Cooling devices for electronic equipment

Abstract

To provide a cooling device for electronic apparatuses with which it is possible to downsize a cooling fan without reducing a discharge amount of a cooling air.SOLUTION: The present invention comprises: a heat sink that allows the air introduced from the outside to pass through between a plurality of fans so as to dissipate the heat generated from an electronic apparatus; a first air blower unit that has a first discharge surface for discharging the air introduced from the outside toward the heat sink; a second air blower unit that has a same size as the first air blower unit and has a second discharge surface for discharging the air introduced from the outside toward the heat sink; and an exhaust opening that ejects the air having passed through between the fans to the outside. A sum total of the diameter of the first discharge surface and the diameter of the second discharge surface is larger than a width of the heat sink, and the first and second discharge surfaces are arranged at a setting angle of 90 degrees or greater on an upstream side of the fins, passing through a widthwise center position of the heat sink and symmetrically with respect to a plane parallel to the fins.SELECTED DRAWING: Figure 5

Description

Technical Field

[0004] , , , , , , , The tabletop and ,

[0005] ,

[0001] Embodiments of the present invention relate to a cooling device for an electronic device.

Background Art

[0002] Conventionally, electronic devices such as PCs (Personal Computers) include components that become hot, such as CPUs (Central Processing Units). Generally, a heat sink is attached to such components for heat dissipation. Then, heat dissipation is performed by the air sucked in by a fan installed on the upstream side flowing through the heat sink and being exhausted to the downstream side of the heat sink. (For example, Patent Document 1)

[0003] Recently, there has been a great demand for miniaturization of electronic devices, and miniaturization of the cooling fan that blows air to the heat sink has been required. However, when the cooling fan is miniaturized, the discharge amount of the cooling air decreases, so the cooling performance of the heat sink deteriorates, which is not preferable.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The problem to be solved by the present invention is to provide a cooling device for an electronic device that can achieve miniaturization of a cooling fan without reducing the discharge amount of cooling air.

Means for Solving the Problems

[0005] The cooling device for an electronic device according to the embodiment includes a heat sink, a first blowing unit, a second blowing unit, and an exhaust port. The tabletop andThe heat sink dissipates heat generated by electronic equipment by passing air introduced from the outside between multiple fins. The first air blower has a first discharge surface that discharges air introduced from the outside toward the heat sink. The second air blower has the same size as the first air blower and has a second discharge surface that discharges air introduced from the outside toward the heat sink. The exhaust port discharges the air that has passed between the fins to the outside. The top panel covers at least a portion of the area above the heatsink and the gap between the first and second air vents. Furthermore, the sum of the diameters of the first discharge surface and the second discharge surface is greater than the width of the heatsink, and the first and second discharge surfaces are positioned symmetrically with respect to a plane parallel to the fins, passing through the center of the heatsink in the width direction, with an angle of 90 degrees or more between them on the upstream side of the fins. Furthermore, the exhaust port is equipped with a branching wall that splits the air that has passed between the fins of the heatsink into an upper exhaust port and a lower exhaust port, so as to avoid a certain area downstream of itself. [Brief explanation of the drawing]

[0006] [Figure 1] Figure 1 is a perspective view showing an example of a fan duct in an embodiment. [Figure 2] Figure 2 is a perspective view showing an example of a housing that forms a fan duct. [Figure 3] Figure 3 is a perspective view showing an example of the schematic structure of an electronic device to which a fan duct is attached. [Figure 4] Figure 4 is a perspective view showing an example of a ventilation hole provided in an electronic device. [Figure 5] Figure 5 is a plan view showing an example of the arrangement of intake fans in a fan duct. [Figure 6] Figure 6 is a front view showing an example of the arrangement of intake fans in a fan duct. [Figure 7] Figure 7 is a side view showing an example of the arrangement of intake fans in a fan duct. [Figure 8] Figure 8 is a plan view showing a second example of the arrangement of intake fans in a fan duct. [Figure 9] Figure 9 is a plan view showing a third example of the arrangement of intake fans in a fan duct. [Figure 10]Figure 10 is a plan view showing an example of the arrangement of the intake fan in a fan duct of a modified embodiment. [Figure 11] Figure 11 is a plan view showing a second example of the arrangement of the suction fan in a fan duct of a modified embodiment. [Figure 12] Figure 12 is a plan view showing a third example of the arrangement of the suction fan in a fan duct, which is a modified example of the embodiment. [Figure 13] Figure 13 is a plan view showing a fourth example of the arrangement of the suction fan in a fan duct, which is a modified example of the embodiment. [Modes for carrying out the invention]

[0007] An embodiment in which the cooling device of this disclosure is applied to a fan duct 1 will be described with reference to the drawings.

