Double-computer parallel equipment with built-in heat dissipation channel optimized structure

Abstract

The embodiment of the invention provides double-computer parallel equipment with a built-in heat dissipation channel optimized structure, and relates to the field of computer parallel equipment. The parallel equipment comprises a parallel equipment main body and heat dissipation holes, a plurality of heat dissipation holes are formed in two sides of the parallel equipment main body; the LED lamp further comprises a heat conduction assembly, an installation base, a flow control mechanism, a heat dissipation part and a fan. The number of the heat conduction assemblies is two, the heat conduction assemblies are installed in the parallel equipment body, the installation base is installed in the parallel equipment body, and the flow control mechanism is installed in the installation base. The heat dissipation part is installed in the parallel equipment body and located on the side face of the installation base. And the fan is connected with the heat dissipation part. According to the equipment, the cooling mode can be selected according to requirements, the flexibility of the equipment is improved, meanwhile, intermittent operation can be achieved through the water cooling mode, and cooling liquid temperature rise and air cooling efficiency reduction caused by long-term use are avoided.

Description

Technical Field

[0001] This invention relates to the field of parallel computer devices, specifically to a dual-computer parallel device with an optimized structure featuring a built-in heat dissipation channel. Background Technology

[0002] Parallel computer devices refer to devices or system architectures that connect two or more computers in a specific way to achieve functions such as resource sharing and collaborative work. Currently used parallel computer devices usually only have a single heat dissipation method, namely either air cooling or water cooling. However, the heat dissipation method currently used cannot be selected according to actual needs, resulting in low flexibility.

[0003] Based on this, the present invention is proposed. Summary of the Invention

[0004] According to embodiments of the present invention, a dual-computer parallel device with an optimized internal heat dissipation channel is provided to address the problems existing in the prior art.

[0005] In a first aspect of the invention, a dual-computer parallel device with an optimized structure featuring a built-in heat dissipation channel is provided.

[0006] The dual-computer parallel device with optimized internal heat dissipation channel includes: a parallel device body and heat dissipation holes; the parallel device body has several heat dissipation holes on both sides; it also includes: a heat conduction component, a mounting base, a flow control mechanism, a heat dissipation section and a fan; There are two heat-conducting components, each installed inside the main body of the parallel equipment. The mounting base is installed inside the main body of the parallel equipment, and the flow control mechanism is installed in the mounting base. The heat dissipation unit is installed inside the main body of the parallel equipment and is located on the side of the mounting base. The fan is connected to the heat dissipation unit. The flow control mechanism includes: a housing, a water outlet pipe, an extension pipe, a piston, a connecting plate, a rotating rod, a slider, and a slide rail; The outer casing is installed inside the mounting base; the water outlet pipe is installed on the outer casing; the extension pipe is installed on the lower surface of the outer casing; the piston is slidably installed inside the outer casing; the connecting plate is installed at the bottom end of the piston; one end of the rotating rod is rotatably installed at the bottom end of the connecting plate; the slide is installed at the bottom end of the inner cavity of the mounting base; the slider is slidably installed in the slide, and the other end of the rotating rod is rotatably installed on the slide.

[0007] Preferably, the heat-conducting component includes: a base, a mounting bracket, a heat-conducting sheet, and a heat-conducting grid; The mounting bracket is installed on the outer wall of the base; the heat-conducting sheet is installed at the bottom of the base; there are several heat-conducting grids, which are installed at equal intervals inside the base. The heat-conducting grids are fixedly connected to the base, and their bottom ends are in contact with the heat-conducting sheet.

[0008] Preferably, the heat dissipation part includes: a copper plate, a storage tank, a first interface, and a channel; The storage tank is installed on the side of the copper plate facing the mounting base; the channel is serpentinely arranged inside the copper plate; there are two second interfaces, which are respectively installed on the copper plate and connected to both ends of the channel; the storage tank and the second interface are connected by a connecting pipe.

[0009] Preferably, the mounting base is provided with a first interface.

[0010] Preferably, a drive mechanism is installed within the mounting base, and the drive mechanism is controlled to control the opening and closing of the housing passage.

[0011] Preferably, the driving mechanism includes: a turntable, a driving groove, a driving rod, and a limiting seat; The drive groove is formed on the upper surface of the turntable; one end of the drive rod is slidably installed in the drive groove, and the other end is connected to the slider; the limiting seat is installed in the mounting base and is slidably connected to the drive rod; the inner cavity of the limiting seat has a polygonal cross-section and is adapted to the cross-sectional shape of the drive rod.

