Injection molding buckle shell busbar structure

Abstract

The invention relates to the technical field of electric vehicle battery pack inner connecting bars, and discloses an injection molding buckle shell busbar structure which comprises a single-conductor injection molding buckle shell busbar structure and a double-conductor injection molding buckle shell busbar structure, the single-conductor injection molding buckle shell busbar structure comprises a first conductive layer, the injection molding buckle shell busbar structure comprises a second conductive layer, and the double-conductor injection molding buckle shell busbar structure comprises a third conductive layer and a fourth conductive layer. A first conductive layer, a second conductive layer and a third conductive layer are made of T2 red copper or 6101 aluminum materials, and a plurality of groups of first injection molding buckle shell layers, second injection molding buckle shell layers, third injection molding buckle shell layers, fourth injection molding buckle shell layers and fifth injection molding buckle shell layers which are made of nylon polyhexamethylene adipamide as main materials are arranged in a layered wrapping mode. Low-loss current transmission in a battery pack is realized by means of excellent conductivity of metal, the requirement of high-voltage conductivity efficiency is met, the conductive layer is isolated from the external environment through high-strength insulativity of nylon polyhexamethylene adipamide, no bubble crack exists on the surface, impurity invasion is blocked, and long-term high-voltage insulation stability is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of internal connection bar technology for electric vehicle battery packs, specifically to an injection-molded snap-fit ​​female bar structure. Background Technology

[0002] In electric vehicles, the battery pack is the most important component. Connecting modules to battery drain units (BDUs), BDUs to high-voltage quick-connect fittings, BDUs to connectors, and modules to modules all require conductive connectors. Because the battery pack operates in a high-voltage environment, these connectors need insulation, such as through spraying, sheathing, dip coating, or extrusion. However, due to increasingly fierce competition in the new energy vehicle market in recent years, OEMs have been advocating for cost reduction and efficiency improvement, significantly increasing the requirements for battery pack assembly efficiency and integration.

[0003] Traditional busbar conductive layer materials and insulation treatments have limitations. Early busbar conductive layers mostly used ordinary pure copper or low-grade aluminum alloys. While the former has excellent conductivity, it has high density and high cost, while the latter is lightweight but has low conductivity and insufficient strength, failing to balance the requirements of "low-loss conductivity," "lightweight," and "structural strength." Insulation treatment methods also have significant defects. Spraying is prone to uneven coating and bubbles, and long-term use can easily lead to insulation failure due to vibration. Heat shrink tubing has poor adaptability, making it difficult to fit the complex shape of the busbar, and the interface is prone to forming weak points in insulation. Although dip coating and extrusion processes have better insulation effects, they have long production cycles and high costs, and the insulation layer needs to be disassembled during subsequent assembly, which seriously affects the overall assembly efficiency of the battery pack.

[0004] Therefore, an injection-molded snap-fit ​​motherboard structure is proposed to solve the above-mentioned problems. Summary of the Invention

[0005] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides an injection-molded buckle busbar structure, which solves the problems of traditional busbar conductive layers being unable to balance the requirements of "low-loss conductivity," "lightweight," and "structural strength," and the insulation treatment methods having issues such as easy coating peeling, poor adaptability, long production cycles, and low assembly efficiency, failing to meet the dual requirements of safe and efficient assembly under high-voltage battery pack environments.

[0006] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a molded injection-molded busbar structure, comprising a single-conductor molded injection-molded busbar structure and a double-conductor molded injection-molded busbar structure. The single-conductor molded injection-molded busbar structure includes a first conductive layer, and an outer surface molded injection-molded shell layer one and a surface-fitting molded injection-molded shell layer two are fastened to the outer surface of the first conductive layer. A step structure is provided at the junction of the outer surface molded injection-molded shell layer one and the surface-fitting molded injection-molded shell layer two. It also includes a snap-fitting position structure A and a screw high-position retention structure B. The double-conductor molded injection-molded busbar structure includes a second conductive layer and a third conductive layer. An outer surface molded injection-molded shell layer three, a surface-fitting injection-molded shell layer four, and a surface-fitting injection-molded shell layer five are fastened to the outer surfaces of the second and third conductive layers. It also includes the snap-fitting position structure and the screw high-position retention structure.

