Substrate cleaning apparatus and substrate cleaning method using same

Abstract

One embodiment of the present invention provides a substrate cleaning apparatus and a substrate cleaning method using the same, the substrate cleaning apparatus comprising: a substrate rotating module for supporting and fixing a substrate to be cleaned and rotating the substrate about a virtual central axis; a chemical solution supply module having an upper chemical solution supply unit for supplying a chemical solution to the upper surface of the substrate and a lower chemical solution supply unit for supplying a chemical solution to the lower surface of the substrate; and a bowl-shaped object module which is arranged on the outer side of the substrate rotating module and discharges the chemical liquid scattered from the substrate through rotation, and a chemical liquid filling space is formed between the upper surface of a rotating chuck which is arranged on the substrate rotating module and the lower surface of the substrate which is fixed on the substrate rotating module. The cleaning operation of the substrate is performed while the lower surface of the substrate is immersed in the chemical solution filled in the chemical solution filling space.

Description

Technical Field

[0001] This invention relates to a substrate cleaning apparatus and a substrate cleaning method using the same, and more specifically, to a substrate cleaning apparatus and a substrate cleaning method using the same for uniformly cleaning the upper and lower surfaces of a substrate. Background Technology

[0002] Generally, during substrate fabrication, cleaning is an essential step to remove foreign matter from the substrate surface and improve substrate yield. Specifically, after processes such as the deposition of insulating films and metal substances, etching, and the coating of photosensitive agents, various impurities may remain on the substrate surface. Since these impurities are significant factors affecting substrate performance and yield, the substrate cleaning process is crucial.

[0003] This substrate cleaning operation involves spraying a cleaning solution onto the upper and lower parts of the substrate while it is rotating, with the substrate as the center, thereby cleaning the substrate. Specifically, the cleaning solution sprayed onto the substrate is propelled from the center to the edge by the centrifugal force of the rotating substrate, thus performing a comprehensive cleaning of both the upper and lower surfaces of the substrate.

[0004] However, the lower liquid supply section, used for spraying liquid onto the lower surface of the substrate, sprays liquid onto the center of the substrate in a largely fixed state. Therefore, depending on the substrate's rotation speed or the liquid flow rate, there are cases where the lower surface of the substrate cannot be cleaned properly. In other words, if the liquid sprayed onto the center of the substrate fails to be continuously supplied to the edge and falls off in the middle, proper substrate cleaning cannot be performed. Due to this problem, substrate cleaning operations are sometimes performed while the substrate is flipped.

[0005] Furthermore, since the substrate cleaning apparatus uses high-temperature solutions, such as those above 120°C, to clean the substrate, infrared lamps are used to maintain the substrate temperature at a predetermined temperature in order to achieve effective substrate cleaning. However, because existing substrate cleaning apparatuses have infrared lamps installed on the upper side of the substrate, there is a possibility of jamming when the upper solution supply unit moves, and the overall structure of the apparatus becomes more complex.

[0006] Therefore, various research and development efforts are underway on substrate cleaning apparatuses that perform uniform cleaning of the upper and lower surfaces of substrates. Summary of the Invention

[0007] Technical issues The technical problem of the present invention, which aims to solve the problems described above, is to provide a substrate cleaning apparatus and a substrate cleaning method using the same for uniformly cleaning the upper and lower surfaces of a substrate.

[0008] Solution to the problem To address the aforementioned technical problem, one embodiment of the present invention provides a substrate cleaning apparatus, comprising: a substrate rotation module for supporting and fixing a substrate for cleaning, and rotating the substrate with respect to a virtual central axis; a solution supply module having an upper solution supply section for supplying solution to the upper surface of the substrate and a lower solution supply section for supplying solution to the lower surface of the substrate; and a bowl-shaped module disposed outside the substrate rotation module, discharging solution that is dispersed from the substrate by rotation; a solution filling space is formed between the upper surface of a rotating chuck disposed on the substrate rotation module and the lower surface of the substrate fixed to the substrate rotation module, wherein the lower surface of the substrate is immersed in the solution filling the solution filling space for substrate cleaning.

[0009] In one embodiment of the present invention, a liquid discharge blade disposed on the edge of the rotating chuck can be inserted into a blade insertion slot of the first bowl-shaped object disposed on the bowl-shaped object module. When the liquid discharge blade is inserted into the blade insertion slot, the upper end of the liquid receiving shoulder forming the blade insertion slot is configured to be higher than the lower surface of the substrate and lower than the upper surface of the substrate.

[0010] In one embodiment of the present invention, the blade insertion groove can form a second space separated from the liquid discharge blade, and the blade insertion groove is inclined so that the closer it is to the central axis, the further it moves from the top to the bottom.

[0011] In one embodiment of the present invention, a plurality of lamps with a predetermined interval in the outward direction with reference to the central axis may be provided on the lower surface of the rotary chuck. The heat energy generated from the lamps is transferred to the substrate through the liquid contained in the liquid filling space, so that the substrate maintains a predetermined temperature, and the plurality of lamps may be configured to be independently controlled.

