Carrying mechanism for packaging workpieces and semiconductor processing equipment

Abstract

The embodiment of the invention provides a carrying mechanism for packaging workpieces and semiconductor processing equipment, and relates to the technical field of semiconductor processing. The carrying mechanism for packaging the workpieces comprises a feeding module, a carrying module and a calibration module and is used for feeding the packaging workpieces, the carrying module and the feeding module are adjacently arranged, the carrying module comprises a frame, a carrying arm, a clamping part and a suction cup, the carrying arm is movably installed on the frame, the clamping part is installed at the tail end of the carrying arm, and the suction cup is arranged on the carrying arm. The clamping part is used for clamping a packaged workpiece, the suction cup is arranged at the bottom of the carrying arm, the calibration module and the carrying module are adjacently arranged, and under the condition that the clamping part clamps the packaged workpiece, the carrying arm drives the clamping part to move, so that the packaged workpiece is moved from the feeding module to the calibration module for calibration. The feeding module, the carrying module and the calibration module are linearly and adjacently arranged to form a smooth material conveying channel, and automatic operation of the whole process of feeding, calibration, carrying and cutting preparation is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically, to a handling mechanism for packaged workpieces and semiconductor processing equipment. Background Technology

[0002] Traditional QFN / SON packages have pins located on the bottom of the package, making it impossible to form visible solder joints from the side after soldering. Therefore, they cannot pass automated optical inspection (AVI) or X-ray inspection (X-ray inspection). (ray) to determine if the package is effectively soldered. To better adapt to the needs of SMT automated assembly and inspection, wettable flank (WF) technology has emerged. Currently, the industry mainly uses dicing to separate wettable flank devices. Dicing wettable flank devices is one of the key process steps. Due to the extremely delicate and fragile nature of integrated chips and interconnect structures (such as through-silicon vias (TSVs) and redistribution layers (RDLs), extremely stringent requirements are placed on the dicing process. First, in terms of precision, the width of the scribe line is increasingly shrinking, requiring the dicing path to have extremely high alignment accuracy and positional stability to avoid damaging adjacent microcircuits and ensure the integrity of chip functionality. Second, in terms of cleanliness, any tiny particulate contaminants or dicing debris can cause short circuits, decreased reliability, or bonding failure in subsequent processes. Therefore, the entire dicing environment and process need to be maintained at an extremely high cleanliness level. The typical production process of packaged parts currently includes: loading → calibration → dicing → unloading. The degree of automation and positioning accuracy of the feeding, calibration, and handling processes directly affect the efficiency and yield of the entire cutting process. Existing technologies are mainly designed for rigid "hard-packaged workpieces." However, for flexible substrates (such as flexible circuit boards, PI films, and ultra-thin silicon wafers), which have been widely used in recent years, i.e., "soft-packaged workpieces," existing mechanisms have significant shortcomings.

[0003] Therefore, there is an urgent need to propose a new type of handling mechanism for packaged workpieces to overcome the problem of unreliable clamping when handling soft-packaged workpieces in the existing technology, and to improve the overall stability of the machine and its adaptability to production. Summary of the Invention

[0004] This invention provides a handling mechanism and semiconductor processing equipment for packaged workpieces, which can meet the handling needs of different packaged workpieces and realize the automation, intelligence and high reliability of the entire process of feeding, calibration, handling and cutting preparation.

[0005] The embodiments of the present invention can be implemented as follows: Embodiments of the present invention provide a conveying mechanism for packaging workpieces, comprising: The feeding module is used to feed the packaged workpieces. A conveying module is provided, which is arranged adjacent to the loading module. The conveying module includes a frame, a conveying arm, a clamping part, and a suction cup. The conveying arm is movably mounted on the frame, the clamping part is mounted on the end of the conveying arm and is used to clamp and package the workpiece, and the suction cup is located at the bottom of the conveying arm. The calibration module and the conveying module are arranged adjacent to each other. When the clamping part clamps the packaged workpiece, the conveying arm drives the clamping part to move, thereby moving the packaged workpiece from the feeding module to the calibration module for calibration. After the calibration of the packaged workpiece is completed, the transport arm moves the suction cup down to the position of the packaged workpiece, the suction cup adheres to the packaged workpiece, and the transport arm moves the suction cup and the packaged workpiece to the cutting disc.

[0006] Optionally, the clamping part includes a drive source, a clamping block, and a clamping seat. The drive source is connected to both the clamping block and the clamping seat. The clamping block is located above the clamping seat. The clamping block and the clamping seat are used to move closer to each other under the drive of the drive source, thereby clamping the packaged workpiece. The contact length between the clamping block and the packaged workpiece is within 2 mm.

