Packaging equipment for optoelectronic device

Abstract

The invention discloses packaging equipment for a photoelectronic device, and relates to the technical field of photoelectronic devices. The device comprises a shell and a magnetic driving assembly, a refrigerator is installed on the bottom face of the shell, a heat sink is installed on the upper surface of the refrigerator, and a laser chip and a positioning piece are installed on the upper surface of the heat sink; a V-shaped groove is formed in the positioning piece, capacitance electrodes are arranged on the inner walls of the two sides of the V-shaped groove, a lower expansion groove is formed in the inner bottom of the V-shaped groove and is separated from the V-shaped groove through a film, an optical fiber is inserted into the V-shaped groove, and the coupling end of the optical fiber is plated with a magnetic nano coating. According to the invention, non-contact and high-precision three-dimensional control is realized in the V-shaped groove by using the magnetic driving assembly and the magnetized optical element, and continuous, high-bandwidth and drifting-free position feedback is provided by manufacturing precise capacitor electrodes on two sides of the V-shaped groove, so that extremely smooth and rapid alignment closed-loop control can be realized. Rapid and efficient positioning of optical fibers is realized.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic device technology, and more specifically to a packaging device for optoelectronic devices. Background Technology

[0002] The packaging of optoelectronic devices, especially the coupling packaging of chips and external optical fibers, is one of the most costly and technically challenging aspects of optical module manufacturing, directly determining the performance, reliability, and cost of the devices.

[0003] The current mainstream packaging technologies for traditional optoelectronic devices and their limitations are as follows: (1) Active alignment encapsulation uses a high-precision six-axis adjustment frame to monitor the output optical power in real time during device operation, dynamically adjust the fiber position, find the maximum coupling point, and then apply adhesive for fixation. It relies on a submicron precision displacement stage and a real-time power monitoring system. The alignment process is time-consuming, typically on the order of minutes. The process is complex, requiring coarse adjustment followed by fine scanning, and operation depends on skilled technicians. Subsequent adhesive dispensing and curing processes can easily disrupt the aligned state, causing micro-displacement.

[0004] (2) Passive alignment packaging utilizes the precision processing capabilities of silicon-based optoelectronic platforms to achieve pre-positioning of optical fibers and chips through mechanical stops. It has extremely stringent requirements for substrate processing precision (nanometer level) and the consistency of component dimensions. It has poor flexibility, with one design corresponding to only one type of device, resulting in low versatility. Furthermore, the subsequent dispensing and curing processes can easily disrupt the aligned state, causing micro-displacement.

[0005] The stress caused by the shrinkage of the cured adhesive leads to "adhesive displacement," rendering high-precision alignment impossible. Summary of the Invention

[0006] The purpose of this invention is to provide a packaging device for optoelectronic devices in order to solve the above problems.

[0007] To achieve the above objectives, the present invention specifically adopts the following technical solution: A packaging device for an optoelectronic device includes a housing and a magnetic drive assembly. A cooler is mounted on the bottom surface of the housing, a heat sink is mounted on the upper surface of the cooler, and a laser chip and a positioning element are mounted on the upper surface of the heat sink. The positioning component has a V-shaped groove inside, and capacitor electrodes are provided on the inner walls on both sides of the V-shaped groove. A lower expansion groove is provided at the bottom of the V-shaped groove, and the lower expansion groove is separated from the V-shaped groove by a thin film. An optical fiber is inserted into the V-shaped groove, and the coupling end of the optical fiber is coated with a magnetic nano-coating. The magnetic drive component is sleeved on the housing. The magnetic drive component can drive the optical fiber to move horizontally and vertically in the V-groove through the magnetic nano-coating.

[0008] Furthermore, the heat sink is provided with a step, and the laser chip is mounted on the step.

[0009] Furthermore, a positioning frame is provided on the heat sink, the positioning component is inserted into the positioning frame, and laser-welded to the positioning frame.

[0010] Furthermore, the opening width at the top of the V-groove is typically greater than the fiber diameter, with a difference of 5-15 μm.

[0011] Furthermore, the curing adhesive for the optical fiber is a UV-curable epoxy resin, and the UV-curable epoxy resin is uniformly mixed with superparamagnetic nanoparticles.

[0012] Furthermore, the top of the V-shaped groove is provided with an adhesive flare, and the bottom of the adhesive flare is provided with an adhesive channel, which is connected to the V-shaped groove, and the outlet of the adhesive channel is located below the capacitor electrode.

