure the outlet temperature. The electric heater 11 is equipped with a temperature control switch to prevent the local liquid temperature from being too high and to supply the circulating medium with a stable temperature to the client. After passing through the client, the circulating medium will enter the liquid tank 2 through the medium return pipe 3, and so on in a reciprocating cycle.
[0044] When the circulating medium flows through the plate heat exchanger 4, cooling water needs to be introduced into the plate heat exchanger 4. At this time, through the setting of the cooling device 1, the coolant is introduced into the plate heat exchanger 4 to provide a source of cooling, thereby dissipating heat from the circulating medium.
[0045] When the system requires less cooling, the first-stage mode is started first. At this time, the electric two-way valve 28 at point A is opened first, while the electric two-way valves 28 at points B and C are closed. The data of the first temperature sensor 21 is used as the detection value, and the opening degree of the electric two-way valve 28 at point A is used as the feedback value. At this time, the opening degree increases, the flow rate of coolant through the plate heat exchanger 4 at point A increases, the heat exchange increases, the cooling capacity increases, and the temperature decreases.
[0046] When the system needs cooling, the electric two-way valve 28 at point B is opened first, while the electric two-way valves 28 at points A and C are closed. The data from the first temperature sensor 21 is used as the detection value, and the opening degree of the electric two-way valve 28 at point B is used as the feedback value. At this time, the opening degree increases, the flow rate of the coolant passing through the plate heat exchangers 4 at points A and B increases, thus increasing the heat exchange, increasing the cooling capacity, and decreasing the temperature.
[0047] When the system requires a larger cooling capacity, the third-level mode is activated. In this mode, the electric two-way valve 28 at point C is opened first, while the electric two-way valves 28 at points A and B are closed. The data from the first temperature sensor 21 is used as the detection value, and the opening degree of the electric two-way valve 28 at point C is used as the feedback value. At this time, the opening degree increases, the flow rate of coolant through the plate heat exchangers 4 at points A, B, and C increases, thus increasing the heat exchange, increasing the cooling capacity, and decreasing the temperature.
[0048] The heating process is similar to the cooling process. When the system needs to be heated, the opening of the electric two-way valve 28 decreases. At this time, the flow rate through the plate heat exchanger 4 decreases, the heat exchange decreases, the cooling capacity decreases, and the temperature rises. In addition, the heating power of the electric heater 11 increases during this process, which together stabilizes the outlet temperature.
[0049] Example 2: Based on a multi-stage temperature control device, this example 2 also proposes a multi-stage temperature control method, including the following steps: The first step is circulation. Start the water pump 5 to pump the circulating medium out of the liquid tank 2 and flow through all the plate heat exchangers 4 connected in series to form the main circulation.
[0050] The second step is temperature monitoring, which involves collecting data from the first temperature sensor 21 on the medium supply pipe 13 in real time as the actual temperature value and comparing it with the process set temperature value.
[0051] The third step is to switch the cooling mode. Based on the temperature difference, determine the required cooling level (small, medium, or large) and open the corresponding level of the electric two-way valve 28 (usually opened by a PLC / PID controller) to allow the coolant to flow through the corresponding number of plate heat exchangers 4. The heat exchange is precisely controlled by adjusting the opening of the electric two-way valve 28. During heating or compensating for cooling overshoot, the opening of the electric two-way valve 28 is reduced or closed.
[0052] The fourth step is to fine-tune the temperature of the circulating medium. Using the data from the first temperature sensor 21 as feedback, the power of the electric heater 11 is adjusted for heating compensation. At the same time, the precision control drive 15 pushes the sliding plug 14 to dynamically adjust the ratio of the medium flow rate entering the electric heater 11 and the branch pipe 12, thereby achieving rapid adjustment of the temperature of the output circulating medium.
[0053] The fifth step is mixing and output. The circulating medium, which has been heated or input through the branch pipe 12, is fully mixed in the flow equalization cylinder to ensure uniform temperature. Finally, a stable constant temperature circulating medium is provided to the client through the medium supply pipe 13.
[0054] Step 6, reflux: The medium refluxed from the client is returned to the liquid tank 2 after being monitored by the third temperature sensor 31. The system continues to perform closed-loop control from S2 to S5 until the process ends.
[0055] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.
Claims
1. A multi-stage temperature control device, comprising a cooling device (1) for conveying a heat exchange medium, a circulating medium circuit, and a refrigeration circuit, characterized in that, Also includes: Liquid tank (2), and a medium return pipe (3) is connected to the liquid tank (2); Plate heat exchanger (4), at least two of the plate heat exchangers (4) are provided on the circulating medium loop, and at least two of the plate heat exchangers (4) are connected in series along the flow direction of the circulating medium loop through a circulation assembly for conveying the circulating medium; A temperature control component is installed at the outlet of the circulating medium and is used to control and adjust the temperature of the circulating medium in real time. The refrigeration component, which is included in the refrigeration circuit, is used to adjust the refrigeration effect on different plate heat exchangers (4) and control the actual refrigeration capacity of several plate heat exchangers (4) for the circulating medium.
2. The multi-stage temperature control device according to claim 1, characterized in that, The loop component includes: A water pump (5) is connected to a circulation input pipe (6) between the input end of the water pump (5) and the liquid tank (2). Among them, at least two of the plate heat exchangers (4) are arranged in series in sequence through a connecting pipe (7) along the flow direction of the circulating medium; The circulation output pipe (8) is connected to the circulation medium inlet of the first plate heat exchanger (4) at the uppermost end, and the circulation output pipe (8) is connected to the output end of the water pump (5). The outlet pipe (9) is connected to the circulating medium outlet of the last plate heat exchanger (4) located at the downstream end.
