LED (Light Emitting Diode) display module with sunken rear cover

Abstract

The LED display module is characterized in that the LED display module comprises a lamp panel, a bottom shell and the inwards-sunken rear cover, the lamp panel is provided with a front light source face and a rear chip binding face, a plurality of LED light sources are arranged on the front light source face, a plurality of chips are arranged on the rear chip binding face, the inwards-sunken rear cover comprises a plate body and an inwards-sunken body, and the inwards-sunken body is arranged on the bottom shell. A heat conduction glue layer is arranged between the inner sinking body and the back chip binding face of the lamp panel, the chips arranged on the back chip binding face are embedded in the heat conduction glue layer, and a conduction cap is attached to the top of each chip.

Description

Technical Field

[0001] This invention relates to an LED display module, and more particularly to an LED display module with a recessed metal heat dissipation back cover. Background Technology

[0002] As is well known, an LED display module is an image display device. In actual use, several LED display modules are spliced ​​together to form an LED display screen, which displays image information to the outside world.

[0003] A typical LED display module includes a light panel, a frame, and a back cover. The LED light source is set on the light panel, which is then assembled in the frame and fitted with a back cover to form the LED display module.

[0004] To improve display resolution, the spacing between LED light sources on the LED board is getting smaller and smaller, and the number of control chips on the LED board is also increasing. This product design attribute inevitably leads to higher and higher operating temperatures of the LED board. The current structure of LED display modules can no longer meet the heat dissipation requirements of the LED board, which is considered the main drawback of existing technology. Summary of the Invention

[0005] The technical solution adopted in this invention is: a recessed LED display module with a back cover, which includes a lamp board, a bottom shell and a recessed back cover, wherein the lamp board is disposed at the front end of the bottom shell and the recessed back cover is disposed at the rear end of the bottom shell.

[0006] The light panel has a front light source surface and a rear chip bonding surface. Several LED light sources are set on the front light source surface, and several chips are set on the rear chip bonding surface.

[0007] The recessed back cover is made of thermally conductive metal material. The recessed back cover includes a plate and a recessed body, wherein the recessed body is connected to the plate and includes a connecting ring wall and a bonding plate. The connecting ring wall is arranged around the bonding plate and connects the plate and the bonding plate. The plate has an inner surface and an outer surface, and the bonding plate has an inner surface and an outer surface. A thermally conductive adhesive layer is provided between the inner surface of the bonding plate and the bonding surface of the back chip of the lamp board. Several chips are embedded in the thermally conductive adhesive layer on the bonding surface of the back chip. The bonding surface of the back chip has an adhesive layer filled area and a non-filled area. The thermally conductive adhesive layer is provided between the adhesive layer filled area and the inner surface of the bonding plate. Several chips are concentrated on the adhesive layer filled area, and an inner cavity is formed between the non-filled area and the recessed back cover.

[0008] Each chip has a conductive cap attached to its top. The conductive cap is made of a thermally conductive metal material and includes a base plate and a hollow column. The base plate is connected to the center of the bottom of the hollow column. The base plate includes several bonding plates and several protruding plates. The bonding plates and protruding plates are connected together to form the base plate. The protruding plates are connected between any two adjacent bonding plates. Each protruding plate has an overflow cavity and an overflow port. The overflow cavity and the overflow port are connected. The hollow column has a top opening, a bottom opening, and a column cavity. The column cavity is connected between the top opening and the bottom opening. The overflow cavity of each protruding plate is connected to the column cavity.

[0009] The conductive cap is attached to the top surface of the chip. Several bonding plates are attached to the top surface of the chip. The top opening, the cylindrical cavity, the bottom opening, the overflow cavity, and the overflow port are connected to form a potting channel, in which overflow thermal conductive adhesive is filled.

[0010] The overflow thermal conductive adhesive includes an overflow top cap, an adhesive body, and an overflow bottom ring. The overflow top cap covers the top opening of the hollow column and has an arc-shaped outer top surface. The overflow bottom ring is located between the overflow opening and the back chip bonding surface of the lamp board. The overflow bottom ring wraps around the chip side of the chip and has an arc-shaped outer side surface. The adhesive body is located in the potting channel and connects the overflow top cap and the overflow bottom ring. The arc-shaped outer top surface and the arc-shaped outer side surface of the overflow thermal conductive adhesive are respectively embedded in the thermal conductive adhesive layer.