[0007] Preferably, the first conductive layer, the second conductive layer, and the third conductive layer are made of T2 copper or 6101 aluminum.

[0008] Preferably, the outer surface injection molded shell layer one, the surface fastening injection molded shell layer two, the outer surface fastening injection molded shell layer three, the surface fastening injection molded shell layer four, and the surface fastening injection molded shell layer five are all made primarily of nylon polyhexamethylene adipamide.

[0009] Preferably, the step structure is a stepped design, which is used to increase the creepage distance and improve the structural insulation performance while occupying the minimum installation space.

[0010] Preferably, the insertion part of the buckle engagement position structure has a guide end chamfer, and the top dimension is 1.66±0.2; the opening part has a guide tilting structure, the minimum part dimension is 1.2±0.2, and the destructive force after buckle engagement is greater than 50N, ensuring the structural stability after engagement.

[0011] Preferably, the screw high-position retention structure B includes a locking structure at the top of the injection-molded snap-fit ​​shell, and the locking structure has chamfers at both the top and bottom to guide the screw to be quickly assembled; the screw high-position retention structure B has a high-position retention force of 5N to 30N for the screw, reducing the risk of screw misinstallation or incorrect installation.

[0012] Preferably, the surface-fitting injection-molded shell layer four in the dual-conductor injection-molded shell busbar structure is an S-shaped solid structure. The S-shaped solid structure completely encloses and separates the second conductive layer and the third conductive layer 5, thus avoiding short circuits between the two conductive layers from a structural design perspective.

[0013] Preferably, each injection-molded snap-on shell layer, mainly composed of nylon polyhexamethylene adipamide, is manufactured using an integral injection molding process. After injection molding, the surface of the snap-on shell layer is free of bubbles and cracks, and the gap between it and the corresponding conductive layer is less than 0.1 mm, ensuring insulation and sealing.

[0014] Preferably, the outer surface injection molded shell layer one and the surface fastening injection molded shell layer two of the single conductor injection molded shell busbar structure, and the outer surface fastening injection molded shell layer three, the surface fastening injection molded shell layer four, and the surface fastening injection molded shell layer five of the double conductor injection molded shell busbar structure, all have rounded transition structures at their edges, with a radius of 0.5 to 1 mm, to avoid sharp edges scratching operators or damaging surrounding components during assembly.

[0015] (III) Beneficial Effects Compared with the prior art, the present invention provides an injection-molded snap-fit ​​female bar structure, which has the following beneficial effects: 1. This injection-molded buckle busbar structure utilizes a multi-layered design with the first, second, and third conductive layers made of T2 copper or 6101 aluminum, and multiple injection-molded buckle layers (layer 1, layer 2, layer 3, layer 4, and layer 5) primarily made of nylon hexamethylene adipamide. This design leverages the excellent conductivity of metals to achieve low-loss current transmission within the battery pack, meeting high-voltage conductivity requirements. Furthermore, the high-strength insulation of nylon hexamethylene adipamide isolates the conductive layers from the external environment, ensuring a bubble-free surface, preventing impurities from entering, and guaranteeing long-term high-voltage insulation stability.

[0016] 2. This injection-molded buckle busbar structure utilizes a stepped structure at the junction of the first and second injection-molded buckle layers in a single-conductor scenario, along with an S-shaped solid structure in the fourth injection-molded buckle layer in a double-conductor scenario. In a single-conductor scenario, this extends the creepage distance within the minimum installation space, reducing the risk of high-voltage creepage. In a double-conductor scenario, it completely physically isolates the second and third conductive layers, preventing contact between the two conductors or conduction by impurities even during vibration and displacement. This structurally eliminates the risk of short circuits and adapts to the safety requirements of different conductive scenarios.

