Preparation method of hyperbolic photovoltaic module and hyperbolic photovoltaic module

Abstract

The invention relates to the technical field of semiconductors, and discloses a preparation method of a hyperbolic photovoltaic module and the hyperbolic photovoltaic module, and the method comprises the steps: providing a mold and a first module; one of the first assembly and the mold is a hyperboloid, and the other one is a plane; temporarily bonding the first assembly on the mold; the shape of the first assembly changes along with the shape of the mold and is kept; performing film processing and / or packaging process on the first assembly to form a second assembly; the mold is removed, and a second assembly with the double curved surfaces is obtained; the hyperbolic photovoltaic module is formed; wherein the first assembly is a solar cell, or the second assembly is a solar cell. The curvature radius of the hyperbolic photovoltaic module is reduced to 4 m or below, meanwhile, the yield of curved surface products can be greatly improved, and the light weight of the module products is kept.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and specifically to a method for preparing a hyperbolic photovoltaic module and the hyperbolic photovoltaic module itself. Background Technology

[0002] Curved (hyperbolic or spherical) photovoltaic modules have broad application prospects in the automotive and construction sectors. For example, they can be used to manufacture automotive photovoltaic (PV) roof products, simultaneously achieving dimming and heating, as well as PV power generation. Currently, traditional crystalline silicon and perovskite cells are generally formed into hyperbolic photovoltaic modules using a hot-bending glass curvature encapsulation process, which has many limitations and defects. The hot-bending glass curvature encapsulation process for crystalline silicon cells suffers from incomplete bonding between the silicon wafer and the hot-bent glass, mutual compression or pulling of the leads between silicon wafers, and low yield rates. Curved perovskite cell products also suffer from complex manufacturing processes, high costs, and short lifespans.

[0003] For cadmium telluride thin-film batteries on rigid glass substrates, a common process for forming hyperbolic photovoltaic modules involves first fabricating the thin-film module (glass-based thin-film battery / encapsulant film / glass structure) on a planar glass substrate, followed by cold bending into a hyperbolic shape. The main problem with this approach is that the deformation during cold bending of the rigid glass substrate cannot be too large; otherwise, excessive stress from the cold bending can cause the glass substrate to break. Typically, the radius of curvature needs to be controlled above 7m. However, most automotive glass products have a minimum radius of curvature of 4-5m or less, which cannot meet market demands. Furthermore, when cold bending a planar module into a hyperbolic shape, the rigid glass substrate primarily undergoes elastic deformation, leading to springback issues. Alternatively, using a planar rigid glass-based thin-film battery / encapsulant film / 5-10mm hot-bent glass solution is a potential improvement (the thickness of the hot-bent backsheet is twice or more than that of the thin-film battery substrate to achieve cold bending into a hyperbolic shape). However, this significantly increases the thickness and overall weight of the hyperbolic photovoltaic module, which is detrimental to automotive photovoltaic applications.

[0004] Therefore, a solution is needed to reduce the radius of curvature to 4m or less without increasing the thickness and weight of hyperbolic photovoltaic modules, while improving the yield of curved photovoltaic products. Summary of the Invention

[0005] This invention provides a method for preparing hyperbolic photovoltaic modules and a hyperbolic photovoltaic module, in order to solve the problems of large radius of curvature, high thickness and weight of hyperbolic photovoltaic modules, and low yield of curved photovoltaic products in the related technology.

[0006] In a first aspect, the present invention provides a method for preparing a hyperbolic photovoltaic module, the method comprising: A mold and a first component are provided; one of the first component and the mold is a hyperboloid, and the other is a plane; The first component is temporarily bonded to the mold; the shape of the first component follows and remains consistent with the shape of the mold. The first component is subjected to film layer processing and / or encapsulation processes to form the second component; Remove the mold; obtain the second component of the hyperboloid. Forming hyperbolic photovoltaic modules; The first component is a solar cell, or the second component is a solar cell.

[0007] The method for fabricating a hyperbolic photovoltaic module provided by this invention involves first temporarily bonding a first module to a mold, the shape of the first module following and maintaining the shape of the mold; then performing a film layering process and / or encapsulation process on the first module to form a second module; finally, removing the mold to obtain a hyperbolic second module. On the one hand, performing a film layering process and / or encapsulation process on the first module to form the second module, and removing the mold to obtain a hyperbolic second module, avoids damage to the hyperbolic photovoltaic module caused by traditional hot bending processes, thereby improving the yield of the hyperbolic photovoltaic module. It also avoids the limitation of the mold on the module thickness, effectively reducing the thickness and weight of the hyperbolic photovoltaic module. On the other hand, since one of the first module and the mold is hyperbolic and the other is planar, the minimum achievable radius of curvature of the hyperbolic photovoltaic module can be reduced by controlling the radius of curvature of the first module or the mold, improving the flexibility of process design. Different encapsulation schemes can be selected according to requirements, simplifying the encapsulation process and reducing complexity.

[0008] In one alternative embodiment, the first component is a hyperboloid; the mold is flat; the first component is adapted to be obtained through a hot bending process; and the second component is a solar cell. In the step of temporarily attaching the first component to the mold, the first component changes from a hyperboloid to a flat surface following the mold and remains there; After removing the mold, the second component restores its hyperboloid shape; The steps involved in forming a hyperbolic photovoltaic module include: After the second component and the first encapsulation substrate are stacked and encapsulated, a hyperbolic photovoltaic module is formed; the first encapsulation substrate is a hyperbolic surface.

[0009] In one alternative embodiment, the second component is a cadmium telluride thin-film battery; the cadmium telluride thin-film battery includes a front glass panel and a cadmium telluride functional layer on its surface. The steps involved in forming a hyperbolic photovoltaic module include: The second component, the first encapsulating film, and the first encapsulating substrate are sequentially stacked and then laminated to form a hyperbolic photovoltaic module. The first encapsulating film is located on the side surface of the cadmium telluride functional layer that is away from the front glass, and is used to bond the cadmium telluride thin-film battery and the first encapsulating substrate.

[0010] In one optional embodiment, the first component is a cadmium telluride battery intermediate; the cadmium telluride battery intermediate includes a stacked front panel glass, a transparent conductive layer and a cadmium telluride layer; and a P1 laser groove and a P2 laser groove penetrating the transparent conductive layer and the cadmium telluride layer; the P1 laser groove is filled with insulating material, and the P2 laser groove is unfilled; The first component is subjected to a membrane layer processing process to form the second component; The steps of forming the second component include: A back electrode layer and a P3 laser groove are formed on a cadmium telluride battery intermediate to obtain a cadmium telluride thin film battery; the cadmium telluride functional layer includes a transparent conductive layer, a cadmium telluride layer and a back electrode layer.

[0011] The method for fabricating hyperbolic photovoltaic modules provided by this invention utilizes a planar mold to form and hold a hyperbolic cadmium telluride (CdTe) battery intermediate, followed by the fabrication of the back electrode layer and P3 laser groove. On one hand, the CdTe battery intermediate can be thermally bent to form a hyperbolic surface before forming the back electrode layer, avoiding the obstruction and influence of the back electrode layer on the thermal bending process, improving the effectiveness of the thermal bending process, effectively reducing the achievable minimum radius of curvature, and increasing the design flexibility of the curved CdTe thin-film module. On the other hand, forming the back electrode layer and P3 laser groove in a planar state improves the process accuracy of back electrode layer coating and P3 laser etching, reduces process difficulty, and avoids the challenges of curved surface coating and laser etching in thermally bent hyperbolic samples. Therefore, the method for fabricating hyperbolic photovoltaic modules provided by this invention can effectively reduce the achievable minimum radius of curvature of photovoltaic modules, improve the design flexibility and reliability of curved CdTe thin-film modules, and effectively meet the needs of automotive glass products.

[0012] In one optional embodiment, the second component is a cadmium telluride thin-film battery; the cadmium telluride thin-film battery includes a second encapsulation glass, a cadmium telluride functional layer, and a front panel glass stacked sequentially. The steps involved in forming a hyperbolic photovoltaic module include: The second component, the first encapsulating film, and the first encapsulating substrate are sequentially stacked and then laminated to form a hyperbolic photovoltaic module. The first encapsulating film is located on the side of the front glass facing away from the cadmium telluride functional layer and is used to bond the cadmium telluride thin-film battery and the first encapsulating substrate.

[0013] In one alternative implementation, the first component is a second packaging substrate; The first component is sequentially encapsulated and processed with a film layer to form the second component; The steps for forming the second component include: Provides a planar initial cadmium telluride thin-film battery; the initial cadmium telluride thin-film battery includes an initial front panel glass and a cadmium telluride functional layer on its surface. The mold, the second encapsulation substrate, the second encapsulation film, and the initial cadmium telluride thin-film battery are sequentially stacked and encapsulated using an encapsulation process; wherein, the second encapsulation film is located on the side surface of the cadmium telluride functional layer that is opposite to the front panel glass, and is used to bond the initial cadmium telluride thin-film battery and the second encapsulation substrate. The initial front panel glass is thinned to 0.1mm~1mm using a chemical processing technique to obtain the front panel glass; the second encapsulation substrate, the second encapsulation film, the cadmium telluride functional layer and the front panel glass constitute a cadmium telluride thin film battery.

[0014] The present invention provides a method for fabricating a hyperbolic photovoltaic module. This method involves using a planar mold to form and hold a second encapsulation substrate, then encapsulating an initial cadmium telluride (CdTe) thin-film battery onto the second encapsulation substrate using an encapsulation process. Next, the front glass is thinned to obtain the CdTe thin-film battery (i.e., the second module), and finally, it is encapsulated with a hyperbolic first encapsulation substrate to obtain the hyperbolic photovoltaic module. On one hand, using a planar mold to form and hold the second encapsulation substrate simplifies the encapsulation process and reduces the encapsulation difficulty between the curved second encapsulation substrate and the initial CdTe thin-film battery. Furthermore, during the thinning of the front glass, the second encapsulation substrate can protect the CdTe function from damage, thereby improving the yield of the photovoltaic module. On the other hand, thinning the front glass reduces the thickness of the CdTe thin-film battery, thus reducing the thickness and weight of the hyperbolic photovoltaic module. Simultaneously, the curvature radius of the hyperbolic photovoltaic module is mainly controlled by the thinner first and second encapsulation substrates, further reducing the minimum achievable curvature radius of the photovoltaic module, improving the design flexibility and reliability of the hyperbolic photovoltaic module, and effectively meeting the needs of automotive glass products.