[0007] Optionally, the clamping block has a trapezoidal structure, with the length of the bottom surface of the clamping block being less than the length of the top surface, and the bottom surface of the clamping block being used to contact the packaged workpiece.

[0008] Optionally, the thickness of the clamping block is in the same direction as the length of the packaged workpiece.

[0009] Optionally, both the clamping block and the clamping seat are made of non-metallic elastic material.

[0010] Optionally, the top surface of the clamping seat is provided with a clearance portion and an abutment portion. The position of the abutment portion corresponds to the position of the bottom surface of the clamping block. The abutment portion and the bottom surface of the clamping block together clamp the packaged workpiece. The clearance portion is provided on both sides of the abutment portion.

[0011] Optionally, the calibration module includes a calibration platform, a first slide rail, and a second slide rail. The first slide rail and the second slide rail are spaced apart on the calibration platform. The transport arm is located above the calibration platform. The transport arm drives the clamping part to move, so that the clamping part drives the two sides of the packaged workpiece to slide into the first slide rail and the second slide rail respectively.

[0012] Optionally, the end of the transport arm is provided with an anti-reverse pin, and the front of the packaged workpiece is provided with a positioning hole. The position of the anti-reverse pin is adapted to the position of the positioning hole. When the packaged workpiece slides into the first slide and the second slide and the front of the packaged workpiece is facing upward, the transport arm moves downward so that the anti-reverse pin is inserted into the positioning hole to perform anti-reverse detection on the packaged workpiece.

[0013] Optionally, the calibration module further includes an anti-reverse detection component, which is installed on the first slide rail and / or the second slide rail. A detection hole is provided on the front side of the packaged workpiece. The position of the anti-reverse detection component is adapted to the position of the detection hole. When the packaged workpiece slides into the first slide rail and the second slide rail with its front side facing upwards, the anti-reverse detection component detects the detection hole, thereby issuing a signal that the packaged workpiece is correctly placed. When the packaged workpiece slides into the first slide rail and the second slide rail with its back side facing upwards, the anti-reverse detection component does not detect the detection hole, thereby issuing a signal that the packaged workpiece is incorrectly placed.

[0014] Optionally, the handling module further includes an unloading arm, which is movably mounted on the frame. The unloading arm is equipped with an air blower for purging before adsorbing and packaging the workpiece to remove residual water.

[0015] This invention also provides a semiconductor processing apparatus, including a transport mechanism for packaging workpieces.

[0016] The beneficial effects of the conveying mechanism for packaged workpieces and the semiconductor processing equipment of the present invention include, for example: This workpiece handling mechanism includes a loading module, a handling module, and a calibration module. The loading module and handling module are arranged adjacent to each other. The handling module includes a frame, a handling arm, a clamping part, and a suction cup. The handling arm is movably mounted on the frame, and the clamping part is mounted at the end of the handling arm to clamp the workpiece. The suction cup is located at the bottom of the handling arm. The calibration module and handling module are arranged adjacent to each other. When the clamping part is holding the workpiece, the handling arm moves the clamping part, thereby moving the workpiece from the loading module to the calibration module for calibration. After calibration, the handling arm moves the suction cup down to the workpiece's location, where the suction cup holds the workpiece. The handling arm then moves the suction cup and workpiece to the cutting disc. In use, the loading module, handling module, and calibration module are arranged linearly adjacent to each other, forming a smooth material transport channel, shortening the handling path and reducing waiting time. The handling arm can complete multiple actions such as gripping, transferring, releasing, adsorbing, and re-transferring on a single track, avoiding complex multi-axis hand-changing or intermediate buffering steps, simplifying the control system logic, improving the processing efficiency per unit time, facilitating modular installation and maintenance, and the handling mechanism for packaging workpieces achieves automated, intelligent, and highly reliable operation of the entire process of loading, calibration, handling, and cutting preparation.

[0017] This semiconductor processing equipment includes a transport mechanism for packaging workpieces. It possesses all the aforementioned beneficial effects. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the feeding, calibration and handling mechanism for packaged workpieces provided in this embodiment; Figure 2 This is a schematic diagram of the feeding module provided in this embodiment; Figure 3 This is a schematic diagram of the transport module provided in this embodiment; Figure 4 This is a schematic diagram of the clamping part provided in this embodiment; Figure 5 This is a partial enlarged view of the clamping part provided in this embodiment; Figure 6 This is a schematic diagram of the calibration module provided in this embodiment.