[0011] The beneficial effects of this invention are as follows: This invention concentrates several chips on the adhesive layer filling area. In addition, the thermally conductive adhesive layer is placed between the adhesive layer filling area and the inner surface of the bonding plate. Several chips are embedded in the thermally conductive adhesive layer. This invention uses the thermally conductive adhesive layer to attach the inner body of the inner recessed back cover to the back of the lamp board, so that the heat generated by the lamp board during operation can be directly conducted to the inner recessed back cover through the thermally conductive adhesive layer, and the inner recessed back cover can dissipate the heat outward. Especially for chips with high heat generation, they are all embedded in the thermally conductive adhesive layer, which is conducive to efficient heat conduction. Attached Figure Description

[0012] Figure 1 This is a three-dimensional schematic diagram of the present invention.

[0013] Figure 2 This is the front view of the present invention.

[0014] Figure 3 This is an exploded view of the present invention.

[0015] Figure 4 This is a cross-sectional structural diagram of the present invention.

[0016] Figure 5 This is a partially enlarged schematic diagram of the present invention.

[0017] Figure 6 This is a three-dimensional structural diagram of the conductive cap of the present invention.

[0018] Figure 7 This is a schematic diagram of the drainage plate of the present invention.

[0019] Figure 8 This is a schematic diagram of the conductive cap of the present invention.

[0020] Figure 9 This is a schematic diagram of the assembly of the conductive cap of the present invention.

[0021] Figure 10 This is a schematic diagram of the heat-absorbing and heat-conducting needle of the present invention.

[0022] Figure 11 This is a top view of the heat-absorbing and heat-conducting needle of the present invention.

[0023] Figure 12 This is a schematic diagram showing the position of the heat-absorbing and heat-conducting needle of the present invention. Detailed Implementation

[0024] like Figures 1 to 12 As shown, a recessed LED display module includes a lamp board 10, a bottom shell 20, and a recessed back cover 30. The lamp board 10 is located at the front end of the bottom shell 20, and the recessed back cover 30 is located at the rear end of the bottom shell 20. The lamp board 10 has a front light source surface 11 and a rear chip bonding surface 12. Several LED light sources are disposed on the front light source surface 11, and several chips 13 are disposed on the rear chip bonding surface 12. The chips 13 are electrically connected to the LED light sources and control the LED light sources. The control method is prior art and will not be described in detail here. The recessed back cover 30 is made of a thermally conductive metal material, such as magnesium alloy, iron, stainless steel, etc.

[0025] The inner recessed back cover 30 includes a plate 40 and an inner recessed body 50. The inner recessed body 50 is connected to the plate 40. The inner recessed body 50 includes a connecting ring wall 51 and a bonding plate 52. The connecting ring wall 51 is arranged around the bonding plate 52 and is connected between the plate 40 and the bonding plate 52.

[0026] The board 40 has an inner surface 41 and an outer surface 42. The bonding plate 52 has an inner surface 521 and an outer surface 522. A thermally conductive adhesive layer 60 is disposed between the inner surface 521 of the bonding plate and the rear chip bonding surface 12 of the lamp board 10. Several chips 13 disposed on the rear chip bonding surface 12 are embedded in the thermally conductive adhesive layer 60. The rear chip bonding surface 12 has an adhesive-filled area 14 and a non-filled area 15. The thermally conductive adhesive layer 60 is disposed between the adhesive-filled area 14 and the inner surface 521 of the bonding plate, and several chips 13 are concentrated on the adhesive-filled area 14. An inner cavity 31 is formed between the non-filled area 15 and the inner recessed back cover 30.

[0027] In this invention, several chips 13 are concentrated on the adhesive filling area 14. In addition, the thermally conductive adhesive layer 60 is disposed between the adhesive filling area 14 and the inner surface 521 of the bonding plate. Several chips 13 are embedded in the thermally conductive adhesive layer 60. In this invention, the inner recess 50 of the inner recessed back cover 30 is attached to the back of the lamp board 10 through the thermally conductive adhesive layer 60, so that the heat generated by the lamp board 10 is directly conducted to the inner recessed back cover 30 through the thermally conductive adhesive layer 60, and the inner recessed back cover 30 dissipates the heat outward. Especially for chips 13 with large heat generation, they are all embedded in the thermally conductive adhesive layer 60, which is conducive to efficient heat conduction.

