Monocrystalline silicon ingot multi-wire cutting machine

Abstract

The invention discloses a monocrystalline silicon ingot multi-wire cutting machine. The device comprises a rack, a clamping mechanism and a cutting mechanism are arranged above the rack, and a transmission mechanism driven by a driving mechanism is arranged below the rack; a plurality of rotating shafts are connected to the rack in a penetrating mode, and the clamping mechanism is connected with the transmission mechanism through the rotating shafts. The clamping mechanism comprises a plurality of clamping arms, and a cutting station is defined by the clamping arms. One end of the clamping arm is fixed at the upper part of the rotating shaft; ball seats are mounted on the clamping arms in a floating manner, and positioning balls are rotationally mounted in the ball seats; a plurality of adsorption holes are formed in the cutting station, a suction cup capable of covering the adsorption holes is fixed to the lower portion of the rack, and an air exhaust mechanism is connected to the suction cup. The single crystal silicon ingot clamping device has the advantages that clamping and positioning are achieved through the positioning balls, the air exhaust mechanism and the clamping blocks, the single crystal silicon ingot clamping device is suitable for single crystal silicon ingots of different sizes, stable and reliable clamping and positioning of the single crystal silicon ingots can be achieved from multiple angles, displacement or deflection caused by stress or shock is avoided, and the quality of cut single crystal silicon wafers is improved.

Description

Technical Field

[0001] This invention relates to a single-crystal silicon wafer processing equipment, specifically a single-crystal silicon ingot multi-wire cutting machine. Background Technology

[0002] As a core material in semiconductors, photovoltaics, and other fields, the processing precision, surface quality, and production efficiency of monocrystalline silicon wafers directly affect the performance and cost of products. In the manufacturing process of monocrystalline silicon wafers, cutting is one of the key steps. Its core objective is to precisely divide monocrystalline silicon ingots into thin wafers of uniform thickness with minimal surface damage, while maximizing the utilization rate of silicon materials.

[0003] Currently, multi-wire cutting is commonly used to prepare monocrystalline silicon wafers. For example, patent CN117584300B discloses a monocrystalline silicon wafer cutting device and its cutting method, and patent CN118528432B discloses a method and device for cutting monocrystalline silicon wafers with fine wires. However, neither of them can stably achieve clamping and positioning of monocrystalline silicon ingots of different sizes. This causes the high-speed wire saw to generate continuous lateral friction and impact forces on the monocrystalline silicon ingot during cutting, causing it to undergo slight translation, rotation or tilting, which affects the quality of the cut monocrystalline silicon wafers. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a multi-wire cutting machine for single crystal silicon ingots that is suitable for raw materials of different sizes and has stable clamping and positioning.

[0005] To solve the above-mentioned technical problems, the present invention provides a multi-wire cutting machine for single-crystal silicon ingots, comprising a frame, a clamping mechanism and a cutting mechanism disposed above the frame, and a transmission mechanism driven by a drive mechanism with a telescopic rod disposed below the frame; a plurality of rotating shafts arranged in a circumferential manner are passed through the frame, and the clamping mechanism is connected to the transmission mechanism through the rotating shafts; the clamping mechanism includes a plurality of clamping arms mounted symmetrically above the frame, which enclose a cutting station for placing the single-crystal silicon ingot to be cut; one end of each clamping arm is fixed to the upper part of the rotating shaft. The other end is fixed with a clamping block. The clamping arm can drive the clamping block to swing along the rotating shaft, thereby clamping and positioning the single crystal silicon ingot. A ball bearing seat is floatingly installed on the clamping arm. A positioning ball bearing is rotatably installed in the ball bearing seat. The positioning ball bearing can perform radial pre-positioning of the single crystal silicon ingot by compression. Multiple adsorption holes are opened at the cutting station. A suction cup that can cover the adsorption holes is fixed under the frame. An air extraction mechanism is connected to the suction cup. The air extraction mechanism can perform axial positioning by adsorbing the single crystal silicon ingot with negative pressure.

[0006] The sidewall of the clamping block is provided with a concave-convex structure to increase the friction between it and the single crystal silicon ingot.

[0007] A mounting block with a through hole in the middle is fixed on the clamping arm. A movable rod passes through the mounting block. A baffle is fixed to the front of the movable rod. A compression spring passes between the baffle and the mounting block. The ball bearing seat is fixed to the front of the baffle.

[0008] The cutting mechanism includes a vertical plate symmetrically fixed above the frame, a horizontal plate slidably disposed on the vertical plate, and a cutting assembly slidably disposed on the horizontal plate.