[0008] (Outline structure of the fan duct) The schematic structure of a fan duct 1, an example of a cooling device according to this disclosure, will be explained using Figures 1 and 2. Figure 1 is a perspective view showing an example of a fan duct of the embodiment. Figure 2 is a perspective view showing an example of a housing forming the fan duct. For the sake of explanation, a three-dimensional coordinate system XYZ is set in Figures 1 and 2. In the three-dimensional coordinate system XYZ, the width direction (left-right direction) of the fan duct 1 is the X-axis direction, the depth direction (front-back direction) is the Y-axis direction, and the height direction (up-down direction) is the Z-axis direction.

[0009] As shown in Figure 1, the fan duct 1 has a roughly box-shaped housing 9 and is a cover member that covers the heat sink 2 and the intake fans 3 and 4 that blow air onto the heat sink 2. The fan duct 1 is a component that combines the functions of both an intake duct and an exhaust duct, passing the air drawn in by the intake fans 3 and 4 from the intake port 11 through the fins 22 of the heat sink 2 installed inside the ventilation pipe (duct) and discharging it from the exhaust port 12.

[0010] Intake fans 3 and 4 draw in air from outside the fan duct 1, introduce the drawn-in air into the fan duct 1, and blow it in the negative direction of the Y-axis. Intake fan 3 is an example of the first blowing section in this disclosure. Intake fan 4 is an example of the second blowing section in this disclosure. Intake ports 11 are provided on the fan duct 1 at a position upstream of the blowing direction of intake fan 3 and intake fan 4, and exhaust ports 12 are provided at a position downstream.

[0011] The intake fan 3 has a first discharge surface that discharges air introduced from the outside toward the heat sink 2. The intake fan 4 also has a second discharge surface that discharges air introduced from the outside toward the heat sink 2.

[0012] Intake fans 3 and 4 are the same size and are positioned symmetrically along the X-axis, passing through the center of the heatsink 2 in the width direction, with an angle of 90 degrees or more, with respect to a plane parallel to the fins 22 (a plane parallel to the YZ plane). Further details will be described later (see Figures 5 and 6).

[0013] The heatsink 2 is attached to a heat-generating electronic component, such as the CPU (Central Processing Unit). The heat generated by the CPU is conducted through the heatsink 2. The heat that has traveled through the heatsink 2 is then dissipated into the surrounding air. This prevents malfunctions caused by CPU overheating.

[0014] The heatsink 2 consists of a base portion 21 and a plurality of fins 22. The fins 22 are erected on the base portion 21. The plurality of fins 22 are adjacent to each other with a predetermined distance between them. The base portion 21 is in contact with the CPU, and heat from the CPU is conducted to it. The fins 22 dissipate the heat conducted from the base portion 21 into the air.

[0015] The heat sink 2 is fixed by the coil spring 44 and the screw 45 on the frames 41 and 42 that form layers at predetermined intervals. The motherboard 101 (see FIG. 3) is sandwiched between the frame 41 and the frame 42.

[0016] The suction fan 3 and the suction fan 4 blow air by continuously sending air in one direction by blades rotated and driven by, for example, an electric motor. In the present embodiment, they are arranged in the order of the intake port 11, the suction fan 3 or the suction fan 4, the heat sink 2, and the exhaust port 12 from the upstream side to the downstream side in the blowing direction of the suction fan 3 and the suction fan 4.