[0012] Preferably, the drive groove includes: a first slide groove, a second slide groove, and a transition groove; the transition groove is disposed between the first slide groove and the second slide groove.

[0013] Preferably, the drive mechanism further includes: a worm gear, a worm, and a motor; The worm gear is rotatably mounted at the bottom of the inner cavity of the mounting base and is fixedly connected to the center of the lower surface of the turntable; the worm is rotatably mounted in the mounting base and meshes with the worm gear; the motor is mounted in the mounting base and its output end is connected to one end of the worm.

[0014] Preferably, a heat sink is also installed inside the main body of the parallel device, and the heat sink is connected to the heat-conducting component by a copper wire.

[0015] Preferably, the copper wire is mounted in a serpentine pattern on the heat sink.

[0016] One or more technical solutions provided in this application have at least the following technical effects or advantages: 1. The present invention provides a dual-computer parallel device with an optimized structure of built-in heat dissipation channel, which can transfer heat from the heat-generating components inside the device through heat-conducting components, and copper wires can transfer heat to the heat sink, increasing the contact area and accelerating heat dissipation.

[0017] 2. The driving mechanism in this invention can drive the flow control mechanism to operate, enabling the water cooling system to participate in the work. It can select the cooling method according to the needs, improving the flexibility of the equipment. At the same time, the water cooling method can operate intermittently, avoiding the coolant temperature rise caused by long-term use and reducing the efficiency of air cooling.

[0018] It should be understood that the description in the Summary of the Invention is not intended to limit the key or essential features of the embodiments of the present invention, nor is it intended to restrict the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0019] The above and other features, advantages, and aspects of the various embodiments of the present invention will become more apparent from the accompanying drawings and the following detailed description. In the drawings, the same or similar reference numerals denote the same or similar elements, wherein: Figure 1 A schematic diagram of a dual-computer parallel device with an optimized built-in heat dissipation channel according to an embodiment of the present invention is shown. Figure 2 An exploded view of a dual-computer parallel device with an optimized internal heat dissipation channel according to an embodiment of the present invention is shown. Figure 3 A schematic diagram of the heat dissipation section of a dual-computer parallel device with an optimized built-in heat dissipation channel according to an embodiment of the present invention is shown. Figure 4 A cross-sectional view of a copper plate of a dual-computer parallel device with an optimized internal heat dissipation channel according to an embodiment of the present invention is shown. Figure 5 A schematic diagram of the flow control mechanism of a dual-computer parallel device with an optimized built-in heat dissipation channel according to an embodiment of the present invention is shown. Figure 6 A top view of the turntable of a dual-computer parallel device with an optimized internal heat dissipation channel structure according to an embodiment of the present invention is shown. Figure 7 A top view of the worm gear of a dual-computer parallel device with an optimized internal heat dissipation channel according to an embodiment of the present invention is shown.

[0020] The attached figures are labeled as follows: 1. Parallel equipment body; 101. Heat dissipation hole; 2. Heat conduction component; 21. Base; 22. Mounting bracket; 23. Heat conduction plate; 24. Heat conduction grid; 3. Mounting seat; 301. First interface; 4. Flow control mechanism; 41. Outer shell; 42. Water outlet pipe; 43. Extension pipe; 44. Piston; 45. Connecting plate; 46. Rotating rod; 47. Slider; 48. Slide rail; 5. Heat dissipation part; 51. Copper plate; 52. Storage tank; 53. Second interface; 54. Channel; 6. Fan; 7. Drive mechanism; 71. Turntable; 72. First slide rail; 73. Second slide rail; 74. Transition groove; 75. Drive rod; 76. Limit seat; 77. Worm gear; 78. Worm; 79. Motor; 8. Copper wire; 9. Heat dissipation plate. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0023] like Figure 1 and Figure 2As shown, this dual-computer parallel device with an optimized internal heat dissipation channel includes: a parallel device body 1, heat dissipation holes 101, heat conduction components 2, a mounting base 3, a flow control mechanism 4, a heat dissipation section 5, a fan 6, a drive mechanism 7, copper wires 8, and a heat sink 9. The parallel device body 1 forms the outer frame of the device. The parallel device is an existing device, and any commonly available model is acceptable. The outer wall has standard sockets for connecting cables, all of which are existing technology and will not be described in detail. Several heat dissipation holes 101 are opened on both sides of the parallel device body 1 to expel internal hot air. There are two heat conduction components 2, each installed inside the parallel device body 1. The heat conduction components 2 can connect to the parallel device body 1 and contact the heat-generating components inside, facilitating rapid heat transfer for heat dissipation. The heat conduction components 2 can be configured for either water cooling or air cooling. The mounting base 3 is installed inside the parallel device body 1, and the flow control mechanism 4 is installed in the mounting base 3. The flow control mechanism 4 is controlled to open and close the water cooling channel of the heat conduction components 2. A heat dissipation unit 5 is installed inside the main body 1 of the parallel equipment and located on the side of the mounting base 3. The heat dissipation unit 5 is used to quickly disperse the heat transferred from the water-cooling passage of the heat-conducting component 2, increasing the contact area and accelerating heat dissipation. A drive mechanism 7 is installed inside the mounting base 3. The drive mechanism 7 is controlled to open and close the cooling water passage in the flow control mechanism 4. A heat dissipation plate 9 is also installed inside the main body 1 of the parallel equipment, and the heat dissipation plate 9 is connected to the heat-conducting component 2 via copper wires 8, which are serpentinely mounted on the heat dissipation plate 9. The heat dissipation plate 9 is made of copper, which has good thermal conductivity. The serpentine copper wires 8 increase the contact area, allowing the heat transferred from the heat-conducting component 2 to be quickly conducted to the heat dissipation plate 9 for rapid heat dissipation. There are two fans 6, installed on both sides inside the main body 1 of the parallel equipment. One is connected to the heat dissipation unit 5, and the other is connected to the heat dissipation plate 9, allowing heat to be discharged through the heat dissipation holes 101.