[0028] Each chip 13 has a conductive cap 100 attached to its top. The conductive cap 100 is made of a thermally conductive metal material, such as magnesium alloy, iron, stainless steel, etc. The conductive cap 100 includes a base plate 110 and a hollow column 120. The base plate 110 is connected to the center of the bottom of the hollow column 120. The base plate 110 includes several bonding plates 130 and several protruding plates 140. Several bonding plates 130 and several protruding plates 140 are connected together to form the base plate 110. The protruding plates 140 are connected between any two adjacent bonding plates 130. Each protruding plate 140 has an overflow cavity 141 and an overflow port 142. The overflow cavity 141 and the overflow port 142 are connected.

[0029] The hollow column 120 has a top opening 121, a bottom opening 122, and a column cavity 123. The column cavity 123 is connected between the top opening 121 and the bottom opening 122. In practice, the hollow column 120 is conical. The diameter of the top opening 121 is smaller than the diameter of the bottom opening 122. The overflow cavity 141 of each of the protruding plates 140 is connected to the column cavity 123.

[0030] The conductive cap 100 is attached to the top surface 16 of the chip 13. Several bonding plates 130 are attached to the top surface 16 of the chip. The top opening 121, the cylindrical cavity 123, the bottom opening 122, the overflow inner cavity 141 and the overflow port 142 are connected to form a potting channel 150. Overflow thermally conductive adhesive 160 is filled in the potting channel 150.

[0031] The overflow thermal conductive adhesive 160 includes an overflow top cap 161, an adhesive body 162, and an overflow bottom ring 163. The overflow top cap 161 covers the top opening 121 of the hollow column 120 and has an arc-shaped outer top surface 171. The overflow bottom ring 163 is located between the overflow port 142 and the rear chip bonding surface 12 of the lamp board 10. The overflow bottom ring 163 wraps around the chip side 17 of the chip 13 and has an arc-shaped outer side surface 172. The adhesive body 162 is located in the potting channel 150 and connects the overflow top cap 161 and the overflow bottom ring 163. The arc-shaped outer top surface 171 and the arc-shaped outer side surface 172 of the overflow thermal conductive adhesive 160 are respectively embedded in the thermal conductive adhesive layer 60.

[0032] In practice, a diversion plate 143 is provided on the top of the convex plate 140, and the diversion plate 143 is inclined above the overflow port 142.

[0033] like Figure 9 As shown, in specific implementation, the conductive cap 100 is attached to the top surface 16 of the chip 13 according to the following steps, the specific steps are as follows.

[0034] Step 1: Place the lamp board 10 horizontally so that the several chips 13 set on the rear chip bonding surface 12 face upward.

[0035] The second step is to pre-fix the conductive cap 100 onto the top surface 16 of the chip 13, and pre-fix several bonding plates 130 of the base plate 110 onto the top surface 16 of the chip 13. In practice, a fixing fixture or bonding plates 130 can be used for pre-fixation.

[0036] The third step is to fill the hollow column 120 with glue by filling the top opening 121 of the glue head A1 into the glue channel 150. The glue A is then poured into the column cavity 123 from the top opening 121. After that, the glue A flows along the top surface 16 of the chip and spreads in the overflow cavity 141. Then, the glue A flows out from the overflow port 142 to form the bottom overflow portion A2 around the chip 13.

[0037] Fourth step: After the glue A fills the glue channel 150, the glue head A1 leaves and forms a top overflow portion A3 at the top opening 121 of the hollow column 120.

[0038] Step 5: Curing. The adhesive A in the dispensing channel 150 cures to form the adhesive 162, the bottom overflow portion A2 cures to form the overflow bottom ring 163, and the top overflow portion A3 cures to form the overflow top cap 161.

[0039] Step 6: Set the thermally conductive adhesive layer 60. Lay the thermally conductive adhesive layer 60 on the adhesive filling area 14 of the back chip bonding surface 12, so that the chip 13 and the conductive cap 100 are embedded in the thermally conductive adhesive layer 60. The arc-shaped outer top surface 171 and the arc-shaped outer side surface 172 of the overflow thermally conductive adhesive 160 are respectively embedded and pressed into the thermally conductive adhesive layer 60.

[0040] Step 7: Press the inner recessed back cover 30 onto the thermally conductive adhesive layer 60, so that the inner surface 521 of the bonding plate of the inner recessed body 50 is pressed onto the thermally conductive adhesive layer 60.

[0041] In practice, the lamp panel 10 dissipates heat according to the following steps.

[0042] Step 1: The lamp board 10 and the chip 13 generate heat during operation.

[0043] Step 2: The heat is directly transferred to the overflow thermal conductive adhesive 160 and the conductive cap 100.

[0044] Step 3: The overflow thermally conductive adhesive 160 and the conductive cap 100 directly conduct the heat to the thermally conductive adhesive layer 60.