[0017] In order to fully exhibit the effects of the above-described fan duct 1, it is desirable that there are no components (obstacles) that obstruct the exhaust on the leeward side of the exhaust port 12. However, depending on the size of the electronic device 100 (see FIG. 3) provided with the fan duct 1 and the arrangement of the built-in components, etc., an obstacle may be arranged on the downstream side of the exhaust port 12.

[0018] In order to perform the exhaust while avoiding such an obstacle on the leeward side, the fan duct 1 includes the branch wall 13 shown in FIG. 1. The branch wall 13 branches the air flow that has passed between the fins 22 of the heat sink 2 into two directions. The branch wall 13 will be described in detail later (see FIG. 7).

[0019] As shown in FIG. 2, the housing 9 forming the fan duct 1 has a shape in which the side where the suction fan 3 and the suction fan 4 are attached and the side of the exhaust port 12 are open.

[0020] A top plate 10 is installed on the upper part of the housing 9 in the Z-axis direction, and a bottom plate 14 is installed on the lower part in the Z-axis direction. In addition, side walls 18 are installed on both ends in the X-axis direction where the housing 9 covers the heat sink 2. Furthermore, a side wall 7 is installed between the top plate 10 and the bottom plate 14 between the upstream opening (positive Y-axis side) where the intake fan 3 is installed and the heat sink 2. Also, a side wall 8 is installed between the top plate 10 and the bottom plate 14 between the upstream opening (positive Y-axis side) where the intake fan 4 is installed and the heat sink 2. As a result, the air discharged from the intake fan 3 reaches the heat sink 2 without leaking from the fan duct 1. Similarly, the air discharged from the intake fan 4 reaches the heat sink 2 without leaking from the fan duct 1. Note that side walls 7 and 8 are examples of the first wall portion in this disclosure.

[0021] A branch wall 13 is formed on the downstream side (negative Y-axis side) of the housing 9. The branch wall 13 comprises an upper wall portion 131 and a lower wall portion 132. A portion of the air that passes between the fins 22 of the heat sink 2 flows along the upper wall portion 131 and is discharged from the upper exhaust port 121. The remaining air that passes between the fins 22 of the heat sink 2 flows along the lower wall portion 132 and is discharged from the lower exhaust port 122.

[0022] (Outline structure of electronic devices) Figures 3 and 4 will be used to describe the electronic device 100 to which the fan duct 1 is attached. Figure 3 is a perspective view showing an example of the schematic structure of the electronic device to which the fan duct is attached. Figure 4 is a perspective view showing an example of a ventilation hole provided in the electronic device.

[0023] As shown in Figure 3, the electronic device 100 includes a motherboard 101, CPU 102, memory 103, SSD (Solid State Drive) 104, riser card 105, and I / O board 106 inside the enclosure 110.

[0024] The motherboard 101 is an example of a circuit board on which an electronic component (CPU 102 in this embodiment) that dissipates heat by the heatsink 2 is mounted. The memory 103 and SSD 104 also generate heat as they operate. This heat is also dissipated by the airflow within the enclosure 110 created by the airflow from the intake fans 3 and 4.

[0025] The I / O board 106 is connected to the motherboard 101 via a slot on the riser card 105. Because the I / O board 106 is connected to the slot on the riser card 105, it is positioned parallel to the motherboard 101, which makes it possible to reduce the height dimension of the chassis 110.

[0026] However, with the arrangement described above, if the I / O board 106 is located downstream of the exhaust port 12, the I / O board 106 becomes an obstacle that obstructs the exhaust. In this embodiment, the exhaust from the fan duct 1 is configured to avoid the I / O board 106.

[0027] As shown in Figure 4, the fan duct 1 is housed inside the housing 110 of the electronic device 100. The housing 110 is provided with ventilation holes 161, 162, and 163 for taking in air introduced into the fan duct 1, and ventilation holes 164, 165, and 167 for exhausting the air that has passed through the fan duct 1.

[0028] Ventilation holes 161, 162, and 163 are provided in the front cover 111, which forms the front of the housing 110. Ventilation hole 164 is provided in the rear cover 112, which forms the back of the housing 110. Ventilation holes 165 and 167 are provided in the I / O panel 113, which forms part of the back of the housing 110. The I / O panel 113 is equipped with connection terminals for various peripheral devices to the electronic device 100.