[0013] Furthermore, a capacitor connection line is provided on the right side of the V-shaped groove. The capacitor connection line is electrically connected to the corresponding capacitor electrode, and the capacitor connection line is sealed through the housing.

[0014] Furthermore, the magnetic drive assembly includes a magnetic drive frame, with an upper magnetic drive disposed above the opening of the magnetic drive frame, a lower magnetic drive disposed below the opening, a forward magnetic drive disposed at an angle to the left of the opening, and a backward magnetic drive disposed at an angle to the right of the opening.

[0015] Furthermore, the magnetic drive frame is C-shaped and has a positioning groove on its inner side, allowing the housing to be tightly inserted into the positioning groove. The opening of the positioning groove is provided with a positioning flare.

[0016] The beneficial effects of this invention are as follows: 1. This invention utilizes magnetic drive components and magnetized optical elements to achieve contactless, high-precision three-dimensional manipulation within a V-groove. Precision capacitive electrodes are fabricated on both sides of the V-groove. As the magnetic nanocoating on the optical fiber moves within the groove, it modulates the capacitance between the electrodes. By measuring minute changes in capacitance (up to alpha-level resolution), the absolute position of the optical fiber can be calculated in real-time at nanometer resolution, independent of optics. It provides continuous, high-bandwidth, drift-free position feedback, enabling extremely smooth and rapid alignment closed-loop control. This achieves fast and efficient optical fiber positioning and has a wide range of applications.

[0017] 2. This invention uses a magnetic drive component to apply downward pressure to the optical fiber, locking its position and preventing displacement during adhesive curing. Simultaneously, the lower expansion groove and the thin film introduce a flexible, deformable interlayer. When the adhesive cures, the resulting stress first acts on the thin film, which absorbs most of the contraction displacement and energy through its elastic deformation. This effectively prevents optical fiber displacement and improves coupling accuracy.

[0018] 3. The adhesive of this invention is made of UV-curable epoxy resin uniformly mixed with superparamagnetic nanoparticles. The magnetic force enables the adhesive to quickly fill between the optical fiber and the V-groove, achieving rapid and uniform filling of the adhesive. Furthermore, with the cooperation of the magnetic drive component, the flow direction of the adhesive can be controlled, thereby achieving active plasticity of the adhesive and improving the dispensing accuracy. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the packaging and positioning of the optoelectronic device of the present invention; Figure 2 This is a schematic diagram of the optoelectronic device coupling structure of the present invention; Figure 3 This is a three-dimensional structural diagram of the positioning component of the present invention; Figure 4 This is a cross-sectional view of the positioning component of the present invention; Figure 5 This is a schematic diagram of the magnetic drive component of the present invention.

[0020] Reference numerals: 1. Housing; 2. Cooler; 3. Heat sink; 31. Step; 32. Positioning frame; 4. Laser chip; 5. Positioning component; 51. V-groove; 52. Capacitor electrode; 53. Lower expansion groove; 54. Thin film; 55. Adhesive flare; 56. Adhesive channel; 57. Capacitor connection wire; 6. Optical fiber; 61. Magnetic nano-coating; 7. Magnetic drive frame; 71. Upper magnetic drive; 72. Lower magnetic drive; 73. Forward magnetic drive; 74. Reverse magnetic drive; 75. Positioning groove; 76. Positioning flare. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0022] Example 1, as Figures 1-5 As shown, a packaging device for optoelectronic devices includes a housing 1 and a magnetic drive assembly. A cooler 2 is mounted on the bottom surface of the housing 1, a heat sink 3 is mounted on the upper surface of the cooler 2, and a laser chip 4 and a positioning component 5 are mounted on the upper surface of the heat sink 3. The positioning component 5 has a V-shaped groove 51 inside, and capacitor electrodes 52 are provided on the inner walls of both sides of the V-shaped groove 51. A lower expansion groove 53 is provided at the bottom of the V-shaped groove 51. The lower expansion groove 53 is separated from the V-shaped groove 51 by a thin film 54. The thin film 54 is made of polyimide, which has high strength, can be made very thin, and has good elasticity. An optical fiber 6 is inserted into the V-shaped groove 51, and the coupling end of the optical fiber 6 is coated with a magnetic nano-coating 61. The magnetic drive component is sleeved on the housing 1. The magnetic drive component can drive the optical fiber 6 to move horizontally and vertically in the V-groove 51 through the magnetic nano-coating 61.

[0023] Preferably, the magnetic drive assembly includes a magnetic drive frame 7, with an upper magnetic drive 71 disposed above the opening of the magnetic drive frame 7, a lower magnetic drive 72 disposed below the opening, a forward magnetic drive 73 disposed at an angle to the left of the opening, and a backward magnetic drive 74 disposed at an angle to the right of the opening.