[0012] In one embodiment of the present invention, the substrate rotation module may include: a rotating chuck; a plurality of substrate fixing portions forming a predetermined interval around the outer periphery of the rotating chuck, and supporting and fixing the edge of the substrate in a state where the upper surface of the rotating chuck and the substrate are separated by a predetermined interval; a rotation power unit for rotating the rotating chuck; a power support unit having a hollow portion for inserting and fixing the rotation power unit and supporting the rotation power unit; and a bellows, one end of which is combined with the power support unit and the other end of which is combined with the placement surface formed on the bowl-shaped module.

[0013] In one embodiment of the present invention, the substrate fixing part may include: a chuck pin for supporting the upper edge of the substrate; a chuck pin pressing part inserted into a chuck fixing groove formed in the rotating chuck and supporting the lower edge of the substrate together with the chuck pin; a chuck pin shaft for through-insertion of the chuck pin pressing part, and the upper end of the chuck pin shaft engaging with the chuck pin; a spring, one end of which is supported by a chuck pin support part having the chuck fixing groove, and the other end of which is supported by a pressing support surface disposed at the lower end of the chuck pin shaft; and a height adjusting ring for pressing the pressing support surface and guiding the chuck pin shaft to move up and down.

[0014] In one embodiment of the invention, an extension guide combined with the chuck pin support can be disposed on the outside of the bellows, with the lower end of the extension guide disposed below the upper end of the bellows.

[0015] In one embodiment of the present invention, the lower medicine supply unit may include: a lower medicine nozzle for spraying medicine toward the lower surface of the substrate; and a central drain outlet for discharging medicine flowing into the first space between the lower medicine nozzle and the rotary chuck.

[0016] In one embodiment of the present invention, the bowl-shaped module may include: a first bowl-shaped object; a second bowl-shaped object, spaced apart and disposed on the upper part of the first bowl-shaped object, forming a first discharge space together with the first bowl-shaped object; a third bowl-shaped object, spaced apart and disposed on the upper part of the second bowl-shaped object, forming a second discharge space together with the second bowl-shaped object; and a bowl-shaped object housing, spaced apart and disposed on the upper part of the third bowl-shaped object, forming a third discharge space together with the third bowl-shaped object, and protecting the first bowl-shaped object to the third bowl-shaped object.

[0017] In one embodiment of the present invention, a placement surface may be formed on the first bowl-shaped object, which is attached to the lower part of the corrugated tube of the substrate rotation module. The placement surface is provided with a bottom drain port, which is used to discharge the medicine flowing in through the second space between the medicine discharge blade and the blade insertion groove provided on the edge of the rotating chuck. The medicine discharged through the first discharge space is discharged to the side drain port that penetrates the first bowl-shaped object.

[0018] An embodiment of the present invention provides a substrate cleaning method, comprising: step (a) loading a substrate onto a substrate rotating module at the upper part of an outermost bowl-shaped object; step (b) the substrate rotating module being located between a first bowl-shaped object and a second bowl-shaped object; step (c) spraying a liquid solution from an upper liquid supply unit and a lower liquid supply unit toward the upper and lower surfaces of the substrate located between the first and second bowl-shaped objects; step (d) the substrate rotating module rinsing and drying the substrate in the outermost bowl-shaped object; step (e) the substrate rotating module stopping the substrate from rotating, the substrate rotating module being located at the upper part of the outermost bowl-shaped object; and step (f) a robot unloading the substrate, wherein in step (b), the lower surface of the substrate is immersed in a liquid solution contained in a liquid solution filling space while the substrate is being cleaned.

[0019] In one embodiment of the present invention, in step (c), a plurality of lamps are provided on the lower surface of the rotating chuck of the substrate rotating module, with a predetermined interval formed in the direction of outward with reference to the central axis. The lamps transfer heat energy to the substrate through the liquid contained in the liquid filling space, so that the substrate maintains a predetermined temperature.

[0020] In one embodiment of the present invention, the upper liquid supply section can be oscillating to move from the center of the substrate to the edge and spray liquid. The rotational speed of the substrate in the second position between the second and third bowl-shaped objects is faster than the rotational speed of the substrate in the lowest position.

[0021] In one embodiment of the present invention, in step (a), the substrate is loaded onto the substrate rotation module with a spacing of 0.5 to 20 mm between the lower surface of the substrate and the upper surface of the rotating chuck disposed on the substrate rotation module.

[0022] The effects of the invention The effects of the substrate cleaning apparatus and substrate cleaning method of the present invention described above are explained below: According to the present invention, the lower surface of the substrate is immersed in a solution filling the solution-filling space during substrate cleaning. This prevents the problem of the lower surface of existing substrates being unable to be properly cleaned. Therefore, substrate cleaning can be performed effectively.

[0023] According to the present invention, since multiple lamps disposed at the lower part of the rotating chuck transfer heat generated from the lamps to the substrate through the liquid contained in the liquid filling space, linear heat transfer to the substrate is possible. Furthermore, since the multiple lamps arranged at predetermined intervals can be individually controlled, the heat output of the lamps can be selectively adjusted according to the substrate position where the lamps are positioned. Therefore, the entire substrate can maintain a uniform temperature regardless of its location. Moreover, since the lamps are disposed at the lower part of the rotating chuck, they will not jam with the swingable upper liquid supply section, and the structure of the substrate cleaning apparatus can be simplified.

