Electronic device

Abstract

The present application relates to an electronic device, and the electronic device includes a sensor layer defining a sensing region and a peripheral region adjacent to the sensing region. The sensor layer includes a plurality of first electrodes and a plurality of second electrodes. The sensing area comprises a plurality of sensing units. The plurality of sensing cells includes a first sensing cell space spaced apart from the peripheral region and a second sensing cell in contact with the peripheral region. The plurality of first electrodes includes first-second electrodes overlapping the second sensing unit. The plurality of second electrodes includes second-second electrodes overlapping the second sensing cells. The first-second electrode and the second-second electrode have an asymmetric structure with respect to at least one of the line extending in the first direction and the line extending in the second direction in the second sensing cell.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0133477, filed on October 2, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure described herein relate to an electronic device with improved sensing performance. Background Technology

[0004] Multimedia electronic devices such as televisions, mobile phones, tablets, laptops, car navigation systems, and game consoles include display devices for displaying images. Electronic devices may include a sensor layer (or input sensor) capable of providing a touch-based input method that allows users to intuitively and conveniently input information or commands in an easy and simple manner, in addition to conventional input methods such as buttons, keyboards, and mice. The sensor layer can sense the user's touch and / or pressure. There is a growing demand for pens for users accustomed to using writing instruments to input information, or pens for precise touch input in specific applications (e.g., applications for drawing or drafting). Summary of the Invention

[0005] Embodiments of this disclosure provide an electronic device for correspondingly improving sensing performance and enhancing sensing sensitivity at the periphery.

[0006] According to one or more embodiments, an electronic device includes: a sensor layer defining a sensing region and a peripheral region adjacent to the sensing region; and a sensor driver driving the sensor layer. The sensor layer includes: a plurality of first electrodes arranged along a first direction; and a plurality of second electrodes intersecting the plurality of first electrodes and arranged along a second direction intersecting the first direction. The sensing region includes a plurality of sensing units arranged along the first and second directions. The plurality of sensing units includes first sensing units spaced apart from the peripheral region and second sensing units contacting the peripheral region. The plurality of first electrodes includes a first-first electrode overlapping a first sensing unit and a first-second electrode overlapping a second sensing unit. The plurality of second electrodes includes a second-first electrode overlapping a first sensing unit and a second-second electrode overlapping a second sensing unit. The first-first electrode and the second-first electrode have a symmetrical structure in the first sensing unit relative to a line extending in the first direction and a line extending in the second direction. The first-second electrode and the second-second electrode have an asymmetrical structure in the second sensing unit relative to at least one of the lines extending in the first direction and the line extending in the second direction.

[0007] The first-first electrode may include a plurality of first sub-electrodes arranged along a first direction and having substantially the same shape, and the first-second electrode may include a plurality of second sub-electrodes arranged along the first direction, and the resistance of one of the plurality of second sub-electrodes may be lower than the resistance of another of the plurality of second sub-electrodes.

[0008] One second sub-electrode can be closer to the peripheral region than another second sub-electrode.

[0009] A second sub-electrode can have a larger area than the other second sub-electrode.

[0010] A second sub-electrode may include a plurality of first grid lines having a first linewidth, and another second sub-electrode may include a plurality of second grid lines having a second linewidth less than the first linewidth.

[0011] The sensor layer may further include a plurality of third electrodes arranged along the first direction, and the plurality of third electrodes may overlap with a plurality of first electrodes in a one-to-one correspondence. The plurality of third electrodes may include a third electrode that overlaps with the first-second electrodes, and a third electrode may include a plurality of third sub-electrodes arranged along the first direction.

[0012] Multiple third sub-electrodes may include a third-first sub-electrode that overlaps with one second sub-electrode and a third-second sub-electrode that overlaps with another second sub-electrode, and the resistance of the third-first sub-electrode may be lower than the resistance of the third-second sub-electrode.

[0013] The third-first sub-electrode may include a first bridging pattern on the same layer as a second sub-electrode, and the third-second sub-electrode may include a second bridging pattern on the same layer as the first bridging pattern, wherein the resistance of the first bridging pattern may be lower than the resistance of the second bridging pattern.

[0014] The number of grid lines included in the first bridging pattern can be greater than the number of grid lines included in the second bridging pattern.

[0015] The first capacitance between a second sub-electrode and a third-first sub-electrode can be greater than the second capacitance between another second sub-electrode and a third-second sub-electrode, and the third-first sub-electrode can be closer to the peripheral region than the third-second sub-electrode.

[0016] The plurality of sensing units may further include a third sensing unit between the first sensing unit and the second sensing unit. The plurality of first electrodes may further include a first-third electrode that overlaps with the third sensing unit. The first-third electrode may have a shape different from that of the first-first electrode and the first-second electrode.

[0017] The first-first electrode may include a plurality of first sub-electrodes arranged along a first direction and having substantially the same shape. The first-second electrode may include a plurality of second sub-electrodes arranged along the first direction. The first-third electrode may include a plurality of third sub-electrodes arranged along the first direction. The plurality of first sub-electrodes may have the same resistance ratio. The maximum difference in resistance ratio among the plurality of second sub-electrodes may be greater than the maximum difference in resistance ratio among the plurality of third sub-electrodes.

[0018] The first-second electrode may include a first layer electrode on the same layer as the first-first electrode and a second layer electrode located below the first layer electrode and electrically connected to the first layer electrode.

[0019] The sensor layer may also include an additional electrode connected to one of the plurality of second electrodes. The plurality of second electrodes may be arranged sequentially along a second direction, and one of the second electrodes may be one of the two second electrodes located at the outermost position among the plurality of second electrodes.

[0020] The sensor layer may also include multiple first traces electrically connected to multiple first electrodes and multiple second traces electrically connected to multiple second electrodes, and some of the multiple second traces may be located between a second electrode and an additional electrode.

[0021] The electronic device may also include a display layer located below the sensor layer and defining a display area and a non-display area adjacent to the display area, and some of the multiple second traces may overlap with the display area.

[0022] In the second sensing unit, the intersection area where the first-second electrode and the second-second electrode overlap can be closer to the peripheral area than the center of the second sensing unit.

[0023] The first sensing unit and the second sensing unit may be spaced apart from each other in a first direction, and the first sensing unit may have a wider width in the first direction than the second sensing unit.

[0024] The distance between the center of the first and second electrodes and the boundary between the peripheral region and the sensing region can be less than half the spacing between the multiple first electrodes.

[0025] According to one or more embodiments, an electronic device includes: a sensor layer defining a sensing region and a peripheral region adjacent to the sensing region; and a sensor driver driving the sensor layer. The sensor layer includes a plurality of first electrodes, a plurality of second electrodes intersecting the plurality of first electrodes, a plurality of third electrodes overlapping the plurality of first electrodes, and a plurality of fourth electrodes intersecting the plurality of first electrodes. The sensing region includes a plurality of sensing units arranged along a first direction and a second direction intersecting the first direction. The plurality of sensing units includes first sensing units spaced apart from the peripheral region and second sensing units in contact with the peripheral region. The plurality of first electrodes includes a first-first electrode overlapping with a first sensing unit and a first-second electrode overlapping with a second sensing unit. The first-first electrode has a shape different from the shape of the first-second electrode.

[0026] The first-first electrode may include a plurality of first-first sub-electrodes arranged along a first direction and having substantially the same shape. The first-second electrode may include a plurality of first-second sub-electrodes arranged along the first direction. The resistance of one of the plurality of first-second sub-electrodes may be lower than the resistance of another of the plurality of first-second sub-electrodes.

[0027] One first-second sub-electrode can be closer to the peripheral region than the other first-second sub-electrode.

[0028] According to one or more embodiments, an electronic device includes: a sensor layer defining a sensing region and a peripheral region adjacent to the sensing region; and a sensor driver driving the sensor layer. The sensing region includes a plurality of sensing units. The plurality of sensing units includes a first sensing unit spaced apart from the peripheral region and a second sensing unit contacting the peripheral region. The second sensing unit includes a first sub-region and a second sub-region, the first sub-region being adjacent to the peripheral region, the second sub-region being spaced apart from the peripheral region, and the first sub-region being between the second sub-region and the peripheral region. The area occupied by a conductive pattern transmitting a predetermined signal in the first sub-region is larger than the area occupied by the conductive pattern transmitting the predetermined signal in the second sub-region. Attached Figure Description

[0029] The above and other aspects and features of the embodiments of this disclosure will become apparent from the detailed description of the embodiments with reference to the accompanying drawings.

[0030] Figure 1A This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0031] Figure 1B This is a rear perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0032] Figure 2 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0033] Figure 3 This is a perspective view of an electronic device according to one or more embodiments of the present disclosure.

[0034] Figure 4 This is a schematic cross-sectional view of a display panel according to one or more embodiments of the present disclosure.

[0035] Figure 5 This is a view used to illustrate the operation of an electronic device according to one or more embodiments of the present disclosure.

[0036] Figure 6A This is a cross-sectional view of a display panel according to one or more embodiments of the present disclosure.

[0037] Figure 6B This is a cross-sectional view showing some components of a sensor layer according to one or more embodiments of the present disclosure.

[0038] Figure 7 This is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0039] Figure 8 This is a schematic diagram illustrating the operation of a sensor layer and a sensor driver according to one or more embodiments of the present disclosure.

[0040] Figure 9 It is a graph showing the induced current generated by the pen.

[0041] Figure 10A It is a plan view showing the sensing area according to one or more embodiments of the present disclosure.

[0042] Figure 10B It is a plan view showing the sensing area according to one or more embodiments of the present disclosure.

[0043] Figure 10C It is a plan view showing the sensing area according to one or more embodiments of the present disclosure.

[0044] Figure 11A This is a plan view showing the first conductive layer of a first sensing unit according to one or more embodiments of the present disclosure.

[0045] Figure 11B This is a plan view showing the second conductive layer of a first sensing unit according to one or more embodiments of the present disclosure.

[0046] Figure 12AThis is a plan view showing the first conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0047] Figure 12B This is a plan view showing the second conductive layer of the second sensing unit according to one or more embodiments of the present disclosure.

[0048] Figure 13A This is an enlarged plan view showing a portion of the second conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0049] Figure 13B This is an enlarged plan view showing a portion of the second conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0050] Figure 14A This is an enlarged plan view showing a portion of the second conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0051] Figure 14B This is an enlarged plan view showing a portion of the second conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0052] Figure 15A This is a plan view showing the first conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0053] Figure 15B This is a plan view showing the second conductive layer of the second sensing unit according to one or more embodiments of the present disclosure.

[0054] Figure 16 This is a plan view showing the second conductive layer of three sensing units according to one or more embodiments of the present disclosure.

[0055] Figure 17A This is a plan view showing the first conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0056] Figure 17B This is a plan view showing the second conductive layer of the second sensing unit according to one or more embodiments of the present disclosure.

[0057] Figure 18A This is a plan view showing the first conductive layer of a first sensing unit according to one or more embodiments of the present disclosure.

[0058] Figure 18B This is a plan view showing the second conductive layer of a first sensing unit according to one or more embodiments of the present disclosure.

[0059] Figure 19AThis is a plan view showing the first conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0060] Figure 19B This is a plan view showing the second conductive layer of the second sensing unit according to one or more embodiments of the present disclosure.

[0061] Figure 20A This is a plan view showing the first conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0062] Figure 20B This is a plan view showing the second conductive layer of the second sensing unit according to one or more embodiments of the present disclosure.

[0063] Figure 21A This is a plan view showing the first conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0064] Figure 21B This is a plan view showing the second conductive layer of the second sensing unit according to one or more embodiments of the present disclosure.

[0065] Figure 22A This is a plan view showing the first conductive layer of a second sensing unit according to one or more embodiments of the present disclosure.

[0066] Figure 22B This is a plan view showing the second conductive layer of the second sensing unit according to one or more embodiments of the present disclosure.

[0067] Figure 23 This is a plan view illustrating some of the components included in the second sensing unit according to one or more embodiments of the present disclosure.

[0068] Figure 24A This is a plan view showing a portion of the first conductive layer of a sensor layer according to one or more embodiments of the present disclosure.

[0069] Figure 24B This is a plan view showing a portion of the second conductive layer of a sensor layer according to one or more embodiments of the present disclosure.

[0070] Figure 25A This is a plan view showing a portion of the first conductive layer of a sensor layer according to one or more embodiments of the present disclosure.

[0071] Figure 25B This is a plan view showing a portion of the second conductive layer of a sensor layer according to one or more embodiments of the present disclosure.

[0072] Figure 26AThis is a plan view showing a portion of the first conductive layer of a sensor layer according to one or more embodiments of the present disclosure.

[0073] Figure 26B This is a plan view showing a portion of the second conductive layer of a sensor layer according to one or more embodiments of the present disclosure.

[0074] Figure 27 This is a plan view of a sensor layer according to one or more embodiments of the present disclosure.

[0075] Figure 28 It is a plan view showing the sensing area according to one or more embodiments of the present disclosure.

[0076] Figure 29 This is a plan view showing the second conductive layer of three sensing units according to one or more embodiments of the present disclosure.

[0077] Figure 30 This is a view illustrating the operation of a sensor driver according to one or more embodiments of the present disclosure.

[0078] Figure 31 This is a view illustrating the operation of a sensor driver according to one or more embodiments of the present disclosure.

[0079] Figure 32 This is a view used to illustrate a first mode according to one or more embodiments of this disclosure.

[0080] Figure 33 This is a view used to illustrate a second mode according to one or more embodiments of this disclosure.

[0081] Figure 34A It is a graph depicting the waveform of a first signal according to one or more embodiments of the present disclosure.

[0082] Figure 34B It is a graph depicting the waveform of a second signal according to one or more embodiments of the present disclosure.

[0083] Figure 35A This is a view used to illustrate a second mode according to one or more embodiments of this disclosure.

[0084] Figure 35B This is a view used to illustrate a second mode based on a sensing unit according to one or more embodiments of the present disclosure. Detailed Implementation

[0085] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on" another component, "connected to" or "attached to" another component, it means that the component may be directly on, directly connected to or directly attached to the other component, or a third component may exist between them.

[0086] The same reference numerals denote the same components. Furthermore, in the accompanying drawings, the thickness, scale, and dimensions of the components are exaggerated for effective description. As used herein, the term "and / or" includes all of one or more combinations defined by the relevant components.

[0087] Terms such as first, second, etc., may be used to describe various components, but these components should not be limited by these terms. These terms may be used only to distinguish one component from others. For example, without departing from the spirit and scope of this disclosure, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless otherwise stated, singular terms may include plural forms.

[0088] Furthermore, terms such as “below,” “under,” “above,” and “above” are used to describe the relationships between the components shown in the accompanying drawings. These terms are relative concepts and are described based on the directions shown in the accompanying drawings.

[0089] It should be understood that, when used herein, terms such as “comprising,” “including,” and “having” specify the presence of the stated features, numbers, steps, operations, components, parts, or combinations thereof, but do not exclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, and / or combinations thereof.

[0090] The terms "part" or "unit" refer to a software or hardware component that performs a specific function. Hardware components may include, for example, field-programmable gate arrays (FPGAs) or application-specific integrated circuits (ASICs). Software components may refer to executable code and / or data used by the executable code in addressable storage media. Therefore, software components can be, for example, object-oriented software components, class components, and task components, and may include processes, functions, attributes, procedures, subroutines, program code segments, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and / or variables.

[0091] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms defined in common dictionaries shall be interpreted as having the same meaning as in the context of the relevant field and shall not be interpreted as having an idealized or overly formal meaning unless clearly defined as having such a meaning in this application.

[0092] In the following description, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0093] Figure 1A This is a perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure. Figure 1B This is a rear perspective view of an electronic device 1000 according to one or more embodiments of the present disclosure.

[0094] refer to Figure 1A and Figure 1B The electronic device 1000 can be a device activated in response to an electrical signal. For example, the electronic device 1000 can display an image and can sense input applied from the outside. The external input can be user input. User input can include various types of external input, such as input through a part of the user's body, input through a pen PN, light, heat, and / or pressure.

[0095] The electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate panels that are independent of each other. The first display panel DP1 may be referred to as the main display panel, and the second display panel DP2 may be referred to as the auxiliary display panel or the external display panel.

[0096] The first display panel DP1 may include a first display portion DA1-F, and the second display panel DP2 may include a second display portion DA2-F. The area of ​​the second display panel DP2 may be smaller than the area of ​​the first display panel DP1. Corresponding to the dimensions of the first display panel DP1 and the second display panel DP2, the area of ​​the first display portion DA1-F may be larger than the area of ​​the second display portion DA2-F.