[0020] Icons: 10-Feeding module; 11-Housing; 12-Feeding slide; 13-Push cylinder; 14-Lifting component; 15-Clamping component; 16-Pushing component; 17-Transverse slide; 18-Safety light curtain; 20-Transfer module; 21-Frame; 22-Transfer arm; 23-Clamping part; 231-Clamping block; 232-Clamping seat; 2321-Avoiding part; 2322-Abutting part; 24-Unloading arm; 25-Transverse guide rail; 30-Calibration module; 31-Calibration platform; 32-First slide; 33-Second slide; 34-Anti-reverse detection component; 100-Transfer mechanism for packaging workpieces. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of this invention, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0025] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0026] It should be noted that, where there is no conflict, the features in the embodiments of the present invention can be combined with each other.

[0027] Traditional QFN / SON packages have pins located on the bottom of the package, making it impossible to form visible solder joints from the side after soldering. Therefore, they cannot pass automated optical inspection (AVI) or X-ray inspection (X-ray inspection). (ray) to determine if the package is effectively soldered. To better adapt to the needs of SMT automated assembly and inspection, wettable flank (WF) technology has emerged. Currently, the industry mainly uses dicing to separate wettable flank devices. Dicing wettable flank devices is one of the key process steps. Due to the extremely delicate and fragile nature of integrated chips and interconnect structures (such as through-silicon vias (TSVs) and redistribution layers (RDLs), extremely stringent requirements are placed on the dicing process. First, in terms of precision, the width of the scribe line is increasingly shrinking, requiring the dicing path to have extremely high alignment accuracy and positional stability to avoid damaging adjacent microcircuits and ensure the integrity of chip functionality. Second, in terms of cleanliness, any tiny particulate contaminants or dicing debris can cause short circuits, decreased reliability, or bonding failure in subsequent processes. Therefore, the entire dicing environment and process need to be maintained at an extremely high cleanliness level. The typical production process of packaged parts currently includes: loading → calibration → dicing → unloading. The degree of automation and positioning accuracy of the feeding, calibration, and handling processes directly affect the efficiency and yield of the entire cutting process. Existing technologies are mainly designed for rigid "hard-packaged workpieces." However, for flexible substrates (such as flexible circuit boards, PI films, and ultra-thin silicon wafers), which have been widely used in recent years, i.e., "soft-packaged workpieces," existing mechanisms have significant shortcomings.

[0028] Therefore, there is an urgent need to propose a new type of handling mechanism for packaged workpieces to overcome the problem of unreliable clamping when handling soft-packaged workpieces in the existing technology, and to improve the overall stability of the machine and its adaptability to production.

[0029] Please refer to Figures 1-6 This embodiment provides a handling mechanism 100 for packaged workpieces, which can effectively improve the aforementioned technical problems. It can meet the handling needs of different packaged workpieces and realize the automation, intelligence, and high reliability of the entire process of feeding, calibration, handling, and cutting preparation.

[0030] The conveying mechanism 100 for packaging workpieces includes a loading module 10, a conveying module 20, and a calibration module 30. The loading module 20 is used to load the packaged workpieces. The conveying module 20 and loading module 10 are arranged adjacent to each other. The conveying module 20 includes a frame 21, a conveying arm 22, a clamping part 23, and a suction cup. The conveying arm 22 is movably mounted on the frame 21, and the clamping part 23 is mounted at the end of the conveying arm 22. The clamping part 23 is used to clamp the packaged workpiece. The suction cup is located at the bottom of the conveying arm 22. The calibration module 30 and conveying module 20 are arranged adjacent to each other. When the clamping part 23 clamps the packaged workpiece, the conveying arm 22 moves the clamping part 23, thereby moving the packaged workpiece from the loading module 10 to the calibration module 30 for calibration. After the packaged workpiece has completed calibration, the conveying arm 22 moves the suction cup down to the location of the packaged workpiece, the suction cup adheres to the packaged workpiece, and the conveying arm 22 moves the suction cup and the packaged workpiece to the cutting disc.

[0031] Specifically, the feeding module 10, the conveying module 20, and the calibration module 30 are arranged adjacent to each other in sequence, forming a compact material transfer path, which shortens the flow distance of the packaged workpieces and reduces the operation cycle time. At the same time, the modular design facilitates maintenance and functional expansion, is suitable for integrated application in fully automated production lines, and helps to improve the overall operating efficiency of the machine.