[0029] In the electronic device 100 of this embodiment, the I / O board 106 is positioned behind the CPU 102. Therefore, the exhaust port 12 of the fan duct 1 is separated into an upper exhaust port 121 that opens upward and a lower exhaust port 122 that opens downward so that the exhaust avoids the I / O board 106 (see Figures 1 and 2). Specifically, the exhaust port 12 is separated into the upper exhaust port 121 and the lower exhaust port 122 by the branching wall 13 shown in Figures 1 and 2.

[0030] (Intake fan arrangement structure) Figures 5 to 7 illustrate the arrangement of intake fans 3 and 4 in the fan duct 1. Figure 5 is a plan view showing an example of the arrangement of intake fans in the fan duct. Figure 6 is a front view showing an example of the arrangement of intake fans in the fan duct. Figure 7 is a side view showing an example of the arrangement of intake fans in the fan duct.

[0031] As shown in Figures 5 and 6, the intake fan 3 has multiple blades that rotate around a rotation axis 5. The intake fan 3 draws in air from the intake port 11 and discharges it from a first discharge surface 24. The first discharge surface 24 is a circular area with a diameter D. Similarly, the intake fan 4 has multiple blades that rotate around a rotation axis 6. The intake fan 4 draws in air from the intake port 11 and discharges it from a second discharge surface 25. The second discharge surface 25 is a circular area with a diameter D.

[0032] Intake fans 3 and 4 are the same size. The size of intake fans 3 and 4 is selected such that the sum of the diameters D of the first discharge surface 24 and the second discharge surface 25, 2D, is greater than the width W of the heatsink 2.

[0033] Furthermore, the first discharge surface 24 from which the intake fan 3 discharges air and the second discharge surface 25 from which the intake fan 4 discharges air are arranged symmetrically on the upstream side of the heatsink 2 with respect to a surface 30 that passes through the center position in the width direction of the heatsink 2 and is parallel to the fins 22.

[0034] More specifically, in Figure 5, the angle θ of the first discharge surface 24 relative to surface 30 and the angle θ of the second discharge surface 25 relative to surface 30 are set to be equal, and the angle (2θ) between the first discharge surface 24 and the second discharge surface 25 is set to be 90° or more. That is, the angle θ is set to be 45° or more.

[0035] Furthermore, the housing containing the intake fan 3 and the housing containing the intake fan 4 are in contact at the surface 30. Therefore, air discharged by the intake fan 3 and the intake fan 4 does not leak from between the housing containing the intake fan 3 and the housing containing the intake fan 4.

[0036] Furthermore, because the top plate 10, bottom plate 14, and side wall 7 are installed, the air discharged by the intake fan 3 from the first discharge surface 24 is guided to the heat sink 2 without leaking outside the fan duct 1. Also, because the top plate 10, bottom plate 14, and side wall 8 are installed, the air discharged by the intake fan 4 from the second discharge surface 25 is guided in a direction along the fins 22 of the heat sink 2 without leaking outside the fan duct 1.

[0037] By arranging the intake fans 3 and 4 in this manner within the housing 9 of the fan duct 1, the air introduced into the fan duct 1 is guided to the heatsink 2 without any leakage. Furthermore, since the sum of the diameters D of the first discharge surface 24 and the second discharge surface 25 is greater than the width W of the heatsink 2, more air can be guided between the fins 22 of the heatsink 2 compared to the case where only one intake fan is installed upstream of the fan duct 1. This makes it possible to improve the cooling performance of the heatsink 2 without increasing the size of the intake fans.