[0015] In one alternative embodiment, the mold is hyperboloidal; the first component is planar; the mold is adapted to be obtained by a hot bending process; the first component is a solar cell; the solar cell includes a stacked front glass panel and a cell functional layer; In the step of temporarily attaching the first component to the mold, the first component changes from a flat surface to a hyperboloid following the mold and remains there; The first component is encapsulated to form the second component; The steps involved in the packaging process to form the second component include: A first encapsulating film and a first encapsulating substrate are sequentially disposed on the side surface of the first component facing away from the mold, and the second component is obtained after pressing and encapsulation; the first encapsulating substrate is a hyperboloid; the first encapsulating film is located on the side surface of the battery functional layer facing away from the front panel glass, and is used to bond the first component and the first encapsulating substrate. After the mold removal process, the second component of the hyperboloid is the hyperboloid photovoltaic module.

[0016] The method for fabricating a hyperbolic photovoltaic module provided by this invention involves first temporarily bonding a curved mold to one side of the front glass of a flat solar cell to achieve and maintain the hyperbolic shape of the solar cell. Then, the cell functional layer of the solar cell is encapsulated with a first encapsulation substrate. Finally, the curved mold is removed to obtain the hyperbolic photovoltaic module. On the one hand, this method can effectively reduce the thickness and weight of the hyperbolic photovoltaic module and lower the minimum achievable radius of curvature. On the other hand, the encapsulation process is basically the same as the conventional curved double-glass encapsulation process and equipment, which can greatly simplify the encapsulation process and reduce its complexity.

[0017] In one alternative implementation, the step of temporarily attaching the first component to the mold includes: The first component and the mold are bonded together using an adhesive. Maintain adhesive pressure until the adhesive cures to form an adhesive layer; The process of removing the mold includes: removing the adhesive layer and the mold.

[0018] In one alternative embodiment, the peel strength of the adhesive layer is greater than 0.5 MPa; The step of temporarily attaching the first component to the mold includes: An interface layer is formed on the first surface of the first component; The interface layer and the mold are bonded together using an adhesive layer; the adhesive layer is located between the interface layer and the mold. The bonding force between the interface layer and the second component is less than the bonding force between the interface layer and the adhesive layer; The mold removal process includes: removing the interface layer, adhesive layer, and mold.

[0019] In one alternative implementation, the step of forming an interface layer on the first surface of the first component further includes: The first surface of the first component is cleaned and plasma modified; The bonding force between the interface layer and the first component is 1N~200N; the material of the interface layer is MgTe, ZnO, SiO2, Mo, Si3N4, ZrO2, Nb2O5 or MgZnO, and the thickness of the interface layer is 10nm~200nm. The steps for removing the mold include: One or more of the following processes are used to remove the adhesive layer and mold: heating modification, solution immersion, and mechanical peeling.

[0020] In one alternative embodiment, the mold is made of glass or stainless steel; The thickness of the mold is twice or more than the thickness of the first component.

[0021] In a second aspect, the present invention provides a hyperbolic photovoltaic module, which is prepared according to the preparation method of the hyperbolic photovoltaic module described in the first aspect above. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a schematic flowchart of a method for preparing a hyperbolic photovoltaic module according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the specific process of a method for preparing a hyperbolic photovoltaic module according to Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the mold structure according to Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the structure of the first component according to Embodiment 1 of the present invention; Figure 5 This is a schematic diagram of the structure forming the interface layer according to Embodiment 1 of the present invention; Figure 6 This is a schematic diagram of the structure in Embodiment 1 of the present invention, in which the mold and the first component are temporarily bonded together; Figure 7 This is a schematic diagram of the structure forming the second component according to Embodiment 1 of the present invention; Figure 8 This is a schematic diagram of the structure of a hyperbolic photovoltaic module formed according to Embodiment 1 of the present invention; Figure 9 This is a schematic diagram of the specific process of a method for preparing a hyperbolic photovoltaic module according to Embodiment 2 of the present invention; Figure 10 This is a schematic diagram of the mold structure according to Embodiment 2 of the present invention; Figure 11 This is a schematic diagram of the structure of the first component according to Embodiment 2 of the present invention; Figure 12 This is a schematic diagram of the structure in Embodiment 2 of the present invention, in which the mold and the first component are temporarily bonded together; Figure 13 This is a schematic diagram of the structure forming the second component according to Embodiment 2 of the present invention; Figure 14This is a schematic diagram of the structure of the second component forming the hyperboloid according to Embodiment 2 of the present invention; Figure 15 This is a schematic diagram of the structure of a hyperbolic photovoltaic module formed according to Embodiment 2 of the present invention; Figure 16 This is a schematic diagram of the specific process of a method for preparing a hyperbolic photovoltaic module according to Embodiment 2 of the present invention; Figure 17 This is a schematic diagram of the mold structure according to Embodiment 2 of the present invention; Figure 18 This is a schematic diagram of the structure of the first component according to Embodiment 2 of the present invention; Figure 19 This is a schematic diagram of the structure in Embodiment 2 of the present invention, in which the mold and the first component are temporarily bonded together; Figure 20 This is a schematic diagram of the structure of packaging the initial cadmium telluride thin-film battery and the second packaging substrate together according to Embodiment 2 of the present invention. Figure 21 This is a schematic diagram of the structure of the second component formed after thinning the initial front glass according to Embodiment 2 of the present invention; Figure 22 This is a schematic diagram of the structure of the second component forming the hyperboloid according to Embodiment 2 of the present invention; Figure 23 This is a schematic diagram of the structure of a hyperbolic photovoltaic module formed according to Embodiment 2 of the present invention.

[0024] Figure label: 10. Mold; 11. Adhesive layer; 110. Adhesive; 20. Cadmium telluride thin-film battery; 21. Front panel glass; 22. Cadmium telluride functional layer; 30. Interface layer; 41. First encapsulating film; 42. Second encapsulating film; 51. First encapsulation substrate; 52. Second encapsulation substrate; 100. First module; 200. Second module; 300. Hyperbolic photovoltaic module; 221. Transparent conductive layer; 222. Cadmium telluride layer; 223. Back electrode layer; 210. Initial front panel glass. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the invention and not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0026] In the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present invention. Various structural schematic diagrams according to embodiments of the present invention are shown in the accompanying drawings. These drawings are not to scale, and some details are enlarged for clarity, and some details may be omitted. The shapes of the various regions and layers shown in the drawings, as well as their relative sizes and positional relationships, are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art can design regions / layers with different shapes, sizes, and relative positions as needed. In the context of the present invention, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element, or there may be an intermediate layer / element between them. Additionally, if a layer / element is "on" another layer / element in one orientation, then when the orientation is reversed, the layer / element may be "below" the other layer / element.

[0027] Curved (hyperbolic or spherical) photovoltaic modules have broad application prospects in the automotive and construction sectors. For example, they can be used to manufacture automotive photovoltaic roof products, simultaneously achieving dimming and heating control as well as photovoltaic power generation. However, mature hyperbolic photovoltaic module products and processes are not yet available on the market.

[0028] On the one hand, the curved surface forming process for crystalline silicon solar cells, as well as cadmium telluride thin-film batteries deposited on rigid glass substrates (2-4mm), is limited and has a low yield. For crystalline silicon cells, a typical structure is hot-bent glass / film / series / parallel cell strings / film / hot-bent glass, where hot-bent glass, film, crystalline silicon cell strings, film, and hot-bent glass are sequentially laid for curved encapsulation. Due to the inherent brittleness of silicon wafers and the inability to fully bond with the hot-bent glass, localized areas of the silicon wafer experience preferential stress and high stress during encapsulation, making them prone to microcracks and breakage. Furthermore, the incomplete bonding and gaps between the silicon wafer and the hot-bent glass cause displacement of the silicon wafer during encapsulation, leading to mutual compression or pulling of the leads, further reducing product yield.

[0029] On the other hand, copper indium gallium selenide (CIGS) and perovskite thin-film batteries deposited on flexible substrates (such as 0.1~0.5 mm thin glass, 50 μm stainless steel or PET) typically employ a hot-bent glass / film / flexible battery / film / hot-bent glass structure for their curved products; this results in complex manufacturing processes and high costs. Furthermore, the poor long-term stability and short lifespan of perovskite thin-film batteries further limit their applications.

[0030] Therefore, cadmium telluride thin-film batteries are generally chosen for manufacturing automotive photovoltaic (PV) roof products. Currently, a feasible approach for cadmium telluride thin-film batteries on rigid glass substrates is to first fabricate the thin-film module (glass-based thin-film battery / encapsulant film / glass structure) on a planar glass substrate, and then cold-bend it into a hyperboloid shape. The main problem is that the deformation during cold bending of the rigid glass substrate should not be too large; otherwise, excessive stress from the cold bending will cause the glass substrate to break. Typically, the radius of curvature needs to be controlled above 7m. However, most automotive glass products have a minimum curvature radius of 4-5m or less, which cannot meet market demands. Furthermore, when cold-bending planar modules into hyperboloid shapes, the rigid glass substrate primarily undergoes elastic deformation, leading to springback issues. Alternatively, using a planar rigid glass-based thin-film battery / encapsulant film / 5-10mm hot-bent glass scheme is a potential improvement (the hot-bent backsheet thickness is twice or more than that of the thin-film battery substrate to achieve cold bending into a hyperboloid shape). However, this significantly increases the overall weight of the hyperboloid photovoltaic module, which is not conducive to automotive PV applications.