[0032] In this embodiment, the feeding module 10 includes a housing 11, a feeding slide 12, a pushing cylinder 13, a lifting component 14, a clamping component 15, a pushing component 16, and a transverse slide 17. The feeding slide 12, the pushing cylinder 13, the lifting component 14, the clamping component 15, the pushing component 16, and the transverse slide 17 are all installed inside the housing 11. A material box containing packaged workpieces is placed on the feeding slide 12. The pushing cylinder 13 is located at one end of the feeding slide 12. When the pushing cylinder 13 is activated, it pushes the material box to the other end of the feeding slide 12. The lifting component 14, the clamping component 15, the pushing component 16, and the transverse slide 17 are all located at the other end of the feeding slide 12. Both the lifting component 14 and the transverse slide 17 are connected to the clamping component 15. When the material box reaches the other end of the loading slide 12, the lifting component 14 drives the clamping component 15 to descend to the height of the material box. Then, the transverse slide 17 drives the clamping component 15 to approach the material box until the clamping component 15 clamps the material box. Then, the lifting component 14 and the transverse slide 17 work together to move the clamping component 15 and the material box to the transport position. The transport arm 22 of the transport module 20 drives the clamping part 23 to move to the transport position. The clamping part 23 clamps a packaged workpiece in the material box. While the transport arm 22 moves the clamping part 23 and the packaged workpiece, the pusher 16 pushes the packaged workpiece forward and works together with the clamping part 23.

[0033] In addition, the feeding module 10 also includes a safety light curtain 18 and an ion fan. Safety light curtains 18 are provided at both ends of the feeding slide 12 to prevent accidental contact and reduce the risk of injury. The ion fan is installed on the housing 11, with its end closest to the feeding slide 12 and furthest from the gripper 15. When the material box is placed on the feeding slide 12, the ion fan blows air towards the material box to eliminate static electricity.

[0034] In this embodiment, the clamping part 23 includes a drive source, a clamping block 231, and a clamping seat 232. The drive source is connected to both the clamping block 231 and the clamping seat 232. The clamping block 231 is located above the clamping seat 232. The clamping block 231 and the clamping seat 232 are used to move closer to each other under the drive of the drive source, thereby clamping the packaged workpiece. The contact length between the clamping block 231 and the packaged workpiece is within 2 mm. The contact length between the clamping part 23 and the packaged workpiece is controlled within 2 mm, forming a micro-area local clamping, which significantly reduces the pressure distribution area acting on the surface of the packaged workpiece during the clamping process. For soft-textured and easily deformable flexible encapsulated workpieces (such as PI films and ultra-thin flexible substrates), traditional large-area clamping methods can easily lead to material stretching, wrinkling, or even tearing. However, this embodiment achieves "point-type" or "line-segment" clamping through extremely short contact lengths. While ensuring sufficient friction for dragging, it minimizes the risk of stress concentration, effectively preventing mechanical damage to the flexible encapsulated workpiece during handling, and improving clamping stability and product yield. This allows the clamping part 23 to clamp both rigid and flexible encapsulated workpieces, adapting to the handling needs of different types of encapsulated workpieces without changing the clamps. It achieves efficient compatibility processing of encapsulated workpieces of various materials, thicknesses, and rigidities with a single device, improving the equipment's process adaptability and production line flexibility.

[0035] In this embodiment, the clamping block 231 has a trapezoidal structure, with the length of the bottom surface of the clamping block 231 being shorter than the length of the top surface. The bottom surface of the clamping block 231 is used to contact the packaged workpiece. First, the trapezoidal structure causes the center of gravity of the clamping block 231 to shift upward and the lower end to be narrow, forming a natural guide cone angle. During the clamping process, it can guide the clamping block 231 to accurately align with the edge of the workpiece, reducing the risk of jamming or off-center loading due to positioning deviation. Second, the smaller bottom contact area further enhances the "point contact" or "line contact" characteristics. Combined with a contact length of no more than 2mm, the actual pressure distribution is more concentrated and does not diffuse excessively. This improves clamping stability and avoids wrinkling or plastic deformation of soft material sheets caused by large-area pressure. In addition, this geometry facilitates mold processing and mass production, while also helping to reduce the overall weight, reduce the inertial load when the handling arm 22 moves, and improve the dynamic response speed.

[0036] Understandably, the thickness direction of the clamping block 231 is aligned with the length direction of the packaged workpiece. The clamping block 231 and clamping seat 232 can hold the end edge of the packaged workpiece along its length. The clamping block 231 has higher structural rigidity in the thickness direction, effectively resisting deformation caused by driving force or external vibration during clamping, ensuring uniform distribution of clamping force along the length of the packaged workpiece, and improving clamping consistency and reliability. When the transport arm 22 moves laterally to drag the workpiece, the clamping force is mainly transmitted along the length direction of the workpiece. If the thickness direction of the clamping block 231 is aligned with this direction, its bending section modulus is maximized, effectively resisting shear stress and torsional moment during dragging, preventing bending deformation or vibration of the clamping block 231 under force, thereby ensuring posture stability and path consistency during transmission.

