Sensor for realizing rapid thermostable temperature measurement and manufacturing method thereof

Abstract

The invention provides a sensor capable of realizing rapid thermostable temperature measurement and a manufacturing method thereof, the sensor comprises a tube socket, a metal sleeve, a circuit substrate and an infrared temperature measurement sensor, the opening end of the metal sleeve is connected with the tube socket, the metal sleeve and the tube socket form a sealed cavity together, and the wall of the metal sleeve is used for being in contact with an external heat source; the circuit substrate is positioned in the sealing cavity and is electrically connected with the tube socket; the infrared temperature measurement sensor is arranged on the circuit substrate, the sensing surface of the infrared temperature measurement sensor faces the sleeve wall of the metal sleeve, and the infrared temperature measurement sensor is used for measuring the infrared radiation temperature of the sleeve wall of the metal sleeve in a non-contact mode, so that quick response, high precision and high stability are achieved at the same time.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a sensor and manufacturing method for achieving rapid thermally stable temperature measurement. Background Technology

[0002] Body temperature measurement is a basic requirement in fields such as clinical diagnosis and health monitoring. Existing mainstream technical solutions can be divided into two main categories: contact temperature measurement and non-contact temperature measurement, represented by NTC (negative temperature coefficient thermistor) electronic thermometers and infrared thermometers, respectively.

[0003] Traditional NTC electronic thermometers use the principle of contact heat conduction for temperature measurement. Their typical structure is as follows: heat from the human body is first transferred to the outer metal protective sleeve of the thermometer probe. Then, the heat is transferred through the thermally conductive adhesive filled inside the sleeve to the NTC thermistor encased within it. The resistance value of the NTC changes with temperature, and after being converted by the circuit, a temperature signal is output.

[0004] The advantage of this technical approach is that, after reaching sufficient thermal equilibrium, the measurement results are relatively accurate and stable. However, it has the following inherent drawbacks: Slow response speed: Heat needs to pass through multiple layers of media such as metal sleeve, thermally conductive adhesive, and NTC encapsulation in sequence. Each layer of material has heat capacity, forming a long heat conduction path and a large overall thermal inertia, which causes the sensor to heat up slowly. It usually takes 30 seconds to several minutes to reach a stable reading, making it impossible to achieve rapid temperature measurement.

[0005] Measurement accuracy is greatly affected by process consistency: factors such as the thickness of the thermally conductive adhesive, the uniformity of curing, and the tightness of contact with the metal sleeve and NTC can introduce uncontrollable contact thermal resistance. Small fluctuations in these process parameters can directly lead to temperature measurement deviations between different products, and even between different parts of the same product, seriously affecting the consistency and long-term reliability of batch products.

[0006] Infrared thermometers calculate body temperature by directly detecting the infrared energy radiated from the surface of human skin using sensors, achieving non-contact and rapid measurement with a response time in the order of seconds or even milliseconds.

[0007] However, this technical approach has the following fundamental limitations: The object of measurement is unstable body surface temperature: skin surface temperature is easily affected by factors such as ambient temperature, air flow, sweating, skin cleanliness and cosmetics, and differs from the human body core temperature and varies unpredictably, resulting in large fluctuations and insufficient accuracy in measurement results.

[0008] Susceptible to interference from measurement conditions and environment: Changes in measurement distance and angle can affect the infrared energy received by the sensor; background thermal radiation and air convection in the environment can also interfere with the measurement signal, resulting in poor repeatability and stability of readings, making it difficult to meet the accuracy requirements of medical grade.

[0009] In summary, the core contradiction facing existing body temperature measurement technologies lies in the fact that NTC contact solutions have acceptable accuracy but slow response, while infrared non-contact solutions have fast response but insufficient accuracy and stability. Summary of the Invention

[0010] The purpose of this invention is to address the shortcomings of existing technologies by providing a sensor and manufacturing method for achieving rapid thermal stability temperature measurement, thereby achieving a balance between rapid response and high precision and high stability.