[0038] As shown in Figure 7, the air that passes between the fins 22 of the heatsink 2 reaches the branching wall 13. The branching wall 13 has an upper wall portion 131 and a lower wall portion 132. The upper wall portion 131 and the lower wall portion 132 are connected by an edge along the X-axis on the upstream side in the airflow direction. The upper wall portion 131 and the lower wall portion 132 are also inclined with respect to the airflow direction such that the distance between them increases as you move downstream in the airflow direction. The upper wall portion 131 guides the air that has passed between the fins 22 of the heatsink 2 diagonally upward and discharges it from the upper exhaust port 121. The lower wall portion 132 guides the air that has passed between the fins 22 of the heatsink 2 diagonally downward and discharges it from the lower exhaust port 122. In this way, the branching wall 13 guides the exhaust to avoid a certain area downstream of itself and branches the exhaust. Therefore, even if peripheral devices such as the I / O board 106 (see Figure 3) are located downstream of the branch wall 13, the cooling performance of the heatsink 2 will not be hindered.

[0039] (Another form of intake fan arrangement structure) Figures 8 and 9 illustrate another configuration of the arrangement of intake fans 3 and 4. Figure 8 is a plan view showing a second example of the arrangement of intake fans in a fan duct. Figure 9 is a plan view showing a third example of the arrangement of intake fans in a fan duct.

[0040] Figure 8 shows an example where intake fan 3 and intake fan 4 are both installed with an angle of deflection θ = 90°. That is, the angle between intake fan 3 and intake fan 4 (2θ) is set to 180°.

[0041] According to the arrangement shown in Figure 8, the air discharged by intake fan 3 and intake fan 4 is guided along the fins 22 of the heatsink 2 without leaking from the housing 9.

[0042] Figure 9 shows an example where intake fan 3 and intake fan 4 are both installed with an angle of deflection θ = 45°. That is, the angle between intake fan 3 and intake fan 4 (2θ) is 90°.

[0043] According to the arrangement shown in Figure 9, the air discharged by intake fans 3 and 4 is guided along the fins 22 of the heatsink 2 without leaking from the housing 9. However, if the angle θ is made even smaller, that is, if the angle between intake fans 3 and 4 (2θ) is made smaller than 90°, the collision between the air discharged from intake fan 3 and the air discharged from intake fan 4 inside the housing 9 will increase. This will cause turbulence in the airflow, which may reduce the amount of air guided along the fins 22 of the heatsink 2. Therefore, it is desirable to set the angle between intake fans 3 and 4 (2θ) to 90° or greater.

[0044] (Effects of the embodiment) As described above, the fan duct 1 (cooling device) of this embodiment comprises a heat sink 2 that dissipates heat generated from an electronic device 100 by passing air introduced from the outside between a plurality of fins 22, an intake fan 3 (first air blower) having a first discharge surface 24 that discharges air introduced from the outside toward the heat sink 2, an intake fan 4 (second air blower) having the same size as the intake fan 3 and a second discharge surface 25 that discharges air introduced from the outside toward the heat sink 2, and an exhaust port 12 that discharges the air that has passed between the fins 22 to the outside. The sum of the diameters D of the first discharge surface 24 and the diameters D of the second discharge surface 25 is greater than the width W of the heat sink 2, and the first discharge surface 24 and the second discharge surface 25 are arranged symmetrically with respect to a plane parallel to the fins 22, passing through the center position in the width direction of the heat sink 2 with a clamping angle (2θ) of 90 degrees or more on the upstream side of the fins 22. Therefore, it is possible to miniaturize the intake fan without reducing the amount of cooling air discharged. In addition, since the air drawn in by intake fan 3 and intake fan 4 can be guided in a direction along the fins 22 of the heatsink 2, the cooling performance of the heatsink 2 can be improved.

[0045] Furthermore, in the fan duct 1 (cooling device) of this embodiment, the space between the outer edge of the intake fan 3 (first air blower) and the outer edge of the heat sink 2 in the width direction, and the space between the outer edge of the intake fan 4 (second air blower) and the outer edge of the heat sink 2 in the width direction, are covered by a housing 9 having side walls 7, 8 (first wall portion) that restrict the airflow discharged from the first discharge surface 24 and the second discharge surface 25 so that it is directed toward the heat sink 2. Therefore, the air drawn in by the intake fan 3 and the intake fan 4 can be guided to the heat sink 2 without leaking from the housing 9. This improves the cooling performance of the heat sink 2.