[0009] The driving mechanism is a hydraulic cylinder.

[0010] The transmission mechanism includes a transmission gear fixedly installed at the lower part of each of the rotating shafts, a gear ring with internal and external teeth rotatably installed on the frame, and a rack slidably installed on the frame. The internal teeth of the gear ring mesh with the transmission gear, and the external teeth mesh with the rack. One end of the rack is fixedly connected to the telescopic rod part of the drive mechanism.

[0011] The frame has a T-shaped annular groove and a T-shaped straight groove. A T-shaped annular groove mounting block for fixing the gear ring is placed in the T-shaped annular groove, and a T-shaped straight groove mounting block for fixing the rack is placed in the T-shaped straight groove.

[0012] A mounting bracket is fixed on the frame. The air extraction mechanism includes a cylinder fixed on the mounting bracket and a piston head with a piston rod slidably disposed in the cylinder. The cylinder is connected to the suction cup through an air supply pipe, and the piston rod is fixedly connected to the rack.

[0013] The advantages of this invention are: (1) The radial pre-positioning is achieved by extruding the monocrystalline silicon ingot using floating positioning balls, the axial positioning is achieved by using the air extraction mechanism to adsorb the monocrystalline silicon ingot by negative pressure, and the main clamping and positioning is achieved by applying pressure to the monocrystalline silicon ingot using multiple clamping blocks. This method can not only adapt to monocrystalline silicon ingots of different sizes, but also achieve stable and reliable clamping and positioning from multiple angles, thereby effectively avoiding displacement or skew due to force or vibration, thus improving the quality of the cut monocrystalline silicon wafers. (2) The rack is slidably installed in the T-shaped straight groove through the T-shaped straight groove mounting block, and the gear ring is rotated and installed in the T-shaped ring groove through the T-shaped ring groove mounting block. Compared with the structure without installation, its movement is more stable. At the same time, the drive device is selected to drive the gear ring with the rack, and the gear ring drives the meshing transmission mode of the transmission gear to finally drive the clamping mechanism to move. The transmission process is stable and reliable, the structure is compact and the transmission efficiency is high. Attached Figure Description

[0014] Figure 1 This is a top-view perspective view of the present invention; Figure 2This is a perspective view of the invention from an upward angle; Figure 3 This is a top-view perspective view of the present invention after removing some components; Figure 4 This is a perspective view from a low angle after removing some components from the present invention; Figure 5 This is a perspective view of the clamping mechanism and transmission mechanism of the present invention; Figure 6 This is a perspective view of the clamping mechanism of the present invention; Figure 7 This is a perspective view of the air extraction mechanism of the present invention. Detailed Implementation

[0015] The multi-wire cutting machine for single-crystal silicon ingots of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0016] As shown in the figure, the single-crystal silicon ingot multi-wire cutting machine of the present invention includes a frame 1. The frame 1 is composed of a main plate as the working surface and support plates located on both sides below the working surface. A hydraulic cylinder as a drive mechanism 4 is fixed at the connecting corner. The telescopic rod of the hydraulic cylinder is connected to a rack 5-3 in the transmission mechanism 5. A T-shaped straight groove 1-2 is opened on the lower surface of the main plate of the frame 1, and a T-shaped straight groove mounting block 1-4 that can slide in it is pre-embedded. The upper surface of the rack 5-3 is fixedly connected to the bottom of the T-shaped straight groove mounting block 1-4 through a connector. A T-shaped annular groove 1-1, i.e., an annular groove with a T-shaped cross-section, is also formed in the middle of the lower surface of the main board of the frame 1. An annular T-shaped groove mounting block 1-3 that can rotate within it is pre-embedded in the groove. The transmission mechanism 5 also includes a gear ring 5-2 whose upper surface is fixedly connected to the bottom of the T-shaped groove mounting block 1-3 via a connector. The gear ring 5-2 has external teeth and internal teeth. The external teeth mesh with the rack 5-3, and the internal teeth mesh with four transmission gears 5-1 that are equally spaced along the circumference inside the gear ring 5-2. The four transmission gears 5-1 are rotatably mounted on the lower surface of the main board of the frame 1 via a rotating shaft 6 fixed at its center.