[0031] Therefore, a solution is needed to reduce the radius of curvature to 4m or less without increasing the thickness and weight of hyperbolic photovoltaic modules, while improving the yield of curved photovoltaic products.

[0032] This application provides a hyperbolic photovoltaic module product and its manufacturing method, which improves the manufacturing process and method of hyperbolic photovoltaic module products based on rigid glass substrate cadmium telluride thin-film batteries, reduces the radius of curvature to 4m or less, and at the same time significantly improves the yield of curved products while maintaining a lighter weight of the module products.

[0033] like Figure 1 As shown, this embodiment provides a method for preparing a hyperbolic photovoltaic module, which includes, but is not limited to, steps S101 to S105.

[0034] Step S101: Provide mold 10 and first component 100; one of the first component 100 and mold 10 is a hyperboloid and the other is a plane.

[0035] In step S102, the first component 100 is temporarily bonded to the mold 10; the shape of the first component 100 follows the shape change of the mold 10 and remains thereafter.

[0036] Step S103: Perform a film layer processing and / or encapsulation process on the first component 100 to form the second component 200; wherein the first component 100 is a solar cell, or the second component 200 is a solar cell.

[0037] Step S104: Remove mold 10; obtain the second component 200 of hyperboloid.

[0038] Step S105, forming hyperbolic photovoltaic module 300.

[0039] The method for fabricating a hyperbolic photovoltaic module provided in this embodiment involves first temporarily bonding a first module to a mold, with the shape of the first module following and maintaining the shape of the mold; then performing a film layering process and / or encapsulation process on the first module to form a second module; finally, removing the mold to obtain a hyperbolic second module. On the one hand, performing a film layering process and / or encapsulation process on the first module to form the second module, and removing the mold to obtain a hyperbolic second module, can avoid damage to the hyperbolic photovoltaic module caused by the traditional hot bending process, thereby improving the yield of the hyperbolic photovoltaic module. At the same time, it can also avoid the limitation of the mold on the module thickness, effectively reducing the thickness and weight of the hyperbolic photovoltaic module. On the other hand, since one of the first module and the mold is hyperbolic and the other is planar, the minimum achievable radius of curvature of the hyperbolic photovoltaic module can be reduced by controlling the radius of curvature of the first module or the mold, improving the flexibility of process design. Different encapsulation schemes can be selected according to requirements, simplifying the encapsulation process and reducing complexity.

[0040] In some alternative embodiments, the first component 100 is a hyperboloid; the mold 10 is a plane; the first component 100 is adapted to be obtained by a hot bending process; and the second component 200 is a solar cell. In the step of temporarily attaching the first component 100 to the mold 10, the first component 100 changes from a hyperboloid to a flat surface following the mold 10 and remains there; After removing mold 10, the second component 200 restores the hyperboloid surface; The steps involved in forming the hyperbolic photovoltaic module 300 include: After the second component 200 and the first encapsulation substrate 51 are stacked and encapsulated, a hyperbolic photovoltaic module 300 is formed; the first encapsulation substrate 51 is a hyperbolic surface.

[0041] In some alternative implementations, the first packaging substrate 51 is hot-bent hyperbolic glass.

[0042] In some alternative implementations, the solar cell is a cadmium telluride thin-film cell, a crystalline silicon cell, or a perovskite cell, etc.

[0043] In some alternative embodiments, the second component 200 is a cadmium telluride thin-film battery 20; the cadmium telluride thin-film battery 20 includes a front glass panel 21 and a cadmium telluride functional layer 22 on its surface. The steps involved in forming the hyperbolic photovoltaic module 300 include: The second component 200, the first encapsulating film 41 and the first encapsulating substrate 51 are stacked in sequence and then laminated to form a hyperbolic photovoltaic module 300. The first encapsulating film 41 is located on the side surface of the cadmium telluride functional layer 22 that is away from the front panel glass 21, and is used to bond the cadmium telluride thin film battery 20 and the first encapsulating substrate 51.

[0044] In some optional embodiments, the first component 100 is a cadmium telluride battery intermediate; the cadmium telluride battery intermediate includes a stacked front panel glass 21, a transparent conductive layer 221 and a cadmium telluride layer 222; and a P1 laser groove and a P2 laser groove penetrating the transparent conductive layer 221 and the cadmium telluride layer 222; the P1 laser groove is filled with insulating material, and the P2 laser groove is unfilled; The first component 100 is subjected to a membrane layer processing process to form the second component 200; The steps of forming the second component 200 include: A back electrode layer 223 and a P3 laser groove are formed on a cadmium telluride battery intermediate to obtain a cadmium telluride thin film battery 20; the cadmium telluride functional layer 22 includes a transparent conductive layer 221, a cadmium telluride layer 222 and a back electrode layer 223.

[0045] In specific implementation, the first component 100 is subjected to a film layer processing process in sequence to form the second component 200. The film layer processing process refers to the process of forming the back electrode layer 223 and the P3 laser groove.

[0046] In some alternative implementations, the hot bending process is 560°C. o C~650 o C. Hot bending hyperboloid forming; the thickness of the cadmium telluride battery intermediate is 2mm~4mm; the minimum radius of curvature of the cadmium telluride battery intermediate is 3m.

[0047] In related technologies, the intermediate body of cadmium telluride battery is generally subjected to hyperbolic hot bending, followed by curved back electrode deposition and curved third laser etching processes. However, this approach is technically challenging, and the precision of the resulting back electrode and P3 laser groove is poor. Currently, there are no mature large-area curved coating and curved laser etching equipment and processes on the market.

[0048] The hyperbolic photovoltaic module fabrication method provided in this embodiment utilizes a planar mold to form and hold a hyperbolic cadmium telluride (CdTe) battery intermediate, followed by the fabrication of the back electrode layer and P3 laser groove. On one hand, the CdTe battery intermediate can be thermally bent to form a hyperbolic surface before the back electrode layer is formed, avoiding the obstruction and influence of the back electrode layer on the thermal bending process, improving the effectiveness of the thermal bending process, effectively reducing the achievable minimum radius of curvature, and increasing the design flexibility of the curved CdTe thin-film module. On the other hand, forming the back electrode layer and P3 laser groove in a planar state improves the process accuracy of back electrode layer coating and P3 laser etching, reduces process difficulty, and avoids the challenges of curved surface coating and laser etching in thermally bent hyperbolic samples. Therefore, the hyperbolic photovoltaic module fabrication method provided in this embodiment can effectively reduce the achievable minimum radius of curvature of photovoltaic modules, improve the design flexibility and reliability of curved CdTe thin-film modules, and effectively meet the needs of automotive glass products.

[0049] In some alternative embodiments, the second component 200, namely the cadmium telluride thin-film battery 20, has a radius of curvature of 3m to 4m; the formed hyperbolic photovoltaic module 300 has a radius of curvature of 3m to 4m.

[0050] The method for preparing hyperbolic photovoltaic modules provided in this embodiment can achieve a curvature radius of 3m to 4m for hyperbolic photovoltaic modules 300, that is, a minimum curvature radius as low as 3m.

[0051] In some alternative embodiments, the second component 200 is a cadmium telluride thin-film battery 20; the cadmium telluride thin-film battery 20 includes a second encapsulation glass, a cadmium telluride functional layer 22 and a front panel glass 21 stacked sequentially. The steps involved in forming the hyperbolic photovoltaic module 300 include: The second component 200, the first encapsulating film 41 and the first encapsulating substrate 51 are stacked in sequence and then laminated to form a hyperbolic photovoltaic module 300. The first encapsulating film 41 is located on the side of the front glass 21 facing away from the cadmium telluride functional layer 22 and is used to bond the cadmium telluride thin film battery 20 and the first encapsulating substrate 51.

[0052] In some alternative implementations, the first component 100 is the second packaging substrate 52; The first component 100 is sequentially encapsulated and coated to form the second component 200.

[0053] In some alternative embodiments, the steps of performing encapsulation and film layer processing to form the second component 200 include: Provides a planar initial cadmium telluride thin-film battery; the initial cadmium telluride thin-film battery includes an initial front panel glass 210 and a cadmium telluride functional layer 22 on its surface; The mold 10, the second encapsulation substrate 52, the second encapsulation film 42 and the initial cadmium telluride thin film battery are sequentially stacked and encapsulated using an encapsulation process; wherein, the second encapsulation film 42 is located on the side surface of the cadmium telluride functional layer 22 that is opposite to the front panel glass 21, and is used to bond the initial cadmium telluride thin film battery and the second encapsulation substrate 52. The initial front panel glass 210 is thinned to 0.1mm~1mm using a chemical processing process to obtain the front panel glass 21; the second encapsulation substrate 52, the second encapsulation film 42, the cadmium telluride functional layer 22 and the front panel glass 21 constitute the cadmium telluride thin film battery 20.

[0054] In specific implementation, the first component 100 is sequentially encapsulated and film-layered to form the second component 200. The encapsulation process refers to the process of sequentially stacking and encapsulating the mold 10, the second encapsulation substrate 52, the second encapsulation film 42, and the initial cadmium telluride thin-film battery; the film-layering process refers to the process of thinning the initial front panel glass 210.

[0055] In some alternative embodiments, after removing the mold 10, a planar second component 200 is obtained since the second adhesive film has been cured.

[0056] In some embodiments, after removing the mold 10, the material is heated to a first temperature to melt the second encapsulation film 42 within the planar second component 200. The cadmium telluride thin-film battery 20 then recovers its hyperbolic shape along with the second encapsulation substrate 52 to obtain the hyperbolic second component 200, which is subsequently encapsulated to form a hyperbolic photovoltaic module 300.