[0046] Furthermore, in the fan duct 1 (cooling device) of this embodiment, the housing 9 further includes a top plate 10 that covers the gap between at least a portion of the upper part of the heatsink 2 and the intake fan 3 (first air blower) and intake fan 4 (second air blower). Therefore, the air drawn in by the intake fan 3 and intake fan 4 can be guided to the heatsink 2 without leaking from the housing 9. This improves the cooling performance of the heatsink 2.

[0047] (Modified examples of the embodiment) A modified example of the fan duct 1 described above will be explained using Figures 10 to 13. Figure 10 is a plan view showing an example of the arrangement of the suction fan in the modified fan duct of the embodiment.

[0048] The fan duct 1 shown in Figure 10, compared to the fan duct 1 shown in Figure 5, includes a partition wall 15 between the inner edges of the intake fan 3 (first air blower) and intake fan 4 (second air blower) and the center of the heat sink 2 in the width direction, which guides the air discharged from the first discharge surface 24 and the second discharge surface 25 to the heat sink 2 without mixing. The partition wall 15 is formed, for example, by raising ribs from the top plate 10 (see Figure 2) in the negative Z-axis direction. Alternatively, the partition wall 15 may be formed, for example, by raising ribs from the bottom plate 14 (see Figure 2) in the positive Z-axis direction. Note that the partition wall 15 is an example of the second wall portion in this disclosure.

[0049] In this way, by installing the partition wall 15, the air discharged from the first discharge surface 24 and the air discharged from the second discharge surface 25 do not come into contact with each other and therefore do not affect one another. As a result, the air drawn in by the intake fan 3 and the air drawn in by the intake fan 4 are reliably guided in a direction along the fins 22 of the heatsink 2.

[0050] Figure 11 is a plan view showing a second example of the arrangement of intake fans in a fan duct of a modified embodiment. Figure 11 shows an example in which intake fans 3 and 4 are both installed with an angle θ = 90°. That is, the angle (2θ) between intake fans 3 and 4 is set to 180°. A partition wall 15 is installed between the inner edges of intake fans 3 and 4 and the center of the heat sink 2 in the width direction, to guide the air discharged from the first discharge surface 24 and the second discharge surface 25 to the heat sink 2 without mixing.

[0051] According to the arrangement in Figure 11, similar to the arrangement in Figure 10, the air discharged by intake fan 3 and intake fan 4 is guided along the fins 22 of the heatsink 2 without mixing with each other.

[0052] Figure 12 is a plan view showing a third example of the arrangement of intake fans in a fan duct of a modified embodiment. Figure 12 shows an example in which intake fan 3 and intake fan 4 are both installed with an angle θ = 40°. That is, the angle (2θ) between intake fan 3 and intake fan 4 is set to 90°. A partition wall 15 is installed between the inner edges of intake fan 3 and intake fan 4 and the center of the heat sink 2 in the width direction, to guide the air discharged from the first discharge surface 24 and the second discharge surface 25 to the heat sink 2 without mixing.

[0053] According to the arrangement shown in Figure 12, similar to the arrangement shown in Figure 10, the air discharged by intake fan 3 and intake fan 4 is guided in a direction along the fins 22 of the heatsink 2 without mixing with each other. However, if the angle θ is made even smaller, that is, if the angle between intake fan 3 and intake fan 4 (2θ) is made smaller than 90°, the air discharged by intake fan 3 will hit the partition wall 15, causing turbulence in the airflow. Similarly, the air discharged by intake fan 4 will hit the partition wall 15, causing turbulence in the airflow. This may reduce the amount of air guided in a direction along the fins 22 of the heatsink 2. Therefore, it is desirable to set the angle between intake fan 3 and intake fan 4 (2θ) to 90° or greater.