[0024] It should be understood that the effects of the present invention are not limited to those described above, but include all effects that can be inferred from the structure of the invention as described in the specific embodiments or claims. Attached Figure Description

[0025] Figure 1 This is a structural diagram of a substrate cleaning apparatus according to an embodiment of the present invention.

[0026] Figure 2 This is a perspective view of a substrate cleaning apparatus according to an embodiment of the present invention, viewed from above.

[0027] Figure 3 This is a perspective view of a substrate cleaning apparatus according to an embodiment of the present invention, viewed from below.

[0028] Figure 4 for Figure 2 A-A' sectional view.

[0029] Figure 5 This is a cross-sectional view of the main part of a substrate rotation module according to an embodiment of the present invention.

[0030] Figure 6 This is an example diagram illustrating the state in which the liquid discharge blade of an embodiment of the present invention is inserted into the blade insertion slot.

[0031] Figure 7 This diagram illustrates the workflow of a substrate cleaning method according to an embodiment of the present invention.

[0032] Figure 8 An example diagram is provided to briefly illustrate the state of movement of the substrate rotation module or bowl-shaped module during substrate cleaning in an embodiment of the present invention. Detailed Implementation

[0033] The present invention will now be described with reference to the accompanying drawings. However, the present invention can be embodied in many different forms, and is therefore not limited to the embodiments described herein. Furthermore, parts unrelated to the description have been omitted for the purpose of clearly illustrating the present invention, and similar reference numerals are used for similar parts throughout this specification.

[0034] Throughout the specification, when it is stated that one part is "connected" to another part, this includes not only "direct connection" but also "indirect connection" with other components in between. Furthermore, when it is stated that a part "comprises" a structural element, unless otherwise stated, it implies that other structural elements may also be included, and does not exclude other structural elements.

[0035] In this invention, "upper" and "lower" mean located above or below the object component, and do not necessarily mean that they must be located above or below the object component in accordance with the direction of gravity.

[0036] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0037] Figure 1 This is a structural diagram of a substrate cleaning apparatus according to an embodiment of the present invention. Figure 2 This is a perspective view of a substrate cleaning apparatus according to an embodiment of the present invention, viewed from above. Figure 3 This is a perspective view of a substrate cleaning apparatus according to an embodiment of the present invention, viewed from below. Figure 4 for Figure 2 Sectional view A-A' Figure 5 This is a cross-sectional view of the main part of a substrate rotation module according to an embodiment of the present invention. Figure 6 This is an example diagram illustrating the state in which the liquid discharge blade of an embodiment of the present invention is inserted into the blade insertion slot.

[0038] like Figures 1 to 6 As shown, the substrate cleaning apparatus 1000 may include a substrate rotation module 100, a liquid supply module 200, and a bowl-shaped module 300.

[0039] This substrate rotation module 100 supports and fixes the loaded substrate W, and controls the rotation and up-and-down movement of the substrate W. The substrate W can be a silicon wafer, serving as a semiconductor substrate.

[0040] This substrate rotation module 100 may include a rotation chuck 110, a substrate fixing part 120, a rotation power part 130, a power support part 140, and a bellows 150.

[0041] The rotary chuck 110 is combined with the rotary power unit 130. The rotary chuck 110 receives the rotational force from the rotary power unit 130, causing the substrate W to rotate.

[0042] Furthermore, the substrate fixing part 120 can be provided on the edge of the rotary chuck 110, and multiple parts can be provided at predetermined intervals around the rotary chuck 110.

[0043] This substrate fixing part 120 supports and fixes the edge of the mounted substrate W. In this invention, although the example shown is a configuration with 6 substrate fixing parts 120, the number of substrate fixing parts 120 is not limited to 6, and can be formed in various numbers other than 6.

[0044] The substrate fixing part 120 supports and fixes the substrate W loaded in the substrate rotation module 100 at a predetermined interval from the upper surface of the rotating chuck 110.

[0045] This substrate fixing part 120 may include a chuck pin 121, a chuck pin pressing part 122, a chuck pin shaft 123, a spring 124, and a height adjusting ring 125.

[0046] The chuck pin 121 supports the upper edge of the substrate W. This chuck pin 121 can move up and down by operating the height adjustment ring 125.

[0047] Furthermore, the chuck pin pressing part 122 supports the lower edge of the substrate W, which is loaded together with the chuck pin 121. This chuck pin pressing part 122 is inserted into and fixed in the chuck fixing groove 113 formed in the chuck pin support part 112.

[0048] Furthermore, the chuck pin 123 is inserted through the shaft through hole 126 formed in the chuck pin pressing part 122. The upper end of the chuck pin 123 is combined with the chuck pin 121, and the chuck pin 123 and the chuck pin 121 are integrated.

[0049] Furthermore, the spring 124 is inserted through the chuck pin 123. One end of the spring 124 is supported by the chuck pin support 112, and the other end is supported by the pressure support surface 127. The pressure support surface 127 is engaged with the lower end of the chuck pin 123 and supports the spring 124.