[0017] The rotating shaft 6 extends upwards and passes through the upper surface of the main board of the frame 1. One end of the clamping arm 2-1 of the clamping mechanism 2 is fixed on it. The four clamping arms 2-1 are centrally symmetrical after being fixed on the rotating shaft 6, and the space enclosed between them is the cutting station for placing the single crystal silicon ingot to be cut. The other end of the clamping arm 2-1 is fixed with a cylindrical clamping block 2-2. The clamping arm 2-1 can drive the clamping block 2-2 to swing along the rotating shaft 6, thereby clamping and positioning the single crystal silicon ingot. The side wall of the clamping block 2-2 is designed with a concave-convex structure similar to a gear to increase the friction between it and the single crystal silicon ingot. A square mounting block 2-5 is fixed to the edge of the upper surface of the clamping arm 2-1. A through hole is opened in the center of the mounting block 2-5, through which a movable rod 2-6 passes. A square baffle 2-7 is fixed to the front of the movable rod 2-6. A compression spring 2-8 passes between the baffle 2-7 and the mounting block 2-5, allowing the movable rod 2-6 to float within the through hole of the mounting block 2-5 according to the applied force. A ball bearing seat 2-3 is fixed to the front of the baffle 2-7, and a rotatable positioning ball 2-4 is pre-installed within the ball bearing seat 2-3. During the rotation of the clamping arm 2-1, the positioning ball 2-4 first contacts the monocrystalline silicon ingot. Under the action of the compression spring 2-8, the positioning ball 2-4 can adaptively float while sliding along the outer wall of the monocrystalline silicon ingot, thus adapting to monocrystalline silicon ingots of different sizes and achieving radial pre-positioning through compression.

[0018] Multiple through-holes 1-5 are opened at the center of the cutting station. A suction cup 1-6 that can cover the suction holes 1-5 is fixed below the main board of the frame 1. A mounting bracket 1-7 located below the drive mechanism 4 is fixed on the inner wall of the support plate of the frame 1. A cylinder 7-1 is fixed on the mounting bracket 1-7. A piston head 7-3 with a piston rod 7-2 is slidably arranged inside the cylinder 7-1. The bottom of the suction cup 1-6 is connected to the rodless end of the cylinder 7-1 through an air supply pipe 7-4. The piston rod 7-2 is connected to the bottom of the rack 5-3 after extending and bending, so that it can pull the piston head 7-3 when driven by the drive mechanism 4 to move, so that the cylinder 7-1 draws air from below to the suction holes 1-5, thereby achieving axial positioning by adsorbing the single crystal silicon ingot through negative pressure.

[0019] A cutting mechanism 3 is also installed above the main board of the frame 1. The cutting mechanism 3 includes vertical plates 3-1 that are symmetrically fixed to the two sides of the working surface of the frame 1. Two longitudinal sliding grooves are opened on the inward side of the vertical plates 3-1. A lead screw slider mechanism (not shown in the figure) is installed inside the vertical plates 3-1, and a horizontal plate 3-2 that can move up and down in the longitudinal sliding grooves is installed through it. Two transverse sliding grooves are opened on the horizontal plates 3-2, and cutting components 3-3 that can move horizontally in them are installed in the same way. A cutting wire is connected between the two cutting components 3-3.

[0020] In actual use, after placing the monocrystalline silicon ingot to be cut on the cutting station, the drive mechanism 4 is first activated. Its telescopic rod drives the rack 5-3 to translate along the T-shaped straight groove 1-2, thereby driving the gear ring 5-2 to rotate along the T-shaped annular groove 1-1. The four transmission gears 5-1 rotate accordingly and drive the four clamping arms 2-1 to rotate through the fixedly connected rotating shaft 6. During the rotation, the positioning balls 2-4 on them first contact the monocrystalline silicon ingot. The positioning balls 2-4 slide along the outer wall of the monocrystalline silicon ingot as the clamping arms 2-1 gradually rotate. Under the action of compression spring 2-8, the device adaptively floats, thus adapting to monocrystalline silicon ingots of different sizes. It also provides radial pre-positioning through compression. Simultaneously, the movement of rack 5-3 pulls piston head 7-3, causing cylinder 7-1 to draw air from below through adsorption holes 1-5. This negative pressure adsorption provides axial positioning of the monocrystalline silicon ingot. After initial positioning, clamping arm 2-1 rotates into position, and each clamping block 2-2 applies pressure to the monocrystalline silicon ingot from multiple angles, thus providing the main clamping and positioning function. The entire process can be summarized as three steps: radial pre-positioning, axial positioning, and main clamping positioning. This not only adapts to monocrystalline silicon ingots of different sizes but also achieves stable clamping and positioning from multiple angles, effectively preventing displacement or skew due to force or vibration, thereby improving the quality of the cut monocrystalline silicon wafers.