[0057] In some other embodiments, after removing the mold 10, the planar second component 200, the first encapsulating film 41 and the first encapsulating substrate 51 are directly stacked in sequence and pressed and encapsulated at a first temperature. During the encapsulation process, the second encapsulating film 42 inside the second component 200 melts and restores the hyperbolic shape to obtain the hyperbolic second component 200. After encapsulation, the hyperbolic photovoltaic module 300 is obtained.

[0058] In some implementations, the first temperature is 100°C to 150°C.

[0059] The method for fabricating a hyperbolic photovoltaic module provided in this embodiment involves using a planar mold to form and hold a second encapsulation substrate, then encapsulating an initial cadmium telluride thin-film battery on the second encapsulation substrate using an encapsulation process. Next, the front glass is thinned to obtain the cadmium telluride thin-film battery (i.e., the second module), and finally, it is encapsulated with the hyperbolic first encapsulation substrate to obtain the hyperbolic photovoltaic module. On one hand, using a planar mold to form and hold the second encapsulation substrate simplifies the encapsulation process and reduces the encapsulation difficulty between the curved second encapsulation substrate and the initial cadmium telluride thin-film battery. Furthermore, during the thinning of the front glass, the second encapsulation substrate can protect the cadmium telluride from damage, thereby improving the yield of the photovoltaic module. On the other hand, thinning the front glass reduces the thickness of the cadmium telluride thin-film battery, thus reducing the thickness and weight of the hyperbolic photovoltaic module. Simultaneously, the curvature radius of the hyperbolic photovoltaic module is mainly controlled by the thinner first and second encapsulation substrates, further reducing the minimum achievable curvature radius of the photovoltaic module, improving the design flexibility and reliability of the hyperbolic photovoltaic module, and effectively meeting the requirements of automotive glass products.

[0060] In some alternative embodiments, the second component 200, namely the cadmium telluride thin-film battery 20, has a radius of curvature of 2m to 3m; the formed hyperbolic photovoltaic module 300 has a radius of curvature of 2m to 3m.

[0061] The method for preparing hyperbolic photovoltaic modules provided in this embodiment can achieve a curvature radius of 2m to 3m for the hyperbolic photovoltaic module 300, that is, a minimum curvature radius as low as 2m.

[0062] In some alternative embodiments, the mold 10 is a hyperboloid; the first component 100 is a plane; the mold 10 is adapted to be obtained by a hot bending process; the first component 100 is a solar cell; the solar cell includes a stacked front glass 21 and a cell functional layer; In the step of temporarily attaching the first component 100 to the mold 10, the first component 100 changes from a flat surface to a hyperboloid following the mold 10 and remains there; The first component 100 is encapsulated to form the second component 200; The steps for forming the second component 200 through the packaging process include: A first encapsulating film 41 and a first encapsulating substrate 51 are sequentially disposed on the side surface of the first component 100 facing away from the mold 10. After pressing and encapsulation, a second component 200 is obtained. The first encapsulating substrate 51 is a hyperboloid. The first encapsulating film 41 is located on the side surface of the battery functional layer facing away from the front panel glass 21 and is used to bond the first component 100 and the first encapsulating substrate 51. After removing the mold 10, the second component 200 of the hyperboloid is the hyperboloid photovoltaic module 300.

[0063] In some alternative embodiments, the thickness of the mold 10 is greater than the thickness of the first packaging substrate 51.

[0064] In related technologies, the common practice is to directly stack hyperboloid hot-bent glass, encapsulating film, and solar cells (including the front glass and the cell functional layers) and then encapsulate and shape them in an autoclave. However, this approach requires the hyperboloid hot-bent glass to have a significant thickness (generally more than twice the thickness of the solar cell) to ensure that the solar cell can be hot-bent. This results in a significant increase in the thickness and weight of the final photovoltaic module, and also a relatively large achievable radius of curvature.

[0065] The method for fabricating a hyperbolic photovoltaic module provided in this embodiment involves first temporarily bonding a curved mold to one side of the front glass of a flat solar cell to achieve and maintain the hyperbolic shape of the solar cell. Then, the cell functional layer of the solar cell is encapsulated with a first encapsulation substrate. Finally, the curved mold is removed to obtain the hyperbolic photovoltaic module. On the one hand, this method can effectively reduce the thickness and weight of the hyperbolic photovoltaic module and lower the minimum achievable radius of curvature. On the other hand, the encapsulation process is basically the same as the conventional curved double-glass encapsulation process and equipment, which can greatly simplify the encapsulation process and reduce its complexity.

[0066] In some alternative embodiments, the radius of curvature of the mold 10 is 4m to 5m; the radius of curvature of the second component 200 is 4m to 5m; and the radius of curvature of the formed hyperbolic photovoltaic module 300 is 4m to 5m.

[0067] The method for preparing hyperbolic photovoltaic modules provided in this embodiment can achieve a curvature radius of 4m to 5m for hyperbolic photovoltaic modules 300, that is, a minimum curvature radius as low as 5m.

[0068] In some alternative embodiments, the thickness of the mold 10 is 10 mm, and the thickness of the first packaging substrate 51 is 2 mm to 4 mm.

[0069] In some alternative implementations, the radius of the hyperbolic photovoltaic module 300 of the mold 10 is greater than or equal to 4m.

[0070] The method for preparing hyperbolic photovoltaic modules provided in this embodiment can achieve a minimum curvature radius of 4m for hyperbolic photovoltaic modules 300.

[0071] In some alternative embodiments, the step of temporarily bonding the first component 100 to the mold 10 includes: The first component 100 and the mold 10 are bonded together using adhesive 110; Maintain the bonding pressure until the adhesive 110 cures to form the adhesive layer 11; The process of removing the mold includes: removing the adhesive layer and the mold.

[0072] In some alternative embodiments, the step of bonding the first component 100 and the mold 10 together using an adhesive 110 includes: An adhesive 110 is applied to one side surface of the mold 10; the first component 100 is placed on the adhesive 110.

[0073] In some optional embodiments, the adhesive 110 is composed of one or more of the following: hot melt adhesive, ultraviolet photoresist, pressure-sensitive adhesive, silicone sealant, glass sealant, modified polyvinyl alcohol sealant, ethylene-vinyl acetate copolymer, polyvinyl butyral, ethylene-1-octene copolymer, a mixture of polyvinyl terephthalate and metal salt ions, potassium silicate adhesive, and phosphate-aluminum hydroxide adhesive; the proportion of the main component of the adhesive 110 is ≥50%.

[0074] In some alternative embodiments, the peel strength of the adhesive layer 11 is less than 0.5 MPa; The step of removing mold 10 includes: One or more of the following processes are used: heat modification, solution immersion, and mechanical peeling, to remove the adhesive layer 11 and the mold 10.

[0075] In practice, some adhesives form an adhesive layer 11 that is very easy to peel off after heat modification, facilitating the complete removal of the mold 10 and the adhesive layer 11 without damaging the second component. For example, pressure-sensitive adhesives have very low peel strength when heated to 150°C, making them easy to remove.

[0076] In some alternative embodiments, the heat modification temperature of the adhesive layer 11 is 50°C. o C~450 o C.

[0077] The hyperbolic photovoltaic module fabrication method provided in this embodiment achieves temporary bonding between the first module and the mold through an adhesive layer. The peel strength of the adhesive layer is less than 0.5 MPa, and / or the heat modification temperature of the adhesive layer is 50°C. o C~450 o C can ensure the stability of temporary bonding while facilitating subsequent removal and peeling; at the same time, one or more of the following processes—heat modification, solution immersion, and mechanical peeling—can effectively remove the adhesive layer and mold without damaging the second component, thereby improving the reliability of the hyperbolic photovoltaic module.

[0078] In some alternative embodiments, the peel strength of the adhesive layer 11 is greater than 0.5 MPa; The step of temporarily attaching the first component 100 to the mold 10 includes: An interface layer 30 is formed on the first surface of the first component 100; The interface layer 30 and the mold 10 are bonded together by the adhesive layer 11; the adhesive layer 11 is located between the interface layer 30 and the mold 10. The bonding force between the interface layer 30 and the first component 100 is less than the bonding force between the interface layer 30 and the adhesive layer 11; The mold removal process includes removing the interface layer 30, the adhesive layer 11, and the mold 10.

[0079] In practice, since some adhesive layers 11 have a peel strength greater than 0.5 MPa, they are difficult to remove directly. Therefore, an interface layer is introduced, and the bonding force between the interface layer 30 and the first component 100 is less than the bonding force between the interface layer 30 and the adhesive layer 11. This makes it easier to separate the interface layer 30 and the first component 100 when removing the mold 10, thereby achieving the removal of the interface layer 30, the adhesive layer 11 and the mold 10.

[0080] Specifically, since the first component 100 undergoes a film layer processing and / or encapsulation process to form the second component 200, the bonding force between the interface layer 30 and the second component 200 before the removal of the mold 10 is the same as the bonding force between the interface layer 30 and the first surface of the first component 100. Therefore, the bonding force between the interface layer 30 and the second component 200 is less than the bonding force between the interface layer 30 and the adhesive layer 11.

[0081] In an alternative implementation, the step of forming the interface layer 30 on the first surface of the first component 100 further includes: The first surface of the first component 100 is cleaned and plasma modified; The bonding force between the interface layer 30 and the first component 100 is 1N~200N; the material of the interface layer 30 is MgTe, ZnO, SiO2, Mo, Si3N4, ZrO2, Nb2O5 or MgZnO, and the thickness of the interface layer 30 is 10nm~200nm. The step of removing mold 10 includes: One or more of the following processes are used: heating modification, solution immersion, and mechanical peeling, to remove the interface layer 30, adhesive layer 11, and mold 10.

[0082] In practice, the bonding force between the interface layer 30 and the second component 200 can be adjusted to ensure that the bonding force is less than that between the adhesive layer 11 and the mold 10, thereby achieving the joint removal of the interface layer 30, the adhesive layer 11, and the mold 10. Simultaneously, the bonding force between the interface layer 30 and the second component 200 ensures that the bonding force between the second component 200 and the interface layer is appropriate and sufficiently secure, while also facilitating subsequent peeling.