[0050] Furthermore, the height adjustment ring 125 applies pressure to the pressure support surface 127 and guides the chuck pin 123 to move up and down. This height adjustment ring 125 is combined with an up-and-down movement adjustment part (not shown) for adjusting the up-and-down movement of the height adjustment ring 125, thereby allowing the height adjustment ring 125 to move up and down according to the desired height.

[0051] The process of loading substrate W into substrate rotation module 100 can be roughly observed as follows: First, height adjustment ring 125 moves upward. During this process, spring 124 is compressed, and chuck pin 123 moves upward. Moreover, chuck pin 121, which is coupled with chuck pin 123, also moves upward together with chuck pin 123.

[0052] As the chuck pin 121 moves upward with reference to the chuck pin pressing part 122, a substrate insertion space is provided between the chuck pin 121 and the chuck pin pressing part 122, and the robot moves the substrate W into the substrate insertion space.

[0053] Then, the height adjustment ring 125 moves downward. During this process, the chuck pin 121 moves downward and supports the upper edge of the substrate W, while the chuck pin pressing part 122 supports the lower edge of the substrate W. At this time, the chuck pin 121 stably supports and fixes the substrate W by the restoring force of the spring 124.

[0054] The substrate W, supported and fixed by the substrate fixing part 120, is fixed at a predetermined interval from the upper surface of the rotary chuck 110. The distance between the lower surface of the substrate W and the upper surface of the rotary chuck 110 can be 0.5 to 20 mm. If the distance between the lower surface of the substrate W and the upper surface of the rotary chuck 110 is less than 0.5 mm, the substrate W may break during loading. Furthermore, if the distance between the lower surface of the substrate W and the upper surface of the rotary chuck 110 is greater than 20 mm, it may be impossible to properly perform the chemical cleaning operation on the lower surface of the substrate W. Therefore, preferably, the distance between the lower surface of the substrate W and the upper surface of the rotary chuck 110 is 0.5 to 20 mm. More preferably, the distance between the lower surface of the substrate W and the upper surface of the rotary chuck 110 is 1 to 3 mm.

[0055] In this manner, with the substrate W mounted on the substrate rotation module 100, the substrate rotation module 100 moves downward. The substrate rotation module 100 may be provided with a movement control unit 170 for moving the substrate rotation module 100 upwards and downwards, thereby allowing the substrate rotation module 100 to move upwards and downwards to the desired position.

[0056] In this manner, the substrate W, which is moved downwards by the movement control unit 170, is cleaned while its lower surface is immersed in the liquid filling space 101. A liquid receiving shoulder 311 may be formed on the first bowl-shaped member 310, and the liquid filling space 101 may be filled with liquid. Therefore, for the initial cleaning operation, the lower surface of the substrate W, which is moving towards the first position P1, may be immersed in the liquid contained in the liquid filling space 101. This liquid filling space 101 may be filled with a first liquid supplied from the lower liquid supply unit 220.

[0057] Specifically, with the liquid discharge blade 111, located on the edge of the rotary chuck 110, inserted into the blade insertion slot 312 of the first bowl-shaped object 310, a liquid receiving shoulder 311 and the upper surface of the rotary chuck 110 are provided together to form a receiving space for receiving the first liquid. That is, the upper surface of the rotary chuck 110 can form the bottom surface of the liquid filling space 101, and the liquid receiving shoulder 311 forms the side surface of the liquid filling space 101, thereby allowing the first liquid to be filled into the liquid filling space 101. For this purpose, the lower surface of the substrate W can be immersed in the first liquid contained in the liquid filling space 101.

[0058] In this manner, with the liquid discharge blade 111 inserted into the blade insertion slot 312, the liquid receiving shoulder 311 is configured such that its upper end is higher than the lower surface of the substrate W and lower than the upper surface of the substrate W. Therefore, the lower surface of the substrate W can be immersed in the first liquid contained in the liquid filling space 101. Furthermore, in the substrate W, not only the lower surface of the substrate W is immersed in the first liquid, but also a portion of the side surface of the substrate W is immersed in the first liquid.

[0059] During the process of spraying the first liquid onto the lower surface of the substrate W through the lower liquid supply nozzle 221 located in the lower liquid supply section 220, a portion of the first liquid contained in the liquid filling space 101 is discharged. For example, the upper end of the lower liquid nozzle 221 is inserted through the center of the rotating chuck 110. Since the lower liquid nozzle 221 is a fixed structure and the rotating chuck 110 is a rotating structure, a small first separation space G1 can be formed between the lower liquid nozzle 221 and the rotating chuck 110, and the first liquid flowing into the first separation space G1 can be discharged through the central drain port 222. Furthermore, the first liquid flowing into the second separation space G2 between the liquid discharge blade 111 and the blade insertion groove 312 can be discharged through the bottom drain port 341.

[0060] On the other hand, the blade insertion groove 312 is formed in an inclined groove shape so that it gets closer to the central axis C as it moves from the top to the bottom. In this way, during the process of the first liquid filling the liquid filling space 101 being discharged through the second space G2, the inclined blade insertion groove 312 delays the smooth discharge of the first liquid. As a result, the first liquid can be effectively filled into the liquid filling space 101.

[0061] Furthermore, an extension guide 114 is incorporated in the chuck pin support portion 112 located around the outer side of the lower part of the rotary chuck 110. This extension guide 114 extends from the chuck pin support portion 112.