[0024] Preferably, the magnetic drive frame 7 is C-shaped and has a positioning groove 75 on its inner side, allowing the housing 1 to be tightly inserted into the positioning groove 75. The opening of the positioning groove 75 is provided with a positioning flare 76. The C-shaped arrangement of the magnetic drive frame 7 ensures that the other half of the housing 1 is not obstructed, facilitating subsequent dispensing and curing irradiation.

[0025] Packaging and positioning: The optical fiber 6 coated with magnetic nano-coating 61 is inserted into the V-groove 51. Then, the optical fiber 6 is made to float by controlling the magnetic force of the upper magnetic drive 71 and the lower magnetic drive 72. Then, the optical fiber 6 is moved along the V-groove 51 towards the laser chip 4 by changing the difference between the forward magnetic drive 73 and the backward magnetic drive 74. It should be noted that the upper magnetic drive 71 and the lower magnetic drive 72 are both composed of linearly aligned micro planar coils, which can generate a stable magnetic field perpendicular to the optical fiber 6. During the movement of the optical fiber 6, each micro coil unit can independently control the switch and current. By sequentially activating coil units at different positions, a moving magnetic field distribution can be simulated. Simultaneously, the tilted forward magnetic drive 73 and backward magnetic drive 74 not only provide horizontal movement force to the fiber 6 but also exert a vertical upward attraction force. Therefore, when changing the magnetic forces of the forward and backward magnetic drives 73 and 74, the magnitude of the upward attraction force can be accurately calculated due to the fixed angle. Then, by synchronously adjusting the magnetic forces of the upper and lower magnetic drives 71 and 72, the stable floating of the fiber 6 can be ensured. During the movement of the fiber 6, the magnetic nanocoating 61 acts as a capacitor medium, modulating the capacitance between the electrodes as it moves within the groove. By measuring minute changes in capacitance (up to alpha-level resolution), the absolute position of the fiber 6 can be calculated in real-time at nanometer resolution, independent of optics. This provides continuous, high-bandwidth, drift-free position feedback, enabling extremely smooth and rapid alignment closed-loop control. It achieves fast and efficient positioning of the fiber 6 and has a wide range of applications. After positioning is completed, the upper magnetic drive 71 demagnetizes and the lower magnetic drive 72 increases the magnetic force, firmly adsorbing and fixing the optical fiber 6 in the V-groove 51, thus locking the optical fiber 6.

[0026] Dispensing: The adhesive enters through the right end of the positioning component 5, which is a section away from the laser chip 4. The magnetic force of the micro-planar coil on the lower magnetic drive 72 is increased sequentially from left to right, creating a stepped magnetic force that applies magnetophore force to the adhesive. This force is counteracted by the reverse magnetic pull, allowing the adhesive to actively plasticize. Precise control of the dispensing position ensures the initial position of the adhesive is far from the most sensitive optical area, avoiding the risk of initial contamination. The lower expansion groove 53 and the thin film 54 introduce a flexible, deformable intermediate layer. When the adhesive cures, whether it shrinks or expands, the resulting stress first acts on the thin film 54. The thin film 54 absorbs most of the shrinkage displacement and energy through its own elastic deformation. This effectively prevents displacement of the optical fiber 6, improving coupling accuracy. Simultaneously, because the optical fiber 6 is firmly fixed by magnetic force, it is guaranteed that the optical fiber 6 will not shift during adhesive curing, resulting in high encapsulation precision.

[0027] Example 2, based on the above examples, further includes a step 31 provided on the heat sink 3, and the laser chip 4 is mounted on the step 31.

[0028] Preferably, a positioning frame 32 is provided on the heat sink 3, the positioning element 5 is inserted into the positioning frame 32, and is laser welded to the positioning frame 32.

[0029] By setting step 31, not only can the positioning component 5 be positioned at the origin, but the center of the laser chip 4 and the center of the optical fiber 6 can also be aligned on the same straight line.

[0030] In embodiment three, based on the above embodiments, the opening width at the top of the V-groove 51 is typically larger than the diameter of the optical fiber 6, with a difference of 5-15 μm. For a standard 125 μm diameter optical fiber 6, the opening width at the top of the V-groove 51 is typically designed to be 130-140 μm, and the depth is approximately 70-80% of the radius of the optical fiber 6. This ensures that the optical fiber 6 "sits" within the groove without being too tightly secured, while also allowing space for the magnetic levitation micro-lifting of the optical fiber 6.