[0083] The hyperbolic photovoltaic module manufacturing method provided in this embodiment can achieve the separation of the mold and adhesive layer from the second module by utilizing the peelable characteristics of the interface layer with adjustable bonding force. This can improve process flexibility, reduce the difficulty of removing the mold and adhesive layer, and ensure that the second module is not damaged, thereby improving the reliability of the hyperbolic photovoltaic module.

[0084] In some optional embodiments, the adhesive 110 comprises glass glue and hot melt adhesive, wherein the glass glue content is ≥70%; the peel strength of the adhesive layer 11 formed after curing is 0.5 MPa to 5 MPa.

[0085] In some optional embodiments, the adhesive 110 comprises potassium silicate sealant and glass sealant, wherein the content of potassium silicate sealant is ≥50%; Curing conditions: 20 o C~80 o Curing at C for 1~12 hours; the peel strength of the adhesive layer 11 formed after curing is 1MPa~10MPa.

[0086] In some alternative embodiments, the adhesive 110 comprises polyvinyl alcohol; the proportion of polyvinyl alcohol in the adhesive 110 is ≥70%. The curing conditions are: room temperature curing for 1 to 10 hours, and the peel strength of adhesive layer 11 is 1 MPa to 5 MPa.

[0087] In some alternative embodiments, the adhesive 110 is applied by roller coating, spraying, scraping, dispensing, or laying.

[0088] Preferably, the adhesive 110 is disposed around the sample and in a localized central position. The adhesive 110 has a dotted discontinuous structure with a dot size ≤10mm and a distance between dots ≥10mm. In some optional embodiments, in the solution soaking process, the solution is one or more of water, alcohol, toluene, acetone, degumming agent, dilute acid, dilute alkali, and sodium dodecylbenzenesulfonate; the concentration of the solution is 1% to 100%; and the soaking temperature is 20°C. o C~150 o C, soaking time is from 5 seconds to 12 hours.

[0089] In some alternative embodiments, the interface layer 30 is made of SiO2, deposited by spraying or roller coating, with a thickness of 50nm~100nm and an adhesion strength of 1N~10N.

[0090] In some alternative embodiments, the first component 100 is a cadmium telluride battery intermediate; the first surface of the first component 100 is the side surface of the front panel glass 21 facing away from the transparent conductive layer.

[0091] In some alternative embodiments, the material of the interface layer 30 is MgZnO, and the thickness is 20nm~100nm.

[0092] In some alternative embodiments, the first surface of the first component 100 is one side surface of the second encapsulation substrate 52, wherein the second encapsulation substrate 52 is heat-bent hyperbolic glass.

[0093] In some alternative implementations, the interface layer 30 is made of ZnO and has a thickness of 20 nm to 100 nm.

[0094] In some alternative embodiments, the mold 10 is made of glass or stainless steel; The thickness of mold 10 is twice or more the thickness of the first component 100.

[0095] In some alternative embodiments, the thickness of the first component 100 is 2mm to 4mm; the thickness of the mold 10 is greater than 8mm, such as 8mm, 9mm, 10mm, 12mm or 15mm, etc.

[0096] In some alternative embodiments, prior to the step of temporarily attaching the first component 100 to the mold 10, the mold 10 is further cleaned and dried.

[0097] In some optional embodiments, the first encapsulation substrate 51 is made of glass; the second encapsulation substrate 52 is made of glass. Both the first encapsulation film 41 and the second encapsulation film 42 are made of PVB film. In some alternative embodiments, the thickness of the first packaging substrate 51 is 2-3 mm; the thickness of the second packaging substrate 52 is 2-3 mm.

[0098] In some alternative embodiments, the thickness of both the first encapsulating film 41 and the second encapsulating film 42 is 0.76 mm.

[0099] Example 1 like Figure 2 As shown, the present invention also provides a detailed flowchart of a method for preparing a hyperbolic photovoltaic module, including but not limited to steps S201 to S206.

[0100] Step S201: Provide a hyperboloid mold 10; the mold 10 is suitable for obtaining by a hot bending process; clean and dry the mold 10, such as... Figure 3 As shown.

[0101] In specific implementation, mold 10 is a hot-bending hyperboloid glass mold 10; the minimum radius of curvature of mold 10 is 4 meters, and the thickness of mold 10 is twice or more the thickness of the first component 100. In some examples, the thickness of mold 10 is 10 mm.

[0102] Step S202, providing a planar first component 100; the first component 100 is a cadmium telluride thin-film battery; the cadmium telluride thin-film battery includes a stacked front panel glass 21 and a cadmium telluride functional layer 22, such as Figure 4 As shown.

[0103] In practice, the thickness of cadmium telluride thin-film batteries is 3mm to 4mm. In some examples, the thickness of cadmium telluride thin-film batteries is 3.2mm.

[0104] Step S203 involves cleaning and plasma-modifying the surface of the front glass 21, and forming an interface layer 30 on the side of the front glass 21 facing away from the battery functional layer, such as... Figure 5 As shown.

[0105] In specific implementations, the bonding force between the interface layer 30 and the front glass 21 is 1N~200N. In some examples, the interface layer 30 is a SiO2 layer with a thickness of 50nm~100nm and a bonding force of 1N~10N, formed by spraying or roller coating processes.

[0106] Step S204: The surface of the interface layer 30 and the mold 10 are bonded together using adhesive 110, as shown below. Figure 6 As shown; maintain adhesive pressure until the adhesive 110 cures to form adhesive layer 11, as... Figure 7 As shown; the first component 100 changes from a planar surface to a hyperboloid following the mold 10 and remains thereafter.

[0107] In specific implementation, the peel strength of the adhesive layer 11 is 0.1 MPa to 10 MPa, and / or the heat modification temperature of the adhesive layer 11 is 50°C. o C~450 o C. In some examples, adhesive 110 comprises potassium silicate glue and silicone sealant, wherein the silicone sealant content is ≥70%. Adhesive 110 is distributed in a dotted, discontinuous pattern, with dot size ≤10mm and dot spacing ≥10mm. The curing condition is: 20... o C~80 o Curing at C for 1 to 12 hours allows the adhesive 110 to partially cure. The peel strength of the adhesive layer 11 formed after curing is 1 MPa to 10 MPa, enabling the first component 100 to be cold-bent into a hyperboloid following the planar mold 10.

[0108] Step S205: The first component 100 is encapsulated to form the second component 200, such as... Figure 7 As shown.

[0109] Step S205 includes: Step S205-1: A first encapsulating film 41 and a first encapsulating substrate 51 are sequentially disposed on the side surface of the first component 100 facing away from the mold 10. The first encapsulating substrate 51 is a hyperboloid. The first encapsulating film 41 is located on the side surface of the cadmium telluride functional layer 22 facing away from the front panel glass 21 and is used to bond the first component 100 and the first encapsulating substrate 51. Step S205-2, after compression and encapsulation, the second component 200 is obtained.

[0110] In specific implementations, the radius of curvature of the first encapsulation substrate 51 is the same as that of the cadmium telluride thin-film battery 20, with a minimum radius of curvature of 4m for both. In some examples, the first encapsulation substrate 51 is a hot-bent glass substrate with a thickness of 3.2mm; the first encapsulation film 41 is a PVB film with a thickness of 0.76mm; and the encapsulation is performed using an autoclave or a curved laminator, resulting in a second component 200 with a thickness of 3.2 + 3.2 + 0.76 = 7.16mm after encapsulation.

[0111] Step S206: Remove the interface layer 30, adhesive layer 11, and mold 10 to obtain the hyperboloid second component 200. The hyperboloid second component 200 is the hyperboloid photovoltaic module 300. Figure 8 As shown.

[0112] In specific implementation, one or more of the following processes are employed: heat modification, solution immersion, and mechanical peeling, to remove the adhesive layer 11 and the mold 10. In some examples, mechanical peeling is used to separate the solar cell / interface layer 30, removing the interface layer 30, adhesive layer 11, and mold 10. Preferably, a 50-150°C process is performed before mechanical peeling. oHeat treatment (C) modifies the adhesive layer 11. The resulting hyperbolic photovoltaic module 300 has a thickness of 7.16 mm, the same as that of a conventional planar module in terms of thickness and weight. Furthermore, the minimum radius of curvature of the hyperbolic photovoltaic module 300 can reach 4 m, meeting the requirements for automotive photovoltaic applications.

[0113] Example 2 like Figure 9 As shown, the present invention also provides a specific flowchart of another method for preparing hyperbolic photovoltaic modules, including but not limited to steps S301 to S307.

[0114] Step S301: Provide a flat mold 10, and clean and dry the mold 10, such as... Figure 10 As shown.

[0115] In practice, mold 10 is a flat glass mold 10, and the thickness of mold 10 is twice or more the thickness of the first component 100. In some examples, the thickness of mold 10 is 10 mm.

[0116] Step S302: A hyperboloid first component 100 is provided, which is suitable for obtaining by a hot bending process; the first component 100 is a cadmium telluride battery intermediate; the cadmium telluride battery intermediate includes a stacked front panel glass 21, a transparent conductive layer 221, and a cadmium telluride layer 222; and a P1 laser groove and a P2 laser groove penetrating the transparent conductive layer 221 and the cadmium telluride layer; the P1 laser groove is filled with insulating material, and the P2 laser groove is unfilled, such as... Figure 11 As shown.

[0117] In practice, a planar cadmium telluride battery intermediate is first provided, and then a hyperboloid cadmium telluride battery intermediate, namely the hyperboloid first component 100, is formed using a hot bending process. Specifically, a 560~650 mm diameter is used. o The C-type hot bending process is used for hyperbolic molding, and the radius of curvature of the first component 100 is 3m~4m.