[0062] This extension guide 114 prevents the first liquid, which flows into the second partition space G2 and is discharged from the bottom drain port 341, from flowing into the rotating power unit 130 and other components disposed inside the extension guide 114. That is, the extension guide 114, together with the bellows 150, prevents the first liquid flowing into the second partition space G2 from penetrating into various components disposed inside the extension guide 114, such as the rotating power unit 130, the height adjustment ring 125, and the spring 124. Therefore, corrosion of various components, including the rotating power unit 130, due to the first liquid can be prevented.

[0063] This extension guide 114 is disposed on the outside of the bellows 150. At this time, the lower end of the extension guide 114 is lower than the upper end of the bellows 150, thereby preventing the first liquid from seeping between the extension guide 114 and the bellows 150.

[0064] Furthermore, a hollow space is formed in the center of the power support portion 140 for inserting and fixing the rotating power unit 130, and the rotating power unit 130 inserted into the hollow space can be supported by the power support portion 140. Among them, the rotating power unit 130 for rotating the rotary chuck 110 can be a motor.

[0065] Furthermore, one end of the bellows 150 is connected to the power support 140, and the other end of the bellows 150 is connected to the placement surface 313 formed on the first bowl-shaped object 310. During the up-and-down movement of the rotation power unit 130 by the movement control unit 170, the bellows 150 expands and contracts, preventing the liquid medicine from seeping into the inside of the bellows 150.

[0066] On the other hand, the substrate rotation module 100 may also include a lamp 160.

[0067] This lamp 160 can be installed on the lower surface of the rotating chuck 110. As an example, the lamps 160 can be spaced at predetermined intervals outward from the central axis C, and multiple lamps can be installed.

[0068] Because the lamp 160 transfers heat generated from the lamp 160 to the substrate W through a first liquid contained in the liquid filling space 101, the substrate W can maintain the required pre-specified temperature. A reflector 161 is provided at the lower part of the lamp 160, thereby effectively transferring heat generated from the lamp 160 to the lower surface of the substrate W.

[0069] The heat output of these multiple lamps 160 can be selectively adjusted according to their positions on the substrate W. That is, each lamp 160 can be individually controlled. For example, the center of the substrate W, which discharges a first liquid at a temperature of 120°C or higher through the lower liquid nozzle 221, can be close to the temperature of the first liquid, but the temperature of the substrate W decreases as it approaches the edge. Therefore, the heat output of the lamps 160 located on the outer edge of the substrate W can be controlled to be greater than that of the lamps 160 located in the center. In this way, the multiple lamps 160 can be individually controlled at different positions, allowing the entire substrate W to maintain a uniform temperature. As an example, these lamps 160 can be infrared lamps, but any lamp that can effectively increase the temperature of the substrate W can be used, except for infrared lamps.

[0070] On the other hand, the liquid medicine supply module 200 may include an upper liquid medicine supply unit 210 and a lower liquid medicine supply unit 220.

[0071] The upper medicine nozzle 211, located in the upper medicine supply section 210, is used to spray medicine onto the upper surface of the substrate W. This upper medicine nozzle 211 can oscillate, allowing it to move from the center of the substrate W to the edge and spray medicine.

[0072] This upper chemical nozzle 211 can selectively adjust the speed at which it moves from the center to the edge, and can also spray chemical solution onto the upper surface of the substrate W. Alternatively, the upper chemical nozzle 211 can repeatedly move from the center to the edge and spray chemical solution, and for areas that still need cleaning, it can pause for a specified time and spray chemical solution again. In this way, the upper chemical nozzle 211 performs cleaning operations on the upper surface of the substrate W in multiple ways.

[0073] Multiple upper medicine nozzles 211 can be provided. For example, they can be configured as different nozzles, such as a nozzle for spraying the first medicine, a nozzle for spraying the second medicine, a nozzle for rinsing, and a nozzle for drying. In this invention, the configuration in which the first medicine, the second medicine, rinsing, and drying operations are performed using a single upper medicine nozzle 211 will be described.

[0074] Furthermore, the lower liquid supply unit 220 is used to spray liquid onto the lower surface of the substrate W.

[0075] This lower medicine supply unit 220 may include a lower medicine nozzle 221 and a central drain port 222.

[0076] The lower medicine nozzle 221 is fixed in a different manner than the upper medicine nozzle 211. This lower medicine nozzle 221 has a flange 223, which is connected to the lower part of the rotating power unit 130. Like the upper medicine nozzle 211, this lower medicine nozzle 221 performs the first medicine, second medicine, rinsing, and drying operations.

[0077] Furthermore, the central drain port 222 discharges the liquid that flows into the first separation space G1 between the rotating chuck 110 and the lower liquid nozzle 221.

[0078] On the other hand, the bowl-shaped module 300 is disposed on the outside of the substrate rotation module 100 and discharges the liquid medicine that is dispersed from the substrate W by rotation.

[0079] This bowl-shaped module 300 may include a first bowl 310, a second bowl 320, a third bowl 330, and a bowl-shaped housing 340.

[0080] The first bowl-shaped object 310 may be provided with a liquid receiving shoulder 311, and the liquid filling space 101 may be filled with liquid.