3. The multi-stage temperature control device according to claim 2, characterized in that, The temperature control component includes: Throttling cylinder (10), the throttling cylinder (10) is connected to the output end of the liquid outlet pipe (9), and the throttling cylinder (10) is arranged perpendicularly to the liquid outlet pipe (9); An electric heater (11) and a branch pipe (12) are provided on the side of the throttle cylinder (10), with a first connection port (1001) and a second connection port (1002) respectively. The first connection port (1001) is connected to the input end of the electric heater (11), and the second connection port (1002) is connected to the input end of the branch pipe (12). A throttling section is installed inside the throttling cylinder (10) to control the flow rate of the circulating medium entering the electric heater (11) and the branch pipe (12); A flow equalization section is installed at the output end of the electric heater (11), and the output end of the flow equalization section is connected to a medium supply pipe (13).
4. The multi-stage temperature control device according to claim 3, characterized in that, The throttling section includes: Sliding plug (14) and driving member (15): Two sliding plugs (14) are slidably and sealed inside the throttling cylinder (10). The two sliding plugs (14) are connected together by a connecting rod (16), and a liquid supply chamber is formed between the two sliding plugs (14). The driving member (15) is fixedly installed on the throttling cylinder (10), and the output end of the driving member (15) is fixedly connected to one of the sliding plugs (14). The liquid outlet pipe (9) is always connected to the liquid supply chamber. When the sliding plug (14) slides to the first position, the liquid supply chamber is completely aligned with the first connecting port (1001) and completely offset from the second connecting port (1002). When the sliding plug (14) slides from the first position to the second position, the overlapping area of the liquid supply chamber with the first connecting port (1001) gradually decreases, while the overlapping area with the second connecting port (1002) gradually increases. When it slides to the second position, the liquid supply chamber is completely aligned with the second connecting port (1002) and completely offset from the first connecting port (1001).
5. The multi-stage temperature control device according to claim 4, characterized in that, The flow equalization section includes: A flow equalization cylinder (17) is connected to the output end of the electric heater (11). A conveying cylinder (18) is fixedly fitted at one end of the flow equalization cylinder (17) near the electric heater (11). Several through holes (19) are opened between the conveying cylinder (18) and the flow equalization cylinder (17). The output end of the branch pipe (12) is connected to the conveying cylinder (18). The first pressure sensor (20) and the first temperature sensor (21) are connected to the medium supply pipe (13) via the flow equalization cylinder (17). The first pressure sensor (20) and the first temperature sensor (21) are installed on the medium supply pipe (13).
6. The multi-stage temperature control device according to claim 5, characterized in that, The flow equalization cylinder (17) has several spiral guide vanes (22) fixedly installed in a circular shape at equal angles inside, and the spiral guide vanes (22) and the through holes (19) are arranged alternately.
7. The multi-stage temperature control device according to claim 1, characterized in that, The cooling component includes: The cooling device (1) has a refrigeration return pipe (23) and a refrigeration supply pipe (24). The input end of the cooling device (1) is connected to the refrigeration return pipe (23). The refrigeration return pipe (23) is connected to the coolant outlet of the first plate heat exchanger (4) located at the downstream end. The output end of the cooling device (1) is connected to the refrigeration supply pipe (24). Among them, at least two plate heat exchangers (4) are arranged in series along the flow direction of the coolant through a delivery pipe (25), and a three-way connector (26) is connected to the coolant inlet of each plate heat exchanger (4), and the three-way connector (26) at the corresponding position is connected to the corresponding delivery pipe (25). Each of the three-way connectors (26) is equipped with a conveying section for conveying coolant.
8. The multi-stage temperature control device according to claim 7, characterized in that, The delivery unit includes an infusion tube (27), and each of the three-way connectors (26) is connected to the infusion tube (27) via an electric two-way valve (28). Each of the infusion tubes (27) is connected to the refrigeration supply tube (24), and the refrigeration supply tube (24) is also equipped with a second pressure sensor (29) and a second temperature sensor (30).
9. A multi-stage temperature control device according to claim 8, characterized in that, A third temperature sensor (31) is installed on the medium return pipe (3).
10. A multi-stage temperature control method, using the multi-stage temperature control device according to any one of claims 1-9, characterized in that, Includes the following steps: S1, Circulation: Start the water pump (5) to pump the circulating medium out of the liquid tank (2) and flow through all the plate heat exchangers (4) in series to form the main circulation; S2. Temperature monitoring: Real-time acquisition of data from the first temperature sensor (21) on the medium supply pipe (13) is used to compare the actual temperature value with the process set temperature. S3. Cooling mode switching: Based on the temperature difference, determine the required cooling level (small, medium, large), open the corresponding level electric two-way valve (28), so that the coolant flows through the corresponding number of plate heat exchangers (4), and control the heat exchange by adjusting the opening of the electric two-way valve (28). In the process of heating up or compensating for cooling overshoot, reduce or close the opening of the electric two-way valve (28). S4. Fine-tune the temperature of the circulating medium. Using the data from the first temperature sensor (21) as feedback, adjust the power of the electric heater (11) for heating compensation. At the same time, control the drive (15) to push the sliding plug (14) to dynamically adjust the ratio of the medium flow rate entering the electric heater (11) and the branch pipe (12) to adjust the temperature of the output circulating medium. S5, Mixed output: The circulating medium, after being heated or input through the branch pipe (12), is fully mixed in the flow equalization cylinder to ensure uniform temperature, and finally provides constant temperature circulating medium to the client through the medium supply pipe (13); S6, reflux: The medium refluxed from the client is returned to the liquid tank (2) after being monitored by the third temperature sensor (31). The system continues to perform closed-loop control from S2 to S5 until the process ends.