[0017] 3. This injection-molded snap-fit ​​motherboard structure utilizes the guiding chamfer and precise dimensional design of the snap-fit ​​engagement position structure A, the chamfered locking of the screw high-position holding structure B and the holding force of 5N~30N, and the arc transition structure at the edges of each injection-molded snap-fit ​​layer. The snap-fit ​​structure achieves stable engagement between the injection-molded snap-fit ​​layer and the conductive layer with a destructive force >50N. The screw structure prevents slippage and misalignment during assembly, and the arc structure prevents personnel scratches and component collision damage. The three elements work together to optimize assembly convenience, structural stability and operational safety, thereby improving the overall assembly efficiency of the battery pack. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the single-conductor injection-molded snap-fit ​​busbar structure of this application; Figure 2 This is a schematic diagram of the dual-conductor injection-molded snap-fit ​​busbar structure of this application; Figure 3This is a schematic diagram of the overall injection-molded snap-fit ​​female busbar structure of this application; Figure 4 This is a schematic diagram of the snap-fit ​​structure of the injection-molded female connector in this application; Figure 5 This is a schematic diagram of the high-position retention structure of the injection-molded snap-fit ​​female screw in this application.

[0019] In the diagram: 1. First conductive layer; 2. Injection molded snap-on shell layer one; 3. Injection molded snap-on shell layer two; 4. Second conductive layer; 5. Third conductive layer; 6. Injection molded snap-on shell layer three; 7. Injection molded snap-on shell layer four; 8. Injection molded snap-on shell layer five; A. Snap-on engagement structure; B. Screw high-position retention structure. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figure 1 - Figure 5 As shown, a type of injection-molded snap-fit ​​busbar structure includes a single-conductor injection-molded snap-fit ​​busbar structure and a double-conductor injection-molded snap-fit ​​busbar structure. The single-conductor injection-molded snap-fit ​​busbar structure includes a first conductive layer 1, with an outer surface injection-molded snap-fit ​​layer 1 2 and a surface-attached injection-molded snap-fit ​​layer 2 3 fastened to the outer surface of the first conductive layer 1. A step structure is provided at the junction of the outer surface injection-molded snap-fit ​​layer 1 2 and the surface-attached injection-molded snap-fit ​​layer 2 3. It also includes a snap-fit ​​position structure A and a screw high-position retention structure B. The double-conductor injection-molded snap-fit ​​busbar structure includes a second conductive layer 4 and a third conductive layer 5, with an outer surface-attached injection-molded snap-fit ​​layer 3 6, a surface-attached injection-molded snap-fit ​​layer 4 7, and a surface-attached injection-molded snap-fit ​​layer 5 8 fastened to the outer surfaces of the second conductive layer 4 and the third conductive layer 5. It also includes a snap-fit ​​position structure A and a screw high-position retention structure B.

[0022] Firstly, the materials of the first conductive layer 1, the second conductive layer 4, and the third conductive layer 5 are either T2 copper or 6101 aluminum. By selecting T2 copper, its high purity of ≥99.95% achieves a high conductivity of 98% IACS, meeting the low-loss current transmission requirements under high-voltage conditions of the battery pack. Simultaneously, T2 copper's good ductility and corrosion resistance facilitate its processing into sheet-like or strip-like structures required for the busbar, and its conductivity is not easily reduced by oxidation and corrosion over long-term use, ensuring conductivity stability. By selecting 6101 aluminum, its conductivity of 60%-65% IACS meets basic conductivity requirements, while its density, only 1 / 3 that of copper, enables lightweight busbar design, aligning with the weight reduction trend of new energy vehicles. Furthermore, 6101 aluminum is a heat-treatable aluminum alloy, and after treatment, its strength is higher than pure aluminum, capable of withstanding external forces under battery pack vibration conditions, preventing deformation of the conductive layers. Ultimately, a balance is achieved between low-loss conductivity, lightweight design, and structural strength.

[0023] Secondly, the outer surface injection-molded shell layer 1 (2), the surface-fitting injection-molded shell layer 2 (3), the outer surface-fitting injection-molded shell layer 3 (6), the surface-fitting injection-molded shell layer 4 (7), and the surface-fitting injection-molded shell layer 5 (8) are all made primarily of nylon polyhexamethylene adipamide. By using PA66 as the main material, a reliable insulating barrier is formed, isolating the conductive layer from external components and preventing short circuits or electric shock risks caused by high-voltage current leakage. At the same time, relying on the excellent mechanical strength and wear resistance of PA66, it resists the damage to the shell layer caused by vibration and impact within the battery pack, avoiding damage to the insulation structure. In addition, PA66 has a melting point of approximately 260℃ and a long-term operating temperature of 80-120℃, which can withstand the normal temperature rise during battery pack operation. It also has a certain degree of resistance to grease and electrolyte, extending the service life of the insulation layer and ensuring long-term high-voltage insulation safety.