[0081] Furthermore, the second bowl-shaped object 320 is positioned above the first bowl-shaped object 310. This second bowl-shaped object 320 together with the first bowl-shaped object 310 forms the first discharge space 301. The liquid medicine discharged through the first discharge space 301 can be discharged through the side drain port 342 penetrating the first bowl-shaped object 310.

[0082] Furthermore, the third bowl-shaped object 330 is positioned above the second bowl-shaped object 320. This third bowl-shaped object 330 and the second bowl-shaped object 320 together form the second discharge space 302. The medicine discharged through this second discharge space 302 can be discharged through the medicine discharge section (not shown).

[0083] Furthermore, the bowl-shaped housing 340 is spaced apart from the upper part of the third bowl-shaped object 330, and together with the third bowl-shaped object 330, forms the third discharge space 303. Through this third discharge space 303, rinsing liquid for rinsing the substrate W and gas for drying the substrate W can be discharged to the external discharge port 343.

[0084] This bowl-shaped housing 340 is used to protect the first bowl-shaped object 310 to the third bowl-shaped object 330 from the outside. This bowl-shaped module 300 prevents liquid medicine from splashing from the substrate W from splashing to the outside of the bowl-shaped module 300.

[0085] In one embodiment of the present invention, although the bowl-shaped module 300 is described as including a first bowl-shaped object 310, a second bowl-shaped object 320, a third bowl-shaped object 330, and a bowl-shaped object housing 340, the number of bowl-shaped objects disposed in the bowl-shaped module 300 is not limited to the first bowl-shaped object 310 to the third bowl-shaped object 330, and may also include a fourth bowl-shaped object (not shown), a fifth bowl-shaped object (not shown), etc. That is, the number of bowl-shaped objects disposed in the bowl-shaped module 300 can be varied.

[0086] Figure 7 This is a diagram illustrating the operation sequence of a substrate cleaning method according to an embodiment of the present invention. Figure 8 An example diagram is provided to briefly illustrate the state of movement of the substrate rotation module or bowl-shaped module during substrate cleaning in an embodiment of the present invention.

[0087] The substrate cleaning method of the present invention will be described using the form of a bowl-shaped module 300 consisting of a first bowl-shaped object 310, a second bowl-shaped object 320, a third bowl-shaped object 330, and a bowl-shaped object housing 340 as an example. The third bowl-shaped object 330 may be the outermost bowl-shaped object among the plurality of first bowl-shaped objects 310 to third bowl-shaped objects 330.

[0088] Moreover, such as Figure 8 As shown, during the cleaning process of the substrate W mounted on the substrate rotation module 100, the relative position between the substrate rotation module 100 and the bowl-shaped module 300 is adjusted, such as... Figure 8 As shown in part (a), the bowl-shaped module 300 can move the substrate rotation module 100 up and down in a fixed state, such as... Figure 8 As shown in part (b), the substrate rotation module 100 can move the bowl-shaped module 300 up and down in a fixed state. When the bowl-shaped module 300 moves up and down, the entire bowl-shaped module 300 can move up and down. Furthermore, when the first bowl-shaped module 310 to the third bowl-shaped module 330 are separated individually, each of the first bowl-shaped module 310 to the third bowl-shaped module 330 can also move up and down individually.

[0089] In describing the substrate cleaning method of the present invention, the bowl-shaped module 300 is in a fixed state, and the substrate rotation module 100 moves up and down as an example.

[0090] pass Figure 7The operation of the substrate cleaning apparatus 1000 can be roughly observed as follows: First, the substrate W is loaded onto the substrate rotation module 100. In other words, the substrate W is loaded onto the substrate rotation module 100 at the top of the outermost bowl-shaped part, that is, at the top of the third bowl-shaped part 330. At this time, the substrate W, which is transferred by the robot, can be supported and fixed by the substrate fixing part 120. The distance between the lower surface of the substrate W and the upper surface of the rotating chuck 110 provided on the substrate rotation module 100 can be formed to be 0.5 to 20 mm, and the substrate W can be loaded onto the substrate rotation module 100 (step S100).

[0091] Then, the substrate rotation module 100 rotates the substrate W and moves it downwards. Specifically, the substrate rotation module 100 moves to a first position P1 between the first bowl-shaped member 310 and the second bowl-shaped member 320, which is the lowest point. At this time, the position of the substrate rotation module 100 can be the position where the lower surface of the substrate W can be immersed in the first medicine in the medicine filling space 101 (step S200).

[0092] Then, the upper liquid supply unit 210 sprays the first liquid onto the upper surface of the substrate W, and the lower liquid supply unit 220 sprays the first liquid onto the lower surface of the substrate W. During this process, the lower surface of the substrate W rotates while being immersed in the first liquid filling the liquid filling space 101. The first liquid sprayed onto the substrate W by the upper liquid supply unit 210 and the lower liquid supply unit 220 can be, for example, an aqueous solution of phosphoric acid. This first liquid is not limited to an aqueous solution of phosphoric acid, and can also be other liquids (step S300).