[0011] To achieve the above objectives, the present invention provides the following technical solution: A sensor for achieving rapid thermally stable temperature measurement, comprising: tube seat; A metal sleeve, the open end of which is connected to the pipe seat, together forming a sealed cavity, and the wall of the metal sleeve is used to contact an external heat source; A circuit board, which is located within the sealed cavity and is electrically connected to the tube socket; An infrared temperature sensor is disposed on the circuit board, with the sensing surface of the infrared temperature sensor facing the wall of the metal sleeve, for non-contact measurement of the infrared radiation temperature of the wall of the metal sleeve.

[0012] As a preferred embodiment, it also includes: A shielding shell is disposed on the circuit board and covers the outside of the infrared temperature sensor. A light-transmitting window is opened on the shielding shell opposite to the sensing surface of the infrared temperature sensor. The surface of the shielding tube shell is provided with an infrared reflective layer.

[0013] In a preferred embodiment, the sealed cavity is filled with inert gas or is in a vacuum state.

[0014] In a preferred embodiment, the tube socket is a glass tube socket, and pins are provided on the tube socket, the pins being electrically connected to the circuit board.

[0015] A method for manufacturing a sensor that enables rapid thermally stable temperature measurement includes the following steps: S100. Attach an infrared temperature sensor to the circuit board. S300: Electrically connect and mechanically fix the circuit board to the tube socket; S400. The open end of the metal sleeve is sealed to the tube seat so that the two together form a sealed cavity, wherein the infrared temperature sensor is located in the sealed cavity and the sensing surface of the infrared temperature sensor is arranged facing the cylinder wall of the metal sleeve.

[0016] In a preferred embodiment, the circuit board is provided with a shielding shell, which covers the outside of the infrared temperature sensor. Between step S100 and step S300, the method further includes the following steps: S200. A shielding tube is encapsulated on the circuit board to cover the infrared temperature sensor. The shielding tube has a light-transmitting window corresponding to the sensing surface of the infrared temperature sensor.

[0017] In a preferred embodiment, after step S400, the method further includes the following steps: S500, Inert gas is introduced into the sealed cavity or the cavity is evacuated.

[0018] The core of this invention lies in its innovative integrated structural design, which uses a thin-walled metal sleeve as a rapid thermal equivalent layer and an infrared sensor for non-contact measurement of the inner wall temperature of the metal sleeve. This design successfully combines the stability of contact temperature measurement with the speed of non-contact temperature measurement, fundamentally resolving the technical contradiction between existing NTC contact thermometers and infrared non-contact thermometers in terms of performance. This results in the following significant and synergistic technical effects: 1. Achieve rapid response temperature measurement capability By employing a thin-walled metal sleeve as the external contact medium, it possesses characteristics of low heat capacity, rapid heat conduction, and short thermal stabilization time. When the metal sleeve comes into contact with the human body, it can reach thermal equilibrium in a very short time, thereby rapidly stabilizing the measured temperature. Combined with the rapid response capability of the infrared temperature sensor, this invention can output stable temperature data within seconds, significantly outperforming the response speed of traditional NTC multi-stage heat conduction structures.

[0019] 2. Achieve high measurement accuracy and high stability This invention does not measure the surface temperature of the human body, but rather the equivalent temperature stabilized by a metal sleeve. This effectively avoids measurement fluctuations caused by factors such as ambient temperature, sweating, and skin condition in traditional infrared thermometers. Simultaneously, it avoids systematic deviations caused by adhesive thickness errors, curing differences, and inconsistent heat conduction paths in NTC temperature measurement structures, significantly improving the repeatability and accuracy of temperature measurements. 3. Improve measurement consistency and reduce batch variation. Using a metal sleeve as the measuring medium, its material, wall thickness, and thermal conductivity can be strictly controlled, ensuring consistent thermal response characteristics across different batches of products. This results in more controllable and stable body temperature measurement output. In contrast, traditional NTC thermometers suffer from significant consistency issues due to glue thickness, glue curing uniformity, and assembly deviations. 4. Significantly reduces environmental interference and enhances noise immunity. The infrared temperature sensor measures the internal temperature of the metal sleeve, rather than the skin surface temperature which is easily affected by the environment; the internal FR4 insulation structure reduces external transient thermal disturbances; the filling of the cavity with inert gas or the extraction of the interior into a vacuum can reduce the thermal conductivity of the cavity and enhance infrared absorption, making the temperature measurement process more stable and reliable, and further improving the signal-to-noise ratio and output stability.