[0037] Furthermore, both the clamping block 231 and the clamping seat 232 are made of non-metallic elastic materials. For example, the clamping block 231 can be made of anti-static polyurethane material, and the clamping seat 232 can be made of polyurethane material. Of course, the clamping block 231 and the clamping seat 232 can also be made of modified rubber, silicone composite material, or high-friction nylon, etc. Understandably, non-metallic elastic materials have a higher surface static friction coefficient, making it easier to form a reliable contact interface with the workpiece (especially smooth or coated soft substrates) compared to metallic materials, achieving effective anti-slip clamping without increasing the clamping force. This is especially important for packaged workpieces that are soft, thin, and have poor deformation resistance, as it can complete the dragging and transfer action through sufficient friction while avoiding indentation, tearing, or warping problems caused by increasing the clamping force. In addition, the elastic material undergoes slight deformation under pressure, which can adaptively conform to the micro-undulations or slightly uneven areas of the workpiece surface, further expanding the actual contact area and enhancing the frictional coupling effect.

[0038] More specifically, the top surface of the clamping seat 232 is provided with a clearance portion 2321 and an abutment portion 2322. The position of the abutment portion 2322 corresponds to the position of the bottom surface of the clamping block 231. The abutment portion 2322 and the bottom surface of the clamping block 231 jointly clamp the packaged workpiece, and the clearance portion 2321 is provided on both sides of the abutment portion 2322. Specifically, the abutment portion 2322 can provide a stable support platform to ensure uniform transmission of clamping force and prevent the workpiece from sinking or tilting during clamping. The clearance portions 2321 on both sides of the abutment portion 2322 provide a spatially reserved accommodating area to accommodate burrs, plating protrusions, or slight warping that may exist on the edge of the workpiece, preventing these non-ideal structures from being squeezed during clamping, which could lead to workpiece deformation or clamping failure. Especially for soft sheets, their edges are prone to slight flanging or wavy warping due to the punching process, which can easily cause insecure clamping or local stress concentration by traditional planar clamping seats.

[0039] Furthermore, the clamping part 23 is connected to an external negative pressure air source. While the clamping part 23 clamps the packaged workpiece, the negative pressure adsorbs the packaged workpiece onto the clamping part 23, further ensuring clamping stability.

[0040] In this embodiment, the driving source is a cylinder.

[0041] Specifically, the transport arm 22 achieves high-precision guided movement through the frame 21. Combined with the low deformation characteristics of the clamping part 23 in the clamped state, it ensures that the packaged workpiece maintains a stable posture during the transfer from the loading module 10 to the calibration module 30, reducing vibration and offset. Especially when linked with the calibration module 30, it can accurately deliver the packaged workpiece into the calibration position, laying the foundation for subsequent high-precision cutting.

[0042] It should also be noted that the handling module 20 also includes an unloading arm 24, which is movably mounted on the frame 21. The unloading arm 24 is equipped with an air blower for blowing away residual water before adsorbing and packaging the workpiece.

[0043] Specifically, the frame 21 is provided with a transverse guide rail 25, and the transport arm 22 and the unloading arm 24 are slidably mounted on the transverse guide rail 25.

[0044] It should also be noted that the calibration module 30 includes a calibration platform 31, a first slide rail 32, and a second slide rail 33. The first slide rail 32 and the second slide rail 33 are spaced apart on the calibration platform 31. The transport arm 22 is located above the calibration platform 31. The transport arm 22 drives the clamping part 23 to move, so that the clamping part 23 drives the two sides of the packaged workpiece to slide into the first slide rail 32 and the second slide rail 33 respectively. The calibration platform 31 serves as a load-bearing structural component, used to install and support the first slide rail 32 and the second slide rail 33. The first slide rail 32 and the second slide rail 33 are spaced apart on the calibration platform 31, forming symmetrically distributed guide channels. The spacing is designed to be adapted to the width of the packaged workpiece, so that the two sides of the packaged workpiece can slide into the first slide rail 32 and the second slide rail 33 respectively under the action of the transport arm 22.

[0045] Specifically, both the first slide rail 32 and the second slide rail 33 are straight structures and are arranged in parallel. The transport arm 22 is located above the calibration table 31, and its end is connected to the clamping part 23. The clamping part 23 is driven to move by the transport arm 22 while holding the packaged workpiece, thereby transferring the packaged workpiece from the loading module 10 to the area where the calibration module 30 is located. Specifically, when the transport arm 22 drives the clamping part 23 to move above the calibration table 31, the control mechanism adjusts the movement trajectory of the transport arm 22, so that the clamping part 23 guides the packaged workpiece to gradually descend in a vertical or inclined direction, so that the two sides of the packaged workpiece simultaneously enter the first slide rail 32 and the second slide rail 33. With this design, the lateral position and rotation angle of the packaged workpiece are automatically corrected by the physical limiting effect of the slide rails on the sides of the packaged workpiece, eliminating positional deviations caused during loading or transport.