[0024] Furthermore, the stepped structure is designed to increase the creepage distance while minimizing installation space, thereby improving the structural insulation performance. By adopting a stepped structure, the current leakage path along the insulation surface between the conductive layer and external components is extended without increasing the overall size of the busbar or the installation space occupied, overcoming the limitation of short creepage distance in traditional planar insulation structures. According to high-voltage insulation design specifications, the increased creepage distance can significantly reduce the creepage risk in high-voltage environments, avoid current leakage caused by moisture and dust accumulation on the insulation surface, further improve the overall insulation level of the busbar, and adapt to the high-voltage operating conditions of battery packs above 300V.

[0025] Furthermore, the insertion part of the snap-fit ​​structure A has a chamfered guide end with a top dimension of 1.66±0.2; the opening part has a guide tilting structure with a minimum dimension of 1.2±0.2, and the destructive force after snap-fit ​​is greater than 50N, ensuring the structural stability after snap-fit. By "setting a chamfered guide end in the insertion part and a guide tilting structure in the opening part", the snap-fit ​​action between the injection-molded snap-fit ​​shell layer and the conductive layer is guided, so that it can be quickly embedded without precise alignment during snap-fit, reducing assembly difficulty and improving the assembly efficiency of the busbar.

[0026] Furthermore, the screw high-position retention structure B includes a locking structure on the top of the injection-molded housing. The locking structure has chamfers on both the top and bottom to guide the screw for quick assembly. The screw high-position retention structure B has a high-position retention force of 5N to 30N for the screw, reducing the risk of screw mis-installation and incorrect installation. By "the locking structure has chamfers on both the top and bottom", it plays a guiding role during screw assembly, allowing the screw to slide quickly into the preset locking position without repeated adjustments, thus shortening the assembly time.

[0027] Furthermore, the surface-fitting injection-molded shell layer 4 7 in the dual-conductor injection-molded busbar structure is an S-shaped solid structure. The S-shaped solid structure completely encloses and separates the second conductive layer 4 and the third conductive layer 5. From a structural design perspective, this avoids short circuits between the two conductive layers. By "designing it as an S-shaped solid structure", its continuous solid insulation form completely encloses the second conductive layer 4 and the third conductive layer 5 in their respective independent insulation spaces, forming a physical isolation barrier.

[0028] Furthermore, each injection-molded shell layer, mainly composed of nylon hexamethylene adipamide, adopts an integrated injection molding process. After injection molding, the surface of the shell layer is free of bubbles and cracks, and the gap between it and the corresponding conductive layer is less than 0.1mm, ensuring insulation and sealing. By adopting an integrated injection molding process, the complex structure of the shell layer is formed in one go, avoiding the interface gaps that exist in traditional spliced ​​insulation layers.

[0029] Finally, the outer surface injection molding shell layer 1 (2), the outer surface fastening injection molding shell layer 2 (3), and the outer surface fastening injection molding shell layer 3 (6), the outer surface fastening injection molding shell layer 4 (7), and the outer surface fastening injection molding shell layer 5 (8) of the double conductor injection molding shell busbar structure all have rounded transition structures at their edges, with a radius of 0.5–1 mm. This prevents sharp edges from scratching operators or damaging surrounding components during assembly. By providing rounded transition structures at the edges, the sharp edges of the injection molding shell layers are eliminated. On the one hand, this prevents assembly personnel from being scratched when holding or installing the busbar, improving operational safety. On the other hand, it prevents sharp edges from scratching the insulation layer or shell of other components when the busbar collides with them, avoiding circuit faults or structural failures caused by component damage, and ensuring the integrity and operational stability of the internal components of the battery pack.