[0097] In the unfolded state of the electronic device 1000, the first display portion DA1-F may have a plane substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and rear surface (or lower surface) of the components constituting the electronic device 1000 may be defined based on the third direction DR3.

[0098] The first display panel DP1 or the first display portion DA1-F may include a foldable region FA capable of being folded and unfolded, and multiple non-foldable regions NFA1 and NFA2, wherein the multiple non-foldable regions NFA1 and NFA2 are spaced apart from each other (e.g., spaced apart), and the foldable region FA is located between the multiple non-foldable regions NFA1 and NFA2. The second display panel DP2 may overlap with one of the multiple non-foldable regions NFA1 and NFA2. For example, the second display panel DP2 may overlap with the first non-foldable region NFA1.

[0099] The display orientation of the first image IM1a displayed on the first display panel DP1 can be opposite to the display orientation of the second image IM2a displayed on the second display panel DP2. For example, the first image IM1a can be displayed on a third direction DR3, and the second image IM2a can be displayed on a fourth direction DR4, which is opposite to the third direction DR3.

[0100] In one or more embodiments of this disclosure, the folding region FA can be bent about a folding axis that extends in a direction parallel to the long side of the electronic device 1000 (e.g., in a direction parallel to the second direction DR2). In the folded state of the electronic device 1000, the folding region FA has an appropriate curvature (e.g., a predetermined curvature) and an appropriate radius of curvature (e.g., a predetermined radius of curvature). The electronic device 1000 can be folded in an inward folding manner such that the first non-folding region NFA1 and the second non-folding region NFA2 face each other, and the first display portion DA1-F is not exposed to the outside.

[0101] In one or more embodiments of this disclosure, the electronic device 1000 can be folded outwards, exposing the first display portion DA1-F to the outside. In one or more embodiments of this disclosure, the electronic device 1000 can be folded inwards or outwards in an unfolded state. However, this disclosure is not limited thereto.

[0102] although Figure 1A An example is shown in which a folding region FA is defined (or provided or included) in an electronic device 1000, but this disclosure is not limited thereto. For example, multiple folding axes and multiple folding regions corresponding to them may be defined in the electronic device 1000, and in the unfolded state, the electronic device 1000 may be folded in each of the multiple folding regions in an inward or outward manner.

[0103] According to one or more embodiments of this disclosure, at least one of the first display panel DP1 and the second display panel DP2 can sense input through the pen PN without a digitizer. Because the digitizer for sensing the pen PN is omitted, the increase in thickness and weight of the electronic device 1000 and the reduction in flexibility of the electronic device 1000 due to the addition of a digitizer are avoided. Therefore, not only the first display panel DP1 but also the second display panel DP2 can be designed to sense the pen PN.

[0104] Figure 2 This is a perspective view of an electronic device 1000-1 according to one or more embodiments of the present disclosure. Figure 3 This is a perspective view of an electronic device 1000-2 according to one or more embodiments of the present disclosure.

[0105] Figure 2 An example of an electronic device 1000-1 is shown, which is a bar-shaped electronic device (e.g., a mobile phone or a tablet computer), and the electronic device 1000-1 may include a display panel DP. Figure 3 An example of an electronic device 1000-2 being a notebook computer is shown, and the electronic device 1000-2 may include a display panel (DP). Although Figure 3 This is a 3D view of electronic device 1000-2, but it is displayed based on the display panel DP within electronic device 1000-2. Figure 3 The coordinate axes in the diagram.

[0106] In one or more embodiments of this disclosure, the display panel DP can sense input applied from an external source. External input can be user input. User input can include input such as through a part of the user's body, through a pen PN (see reference). Figure 1A Various types of external inputs, including light, heat, and / or pressure.

[0107] According to one or more embodiments of this disclosure, the display panel DP can sense input via the pen PN without a digitizer. Because the digitizer for sensing the pen PN is omitted, the increase in thickness and weight of the electronic device 1000-1 or 1000-2 due to the addition of a digitizer is avoided.

[0108] Despite Figure 1A The image shows a foldable electronic device 1000 and... Figure 2 The diagram shows a strip-shaped electronic device 1000-1, but the present disclosure described below is not limited thereto. For example, the following description can be applied to various electronic devices such as rollable electronic devices, sliding electronic devices, and / or stretchable electronic devices.

[0109] Figure 4This is a schematic cross-sectional view of a display panel DP according to one or more embodiments of the present disclosure.

[0110] refer to Figure 4 The display panel DP may include a display layer 100 and a sensor layer 200.

[0111] Display layer 100 may be a component that generally generates an image. A display area 100A and a non-display area 100NA adjacent to the display area 100A may be defined within display layer 100. An image may be displayed in display area 100A.

[0112] Display layer 100 may be an emitting display layer. For example, display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, and / or a nano-LED display layer. Display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0113] The base layer 110 may be a component providing a base surface on which the circuit layer 120 is disposed. The base layer 110 may have a multilayer structure or a single-layer structure. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, and / or a polymer substrate, but is not particularly limited thereto.

[0114] Circuit layer 120 may be disposed on base layer 110. Circuit layer 120 may include insulating layers, semiconductor patterns, conductive patterns, and / or signal lines. Insulating layers, semiconductor layers, and / or conductive layers may be formed on base layer 110 by processes such as coating and / or deposition. Insulating layers, semiconductor layers, and conductive layers may be selectively patterned by performing photolithography processes multiple times.

[0115] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro LEDs and / or nano LEDs.

[0116] An encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 can protect the light-emitting element layer 130 from foreign matter such as moisture, oxygen and / or dust particles.

[0117] The sensor layer 200 can be disposed on the display layer 100. A sensing area 200A and a peripheral area 200NA adjacent to the sensing area 200A can be defined in the sensor layer 200. The sensing area 200A can overlap with the display area 100A, and the peripheral area 200NA can overlap with the non-display area 100NA.

[0118] although Figure 4 An example is shown where the area of ​​the sensing region 200A is substantially the same as the area of ​​the display region 100A, but this disclosure is not limited thereto. For example, the area of ​​the sensing region 200A may be larger than the area of ​​the display region 100A. Therefore, a portion of the sensing region 200A may overlap with the non-display region 100NA. In this case, even if an input occurs near the boundary between the display region 100A and the non-display region 100NA, the sensor layer 200 can adequately recognize the signal because the sensing region 200A overlaps with a portion of the non-display region 100NA.

[0119] Sensor layer 200 can sense external input applied from the outside. Sensor layer 200 can be an integrated sensor continuously formed in the process of manufacturing display layer 100. Alternatively, sensor layer 200 can be an external sensor attached to display layer 100. Sensor layer 200 can be referred to as a sensor, input sensing layer, input sensing panel, and / or electronic device for sensing input coordinates.

[0120] According to one or more embodiments of this disclosure, sensor layer 200 can sense both input from a passive input device, such as a part of a user's body, and input from an input device that generates a magnetic field having an appropriate resonant frequency (e.g., a predetermined resonant frequency). The input device may be referred to as a pen, input pen, magnetic pen, stylus, and / or electromagnetic resonant pen.

[0121] Figure 5 This is a view used to illustrate the operation of an electronic device 1000 according to one or more embodiments of the present disclosure.

[0122] refer to Figure 5 The electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power circuit 1000P.

[0123] Sensor layer 200 can sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 can be an input through an input device capable of changing the capacitance of sensor layer 200 or an input device capable of inducing a current in sensor layer 200. For example, the first input 2000 can be an input through a passive input device such as a part of a user's body. The second input 3000 can be an input through a pen PN or an input through a radio frequency integrated circuit (RFIC) tag. For example, the pen PN can be a passive type pen or an active type pen.

[0124] In one or more embodiments of this disclosure, the pen PN can be a device that generates a magnetic field having an appropriate resonant frequency (e.g., a predetermined resonant frequency). The pen PN can transmit output signals based on an electromagnetic resonance scheme. The pen PN can be referred to as an input device, input pen, magnetic pen, stylus, and / or electromagnetic resonant pen.

[0125] The PN pen may include an RLC resonant circuit, and the RLC resonant circuit may include at least an inductor L and a capacitor C. In one or more embodiments of this disclosure, the RLC resonant circuit may be a variable resonant circuit that changes the resonant frequency. In this case, the inductor L may be a variable inductor, and / or the capacitor C may be a variable capacitor. However, this disclosure is not particularly limited thereto.

[0126] Inductor L generates current through a magnetic field formed in electronic device 1000 (e.g., sensor layer 200). However, this disclosure is not particularly limited thereto. For example, when pen PN operates in an active type, pen PN can generate current even without an externally supplied magnetic field. The generated current is transferred to capacitor C. Capacitor C charges the current input from inductor L and discharges the charged current back to inductor L. Thereafter, inductor L can emit a magnetic field with a resonant frequency. The induced current can flow in sensor layer 200 through the magnetic field emitted from pen PN. The induced current can be transmitted to sensor driver 200C as a received signal (e.g., a sensing signal or signal).

[0127] The main driver 1000C can control the overall operation of the electronic device 1000. For example, the main driver 1000C can control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, and / or a main processor.

[0128] Display driver 100C can drive display layer 100. Display driver 100C can receive image data and control signals from master driver 1000C. Control signals can include various signals. For example, control signals can include input vertical sync signals, input horizontal sync signals, master clock signals, and / or data enable signals.

[0129] Sensor driver 200C can drive sensor layer 200. Sensor driver 200C can receive control signals from main driver 1000C. The control signals may include a clock signal of sensor driver 200C. In addition, the control signals may also include a mode determination signal for determining the operating mode of sensor driver 200C and sensor layer 200.

[0130] The sensor driver 200C can be implemented using an integrated circuit (IC) and can be electrically connected to the sensor layer 200. For example, the sensor driver 200C can be directly mounted on an appropriate area (e.g., a predetermined area) of the display panel. Alternatively, the sensor driver 200C can be mounted on a separate printed circuit board (PCB) using a chip-on-film (COF) method and can be electrically connected to the sensor layer 200.

[0131] The sensor driver 200C and the sensor layer 200 can selectively operate in either a first mode or a second mode. For example, the first mode may be a mode for sensing touch input (e.g., first input 2000). The second mode may be a mode for sensing input via a pen PN (e.g., second input 3000). The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.

[0132] Switching between the first mode and the second mode can be performed in various ways. For example, the sensor driver 200C and the sensor layer 200 can be driven in a time-division manner in the first mode and the second mode, and can sense the first input 2000 and the second input 3000. Optionally, switching between the first mode and the second mode can be performed by user selection or a specific user action (or input). In another case, one of the first mode and the second mode can be activated or disabled by activating or disabling a specific application, or the operating mode can be switched from one mode to another. In yet another case, when the sensor driver 200C and the sensor layer 200 sense the first input 2000 while operating alternately in the first mode and the second mode, the sensor driver 200C and the sensor layer 200 can remain in the first mode, and when the second input 3000 is sensed, the sensor driver 200C and the sensor layer 200 can remain in the second mode.

[0133] The sensor driver 200C can calculate the input coordinate information based on the signal received from the sensor layer 200, and can provide a coordinate signal with the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user input based on the coordinate signal. For example, the main driver 1000C can operate the display driver 100C to display a new application image on the display layer 100.

[0134] The power circuit 1000P may include a power management integrated circuit (PMIC). The power circuit 1000P may generate multiple drive voltages for driving the display layer 100, sensor layer 200, display driver 100C, sensor driver 200C, and / or main driver 1000C. For example, the multiple drive voltages may include a gate high voltage, a gate low voltage, a first drive voltage (e.g., ELVSS voltage), a second drive voltage (e.g., ELVDD voltage), and an initialization voltage, but are not particularly limited to this example.

[0135] Figure 6A This is a cross-sectional view of a display panel DP according to one or more embodiments of the present disclosure.

[0136] refer to Figure 6A At least one buffer layer BFL is formed on the upper surface of the base layer 110. The buffer layer BFL can improve the bonding force between the base layer 110 and the semiconductor pattern. The buffer layer BFL can be formed from multiple layers. Optionally, the display layer 100 may also include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxide nitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately stacked one on top of the other.

[0137] Semiconductor patterns SC, AL, DR, and SCL can be disposed on the buffer layer BFL. The semiconductor patterns SC, AL, DR, and SCL can include polycrystalline silicon. However, they are not limited thereto; the semiconductor patterns SC, AL, DR, and SCL can include amorphous silicon, low-temperature polycrystalline silicon, and / or oxide semiconductors.

[0138] Figure 6A Only a portion of the semiconductor patterns SC, AL, DR, and SCL are shown, and these semiconductor patterns can be additionally disposed in other regions. The semiconductor patterns SC, AL, DR, and SCL can be arranged across pixels according to specific rules. Depending on whether they are doped, the semiconductor patterns SC, AL, DR, and SCL can have different electrical properties. The semiconductor patterns SC, AL, DR, and SCL can include a first region SC, DR, and SCL with high conductivity and a second region AL with low conductivity. The first regions SC, DR, and SCL can be doped with N-type or P-type dopant. A P-type transistor can include a doped region doped with P-type dopant, and an N-type transistor can include a doped region doped with N-type dopant. The second region AL can be an undoped region, or it can be a region that is lightly doped compared to the first regions SC, DR, and SCL.

[0139] The first regions SC, DR, and SCL can have higher conductivity than the second region AL and can be essentially used as electrodes or signal lines. The second region AL can essentially correspond to the active region AL (or channel) of transistor 100PC. In other words, one portion AL of the semiconductor pattern SC, AL, DR, and SCL can be the active region AL of transistor 100PC, another portion SC or DR can be the source region SC or drain region DR of transistor 100PC, and another portion SCL can be a connecting electrode or a connecting signal line SCL.

[0140] Each pixel can have an equivalent circuit comprising multiple transistors, at least one capacitor, and at least one light-emitting element, and the equivalent circuit of a pixel can be modified in various forms. Figure 6A The image shows a transistor 100PC and a light-emitting element 100PE included in a pixel.

[0141] The source region SC, active region AL, and drain region DR of transistor 100PC can be formed by semiconductor patterns SC, AL, DR, and SCL. The source region SC and drain region DR can extend from the active region AL in opposite directions in cross-section. Figure 6A The diagram shows a portion of the connection signal line SCL formed by semiconductor patterns SC, AL, DR, and SCL. In one or more embodiments, when viewed from above the plane (e.g., in a plan view), the connection signal line SCL may be connected to the drain region DR of transistor 100PC.

[0142] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may overlap with multiple pixels and may cover semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon nitride, zirconium oxide, and / or hafnium oxide. In this embodiment, the first insulating layer 10 may be a single silicon oxide layer. Not only the first insulating layer 10, but also the insulating layer of the circuit layer 120 described below may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the aforementioned materials, but is not limited thereto.

[0143] The gate GT of transistor 100PC is disposed on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT overlaps with the active region AL. In the process of doping or reducing semiconductor patterns SC, AL, DR, and SCL, the gate GT can act as a mask.

[0144] The second insulating layer 20 can be disposed on the first insulating layer 10 and can cover the gate GT. The second insulating layer 20 can overlap with the pixel. The second insulating layer 20 can be an inorganic layer and / or an organic layer, and can have a single-layer structure or a multi-layer structure. The second insulating layer 20 can include silicon oxide, silicon nitride, and / or silicon oxide nitride. In this embodiment, the second insulating layer 20 can have a multi-layer structure including silicon oxide layers and silicon nitride layers.

[0145] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0146] The first connection electrode CNE1 can be disposed on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through the contact hole CNT-1 that penetrates the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0147] A fourth insulating layer 40 may be disposed on the third insulating layer 30 and may cover the first connecting electrode CNE1. The fourth insulating layer 40 may be a single silicon oxide layer. A fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0148] The second connecting electrode CNE2 can be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the contact hole CNT-2 penetrating the fourth insulating layer 40 and the fifth insulating layer 50.

[0149] The sixth insulating layer 60 can be disposed on the fifth insulating layer 50 and can cover the second connecting electrode CNE2. The sixth insulating layer 60 can be an organic layer.

[0150] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, microLEDs, or nanoLEDs. In the following, the light-emitting element 100PE will be exemplified as an organic light-emitting element. However, this disclosure is not particularly limited thereto.

[0151] The light-emitting element 100PE may include a first electrode AE, an emitting layer EL, and a second electrode CE.

[0152] The first electrode AE ​​can be disposed on the sixth insulating layer 60. The first electrode AE ​​can be connected to the second connecting electrode CNE2 through the contact hole CNT-3 penetrating the sixth insulating layer 60.