[0054] Figure 13 is a plan view showing a fourth example of the arrangement of intake fans in a fan duct of a modified embodiment. Figure 13 shows an example in which intake fans 3 and 4 are installed with an angle θ exceeding 90°. That is, the angle (2θ) between intake fans 3 and 4 is set to be greater than 180°. Partition walls 16 and 17 are installed between the inner edges of intake fans 3 and 4 and the center of the heat sink 2 in the width direction, to guide the air discharged from the first discharge surface 24 and the second discharge surface 25 to the heat sink 2 without mixing them. Partition wall 16 is installed between the inner edge of intake fan 3 and the center of the heat sink 2 in the width direction, and guides the air discharged from the first discharge surface 24 in a direction along the fins 22 of the heat sink 2 without mixing it with the air discharged from the second discharge surface 25. The partition wall 17 is installed between the inner edge of the intake fan 4 and the center of the heat sink 2 in the width direction, and guides the air discharged from the second discharge surface 25 along the fins 22 of the heat sink 2 without mixing it with the air discharged from the first discharge surface 24.

[0055] In Figure 13, the side wall 7 and the partition wall 16 are formed in a curved shape so as not to disturb the airflow discharged from the first discharge surface 24 and guide it to the heat sink 2. Also, the side wall 8 and the partition wall 17 are formed in a curved shape so as not to disturb the airflow discharged from the second discharge surface 25 and guide it to the heat sink 2.

[0056] (Effects of modified embodiments of the embodiment) As described above, the modified fan duct 1 (cooling device) of this embodiment includes a partition wall 15 (second wall portion) between the inner edges of the intake fan 3 (first air blowing portion) and the intake fan 4 (second air blowing portion) and the center of the heat sink 2 in the width direction, which guides the air discharged from the first discharge surface 24 and the second discharge surface 25 to the heat sink 2 without mixing. Therefore, the air drawn in by the intake fan 3 and the intake fan 4 can be guided to the heat sink 2 without mixing. This prevents interference between the air drawn in by the two intake fans, thereby improving the cooling performance of the heat sink 2.

[0057] Although embodiments of the present invention have been described above, these embodiments are illustrative and are not intended to limit the scope of the invention. This novel embodiment can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0058] 1. Fan duct (cooling device) 2 Heatsinks 3. Intake fan (first air blower) 4. Intake fan (second air blower) 5,6 Rotation axis 7,8 Side walls (first wall section) 9 cabinets 10 Top plate 11 Air intake 12 Exhaust vents 13 Branch Wall 14 Bottom plate 15, 16, 17 Partition wall (second wall section) 18 Side wall 22 fins 24 First discharge surface 25 Second discharge surface 30 sides 100 Electronic equipment 106 I / O board 110 cabinets 121 Upper exhaust port 122 Lower exhaust port 131 Upper wall section 132 Lower wall part D diameter W width θ declination [Prior art documents] [Patent Documents]

[0059] [Patent Document 1] Japanese Patent Publication No. 2003-283171

Claims

1. A heat sink that dissipates heat generated by electronic devices by passing air introduced from the outside through multiple fins, A first air blower having a first discharge surface that discharges air introduced from the outside toward the heat sink, A second air blower having the same size as the first air blower and a second discharge surface that discharges air introduced from the outside toward the heat sink, An exhaust port for discharging the air that has passed between the fins to the outside, The heat sink is provided with a top plate that covers the gap between at least a portion of the upper part of the heat sink and the first and second air blowers, The sum of the diameters of the first discharge surface and the second discharge surface is greater than the width of the heat sink, and the first discharge surface and the second discharge surface are arranged symmetrically with respect to a plane parallel to the fin, passing through the center position in the width direction of the heat sink, with an angle of 90 degrees or more between them on the upstream side of the fin. The exhaust port is equipped with a branching wall that splits the air that has passed between the fins of the heat sink into an upper exhaust port and a lower exhaust port, so as to avoid a portion of the area downstream of itself. Cooling device for electronic equipment.

2. The space between the outer edge of the first air blower and the outer edge of the heat sink in the width direction, and the space between the outer edge of the second air blower and the outer edge of the heat sink in the width direction, are covered by a housing having a first wall portion that restricts the airflow discharged from the first discharge surface and the second discharge surface to be directed toward the heat sink. Cooling device for electronic equipment according to claim 1.

3. Between the inner edges of the first and second air blowers and the central position in the width direction of the heat sink, there is a second wall portion that guides the air discharged from the first and second discharge surfaces to the heat sink without mixing them. Cooling device for electronic equipment according to claim 2.

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