[0030] Working principle: This injection-molded buckle busbar structure is designed for high-voltage conductive scenarios in electric vehicle battery packs. Through a collaborative design of "multi-conductive layer division of labor for conduction + layered injection-molded buckle insulation and protection + functional structural optimization assembly," it adapts to both single-conductor and double-conductor connection requirements, achieving integrated functions of safe conductivity, efficient insulation, and convenient assembly. The conductive layers are the core of current conduction. In the single-conductor scenario, the first conductive layer 1 serves as the sole current transmission carrier. In the double-conductor scenario, the second conductive layer 4 and the third conductive layer 5 transmit two current paths respectively. All three conductive layers use T-type conductive materials. 2. Made of copper or 6101 aluminum—relying on the excellent conductivity of these metals, low-loss current transmission between modules and BDUs within the battery pack, high-voltage quick-connects, and between modules is achieved, meeting the conductivity efficiency requirements under high-voltage environments. The insulation protection surrounding the conductive layer is achieved through multiple injection-molded shell layers: in a single-conductor scenario, injection-molded shell layer 1 (2) and injection-molded shell layer 2 (3) are respectively fastened to the outer surface of the first conductive layer 1; in a dual-conductor scenario, injection-molded shell layer 3 (6), injection-molded shell layer 4 (7), and injection-molded shell layer 5 (8) wrap the second conductive layer 4 and the third conductive layer 5. All injection-molded shell layers are made primarily of nylon polyhexamethylene adipamide, utilizing its high-strength insulation properties to isolate the conductive layer from the external environment, preventing current leakage or short circuits caused by accidental contact with external components. Simultaneously, each injection-molded shell layer employs an integrated injection molding process, ensuring no bubbles or cracks on the surface, and that the gap between the shell layer and the corresponding conductive layer is less than 0.1mm, further improving insulation sealing, preventing the intrusion of moisture, dust, and other impurities, and ensuring long-term high-voltage insulation stability.

[0031] In a single conductor scenario, a stepped structure is provided at the junction of the first injection-molded shell layer 2 and the second injection-molded shell layer 3. This design extends the creepage distance between the first conductive layer 1 and external components without taking up additional installation space, significantly reducing the risk of creepage under high voltage conditions and enhancing the overall insulation performance. The snap-fit ​​structure A ensures a stable connection between the injection-molded shell layer and the first conductive layer 1: its insertion part is designed with a chamfered guide end, and the opening part is equipped with a guide tilting structure, which can guide the snap-fit ​​action to quickly align and reduce assembly difficulty; the precise design with a top dimension of 1.66±0.2mm and a minimum opening dimension of 1.2±0.2mm, combined with a destructive force of more than 50N after snapping, ensures that the injection-molded shell layer and the first conductive layer 1 are not loose after snapping, and avoids structural misalignment caused by long-term vibration of the battery pack; The high-position retention structure B solves the pain point of assembly positioning: the locking structure at the top of the injection-molded housing guides the screw to be quickly inserted through the upper and lower chamfers. At the same time, the high-position retention force of 5N to 30N can temporarily fix the screw at the preset high position, preventing the screw from slipping or shifting during assembly, reducing the risk of misinstallation and incorrect installation, and improving the overall assembly efficiency of the battery pack.

[0032] In the dual-conductor scenario, the structure retains the snap-fit ​​engagement structure A, the screw high-position retention structure B, and the insulating shell layer design from the single-conductor scenario. The core difference lies in the injection-molded shell layer 7, which adopts an S-shaped solid structure. This structure completely encloses and physically isolates the side-by-side second conductive layer 4 and third conductive layer 5, forming two independent insulating spaces. Even under conditions of battery pack vibration or slight component displacement, the two conductive layers will not come into direct contact and can block conductive paths formed by external impurities. From a structural design perspective, this completely avoids the risk of short circuits between the two conductors and meets the safety requirements of dual-circuit conductive connections within the battery pack.