[0118] The thickness of the first component 100 is 3mm to 3.5mm. In some examples, the thickness of the front glass 21 is 3.2mm, the thickness of the transparent conductive layer 221 is 600nm, the thickness of the cadmium telluride layer 222 is 3µm, and the P1 laser groove is filled with high-temperature resistant insulating material.

[0119] Step S303 involves cleaning and plasma-modifying the surface of the front glass 21 of the cadmium telluride battery intermediate, and forming an interface layer 30 on the side of the front glass 21 facing away from the cadmium telluride functional layer 22. Figure 11 As shown.

[0120] In practice, the bonding force between the interface layer 30 and the front glass 21 is 1N to 200N. In some examples, the material of the interface layer 30 is a MgZnO layer with a thickness of 20nm to 100nm.

[0121] In some examples, step S303 can be performed before step S302; that is, the interface layer 30 is formed before the hot bending process, and then the hot bending process is performed to obtain the hyperboloid first component 100. In other examples, step S303 is performed after step S302.

[0122] Step S304: Adhere the surface of the interface layer 30 and the mold 10 together using adhesive 110; maintain adhesive pressure until the adhesive 110 cures to form an adhesive layer 11, as shown. Figure 12 As shown; the first component 100 is transformed from a hyperboloid to a plane following the mold 10 and remains there.

[0123] In specific implementation, the peel strength of the adhesive layer 11 is 0.1 MPa to 10 MPa, and / or the heat modification temperature of the adhesive layer 11 is 50°C. o C~450 o C. In some examples, adhesive 110 consists of potassium silicate glue and glass glue, wherein the potassium silicate glue content is ≥50%; the curing conditions are: 20 o C~80 o Curing at C for 1-12 hours; the peel strength of the adhesive layer 11 formed after curing is 1 MPa-10 MPa. Under the action of the adhesive layer 11, the first component 100 and the 10mm flat glass mold 10 are cold-bent and bonded, and the first component 100 changes from a hyperbolic shape to a flat shape and remains thereafter.

[0124] Step S305: Perform a film layer processing process on the first component 100 to form a second component 200; the second component 200 is a cadmium telluride thin-film battery 20; the cadmium telluride thin-film battery 20 includes a front glass panel 21 and a cadmium telluride functional layer 22 on its surface, such as... Figure 13 As shown.

[0125] Step S305 includes: In step S305-1, a back electrode layer 223 is formed on the surface of the cadmium telluride layer 222 facing away from the transparent conductive layer 221. The back electrode layer 223 is also filled with a P2 laser groove.

[0126] In step S305-2, a P3 laser groove is formed, which penetrates the back electrode layer 223 and exposes the cadmium telluride layer 222, thus obtaining a cadmium telluride thin film battery 20. The cadmium telluride functional layer 22 includes a transparent conductive layer 221, a cadmium telluride layer 222, and a back electrode layer 223.

[0127] In specific implementations, the thickness of the cadmium telluride thin-film battery 20 is 3.1 mm to 4 mm. In some examples, the thickness of the back electrode layer is 100 nm to 300 nm, and the thickness of the cadmium telluride thin-film battery 20 is 3.2 mm to 3.3 mm. In some embodiments, the cadmium telluride battery intermediate is further subjected to a 400 to 450 °C treatment before step S305-1. o C heat treatment.

[0128] In step S306, the interface layer 30, adhesive layer 11, and mold 10 are removed, and the cadmium telluride thin-film battery 20 recovers its hyperboloid surface, resulting in the second hyperboloid component 200. Figure 14 As shown.

[0129] In practice, the sample is immersed in water at a temperature of 50-100°C. o The cadmium telluride thin-film battery 20 is ultrasonically treated in a solution of 0-10% citric acid and 0-10% sodium dodecylbenzenesulfonate for 0.5-12 hours, combined with mechanical peeling, to remove the interface layer 30, adhesive layer and 10mm flat glass mold 10, and restore the hyperbolic shape of the battery.

[0130] Step S307: The second component 200, the first encapsulating film 41, and the first encapsulating substrate 51 are sequentially stacked and then laminated to form a hyperbolic photovoltaic module 300; wherein, the first encapsulating substrate 51 is a hyperbolic surface, and the first encapsulating film 41 is located on the surface of the front glass 21 facing away from the cadmium telluride functional layer 22, for bonding the cadmium telluride thin-film battery 20 and the first encapsulating substrate 51, as shown below. Figure 15 As shown.

[0131] In specific implementations, the radius of curvature of the first encapsulation substrate 51 is the same as that of the cadmium telluride thin-film battery 20, both being 3-4 m. In some examples, the first encapsulation substrate 51 is a hot-bent glass substrate with a thickness of 2 mm; the first encapsulation film 41 is a PVB film with a thickness of 0.76 mm. The thickness of the hyperbolic photovoltaic module 300 formed after encapsulation is 5.96 mm to 6.06 mm, and the thickness and weight can be further reduced. Furthermore, the minimum radius of curvature of the hyperbolic photovoltaic module 300 can reach as low as 3 m, meeting the application requirements of automotive photovoltaic products.

[0132] Example 3 like Figure 16 As shown, the present invention also provides a detailed flowchart of another method for preparing a hyperbolic photovoltaic module, including but not limited to steps S401 to S407.

[0133] Step S401: Provide a flat mold 10, and clean and dry the mold 10, such as... Figure 17 As shown.

[0134] In practice, mold 10 is a flat glass mold 10, and the thickness of mold 10 is twice or more the thickness of the first component 100. In some examples, the thickness of mold 10 is 10 mm.

[0135] Step S402: Provide a hyperboloid first component 100, which is suitable for obtaining by a hot bending process; the first component 100 is a second packaging substrate 52; as shown Figure 18 As shown.

[0136] In specific implementation, the second packaging substrate 52 is a glass substrate, and the thickness of the second packaging substrate 52 is 2mm to 3mm. The radius of curvature of the second packaging substrate 52 is 2m to 3m.

[0137] Step S403: The surface of the second packaging substrate 52 is cleaned and modified, and an interface layer 30 is formed on the second packaging substrate 52, such as... Figure 18 As shown; In practice, the bonding force between the interface layer 30 and the front glass 21 is 1N to 200N. In some examples, the material of the interface layer 30 is MgZnO, and the thickness is 20nm to 100nm.

[0138] In some examples, step S403 can be performed before step S402; that is, the interface layer 30 is formed before the hot bending process, and then the hot bending process is performed to obtain the hyperboloid second packaging substrate 52. In other examples, step S403 is performed after step S402.

[0139] Step S404: The interface layer 30 surface of the second packaging substrate 52 and the mold 10 are bonded together using adhesive 110; the bonding pressure is maintained until the adhesive 110 is cured to form an adhesive layer 11, as shown. Figure 19 As shown; the second packaging substrate 52 is transformed from a hyperboloid to a flat surface following the mold 10 and held thereafter.

[0140] In specific implementation, the peel strength of the adhesive layer 11 is 0.1 MPa to 10 MPa, and / or the heat modification temperature of the adhesive layer 11 is 50°C. o C~450 o C. In some examples, the adhesive 110 comprises polyvinyl alcohol; the proportion of polyvinyl alcohol in the adhesive 110 is ≥70%; the curing conditions are: room temperature curing for 1 hour to 10 hours, and the peel strength of the adhesive layer 11 is 1 MPa to 5 MPa. Under the action of the adhesive layer 11, the first component 100 and the 10mm flat glass mold 10 are cold-bent and bonded, and the second encapsulation substrate 52 changes from a hyperbolic shape to a flat shape and remains thereafter.

[0141] Step S405: The first component 100 is sequentially encapsulated and processed to form the second component 200; the second component 200 is a cadmium telluride thin-film battery 20; the cadmium telluride thin-film battery 20 includes a second encapsulation substrate 52, a cadmium telluride functional layer 22, and a front glass panel 21 stacked sequentially, as shown below. Figure 20 and Figure 21 As shown.

[0142] Step S405 includes: Step S405-1, providing a planar initial cadmium telluride thin-film battery 20; the initial cadmium telluride thin-film battery 20 includes an initial front panel glass 21 and a cadmium telluride functional layer 22 on its surface. Step S405-2: The mold 10, the second encapsulation substrate 52, the second encapsulation film 42, and the initial cadmium telluride thin-film battery 20 are sequentially stacked and encapsulated using an encapsulation process. The second encapsulation film 42 is located on the side surface of the cadmium telluride functional layer 22 facing away from the front panel glass 21, and is used to bond the initial cadmium telluride thin-film battery 20 and the second encapsulation substrate 52, such as... Figure 20 As shown; Step S405-3: The initial front panel glass 21 is thinned to 0.1mm~1mm using a chemical processing technique to obtain the front panel glass 21; the second encapsulation substrate 52, the second encapsulation film 42, the cadmium telluride functional layer 22, and the front panel glass 21 constitute the cadmium telluride thin-film battery 20, as follows. Figure 21 As shown.

[0143] In practice, the initial cadmium telluride thin-film battery 20 has a thickness of 3mm to 4mm. In some examples, the initial front panel glass 21 has a thickness of 0.32mm; the cadmium telluride functional layer 22 has a thickness of less than or equal to 0.1mm. The second encapsulating film 42 is a PVB film with a thickness of 0.76mm.

[0144] Step S406: Remove the interface layer 30, adhesive layer 11, and mold 10; at the first temperature, the cadmium telluride thin-film battery 20 recovers its hyperboloid along with the second encapsulation substrate 52, resulting in a hyperboloid second component 200, as shown. Figure 22 As shown.

[0145] In practice, the sample is immersed in water at a temperature of 50-100°C. o The interface layer 30, adhesive layer 11, and 10mm flat glass mold 10 are removed by ultrasonic treatment in aqueous solution C for 0.5 to 12 hours, combined with mechanical peeling. After removing the mold 10, the radius of curvature of the second component 200 is the same as that of the second packaging substrate 52, which is 2m to 3m.