[0153] A pixel defining layer 70 may be disposed on the sixth insulating layer 60 and may cover a portion of the first electrode AE. The pixel defining layer 70 has an opening 70-OP defined therein. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0154] First display section DA1-F (reference) Figure 1A The electrode may include an emitting region PXA and a non-emitting region NPXA adjacent to the emitting region PXA. The non-emitting region NPXA may surround the emitting region PXA (e.g., it may surround the emitting region PXA). In this embodiment, the emitting region PXA is defined to correspond to the portion of the first electrode AE ​​exposed through the opening 70-OP.

[0155] The emitter layer EL can be disposed on the first electrode AE. The emitter layer EL can be disposed in the region corresponding to the opening 70-OP. Although Figure 6A An example of an emission layer EL disposed in an opening 70-OP is shown, but this disclosure is not particularly limited thereto. For example, in one or more embodiments, the emission layer EL may extend to cover a portion of the side surface of the pixel defining layer 70 defining the opening 70-OP and the upper surface of the pixel defining layer 70.

[0156] In one or more embodiments of this disclosure, the emission layer EL can be formed individually in each pixel. When the emission layer EL is formed individually in each pixel, each emission layer EL can emit at least one of blue light, red light, and green light. However, it is not limited thereto; the emission layer EL can have a monolithic shape and can be collectively included in multiple pixels. In this case, the emission layer EL can provide blue light or white light.

[0157] The second electrode CE can be disposed on the emitter layer EL. The second electrode CE can have a monolithic shape and can be included together in multiple pixels.

[0158] In one or more embodiments of this disclosure, a hole control layer may be disposed between the first electrode AE ​​and the emitter layer EL. The hole control layer is commonly disposed in the emitter region PXA and the non-emitter region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer may be disposed between the emitter layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be jointly formed in multiple pixels using an aperture mask or an inkjet process.

[0159] An encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and another inorganic layer stacked sequentially on top of each other. However, the layers constituting the encapsulation layer 140 are not limited to these. The inorganic layer may protect the light-emitting element layer 130 from moisture and / or oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer. The organic layer may include, but is not limited to, an acrylic organic layer.

[0160] The sensor layer 200 may include a base layer 201, a first conductive layer 202, a first insulating layer 203, a second conductive layer 204, and a second insulating layer 205.

[0161] The base layer 201 may be an inorganic layer comprising at least one of silicon nitride, silicon oxide nitride, and silicon oxide. Optionally, the base layer 201 may be an organic layer comprising epoxy resin, acrylic resin, or imide-based resin. The base layer 201 may have a monolayer structure or may have a multilayer structure stacked on a third-direction DR3. In one or more embodiments of this disclosure, the sensor layer 200 may not include the base layer 201.

[0162] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or may have a multi-layer structure stacked on the third-direction DR3.

[0163] Each of the first conductive layer 202 and the second conductive layer 204, having a monolayer structure, may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and / or alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and / or indium zinc tin oxide (IZTO). Furthermore, the transparent conductive layer may include conductive polymers such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, and / or graphene.

[0164] Each of the first conductive layer 202 and the second conductive layer 204, which have a multilayer structure, may include a metal layer. The metal layer may have a three-layer structure, such as titanium / aluminum / titanium. The conductive layer with a multilayer structure may include at least one metal layer and at least one transparent conductive layer.

[0165] In one or more embodiments of this disclosure, the thickness of the first conductive layer 202 may be greater than or equal to the thickness of the second conductive layer 204. When the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of the components included in the first conductive layer 202 (e.g., electrodes, patterns, and / or bridging patterns) may decrease. Furthermore, because the first conductive layer 202 is disposed below the second conductive layer 204, even if the thickness of the first conductive layer 202 is increased, the probability that the components included in the first conductive layer 202 will be visually identifiable due to reflection of external light may be lower than that of the components included in the second conductive layer 204.

[0166] At least one of the first insulating layer 203 and the second insulating layer 205 may include an inorganic film. The inorganic film may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon nitride, zirconium oxide and / or hafnium oxide.

[0167] At least one of the first insulating layer 203 and the second insulating layer 205 may include an organic film. The organic film may include acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, urethane-based resins, cellulose resins, siloxane-based resins, polyimide resins, polyamide resins, and / or benzo[a]phthalene-based resins.

[0168] Although the sensor layer 200 has been described as including a first conductive layer 202 and a second conductive layer 204, i.e., a total of two conductive layers, this disclosure is not particularly limited thereto. For example, the sensor layer 200 may include three or more conductive layers.

[0169] Figure 6B This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (reference 200). Figure 6A A cross-sectional view of some components of ).

[0170] refer to Figure 6A and Figure 6B The second width 204wt of the second grid line MS2 included in the second conductive layer 204 can be greater than or equal to the first width 202wt of the first grid line MS1 included in the first conductive layer 202. When the user USR views the first grid line MS1 and the second grid line MS2 from the side, because the first grid line MS1 has a smaller width than the second grid line MS2, the probability that the first grid line MS1 will be visually recognized by the user USR can be reduced.

[0171] Each of the first grid line MS1 and the second grid line MS2 may include a first metal layer M1 and a second metal layer M2 disposed between the first metal layers M1. For example, the first metal layer M1 may include titanium (Ti), and the second metal layer M2 may include aluminum (Al). However, this is merely an example, and this disclosure is not particularly limited thereto.

[0172] In one or more embodiments of this disclosure, the first thickness TK1 of the second metal layer M2 of the first grid line MS1 and the second thickness TK2 of the second metal layer M2 of the second grid line MS2 may be substantially the same as each other, but are not particularly limited thereto. For example, the first thickness TK1 may be greater than the second thickness TK2. Optionally, the second thickness TK2 may be greater than the first thickness TK1. In one or more embodiments of this disclosure, each of the first thickness TK1 and the second thickness TK2 may be 1000 angstroms or greater (e.g., 6000 angstroms).

[0173] Figure 7 This is a plan view of a sensor layer 200 according to one or more embodiments of the present disclosure.

[0174] refer to Figure 7 A sensing region 200A and an adjacent peripheral region 200NA can be defined in the sensor layer 200.

[0175] The sensor layer 200 may include a plurality of first electrodes 210, a plurality of second electrodes 220, a plurality of third electrodes 230 and a plurality of fourth electrodes 240 disposed in the sensing area 200A.

[0176] Each of the first electrodes 210 may intersect with the second electrode 220. Each of the first electrodes 210 may extend in a second direction DR2, and the first electrodes 210 may be spaced apart from each other along a first direction DR1 (e.g., spaced apart). Each of the second electrodes 220 may extend in the first direction DR1, and the second electrodes 220 may be spaced apart from each other along a second direction DR2 (e.g., spaced apart).

[0177] The sensing region 200A may include a plurality of sensing units SU arranged along a first direction DR1 and a second direction DR2. Each sensing unit SU may include a region where a first electrode 210 and a second electrode 220 intersect each other. Figure 7 The diagram shows eight first electrodes 210 and six second electrodes 220 as an example, and 48 sensing units SU as an example. However, the number of first electrodes 210 and the number of second electrodes 220 are not limited to these.

[0178] Each of the third electrodes 230 may extend in the second direction DR2, and the third electrodes 230 may be spaced apart from each other along the first direction DR1 (e.g., spaced apart). A third electrode 230 may overlap with at least a portion of a first electrode 210. According to one or more embodiments of the present disclosure, the capacitance (or coupling capacitance) between a first electrode 210 and a third electrode 230 can be adjusted by adjusting the overlap area between the first electrode 210 and the third electrode 230.

[0179] In one or more embodiments of this disclosure, at least some of the third electrodes 230 may be connected in parallel. For example, Figure 7 An example is shown where two third electrodes 230 are connected in parallel to form a first electrode group 230pc, and four first electrode groups 230pc can be arranged along a first direction DR1. However, the number of third electrodes 230 constituting a first electrode group 230pc is not limited thereto. For example, a first electrode group 230pc may include only one third electrode 230, or it may include three or more third electrodes 230.

[0180] When the number of third electrodes 230 included in and connected in parallel with the first electrode group 230pc increases, the resistance of the first electrode group 230pc can be reduced, and thus power efficiency and sensing sensitivity can be improved. Conversely, when the number of third electrodes 230 included in the first electrode group 230pc decreases, the loop coil pattern formed using the first electrode group 230pc can be implemented in a wider variety of forms.

[0181] The fourth electrode 240 may be arranged in the second direction DR2. The fourth electrode 240 may extend in the first direction DR1. A fourth electrode 240 may at least partially overlap with a second electrode 220. According to one or more embodiments of the present disclosure, the capacitance (or coupling capacitance) between a second electrode 220 and a fourth electrode 240 can be adjusted by adjusting the overlap area between the second electrode 220 and the fourth electrode 240.

[0182] In one or more embodiments of this disclosure, at least some of the fourth electrodes 240 may be electrically connected to form a second electrode group 240pc. For example, Figure 7 An example is shown where three fourth electrodes 240 are connected to the same trace (e.g., a group trace 240t) to form a second electrode group 240pc. Therefore, in Figure 7In the diagram, two second electrode groups 240pc are shown arranged along the second direction DR2. However, the number of fourth electrodes 240 constituting one second electrode group 240pc is not limited to this. For example, the number of fourth electrodes 240 constituting one second electrode group 240pc can be six, and in this case, the sensor layer 200 can include only one second electrode group 240pc.

[0183] The sensor layer 200 may further include a plurality of first traces 210t and a plurality of second traces 220t disposed in the peripheral region 200NA. The first traces 210t may be electrically connected to the first electrode 210 in a one-to-one correspondence. The second traces 220t may be electrically connected to the second electrode 220 in a one-to-one correspondence. In one or more embodiments of this disclosure, at least some of the first traces 210t and at least some of the second traces 220t may be connected to the display layer 100 (see reference 100). Figure 4 The display area 100A (reference) Figure 4 )overlapping.

[0184] The sensor layer 200 may also include a first loop trace 230rt1, a group trace 240t, and a second loop trace 230rt2 disposed in the peripheral region 200NA.

[0185] The first loop trace 230rt1 may be electrically connected to the third electrode 230. In one or more embodiments of this disclosure, the first loop trace 230rt1 may be electrically connected to all of the third electrode 230. The first loop trace 230rt1 may include a first line portion 231t extending in a first direction DR1 and electrically connected to the third electrode 230, a second line portion 232t extending in a second direction DR2 from a first end of the first line portion 231t, and a third line portion 233t extending in the second direction DR2 from a second end of the first line portion 231t.

[0186] In one or more embodiments of this disclosure, each of the resistance of the second wire portion 232t and the resistance of the third wire portion 233t can be substantially the same as the resistance of one of the first electrode groups 230pc. Therefore, each of the second wire portion 232t and the third wire portion 233t can be used as a first electrode group 230pc, and the same effect as placing the third electrode 230 in the peripheral region 200NA can be obtained. For example, one of the second wire portion 232t and the third wire portion 233t, and one of the third electrodes 230, can form a coil. Therefore, the pen PN located in the region adjacent to the peripheral region 200NA can also be adequately charged by a loop including the second wire portion 232t or the third wire portion 233t.

[0187] In one or more embodiments of this disclosure, the widths of the second line portion 232t and the third line portion 233t in the first direction DR1 can be adjusted to adjust the resistance of the second line portion 232t and the third line portion 233t. However, this is merely an example, and the first line portion 231t, the second line portion 232t, and the third line portion 233t may have substantially the same width.

[0188] The second loop trace 230rt2 can be connected to the first electrode group 230pc in a one-to-one correspondence. That is, the number of second loop traces 230rt2 can correspond to the number of first electrode groups 230pc. Figure 7 The image shows four second loop traces 230rt2 and four first electrode groups 230pc as an example.

[0189] In one or more embodiments of this disclosure, the second loop trace 230rt2 may be omitted, as may the charging operation mode for charging the pen. In this case, the sensor layer 200 can sense input via an active pen capable of emitting a magnetic field, even without providing a magnetic field from the sensor layer 200.

[0190] The group traces 240t can be spaced apart from each other (e.g., spaced apart), and the sensing area 200A is between them. The group traces 240t can be electrically connected to the second electrode group 240pc in a one-to-one correspondence. Figure 7 An example of arranging two second electrode groups 240pc is shown. Group traces 240t connected to one second electrode group 240pc and group traces 240t connected to the other second electrode group 240pc can be spaced apart from each other (e.g., spaced apart), and a sensing region 200A lies between them. However, this disclosure is not particularly limited thereto. Group traces 240t may be referred to as traces.

[0191] The sensor layer 200 may include a plurality of pads PD disposed in a peripheral region 200NA. The pads PD may be spaced apart from each other along a first direction DR1 (e.g., spaced apart). Although Figure 7 An example is shown where pads PD are arranged in a row along a first direction DR1, but this disclosure is not particularly limited thereto. For example, pads PD can be arranged in multiple rows.

[0192] The pads PD can be electrically connected in a one-to-one correspondence to one end and the opposite end of the first trace 210t, the second trace 220t, the first loop trace 230rt1, the second loop trace 230rt2, and the group trace 240t.

[0193] Figure 8 This illustrates a sensor layer 200 according to one or more embodiments of the present disclosure (reference 200). Figure 7A schematic diagram of the operation of the sensor driver 200C. Figure 9 This shows the pen PN (reference) Figure 5 The graph shows the induced current generated.

[0194] refer to Figure 7 , Figure 8 and Figure 9 The sensor driver 200C can differentially sense channels that are adjacent to each other or channels that are spaced apart (e.g., separated) to sense the current induced by the pen PN. For example, to sense the horizontal axis coordinate parallel to the first direction DR1, the sensor driver 200C can differentially sense the signal received from the first electrode 210. To sense the vertical axis coordinate parallel to the second direction DR2, the sensor driver 200C can differentially sense the signal received from the second electrode 220.

[0195] The first electrode 210 and the second electrode 220 may be referred to as channels, respectively. The following description is based on the first electrode 210, but can also be applied to the second electrode 220. The signal can be an induced current induced by the pen PN. For example, an induced current corresponding to the position of the current path can be generated in each of the channels. Therefore, when the position of the current path in the channel is adjusted, the intensity (or amplitude) of the current can be changed.

[0196] exist Figure 8 The diagram illustrates three channels 210ch1, 210ch2, and 210ch3 adjacent to the boundary BD between the sensing region 200A and the peripheral region 200NA, as an example. These three channels 210ch1, 210ch2, and 210ch3 may correspond to three first electrodes 210. In one or more embodiments of this disclosure, the sensor driver 200C can differentially sense signals received from the Xth channel and the (X+2)th channel, but is not particularly limited thereto. x is a positive integer of 1 or greater.

[0197] exist Figure 8 and Figure 9 The diagram shows the center P1 of the first channel 210ch1 and the center P2 of the third channel 210ch3. The center P1 of the first channel 210ch1 may be separated from the boundary BD between the sensing region 200A and the peripheral region 200NA by half the spacing between the first electrodes 210.

[0198] Figure 9 It is to depict the PN pen (reference) Figure 5 The graph shows the induced current at the first point P0 corresponding to the boundary BD. The direction of the induced current flowing to the channel on the upper left relative to the position of the pen PN can differ from the direction of the induced current flowing to the channel on the upper right relative to the position of the pen PN. The strength of the magnetic field can be proportional to the current. Therefore, Figure 9 The vertical axis of the graph shown represents the strength of the magnetic field.

[0199] When the pen PN is positioned to overlap with the sensing area 200A, the sensor driver 200C can differentially sense the induced current received from the first electrode 210, which is positioned on the opposite side relative to the pen PN, and can obtain absolute value data. For example, the maximum value of the absolute value data can be obtained by differentially sensing the induced current facing different directions.

[0200] When the pen PN is located at or adjacent to the first point P0, no electrode for sensing the induced current is provided because the left side of the pen PN corresponds to the peripheral region 200NA. Therefore, the sensor driver 200C can sense the position of the pen PN differentially from signals received from channels 210ch1, 210ch2, and 210ch3 positioned on the right side relative to the pen PN. Because the sensor driver 200C must use the first electrode 210 positioned on one side relative to the pen PN to differentially sense the induced current supplied from the pen PN, the sensitivity may be reduced compared to when the pen PN is positioned to overlap with the sensing region 200A.

[0201] According to one or more embodiments of this disclosure, the resistance or shape of a channel disposed adjacent to the peripheral region 200NA can be adjusted to improve pen sensing sensitivity in the region adjacent to the peripheral region 200NA. For example, the current path of the first channel 210ch1 can be designed to move from the center P1 of the first channel 210ch1 to the adjustment point PA of the first channel 210ch1.