[0045] Step 4: The heat is directly conducted to the inner recessed back cover 30 by the thermally conductive adhesive layer 60, and then dissipated to the outside by the inner recessed back cover 30.

[0046] In practical implementation, the inner cavity 31 is provided with several heat-absorbing and heat-conducting needles 200. Each heat-absorbing and heat-conducting needle 200 is disposed in the inner cavity 31. One end of the heat-absorbing and heat-conducting needle 200 is inserted into the heat-conducting adhesive layer 60, and the other end of the heat-absorbing and heat-conducting needle 200 is in contact with the inner recessed back cover 30. When working, the heat-absorbing and heat-conducting needle 200 absorbs the heat in the inner cavity 31 and conducts the heat to the inner recessed back cover 30, from which the inner recessed back cover 30 dissipates the heat outward.

[0047] The heat-absorbing and heat-conducting needle 200 includes a needle body 210, heat-absorbing fins 220, and a contact piece 230. The heat-absorbing fins 220 are disposed on the needle body 210 and are located in the inner cavity 31. The contact piece 230 is disposed at the rear end of the needle body 210 and is pressed onto the inner surface 521 of the bonding plate 52 of the inner recessed rear cover 30. The front end of the needle body 210 is inserted into the heat-conducting adhesive layer 60. Several heat-absorbing and heat-conducting needles 200 are radially inserted into the heat-conducting adhesive layer 60 on all sides.

[0048] In practice, the needle body 210 and the contact piece 230 are made of thermally conductive metal materials, such as magnesium alloy, iron, stainless steel, etc., and the heat-absorbing fins 220 are made of heat-absorbing materials, such as glass wool, metal sheets, etc. The heat-absorbing and heat-conducting needle 200 can absorb the heat in the inner cavity 31 and conduct the heat to the inner recessed back cover 30, and the inner recessed back cover 30 dissipates the heat outward.

[0049] In specific implementation, the bottom shell 20 includes an outer frame 21, transverse ribs 22 and longitudinal ribs 23. The transverse ribs 22 and longitudinal ribs 23 are arranged in the outer frame 21, and the inner cavity of the outer frame 21 is divided into several insertion cavities 24 by means of the transverse ribs 22 and longitudinal ribs 23. The inner recessed body 50 of the inner recessed back cover 30 is arranged in the insertion cavity 24 in a corresponding manner. A waterproof sealing ring 25 is also provided between the inner recessed back cover 30 and the bottom shell 20. A handle 26 is provided at the center of the inner recessed back cover 30.

[0050] like Figures 1 to 12 As shown, an assembly method for a back cover heat dissipation LED display module includes the following steps.

[0051] Step 1: Make the light board 10, place several LED light sources on the front light source surface 11 of the light board 10, and place several chips 13 on the rear chip bonding surface 12 of the light board 10.

[0052] The second step is to place the lamp board 10 horizontally, so that the several chips 13 set on the rear chip bonding surface 12 face upward, and pre-fix the conductive cap 100 on the top surface 16 of each chip 13.

[0053] The conductive cap 100 includes a base plate 110 and a hollow column 120. The base plate 110 is connected to the center of the bottom of the hollow column 120. The base plate 110 includes several bonding plates 130 and several protruding plates 140. The bonding plates 130 and the protruding plates 140 are connected together to form the base plate 110. The protruding plates 140 are connected between any two adjacent bonding plates 130. Each protruding plate 140 has an overflow cavity 141 and an overflow port 142. The overflow cavity 141 and the overflow port 142 are connected.

[0054] The hollow column 120 has a top opening 121, a bottom opening 122, and a column cavity 123. The column cavity 123 is connected between the top opening 121 and the bottom opening 122. The overflow cavity 141 of each of the protruding plates 140 is connected to the column cavity 123.

[0055] When the conductive cap 100 is attached to the top surface 16 of the chip 13, a potting channel 150 is formed by the top opening 121, the cylindrical cavity 123, the bottom opening 122, the overflow inner cavity 141 and the overflow port 142.

[0056] The third step is to fill the hollow column 120 with glue by filling the top opening 121 of the glue head A1 into the glue channel 150. The glue A is then poured into the column cavity 123 from the top opening 121. After that, the glue A flows along the top surface 16 of the chip and spreads in the overflow cavity 141. Then, the glue A flows out from the overflow port 142 to form the bottom overflow portion A2 around the chip 13.