[0046] It should be noted that the phrase "the two sides of the packaged workpiece slide into the first slide rail 32 and the second slide rail 33 respectively" refers to the packaged workpiece being held in a clamping state by the clamping part 23, with its left and right sides axially inserted into the gap between the two slide rails. The inner wall of the slide rail forms a constraint surface on the sides of the packaged workpiece, restricting its degree of freedom in the horizontal plane. Based on the above design, the packaged workpiece completes its initial positioning after entering the slide rail, providing a reference basis for subsequent possible fine-tuning or testing operations.

[0047] Understandably, both the first slide 32 and the second slide 33 are equipped with guide parts at their feeding ends. These guide parts guide and limit the edge of the packaged workpiece, effectively correcting the positional deviation caused by initial posture deviation or path disturbance during the handling process, and significantly improving the positioning accuracy of the packaged workpiece before it enters the processing station.

[0048] Furthermore, the calibration module 30 also includes a stop cylinder that extends to form a limiting barrier before the packaged workpiece enters the first slide 32 and the second slide 33, preventing the packaged workpiece from shifting or being crushed during transport.

[0049] Furthermore, the calibration module 30 also includes a reverse support mechanism, which is located at the lower end of the calibration platform 31. After the packaged workpiece arrives, the reverse support mechanism lifts up to support the bottom of the packaged workpiece and completes the three-dimensional positioning calibration in conjunction with the clamping force above.

[0050] In the existing technology, if the packaged workpiece is placed in the wrong direction (front and back reversed) during the loading process, the existing equipment lacks an effective error prevention mechanism, which may lead to subsequent cutting failures or equipment collisions, resulting in product scrap or component damage. Therefore, in order to solve this technical problem, the end of the conveying arm 22 provided in this embodiment is provided with an anti-reverse pin, and the front of the packaged workpiece is provided with a positioning hole. The position of the anti-reverse pin is adapted to the position of the positioning hole. When the packaged workpiece slides into the first slide rail 32 and the second slide rail 33, and the front of the packaged workpiece is facing upward, the conveying arm 22 moves downward, so that the anti-reverse pin is inserted into the positioning hole to perform anti-reverse detection on the packaged workpiece.

[0051] When the packaged workpiece slides into the first slide rail 32 and the second slide rail 33 with its front side facing up, the transport arm 22 moves downward, causing the anti-reverse pin to insert into the positioning hole, indicating that the packaged workpiece is placed correctly, thus completing the physical anti-reverse detection. When the packaged workpiece slides into the first slide rail 32 and the second slide rail 33 with its back side facing up, the transport arm 22 moves downward, and the anti-reverse pin at the bottom of the transport arm 22 cannot insert into the positioning hole, indicating that the packaged workpiece is placed incorrectly, thus triggering an alarm.

[0052] Specifically, there is at least one anti-reverse pin, and the number of positioning holes corresponds one-to-one with the number of anti-reverse pins. A single pin can achieve basic orientation determination, simplifying the structure and reducing costs; multiple pins can be used to match multiple sets of positioning holes on workpieces of different specifications, expanding the equipment's compatibility with various product models. In this embodiment, there are three anti-reverse pins, which are spaced apart at the bottom of the conveying arm 22. In other embodiments, the number of anti-reverse pins can be increased or decreased according to actual usage, and no specific limitation is made here.

[0053] In addition, the calibration module 30 also includes an anti-reverse detection element 34, which is installed on the first slide rail 32 and / or the second slide rail 33. The front of the packaged workpiece is provided with a detection hole, and the position of the anti-reverse detection element 34 is adapted to the position of the detection hole. When the packaged workpiece slides into the first slide rail 32 and the second slide rail 33 and the front of the packaged workpiece is facing upward, the anti-reverse detection element 34 detects the detection hole and sends a signal that the packaged workpiece is placed correctly. When the packaged workpiece slides into the first slide rail 32 and the second slide rail 33 and the back of the packaged workpiece is facing upward, the anti-reverse detection element 34 does not detect the detection hole and sends a signal that the packaged workpiece is placed incorrectly.

[0054] Specifically, when the packaged workpiece slides into the first slide rail 32 and the second slide rail 33 with its front side facing up, the anti-reverse detection element 34 can detect the presence of the detection hole and output a signal that the packaged workpiece is placed correctly; conversely, if the back side of the packaged workpiece faces up, the detection hole position is blocked or there is no corresponding feature, the anti-reverse detection element 34 cannot detect the target signal, and thus determines that the placement is incorrect.