[0020] 5. Improve measurement reliability and device lifespan The infrared temperature sensor adopts a non-contact temperature measurement method, which does not rely on complex glue structures and avoids problems such as glue aging and delamination; the metal sleeve has excellent mechanical protection capabilities, while the internal chip is isolated from external thermal stress through a thermal insulation support structure, making the whole machine more reliable and longer-lasting.

[0021] 6. Overall performance achieves a "fast and accurate" temperature measurement effect. Through the structural design of this invention, the temperature measurement object of the thermometer is transformed from "human body surface" or "glue / NTC combination structure" to "fast, stable, and thermally controllable metal sleeve". This technical approach fundamentally solves the problems of slow response or inaccurate measurement in traditional solutions, enabling the thermometer of this invention to simultaneously possess the following advantages: fast measurement speed (second-level), high temperature accuracy, stable output, minimal environmental influence, and strong batch consistency. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the sensor structure for achieving rapid thermally stable temperature measurement as described in this invention; Figure 2 This is an exploded view of the sensor for achieving rapid thermal stability temperature measurement as described in this invention.

[0023] In the diagram: 100 tube socket, 110 pin, 200 metal sleeve, 200a enclosed cavity, 210 open end, 220 closed end, 230 cylinder wall, 300 circuit board, 400 infrared temperature sensor, 400a sensing surface, 500 shielded tube shell, 510 light-transmitting window, 610 signal conditioning chip, 620 temperature compensation element, 630 oxygen-free copper gasket. Detailed Implementation

[0024] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0025] First Embodiment Please refer to Figure 1 and Figure 2The present invention provides a sensor for achieving rapid thermal stability temperature measurement, comprising: 100mm tube seat; A metal sleeve 200, the open end 210 of which is connected to the tube seat 100, together forming a sealed cavity 200a, and the cylinder wall 230 of the metal sleeve 200 is used to contact an external heat source. Circuit board 300, the circuit board 300 is located in the sealed cavity 200a and is electrically connected to the tube seat 100; An infrared temperature sensor 400 is disposed on the circuit board 300, and the sensing surface 400a of the infrared temperature sensor 400 faces the cylinder wall 230 of the metal sleeve 200, for non-contact measurement of the infrared radiation temperature of the cylinder wall 230 of the metal sleeve 200.

[0026] This invention elevates the metal sleeve 200 from its traditional structural role to a crucial temperature equivalent measurement layer. When the outer wall of the sleeve 230 contacts a heat source, thanks to its small heat capacity and high thermal conductivity (preferably a thin-walled design), heat can rapidly and uniformly diffuse within the sleeve 230, causing its overall temperature to quickly approach the heat source temperature within seconds, forming a stable and uniform temperature measurement target surface. This completely bypasses the slow heat conduction process that requires heat to pass through multiple solid interfaces in traditional solutions. Inside the sealed cavity 200a, the infrared temperature sensor 400 directly and non-contactly acquires the temperature value by sensing the infrared energy radiated from the inner surface of the sleeve 230, which has achieved thermal equilibrium. This achieves: The response is extremely fast. The infrared sensor itself has a fast response and does not need to wait for solid heat conduction. The system response time mainly depends on the thermal equilibrium speed of the metal sleeve. It eliminates the use of thermally conductive adhesive media that are prone to introducing errors, and because the measurement object is a stable metal surface inside a closed cavity, it effectively isolates interference from airflow and background radiation in open environments.

[0027] like Figure 1 and Figure 2 As shown, the metal sleeve 200 has an open end 210, a closed end 220, and a sleeve wall 230 connected between the open end 210 and the closed end 200.

[0028] The metal sleeve 200 can be made of stainless steel or other metal materials with good thermal conductivity and biocompatibility.