[0033] The edges of injection-molded snap-in shell layers 1 (2), 2 (3), 3 (6), 4 (7), and 5 (8) are all equipped with rounded transition structures to eliminate sharp edges. This prevents injuries to assembly personnel and avoids damage from collisions with other components within the battery pack, improving assembly safety and structural compatibility. Furthermore, the symmetrically distributed conductive layers and injection-molded snap-in shell layers in a dual-conductor configuration balance structural stress, ensuring overall stability after installation and adapting to the complex spatial layout and long-term vibration environment within the battery pack.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A type of injection-molded snap-fit ​​female connector structure, characterized in that: The structure includes a single-conductor injection-molded snap-fit ​​motherboard structure and a double-conductor injection-molded snap-fit ​​motherboard structure. The single-conductor injection-molded snap-fit ​​motherboard structure includes a first conductive layer (1), and the outer surface of the first conductive layer (1) is fastened with an outer surface injection-molded snap-fit ​​layer one (2) and a surface-fastened injection-molded snap-fit ​​layer two (3). A step structure is provided at the junction of the outer surface injection-molded snap-fit ​​layer one (2) and the surface-fastened injection-molded snap-fit ​​layer two (3). The structure also includes a snap-fit ​​position structure (A) and a screw high-position retention structure (B). The double-conductor injection-molded snap-fit ​​motherboard structure includes a second conductive layer (4) and a third conductive layer (5). The outer surfaces of the second conductive layer (4) and the third conductive layer (5) are fastened with an outer surface-fastened injection-molded snap-fit ​​layer three (6), a surface-fastened injection-molded snap-fit ​​layer four (7) and a surface-fastened injection-molded snap-fit ​​layer five (8). The structure also includes the snap-fit ​​position structure (A) and the screw high-position retention structure (B).

2. The injection-molded snap-fit ​​female bar structure according to claim 1, characterized in that: The first conductive layer (1), the second conductive layer (4) and the third conductive layer (5) are made of T2 copper or 6101 aluminum.

3. The injection-molded snap-fit ​​female bar structure according to claim 1, characterized in that: The outer surface injection molding shell layer one (2), the surface fastening injection molding shell layer two (3), the outer surface fastening injection molding shell layer three (6), the surface fastening injection molding shell layer four (7) and the surface fastening injection molding shell layer five (8) are all made of nylon polyhexamethylene adipamide.

4. The injection-molded snap-fit ​​female bar structure according to claim 1, characterized in that: The stepped structure is designed to increase the creepage distance and improve the structural insulation performance while occupying minimal installation space.

5. The injection-molded snap-fit ​​female strip structure according to claim 1, characterized in that: The insertion part of the buckle engagement structure (A) is provided with a guide end chamfer, and the top dimension is 1.66±0.2; the opening part is provided with a guide tilting structure, the minimum part dimension is 1.2±0.2, and the destructive force after buckle engagement is greater than 50N, ensuring the structural stability after engagement.

6. The injection-molded snap-fit ​​female bar structure according to claim 1, characterized in that: The screw high-position retention structure (B) includes a locking structure at the top of the injection-molded snap-fit ​​shell. The locking structure has chamfers at both the top and bottom to guide the screw to be quickly assembled. The screw high-position retention structure (B) has a high-position retention force of 5N to 30N for the screw, reducing the risk of screw misinstallation or incorrect installation.

7. The injection-molded snap-fit ​​female bar structure according to claim 1, characterized in that: The surface-fitting injection-molded shell layer four (7) in the dual-conductor injection-molded shell busbar structure is an S-shaped solid structure. The S-shaped solid structure completely wraps around and separates the second conductive layer (4) and the third conductive layer (5), thus avoiding short circuits between the two conductive layers from a structural design perspective.

8. The injection-molded snap-fit ​​female bar structure according to claim 1, characterized in that: Each injection-molded snap-on shell layer adopts an integral injection molding process. After injection molding, the surface of the snap-on shell layer is free of bubbles and cracks, and the gap between it and the corresponding conductive layer is less than 0.1mm, ensuring insulation and sealing.

9. The injection-molded snap-fit ​​female bar structure according to claim 1, characterized in that: The outer surface injection molding shell layer one (2) and the surface fastening injection molding shell layer two (3) of the single conductor injection molding shell busbar structure, and the outer surface fastening injection molding shell layer three (6), the surface fastening injection molding shell layer four (7), and the surface fastening injection molding shell layer five (8) of the double conductor injection molding shell busbar structure, all have rounded transition structures at their edges, with a radius of 0.5 to 1 mm, to avoid sharp edges scratching operators or damaging surrounding parts during assembly.

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