[0021] Of course, the above description is not intended to limit the present invention, and the present invention is not limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present invention should also fall within the protection scope of the present invention.

Claims

1. A multi-wire cutting machine for single-crystal silicon ingots, characterized in that: The system includes a frame (1), with a clamping mechanism (2) and a cutting mechanism (3) above the frame (1) and a transmission mechanism (5) driven by a drive mechanism (4) with a telescopic rod below the frame (1); multiple rotating shafts (6) arranged in a circular manner are connected to the frame (1), and the clamping mechanism (2) is connected to the transmission mechanism (5) through the rotating shafts (6); the clamping mechanism (2) includes multiple clamping arms (2-1) installed symmetrically above the frame (1), with a cutting station (8) for placing the single crystal silicon ingot to be cut in between; one end of each clamping arm (2-1) is fixed to the upper part of the rotating shaft (6), and the other end is fixed with a clamping block (2-2). -1) It can drive the clamping block (2-2) to swing along the rotating shaft (6), so that it can clamp and position the single crystal silicon ingot; a ball seat (2-3) is floatingly installed on the clamping arm (2-1), and a positioning ball (2-4) is rotatably installed in the ball seat (2-3). The positioning ball (2-4) can perform radial pre-positioning on the single crystal silicon ingot by squeezing; multiple adsorption holes (1-5) are opened at the cutting station (8), and a suction cup (1-6) that can cover the adsorption holes (1-5) is fixed below the frame (1). An air extraction mechanism (7) is connected to the suction cup (1-6), and the air extraction mechanism (7) can perform axial positioning by adsorbing the single crystal silicon ingot by negative pressure.

2. The single-crystal silicon ingot multi-wire cutting machine according to claim 1, characterized in that: The sidewall of the clamping block (2-2) is provided with a concave-convex structure to increase the friction between it and the single crystal silicon ingot.

3. The single-crystal silicon ingot multi-wire cutting machine according to claim 1, characterized in that: A mounting block (2-5) with a through hole in the middle is fixed on the clamping arm (2-1). A movable rod (2-6) is inserted through the mounting block (2-5). A baffle (2-7) is fixed at the front of the movable rod (2-6). A compression spring (2-8) is inserted between the baffle (2-7) and the mounting block (2-5). The ball bearing seat (2-3) is fixed at the front of the baffle (2-7).

4. The single-crystal silicon ingot multi-wire cutting machine according to claim 1, characterized in that: The cutting mechanism (3) includes a vertical plate (3-1) symmetrically fixed above the frame (1), a horizontal plate (3-2) slidably disposed on the vertical plate (3-1), and a cutting assembly (3-3) slidably disposed on the horizontal plate (3-2).

5. The single-crystal silicon ingot multi-wire cutting machine according to claim 1, characterized in that: The drive mechanism (4) is a hydraulic cylinder.

6. The single-crystal silicon ingot multi-wire cutting machine according to any one of claims 1-5, characterized in that: The transmission mechanism (5) includes a transmission gear (5-1) fixedly installed on the lower part of each of the rotating shafts (6), a gear ring (5-2) with internal and external teeth rotatably installed on the frame (1), and a rack (5-3) slidably installed on the frame (1). The internal teeth of the gear ring (5-2) mesh with the transmission gear (5-1), and the external teeth mesh with the rack (5-3). One end of the rack (5-3) is fixedly connected to the telescopic rod part of the drive mechanism (4).

7. The single-crystal silicon ingot multi-wire cutting machine according to claim 6, characterized in that: The frame (1) has a T-shaped annular groove (1-1) and a T-shaped straight groove (1-2). A T-shaped annular groove mounting block (1-3) for fixing the gear ring (5-2) is placed in the T-shaped annular groove (1-1), and a T-shaped straight groove mounting block (1-4) for fixing the rack (5-3) is placed in the T-shaped straight groove (1-2).

8. The single-crystal silicon ingot multi-wire cutting machine according to claim 7, characterized in that: The frame (1) is fixed with a mounting bracket (1-7). The suction mechanism (7) includes a cylinder (7-1) fixed on the mounting bracket (1-7) and a piston head (7-3) with a piston rod (7-2) slidably disposed in the cylinder (7-1). The cylinder (7-1) is connected to the suction cup (1-6) through an air supply pipe (7-4). The piston rod (7-2) is fixedly connected to the rack (5-3).

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