[0024] refer to Figure 3The heat-conducting component 2 includes: a base 21, a mounting bracket 22, a heat-conducting plate 23, and a heat-conducting grid 24. The base 21 is made of copper, which has good thermal conductivity, and copper wire 8 is spirally wound around its outer wall. Furthermore, a cavity is provided in the side wall of the base 21, serving as a coolant channel, and two connectors are provided for coolant inlet and outlet. Additionally, a plastic protective shell can be added to the outermost part of the base 21, and a miniature water pump is preferably provided on the connectors for pumping coolant. The mounting bracket 22 is installed on the outer wall of the base 21 and has slots. The base 21 can be fixedly installed in the mounting base 3 using screws and other fixing parts. The heat-conducting plate 23 is installed at the bottom of the base 21. During use, the copper heat-conducting plate 23 is attached to and connected to the heat-generating components within the connected equipment. Several heat-conducting grilles 24, all made of copper, are installed at equal intervals within the base 21. The heat-conducting grilles 24 are fixedly connected to the base 21, and their bottom ends contact the heat-conducting plates 23. The heat-conducting grilles 24 have a large contact area with the air, enabling them to transfer heat from the heat-conducting plates 23 to the base 21 while simultaneously dissipating some of the heat themselves. The mounting base 3 is provided with several first interfaces 301, and the connectors reserved on the base 21 are connected to the first interfaces 301.

[0025] refer to Figure 5 The flow control mechanism 4 includes: a housing 41, a water outlet pipe 42, an extension pipe 43, a piston 44, a connecting plate 45, a rotating rod 46, a slider 47, and a slide rail 48. The housing 41 is installed inside the mounting base 3 and has a fluid passage therein. The housing 41 is connected to the first interface 301 for supplying or discharging coolant into or out of the internal cavity of the base 21. The water outlet pipe 42 is installed on the housing 41, and its free end extends out of the mounting base 3. The extension pipe 43 is installed on the lower surface of the housing 41. The piston 44 is slidably installed inside the housing 41. When the piston 44 rises, it can enter the housing 41 and block the fluid passage within the housing 41. A connecting plate 45 is mounted on the bottom end of the piston 44. One end of the rotating rod 46 is rotatably mounted on the bottom end of the connecting plate 45. A slide rail 48 is mounted on the bottom end of the inner cavity of the mounting base 3. A slider 47 is slidably mounted in the slide rail 48, and the other end of the rotating rod 46 is rotatably mounted on the slide rail 48. The slider 47 can move axially along the slide rail 48. The limiting function of the slide rail 48 ensures the stability of the slider 47 and prevents it from shaking. At the same time, the rotating rod 46 rotates, opening and closing the fluid channel inside the complete outer shell 41. The length of the slide rail 48 is adapted to the length of the extension tube 43, ensuring that the piston 44 can completely seal and open the internal channel of the outer shell 41.