[0055] In this embodiment, the anti-reverse detection element 34 is installed on the first slide rail 32. In other embodiments, the anti-reverse detection element 34 may be installed on the second slide rail 33, or the anti-reverse detection element 34 may be installed on both the first slide rail 32 and the second slide rail 33. No specific limitation is made here.

[0056] Furthermore, the number of anti-reverse detection components 34 is multiple. Specifically, there are two.

[0057] In this embodiment, the anti-reverse detection component 34 is a fiber optic sensor. It features fast response speed, small size, and strong resistance to electromagnetic interference, making it suitable for high-cleanliness, high-precision automated production environments. Specifically, the fiber optic sensor determines the presence of a detection hole by emitting a light beam and receiving changes in the reflected signal. When the light beam falls into the detection hole, the reflection intensity decreases, thereby triggering the state recognition logic. This design allows the entire anti-reverse detection process to be completed simultaneously with the packaged workpiece sliding into the slide, without any additional delay.

[0058] It should be noted that the packaged workpiece refers to a packaged product with a wettable side edge structure.

[0059] It should also be noted that the suction cups mentioned in this embodiment include soft-packing workpiece suction cups and hard-packing workpiece suction cups. The hard-packing workpiece suction cups are conventional suction cups in the prior art and will not be described in detail here. The soft-packing workpiece suction cup includes a suction cup body and several suction nozzles. The suction cup body is located at the bottom of the transport arm 22, and the several suction nozzles are arranged in a matrix on the suction cup body. Each of the suction nozzles is connected to an external negative pressure air source. After the workpiece is calibrated, the transport arm 22 moves down until the suction nozzles of the suction cup are in contact with the upper surface of the workpiece. Then, the negative pressure is turned on, so that the suction cup adsorbs the workpiece.

[0060] Understandably, the packaged workpiece has a curved shape. When the suction cup picks up the packaged workpiece, the counter-support mechanism at the lower end of the calibration stage 31 can support the packaged workpiece, thus facilitating the suction cup to pick up the packaged workpiece. Then, the transport arm 22 moves the suction cup and the packaged workpiece together to the position of the cutting disc, places the packaged workpiece into the cutting cavity on the cutting disc, and then the suction cup separates from the packaged workpiece.

[0061] More importantly, during the process of the conveying arm 22 picking up the packaged workpiece and transferring it to the cutting disc, the adsorption status is monitored in real time by the vacuum pressure monitoring module; if the vacuum pressure value is lower than the preset threshold, it is determined that the packaged workpiece is severely warped or the vacuum has failed, and a maintenance prompt signal is issued.

[0062] This embodiment also provides a semiconductor processing apparatus, including a transport mechanism 100 for packaging workpieces.

[0063] In summary, this embodiment of the invention provides a conveying mechanism 100 for packaging workpieces. The conveying mechanism 100 includes a loading module 10, a conveying module 20, and a calibration module 30 for loading the packaged workpieces. The conveying module 20 and the loading module 10 are arranged adjacent to each other. The conveying module 20 includes a frame 21, a conveying arm 22, a clamping part 23, and a suction cup. The conveying arm 22 is movably mounted on the frame 21, and the clamping part 23 is mounted at the end of the conveying arm 22 for clamping the packaged workpiece. The suction cup is located at the bottom of the conveying arm 22. The calibration module 30 and the conveying module 20 are arranged adjacent to each other. When the clamping part 23 clamps the packaged workpiece, the conveying arm 22 moves the clamping part 23, thereby moving the packaged workpiece from the loading module 10 to the calibration module 30 for calibration. After the packaged workpiece has completed calibration, the conveying arm 22 moves the suction cup down to the location of the packaged workpiece, the suction cup adheres to the packaged workpiece, and the conveying arm 22 moves the suction cup and the packaged workpiece to the cutting disc. In use, the feeding module 10, the handling module 20, and the calibration module 30 are arranged linearly adjacently, forming a smooth material conveying channel, shortening the handling path and reducing motion waiting time. The handling arm 22 can complete multiple actions such as clamping, transferring, releasing, adsorbing, and re-transferring on a single track, avoiding complex multi-axis hand-changing or intermediate buffering steps, simplifying the control system logic, improving the processing efficiency per unit time, and facilitating modular installation and maintenance. Moreover, the handling mechanism 100 for packaging workpieces achieves automated, intelligent, and highly reliable operation of the entire process of feeding, calibration, handling, and cutting preparation.