[0093] In this way, the first liquid medicine, which is dispersed from the substrate W rotating at the first position P1, is discharged through the first discharge space 301 formed between the first bowl-shaped object 310 and the second bowl-shaped object 320. During this process, a plurality of lamps 160, which are coupled to the lower surface of the rotating chuck 110 and are spaced at predetermined intervals outward about the central axis C, can operate to maintain the substrate W at a predetermined temperature. These lamps 160 transfer heat generated from the first liquid medicine contained in the liquid medicine filling space 101 to the substrate W. In this way, since the first liquid medicine contained in the liquid medicine filling space 101 can transfer heat to the substrate W while absorbing the heat generated from the lamps 160, linear heat transfer to the substrate W is possible.

[0094] Furthermore, the upper liquid supply unit 210 that sprays the first liquid onto the upper surface of the substrate W can be oscillating. For example, it can move from the center of the substrate W to the edge and spray the first liquid onto the upper surface of the substrate W.

[0095] In this way, during the process of the upper liquid supply unit 210 spraying the first liquid onto the upper surface of the substrate W and the lower liquid supply unit 220 simultaneously spraying the first liquid onto the lower surface of the substrate W, the first liquid scattered from the rotating substrate W is discharged into the first discharge space 301. At the same time, a portion of the first liquid filling the liquid filling space 101 is discharged into the central drain port 222 and the bottom drain port 341.

[0096] Then, the substrate rotation module 100 moves the substrate W to a second position P2 between the second bowl-shaped object 320 and the third bowl-shaped object 330. In this way, during the movement of the substrate W from the first position P1 to the second position P2, the substrate rotation module 100 further increases the rotational speed of the substrate W.

[0097] Then, with the substrate W moved to the second position P2, the upper liquid supply unit 210 sprays a second liquid onto the upper surface of the substrate W, and the lower liquid supply unit 220 sprays a second liquid onto the lower surface of the substrate W. The second liquid sprayed onto the substrate W can be a different liquid used for cleaning the substrate W than the first liquid.

[0098] Since the rotational speed of the substrate W in the second position P2 is greater than that of the substrate W in the first position P1, the second liquid sprayed onto the substrate W can move from the center of the substrate W to the edge and be completely discharged through the second discharge space 302 formed between the second bowl-shaped object 320 and the third bowl-shaped object 330.

[0099] Then, with the substrate W moved to the third position P3, which is the uppermost position between the third bowl-shaped object 330 and the bowl-shaped object housing 340, the substrate rotation module 100 performs rinsing and drying operations on the substrate W (step S400).

[0100] That is, the upper liquid supply unit 210 and the lower liquid supply unit 220 perform rinsing and drying operations on the substrate W, which has moved to the uppermost third position P3. The rinsing solution can be, for example, de-ionized water (DI water). In this way, the substrate W, after rinsing, can rotate at a speed greater than that of the substrate W in the second position P2 to dry the liquid present in the substrate W. Alternatively, the upper liquid supply unit 210 and the lower liquid supply unit 220 can discharge, for example, nitrogen gas towards the substrate W to dry it. In this way, during the rinsing and drying process of the substrate W, water or gas discharged through the third discharge space 303 can be discharged to the external discharge port 343.

[0101] Then, with the substrate W stopped rotating, the substrate rotation module 100 loads the upper part of the substrate W at the third position P3. That is, the substrate rotation module 100 positions the substrate W that has completed the cleaning process on the upper part of the third bowl-shaped object 330, which is the outermost bowl-shaped object (step S500).

[0102] Finally, the substrate W, which is supported and fixed to the substrate rotation module 100, is released from the fixation by the substrate fixing part 120, and the robot unloads the substrate W from the substrate rotation module 100 (step S600).

[0103] However, this is only a preferred embodiment of the present invention, and the scope of protection of the present invention shall not be limited by the scope of this embodiment.

[0104] The above description of the present invention is for illustrative purposes. Those skilled in the art will understand that it can be easily modified into other specific forms without altering the technical concept or essential features of the invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and are not intended to be limiting. For example, structural elements described in a single form can be implemented separately; similarly, structural elements described separately can also be implemented in a combined form.

[0105] It should be explained that the scope of the present invention should be indicated by the claims, and the meaning and scope of the claims, as well as all changes or modifications derived from their equivalents, are included within the scope of the present invention.

Claims

1. A substrate cleaning apparatus, characterized in that, include: The substrate rotation module supports and fixes the substrate used for cleaning, and rotates the substrate with respect to a virtual central axis. The drug supply module has an upper drug supply section for supplying drug to the upper surface of the substrate and a lower drug supply section for supplying drug to the lower surface of the substrate. as well as A bowl-shaped module is disposed on the outside of the substrate rotation module and discharges the liquid medicine that is dispersed from the substrate by rotation. A liquid filling space is formed between the upper surface of the rotating chuck of the substrate rotating module and the lower surface of the substrate fixed to the substrate rotating module. The substrate is cleaned while the lower surface of the substrate is immersed in the liquid filling the liquid filling space.

2. The substrate cleaning apparatus according to claim 1, characterized in that, The liquid discharge blade, located on the edge of the rotating chuck, is inserted into the blade insertion slot of the first bowl-shaped part of the bowl-shaped module. With the liquid discharge blade inserted into the blade insertion slot, the upper end of the liquid receiving shoulder forming the blade insertion slot is configured to be higher than the lower surface of the substrate and lower than the upper surface of the substrate.