[0026] refer to Figure 3 and Figure 4The heat dissipation unit 5 includes a copper plate 51, a storage tank 52, a second interface 53, and a channel 54. The copper plate 51 is made entirely of copper and has good thermal conductivity. The storage tank 52 is installed on the side of the copper plate 51 facing the mounting base 3, and is filled with coolant. It has connection ports at both ends. The side of the copper plate 51 away from the mounting base 3 is connected to the fan 6 for easy heat dissipation. The channel 54 is arranged in a serpentine pattern inside the copper plate 51 to increase the contact area between the coolant and the copper plate 51. There are two second interfaces 53, which are installed on the copper plate 51 and connected to both ends of the channel 54. In actual use, one end of the storage tank 52 is connected to one second interface 53 via a connecting pipe, and the other end of the storage tank 52 is connected to the outlet pipe 42. The other second interface 53 extends into the mounting base 3 via a pipe and connects to the return water connector of the base 21 through another first interface 301.

[0027] refer to Figure 5 , Figure 6 and Figure 7 The drive mechanism 7 includes: a turntable 71, a drive groove, a drive rod 75, a limit seat 76, a worm gear 77, a worm 78, and a motor 79.

[0028] A drive groove is formed on the upper surface of the turntable 71. One end of the drive rod 75 is slidably installed in the drive groove, and the other end is connected to the slider 47. When the turntable 71 rotates, the drive groove limits the movement of the drive rod 75, which can push or pull the slider 47. A limiting seat 76 is installed in the mounting base 3 and is slidably connected to the drive rod 75. The inner cavity of the limiting seat 76 has a polygonal cross-section that matches the cross-sectional shape of the drive rod 75. The limiting effect of the limiting seat 76 can achieve stable movement of the drive rod 75 and prevent skewing. The worm gear 77 is rotatably installed at the bottom of the inner cavity of the mounting base 3 and is fixedly connected to the center of the lower surface of the turntable 71 to ensure that the two can rotate synchronously. The worm 78 is rotatably installed in the mounting base 3 and meshes with the worm gear 77. The rotation of the worm 78 around its own central axis can drive the rotation of the worm gear 77. At the same time, the rotation system of the two has self-locking properties. When the worm 78 stops rotating, it can lock the worm gear 77 to prevent the worm gear 77 from rotating on its own. The motor 79 is installed in the mounting base 3, and its output end is connected to one end of the worm gear 78. Turning on the motor 79 can drive the worm gear 78 to rotate. In this embodiment, the drive groove includes: a first slide groove 72, a second slide groove 73, and a transition groove 74. The transition groove 74 is disposed between the first slide groove 72 and the second slide groove 73. The first slide groove 72 and the second slide groove 73 are both arc-shaped and coaxial. The diameter of the circle containing the first slide groove 72 is larger than the diameter of the circle containing the second slide groove 73. The first slide groove 72, the second slide groove 73, and the transition groove 74 together form a unit. The four units are connected at equal intervals along the circumference to form a complete groove, ensuring that the rotation of the turntable 71 can complete four movements and resets of the drive rod 75.

[0029] In use, the base 21 is first installed so that the heat-conducting plate 23 comes into contact with the heat-generating component. When heat is generated, it is transferred to the heat sink 9 through the copper wire 8, and then quickly dissipated by the fan 6 connected to it. When water cooling mode is required, the motor 79 is turned on to drive the worm gear 78 to rotate, which in turn causes the worm wheel 77 to drive the turntable 71 to rotate. When the drive rod 75 enters the second slide groove 73 from the first slide groove 72 through the transition groove 74, it can pull the slider 47 to move towards the turntable 71. Then, through the pull of the rotating rod 46, the piston 44 moves downward, opening the passage in the outer shell 41. The micro pump on the base 21 pumps the cooling water through the pipe into the cavity in the base 21, which then carries away the heat transferred from the heat-conducting plate 23. The water then passes through the outer shell 41 into the storage tank 52, then flows into the channel 54 and finally flows out, returning to the cavity in the base 21, completing one cycle. In actual use, as the cooling water gradually heats up with use, continuous circulation of the cooling water can easily lead to its temperature becoming too high, which can no longer meet the cooling demand. Instead, it will increase the efficiency of another part of the air cooling. Therefore, when the overall temperature of the cooling water is too high, the turntable 71 is continuously rotated to complete the reciprocating movement of the drive rod 75, which can intermittently open the water cooling channel and reserve cooling time for the cooling water.