[0064] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A conveying mechanism for packaging workpieces, characterized in that, include: The feeding module (10) is used to feed the packaged workpiece; The transport module (20) and the loading module (10) are arranged adjacent to each other. The transport module (20) includes a frame (21), a transport arm (22), a clamping part (23) and a suction cup. The transport arm (22) is movably installed on the frame (21). The clamping part (23) is installed at the end of the transport arm (22) and is used to clamp and package the workpiece. The suction cup is located at the bottom of the transport arm (22). The calibration module (30) and the conveying module (20) are arranged adjacent to each other. When the clamping part (23) clamps the packaged workpiece, the conveying arm (22) drives the clamping part (23) to move, thereby moving the packaged workpiece from the feeding module (10) to the calibration module (30) for calibration. When the calibrated workpiece is completed, the transport arm (22) moves the suction cup down to the position of the workpiece, the suction cup holds the workpiece, and the transport arm (22) moves the suction cup and the workpiece to the cutting disc.

2. The conveying mechanism for packaging workpieces according to claim 1, characterized in that, The clamping part (23) includes a drive source, a clamping block (231) and a clamping seat (232). The drive source is connected to both the clamping block (231) and the clamping seat (232). The clamping block (231) is located above the clamping seat (232). The clamping block (231) and the clamping seat (232) are used to move closer to each other under the drive of the drive source, thereby clamping the packaged workpiece. The contact length between the clamping block (231) and the packaged workpiece is within 2 mm.

3. The conveying mechanism for packaging workpieces according to claim 2, characterized in that, The clamping block (231) has a trapezoidal structure. The length of the bottom surface of the clamping block (231) is less than the length of the top surface. The bottom surface of the clamping block (231) is used to contact the packaged workpiece.

4. The conveying mechanism for packaging workpieces according to claim 2, characterized in that, The direction of the thickness of the clamping block (231) is consistent with the length direction of the packaged workpiece.

5. The conveying mechanism for packaging workpieces according to claim 2, characterized in that, Both the clamping block (231) and the clamping seat (232) are made of non-metallic elastic material.

6. The conveying mechanism for packaging workpieces according to claim 2, characterized in that, The top surface of the clamping seat (232) is provided with a clearance part (2321) and an abutment part (2322). The position of the abutment part (2322) corresponds to the position of the bottom surface of the clamping block (231). The bottom surface of the abutment part (2322) and the clamping block (231) together clamp the packaged workpiece. The clearance part (2321) is provided on both sides of the abutment part (2322).

7. The conveying mechanism for packaging workpieces according to claim 1, characterized in that, The calibration module (30) includes a calibration platform (31), a first slide rail (32) and a second slide rail (33). The first slide rail (32) and the second slide rail (33) are spaced apart on the calibration platform (31). The transport arm (22) is located above the calibration platform (31). The transport arm (22) drives the clamping part (23) to move, so that the clamping part (23) drives the two sides of the packaged workpiece to slide into the first slide rail (32) and the second slide rail (33) respectively.

8. The conveying mechanism for packaging workpieces according to claim 7, characterized in that, The end of the transport arm (22) is provided with an anti-reverse pin, and the front of the packaged workpiece is provided with a positioning hole. The position of the anti-reverse pin is adapted to the position of the positioning hole. When the packaged workpiece slides into the first slide rail (32) and the second slide rail (33) and the front of the packaged workpiece is facing upward, the transport arm (22) moves downward so that the anti-reverse pin is inserted into the positioning hole to perform anti-reverse detection on the packaged workpiece.

9. The conveying mechanism for packaging workpieces according to claim 7, characterized in that, The calibration module (30) further includes an anti-reverse detection element (34), which is installed on the first slide (32) and / or the second slide (33). The front of the packaged workpiece is provided with a detection hole. The position of the anti-reverse detection element (34) is adapted to the position of the detection hole. When the packaged workpiece slides into the first slide (32) and the second slide (33) and the front of the packaged workpiece is facing upward, the anti-reverse detection element (34) detects the detection hole and sends a signal that the packaged workpiece is placed correctly. When the packaged workpiece slides into the first slide (32) and the second slide (33) and the back of the packaged workpiece is facing upward, the anti-reverse detection element (34) does not detect the detection hole and sends a signal that the packaged workpiece is placed incorrectly.

10. The conveying mechanism for packaging workpieces according to any one of claims 1-9, characterized in that, The transport module (20) also includes an unloading arm (24), which is movably mounted on the frame (21). The unloading arm (24) is provided with an air blower for blowing away residual water before adsorbing and packaging the workpiece.

11. A semiconductor processing apparatus, characterized in that, Includes the conveying mechanism for packaging workpieces as described in any one of claims 1-10.

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