[0146] In step S407, the second component 200, the first encapsulating film 41, and the first encapsulating substrate 51 are sequentially stacked and then laminated to form a hyperbolic photovoltaic module 300; wherein, the first encapsulating film 41 is located on the surface of the front glass 21 facing away from the cadmium telluride functional layer 22, and is used to bond the cadmium telluride thin-film battery 20 and the first encapsulating substrate 51, such as... Figure 23 As shown.

[0147] In specific implementations, the radius of curvature of the first encapsulation substrate 51 is the same as that of the second component 200, both being 2-3 m. In some examples, the first encapsulation substrate 51 is a hot-bent glass substrate with a thickness of 2-3 mm; the first encapsulation film 41 is a PVB film with a thickness of 0.76 mm. The thickness of the hyperbolic photovoltaic module 300 formed after encapsulation is as low as 5.72 mm, allowing for further reduction in thickness and weight. Furthermore, the minimum radius of curvature of the hyperbolic photovoltaic module 300 can reach 2 m, meeting the requirements for automotive photovoltaic products.

[0148] Specifically, steps S406 and S407 can be performed simultaneously. In some embodiments, after removing the mold 10, since the second encapsulating film has been cured, a planar second component 200 is obtained. The planar second component 200, the first encapsulating film 41, and the first encapsulating substrate 51 are directly stacked in sequence and pressed and encapsulated at a first temperature. During the encapsulation process, the second encapsulating film 42 inside the second component 200 melts and restores its hyperbolic shape, resulting in a hyperbolic second component 200. After encapsulation, a hyperbolic photovoltaic module 300 is obtained.

[0149] This embodiment also provides a hyperbolic photovoltaic module, which is prepared according to the above-described method for preparing a hyperbolic photovoltaic module. Figure 8 As shown, this is a hyperbolic photovoltaic module obtained by the preparation method of Example 1; as Figure 15 As shown, this is a hyperbolic photovoltaic module obtained by the preparation method of Example 2; as Figure 23 As shown, this is a hyperbolic photovoltaic module obtained by the preparation method of Example 3.

[0150] To verify the effectiveness of the hyperbolic photovoltaic module fabrication method provided by this invention, this application provides Example 1, Example 2, Example 3, Comparative Example 1, Comparative Example 2, and Comparative Example 3 to fabricate different hyperbolic photovoltaic modules. Example 1 is fabricated using... Figure 2 Prepared by the method shown. Figure 8 This is a schematic diagram of the hyperbolic photovoltaic module obtained through Example 1. Example 2 is obtained through... Figure 9 Prepared by the method shown. Figure 15 This is a schematic diagram of the hyperbolic photovoltaic module obtained through Example 2. Example 3 is obtained through... Figure 16 Prepared by the method shown. Figure 23This is a schematic diagram of the hyperbolic photovoltaic module obtained through Example 3. Comparative Examples 1-3 illustrate conventional methods for fabricating hyperbolic photovoltaic modules.

[0151] The preparation method provided in Comparative Example 1 includes: sequentially providing a 10 mm thick hot-bent hyperbolic glass, a 0.76 mm thick PVB film, and a 3.2 mm thick cadmium telluride thin-film battery (the cadmium telluride thin-film battery includes a front glass panel and a cadmium telluride functional layer); and then packaging and shaping the battery in an autoclave.

[0152] The challenges and problems encountered in Comparative Example 1 include: ensuring that the thickness of the hot-bent hyperbolic glass is significantly greater than that of the 3.2 mm glass-based cadmium telluride thin-film battery, so that the 3.2 mm thick cadmium telluride thin-film battery can achieve hyperbolic molding along with the hot-bent hyperbolic glass during the encapsulation and shaping process, while the shape of the hyperbolic mold remains unaffected. The final double-glass photovoltaic module has a thickness of 3.2 mm + 0.76 mm + 10 mm, resulting in a significant increase in both thickness and weight.

[0153] Example 1 provides a preparation method including: providing a hyperbolic glass mold with a thickness of 10 mm and a minimum radius of curvature of 4 m; cleaning and drying the surface of the hyperbolic glass mold using glass cleaning fluid and alcohol; selectively and locally coating an adhesive around the perimeter and center of the hyperbolic glass mold surface, the adhesive consisting of glass glue and hot melt adhesive, wherein the glass glue content is ≥70%; the adhesive is a dotted, discontinuous distribution, with a dot size ≤10 mm and a dot spacing ≥10 mm; placing a 3.2 mm thick cadmium telluride thin-film battery (the cadmium telluride thin-film battery includes a front glass panel and a cadmium telluride functional layer, wherein the surface of the front glass panel is pre-deposited with a SiO2 interface layer with a thickness of 50 nm~100 nm and an adhesion strength of 1~10 N using a spraying or roller coating process; the cadmium telluride thin-film battery is cold-bent under the action of the hyperbolic glass mold at 20~80 °C) o Under pressure of C for 1-12 hours, the adhesive is partially cured to form an adhesive layer. The peel strength between the adhesive layer and the interface layer is 0.5-5 MPa, resulting in a cold-bent cadmium telluride thin-film battery / interface layer / adhesive layer / hyperbolic glass mold sample. A 0.76 mm thick PVB film (i.e., the first encapsulation film) and a 3.2 mm thick hot-bent glass backplate (i.e., the first encapsulation substrate) are then sequentially applied. Encapsulation is performed in an autoclave or curved laminator. Separation of the glass-based cadmium telluride thin-film battery / SiO2 layer is achieved using mechanical peeling. Preferably, 50-150 °C of pressure is applied before mechanical peeling. o Heat treatment (C) modifies the adhesive layer. Finally, after removing the mold, a hyperbolic photovoltaic module with a cold-bent hyperbolic shape (radius of curvature of 4m~5m) is obtained.

[0154] Compared to Comparative Example 1, Example 1 achieves cold-bending hyperboloid forming of a 3.2mm glass-based cadmium telluride thin-film battery sample using a 10mm hyperboloid mold and adhesive, resulting in a curvature radius of 4m. The cold-bending hyperboloid forming of the 3.2mm glass-based cadmium telluride thin-film battery sample, PVB film, and hot-bending hyperboloid backsheet glass allows for conventional curved double-glass encapsulation, greatly simplifying the encapsulation process and reducing complexity. Furthermore, the adjustable bonding strength of the SiO2 interface layer and the peelable properties of the adhesive enable the separation of the 10mm hyperboloid mold and adhesive from the cadmium telluride thin-film battery / PVB film / glass backsheet hyperboloid module product. The final thickness of the double-glass module is 3.2mm + 0.76mm + 3.2mm, the same as the thickness and weight of conventional modules.

[0155] The preparation method provided in Comparative Example 2 includes: providing a cadmium telluride (CdTe) battery intermediate with a thickness of 3.2 mm, performing hyperbolic hot bending, performing a curved back electrode deposition process and a curved third laser etching process to form a CdTe thin-film battery. Finally, the CdTe thin-film battery is encapsulated with a curved glass substrate to obtain a curved photovoltaic module.

[0156] The difficulties and problems of Comparative Example 2 include: there are currently no mature large-area curved surface coating and curved surface laser etching equipment and processes on the market.

[0157] Example 2 provides a fabrication method comprising: providing a front panel glass with a thickness of 3.2 mm / a transparent conductive layer with a thickness of 600 nm / a cadmium telluride layer with a thickness of 3 μm; performing a first laser etching process to etch the transparent conductive layer and the cadmium telluride layer to form a P1 laser groove; filling the P1 laser groove with a high-temperature resistant SiO2 insulating material; performing a second laser etching process to etch the cadmium telluride layer to form a P2 laser groove; depositing a MgZnO interface layer with a thickness of 20~100 nm on the surface of the front panel glass; and performing a 560~650 nm laser etching process. o C-bending hyperboloid forming with a curvature radius of 3m~4m; using an adhesive (composed of potassium silicate glue and glass glue, wherein the potassium silicate glue content is ≥50%, 20~80%). o Curing at C for 1-12 hours, peel strength 1-10 MPa) The interface layer side of the above cadmium telluride battery intermediate (i.e., the first component) is cold-bent and bonded to a 10mm flat glass mold, changing the hyperbolic shape of the semi-cadmium telluride battery intermediate from a hyperbolic shape to a flat shape and maintaining it; 400-450 o C-heat treatment; deposition of a back electrode layer with a thickness of 100~300nm; third laser etching to etch the back electrode layer, forming a P3 laser groove, completing the fabrication of the cadmium telluride thin-film battery (i.e., the second component); immersion of the sample in a solution at a temperature of 50~100℃ oThe sample was ultrasonically treated with 0-10% citric acid and 0-10% sodium dodecylbenzenesulfonate solution for 0.5-12 hours, followed by mechanical peeling, to remove the MgZnO interface layer, adhesive layer, and 10mm flat glass mold. The 3.2mm glass-based cadmium telluride battery sample (i.e., the second module) was restored to its hyperbolic shape. Finally, a 3.2mm thick glass-based cadmium telluride thin-film battery, a 0.76mm PVB film (i.e., the first encapsulation film), and a 2mm hot-bent glass backplate (i.e., the first encapsulation substrate) were stacked to obtain a hyperbolic photovoltaic module with a curvature radius of 3m-4m.

[0158] Compared to Comparative Example 2, Example 2 achieves cold bending and planar forming of a 3.2mm glass-based cadmium telluride thin-film battery semi-finished product through hot bending using a 10mm planar mold and adhesive. This facilitates subsequent planar back electrode coating and laser etching processes, thus avoiding the difficulties of curved surface coating and laser etching in the hot-bent hyperboloid sample. Furthermore, by utilizing the adjustable bonding strength of the MgZnO interface layer and the soluble and peelable properties of the adhesive, the MgZnO interface layer, adhesive layer, and mold are removed. The final thickness of the double-glass module is 3.2mm + 0.76mm + 2mm, further reducing thickness and weight.