[0030] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A dual-computer parallel device with an optimized internal heat dissipation channel, comprising: Parallel equipment body (1) and heat dissipation holes (101); the parallel equipment body (1) has several heat dissipation holes (101) on both sides; characterized in that it further includes: heat conduction component (2), mounting base (3), flow control mechanism (4), heat dissipation part (5) and fan (6); There are two heat-conducting components (2), which are respectively installed in the main body (1) of the parallel equipment. The mounting base (3) is installed in the main body (1) of the parallel equipment. The flow control mechanism (4) is installed in the mounting base (3). The heat dissipation part (5) is installed in the main body (1) of the parallel equipment and is located on the side of the mounting base (3). The fan (6) is connected to the heat dissipation part (5). The flow control mechanism (4) includes: a housing (41), a water outlet pipe (42), an extension pipe (43), a piston (44), a connecting plate (45), a rotating rod (46), a slider (47), and a slide rail (48). The outer shell (41) is installed inside the mounting base (3); the water outlet pipe (42) is installed on the outer shell (41); the extension pipe (43) is installed on the lower surface of the outer shell (41); the piston (44) is slidably installed inside the outer shell (41); the connecting plate (45) is installed at the bottom end of the piston (44); one end of the rotating rod (46) is rotatably installed at the bottom end of the connecting plate (45); the slide rail (48) is installed at the bottom end of the inner cavity of the mounting base (3); the slider (47) is slidably installed in the slide rail (48), and the other end of the rotating rod (46) is rotatably installed on the slide rail (48).

2. The dual-computer parallel device with an optimized internal heat dissipation channel as described in claim 1, characterized in that, The heat-conducting component (2) includes: a base (21), a mounting bracket (22), a heat-conducting sheet (23), and a heat-conducting grid (24); The mounting bracket (22) is installed on the outer wall of the base (21); the heat-conducting plate (23) is installed at the bottom of the base (21); there are several heat-conducting grids (24), which are installed at equal intervals inside the base (21). The heat-conducting grids (24) are fixedly connected to the base (21), and their bottom ends are in contact with the heat-conducting plate (23).

3. The dual-computer parallel device with an optimized built-in heat dissipation channel according to claim 2, characterized in that, The heat dissipation part (5) includes: a copper plate (51), a storage tank (52), a second interface (53), and a channel (54). The storage tank (52) is installed on the side of the copper plate (51) facing the mounting base (3); the channel (54) is serpentinely arranged inside the copper plate (51); there are two second interfaces (53), which are respectively installed on the copper plate (51) and connected to both ends of the channel (54); the storage tank (52) and the second interface (53) are connected by a connecting pipe.

4. The dual-computer parallel device with an optimized built-in heat dissipation channel according to claim 3, characterized in that, The mounting base (3) is provided with a first interface (301).

5. The dual-computer parallel device with an optimized internal heat dissipation channel as described in claim 4, characterized in that, Also includes: A drive mechanism (7) is installed in the mounting base (3) and is controlled to control the opening and closing of the passage of the housing (41).

6. The dual-computer parallel device with an optimized internal heat dissipation channel as described in claim 5, characterized in that, The drive mechanism (7) includes: a turntable (71), a drive groove, a drive rod (75), and a limit seat (76). The drive groove is formed on the upper surface of the turntable (71); one end of the drive rod (75) is slidably installed in the drive groove, and the other end is connected to the slider (47); the limiting seat (76) is installed in the mounting seat (3) and is slidably connected to the drive rod (75); the inner cavity of the limiting seat (76) is polygonal and is adapted to the cross-sectional shape of the drive rod (75).

7. The dual-computer parallel device with an optimized internal heat dissipation channel as described in claim 6, characterized in that, The drive groove includes: a first slide groove (72), a second slide groove (73) and a transition groove (74); the transition groove (74) is disposed between the first slide groove (72) and the second slide groove (73).

8. The dual-computer parallel device with an optimized internal heat dissipation channel as described in claim 7, characterized in that, The drive mechanism (7) further includes: a worm gear (77), a worm (78), and a motor (79); The worm gear (77) is rotatably mounted at the bottom of the inner cavity of the mounting base (3) and is fixedly connected to the center of the lower surface of the turntable (71); the worm (78) is rotatably mounted in the mounting base (3) and meshes with the worm gear (77); the motor (79) is mounted in the mounting base (3) and its output end is connected to one end of the worm (78).

9. The dual-computer parallel device with an optimized internal heat dissipation channel according to claim 8, characterized in that, The main body (1) of the parallel equipment is also equipped with a heat sink (9), and the heat sink (9) is connected to the heat conduction component (2) by a copper wire (8).

10. The dual-computer parallel device with an optimized internal heat dissipation channel according to claim 9, characterized in that, The copper wire (8) is serpentinely mounted on the heat sink (9).

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