[0031] Example 4, based on the above examples, further includes a gluing flare 55 at the top of the V-groove 51, a gluing channel 56 at the bottom of the gluing flare 55, the gluing channel 56 being connected to the V-groove 51, and the outlet of the gluing channel 56 being located below the capacitor electrode 52.

[0032] Preferably, a capacitor connection line 57 is provided on the right side of the V-groove 51. The capacitor connection line 57 is electrically connected to the corresponding capacitor electrode 52, and the capacitor connection line 57 is sealed through the housing 1. This improves the sealing performance. At the same time, by setting the capacitor connection line 57, not only can the position of the optical fiber 6 be detected during packaging, but it can also be determined whether the optical fiber 6 has been displaced after long-term use, resulting in good self-testing effect.

[0033] Preferably, the curing adhesive for the optical fiber 6 is a UV-curable epoxy resin, and the UV-curable epoxy resin is uniformly mixed with superparamagnetic nanoparticles.

[0034] With the glue dispensing flare 55 set, and the glue being a UV-curable epoxy resin uniformly mixed with superparamagnetic nanoparticles, under the magnetic force of the lower magnetic drive 72, the glue can quickly fill the cavity between the lower surface of the optical fiber 6 and the V-groove 51 through the glue dispensing channel 56, achieving rapid and uniform glue filling and high dispensing efficiency.

[0035] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A packaging device for an optoelectronic device, comprising a housing (1) and a magnetic drive assembly, characterized in that, A cooler (2) is installed on the bottom surface of the housing (1), a heat sink (3) is installed on the upper surface of the cooler (2), and a laser chip (4) and a positioning component (5) are installed on the upper surface of the heat sink (3). The positioning component (5) has a V-shaped groove (51) inside. Capacitor electrodes (52) are provided on the inner walls of both sides of the V-shaped groove (51). A lower expansion groove (53) is provided at the bottom of the V-shaped groove (51). The lower expansion groove (53) is separated from the V-shaped groove (51) by a thin film (54). An optical fiber (6) is inserted into the V-shaped groove (51). The coupling end of the optical fiber (6) is coated with a magnetic nano-coating (61). The magnetic drive assembly is sleeved on the housing (1). The magnetic drive assembly can drive the optical fiber (6) to move horizontally and vertically in the V-groove (51) through the magnetic nano-coating (61).

2. The packaging equipment for an optoelectronic device according to claim 1, characterized in that, A step (31) is provided on the heat sink (3), and the laser chip (4) is installed on the step (31).

3. The packaging equipment for an optoelectronic device according to claim 2, characterized in that, The heat sink (3) is provided with a positioning frame (32), the positioning component (5) is inserted into the positioning frame (32) and laser welded to the positioning frame (32).

4. The packaging equipment for an optoelectronic device according to claim 3, characterized in that, The opening width at the top of the V-groove (51) is typically greater than the diameter of the optical fiber (6), with a difference of 5-15 μm.

5. The packaging equipment for an optoelectronic device according to claim 4, characterized in that, The curing adhesive for the optical fiber (6) is a UV-curable epoxy resin, and the UV-curable epoxy resin is uniformly mixed with superparamagnetic nanoparticles.

6. The packaging equipment for an optoelectronic device according to claim 5, characterized in that, The top of the V-groove (51) is provided with a glue-applying flare (55), and the bottom of the glue-applying flare (55) is provided with a glue-applying channel (56). The glue-applying channel (56) is connected to the V-groove (51), and the outlet of the glue-applying channel (56) is located below the capacitor electrode (52).

7. The packaging equipment for an optoelectronic device according to claim 6, characterized in that, A capacitor connection line (57) is provided on the right side of the V-groove (51). The capacitor connection line (57) is electrically connected to the corresponding capacitor electrode (52). The capacitor connection line (57) is sealed through the housing (1).

8. The packaging equipment for an optoelectronic device according to claim 7, characterized in that, The magnetic drive assembly includes a magnetic drive frame (7), with an upper magnetic drive (71) above the opening of the magnetic drive frame (7), a lower magnetic drive (72) below the opening, a forward magnetic drive (73) tilted to the left of the opening, and a backward magnetic drive (74) tilted to the right of the opening.

9. The packaging equipment for an optoelectronic device according to claim 8, characterized in that, The magnetic drive frame (7) is C-shaped and has a positioning groove (75) on its inner side. The housing (1) can be tightly inserted into the positioning groove (75). The opening of the positioning groove (75) is provided with a positioning flare (76).

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