[0029] The metal sleeve 200 has a cylindrical wall 230 configured to have excellent thermal conductivity and a small wall thickness. With this structure, when the outer wall of the cylindrical wall 230 comes into contact with the human body (e.g., when measuring axillary temperature), heat can be transferred radially along the thickness of the cylindrical wall 230 with extremely low thermal resistance and extremely fast speed, allowing heat from the outer wall of the cylindrical wall 230 to be conducted to the inner wall of the cylindrical wall 230 almost instantly. This design enables the inner and outer walls of the cylindrical wall 230 to reach substantially equal temperatures within a very short time constant, achieving rapid thermal equilibrium.

[0030] Therefore, the infrared temperature sensor 400 located inside the sealed cavity 200a measures the temperature of the inner wall of the cylinder wall 230 in a non-contact manner, which is essentially equivalent to measuring the temperature of human skin that comes into contact with the outer wall of the cylinder wall 230. At the same time, since the object of measurement is the inner surface of the metal cylinder wall, which has good thermal stability, this method effectively avoids the problem of interference from variable factors such as ambient temperature, airflow, and sweat when directly measuring the human skin surface, thus significantly improving the accuracy and reliability of temperature measurement.

[0031] like Figure 1 and Figure 2 As shown, the tube socket 100 is made of glass and has pins 110 inserted through it. One end of the pin 110 extends into the sealed cavity 200a and is electrically connected to the corresponding pad on the circuit board 300; the other end extends to the outside of the tube socket 100 for connection to external circuits (such as the main control board).

[0032] Glass has low thermal conductivity. This effectively blocks or significantly reduces the conduction of heat generated by the rear pin 110 due to contact with the external environment or by heat generated during circuit operation into the sealed cavity 200a. Therefore, the disturbance of the front-end temperature measurement area by rear-end thermal interference can be minimized.

[0033] The tube seat 100 and the open end 210 of the metal sleeve 200 are fixed and sealed by sleeve connection and sealing welding. Specifically, after the open end 210 of the metal sleeve 200 is sleeved and positioned with the tube seat 100, the joint is sealed using an airtight welding process such as laser welding, energy storage welding, or brazing. This connection method not only ensures the structural strength and long-term reliability of the sealed cavity 200a, but also achieves high airtightness of the sealed cavity 200a, effectively isolating the intrusion of the external environment (such as moisture and dust) and maintaining the stability of the internal thermal environment.

[0034] like Figure 1 and Figure 2As shown, the enclosed cavity 200a is filled with an inert gas or is in a vacuum state. The inert gas can be selected from those with low thermal conductivity, stable chemical properties, and weak absorption of infrared radiation, in order to maximize the effects of heat insulation, stability, and infrared transmission. For example, inert gases such as nitrogen.

[0035] Whether filling with a low thermal conductivity inert gas or creating a vacuum, the inert gas convection intensity inside the sealed cavity 200a can be significantly reduced, thereby suppressing local temperature fluctuations and heat redistribution that may be caused by air flow, ensuring the uniformity and stability of the temperature field on the inner wall of the metal sleeve 200. Secondly, this environment enhances the effectiveness of infrared radiation measurement. In a vacuum or specific inert gas environment, the absorption and scattering effects of the medium on infrared energy are greatly weakened, allowing the infrared radiation emitted from the inner wall of the cylinder 230 to be received more efficiently and directly by the sensing surface 400a of the infrared temperature sensor 400. This is equivalent to enhancing the intensity of the infrared radiation signal and reducing interference from non-target radiation.

[0036] like Figure 1 and Figure 2 As shown, the circuit board 300 is a printed circuit board, preferably an FR4 substrate. The circuit board 300 is arranged longitudinally within the sealed cavity 200a, with one end fixedly connected to the tube seat 100 and electrically conductive, and the other end extending towards the closed end 220 of the metal sleeve 200. The longitudinal orientation refers to the circuit board 300 being arranged along the axial direction of the metal sleeve 200.

[0037] The circuit board 300 serves as the core support structure, carrying the infrared temperature sensor 400 and other necessary electronic components. Meanwhile, the FR4 material itself has low thermal conductivity, effectively blocking heat from the socket 100 and the rear pin 110 towards the infrared temperature sensor 400 area located at its front end, acting as a thermal barrier and reducing interference from the rear heat source to the temperature-sensitive area.