[0057] Fourth step: After the glue A fills the glue channel 150, the glue head A1 leaves and forms a top overflow portion A3 at the top opening 121 of the hollow column 120.

[0058] Step 5: Curing. The adhesive A in the dispensing channel 150 cures to form adhesive 162, the bottom overflow portion A2 cures to form an overflow bottom ring 163, and the top overflow portion A3 cures to form an overflow top cap 161.

[0059] The overflow top cap 161 is placed over the top opening 121 of the hollow column 120. The overflow top cap 161 has an arc-shaped outer top surface 171. The overflow bottom ring 163 is located between the overflow port 142 and the rear chip bonding surface 12 of the lamp board 10. The overflow bottom ring 163 wraps around the chip side 17 of the chip 13. The overflow bottom ring 163 has an arc-shaped outer side surface 172. The adhesive 162 is located in the potting channel 150. The adhesive 162 is connected between the overflow top cap 161 and the overflow bottom ring 163.

[0060] Step 6: Set up the thermally conductive adhesive layer 60. Lay the thermally conductive adhesive layer 60 on the back chip bonding surface 12, so that the chip 13 and the conductive cap 100 are embedded in the thermally conductive adhesive layer 60. The arc-shaped outer top surface 171 and the arc-shaped outer side surface 172 of the overflow thermally conductive adhesive 160 are respectively embedded and pressed into the thermally conductive adhesive layer 60.

[0061] Step 7: Insert several heat-absorbing and heat-conducting needles 200 radially around the thermally conductive adhesive layer 60. Each heat-absorbing and heat-conducting needle 200 includes a needle body 210, heat-absorbing fins 220, and contact pieces 230. The heat-absorbing fins 220 are disposed on the needle body 210, the contact pieces 230 are disposed at the rear end of the needle body 210, and the front end of the needle body 210 is inserted into the thermally conductive adhesive layer 60.

[0062] Step 8: Assemble the bottom shell 20 and the inner recessed back cover 30, and press the inner recessed back cover 30 onto the thermally conductive adhesive layer 60. The inner recessed back cover 30 includes a plate 40 and an inner recessed body 50. The inner recessed body 50 is connected to the plate 40. The inner recessed body 50 includes a connecting ring wall 51 and a bonding plate 52. Press the inner surface 521 of the bonding plate of the inner recessed body 50 onto the thermally conductive adhesive layer 60. At the same time, the contact piece 230 is pressed onto the inner surface 521 of the bonding plate.

Claims

1. A recessed LED display module with a back cover, characterized in that: It includes a light panel, a base shell, and an inner recessed rear cover, wherein the light panel is located at the front end of the base shell, and the inner recessed rear cover is located at the rear end of the base shell. The light panel has a front light source surface and a rear chip bonding surface. Several LED light sources are disposed on the front light source surface, and several chips are disposed on the rear chip bonding surface. The recessed back cover is made of thermally conductive metal material. It includes a plate and a recessed body, with the recessed body connected to the plate. The recessed body includes a connecting ring wall and a bonding plate. The connecting ring wall surrounds the bonding plate and connects the plate and the bonding plate. The plate has an inner surface and an outer surface, and the bonding plate has an inner surface and an outer surface. A thermally conductive adhesive layer is provided between the inner surface of the bonding plate and the bonding surface of the back chip of the lamp board. Several chips on the bonding surface are embedded in the thermally conductive adhesive layer. The bonding surface has an adhesive-filled area and a non-filled area. The thermally conductive adhesive layer is located between the adhesive-filled area and the inner surface of the bonding plate. Several chips are concentrated in the adhesive-filled area, and an inner cavity is formed between the non-filled area and the recessed back cover. Each chip has a conductive cap attached to its top, made of a thermally conductive metal material. The conductive cap includes a base plate and a hollow column. The base plate is connected to the center of the bottom of the hollow column. The base plate includes several bonding plates and several protruding plates, which are connected together to form the base plate. The protruding plates are connected between any two adjacent bonding plates. Each protruding plate has an overflow cavity and an overflow port, which are connected in communication. The hollow column has a top opening, a bottom opening, and a column cavity, which is connected between the top opening and the bottom opening. The overflow cavity of each protruding plate is connected to the column cavity. The conductive cap is attached to the top surface of the chip. Several bonding plates are attached to the top surface of the chip. A potting channel is formed by the top opening, the cylindrical cavity, the bottom opening, the overflow cavity, and the overflow outlet. Overflow thermally conductive adhesive is filled in the potting channel. The overflow thermal conductive adhesive includes an overflow top cap, an adhesive body, and an overflow bottom ring. The overflow top cap covers the top opening of the hollow column and has an arc-shaped outer top surface. The overflow bottom ring is located between the overflow opening and the back chip bonding surface of the lamp board. The overflow bottom ring wraps around the chip side of the chip and has an arc-shaped outer side surface. The adhesive body is located in the potting channel and connects the overflow top cap and the overflow bottom ring. The arc-shaped outer top surface and the arc-shaped outer side surface of the overflow thermal conductive adhesive are respectively embedded in the thermal conductive adhesive layer.