[0202] The adjustment point PA can be closer to the peripheral region 200NA than the center P1 of the first channel 210ch1. Therefore, the sensor driver 200C may not receive the induced current corresponding to the center P1 of the first channel 210ch1, but may receive the induced current corresponding to the adjustment point PA which is closer to the peripheral region 200NA than the center P1.

[0203] The adjustment point PA of the first channel 210ch1 can be separated from the boundary BD between the sensing area 200A and the peripheral area 200NA by less than half the spacing between the first electrodes 210. The difference SM between the induced current corresponding to the adjustment point PA of the first channel 210ch1 and the induced current received from the third channel 210ch3 can be greater than the difference SM-C between the induced current corresponding to the center P1 of the first channel 210ch1 and the induced current received from the third channel 210ch3. As the difference increases, the sensitivity of the pen can be improved.

[0204] In other words, according to one or more embodiments of this disclosure, the resistance or shape of the first channel 210ch1 disposed adjacent to the peripheral region 200NA can be designed asymmetrically. For example, the current path of the first channel 210ch1 can be adjusted so that it is closer to the peripheral region 200NA than the center P1 of the first channel 210ch1. In this case, the difference between signals (e.g., the difference in intensity between induced currents) can be further increased during differential sensing, and thus the pen PN sensing sensitivity in the region adjacent to the peripheral region 200NA can be further improved.

[0205] Figure 10A This is a plan view showing a sensing area 200A according to one or more embodiments of the present disclosure.

[0206] refer to Figure 7 and Figure 10A The sensing area 200A may include multiple sensing units SU1 and SU2. The sensing units SU1 and SU2 may be arranged along a first direction DR1 and a second direction DR2. Each of the sensing units SU1 and SU2 may correspond to an area where one channel and another channel intersect each other.

[0207] The sensing units SU1 and SU2 may include a first sensing unit SU1 and a second sensing unit SU2.

[0208] The first sensing unit SU1 may include a reference sensing unit SU-C. The portion of the electrode included in the reference sensing unit SU-C may have a symmetrical shape relative to a virtual line intersecting the center of the first sensing unit SU1. The center of the resistor in each of the first sensing units SU1 may be substantially the same as the center of the first sensing unit SU1. Therefore, the current path of the first sensing unit SU1 may correspond to the center of the first sensing unit SU1.

[0209] The second sensing unit SU2 may include multiple external sensing units SU-EU, SU-EL, SU-EC1, SU-EC2, and SU-EB. The portion of the electrode included in each of the external sensing units SU-EU, SU-EL, SU-EC1, SU-EC2, and SU-EB may have an asymmetrical shape. For example, each of the external sensing units SU-EU, SU-EL, SU-EC1, SU-EC2, and SU-EB may differ in shape from the reference sensing unit SU-C. Therefore, the current path of the second sensing unit SU2 may not be aligned with the center of the second sensing unit SU2.

[0210] The center of the resistor in each of the second sensing units SU2 may be different from the center of the second sensing unit SU2. For example, the center of the resistor in each of the second sensing units SU2 may be closer to the peripheral region by 200NA than the center of the second sensing unit SU2. For example, the first outer sensing unit SU-EL is located to the right of the boundary BD. Therefore, the center of the resistor in the first outer sensing unit SU-EL may be located to the left of the center of the first outer sensing unit SU-EL. The second outer sensing unit SU-EU is located below the boundary BD. Therefore, the center of the resistor in the second outer sensing unit SU-EU may be located above the center of the second outer sensing unit SU-EU.

[0211] In other words, the resistance or shape of the electrodes disposed in the second sensing unit SU2 can be designed such that the current path of the second sensing unit SU2 is closer to the peripheral region 200NA than the center of the second sensing unit SU2. Therefore, even if a pen input occurs adjacent to the peripheral region 200NA, the difference between the induced currents provided from the channel can be increased, and thus the pen sensing sensitivity can be improved.

[0212] According to one or more embodiments of this disclosure, the second sensing unit SU2 may completely surround the first sensing unit SU1. Therefore, the first sensing unit SU1 may not contact the boundary BD and may be spaced apart from the boundary BD (e.g., spaced apart), with the second sensing unit SU2 positioned between them. This further improves pen sensing sensitivity relative to the upper outer region, lower outer region, left outer region, and right outer region of the sensing area 200A.

[0213] Figure 10B This is a plan view showing a sensing region 200Aa according to one or more embodiments of the present disclosure. In the description... Figure 10B Time, and reference Figure 10A Components that are identical to those described will be given the same reference numerals, and the descriptions thereon will be omitted.

[0214] refer to Figure 7 and Figure 10B The sensing area 200Aa may include multiple sensing units SU1 and SU2. The sensing units SU1 and SU2 may include a first sensing unit SU1 and a second sensing unit SU2.

[0215] Some of the second sensing units SU2 may be arranged along the second direction DR2, and other second sensing units SU2 may be arranged along the second direction DR2. Some of the second sensing units SU2 and other second sensing units SU2 may be spaced apart from each other in the first direction DR1 (e.g., spaced apart), and the first sensing unit SU1 is located between them.

[0216] The portion of the boundary BD extending in the second direction DR2 can contact the second sensing unit SU2, and the portion of the boundary BD extending in the first direction DR1 can contact the first sensing unit SU1.

[0217] The resistance or shape of the electrodes disposed in the second sensing unit SU2 can be designed such that the current path of the second sensing unit SU2 is closer to the peripheral region 200NA than the center of the second sensing unit SU2. Therefore, the pen sensing sensitivity for the left and right outer regions relative to the sensing region 200Aa can be further improved.

[0218] Figure 10C This is a plan view showing the sensing area 200Ab according to one or more embodiments of the present disclosure. In the description... Figure 10C Time, and reference Figure 10A Components that are identical to those described will be given the same reference numerals, and the descriptions thereon will be omitted.

[0219] refer to Figure 7 and Figure 10C The sensing area 200Ab may include multiple sensing units SU1 and SU2. The sensing units SU1 and SU2 may include a first sensing unit SU1 and a second sensing unit SU2.

[0220] Some of the second sensing units SU2 may be arranged along the first direction DR1, and other second sensing units SU2 may be arranged along the first direction DR1. Some of the second sensing units SU2 and other second sensing units SU2 may be spaced apart from each other in the second direction DR2 (e.g., spaced apart), and the first sensing unit SU1 is located between them.

[0221] The portion of the boundary BD extending in the first direction DR1 can contact the second sensing unit SU2, and the portion of the boundary BD extending in the second direction DR2 can contact the first sensing unit SU1.

[0222] The resistance or shape of the electrodes disposed in the second sensing unit SU2 can be designed such that the current path of the second sensing unit SU2 is closer to the peripheral region 200NA than the center of the second sensing unit SU2. Therefore, the pen sensing sensitivity for the upper and lower outer regions relative to the sensing region 200Ab can be further improved.

[0223] Figure 11A This is a plan view showing the first conductive layer SU1-L1 of a first sensing unit SU1 (e.g., a reference sensing unit SU-C) according to one or more embodiments of the present disclosure. Figure 11BThis is a plan view showing the second conductive layer SU1-L2 of a reference sensing unit SU-C according to one or more embodiments of the present disclosure.

[0224] refer to Figure 11A and Figure 11B The first conductive layer SU1-L1 of the first sensing unit SU1 (e.g., reference sensing unit SU-C) may be included in... Figure 6A The first conductive layer 202 shown is included, and the second conductive layer SU1-L2 may be included in... Figure 6A In the second conductive layer 204 shown. Figure 11A and Figure 11B The shapes of the first conductive layer SU1-L1 and the second conductive layer SU1-L2 shown are merely examples, and this disclosure is not limited thereto. The shape of the reference sensing unit SU-C can be modified in various ways.

[0225] exist Figure 11A and Figure 11B The shape of the mesh structure is not shown, and the boundaries between components are simply indicated by lines. That is to say, it can be understood that... Figure 11A and Figure 11B The lines shown correspond to lines from which the mesh structure has been removed, and are spaced apart from each other (e.g., spaced apart), with the two components between the lines being electrically insulated from each other. Furthermore, in Figure 11A and Figure 11B Dummy patterns can be placed in areas where no shaded lines are drawn. Dummy patterns can be electrically floating or electrically grounded, and can have a grid structure.

[0226] refer to Figure 7 , Figure 11A and Figure 11B The first electrode 210 may include a first-first electrode 210-1 overlapping with the reference sensing unit SU-C, and the second electrode 220 may include a second-first electrode 220-1 overlapping with the reference sensing unit SU-C. Furthermore, the third electrode 230 may include a third-first electrode 230-1 overlapping with the reference sensing unit SU-C, and the fourth electrode 240 may include a fourth-first electrode 240-1 overlapping with the reference sensing unit SU-C.

[0227] exist Figure 11A and Figure 11BThe diagram shows the portions of the first-first electrode 210-1, the second-first electrode 220-1, the third-first electrode 230-1, and the fourth-first electrode 240-1 that overlap with the reference sensing unit SU-C. These portions may have a symmetrical structure with respect to a first virtual line IML1 extending in the first direction DR1 and a second virtual line IML2 extending in the second direction DR2. For example, the first virtual line IML1 and the second virtual line IML2 may intersect each other at the center of the reference sensing unit SU-C in the first direction DR1 and the second direction DR2.

[0228] In one or more embodiments of this disclosure, the first electrode 210-1 may include a plurality of first sub-electrodes 210dp arranged along a first direction DR1 and having substantially the same shape. The first sub-electrodes 210dp may have the same shape as each other. Figure 11B An example of a first electrode 210-1 including three first sub-electrodes 210dp is shown. The three first sub-electrodes 210dp can be connected to a first trace 210t (reference). Figure 7 ).

[0229] The second-first electrode 220-1 may include a plurality of first patterns 221 and a plurality of first bridging patterns 222 electrically connected to the first patterns 221. The first patterns 221 that are spaced apart from each other in the first direction DR1 may be electrically connected by the first bridging patterns 222. The first patterns 221 may be included in the second conductive layers SU1-L2, and the first bridging patterns 222 may be included in the first conductive layers SU1-L1.

[0230] In the second-first electrode 220-1, two adjacent first patterns 221 along the first direction DR1 can be electrically connected to each other via three first bridging patterns 222. An increase in the number of first bridging patterns 222 arranged along a second direction DR2 intersecting the first direction DR1, which is the extension direction of the second-first electrode 220-1, corresponds to an increase in the number of signal paths. Therefore, as the number of signal paths increases, the resistance of the second-first electrode 220-1 can decrease. Thus, the sensing sensitivity of the sensor layer 200 can be improved.

[0231] The third-first electrode 230-1 may include a plurality of first sub-auxiliary electrodes 230dp spaced apart from each other in the first direction DR1 (e.g., spaced apart). Each of the first sub-auxiliary electrodes 230dp may extend in the second direction DR2. The first sub-auxiliary electrodes 230dp may be spaced apart from each other in the first direction DR1 (e.g., spaced apart). When viewed in the third direction DR3, the first sub-auxiliary electrodes 230dp may at least partially overlap with the first sub-electrode 210dp.

[0232] Each of the first sub-auxiliary electrodes 230dp may include a plurality of second patterns 231 and a plurality of second bridging patterns 232 electrically connected to the second patterns 231. The second patterns 231 and the second bridging patterns 232 may be defined by a first insulating layer 203 (see reference). Figure 6A The contact holes in the ) are electrically connected to each other.

[0233] The fourth-first electrode 240-1 may include a plurality of second sub-auxiliary electrodes 240dp spaced apart from each other in the second direction DR2 (e.g., spaced apart). Each of the second sub-auxiliary electrodes 240dp may extend in the first direction DR1. The second sub-auxiliary electrodes 240dp may be spaced apart from each other in the second direction DR2 (e.g., spaced apart). When viewed in the third direction DR3, the second sub-auxiliary electrodes 240dp may at least partially overlap with a plurality of first patterns 221 of the second-first electrode 220-1.

[0234] In one or more embodiments of this disclosure, a first capacitor may be defined between a first electrode 210-1 and a third electrode 230-1, and a second capacitor may be defined between a second electrode 220-1 and a fourth electrode 240-1. The first capacitance of the first capacitor and the second capacitance of the second capacitor may be adjusted by the overlapping area between the first electrode 210-1 and the third electrode 230-1 and the overlapping area between the second electrode 220-1 and the fourth electrode 240-1.

[0235] As the first and second capacitors increase, the amount of induced current transmitted from the third-first electrode 230-1 to the first-first electrode 210-1 can increase, and the amount of induced current transmitted from the fourth-first electrode 240-1 to the second-first electrode 220-1 can also increase. Therefore, increasing the first and second capacitors improves the pen sensing performance of the sensor layer 200. Furthermore, when a touch is sensed, the first and second capacitors can act as a load. Therefore, decreasing the first and second capacitors improves touch sensing performance.

[0236] In one or more embodiments of this disclosure, the overlap area between the first-first electrode 210-1 and the third-first electrode 230-1, as well as the overlap area between the second-first electrode 220-1 and the fourth-first electrode 240-1, can be adjusted. Therefore, considering touch sensitivity and pen sensing sensitivity, a sensor layer 200 with an appropriate level of capacitance can be provided. Thus, an electronic device 1000 with improved pen sensing sensitivity and touch sensitivity (see reference) can be provided. Figure 1A ).

[0237] In one or more embodiments of this disclosure, in a second conductive layer SU1-L2 of a sensing unit SU, the area occupied by components included in the first-first electrode 210-1 and the second-first electrode 220-1 can be larger than the area occupied by components included in the third-first electrode 230-1 and the fourth-first electrode 240-1. First input 2000 (reference) Figure 5 The change in capacitance can increase as the distance decreases. Therefore, the capacitance used to sense the first input 2000 (reference) Figure 5 The components can be used with electronic device 1000 (reference). Figure 1A The surface of the device is arranged in relatively large areas in adjacent layers. Therefore, touch performance can be improved.

[0238] Figure 12A This is a plan view showing the first conductive layer SU2-L1 of the second sensing unit SU2 (e.g., the first external sensing unit SU-EL) according to an embodiment of the present disclosure. Figure 12B This is a plan view showing the second conductive layer SU2-L2 of the first external sensing unit SU-EL according to one or more embodiments of the present disclosure.

[0239] refer to Figure 7 , Figure 12A and Figure 12B The first external sensing unit SU-EL can be positioned to the right of the boundary BD, and can correspond to the above reference. Figure 10A The first external sensing unit SU-EL is described.

[0240] The first electrode 210 may include a first-second electrode 210-2 overlapping with the first external sensing unit SU-EL, and the second electrode 220 may include a second-second electrode 220-2 overlapping with the first external sensing unit SU-EL. Furthermore, the third electrode 230 may include a third-second electrode 230-2 overlapping with the first external sensing unit SU-EL, and the fourth electrode 240 may include a fourth-second electrode 240-2 overlapping with the first external sensing unit SU-EL. The shape of the first-second electrode 210-2 may be the same as that of the first-first electrode 210-1 (see reference). Figure 11BThe shape of the third-second electrode 230-2 may differ from that of the third-first electrode 230-1 (see [reference]). Figure 11A (They) have different shapes.

[0241] exist Figure 12A and Figure 12B The diagram shows portions of the first-second electrode 210-2, the second-second electrode 220-2, the third-second electrode 230-2, and the fourth-second electrode 240-2. These portions may have an asymmetrical structure relative to one of the first virtual line IML1 extending in the first direction DR1 and the second virtual line IML2 extending in the second direction DR2. For example, Figure 12A and Figure 12B An example is shown where portions of the first-second electrode 210-2, the second-second electrode 220-2, the third-second electrode 230-2, and the fourth-second electrode 240-2 have an asymmetric structure relative to the second virtual line IML2.

[0242] The first-second electrode 210-2 may include a plurality of second sub-electrodes 210dpt1, 210dpt2, and 210dpt3 arranged along a first direction DR1. The second sub-electrodes 210dpt1, 210dpt2, and 210dpt3 may be connected to a first trace 210t (reference). Figure 7 ).