[0038] The vertical design allows the infrared temperature sensor 400, mounted at the front end of the circuit board 300, to be positioned closer to the inner wall of the metal sleeve 200 230. This shortens the transmission distance of infrared radiation, effectively increases the intensity of the infrared signal received by the sensor, and helps to limit its field of view, enabling it to receive radiation from the target area more concentratedly, thereby improving measurement sensitivity and signal-to-noise ratio, and stabilizing the sensing environment.

[0039] like Figure 1 and Figure 2 As shown, the circuit board 300 integrates a complete signal sensing and processing circuit, mainly including an infrared temperature sensor 400, a signal conditioning chip 610, and a temperature compensation element 620.

[0040] Specifically, the infrared temperature sensor 400 (referred to as a thermopile sensor, or TPS for short) is soldered onto the circuit board 300. Its core temperature-sensing component consists of multiple tiny thermocouples connected in series. When the infrared sensitive area on the front of the infrared temperature sensor 400 receives infrared radiation from the inner wall of the metal sleeve 200, a temperature difference is generated between its front and back reference areas. Based on the Seebeck effect, a weak voltage signal in the microvolt range, proportional to the received radiation power, is directly output.

[0041] To process this signal, a signal conditioning chip 610 is also soldered onto the circuit board 300. This chip, as an analog front end, is specifically used to perform high-gain amplification, filtering, and analog-to-digital conversion on the weak voltage signal output by the TPS, converting it into a digital signal that can be read by a microprocessor.

[0042] Meanwhile, a temperature compensation element 620 is provided on the circuit board 300. This temperature compensation element 620 measures the real-time temperature of the infrared temperature sensor 400 or a local critical area of ​​the circuit board 300. Since the output signal strength of the infrared temperature sensor 400 is significantly affected by its own temperature, the ambient temperature measured by this temperature compensation element 620 must be used to compensate and calibrate the signal of the infrared temperature sensor 400 in real time to eliminate the error introduced by the temperature drift of the sensor body. This is the key to achieving high-precision infrared temperature measurement.

[0043] To further improve the stability and response speed of the temperature measurement system, oxygen-free copper gaskets 630 are provided between the mounting interfaces of the infrared temperature sensor 400 and the temperature compensation element 620 and the circuit board 300, respectively. For the temperature compensation element 620, this gasket significantly reduces its thermal resistance with the monitored heat source, enabling the temperature compensation element 620 to sense temperature transients in the target area in real time and accurately, greatly shortening the thermal response delay, thereby providing a more timely and reliable body temperature reference for the system's temperature compensation algorithm. For the infrared temperature sensor 400, this gasket optimizes the thermal coupling between itself and the mounting base, promoting rapid thermal equilibrium between the reference area on the back of the sensor and the external environment, establishing a more constant local thermal reference for the sensor, and effectively improving the thermal stability and consistency of the sensor's output signal.

[0044] like Figure 1 and Figure 2 As shown, the sensor for achieving rapid thermal stability temperature measurement also includes: A shielding tube shell 500 is disposed on the circuit board 300 and covers the outside of the infrared temperature sensor 400. A light-transmitting window 510 is opened on the shielding tube shell 500, which is opposite to the sensing surface 400a of the infrared temperature sensor 400. The size and position of the light-transmitting window 510 are optically designed to strictly limit the effective field of view of the infrared temperature sensor 400. Specifically, its field of view cone angle is configured to completely cover only an annular region or local area of ​​the cylinder wall 230 of the metal sleeve 200 that is axially aligned with the sensing surface 400a. This region is the target temperature measurement area of ​​the inner wall of the cylinder wall 230.

[0045] Meanwhile, at least a portion of the inner surface of the shielding tube shell 500 is covered with an infrared reflective layer (such as a gold-plated layer).

[0046] The light-transmitting window 510 only allows infrared radiation from the target temperature measurement area to pass through and reach the sensing surface 400a of the infrared temperature sensor 400. This effectively limits the sensor's field of view and avoids stray radiation interference from other non-target areas inside the cavity (such as circuit boards and tube sockets).