[0159] The preparation method provided in Comparative Example 3 includes: hot bending after all cadmium telluride batteries have been prepared.

[0160] The difficulties and problems of Comparative Example 3 include: power generation efficiency close to 0%, and high-temperature hot bending will damage the performance of battery layer materials.

[0161] Example 3 provides a preparation method including: sequentially providing a 10mm thick planar glass mold, an adhesive (polyvinyl alcohol ratio ≥70%, cured at room temperature for 1-10 hours, forming an adhesive layer with a peel strength of 1-5MPa), and a 2-3mm thick hot-bent hyperbolic glass substrate (the interface layer is formed by coating before hot bending, with a radius of curvature of 2-3m); cold bending to form the 2-3mm thick hot-bent hyperbolic glass (i.e., the second encapsulation substrate) into a planar shape; sequentially applying a 0.76mm thick adhesive film (i.e., the second encapsulation film) and a glass-based cadmium telluride thin-film battery; performing lamination encapsulation; chemically etching the glass substrate in the glass-based cadmium telluride thin-film battery sample to thin it until the remaining front glass thickness is 0.1-0.5mm. The sample is then immersed in a solution at a temperature of 50-100°C. oThe ZnO interface layer, adhesive layer, and 10mm flat glass mold were removed by ultrasonication in an aqueous solution for 0.5–12 hours, combined with mechanical exfoliation, to obtain the cadmium telluride thin-film battery (i.e., the second component). Finally, a 2–3mm hot-bent hyperboloid glass substrate (i.e., the first encapsulation substrate), a 0.76mm encapsulating film (i.e., the first encapsulation film), and the cadmium telluride thin-film battery were sequentially deposited; autoclave encapsulation was then performed at a first temperature of 100–150°C. o C. During the encapsulation process, the second encapsulating film softens or melts again, causing the cadmium telluride thin-film battery to recover its curved shape along with the second encapsulation substrate; after encapsulation, a hyperbolic photovoltaic module with a radius of curvature of 2m~3m is obtained. (Alternatively, the second module can be restored to a hyperbolic shape at the first temperature before being encapsulated with the first encapsulation substrate to form a hyperbolic photovoltaic module).

[0162] Compared to Comparative Examples 1-3, Example 3 uses a 10mm thick planar mold and adhesive to flatten a 2-3mm thick curved hot-bent glass, simplifying the subsequent encapsulation between the curved hot-bent glass and the planar glass-based cadmium telluride thin-film battery. The encapsulated curved hot-bent glass / encapsulation film / planar glass-based cadmium telluride thin-film battery structure further protects the cadmium telluride thin-film battery from damage during the subsequent chemical thinning process of the glass substrate. Furthermore, the front and back panels of the hot-bent glass can be chemically or physically strengthened to improve strength and ensure cold bending formation. Finally, a hyperbolic photovoltaic module is formed with the second encapsulation substrate, achieving a curvature radius as low as 2m.

[0163] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0164] The above description does not provide detailed explanations of the technical aspects of each layer's patterning, etching, etc. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination.

[0165] The above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described above, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of protection of the present invention is determined by the scope of the appended claims.

Claims

1. A method for preparing a hyperbolic photovoltaic module, characterized in that, The preparation method includes: A mold and a first component are provided; one of the first component and the mold is a hyperboloid, and the other is a plane; The first component is temporarily bonded to the mold; the shape of the first component follows and remains consistent with the shape of the mold. The first component is subjected to a film layer processing and / or encapsulation process to form a second component; Remove the mold; to obtain the second hyperboloid component; Forming hyperbolic photovoltaic modules; Wherein, either the first component is a solar cell, or the second component is a solar cell.

2. The method for preparing a hyperbolic photovoltaic module according to claim 1, characterized in that, The first component is a hyperboloid; the mold is planar; the first component is suitable for obtaining through a hot bending process; the second component is a solar cell; In the step of temporarily bonding the first component to the mold, the first component changes from a hyperboloid to a flat surface following the mold and remains there; After the mold is removed, the second component restores its hyperboloid shape; The steps for forming the hyperbolic photovoltaic module include: After the second component and the first encapsulation substrate are stacked and encapsulated, a hyperbolic photovoltaic module is formed; The first packaging substrate is a hyperboloid.

3. The method for preparing a hyperbolic photovoltaic module according to claim 2, characterized in that, The second component is a cadmium telluride thin-film battery; the cadmium telluride thin-film battery includes a front glass panel and a cadmium telluride functional layer on its surface. The steps for forming the hyperbolic photovoltaic module include: The second component, the first encapsulating film, and the first encapsulating substrate are sequentially stacked and then laminated to form a hyperbolic photovoltaic module; wherein, the first encapsulating film is located on the side surface of the cadmium telluride functional layer facing away from the front glass, and is used to bond the cadmium telluride thin-film battery and the first encapsulating substrate.

4. The method for preparing a hyperbolic photovoltaic module according to claim 3, characterized in that, The first component is a cadmium telluride battery intermediate; the cadmium telluride battery intermediate includes a stacked front glass panel, a transparent conductive layer and a cadmium telluride layer; and a P1 laser groove and a P2 laser groove penetrating the transparent conductive layer and the cadmium telluride layer; the P1 laser groove is filled with insulating material, and the P2 laser groove is unfilled; The first component is subjected to a film layer processing process to form the second component; The steps of forming the second component include: A back electrode layer and a P3 laser groove are formed on the cadmium telluride battery intermediate to obtain a cadmium telluride thin film battery. The cadmium telluride functional layer includes a transparent conductive layer, a cadmium telluride layer, and a back electrode layer.

5. The method for preparing a hyperbolic photovoltaic module according to claim 2, characterized in that, The second component is a cadmium telluride thin-film battery; the cadmium telluride thin-film battery includes a second encapsulation glass, a cadmium telluride functional layer and a front panel glass stacked sequentially; The steps for forming the hyperbolic photovoltaic module include: The second component, the first encapsulating film, and the first encapsulating substrate are sequentially stacked and then laminated to form a hyperbolic photovoltaic module; wherein, the first encapsulating film is located on the side surface of the front glass facing away from the cadmium telluride functional layer, and is used to bond the cadmium telluride thin-film battery and the first encapsulating substrate.

6. The method for preparing a hyperbolic photovoltaic module according to claim 5, characterized in that, The first component is the second packaging substrate; The first component is sequentially encapsulated and processed with a film layer to form the second component; The step of forming the second component includes: A planar initial cadmium telluride thin-film battery is provided; the initial cadmium telluride thin-film battery includes an initial front panel glass and a cadmium telluride functional layer on its surface. The second encapsulation substrate, the second encapsulation film, and the initial cadmium telluride thin-film battery are sequentially stacked and encapsulated using an encapsulation process; wherein, the second encapsulation film is located on the side surface of the cadmium telluride functional layer facing away from the front glass, and is used to bond the initial cadmium telluride thin-film battery and the second encapsulation substrate. The initial front panel glass is thinned to 0.1mm~1mm using a chemical processing technique to obtain the front panel glass; the second encapsulation substrate, the second encapsulation film, the cadmium telluride functional layer, and the front panel glass constitute a cadmium telluride thin-film battery.

7. The method for preparing a hyperbolic photovoltaic module according to claim 1, characterized in that, The mold is a hyperboloid; the first component is a plane; the mold is suitable for obtaining through a hot bending process; the first component is a solar cell; the solar cell includes a stacked front glass panel and a battery functional layer. In the step of temporarily bonding the first component to the mold, the first component changes from a flat surface to a hyperboloid following the mold and remains there; The first component is encapsulated to form the second component; The steps involved in the packaging process to form the second component include: A first encapsulating film and a first encapsulating substrate are sequentially disposed on the side surface of the first component facing away from the mold, and the second component is obtained after pressing and encapsulation; the first encapsulating substrate is a hyperboloid; the first encapsulating film is located on the side surface of the battery functional layer facing away from the front glass, and is used to bond the first component and the first encapsulating substrate; After the step of removing the mold, the second component of the hyperboloid is the hyperboloid photovoltaic module.

8. The method for preparing a hyperbolic photovoltaic module according to claim 1, characterized in that, The step of temporarily attaching the first component to the mold includes: The first component and the mold are bonded together using an adhesive. Maintain the adhesive pressure until the adhesive cures to form an adhesive layer; The step of removing the mold includes: removing the adhesive layer and the mold.

9. The method for preparing a hyperbolic photovoltaic module according to claim 8, characterized in that, The peel strength of the adhesive layer is greater than 0.5 MPa; The step of temporarily attaching the first component to the mold includes: An interface layer is formed on the first surface of the first component; The interface layer and the mold are bonded together by an adhesive layer; the adhesive layer is located between the interface layer and the mold. The bonding force between the interface layer and the second component is less than the bonding force between the interface layer and the adhesive layer; The step of removing the mold includes: removing the interface layer, the adhesive layer, and the mold.

10. The method for preparing a hyperbolic photovoltaic module according to claim 9, characterized in that, The step of forming an interface layer on the first surface of the first component includes: The first surface of the first component is cleaned and plasma modified; The bonding force between the interface layer and the first component is 1N~200N; the material of the interface layer is MgTe, ZnO, SiO2, Mo, Si3N4, ZrO2, Nb2O5 or MgZnO, and the thickness of the interface layer is 10nm~200nm. The step of removing the mold includes: The interface layer, the adhesive layer, and the mold are removed by one or more of the following processes: heating modification, solution immersion, and mechanical peeling.

11. The method for preparing a hyperbolic photovoltaic module according to claim 1, characterized in that, The mold is made of glass or stainless steel. The thickness of the mold is twice or more the thickness of the first component.

12. A hyperbolic photovoltaic module, characterized in that, It is prepared by the method of preparing hyperbolic photovoltaic modules according to any one of claims 1 to 11.

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