[0243] According to one or more embodiments of this disclosure, the resistance of one of the second sub-electrodes 210dpt1, 210dpt2, and 210dpt3, 210dpt1, can be lower than the resistance of the other second sub-electrode 210dpt3. One second sub-electrode 210dpt1 can be closer to the peripheral region 200NA than the other second sub-electrode 210dpt3. The current path of the channel overlapping with the first external sensing unit SU-EL (e.g., the first-second electrode 210-2) can be adjusted so that it is closer to the peripheral region 200NA than the center of the channel. Therefore, during differential sensing, the difference between signals (e.g., the difference in intensity between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0244] The second sub-electrodes 210dpt1, 210dpt2, and 210dpt3 can be referred to as the second-first sub-electrode 210dpt1, the second-second sub-electrode 210dpt2, and the second-third sub-electrode 210dpt3. The resistance ratio between the second-first sub-electrode 210dpt1, the second-second sub-electrode 210dpt2, and the second-third sub-electrode 210dpt3 can be 0.5:2:2, but is not particularly limited thereto. The resistance ratio can be adjusted in various ways, as long as the resistance of the second-first sub-electrode 210dpt1 adjacent to the peripheral region 200NA is lower.

[0245] Various designs can be applied to make the resistance of the second sub-electrodes 210dpt1, 210dpt2, and 210dpt3 non-uniform. For example, the area of ​​the second-first sub-electrode 210dpt1 can be larger than the area of ​​the second-second sub-electrode 210dpt2 and the area of ​​the second-third sub-electrode 210dpt3. Figure 12B In this process, each of the second sub-electrode 210dpt2 and the second sub-electrode 210dpt3 may be provided with a cutting pattern such that the second sub-electrode 210dpt2 and the second sub-electrode 210dpt3 have a higher resistance than the second sub-electrode 210dpt1.

[0246] Furthermore, according to one or more embodiments of this disclosure, the first-second electrode 210-2 may further include an additional electrode 210ad electrically connected to the second-first sub-electrode 210dpt1. The additional electrode 210ad may be disposed below the second-first sub-electrode 210dpt1 and may be electrically connected to the second-first sub-electrode 210dpt1. Therefore, the resistance of the second-first sub-electrode 210dpt1 can be further reduced. The second-first sub-electrode 210dpt1 may be referred to as a first layer electrode disposed on the same layer (e.g., at a location) as the first-first electrode 210-1, and the additional electrode 210ad may be referred to as a second layer electrode disposed below the first layer electrode. In one or more embodiments of this disclosure, the additional electrode 210ad may be omitted.

[0247] The second electrode 220-2 may include a plurality of first patterns 221 and a plurality of first bridging patterns 222 electrically connected to the first patterns 221. The first patterns 221 that are spaced apart from each other in the first direction DR1 may be electrically connected by the first bridging patterns 222. The first patterns 221 may be included in the second conductive layer SU2-L2, and the first bridging patterns 222 may be included in the first conductive layer SU2-L1.

[0248] The third-second electrode 230-2 may include a plurality of third sub-electrodes 230dpt1, 230dpt2 and 230dpt3 spaced apart from each other in the first direction DR1. The third sub-electrodes 230dpt1, 230dpt2 and 230dpt3 may be referred to as the first sub-auxiliary electrode.

[0249] The third sub-electrodes 230dpt1, 230dpt2, and 230dpt3 may include a third-first sub-electrode 230dpt1 overlapping with the second-first sub-electrode 210dpt1, a third-second sub-electrode 230dpt2 overlapping with the second-second sub-electrode 210dpt2, and a third-third sub-electrode 230dpt3 overlapping with the second-third sub-electrode 210dpt3. The resistance of the third-first sub-electrode 230dpt1 may be lower than the resistance of the third-second sub-electrode 230dpt2 and the resistance of the third-third sub-electrode 230dpt3.

[0250] The third-first sub-electrode 230dpt1 may include a plurality of second-first patterns 231t1 and a plurality of second-first bridging patterns 232t1 electrically connected to the second-first patterns 231t1. Each of the third-second sub-electrode 230dpt2 and the third-third sub-electrode 230dpt3 may include a plurality of second-second patterns 231t2 and a plurality of second-second bridging patterns 232t2 electrically connected to the second-second patterns 231t2.

[0251] According to one or more embodiments of this disclosure, various designs can be applied to make the resistance of the third sub-electrodes 230dpt1, 230dpt2, and 230dpt3 non-uniform. For example, the area of ​​each of the second-first pattern 231t1 can be larger than the area of ​​the second-second pattern 231t2. Figure 12A In this process, each of the second-second pattern 231t2 can be provided with a cutting pattern such that the second-second pattern 231t2 has a higher resistance than the second-first pattern 231t1.

[0252] Furthermore, according to one or more embodiments of this disclosure, the third-second electrode 230-2 may further include an additional auxiliary electrode 230ad electrically connected to the second-first pattern 231t1. The additional auxiliary electrode 230ad may be disposed above the second-first pattern 231t1 and may be electrically connected to the second-first pattern 231t1. Therefore, the resistance of the second-first pattern 231t1 can be further reduced. In one or more embodiments of this disclosure, the additional auxiliary electrode 230ad may be omitted.

[0253] The fourth-second electrode 240-2 may include a plurality of second sub-auxiliary electrodes 240dp spaced apart from each other in the second direction DR2 (e.g., spaced apart). When viewed in the third direction DR3, the second sub-auxiliary electrodes 240dp may at least partially overlap with a plurality of first patterns 221 of the second-second electrode 220-2.

[0254] The boundary BD, which contacts the first external sensing unit SU-EL, can extend parallel to the second virtual line IML2. Therefore, the first external sensing unit SU-EL can include a first sub-region SUS1 between the second virtual line IML2 and the boundary BD, and a second sub-region SUS2 separated from (e.g., spaced apart from) the boundary BD, with the first sub-region SUS1 located between them. In this case, because the area of ​​the conductive pattern disposed in the first sub-region SUS1 is larger than the area of ​​the conductive pattern disposed in the second sub-region SUS2, the resistance of the first sub-region SUS1 can be lower than the resistance of the second sub-region SUS2.

[0255] Furthermore, the area occupied by the conductive pattern transmitting an appropriate signal (e.g., a predetermined signal) in the first sub-region SUS1 can be larger than the area occupied by the conductive pattern transmitting an appropriate signal (e.g., a predetermined signal) in the second sub-region SUS2. For example, in Figure 12B In this process, the conductive pattern constituting the first-second electrode 210-2 can be set at a higher density in the first sub-region SUS1 than in the second sub-region SUS2.

[0256] Figure 13A This illustrates a second sensing unit SU2 (reference) according to one or more embodiments of the present disclosure. Figure 10A The second conductive layer 204 (reference) Figure 6A An enlarged plan view of a portion of the image. Figure 13B This illustrates a second sensing unit SU2 (reference) according to one or more embodiments of the present disclosure. Figure 10A The second conductive layer 204 (reference) Figure 6A An enlarged plan view of a portion of ( ). For example, Figure 13A It can be with Figure 12B The enlarged plan view of the region corresponding to region AA' shown in the figure, and Figure 13B It can be with Figure 12B The enlarged plan view of the area corresponding to region BB' shown in the figure.

[0257] refer to Figure 13A and Figure 13B This can be achieved by adjusting the second sensing unit SU2 (reference). Figure 10A The resistance is adjusted by the line width of the grid lines in the diagram.

[0258] According to one or more embodiments of this disclosure, the second-first sub-electrode 210dpt1a may include a plurality of first grid lines ML1 having a first linewidth LWT1, and the second-third sub-electrode 210dpt3a may include a plurality of second grid lines ML2 having a second linewidth LWT2 smaller than the first linewidth LWT1. Furthermore, the second-first bridging pattern 232t1a may include a plurality of third grid lines ML3 having a first linewidth LWT1, and the second-second bridging pattern 232t2a may include a plurality of fourth grid lines ML4 having a second linewidth LWT2 smaller than the first linewidth LWT1.

[0259] The resistance of the second-first sub-electrode 210dpt1a can be lower than the resistance of the second-third sub-electrode 210dpt3a. Furthermore, the resistance of each of the second-first bridging patterns 232t1a can be lower than the resistance of each of the second-second bridging patterns 232t2a. The current path of the channel overlapping with the second sensing unit SU2 (e.g., the first-second electrode 210-2) can be adjusted to be closer to the peripheral region 200NA than the center of the channel. Therefore, during differential sensing, the difference between signals (e.g., the difference in intensity between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0260] Figure 14A This illustrates a second sensing unit SU2 (reference) according to one or more embodiments of the present disclosure. Figure 10A The second conductive layer 204 (reference) Figure 6A An enlarged plan view of a portion of the image. Figure 14B This illustrates a second sensing unit SU2 (reference) according to one or more embodiments of the present disclosure. Figure 10A The second conductive layer 204 (reference) Figure 6A An enlarged plan view of a portion of ( ). For example, Figure 14A It can be with Figure 12B The enlarged plan view of the region corresponding to region CC' shown in the figure, and Figure 14B It can be with Figure 12B The enlarged plan view of the region corresponding to region DD' shown in the figure.

[0261] refer to Figure 14A and Figure 14BThe resistance of each of the second-first bridging patterns 232t1b can be lower than the resistance of each of the second-second bridging patterns 232t2b. For example, the width BWT1 of the second-first bridging pattern 232t1b in the first direction DR1 can be greater than the width BWT2 of the second-second bridging pattern 232t2b in the first direction DR1. The number of grid lines included in the second-first bridging pattern 232t1b can be greater than the number of grid lines included in the second-second bridging pattern 232t2b.

[0262] According to one or more embodiments of this disclosure, the second-first bridging pattern 232t1b can be connected to the second-first pattern 231t1 (see reference) via four first contact portions CNT_T1. Figure 12A Electrical connection, and the second-second bridging pattern 232t2b can be connected to the second-second pattern 231t2 (reference) via two second contacts CNT_T2. Figure 12A Electrical connection. The number of first contacts CNT_T1 is not particularly limited to the number mentioned above, as long as the number of first contacts CNT_T1 is greater than the number of second contacts CNT_T2. As the number of contacts increases, the resistance can be further reduced.

[0263] According to one or more embodiments of this disclosure, reference is made to Figure 13A and Figure 13B The structure and references described Figure 14A and Figure 14B One or both of the structures described can be applied to the reference. Figure 12A and Figure 12B The second sensing unit SU2 is described. Furthermore, refer to... Figure 13A and Figure 13B The structure described and references Figure 14A and Figure 14B The described structure can be disregarded in references. Figure 12A and Figure 12B The second sensing unit SU2 is described.

[0264] Figure 15A This is a plan view showing the first conductive layer SU2a-L1 of a second sensing unit SU2 (e.g., a first external sensing unit SU-ELa) according to one or more embodiments of the present disclosure. Figure 15B This is a plan view showing the second conductive layer SU2a-L2 of the first external sensing unit SU-ELa according to one or more embodiments of the present disclosure. Figure 16 This illustrates the second conductive layer 204 (see reference) of three sensing units SU-ELa, SU1, and SU1 according to one or more embodiments of the present disclosure. Figure 6A (A floor plan of ).

[0265] refer to Figure 7 , Figure 15A and Figure 15B The first external sensing unit SU-ELa can be positioned to the right of the boundary BD, and can correspond to the above reference. Figure 10A The first external sensing unit SU-EL is described.

[0266] When with Figure 11A and Figure 11B Compared to the reference sensing unit SU-C shown, Figure 15A and Figure 15B The first external sensing unit SU-ELa shown may have a shape similar to that in which the portion adjacent to the boundary BD is cut off or omitted.

[0267] When with Figure 11A Compared to the first conductive layer SU1-L1 shown, the first conductive layer SU2a-L1 of the first external sensing unit SU-ELa can have a shape in which a portion of it is cut off. When compared with Figure 11B Compared to the second conductive layer SU1-L2 shown, the second conductive layer SU2a-L2 of the first external sensing unit SU-ELa can have a shape in which a portion of it is cut off. Figure 15A and Figure 15B In the middle, when with Figure 11A and Figure 11B When comparing the patterns shown, the omitted parts of the pattern are indicated by dashed lines.

[0268] According to one or more embodiments of this disclosure, because the portion of the pattern adjacent to the boundary BD is omitted, the current path of the channel included in the first outer sensing unit SU-ELa can be further moved toward the boundary BD. Therefore, during differential sensing, the differences between signals (e.g., the differences in intensity between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0269] refer to Figure 16 The diagram illustrates a first external sensing unit SU-ELa and two first sensing units SU1 arranged sequentially in a direction away from the boundary BD. The first external sensing unit SU-ELa may contact a portion of the boundary BD extending in the second direction DR2, and the two first sensing units SU1 may be spaced apart from the boundary BD in the first direction DR1 (e.g., spaced apart). According to one or more embodiments of this disclosure, the width SUWT2 of the first external sensing unit SU-ELa in the first direction DR1 can be adjusted. For example, as shown in reference... Figure 15A and Figure 15BAs described, a portion of the first external sensing unit SU-ELa can be removed. Therefore, the width SUWT1 of the first sensing unit SU1 in the first direction DR1 can be greater than the width SUWT2 of the first external sensing unit SU-ELa in the first direction DR1.

[0270] Furthermore, the distance DT between the center 210-2ct of the first-second electrode 210-2a overlapping with the first external sensing unit SU-ELa and the boundary BD can be less than half the spacing PC between the remaining first electrodes 210. Therefore, compared to when a portion of the pattern of the first external sensing unit SU-ELa is not removed, the current path of the first-second electrode 210-2a can be further moved towards the boundary BD. Thus, during differential sensing, the differences between signals (e.g., differences in the intensity of induced currents) can be further increased, and therefore the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0271] According to one or more embodiments of this disclosure, even when the first external sensing unit SU-ELa and the reference sensing unit SU-C (reference... Figure 11B Compared to the first electrode 210, which has a portion of its shape cut off, the first electrode 210 (reference) has a shape that has a portion of its shape cut off. Figure 7 ) and the third electrode 230 (reference) Figure 7 The first coupling capacitor between the first electrode 220 and the second electrode 220 (reference) Figure 7 ) and fourth electrode 240 (reference) Figure 7 The second coupling capacitance between the reference sensing unit SU-C and the reference sensing unit SU-E1 can also be adjusted so as not to decrease. For example, the decrease in coupling capacitance due to the omitted pattern can be compensated by increasing the area of ​​the first electrode 210 or the third electrode 230 included in the first external sensing unit SU-E1a, or by increasing the area of ​​the second electrode 220 or the fourth electrode 240 included in the first external sensing unit SU-E1a.

[0272] Figure 17A This is a plan view showing the first conductive layer SU2b-L1 of a second sensing unit SU2 (e.g., a first external sensing unit SU-ELb) according to one or more embodiments of the present disclosure. Figure 17B This is a plan view showing the second conductive layer SU2b-L2 of the first external sensing unit SU-ELb according to one or more embodiments of the present disclosure.

[0273] refer to Figure 17A and Figure 17B The first external sensing unit SU-ELb can be positioned to the right of the boundary BD, and can correspond to the above reference. Figure 10A The first external sensing unit SU-EL is described.

[0274] When with Figure 12A and Figure 12B Compared to the first external sensing unit SU-EL shown, Figure 17A and Figure 17B The first external sensing unit SU-ELb shown may have a shape in which the portion adjacent to the boundary BD is cut off or omitted.

[0275] When with Figure 12A Compared to the first conductive layer SU2-L1 shown, the first conductive layer SU2b-L1 of the first external sensing unit SU-ELb can have a shape in which a portion of it is cut off. When compared with Figure 12B Compared to the second conductive layer SU2-L2 shown, the second conductive layer SU2b-L2 of the first external sensing unit SU-ELb can have a shape in which a portion of it is cut off. Figure 17A and Figure 17B In the middle, when with Figure 12A and Figure 12B When comparing the patterns shown, the omitted parts of the pattern are indicated by dashed lines.

[0276] According to one or more embodiments of this disclosure, the resistance of one of the second sub-electrodes 210dpt1, 210dpt2, and 210dpt3, 210dpt1, can be lower than the resistance of the other second sub-electrode 210dpt3. One second sub-electrode 210dpt1 can be closer to the peripheral region 200NA than the other second sub-electrode 210dpt3. The current path of the channel (e.g., the first-second electrode 210-2) overlapping with the first external sensing unit SU-ELb can be adjusted so that it is closer to the peripheral region 200NA than the center of the channel. Because the portion of the pattern adjacent to the boundary BD is omitted, the current path of the channel included in the first external sensing unit SU-ELb can be further shifted towards the boundary BD. Therefore, during differential sensing, the difference between signals (e.g., the difference in intensity between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0277] Figure 18A This is a plan view showing the first conductive layer SU1a-L1 of a first sensing unit SU1 (e.g., a reference sensing unit SU-Ca) according to one or more embodiments of the present disclosure. Figure 18B This is a plan view showing the second conductive layer SU1a-L2 of the reference sensing unit SU-Ca according to one or more embodiments of the present disclosure.