[0047] The infrared reflective layer covering the surface of the shielding housing 500 can efficiently reflect stray heat radiation from non-target directions (e.g., radiation generated from other heat-generating elements on the circuit board 300 or from parasitic heat conducted through the housing 100), preventing it from entering the sensor sensing area.

[0048] Through the combined effect of the light-transmitting window 510 and the infrared reflective layer, this structure fundamentally solves the background thermal radiation interference problem commonly found in traditional infrared sensors. It ensures that the infrared temperature sensor 400 primarily receives and responds to the true temperature radiation signal from the inner wall of the target metal sleeve 200, thereby significantly improving the signal-to-noise ratio and the accuracy and repeatability of the final temperature measurement.

[0049] During operation, the outer wall 230 of the sensor metal sleeve 200 contacts a heat source (such as a human body). The heat rapidly brings the thin-walled metal sleeve 200 to thermal equilibrium, and its inner wall becomes a uniformly and stably heated radiation source. The infrared temperature sensor 400 receives infrared radiation from the target temperature measurement area on the inner wall of the sleeve 230 through the light-transmitting window 510 of the shielded housing 500 and converts it into an electrical signal. This signal is processed by the signal conditioning chip 610 and calibrated in real time using the body temperature measured by the temperature compensation element 620, ultimately outputting a high-precision, highly stable digital temperature value. The entire temperature measurement process is completed within seconds.

[0050] The sensor structure disclosed in this embodiment is not only about the core concept of using an internal infrared sensor 400 to non-contactly measure the temperature of a contact metal sleeve 200, but also about the complex process and design challenges that must be systematically solved across multiple disciplines to transform this concept into a mass-producible, highly reliable product.

[0051] (i) Upgrades in materials and manufacturing processes brought about by functional restructuring Traditional electronic thermometers use a metal sleeve that serves only as a protective shell and primary heat conductor. This invention, for the first time, repurposes it as a crucial, rapidly thermally stable carrier and a standard infrared radiation source. This role shift places unprecedented and interconnected demands on the manufacturing process: The contradiction between thermodynamics and mechanics: to achieve a second-level thermal response, the cylinder wall must be extremely thin to reduce heat capacity; however, to withstand the high temperature and stress of the hermetically sealed welding with the glass tube seat, sufficient structural strength is required to prevent deformation. This necessitates the development of specialized thin-walled precision forming and heat treatment processes.

[0052] Surface finish, from aesthetics to radiation metrology: Traditional metal parts control roughness and smoothness. In this solution, the inner surface of the cylinder wall 230 is the direct target for infrared thermometry. Its microstructure, oxide layer uniformity, and emissivity consistency must be strictly controlled to ensure the accuracy of temperature measurement and batch-to-batch consistency. This has entered the field of surface physics and materials engineering.

[0053] (II) Microsystem-level high-precision optical-mechanical-thermal alignment and integration The precision of this solution is based on the accurate spatial relationships of multiple components within a millimeter-level cavity, and its assembly is upgraded from electrical connections to precision opto-mechanical-thermal system integration: Submillimeter-level optical alignment: The infrared sensor sensing surface, the light-transmitting window of the shielded tube, and the target area on the inner wall of the metal sleeve must achieve strict coaxiality and field-of-view matching in three-dimensional space. Any minute deviation will cause nonlinear attenuation of the measurement signal or introduce uncalibrable background noise.

[0054] Active design and precise control of the thermal path: The oxygen-free copper pads and the specifically laid-out FR4 substrate, introduced to optimize response and compensation accuracy, directly affect the local thermal time constant due to their dimensions and contact interface conditions. These parameters cannot be obtained through simple theoretical calculations and must be optimized through multiple iterative experiments with the overall thermal model, resulting in high design uncertainty and implementation difficulty.

[0055] (III) The inherent contradictions and collaborative solutions of heterogeneous material encapsulation To achieve long-term stability, a permanent seal must be established between stainless steel (metal sleeve) and glass (tube base), two materials with vastly different coefficients of thermal expansion, that combines high strength and high airtightness without disrupting the internal thermal environment. This requires: To address thermal stress concentration, special welding processes (such as energy storage welding) and matching transition materials must be used to alleviate thermal stress during the sealing process, prevent the formation of microcracks, and ensure long-term airtight reliability.