3. The substrate cleaning apparatus according to claim 2, characterized in that, The blade insertion groove and the liquid discharge blade form a second separating space. The blade insertion slot is inclined so that the closer it is to the central axis, the further it moves from the top to the bottom.

4. The substrate cleaning apparatus according to claim 1, characterized in that, The lower surface of the rotary chuck is provided with a plurality of lights arranged at predetermined intervals outward from the central axis. The heat generated by the lamps is transferred to the substrate through the liquid contained in the liquid filling space, so that the substrate maintains a predetermined temperature, and the plurality of lamps are configured to be controlled independently.

5. The substrate cleaning apparatus according to claim 1, characterized in that, The substrate rotation module includes: Rotary chuck; Multiple substrate fixing parts are formed at predetermined intervals around the outer periphery of the rotating chuck, and the upper surface of the rotating chuck and the substrate are separated at predetermined intervals to support and fix the edge of the substrate. The rotating power unit causes the rotating chuck to rotate; A power support portion is formed, having a hollow space for inserting and fixing the rotating power unit, and supporting the rotating power unit; and The corrugated pipe is connected at one end to the power support and at the other end to the placement surface formed on the bowl-shaped module.

6. The substrate cleaning apparatus according to claim 5, characterized in that, The substrate fixing part includes: The chuck pins support the upper edge of the substrate; The chuck pin pressure part is inserted into the chuck fixing groove formed in the rotating chuck, and together with the chuck pin, it supports the lower edge of the substrate. A chuck pin is inserted through the chuck pin pressurization part, and the upper end of the chuck pin is engaged with the chuck pin. A spring, one end of which is supported by a chuck pin support portion having the chuck fixing groove, and the other end of which is supported by a pressure support surface located at the lower end of the chuck pin shaft; and The height adjustment ring applies pressure to the pressure support surface and guides the chuck pin to move up and down.

7. The substrate cleaning apparatus according to claim 6, characterized in that, An extension guide, which is combined with the chuck pin support, is disposed on the outside of the bellows, and the lower end of the extension guide is configured to be lower than the upper end of the bellows.

8. The substrate cleaning apparatus according to claim 1, characterized in that, The lower medicine supply unit includes: The lower liquid nozzle sprays liquid medicine toward the lower surface of the substrate; and The central drain outlet discharges the liquid that flows into the first space between the lower liquid nozzle and the rotary chuck.

9. The substrate cleaning apparatus according to claim 1, characterized in that, The bowl-shaped module includes: The first bowl-shaped object; The second bowl-shaped object is positioned above the first bowl-shaped object, and together with the first bowl-shaped object, forms the first discharge space; A third bowl-shaped object is positioned above the second bowl-shaped object, and together with the second bowl-shaped object, forms a second discharge space; and The bowl-shaped shell is spaced apart and disposed on the upper part of the third bowl-shaped object, forming a third discharge space together with the third bowl-shaped object, and protecting the first bowl-shaped object to the third bowl-shaped object.

10. The substrate cleaning apparatus according to claim 9, characterized in that, The first bowl-shaped object has a placement surface that is coupled to the lower part of the bellows disposed on the base plate rotating module. The placement surface is provided with a bottom drain port, which is used to discharge the medicine flowing in through the second spacer between the medicine discharge blade and the blade insertion groove disposed on the edge of the rotating chuck. The liquid medicine discharged through the first discharge space is discharged into the side discharge port that penetrates the first bowl-shaped object.

11. A substrate cleaning method, characterized in that, include: Step (a): Load the substrate onto the substrate rotation module at the top of the outermost bowl-shaped object; In step (b), the substrate rotation module is located between the first bowl-shaped object and the second bowl-shaped object; Step (c): The upper liquid supply section and the lower liquid supply section spray liquid towards the upper and lower surfaces of the substrate located between the first bowl-shaped object and the second bowl-shaped object. In step (d), the substrate rotation module performs rinsing and drying of the substrate in the outermost bowl-shaped object; Step (e): The substrate rotation module stops the substrate from rotating, and the substrate rotation module is located on the upper part of the outermost bowl-shaped object; as well as Step (f): The robot unloads the substrate. In step (b), the lower surface of the substrate is cleaned while it is immersed in a solution contained in the solution-filled space.

12. The substrate cleaning method according to claim 11, characterized in that, In step (c), The lower surface of the rotating chuck of the substrate rotating module is provided with a plurality of lamps arranged at predetermined intervals in the direction of outward with reference to the central axis. The lamps transfer heat energy to the substrate through the liquid contained in the liquid filling space, so that the substrate maintains a predetermined temperature.

13. The substrate cleaning method according to claim 11, characterized in that, The upper medicine supply section oscillates to move from the center of the substrate towards the edge and spray medicine. The substrate in the second position between the second and third bowl-shaped objects rotates faster than the substrate in the lowest position.

14. The substrate cleaning method according to claim 11, characterized in that, In step (a), the substrate is loaded onto the substrate rotation module with a spacing of 0.5 to 20 mm between the lower surface of the substrate and the upper surface of the rotating chuck provided on the substrate rotation module.

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