[0278] refer to Figure 7 , Figure 18A and Figure 18BThe first electrode 210 may include a first-first electrode 210-1a overlapping with the reference sensing unit SU-Ca, and the second electrode 220 may include a second-first electrode 220-1a overlapping with the reference sensing unit SU-Ca. Furthermore, the third electrode 230 may include a third-first electrode 230-1a overlapping with the reference sensing unit SU-Ca, and the fourth electrode 240 may include a fourth-first electrode 240-1a overlapping with the reference sensing unit SU-Ca.

[0279] exist Figure 18A and Figure 18B The diagram shows the portions of the first-first electrode 210-1a, the second-first electrode 220-1a, the third-first electrode 230-1a, and the fourth-first electrode 240-1a that overlap with the reference sensing unit SU-Ca. These portions may have a symmetrical structure relative to a first virtual line IML1 extending in the first direction DR1 and a second virtual line IML2 extending in the second direction DR2.

[0280] The second-first electrode 220-1a may include a plurality of first patterns 221a and a first bridging pattern 222a electrically connected to the first patterns 221a. The third-first electrode 230-1a may include a plurality of second patterns 231a and a second bridging pattern 232a electrically connected to the second patterns 231a.

[0281] The fourth-first electrode 240-1a, the first bridging pattern 222a, and the second pattern 231a can be disposed on the same layer (e.g., at a location). For example, the fourth-first electrode 240-1a, the first bridging pattern 222a, and the second pattern 231a can be included in... Figure 6A In the first conductive layer 202 shown, the fourth-first electrode 240-1a may have an opening defined therein, and a first bridging pattern 222a may be configured to correspond to the opening. Second patterns 231a may be spaced apart from each other (e.g., spaced apart), with the fourth-first electrode 240-1a and the first bridging pattern 222a between them.

[0282] The first electrode 210-1a, the first pattern 221a, and the second bridging pattern 232a can be disposed on the same layer (e.g., at a location). For example, the first electrode 210-1a, the first pattern 221a, and the second bridging pattern 232a can be included in... Figure 6AIn the second conductive layer 204 shown, the first-first electrode 210-1a may have an opening defined therein, and the second bridging pattern 232a may be configured to correspond to the opening. The first patterns 221a may be spaced apart from each other (e.g., spaced apart), and the first-first electrode 210-1a and the second bridging pattern 232a are between them.

[0283] Figure 19A This is a plan view showing the first conductive layer SU2c-L1 of a second sensing unit SU2 (e.g., a first external sensing unit SU-ELc) according to one or more embodiments of the present disclosure. Figure 19B This is a plan view showing the second conductive layer SU2c-L2 of the first external sensing unit SU-ELc according to one or more embodiments of the present disclosure.

[0284] refer to Figure 19A and Figure 19B The first external sensing unit SU-ELc can be positioned to the right of the boundary BD, and can correspond to the above reference. Figure 10A The first external sensing unit SU-EL is described.

[0285] When with Figure 18A and Figure 18B Compared to the reference sensing unit SU-Ca shown, Figure 19A and Figure 19B The first external sensing unit SU-ELc shown may include a shape in which the portion adjacent to the boundary BD is cut off or omitted. Figure 19A and Figure 19B In the middle, when with Figure 18A and Figure 18B When comparing the patterns shown, the omitted parts of the pattern are indicated by dashed lines.

[0286] refer to Figure 7 , Figure 19A and Figure 19B The first electrode 210 may include a first-second electrode 210-2b overlapping with the first external sensing unit SU-ELc, and the second electrode 220 may include a second-second electrode 220-2a overlapping with the first external sensing unit SU-ELc. Furthermore, the third electrode 230 may include a third-second electrode 230-2a overlapping with the first external sensing unit SU-ELc, and the fourth electrode 240 may include a fourth-second electrode 240-2a overlapping with the first external sensing unit SU-ELc.

[0287] The second electrode 220-2a may include a plurality of first patterns 221b and a first bridging pattern 222b electrically connected to the first patterns 221b. The third electrode 230-2a may include a plurality of second patterns 231b and a second bridging pattern 232b electrically connected to the second patterns 231b.

[0288] The first conductive layer SU2c-L1 may include a second pattern 231b and a fourth-second electrode 240-2a. Furthermore, the first conductive layer SU2c-L1 may also include a first additional pattern 210ada. The first additional pattern 210ada may be disposed between the boundary BD and the fourth-second electrode 240-2a. The first additional pattern 210ada may be electrically connected to the first-second electrode 210-2b. Additionally, a first diced pattern RH1 may be provided to the second pattern 231b. When the first diced pattern RH1 is provided, the resistance of a portion of the second pattern 231b may be increased.

[0289] The second conductive layer SU2c-L2 may include a first-second electrode 210-2b, a first pattern 221b, and a second bridging pattern 232b. Furthermore, the second conductive layer SU2c-L2 may also include a second additional pattern 230ada. The second additional pattern 230ada may overlap with and be electrically connected to the second pattern 231b. Additionally, a second dicing pattern RH2 may be provided to the first-second electrode 210-2b. When the second dicing pattern RH2 is provided, the resistance of a portion of the first-second electrode 210-2b may be increased.

[0290] According to one or more embodiments of this disclosure, because the portion of the pattern adjacent to the boundary BD is omitted, the current path of the channel included in the first external sensing unit SU-ELc can be further moved towards the boundary BD. Furthermore, by additionally placing conductive patterns (e.g., the first additional pattern 210ada and the second additional pattern 230ada) in the region closer to the boundary BD and providing cut patterns (e.g., the first cut pattern RH1 and the second cut pattern RH2) for portions further away from the boundary BD, non-uniform resistance can be achieved in the first external sensing unit SU-ELc. In particular, by making the resistance of the region adjacent to the boundary BD lower, the current path of the channel included in the first external sensing unit SU-ELc can be further moved towards the boundary BD. Therefore, during differential sensing, the difference between signals (e.g., the difference in intensity between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0291] Figure 20AThis is a plan view showing the first conductive layer SU2d-L1 of a second sensing unit SU2 (e.g., a first external sensing unit SU-ELd) according to one or more embodiments of the present disclosure. Figure 20B This is a plan view showing the second conductive layer SU2d-L2 of the first external sensing unit SU-ELd according to one or more embodiments of the present disclosure.

[0292] refer to Figure 20A and Figure 20B The first external sensing unit SU-ELd can be positioned to the right of the boundary BD, and can correspond to the above reference. Figure 10A The first external sensing unit SU-EL is described.

[0293] refer to Figure 7 , Figure 20A and Figure 20B The first electrode 210 may include a first-second electrode 210-2c overlapping with the first external sensing unit SU-ELd, and the second electrode 220 may include a second-second electrode 220-2b overlapping with the first external sensing unit SU-ELd. Furthermore, the third electrode 230 may include a third-second electrode 230-2b overlapping with the first external sensing unit SU-ELd, and the fourth electrode 240 may include a fourth-second electrode 240-2b overlapping with the first external sensing unit SU-ELd.

[0294] The second electrode 220-2b may include a plurality of first patterns 221c and a first bridging pattern 222c electrically connected to the first patterns 221c. The third electrode 230-2b may include a plurality of second patterns 231c and a second bridging pattern 232c electrically connected to the second patterns 231c.

[0295] In the first external sensing unit SU-ELd, the intersection region CRA where the first-second electrode 210-2c and the second-second electrode 220-2b overlap can be closer to the peripheral region 200NA or the boundary BD than the center SU-ct of the first external sensing unit SU-ELd. The intersection region CRA can overlap with the region where the first bridging pattern 222c and the second bridging pattern 232c are set.

[0296] According to one or more embodiments of this disclosure, the position of the cross region CRA can be adjusted so that the current path is closer to the boundary BD. Therefore, during differential sensing, the differences between signals (e.g., the differences in strength between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0297] Figure 21AThis is a plan view showing the first conductive layer SU2e-L1 of a second sensing unit SU2 (e.g., a second external sensing unit SU-EU) according to one or more embodiments of the present disclosure. Figure 21B This is a plan view showing the second conductive layer SU2e-L2 of the second external sensing unit SU-EU according to one or more embodiments of the present disclosure.

[0298] refer to Figure 21A and Figure 21B The second external sensing unit SU-EU can be positioned below the boundary BD and can correspond to the above reference. Figure 10A The second external sensing unit SU-EU is described.

[0299] refer to Figure 7 , Figure 21A and Figure 21B The first electrode 210 may include a first-second electrode 210-2d overlapping with the second external sensing unit SU-EU, and the second electrode 220 may include a second-second electrode 220-2c overlapping with the second external sensing unit SU-EU. Furthermore, the third electrode 230 may include a third-second electrode 230-2c overlapping with the second external sensing unit SU-EU, and the fourth electrode 240 may include a fourth-second electrode 240-2c overlapping with the second external sensing unit SU-EU.

[0300] exist Figure 21A and Figure 21B The diagram shows portions of the first-second electrode 210-2d, the second-second electrode 220-2c, the third-second electrode 230-2c, and the fourth-second electrode 240-2c. These portions may have an asymmetrical structure relative to one of the first virtual line IML1 extending in the first direction DR1 and the second virtual line IML2 extending in the second direction DR2. For example, Figure 21A and Figure 21B An example is shown where portions of the first-second electrode 210-2d, the second-second electrode 220-2c, the third-second electrode 230-2c, and the fourth-second electrode 240-2c have an asymmetric structure relative to the first virtual line IML1.

[0301] The first-second electrode 210-2d may include a first sub-electrode 210dp arranged along the first direction DR1. The first sub-electrode 210dp may have the same shape. The third-second electrode 230-2c may include a first sub-auxiliary electrode 230dp arranged along the first direction DR1. The first sub-auxiliary electrode 230dp may have the same shape.

[0302] The second-second electrode 220-2c may include a first pattern portion 221-p1, a second pattern portion 221-p2, and a third pattern portion 221-p3, as well as a first bridging pattern 222. The fourth-second electrode 240-2c may include third sub-electrodes 240dp1, 240dp2, and 240dp3 arranged along the second direction DR2. The third sub-electrodes 240dp1, 240dp2, and 240dp3 may include a third-first sub-electrode 240dp1, a third-second sub-electrode 240dp2, and a third-third sub-electrode 240dp3 arranged in a direction away from the boundary BD. The first pattern portion 221-p1 may overlap with the third-first sub-electrode 240dp1, the second pattern portion 221-p2 may overlap with the third-second sub-electrode 240dp2, and the third pattern portion 221-p3 may overlap with the third-third sub-electrode 240dp3.

[0303] According to one or more embodiments of this disclosure, a cutting pattern can be provided to make the resistance ratio between the second-second electrode 220-2c and the fourth-second electrode 240-2c in the second external sensing unit SU-EU non-uniform. For example, a cutting pattern can be provided for the third-second sub-electrode 240dp2, the third-third sub-electrode 240dp3, the second pattern portion 221-p2, and the third pattern portion 221-p3. The resistance ratio between the third-first sub-electrode 240dp1, the third-second sub-electrode 240dp2, and the third-third sub-electrode 240dp3 can be 0.5:2:2, but is not particularly limited thereto. The resistance ratio can be adjusted in various ways, as long as the resistance of the third-first sub-electrode 240dp1 adjacent to the peripheral region 200NA is lower.

[0304] According to one or more embodiments of this disclosure, the first conductive layer SU2e-L1 may further include a first additional electrode 220ad that overlaps with and is electrically connected to the first patterned portion 221-p1. Furthermore, the second conductive layer SU2e-L2 may further include a second additional electrode 240ad that overlaps with and is electrically connected to the third-first sub-electrode 240dp1.

[0305] According to one or more embodiments of this disclosure, the current path of the channel (e.g., the second-second electrode 220-2c) overlapping with the second external sensing unit SU-EU can be adjusted so that it is closer to the peripheral region 200NA than the channel center. Therefore, during differential sensing, the difference between signals (e.g., the difference in intensity between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0306] Figure 22A This is a plan view showing the first conductive layer SU2f-L1 of a second sensing unit SU2 (e.g., a second external sensing unit SU-EUa) according to one or more embodiments of the present disclosure. Figure 22B This is a plan view showing the second conductive layer SU2f-L2 of the second external sensing unit SU-EUa according to one or more embodiments of the present disclosure.

[0307] refer to Figure 22A and Figure 22B When with Figure 21A and Figure 21B Compared to the second external sensing unit SU-EU shown, the second external sensing unit SU-EUa may have a shape in which the portion adjacent to the boundary BD is cut off or omitted.

[0308] When with Figure 21A Compared to the first conductive layer SU2e-L1 shown, the first conductive layer SU2f-L1 of the first external sensing unit SU-ELa can have a shape in which a portion of it is cut off. When compared with Figure 21B Compared to the second conductive layer SU2e-L2 shown, the second conductive layer SU2f-L2 of the first external sensing unit SU-ELa can have a shape in which a portion of it is cut off. Figure 22A and Figure 22B In, with Figure 21A and Figure 21B Compared to the pattern shown, the omitted parts of the pattern are indicated by dashed lines.

[0309] Because the portion of the pattern adjacent to the boundary BD is omitted, the current path of the channel included in the second outer sensing unit SU-EUa can be further moved toward the boundary BD. Therefore, during differential sensing, the difference between signals (e.g., the difference in intensity between induced currents) can be further increased, and thus the sensitivity in the channel adjacent to the peripheral region 200NA can be further improved.

[0310] Figure 23 This is a plan view showing some of the components included in a second sensing unit SU2 (e.g., a first external sensing unit SU-ELe) according to one or more embodiments of the present disclosure.

[0311] refer to Figure 7 and Figure 23 The first external sensing unit SU-ELe can be positioned to the right of the boundary BD, and can correspond to the above reference. Figure 10A The first external sensing unit SU-EL is described.

[0312] The first electrode 210 may include a first-second electrode 210-2e that overlaps with the first external sensing unit SU-ELe, and the third electrode 230 may include a third-second electrode 230-2d that overlaps with the first external sensing unit SU-ELe.

[0313] The first-second electrode 210-2e may include first sub-electrodes 210s1, 210s2, and 210s3 arranged along the first direction DR1, and the third electrode 230 may include second sub-electrodes 230s1, 230s2, and 230s3 arranged along the first direction DR1. The first sub-electrodes 210s1, 210s2, and 210s3 may include a first-first sub-electrode 210s1, a first-second sub-electrode 210s2, and a first-third sub-electrode 210s3 arranged in a direction away from the boundary BD. The second sub-electrodes 230s1, 230s2, and 230s3 may include a second-first sub-electrode 230s1, a second-second sub-electrode 230s2, and a second-third sub-electrode 230s3 arranged in a direction away from the boundary BD.

[0314] Induced current can be transmitted through a coupling capacitor generated between the first-second electrode 210-2e and the third-second electrode 230-2d. According to one or more embodiments of this disclosure, the current path can be adjusted by regulating the capacitance of the coupling capacitor. Because the amount of current transmitted is proportional to the size of the capacitance, the coupling capacitor closer to the boundary BD can be adjusted to be larger. For example, the first capacitance between the first-first sub-electrode 210s1 and the second-first sub-electrode 230s1 can be larger than the second capacitance between the first-third sub-electrode 210s3 and the second-third sub-electrode 230s3.

[0315] According to one or more embodiments of this disclosure, in order to provide a difference between the first capacitor and the second capacitor, the overlap area between the first-first sub-electrode 210s1 and the second-first sub-electrode 230s1, and the overlap area between the first-third sub-electrode 210s3 and the second-third sub-electrode 230s3, can be adjusted to be different from each other. For example, a first opening OPt1 can be defined in the first-first sub-electrode 210s1, a second opening OPt2 can be defined in the first-second sub-electrode 210s2, and a third opening OPt3 can be defined in the first-third sub-electrode 210s3. The size of the third opening OPt3 can be larger than the size of the first opening OPt1. Therefore, the overlap area between the first-first sub-electrode 210s1 and the second-first sub-electrode 230s1 can be larger than the overlap area between the first-third sub-electrode 210s3 and the second-third sub-electrode 230s3.

[0316] In one or more embodiments of this disclosure, the first-first sub-electrode 210s1 and the first-third sub-electrode 210s3 may be disposed on the same layer (e.g., at [location]). In this case, the capacitance can be increased by increasing the area of ​​the first-first sub-electrode 210s1 and the first-third sub-electrode 210s3 facing each other. For example, the boundary between the first-first sub-electrode 210s1 and the first-third sub-electrode 210s3 may be configured as a tortuous or non-uniform shape rather than a straight line to increase the capacitance.