2. The recessed LED display module with a rear cover as described in claim 1, characterized in that: A diversion plate is provided on the top of the convex plate, and the diversion plate is inclined above the overflow port.

3. The recessed LED display module with a rear cover as described in claim 1, characterized in that: The hollow column is conical in shape, and the diameter of the top opening is smaller than the diameter of the bottom opening.

4. The recessed LED display module with a rear cover as described in claim 1, characterized in that: The conductive cap is attached to the top surface of the chip according to the following steps: Step 1: Place the light board horizontally, with the several chips on the back chip bonding surface facing upwards. The second step is to pre-fix the conductive cap to the top surface of the chip, and to pre-fix several bonding plates of the base plate to the top surface of the chip. The third step involves the dispensing head filling the hollow column with adhesive at the top opening. The adhesive is poured into the dispensing channel, entering the column cavity through the top opening. Then, the adhesive flows along the top surface of the chip and spreads within the overflow cavity. Finally, the adhesive flows out from the overflow port, forming a bottom overflow portion around the chip. Fourth step: After the glue fills the glue-filling channel, the glue-filling head leaves, forming a top overflow portion at the top opening of the hollow column. Step 5: Curing. The adhesive in the dispensing channel cures to form the adhesive body, the bottom overflow portion cures to form the overflow bottom ring, and the top overflow portion cures to form the overflow top cap. Step 6: Apply the thermally conductive adhesive layer. Lay the thermally conductive adhesive layer on the adhesive filling area of ​​the subsequent chip bonding surface, so that the chip and the conductive cap are embedded in the thermally conductive adhesive layer. The arc-shaped top surface and arc-shaped outer surface of the overflow thermally conductive adhesive are respectively embedded and pressed into the thermally conductive adhesive layer. Step 7: Press the inner back cover onto the thermally conductive adhesive layer, so that the inner surface of the inner back cover is pressed onto the thermally conductive adhesive layer.

5. The recessed LED display module with a rear cover as described in claim 1, characterized in that: The lamp panel dissipates heat according to the following steps: Step 1: The lamp board and the chip generate heat during operation. Step 2: The heat is directly conducted to the overflow thermal conductive adhesive and the conductive cap. Step 3: The overflowing thermally conductive adhesive and the conductive cap directly transfer the heat to the thermally conductive adhesive layer. Step 4: The heat is directly conducted to the inner recessed back cover by the thermally conductive adhesive layer, and then dissipated to the outside by the inner recessed back cover.

6. The recessed LED display module with a rear cover as described in claim 1, characterized in that: The inner cavity is equipped with several heat-absorbing and heat-conducting needles. Each heat-absorbing and heat-conducting needle is located in the inner cavity. One end of the heat-absorbing and heat-conducting needle is inserted into the heat-conducting adhesive layer, and the other end of the heat-absorbing and heat-conducting needle is in contact with the inner recessed back cover. The heat-absorbing and heat-conducting needle absorbs the heat in the inner cavity and conducts the heat to the inner recessed back cover, which then dissipates the heat outward.

7. The recessed LED display module with a rear cover as described in claim 6, characterized in that: The heat-absorbing and heat-conducting needle includes a needle body, heat-absorbing fins, and a contact plate. The heat-absorbing fins are disposed on the needle body and are located in the inner cavity. The contact plate is disposed at the rear end of the needle body, and the front end of the needle body is inserted into the heat-conducting adhesive layer.

8. The recessed LED display module with a rear cover as described in claim 7, characterized in that: The contact piece is pressed onto the inner surface of the bonding plate of the recessed back cover.

9. The recessed LED display module with a rear cover as described in claim 7, characterized in that: Several heat-absorbing and heat-conducting pins are radially inserted around the sides of the heat-conducting adhesive layer.

10. A recessed LED display module with a rear cover as described in claim 6, characterized in that: The needle body and the contact plate are made of thermally conductive metal material, and the heat-absorbing fins are made of heat-absorbing material.

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