[0056] Coordinated control of the encapsulation process and internal environment: Soldering itself is a violent thermal process, but the goal is to create a stable internal environment with low thermal conductivity and no convection. This requires finding an extremely narrow, repeatable process window between soldering heat input, protective atmosphere control, and cooling process.

[0057] (iv) Narrow process window for systems with multiple coupling links The aforementioned steps are not independent but form a highly coupled process chain. For example, a slight change in the processing of the inner wall of the metal sleeve will directly affect its emissivity, thus requiring recalibration of the infrared sensor; the quality of the gold plating layer of the shielding shell and the accuracy of the window together determine the background noise suppression level, and together with the sensor's inherent noise level, determine the final signal-to-noise ratio. This strong coupling characteristic, where a change in one part affects the whole, makes the overall process window extremely narrow. Parameter drift in any step can lead to system-level performance failure, rather than a simple performance degradation.

[0058] In summary, realizing the technical solution of this invention is far more complex than simply fitting a commercially available infrared sensor into a metal casing. It requires the inventor to proactively identify and systematically overcome a series of interdisciplinary and complex technical challenges, ranging from material surface engineering, precision micro-assembly, multi-physics co-design to heterogeneous material encapsulation. The existence of these challenges and their systematic solutions fully demonstrate that this invention possesses outstanding substantive features compared to existing technologies (such as traditional NTC structures or independent infrared temperature measurement modules), and has achieved significant progress in realizing rapid, accurate, and stable temperature measurement capabilities, thus meeting the inventive step requirements of patent law.

[0059] Second Embodiment like Figure 1 and Figure 2 As shown, a method for manufacturing a sensor that enables rapid thermally stable temperature measurement includes the following steps: S100, An infrared temperature sensor 400 is mounted on the circuit board 300.

[0060] Specifically, the circuit board 300 is placed in a die bonding fixture, and then die bonding adhesive is applied to the mounting area of ​​the infrared temperature sensor 400. The infrared temperature sensor 400 is then precisely mounted onto the circuit board 300 using a die bonding machine. After mounting, gold wire bonding is performed between the infrared temperature sensor 400 and the pads on the circuit board 300 using bonding equipment to achieve the connection between the infrared temperature sensor 400 and the substrate 300.

[0061] S200, The shielding tube shell 500 is encapsulated on the circuit board 300 to cover the infrared temperature sensor 400. The shielding tube shell 500 is provided with a light-transmitting window 510 corresponding to the sensing surface 400a of the infrared temperature sensor 400.

[0062] The shielding housing 500 is aligned with the sensitive area of ​​the circuit board 300, so that the shielding housing 500 covers the infrared temperature sensor 400 and the bonding area. After applying solder paste to the solder rings of the circuit board 300, the shielding housing 500 is positioned onto the surface of the circuit board 300 using a mounting device. The assembly is then sent to a reflow oven for heating, which melts the solder paste and solders it to the copper pads of the circuit board 300, thereby forming a primary protective cavity for the infrared temperature sensor 400 and the bonding area.

[0063] S300, Electrically connect and mechanically fix the circuit board 300 to the tube socket 100.

[0064] The socket 100 is placed in a positioning fixture to stabilize it. Then, the two pads at the bottom of the circuit board 300 are inserted into the surface of the socket 100, mechanically connecting the flat pins of the socket 100 to the pads of the circuit board 300. The inserted pin areas are then soldered using a soldering iron to firmly bond the circuit board 300 and the socket 100, forming the leads for the external electrical interface.

[0065] S400, the open end 210 of the metal sleeve 200 is sealed to the tube seat 100 so that the two together form a sealed cavity 200a, wherein the infrared temperature sensor 400 is located inside the sealed cavity 200a, and the sensing surface 400a of the infrared temperature sensor 400 is arranged facing the cylinder wall 230 of the metal sleeve 200.