[0317] Figure 24A This illustrates a first conductive layer 202 of a sensor layer according to one or more embodiments of the present disclosure (reference 202). Figure 6A A partial floor plan of ( ). Figure 24B This illustrates a second conductive layer 204 of a sensor layer according to one or more embodiments of the present disclosure (see reference). Figure 6A A partial floor plan of ( ). Figure 25A This illustrates a first conductive layer 202 of a sensor layer according to one or more embodiments of the present disclosure (reference 202). Figure 6A A partial floor plan of ( ). Figure 25B This illustrates a second conductive layer 204 of a sensor layer according to one or more embodiments of the present disclosure (see reference). Figure 6A A partial floor plan of ( ). Figure 26A This illustrates a first conductive layer 202 of a sensor layer according to one or more embodiments of the present disclosure (reference 202). Figure 6A A partial floor plan of ( ). Figure 26B This illustrates a second conductive layer 204 of a sensor layer according to one or more embodiments of the present disclosure (see reference). Figure 6A A partial floor plan of ( ).

[0318] refer to Figures 24A to 26B This shows that it has been referenced Figure 4 The boundary 100BD between the display area 100A and the non-display area 100NA adjacent to the display area 100A.

[0319] According to one or more embodiments of this disclosure, sensor layer 200 (reference) Figure 7 At least some of the traces of the sensor layer 200 can overlap with the display area 100A. The area of ​​the peripheral region 200NA of the sensor layer 200 can be reduced. Therefore, the area of ​​the peripheral region 200NA (see reference) on the front surface of the electronic device 1000 can be reduced. Figure 1A It occupies a small area and can implement narrow bezels.

[0320] Figure 24A and Figure 24B The first conductive layer SUC1-L1 and the second conductive layer SUC1-L2 shown may be included in Figure 10A In the first external angle sensing unit SU-EC1 shown, Figure 25A and Figure 25B The first conductive layer SUB-L1 and the second conductive layer SUB-L2 shown may be included in Figure 10A In the lower external sensing unit SU-EB shown, and Figure 26A and Figure 26B The first conductive layer SUC2-L1 and the second conductive layer SUC2-L2 shown may include in Figure 10A The second external sensing unit SU-EC2 shown in the figure.

[0321] The first outer corner sensing unit SU-EC1, the lower outer corner sensing unit SU-EB, and the second outer corner sensing unit SU-EC2 can be disposed at the lower edge of the sensing area 200A and can be spaced apart from each other in the first direction DR1 (e.g., spaced apart). The second outer electrode 220-A from the second electrode 220 and the fourth outer electrode 240-A from the fourth electrode 240, which are disposed at the outermost positions, can each overlap with the first outer corner sensing unit SU-EC1, the lower outer corner sensing unit SU-EB, and the second outer corner sensing unit SU-EC2.

[0322] Each of the second external electrode 220-A and the fourth external electrode 240-A may be spaced apart from the boundary 100BD (e.g., spaced apart), and the trace is between them. For example, the second external electrode 220-A may have a greater [specific characteristic] than [other characteristics] in the second direction DR2. Figure 11B The second-first electrode 220-1 shown has a smaller width, and the fourth outer electrode 240-A can have a width greater than that shown in the second direction DR2. Figure 11A The fourth-first electrode 240-1 shown has a small width.

[0323] According to one or more embodiments of this disclosure, additional electrodes 220-A1 and 220-A2 and additional auxiliary electrodes 240-A1 and 240-A2 may be added adjacent to the boundary 100BD to prevent a decrease in pen sensing sensitivity. The additional electrodes 220-A1 and 220-A2 and the additional auxiliary electrodes 240-A1 and 240-A2 may be disposed in the area where traces are provided.

[0324] For example, the additional electrodes 220-A1 and 220-A2 and the additional auxiliary electrodes 240-A1 and 240-A2 can be disposed inside the boundary 100BD and can overlap with the display area 100A. Optionally, the additional electrodes 220-A1 and 220-A2 and the additional auxiliary electrodes 240-A1 and 240-A2 can overlap with the boundary 100BD. In another case, at least some of the additional electrodes 220-A1 and 220-A2 and the additional auxiliary electrodes 240-A1 and 240-A2 can be disposed inside the boundary 100BD, and the remainder can be disposed outside the boundary 100BD. In yet another case, the additional electrodes 220-A1 and 220-A2 and the additional auxiliary electrodes 240-A1 and 240-A2 can be disposed outside the boundary 100BD. The area inside the boundary 100BD can represent the area overlapping with the display area 100A, and the area outside the boundary 100BD can represent the area overlapping with the non-display area 100NA.

[0325] The auxiliary electrodes 220-A1 and 220-A2 may include a first auxiliary electrode 220-A1 and a second auxiliary electrode 220-A2. (Reference) Figure 24A The first additional electrode 220-A1 can extend in a direction corresponding to the extension direction of the boundary 100BD. For example, a portion of the first additional electrode 220-A1 can extend in the second direction DR2, and another portion of the first additional electrode 220-A1 can extend in the first direction DR1.

[0326] refer to Figure 24A and Figure 24B The first auxiliary electrode 220-A1 can be electrically connected to the second external electrode 220-A via the first contact portion CT1. The second auxiliary electrode 220-A2 can be electrically connected to the first auxiliary electrode 220-A1 via the second contact portion CT2. (Reference) Figure 26A and Figure 26B The first additional electrode 220-A1 can be electrically connected to the second external electrode 220-A via the first contact portion CT1a. The second additional electrode 220-A2 can be electrically connected to the first additional electrode 220-A1 via the second contact portion CT2a. That is, the additional electrodes 220-A1 and 220-A2 can be connected to the opposite ends of the second external electrode 220-A. Therefore, the path of the induced current induced in the first additional electrode 220-A1 and the second external electrode 220-A can be moved so that it is closer to the boundary 100BD than the path of the induced current induced in the second external electrode 220-A where the first additional electrode 220-A1 is not connected.

[0327] The auxiliary electrodes 240-A1 and 240-A2 may include a first auxiliary electrode 240-A1 and a second auxiliary electrode 240-A2. (Reference) Figure 24A The first auxiliary electrode 240-A1 can be disposed on the same layer as the fourth external electrode 240-A (e.g., at [location]), and can be integrally connected to the fourth external electrode 240-A. The first auxiliary electrode 240-A1 can extend in a direction corresponding to the extension direction of the boundary 100BD. For example, a portion of the first auxiliary electrode 240-A1 can extend in the second direction DR2, and another portion of the first auxiliary electrode 240-A1 can extend in the first direction DR1.

[0328] refer to Figure 24A and Figure 24B The first-layer auxiliary electrode 240-A1 can be electrically connected to the second-layer auxiliary electrode 240-A2 via the third contact CT3. (Reference) Figure 26A and Figure 26B The first auxiliary electrode 240-A1 can be electrically connected to the second auxiliary electrode 240-A2 via the third contact CT3a. That is, the auxiliary electrodes 240-A1 and 240-A2 can be connected to the opposite ends of the fourth external electrode 240-A.

[0329] refer to Figure 24A and Figure 24B The image shows the SU-EC1 sensor unit located at the first corner (reference). Figure 10A A portion of a third electrode 230-A and a portion of a first electrode 210-A.

[0330] A second loop trace 230rt2a connected to a third electrode 230-A can be positioned inside the boundary 100BD and can overlap with the display area 100A. Sensor layer 200 (reference) Figure 7 It may also include a first line 230rt2aa connected to the second loop trace 230rt2a via the fourth contact portion CT4. The first line 230rt2aa may also overlap with the display area 100A.

[0331] A first trace 210ta connected to a first electrode 210-A can be positioned inside the boundary 100BD and can overlap with the display area 100A. Sensor layer 200 (reference) Figure 7 It may also include a trace pattern 210pt connected to the first trace 210ta. The trace pattern 210pt may be electrically connected to the first trace 210ta via the fifth contact CT5.

[0332] refer to Figure 24BA second trace 220ta is shown as an example. A second trace 220ta may include a portion extending in the region overlapping with the non-display area 100NA and a portion extending in the region overlapping with the display area 100A. (Reference) Figure 24A Sensor layer 200 (reference) Figure 7 It may also include a second line 220ta1 and a third line 220ta2 connected to a second trace 220ta via a sixth contact portion CT6. The second line 220ta1 may overlap with the non-display area 100NA, and the third line 220ta2 may overlap with the display area 100A.

[0333] Figure 27 This is a plan view of sensor layer 200-1 according to one or more embodiments of this disclosure. In the description... Figure 27 Time, and reference Figure 7 Components that are identical to those described will be given the same reference numerals, and the descriptions thereon will be omitted.

[0334] refer to Figure 27 The sensor layer 200-1 can define a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A. The sensor layer 200-1 may include a plurality of first electrodes 210, a plurality of second electrodes 220, a plurality of third electrodes 230 and a plurality of fourth electrodes 240 disposed in the sensing region 200A.

[0335] According to one or more embodiments of this disclosure, the sensor layer 200-1 may further include a first additional electrode 220-E1a and a second additional electrode 220-E2a. The first additional electrode 220-E1a and the second additional electrode 220-E2a may be disposed in the peripheral region 200NA. For example, the first additional electrode 220-E1a and the second additional electrode 220-E2a may be disposed between traces, or may be disposed adjacent to the outer edge of the sensor layer 200-1. One of the first additional electrode 220-E1a and the second additional electrode 220-E2a may be omitted.

[0336] The first auxiliary electrode 220-E1a can be electrically connected to one of the second electrodes 220-E1, and the second auxiliary electrode 220-E2a can be electrically connected to the other second electrode 220-E2. When the second electrodes 220 are arranged sequentially along the second direction DR2, one second electrode 220-E1 and the other second electrode 220-E2 can be located at the outermost position.

[0337] One end and the opposite end of the first auxiliary electrode 220-E1a can be electrically connected to a second electrode 220-E1, and one end and the opposite end of the second auxiliary electrode 220-E2a can be electrically connected to another second electrode 220-E2. That is, the first auxiliary electrode 220-E1a and the second electrode 220-E1 can be used as a channel, and the second auxiliary electrode 220-E2a and the other second electrode 220-E2 can be used as a channel.

[0338] In one or more embodiments of this disclosure, the sensor layer 200-1 may further include a first auxiliary electrode 240-ad1 and a second auxiliary electrode 240-ad2. The first auxiliary electrode 240-ad1 may be electrically connected to a second electrode group 240pc, and the second auxiliary electrode 240-ad2 may be electrically connected to another second electrode group 240pc. The first auxiliary electrode 240-ad1 may be disposed adjacent to the first auxiliary electrode 220-E1a, and the second auxiliary electrode 240-ad2 may be disposed adjacent to the second auxiliary electrode 220-E2a.

[0339] Figure 28 This is a plan view showing the sensing area 200Ac according to one or more embodiments of the present disclosure. Figure 29 This is a plan view showing the second conductive layer of three sensing units SU2, SU3 and SU1 according to one or more embodiments of the present disclosure.

[0340] refer to Figure 7 , Figure 28 and Figure 29 The sensing area 200Ac may include multiple sensing units SU1, SU2, and SU3. Sensing units SU1, SU2, and SU3 may include a first sensing unit SU1, a second sensing unit SU2, and a third sensing unit SU3. The third sensing unit SU3 may be disposed between the first sensing unit SU1 and the second sensing unit SU2.

[0341] refer to Figure 29 The first-first electrode 210-1 overlapping with the first sensing unit SU1 may include a plurality of first sub-electrodes 210dp arranged along the first direction DR1 and having substantially the same shape. The first-second electrode 210-2 overlapping with the second sensing unit SU2 may include a plurality of second sub-electrodes 210dpt1, 210dpt2 and 210dpt3 arranged along the first direction DR1. The first-third electrode 210-3 overlapping with the third sensing unit SU3 may include a plurality of third sub-electrodes 210dpm1, 210dpm2 and 210dpm3 arranged along the first direction DR1.

[0342] The first sub-electrodes 210dp can have the same shape. Therefore, the resistance ratio between the first sub-electrodes 210dp can be 1:1:1. The second sub-electrodes 210dpt1, 210dpt2, and 210dpt3 can be referred to as the second-first sub-electrode 210dpt1, the second-second sub-electrode 210dpt2, and the second-third sub-electrode 210dpt3. The resistance ratio between the second-first sub-electrode 210dpt1, the second-second sub-electrode 210dpt2, and the second-third sub-electrode 210dpt3 can be 0.5:2:2, but is not particularly limited thereto. The resistance ratio can be adjusted in various ways, as long as the resistance of the second-first sub-electrode 210dpt1 adjacent to the peripheral region 200NA is lower.

[0343] The third sub-electrodes 210dpm1, 210dpm2, and 210dpm3 can be referred to as the third-first sub-electrode 210dpm1, the third-second sub-electrode 210dpm2, and the third-third sub-electrode 210dpm3. The resistance ratio among the third-first sub-electrode 210dpm1, the third-second sub-electrode 210dpm2, and the third-third sub-electrode 210dpm3 can have a value between the resistance ratio among the first sub-electrodes 210dp and the resistance ratio among the second-first sub-electrode 210dpt1, the second-second sub-electrode 210dpt2, and the second-third sub-electrode 210dpt3. For example, the resistance ratio among the third-first sub-electrode 210dpm1, the third-second sub-electrode 210dpm2, and the third-third sub-electrode 210dpm3 can be x:2:2, where x is greater than 0.5 and less than 2.

[0344] Figure 30 This illustrates a sensor driver 200C according to one or more embodiments of the present disclosure (reference 200C). Figure 5 (The view of the operation).

[0345] refer to Figure 5 and Figure 30 The sensor driver 200C can be selectively driven in one of the first operating mode DMD1, the second operating mode DMD2, and the third operating mode DMD3.

[0346] The first operating mode DMD1 can be referred to as the touch and pen standby mode, the second operating mode DMD2 can be referred to as the touch activated and pen standby mode, and the third operating mode DMD3 can be referred to as the pen activated mode. The first operating mode DMD1 can be a mode in which the sensor driver 200C waits for the first input 2000 and the second input 3000. The second operating mode DMD2 can be a mode in which the sensor driver 200C senses the first input 2000 and waits for the second input 3000. The third operating mode DMD3 can be a mode in which the sensor driver 200C senses the second input 3000.

[0347] In one or more embodiments of this disclosure, the sensor driver 200C may initially operate in a first operating mode DMD1. When a first input 2000 is sensed in the first operating mode DMD1, the sensor driver 200C may switch (or change) to a second operating mode DMD2. Optionally, when a second input 3000 is sensed in the first operating mode DMD1, the sensor driver 200C may switch (or change) to a third operating mode DMD3.

[0348] In one or more embodiments of this disclosure, when the second input 3000 is sensed in the second operating mode DMD2, the sensor driver 200C can switch to the third operating mode DMD3. When the first input 2000 is released (or not sensed) in the second operating mode DMD2, the sensor driver 200C can switch to the first operating mode DMD1. When the second input 3000 is released (or not sensed) in the third operating mode DMD3, the sensor driver 200C can switch to the first operating mode DMD1.

[0349] Figure 31 This illustrates a sensor driver 200C according to one or more embodiments of the present disclosure (reference 200C). Figure 5 (The view of the operation).

[0350] refer to Figure 5 , Figure 30 and Figure 31 The operation in the first operating mode DMD1, the second operating mode DMD2, and the third operating mode DMD3 are shown in time (t) order.

[0351] In the first operating mode DMD1, the sensor driver 200C can be driven repeatedly in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 can be scanned to detect the first input 2000. Although Figure 31An example is shown where the sensor driver 200C operates in the first mode MD1-d consecutively after the second mode MD2-d, but the order is not limited to this.

[0352] In the second operating mode DMD2, the sensor driver 200C can be driven repeatedly in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 can be scanned to detect the second input 3000. During the first mode MD1, the sensor layer 200 can be scanned to detect the coordinates of the first input 2000.

[0353] In the third operating mode DMD3, the sensor driver 200C can be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 can be scanned to detect the coordinates of the second input 3000. In the third operating mode DMD3, the sensor driver 200C may not operate in the first mode MD1-D or MD1 until the second input 3000 is released (or not sensed).

[0354] Let's refer to each other. Figure 7 In both the first modes MD1-d and MD1, all of the third electrode 230 and the fourth electrode 240 can be grounded or receive a constant voltage. Optionally, in both the first modes MD1-d and MD1, the third electrode 230 and the fourth electrode 240 can be floated (or electrically floated). In another case, in both the first modes MD1-d and MD1, a signal in phase with the transmission signal provided to the first electrode 210 can be applied to the third electrode 230 and the fourth electrode 240. In this case, touch noise can be prevented from being introduced through the third electrode 230 and the fourth electrode 240.