[0066] The metal sleeve 200 is inserted from the outside of the circuit board 300 and fitted to the outer edge of the tube seat 100. Then, the metal sleeve 200 and the outer periphery of the tube seat 100 are sealed by a welding process (energy storage welding) to form a basically closed cavity structure for the sensor.

[0067] S500, Inert gas is introduced into the sealed cavity 200a or the interior is evacuated.

[0068] In summary, by having the metal sleeve 200 perform the functions of rapid thermal equilibration and temperature carrier, and utilizing the internal infrared sensor 400 for non-contact precision measurement, the industry challenges of slow response in contact measurements and poor accuracy in non-contact measurements are solved. This design achieves a response speed close to that of infrared thermometry while ensuring reliable contact with the heat source to reflect true body temperature, and possesses superior accuracy consistency and long-term stability compared to traditional NTC contact thermometry, thus meeting the high-demand application scenarios such as dynamic body temperature monitoring and rapid screening.

[0069] The embodiments described above are only used to illustrate the technical ideas and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly. The scope of patent application of the present invention should not be limited by these embodiments. That is, any equivalent changes or modifications made in accordance with the spirit disclosed in the present invention still fall within the patent scope of the present invention.

Claims

1. A sensor for achieving rapid thermally stable temperature measurement, characterized in that, include: Tube seat (100); A metal sleeve (200) has an open end (210) connected to the tube seat (100), and the two together form a sealed cavity (200a). The wall (230) of the metal sleeve (200) is used to contact an external heat source. Circuit board (300), the circuit board (300) is located inside the sealed cavity (200a) and is electrically connected to the tube seat (100); An infrared temperature sensor (400) is disposed on the circuit board (300), and the sensing surface (400a) of the infrared temperature sensor (400) faces the cylinder wall (230) of the metal sleeve (200) for non-contact measurement of the infrared radiation temperature of the cylinder wall (230) of the metal sleeve (200).

2. The sensor for achieving rapid thermal stability temperature measurement as described in claim 1, characterized in that, Also includes: A shielding tube shell (500) is disposed on the circuit board (300) and covers the outside of the infrared temperature sensor (400). A light-transmitting window (510) is opened on the shielding tube shell (500) opposite to the sensing surface (400a) of the infrared temperature sensor (400). The surface of the shielding tube shell (500) is provided with an infrared reflective layer.

3. The sensor for achieving rapid thermal stability temperature measurement as described in claim 1, characterized in that, The enclosed cavity (200a) is filled with inert gas or is in a vacuum state.

4. The sensor for achieving rapid thermal stability temperature measurement as described in claim 1, characterized in that, The tube socket (100) is a glass tube socket, and a pin (110) is provided on the tube socket (100). The pin (110) is electrically connected to the circuit board (300).

5. A method for manufacturing a sensor that enables rapid thermally stable temperature measurement, characterized in that, Includes the following steps: S100, Attach an infrared temperature sensor (400) to the circuit board (300); S300, Electrically connect and mechanically fix the circuit board (300) to the tube socket (100); S400, the open end (210) of the metal sleeve (200) is sealed to the tube seat (100) so that the two together form a sealed cavity (200a), wherein the infrared temperature sensor (400) is located inside the sealed cavity (200a) and the sensing surface (400a) of the infrared temperature sensor (400) is set towards the cylinder wall (230) of the metal sleeve (200).

6. The method for manufacturing a sensor for rapid thermally stable temperature measurement as described in claim 5, characterized in that, The circuit board (300) is provided with a shielding shell (500), which covers the outside of the infrared temperature sensor (400). Between step S100 and step S300, the method further includes the following steps: S200. The shielding tube shell (500) is encapsulated on the circuit board (300) to cover the infrared temperature sensor (400). The shielding tube shell (500) is provided with a light-transmitting window (510) corresponding to the sensing surface (400a) of the infrared temperature sensor (400).

7. The manufacturing method of the sensor for achieving rapid thermally stable temperature measurement as described in claim 5, characterized in that, Following step S400, the method further includes the following steps: S500, Inert gas is introduced into the sealed cavity (200a) or the interior of the cavity is evacuated.

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