[0355] In both the second mode MD2-d and the second mode MD2, the first ends of the third electrode 230 and the fourth electrode 240 can be completely floated. Furthermore, in both the second mode MD2-d and the second mode MD2, the second ends of the third electrode 230 and the fourth electrode 240 can be completely grounded or floated. Therefore, by connecting the first electrode 210 and the third electrode 230, and by connecting the second electrode 220 and the fourth electrode 240, compensation of the sensing signal can be maximized.

[0356] Figure 32 This is a view used to illustrate a first mode according to one or more embodiments of this disclosure.

[0357] refer to Figure 5 , Figure 31 and Figure 32 The first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2 may include a mutual capacitance detection mode. Figure 32 This is a view used to illustrate the mutual capacitance detection mode under the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2.

[0358] In mutual capacitance detection mode, sensor driver 200C can sequentially provide transmission signal TX to first electrode 210, and can use the received signal RX detected by second electrode 220 to detect the coordinates of first input 2000. For example, sensor driver 200C can sense the change in mutual capacitance between first electrode 210 and second electrode 220, and can calculate input coordinates.

[0359] Figure 32 An example is shown where a transmission signal TX is provided to a first electrode 210 and a reception signal RX is output from a second electrode 220. The sensor driver 200C can sense changes in capacitance between each of the first electrode 210 and the second electrode 220, and can detect the input coordinates of the first input 2000.

[0360] In one or more embodiments of this disclosure, at least one of the first mode MD1-d of the first operating mode DMD1 and the first mode MD1 of the second operating mode DMD2 may further include a self-capacitance detection mode. In the self-capacitance detection mode, the sensor driver 200C can calculate the input coordinates by outputting drive signals to the first electrode 210 and the second electrode 220 and sensing the change in capacitance of each of the first electrode 210 and the second electrode 220.

[0361] Figure 33 This is a view used to illustrate a second mode (particularly a charging operation mode) according to one or more embodiments of this disclosure. Figure 34A It is a graph depicting the waveform of the first signal SG1 according to one or more embodiments of the present disclosure. Figure 34B It is a graph depicting the waveform of the second signal SG2 according to one or more embodiments of the present disclosure.

[0362] refer to Figure 33 , Figure 34A and Figure 34B The second mode, MD2, can include charging operation modes. These charging operation modes can include a search charging operation mode and a tracking charging operation mode.

[0363] The search-to-charge operation mode can be an operation mode prior to sensing the position of the pen PN. Therefore, the first signal SG1 or the second signal SG2 can be sequentially provided to all channels included in the sensor layer 200. That is, in the search-to-charge operation mode, the entire area of ​​the sensor layer 200 can be scanned sequentially. When the pen PN is sensed in the search-to-charge operation mode, the sensor layer 200 can be driven in a tracking-to-charge operation mode. For example, in the tracking-to-charge operation mode, the sensor driver 200C can sequentially output the first signal SG1 and the second signal SG2 to the area overlapping the point where the pen PN is sensed, rather than the entire sensor layer 200.

[0364] In charging operation mode, the sensor driver 200C can apply a first signal SG1 to one of the pads connected to one end and the opposite end of the first loop trace 230rt1 and the second loop trace 230rt2, and can apply a second signal SG2 to the other pad. The second signal SG2 can be the inverse of the first signal SG1. For example, the first signal SG1 can be a sinusoidal signal.

[0365] Because the first signal SG1 and the second signal SG2 are applied to at least two pads, the current RFS can have a current path flowing from one pad to the other. Furthermore, since the first signal SG1 and the second signal SG2 are sinusoidal signals with an out-of-phase relationship, the direction of the current RFS can change periodically. In one or more embodiments of this disclosure, the first signal SG1 and the second signal SG2 can be square wave signals with an out-of-phase relationship.

[0366] When the first signal SG1 and the second signal SG2 are out of phase, the first signal SG1 is displayed on the display layer 100 (reference). Figure 4 The noise caused by the signal SG2 can be canceled out by the noise caused by the second signal SG2. Therefore, flickering can be eliminated in the display layer 100, and the display quality of the display layer 100 can be improved.

[0367] In one or more embodiments of this disclosure, the first signal SG1 may be a sinusoidal signal. However, it is not limited thereto; the first signal SG1 may be a square wave signal. The second signal SG2 may have a constant voltage (e.g., a predetermined constant voltage). For example, the second signal SG2 may be a ground voltage. That is, the pad to which the second signal SG2 is applied can be considered grounded. Even in this case, the current RFS can flow from one pad to another. Furthermore, even if the other pad is grounded, the direction of the current RFS can change periodically because the first signal SG1 is a sinusoidal or square wave signal.

[0368] Figure 33An example is shown where a second signal SG2 is provided to one end of a first loop trace 230rt1 and a first signal SG1 is provided to a first electrode group 230pc. Current RFS can flow along a current path including the first loop trace 230rt1 and the first electrode group 230pc. The current path can have a coil shape. Therefore, in the charging operation mode of the second mode, the resonant circuit of the pen PN can be charged by the current path.

[0369] According to this disclosure, a current path having a loop coil pattern can be implemented by components included in the sensor layer 200. Therefore, electronic device 1000 (reference) Figure 1A The pen PN can be charged using the sensor layer 200. Therefore, there is no need to add a separate component with a coil for charging the pen PN, so that there is no increase in the thickness and weight of the electronic device 1000 or a decrease in the flexibility of the electronic device 1000.

[0370] In charging operation mode, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be grounded, electrically floated, or can receive a constant voltage. Specifically, the first electrode 210, the second electrode 220, and the fourth electrode 240 can be floated. In this case, the current RFS may not flow to the first electrode 210, the second electrode 220, and the fourth electrode 240.

[0371] Figure 35A This is a view used to illustrate a second mode according to one or more embodiments of this disclosure. Figure 35B This is a view used to illustrate a second mode based on a sensing unit SU according to one or more embodiments of the present disclosure.

[0372] refer to Figure 35A and Figure 35B The second mode may include a charging operation mode and a pen sensing operation mode. Figure 35A and Figure 35B This is a view used to illustrate the pen sensing operation mode.

[0373] refer to Figure 35A In pen-sensing operation mode, a first receive signal PRX1 can be output from the first electrode 210, and a second receive signal PRX2 can be output from the second electrode 220. Figure 35B The image shows a sensing unit SU through which a first induced current Ia, a second induced current Ib, a third induced current Ic, and a fourth induced current Id generated by a pen PN flow.

[0374] refer to Figure 35A and Figure 35BIn one or more embodiments of this disclosure, the wiring directions of one overlapping electrode and another electrode of the sensor layer 200 may be different from each other. For example, the wiring directions of the first electrode 210x and the third electrode 230x may be different from each other. Furthermore, the wiring directions of the second electrode 220x and the fourth electrode 240x may be different from each other. For example, in... Figure 35B In this design, the first electrode 210x and the first trace 210t can be connected to each other on the lower side of the sensing unit SU, and the third electrode 230x and the first loop trace 230rt1 can be connected to each other on the upper side of the sensing unit SU. The second electrode 220x and the second trace 220t can be connected to each other on the right side of the sensing unit SU, and the fourth electrode 240x and the group trace 240t can be connected to each other on the left side of the sensing unit SU.

[0375] The RLC resonant circuit of the pen PN can emit a magnetic field with a resonant frequency while discharging charged charges. Due to the magnetic field provided by the pen PN, a first induced current Ia can be generated in the first electrode 210x, and a second induced current Ib can be generated in the second electrode 220x. In addition, a third induced current Ic can be generated in the third electrode 230x, and a fourth induced current Id can be generated in the fourth electrode 240x.

[0376] A first coupling capacitor Ccp1 can be formed between the third electrode 230x and the first electrode 210x, and a second coupling capacitor Ccp2 can be formed between the fourth electrode 240x and the second electrode 220x. The third induced current Ic can be transmitted to the first electrode 210x through the first coupling capacitor Ccp1, and the fourth induced current Id can be transmitted to the second electrode 220x through the second coupling capacitor Ccp2.

[0377] The sensor driver 200C can receive a first received signal PRX1a from the first electrode 210x based on a first induced current Ia and a third induced current Ic, and can receive a second received signal PRX2a from the second electrode 220x based on a second induced current Ib and a fourth induced current Id. The sensor driver 200C can detect the input coordinates of the pen PN based on the first received signal PRX1a and the second received signal PRX2a.

[0378] The sensor driver 200C can receive a first received signal PRX1a from the first electrode 210x and a second received signal PRX2a from the second electrode 220x. In this case, the first ends of the third electrode 230x and the fourth electrode 240x can be completely floating. Therefore, through the coupling between the first electrode 210x and the third electrode 230x and the coupling between the second electrode 220x and the fourth electrode 240x, the compensation of the sensing signal can be maximized.

[0379] Furthermore, the second terminals of the third electrode 230x and the fourth electrode 240x can be grounded or floating. Therefore, through the coupling between the first electrode 210x and the third electrode 230x and the coupling between the second electrode 220x and the fourth electrode 240x, the third induced current Ic and the fourth induced current Id can be sufficiently transmitted to the first electrode 210x and the second electrode 220x.

[0380] As described above, the resistance or shape of the channel positioned adjacent to the peripheral region can be designed asymmetrically. For example, the current path of the channel can be adjusted to be closer to the peripheral region than the center of the channel. In this case, the differences between signals (e.g., the differences in intensity between induced currents) can be further increased during differential sensing, and thus the pen sensing sensitivity in the region adjacent to the peripheral region can be further improved.

[0381] Although this disclosure has been described with reference to embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications may be made thereto without departing from the spirit and scope of this disclosure as set forth in the appended claims and their equivalents.

Claims

1. An electronic device, comprising: The sensor layer defines a sensing area and a peripheral area adjacent to the sensing area; as well as A sensor driver, configured to drive the sensor layer, The sensor layer includes: Multiple first electrodes are arranged along a first direction; and A plurality of second electrodes are configured to intersect the plurality of first electrodes and are arranged along a second direction that intersects the first direction. The sensing area includes a plurality of sensing units arranged along the first direction and the second direction. The plurality of sensing units include a first sensing unit spaced apart from the peripheral region and a second sensing unit in contact with the peripheral region. The plurality of first electrodes include a first-first electrode configured to overlap with the first sensing unit and a first-second electrode configured to overlap with the second sensing unit. The plurality of second electrodes include a second-first electrode configured to overlap with the first sensing unit and a second-second electrode configured to overlap with the second sensing unit. Wherein, the first-first electrode and the second-first electrode have a symmetrical structure in the first sensing unit with respect to the line extending in the first direction and the line extending in the second direction, and The first-second electrode and the second-second electrode have an asymmetrical structure in the second sensing unit relative to at least one of the lines extending in the first direction and the lines extending in the second direction.

2. The electronic device according to claim 1, wherein, The first electrode comprises a plurality of first sub-electrodes arranged along the first direction and having the same shape. The first and second electrodes include a plurality of second sub-electrodes arranged along the first direction, and The resistance of one of the plurality of second sub-electrodes is lower than the resistance of another of the plurality of second sub-electrodes.

3. The electronic device according to claim 2, wherein, The first second sub-electrode is closer to the peripheral region than the second second sub-electrode.

4. The electronic device according to claim 2, wherein, The second sub-electrode has a larger area than the other second sub-electrode.

5. The electronic device according to claim 2, wherein, One of the second sub-electrodes includes a plurality of first grid lines having a first linewidth, and the other second sub-electrode includes a plurality of second grid lines having a second linewidth smaller than the first linewidth.

6. The electronic device according to claim 2, wherein, The sensor layer further includes a plurality of third electrodes arranged along the first direction, and the plurality of third electrodes overlap with the plurality of first electrodes in a one-to-one correspondence. The plurality of third electrodes includes one third electrode configured to overlap with the first and second electrodes, and The third electrode includes a plurality of third sub-electrodes arranged along the first direction.

7. The electronic device according to claim 6, wherein, The plurality of third sub-electrodes include a third-first sub-electrode configured to overlap with one of the second sub-electrodes and a third-second sub-electrode configured to overlap with another second sub-electrode, wherein the resistance of the third-first sub-electrode is lower than the resistance of the third-second sub-electrode.

8. The electronic device according to claim 7, wherein, The third-first sub-electrode includes a first bridging pattern on the same layer as the first second sub-electrode. The third-second sub-electrode includes a second bridging pattern on the same layer as the first bridging pattern, and The resistance of the first bridging pattern is lower than that of the second bridging pattern.

9. The electronic device according to claim 8, wherein, The number of grid lines included in the first bridging pattern is greater than the number of grid lines included in the second bridging pattern.

10. The electronic device according to claim 7, wherein, The first capacitance between one second sub-electrode and the third-first sub-electrode is greater than the second capacitance between the other second sub-electrode and the third-second sub-electrode. The third-first sub-electrode is closer to the peripheral region than the third-second sub-electrode.

11. The electronic device according to claim 1, wherein, The plurality of sensing units further includes a third sensing unit located between the first sensing unit and the second sensing unit. The plurality of first electrodes further includes first-third electrodes configured to overlap with the third sensing unit, and The first-third electrode has a shape that is different from the shape of the first-first electrode and the shape of the first-second electrode.

12. The electronic device according to claim 11, wherein, The first electrode comprises a plurality of first sub-electrodes arranged along the first direction and having the same shape. The first and second electrodes include a plurality of second sub-electrodes arranged along the first direction. The first-third electrodes include a plurality of third sub-electrodes arranged along the first direction. Wherein, the plurality of first sub-electrodes have the same resistance ratio, and The maximum difference in resistance ratio among the plurality of second sub-electrodes is greater than the maximum difference in resistance ratio among the plurality of third sub-electrodes.

13. The electronic device according to claim 1, wherein, The first-second electrode includes a first layer electrode on the same layer as the first-first electrode and a second layer electrode located below the first layer electrode and electrically connected to the first layer electrode.

14. The electronic device according to claim 1, wherein, The sensor layer also includes an additional electrode connected to one of the plurality of second electrodes, and The plurality of second electrodes are arranged sequentially along the second direction, and the first second electrode is one of two second electrodes located at the outermost position among the plurality of second electrodes.

15. The electronic device according to claim 14, wherein, The sensor layer also includes: Multiple first traces are electrically connected to the multiple first electrodes; and Multiple second traces are electrically connected to the multiple second electrodes, and Some of the multiple second traces are located between the first second electrode and the additional electrode.

16. The electronic device of claim 15, further comprising: A display layer, located below the sensor layer, defines a display area and a non-display area adjacent to the display area. Some of the multiple second traces overlap with the display area.

17. The electronic device according to claim 1, wherein, The intersection area where the first-second electrode and the second-second electrode overlap in the second sensing unit is closer to the peripheral area than the center of the second sensing unit.

18. The electronic device according to claim 1, wherein, The first sensing unit and the second sensing unit are spaced apart from each other in the first direction, and the first sensing unit has a wider width in the first direction than the second sensing unit.

19. An electronic device comprising: The sensor layer defines a sensing area and a peripheral area adjacent to the sensing area; as well as A sensor driver, configured to drive the sensor layer, The sensor layer includes: Multiple first electrodes; A plurality of second electrodes are configured to intersect with the plurality of first electrodes; A plurality of third electrodes are configured to overlap with the plurality of first electrodes; and Multiple fourth electrodes are configured to intersect with the multiple first electrodes. The sensing area includes a plurality of sensing units arranged along a first direction and a second direction intersecting the first direction. The plurality of sensing units include a first sensing unit spaced apart from the peripheral region and a second sensing unit in contact with the peripheral region. The plurality of first electrodes includes a first-first electrode configured to overlap with the first sensing unit and a first-second electrode configured to overlap with the second sensing unit, and The first electrode has a shape that is different from that of the second electrode.

20. An electronic device, comprising: A sensor layer, wherein a sensing region and a peripheral region adjacent to the sensing region are defined; as well as A sensor driver, configured to drive the sensor layer, The sensing area includes multiple sensing units. The plurality of sensing units include a first sensing unit spaced apart from the peripheral region and a second sensing unit in contact with the peripheral region. The second sensing unit includes a first sub-region and a second sub-region. The first sub-region is adjacent to the peripheral region, and the second sub-region is spaced apart from the peripheral region. The first sub-region lies between the second sub-region and the peripheral region. In this case, the area occupied by the conductive pattern configured to transmit a predetermined signal in the first sub-region is greater than the area occupied by the conductive pattern configured to transmit the predetermined signal in the second sub-region.

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